CN215392094U - Thermal leveling equipment with heat dissipation function - Google Patents
Thermal leveling equipment with heat dissipation function Download PDFInfo
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- CN215392094U CN215392094U CN202121610373.2U CN202121610373U CN215392094U CN 215392094 U CN215392094 U CN 215392094U CN 202121610373 U CN202121610373 U CN 202121610373U CN 215392094 U CN215392094 U CN 215392094U
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- heat dissipation
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Abstract
The utility model provides thermal leveling equipment with a heat dissipation function, which comprises a shell, a heating module and a heat dissipation mechanism, wherein the shell is provided with a heating cavity; an opening is formed in one side of the shell; the heating module is arranged in the shell, and a heating area formed by the heating module corresponds to the opening; the heat dissipation mechanism is arranged on the shell; according to the utility model, through the arrangement of the heat dissipation mechanism, a good heat dissipation effect is achieved, heat generated by heating of the heating module can be effectively dissipated from the shell in time, the heating module and the shell are prevented from being damaged by overhigh temperature in the shell, and the service life of the thermal leveling equipment is prolonged.
Description
Technical Field
The utility model belongs to the technical field of thermal leveling, and particularly relates to thermal leveling equipment with a heat dissipation function.
Background
Welding is an important process in shipbuilding, however, the machining process is easy to generate residual stress and deformation, and the deformation cannot be completely eliminated, so that the knowledge that the welding process is widely accepted; however, when the root cause of the deformation is found, a thermal leveling method has been proposed by the skilled person.
The existing thermal leveling method adopts a 'fire work' mode, and comprises the following specific operations: heating the surface layer in the raised area, wherein the shrinkage of the surface layer in the area can reduce the raised area after cooling, thereby realizing thermal leveling; the thermal leveling method needs to be realized by means of thermal leveling equipment, the thermal leveling equipment can generate a large amount of heat in the process of initiating explosive work, the temperature of the equipment can be increased while a workpiece is heated, and due to the lack of a heat dissipation device, the thermal leveling equipment is easily damaged to a certain extent due to overhigh temperature, so that the service life of the thermal leveling equipment is shortened.
SUMMERY OF THE UTILITY MODEL
In view of the above disadvantages of the prior art, the present invention provides a thermal leveling device with a heat dissipation function, which is used to solve the problems of the prior thermal leveling device that the temperature is too high, the device is damaged, and the service life of the device is shortened during the thermal leveling process due to the lack of a heat dissipation device.
To achieve the above and other related objects, the present invention provides a thermal leveling apparatus having a heat dissipation function, including: the heating device comprises a shell, a heating module and a heat dissipation mechanism; an opening is formed in one side of the shell; the heating module is arranged in the shell, and a heating area formed by the heating module corresponds to the opening; the heat dissipation mechanism is arranged on the shell.
In an embodiment of the present invention, the heat dissipation mechanism includes: a heat dissipation tool and a mounting assembly; the mounting assembly is arranged on the shell; the heat dissipation tool is mounted on the mounting assembly.
In an embodiment of the present invention, the mounting assembly includes: installing a frame body and an air duct; the mounting frame body is provided with an opening; both ends of the air duct are open, one end of the air duct is connected with the shell, and the other end of the air duct corresponds to the opening and is connected with the mounting frame body; the heat dissipation tool is arranged on the mounting frame body, and an air outlet of the heat dissipation tool corresponds to the opening.
In an embodiment of the utility model, a side surface of the housing on which the heat dissipation mechanism is disposed is opposite to a side surface of the housing on which the opening is disposed.
In an embodiment of the utility model, a side surface of the housing on which the heat dissipation mechanism is disposed is perpendicular to a side surface of the housing on which the opening is disposed.
In an embodiment of the present invention, the number of the heat dissipation mechanisms is two; the side surface of the shell, on which the heat dissipation mechanism is arranged, is opposite to the side surface of the shell, on which the opening is arranged; the side surface of the shell provided with the other heat dissipation mechanism is vertical to the side surface of the shell provided with the opening.
In an embodiment of the present invention, the heating module is disposed in the housing with a gap therebetween.
In an embodiment of the present invention, the housing is provided with heat dissipation holes.
In an embodiment of the utility model, the housing is provided with a sliding device.
