CN110430298A - Anti-static cell phone mainboard with radiator structure - Google Patents
Anti-static cell phone mainboard with radiator structure Download PDFInfo
- Publication number
- CN110430298A CN110430298A CN201910781180.4A CN201910781180A CN110430298A CN 110430298 A CN110430298 A CN 110430298A CN 201910781180 A CN201910781180 A CN 201910781180A CN 110430298 A CN110430298 A CN 110430298A
- Authority
- CN
- China
- Prior art keywords
- cell phone
- heat
- radiating block
- mobile phone
- phone mainboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 31
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 27
- 239000004411 aluminium Substances 0.000 claims abstract description 27
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000741 silica gel Substances 0.000 claims abstract description 8
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 8
- 238000010586 diagram Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000003434 inspiratory effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Signal Processing (AREA)
- Telephone Set Structure (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses the Anti-static cell phone mainboards with radiator structure, including mobile phone substrate, cell phone mainboard and camera shooting head bore, heat-dissipating aluminium plate is provided on the mobile phone substrate, the last surface of heat-dissipating aluminium plate is bonded with radiating block by heat conductive silica gel, and is bonded with cell phone mainboard by heat conductive silica gel on radiating block.In the present invention, the highly integrated small handsets mainboard, heat-dissipating aluminium plate is provided on mobile phone substrate, then cell phone mainboard is fixed on heat-dissipating aluminium plate by radiating block, the heat that cell phone mainboard work is generated is transmitted directly on heat-dissipating aluminium plate then be dispersed into air by radiating block, improve its radiating efficiency, secondly cavity is offered inside radiating block, air inlet pipe and an air outlet pipe is connected on radiating block, it can be under the action of mini-fan, it is transferred in radiating block internal cavities by air inlet pipe draw air, then draw heat radiates to cell phone mainboard from escape pipe discharge, to further improve the radiating efficiency of cell phone mainboard.
Description
Technical field
The present invention relates to cell phone mainboard technical fields, more particularly to the Anti-static cell phone mainboard with radiator structure.
Background technique
Mainboard (English: Motherboard, Mainboard, abbreviation Mobo), also known as motherboard, system board, logic card, mother
Plate, bottom plate etc. are that the center for constituting Complex Electronic Systems Based such as electronic computer or main circuit board, typical mainboard can provide
A series of junctions for processor, video card, sonic-effect card, hard disk, memory, engage the equipment such as external equipment.They are typically directly
It is inserted into related slot, or uses connection.Most important composition component is chipset (Chipset) on mainboard.And chipset is logical
It is often made of north bridge and south bridge, also some are designed with single-chip microcontroller, enhance its performance.These chipsets for mainboard provide one it is general
Platform is connected for distinct device, controls the communication of distinct device.It also includes the support to different expansion slots, such as is handled
Device, PCI, ISA, AGP and PCI Express.Chipset also provides additional functionality, such as integrated aobvious core for mainboard, integrates sound effect
Card (also referred to as built-in aobvious core and built-in sound card).Some high price mainboards also integrate infrared communication technology, bluetooth and 802.11(Wi-Fi)
Etc. functions.
Current existing highly integrated small handsets mainboard, lacks radiator structure, it is general it is long-term it is remarkable using or
The problems such as causing mainboard to burn is led in use, will appear cell phone mainboard temperature and cross under hot weather, it is secondly existing highly integrated small
Type cell phone mainboard, mainboard also lack anti-electrostatic protecting structure, so can not meet the demand of user.
Summary of the invention
The purpose of the present invention is to solve disadvantage existing in the prior art, and propose with radiator structure prevent it is quiet
Electric hand mainboard.
To achieve the goals above, present invention employs following technical solutions: the Anti-static cell phone master with radiator structure
Plate, including mobile phone substrate, cell phone mainboard and camera shooting head bore；
Heat-dissipating aluminium plate is provided on the mobile phone substrate, the mobile phone substrate and heat-dissipating aluminium plate are to pour integral structure, described
The last surface of heat-dissipating aluminium plate is bonded with radiating block by heat conductive silica gel, and is bonded with mobile phone master by heat conductive silica gel on radiating block
Plate；
The radiating block is connected with air inlet pipe by the first conduit, and the both ends of air inlet pipe along its length are connected with through mobile phone
The air inlet of substrate, the radiating block are connected with escape pipe, and the both ends connection of escape pipe along its length by the second conduit
Have through the gas outlet of mobile phone substrate.
