CN108515468A - A kind of novel soldering diamond abrasive tool and its preparation process - Google Patents
A kind of novel soldering diamond abrasive tool and its preparation process Download PDFInfo
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- CN108515468A CN108515468A CN201810438348.7A CN201810438348A CN108515468A CN 108515468 A CN108515468 A CN 108515468A CN 201810438348 A CN201810438348 A CN 201810438348A CN 108515468 A CN108515468 A CN 108515468A
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- polishing pad
- abrasive
- plane
- abrasive material
- polishing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
- B24D7/066—Grinding blocks; their mountings or supports
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The present invention provides a kind of novel soldering diamond abrasive tools, including hand operated grinding wheel machine and the soldering dimond synneusis casting grinding disk for being installed on hand operated grinding wheel machine, soldering dimond synneusis casting grinding disk matrix is disc, including polishing pad outer end, polishing pad inclined-plane, polishing pad plane top and polishing pan bottom, polishing pad outer end, polishing pad inclined-plane and polishing pad plane top plan are evenly equipped with the poly- golden abrasive material of diamond, the abrasive material of wherein polishing pad outer end edges is ordered into solid matter, the abrasive material on polishing pad inclined-plane is single and along the radial orderly equidistantly distributed of mill, the abrasive material of polishing pad plane top plan is the arrangement of tufted abrasive material turbine-like.The invention also provides the preparation methods of this grinding tool, the polishing pad produced using this method, grinding efficiency is high, feel is light, vibrations are small, odorlessness, long lifespan, good appearance, is easy to optimize cost, it is the direction of casting manufacturing industry medium casting polishing pad development, there is prodigious market potential.
Description
Technical field
The present invention relates to casting fin grinding technology field, more particularly, to a kind of novel soldering diamond abrasive tool and
Its preparation process.
Background technology
Currently, the polishing process of casting fin routine is polishing work with being mounted with that the hand operated grinding wheel machine of resin grinding wheels carries out
Hand sand.Since resin grinding wheels are that silicon carbide abrasive, corundum abrasive are consolidated discoid system using the principle of resin solidification
It forms, bond strength is low, therefore in bruting process, it may appear that polishing pad easy consumption, spark are big, smell is big, dust is big
The shortcomings of.This is because resin grinding wheels encounter ironcasting overlap by large impact in bruting process, abrasive material side is caused to be ground
Chamfered edge falls off, and since abrasive material proud exposure is low, and grinding skin temperature is high, causes resin to soften, scorification volatilization, has given out
Poison, penetrating odor.Cause polishing pad sharpness undesirable further, since abrasive material exposure is low, grinding efficiency is slower so that casting
Polishing workload accounts for a quarter or so of casting entirety manufacturing effort.
More than haveing the shortcomings that, requirement of the casting manufacturing industry to cost control is added, needs exploitation a kind of novel
Polishing pad replaces traditional polishing pad, with reach grinding efficiency height, long lifespan, it is pollution-free the purpose of.
The concretion technology of dimond synneusis has three kinds of plating, sintering, soldering etc. mainly in combination with mode at present.By to above
Three kinds of combinations carry out comparison discovery, sintering technology and electroplating technology abrasive material proud exposure bottom, and carcass holds intensity to abrasive material
Low, sharpness is undesirable, and chip removal effect is poor, it has therefore proved that is difficult to the requirement of competent polishing casting fin.And soldering tech is to utilize
Solder fusing welds together dimond synneusis and matrix, and enhanced primary treatment, abrasive material weldering have occurred before solder and abrasive material
Intensity height is connect, therefore abrasive material exposure is high, grinding is sharp, is a kind of ideal technology making polishing casting fin.It compares
Other abrasive materials, diamond are current most hard substance；Abrasiveness is good；Specific heat is small and thermal conductivity is big, therefore easily heating is also easy to dissipate
Heat, and diamond is the ideal material of metal of polishing.Compared to conventional resins grinding wheel, brazed diamond tool due to
Be not in abrasive material obscission substantially in use, and without resin melting volatilization, it is stingless because using process safety
Swash property smell to generate, have the characteristics that environmentally protective.The idea of development of this and current low-carbon, environmental protection is consistent.