As described above, the thermal leveling device with heat dissipation function of the present invention has the following beneficial effects:
compared with the prior art, the heat dissipation device has the advantages that through the arrangement of the heat dissipation mechanism, a good heat dissipation effect is achieved in the heat leveling process, heat generated by heating of the heating module can be timely and effectively dissipated from the shell, damage to the heating module and the shell due to overhigh temperature in the shell is avoided, and the service life of the heat leveling device is prolonged.
Drawings
Fig. 1 to 3 are schematic structural diagrams of a thermal leveling apparatus with heat dissipation function according to an embodiment of the present invention at different angles.
Description of the reference symbols
1 casing
2 Heat dissipation mechanism
201 mounting frame body
202 air duct
203 is provided with an opening
3 opening of the container
4 heat dissipation holes
5 cover plate
6 air vent
7 first sliding device
701 first mounting plate
702 first pulley
8 second sliding device
801 second mounting plate
802 second sliding wheel
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.
It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions of the present invention, so that the present invention has no technical significance. In addition, the terms "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for clarity of description, and are not intended to limit the scope of the present invention, and the relative relationship between the terms and the terms is not to be construed as a scope of the present invention.
The thermal leveling equipment with the heat dissipation function is used for solving the problems that the existing thermal leveling equipment is lack of a heat dissipation device, so that the equipment is damaged due to overhigh temperature in the thermal leveling process, and the service life of the equipment is shortened. The principle and embodiment of a thermal leveling apparatus having a heat dissipation function according to the present invention will be described in detail below, so that those skilled in the art can understand the thermal leveling apparatus having a heat dissipation function without creative efforts.
See fig. 1-3. Compared with the prior art, the thermal leveling device with the heat dissipation function provided by the embodiment of the utility model has the advantages that through the arrangement of the heat dissipation mechanism, a good heat dissipation effect is achieved in the thermal leveling process, heat generated by heating of the heating module can be timely and effectively dissipated from the shell, the heating module and the shell are prevented from being damaged due to overhigh temperature in the shell, and the service life of the thermal leveling device is prolonged.
As shown in fig. 1 and 2, in one embodiment, the thermal leveling apparatus with heat dissipation function of the present invention is applied to thermal leveling of a steel plate; the thermal leveling device comprises a shell 1, a heating module and a heat dissipation mechanism 2.
Specifically, one side of the housing 1 is provided with an opening 3; the heating module is arranged in the shell 1, and a heating area formed by the heating module corresponds to the opening 3.
The heating module is used for heating a pre-leveling area on a steel plate through the opening 3, so that internal stress in the pre-leveling area is released, and meanwhile, the pre-leveling area generates vertical deformation; upon cooling, the pre-leveling zone shrinks in all directions, creating a permanent deformation to achieve straightening and leveling of the pre-leveling zone.
As shown in fig. 1, in an embodiment, the heat dissipation mechanism 2 is disposed on the housing 1.
As shown in fig. 1, in an embodiment, the heat dissipation mechanism 2 is disposed above the housing 1 to form a heat dissipation air channel from top to bottom.
As shown in fig. 1, in an embodiment, the heat dissipation mechanism 2 is disposed in front of the housing 1 to form a front-to-back heat dissipation air duct.
As shown in fig. 1, in an embodiment, the number of the heat dissipation mechanisms 2 is two.
Specifically, the heat dissipation mechanism 2 is arranged above the housing 1 to form a heat dissipation air channel from top to bottom; the other heat dissipation mechanism 2 is arranged in front of the housing 1 to form a heat dissipation air duct from front to back.
In one embodiment, as shown in fig. 1, the heat dissipation mechanism 2 includes a heat dissipation tool and a mounting assembly.
Specifically, the mounting assembly is arranged on the shell 1; the heat dissipation tool is mounted on the mounting assembly.
As shown in fig. 1, in one embodiment, the mounting assembly includes a mounting frame 201 and a wind barrel 202.
Specifically, the mounting frame 201 is provided with an opening 203; both ends of the air duct 202 are open, one end of the air duct 202 is connected with the shell 1, and the other end of the air duct 202 corresponds to the opening 203 and is connected with the mounting frame 201; the heat dissipation tool is disposed on the mounting frame 201, and an air outlet of the heat dissipation tool corresponds to the opening 203.
It should be noted that, the heating module inside the casing 1 can generate a large amount of heat in the thermal leveling process, and can gather inside the casing 1, through installing the heat dissipation mechanism 2 on the casing 1 additionally, active heat dissipation by blowing to the inside of the casing 1 can be realized, in the thermal leveling process, a good heat dissipation effect is achieved, the heat generated by heating the heating module can be dissipated from the casing 1 effectively in time, thereby effectively reducing the temperature inside the casing 1, avoiding the damage to the heating module and the casing 1 due to the overhigh temperature inside the casing 1, ensuring the overall heat dissipation of the heating module, and further prolonging the service life of the thermal leveling device.