Preferably, cavity is offered inside the radiating block, is welded with heat sink in the internal backplane of the radiating block.
Preferably, camera shooting head bore is offered on the mobile phone substrate.
Preferably, the junction of first conduit and air inlet pipe is provided with mini-fan.
Preferably, the area of the heat-dissipating aluminium plate is greater than the area of radiating block, and the area of radiating block is greater than cell phone mainboard
Area.
Preferably, the air inlet pipe and an air outlet pipe is embedded respectively on mobile phone substrate two sidewalls along its length, and into
Tracheae and escape pipe are symmetrical about the horizontal central line of mobile phone substrate along its length.
Compared with prior art, the beneficial effects of the present invention are:
In the present invention, which is provided with heat-dissipating aluminium plate, then by cell phone mainboard on mobile phone substrate
It is fixed on heat-dissipating aluminium plate by radiating block, the heat that cell phone mainboard work is generated is transmitted directly to by radiating block
It is then dispersed into air on heat-dissipating aluminium plate, improves its radiating efficiency, secondly offered cavity inside radiating block, connect on radiating block
It is connected to air inlet pipe and an air outlet pipe, can be transferred to inside radiating block under the action of mini-fan by air inlet pipe draw air
In cavity, then draw heat radiates to cell phone mainboard from escape pipe discharge, to further improve cell phone mainboard
Radiating efficiency, then have and be provided with heat-dissipating aluminium plate on mobile phone substrate, cell phone mainboard can be grounded by heat-dissipating aluminium plate, from
And antistatic protection can be carried out to cell phone mainboard.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the Anti-static cell phone mainboard proposed by the present invention with radiator structure；
Fig. 2 is the radiating block of the Anti-static cell phone mainboard proposed by the present invention with radiator structure and the company of air inlet pipe and an air outlet pipe
Connect structural schematic diagram；
Fig. 3 is the radiating block of the Anti-static cell phone mainboard proposed by the present invention with radiator structure and the connection structure of cell phone mainboard
Schematic diagram.
Marginal data:
1, mobile phone substrate；2, heat-dissipating aluminium plate；3, radiating block；4, cell phone mainboard；5, head bore is imaged；6, the first conduit；7, air inlet pipe；
8, mini-fan；9, air inlet；10, the second conduit；11, escape pipe；12, gas outlet；13, cavity；14, heat sink.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention；Term " first ", " second ", " third "
It is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance；In addition, unless otherwise specific regulation and limit
Fixed, term " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, be also possible to detachably connect
It connects, or is integrally connected；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, intermediate matchmaker can also be passed through
Jie is indirectly connected, and can be the connection inside two elements.It for the ordinary skill in the art, can be with concrete condition
Understand the concrete meaning of above-mentioned term in the present invention.
Referring to Fig.1-3, with the Anti-static cell phone mainboard of radiator structure, including mobile phone substrate 1, cell phone mainboard 4 and camera shooting
Head bore 5；
Heat-dissipating aluminium plate 2 is provided on mobile phone substrate 1, mobile phone substrate 1 and heat-dissipating aluminium plate 2 are to pour integral structure, heat-dissipating aluminium plate 2
Last surface is bonded with radiating block 3 by heat conductive silica gel, and is bonded with cell phone mainboard 4 by heat conductive silica gel on radiating block 3；
Radiating block 3 is connected with air inlet pipe 7 by the first conduit 6, and the both ends of air inlet pipe 7 along its length are connected with through mobile phone
The air inlet 9 of substrate 1, radiating block 3 are connected with escape pipe 11, and the both ends of escape pipe 11 along its length by the second conduit 10
It is connected with through the gas outlet 12 of mobile phone substrate 1.
Cavity 13 is offered inside radiating block 3, and heat sink 14 is welded in the internal backplane of radiating block 3.
Referring to Fig.1, camera shooting head bore 5 is offered on mobile phone substrate 1.
Referring to Fig.1, the first conduit 6 and the junction of air inlet pipe 7 are provided with mini-fan 8, air inlet pipe 7 and escape pipe 11
Be embedded on the two sidewalls along its length of mobile phone substrate 1 respectively, and air inlet pipe 7 and escape pipe 11 about mobile phone substrate 1 along length
The horizontal central line for spending direction is symmetrical, and mini-fan 8 is opened for being transferred to inside radiating block 3 by 7 inspiratory air of air inlet pipe
If cavity 13 inside.
