CN108459692B - Computer motherboard heat dissipation mechanism - Google Patents
Computer motherboard heat dissipation mechanism Download PDFInfo
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- CN108459692B CN108459692B CN201810315539.4A CN201810315539A CN108459692B CN 108459692 B CN108459692 B CN 108459692B CN 201810315539 A CN201810315539 A CN 201810315539A CN 108459692 B CN108459692 B CN 108459692B
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 111
- 230000007246 mechanism Effects 0.000 title claims abstract description 28
- 238000007789 sealing Methods 0.000 claims abstract description 41
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 22
- 238000003466 welding Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 abstract description 5
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000006641 stabilisation Effects 0.000 description 3
- 238000011105 stabilization Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a computer mainboard heat dissipation mechanism. In the invention, the computer comprises a case, a heat dissipation mechanism comprises an aluminum plate arranged in the case, a plurality of heat dissipation holes are formed in the aluminum plate in a penetrating manner, an exhaust pipe is horizontally arranged in the case, the number of the exhaust pipe and the heat dissipation holes is the same, the inner end of the exhaust pipe is communicated with the heat dissipation holes, the outer end of the exhaust pipe extends out of the case, a heat dissipation cylinder is sleeved outside the outer end of the exhaust pipe, an annular sealing part is arranged on the inner side wall of one end of the heat dissipation cylinder, which is far away from the case, the exhaust pipe and the sealing part form a closed heat dissipation cavity, the two adjacent heat dissipation cavities are communicated through the air guide pipe fixedly arranged between the two adjacent heat dissipation cylinders, the chassis is vertically fixed with an air inlet pipe, a heat dissipation fan is installed in the upper end of the air inlet pipe, the heat dissipation cavity at the top is communicated with the lower end of the air inlet pipe, and the cavity wall of the heat dissipation cavity at the bottom is provided with an exhaust hole. The invention has the advantage of improving the working stability of the computer.
Description
Technical Field
The invention relates to a computer, in particular to a computer mainboard heat dissipation mechanism.
Background
The computer is commonly called as computer, is a modern electronic computing machine for high-speed computation, can perform numerical computation and logic computation, and also has the function of storage and memory.
A computer is composed of a hardware system and a software system, and a computer without any software installed is called a bare computer. The computer can be divided into a super computer, an industrial control computer, a network computer, a personal computer and an embedded computer, and more advanced computers comprise a biological computer, a photon computer, a quantum computer and the like.
In existing computers, the CPU is mounted on the motherboard. The CPU can emit large heat when in work, wherein one part of heat is taken away by the fan, and the other part of heat can be transmitted to the mainboard for heat dissipation. However, in the existing computer, no structure for heat dissipation of the main board is provided, which not only affects the service life of the main board, but also has a certain effect on the working stability of the computer.
Disclosure of Invention
The invention aims to provide a computer mainboard heat dissipation mechanism aiming at the problems in the prior art, and solves the technical problem of how to improve the working stability of a computer.
The purpose of the invention can be realized by the following technical scheme: a computer motherboard heat dissipation mechanism comprises a case, the heat dissipation mechanism comprises an aluminum plate vertically arranged in the case, the length of the aluminum plate extends along the vertical direction, and mounting holes for mounting a motherboard are formed in the periphery of the aluminum plate; the outer end of each exhaust pipe is externally sleeved with a heat dissipation cylinder, the inner diameter of each heat dissipation cylinder is larger than the outer diameter of each exhaust pipe, the inner side wall of one end, away from the case, of each heat dissipation cylinder is provided with an annular convex sealing part, the sealing part is sleeved outside each exhaust pipe and is fixedly connected with the exhaust pipe in a sealing mode, the other end of each heat dissipation cylinder is tightly abutted to the outer wall of the case, a closed heat dissipation cavity is formed among the heat dissipation cylinders, the case, the exhaust pipes and the sealing parts, the two adjacent heat dissipation cavities are communicated through air guide pipes fixedly arranged between the two adjacent heat dissipation cylinders, an air inlet pipe is vertically fixed outside the case, and a heat dissipation fan is installed in the upper; in all the heat dissipation cavities, the heat dissipation cavity at the top is communicated with the lower end of the air inlet pipe, the cavity wall of the heat dissipation cavity at the bottom is provided with an exhaust hole which enables the heat dissipation cavity to be communicated with the outside, and the exhaust pipe, the heat dissipation cylinder and the air guide pipe are all made of heat conduction materials.