Currently, using soldering tech, diamond welding is prepared into the existing part of brazed diamond tool in steel matrix and is answered
For in actual production, for example high ferro wins panel emery wheel, brazed diamond drill bit etc..But for profession polishing casting casting fin
Diamond tool there has been no relevant report and patents to occur at present.Existing soldering diamond milling tools type is few and more
For stone material of polishing, the manufacture craft of tool, matrix shape and grinding apparatus have relatively big difference, can not be applied to casting
In polishing.
And in a certain number of diamonds of grinding disc substrate interface disorder arrangement, then soldering mill conventional at present is mostly
It is made by high temperature brazing.The arrangement of its disc surface abrasive material is limited due to technique, it is difficult to accomplish uniformly to arrange, and not have
Landforms optimization is carried out according to the practical pattern of mill, that is, wastes diamond dosage, and constrain grinding efficiency and the longevity of mill
Life.
Abrasive material alignment technology has certain applications in soldering, electroplated product, and the technology for being applied to production has casement
Plate method, vacuum suction method and tufted arrangement method.Wherein hole template is orderly divided using hole template made of special material
Cloth abrasive material, principle are that sequence aperture is provided on substrate, and a diamond is accommodated per hole, then utilize related process by sequence
The diamond of arrangement is adhered to matrix surface.The method is chiefly used in preparing in sintered diamond tool, such as saw blade tip, at present only
It can be used for plane and a small amount of simple geometry shape.Vacuum suction method is allowed one with foraminate template using the principle that vacuumizes
Diamond is adsorbed with adsorption capacity, is subsequently placed in matrix surface, such mode is similar with hole template, can only prepare some more
Simple geometric surface, and above two method not yet accomplishes orderly to be distributed abrasive material according to workpiece performance at present.Third
Kind tufted arrangement method refers to the template using certain geometric shape, so that diamond abrasive is distributed in the gap of this template, after cloth is good
Spread template.Such mode is more common in electroplated diamond product, since template construct is relatively simple, in electroplated product
It is widely used, but such method is only capable of accomplishing that macroshape is orderly, and the diamond abrasive arrangement in each gap is still nothing
Sequence, it can not accomplish ordered arrangement, it is difficult to effectively play the advantage of diamond abrasive.
Invention content
For the technical problems in the prior art, the specific requirement that the present invention polishes according to ironcasting, with use of polishing
Hand operated grinding wheel machine is mating machine, in conjunction with the soldering processes of soldering dimond synneusis tool, and according to ironcasting overlap size, outer
Shape and the optimised of polishing pad calculate arrangement of the dimond synneusis abrasive material in polishing panel surface, provide a kind of suitable for casting
The soldering diamond abrasive tool and preparation method thereof of part overlap polishing.Grinding tool designed by the present invention has grinding efficiency height, feel
Gently, the characteristics of shaking small, odorlessness, long lifespan, good appearance.
To achieve the above object, the present invention is achieved by the following technical solutions：
A kind of soldering diamond abrasive tool suitable for casting fin polishing, including hand operated grinding wheel machine and it is installed on hand operated grinding wheel
The soldering dimond synneusis casting grinding disk of machine, the soldering dimond synneusis casting grinding disk matrix is disc, including is beaten
Mill outer end, polishing pad inclined-plane, polishing pad plane top and polishing pan bottom, polishing pad outer end, polishing pad inclined-plane and polishing pad
Plane top plan is evenly equipped with the poly- golden abrasive material of diamond, and the poly- golden abrasive material of the diamond is brazed by solder to be fixed；The polishing
The abrasive material of disk outer end edges is ordered into solid matter, and the abrasive material on polishing pad inclined-plane is single and along the radial orderly equidistantly distributed of mill
, the abrasive material of polishing pad plane top plan is the arrangement of tufted abrasive material turbine-like；Polishing pan bottom is a concave surface, is used for chip removal
And it is positioned at abrasive machine, the hole for being fixed on grinding wheel is arranged in polishing pad bottom centre.
