CN107978547B - Turnover mechanism for diode device production - Google Patents

Turnover mechanism for diode device production Download PDF

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Publication number
CN107978547B
CN107978547B CN201710947526.4A CN201710947526A CN107978547B CN 107978547 B CN107978547 B CN 107978547B CN 201710947526 A CN201710947526 A CN 201710947526A CN 107978547 B CN107978547 B CN 107978547B
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China
Prior art keywords
teeth
strip
copper lead
shaped substrate
directional
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CN201710947526.4A
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Chinese (zh)
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CN107978547A (en
Inventor
许卫岗
蒋祖良
李建芬
毛韦娟
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Suzhou Goodark Electronics Co ltd
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Suzhou Goodark Electronics Co ltd
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Publication of CN107978547A publication Critical patent/CN107978547A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331—Disposition
    • H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Slot Machines And Peripheral Devices (AREA)
  • Rectifiers (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Packaging Frangible Articles (AREA)
  • Combined Means For Separation Of Solids (AREA)

Abstract

The invention discloses a turnover mechanism for producing a diode device, wherein a diode chip, a first copper lead and one end, which is contacted with the diode chip, of a second copper lead are coated by epoxy bodies; the turnover device comprises a strip-shaped substrate, a plurality of comb material teeth and a plurality of directional teeth, wherein the comb material teeth are positioned in the middle of the strip-shaped substrate and are arranged in a straight line along the length direction of the strip-shaped substrate, and the directional teeth are positioned on one side of the strip-shaped substrate and are arranged in a straight line along the length direction of the strip-shaped substrate, so that a long groove is formed between the comb material teeth and the directional teeth of the plurality of combs, a comb material inter-tooth groove is formed between every two adjacent comb material teeth, a directional inter-tooth groove is formed between every two adjacent directional teeth, and the gaps between the comb material inter-tooth grooves and the directional inter-tooth grooves are larger than the diameters of the first copper lead and the second copper lead. The invention can comb the welded diode from the graphite boat and rotate 180 degrees to prevent the material from falling off, thereby achieving the purpose of direct feeding and reducing turnover tools.

