CN204231845U - Heat radiation module and electronic equipment - Google Patents
Heat radiation module and electronic equipment Download PDFInfo
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- CN204231845U CN204231845U CN201420709186.3U CN201420709186U CN204231845U CN 204231845 U CN204231845 U CN 204231845U CN 201420709186 U CN201420709186 U CN 201420709186U CN 204231845 U CN204231845 U CN 204231845U
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Abstract
The utility model provides a kind of heat radiation module and electronic equipment, and relate to electronic device field, the object reached is reduction of dust adsorbance on a heat sink, effectively reduces dust accumulation.The technical scheme of main employing is: heat radiation module comprises heat-transfer device, heat radiation pack and fan.Wherein, one end of heat-transfer device is connected with the electronic component in external electronic device.Heat radiation pack is connected with the other end of heat-transfer device, heat radiation pack has the gas channel that air inlet size is greater than air outlet size, fan is arranged on the side of radiating subassembly, the dust that fan is rotated in the air-flow produced flows into gas channel from air inlet, then flows out to the outside of external electronic device from air outlet.The utility model embodiment is mainly used in the process of electronic equipment dissipating heat.
Description
Technical field
The utility model relates to electronic device field, particularly relates to a kind of heat radiation module and electronic equipment.
Background technology
The electronic component of electronic equipment electronic equipment internal in the process used all can produce a large amount of heats, and the heat of electronic equipment internal collects can cause electronic component to burn out too much, normally works to affect electronic equipment.In order to the heat of the electronic equipment internal that leaves, need to be provided with heat radiation module in electronic equipment internal, and the module that dispels the heat comprises fan and at least one fin.In order to improve the radiating efficiency of heat radiation module, will adopt a large amount of fin, these fin are in the mode be parallel to each other, and the intensive side being arranged in fan, produces air-flow by the rotation of fan, and air-flow outwards flows out to accelerate heat radiation through described fin.But, usually the dust such as dust and/or fiber is carried because fan rotates in the air-flow produced, and the rough surface of fin, when air-flow outwards flows out through fin, this dust will adsorb on a heat sink, time one is long, to a large amount of dust accumulation be had on a heat sink, to make distinguished and admirablely cannot pass fin, reduce the heat sinking function of fin, and the accumulation of a large amount of dust also can make the heat sinking function of fin self lose efficacy, heat radiation module is caused to be scrapped.
In order to reduce dust adsorbance on a heat sink, plated film on the surface being typically employed in fin at present, reduces the adsorption capacity of fin to dust by the smoothness improving fin surface.But, if the time one is long, still have the little dust accumulation of the particles such as dust on a heat sink, quantity again due to fin is more, is arranged parallel to each other intensive, still can be adsorbed by fin for dusts such as the fibers large compared with block, so aforesaid way reduces the weak effect of dust accumulation.
Utility model content
Main purpose of the present utility model is the heat radiation module and the electronic equipment that provide a kind of new structure, and technical problem to be solved is reduction of dust adsorbance on a heat sink, effectively reduces dust accumulation.
The purpose of this utility model and solve its technical problem and realize by the following technical solutions:
On the one hand, the utility model provides a kind of heat radiation module, and this heat radiation module comprises:
Heat-transfer device, one end of described heat-transfer device is connected with the electronic component in external electronic device;
Heat radiation pack, described heat radiation pack is connected with the other end of described heat-transfer device; Described heat radiation pack has the gas channel that air inlet size is greater than air outlet size;
Fan, described fan is arranged on the side of described radiating subassembly, and the dust that described fan is rotated in the air-flow produced flows into described gas channel from described air inlet, then flows out to the outside of described external electronic device from described air outlet.
Optionally, aforesaid heat radiation module, wherein, described heat radiation pack is made up of the first connecting plate, multiple first fin and multiple second fin;
First end face of described first connecting plate is connected with the other end of described heat-transfer device;
Described multiple first fin is arranged in parallel on second end face relative with described first end face of described first connecting plate;
Often be provided with the second fin described at least one between adjacent two described first fin, and described each second fin is connected with a fin in every adjacent two described first fin; Wherein,
Described second fin and connected described first fin are predetermined angle, the gas channel surrounding described air inlet size to make described first connecting plate, described first fin and described second fin and be greater than air outlet size.
Optionally, aforesaid heat radiation module, wherein, a fin smooth connection in described second fin and often adjacent two described first fin.
