CN219403942U - Diamond grinding wheel beneficial to chip removal - Google Patents

Abstract

The utility model discloses a diamond grinding wheel beneficial to chip removal, which comprises a support ring and a chip removal groove II; a support ring: the outer edges of the upper surface and the lower surface of the diamond abrasive are inclined to the horizontal middle surface of the supporting ring, chip grooves I are formed in the upper surface and the lower surface of the diamond abrasive in an annular array, the chip grooves I are arranged in a staggered mode with the circle center of the supporting ring, heat dissipation holes are uniformly formed in the diamond abrasive, and the heat dissipation holes are located in the chip grooves II; chip groove two: the two chip grooves are communicated with the first chip groove adjacent to the anticlockwise direction respectively, and the second chip groove on the same side of the diamond abrasive is arranged in a vortex shape, so that the diamond grinding wheel beneficial to chip removal can smoothly discharge scraps generated in the working process of the grinding wheel, the strength of the diamond abrasive is ensured, and the overhigh temperature of the grinding wheel in the running process is effectively prevented.

Description

Diamond grinding wheel beneficial to chip removal

Technical Field

The utility model relates to the technical field of diamond grinding wheels, in particular to a diamond grinding wheel beneficial to chip removal.

Background

The grinding wheel is also called a bonded grinding tool, which is formed by bonding common grinding materials into a certain shape (most of the grinding materials are round, the center of the grinding materials is provided with a through hole), and the grinding wheel has certain strength. The grinding wheel is one of the grinding tools with the largest dosage and the widest use surface, and can rotate at high speed during use, and can perform rough grinding, semi-finish grinding, slotting, cutting and the like on the outer circle, the inner circle, the plane, various molded surfaces and the like of metal or nonmetal workpieces. The characteristics of the grinding wheel are mainly determined by factors such as abrasive materials, granularity, binding agents, hardness, tissues, shapes and sizes, the grinding faces of the existing diamond grinding wheel are smooth and ungrooved or chip grooves are linearly arranged along the radial direction of the grinding wheel, and the section shape of the chip grooves easily causes chip groove blocking, so that waste residues ground during grinding are not ideal, the grinding speed is low, the quality is poor, grinding tools are wasted, and the working efficiency is seriously affected.

Disclosure of Invention

The utility model aims to overcome the existing defects, and provides the diamond grinding wheel which is favorable for chip removal, so that waste chips generated in the working process of the grinding wheel are smoothly discharged, the working efficiency is improved, the strength of diamond grinding materials is ensured, the excessive temperature in the running process of the grinding wheel is effectively prevented, the practicability is strong, and the problems in the background technology can be effectively solved.

In order to achieve the above purpose, the present utility model provides the following technical solutions: a diamond grinding wheel beneficial to chip removal comprises a support ring and a chip removal groove II;

a support ring: the outer edges of the upper surface and the lower surface of the diamond abrasive are inclined to the horizontal middle surface of the supporting ring, chip grooves I are formed in the upper surface and the lower surface of the diamond abrasive in an annular array, and the chip grooves I are arranged in a staggered manner with the circle center of the supporting ring;

chip groove two: the chip grooves are respectively communicated with the inner parts of the chip grooves adjacent to the counter-clockwise direction, so that the waste chips generated in the working process of the grinding wheel are smoothly discharged, the working efficiency is improved, the strength of the diamond abrasive is ensured, the temperature is effectively prevented from being too high in the running process of the grinding wheel, and the practicability is strong.

Furthermore, the second chip grooves on the same side face of the diamond abrasive are arranged in a vortex shape, so that the second chip grooves are uniformly arranged on the outer surface of the diamond abrasive, and meanwhile, the strength of the diamond abrasive is ensured.

Further, the inside of diamond abrasive material evenly is equipped with the louvre, and the louvre all is located the inside of junk slot two, the heat dissipation of the diamond grinding wheel of being convenient for.

Further, the outer edge annular array of diamond abrasive material is equipped with U type mouth, and U type mouth communicates with the outside end of junk groove one respectively, is convenient for the discharge of grinding piece.

Furthermore, the outer edges of the joints of the first chip groove and the second chip groove are respectively provided with a round angle, so that grinding chips can flow to the outer edge of the first chip groove conveniently, and chip removal efficiency is improved.

Further, the outer cambered surface annular array of the supporting ring is provided with T-shaped blocks, and the T-shaped blocks extend to the inside of the diamond abrasive, so that the supporting strength of the diamond abrasive is improved.

Furthermore, the inside symmetry of supporting ring is equipped with the locating hole, is convenient for connect fixedly to the supporting ring.

Compared with the prior art, the utility model has the beneficial effects that: the diamond grinding wheel beneficial to chip removal has the following advantages:

the locating hole is fixed a position the diamond grinding wheel, improve the joint strength to the diamond grinding wheel, chip groove two is vortex arrangement and sets up the piece that is convenient for cut and produce and get into adjacent chip groove two inside fast, chip gets into chip groove two inside back along the centrifugal force of diamond grinding wheel high-speed rotation along chip groove two removal, chip gets into chip groove two anticlockwise adjacent chip groove one inside along chip groove two, then remove along chip groove one, and discharge outward through U type mouth, the width of U type mouth is greater than chip groove one's width, the quick discharge of piece of being convenient for, avoid the piece to block up in chip groove one inside, chip groove two's vortex arrangement structure can avoid the diamond abrasive material to be located too weak and fracture of thickness in same radius region simultaneously, the intensity of diamond abrasive material has been guaranteed, the louvre is convenient for the heat dissipation of diamond grinding wheel, avoid the during cutting because the too high temperature leads to the work piece cutting face carbonization, this diamond grinding wheel that does benefit to the chip removal, the waste chip that produces in the course of the grinding wheel work is discharged smoothly, the intensity of diamond abrasive material has been guaranteed, the effective temperature is too high in the course of preventing to operate, practicality.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model.