Description

Turnover mechanism for diode device production
Technical Field
The invention relates to production of a rectifying device, in particular to a turnover mechanism for producing a diode device.
Background
In the prior art, in the manufacture of diodes, materials are combed on an aluminum strip through a material combing strip, and then the materials on the aluminum strip are transferred to a material loading frame of a forming die. The problems brought by the mode are that the turnover tools are increased, the labor cost is increased, and the risk of damaging the product by one process is increased.
Disclosure of Invention
The turnover mechanism for producing the diode device can comb the welded diode from a graphite boat and rotate 180 degrees to prevent the material from falling off, so that the purpose of direct feeding is achieved, turnover tools can be reduced, the labor efficiency is improved, the turnover procedures of the diode are reduced, and the product yield is improved.
In order to achieve the purpose, the invention adopts the technical scheme that: the turnover mechanism for producing the diode device comprises a diode chip, a first copper lead and a second copper lead, wherein one end of the first copper lead is connected to an N pole surface of the diode chip through soldering tin, and the other end of the first copper lead is used as an input end of the axial diode; one end of the second copper lead is connected to the P pole surface of the diode chip through soldering tin, the other end of the second copper lead is used as the input end of the axial diode, and the diode chip, the first copper lead and one end of the second copper lead, which is in contact with the diode chip, are covered by an epoxy body;
the turnover device comprises a strip-shaped substrate, a plurality of comb teeth and a plurality of directional teeth, wherein the comb teeth are positioned in the middle of the strip-shaped substrate and are arranged in a straight line along the length direction of the strip-shaped substrate, the directional teeth are positioned on one side of the strip-shaped substrate and are arranged in a straight line along the length direction of the strip-shaped substrate, so that a long groove is formed between the comb teeth and the directional teeth, a comb inter-tooth groove is formed between every two adjacent comb teeth, a directional inter-tooth groove is formed between every two adjacent directional teeth, and the gaps between the comb inter-tooth grooves and the directional inter-tooth grooves are larger than the diameters of the first copper lead and the second copper lead;
the material combing teeth and the directional teeth are positioned on the same side of the strip-shaped substrate and are arranged oppositely, the left handle and the right handle are respectively arranged at the two ends of the strip-shaped substrate along the length direction, and the upper ends of the material combing teeth are provided with hook parts extending into the long grooves;
the included angle between the left handle and the strip-shaped substrate and the included angle between the right handle and the strip-shaped substrate are 20-40 degrees.
The technical scheme of further improvement in the technical scheme is as follows:
1. as the preferred scheme, the left handle, the right handle, the material combing teeth and the directional teeth are respectively positioned on two sides of the strip-shaped substrate.
2. As a preferred scheme, the included angle between the left handle and the strip-shaped base plate and the included angle between the right handle and the strip-shaped base plate are 20-40 degrees.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages and effects:
the turnover mechanism for producing the diode device can comb the welded diode from the graphite boat and rotate 180 degrees to prevent the material from falling off, thereby achieving the purpose of direct feeding, reducing turnover tools, improving the labor efficiency, reducing the turnover procedures of the diode and improving the yield of products.
Drawings
FIG. 1 is a schematic diagram of a conventional axial diode structure;
FIG. 2 is a schematic structural view of a turnover mechanism for producing a diode device according to the present invention;
FIG. 3 is a side view schematic of the structure of FIG. 2;
FIG. 4 is a schematic diagram of the using state of the turnover mechanism for producing the diode device.
In the above drawings: 1. a diode chip; 2. a first copper lead; 3. a second copper lead; 4. soldering tin; 5. an epoxy body; 6. a strip-shaped substrate; 7. combing the material teeth; 71. combing inter-tooth grooves; 8. a directional tooth; 81. combing inter-tooth grooves; 9. a long trench; 10. a hook portion; 11. a left handle; 12. and a right handle.
Detailed Description
The invention is further described with reference to the following figures and examples:
example 1: a turnover mechanism for producing a diode device is characterized in that an axial diode comprises a diode chip 1, a first copper lead 2 and a second copper lead 3, one end of the first copper lead 2 is connected to the N pole face of the diode chip 1 through soldering tin 4, and the other end of the first copper lead 2 serves as the input end of the axial diode; one end of the second copper lead 3 is connected to the P pole surface of the diode chip 1 through soldering tin 4, the other end of the second copper lead 3 is used as the input end of the axial diode, and the diode chip 1, the first copper lead 2 and one end of the second copper lead 3, which is in contact with the diode chip, are covered by an epoxy body 5;
the turnover device comprises a strip-shaped substrate 6, a plurality of comb teeth 7 and a plurality of directional teeth 8, wherein the comb teeth 7 are positioned in the middle of the strip-shaped substrate 6 and are arranged in a straight line along the length direction of the strip-shaped substrate, the directional teeth 8 are positioned on one side of the strip-shaped substrate 6 and are arranged in a straight line along the length direction of the strip-shaped substrate, so that a long groove 9 is formed between the comb teeth 7 and the directional teeth 8, a comb inter-tooth groove 71 is formed between every two adjacent comb teeth 7, a directional inter-tooth groove 81 is formed between every two adjacent directional teeth 8, and the gaps between the comb inter-tooth grooves 71 and the directional inter-tooth grooves 81 are larger than the diameters of the first copper lead 2 and the second copper lead 3;
the material combing teeth 7 and the directional teeth 8 are located on the same side of the strip-shaped substrate 6 and are arranged oppositely, the left and right handles 11 and 12 are respectively arranged at the two ends of the strip-shaped substrate 6 along the length direction, and the upper ends of the material combing teeth 7 are provided with hook portions 10 extending into the long grooves 9.
The left and right handles 11, 12 form an angle of 25 ° with the strip-shaped base plate 6.
Example 2: a turnover mechanism for producing a diode device is characterized in that an axial diode comprises a diode chip 1, a first copper lead 2 and a second copper lead 3, one end of the first copper lead 2 is connected to the N pole face of the diode chip 1 through soldering tin 4, and the other end of the first copper lead 2 serves as the input end of the axial diode; one end of the second copper lead 3 is connected to the P pole surface of the diode chip 1 through soldering tin 4, the other end of the second copper lead 3 is used as the input end of the axial diode, and the diode chip 1, the first copper lead 2 and one end of the second copper lead 3, which is in contact with the diode chip, are covered by an epoxy body 5;
the turnover device comprises a strip-shaped substrate 6, a plurality of comb teeth 7 and a plurality of directional teeth 8, wherein the comb teeth 7 are positioned in the middle of the strip-shaped substrate 6 and are arranged in a straight line along the length direction of the strip-shaped substrate, the directional teeth 8 are positioned on one side of the strip-shaped substrate 6 and are arranged in a straight line along the length direction of the strip-shaped substrate, so that a long groove 9 is formed between the comb teeth 7 and the directional teeth 8, a comb inter-tooth groove 71 is formed between every two adjacent comb teeth 7, a directional inter-tooth groove 81 is formed between every two adjacent directional teeth 8, and the gaps between the comb inter-tooth grooves 71 and the directional inter-tooth grooves 81 are larger than the diameters of the first copper lead 2 and the second copper lead 3;
the material combing teeth 7 and the directional teeth 8 are located on the same side of the strip-shaped substrate 6 and are arranged oppositely, the left and right handles 11 and 12 are respectively arranged at the two ends of the strip-shaped substrate 6 along the length direction, and the upper ends of the material combing teeth 7 are provided with hook portions 10 extending into the long grooves 9.
The left and right handles 11 and 12, the combing teeth 7 and the directional teeth 8 are respectively positioned at two sides of the strip-shaped substrate 6.
The left and right handles 11, 12 form an angle of 30 ° with the strip-shaped base plate 6.
The working process of the turnover mechanism for producing the diode device is as follows: the comb inter-tooth grooves 71 are used for fixing the diodes, the long grooves 9 are used for avoiding crystal grain parts in the middle of the diodes, the hook parts 10 are used for supporting the diodes after the turnover device rotates 180 degrees, the diodes cannot fall off, and the left and right handles 11 and 12 are convenient to operate manually.
When the turnover mechanism for producing the diode device is adopted, the welded diode can be combed from the graphite boat and the material can not fall off after rotating 180 degrees, so that the purpose of direct feeding is achieved. The purpose is achieved by reducing turnover tools, improving labor efficiency, reducing the aluminum strip turnover process and improving the product yield.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims (1)