Further, the model selection treatment of the heat dissipation tool is tested and compared through various schemes, and the following conclusion is reached:
(1) heat dissipation tool adopting cold air blowing
Specifically, an electric air cooler is usually adopted, the air outlet amount of the cold air blowing opening is large, if short-distance heat dissipation is possible, the requirement of the excitation device is met, but if an air pipe with the length of 20 meters is added, the air outlet amount with the large caliber becomes the air outlet amount with the small caliber, the air can flow backwards, the air outlet amount with the small caliber outside the 20 meters is weak, and the cooling on the excitation device is not met, so that the use is not suggested.
(2) By means of an air compressor
Specifically, the air compressor with the air storage tank is often adopted, the pressure inside the pipeline of the air compressor is kept consistent, and the pressure in the air pipe can be seen through the pressure gauge, so that the overall heat dissipation performance of the excitation device is guaranteed, however, the heat dissipation mode is relatively heavy, and the manual carrying operation is inconvenient.
(3) Heat dissipation tool adopting water cooling
The water-cooling heat dissipation tool has the problems of large size and inconvenient operation.
(4) Using small force fans
Through the test comparison, adopt little violence fan to dispel the heat to excitation device, the effect is best, and the appearance is small and exquisite, and light in weight is convenient for operating personnel one-hand operation.
In summary, preferably, the heat dissipation means employs a force fan.
The forced fan is a computer heat dissipation fan having an air volume (CFM) of 100 Cubic Feet or more.
As shown in fig. 1, in an embodiment, a side surface of the housing 1 on which the heat dissipation mechanism 2 is disposed is opposite to a side surface of the housing 1 on which the opening 3 is disposed, so as to form a heat dissipation air duct in a direction from a side away from the opening 3 to the opening 3 in the housing 1.
Specifically, the opening 3 is disposed at the lower end of the housing 1, and the heat dissipation mechanism 2 is disposed above the housing 1, thereby forming a heat dissipation air passage from top to bottom.
As shown in fig. 1, in an embodiment, a side surface of the housing 1 on which the heat dissipation mechanism 2 is disposed is perpendicular to a side surface of the housing 1 on which the opening 3 is disposed.
Specifically, the opening 3 is disposed at the lower end of the housing 1, and the heat dissipation mechanism 2 is disposed in front of the housing 1 to form a heat dissipation air duct from front to back.
As shown in fig. 1, in an embodiment, the number of the heat dissipation mechanisms 2 is two.
It should be noted that the side of the housing 1 on which the heat dissipation mechanism 2 is disposed is opposite to the side of the housing 1 on which the opening 3 is disposed; the side surface of the other heat dissipation mechanism 2 arranged on the shell 1 is perpendicular to the side surface of the opening 3 arranged on the shell 1.
Specifically, the opening 3 is arranged at the lower end of the shell 1, and the heat dissipation mechanism 2 is arranged above the shell 1, so that a heat dissipation air duct is formed from top to bottom; the other heat dissipation mechanism 2 is arranged in front of the housing 1 to form a heat dissipation air duct from front to back.
In one embodiment, the heating module is disposed in the housing 1 with a gap between the heating module and the housing 1.
Specifically, inside the housing 1, a gap is left between the side end of the heating module and the inner wall of the housing 1, so that air flow and heat dissipation are facilitated.
As shown in fig. 2, in an embodiment, the housing 1 is provided with heat dissipation holes 4.
It should be noted that the heat dissipation hole 4 is more beneficial to the dissipation of heat inside the casing 1.
As shown in fig. 2, in an embodiment, the housing 1 has a cover plate 5, the cover plate 5 is connected to the housing 1 in a matching manner, and the cover plate 5 is provided with a vent hole 6 for facilitating heat dissipation.
As shown in fig. 1, in one embodiment, a first sliding device 7 is mounted on the housing 1.
It should be noted that, without using a sliding device, the hot leveling device has the following defects in the process of hot leveling movement of the steel plate:
(1) resistance is generated, which is not beneficial to moving.
(2) The long-term movement can cause a great deal of wear to the bottom of the thermal leveling device (particularly the lower end face of the housing 1), shortening the service life thereof.
