CN108447817A - Silicon chip lifting apparatus - Google Patents
Silicon chip lifting apparatus Download PDFInfo
- Publication number
- CN108447817A CN108447817A CN201810231084.8A CN201810231084A CN108447817A CN 108447817 A CN108447817 A CN 108447817A CN 201810231084 A CN201810231084 A CN 201810231084A CN 108447817 A CN108447817 A CN 108447817A
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- Prior art keywords
- plate
- lifting assembly
- bracket
- lifter plate
- silicon chip
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 40
- 239000010703 silicon Substances 0.000 title claims abstract description 40
- 230000001360 synchronised effect Effects 0.000 claims abstract description 7
- 230000002035 prolonged effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 5
- 230000000712 assembly Effects 0.000 abstract description 3
- 238000000429 assembly Methods 0.000 abstract description 3
- 230000007423 decrease Effects 0.000 description 5
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 206010044565 Tremor Diseases 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Electromagnetism (AREA)
- Reciprocating Conveyors (AREA)
Abstract
The invention discloses a kind of silicon chip lifting apparatus, including bottom frame, slipping block, the first lifting assembly, bracket and the second lifting assembly；Slipping block is slidably mounted on bottom frame；And it can in X direction be moved on bottom frame；First lifting assembly is slidably mounted on slipping block；And can be moved in slipping block upper edge Y-direction, the first lifting assembly includes the first lifter plate that can be moved in the first lifting assembly upper edge Z-direction；The first end of bracket is fixedly connected with the first lifter plate, and second end extends in X direction；Second lifting assembly is fixed on bottom frame, and the second lifter plate is supported in the second end of bracket, and including can the second lifter plate moved along Z-direction synchronous with the first lifter plate.In the present invention, the both ends of bracket are supported by the first and second lifting assemblies respectively, and the first and second lifting assemblies are run simultaneously, under the premise of the both ends synchronizing moving for ensureing bracket, the supporting point for increasing bracket avoids the shaking in bracket moving process, increases pallet stationarity.
Description
Technical field
The present invention relates to technical field of solar batteries more particularly to a kind of silicon chip lifting apparatus.
Background technology
Solar cell is following generally acknowledged one of the clean energy resource that can be in large-scale application, as the energy constantly subtracts
It is few, and the use of other energy can bring immeasurable environmental pollution, people higher and higher to the cry that clean energy resource is more next,
And the reinforcement realized along with national environmental protection, China is also to support this generation mode energetically, especially to being propped up in terms of high-efficiency battery
Holding force degree rises year by year, and efficient heterojunction battery is occupied as high-efficiency battery generating efficiency forefront in high-efficiency battery field
Prodigious proportion.
It is exactly PECVD manufacturing techniques to prepare process the most key in such battery and equipment, and wherein silicon chip
An important link of the transmission as the process, i.e., before silicon chip original piece being transmitted to PECVD chambers by transmission device, then pass through
Transfer mechanism drives the pallet for silicon chip original piece of having arranged to be placed into the chamber of PECVD.Due to the corresponding bracket of pallet about 2.5
Rice or so, and its size has stringent control, due to itself rigidity and length, it is easy to cause transfer mechanism lift and
Shaking is generated when decline, is pendulum a great problem in face of designer then how to realize the steady lifting of pallet.
Invention content
The purpose of the present invention is to provide a kind of silicon chip lifting apparatus, to solve the above problems, ensure silicon chip on pallet
Position it is accurate, not by lift, transmission process trembles and swings situation and influenced, it is ensured that the accurate conveying of silicon chip.
Silicon chip lifting apparatus provided by the invention, including：
Bottom frame；
Slipping block, the slipping block are slidably mounted on the bottom frame；And the slipping block can be in the bottom frame upper edge side X
To movement；
First lifting assembly is slidably mounted on the slipping block；And first lifting assembly can be in the slipping block
Upper edge Y-direction moves；First lifting assembly includes the first lifter plate, and first lifter plate can be in the first lifting group
Part upper edge Z-direction moves；
Bracket, the first end of the bracket are fixedly connected with first lifter plate, and the second end of the bracket is in X direction
Extend；
Second lifting assembly is fixed on the bottom frame, second lifting assembly include the second lifter plate, described second
Lifter plate supports the second end of the bracket, second lifter plate that can be moved in the lifting assembly upper edge Z-direction, and described
Second lifter plate is synchronous with the mobile holding of the first lifter plate.
Silicon chip lifting apparatus as described above, wherein preferably, the bottom frame is mutually parallel equipped with two and along the side X
To the first track；The both ends of the slipping block are slidably mounted on two first tracks；
The second track along Y-direction is provided on the slipping block；First lifting assembly is slidably mounted on described
On two tracks.
Silicon chip lifting apparatus as described above, wherein preferably, first lifting assembly further includes the first installation
Plate；First mounting plate is slidably mounted on second track；
First mounting plate is provided with the third track along Z-direction, and first lifter plate is slidably mounted on described
On three tracks.
Silicon chip lifting apparatus as described above, wherein preferably, first lifting assembly further includes the first driving dress
It sets, the first driving means are set on first mounting plate, and the first driving means are passed with first lifter plate
Dynamic connection, for driving first lifter plate to be slided along the third track.
Silicon chip lifting apparatus as described above, wherein preferably, second lifting assembly further includes the second installation
Plate, second mounting plate are set on the bottom frame, and second mounting plate is provided with the 4th track along Z-direction, described
Second lifter plate is slidably mounted on the 4th track.
Silicon chip lifting apparatus as described above, wherein preferably, second lifting assembly further includes the second driving dress
It sets, second driving device is set on second mounting plate, and second driving device is passed with second lifter plate
Dynamic connection, for driving second lifter plate to be slided along the 4th track.
Silicon chip lifting apparatus as described above, wherein preferably, second lifter plate includes connecting plate and support
Plate, the connecting plate with the support plate is L-shaped is fixedly connected, the connecting plate is slidably connected with the 4th track, described
Guide wheel is provided in support plate, the guide wheel supports the second end of the bracket.
Silicon chip lifting apparatus as described above, wherein preferably, the bracket includes fixed plate and lifts plate, described
Fixed plate lifts that plate is L-shaped to be fixedly connected with described, and the fixed plate is fixedly connected with first lifter plate, described to lift plate
Extend in X direction.
Silicon chip lifting apparatus as described above, wherein preferably, described lift is provided with U-lag on plate.
Silicon chip lifting apparatus as described above, wherein further include sliding driving device preferably, the sliding driving
Device is connected on the bottom frame, for driving the slipping block to slide in X direction.
Silicon chip lifting apparatus provided by the invention, including bottom frame, slipping block, the first lifting assembly, bracket and the second lifting
Component；Wherein, slipping block is slidably mounted on bottom frame；And it can in X direction be moved on bottom frame；First lifting assembly is slidably installed
In on slipping block；And can be moved in slipping block upper edge Y-direction, the first lifting assembly includes can be in the first lifting assembly upper edge side Z
To the first mobile lifter plate；The first end of bracket is fixedly connected with the first lifter plate, and second end extends in X direction；Second liter
Part of coming down to a lower group is fixed on bottom frame, and the second lifter plate is supported in the second end of bracket, and including can be synchronous with the first lifter plate along Z
Second lifter plate of direction movement.In the present invention, the both ends of bracket are supported by the first and second lifting assemblies respectively, and the first He
Second lifting assembly is run simultaneously, and under the premise of the both ends synchronizing moving for ensureing bracket, is increased the supporting point of bracket, is avoided bracket
Shaking in moving process increases pallet stationarity.
Description of the drawings
Fig. 1 is the structural schematic diagram of silicon chip lifting apparatus provided in an embodiment of the present invention；
Fig. 2 is the partial enlarged view of silicon chip lifting apparatus provided in an embodiment of the present invention；
Fig. 3 is the structural schematic diagram of the second lifting assembly of silicon chip lifting apparatus provided in an embodiment of the present invention；
Fig. 4 is the structural schematic diagram of the bracket of silicon chip lifting apparatus provided in an embodiment of the present invention.
Reference sign：
10- bottom frames 11- the first track 20- slipping blocks the second tracks of 21-
30- the first lifting assembly 31- the first lifter plate 32- the first mounting plate 321- third tracks
33- first driving means 331- the first leading screw 40- bracket 41- fixed plates
42- lifts plate 421-U shape slot 50- the second lifting assembly the second lifter plates of 51-
511- connecting plate 512- support plate 513- guide wheels the second mounting plates of 52-
The 4th track 53- the second driving device 54- the second leading screw 60- sliding driving devices of 521-
Specific implementation mode
The embodiment of the present invention is described below in detail, the example of embodiment is shown in the accompanying drawings, wherein identical from beginning to end
Or similar label indicates same or similar element or element with the same or similar functions.It is retouched below with reference to attached drawing
The embodiment stated is exemplary, and is only used for explaining the present invention, and is not construed as limiting the claims.
As shown in Figures 1 to 4, silicon chip lifting apparatus provided in an embodiment of the present invention, including bottom frame 10, slipping block 20,
One lifting assembly 30, bracket 40 and the second lifting assembly 50.
Wherein, slipping block 20 is slidably mounted on bottom frame 10, and slipping block 20 can in X direction move on bottom frame 10, the
One lifting assembly 30 is slidably mounted on slipping block 20, and the first lifting assembly 30 can be moved in 20 upper edge Y-direction of slipping block；The
One lifting assembly 30 includes the first lifter plate 31；First lifter plate 31 can be moved in 30 upper edge Z-direction of the first lifting assembly；Bracket
40 first end is fixedly connected with the first lifter plate 31, and second end extends in X direction；Second lifting assembly 50 is fixed on bottom frame 10
On, the second lifting assembly 50 includes the second lifter plate 51, and the second lifter plate 51 is supported on the second end of bracket 40, and the second lifting
Plate 51 can be synchronous with the mobile holding of the first lifter plate 31.
Preferably, further include sliding driving device 60, sliding driving device 60 is connected on bottom frame 10, for driving sliding
Block 20 slides in X direction.The sliding driving device 60 can be that components, the those skilled in the art such as cylinder or servo motor can
To be selected according to actual needs.
Further, bottom frame 10 is mutually parallel and the first track 11 in X direction equipped with two；It slides at the both ends of slipping block 20
It is dynamic to be installed on two first tracks 11；And the second track 21 along Y-direction is provided on slipping block 20；Second lifting assembly 50 is slided
It is dynamic to be installed on the second track 21.First track 11 and the second track 21 are used to guide bottom frame 10 and slipping block 20 smoothly to slide,
In order to accurately control the position of pallet.
Referring to FIG. 1, all X, Y of the present invention, Z-direction are reference with the reference axis marked in Fig. 1, it can from Fig. 1
See, slipping block 20 can be slided along the first track 11 in X-direction, and the first lifting assembly 30 can be along the second track 21 in Y
Direction is slided, while the first lifting assembly 30 can also drive bracket 40 to be moved along Z-direction, therefore, in the present embodiment, bracket 40
It can be moved simultaneously from tri- directions X, Y and Z.
And the both ends of bracket 40 are supported by the first lifting assembly 30 and the second lifting assembly 50 respectively, and the first lifting
Component 30 and the synchronous operation of the second lifting assembly 50 increase under the premise of ensureing that the both ends of bracket 40 synchronize rising or decline
The supporting point of bracket 40 to avoid the shaking during 40 raising and lowering of bracket increases the stationarity of pallet.
When silicon chip is needed from transport to the chamber of PECVD on conveyer belt, the pallet for being placed with silicon chip can be placed in
On bracket 40, then adjust and X, Y of bracket 40, Z-direction position adjusted according to traffic condition, to silicon chip is accurately transported to
In PECVD chambers.
Specifically, referring to FIG. 3, the first lifting assembly 30 further includes the first mounting plate 32；First mounting plate 32 sliding peace
Loaded on the second track 21；First mounting plate 32 is provided with the third track 321 along Z-direction, and the first lifter plate 31 is slidably installed
In on third track 321.
In order to increase operation ease, realization automation mechanized operation, the first lifting assembly 30 further includes first driving means 33,
First driving means 33 are set on the first mounting plate 32, and first driving means 33 and the first lifter plate 31 are sequentially connected, and are used for
The first lifter plate 31 is driven to be slided along third track 321.The first driving means 33 can be servo motor, and servo motor
Rotor connect the first leading screw 331, and the first feed screw nut is connected on the first lifter plate 31, when servo motor starts, band
Dynamic first leading screw 331 rotates in the first feed screw nut, rise along the second track 21 to the first lifter plate 31 of driving or
Decline.It will be appreciated by persons skilled in the art that above-mentioned first driving means 33 or cylinder, the wherein cylinder body of cylinder
It is fixed on the first mounting plate 32, the connecting rod of cylinder drives the first lifter plate 31 to rise or decline.
Specifically, the second lifting assembly 50 further includes the second mounting plate 52, and the second mounting plate 52 is fixed on bottom frame 10, the
Two mounting plates 52 are provided with the 4th track 521 along Z-direction, and the second lifter plate 51 is slidably mounted on the 4th track 521.
In order to increase operation ease, realization automation mechanized operation, the second lifting assembly 50 further includes the second driving device 53,
Second driving device 53 is connected on the second mounting plate 52, and the second driving device 53 and the second lifter plate 51 are sequentially connected, and are used for
The second lifter plate 51 is driven to be slided along the 4th track 521.Second driving device 53 can be servo motor, and servo motor
Rotor connect the second leading screw 54, and be connected with the second feed screw nut on the second lifter plate 51, when servo motor starts, drive
Second leading screw 54 rotates in the second feed screw nut, to driving the second lifter plate 51 along third track 321 rise or under
Drop.It will be appreciated by persons skilled in the art that above-mentioned second driving device 53 or cylinder, the wherein cylinder body of cylinder are solid
It is scheduled on the second mounting plate 52, the connecting rod of cylinder drives the second lifter plate 51 to rise or decline.
And preferably, the second lifter plate 51 includes connecting plate 511 and support plate 512, connecting plate 511 and support plate 512
L-shaped to be fixedly connected, connecting plate 511 is slidably connected with the 4th track 521, and guide wheel 513, guide wheel 513 are provided in support plate 512
The second end of Support bracket 40.When bracket 40 moves along the Y direction, bracket 40 can roll on guide wheel 513, guide wheel 513
On the one hand it is the case where bracket 40 provides support, ensures that bracket 40 is steady, be not in shaking；Another aspect bracket 40 is along leading
513 movement of wheel, can increase stability when bracket 40 moves.
It will be appreciated by persons skilled in the art that connecting plate 511 and support plate 512 can be integrated machine-shaping,
Welding manner may be used to fix, or be fixed using fasteners such as bolts, those skilled in the art can be according to reality
It is selected.
It is understood that since the both ends of bracket 40 need synchronous raising and lowering, master control system that should control
33 and second driving device 53 of first driving means processed starts or is simultaneously stopped simultaneously, to ensure that the both ends of bracket 40 synchronize
It rises or declines.
Further, referring to FIG. 4, bracket 40 includes fixed plate 41 and lifts plate 42, fixed plate 41 and plate 42 is lifted into L
Shape is fixedly connected, and fixed plate 41 is fixedly connected with the first lifter plate 31, is lifted plate 42 and is extended in X direction.Preferably, plate 42 is lifted
On be provided with U-lag 421.Fixed plate 41 is mainly used for entire bracket 40 being fixed on the first lifting assembly 30, and lifts plate
42 are mainly used for lifting the pallet for being mounted with silicon chip, and setting U-lag 421 can then reduce the overall weight of bracket 40, and have
Conducive to cost-effective.
It will be appreciated by persons skilled in the art that fixed plate 41 and lifting plate 412 and can be integrated machine-shaping, also may be used
To be fixed using welding manner, or the fasteners such as bolt is used to be fixed, those skilled in the art can be according to practical need
It is selected.
Preferably, above-mentioned bottom frame 10 can be cube frame, and the first track 11 is arranged in the top of bottom frame 10, remaining group
Part is arranged at the top of bottom frame 10 successively.
Be described in detail based on the embodiments shown in the drawings the present invention structure, feature and effect, it is above only
For presently preferred embodiments of the present invention, but the present invention is not to limit practical range, every conception institute according to the present invention shown in drawing
The change of work, or it is revised as the equivalent embodiment of equivalent variations, it, should all when not going beyond the spirit of the description and the drawings
Within the scope of the present invention.
Claims (10)
1. a kind of silicon chip lifting apparatus, which is characterized in that including：
Bottom frame；
Slipping block, the slipping block are slidably mounted on the bottom frame；And the slipping block can in X direction move on the bottom frame
It is dynamic；
First lifting assembly is slidably mounted on the slipping block；And first lifting assembly can be in the slipping block upper edge Y
It moves in direction；First lifting assembly includes the first lifter plate, and first lifter plate can be on first lifting assembly
It is moved along Z-direction；
Bracket, the first end of the bracket are fixedly connected with first lifter plate, and the second end of the bracket is prolonged in X direction
It stretches；
Second lifting assembly is fixed on the bottom frame, and second lifting assembly includes the second lifter plate, second lifting
Plate supports the second end of the bracket, second lifter plate that can be moved in the lifting assembly upper edge Z-direction, and described second
Lifter plate is synchronous with the mobile holding of the first lifter plate.
2. silicon chip lifting apparatus according to claim 1, which is characterized in that the bottom frame is mutually parallel equipped with two and edge
First track of X-direction；The both ends of the slipping block are slidably mounted on two first tracks；
The second track along Y-direction is provided on the slipping block；First lifting assembly is slidably mounted on second rail
On road.
3. silicon chip lifting apparatus according to claim 2, which is characterized in that first lifting assembly further includes the first peace
Loading board；First mounting plate is slidably mounted on second track；
First mounting plate is provided with the third track along Z-direction, and first lifter plate is slidably mounted on the third rail
On road.
4. silicon chip lifting apparatus according to claim 3, which is characterized in that first lifting assembly further includes the first drive
Dynamic device, the first driving means are set on first mounting plate, and the first driving means are lifted with described first
Plate is sequentially connected, for driving first lifter plate to be slided along the third track.
5. silicon chip lifting apparatus according to claim 1, which is characterized in that second lifting assembly further includes the second peace
Loading board, second mounting plate are set on the bottom frame, and second mounting plate is provided with the 4th track along Z-direction, institute
The second lifter plate is stated to be slidably mounted on the 4th track.
6. silicon chip lifting apparatus according to claim 5, which is characterized in that second lifting assembly further includes the second drive
Dynamic device, second driving device are set on second mounting plate, and second driving device is lifted with described second
Plate is sequentially connected, for driving second lifter plate to be slided along the 4th track.
7. silicon chip lifting apparatus according to claim 5, which is characterized in that second lifter plate includes connecting plate and branch
Fagging, the connecting plate with the support plate is L-shaped is fixedly connected, the connecting plate is slidably connected with the 4th track, institute
It states and is provided with guide wheel in support plate, the guide wheel supports the second end of the bracket.
8. silicon chip lifting apparatus according to claim 1, which is characterized in that the bracket includes fixed plate and lifts plate,
The fixed plate lifts that plate is L-shaped to be fixedly connected with described, and the fixed plate is fixedly connected with first lifter plate, the support
Plate is lifted in X direction to extend.
9. silicon chip lifting apparatus according to claim 8, which is characterized in that described lift is provided with U-lag on plate.
10. the silicon chip lifting apparatus according to any one of claim 1-9, which is characterized in that further include sliding driving dress
It sets, the sliding driving device is connected on the bottom frame, for driving the slipping block to slide in X direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810231084.8A CN108447817A (en) | 2018-03-20 | 2018-03-20 | Silicon chip lifting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810231084.8A CN108447817A (en) | 2018-03-20 | 2018-03-20 | Silicon chip lifting apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108447817A true CN108447817A (en) | 2018-08-24 |
Family
ID=63195521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810231084.8A Pending CN108447817A (en) | 2018-03-20 | 2018-03-20 | Silicon chip lifting apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108447817A (en) |
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|---|---|---|---|---|
| US20100040768A1 (en) * | 2008-08-15 | 2010-02-18 | Lam Research Corporation | Temperature controlled hot edge ring assembly |
| CN101789471A (en) * | 2010-02-10 | 2010-07-28 | 无锡先导自动化设备有限公司 | Mechanism for taking out boxed silicon wafers |
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| CN107093651A (en) * | 2017-05-18 | 2017-08-25 | 江西比太科技有限公司 | The two-in-one automatic loading/unloading equipment of solar silicon wafers |
| CN206864490U (en) * | 2017-05-18 | 2018-01-09 | 江西比太科技有限公司 | The two-in-one automatic loading/unloading equipment of solar silicon wafers |
| CN207896071U (en) * | 2018-03-20 | 2018-09-21 | 君泰创新（北京）科技有限公司 | Silicon chip lifting apparatus |
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