Further, the width on polishing pad plane top accounts for the 1/3~1/2 of mill radius, the width on polishing pad inclined-plane
Degree is 3~5mm；Polishing pan bottom is a concave surface, for chip removal and is positioned at abrasive machine, and the setting of polishing pad bottom centre is used for
It is fixed on the hole of grinding wheel.
Further, the soldering dimond synneusis casting grinding disk matrix outer diameter is 100mm~180mm, matrix thickness
For 1.4mm~4.5mm.
Further, the angle theta of the polishing pad inclined-plane and horizontal direction is 5 °~15 °.
Further, in polishing pad matrix surface, solder is ambrose alloy chromium borosilicate alloy, brazing mode for abrasive material soldering
For vacuum brazing.
Further, the abrasive material of the polishing pad outer end edges is ordered into the high-grade drilling abrasive material of solid matter, abrasive material
Granularity is 10~50 mesh, and the horizontal spacing of adjacent two abrasive grains is 2d~4d, and the longitudinal pitch of adjacent two abrasive grains is 2d~5d,
Wherein d is the maximum particle diameter of abrasive material.
Further, the abrasive material on the polishing pad inclined-plane is along mill, quantity is identical in the radial direction.
Further, the abrasive material of the polishing pad plane top plan is the tufted grinding of the turbine-like arrangement of medium grade
With abrasive material, abrasive grain is 10~50 mesh, per 3~8 abrasive materials of cluster.
The present invention also provides a kind of preparation method of the soldering diamond abrasive tool suitable for casting fin polishing, the sides
Method includes the following steps：
(1) polishing pad matrix outer diameter punching press；
(2) polishing pad matrix outer end edges carry out chamfering；
(3) polishing pad matrix surface carries out blasting treatment, and is cleaned by ultrasonic；
(4) carry out coated with adhesive in the matrix surface that dries of cleaning, the binder for bond diamond abrasive grain with
Solder；
(5) abrasive material arrangement is carried out to polishing pad planar top end, polishing pad inclined-plane and polishing pad outer end edges successively；
(6) it after the completion of abrasive material arrangement, adds brazing solder and carries out vacuum brazing, prepare casting grinding Buddha's warrior attendant stone mill
Disk.
Further, it is equal to carry out abrasive material arrangement for polishing pad plane top, polishing pad inclined-plane and polishing pad outer end edges
It is completed by following steps：
(1) by it is prefabricated by landforms optimization be designed with sequence arrangement template be placed in matrix surface；
(2) arrangement diamond abrasive, diamond abrasive is distributed in the hole region of template, excellent according to landforms to obtain
Change designed pattern；Polishing pad plane top obtains the orderly landforms of tufted of swirl shape arrangement；Outside the polishing pad
End margin obtains the landforms of orderly solid matter；The polishing pad inclined-plane obtain single abrasive grain ordered arrangement and it is radial the same number ofly
Looks；
(3) ordered arrangement template is removed, diamond is obtained and optimizes arrangement surface topography by landforms.
Compared with prior art, the beneficial effects of the present invention are：
(1) the soldering diamond casting grinding disk of preparation method of the invention production, have grinding efficiency is high, feel is light,
The features such as shaking small, odorlessness, long lifespan, good appearance, and the abrasive material of different grades is selected according to actual conditions, it optimizes
Cost has more economy, is casting manufacturing industry medium casting polishing pad hair more ideally instead of traditional resin grinding wheels
The direction of exhibition has prodigious market potential.
(2) preparation method of the invention is simple for process, easy to operate, can simply realize diamond abrasive it is orderly,
Tufted is arranged.
Figure of description
Fig. 1 is the soldering dimond synneusis casting grinding dish structure sectional view of the present invention；
Fig. 2 is the soldering dimond synneusis casting grinding disk outer end edges abrasive material arrangement schematic diagram of the present invention；
Fig. 3 is the soldering dimond synneusis casting grinding disk top plan abrasive material arrangement schematic diagram of the present invention.