(3) Operator fatigue can occur when holding the thermal leveling device for extended periods of time.
In view of the above defects, the steel plate is not heated uniformly, which affects the effect of the thermal leveling process, therefore, in the embodiment, the first sliding device 7 is installed on the housing 1, and the lower end surface of the housing 1 is kept in a virtual contact or non-contact state with the pre-leveling area (steel plate) by the arrangement of the first sliding device 7.
The "virtual contact state" means that the lower end surface of the housing 1 is in contact with the pre-leveling region (steel plate), but there is no force therebetween, that is, the steel plate does not wear the lower end surface of the housing 1; of course, the lower end surface of the shell 1 may also be spaced from the pre-leveling area by a certain distance in the vertical height, even if the lower end surface of the shell 1 and the pre-leveling area are kept in a non-contact state, the specific distance is not a condition for limiting the present invention, and may be determined according to the actual application scenario.
As shown in fig. 3, in an embodiment, a horizontal plane of the lower end surface of the housing 1 is an upper dotted line in fig. 3, and a lower dotted line in fig. 3 is a horizontal plane corresponding to the pre-leveling area; as can be seen from fig. 3, there is a space between the upper and lower dotted lines to ensure that the pre-leveling area does not wear the lower end surface of the housing 1 during pre-leveling.
It should be noted that, through the design of the sliding device, on one hand, the movement of the thermal leveling device is facilitated, and the workload of the operator can be further reduced; on the other hand, the installation of the sliding device ensures that the lower end surface of the shell 1 is directly in virtual contact with the pre-leveling area, even in a non-contact state, thereby protecting the shell 1, avoiding the phenomenon that the shell 1 is greatly abraded and the service life of the shell 1 is shortened due to the long-time movement of the thermal leveling equipment in the thermal leveling process; finally, the sliding device enables the pre-leveling area to be heated more uniformly, and the effect of the thermal leveling process is improved.
Specifically, the first sliding device 7 includes a first mounting plate 701 and a first sliding wheel 702; wherein the first mounting plate 701 is connected to the housing 1 and the first sliding wheel 702, respectively.
In one embodiment, the first sliding wheel 702 is a universal wheel.
It should be noted that the first pulley 702 is selected as follows:
(1) the ball adopts the bull's eye universal wheel of nylon: after installation, through practical use, the hot leveling equipment can shake and be unstable under the condition that the steel plate is not flat, and a heating route is changed, so that the leveling process effect is influenced.
(2) The ball is the bull's eye universal wheel of steel ball: after the mounting, through the practical use, the problem of instability of the bull-eye universal wheel made of nylon by the balls in the step (1) is solved.
Therefore, through multiple model selection (multiple screening of size, material and model) tests, the bull-eye universal wheel with the balls as the steel balls is finally determined to be adopted by the first sliding wheel 802.
As shown in fig. 1, in an embodiment, a second sliding device 8 is mounted on the heat dissipation mechanism 2.
Specifically, the second sliding device 8 includes a second mounting plate 801 and a second sliding wheel 802; wherein, the second mounting plate 801 is respectively connected with the heat dissipation mechanism 2 and the second sliding wheel 802.
As shown in fig. 1, the second sliding device 8 is connected to a heat dissipation mechanism provided at the front of the housing 1; specifically, the second mounting plate 801 is connected to the mounting frame body 201 and the second pulley 802 in the heat dissipation mechanism 2.
Preferably, the second sliding wheel 802 is a bull's eye universal wheel with steel balls.
It should be noted that the operation principle of the second sliding device 8 is the same as that of the first sliding device 7, and the description thereof is omitted.
Further, by the provision of the second sliding means 8, the stability of the thermal leveling apparatus is ensured after the heat dissipation mechanism 2 is installed at the front portion of the housing 1, and the housing 1 is prevented from being inclined to the front side due to the weight of the front portion of the housing 1 being greater than the weight of the rear portion.
In one embodiment, the housing 1 is made of nylon and fiber material.
The nylon and the fiber are modified by adding the glass fiber into the nylon material, so that the nylon material is more excellent in strength; in this embodiment, the housing 1 is made of nylon and fiber material, and has the advantages of high strength and rigidity, and high temperature resistance.
It should be noted that the material of the housing 1 is not limited to be nylon fiber material, and any material having similar or same function as the nylon fiber material can meet the requirement of production as the housing 1, and the embodiment of replacing other materials by equivalent is within the protection scope of the present invention.
