CN218675964U - Heat abstractor and industrial computer - Google Patents
Heat abstractor and industrial computer Download PDFInfo
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- CN218675964U CN218675964U CN202222900884.9U CN202222900884U CN218675964U CN 218675964 U CN218675964 U CN 218675964U CN 202222900884 U CN202222900884 U CN 202222900884U CN 218675964 U CN218675964 U CN 218675964U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The application relates to the technical field of heat dissipation of control machines, in particular to a heat dissipation device and an industrial personal computer. A heat dissipation device is used for dissipating heat of an industrial personal computer, and the industrial personal computer is provided with a shell; the heat dissipation device comprises a water-cooling heat dissipation component and an air-cooling heat dissipation component which are arranged in the shell; the water-cooling radiating assembly comprises a substrate and a water supply component; a water cooling channel is formed in the substrate, and the water supply component is communicated with the water cooling channel and can supply water to the water cooling channel; the heat dissipation assembly comprises a heat dissipation plate and a ventilation component; the heating panel has a plurality ofly, and is formed with air-cooled passageway between a plurality of heating panels, and ventilation member can supply air or convulsions in air-cooled passageway. The industrial personal computer is cooled by the water-cooling radiating assembly and the air-cooling radiating assembly, and compared with a radiating mode of only adopting a direct current fan to be matched with a radiator, the radiating effect is better, and the requirement of the industrial personal computer can be met.
Description
Technical Field
The application relates to the technical field of heat dissipation of control machines, in particular to a heat dissipation device and an industrial personal computer.
Background
Industrial Personal Computer (IPC), is a general name for tools that use a bus structure to detect and control production processes, electromechanical devices, and process equipment. In addition, the industrial personal computer has important computer attributes and characteristics, such as a computer CPU, a hard disk, a memory, peripherals and interfaces, an operating system, a control network and protocol, computing capability and a friendly human-computer interface.
For an industrial personal computer, the problem of heat dissipation is one of the reasons for influencing the service life of the industrial personal computer, the industrial personal computer is cooled by adopting a direct current fan and a radiator to directly dissipate heat, however, the heat dissipation effect of the heat dissipation method is not ideal.
Therefore, a heat dissipation device and an industrial personal computer are needed to solve the technical problems in the prior art to a certain extent.
SUMMERY OF THE UTILITY MODEL
The application aims to provide a heat dissipation device and an industrial personal computer, and the technical problem that the heat dissipation effect of the existing industrial personal computer is not ideal is solved to a certain extent.
The application provides a heat dissipation device for dissipating heat of an industrial personal computer, wherein the industrial personal computer is provided with a shell; the heat dissipation device comprises a water-cooling heat dissipation component and an air-cooling heat dissipation component which are arranged in the shell;
the water-cooling heat dissipation assembly comprises a substrate and a water supply component; a water-cooling channel is formed in the substrate, and the water supply component is communicated with the water-cooling channel and can supply water to the water-cooling channel;
the heat dissipation assembly comprises a heat dissipation plate and a ventilation component; the heating panel has a plurality ofly, and is a plurality of it is formed with air-cooled passageway to be a plurality of between the heating panel, ventilation member can supply air or convulsions in air-cooled passageway.
In the above technical solution, further, the water cooling channel is serpentine in an S shape.
In the above technical solution, further, the water cooling channel is meandering in an annular shape.
In the above technical solution, further, the water supply member includes a water inlet pipe, a water outlet pipe, a first water tank, a second water tank, and a pump body;
one end of the water inlet pipe is communicated with the water cooling channel, and the other end of the water inlet pipe is communicated with the first water tank;
the pump body is arranged on the water inlet pipe and used for controlling whether the first water tank supplies water to the water cooling channel through the water inlet pipe or not;
one end of the water outlet pipe is communicated with the water cooling channel, the other end of the water outlet pipe is communicated with the second water tank, and the second water tank is used for recovering water passing through the water cooling channel through the water outlet pipe.
In the above technical scheme, further, the water supply member further includes a main water pipe, the main water pipe is disposed in the water cooling channel, and one end of the main water pipe is communicated with the water inlet pipe and the other end of the main water pipe is communicated with the water outlet pipe.
In the above technical solution, further, the water supply member further includes a flow control valve and a flow meter;
the flow control valve and the flow meter are respectively arranged on the water inlet pipe and the water outlet pipe.
