CN108511384B - 临时键合/解键合的材料及其制备方法和应用 - Google Patents
临时键合/解键合的材料及其制备方法和应用 Download PDFInfo
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- CN108511384B CN108511384B CN201810345076.6A CN201810345076A CN108511384B CN 108511384 B CN108511384 B CN 108511384B CN 201810345076 A CN201810345076 A CN 201810345076A CN 108511384 B CN108511384 B CN 108511384B
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- 239000000463 material Substances 0.000 title claims abstract description 72
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000011521 glass Substances 0.000 claims abstract description 29
- 239000007770 graphite material Substances 0.000 claims abstract description 24
- 238000007788 roughening Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 60
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 34
- 229910002804 graphite Inorganic materials 0.000 claims description 29
- 239000010439 graphite Substances 0.000 claims description 29
- 238000000227 grinding Methods 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 229910052594 sapphire Inorganic materials 0.000 claims description 11
- 239000010980 sapphire Substances 0.000 claims description 11
- 239000011889 copper foil Substances 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 9
- 238000005229 chemical vapour deposition Methods 0.000 claims description 8
- 238000001020 plasma etching Methods 0.000 claims description 7
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 6
- 229910021389 graphene Inorganic materials 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229910052755 nonmetal Inorganic materials 0.000 claims description 4
- 238000011282 treatment Methods 0.000 claims description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract description 7
- 230000007547 defect Effects 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 105
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 15
- 229910052710 silicon Inorganic materials 0.000 description 15
- 239000010703 silicon Substances 0.000 description 15
- 229910010271 silicon carbide Inorganic materials 0.000 description 10
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 9
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000005498 polishing Methods 0.000 description 7
- 238000010494 dissociation reaction Methods 0.000 description 5
- 230000005593 dissociations Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910002601 GaN Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus
- H01L2224/81005—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus being a temporary or sacrificial substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/98—Methods for disconnecting semiconductor or solid-state bodies
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810345076.6A CN108511384B (zh) | 2018-04-17 | 2018-04-17 | 临时键合/解键合的材料及其制备方法和应用 |
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CN201810345076.6A CN108511384B (zh) | 2018-04-17 | 2018-04-17 | 临时键合/解键合的材料及其制备方法和应用 |
Publications (2)
Publication Number | Publication Date |
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CN108511384A CN108511384A (zh) | 2018-09-07 |
CN108511384B true CN108511384B (zh) | 2021-03-16 |
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CN201810345076.6A Active CN108511384B (zh) | 2018-04-17 | 2018-04-17 | 临时键合/解键合的材料及其制备方法和应用 |
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Families Citing this family (2)
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CN111250863B (zh) * | 2020-03-31 | 2021-06-29 | 格物感知(深圳)科技有限公司 | 一种特殊无铝焊接键合工艺 |
CN111599742B (zh) * | 2020-06-04 | 2023-06-16 | 西南大学 | 一种基于石墨的临时键合和解键方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150060870A1 (en) * | 2013-08-30 | 2015-03-05 | Jae-Sang Ro | Supporting substrate for manufacturing flexible information display device, manufacturing method thereof, and flexible information display device |
Family Cites Families (5)
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---|---|---|---|---|
TWI446420B (zh) * | 2010-08-27 | 2014-07-21 | Advanced Semiconductor Eng | 用於半導體製程之載體分離方法 |
US8822306B2 (en) * | 2010-09-30 | 2014-09-02 | Infineon Technologies Ag | Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core |
CN103794523B (zh) * | 2014-01-24 | 2017-06-06 | 清华大学 | 一种晶圆临时键合方法 |
CN105280745B (zh) * | 2014-06-05 | 2018-04-24 | 中国科学院苏州纳米技术与纳米仿生研究所 | GaInP/GaAs /InGaAs/Ge四结级联太阳电池及其制作方法 |
CN106652820B (zh) * | 2016-12-28 | 2019-12-06 | 歌尔股份有限公司 | 一种led微显示屏及其制备方法 |
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2018
- 2018-04-17 CN CN201810345076.6A patent/CN108511384B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150060870A1 (en) * | 2013-08-30 | 2015-03-05 | Jae-Sang Ro | Supporting substrate for manufacturing flexible information display device, manufacturing method thereof, and flexible information display device |
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CN108511384A (zh) | 2018-09-07 |
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Effective date of registration: 20240207 Address after: Room A107, Research Building A, Neifo High tech Think Tank Center, Nanhai Software Technology Park, Shishan Town, Nanhai District, Foshan City, Guangdong Province, 528000 Patentee after: Guangdong fozhixin microelectronics technology research Co.,Ltd. Country or region after: China Address before: No.729, Dongfeng East Road, Yuexiu District, Guangzhou City, Guangdong Province 510060 Patentee before: GUANGDONG University OF TECHNOLOGY Country or region before: China |
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