CN108463055A - Two-sided composite aluminum base wiring board and technique - Google Patents
Two-sided composite aluminum base wiring board and technique Download PDFInfo
- Publication number
- CN108463055A CN108463055A CN201810244214.1A CN201810244214A CN108463055A CN 108463055 A CN108463055 A CN 108463055A CN 201810244214 A CN201810244214 A CN 201810244214A CN 108463055 A CN108463055 A CN 108463055A
- Authority
- CN
- China
- Prior art keywords
- aluminium sheet
- epoxy
- wiring board
- technique
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 95
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 95
- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000002131 composite material Substances 0.000 title claims abstract description 18
- 239000004411 aluminium Substances 0.000 claims abstract description 69
- 239000004593 Epoxy Substances 0.000 claims abstract description 52
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000011889 copper foil Substances 0.000 claims abstract description 18
- 238000003801 milling Methods 0.000 claims abstract description 18
- 238000005530 etching Methods 0.000 claims abstract description 7
- 238000003466 welding Methods 0.000 claims abstract description 7
- 230000005611 electricity Effects 0.000 claims abstract description 4
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 229920002521 macromolecule Polymers 0.000 claims description 4
- 238000011161 development Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 4
- 241001465382 Physalis alkekengi Species 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The present invention relates to a kind of two-sided composite aluminum base wiring board and techniques.The technique includes at least following technological process：1）Aluminium sheet, epoxy plate blanking；2）Milling aluminium sheet punches；3）Milling epoxy disc；4）Epoxy disc is put into aluminium sheet；5）It is die-filling；6）Vacuum pressing-combining；7）Bore plate endoporus；8）Conductive film line；9）Line map electricity；10）Etching；11）Silk-screen welding resistance；12）Silk-screen character；13）Milling shape.After the present invention is due to combining epoxy disc and aluminium sheet, one layer of copper foil is spread by thermal conductivity prepreg, then aluminum substrate technique is carried out using existing technique and manufactures lamp plate, when lamp plate circuit and Power Management Design, by high-pressure section design on epoxy disc, by the design of power heater spreader portion on aluminum substrate, tooling process can be reduced in lamps and lanterns manufacture, reduces and reduces human cost.
Description
Technical field
The present invention relates to a kind of composite aluminum base wiring board, especially two-sided composite aluminum base wiring board and technique.
Background technology
Continuous universal with LED light, the product quality between enterprise grows in intensity with market competition, continuous reduction at
This, can only make enterprise that can not increasingly survive.
Two problems are always existed in LED light production, when safety problem, second is that production technology problem, usual feelings
Both under condition can not both with.
The driving power of existing LED constantly from Switching Power Supply to high drive transition, Switching Power Supply output can be with
It is low-voltage, low voltage drive LED has safety, LED to select convenient feature, but low-voltage switches power drives efficiency and valence
Lattice are higher, and especially the LED light of high-power driving is dual by safety and technique simultaneously.
And the high-power needs heat dissipation of high drive and insulation, heat dissipation need metal shell, insulation to need non-metal shell, because
This needs two kinds of techniques to combine, and can be only achieved requirement, makes cost reaching requirement.
Invention content
The object of the present invention is to provide a kind of heat dissipations and insulation can reach requirement simultaneously, and can reduce the two-sided compound of cost
Aluminum-based circuit board and technique.So that manufacture lamps and lanterns is crossed into middle reduction tooling process, reduces and reduce human cost.
Technical scheme of the present invention：A kind of technique of two-sided composite aluminum base wiring board, it is characterized in that：Including at least following work
Skill flow：
1）Aluminium sheet, epoxy plate blanking；
2）Milling aluminium sheet punches；
3）Milling epoxy disc；
4）Epoxy disc is put into aluminium sheet；
5）It is die-filling；
6）Vacuum pressing-combining；
7）Bore plate endoporus；
8）Conductive film line；
9）Line map electricity；
10）Etching；
11）Silk-screen welding resistance；
12）Silk-screen character；
13）Milling shape.
The step 2）It is that the certain hole of diameter is milled out on aluminium sheet in the punching of milling aluminium sheet, it is smooth around orifice ring.
The step 4）Epoxy disc is put into aluminium sheet, and wherein epoxy plate is as aluminium plate thickness, epoxy disc
Mill out the smooth round block of surrounding of 1mm smaller than aluminium sheet bore dia.
Described is placed on epoxy disc in aluminium sheet hole, and epoxy disc and aluminium sheet surrounding fill out toner.
The step 5）It is die-filling to include：In one layer of aluminium sheet upper berth thermal conductivity prepreg, thermal conductivity prepreg thickness, size
As aluminium sheet；
In one layer of thermal conductivity prepreg upper berth copper foil, copper foil surrounding distinguishes big 30-50mm than prepreg；
It in laminating machine, vacuumizes, heating is pressed, cooling；
In centre-drilling hole；
Macromolecule conductive film is crossed to non-metallic hole, carries out metalized.
