CN108459692A - A kind of computer motherboard cooling mechanism - Google Patents
A kind of computer motherboard cooling mechanism Download PDFInfo
- Publication number
- CN108459692A CN108459692A CN201810315539.4A CN201810315539A CN108459692A CN 108459692 A CN108459692 A CN 108459692A CN 201810315539 A CN201810315539 A CN 201810315539A CN 108459692 A CN108459692 A CN 108459692A
- Authority
- CN
- China
- Prior art keywords
- exhaust pipe
- heat
- cabinet
- dissipating cylinder
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The present invention provides a kind of computer motherboard cooling mechanisms.In the present invention,Computer includes cabinet,Cooling mechanism includes the aluminium sheet being set in cabinet,Run through on aluminium sheet and offers multiple heat emission holes,It is also horizontal in cabinet to be equipped with exhaust pipe,Exhaust pipe is identical with heat dissipation hole number,Exhaust pipe inner end is connected to heat emission hole,Cabinet is stretched out in exhaust pipe outer end,Exhaust pipe is cased with heat-dissipating cylinder outside outer end,There is annular sealing portion on the madial wall of the one end of heat-dissipating cylinder far from cabinet,Sealing is sleeved on outside exhaust pipe and the two sealing is connected,Heat-dissipating cylinder,Cabinet,Exhaust pipe,The heat dissipation cavity in closed is formed between sealing,Adjacent two heat dissipation cavity is connected to by the gas-guide tube between being installed in adjacent two heat-dissipating cylinder,It is also vertically fixed air inlet pipe outside cabinet,Air inlet pipe is equipped with radiator fan in upper end,Heat dissipation cavity in the top is connected to air inlet pipe lower end,The cavity wall of heat dissipation cavity in bottom is equipped with gas vent.The present invention has the advantages that computer operation stability can be improved.
Description
Technical field
The present invention relates to a kind of computer, especially a kind of computer motherboard cooling mechanism.
Background technology
Computer is commonly called as computer, is a kind of modern electronic computer device for supercomputing, can carry out numerical computations,
Logical calculated can be carried out again, also have the function of store-memory.
Computer is made of hardware system and software systems, and the computer for being fitted without any software is known as bare machine.It can
It is divided into supercomputer, industrial control computer, network computer, personal computer, five class of embedded computer, it is more advanced
Computer has biocomputer, photonic computer, quantum computer etc..
In existing computer, CPU is mounted on mainboard.CPU can give out larger heat at work,
A portion heat is taken away by fan, and another part heat, which can be transmitted on mainboard, to radiate.But in existing computer
In, it is not provided with the structure to radiate for mainboard, not only influences the mainboard service life in this way, but also to the job stability of computer
It will also result in certain influence.
Invention content
The purpose of the present invention is there is the above problem in view of the prior art, it is proposed that a kind of computer motherboard heat dissipation machine
The technical issues of structure, solution is how to improve computer operation stability.
Object of the invention can be realized by the following technical scheme：A kind of computer motherboard cooling mechanism, computer packet
Cabinet is included, this cooling mechanism includes the aluminium sheet being vertically arranged in cabinet, and the length of aluminium sheet vertically extends, and aluminium sheet
Surrounding is equipped with the mounting hole for installing mainboard, which is characterized in that the aluminium sheet runs through along the width direction of the aluminium sheet to be opened
Equipped with heat emission hole, heat emission hole has multiple and length directions along aluminium sheet uniformly distributed, also horizontally disposed in the cabinet to have exhaust pipe,
Hole number is identical and face, the inner end of exhaust pipe are connected to corresponding heat emission hole one by one for position for exhaust pipe and heat dissipation, exhaust pipe
Cabinet is stretched out in outer end, and cabinet and aluminium sheet are connected with exhaust pipe；It is cased with heat-dissipating cylinder outside the outer end of exhaust pipe described in every,
The internal diameter of heat-dissipating cylinder is more than the outer diameter of exhaust pipe, has on the madial wall of the one end of the heat-dissipating cylinder far from cabinet annular in shape convex
The sealing gone out, sealing is sleeved on outside exhaust pipe and the two sealing is connected, the other end of the heat-dissipating cylinder and the outer wall of cabinet
It closely offsets, forms the heat dissipation cavity in closed, and adjacent two heat dissipation cavity between heat-dissipating cylinder, cabinet, exhaust pipe, sealing
By the gas-guide tube connection being installed between adjacent two heat-dissipating cylinder, air inlet pipe, air inlet pipe are also vertically fixed outside the cabinet
Upper end in radiator fan is installed；In all heat dissipation cavities, the heat dissipation cavity in the top is connected to the lower end of air inlet pipe, is located
It is equipped with the gas vent for making the heat dissipation cavity be in communication with the outside, the exhaust pipe, heat-dissipating cylinder in the cavity wall of the heat dissipation cavity of bottom
It is made from a material that be thermally conductive with gas-guide tube.