In the figure: 1 supporting ring, 2 diamond abrasive, 3 junk slots, 4 junk slots, 5U-shaped mouth, 6 radiating holes, 7 locating holes, 8 fillets and 9T-shaped blocks.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1, the present embodiment provides a technical solution: a diamond grinding wheel beneficial to chip removal comprises a support ring 1 and a chip removal groove II 4;

support ring 1: the outer cambered surface of the support ring 1 is bonded with a diamond abrasive 2 through an adhesive, the outer cambered surface annular array of the support ring 1 is provided with T-shaped blocks 9, the T-shaped blocks 9 are all extended into the diamond abrasive 2, the support strength of the diamond abrasive 2 is improved, the outer edges of the upper surface and the lower surface of the diamond abrasive 2 are inclined towards the horizontal middle surface of the support ring 1, the annular array of the upper surface and the lower surface of the diamond abrasive 2 is provided with a first chip groove 3, the first chip groove 3 is arranged in staggered arrangement with the center of the support ring 1, the annular array of the outer edge of the diamond abrasive 2 is provided with U-shaped openings 5, the U-shaped openings 5 are respectively communicated with the outer ends of the first chip groove 3, the discharge of grinding chips is facilitated, and the inner part of the support ring 1 is symmetrically provided with positioning holes 7, so that the support ring 1 is convenient to connect and fix.

Chip groove two 4: set up in the upper surface and the lower surface of diamond abrasive material 2 respectively, junk slot two 4 respectively with the adjacent junk slot one 3 inside intercommunication of anticlockwise, the junk slot two 4 of the same side of diamond abrasive material 2 is vortex form arrangement setting, make junk slot two 4 evenly arrange in the surface of diamond abrasive material 2, the intensity of diamond abrasive material 2 has been guaranteed simultaneously, the inside of diamond abrasive material 2 evenly is equipped with louvre 6, louvre 6 all is located the inside of junk slot two 4, the heat dissipation of diamond grinding wheel of being convenient for, the junction outer edge of junk slot one 3 and junk slot two 4 all is equipped with fillet 8, the outer edge flow of the abrasive chip to junk slot one 3 of being convenient for improves chip removal efficiency.

The working principle of the diamond grinding wheel beneficial to chip removal provided by the utility model is as follows:

the locating hole 7 is to the diamond grinding wheel location, improve the joint strength to the diamond grinding wheel, chip groove two 4 is the vortex arrangement and sets up the piece that is convenient for cut and produce and get into adjacent chip groove two inside 4 fast, chip moves along chip groove two 4 along the centrifugal force that the diamond grinding wheel rotated at a high speed after getting into chip groove two inside 4, chip gets into chip groove two 4 anticlockwise adjacent chip groove one inside 3 along chip groove two 4, then move along chip groove one 3, and discharge outside through U type mouth 5, the width of U type mouth 5 is greater than the width of chip groove one 3, the quick discharge of piece of being convenient for, avoid the piece to block up in chip groove one 3 inside, chip groove two 4's vortex arrangement structure can avoid diamond abrasive material 2 to be located too weak and fracture of thickness in same radius region simultaneously, the intensity of diamond abrasive material 2 has been guaranteed, the louvre 6 is convenient for the heat dissipation of diamond grinding wheel, avoid cutting the time because the too high temperature leads to the carbide of work piece cutting face.

The foregoing is only illustrative of the present utility model and is not to be construed as limiting the scope of the utility model, and all equivalent structures or equivalent flow modifications which may be made by the teachings of the present utility model and the accompanying drawings or which may be directly or indirectly employed in other related art are within the scope of the utility model.

Claims (7)

1. The utility model provides a do benefit to diamond grinding wheel of chip removal which characterized in that: comprises a supporting ring (1) and a chip removal groove II (4);

support ring (1): the outer edges of the upper surface and the lower surface of the diamond abrasive (2) are inclined to the horizontal middle surface of the supporting ring (1), chip grooves I (3) are annularly arranged on the upper surface and the lower surface of the diamond abrasive (2) in an array manner, and the chip grooves I (3) are arranged in a staggered manner with the circle center of the supporting ring (1);

chip groove two (4): the chip grooves II (4) are respectively communicated with the inner parts of the adjacent chip grooves I (3) in the anticlockwise direction.

2. A diamond grinding wheel for facilitating chip removal according to claim 1, wherein: the chip grooves II (4) on the same side face of the diamond abrasive (2) are arranged in a vortex shape.

3. A diamond grinding wheel for facilitating chip removal according to claim 1, wherein: and radiating holes (6) are uniformly formed in the diamond abrasive (2), and the radiating holes (6) are all positioned in the second chip removal groove (4).

4. A diamond grinding wheel for facilitating chip removal according to claim 1, wherein: the outer edge annular array of diamond abrasive material (2) is equipped with U type mouth (5), and U type mouth (5) communicate with the outside end of junk slot one (3) respectively.

5. A diamond grinding wheel for facilitating chip removal according to claim 1, wherein: and round corners (8) are arranged at the outer edges of the joints of the first chip removal groove (3) and the second chip removal groove (4).

6. A diamond grinding wheel for facilitating chip removal according to claim 1, wherein: the outer arc surface annular array of the supporting ring (1) is provided with T-shaped blocks (9), and the T-shaped blocks (9) extend to the inside of the diamond abrasive (2).

7. A diamond grinding wheel for facilitating chip removal according to claim 1, wherein: positioning holes (7) are symmetrically formed in the support ring (1).