Referring to Figure 1 and Figure 3, the area of heat-dissipating aluminium plate 2 is greater than the area of radiating block 3, and the area of radiating block 3 is greater than mobile phone
The area of mainboard 4.
Working principle: the highly integrated small handsets mainboard is in use, the heat that the work of cell phone mainboard 4 generates first can be with
It is transmitted directly on heat-dissipating aluminium plate 2 by radiating block 3, is then dispersed into air, is radiated by heat-dissipating aluminium plate 2, secondly
Cavity 13 is offered inside radiating block 3, air inlet pipe 7 and escape pipe 11 are connected on radiating block 3, by interior of mobile phone battery to micro-
Type fan 8 provides power supply, opens mini-fan 8, can be transmitted under the action of mini-fan 8 by 7 draw air of air inlet pipe
Into 3 internal cavities 13 of radiating block, then draw heat radiates to cell phone mainboard 4 from the discharge of escape pipe 11, thus into one
Step improves the radiating efficiency of cell phone mainboard 4, then has and is provided with heat-dissipating aluminium plate 2 on mobile phone substrate 1, and cell phone mainboard 4 can be with
It is grounded by heat-dissipating aluminium plate 2, so as to carry out antistatic protection to cell phone mainboard 4.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (6)
1. the Anti-static cell phone mainboard with radiator structure, which is characterized in that including mobile phone substrate (1), cell phone mainboard (4) and take the photograph
As head bore (5)；
It is provided with heat-dissipating aluminium plate (2) on the mobile phone substrate (1), the mobile phone substrate (1) and heat-dissipating aluminium plate (2) are to pour one
Change structure, the last surface of the heat-dissipating aluminium plate (2) is bonded with radiating block (3) by heat conductive silica gel, and by leading on radiating block (3)
Hot silica gel is bonded with cell phone mainboard (4)；
The radiating block (3) is connected with air inlet pipe (7) by the first conduit (6), and the both ends of air inlet pipe (7) along its length connect
It is connected to the air inlet (9) through mobile phone substrate (1), the radiating block (3) is connected with escape pipe (11) by the second conduit (10),
And the both ends of escape pipe (11) along its length are connected with through the gas outlet (12) of mobile phone substrate (1).
2. the Anti-static cell phone mainboard according to claim 1 with radiator structure, which is characterized in that the radiating block
(3) internal to offer cavity (13), heat sink (14) are welded in the internal backplane of the radiating block (3).
3. the Anti-static cell phone mainboard according to claim 1 with radiator structure, which is characterized in that the mobile phone substrate
(1) camera shooting head bore (5) is offered on.
4. the Anti-static cell phone mainboard according to claim 1 with radiator structure, which is characterized in that first conduit
(6) junction of air inlet pipe (7) is provided with mini-fan (8).
5. the Anti-static cell phone mainboard according to claim 1 with radiator structure, which is characterized in that the heat-dissipating aluminium plate
(2) area is greater than the area of radiating block (3), and the area of radiating block (3) is greater than the area of cell phone mainboard (4).
6. the Anti-static cell phone mainboard according to claim 1 with radiator structure, which is characterized in that the air inlet pipe
(7) it is embedded on mobile phone substrate (1) two sidewalls along its length respectively with escape pipe (11), and air inlet pipe (7) and escape pipe
(11) symmetrical about the horizontal central line of mobile phone substrate (1) along its length.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910781180.4A CN110430298A (en) | 2019-08-23 | 2019-08-23 | Anti-static cell phone mainboard with radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910781180.4A CN110430298A (en) | 2019-08-23 | 2019-08-23 | Anti-static cell phone mainboard with radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110430298A true CN110430298A (en) | 2019-11-08 |
Family
ID=68417245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910781180.4A Pending CN110430298A (en) | 2019-08-23 | 2019-08-23 | Anti-static cell phone mainboard with radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110430298A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110995893A (en) * | 2019-11-13 | 2020-04-10 | 惠州鼎智通讯有限公司 | Smart phone motherboard that radiating efficiency is high |