In the above technical solution, further, the heat dissipation plates extend along the first direction and are arranged at intervals along the second direction.
In the above technical solution, further, the ventilation member includes a heat radiation fan;
the shell is provided with a vent hole corresponding to the air cooling channel;
the heat dissipation fan is arranged on the shell and corresponds to the vent hole;
the cooling fan supplies air or draws air to the air cooling channel through the vent hole.
In the above technical solution, further, the substrate, the heat dissipation plate, and the housing are integrally formed.
The application also provides an industrial personal computer which comprises the heat dissipation device;
the base plate divides the shell into a mounting cavity and an air cooling cavity;
the mounting cavity is used for mounting an electronic component;
the air cooling cavity is used for installing the water cooling heat dissipation assembly and the air cooling heat dissipation assembly.
Compared with the prior art, the beneficial effects of this application do:
the application provides a heat dissipation device for dissipating heat of an industrial personal computer, wherein the industrial personal computer is provided with a shell; the heat dissipation device comprises a water-cooling heat dissipation component and an air-cooling heat dissipation component which are arranged in the shell;
the water-cooling heat dissipation assembly comprises a substrate and a water supply component; a water-cooling channel is formed in the substrate, and the water supply component is communicated with the water-cooling channel and can supply water to the water-cooling channel;
the heat dissipation assembly comprises a heat dissipation plate and a ventilation component; the heating panel has a plurality ofly, and is a plurality of be formed with air-cooled passageway between the heating panel, ventilation member can supply air or convulsions in air-cooled passageway.
Specifically, water-cooling radiating component and air-cooling radiating component dispel the heat to the industrial computer simultaneously, compare in the radiating mode that only adopts direct current fan cooperation radiator, and the radiating effect is better, can satisfy the demand of industrial computer.
The application also provides an industrial personal computer, which comprises a heat dissipation device; the base plate divides the shell into a mounting cavity and an air cooling cavity; the mounting cavity is used for mounting an electronic component; the air cooling cavity is used for installing the water cooling heat dissipation assembly and the air cooling heat dissipation assembly. The water-cooling radiating assembly and the air-cooling radiating assembly are simultaneously used for radiating the electronic elements in the mounting cavity, so that the radiating effect is better; in addition, the air-cooled heat dissipation assembly does not directly act on the electronic element, but circulates the air on one side of the electronic element, so that the heat dissipation of the electronic element is realized; that is, in the process of dissipating heat through the air-cooled heat dissipation assembly, the electronic component has a dustproof effect (compared with the case where the fan directly acts on the electronic component, in the process of dissipating heat through wind, dust in air is blown onto the electronic component, and dust is hung on the surface of the electronic component).
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present disclosure;
fig. 2 is a top view of a substrate in a heat dissipation device according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a heat dissipation device according to a second embodiment of the present application;
fig. 4 is a top view of a substrate in a heat dissipation device according to a third embodiment of the present application;
fig. 5 is a schematic diagram of an external structure of an industrial personal computer provided in the fourth embodiment of the present application;
fig. 6 is an internal structure schematic diagram of an industrial personal computer provided in the fourth embodiment of the present application.
Reference numerals:
100-a housing; 103-a substrate; 106-heat sink plate; 108-air cooling channel; 109-a water inlet pipe; 110-a water outlet pipe; 111-a first water tank; 112-a second water tank; 117-second direction; 118-a heat dissipation fan; 119-a vent hole; 120-a mounting cavity; 121-air cooling chamber; 122-main water pipe.
Detailed Description
The following detailed description is provided to assist the reader in obtaining a thorough understanding of the methods, devices, and/or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and/or systems described herein will be apparent to those skilled in the art in view of the disclosure of the present application. For example, the order of operations described herein is merely an example, which is not limited to the order set forth herein, but rather, variations may be made in addition to operations which must occur in a particular order, which will be apparent upon understanding the disclosure of the present application. Moreover, descriptions of features known in the art may be omitted for the sake of clarity and conciseness.
The features described herein may be embodied in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many possible ways to implement the methods, devices, and/or systems described herein that will be apparent after understanding the disclosure of the present application.
Throughout the specification, when an element (such as a layer, region, or substrate 103) is described as being "on," "connected to," coupled to, "over," or "overlying" another element, it may be directly "on," "connected to," coupled to, "over," or "overlying" the other element, or one or more other elements may be present therebetween. In contrast, when an element is referred to as being "directly on," "directly connected to," directly coupled to, "directly over" or "directly overlying" another element, there may be no intervening elements present.