When the heat-insulating heat; the cooling fan works to generate cold air, the cold air enters the uppermost cooling cavity through the air inlet pipe, then flows through the cooling cavities in sequence under the cooperation of the air guide pipe and is finally discharged outwards through the exhaust holes, and therefore heat on the exhaust pipes is taken away quickly.
In the mechanism, the mainboard is in direct contact with the external environment through the exhaust pipe, and the heat on the exhaust pipe is rapidly and actively dissipated under the coordination of components such as a cooling fan, an air inlet pipe, a cooling cylinder and the like, so that the heat dissipation speed of the mainboard is effectively increased, and the working stability of the computer is improved.
In the computer motherboard heat dissipation mechanism, each exhaust pipe has a flange protruding annularly on the outer side wall of the inner end, and the flange is tightly abutted against the inner side wall of the case. At the moment, the side wall of the case is clamped between the flange and the heat dissipation cylinder, so that the heat dissipation cylinder and the exhaust pipe can be positioned and completed simultaneously during actual assembly, the assembly processes are effectively reduced, and the assembly of the heat dissipation mechanism is simpler and more convenient.
In the computer motherboard heat dissipation mechanism, the end surface of the heat dissipation cylinder, which abuts against the case, is provided with an annular groove coaxial with the heat dissipation cylinder, an annular sealing gasket is arranged in the annular groove, and two end surfaces of the annular sealing gasket respectively abut against the bottom wall of the annular groove and the outer side wall of the case. Under the action of the annular sealing gasket, reliable sealing is formed between the heat dissipation cylinder and the case, and the heat dissipation cavity is stably formed, so that the working stability of the mechanism is improved.
In the above-mentioned heat dissipation mechanism for a computer motherboard, the outer sidewall of the exhaust pipe is provided with an annular sealing groove, a sealing ring is arranged in the sealing groove, and the outer sidewall of the sealing ring abuts against the inner sidewall of the sealing part. Under the effect of sealing washer, make and form reliable sealed between blast pipe and the heat dissipation section of thick bamboo to further improve the stability that the heat dissipation chamber formed, improve the job stabilization nature of this mechanism.
In the computer motherboard heat dissipation mechanism, the case is further externally provided with an L-shaped air outlet pipe, the end, away from the case, of each air outlet pipe is externally sleeved with the air outlet pipe, the air outlet pipe is connected with the air outlet pipe through a threaded structure, and the port, away from one end of the air outlet pipe, of the air outlet pipe is arranged downwards. Under the effect of outlet duct, change the direction of giving vent to anger of blast pipe into giving vent to anger downwards to effectively reduce impurity such as dust and enter into in the blast pipe, improve the job stabilization nature of this mechanism.
In the computer motherboard heat dissipation mechanism, the hole wall of each heat dissipation hole is provided with a through hole matched with the exhaust pipe in a penetrating manner, the through holes are the same in number as the exhaust pipes and are aligned to the exhaust pipes one by one, the inner end of each exhaust pipe is inserted into the corresponding through hole, and the exhaust pipes are fixedly connected with the aluminum plates in a welding manner. By adopting the design, the device has the advantages of simple structure and convenience in assembly.
In the computer motherboard heat dissipation mechanism, the side wall of the heat dissipation cylinder at the top is provided with a threaded hole which is right opposite to the air inlet pipe in a penetrating way, the lower end of the air inlet pipe penetrates through the threaded hole and is positioned in the heat dissipation cylinder, and the air inlet pipe is in threaded connection with the threaded hole.
Compared with the prior art, this computer motherboard heat dissipation mechanism has following advantage:
1. the mainboard takes place direct contact through blast pipe and external environment to in order fast and initiatively to dispel the heat on the blast pipe under the cooperation of parts such as radiator fan, intake pipe, heat dissipation cylinder, thereby effectively add the radiating rate of piece mainboard, improve the job stabilization nature of computer.
