CN107958863A - Rectifying device processing unit (plant) - Google Patents
Rectifying device processing unit (plant) Download PDFInfo
- Publication number
- CN107958863A CN107958863A CN201710947527.9A CN201710947527A CN107958863A CN 107958863 A CN107958863 A CN 107958863A CN 201710947527 A CN201710947527 A CN 201710947527A CN 107958863 A CN107958863 A CN 107958863A
- Authority
- CN
- China
- Prior art keywords
- tooth
- bronze medal
- orientation
- medal lead
- diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Slot Machines And Peripheral Devices (AREA)
- Rectifiers (AREA)
- Electrodes Of Semiconductors (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Packaging Frangible Articles (AREA)
- Combined Means For Separation Of Solids (AREA)
Abstract
The present invention discloses a kind of rectifying device processing unit (plant), and one end of its first bronze medal lead is connected to the N pole-faces of the diode chip for backlight unit by scolding tin, and the other end of the first bronze medal lead is as the axialmode diode input terminal；One end of the second bronze medal lead is connected to the P pole-faces of the diode chip for backlight unit by scolding tin, and the other end of the second bronze medal lead is as the axialmode diode input terminal；The turnover device includes strip substrate, several comb material teeth and several orientation teeth, several described comb material tooth positions are in the middle part of the strip substrate and inline along its length, several described orientation tooth positions are in strip substrate a side and inline along its length；The left and right handle is located at strip substrate both sides respectively with comb material tooth, orientation tooth.The present invention, which can comb from graphite boat the diode being welded, to be got up and rotates 180 degree material and will not fall down, is reduced turnover tool so as to reach, is improved man efficiency.
Description
Technical field
The present invention relates to the production of rectifying device, more particularly to a kind of rectifying device processing unit (plant).
Background technology
The prior art is combed material onto aluminum strip by combing material strip in diode manufacture, then again by the material on aluminum strip
It is transferred on the stock shelf of molding die.The problem of such mode is brought is increase turnover tool, increase cost of labor, increases
A procedure is added to cause the risk of damage to product.
The content of the invention
It is an object of the present invention to provide a kind of rectifying device processing unit (plant), which will be welded
Diode is combed from graphite boat to be got up and rotates 180 degree material and will not fall down, so as to achieve the purpose that direct feeding, it is possible to reduce
Turnover tool, improve man efficiency, the process for reducing diode turnover, improves product yield.
To reach above-mentioned purpose, the technical solution adopted by the present invention is：A kind of rectifying device processing unit (plant), the axial direction
Type diode includes diode chip for backlight unit, the first bronze medal lead, the second bronze medal lead, and one end of the first bronze medal lead is connected by scolding tin
To the N pole-faces of the diode chip for backlight unit, the other end of the first bronze medal lead is as the axialmode diode input terminal；Described second
One end of copper lead is connected to the P pole-faces of the diode chip for backlight unit by scolding tin, and the other end of the second bronze medal lead is as the axis
To type diode input terminal, one end that the diode chip for backlight unit, first bronze medal lead the second bronze medal lead are contacted with diode chip for backlight unit by
Epoxy body coats；
The turnover device include strip substrate, several comb material teeth and several orientation teeth, several it is described comb material tooth positions in
It is in the middle part of strip substrate and inline along its length, several described orientation tooth positions in strip substrate a side and along its
Length direction is inline, so that a long groove is formed between several comb material teeth and several orientation teeth, adjacent comb material
There are comb material inter-tooth slots between tooth, there are orientation inter-tooth slots, the comb material inter-tooth slots, orientation inter-tooth slots between adjacent orientation tooth
Gap is more than the first bronze medal lead, the diameter of the second bronze medal lead；
The comb material tooth and orientation tooth position in strip substrate homonymy and are oppositely arranged, the both ends of the strip substrate along its length
Left and right handle is respectively arranged with, the upper end of the comb material tooth has a hook portion for stretching into long groove；
The left and right handle is located at strip substrate both sides respectively with comb material tooth, orientation tooth.
Further improved technical solution is as follows in above-mentioned technical proposal：
1. preferably, the left and right handle is located at strip substrate both sides respectively with comb material tooth, orientation tooth.
2. preferably, the angle of the left and right handle and strip substrate is 20 ° ~ 40 °.
Since above-mentioned technical proposal is used, the present invention has following advantages and effect compared with prior art：
Rectifying device processing unit (plant) of the present invention, it can comb the diode being welded from graphite boat gets up and rotates 180
Degree material will not fall down, so as to achieve the purpose that direct feeding, it is possible to reduce turnover tool, improve man efficiency, reduce by two poles
The process of pipe turnover, improves product yield.