In use, the heat on mainboard is shifted by exhaust pipe external environment；Radiator fan work generates cold air, cold air
It is entered in the heat dissipation cavity in the top by air inlet pipe, then under the cooperation of gas-guide tube followed by each heat dissipation cavity and most
It is discharged eventually by gas vent, quickly to take away the heat on each exhaust pipe.
In mechanism, mainboard is in direct contact by exhaust pipe and external environment, and in radiator fan, air inlet
The heat on exhaust pipe is dispersed quickly and actively under the cooperation of the components such as pipe, heat-dissipating cylinder, to effectively add the heat dissipation of block mainboard
Speed, to improve the job stability of computer.
In above-mentioned computer motherboard cooling mechanism, all had in ring on the inner end lateral wall of the exhaust pipe described in every
The rib of shape protrusion, and the madial wall tight abutment of rib and cabinet.At this point, the side wall of cabinet be clamped in rib and heat-dissipating cylinder it
Between, in this way in actual assembled, the positioning of heat-dissipating cylinder and exhaust pipe can be carried out at the same time and be completed at the same time, to effectively reduce assembling work
Sequence makes the assembling of this cooling mechanism become relatively simple, conveniently.
In above-mentioned computer motherboard cooling mechanism, offers and dissipate on the end face that the heat-dissipating cylinder offsets with cabinet
The coaxial annular groove of hot cylinder, is equipped with Gask-O-Seal in the annular groove, and the both ends of the surface of Gask-O-Seal respectively with
The bottom wall of annular groove and the lateral wall of cabinet offset.Under the action of Gask-O-Seal, make to be formed between heat-dissipating cylinder and cabinet
Reliable sealing, makes heat dissipation cavity stablize to be formed, to improve the job stability of mechanism.
In above-mentioned computer motherboard cooling mechanism, sealing in a ring is offered on the lateral wall of the exhaust pipe
Slot, seal groove is interior to be equipped with sealing ring, and the lateral wall of sealing ring and the madial wall of sealing offset.Under the action of sealing ring,
Make to form reliable sealing between exhaust pipe and heat-dissipating cylinder, to further increase the stability of heat dissipation cavity formation, to improve mechanism
Job stability.
In above-mentioned computer motherboard cooling mechanism, L-shaped escape pipe, and every row are additionally provided with outside the cabinet
Tracheae is cased with above-mentioned escape pipe outside one end far from cabinet, escape pipe is connected with exhaust pipe by helicitic texture, and outlet
The port of the one end of pipe far from exhaust pipe is arranged downward.Under the action of escape pipe, the outgassing direction of exhaust pipe is changed to downwards
Outlet is entered with effectively reducing the impurity such as dust in exhaust pipe, to improve the job stability of mechanism.
In above-mentioned computer motherboard cooling mechanism, runs through on the hole wall of each heat emission hole and offer and arrange
The matched through-hole of tracheae, through-hole is identical with exhaust pipe quantity and position face one by one, the inner end of every exhaust pipe insert embedded in pair
In the through-hole answered, and exhaust pipe and aluminium sheet are fixedly connected with by welding.Using above-mentioned design, there is simple in structure, group
Fill convenient advantage.
In above-mentioned computer motherboard cooling mechanism, on the side wall of the heat-dissipating cylinder in the top through offer with into
The lower end of the threaded hole of tracheae face, the air inlet pipe passes through threaded hole and in heat-dissipating cylinder, and air inlet pipe and threaded hole
Bolt.
Compared with prior art, this computer motherboard cooling mechanism has the following advantages：
1, mainboard is in direct contact by exhaust pipe and external environment, and in radiator fan, air inlet pipe, heat-dissipating cylinder etc.