2. The side wall of the case is clamped between the flange and the heat dissipation cylinder, so that the heat dissipation cylinder and the exhaust pipe can be positioned simultaneously and completed simultaneously during actual assembly, assembly procedures are effectively reduced, and the assembly of the heat dissipation mechanism is simpler and more convenient.
Drawings
Fig. 1 is a schematic structural diagram of the heat dissipation mechanism for a computer motherboard.
Fig. 2 is an enlarged schematic view of a structure at a in fig. 1.
In the figure, 1, a chassis; 2. an aluminum plate; 2a, heat dissipation holes; 3. an exhaust pipe; 3a, a flange; 4. an air duct; 5. a heat-dissipating cylinder; 5a, a sealing part; 5b, an exhaust hole; 6. a heat radiation fan; 7. an air inlet pipe; 8. an air outlet pipe; 9. an annular seal; 10. a seal ring; 11. and a heat dissipation cavity.
Detailed Description
The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.
As shown in fig. 1 and 2, the computer includes a housing 1, and the inside of the housing 1 is a cavity. The computer mainboard heat dissipation mechanism comprises an aluminum plate 2, an exhaust pipe 3, an air duct 4, a heat dissipation cylinder 5, a heat dissipation fan 6, an air inlet pipe 7, an air outlet pipe 8 and the like. The exhaust pipe 3, the air guide pipe 4, the heat dissipation cylinder 5 and the air outlet pipe 8 are all made of heat conducting materials, and the heat conducting materials can be aluminum alloy or brass.
Specifically, aluminum plate 2 is flat-plate-shaped, and aluminum plate 2 all is equipped with the mounting hole that is used for installing the mainboard all around. As shown in fig. 1, the aluminum plate 2 is disposed in the cabinet 1 in a vertical direction, and a length of the aluminum plate 2 extends in the vertical direction. Aluminum plate 2 has run through along this aluminum plate 2's width direction and has seted up louvre 2a, and louvre 2a has a plurality ofly and follows aluminum plate 2's length direction equipartition. The case 1 is horizontally provided with straight-tube-shaped exhaust pipes 3, and the exhaust pipes 3 and the heat dissipation holes 2a are the same in number and are opposite to each other in position. The inner end of the exhaust pipe 3 is communicated with the corresponding heat dissipation holes 2a, the outer end of the exhaust pipe 3 extends out of the case 1, and the case 1 and the aluminum plate 2 are fixedly connected with the exhaust pipe 3.
The exhaust pipe 3 and the aluminum plate 2 are connected in the following manner: all run through on the pore wall of every louvre 2a and set up the through-hole that matches with blast pipe 3, the through-hole is the same with 3 quantity of blast pipes and the position is just right one by one, and every blast pipe 3's inner all inserts and inlays in the through-hole that corresponds, and blast pipe 3 links firmly mutually with aluminum plate 2 through the welded mode. It is preferable that the exhaust pipe 3 is connected to the middle of the heat radiating hole 2 a.
The exhaust pipe 3 and the cabinet 1 are connected as follows: the outer end of each exhaust pipe 3 is sleeved with a heat dissipation cylinder 5, and the inner diameter of each heat dissipation cylinder 5 is larger than the outer diameter of each exhaust pipe 3. The inner side wall of one end, far away from the case 1, of the heat dissipation cylinder 5 is provided with a sealing part 5a protruding in an annular shape, the sealing part 5a and the heat dissipation cylinder 5 are of an integrated structure, the sealing part 5a is sleeved outside the exhaust pipe 3, and the sealing part and the exhaust pipe are fixedly connected in a sealing mode. The other end of the heat dissipation cylinder 5 is tightly abutted to the outer wall of the case 1, a flange 3a protruding in an annular shape is arranged on the outer side wall of the inner end of each exhaust pipe 3, and the flange 3a and the exhaust pipe 3 are coaxially arranged and are in an integrated structure. The flange 3a is tightly abutted to the inner side wall of the case 1, and at the moment, the side wall of the case 1 is clamped between the flange 3a and the heat dissipation cylinder 5, so that the exhaust pipe 3 is stably connected with the case 1.
