CN214376187U - Double-cold-source case - Google Patents
Double-cold-source case Download PDFInfo
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- CN214376187U CN214376187U CN202120171539.9U CN202120171539U CN214376187U CN 214376187 U CN214376187 U CN 214376187U CN 202120171539 U CN202120171539 U CN 202120171539U CN 214376187 U CN214376187 U CN 214376187U
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- heat exchanger
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Abstract
The utility model discloses a double-cold-source case, which comprises a case body, wherein a back plate is arranged at the lower part of the case body at intervals, a back heat dissipation channel is formed between the back plate and the inner wall of the case body, and a water-cooling heat dissipation structure is arranged on the back plate; the water-cooling heat dissipation structure comprises a water pump, a water tank, a water-cooling block, a water pipe and a heat exchanger, wherein the water pump is connected with the water tank, and a water outlet of the water tank is sequentially connected with the water-cooling block, the heat exchanger and a water inlet of the water pump through the water pipe; the power supply is positioned at the upper part of the heat exchanger, and an air cooling exhaust fan is arranged between the power supply and the heat exchanger; the double-cold-source heat dissipation case is provided, the mainboard in the case can be cooled from the back, the core element of the mainboard is cooled from the front by water cooling, the whole body in the case is cooled by air cooling, the heat dissipation efficiency of the case is greatly improved, and a good environment is provided for normal operation of elements in the case.
Description
Technical Field
The utility model belongs to the technical field of computer hardware, concretely relates to two cold source machine casees.
Background
The existing computer belongs to an electric appliance which is frequently used, the existing computer case has long service time, dust is always adhered to a heat dissipation net, and unsmooth ventilation can be caused, so that the temperature in the case is overhigh, and the normal work of electronic elements in the case is influenced.
The existing computer case aims to ensure better ventilation and heat dissipation performance; usually, a shell or a cover body is required to be made into a multi-heat-dissipation-hole structure, but the heat dissipation requirements of a computer case cannot be met by the simple structures, so that the heat dissipation efficiency is low, and the heat in the case is serious; and the heat that power fan produced directly gets into in the box, has the defect on the arrangement structure, and the cold source is single.
With the continuous development of the water cooling technology, the installation of the water cooling structure on the computer host is very common, but because of the defects of the water cooling structure, water is required to be used as a medium, water seepage of a water pipe is easy to occur in the using process, the use is unsafe, and in order to reduce the harm of the water seepage of the water pipe to the case, the research on the case with the safe use and the double cold sources is necessary.
Disclosure of Invention
To the defect and the problem that existing equipment exists, the utility model provides a two cold source machine casees, the effectual cold source that exists of having solved among the existing equipment is single, and the radiating effect is poor and use unsafe problem.
The utility model provides a scheme that its technical problem adopted is: a double-cold-source case comprises a case body, wherein a back plate is arranged at the lower part of the case body at intervals, a back heat dissipation channel is formed between the back plate and the inner wall of the case body, heat dissipation holes penetrating through the back plate are formed in a mounting area on the back plate, and elements mounted on the mounting area are communicated with the back heat dissipation channel through the heat dissipation holes; the front side of the back plate is provided with a hollow-out air outlet; an exhaust fan is installed at the air outlet, a partition plate is arranged on the inner side of the air outlet, and an air outlet channel is defined between the partition plate and the side wall of the box body; the back plate is provided with a water-cooling heat dissipation structure; the water-cooling heat dissipation structure comprises a water pump, a water tank, a water-cooling block, a water pipe and a heat exchanger, wherein the water pump is connected with the water tank, a water outlet of the water tank is sequentially connected with the water-cooling block, the heat exchanger and a water inlet of the water pump through the water pipe, the water-cooling block is in contact with the CPU, and the heat exchanger is arranged on the bracket; the power supply is positioned at the upper part of the heat exchanger, and an air cooling exhaust fan is arranged between the power supply and the heat exchanger.
Furthermore, the main board is arranged at the bottom of the support, the support is of a plate-shaped structure, and the water pump and the water tank are arranged at the lower part of the main board and fixed on the box body.
Furthermore, the support is of a U-shaped structure, a through hole is formed in the position close to the left side of the support, a vertical downward outer sleeve is arranged at the bottom of the through hole, and a water pipe is led out of the through hole and is communicated with a water inlet of the water pump through the inner sleeve.
Furthermore, the power supply is arranged at the left upper part of the box body, and the fan outlet of the power supply is arranged close to the air cooling exhaust fan.
The utility model has the advantages that: aiming at the problems of single cold source and poor heat dissipation effect in the existing organic case, the utility model provides a heat dissipation case combining air cooling and water cooling, firstly, the utility model is provided with a back plate in the case, a back heat dissipation channel is formed between the back plate and the case body, the back of an electrical element is communicated with the back heat dissipation channel by using a heat dissipation hole, and the end part of the back heat dissipation channel generates negative pressure by using an exhaust fan continuously, so that the electrical element is dissipated by the back; meanwhile, a water-cooling heat dissipation structure is arranged, and the water-cooling heat dissipation structure is utilized to carry out targeted heat dissipation on core components such as a CPU; and the heat exchanger and the power supply fan are subjected to centralized heat dissipation by utilizing air cooling heat dissipation, so that the heat dissipation effect of the case is ensured.
Additionally, the utility model discloses carry out the rationality to the structure of mainboard, water pump and heat exchanger and arrange, it is used for supporting the heat exchanger to set up the horizontally support, and hide the mainboard in the lower part of support, avoid the heat exchanger seepage to cause the influence to the mainboard, be provided with the through-hole in the left side of support simultaneously, the bottom of through-hole is provided with the outer tube, the outer tube is used for letting the water pipe pass through, simultaneously can also be with the liquid discharge of heat exchanger seepage production, the liquid of this section water pipe seepage has been avoided simultaneously is excessive, the damage probability of liquid infiltration to the mainboard has been reduced.
Therefore, the utility model discloses novel structure provides two cold sources heat dissipation machine casees, can dispel the heat to the mainboard of quick-witted incasement from the back, utilizes the water-cooling to dispel the heat from the front to the core element of mainboard, utilizes the forced air cooling to dispel the heat to quick-witted incasement whole, very big improvement the radiating efficiency of quick-witted case, provide good environment for quick-witted incasement component normal operating.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a structural schematic diagram of the stent.
Fig. 3 is a schematic structural diagram of a back plate.
The reference numbers in the figures are: the heat exchanger comprises a box body 1, a back plate 2, heat dissipation holes 3, a back heat dissipation channel 4, an exhaust fan 5, a water pump 6, a water tank 7, a water pipe 8, a heat exchanger 9, an outer sleeve 10, a main plate 11, a support 12, a through hole 13, an air-cooled exhaust fan 14 and a power supply 15.
Detailed Description
The present invention will be further explained with reference to the drawings and examples.
Example 1: the embodiment aims to provide a double-cold-source case which is mainly used for radiating a host case of a desktop, and aims at overcoming the defects existing in the existing host case structure to cause single cold source and low radiating efficiency of the case.
As shown in fig. 1, a double-cold-source chassis comprises a chassis 1, a back plate 2 is arranged at the lower part of the chassis 1 at intervals, as shown in fig. 1, the back plate 2 is arranged at the lower part of the chassis 1, and occupies about half of the space in the chassis, and elements with large heat productivity such as a main plate 11 are arranged at the position, the back plate is arranged to radiate heat from the back, a back radiating channel 4 is formed between the back plate and the inner wall of the chassis, a radiating hole 3 penetrating through the back plate is arranged on a mounting area on the back plate 2, and the radiating hole 3 enables the elements mounted on the mounting area to communicate with the back radiating channel 11; a hollow-out air outlet is formed in the right side of the back plate 2; air outlet department installs exhaust fan 5, and the inboard of air outlet is provided with the baffle, encloses into the air-out passageway between the lateral wall of baffle and box, and the air-out passageway is with exhaust fan exhaust hot-air guide to the outside.
The whole of back heat dissipation channel 11 is the closed form structure, sets up fretwork form export in the right side, utilizes exhaust fan 5 suction here, is in the negative pressure state in making back heat dissipation channel, and then can dispel the heat to the mainboard from the back.
For core components on the mainboard, such as a CPU, the present embodiment utilizes water cooling to dissipate heat of the core components; a water-cooling heat dissipation structure is arranged on the back plate 2; the water-cooling heat dissipation structure comprises a water pump 6, a water tank 5, a water-cooling block, a water pipe 8 and a heat exchanger 9, wherein the water pump 6 is connected with the water tank 7, a water outlet of the water tank 7 is connected with a water inlet of the water-cooling block, the heat exchanger 9 and the water pump 6 through the water pipe 8 in sequence, the water-cooling block is in contact with a CPU, and the heat exchanger 9 is arranged on a support 12.
In addition, in this embodiment, the power supply 15 is installed at the upper left portion of the box, the air-cooling exhaust fan 14 is disposed between the power supply 15 and the heat exchanger 12, and the fan outlet of the power supply is disposed close to the air-cooling exhaust fan 14.
