CN108495444A - Cooling electronic component structure - Google Patents
Cooling electronic component structure Download PDFInfo
- Publication number
- CN108495444A CN108495444A CN201810273577.8A CN201810273577A CN108495444A CN 108495444 A CN108495444 A CN 108495444A CN 201810273577 A CN201810273577 A CN 201810273577A CN 108495444 A CN108495444 A CN 108495444A
- Authority
- CN
- China
- Prior art keywords
- electronic component
- soldering
- coaming plate
- tin layer
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F3/00—Carrying-off electrostatic charges
- H05F3/02—Carrying-off electrostatic charges by means of earthing connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20181—Filters; Louvers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0067—Devices for protecting against damage from electrostatic discharge
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses cooling electronic component structures, including conductive coating, exhaust fan, soldering-tin layer pin and ground pin, radiator main body top is installed by coaming plate, the coaming plate is internally provided with circuit board, the circuit board top is provided with conductive coating, it is provided with mounting groove on the circuit board, soldering-tin layer pin is installed in the mounting groove, soldering-tin layer pin top is equipped with electronic component, the conductive coating left end and right end are mounted on conducting foam, and described ground pin passes through filter screen and coaming plate to be connect with conducting foam.The present invention can substantially reduce the interference of the heat generated in work and electrostatic to electronic component, improve the working efficiency and service life of the present invention, pass through being used cooperatively for mounting groove and soldering-tin layer pin, it can be when electronic component failure needs to weld again, soldering-tin layer pin can be welded directly by being contacted with electric iron, easy to use.
Description
Technical field
The present invention relates to technical field of electronic components, specially cooling electronic component structure.
Background technology
With the development of science and technology, the use of electronic component is more and more, application is also more and more extensive, electronic component
Development also becomes an important symbol of modern science technology development, and electronic component includes resistance, capacitor, potentiometer, electricity
Sub- pipe, radiator, electromechanical original paper and electron chemistry material and component etc.；Although electronic component number of species currently on the market
It is very various, but cooling electronic component problem and electrostatic interference problem annoying the development of technology always, and current electricity
Most of sub- component does not all have heat dissipation and anti-static function, only possesses most basic function, this makes electronic component
Device can become trouble because of heat dissipation and electrostatic problem when in use, and the service life for not only reducing equipment also reduces work
Make efficiency, the electronics devices heat dissipation effect and anti-static effect of the existing antistatic that radiates are not fine, Er Qierong
Easily falling into dust causes service using life to be lower.Therefore, it is unsatisfactory for demand.
Invention content
The purpose of the present invention is to provide cooling electronic component structures, to solve mentioned above in the background art ask
Topic, possessed advantageous effect are；The interference of the heat generated in work and electrostatic to electronic component can be substantially reduced, is carried
The high working efficiency and service life of the present invention can be in electronics member by being used cooperatively for mounting groove and soldering-tin layer pin
When device failure needs to weld again, soldering-tin layer pin can be welded directly by being contacted with electric iron, easy to use.
To achieve the above object, the present invention provides the following technical solutions：Cooling electronic component structure, including conductive painting
Layer, exhaust fan, soldering-tin layer pin and ground pin, radiator main body top are installed coaming plate, are arranged inside the coaming plate
There is circuit board, and circuit board is mounted on radiator main body top, the circuit board top is provided with conductive coating, the circuit
It is provided with mounting groove on plate, soldering-tin layer pin is installed, and gap connects between soldering-tin layer pin and mounting groove in the mounting groove
It connects, soldering-tin layer pin top is equipped with electronic component, and passes through the company of welding between electronic component and soldering-tin layer pin
It connects, the conductive coating left end and right end are mounted on conducting foam, and pass through the company of welding between conducting foam and conductive coating
It connects, described ground pin passes through filter screen and coaming plate to be connect with conducting foam, and passes through the company of welding between ground pin and conducting foam
It connects, the filter screen is mounted on coaming plate left side wall and right side wall, and the coaming plate top is equipped with top plate, the top plate bottom end peace
Equipped with exhaust fan, heat conducting medium filling pipe is installed above the radiator main body left side wall.
