CN108502526A - Electronic unit conveyer and electronic component inspection device - Google Patents
Electronic unit conveyer and electronic component inspection device Download PDFInfo
- Publication number
- CN108502526A CN108502526A CN201810164320.9A CN201810164320A CN108502526A CN 108502526 A CN108502526 A CN 108502526A CN 201810164320 A CN201810164320 A CN 201810164320A CN 108502526 A CN108502526 A CN 108502526A
- Authority
- CN
- China
- Prior art keywords
- temperature
- electronic unit
- temperature sensor
- inspection
- mounting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/902—Devices for picking-up and depositing articles or materials provided with drive systems incorporating rotary and rectilinear movements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
- F25B2400/01—Heaters
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2700/00—Sensing or detecting of parameters; Sensors therefor
- F25B2700/21—Temperatures
Abstract
Present invention offer can be by the electronic unit conveyer and electronic component inspection device that desired temperature is checked.Electronic unit conveyer is characterized in that having：Transport portion transports electronic unit；Mounting portion loads the electronic unit；Heat cooling end, at least one party in the mounting portion being heated and be cooled down；First temperature sensor detects that the temperature of the mounting portion is used as the first temperature；Second temperature sensor detects that the temperature of the mounting portion is used as second temperature；And shell, it is configured at the mounting portion, stores first temperature sensor and the second temperature sensor.
Description
Technical field
The present invention relates to electronic unit conveyer and electronic component inspection devices.
Background technology
In the past, it is known that check the electronic component inspection device of the electrical characteristic of the electronic unit such as IC devices, the electricity
Subassembly check device is assembled with the electronic unit conveyer for transporting IC devices (referring for example to patent document 1).
Electronic component inspection device recorded in patent document 1 has：It transports the transport portion of electronic unit, be placed with electronics
The temperature detecting part of the temperature of the mounting portion of component, the temperature regulation section of the temperature of adjusting mounting portion and detection mounting portion.
Existing technical literature
Patent document
Patent document 1：Special open 2000-310665 bulletins
But temperature detecting part, with reuse, the accuracy of detection of temperature can reduce.It has been dropped in the accuracy of detection of temperature
In the state of low, when making electronic component inspection device work, the temperature of mounting portion will not become desirable temperature, the ministry of electronics industry
The inspection precision of part reduces.This includes not only that the temperature detecting point of temperature detecting part (such as is referred to as in thermocouple
The tie point of Junction) neighbouring aging deterioration further includes the connector for temperature detecting part to be connected to device circuit
Deng contact point at resistance variation.
Invention content
The present invention is completed to solve at least part of the technical problem, can be come as the following contents real
It is existing.
The electronic unit conveyer of the present invention is characterized in that having：Transport portion transports electronic unit；Mounting portion carries
Set the electronic unit；Heat cooling end, at least one party in can the mounting portion being heated and be cooled down；First temperature
Sensor detects that the temperature of the mounting portion is used as the first temperature；Second temperature sensor detects the mounting portion
Temperature is used as second temperature；And shell, it is configured at the mounting portion, stores first temperature sensor and described second
Temperature sensor.
The first temperature sensor can be for example set as a result, has the function of the temperature of detection surrounding, second temperature sensor
Have the function of detecting the composition whether the first temperature sensor is working normally.Also, these first temperature sensors and
Second temperature sensor is configured in 1 shell, thus can by 1 sensor unit to the temperature detection of surrounding with whether
The temperature detection that surrounding can normally be carried out is detected.
In the electronic unit conveyer of the present invention, preferably described first temperature sensor and second temperature sensing
Utensil has platinum resistive element.
The temperature of surrounding can be accurately detected as a result,.
In the electronic unit conveyer of the present invention, preferably described first temperature sensor and second temperature sensing
Device is distinguished one end and is connect with the first wiring, and the other end is connect with the second wiring, in first wiring and second wiring
At least one party has the multiple wirings connected in parallel each other.
As a result, by the wiring connected in parallel each other, the value of the resistance value of wiring lengths definitely, therefore
The resistance value of wiring lengths can be offset and improve the temperature detecting precision of the first temperature sensor and second temperature sensor.
In the electronic unit conveyer of the present invention, preferably the multiple wiring is connect with bridgt circuit.
Operating personnel can think that at least one party in the first temperature sensor and second temperature sensor has occurred as a result,
Sensor unit can be changed to new product or be safeguarded (repair) by aging deterioration.
The present invention electronic unit conveyer in, preferably detected in first temperature sensor described first
In the case that the difference for the second temperature that temperature is detected with the second temperature sensor has been more than preset value, lead to
Know that the difference has been more than preset value.
Operating personnel can think that at least one party in the first temperature sensor and second temperature sensor has occurred as a result,
Sensor unit can be changed to new product, or be safeguarded (repair) by aging deterioration.
In the electronic unit conveyer of the present invention, first temperature is preferably based on to control the heating cooling
Portion.
The temperature of mounting portion can be remained desired temperature as a result, can accurately be checked.
In the electronic unit conveyer of the present invention, the preferably described shell is cylindrical.
It is readily susceptible to setting shell as a result,.
In the electronic unit conveyer of the present invention, at least one end of the preferably described shell has curvature.
It is readily susceptible to setting shell as a result,.
In the electronic unit conveyer of the present invention, the preferably described shell is in strip, first temperature sensor
It is configured along the long side direction arrangement of the shell with the second temperature sensor.
Even if the first temperature sensor and second temperature sensor can be accommodated in if the diameter of shell is smaller as a result,
In shell.
In the electronic unit conveyer of the present invention, preferably described first temperature sensor and second temperature sensing
Device is radially arranged the shell.
Even if the first temperature sensor and second temperature sensor can be accommodated in if the length of shell is shorter as a result,
In shell.
In the electronic unit conveyer of the present invention, thermal conductivity filler is configured with preferably in the shell.
As a result, the heat around the first temperature sensor and second temperature sensor be easy to be transmitted to the first temperature sensor and
Second temperature sensor.Thus, the temperature detecting precision of the first temperature sensor and second temperature sensor can be improved.
In the electronic unit conveyer of the present invention, the preferably described mounting portion is configured at the inspection for carrying out the electronic unit
The inspection area looked into.
The temperature that mounting portion can accurately be detected as a result, contributes to inspection with high accuracy.
In the electronic unit conveyer of the present invention, the preferably described heating cooling end is provided with multiple.
Heating cooling end can be set as a result, by mounting portion, can be heated and be cooled down by mounting portion.
In the electronic unit conveyer of the present invention, the preferably described shell can be assembled and disassembled relative to the mounting portion.
As a result, for example when sensor unit is needed replacing due to aging deterioration, it can be carried out with the sensor unit of new product
It replaces.
In the electronic unit conveyer of the present invention, the preferably described shell can be configured at the mounting across thermal conducting agent
Portion.
As a result, the heat around the first temperature sensor and second temperature sensor be easy to be transmitted to the first temperature sensor and
Second temperature sensor.Thus, the temperature detecting precision of the first temperature sensor and second temperature sensor can be improved.
In the electronic unit conveyer of the present invention, the preferably described heating cooling end has heater.
Mounting portion can be heated as a result,.Thus, the temperature for the electronic unit for being configured at mounting portion can be remained desired temperature
Degree.
The present invention electronic unit conveyer in, preferably it is described heating cooling end have refrigerant can by flow path.