Therefore, the embodiment provides a heat dissipation case combining air cooling, water cooling and back heat dissipation, aiming at the problems of single cold source and poor heat dissipation effect in the existing case, firstly, a back plate is arranged in the case, a back heat dissipation channel is formed between the back plate and the case, the back of an electrical element is communicated with the back heat dissipation channel through heat dissipation holes, and an exhaust fan is used for continuously generating negative pressure at the end part of the back heat dissipation channel to dissipate heat of the electrical element from the back; meanwhile, a water-cooling heat dissipation structure is arranged, and the water-cooling heat dissipation structure is utilized to carry out targeted heat dissipation on core components such as a CPU; and utilize the forced air cooling heat dissipation to concentrate the heat dissipation to heat exchanger and power fan department, adopt multiple mode to carry out pertinence and wholeness heat dissipation to the appointed position in the quick-witted case, the radiating effect is good, very big improvement the performance of host computer.
Example 2: this example is substantially the same as example 1, except that: aiming at the defects of the existing water-cooling heat dissipation structure, the liquid is easy to permeate into the case 1, and the damage to the mainboard and other electrical elements is easy to cause.
Based on this, the main board is installed at the bottom of the bracket 12 in the embodiment, the bracket 12 is a plate-shaped structure, the water pump 6 and the water tank 7 are arranged at the lower part of the main board 11 and fixed on the box body 1; in this embodiment, the bracket 12 is a U-shaped structure, the U-shaped structure forms a container, a through hole 13 is formed near the left side of the U-shaped structure, the bottom of the through hole 13 is provided with a vertically downward outer sleeve 10, and a water pipe is led out from the through hole 13 and is communicated with a water inlet of the water pump 6 through the inner part of the outer sleeve 10.
From this, this embodiment is to mainboard 11, water pump 6 and heat exchanger 9's structure carries out the rationality and arranges, it is used for supporting the heat exchanger to have set up the horizontally support, and hide the mainboard in the lower part of support, avoid the heat exchanger seepage to cause the influence to the mainboard, be provided with through-hole 13 in the left side of support simultaneously, the bottom of through-hole is provided with the outer tube, outer tube 10 is used for letting the water pipe pass through, simultaneously can also be with the liquid discharge of heat exchanger seepage production, the liquid of this section water pipe seepage is excessive simultaneously avoided, the damage probability of liquid infiltration to the mainboard has been reduced.
Claims (4)
1. The utility model provides a two cold source machine casees, includes the box, its characterized in that: a back plate is arranged at the lower part of the box body at intervals, a back heat dissipation channel is formed between the back plate and the inner wall of the box body, heat dissipation holes penetrating through the back plate are formed in a mounting area on the back plate, and elements mounted on the mounting area are communicated with the back heat dissipation channel through the heat dissipation holes; the front side of the back plate is provided with a hollow-out air outlet; an exhaust fan is installed at the air outlet, a partition plate is arranged on the inner side of the air outlet, and an air outlet channel is defined between the partition plate and the side wall of the box body; the back plate is provided with a water-cooling heat dissipation structure; the water-cooling heat dissipation structure comprises a water pump, a water tank, a water-cooling block, a water pipe and a heat exchanger, wherein the water pump is connected with the water tank, a water outlet of the water tank is sequentially connected with the water-cooling block, the heat exchanger and a water inlet of the water pump through the water pipe, the water-cooling block is in contact with the CPU, and the heat exchanger is arranged on the bracket; the power supply of the case is positioned at the upper part of the heat exchanger, and an air cooling exhaust fan is arranged between the power supply and the heat exchanger.
2. The dual cold source enclosure of claim 1, wherein: the main board of the element is arranged at the bottom of the bracket, the bracket is of a plate-shaped structure, and the water pump and the water tank are arranged at the lower part of the main board and are fixed on the box body.
3. The dual cold source enclosure of claim 1, wherein: the support is of a U-shaped structure, a through hole is formed in the position close to the left side of the support, a vertical downward outer sleeve is arranged at the bottom of the through hole, and a water pipe is led out of the through hole and is communicated with a water inlet of the water pump through the inner sleeve.
4. The dual cold source enclosure of claim 1, wherein: the power supply is arranged at the upper left part of the box body, and the fan outlet of the power supply is arranged close to the air-cooled exhaust fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120171539.9U CN214376187U (en) | 2021-01-22 | 2021-01-22 | Double-cold-source case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120171539.9U CN214376187U (en) | 2021-01-22 | 2021-01-22 | Double-cold-source case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214376187U true CN214376187U (en) | 2021-10-08 |
Family
ID=77958217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120171539.9U Active CN214376187U (en) | 2021-01-22 | 2021-01-22 | Double-cold-source case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214376187U (en) |
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2021
- 2021-01-22 CN CN202120171539.9U patent/CN214376187U/en active Active
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