1. The utility model provides a turnover mechanism is used in diode device production which characterized in that: the diode device comprises a diode chip (1), a first copper lead (2) and a second copper lead (3), wherein one end of the first copper lead (2) is connected to the N pole face of the diode chip (1) through soldering tin (4), and the other end of the first copper lead (2) is used as the input end of the diode device; one end of the second copper lead (3) is connected to the P pole surface of the diode chip (1) through soldering tin (4), the other end of the second copper lead (3) serves as the input end of the diode device, and one ends, in contact with the diode chip (1), of the diode chip (1), the first copper lead (2) and the second copper lead (3) are wrapped by epoxy bodies (5);
the turnover mechanism comprises a strip-shaped substrate (6), a plurality of combing teeth (7) and a plurality of directional teeth (8), wherein the combing teeth (7) are positioned in the middle of the strip-shaped substrate (6) and are arranged in a straight line along the length direction of the strip-shaped substrate, the directional teeth (8) are positioned on one side of the strip-shaped substrate (6) and are arranged in a straight line along the length direction of the strip-shaped substrate, so that a long groove (9) is formed between the combing teeth (7) and the directional teeth (8), a combing inter-tooth groove (71) is formed between every two adjacent combing teeth (7), a directional inter-tooth groove (81) is formed between every two adjacent directional teeth (8), and the gaps of the combing inter-tooth grooves (71) and the directional inter-tooth grooves (81) are larger than the diameters of the first copper lead (2) and the second copper lead (3);
the material combing teeth (7) and the directional teeth (8) are positioned on the same side of the strip-shaped substrate (6) and are arranged oppositely, the two ends of the strip-shaped substrate (6) along the length direction are respectively provided with a left handle (11) and a right handle (12), and the upper ends of the material combing teeth (7) are provided with hook parts (10) extending into the long grooves (9);
the included angle between the left handle (11) and the right handle (12) and the strip-shaped substrate (6) is 20-40 degrees.
CN201710947526.4A 2014-12-22 2014-12-22 Turnover mechanism for diode device production Active CN107978547B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710947526.4A CN107978547B (en) 2014-12-22 2014-12-22 Turnover mechanism for diode device production