Brief description of the drawings
Attached drawing 1 is existing axialmode diode structure schematic diagram；
Attached drawing 2 is rectifying device processing unit (plant) structure diagram of the present invention；
Attached drawing 3 is the side structure schematic view of attached drawing 2；
Attached drawing 4 is rectifying device processing unit (plant) use state diagram of the present invention.
In the figures above：1st, diode chip for backlight unit；2nd, the first bronze medal lead；3rd, the second bronze medal lead；4th, scolding tin；5th, epoxy body；6、
Strip substrate；7th, comb material tooth；71st, comb material inter-tooth slots；8th, tooth is oriented；81st, comb material inter-tooth slots；9th, long groove；10th, hook portion；11st, it is left
Handle；12nd, right handles.
Embodiment
The invention will be further described with reference to the accompanying drawings and embodiments：
Embodiment 1：A kind of rectifying device processing unit (plant), the axialmode diode include diode chip for backlight unit 1, the first bronze medal lead
2nd, the second bronze medal lead 3, one end of the first bronze medal lead 2 are connected to the N pole-faces of the diode chip for backlight unit 1 by scolding tin 4, and first
The other end of copper lead 2 is as the axialmode diode input terminal；One end of the second bronze medal lead 3 is connected by scolding tin 4
To the P pole-faces of the diode chip for backlight unit 1, the other end of the second bronze medal lead 3 is as the axialmode diode input terminal, and described two
One end that pole pipe chip 1,2 second bronze medal lead 3 of the first bronze medal lead are contacted with diode chip for backlight unit is coated by epoxy body 5；
The turnover device includes strip substrate 6, several comb material teeth 7 and several orientation teeth 8, several described comb material teeth 7
In the middle part of strip substrate 6 and inline along its length, several described orientation teeth 8 are located at 6 side of strip substrate
Side and inline along its length, so as to form a long groove between several comb material teeth 7 and several orientation teeth 8
9, it is adjacent comb material tooth 7 between have comb material inter-tooth slots 71, it is adjacent orientation tooth 8 between have orientation inter-tooth slots 81, it is described comb material tooth
Between groove 71, orient inter-tooth slots 81 gap be more than the first bronze medal lead 2, the diameter of the second bronze medal lead 3；
The comb material tooth 7 and orientation tooth 8 are located at 6 homonymy of strip substrate and are oppositely arranged, and the strip substrate 6 is along its length
Both ends are respectively arranged with left and right handle 11,12, and the upper end of the comb material tooth 7 has a hook portion 10 for stretching into long groove 9.
The angle of above-mentioned left and right handle 11,12 and strip substrate 6 is 25 °.
Embodiment 2：A kind of rectifying device processing unit (plant), the axialmode diode include diode chip for backlight unit 1, the first bronze medal
Lead 2, the second bronze medal lead 3, one end of the first bronze medal lead 2 are connected to the N pole-faces of the diode chip for backlight unit 1 by scolding tin 4,
The other end of first bronze medal lead 2 is as the axialmode diode input terminal；One end of the second bronze medal lead 3 passes through scolding tin 4
The P pole-faces of the diode chip for backlight unit 1 are connected to, the other end of the second bronze medal lead 3 is as the axialmode diode input terminal, institute
State diode chip for backlight unit 1, one end that 2 second bronze medal lead 3 of the first bronze medal lead is contacted with diode chip for backlight unit is coated by epoxy body 5；
The turnover device includes strip substrate 6, several comb material teeth 7 and several orientation teeth 8, several described comb material teeth 7
In the middle part of strip substrate 6 and inline along its length, several described orientation teeth 8 are located at 6 side of strip substrate
Side and inline along its length, so as to form a long groove between several comb material teeth 7 and several orientation teeth 8
9, it is adjacent comb material tooth 7 between have comb material inter-tooth slots 71, it is adjacent orientation tooth 8 between have orientation inter-tooth slots 81, it is described comb material tooth
Between groove 71, orient inter-tooth slots 81 gap be more than the first bronze medal lead 2, the diameter of the second bronze medal lead 3；
The comb material tooth 7 and orientation tooth 8 are located at 6 homonymy of strip substrate and are oppositely arranged, and the strip substrate 6 is along its length
Both ends are respectively arranged with left and right handle 11,12, and the upper end of the comb material tooth 7 has a hook portion 10 for stretching into long groove 9.
Above-mentioned left and right handle 11,12 is located at 6 both sides of strip substrate respectively with comb material tooth 7, orientation tooth 8.
The angle of above-mentioned left and right handle 11,12 and strip substrate 6 is 30 °.