Specific implementation mode
It shows that example illustrates certain embodiments of the present invention, and should not be construed as the model of the limitation present invention
It encloses.Present disclosure can be improved from material, method and reaction condition simultaneously, all these improvement should all
It falls within the spirit and scope of the present invention.
Suitable for the soldering diamond abrasive tool of casting fin polishing, including hand operated grinding wheel machine and it is installed on hand operated grinding wheel machine
It is brazed dimond synneusis casting grinding disk, wherein soldering dimond synneusis casting grinding disk matrix shape is disc, such as Fig. 1 institutes
Show, including polishing pad outer end 1, polishing pad inclined-plane 2, polishing pad plane top 3 and polishing pan bottom 4, polishing pad outer end 1, polishing
Disk inclined-plane 2 and 3 plane of polishing pad plane top are evenly equipped with the poly- golden abrasive material of diamond, and the poly- golden abrasive material of the diamond passes through solder pricker
Solid welding is fixed；On steel matrix surface, solder is ambrose alloy chromium borosilicate alloy for abrasive material soldering, and high intensity connection is realized in vacuum brazing.Polishing
The width on disk plane top accounts for the 1/3~1/2 of mill radius, and the width on inclined-plane is 3~5mm；Polishing pan bottom is a concave surface, is used
In chip removal and it is positioned at abrasive machine, the hole for being fixed on grinding wheel is arranged in polishing pad bottom centre.It falls polishing pad matrix outer end
Fillet, fillet size are matched with matrix thickness.The polishing pad size range that is applicable in of the present invention is：Outer diameter 100mm~180mm,
Matrix thickness is 1.4mm~4.5mm.
The abrasive material cloth of polishing pad is determined according to mill working condition and mill shape.Along polishing pad when polishing pad works
Central shaft high speed rotation, and can be according to either direction, certain angular movement, therefore, the movement of polishing pad grinding is extremely complex, root
According to the state conversed analysis of its practical application, determine that the abrasive material on soldering dimond synneusis casting grinding disk is distributed and carries out landforms
Optimization.
(1) polishing pad outer end edges abrasive material arrangement landforms optimization
Polishing pad in use, push ahead by polishing pad outer end edges high-speed rotation side, thus polishing pad outer end by
Power is maximum, it is desirable that diamond brazing intensity higher, undertaken load bigger, and the movement of polishing pad outer end are considered as on one side
The movement being ground on one side is cut, therefore, in order to reduce outer end load, the density of mill outer end abrasive material should ensure chip space
In the case of it is more as far as possible, therefore mill outer end cloth will accomplish that solid matter is orderly, as shown in Figure 2.
According to load and mill motion trail analysis, the big granularity of abrasive material selection herein, high-grade drilling abrasive material.Abrasive material
Particle size range is the mesh of 10 mesh~50, by testing preferably with the mesh granularity of 35 mesh~40.The horizontal spacing of adjacent two abrasive grains is 2d
The longitudinal pitch of~4d, adjacent two abrasive grains are 2d~5d, and wherein d is the maximum particle diameter of abrasive material.
(2) polishing pad inclined-plane abrasive material arrangement landforms optimization
Since polishing pad can often keep certain angle to operating personnel with polishing plane when using sander so that polishing pad
A forward thrust can be obtained to cut the casting fin of protrusion, and polishing pad can be ensured in polishing casting fin
When blade edges abrasive dust can be discharged by inclined-plane, and make polishing pad have certain adaptability to buffed surface.Therefore it polishes
Disk upper end is that an inclined-plane by plane and certain inclination angle forms.Bevel angle θ (as shown in Figure 1) can be according to ergonomics
Principle and determined in conjunction with the shape of casting casting fin.