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410802411.2A CN104617014B (en) 2014-12-22 2014-12-22 Highly-efficient processing device for diode component
CN201710947526.4A CN107978547B (en) 2014-12-22 2014-12-22 Turnover mechanism for diode device production

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CN201410802411.2A Division CN104617014B (en) 2014-12-22 2014-12-22 Highly-efficient processing device for diode component

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CN107978547B true CN107978547B (en) 2020-03-24

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CN201410802411.2A Active CN104617014B (en) 2014-12-22 2014-12-22 Highly-efficient processing device for diode component
CN201710947151.1A Active CN107978546B (en) 2014-12-22 2014-12-22 Diode device turnover device convenient to material loading
CN201810255654.7A Active CN108630589B (en) 2014-12-22 2014-12-22 Transfer mechanism for improving yield of semiconductor device
CN201710947526.4A Active CN107978547B (en) 2014-12-22 2014-12-22 Turnover mechanism for diode device production
CN201710947527.9A Active CN107958863B (en) 2014-12-22 2014-12-22 Processing device for rectifier
CN201810255573.7A Active CN108461428B (en) 2014-12-22 2014-12-22 Processing device for semiconductor rectifying device

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CN201410802411.2A Active CN104617014B (en) 2014-12-22 2014-12-22 Highly-efficient processing device for diode component
CN201710947151.1A Active CN107978546B (en) 2014-12-22 2014-12-22 Diode device turnover device convenient to material loading
CN201810255654.7A Active CN108630589B (en) 2014-12-22 2014-12-22 Transfer mechanism for improving yield of semiconductor device

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CN201710947527.9A Active CN107958863B (en) 2014-12-22 2014-12-22 Processing device for rectifier
CN201810255573.7A Active CN108461428B (en) 2014-12-22 2014-12-22 Processing device for semiconductor rectifying device

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CN111128808B (en) * 2019-12-30 2023-07-21 广安市嘉乐电子科技有限公司 Turnover tool for axial diode packaging process

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JP4360595B2 (en) * 2002-10-18 2009-11-11 ペルノックス株式会社 Photoelectric conversion device
EP2277198B1 (en) * 2008-05-13 2018-07-11 Siemens Aktiengesellschaft Arrangement of light-emitting diodes
CN201466010U (en) * 2009-06-19 2010-05-12 常州新区佳讯电子器材有限公司 Full-automatic diode gilling machine
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CN202549817U (en) * 2012-04-20 2012-11-21 常州信息职业技术学院 Elastic hand grasping device for carrying diodes
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Publication number Publication date
CN107958863B (en) 2021-05-18
CN107978546A (en) 2018-05-01
CN108630589B (en) 2020-12-08
CN107978546B (en) 2020-08-07
CN108461428B (en) 2020-12-08
CN107978547A (en) 2018-05-01
CN104617014A (en) 2015-05-13
CN104617014B (en) 2018-09-07
CN108461428A (en) 2018-08-28
CN107958863A (en) 2018-04-24
CN108630589A (en) 2018-10-09

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