Mounting portion can be cooled down as a result,.Thus, the temperature for the electronic unit for being configured at mounting portion can be remained desired temperature
Degree.
In the electronic unit conveyer of the present invention, preferably has and store first temperature and the second temperature
Storage part.
The work of heating cooling end can be controlled based on the first temperature and second temperature as a result,.
In the electronic unit conveyer of the present invention, it can preferably be connect with the inspection portion of the electronic unit is checked, institute
State the inspection result that storage part stores the inspection portion to the electronic unit.
The data of inspection result can be put aside as a result, such as can grasp the ratio etc. of certified products or defective work.
The electronic component inspection device of the present invention is characterized in that having：Transport portion transports electronic unit；Mounting portion carries
Set the electronic unit；Heat cooling end, at least one party in can the mounting portion being heated and be cooled down；First temperature
Sensor detects that the temperature of the mounting portion is used as the first temperature；Second temperature sensor detects the mounting portion
Temperature is used as second temperature；Shell is configured at the mounting portion, stores first temperature sensor and the second temperature
Sensor；And inspection portion, check the electronic unit.
The electronic component inspection device with the electronic unit conveyer can be obtained as a result,.In addition, can incite somebody to action
Electronic unit is transported to inspection portion, thus, the inspection to the electronic unit can be carried out with inspection portion.In addition, can be transported from inspection portion
Inspection look into after electronic unit.
Description of the drawings
Diagrammatic perspective when Fig. 1 is the first embodiment of the electronic component inspection device of the present invention from face side
Figure.
Fig. 2 is the approximate vertical view for the action state for indicating electronic component inspection device shown in FIG. 1.
Fig. 3 is the block diagram of electronic component inspection device shown in FIG. 1.
Fig. 4 is the sectional view that the device that electronic component inspection device shown in FIG. 1 has transports head.
Fig. 5 is the amplification sectional view of sensor unit shown in Fig. 4.
Fig. 6 is the flow chart for the control action for indicating control unit shown in FIG. 1.
Fig. 7 is the coordinate diagram that horizontal axis is indicated with time, the longitudinal axis with the difference of the first temperature and second temperature.
Fig. 8 is the longitudinal section for the sensor unit that the second embodiment of the electronic component inspection device of the present invention has
Figure.
Fig. 9 is the circuit diagram of sensor unit and its peripheral portion shown in FIG. 1.
Reference sign
1：Electronic component inspection device, 10：Electronic unit conveyer, 2：Base portion, 210：Lower surface, 3：Handle, 31：
Hand main body, 32：Sucker, 321：Hole, 4：Heat cooling end, 41：Heater, 42：Flow path, 5：Sensor unit, 50：Shell, 51：
First temperature sensor, 52：Second temperature sensor, 53：First wiring, 531：Wiring, 532：Wiring, 54：Second wiring,
55：Amplifier, 11A：Pallet conveyer, 11B：Pallet conveyer, 12：Temperature regulation section, 13：Device transports head, 14：Device
Part supply unit, 14A：Device supply unit, 14B：Device supply unit, 15：Pallet conveyer, 16：Inspection portion, 17：Device transports
Head, 17A：Device transports head, 17B：Device transports head, 18：Device recoverer, 18A：Device recoverer, 18B：Device recoverer,
19：Recycling pallet, 20：Device transports head, 21：Pallet conveyer, 22A：Pallet conveyer, 22B：Pallet transveyer
Structure, 23：Notification unit, 24：Thermal conductivity filler, 25：Transport portion, 26：Thermal conducting agent, 27：Mounting portion, 90：IC devices, 200：Support
Disk, 231：First partition wall, 232：Second partition wall, 233：Third partition wall, 234：4th partition wall, 235：5th separates
Wall, 241：Protecgulum, 242：Side cover, 243：Side cover, 244：Rear cover, 245：Head cover, 300：Monitor, 301：Show picture, 400：
Signal lamp, 500：Loud speaker, 600：Mouse table, 700：Operation panel, 800：Control unit, 801：CPU、802：Storage part, A：Point
Fulcrum, B：Branch point, C：Branch point, D：Branch point, E：Partly, A1：Pallet supply area, A2：Device supply area, A3：Inspection
Look into region, A4：Device recovery zone, A5：Pallet removes region, S101：Step, S102：Step, S103：Step, S104：Step
Suddenly, S105：Step, S106：Step, S107：Step, S108：Step, S109：Step, V：Power supply, t：Time, tx：Time, T0：
Specified value, Δ T：Difference, α11A：Arrow, α11B：Arrow, α13X：Arrow, α13Y：Arrow, α14：Arrow, α15：Arrow, α17Y：Arrow,
α18：Arrow, α20X：Arrow, α20Y：Arrow, α21：Arrow, α22A：Arrow, α22B：Arrow, α90：Arrow.
Specific implementation mode
Hereinafter, preferred embodiment based on ... shown in the drawings explain in detail the present invention electronic unit conveyer and
Electronic component inspection device.
＜ first embodiments ＞
Hereinafter, referring to Fig.1~Fig. 7 illustrates the implementation of the electronic unit conveyer and electronic component inspection device of the present invention
Mode.In addition, below for convenience of description, as shown in Figure 1, Figure 2, Fig. 4 and Fig. 5 (Fig. 8 is also the same) are shown, by orthogonal 3
Axis is set as X-axis, Y-axis and Z axis.In addition, the X/Y plane comprising X-axis and Y-axis becomes level, Z axis becomes vertical.In addition, will also be with X
The parallel direction of axis is known as " X-direction ", and the direction parallel with Y-axis is known as " Y-direction ", and the direction parallel with Z axis is known as " Z
Direction ".In addition, the direction of the arrow direction of all directions is known as " just ", by opposite to that direction referred to as " negative ".In addition, this
"horizontal" described in application specification is not limited to complete level, as long as not interfering the transport of electronic unit, also include relative to
Horizontal slightly (such as less than 5 ° degree) inclined state.
The electronic unit conveyer 10 of the present invention has appearance shown in FIG. 1.The electronic unit conveyer 10 is place
Reason machine has as shown in Figure 2 and Figure 4：Transport portion 25 transports the IC devices 90 as electronic unit；Mounting portion 27 loads IC
Device 90；Heat cooling end 4, at least one party in mounting portion 27 being heated and be cooled down；First temperature sensor 51, inspection
The temperature for measuring mounting portion 27 is used as the first temperature T1；Second temperature sensor 52 detects the temperature of mounting portion 27 to make
For second temperature T2；And shell 50, it is configured at mounting portion 27, stores the first temperature sensor 51 and second temperature sensor
52。
The first temperature sensor 51 can be for example set as a result, has the function of that temperature, second temperature around detection sense
Device 52 has the function of detecting the composition whether the first temperature sensor 51 is working normally.Also, these first temperature pass
Sensor 51 and second temperature sensor 52 configure in 1 shell 50, therefore can be by 1 sensor unit 5 to surrounding
Temperature detection with whether can normally carry out the temperature detection of surrounding and be detected.
In addition, as shown in Fig. 2, the electronic component inspection device 1 of the present invention has electronic unit conveyer 10, also have
Check the inspection portion 16 of electronic unit.That is, the electronic component inspection device 1 of the present invention has appearance shown in FIG. 1.The ministry of electronics industry
Part conveyer 10 is processor, is had：Transport portion 25 transports the IC devices 90 as electronic unit；Mounting portion 27 loads IC
Device 90；Heat cooling end 4, at least one party in mounting portion 27 being heated and be cooled down；First temperature sensor 51, inspection
The temperature for measuring mounting portion 27 is used as the first temperature T1；Second temperature sensor 52 detects the temperature of mounting portion 27 to make
For second temperature T2；Shell 50 is configured at mounting portion 27, stores the first temperature sensor 51 and second temperature sensor 52；With
And inspection portion 16, check IC devices 90.