Above-mentioned rectifying device is as follows with the processing unit (plant) course of work：Comb material inter-tooth slots 71 are used to fix diode, long groove 9
For avoiding the die portions among diode, 10 purpose of hook portion is can to support diode after turnover device rotates 180 degree,
Do not fall out diode, left and right handle 11,12 is easy to manual operations.
During using above-mentioned rectifying device processing unit (plant), the diode being welded can be combed to get up simultaneously by it from graphite boat
Rotation 180 degree material will not fall down, so as to achieve the purpose that direct feeding.Turnover tool can be reduced, carry by reaching the purpose
High man efficiency, the process for reducing aluminum strip turnover, improve product yield.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar can understand present disclosure and implement according to this, and it is not intended to limit the scope of the present invention.It is all according to the present invention
The equivalent change or modification that Spirit Essence is made, should be covered by the protection scope of the present invention.
Claims (1)
- A kind of 1. rectifying device processing unit (plant), it is characterised in that：The diode component includes diode chip for backlight unit（1）, first Copper lead（2）, the second bronze medal lead（3）, the first bronze medal lead（2）One end pass through scolding tin（4）It is connected to the diode core Piece（1）N pole-faces, the first bronze medal lead（2）The other end as the axialmode diode input terminal；The second bronze medal lead （3）One end pass through scolding tin（4）It is connected to the diode chip for backlight unit（1）P pole-faces, the second bronze medal lead（3）Other end conduct The axialmode diode input terminal, the diode chip for backlight unit（1）, the first bronze medal lead（2）, the second bronze medal lead（3）With diode Chip（1）One end of contact is by epoxy body（5）Cladding；The processing unit (plant) includes strip substrate（6）, several comb material teeth（7）With several orientation teeth（8）, several described combs Expect tooth（7）Positioned at strip substrate（6）Middle part and inline along its length, several described orientation teeth（8）Positioned at bar Shape substrate（6）A side and inline along its length, so that in several comb material teeth（7）With several orientation teeth （8）Between formed a long groove（9）, adjacent comb material tooth（7）Between have comb material inter-tooth slots（71）, adjacent orientation tooth（8）Between With orientation inter-tooth slots（81）, the comb material inter-tooth slots（71）, orientation inter-tooth slots（81）Gap be more than the first bronze medal lead （2）, the second bronze medal lead（3）Diameter；The comb material tooth（7）With orientation tooth（8）Positioned at strip substrate（6）Homonymy and it is oppositely arranged, the strip substrate（6）Along length The both ends in degree direction are respectively arranged with left and right handle（11、12）, the comb material tooth（7）Upper end have and one stretch into long groove（9） Hook portion（10）；The left and right handle（11、12）Expect tooth with comb（7）, orientation tooth（8）It is located at strip substrate respectively（6）Both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710947527.9A CN107958863B (en) | 2014-12-22 | 2014-12-22 | Processing device for rectifier |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410802411.2A CN104617014B (en) | 2014-12-22 | 2014-12-22 | Highly-efficient processing device for diode component |
| CN201710947527.9A CN107958863B (en) | 2014-12-22 | 2014-12-22 | Processing device for rectifier |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410802411.2A Division CN104617014B (en) | 2014-12-22 | 2014-12-22 | Highly-efficient processing device for diode component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107958863A true CN107958863A (en) | 2018-04-24 |
| CN107958863B CN107958863B (en) | 2021-05-18 |
Family
ID=53151404
Family Applications (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410802411.2A Active CN104617014B (en) | 2014-12-22 | 2014-12-22 | Highly-efficient processing device for diode component |
| CN201710947151.1A Active CN107978546B (en) | 2014-12-22 | 2014-12-22 | Diode device turnover device convenient to material loading |
| CN201810255654.7A Active CN108630589B (en) | 2014-12-22 | 2014-12-22 | Transfer mechanism for improving yield of semiconductor device |
| CN201710947526.4A Active CN107978547B (en) | 2014-12-22 | 2014-12-22 | Turnover mechanism for diode device production |
| CN201710947527.9A Active CN107958863B (en) | 2014-12-22 | 2014-12-22 | Processing device for rectifier |
| CN201810255573.7A Active CN108461428B (en) | 2014-12-22 | 2014-12-22 | Processing device for semiconductor rectifying device |
Family Applications Before (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410802411.2A Active CN104617014B (en) | 2014-12-22 | 2014-12-22 | Highly-efficient processing device for diode component |
| CN201710947151.1A Active CN107978546B (en) | 2014-12-22 | 2014-12-22 | Diode device turnover device convenient to material loading |
| CN201810255654.7A Active CN108630589B (en) | 2014-12-22 | 2014-12-22 | Transfer mechanism for improving yield of semiconductor device |
| CN201710947526.4A Active CN107978547B (en) | 2014-12-22 | 2014-12-22 | Turnover mechanism for diode device production |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810255573.7A Active CN108461428B (en) | 2014-12-22 | 2014-12-22 | Processing device for semiconductor rectifying device |
Country Status (1)
| Country | Link |
|---|---|
| CN (6) | CN104617014B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111128808B (en) * | 2019-12-30 | 2023-07-21 | 广安市嘉乐电子科技有限公司 | Turnover tool for axial diode packaging process |
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| JP2004140220A (en) * | 2002-10-18 | 2004-05-13 | Nippon Pelnox Corp | Photoelectric converter |
| KR20110037511A (en) * | 2009-10-07 | 2011-04-13 | 주식회사 프로텍 | Bond head module for manufacturing led |
| CN102027596A (en) * | 2008-05-13 | 2011-04-20 | 西门子公司 | LED arrangement |
| CN102593283A (en) * | 2012-03-01 | 2012-07-18 | 溧阳通亿能源科技有限公司 | High light-efficiency LED (light-emitting diode) packaging preparation method |
| CN204632728U (en) * | 2014-12-22 | 2015-09-09 | 苏州固锝电子股份有限公司 | For the highly-efficient processing device of diode component |
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| US4997792A (en) * | 1989-11-21 | 1991-03-05 | Eastman Kodak Company | Method for separation of diode array chips during fabrication thereof |
| CN201466010U (en) * | 2009-06-19 | 2010-05-12 | 常州新区佳讯电子器材有限公司 | Full-automatic diode gilling machine |
| CN201754503U (en) * | 2010-03-03 | 2011-03-02 | 苏州固锝电子股份有限公司 | Transient voltage suppressor |
| KR101141577B1 (en) * | 2010-07-07 | 2012-06-08 | (주)세미머티리얼즈 | Apparatus and method for plasma texturing of solar cell |
| CN102108479B (en) * | 2010-11-19 | 2012-03-07 | 程远山 | Method for tinning pins of plastics-sealed diodes |
| CN102646618A (en) * | 2012-04-12 | 2012-08-22 | 苏州固锝电子股份有限公司 | Dissecting process for diode device |
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| JP5807721B2 (en) * | 2012-11-05 | 2015-11-10 | 日本精工株式会社 | Semiconductor module |
| CN203266649U (en) * | 2013-04-10 | 2013-11-06 | 常州信息职业技术学院 | Mechanical arm device for carrying diodes integrally |
| CN203277327U (en) * | 2013-05-15 | 2013-11-06 | 常州广达电子有限公司 | Material-combing strip for diode production |
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2014
- 2014-12-22 CN CN201410802411.2A patent/CN104617014B/en active Active
- 2014-12-22 CN CN201710947151.1A patent/CN107978546B/en active Active
- 2014-12-22 CN CN201810255654.7A patent/CN108630589B/en active Active
- 2014-12-22 CN CN201710947526.4A patent/CN107978547B/en active Active
- 2014-12-22 CN CN201710947527.9A patent/CN107958863B/en active Active
- 2014-12-22 CN CN201810255573.7A patent/CN108461428B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004140220A (en) * | 2002-10-18 | 2004-05-13 | Nippon Pelnox Corp | Photoelectric converter |
| CN102027596A (en) * | 2008-05-13 | 2011-04-20 | 西门子公司 | LED arrangement |
| KR20110037511A (en) * | 2009-10-07 | 2011-04-13 | 주식회사 프로텍 | Bond head module for manufacturing led |
| CN102593283A (en) * | 2012-03-01 | 2012-07-18 | 溧阳通亿能源科技有限公司 | High light-efficiency LED (light-emitting diode) packaging preparation method |
| CN204632728U (en) * | 2014-12-22 | 2015-09-09 | 苏州固锝电子股份有限公司 | For the highly-efficient processing device of diode component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107958863B (en) | 2021-05-18 |
| CN107978546A (en) | 2018-05-01 |
| CN108630589B (en) | 2020-12-08 |
| CN107978546B (en) | 2020-08-07 |
| CN107978547B (en) | 2020-03-24 |
| CN108461428B (en) | 2020-12-08 |
| CN107978547A (en) | 2018-05-01 |
| CN104617014A (en) | 2015-05-13 |
| CN104617014B (en) | 2018-09-07 |
| CN108461428A (en) | 2018-08-28 |
| CN108630589A (en) | 2018-10-09 |
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