It is smaller due to bearing load polishing pad outer end edges on polishing pad inclined-plane, but there is still a need for the works for playing grinding, chip removal
With the requirement to this inclined-plane is that grinding efficiency is high, it is good to be ground long lifespan, excellent in heat dissipation effect, chip removal effect, in order to realize above-mentioned want
It asks, using the method for ordered arrangement abrasive material, by abrasive material radially arranged along mill, specific arrangement mode is in polishing pad diameter
To on direction, by single abrasive material according to being equally separated from, and abrasive grain quantity is identical in the radial direction.This is because mill
Revolution at a high speed, to ensure vibration minimum and grinding efficiency highest, then synchronization participates in the abrasive particle number being ground on gyratory directions
Amount is unanimously to ensure the stationarity of grinding.In addition the order arrangement of abrasive grain also improves the aesthetics of polishing pad.According to negative
It carries and mill motion trail analysis, the medium size of abrasive material selection herein, high-grade grinding abrasive material.
In order to realize that above-mentioned requirements, bevel angle θ are 5 °~15 °, abrasive material is when radially distributed on polishing pad, along mill
Radially along mill radially adjoining phase abrasive grain spacing range 1.5d~4d, the spacing range 1.5d of two radially distributed row abrasive grains
~6d.The mesh of 10 mesh of abrasive grain range~50 selects the mesh granularity of 40 mesh~50 by assay optimization.
(3) polishing pad top plan abrasive material arrangement landforms optimization
Since the movement of casting grinding disk is actually cutting, is ground the movement being combined into one, and the surface polished has
The requirement of certain precision, therefore after mill outer end and inclined-plane are cut, the effect of plane is chip removal, further grinding, throwing
Light polishing surface, therefore in order to improve polishing precision and chip removal effect, polishing pad top abrasive material arrangement situation is as shown in Figure 3.
The polishing pad plane top plan landforms principle of optimality is that the casting for requiring and polishing according to casting fin polishing flies
The operating conditions such as side shape, abrasive machine rotating speed carry out creatively landforms and optimize obtained optimum.
The track that each tufted abrasive material is formed can be straight line, circular arc, involute, the tracks such as parabola.Two is two adjacent
Spacing range 3mm~25mm between path line.According to load and mill motion trail analysis, the fair average quality of abrasive material selection herein
Grade, the thinner grinding abrasive material of granularity.According to turbine-like arrangement tufted abrasive material at polishing pad plane top plan, other positions are not
Arrangement abrasive material.Abrasive grain is 10~50 mesh, the mesh granularity of 40 mesh~50 is selected by assay optimization, per 3~8 abrasive materials of cluster, cluster
Shape areal extent is 4mm2~12mm2。
The chip space that tufted arrangement improves plane polishing is carried out at top plan, is ensured heat-dissipating space, is also improved
Grinding efficiency.The tufted diamond of top plan is arranged according to turbine-like, ensure that stationarity of the polishing pad in high-speed rotation,
This is because the entrance angle of every tufted diamond belt is all consistent, and in the dynamic Effective grains' number one of synchronization
It causes.
Grade classification identical as JB/GQF6010-86 (diamond, the cubic boron nitride of abrasive material of the present invention
Product quality grading standard)
Embodiment 1
A kind of soldering diamond abrasive tool suitable for casting fin polishing, including hand operated grinding wheel machine and it is installed on hand operated grinding wheel
The soldering dimond synneusis casting grinding disk of machine, wherein soldering dimond synneusis casting grinding disk matrix shape is disc, packet
Include polishing pad outer end, polishing pad inclined-plane, polishing pad plane top and polishing pan bottom.Polishing pad matrix outer diameter is 100mm, matrix
Thickness is 1.4mm, and the width on polishing pad plane top is 34mm, and the width on inclined-plane is 3mm, and bevel angle θ is 5 °.Outside polishing pad
End, polishing pad inclined-plane and polishing pad plane top plan are furnished with the poly- golden abrasive material of diamond by soldering.Polishing pan bottom is one
Concave surface for chip removal and is positioned at abrasive machine, and the hole for being fixed on grinding wheel is arranged in polishing pad bottom centre.Polishing pad matrix
Outer end rounded corner, fillet size are matched with matrix thickness.