As used herein, the term "and/or" includes any one of the associated listed items and any combination of any two or more of the items.
Although terms such as "first", "second", and "third" may be used herein to describe various elements, devices, regions, layers or sections, these elements, devices, regions, layers or sections should not be limited by these terms. Rather, these terms are only used to distinguish one element, device, region, layer or section from another element, device, region, layer or section. Thus, a first element, device, region, layer or section discussed in the examples described herein could be termed a second element, device, region, layer or section without departing from the teachings of the examples.
For ease of description, spatial relationship terms such as "above … …", "upper", "below … …" and "lower" may be used herein to describe the relationship of one element to another element as shown in the figures. Such spatial relationship terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "upper" relative to other elements would then be oriented "below" or "lower" relative to the other elements. Thus, the term "above … …" includes both orientations "above … …" and "below … …" depending on the spatial orientation of the device. The device may also be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative terms used herein should be interpreted accordingly.
The terminology used herein is for the purpose of describing various examples only and is not intended to be limiting of the disclosure. The singular forms also are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," and "having" specify the presence of stated features, quantities, operations, elements, components, and/or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and/or combinations thereof.
Variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, may be expected. Thus, the examples described herein are not limited to the particular shapes shown in the drawings, but include changes in shape that occur during manufacturing.
The features of the examples described herein may be combined in various ways that will be apparent after understanding the disclosure of this application. Further, while the examples described herein have a variety of configurations, other configurations are possible, as will be apparent after understanding the disclosure of the present application.
Example one
Referring to fig. 1, the present application provides a heat dissipation apparatus for dissipating heat from an industrial personal computer (the industrial personal computer has a housing 100); the heat dissipation device comprises a water cooling heat dissipation component and an air cooling heat dissipation component which are arranged in the shell 100; the industrial personal computer is cooled by the water-cooling radiating assembly and the air-cooling radiating assembly, and compared with a radiating mode of only adopting a direct current fan to be matched with a radiator, the radiating effect is better, and the requirement of the industrial personal computer can be met.
In this embodiment, the water-cooled heat dissipating assembly includes a base plate 103 and a water supply member; a water-cooling channel is formed in the base plate 103, and the water supply member is communicated with the water-cooling channel and can supply water to the water-cooling channel; in the actual heat dissipation process: the water supply component continuously supplies water to the water cooling channel, and the heat conduction principle is adopted, namely the heat (heat energy) generated by outward diffusion of the heat generated by the main board in the industrial personal computer is finally absorbed by the water in the substrate 103, so that the heat dissipation effect is achieved.
Specifically, as shown in fig. 2, the water-cooling channel is serpentine in an S shape, so that the water-cooling channel can cover the substrate 103 as much as possible, thereby improving the heat dissipation effect of the substrate 103.
Specifically, the water supply member includes a water inlet pipe 109, a water outlet pipe 110, a first water tank 111, a second water tank 112, and a pump body; one end of the water inlet pipe 109 is communicated with the water cooling channel and the other end is communicated with the first water tank 111; the pump body is arranged on the water inlet pipe 109 and is used for controlling whether the first water tank 111 supplies water to the water cooling channel through the water inlet pipe 109 or not; one end of the water outlet pipe 110 is communicated with the water cooling passage and the other end is communicated with the second water tank 112, and the second water tank 112 recovers water passing through the water cooling passage through the water outlet pipe 110.
More specifically, considering that the water cooling channel is directly formed inside the substrate 103, the industrial personal computer is electrically leaked in order to prevent water from leaking out through the substrate 103; the water supply member further includes a main water pipe 122, the main water pipe 122 is disposed in the water cooling channel, and one end of the main water pipe 122 is communicated with the water inlet pipe 109 and the other end is communicated with the water outlet pipe 110.
In conclusion, through set up main water pipe 122 in the water-cooling passageway, the both ends of main water pipe 122 communicate with inlet tube 109 and outlet pipe 110 again, have guaranteed water-cooling radiating component's leakproofness, prevent that water from revealing away through base plate 103, guarantee the safety of industrial computer.