The step 8）-13）Including：Circuit, exposure, development, plating, etching are made in copper-clad surface, surface of aluminum plate goes out
The line map now needed；In circuit surface silk-screen welding resistance, silk-screen character and ink solidification is carried out, outer shape is milled out with milling machine.
A kind of two-sided composite aluminum base wiring board, it is characterized in that：It includes at least：Epoxy plate and aluminium sheet, epoxy plate are disk, aluminium
Plate has a circular hole, and the circular hole of disk and aluminium sheet matches, and epoxy disc is placed in aluminium sheet hole, epoxy disc and aluminium sheet surrounding
It is fixedly connected by resin, copper foil is fixed in epoxy disc and aluminium sheet both sides by thermal conductivity prepreg.
The copper foil surrounding distinguishes big 30-50mm than prepreg.
After the present invention is due to combining epoxy disc and aluminium sheet, one layer of copper foil is spread by thermal conductivity prepreg, then
Aluminum substrate technique is carried out using existing technique and manufactures lamp plate, when lamp plate circuit and Power Management Design, high-pressure section is designed in ring
On oxygen disc, by the design of power heater spreader portion on aluminum substrate, tooling process can be reduced in lamps and lanterns manufacture, reduces and reduces
Human cost.
Description of the drawings
With reference to embodiment attached drawing, the invention will be further described：
Fig. 1 is flow chart of the embodiment of the present invention；
Fig. 2 is structural schematic diagram of the embodiment of the present invention.
In figure, 1, aluminium sheet；2, epoxy plate；3, thermal conductivity prepreg；4, copper foil；5, connecting line；6, toner；7, high
Voltage device；8, power radiating element.
Specific implementation mode
As shown in Figure 1, the technique of two-sided composite aluminum base wiring board, technological process：
1）Aluminium sheet 1,2 blanking of epoxy plate；
2）Milling aluminium sheet 1 punches；
3）Milling epoxy disc；
4）Epoxy disc is put into aluminium sheet；
5）It is die-filling；
6）Vacuum pressing-combining；
7）Bore plate endoporus；
8）Conductive film line；
9）Line map electricity；
10）Etching；
11）Silk-screen welding resistance；
12）Silk-screen character；
13）Milling shape.
The step 2）It is that the certain hole of diameter is milled out on aluminium sheet in the punching of milling aluminium sheet, it is smooth around orifice ring.
The step 4）Epoxy disc is put into aluminium sheet, and wherein epoxy plate is as aluminium plate thickness, epoxy disc
Mill out the smooth round block of surrounding of 1mm smaller than aluminium sheet bore dia.
Described is placed on 2 disk of epoxy plate in 1 hole of aluminium sheet, and 2 disk of epoxy plate and 1 surrounding of aluminium sheet fill out toner
6。
The step 5）It is die-filling to include：In one layer of aluminium sheet upper berth thermal conductivity prepreg 3,3 thickness of thermal conductivity prepreg, ruler
It is very little as aluminium sheet 1；
In 3 upper berth of thermal conductivity prepreg, one layer of copper foil 4,4 surrounding of copper foil distinguishes big 30-50mm than prepreg；
It in laminating machine, vacuumizes, heating is pressed, cooling；
In centre-drilling hole；
Macromolecule conductive film is crossed to non-metallic hole and carries out metalized.
The step 8）-13）Including：Circuit, exposure, development, plating, etching are made in copper-clad surface, surface of aluminum plate goes out
The line map now needed；In circuit surface silk-screen welding resistance, silk-screen character and ink solidification is carried out, outer shape is milled out with milling machine.
As shown in Fig. 2, a kind of two-sided composite aluminum base wiring board, includes at least：Epoxy plate 2 and aluminium sheet 1, epoxy plate 2 are round
Piece, aluminium sheet 1 have a circular hole, and the circular hole of disk and aluminium sheet 1 matches, and 2 disk of epoxy plate is placed in 1 hole of aluminium sheet, 2 disk of epoxy plate
It is fixedly connected by resin with 1 surrounding of aluminium sheet, copper foil 4 is fixed in 2 disk of epoxy plate and 1 both sides of aluminium sheet by thermal conductivity prepreg 3.
4 surrounding of copper foil distinguishes big 30-50mm than prepreg.There are multiple circular holes, Mei Geyuan on the aluminium sheet 1
Epoxy plate 2 is fixed with by resin in hole.The epoxy plate 2 is equal with 1 thickness of aluminium sheet.