Optionally, aforesaid heat radiation module, wherein, described predetermined angle is acute angle.
Optionally, aforesaid heat radiation module, wherein, described heat radiation pack is made up of the second connecting plate, multiple 3rd fin and multiple 4th fin, and wherein, described 4th heat sink sizes is less than the size of described 3rd fin;
First end face of described second connecting plate is connected with the other end of described heat-transfer device;
Described multiple 3rd fin is arranged in parallel on second end face relative with described first end face of described second connecting plate;
Often be provided with the 4th fin described at least one between adjacent two described 3rd fin, described 4th fin and described 3rd fin be arranged in parallel, and one end of described 4th fin is connected with described second end face of described second connecting plate, the gas channel surrounding described air inlet size to make described second connecting plate, described 3rd fin and described 4th fin and be greater than air outlet size.
Optionally, aforesaid heat radiation module, wherein, comprising:
Earthing device, it is connected with described heat radiation pack.
Optionally, aforesaid heat radiation module, wherein, described earthing device comprises:
Electric connection line, one end of described electric connection line is connected with described heat radiation pack, and the other end is connected with the grounding parts in described external electronic device; Or,
Earthed circuit, described earthed circuit is connected with described heat radiation pack.
Optionally, aforesaid heat radiation module, wherein, also comprises:
Storage dirt device, described storage dirt device is arranged on the side end face of described heat radiation pack, and surrounds the accommodation space with opening with described heat radiation pack, and described opening is corresponding with the described air stream outlet of described fan.
Optionally, aforesaid heat radiation module, wherein, the degree of depth of described accommodation space is consistent with the degree of depth of described gas channel.
On the other hand, the utility model provides a kind of electronic equipment, and this electronic equipment comprises:
Housing, described housing is provided with ventilating opening;
M electronic component, a described M electronic component is fixedly installed in described housing, the positive integer of M >=1;
Heat radiation module described above, described heat radiation module is fixedly installed in described housing; Wherein,
The heat-transfer device of described heat radiation module is connected with a described M electronic component, and the air outlet of the heat radiation pack of described heat radiation module is corresponding with described ventilating opening.
By technique scheme, the utility model structure at least has following advantages:
The gas channel that the technical scheme that the utility model provides is greater than air outlet size by heat radiation pack being provided with air inlet size, the fan dust rotated in the air-flow produced is made not easily to be adsorbed on the air inlet of heat radiation pack, gas channel can be flowed into from air inlet, flow out to electronic device exterior from air outlet again, thus reduce dust adsorbance on a heat sink.The technical scheme provided compared with prior art the utility model effectively reduces dust accumulation, and practicality is high.
Above-mentioned explanation is only the general introduction of technical solutions of the utility model, in order to better understand technological means of the present utility model, and can be implemented according to the content of specification, coordinates accompanying drawing to be described in detail as follows below with preferred embodiment of the present utility model.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the utility model is further described.
A kind of structural representation realized of the heat radiation module that Fig. 1 provides for the utility model embodiment;
The first the implementation structure schematic diagram of the heat radiation pack that Fig. 2 provides for the utility model embodiment;
Fig. 3 is the partial enlarged drawing of Fig. 2;
The plane graph of the first implementation structure of the heat radiation pack that Fig. 4 provides for the utility model embodiment;
The plane graph of the second implementation structure of the electricity heat radiation pack that Fig. 5 provides for the utility model embodiment;
The plane graph of the third implementation structure of the heat radiation pack that Fig. 6 provides for the utility model embodiment;
Fig. 7 is provided with a kind of implementation structure schematic diagram of storage dirt device for heat radiation pack that the utility model embodiment provides;
A kind of structural representation realized of the electronic equipment that Fig. 8 provides for the utility model embodiment.
Embodiment
The utility model embodiment is the problem solving in prior art dust adsorption in pack of dispelling the heat, and proposes a kind of heat radiation module and electronic equipment of new structure.
The technical scheme of the utility model embodiment is for solving the problems of the technologies described above, and general thought is as follows:
In the technical scheme that the utility model embodiment provides, described electronic equipment comprises:
Heat-transfer device, one end of described heat-transfer device is connected with the electronic component in external electronic device;
Heat radiation pack, described heat radiation pack is connected with the other end of described heat-transfer device; Described heat radiation pack has the gas channel that air inlet size is greater than air outlet size;
Fan, described fan is arranged on the side of described radiating subassembly, and the dust that described fan is rotated in the air-flow produced flows into described gas channel from described air inlet, then flows out to the outside of described external electronic device from described air outlet.