More specifically, in order to be able to control the inflow and outflow flow rates, the water supply means further comprises a flow control valve and a flow meter; a control valve and a flowmeter are arranged on the water inlet pipe 109, and a control valve and a flowmeter are also arranged on the water outlet pipe 110; the flow meter on the water inlet pipe 109 is used for detecting the water inlet flow rate on the water inlet pipe 109, and once the water inlet flow rate is not within the range of the set value, the control valve of the water inlet pipe 109 is adjusted in time; similarly, once the water outlet flow rate is not within the set range value, the control valve on the water outlet pipe 110 is adjusted in time.
In conclusion, the cooperation of the flow meter and the control valve can conveniently monitor the water inlet flow rate and the water outlet flow rate.
In this embodiment, the heat dissipation assembly includes a heat dissipation plate 106 and a ventilation member; the plurality of heat dissipation plates 106 are provided, and an air cooling channel 108 is formed between the plurality of heat dissipation plates 106, and the ventilation member blows or draws air inside the casing 100 through the air cooling channel 108; namely, the heat generated by the industrial personal computer is blown from the inside of the housing 100 of the industrial personal computer to the outside of the housing 100 through the air cooling channel 108 by using the ventilation member, thereby realizing the heat dissipation of the industrial personal computer.
In this embodiment, as shown in fig. 2, the heat dissipation plates 106 extend in the first direction and are arranged at intervals in the second direction 117. The first direction here means a direction parallel to the flow direction of the cooling wind, and the second direction 117 means a direction perpendicular to the flow direction of the cooling wind.
The specific heat dissipation process of the arrangement mode of the heat dissipation plate is as follows: the air-cooled channel 108 close to the electronic component (for the position of the electronic component, described in the fourth embodiment, refer to the fourth embodiment) serves as a main heat dissipation air-cooled channel to perform a main heat dissipation function; the remaining air-cooled channels 108 have a secondary heat dissipation effect (the heat generated by the electronic components is sequentially conducted to the air-cooled channels 108 arranged in a direction perpendicular to the flowing direction of the cooling air by means of heat conduction, and the heat cast is gradually decreased), in other words, the air-cooled channels 108 near the electronic components have the most heat and the air-cooled channels 108 far away from the electronic components have the least heat; then the air-cooled channels 108 near the electronic components can serve the primary heat sink function when the heat sink fan 118 is operating.
Specifically, the ventilation member includes a heat radiation fan 118; the side wall of the casing 100 is provided with a vent hole 119 corresponding to the air cooling channel 108; the heat dissipation fan 118 is disposed on the housing 100 and corresponds to the vent hole 119; the cooling fan 118 blows air or drafts air in the air cooling channel 108 through the vent hole 119, namely, heat in the air cooling channel 108 is blown to the outside of the shell 100 from the inside of the shell 100, and therefore heat dissipation of the industrial personal computer is achieved.
Specifically, the substrate, the heat dissipation plate, and the housing are integrally molded, thereby ensuring stability in fixing the substrate 103 and the heat dissipation plate 106 to the housing 100.
Example two
The second embodiment is an improvement on the basis of the first embodiment, the technical contents disclosed in the first embodiment are not described repeatedly, and the contents disclosed in the second embodiment also belong to the contents disclosed in the first embodiment.
As shown in fig. 3, in this embodiment, the heat dissipation plates 106 extend in a direction perpendicular to the flow direction of the cooling air, and the heat dissipation plates 106 are arranged at intervals in the thickness direction of the housing.
Specifically, the heat generated by the electronic component can be uniformly conducted to the air-cooled channels 108 through the substrate, in other words, each air-cooled channel 108 has hot air with the same heat; when the heat dissipation fan 118 is used for dissipating heat through the vent holes 119 and the air cooling channels 108, it is ensured that the hot air of all the air cooling channels 108 can be blown to the outside of the housing at the same time, and the heat dissipation efficiency is further improved.
EXAMPLE III
The third embodiment is an improvement on the third embodiment, technical contents disclosed in the third embodiment are not described repeatedly, and the contents disclosed in the third embodiment also belong to the contents disclosed in the third embodiment.
Specifically, as shown in fig. 4, the water-cooling channel extends in an annular shape, so as to ensure that the water-cooling channel can cover the substrate 103 as much as possible, thereby improving the heat dissipation effect of the substrate 103.
Example four
The fourth embodiment is an improvement on the basis of the fourth embodiment, the technical contents disclosed in the fourth embodiment are not described repeatedly, and the contents disclosed in the fourth embodiment also belong to the contents disclosed in the fourth embodiment.