When processing, technique is realized by flow, and aluminium sheet 1 is circle and other shapes, and 1 minimum dimension of aluminium sheet is more than epoxy plate 2
Size.
Under normal conditions, 2 disk of epoxy plate is placed in 1 hole of aluminium sheet, and 2 disk of epoxy plate and 1 surrounding of aluminium sheet fill out resin
Powder 6.In one layer of aluminium sheet upper berth thermal conductivity prepreg 3,3 thickness of thermal conductivity prepreg, size are as aluminium sheet 1；In heat conduction half
The copper foil 4 on one layer of 3 upper berth of cured sheets, 4 surrounding of copper foil distinguish big 30-50mm than prepreg；It in laminating machine, vacuumizes, adds
Heat is pressed, cooling；In centre-drilling hole；Macromolecule conductive film is crossed to non-metallic hole and carries out metalized.
When designing circuit, high tension apparatus 7 designs on epoxy plate 2, and such as high-voltage linear power supply, such as LED of power radiating element 8 is set
Meter on aluminium sheet 3, between the connecting line 5 that is etched by copper foil 4 of connection connect, make on same circuit board to have simultaneously high tension apparatus with
Low-pressure high-power radiating element, high tension apparatus and low-pressure high-power radiating element are welded by chip mounter simultaneously, and good manufacturability subtracts
The high cost and low reliability that manual operation is brought are lacked.
The well-known components and common structure of the component and the structure category industry that the present embodiment does not describe in detail or common hand
Section, does not describe one by one here.
Claims (9)
1. a kind of technique of two-sided composite aluminum base wiring board, it is characterized in that：Including at least following technological process：
1）Aluminium sheet, epoxy plate blanking；
2）Milling aluminium sheet punches；
3）Milling epoxy disc；
4）Epoxy disc is put into aluminium sheet；
5）It is die-filling；
6）Vacuum pressing-combining；
7）Bore plate endoporus；
8）Conductive film line；
9）Line map electricity；
10）Etching；
11）Silk-screen welding resistance；
12）Silk-screen character；
13）Milling shape.
2. the technique of two-sided composite aluminum base wiring board according to claim 1, it is characterized in that：The step 2）In milling aluminium
Plate punching is that the certain hole of diameter is milled out on aluminium sheet, smooth around orifice ring.
3. the technique of two-sided composite aluminum base wiring board according to claim 1, it is characterized in that：The step 4）Epoxy plate
Disk is put into aluminium sheet, and for wherein epoxy plate as aluminium plate thickness, epoxy disc mills out the surrounding of 1mm smaller than aluminium sheet bore dia
Smooth round block.
4. the technique of two-sided composite aluminum base wiring board according to claim 3, it is characterized in that：It is described by epoxy disc
It is placed in aluminium sheet hole, epoxy disc and aluminium sheet surrounding fill out toner.
5. the technique of two-sided composite aluminum base wiring board according to claim 1, it is characterized in that：The step 5）Die-filling packet
It includes：In one layer of aluminium sheet upper berth thermal conductivity prepreg, thermal conductivity prepreg thickness, size are as aluminium sheet.
6. the technique of two-sided composite aluminum base wiring board according to claim 5, it is characterized in that：On thermal conductivity prepreg upper berth
One layer of copper foil, copper foil surrounding distinguish big 30-50mm than prepreg；
It in laminating machine, vacuumizes, heating is pressed, cooling；
In centre-drilling hole；
Macromolecule conductive film is crossed to non-metallic hole, carries out metalized.
7. the technique of two-sided composite aluminum base wiring board according to claim 1, it is characterized in that：The step 8）-13）Packet
It includes：Circuit, exposure, development, plating, etching are made in copper-clad surface, the line map needed occurs in surface of aluminum plate；In circuit surface silk
Print welding resistance, silk-screen character simultaneously carry out ink solidification, and outer shape is milled out with milling machine.
8. a kind of two-sided composite aluminum base wiring board, it is characterized in that：It includes at least：Epoxy plate（2）And aluminium sheet（1）, epoxy plate（2）It is
Disk, aluminium sheet（1）There are circular hole, disk and aluminium sheet（1）Circular hole match, epoxy plate（2）Disk is placed on aluminium sheet（1）In hole,
Epoxy plate（2）Disk and aluminium sheet（1）Surrounding is fixedly connected by resin, epoxy plate（2）Disk and aluminium sheet（1）Both sides pass through heat conduction
Prepreg（3）Fixed copper foil（4）.