The electronic component inspection device 1 with above-mentioned electronic unit conveyer 10 can be obtained as a result,.In addition,
Electronic unit can be transported to inspection portion 16, thus, the inspection to the electronic unit can be carried out with inspection portion 16.In addition, can be from
Transport the electronic unit after checking in inspection portion 16.
Hereinafter, explaining the composition in each portion in detail.
As shown in Figure 1 and Figure 2, the electronic component inspection device 1 of built-in electronic member transferring device 10 is to transport such as conduct
BGA(Ball Grid Array：Ball grid array) encapsulation the electronic units such as IC devices and check, test during the transport
The device of the electrical characteristic of (hereinafter referred to as " checking ") electronic unit.In addition, below for convenience of description, typically illustrating
It the case where IC devices are used as above-mentioned electronic unit, is set to " IC devices 90 ".IC devices 90 are in flat in the present embodiment
Plate.
In addition, as IC devices, other than above-mentioned device, such as " LSI (Large Scale can be enumerated
Integration：Large scale integrated circuit) " " CMOS (Complementary MOS：Complementary metal oxide semiconductor) "
“CCD(Charge Coupled Device：Charge coupling device) ", by multiple IC devices realize module encapsulation " module
IC " and " crystal device ", " inertial sensor (acceleration transducer) ", " gyro sensor ", " refer to " pressure sensor "
Line sensor " etc..
Electronic component inspection device 1 (electronic unit conveyer 10) has：Pallet supply area A1, device supply area
A2 (supply area), inspection area A3, device recovery zone A4 (recovery zone) and pallet remove region A5, these regions are such as
It is described afterwards to be separated by each wall portion.Also, IC devices 90 remove region A5 from pallet supply area A1 to pallet along arrow α90Side
To above-mentioned each region is passed through successively, checked in the inspection area A3 of midway.Electronic component inspection device 1 has in this way：
Electronic unit conveyer 10 has the transport portion 25 that IC devices 90 (electronic unit) are transported in a manner of via each region；Inspection
Portion 16 is looked into, is checked in the A3 of inspection area；And control unit 800.In addition, in addition to this, electronic component inspection device 1 has
Standby monitor 300, signal lamp 400 and operation panel 700.
In addition, the side, i.e. for removing region A5 configured with pallet supply area A1, pallet of electronic component inspection device 1
Downside in Fig. 2 becomes face side, and the upside in side, i.e. Fig. 2 configured with inspection area A3 is used as back side.
In addition, electronic component inspection device 1 carries (setting) such as lower member to use in advance：By IC devices 90 type more
Change be referred to as " replace external member (Change Kit (are also identified as sometimes：' C/K ') " component.There is load in the replacement external member
The mounting component for setting IC devices 90 has the first mounting component for being configured at device supply area A2 and configuration in the mounting component
Second in device recovery zone A4 loads component.As the first mounting component, such as there are aftermentioned temperature regulation section 12, device
Supply unit 14.Second mounting component is, for example, aftermentioned device recoverer 18.In addition, in the mounting component of mounting IC devices 90
In, other than replacement external member as described above, also user prepare pallet 200, recycling use pallet 19 and inspection portion 16.
The first mounting component can be known as by being configured at the pallet 200 of device supply area A2, be configured at the pallet 200 of device recovery zone A4
It can be known as the second mounting component with recycling pallet 19.
Pallet supply area A1 is supplied with the piece supplying portion of the pallet 200 for the multiple IC devices 90 for being arranged non-inspection state.
Pallet supply area A1 can also be known as being laminated and loading the carrying region of multiple pallets 200.In addition, in the present embodiment,
In each pallet 200 multiple recess portions (recess) are configured with rectangular.IC devices 90 can be stored one by one in each recess portion.
Device supply area A2 is from each IC devices 90 before the inspection on the pallet 200 that pallet supply area A1 is transported
(electronic unit) is transported the region for being supplied to (the inspection portion 16) inspection area A3.In addition, with across pallet supply area A1 and
The mode of device supply area A2 is equipped with pallet conveyer 11A, the 11B for transporting pallet 200 in the horizontal direction one by one.Support
Disk conveyer 11A is a part for transport portion 25, and pallet 200 can be made by being placed in every IC devices 90 of the pallet 200 to Y
The positive side in direction, the arrow α i.e. in Fig. 211AIt moves in direction.IC devices 90 can be steadily sent into device supply area as a result,
A2.In addition, pallet conveyer 11B is the arrow α that can make empty pallet 200 into the negative side of Y-direction, i.e. Fig. 211BIt moves in direction
Moving portion.Empty pallet 200 can be made to be moved to pallet supply area A1 from device supply area A2 as a result,.
Temperature regulation section is equipped in the A2 of device supply area, and ((English marks temperature-uniforming plate：Soak plate, Chinese label
(an example)：Temperature-uniforming plate)) 12, device transport head 13 and pallet conveyer 15.In addition, being additionally provided with to cross over device drainage area
The device supply unit 14 that the mode of domain A2 and inspection area A3 move.
Temperature regulation section 12 is a part for the mounting portion 27 of the multiple IC devices of mounting 90, be referred to as heating together or
" temperature-uniforming plate " of the IC devices 90 of the cooling mounting.It can be by temperature-uniforming plate heating in advance or cooling by 16 inspection of inspection portion
Preceding IC devices 90 can be adjusted to be suitble to the temperature of the inspection (high temperature inspection or low temperature inspection).Composition shown in Fig. 2
In, it configures in the Y direction, be fixed with 2 temperature regulation sections 12.Also, by pallet conveyer 11A from pallet supply area A1
The IC devices 90 on pallet 200 moved in can be transported to arbitrary temperature regulation section 12.In addition, the temperature as the mounting component
Degree adjustment portion 12 is fixed, and thus, it is possible to steadily be adjusted into trip temperature to the IC devices 90 in the temperature regulation section 12.In addition, warm
Adjustment portion 12 is spent to be grounded.
It is the handle part for holding IC devices 90 that device, which transports head 13, and being supported in the A2 of device supply area can be in the side X
To with moved in Y-direction, be also supported for moving in z-direction.The device transports the part that head 13 is also transport portion 25,
It can be responsible for from transport IC devices 90 between the pallet supply area A1 pallets 200 moved in and temperature regulation section 12 and in temperature
It spends and transports IC devices 90 between adjustment portion 12 and aftermentioned device supply unit 14.In addition, in fig. 2, using arrow α13XDevice is shown
Head 13 is transported in the movement of X-direction, uses arrow α13YShow that device transports the movement of head 13 in the Y direction.
Device supply unit 14 is one of the mounting portion 27 for loading the IC devices 90 that temperature is had adjusted by temperature regulation section 12
Point, it is referred to as the IC devices 90 capable of being transported to " supply shuttle plate " near inspection portion 16 or is called for short " supply shuttle ".It should
Device supply unit 14 also becomes a part for transport portion 25
In addition, as the device supply unit 14 of mounting component, be supported for can be in device supply area A2 and inspection area A3
Between along the X direction, i.e. arrow α14Direction moves back and forth.Device supply unit 14 can be by IC devices 90 from device drainage area as a result,
Domain A2 is steadily transported near the inspection portion 16 of inspection area A3, in addition, transporting head 17 from inspection by device in IC devices 90
After region A3 is removed, device supply unit 14 makes IC devices 90 turn again to device supply area A2.