The arrangement of the abrasive material of the soldering diamond abrasive tool is as follows：
1. polishing pad outer end edges select medium sane level diamond abrasive, 35~40 mesh of granularity, adjacent two abrasive grain transverse directions
Spacing is 2d, longitudinal pitch 2d.
2. high grade diamond abrasive, 40~50 mesh of granularity, radially between two abrasive grain transverse directions are selected in polishing pad inclined-plane
Away from for 1.5d, two radially distributed row abrasive grain spacing 1.5d.
3. polishing pad top plan abrasive material presses round tufted and arranges, tufted diameter 3mm, 40~50 mesh of each tufted area arrangement
Fair average quality grade diamond 10~15, path line are the circular arc of radius 80, arrange 17.
This is brazed the preparation of dimond synneusis casting grinding disk suitable for the soldering diamond abrasive tool that casting fin is polished
Method is as follows：
(1) polishing pad matrix outer diameter punching press.Polishing pad basis material used is 65Mn steel, ensures that tooling strength, matrix are thick
Degree is 1.4mm.
(2) polishing pad matrix outer end edges carry out chamfering, chamfer dimesion r=0.5.
(3) polishing pad matrix surface carries out blasting treatment, and is cleaned by ultrasonic.
(4) matrix surface dried in cleaning carries out coated with adhesive, and the effect of this binder is bond diamond abrasive grain
With solder.The wherein brush binder first at polishing pad top plan.
(5) prefabricated optimize by landforms of the arrangement mode of polishing pad abrasive material in the present embodiment is designed with sequence arrangement mould
Plate is placed in matrix surface.Mould material flexibility is good, can be bent, therefore can be fitted closely with disc surface.
(6) arrangement diamond abrasive is carried out, diamond selects the grinding diamond of 40~50 mesh of medium grade, due to
The effect of ordered arrangement template, diamond abrasive are only distributed in the hole region of template, thus can be obtained according to landforms
The designed pattern of optimization.The orderly landforms of the tufted arranged by swirl shape can be obtained at polishing pad top plan.
(7) ordered arrangement template is removed, just realizes the arrangement of polishing pad top plan abrasive material.
(8) method for pressing step (4)~(7) carries out cloth to polishing pad inclined-plane, and abrasive material selects high-grade 40~50 mesh
Grinding diamond.Obtained landforms are single abrasive grain radial direction ordered arrangement, and radial number is identical.
(9) step (4)~(7) are pressed, cloth is carried out to polishing pad outer end edges, abrasive material selects high-grade 35~40 purpose
Drilling diamond.The obtained abrasive material landforms being orderly distributed for solid matter.
(10) it after the completion of abrasive material arrangement, adds brazing solder and carries out vacuum brazing, prepare casting grinding diamond
Mill.
Embodiment 2
A kind of soldering diamond abrasive tool suitable for casting fin polishing, including hand operated grinding wheel machine and it is installed on hand operated grinding wheel
The soldering dimond synneusis casting grinding disk of machine, wherein soldering dimond synneusis casting grinding disk matrix shape is disc, packet
Include polishing pad outer end, polishing pad inclined-plane, polishing pad plane top and polishing pan bottom.Polishing pad matrix outer diameter is 180mm, matrix
Thickness is 4.5mm, and the width on polishing pad plane top is 120mm, and the width on inclined-plane is 3mm, and bevel angle θ is 15 °.Polishing pad
Outer end, polishing pad inclined-plane and polishing pad plane top plan are furnished with the poly- golden abrasive material of diamond by soldering.Polishing pan bottom is
One concave surface for chip removal and is positioned at abrasive machine, and the hole for being fixed on grinding wheel is arranged in polishing pad bottom centre.Polishing pad base
External end rounded corner, fillet size are matched with matrix thickness.