9. a kind of two-sided composite aluminum base wiring board according to claim 9, it is characterized in that：The copper foil（4）Surrounding ratio
Prepreg distinguishes big 30-50mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810244214.1A CN108463055A (en) | 2018-03-23 | 2018-03-23 | Two-sided composite aluminum base wiring board and technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810244214.1A CN108463055A (en) | 2018-03-23 | 2018-03-23 | Two-sided composite aluminum base wiring board and technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108463055A true CN108463055A (en) | 2018-08-28 |
Family
ID=63237187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810244214.1A Pending CN108463055A (en) | 2018-03-23 | 2018-03-23 | Two-sided composite aluminum base wiring board and technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108463055A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109451661A (en) * | 2018-09-13 | 2019-03-08 | 镇江华印电路板有限公司 | A kind of LED aluminum base plate exposure printing technology |
| CN112654177A (en) * | 2020-11-25 | 2021-04-13 | 浙江德加电子科技有限公司 | Direct-pressing process and processing equipment for aluminum substrate with double-sided metalized holes |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004105451A1 (en) * | 2003-05-26 | 2004-12-02 | Lihua Wang | Printed ciruit board and method of producing the same |
| KR20140013612A (en) * | 2012-07-25 | 2014-02-05 | 서호이노베이션(주) | Chip on metal type heat radiating printed circuit board and manufacturing the same |
| CN105570848A (en) * | 2015-12-02 | 2016-05-11 | 宁波凯耀电器制造有限公司 | Compound type LED circuit board and manufacturing method |
| CN208029199U (en) * | 2018-03-23 | 2018-10-30 | 浙江展邦电子科技有限公司 | Two-sided composite aluminum base wiring board |
-
2018
- 2018-03-23 CN CN201810244214.1A patent/CN108463055A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004105451A1 (en) * | 2003-05-26 | 2004-12-02 | Lihua Wang | Printed ciruit board and method of producing the same |
| KR20140013612A (en) * | 2012-07-25 | 2014-02-05 | 서호이노베이션(주) | Chip on metal type heat radiating printed circuit board and manufacturing the same |
| CN105570848A (en) * | 2015-12-02 | 2016-05-11 | 宁波凯耀电器制造有限公司 | Compound type LED circuit board and manufacturing method |
| CN208029199U (en) * | 2018-03-23 | 2018-10-30 | 浙江展邦电子科技有限公司 | Two-sided composite aluminum base wiring board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109451661A (en) * | 2018-09-13 | 2019-03-08 | 镇江华印电路板有限公司 | A kind of LED aluminum base plate exposure printing technology |
| CN112654177A (en) * | 2020-11-25 | 2021-04-13 | 浙江德加电子科技有限公司 | Direct-pressing process and processing equipment for aluminum substrate with double-sided metalized holes |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2658356B1 (en) | Manufacturing method for printed circuit board with insulated micro radiator | |
| CN101790290B (en) | Method for manufacturing embedded high-conductivity printed circuit board (PCB) | |
| US9942976B2 (en) | Preparation method of a boss-type metal-based sandwich rigid-flex circuit board | |
| CN105491822B (en) | Multilayer printed circuit board integrates liquid cold passage preparation method | |
| JP2006165299A (en) | Method of manufacturing printed circuit board | |
| CN108463055A (en) | Two-sided composite aluminum base wiring board and technique | |
| CN201788966U (en) | Non-thermoelectric separated metal substrate and light emitting component with same | |
| CN111132476A (en) | Preparation method of double-sided circuit radiating substrate | |
| CN205005345U (en) | Circuit board that epoxy and metal base combine | |
| CN103237410A (en) | Non-etched aluminum substrate and manufacturing method thereof | |
| CN108770191B (en) | New energy automobile copper base line circuit board and manufacturing method thereof | |
| CN208029199U (en) | Two-sided composite aluminum base wiring board | |
| JP2006324542A (en) | Printed wiring board and its manufacturing method | |
| CN108575046A (en) | A kind of high heat conduction composite base material multilayer printed circuit board | |
| CN103167724A (en) | Light-emitting diode (LED) double-sided circuit board made by four wires | |
| CN104470215B (en) | The preparation method and products obtained therefrom of printed circuit board (PCB) with micro- radiator | |
| CN110871610B (en) | Carbon nanotube composite material copper-clad plate | |
| CN210247149U (en) | Printed circuit board heat radiation structure and printed circuit board | |
| CN204272571U (en) | There is printed circuit board (PCB) and the LED light source module of micro-radiator | |
| CN203912327U (en) | Heat-radiation polyimides circuit board with metallic holes and copper core | |
| JPH10242621A (en) | Smoothed printed wiring board and its manufacture | |
| CN201897096U (en) | Heat radiating structure of LED (light-emitting diode) lamp | |
| CN202535630U (en) | A LED double-sided circuit board produced by four wires | |
| CN206365149U (en) | A kind of bent aluminium base | |
| CN218897333U (en) | Composite circuit board conducting structure and soft lamp strip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |