CN215815853U

CN215815853U - Discrete device and discrete device heat dissipation device

Info

Publication number: CN215815853U
Application number: CN202122379598.8U
Authority: CN
Inventors: 杨伟东
Original assignee: Hena Semiconductor Shenzhen Co ltd
Current assignee: Hena Semiconductor Shenzhen Co ltd
Priority date: 2021-09-29
Filing date: 2021-09-29
Publication date: 2022-02-11
Anticipated expiration: 2031-09-29

Abstract

The utility model discloses a discrete device and a discrete device heat dissipation device, which comprise a heat dissipation device and a discrete device, wherein the heat dissipation device comprises a heat dissipation shell and a heat conduction mechanism; the side surface of the discrete device is provided with radiating fins, the side surface of the discrete device is fixedly connected with pins, and one end of each pin penetrates through the radiating shell and is fixedly connected with the penetrating part of the radiating shell; the heat dissipation device comprises a heat dissipation shell, a fixing block and a heat conduction mechanism, wherein the heat dissipation shell is provided with heat dissipation through holes on the side face, opposite to the heat dissipation fins, of the heat dissipation shell, a gas flow guide channel is arranged below the fixing block, the heat conduction mechanism is arranged on the side face outside the heat dissipation shell, and the gas flow guide channel is communicated with the heat conduction mechanism inside the heat dissipation shell and outside the heat dissipation shell. The utility model transmits the heat at the bottom of the discrete device to the outside of the heat dissipation shell in time through the heat conduction mechanism, thereby improving the heat dissipation performance of the whole semiconductor discrete device.

Description

Discrete device and discrete device heat dissipation device

Technical Field

The utility model belongs to the field of semiconductor discrete devices, and particularly relates to a discrete device and a discrete device heat dissipation device.

Background

Discrete device is widely applied to consumer electronics, computers, peripheral equipment, network communication, automotive electronics, display screens and other fields, discrete device includes special device, sensor and sensitive device, the existing discrete semiconductor device can produce great heat when using, and in order to make the heat can in time dispel, can set up a heating panel on the bottom surface of plastic-sealed body usually, with this to distribute away the heat, but the heat radiating area of the existing heating panel is less, make the holistic heat dispersion of discrete semiconductor device lower, and only limit to and give off the heat of discrete semiconductor device bottom.

Disclosure of Invention

The utility model provides a discrete device and a discrete device heat dissipation device, aiming at the problems in the prior art.

In order to achieve the technical purpose, the technical scheme adopted by the utility model is as follows:

a discrete device and a discrete device heat dissipation device comprise a heat dissipation device and a discrete device, wherein the heat dissipation device comprises a heat dissipation shell and a heat conduction mechanism, the discrete device is arranged in the heat dissipation shell, a fixed block is arranged at the bottom in the heat dissipation shell, an insertion groove is formed in the fixed block, and the side surface of one side of the discrete device is clamped in the insertion groove; the side surface of the discrete device is provided with radiating fins, the side surface of the discrete device is fixedly connected with pins, and one end of each pin penetrates through the radiating shell and is fixedly connected with the penetrating part of the radiating shell; the heat dissipation device comprises a heat dissipation shell, a fixing block and a heat conduction mechanism, wherein the heat dissipation shell is provided with heat dissipation through holes on the side face, opposite to the heat dissipation fins, of the heat dissipation shell, a gas flow guide channel is arranged below the fixing block, the heat conduction mechanism is arranged on the side face outside the heat dissipation shell, and the gas flow guide channel is communicated with the heat conduction mechanism inside the heat dissipation shell and outside the heat dissipation shell.

The utility model has the use principle that when the discrete device operates, heat generated by the radiating fins is released in the radiating shell, partial heat is discharged through the radiating through holes which are arranged just opposite to the radiating fins, and then external air is led into the radiating shell through the air guide channel by the heat conduction mechanism, or the hot air of the radiating shell is accelerated to be discharged to the radiating through holes from bottom to top.

Further, heat conduction mechanism includes motor, drive structure, flabellum and mounting panel, the motor passes through the mounting panel to be fixed at the heat dissipation casing surface, and drive mechanism includes gear and transmission shaft, and motor output shaft and gear connection, gear pass through the transmission shaft and are connected with the flabellum, and the flabellum setting is in gaseous water conservancy diversion passageway space.

Further, a gas guide plate is further arranged between the fixing block and the gas guide channel, two ends of the gas guide plate are fixedly connected with the inner side wall of the radiating shell in an embedded mode, and a gas guide hole penetrating through the gas guide plate is formed in the gas guide plate.

Furthermore, the upper side face and the left side face of the discrete device are fixedly connected with radiating fins, the front side face of the discrete device is fixedly connected with pins, and the lower side face of the discrete device is clamped in the slot.

Furthermore, the right side of the heat dissipation shell is provided with an exhaust hole at a position corresponding to the right side of the gas guide channel.

Furthermore, a connecting block is arranged between the pins of the discrete devices, a separating sleeve is fixedly arranged inside the connecting block, and the separating sleeve is sleeved on the outer surface of the pins.

Compared with the prior art, the utility model has the following beneficial effects:

the heat at the bottom of the discrete device is conducted to the outside of the heat dissipation shell in time through the heat conduction mechanism, and the heat dissipation performance of the whole semiconductor discrete device is improved. Through the setting of fixed block and slot, promote discrete device and radiating shell's stability of connecting. The side of the radiating shell, which faces the radiating fins, is provided with radiating through holes, so that the radiating area and the radiating performance of the whole radiating shell are improved. The arrangement mode of the heat conduction mechanism for communicating the inside of the heat dissipation shell with the outside of the heat dissipation shell through the gas diversion channel helps to improve the air exchange speed inside and outside the heat dissipation shell.

Drawings

FIG. 1 is a schematic diagram of an overall structure of a discrete device and a discrete device heat dissipation apparatus according to the present invention;

FIG. 2 is a schematic structural diagram of a heat conducting mechanism of a discrete device and a heat dissipating apparatus of the discrete device according to the present invention;

fig. 3 is a cross-sectional view of a discrete device and a connector block of a discrete device heat sink of the present invention.

The notation in the figure is: 1-radiating shell, 2-heat conducting mechanism, 3-discrete device, 4-fixed block, 5-slot, 6-radiating fin, 7-pin, 8-radiating through hole, 9-gas guide channel, 21-motor, 22-transmission structure, 23-fan blade, 24-mounting plate, 10-gas guide plate, 11-gas guide hole, 12-exhaust hole, 13-connecting block and 14-separation sleeve.

Detailed Description

In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and drawings, which are not intended to limit the present invention.

As shown in fig. 1, a discrete device and a discrete device heat dissipation apparatus include a heat dissipation apparatus and a discrete device 3, the heat dissipation apparatus includes a heat dissipation housing 1 and a heat conduction mechanism 2, the discrete device 3 is disposed in the heat dissipation housing 1, a fixed block 4 is disposed at the bottom of the heat dissipation housing 1, a slot 5 is disposed in the fixed block 4, and a side surface of one side of the discrete device 3 is clamped in the slot 5; the side surface of the discrete device 3 is provided with a heat radiation fin 6, the side surface of the discrete device is fixedly connected with pins 7, and one end of each pin 7 penetrates through the heat radiation shell 1 and is fixedly connected with the penetrating part of the heat radiation shell 1; the heat dissipation device is characterized in that a heat dissipation through hole 8 is formed in the side face, opposite to the heat dissipation fins 6, of the heat dissipation shell 1, a gas flow guide channel 9 is arranged below the fixing block 4, the heat conduction mechanism 2 is arranged on the outer side face of the heat dissipation shell 1, and the gas flow guide channel 9 is communicated with the heat conduction mechanism 2 inside the heat dissipation shell 1 and outside the heat dissipation shell 1.

The using principle of the utility model is that when the discrete device 3 operates, the heat generated by the radiating fins 6 is released in the radiating shell 1, firstly, partial heat is discharged through the radiating through holes 8 which are arranged just opposite to the radiating fins 6, then, the external air is led into the radiating shell 1 through the air guide channel 9 by the heat conducting mechanism 2, or the hot air of the radiating shell 1 is accelerated to be discharged to the radiating through holes 8 from bottom to top.

As shown in fig. 2, the heat conducting mechanism 2 includes a motor 21, a transmission structure 22, fan blades 23 and a mounting plate 24, the motor 21 is fixed on the outer surface of the heat dissipating housing 1 through the mounting plate 24, the transmission mechanism includes a gear and a transmission shaft, an output shaft of the motor 21 is connected with the gear, the gear is connected with the fan blades 23 through the transmission shaft, and the fan blades 23 are disposed in the space of the gas guiding channel 9. Through the arrangement of the motor 21 and the fan blades 23, the exchange of the air inside and outside the heat dissipation shell 1 by the air guide channel 9 is accelerated.

A gas guide plate 10 is further arranged between the fixed block 4 and the gas guide channel 9, two ends of the gas guide plate 10 are fixedly connected with the inner side wall of the heat dissipation shell 1 in an embedded mode, and a gas guide hole 11 penetrating through the gas guide plate 10 is formed in the gas guide plate 10. Through the arrangement of the guide plate and the air guide holes 11, the cold air in the air guide channel 9 at the bottom of the heat dissipation shell 1 upwards extrudes the heat generated by the operation of the discrete device 3, and further the heat dissipation speed of the heat dissipation device of the discrete device 3 is improved.

The upper side and the left side of the discrete device 3 are fixedly connected with radiating fins 6, the front side of the discrete device 3 is fixedly connected with pins 7, and the lower side of the discrete device 3 is clamped in the slot 5. Discrete device 3 is vertical places the installation, and upside and left side set up heat radiation fin 6, and the downside is connected to be fixed in slot 5, and the right side sets up stitch 7, and the 3 every sides of make full use of discrete device improve discrete device 3 heat radiating area.

