CN108461428A - Semiconductor rectifier device processing unit (plant) - Google Patents
Semiconductor rectifier device processing unit (plant) Download PDFInfo
- Publication number
- CN108461428A CN108461428A CN201810255573.7A CN201810255573A CN108461428A CN 108461428 A CN108461428 A CN 108461428A CN 201810255573 A CN201810255573 A CN 201810255573A CN 108461428 A CN108461428 A CN 108461428A
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- Prior art keywords
- tooth
- bronze medal
- strip substrate
- orientation
- several
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Slot Machines And Peripheral Devices (AREA)
- Rectifiers (AREA)
- Electrodes Of Semiconductors (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Packaging Frangible Articles (AREA)
- Combined Means For Separation Of Solids (AREA)
Abstract
The present invention discloses a kind of semiconductor rectifier device processing unit (plant), one end of its second bronze medal lead is connected to the P pole-faces of the diode chip for backlight unit by scolding tin, as the axialmode diode input terminal, one end that the diode chip for backlight unit, first bronze medal lead the second bronze medal lead are contacted with diode chip for backlight unit is coated the other end of second bronze medal lead by epoxy body；Turnover device includes strip substrate, several comb material teeth and several orientation teeth, several described combs material tooth positions are in the middle part of strip substrate and inline along its length, several described orientation tooth positions are in strip substrate a side and inline along its length；The left and right handle is located at strip substrate both sides with comb material tooth, orientation tooth, and the angle of the left and right handle and strip substrate is 30 °.The present invention, which can comb from graphite boat the diode being welded, to be got up and rotates 180 degree material and will not fall down, to achieve the purpose that reduce turnover tool, improves man efficiency.
Description
Technical field
The present invention relates to the production of rectifying device, more particularly to a kind of semiconductor rectifier device processing unit (plant).
Background technology
The prior art is combed material onto aluminum strip by combing material strip in diode manufacture, then again by the material on aluminum strip
It is transferred on the stock shelf of molding die.The problem of such mode is brought is to increase turnover tool, increase cost of labor, increase
A procedure is added to cause the risk of damage to product.
Invention content
It is an object of the present invention to provide a kind of semiconductor rectifier device processing unit (plant), which is filled with processing
It sets the diode that will be welded and combs from graphite boat to get up and rotate 180 degree material and will not fall down, to reach direct feeding
Purpose, it is possible to reduce turnover tool, the process for improving man efficiency, reducing diode turnover improve product yield.
In order to achieve the above objectives, the technical solution adopted by the present invention is：A kind of semiconductor rectifier device processing unit (plant), institute
It includes diode chip for backlight unit, the first bronze medal lead, the second bronze medal lead to state axialmode diode, and one end of the first bronze medal lead passes through weldering
Tin is connected to the N pole-faces of the diode chip for backlight unit, and the other end of the first bronze medal lead is as the axialmode diode input terminal；Institute
The one end for stating the second bronze medal lead is connected to the P pole-faces of the diode chip for backlight unit, the other end conduct of the second bronze medal lead by scolding tin
The axialmode diode input terminal, the diode chip for backlight unit, first bronze medal lead the second bronze medal lead are contacted with diode chip for backlight unit
One end is coated by epoxy body；
The turnover device includes strip substrate, several comb material teeth and several orientation teeth, several described combs expect tooth positions in
In the middle part of strip substrate and inline along its length, several described orientation tooth positions are in strip substrate a side and along it
Length direction is inline, to form a long groove, adjacent comb material between several comb material teeth and several orientation teeth
There is comb to expect inter-tooth slots between tooth, there are orientation inter-tooth slots, the comb material inter-tooth slots to orient inter-tooth slots between adjacent orientation tooth
Gap is more than the diameter of the first bronze medal lead, the second bronze medal lead；
The comb material tooth and orientation tooth position in strip substrate homonymy and are oppositely arranged, the both ends of the strip substrate along its length
It is respectively arranged with left and right handle, the upper end of the comb material tooth has a hook portion for stretching into long groove；
The left and right handle is located at strip substrate both sides, the left and right handle and strip substrate with comb material tooth, orientation tooth
Angle be 30 °.
Further improved technical solution is as follows in above-mentioned technical proposal：
1. preferably, the left and right handle is located at strip substrate both sides with comb material tooth, orientation tooth.
2. preferably, the angle of the left and right handle and strip substrate is 20 ° ~ 40 °.
Since above-mentioned technical proposal is used, the present invention has following advantages and effect compared with prior art：
Semiconductor rectifier device processing unit (plant) of the present invention, the diode being welded can be combed to get up and revolve from graphite boat
Turnback material will not fall down, to achieve the purpose that direct feeding, it is possible to reduce turnover tool improves man efficiency, reduces
The process of diode turnover, improves product yield.
Description of the drawings
Attached drawing 1 is existing axialmode diode structure schematic diagram；
Attached drawing 2 is semiconductor rectifier device processing unit (plant) structural schematic diagram of the present invention；
Attached drawing 3 is the partial structural diagram of attached drawing 2；
Attached drawing 4 is the side structure schematic view of attached drawing 3；
Attached drawing 5 is semiconductor rectifier device processing unit (plant) use state diagram of the present invention.
In the figures above：1, diode chip for backlight unit；2, the first bronze medal lead；3, the second bronze medal lead；4, scolding tin；5, epoxy body；6、
Strip substrate；7, comb material tooth；71, comb material inter-tooth slots；8, tooth is oriented；81, comb material inter-tooth slots；9, long groove；10, hook portion；11, left
Handle；12, right handles.
Specific implementation mode
The invention will be further described with reference to the accompanying drawings and embodiments：
Embodiment：A kind of semiconductor rectifier device processing unit (plant), the axialmode diode include diode chip for backlight unit 1, first
One end of copper lead 2, the second bronze medal lead 3, the first bronze medal lead 2 is connected to the poles N of the diode chip for backlight unit 1 by scolding tin 4
Face, the other end of the first bronze medal lead 2 is as the axialmode diode input terminal；One end of the second bronze medal lead 3 passes through weldering
Tin 4 is connected to the P pole-faces of the diode chip for backlight unit 1, and the other end of the second bronze medal lead 3 is inputted as the axialmode diode
End, one end that the diode chip for backlight unit 1,2 second bronze medal lead 3 of the first bronze medal lead are contacted with diode chip for backlight unit is coated by epoxy body 5；
The turnover device includes that strip substrate 6, several comb material teeth 7 and several orientation teeth 8, several described combs expect tooth 7
In the middle part of strip substrate 6 and inline along its length, several described orientation teeth 8 are located at 6 side of strip substrate
Side and inline along its length, to form a long groove between several comb material teeth 7 and several orientation teeth 8
9, adjacent comb expects there is comb material inter-tooth slots 71 between tooth 7, has between adjacent orientation tooth 8 and orients inter-tooth slots 81, the comb expects tooth
Between slot 71, orient inter-tooth slots 81 gap be more than the first bronze medal lead 2, the second bronze medal lead 3 diameter；
Comb material tooth 7 and orientation tooth 8 be located at 6 homonymy of strip substrate and be oppositely arranged, and the strip substrate 6 is along its length
Both ends are respectively arranged with left and right handle 11,12, and the upper end of the comb material tooth 7 has a hook portion 10 for stretching into long groove 9.
Above-mentioned left and right handle 11,12 is located at 6 both sides of strip substrate with comb material tooth 7, orientation tooth 8.
Above-mentioned left and right handle 11,12 and the angle of strip substrate 6 are 30 °.
Above-mentioned semiconductor rectifier device is as follows with the processing unit (plant) course of work：Comb material inter-tooth slots 71 are used to fix diode,
Long groove 9 is used to avoid the die portions among diode, and 10 purpose of hook portion can be supported after turnover device rotates 180 degree
Diode makes diode not fall out, and left and right handle 11,12 is convenient for manual operations.
When using above-mentioned semiconductor rectifier device processing unit (plant), the diode being welded can be combed from graphite boat
Get up and rotate 180 degree material to will not fall down, to achieve the purpose that direct feeding.Reach the purpose and can reduce and changes a job in week
Tool, the process for improving man efficiency, reducing aluminum strip turnover, improve product yield.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the protection scope of the present invention.
Claims (1)
1. a kind of semiconductor rectifier device processing unit (plant), it is characterised in that：The semiconductor rectifier device includes diode core
Piece（1）, the first bronze medal lead（2）, the second bronze medal lead（3）, the first bronze medal lead（2）One end pass through scolding tin（4）It is connected to institute
State diode chip for backlight unit（1）N pole-faces, the first bronze medal lead（2）The other end as the axialmode diode input terminal；Described
Two bronze medal leads（3）One end pass through scolding tin（4）It is connected to the diode chip for backlight unit（1）P pole-faces, the second bronze medal lead（3）It is another
One end is as the axialmode diode input terminal, the diode chip for backlight unit（1）, the first bronze medal lead（2）, the second bronze medal lead（3）
With diode chip for backlight unit（1）One end of contact is by epoxy body（5）Cladding；
The highly-efficient processing device includes strip substrate（6）, several comb material teeth（7）With several orientation teeth（8）, several institute
State comb material tooth（7）Positioned at strip substrate（6）Middle part and inline along its length, several described orientation teeth（8）Position
In strip substrate（6）A side and inline along its length, in several comb material teeth（7）With several orientations
Tooth（8）Between formed a long groove（9）, adjacent comb material tooth（7）Between have comb material inter-tooth slots（71）, adjacent orientation tooth（8）It
Between have orientation inter-tooth slots（81）, the comb material inter-tooth slots（71）, orientation inter-tooth slots（81）Gap draw more than first bronze medal
Line（2）, the second bronze medal lead（3）Diameter；
The comb expects tooth（7）With orientation tooth（8）Positioned at strip substrate（6）It homonymy and is oppositely arranged, the strip substrate（6）Along long
The both ends in degree direction are respectively arranged with left and right handle（11、12）, the comb material tooth（7）Upper end have and one stretch into long groove（9）
Hook portion（10）；
The left and right handle（11、12）Expect tooth with comb（7）, orientation tooth（8）It is located at strip substrate（6）Both sides, the left side,
Right handles（11、12）With strip substrate（6）Angle be 30 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810255573.7A CN108461428B (en) | 2014-12-22 | 2014-12-22 | Processing device for semiconductor rectifying device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810255573.7A CN108461428B (en) | 2014-12-22 | 2014-12-22 | Processing device for semiconductor rectifying device |
| CN201410802411.2A CN104617014B (en) | 2014-12-22 | 2014-12-22 | Highly-efficient processing device for diode component |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410802411.2A Division CN104617014B (en) | 2014-12-22 | 2014-12-22 | Highly-efficient processing device for diode component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108461428A true CN108461428A (en) | 2018-08-28 |
| CN108461428B CN108461428B (en) | 2020-12-08 |
Family
ID=53151404
Family Applications (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410802411.2A Active CN104617014B (en) | 2014-12-22 | 2014-12-22 | Highly-efficient processing device for diode component |
| CN201710947151.1A Active CN107978546B (en) | 2014-12-22 | 2014-12-22 | Diode device turnover device convenient to material loading |
| CN201810255654.7A Active CN108630589B (en) | 2014-12-22 | 2014-12-22 | Transfer mechanism for improving yield of semiconductor device |
| CN201710947526.4A Active CN107978547B (en) | 2014-12-22 | 2014-12-22 | Turnover mechanism for diode device production |
| CN201710947527.9A Active CN107958863B (en) | 2014-12-22 | 2014-12-22 | Processing device for rectifier |
| CN201810255573.7A Active CN108461428B (en) | 2014-12-22 | 2014-12-22 | Processing device for semiconductor rectifying device |
Family Applications Before (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410802411.2A Active CN104617014B (en) | 2014-12-22 | 2014-12-22 | Highly-efficient processing device for diode component |
| CN201710947151.1A Active CN107978546B (en) | 2014-12-22 | 2014-12-22 | Diode device turnover device convenient to material loading |
| CN201810255654.7A Active CN108630589B (en) | 2014-12-22 | 2014-12-22 | Transfer mechanism for improving yield of semiconductor device |
| CN201710947526.4A Active CN107978547B (en) | 2014-12-22 | 2014-12-22 | Turnover mechanism for diode device production |
| CN201710947527.9A Active CN107958863B (en) | 2014-12-22 | 2014-12-22 | Processing device for rectifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (6) | CN104617014B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111128808B (en) * | 2019-12-30 | 2023-07-21 | 广安市嘉乐电子科技有限公司 | Turnover tool for axial diode packaging process |
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| CN102315070A (en) * | 2010-07-07 | 2012-01-11 | 森美材料有限公司 | The plasma texturing device that is used for solar cell |
| CN103918066A (en) * | 2012-11-05 | 2014-07-09 | 日本精工株式会社 | Semiconductor module |
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| JP4360595B2 (en) * | 2002-10-18 | 2009-11-11 | ペルノックス株式会社 | Photoelectric conversion device |
| EP2277198B1 (en) * | 2008-05-13 | 2018-07-11 | Siemens Aktiengesellschaft | Arrangement of light-emitting diodes |
| CN201466010U (en) * | 2009-06-19 | 2010-05-12 | 常州新区佳讯电子器材有限公司 | Full-automatic diode gilling machine |
| KR101065724B1 (en) * | 2009-10-07 | 2011-09-19 | 주식회사 프로텍 | Bond head module for manufacturing led |
| CN201754503U (en) * | 2010-03-03 | 2011-03-02 | 苏州固锝电子股份有限公司 | Transient voltage suppressor |
| CN102108479B (en) * | 2010-11-19 | 2012-03-07 | 程远山 | Method for tinning pins of plastics-sealed diodes |
| CN102593283A (en) * | 2012-03-01 | 2012-07-18 | 溧阳通亿能源科技有限公司 | High light-efficiency LED (light-emitting diode) packaging preparation method |
| CN102646618A (en) * | 2012-04-12 | 2012-08-22 | 苏州固锝电子股份有限公司 | Dissecting process for diode device |
| CN202549817U (en) * | 2012-04-20 | 2012-11-21 | 常州信息职业技术学院 | Elastic hand grasping device for carrying diodes |
| CN203266649U (en) * | 2013-04-10 | 2013-11-06 | 常州信息职业技术学院 | Mechanical arm device for carrying diodes integrally |
| CN203277327U (en) * | 2013-05-15 | 2013-11-06 | 常州广达电子有限公司 | Material-combing strip for diode production |
| CN203631492U (en) * | 2013-11-29 | 2014-06-04 | 如皋市大昌电子有限公司 | Axial diode SKY and GPP product rotating plate tooling |
| CN204632728U (en) * | 2014-12-22 | 2015-09-09 | 苏州固锝电子股份有限公司 | For the highly-efficient processing device of diode component |
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2014
- 2014-12-22 CN CN201410802411.2A patent/CN104617014B/en active Active
- 2014-12-22 CN CN201710947151.1A patent/CN107978546B/en active Active
- 2014-12-22 CN CN201810255654.7A patent/CN108630589B/en active Active
- 2014-12-22 CN CN201710947526.4A patent/CN107978547B/en active Active
- 2014-12-22 CN CN201710947527.9A patent/CN107958863B/en active Active
- 2014-12-22 CN CN201810255573.7A patent/CN108461428B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102315070A (en) * | 2010-07-07 | 2012-01-11 | 森美材料有限公司 | The plasma texturing device that is used for solar cell |
| CN103918066A (en) * | 2012-11-05 | 2014-07-09 | 日本精工株式会社 | Semiconductor module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107958863B (en) | 2021-05-18 |
| CN107978546A (en) | 2018-05-01 |
| CN108630589B (en) | 2020-12-08 |
| CN107978546B (en) | 2020-08-07 |
| CN107978547B (en) | 2020-03-24 |
| CN108461428B (en) | 2020-12-08 |
| CN107978547A (en) | 2018-05-01 |
| CN104617014A (en) | 2015-05-13 |
| CN104617014B (en) | 2018-09-07 |
| CN107958863A (en) | 2018-04-24 |
| CN108630589A (en) | 2018-10-09 |
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