Conceive based on same utility model, the utility model provides a kind of electronic equipment, and described electronic equipment comprises:
Housing, described housing is provided with ventilating opening;
M electronic component, a described M electronic component is fixedly installed in described housing, the positive integer of M >=1;
Heat radiation module, described heat radiation module is fixedly installed in described housing; Wherein,
The heat-transfer device of described heat radiation module is connected with a described M electronic component, and the air outlet of the heat radiation pack of described heat radiation module is corresponding with described ventilating opening; Wherein,
Described heat radiation module comprises:
Heat-transfer device, one end of described heat-transfer device is connected with the electronic component in external electronic device;
Heat radiation pack, described heat radiation pack is connected with the other end of described heat-transfer device; Described heat radiation pack has the gas channel that air inlet size is greater than air outlet size;
Fan, described fan is arranged on the side of described radiating subassembly, and the dust that described fan is rotated in the air-flow produced flows into described gas channel from described air inlet, then flows out to the outside of described external electronic device from described air outlet.
The gas channel that the technical scheme that the utility model provides is greater than air outlet size by heat radiation pack being provided with air inlet size, the fan dust rotated in the air-flow produced is made not easily to be adsorbed on the air inlet of heat radiation pack, gas channel can be flowed into from air inlet, flow out to electronic device exterior from air outlet again, thus reduce dust adsorbance on a heat sink.The technical scheme provided compared with prior art the utility model effectively reduces dust accumulation, and practicality is high.
For further setting forth the utility model for the technological means reaching predetermined utility model object and take and effect, below in conjunction with accompanying drawing and preferred embodiment, to according to its embodiment of testing stand, structure, feature and the effect thereof that the utility model proposes, be described in detail as follows.In the following description, the not necessarily same embodiment that different " embodiment " or " embodiment " refers to.In addition, special characteristic, structure or feature in one or more embodiment can be combined by any suitable form.
As shown in Figure 1, the structural representation of heat radiation module that provides of the utility model embodiment one.One heat radiation module described in the present embodiment comprises: heat-transfer device 10, heat radiation pack 20 and fan 30.Wherein, as shown in Figure 1, described one end of heat-transfer device 10 is connected with the electronic component in external electronic device.Described heat radiation pack 20 is connected with the other end of described heat-transfer device 10, described heat radiation pack 20 has the gas channel that air inlet 21 size is greater than air outlet 22 size, that is, fin in described heat radiation pack 20 can arrange according to certain arrangement mode, and after multiple heat radiation pack 20 is arranged according to certain arrangement mode, the heat radiation pack 20 of composition has the gas channel that air inlet 21 size is greater than air outlet 22 size.Wherein, certain arrangement mode described is the arrangement mode that any one can make heat radiation pack 20 have air inlet 21 size to be greater than the gas channel of air outlet 22 size, does not do concrete restriction at this.Described fan 30 is arranged on the side of described radiating subassembly, and the dust that described fan 30 is rotated in the air-flow produced flows into described gas channel from described air inlet 21, then flows out to the outside of described external electronic device from described air outlet 22.
In actual applications, described air inlet size is generally and is greater than 1mm, described air outlet size can be the arbitrary value between 1mm or 0.9mm or 1mm ~ 0.9mm, and the selection of concrete air inlet size and air outlet size is determined according to customer demand, and the utility model embodiment does not do concrete restriction.
The gas channel that the utility model embodiment is greater than air outlet size by heat radiation pack being provided with air inlet size, the fan dust rotated in the air-flow produced is made not easily to be adsorbed on the air inlet of heat radiation pack, gas channel can be flowed into from air inlet, flow out to electronic device exterior from air outlet again, thus reduce dust adsorbance on a heat sink.Comparatively prior art the utility model embodiment effectively reduces dust accumulation, and practicality is high.
Further, the heat radiation pack 20 that air inlet 21 size described in above-described embodiment is greater than the gas channel of air outlet 22 size can adopt following structure to realize:
The first, as shown in Figures 2 and 3, described heat radiation pack 20 can be made up of the first connecting plate 23a, multiple first fin 24a and multiple second fin 25a.First end face of described first connecting plate 23a is connected with the other end of described heat-transfer device 10.Described multiple first fin 24a is arranged in parallel on second end face relative with described first end face of described first connecting plate 23a.Often be provided with the second fin 25a described at least one between adjacent two described first fin 24a, and described each second fin 25a is connected with a fin in every adjacent two described first fin 24a, here it should be noted that, described each second fin 25a can be connected to any position place on a fin in every adjacent two described first fin 24a.Wherein, described second fin 25a and connected described first fin 24a is predetermined angle A, the gas channel surrounding described air inlet 21 size to make described first connecting plate 23a, described first fin 24a and described second fin 25a and be greater than air outlet 22 size.Wherein, described predetermined angle A can be acute angle.That is, described second fin 25a is the flow direction setting along the air-flow flowing through heat radiation pack 20, so that fan 30 rotates the dust carried in the air-flow and air-flow produced flow out to electronic device exterior through heat radiation pack 20, to reduce dust adsorbance on a heat sink, decrease the accumulation of dust, ensure that the heat dispersion of heat radiation module.
In the present embodiment, the quantity of the described second fin 25a often arranged between adjacent two described first fin 24a can be one, two or more.In the specific implementation, if be often provided with a described second fin 25a between adjacent two described first fin 24a, as shown in Figure 4, described second fin 25a and connected described first fin 24a is predetermined angle A, fan 30 can be made to rotate the air-flow produced and to flow out to electronic device exterior along described second fin 25a, effectively reduce dust adsorbance on a heat sink; If be often provided with two described second fin 25a between adjacent two described first fin 24a, as shown in Figure 5, one end of second fin 25a1 is connected with the first fin 24a1, and the second fin 25a1 and the first fin 24a1 is described predetermined angle A.One end of second fin 25a2 is connected with the first fin 24a2, and the second fin 25a2 and the first fin 24a2 is described predetermined angle A, the air inlet 21 of the gas channel surrounded to make the first connecting plate 23a, the first fin 24a and the second fin 25a and air outlet 22 are on same center line, thus to make in gas channel air pressure everywhere impartial, fan 30 of being more convenient for rotates the dust that carries in the air-flow and air-flow produced and flows out to electronic device exterior along the second fin 25a, more effectively reduces dust adsorbance on a heat sink.Certainly, often can also be provided with multiple described second fin between adjacent two described first fin, and adopt the design of multiple described second fin not only can reduce dust adsorbance on a heat sink, also enhance the heat-sinking capability of heat radiation module simultaneously.
In the present embodiment, the phenomenon that junction in order to avoid the second fin and the first fin exists dust accumulation occurs, a fin in described second fin and often adjacent two described first fin needs smooth connection, second fin and the first fin are seamlessly transitted, thus effectively reduces dust adsorbance on a heat sink.
The second, as shown in Figure 6, described heat radiation pack 20 can also be made up of the second connecting plate 23b, multiple 3rd fin 24b and multiple 4th fin 25b, and wherein, described 4th fin 25b size is less than the size of described 3rd fin 24b.First end face of described second connecting plate 23b is connected with the other end of described heat-transfer device 10.Described multiple 3rd fin 24b is arranged in parallel on second end face relative with described first end face of described second connecting plate 23b.Often be provided with the 4th fin 25b described at least one between adjacent two described 3rd fin 24b, described 4th fin 25b and described 3rd fin 24b be arranged in parallel, and one end of described 4th fin 25b is connected with described second end face of described second connecting plate 23b, to make described second connecting plate 23b, described 3rd fin 24b and described 4th fin 25b surrounds the gas channel that described air inlet 21 size is greater than air outlet 22 size, so that fan 30 rotates the dust carried in the air-flow and air-flow produced flow out to electronic device exterior through heat radiation pack 20, to reduce dust adsorbance on a heat sink, decrease the accumulation of dust, ensure that the heat dispersion of heat radiation module.
In the present embodiment, the quantity often arranging described 4th fin between adjacent two described 3rd fin can be one or more.Concrete quantity can be determined according to the actual requirements.In the specific implementation, as shown in Figure 6, often can be provided with a described 4th fin 25b between adjacent two described 3rd fin 24b, described 4th fin 25b's and the 3rd fin 24b is arranged in parallel on described second end face of described second connecting plate 23b, described 4th fin can any position place between described adjacent two described 3rd fin, be positioned at the middle position of described adjacent two described 3rd fin, two air-flow flow pass are divided into by described 4th fin to make the passage of adjacent two described 3rd fin compositions, thus make described second connecting plate, described 3rd fin and described 4th fin surround the gas channel that described air inlet size is greater than air outlet size, effectively less dust accumulation, practicality is high.
Further, in order to avoid the electrostatic in heat radiation pack makes dust granule be adsorbed in heat radiation pack, the heat radiation module described in above-described embodiment can comprise: earthing device.Described earthing device is connected with described heat radiation pack.Make static guiding in heat radiation pack to the earth by described earthing device, to make in heat radiation pack voltage for zero, thus effectively avoid electrostatic the phenomenon of dust adsorption is occurred.In the specific implementation, described earthing device can comprise: electric connection line, and one end of described electric connection line is connected with described heat radiation pack, and the other end is connected with the grounding parts in described external electronic device; Or described earthing device can comprise earthed circuit, described earthed circuit is connected with described heat radiation pack.Wherein, described earthed circuit can adopt earthed circuit of the prior art, and the utility model embodiment is not specifically limited.
Further, in order to prevent that the side of heat radiation pack has dust accumulation, the heat radiation module described in above-described embodiment can also comprise: storage dirt device 40.As shown in Figure 7, described storage dirt device 40 is arranged on the side end face of described heat radiation pack 20, and surrounds the accommodation space with opening with described heat radiation pack 20, and described opening is corresponding with the described air stream outlet of described fan.Wherein, the degree of depth of described accommodation space is consistent with the degree of depth of described gas channel, makes the globality of heat radiation module high.
As shown in Figure 8, the structural representation of electronic equipment that provides of the utility model two embodiment.As shown in Figure 5, this electronic equipment comprises: housing 200, a M electronic component 300 and heat radiation module 100.Wherein, described heat radiation module 100 comprises: heat-transfer device 10, heat radiation pack 20 and fan 30.Wherein, as shown in Figure 1, described one end of heat-transfer device 10 is connected with the electronic component in external electronic device.Described heat radiation pack 20 is connected with the other end of described heat-transfer device 10, and described heat radiation pack 20 has the gas channel that air inlet 21 size is greater than air outlet 22 size.Described fan 30 is arranged on the side of described radiating subassembly, and the dust that described fan 30 is rotated in the air-flow produced flows into described gas channel from described air inlet 21, then flows out to the outside of described external electronic device from described air outlet 22.Wherein, as shown in Figure 8, described housing 200 is provided with ventilating opening 210, and a described M electronic component 300 is fixedly installed in described housing 200, the positive integer of M >=1.Described heat radiation module 100 is fixedly installed in described housing 200.The heat-transfer device 10 of described heat radiation module 100 is connected with a described M electronic component 300, and the air outlet of the heat radiation pack of described heat radiation module 100 is corresponding with described ventilating opening 210.
Particularly, the described heat radiation module that the heat radiation module described in the present embodiment two can directly adopt above-described embodiment one to provide, concrete implementation structure see the related content described in above-described embodiment one, can repeat no more herein.
Wherein, the electronic equipment described in above-described embodiment can be notebook computer or desk-type integrated computer.
The gas channel that the technical scheme that the utility model provides is greater than air outlet size by heat radiation pack being provided with air inlet size, the fan dust rotated in the air-flow produced is made not easily to be adsorbed on the air inlet of heat radiation pack, gas channel can be flowed into from air inlet, flow out to electronic device exterior from air outlet again, thus reduce dust adsorbance on a heat sink.The technical scheme provided compared with prior art the utility model effectively reduces dust accumulation, and practicality is high.
Last it is noted that above embodiment is only in order to illustrate the technical solution of the utility model, be not intended to limit; Although be described in detail the utility model with reference to previous embodiment, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of each embodiment technical scheme of the utility model.
Claims (10)
1. dispel the heat a module, it is characterized in that, comprising:
Heat-transfer device, one end of described heat-transfer device is connected with the electronic component in external electronic device;
Heat radiation pack, described heat radiation pack is connected with the other end of described heat-transfer device; Described heat radiation pack has the gas channel that air inlet size is greater than air outlet size;
Fan, described fan is arranged on the side of described radiating subassembly, and the dust that described fan is rotated in the air-flow produced flows into described gas channel from described air inlet, then flows out to the outside of described external electronic device from described air outlet.
2. heat radiation module according to claim 1, is characterized in that, described heat radiation pack is made up of the first connecting plate, multiple first fin and multiple second fin;
First end face of described first connecting plate is connected with the other end of described heat-transfer device;
Described multiple first fin is arranged in parallel on second end face relative with described first end face of described first connecting plate;
Often be provided with the second fin described at least one between adjacent two described first fin, and described each second fin is connected with a fin in every adjacent two described first fin; Wherein,
Described second fin and connected described first fin are predetermined angle, the gas channel surrounding described air inlet size to make described first connecting plate, described first fin and described second fin and be greater than air outlet size.
3. heat radiation module according to claim 2, is characterized in that, a fin smooth connection in described second fin and often adjacent two described first fin.
4. heat radiation module according to claim 2, is characterized in that, described predetermined angle is acute angle.
5. heat radiation module according to claim 1, is characterized in that, described heat radiation pack is made up of the second connecting plate, multiple 3rd fin and multiple 4th fin, and wherein, described 4th heat sink sizes is less than the size of described 3rd fin;
First end face of described second connecting plate is connected with the other end of described heat-transfer device;
Described multiple 3rd fin is arranged in parallel on second end face relative with described first end face of described second connecting plate;
Often be provided with the 4th fin described at least one between adjacent two described 3rd fin, described 4th fin and described 3rd fin be arranged in parallel, and one end of described 4th fin is connected with described second end face of described second connecting plate, the gas channel surrounding described air inlet size to make described second connecting plate, described 3rd fin and described 4th fin and be greater than air outlet size.
6. heat radiation module according to claim 1, is characterized in that, comprising:
Earthing device, it is connected with described heat radiation pack.
7. heat radiation module according to claim 6, is characterized in that, described earthing device comprises:
Electric connection line, one end of described electric connection line is connected with described heat radiation pack, and the other end is connected with the grounding parts in described external electronic device; Or,
Earthed circuit, described earthed circuit is connected with described heat radiation pack.
8. the heat radiation module according to any one of claim 1 ~ 7, is characterized in that, also comprise:
Storage dirt device, described storage dirt device is arranged on the side end face of described heat radiation pack, and surrounds the accommodation space with opening with described heat radiation pack, and described opening is corresponding with the described air stream outlet of described fan.
9. heat radiation module according to claim 8, is characterized in that, the degree of depth of described accommodation space is consistent with the degree of depth of described gas channel.
10. an electronic equipment, is characterized in that, comprising:
Housing, described housing is provided with ventilating opening;
M electronic component, a described M electronic component is fixedly installed in described housing, the positive integer of M >=1;
Heat radiation module according to any one of the claims 1 ~ 9, described heat radiation module is fixedly installed in described housing; Wherein,
The heat-transfer device of described heat radiation module is connected with a described M electronic component, and the air outlet of the heat radiation pack of described heat radiation module is corresponding with described ventilating opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420709186.3U CN204231845U (en) | 2014-11-21 | 2014-11-21 | Heat radiation module and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201420709186.3U CN204231845U (en) | 2014-11-21 | 2014-11-21 | Heat radiation module and electronic equipment |
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| CN204231845U true CN204231845U (en) | 2015-03-25 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106774751A (en) * | 2017-01-03 | 2017-05-31 | 北京飞讯数码科技有限公司 | A kind of outer surface heat abstractor |
| CN108255276A (en) * | 2018-04-26 | 2018-07-06 | 刘康 | Heat dissipation performance is not easy the air-cooled laptop decayed |
| CN109786344A (en) * | 2019-02-28 | 2019-05-21 | 苏州浪潮智能科技有限公司 | A kind of adding pressure type cooling fin and radiating module |
| CN111815809A (en) * | 2020-06-17 | 2020-10-23 | 安徽超清科技股份有限公司 | Intelligent traffic signal machine |
-
2014
- 2014-11-21 CN CN201420709186.3U patent/CN204231845U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106774751A (en) * | 2017-01-03 | 2017-05-31 | 北京飞讯数码科技有限公司 | A kind of outer surface heat abstractor |
| CN106774751B (en) * | 2017-01-03 | 2023-05-05 | 北京飞讯数码科技有限公司 | External surface heat abstractor |
| CN108255276A (en) * | 2018-04-26 | 2018-07-06 | 刘康 | Heat dissipation performance is not easy the air-cooled laptop decayed |
| CN109786344A (en) * | 2019-02-28 | 2019-05-21 | 苏州浪潮智能科技有限公司 | A kind of adding pressure type cooling fin and radiating module |
| CN111815809A (en) * | 2020-06-17 | 2020-10-23 | 安徽超清科技股份有限公司 | Intelligent traffic signal machine |
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