In composition shown in Fig. 2, device supply unit 14 is configured with 2 in the Y direction, sometimes by the device of Y-direction negative side
Part supply unit 14 is known as " device supply unit 14A ", and the device supply unit 14 of Y-direction positive side is known as " device supply unit 14B ".And
And the IC devices 90 in temperature regulation section 12 are transported to device supply unit 14A or device supply in the A2 of device supply area
Portion 14B.In addition, device supply unit 14 is similarly configured to be heated or cooled with temperature regulation section 12 is placed in device supply
The IC devices 90 in portion 14.It as a result, can be in the temperature adjustment state for the IC devices 90 for maintaining to be had adjusted temperature by temperature regulation section 12
It is conveyed to afterwards near the inspection portion 16 of inspection area A3.In addition, device supply unit 14 is also in the same manner as temperature regulation section 12
Ground connection.
Pallet conveyer 15 is the empty pallet 200 for the state for being removed whole IC devices 90 in device supply area
To the positive side of X-direction, i.e. arrow α in A215The mechanism that direction is transported.Also, after the transport, empty pallet 200 is transported by pallet
Mechanism 11B is sent to return to pallet supply area A1 from device supply area A2.
Inspection area A3 is the region for checking IC devices 90.In the A3 of the inspection area, equipped with being examined to IC devices 90
The inspection portion 16 looked into and device transport head 17.
Device transports the part that head 17 is transport portion 25, can hold the IC devices for maintaining above-mentioned temperature adjustment state
90, the IC devices 90 can be transported in the A3 of inspection area.Device transport head 17 is supported in the A3 of inspection area can be in the side Y
To with moved back and forth in Z-direction, become a part for the mechanism for being referred to as " index arm ".As a result, device transport head 17 can will be from
IC devices 90 on the device supply unit 14 that device supply area A2 is moved in are transported, are placed in inspection portion 16.In addition, in Fig. 2
In, use arrow α17YIndicate that device transports the reciprocating movement of head 17 in the Y direction.In addition, though device, which transports head 17, is supported for energy
It moves back and forth in the Y direction, but not limited to this, can also be supported for moving back and forth in the X direction.In addition, in Fig. 2
Shown in constitute in, device transport head 17 in the Y direction be configured with 2, sometimes by the device of Y-direction negative side transport head 17 be known as
The device of positive side in the Y direction is transported head 17 and is known as " device transports head 17B " by " device transports head 17A ".Device transports head 17A
It can be responsible in the A3 of inspection area transporting IC devices 90 from device supply unit 14A to inspection portion 16, device transports head 17B and can bear
Duty transports IC devices 90 from device supply unit 14B to inspection portion 16 in the A3 of inspection area.
In addition, device transports head 17 it is configured to that the IC devices of holding can be heated or cooled in the same manner as temperature regulation section 12
90.The temperature adjustment state of IC devices 90 can be persistently maintained from device supply unit 14 to inspection portion 16 as a result,.
Inspection portion 16 can be connect with electronic unit conveyer 10, under the connection status, be loaded as electronic unit
IC devices 90 check the electrical characteristic of the IC devices 90.It is more equipped with being electrically connected with the terminal of IC devices 90 in the inspection portion 16
A probe.Also, it can be electrically connected, be contacted to carry out the inspection of IC devices 90 with probe by the terminal of IC devices 90.It is based on
What the tester by being connected to inspection portion 16 had checks that the program of control unit storage carries out the inspection of IC devices 90.In addition,
Also the IC devices 90 can be adjusted to be suitble to by the way that IC devices 90 are heated or cooled in the same manner as inspection portion 16 and temperature regulation section 12
The temperature of inspection.The inspection portion 16 is also a part for mounting portion 27.
Device recovery zone A4 be from inspection portion 16 transport and recycle in the A3 of inspection area be examined and the inspection
The region of multiple IC devices 90 (electronic unit) after the i.e. inspection terminated.Recycling is equipped in the A4 of the device recovery zone to hold in the palm
Disk 19, device transport head 20 and pallet conveyer 21.In addition, being additionally provided with to cross over inspection area A3 and device recovery zone
The device recoverer 18 that the mode of A4 moves.In addition, being also prepared for empty pallet 200 in the A4 of device recovery zone.
Device recoverer 18 is a part for the mounting portion 27 for the IC devices 90 that the inspection in mounting inspection portion 16 has terminated, energy
The IC devices 90 are transported to device recovery zone A4, are referred to as " recycling shuttle plate " or referred to as " recycling shuttle ".The device
Recoverer 18 also becomes a part for transport portion 25.
In addition, device recoverer 18 be supported for can between inspection area A3 and device recovery zone A4 along the X direction,
That is arrow α18Direction moves back and forth.In addition, in composition shown in Fig. 2, device recoverer 18 is in the same manner as device supply unit 14
It is configured with 2 in the Y direction, the device recoverer 18 of Y-direction negative side is known as " device recoverer 18A " sometimes, just by Y-direction
The device recoverer 18 of side is known as " device recoverer 18B ".Also, the IC devices 90 in inspection portion 16 are transported, are placed on device
Part recoverer 18A or device recoverer 18B.It is responsible for returning IC devices 90 from inspection portion 16 to device in addition, device transports head 17A
Receipts portion 18A is transported, and device, which transports head 17B, to be responsible for transporting IC devices 90 from inspection portion 16 to device recoverer 18B.In addition, device
Part recoverer 18 is also likely grounded with temperature regulation section 12 or device supply unit 14.
Recycling pallet 19 is the mounting component for loading the IC devices 90 checked by inspection portion 16, is fixed as returning in device
Receiving can not move in the A4 of region.As a result, in the device recovery zone for being more configured with the various movable parts such as device transport head 20
In A4, it can will also check that the IC devices 90 finished are steadily placed on recycling pallet 19.In addition, composition shown in Fig. 2
In, 3 recycling pallets 19 can be configured along the X direction.
In addition, empty pallet 200 is configured with 3 also along X-direction.The empty pallet 200 also becomes mounting and has been examined portion 16
The mounting component of the IC devices 90 of inspection.Also, the IC devices 90 being moved on the device recoverer 18 of device recovery zone A4
Any one for being transported, being placed in recycling pallet 19 and empty pallet 200.IC devices 90 press each inspection result as a result,
It is classified, recycles.
Device transport head 20, which has, to be supported in the x-direction and the z-direction moving in turn in the A4 of device recovery zone
The part that can also be moved in z-direction.The device transports the part that head 20 is transport portion 25, can return IC devices 90 from device
Receipts portion 18 is transported to recycling pallet 19 or empty pallet 200.In addition, in fig. 2, using arrow α20XShow that device transports head 20 in X
The movement in direction, uses arrow α20YShow that device transports the movement of head 20 in the Y direction.
Pallet conveyer 21 be by from pallet remove empty pallet 200 that region A5 is moved in the A4 of device recovery zone to
X-direction, i.e. arrow α21The mechanism that direction is transported.Also, after the transport, empty pallet 200 is configured at what IC devices 90 were recovered
Position becomes any one in above-mentioned 3 empty pallets 200.
It is that the pallet 200 for being arranged the multiple IC devices 90 for checking the state that finishes is recycled and removed that pallet, which removes region A5,
Remove material portion.Multiple pallets 200 can be laminated in pallet removes region A5.
In addition, being equipped with pallet 200 one by one to the side Y in a manner of removing region A5 across device recovery zone A4 and pallet
Pallet conveyer 22A, pallet conveyer 22B to transport.Pallet conveyer 22A is a part for transport portion 25, is
Pallet 200 can be made to Y-direction, i.e. arrow α22AThe moving portion that direction moves back and forth.The IC devices 90 that inspection can be finished as a result,
From device recovery zone, A4 is transported to pallet and removes region A5.In addition, pallet conveyer 22B can be used in recycling IC devices 90
Empty pallet 200 to the positive side of Y-direction, i.e. arrow α22BIt moves in direction.Empty pallet 200 can be made to remove region A5 from pallet as a result,
It is moved to device recovery zone A4.
As shown in figure 3, control unit 800 has CPU801 and storage part 802.
CPU801 can for example control pallet conveyer 11A, pallet conveyer 11B, temperature regulation section 12, device and transport
First 13, device supply unit 14, pallet conveyer 15, inspection portion 16, device transport head 17, device recoverer 18, device and transport
First 20, pallet conveyer 21, pallet conveyer 22A, pallet conveyer 22B and aftermentioned heating cooling end 4 etc. are each
The work in portion.
Storage part 802 such as including the nonvolatile memories such as volatile memory RAM, ROM, EPROM, EEPROM,
Nonvolatile memory that flash memories etc. can be rewritten and (can eliminate, rewrite) etc., various semiconductor memories (IC memories)
Deng.
The program etc. of inspection is stored in storage part 802.In addition, storing aftermentioned first temperature in storage part 802
The second temperature etc. that the first temperature and second temperature sensor 52 that sensor 51 detects detect.That is, electronic unit inspection
Device 1 has the storage part 802 of storage the first temperature and second temperature.As a result, as described later, the first temperature and second can be based on
Temperature heats the work of cooling end 4 to control.
In addition, as described above, electronic unit conveyer 10 can be with the inspection portion 16 of inspection IC devices 90 (electronic unit)
Connection, storage part 802 can store inspection result of the inspection portion 16 to IC devices 90 (electronic unit).Inspection knot can be put aside as a result,
The data of fruit, such as the ratio etc. of certified products or defective work can be grasped.
In addition, operating personnel can set via monitor 300 or confirm the operation condition of electronic component inspection device 1
Deng.The monitor 300 is configured at electronic component inspection device 1 just for example with the display picture 301 including liquid crystal panel
Surface side top.As shown in Figure 1, the right side in the figure that pallet removes region A5 is equipped with the Mouse table 600 of mounting mouse.Work as operation
The mouse is used when the picture shown in monitor 300.
In addition, being configured with operation panel 700 in the lower right of Fig. 1 relative to monitor 300.Operation panel 700 and monitoring
Device 300 independently orders desired action to electronic component inspection device 1.In addition, can show (notice) electricity in monitor 300
The working condition etc. of subassembly check device 1.
In addition, signal lamp 400 can notify the working condition of electronic component inspection device 1 by the combination of luminous color
Deng.Signal lamp 400 is configured at the top of electronic component inspection device 1.It is raised in addition, being built-in in electronic component inspection device 1
Sound device 500, moreover it is possible to the working condition etc. that electronic component inspection device 1 is notified by the loud speaker 500.
In this way, monitor 300, signal lamp 400 and loud speaker 500 are functioned as notification unit 23.
In electronic component inspection device 1, by the first partition wall between pallet supply area A1 and device supply area A2
231 divide, and are divided by the second partition wall 232 between device supply area A2 and inspection area A3, and inspection area A3 and device return
It is divided by third partition wall 233 between receipts region A4, is separated by the 4th between device recovery zone A4 and pallet removing region A5
Wall 234 divides.In addition, also being divided by the 5th partition wall 235 between device supply area A2 and device recovery zone A4.
Electronic component inspection device 1 outermost layer packaging by lid cover, for example have in the lid protecgulum 241, side cover 242,
Side cover 243, rear cover 244, head cover 245.
In addition, in the present specification, device transports head 13, device transports head 17 (device transport head 17A and device transport head
17B) and device transports " holding " of IC devices 90 that head 20 carries out and is also contained in " mounting ".That is, device transports head 13, device
Part transports head 17A, device transports head 17B, device transports head 20 and is included in the mounting portion 27 of mounting IC devices 90.Thus, it carries
Portion 27 is set other than above-mentioned temperature regulation section 12, device supply unit 14 and device recoverer 18, also there is device to transport head
13, device transports head 17 and device transports head 20.
Then, illustrate that device transports head 13, device transports head 17A, device transports head 17B, device transports the composition of head 20,
These are roughly the same compositions, therefore following typically illustrate that device transports head 17A.
As shown in figure 4, device transport head 17A have base portion 2, multiple handles 3, be built in each handle 3 respectively heating it is cold
But portion 4 and it is built in the sensor unit 5 of each handle 3 respectively.
Base portion 2 is plate-like component.It is equipped with multiple handles 3 in the lower surface of base portion 2 210.That is, base portion 2 is to prop up together
Support the component of multiple handles 3.Each handle 3 is similarly to constitute, therefore typically illustrate 1 handle 3 below.
Handle 3 has the handle body 31 of 2 side of base portion and the sucker 32 set on the lower end of handle body 31.Handle body
31 be in strip, is built-in with attitude regulation portion (not shown) etc..Sucker 32 is to be assemblied in handle body 31 and can assemble and disassemble, adsorb IC
The component of device 90.
In addition, handle 3 is set to handle body 31 and sucker 32, there is the inner cavity opened to the lower surface of sucker 32 (not
Diagram), such as it is connected to injector.Inner cavity is set to generate negative pressure, sucker 32 can adsorb and hold IC devices 90 as a result, in addition,
It can be held by releasing negative pressure to release the absorption of IC devices 90 under the adsorbed state.
Heating cooling end 4 handle 3 can be heated and be cooled down at least one party's (being in the present embodiment both sides).
Heat cooling end 4 have heater 41 and refrigerant can by flow path 42.
Heating cooling end 4 has heater 41, and thus, it is possible to heat handle 3.Thus, the IC devices that can will be held by handle 3
90 temperature remains desired temperature.In addition, heater 41 can for example be set as having through electric current as shown in the figure to generate heat
Heating wire composition.
In addition, heating cooling end 4 have refrigerant can by flow path, thus, it is possible to pass through refrigerant supply unit (not shown) supply
Refrigerant and cool down handle 3.Thus, the temperature of the IC devices 90 held by handle 3 can be remained desired temperature.
This heating cooling end 4 is electrically connected with control unit 800 as shown in Figure 3, controls its work.
As shown in figure 5, sensor unit 5 has shell 50, the first temperature sensor 51 and second temperature sensor 52.
Shell 50 includes cylindrical babinet, the hole 321 of embedded sucker 32.In addition, shell 50 is pressed relative to handle 3
The direction configuration that long side direction intersects.Shell 50 is cylindrical, and thus, it is possible to easy to set up in the hole of sucker 32 321.