With reference to fig. 5 and 6, in this embodiment, an industrial personal computer is provided, including the heat dissipation device in the above embodiment; the base plate 103 divides the case 100 into a mounting chamber 120 and an air-cooling chamber 121; the mounting cavity 120 is used for mounting electronic components; the air cooling cavity 121 is used for installing a water cooling heat dissipation assembly and an air cooling heat dissipation assembly. The water-cooling radiating component and the air-cooling radiating component are simultaneously used for radiating the electronic elements in the mounting cavity 120, so that the radiating effect is better; in addition, the air-cooled heat dissipation assembly does not directly act on the electronic element, but circulates the air on one side of the electronic element, so that the heat dissipation of the electronic element is realized; that is, in the process of dissipating heat through the air-cooled heat dissipation assembly, the electronic component has a dustproof effect (compared with the case where the fan directly acts on the electronic component, in the process of dissipating heat through wind, dust in air is blown onto the electronic component, and dust is hung on the surface of the electronic component).
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. A heat dissipation device is used for dissipating heat of an industrial personal computer, and the industrial personal computer is provided with a shell; the heat dissipation device is characterized by comprising a water-cooling heat dissipation component and an air-cooling heat dissipation component which are arranged in the shell;
the water-cooling heat dissipation assembly comprises a substrate and a water supply component; a water-cooling channel is formed in the substrate, and the water supply component is communicated with the water-cooling channel and can supply water to the water-cooling channel;
the heat dissipation assembly comprises a heat dissipation plate and a ventilation component; the heating panel has a plurality ofly, and is a plurality of be formed with air-cooled passageway between the heating panel, ventilation member can supply air or convulsions in air-cooled passageway.
2. The heat dissipating device of claim 1, wherein said water cooling channel is serpentine in an S-shape.
3. The heat dissipating device of claim 1, wherein said water cooling channel is serpentine in a ring shape.
4. The heat dissipating device of claim 1, wherein the water supply member comprises a water inlet pipe, a water outlet pipe, a first water tank, a second water tank, and a pump body;
one end of the water inlet pipe is communicated with the water cooling channel, and the other end of the water inlet pipe is communicated with the first water tank;
the pump body is arranged on the water inlet pipe and used for controlling whether the first water tank supplies water to the water cooling channel through the water inlet pipe or not;
one end of the water outlet pipe is communicated with the water cooling channel, the other end of the water outlet pipe is communicated with the second water tank, and the second water tank is used for recovering water passing through the water cooling channel through the water outlet pipe.
5. The heat dissipating device of claim 4, wherein the water supply member further comprises a main water pipe disposed in the water cooling passage and having one end communicating with the water inlet pipe and the other end communicating with the water outlet pipe.
6. The heat dissipating device of claim 4, wherein the water supply means further comprises a flow control valve and a flow meter;
the flow control valve and the flow meter are respectively arranged on the water inlet pipe and the water outlet pipe.
7. The heat dissipating device of claim 1, wherein the heat dissipating plates extend in a first direction and are spaced apart in a second direction.
8. The heat dissipating device of claim 1, wherein the ventilation member comprises a heat dissipating fan;
the shell is provided with a vent hole corresponding to the air cooling channel;
the heat dissipation fan is arranged on the shell and corresponds to the vent hole;
the cooling fan supplies air or draws air to the air cooling channel through the vent hole.
9. The heat dissipating device of claim 1, wherein the substrate, the heat dissipating plate, and the housing are integrally formed.
10. An industrial personal computer, characterized by comprising the heat dissipation device of any one of claims 1-9;
the base plate divides the shell into a mounting cavity and an air cooling cavity;
the mounting cavity is used for mounting an electronic component;
the air cooling cavity is used for installing the water cooling heat dissipation assembly and the air cooling heat dissipation assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222900884.9U CN218675964U (en) | 2022-10-31 | 2022-10-31 | Heat abstractor and industrial computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222900884.9U CN218675964U (en) | 2022-10-31 | 2022-10-31 | Heat abstractor and industrial computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218675964U true CN218675964U (en) | 2023-03-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202222900884.9U Active CN218675964U (en) | 2022-10-31 | 2022-10-31 | Heat abstractor and industrial computer |
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| CN (1) | CN218675964U (en) |
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