The arrangement of the abrasive material of the soldering diamond abrasive tool is as follows：
1. polishing pad outer end edges select medium sane level diamond abrasive, 35~40 mesh of granularity, adjacent two abrasive grain transverse directions
Spacing is 4d, longitudinal pitch 5d.
2. high grade diamond abrasive, 40~50 mesh of granularity, radially between two abrasive grain transverse directions are selected in polishing pad inclined-plane
Away from for 3.5d, two radially distributed row abrasive grain spacing 5d.
3. polishing pad top plan abrasive material presses round tufted and arranges, tufted diameter 6mm, 40~50 mesh of each tufted area arrangement
Fair average quality grade diamond 25~30 arranges 35.
This is brazed the preparation of dimond synneusis casting grinding disk suitable for the soldering diamond abrasive tool that casting fin is polished
Method is as follows：
(1) polishing pad matrix outer diameter punching press.Polishing pad basis material used is 65Mn steel, ensures that tooling strength, matrix are thick
Degree is 4.5mm.
(2) polishing pad matrix outer end edges carry out chamfering, chamfer dimesion r=0.5.
(3) polishing pad matrix surface carries out blasting treatment, and is cleaned by ultrasonic.
(4) matrix surface dried in cleaning carries out coated with adhesive, and the effect of this binder is bond diamond abrasive grain
With solder.The wherein brush binder first at polishing pad top plan.
(5) prefabricated optimize by landforms of the arrangement mode of polishing pad abrasive material in the present embodiment is designed with sequence arrangement mould
Plate is placed in matrix surface.Mould material flexibility is good, can be bent, therefore can be fitted closely with disc surface.
(6) arrangement diamond abrasive is carried out, diamond selects the grinding diamond of 40~50 mesh of medium grade, due to
The effect of ordered arrangement template, diamond abrasive are only distributed in the hole region of template, thus can be obtained according to landforms
The designed pattern of optimization.The orderly landforms of the tufted arranged by swirl shape can be obtained at polishing pad top plan.
(7) ordered arrangement template is removed, just realizes the arrangement of polishing pad top plan abrasive material.
(8) method for pressing step (4)~(7) carries out cloth to polishing pad inclined-plane, and abrasive material selects high-grade 40~50 mesh
Grinding diamond.Obtained landforms are single abrasive grain radial direction ordered arrangement, and radial number is identical.
(9) step (4)~(7) are pressed, cloth is carried out to polishing pad outer end edges, abrasive material selects high-grade 35~40 purpose
Drilling diamond.The obtained abrasive material landforms being orderly distributed for solid matter.
(10) it after the completion of abrasive material arrangement, adds brazing solder and carries out vacuum brazing, prepare casting grinding diamond
Mill.
The soldering diamond casting grinding disk produced by the method, with grinding efficiency height, feel is light, shakes small, nothing
The features such as smell, long lifespan, good appearance, and the abrasive material of different grades is selected according to actual conditions, cost is optimized, more
There is an economy, be the direction of casting manufacturing industry medium casting polishing pad development more ideally instead of traditional resin grinding wheels,
With prodigious market potential.
Claims (10)
1. a kind of soldering diamond abrasive tool suitable for casting fin polishing, including hand operated grinding wheel machine and it is installed on hand operated grinding wheel machine
Soldering dimond synneusis casting grinding disk, which is characterized in that the soldering dimond synneusis casting grinding disk matrix be disk
Shape, including polishing pad outer end (1), polishing pad inclined-plane (2), polishing pad plane top (3) and polishing pan bottom (4), outside polishing pad
End (1), polishing pad inclined-plane (2) and polishing pad plane top (3) plane is evenly equipped with the poly- golden abrasive material of diamond, the poly- gold of the diamond
Abrasive material is brazed by solder and is fixed；The abrasive material at polishing pad outer end (1) edge is ordered into solid matter, polishing pad inclined-plane (2)
Abrasive material is single and along the radial orderly equidistantly distributed of mill, and the abrasive material of polishing pad plane top (3) plane is tufted abrasive material
Turbine-like arrangement；Polishing pan bottom is a concave surface, for chip removal and is positioned at abrasive machine, and the setting of polishing pad bottom centre is used
In the hole for being fixed on grinding wheel.
2. a kind of soldering diamond abrasive tool suitable for casting fin polishing according to claim 1, which is characterized in that institute
The width for stating polishing pad plane top (3) accounts for the 1/3~1/2 of mill radius, and the width of polishing pad inclined-plane (2) is 3~5mm；It beats
Mill bottom (4) is a concave surface, for chip removal and is positioned at abrasive machine, and polishing pad bottom centre is arranged for being fixed on grinding wheel
Hole.
3. a kind of soldering diamond abrasive tool suitable for casting fin polishing according to claim 1, which is characterized in that institute
It is 100mm~180mm to state soldering dimond synneusis casting grinding disk matrix outer diameter, and matrix thickness is 1.4mm~4.5mm.
4. a kind of soldering diamond abrasive tool suitable for casting fin polishing according to claim 1, which is characterized in that institute
The angle theta for stating polishing pad inclined-plane (2) and horizontal direction is 5 °~15 °.
5. a kind of soldering diamond abrasive tool suitable for casting fin polishing according to claim 1, which is characterized in that institute
The abrasive material soldering stated is in polishing pad matrix surface, and solder is ambrose alloy chromium borosilicate alloy, and brazing mode is vacuum brazing.
6. a kind of soldering diamond abrasive tool suitable for casting fin polishing according to claim 1, which is characterized in that institute
The abrasive material for stating polishing pad outer end (1) edge is ordered into the high-grade drilling abrasive material of solid matter, and abrasive grain is 10~50 mesh, phase
The horizontal spacing of adjacent two abrasive grains is 2d~4d, and the longitudinal pitch of adjacent two abrasive grains is 2d~5d, and wherein d is the maximum of abrasive material
Grain size.
7. a kind of soldering diamond abrasive tool suitable for casting fin polishing according to claim 1, which is characterized in that institute
The abrasive material on polishing pad inclined-plane is stated quantity is identical in the radial direction along mill.
8. a kind of soldering diamond abrasive tool suitable for casting fin polishing according to claim 1, which is characterized in that institute
The abrasive material for stating polishing pad plane top plan is the tufted grinding abrasive material of the turbine-like arrangement of medium grade, abrasive grain 10
~50 mesh, per 3~8 abrasive materials of cluster.
9. a kind of preparation method of soldering diamond abrasive tool suitable for casting fin polishing, which is characterized in that the method packet
Include following steps：
(1) polishing pad matrix outer diameter punching press；
(2) polishing pad matrix outer end edges carry out chamfering；
(3) polishing pad matrix surface carries out blasting treatment, and is cleaned by ultrasonic；
(4) matrix surface dried in cleaning carries out coated with adhesive, and the binder is used for bond diamond abrasive grain and solder；
(5) abrasive material arrangement is carried out to polishing pad planar top end, polishing pad inclined-plane and polishing pad outer end edges successively；
(6) it after the completion of abrasive material arrangement, adds brazing solder and carries out vacuum brazing, prepare casting grinding diamond disk.
10. a kind of preparation method of soldering diamond abrasive tool suitable for casting fin polishing according to claim 9,
It is characterized in that, polishing pad plane top, polishing pad inclined-plane and polishing pad outer end edges carry out abrasive material arrangement by following
Step is completed：
(1) by it is prefabricated by landforms optimization be designed with sequence arrangement template be placed in matrix surface；
(2) arrangement diamond abrasive, diamond abrasive are distributed in the hole region of template, to obtain optimizing institute according to landforms
The pattern of design；Polishing pad plane top obtains the orderly landforms of tufted of swirl shape arrangement；The polishing pad outer end edges
Edge obtains the landforms of orderly solid matter；The polishing pad inclined-plane obtains single abrasive grain ordered arrangement and radial the same number of landforms；
(3) ordered arrangement template is removed, diamond is obtained and optimizes arrangement surface topography by landforms.
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