In addition, the top end part (at least one end) of shell 50 has curvature.As a result, when the hole 321 of embedded sucker 32, energy
Top end part is readily inserted into hole 321, later, is pressed to direction of insertion, thus, it is possible to be easily embedded into.
In addition, shell 50 can be inserted into or take out relative to hole 321.That is, shell 50 can be relative to one as mounting portion 27
Partial handle 3 is assembled and disassembled.It, can be with the sensor of new product as a result, for example when sensor unit 5 is needed replacing due to aging deterioration
Unit 5 is replaced.
In addition, shell 50 can be configured at the handle of the part as mounting portion 27 across the thermal conducting agent 26 of excellent thermal conductivity
3.The heat around the first temperature sensor 51 and second temperature sensor 52 is easy to be transmitted to 51 He of the first temperature sensor as a result,
Second temperature sensor 52.Thus, the temperature detecting precision of the first temperature sensor 51 and second temperature sensor 52 can be improved.
As thermal conducting agent 26, such as heat-conducting cream can be used.Can play as a result, said effect and when by shell 50 from hole
321 are also used as lubricant plays function when being inserted into or taking out.The replacement of sensor unit 5 for example can be promptly carried out as a result,.
First temperature sensor 51 and second temperature sensor 52 are respectively provided with platinum resistive element (platinum temperature detecting resistance).First
Temperature sensor 51 and second temperature sensor 52 are electrically connected via the first wiring 53 and the second wiring 54 with control unit 800 respectively
(with reference to Fig. 3).
Control unit 800 supplies electric current via the first wiring 53 and the second wiring 54 to platinum resistive element, measures platinum resistance member
The resistance value of part.In addition, storage part 802 is for example stored with the resistance value of platinum resistive element and the calibration curve of temperature.Control unit
800 can detect the temperature of platinum resistive element based on the resistance value that platinum resistive element detects and calibration curve.Also, it will detect
The temperature of platinum resistive element be considered as the temperature around platinum resistive element, the first temperature sensor 51 and second temperature pass as a result,
Sensor 52 can detect the temperature of surrounding.
First temperature sensor 51 and second temperature sensor 52 have platinum resistive element (platinum temperature detecting resistance), and thus, it is possible to standards
Really detect the temperature of surrounding.
In addition, as shown in figure 5, being configured with the thermal conductivity filler 24 of excellent thermal conductivity in shell 50.First temperature as a result,
Heat around degree sensor 51 and second temperature sensor 52 is easy to be transmitted to the first temperature sensor 51 and second temperature sensing
Device 52.Thus, the temperature detecting precision of the first temperature sensor 51 and second temperature sensor 52 can be improved.
As the thermal conductivity filler 24, as long as having above-mentioned function, it is not particularly limited, such as epoxy can be enumerated
Resin, organic siliconresin, phenolic resin etc..
In addition, shell 50 is in the long side of strip, the first temperature sensor 51 and second temperature sensor 52 in shell 50
It is arranged on direction.Even if the first temperature sensor 51 and second temperature can be passed if the diameter of shell 50 is smaller as a result,
Sensor 52 is accommodated in shell 50.Thus, even if sensor unit 5 can be arranged if thinner in hole 321.
First temperature sensor 51 and second temperature sensor 52 are that one end is connected to the first wiring 53 respectively, and the other end connects
It is connected to the second wiring 54, is electrically connected with control unit 800 by the first wiring 53 and the second wiring 54.In addition, 53 He of the first wiring
At least one party's (being in the present embodiment the first wiring 53) in second wiring 54 is multiple (at this with what is be connected in parallel with each other
It is 2 in embodiment) wiring 531,532.Although the first wiring 53 and the second wiring 54 also depend on control unit 800 and handle
3 position relationship, but existing becomes longer tendency.First wiring 53 and the second wiring 54 are such as including copper wire, resistance
As the first wiring 53 and the second wiring 54 are elongated and increase.The tendency that temperature detecting precision is reduced with the increase is shown.
Therefore, the first wiring 53 has the wiring 531,532 being connected in parallel with each other, and thus, it is possible to make the reduction of the resistance of the first wiring 53.For
The value for distinguishing the resistance value of wiring lengths can make the resistance value of wiring lengths offset and improve the first temperature sensor and second
The temperature detecting precision of temperature sensor.Thus, the temperature of the first temperature sensor 51 and second temperature sensor 52 can be improved
Accuracy of detection.
Here, Fig. 9 is the circuit diagram of sensor unit 5 and its peripheral portion, the first temperature sensor is typically illustrated
51.In the figure, the resistance that the first temperature sensor 51 is indicated with Rt indicates resistance, the wiring of the first wiring 53 with R1 respectively
531,532 resistance.
Circuit shown in Fig. 9 includes bridgt circuit, has branch point A, B, C, D.Portion between branch point A and branch point D
It includes the second wiring 54, the first temperature sensor 51 and wiring 532 to divide.Wiring 532 is connected to branch point B, and wiring 531 connects
Part E between the first temperature sensor 51 and branch point D.In addition, being equipped with power supply near the branch point B of wiring 531
V.Also, branch point A and branch point C are connected respectively to amplifier 55, and control unit 800 is connected to via amplifier 55.
In this way, wiring 531,532 is connected to bridgt circuit, therefore the resistance quilt of outer lead (wiring in 50 outside of shell)
It assigns to the both sides of bridge joint and offsets, therefore the influence of the resistance of outer lead can be reduced.As a result, outer lead it is elongated or
In the case of temperature change around person, high temperature detecting precision can be also maintained.
Above-mentioned handle 3 is equipped with multiple heating cooling ends 4, and 1 heating cooling end 4 is equipped with by each of each handle 3.By
This, can be heated and be cooled down by each handle 3.Also, sensor unit 5 is also equipped with multiple, is equipped with by every leader 3
1 sensor unit 5.It as a result, can be by every leader 3 into the detection of trip temperature.
Although in addition, in the present embodiment to 1 heating cooling end 4 be equipped with 1 sensor unit 5, can also
Multiple (such as 2) sensor units 5 are equipped with to 1 heating cooling end 4.
In addition, in electronic component inspection device 1, the handle 3 as mounting portion, which is configured at, carries out the 90 (ministry of electronics industry of IC devices
Part) inspection inspection area A3.That is, in electronic component inspection device 1, it is built-in with heating cooling end 4 and sensor unit 5
Handle 3 be suitble to device transport head 17.The temperature that device transports head 17 can be accurately detected as a result, contribute to inspection with high accuracy
It looks into.
In this electronic component inspection device 1, for example occur in sensor unit 5 sometimes aging deterioration (such as
It is deteriorated caused by aoxidizing).In the case where deterioration has occurred, the accuracy of detection of temperature is reduced according to the degree of deterioration.
When electronic component inspection device 1 being made to work under the lowered state of accuracy of detection of temperature, it is difficult to protect the temperature of IC devices 90
It holds as desired temperature, it is difficult to accurately be checked.
Electronic component inspection device 1 becomes for solving the problems, such as this effectively to constitute.Hereinafter, about the content with reference to figure
Flow chart shown in 6 and the control action for illustrating electronic component inspection device 1, typically illustrate device as described above
Part transports the sensor unit 5 of head 17.In addition, each sensor unit 5 is similarly controlled, therefore typically illustrate below
1 sensor unit 5.
First, in step S101, heating cooling end 4 is made to work, carries out the temperature adjusting that device transports head 17, starts IC
The inspection (transport) of device 90.