| CN114844972A (en) * | 2022-05-18 | 2022-08-02 | 深圳固特讯科技有限公司 | Explosion-proof industrial mobile phone |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200996589Y (en) * | 2006-11-10 | 2007-12-26 | 浙江莱克斯瑞电气有限公司 | Stepless hanger-type light modulater |
| CN203675151U (en) * | 2013-12-17 | 2014-06-25 | 上海斐讯数据通信技术有限公司 | Cell phone with heat radiator |
| CN205356430U (en) * | 2015-12-14 | 2016-06-29 | 天津华迈科技有限公司 | Self -cooling mobile phone motherboard |
| CN205377947U (en) * | 2015-12-14 | 2016-07-06 | 天津华迈科技有限公司 | Make things convenient for radiating mobile phone motherboard of cell -phone |
| CN206991008U (en) * | 2017-06-02 | 2018-02-09 | 深圳众赢时代科技有限公司 | A kind of flat board micro projector of anti-ESD interference |
| CN108459692A (en) * | 2018-04-10 | 2018-08-28 | 温岭市志创网络科技有限公司 | A kind of computer motherboard cooling mechanism |
-
2019
- 2019-08-23 CN CN201910781180.4A patent/CN110430298A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200996589Y (en) * | 2006-11-10 | 2007-12-26 | 浙江莱克斯瑞电气有限公司 | Stepless hanger-type light modulater |
| CN203675151U (en) * | 2013-12-17 | 2014-06-25 | 上海斐讯数据通信技术有限公司 | Cell phone with heat radiator |
| CN205356430U (en) * | 2015-12-14 | 2016-06-29 | 天津华迈科技有限公司 | Self -cooling mobile phone motherboard |
| CN205377947U (en) * | 2015-12-14 | 2016-07-06 | 天津华迈科技有限公司 | Make things convenient for radiating mobile phone motherboard of cell -phone |
| CN206991008U (en) * | 2017-06-02 | 2018-02-09 | 深圳众赢时代科技有限公司 | A kind of flat board micro projector of anti-ESD interference |
| CN108459692A (en) * | 2018-04-10 | 2018-08-28 | 温岭市志创网络科技有限公司 | A kind of computer motherboard cooling mechanism |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110995893A (en) * | 2019-11-13 | 2020-04-10 | 惠州鼎智通讯有限公司 | Smart phone motherboard that radiating efficiency is high |
| CN114844972A (en) * | 2022-05-18 | 2022-08-02 | 深圳固特讯科技有限公司 | Explosion-proof industrial mobile phone |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102384532B1 (en) | Electronic device having heat dissipation structure of camera | |
| CN107479625B (en) | External function expanding device | |
| US9268376B2 (en) | Mobile computing device dock station with headset jack heat pipe interface | |
| CN105807869A (en) | Radiating structure and mounting structure for independent graphics card of computer | |
| CN110430298A (en) | Anti-static cell phone mainboard with radiator structure | |
| CN105122173A (en) | Modular computer and thermal management | |
| US10739831B2 (en) | Card-based extension cooling | |
| TW201201560A (en) | Mobile phone | |
| JP2013122730A (en) | Electronic apparatus | |
| USRE48365E1 (en) | Mobile motherboard | |
| CN201230436Y (en) | Combination of radiating device | |
| EP3188579B1 (en) | Heat dissipation apparatus and portable device | |
| CN107636562B (en) | Forced and natural convection liquid cooling device for personal computer | |
| CN105899046A (en) | Mobile phone cooling device with external cooling air duct | |
| CN110430299A (en) | Shockproof cell phone mainboard with position limiting structure | |
| CN216871165U (en) | Heat dissipation assembly and computer | |
| CN104991610B (en) | virtual instrument platform | |
| CN210640717U (en) | Device for wirelessly charging mobile phone and simultaneously dissipating heat of mobile phone | |
| CN101714015A (en) | Shell structure of portable electronic device | |
| CN209594186U (en) | Traffic lights cabinet body and traffic lights | |
| CN201097304Y (en) | Electronic apparatus | |
| CN109275309A (en) | Radiating module and motherboard component comprising it | |
| CN108776515A (en) | A kind of portable Small Computer Case of good heat dissipation | |
| CN204945876U (en) | Virtual instrument platform | |
| CN213399379U (en) | Notebook convenient to radiate heat |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210603 Address after: 343000 green lighting base of Hexi Industrial Park, Xingan County, Ji'an City, Jiangxi Province Applicant after: Jiangxi Liangan Electronic Technology Co.,Ltd. Address before: 451164 Building 5 and 6, area C, smart terminal mobile phone industrial park, intersection of Xingang Avenue and Renmin Road, HANGGANG District, Zhengzhou City, Henan Province Applicant before: Henan cool beauty Intelligent Technology Co.,Ltd. |
|
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |