CN108461430A - 一种半导体二极管引线封胶系统 - Google Patents
一种半导体二极管引线封胶系统 Download PDFInfo
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- CN108461430A CN108461430A CN201810532902.8A CN201810532902A CN108461430A CN 108461430 A CN108461430 A CN 108461430A CN 201810532902 A CN201810532902 A CN 201810532902A CN 108461430 A CN108461430 A CN 108461430A
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- 238000007789 sealing Methods 0.000 title claims abstract description 65
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 238000001035 drying Methods 0.000 claims abstract description 20
- 210000003781 tooth socket Anatomy 0.000 claims abstract description 4
- 230000008859 change Effects 0.000 claims description 31
- 238000003475 lamination Methods 0.000 claims description 22
- 239000003292 glue Substances 0.000 claims description 13
- 239000004744 fabric Substances 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000012945 sealing adhesive Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 230000002028 premature Effects 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 239000000872 buffer Substances 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003116 impacting effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
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- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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CN201810532902.8A CN108461430B (zh) | 2018-05-29 | 2018-05-29 | 一种半导体二极管引线封胶系统 |
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CN201810532902.8A CN108461430B (zh) | 2018-05-29 | 2018-05-29 | 一种半导体二极管引线封胶系统 |
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CN108461430A true CN108461430A (zh) | 2018-08-28 |
CN108461430B CN108461430B (zh) | 2020-09-04 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111755364A (zh) * | 2020-08-13 | 2020-10-09 | 抚州华成半导体科技有限公司 | 一种半导体二极管生产设备 |
CN112117201A (zh) * | 2020-09-10 | 2020-12-22 | 安徽龙芯微科技有限公司 | 一种半导体芯片的封装方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010040989A (ja) * | 2008-08-08 | 2010-02-18 | Nsk Ltd | 真空チャンバー |
CN102651330A (zh) * | 2012-06-04 | 2012-08-29 | 扬州扬杰电子科技股份有限公司 | 一种整流子下料装置及其加工工艺 |
CN103050426A (zh) * | 2012-12-25 | 2013-04-17 | 王奉瑾 | 用于半导体集成制造生产线中的连续干燥模块 |
CN104984872A (zh) * | 2015-06-23 | 2015-10-21 | 定远县安卓电子科技有限公司 | 二极管引线封胶装置的上胶装置 |
CN104992913A (zh) * | 2015-06-23 | 2015-10-21 | 定远县安卓电子科技有限公司 | 可实现引线定位加工的二极管引线封胶装置 |
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- 2018-05-29 CN CN201810532902.8A patent/CN108461430B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010040989A (ja) * | 2008-08-08 | 2010-02-18 | Nsk Ltd | 真空チャンバー |
CN102651330A (zh) * | 2012-06-04 | 2012-08-29 | 扬州扬杰电子科技股份有限公司 | 一种整流子下料装置及其加工工艺 |
CN103050426A (zh) * | 2012-12-25 | 2013-04-17 | 王奉瑾 | 用于半导体集成制造生产线中的连续干燥模块 |
CN104984872A (zh) * | 2015-06-23 | 2015-10-21 | 定远县安卓电子科技有限公司 | 二极管引线封胶装置的上胶装置 |
CN104992913A (zh) * | 2015-06-23 | 2015-10-21 | 定远县安卓电子科技有限公司 | 可实现引线定位加工的二极管引线封胶装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111755364A (zh) * | 2020-08-13 | 2020-10-09 | 抚州华成半导体科技有限公司 | 一种半导体二极管生产设备 |
CN112117201A (zh) * | 2020-09-10 | 2020-12-22 | 安徽龙芯微科技有限公司 | 一种半导体芯片的封装方法 |
CN112117201B (zh) * | 2020-09-10 | 2022-12-27 | 安徽龙芯微科技有限公司 | 一种半导体芯片的封装方法 |
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Effective date of registration: 20200807 Address after: Building 39, Weile neighborhood life square, Luzhi Town, Wuzhong District, Suzhou City, Jiangsu Province Applicant after: Suzhou yinzhicheng new energy Co.,Ltd. Address before: 211189 Southeast University, No. 2 Southeast University Road, Jiangning District, Nanjing City, Jiangsu Province Applicant before: LAN Feng |
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Effective date of registration: 20240708 Address after: 518000, Unit 1304, Building 1, Lechuanghui Building, No. 1211 Guihua Community Sightseeing Road, Guanlan Street, Longhua District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Huatian Microelectronics Co.,Ltd. Country or region after: China Address before: Building 39, Weile Neighborhood Life Plaza, Luzhi Town, Wuzhong District, Suzhou City, Jiangsu Province, 215125 Patentee before: Suzhou yinzhicheng new energy Co.,Ltd. Country or region before: China |
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