Further, as shown in fig. 2, an annular groove coaxial with the heat-dissipating cylinder 5 is formed on an end surface of the heat-dissipating cylinder 5 abutting against the chassis 1, an annular sealing gasket 9 is arranged in the annular groove, and two end surfaces of the annular sealing gasket 9 respectively abut against a bottom wall of the annular groove and an outer side wall of the chassis 1; an annular sealing groove is formed in the outer side wall of the exhaust pipe 3, a sealing ring 10 is arranged in the sealing groove, and the outer side wall of the sealing ring 10 is abutted to the inner side wall of the sealing part 5 a.
As shown in fig. 1 and 2, a heat radiation chamber 11 is formed in a closed shape between the heat radiation cylinder 5, the casing 1, the exhaust pipe 3, and the sealing portion 5 a. Two adjacent heat dissipation cavities 11 are communicated through air ducts 4 fixedly arranged between two adjacent heat dissipation cylinders 5, an air inlet pipe 7 is vertically fixed outside the case 1, and a heat dissipation fan 6 is installed in the upper end of the air inlet pipe 7. Among all the heat dissipation chambers 11, the uppermost heat dissipation chamber 11 is communicated with the lower end of the air inlet pipe 7, and the chamber wall of the lowermost heat dissipation chamber 11 is provided with an exhaust hole 5b for communicating the heat dissipation chamber 11 with the outside.
Wherein, the connection mode of intake pipe 7 and heat dissipation chamber 11 is as follows: the side wall of the heat dissipation cylinder 5 at the top is provided with a threaded hole opposite to the air inlet pipe 7 in a penetrating mode, the lower end of the air inlet pipe 7 penetrates through the threaded hole and is located in the heat dissipation cylinder 5, and the air inlet pipe 7 is in threaded connection with the threaded hole.
The air duct 4 and the heat dissipation cylinder 5 are connected in the following way: the lateral wall of the heat dissipation cylinder 5 is provided with a connecting hole matched with the air duct 4 in a penetrating manner, the end part of the air duct 4 is inserted into the connecting hole, and the air duct 4 is fixedly connected with the heat dissipation cylinder 5 in a welding manner.
As shown in fig. 1, an L-shaped air outlet pipe 8 is further arranged outside the case 1, an air outlet pipe 8 is sleeved outside one end of each exhaust pipe 3 away from the case 1, the air outlet pipe 8 is connected with the exhaust pipe 3 through a threaded structure, and a port of one end of the air outlet pipe 8 away from the exhaust pipe 3 is arranged downwards.
When in use, the heat on the main board is transferred to the external environment through the exhaust pipe 3; the cooling fan 6 works to generate cold air, the cold air enters the uppermost cooling cavity 11 through the air inlet pipe 7, then flows through the cooling cavities 11 in sequence under the cooperation of the air duct 4 and is finally discharged outwards through the exhaust holes 5b, and therefore heat on the exhaust pipes 3 is taken away quickly.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (4)
1. A computer motherboard heat dissipation mechanism comprises a case, the heat dissipation mechanism comprises an aluminum plate vertically arranged in the case, the length of the aluminum plate extends along the vertical direction, and mounting holes for mounting a motherboard are formed in the periphery of the aluminum plate; the outer end of each exhaust pipe is externally sleeved with a heat dissipation cylinder, the inner diameter of each heat dissipation cylinder is larger than the outer diameter of each exhaust pipe, the inner side wall of one end, away from the case, of each heat dissipation cylinder is provided with an annular convex sealing part, the sealing part is sleeved outside each exhaust pipe and is fixedly connected with the exhaust pipe in a sealing mode, the other end of each heat dissipation cylinder is tightly abutted to the outer wall of the case, a closed heat dissipation cavity is formed among the heat dissipation cylinders, the case, the exhaust pipes and the sealing parts, the two adjacent heat dissipation cavities are communicated through air guide pipes fixedly arranged between the two adjacent heat dissipation cylinders, an air inlet pipe is vertically fixed outside the case, and a heat dissipation fan is installed in the upper; in all the heat dissipation cavities, the heat dissipation cavity at the top is communicated with the lower end of the air inlet pipe, the cavity wall of the heat dissipation cavity at the bottom is provided with an exhaust hole which enables the heat dissipation cavity to be communicated with the outside, and the exhaust pipe, the heat dissipation cylinder and the air guide pipe are all made of heat conduction materials; the outer side wall of the inner end of each exhaust pipe is provided with a flange which protrudes in an annular shape, and the flange is tightly abutted against the inner side wall of the case; an annular groove coaxial with the heat dissipation cylinder is formed in the end face, abutted against the chassis, of the heat dissipation cylinder, an annular sealing gasket is arranged in the annular groove, and two end faces of the annular sealing gasket are abutted against the bottom wall of the annular groove and the outer side wall of the chassis respectively; the outer side wall of the exhaust pipe is provided with an annular sealing groove, a sealing ring is arranged in the sealing groove, and the outer side wall of the sealing ring is abutted to the inner side wall of the sealing part.