The heat on exhaust pipe is dispersed quickly and actively under the cooperation of component, to effectively add the radiating rate of block mainboard, to improve
The job stability of computer.
2, the side wall of cabinet is clamped between rib and heat-dissipating cylinder, in this way in actual assembled, heat-dissipating cylinder and exhaust pipe
Positioning can be carried out at the same time and be completed at the same time, to effectively reduce assembling procedure, so that the assembling of this cooling mechanism is become relatively simple, side
Just.
Description of the drawings
Fig. 1 is the structural schematic diagram of this computer motherboard cooling mechanism.
Fig. 2 is the enlarged structure schematic diagram at A in Fig. 1.
In figure, 1, cabinet；2, aluminium sheet；2a, heat emission hole；3, exhaust pipe；3a, rib；4, gas-guide tube；5, heat-dissipating cylinder；It is 5a, close
Envelope portion；5b, gas vent；6, radiator fan；7, air inlet pipe；8, escape pipe；9, Gask-O-Seal；10, sealing ring；11, heat dissipation cavity.
Specific implementation mode
Following is a specific embodiment of the present invention in conjunction with the accompanying drawings, technical scheme of the present invention will be further described,
However, the present invention is not limited to these examples.
As depicted in figs. 1 and 2, computer includes cabinet 1, and 1 inside of cabinet is cavity.This computer motherboard cooling mechanism
It is made of aluminium sheet 2, exhaust pipe 3, gas-guide tube 4, heat-dissipating cylinder 5, radiator fan 6, air inlet pipe 7, escape pipe 8 etc..Wherein, exhaust pipe 3,
Gas-guide tube 4, heat-dissipating cylinder 5 and escape pipe 8 are made from a material that be thermally conductive, and Heat Conduction Material can be aluminium alloy or brass.
Specifically, aluminium sheet 2 is in tabular, and the surrounding of aluminium sheet 2 is equipped with the mounting hole for installing mainboard.Such as Fig. 1
Shown, aluminium sheet 2 is arranged vertically in cabinet 1, and the length of aluminium sheet 2 vertically extends.Aluminium sheet 2 is along the aluminium sheet 2
Width direction through heat emission hole 2a is offered, heat emission hole 2a has multiple and uniformly distributed along the length direction of aluminium sheet 2.Water in cabinet 1
The flat exhaust pipe 3 being provided in straight tube-like, exhaust pipe 3 is identical with heat emission hole 2a quantity and position face one by one.Exhaust pipe 3 it is interior
End is connected to corresponding heat emission hole 2a, and cabinet 1 is stretched out in the outer end of exhaust pipe 3, and cabinet 1 and aluminium sheet 2 are connected with exhaust pipe 3.
Wherein, the connection type of exhaust pipe 3 and aluminium sheet 2 is as follows：Run through on the hole wall of each heat emission hole 2a offer with
3 matched through-hole of exhaust pipe, through-hole is identical with 3 quantity of exhaust pipe and position face one by one, and the inner end of every exhaust pipe 3 is inserted embedding
In corresponding through-hole, and exhaust pipe 3 and aluminium sheet 2 are fixedly connected with by welding.It is preferred that exhaust pipe 3 is connected to heat emission hole 2a
Middle part.
The connection type of exhaust pipe 3 and cabinet 1 is as follows：It is cased with heat-dissipating cylinder 5 outside the outer end of every exhaust pipe 3, and radiates
The internal diameter of cylinder 5 is more than the outer diameter of exhaust pipe 3.It is close with annularly protruding on the madial wall of the one end of heat-dissipating cylinder 5 far from cabinet 1
Envelope portion 5a, sealing 5a and heat-dissipating cylinder 5 are an integral structure, and sealing 5a is sleeved on outside exhaust pipe 3 and the two sealing is connected.Heat dissipation
The outer wall of the other end and cabinet 1 of cylinder 5 closely offsets, and all has on the inner end lateral wall of every exhaust pipe 3 and annularly protrudes
Rib 3a, rib 3a and exhaust pipe 3 are coaxially disposed and the two is an integral structure.The madial wall of rib 3a and cabinet 1 closely supports
It leans on, at this point, 1 side wall of cabinet is clamped between rib 3a and heat-dissipating cylinder 5, realizes that exhaust pipe 3 and cabinet 1 are stably connected with.