In one embodiment, the housing 1 is integrally ejected by 3D printing.
Further, the mounting frame 201, the air duct 202, the first mounting plate 701, and the second mounting plate 801 are all integrally formed with the housing 1, and are integrally ejected by a 3D printing technique.
It should be noted that the thermal leveling device with the heat dissipation function is small in size and convenient to operate.
Furthermore, the thermal leveling equipment with the heat dissipation function can be produced into thermal leveling equipment similar to a robot, so that the whole thermal leveling process is intelligent and automatic without human participation in the thermal leveling process, and on one hand, the workload of operators can be reduced; on the other hand, the damage to the body health of the operator caused by the fact that the operator is in a high-temperature working environment for a long time can be avoided.
In summary, compared with the prior art, the heat leveling device with the heat dissipation function has the advantages that through the arrangement of the heat dissipation mechanism, a good heat dissipation effect is achieved in the heat leveling process, heat generated by heating of the heating module can be dissipated from the shell in time, damage to the heating module and the shell per se due to overhigh temperature in the shell is avoided, and the service life of the heat leveling device is prolonged; therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the utility model. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (9)
1. A thermal leveling apparatus having a heat dissipation function, comprising: the heating device comprises a shell, a heating module and a heat dissipation mechanism;
an opening is formed in one side of the shell;
the heating module is arranged in the shell, and a heating area formed by the heating module corresponds to the opening;
the heat dissipation mechanism is arranged on the shell.
2. The thermal leveling apparatus with a heat dissipation function according to claim 1, wherein the heat dissipation mechanism includes: a heat dissipation tool and a mounting assembly;
the mounting assembly is arranged on the shell;
the heat dissipation tool is mounted on the mounting assembly.
3. The thermal leveling apparatus with a heat dissipation function of claim 2, wherein the mounting assembly comprises: installing a frame body and an air duct;
the mounting frame body is provided with an opening;
both ends of the air duct are open, one end of the air duct is connected with the shell, and the other end of the air duct corresponds to the opening and is connected with the mounting frame body;
the heat dissipation tool is arranged on the mounting frame body, and an air outlet of the heat dissipation tool corresponds to the opening.
4. The thermal leveling apparatus with a heat dissipation function according to any one of claims 1 to 3, wherein a side of the housing on which the heat dissipation mechanism is provided is located opposite to a side of the housing on which the opening is provided.
5. The thermal leveling apparatus with a heat dissipation function according to any one of claims 1 to 3, wherein a side of the housing on which the heat dissipation mechanism is provided is perpendicular to a side of the housing on which the opening is provided.
6. The thermal leveling apparatus with a heat dissipation function according to any one of claims 1 to 3, wherein the number of the heat dissipation mechanisms is two;
the side surface of the shell, on which the heat dissipation mechanism is arranged, is opposite to the side surface of the shell, on which the opening is arranged;
the side surface of the shell provided with the other heat dissipation mechanism is vertical to the side surface of the shell provided with the opening.
7. The thermal leveling apparatus having a heat dissipation function according to claim 1, wherein the heating module is disposed within the housing with a gap therebetween.
8. The thermal leveling apparatus with a heat dissipation function according to claim 1, wherein a heat dissipation hole is provided on the housing.
9. The thermal leveling apparatus with a heat dissipation function as recited in claim 1, wherein a sliding device is mounted on the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121610373.2U CN215392094U (en) | 2021-07-15 | 2021-07-15 | Thermal leveling equipment with heat dissipation function |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121610373.2U CN215392094U (en) | 2021-07-15 | 2021-07-15 | Thermal leveling equipment with heat dissipation function |
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| CN215392094U true CN215392094U (en) | 2022-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202121610373.2U Active CN215392094U (en) | 2021-07-15 | 2021-07-15 | Thermal leveling equipment with heat dissipation function |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023155524A1 (en) * | 2022-02-16 | 2023-08-24 | 江苏科技大学 | Intelligent levelling system having automatic temperature control function and method thereof |
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2021
- 2021-07-15 CN CN202121610373.2U patent/CN215392094U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023155524A1 (en) * | 2022-02-16 | 2023-08-24 | 江苏科技大学 | Intelligent levelling system having automatic temperature control function and method thereof |
| US11921221B2 (en) | 2022-02-16 | 2024-03-05 | Jiangsu University Of Science And Technology | System for intelligently leveling with automatic temperature control function and method thereof |
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