The top surface and the left side surface of the heat radiation shell 1 are provided with exhaust holes 12 corresponding to the positions of the heat radiation fins 6. The arrangement mode that the exhaust holes 12 are over against the fan blades 23 reduces the heat discharge path at the bottom of the heat dissipation shell 1 and accelerates the heat discharge speed of the heat dissipation fins 6.

As shown in fig. 3, a connecting block 13 is arranged between the pins 7 of the discrete device 3, a separating sleeve 14 is fixedly installed inside the connecting block 13, and the separating sleeve 14 is sleeved on the outer surface of the pin 7. The one end that separation sleeve 14 runs through stitch 7 sets up, and the quantity of stitch 7 is three, and corresponds the inside of separation sleeve 14 respectively and sets up, can prevent through increasing connecting block 13 and separation sleeve 14 in the department of being separated by of three stitch 7 that stitch 7 from appearing bending when installing this discrete device 3, can also avoid mutual contact between the stitch 7, guarantees discrete device 3's normal use.

the heat at the bottom of the discrete device 3 is timely conducted to the outside of the heat dissipation shell 1 through the heat conduction mechanism 2, so that the heat dissipation performance of the whole semiconductor discrete device 3 is improved. Through the setting of fixed block 4 and slot 5, promote discrete device 3 and the stability of heat dissipation casing 1 connection. The side surface of the heat dissipation shell 1, which faces the heat dissipation fins 6, is provided with heat dissipation through holes 8, so that the heat dissipation area and the heat dissipation performance of the whole heat dissipation shell 1 are improved. The arrangement mode of the heat conduction mechanism 2 for communicating the inside of the heat dissipation shell 1 and the outside of the heat dissipation shell 1 through the gas guide channel 9 helps to improve the air exchange speed inside and outside the heat dissipation shell 1.

The above detailed description is made on a discrete device and a discrete device heat dissipation apparatus provided in the present application. The description of the specific embodiments is provided to facilitate an understanding of the structure and design of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.

Claims

1. The discrete device and the discrete device heat dissipation device are characterized by comprising a heat dissipation device and a discrete device (3), wherein the heat dissipation device comprises a heat dissipation shell (1) and a heat conduction mechanism (2), the discrete device (3) is arranged in the heat dissipation shell (1), a fixed block (4) is arranged at the bottom in the heat dissipation shell (1), a slot (5) is formed in the fixed block (4), and the side surface of one side of the discrete device (3) is clamped in the slot (5); the side surface of the discrete device (3) is provided with a heat radiation fin (6), the side surface of the discrete device is fixedly connected with pins (7), and one end of each pin (7) penetrates through the heat radiation shell (1) and is fixedly connected with the penetrating part of the heat radiation shell (1); the heat dissipation device is characterized in that the heat dissipation shell (1) is provided with heat dissipation through holes (8) on the side face of the heat dissipation fins (6), a gas flow guide channel (9) is arranged below the fixing block (4), the heat conduction mechanism (2) is arranged on the outer side face of the heat dissipation shell (1), and the gas flow guide channel (9) is communicated with the heat conduction mechanism (2) inside the heat dissipation shell (1) and outside the heat dissipation shell (1).

2. The heat sink for discrete devices and discrete devices according to claim 1, wherein the heat conducting mechanism (2) comprises a motor (21), a transmission structure (22), fan blades (23) and a mounting plate (24), the motor (21) is fixed on the outer surface of the heat dissipating housing (1) through the mounting plate (24), the transmission mechanism comprises a gear and a transmission shaft, an output shaft of the motor (21) is connected with the gear, the gear is connected with the fan blades (23) through the transmission shaft, and the fan blades (23) are disposed in the space of the gas guiding channel (9).

3. The heat sink for discrete devices and discrete devices as claimed in claim 1 or 2, wherein a gas guide plate (10) is further disposed between the fixing block (4) and the gas guide channel (9), two ends of the gas guide plate (10) are fixedly connected with the inner sidewall of the heat sink housing (1) in an embedded manner, and the gas guide plate (10) is provided with a gas hole (11) penetrating through the gas guide plate (10).

4. A discrete device and discrete device heat sink as claimed in claim 3, characterized in that the discrete device (3) has heat dissipating fins (6) fixedly attached to its upper and left sides, pins (7) fixedly attached to the front side of the discrete device (3), and the lower side of the discrete device (3) is snap-fitted into the socket (5).

5. A discrete device and its heat sink as claimed in claim 4, characterized in that the right side of the heat sink housing (1) is provided with a vent hole (12) at a position corresponding to the right side of the gas guiding channel (9).

6. A discrete device and a discrete device heat sink according to claim 5, wherein a connecting block (13) is arranged between the pins (7) of the discrete device (3), a separating sleeve (14) is fixedly installed inside the connecting block (13), and the separating sleeve (14) is sleeved on the outer surface of the pin (7).