It further illustrates, as shown in Fig. 2, being offered on the end face that heat-dissipating cylinder 5 offsets with cabinet 1 coaxial with heat-dissipating cylinder 5
Annular groove, is equipped with Gask-O-Seal 9 in annular groove, and the both ends of the surface of Gask-O-Seal 9 respectively with the bottom wall of annular groove
It offsets with the lateral wall of cabinet 1；Seal groove in a ring is offered on the lateral wall of exhaust pipe 3, and sealing ring is equipped in seal groove
10, and the lateral wall of sealing ring 10 and the madial wall of sealing 5a offset.
As depicted in figs. 1 and 2, dissipating in closed is formed between heat-dissipating cylinder 5, cabinet 1, exhaust pipe 3, sealing 5a
Hot chamber 11.Adjacent two heat dissipation cavity 11 is connected to by the gas-guide tube 4 between being installed in adjacent two heat-dissipating cylinder 5, also vertical solid outside cabinet 1
Surely there is air inlet pipe 7, radiator fan 6 is installed in the upper end of air inlet pipe 7.In all heat dissipation cavities 11, it is in the heat dissipation of the top
Chamber 11 is connected to the lower end of air inlet pipe 7, and the cavity wall of the heat dissipation cavity 11 in bottom, which is equipped with, makes the heat dissipation cavity 11 connect with extraneous
Logical gas vent 5b.
Wherein, the connection type of air inlet pipe 7 and heat dissipation cavity 11 is as follows：Run through on the side wall of heat-dissipating cylinder 5 in the top
The threaded hole with 7 face of air inlet pipe is offered, the lower end of air inlet pipe 7 passes through threaded hole and in heat-dissipating cylinder 5, and air inlet pipe 7
With threaded hole bolt.
The connection type of gas-guide tube 4 and heat-dissipating cylinder 5 is as follows：Run through to offer on the side wall of heat-dissipating cylinder 5 and be matched with gas-guide tube 4
Connecting hole, the end of gas-guide tube 4 is inserted in connecting hole, and gas-guide tube 4 is connected by welding manner and heat-dissipating cylinder 5.
As shown in Figure 1, it is additionally provided with L-shaped escape pipe 8 outside cabinet 1, and outside the every one end of exhaust pipe 3 far from cabinet 1
It is cased with escape pipe 8, escape pipe 8 is connected with exhaust pipe 3 by helicitic texture, and the end of the one end of escape pipe 8 far from exhaust pipe 3
Mouth down is arranged.
In use, the heat on mainboard is shifted by 3 external environment of exhaust pipe；The work of radiator fan 6 generates cold air, cold
Gas is entered by air inlet pipe 7 in the heat dissipation cavity 11 in the top, then followed by each heat dissipation under the cooperation of gas-guide tube 4
Chamber 11 is simultaneously finally discharged by gas vent 5b, quickly to take away the heat on each exhaust pipe 3.
Specific embodiment described herein is only an example for the spirit of the invention.Technology belonging to the present invention is led
The technical staff in domain can make various modifications or additions to the described embodiments or replace by a similar method
In generation, however, it does not deviate from the spirit of the invention or beyond the scope of the appended claims.
Claims (7)
1. a kind of computer motherboard cooling mechanism, computer includes cabinet, this cooling mechanism includes being vertically arranged in cabinet
The length of aluminium sheet, aluminium sheet vertically extends, and the surrounding of aluminium sheet is equipped with the mounting hole for installing mainboard, and feature exists
In, the aluminium sheet along the aluminium sheet width direction through offering heat emission hole, heat emission hole has multiple and along the length side of aluminium sheet
Also horizontally disposed in the cabinet to have an exhaust pipe to uniformly distributed, exhaust pipe and heat dissipation hole number is identical and position face one by one is arranged
The inner end of tracheae is connected to corresponding heat emission hole, and cabinet is stretched out in the outer end of exhaust pipe, and cabinet and aluminium sheet are connected with exhaust pipe；
Heat-dissipating cylinder is cased with outside the outer end of exhaust pipe described in every, the internal diameter of heat-dissipating cylinder is more than the outer diameter of exhaust pipe, the heat dissipation
There is the sealing annularly protruded, sealing is sleeved on outside exhaust pipe and the two seals on the madial wall of the one end of cylinder far from cabinet
Be connected, the other end of the heat-dissipating cylinder and the outer wall of cabinet closely offset, heat-dissipating cylinder, cabinet, exhaust pipe, sealing it
Between form the heat dissipation cavity in closed, and adjacent two heat dissipation cavity is connected to by gas-guide tube between being installed in adjacent two heat-dissipating cylinder,
It is also vertically fixed air inlet pipe outside the cabinet, radiator fan is installed in the upper end of air inlet pipe；In all heat dissipation cavities, place
Be connected to the lower end of air inlet pipe in the heat dissipation cavity of the top, the cavity wall of the heat dissipation cavity in bottom be equipped with make the heat dissipation cavity with
The gas vent of external world's connection, the exhaust pipe, heat-dissipating cylinder and gas-guide tube are made from a material that be thermally conductive.