Then, in step s 102, the first temperature T is detected by the first temperature sensor 511.By first temperature T1Depending on
The temperature of head 17 is transported for device, is based on first temperature T1To control heating cooling end 4.Device can be transported head 17 as a result,
Temperature remain desired temperature, can accurately be checked.
Next, in step s 103,2 temperature T are detected by second temperature sensor 522。
Also, in step S104, the first temperature T is calculated1With second temperature T2Difference Δ T (| Δ T |), in step S105
In, judge whether poor Δ T is specified value T as preset value0Below.
In step S105, judging that difference Δ T is the specified value T as preset value0In the case of below, in step
Judge to check whether in rapid S106 and be completed.Be judged as checking do not complete in the case of, return to step S102, repeat following
The step of.
On the other hand, in step S105, it is being judged as that poor Δ T is more than the specified value T as preset value0Feelings
(with reference to Fig. 7) under condition, stops the work that device transports head 17 in step s 107, interrupt and check.
In addition, coordinate diagram shown in Fig. 7 is horizontal axis is time t, the coordinate diagram that the longitudinal axis is poor Δ T, after aging deterioration in-depth
Poor Δ T becomes larger, when for time txWhen, poor Δ T reaches specified value T0。
After interrupting inspection, in step S108, in the first temperature T that the first temperature sensor 51 detects1With second
The second temperature T that temperature sensor 52 detects2Difference Δ T be more than specified value T as preset value0In the case of,
Notify that difference has been more than the specified value T as preset value by notification unit 230.Operating personnel can be considered as in the first temperature as a result,
Aging deterioration has occurred in degree sensor 51, sensor unit 5 can be changed to new product, can be safeguarded (repair).
In addition, operating personnel replace or after being safeguarded (repair) having carried out new product to sensor unit 5,
Such as inspection can be started again at by the opening button (not shown) again of pressing operation panel 700.
In step S109, in the case where being judged as that opening button again has been pressed, step S101 is returned to, is repeated below
Step.
In this way, according to electronic component inspection device 1 (electronic unit conveyer 10), the first temperature sensor 51 has inspection
The function of ambient temperature is surveyed, second temperature sensor 52 has the work(whether the first temperature sensor 51 of detection is working normally
Energy.Also, these first temperature sensors 51 and the configuration of second temperature sensor 52 can pass through 1 in 1 shell 50
Can sensor unit 5 be normally carried out the temperature detection of surrounding come the temperature and detection that detect surrounding.In addition, notifying the detection
As a result prompting changing or maintenance after, thus, it is possible to the inspection of IC devices 90 is carried out by desired temperature.
In addition, as described above, there is mounting portion 27 temperature regulation section 12, device to transport head 13, device supply unit 14, device
It transports head 17, device recoverer 18 and device and transports head 20.Thus, transport head 13, device in these temperature regulation sections 12, device
Part supply unit 14, device, which transport head 17, device recoverer 18 and device transport in head 20 built-in to heat cooling end 4, can be into
Row control same as described above.
＜ second embodiments ＞
Hereinafter, illustrating that the electronic unit conveyer of the present invention and the second of electronic component inspection device are implemented with reference to Fig. 8
Mode is illustrated centered on the difference with the above embodiment, omits the explanation to identical item.
Present embodiment is the same as the above first embodiment other than the composition of sensor unit.
As shown in figure 8, in the present embodiment, the first temperature sensor 51 and second temperature sensor 52 are in shell 50
Radially it is arranged.That is, the position phase of the first temperature sensor 51 and second temperature sensor 52 in the axial direction of shell 50
Together.Even if the first temperature sensor 51 and second temperature sensor 52 can be accommodated in if the length of shell 50 is shorter as a result,
In shell 50.Thus, even if sensor unit 5 can be arranged if shorter in hole 321.
The electronic unit conveyer and electronic unit inspection dress of the present invention are illustrated above by embodiment illustrated
It sets, but the invention is not restricted to this, and each portion of composition electronic unit conveyer and electronic component inspection device can be replaced into can
Play being formed arbitrarily for identical function.Furthermore it is possible to add arbitrary construct.
In addition, the electronic unit conveyer and electronic component inspection device of the present invention can will be in the respective embodiments described above
, the combination of arbitrary 2 or more compositions (feature).
In addition, in the respective embodiments described above, illustrate the first temperature sensor have the function of detecting ambient temperature and
Second temperature sensor has the function of the case where whether the first temperature sensor is working normally detected, but can also be
Second temperature sensor has the function of detecting ambient temperature and there is the first temperature sensor detection second temperature sensor to be
The composition of the no function of working normally.
In addition, be the composition of the detection second temperature after detecting the first temperature in the respective embodiments described above, but
The first temperature can be detected after detecting second temperature, can also detect the first temperature and second temperature simultaneously.
In addition, in the above-described first embodiment, illustrate to be inserted into shell to mounting portion until the first temperature sensor and
Second temperature sensor both sides are located at the situation in mounting portion, and but the invention is not restricted to this, can also be with the first temperature sensing
The mode that device is located in mounting portion, second temperature sensor is located on the outside of mounting portion is inserted into.In this case, the first temperature sensing
Device also can accurately detect the temperature of mounting portion and can detect the deterioration of the first temperature sensor.
In addition, in the respective embodiments described above, illustrating to detect the first temperature when carrying out the inspection of electronic unit
The case where deterioration of sensor, but the invention is not restricted to this, and the work of heating cooling end can also be made to detect first before inspection
The deterioration of temperature sensor.It can prevent from interrupting as a result, and check, can prevent from checking that efficiency reduces.
In addition, in the respective embodiments described above, illustrating that the side in the first wiring and the second wiring has and being connected in parallel to each other
The case where multiple wirings of connection, but the invention is not restricted to this, and the both sides in the first wiring and the second wiring can also have
The multiple wirings being connected in parallel with each other.
Claims (20)
1. a kind of electronic unit conveyer, which is characterized in that have：
Transport portion transports electronic unit；
Mounting portion loads the electronic unit；
Heat cooling end, at least one party in can the mounting portion being heated and be cooled down；
First temperature sensor detects that the temperature of the mounting portion is used as the first temperature；
Second temperature sensor detects that the temperature of the mounting portion is used as second temperature；And
Shell is configured at the mounting portion, stores first temperature sensor and the second temperature sensor.
2. electronic unit conveyer according to claim 1, which is characterized in that
First temperature sensor and the second temperature sensor have platinum resistive element.
3. electronic unit conveyer according to claim 1, which is characterized in that
First temperature sensor and the second temperature sensor are distinguished one end and are connect with the first wiring, the other end and second
Wiring connects,
At least one party in first wiring and second wiring has the multiple wirings connected in parallel each other.
4. electronic unit conveyer according to claim 3, which is characterized in that
The multiple wiring is connect with bridgt circuit.
5. electronic unit conveyer according to claim 1, which is characterized in that
Described in being detected in first temperature and the second temperature sensor that first temperature sensor detects
In the case that the difference of second temperature has been more than preset value, notify that the difference has been more than preset value.
6. electronic unit conveyer according to claim 1, which is characterized in that
The electronic unit conveyer controls the heating cooling end based on first temperature.
7. electronic unit conveyer according to claim 1, which is characterized in that
The shell is cylindrical.
8. electronic unit conveyer according to claim 7, which is characterized in that
At least one end of the shell has curvature.
9. electronic unit conveyer according to claim 7, which is characterized in that
The shell is in strip,
First temperature sensor and the second temperature sensor are configured along the long side direction arrangement of the shell.