2. The computer motherboard heat dissipation mechanism of claim 1, wherein the chassis is further provided with an L-shaped air outlet pipe, and the air outlet pipe is sleeved outside one end of each air outlet pipe away from the chassis, the air outlet pipe and the air outlet pipe are connected by a threaded structure, and a port of one end of the air outlet pipe away from the air outlet pipe is arranged downward.
3. The computer motherboard heat dissipation mechanism of claim 1, wherein the hole wall of each heat dissipation hole is penetrated with a through hole matching with the exhaust pipe, the number of the through holes and the exhaust pipes are the same, the positions of the through holes and the exhaust pipes are opposite, the inner end of each exhaust pipe is inserted into the corresponding through hole, and the exhaust pipes and the aluminum plate are fixedly connected by welding.
4. The computer motherboard heat dissipation mechanism of claim 1, wherein a threaded hole opposite to the air inlet pipe is formed through the side wall of the uppermost heat dissipation cylinder, the lower end of the air inlet pipe penetrates through the threaded hole and is positioned in the heat dissipation cylinder, and the air inlet pipe is in threaded connection with the threaded hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810315539.4A CN108459692B (en) | 2018-04-10 | 2018-04-10 | Computer motherboard heat dissipation mechanism |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810315539.4A CN108459692B (en) | 2018-04-10 | 2018-04-10 | Computer motherboard heat dissipation mechanism |
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| CN108459692A CN108459692A (en) | 2018-08-28 |
| CN108459692B true CN108459692B (en) | 2020-02-04 |
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| CN201810315539.4A Active CN108459692B (en) | 2018-04-10 | 2018-04-10 | Computer motherboard heat dissipation mechanism |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109286734A (en) * | 2018-12-08 | 2019-01-29 | 大连国晨科技有限公司 | A kind of novel mixing audio and video matrix equipment and heat dissipating method |
| CN110430298A (en) * | 2019-08-23 | 2019-11-08 | 河南省酷美智能科技有限公司 | Anti-static cell phone mainboard with radiator structure |
| CN114813996A (en) * | 2022-03-23 | 2022-07-29 | 广东德立科技发展有限公司 | Gas chromatography-single quadrupole mass spectrometer and control method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH088421B2 (en) * | 1991-03-20 | 1996-01-29 | さとみ 伊藤 | Heat dissipation device |
| EP2518816B1 (en) * | 2009-12-25 | 2018-01-10 | Valeo Japan Co., Ltd. | Safety device of battery temperature control system |
| JP5427021B2 (en) * | 2009-12-25 | 2014-02-26 | 株式会社ヴァレオジャパン | Battery temperature control device |
| JP6459430B2 (en) * | 2014-11-25 | 2019-01-30 | 株式会社デンソー | Cooler |
| CN205384559U (en) * | 2016-02-19 | 2016-07-13 | 长沙师范学院 | Easy radiating computer machine case |
| CN206162308U (en) * | 2016-08-31 | 2017-05-10 | 张博威 | Mix refrigeration sealed cabinet |
| CN206574033U (en) * | 2017-03-22 | 2017-10-20 | 黑龙江工业学院 | A kind of moistureproof dustproof computer CPU heat abstractors |
| CN207115316U (en) * | 2017-07-30 | 2018-03-16 | 田伟 | A kind of computer heat radiating device |
| CN207164673U (en) * | 2017-09-07 | 2018-03-30 | 陕西国际商贸学院 | A kind of computer host box rapid heat radiation device |
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