2. computer motherboard cooling mechanism according to claim 1, which is characterized in that the inner end of the exhaust pipe described in every
The rib annularly protruded, and the madial wall tight abutment of rib and cabinet are all had on lateral wall.
3. computer motherboard cooling mechanism according to claim 1, which is characterized in that the heat-dissipating cylinder offsets with cabinet
End face on offer the annular groove coaxial with heat-dissipating cylinder, Gask-O-Seal is equipped in the annular groove, and annular is close
Lateral wall of the both ends of the surface of packing respectively with the bottom wall of annular groove and cabinet offsets.
4. computer motherboard cooling mechanism according to claim 3, which is characterized in that on the lateral wall of the exhaust pipe
Seal groove in a ring is offered, is equipped with sealing ring in seal groove, and the lateral wall of sealing ring and the madial wall of sealing offset.
5. computer motherboard cooling mechanism according to claim 1, which is characterized in that be additionally provided in L outside the cabinet
The escape pipe of shape, and above-mentioned escape pipe is cased with outside the one end of every exhaust pipe far from cabinet, escape pipe and exhaust pipe pass through
Helicitic texture is connected, and the port of the one end of escape pipe far from exhaust pipe is arranged downward.
6. computer motherboard cooling mechanism according to claim 1, which is characterized in that the hole wall of each heat emission hole
On run through offer with the matched through-hole of exhaust pipe, through-hole is identical with exhaust pipe quantity and position face one by one, every exhaust
The inner end of pipe is inserted in corresponding through-hole, and exhaust pipe and aluminium sheet are fixedly connected with by welding.
7. computer motherboard cooling mechanism according to claim 1, which is characterized in that the side of the heat-dissipating cylinder in the top
It passes through threaded hole through the threaded hole offered with air inlet pipe face, the lower end of the air inlet pipe on wall and is in heat-dissipating cylinder
It is interior, and air inlet pipe and threaded hole bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810315539.4A CN108459692B (en) | 2018-04-10 | 2018-04-10 | Computer motherboard heat dissipation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810315539.4A CN108459692B (en) | 2018-04-10 | 2018-04-10 | Computer motherboard heat dissipation mechanism |
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| CN108459692A true CN108459692A (en) | 2018-08-28 |
| CN108459692B CN108459692B (en) | 2020-02-04 |
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ID=63234456
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810315539.4A Active CN108459692B (en) | 2018-04-10 | 2018-04-10 | Computer motherboard heat dissipation mechanism |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109286734A (en) * | 2018-12-08 | 2019-01-29 | 大连国晨科技有限公司 | A kind of novel mixing audio and video matrix equipment and heat dissipating method |
| CN110430298A (en) * | 2019-08-23 | 2019-11-08 | 河南省酷美智能科技有限公司 | Anti-static cell phone mainboard with radiator structure |
| CN114813996A (en) * | 2022-03-23 | 2022-07-29 | 广东德立科技发展有限公司 | Gas chromatography-single quadrupole mass spectrometer and control method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109286734A (en) * | 2018-12-08 | 2019-01-29 | 大连国晨科技有限公司 | A kind of novel mixing audio and video matrix equipment and heat dissipating method |
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| CN114813996A (en) * | 2022-03-23 | 2022-07-29 | 广东德立科技发展有限公司 | Gas chromatography-single quadrupole mass spectrometer and control method thereof |
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|---|---|
| CN108459692B (en) | 2020-02-04 |
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