10. electronic unit conveyer according to claim 7, which is characterized in that
First temperature sensor and the second temperature sensor are configured along the arranged radially of the shell.
11. electronic unit conveyer according to claim 1, which is characterized in that
Thermal conductivity filler is configured in the shell.
12. electronic unit conveyer according to claim 1, which is characterized in that
The mounting portion is configured at the inspection area for the inspection for carrying out the electronic unit.
13. electronic unit conveyer according to claim 1, which is characterized in that
The heating cooling end is provided with multiple.
14. electronic unit conveyer according to claim 1, which is characterized in that
The shell can be assembled and disassembled relative to the mounting portion.
15. electronic unit conveyer according to claim 1, which is characterized in that
The shell can be configured at the mounting portion across thermal conducting agent.
16. electronic unit conveyer according to claim 1, which is characterized in that
The heating cooling end has heater.
17. electronic unit conveyer according to claim 1, which is characterized in that
It is described heating cooling end have refrigerant can by flow path.
18. electronic unit conveyer according to claim 1, which is characterized in that
The electronic unit conveyer has the storage part for storing first temperature and the second temperature.
19. electronic unit conveyer according to claim 18, which is characterized in that
The electronic unit conveyer can be connect with the inspection portion of the electronic unit is checked,
The storage part is stored in the inspection result of the electronic unit in the inspection portion.
20. a kind of electronic component inspection device, which is characterized in that have：
Transport portion transports electronic unit；
Mounting portion loads the electronic unit；
Heat cooling end, at least one party in can the mounting portion being heated and be cooled down；
First temperature sensor detects that the temperature of the mounting portion is used as the first temperature；
Second temperature sensor detects that the temperature of the mounting portion is used as second temperature；
Shell is configured at the mounting portion, stores first temperature sensor and the second temperature sensor；And
Inspection portion checks the electronic unit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-035984 | 2017-02-28 | ||
| JP2017035984A JP2018141700A (en) | 2017-02-28 | 2017-02-28 | Electronic component conveyance device and electronic component inspection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108502526A true CN108502526A (en) | 2018-09-07 |
| CN108502526B CN108502526B (en) | 2020-05-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810164320.9A Expired - Fee Related CN108502526B (en) | 2017-02-28 | 2018-02-26 | Electronic component conveying device and electronic component inspection device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2018141700A (en) |
| CN (1) | CN108502526B (en) |
| TW (1) | TWI674421B (en) |
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|---|---|---|---|---|
| EP4191241A1 (en) * | 2021-12-03 | 2023-06-07 | Biolin Scientific AB | Qcm apparatus |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10154739A (en) * | 1996-11-18 | 1998-06-09 | Applied Materials Inc | Ultrahigh throughput-wafer vacuum treating system |
| CN1696030A (en) * | 2004-05-13 | 2005-11-16 | 东京毅力科创株式会社 | Substrate transfer mechanism and subtrate transfer apparatus, particle removal method, program, and storage medium |
| CN1920585A (en) * | 2005-08-25 | 2007-02-28 | 日本电产理德株式会社 | Substrate detector and substrate detection method |
| CN102235917A (en) * | 2010-03-23 | 2011-11-09 | 东京毅力科创株式会社 | Wafer-type temperature sensor and manufacturing method thereof |
| CN102695947A (en) * | 2009-12-18 | 2012-09-26 | 东京毅力科创株式会社 | Temperature measuring apparatus |
| CN103180230A (en) * | 2010-09-09 | 2013-06-26 | 莱特拉姆有限责任公司 | System and method for measuring, mapping, and modifying the temperature of a conveyor |
| CN103261862A (en) * | 2010-08-11 | 2013-08-21 | 莫戈公司 | Temperature measurement correction using multiple temperature sensors |
| CN105277870A (en) * | 2014-07-16 | 2016-01-27 | 精工爱普生株式会社 | Electronic component transfer apparatus and electronic component inspection apparatus |
| CN105319460A (en) * | 2014-07-17 | 2016-02-10 | 精工爱普生株式会社 | Electronic component conveying device and electronic component inspection device |
| CN105408730A (en) * | 2013-06-05 | 2016-03-16 | 纽约市哥伦比亚大学理事会 | Mems-based calorimeter, fabrication, and use thereof |
| CN106405369A (en) * | 2015-07-31 | 2017-02-15 | 精工爱普生株式会社 | Electronic component transportation device and electronic component inspection device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7771113B2 (en) * | 2007-06-29 | 2010-08-10 | Cummins Filtration Ip, Inc | Sensor rationality diagnostic |
| TW201409046A (en) * | 2012-05-31 | 2014-03-01 | Advantest Corp | Carrier dismantling device, electronic component housing device, electronic component retrieval method, and electronic component test device |
| JP2016023971A (en) * | 2014-07-17 | 2016-02-08 | セイコーエプソン株式会社 | Electronic component transfer device and electronic component inspection device |
| JP2016161356A (en) * | 2015-02-27 | 2016-09-05 | セイコーエプソン株式会社 | Electronic component conveyance device and electronic component inspection device |
-
2017
- 2017-02-28 JP JP2017035984A patent/JP2018141700A/en active Pending
-
2018
- 2018-02-14 TW TW107105518A patent/TWI674421B/en not_active IP Right Cessation
- 2018-02-26 CN CN201810164320.9A patent/CN108502526B/en not_active Expired - Fee Related
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10154739A (en) * | 1996-11-18 | 1998-06-09 | Applied Materials Inc | Ultrahigh throughput-wafer vacuum treating system |
| CN1696030A (en) * | 2004-05-13 | 2005-11-16 | 东京毅力科创株式会社 | Substrate transfer mechanism and subtrate transfer apparatus, particle removal method, program, and storage medium |
| CN1920585A (en) * | 2005-08-25 | 2007-02-28 | 日本电产理德株式会社 | Substrate detector and substrate detection method |
| CN102695947A (en) * | 2009-12-18 | 2012-09-26 | 东京毅力科创株式会社 | Temperature measuring apparatus |
| CN102235917A (en) * | 2010-03-23 | 2011-11-09 | 东京毅力科创株式会社 | Wafer-type temperature sensor and manufacturing method thereof |
| CN103261862A (en) * | 2010-08-11 | 2013-08-21 | 莫戈公司 | Temperature measurement correction using multiple temperature sensors |
| CN103180230A (en) * | 2010-09-09 | 2013-06-26 | 莱特拉姆有限责任公司 | System and method for measuring, mapping, and modifying the temperature of a conveyor |
| CN105408730A (en) * | 2013-06-05 | 2016-03-16 | 纽约市哥伦比亚大学理事会 | Mems-based calorimeter, fabrication, and use thereof |
| CN105277870A (en) * | 2014-07-16 | 2016-01-27 | 精工爱普生株式会社 | Electronic component transfer apparatus and electronic component inspection apparatus |
| CN105319460A (en) * | 2014-07-17 | 2016-02-10 | 精工爱普生株式会社 | Electronic component conveying device and electronic component inspection device |
| CN106405369A (en) * | 2015-07-31 | 2017-02-15 | 精工爱普生株式会社 | Electronic component transportation device and electronic component inspection device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI674421B (en) | 2019-10-11 |
| JP2018141700A (en) | 2018-09-13 |
| TW201833571A (en) | 2018-09-16 |
| CN108502526B (en) | 2020-05-15 |
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