Preferably, it is provided with through-hole on the coaming plate left side wall and right side wall, and through-hole is evenly distributed on coaming plate left side wall
On right side wall.
Preferably, the radiator body interior is provided with heat-conducting medium.
Preferably, radiator main body bottom end is equipped with thermal column.
Preferably, the heat conducting medium filling pipe right end is equipped with sealing cover.
Compared with prior art, the beneficial effects of the invention are as follows：The electronics devices of antistatic that can radiate, pass through
Radiator main body, heat-conducting medium, thermal column and exhaust fan are used cooperatively, and can substantially reduce the heat generated in work
Interference to electronic component can be substantially reduced in work by being used cooperatively for conductive coating, conducting foam and ground pin
Interference of the electrostatic of generation to electronic component can be crossed the dust granule in air filtering, be improved by the setting of filter screen
The working efficiency and service life of the present invention can be in electronic component by being used cooperatively for mounting groove and soldering-tin layer pin
When failure needs to weld again, soldering-tin layer pin can be welded directly by being contacted with electric iron, mounting groove and welding
Gap connects between layer pin, and can install electronic component consolidates, and will not lead to electronic component because of shaking, vibrations due to
Loosening and fall off, by the addition of thermal column, the heat that electronic component and circuit board generate at work can be made more
It is uniformly distributed in radiator main body, improves heat dissipation effect, it is easy to use.
Description of the drawings
Fig. 1 is the structural schematic diagram inside the present invention；
Fig. 2 is schematic structural view of the invention.
In figure：1- conductive coatings；2- exhaust fans；3- soldering-tin layer pins；4- top plates；5- circuit boards；6- coaming plates；7- is logical
Hole；8- conducting foams；9- filter screens；The ground 10- pin；11- heat-conducting mediums；12- radiator main bodys；13- electronic components；
14- mounting grooves；15- heat conducting medium filling pipes；16- sealing covers；17- thermal columns.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
- 2 are please referred to Fig.1, a kind of embodiment provided by the invention：Cooling electronic component structure, including conductive coating 1,
Coaming plate 6 is installed on exhaust fan 2, soldering-tin layer pin 3 and ground pin 10,12 top of radiator main body, and coaming plate 6 is internally provided with electricity
Road plate 5, and circuit board 5 is mounted on 12 top of radiator main body, 5 top of circuit board is provided with conductive coating 1, on circuit board 5
It is provided with mounting groove 14, soldering-tin layer pin 3 is installed, and gap connects between soldering-tin layer pin 3 and mounting groove 14 in mounting groove 14
It connects, 3 top of soldering-tin layer pin is equipped with electronic component 13, and passes through welding between electronic component 13 and soldering-tin layer pin 3
Connection, 1 left end of conductive coating and right end are mounted on conducting foam 8, and pass through welding between conducting foam 8 and conductive coating 1
Connection, ground pin 10 passes through filter screen 9 and coaming plate 6 to be connect with conducting foam 8, and passes through between ground pin 10 and conducting foam 8
It is welded to connect, filter screen 9 is mounted on 6 left side wall of coaming plate and right side wall, and 6 top of coaming plate is equipped with top plate 4,4 bottom end of top plate peace
Equipped with exhaust fan 2, heat conducting medium filling pipe 15 is installed above 12 left side wall of radiator main body；6 left side wall of coaming plate and the right side
Through-hole 7 is provided on side wall, and through-hole 7 is evenly distributed on 6 left side wall of coaming plate and right side wall；It is set inside radiator main body 12
It is equipped with heat-conducting medium 11；12 bottom end of radiator main body is equipped with thermal column 17；15 right end of heat conducting medium filling pipe is equipped with close
Capping 16.
Operation principle：In use, opening sealing cover 16, is filled out by heat conducting medium filling pipe 15 and be injected into heat-conducting medium 11
The inside of radiator main body 12 covers tightly sealing cover 16 after the completion of injection, when electronic component 13 is in running order, electronics
The heat that component 13 and circuit board 5 generate can pass to heat-conducting medium 11,11 energy of heat-conducting medium by radiator main body 12
It is enough that heat is dispersed on each position and thermal column 17 of radiator main body 12 well, while heat can also pass through air draft
Wind turbine 2 discharges, to reduce the heat on electronic component 13 and circuit board 5, in order to improve working efficiency and increase this
The service life of invention, electrostatic is also will produce when electronic component 13 works, and electrostatic can make the work of electronic component 13
At interference, working efficiency is caused to reduce, when electrostatic generates, electrostatic can be transferred to by conductive coating 1 on conducting foam 8, so
Electrostatic is conducted by ground pin 10 again afterwards, it, can be with by the setting of filter screen 9 to reduce the electrostatic inside the present invention
The dust granule in air filtering is crossed, the working efficiency and service life of the present invention are improved.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Profit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent requirements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
Claims (5)
1. cooling electronic component structure, including conductive coating (1), exhaust fan (2), soldering-tin layer pin (3) and ground pin
(10), it is characterised in that：Radiator main body (12) the top installation coaming plate (6), the coaming plate (6) are internally provided with circuit
Plate (5), and circuit board (5) is mounted on radiator main body (12) top, circuit board (5) top is provided with conductive coating
(1), it is provided with mounting groove (14) on the circuit board (5), soldering-tin layer pin (3) is installed, and weld in the mounting groove (14)
Gap is connect between tin layers pin (3) and mounting groove (14), and soldering-tin layer pin (3) top is equipped with electronic component
(13), by being welded to connect and between electronic component (13) and soldering-tin layer pin (3), conductive coating (1) left end and the right side
End is mounted on conducting foam (8), and by being welded to connect between conducting foam (8) and conductive coating (1), described ground pin
(10) it passes through filter screen (9) and coaming plate (6) to be connect with conducting foam (8), and passes through between ground pin (10) and conducting foam (8)
It is welded to connect, the filter screen (9) is mounted on coaming plate (6) left side wall and right side wall, and coaming plate (6) top is equipped with top plate
(4), top plate (4) bottom end is equipped with exhaust fan (2), and heat conduction is equipped with above radiator main body (12) left side wall
Media filler pipe (15).
2. cooling electronic component structure according to claim 1, it is characterised in that：Coaming plate (6) left side wall and the right side
Through-hole (7) is provided on side wall, and through-hole (7) is evenly distributed on coaming plate (6) left side wall and right side wall.
3. cooling electronic component structure according to claim 1, it is characterised in that：In the radiator main body (12)
Portion is provided with heat-conducting medium (11).
4. cooling electronic component structure according to claim 1, it is characterised in that：Radiator main body (12) bottom
End is equipped with thermal column (17).
5. cooling electronic component structure according to claim 1, it is characterised in that：The heat conducting medium filling pipe (15)
Right end is equipped with sealing cover (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810273577.8A CN108495444A (en) | 2018-03-29 | 2018-03-29 | Cooling electronic component structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810273577.8A CN108495444A (en) | 2018-03-29 | 2018-03-29 | Cooling electronic component structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108495444A true CN108495444A (en) | 2018-09-04 |
Family
ID=63317370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810273577.8A Withdrawn CN108495444A (en) | 2018-03-29 | 2018-03-29 | Cooling electronic component structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108495444A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566346A (en) * | 2020-12-24 | 2021-03-26 | 湖南省益思迪科技有限公司 | Anti-static heat dissipation device for electronic component |
-
2018
- 2018-03-29 CN CN201810273577.8A patent/CN108495444A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566346A (en) * | 2020-12-24 | 2021-03-26 | 湖南省益思迪科技有限公司 | Anti-static heat dissipation device for electronic component |
| CN112566346B (en) * | 2020-12-24 | 2024-03-12 | 湖南省益思迪科技有限公司 | Antistatic heat dissipation device for electronic components |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180904 |
|
| WW01 | Invention patent application withdrawn after publication |