CN206864490U - The two-in-one automatic loading/unloading equipment of solar silicon wafers - Google Patents

The two-in-one automatic loading/unloading equipment of solar silicon wafers Download PDF

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Publication number
CN206864490U
CN206864490U CN201720551624.1U CN201720551624U CN206864490U CN 206864490 U CN206864490 U CN 206864490U CN 201720551624 U CN201720551624 U CN 201720551624U CN 206864490 U CN206864490 U CN 206864490U
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China
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silicon chip
module
discharge end
main equipment
cylinder
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Chinese (zh)
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杨虎
芦伟
聂文杰
上官泉元
李跃平
李妙
蒲云祥
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Shanghai Hui Hui Automation Equipment Co Ltd
Jiangxi Better Technology Co Ltd
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Shanghai Hui Hui Automation Equipment Co Ltd
Jiangxi Better Technology Co Ltd
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Abstract

The utility model discloses a kind of two-in-one automatic loading/unloading equipment of solar silicon wafers, feeding module is located at the both sides of lifting platform with cutting module respectively, transfer module is provided with above the discharging opening of feeding module and the charging aperture of cutting module, lifting platform docks the charging discharge end of main equipment along support plate Y-direction traffic direction, and the discharging opening of feeding module and the charging aperture of cutting module correspond to main equipment and feed the X of discharge end to both sides respectively;Lifting platform includes upper outlet station and bottom feed station, and upper outlet station Y-direction docking main equipment feeds the discharging opening above discharge end, and feed station Y-direction docking main equipment in bottom feeds the charging aperture below discharge end;Cutting module includes CCD detection modules, device for eliminating and stacking mechanism;The silicon chip that the principle that stacking mechanism is automatically positioned using inclined-plane will fall off neatly stacks and makes the direct pile of silicon chip into bulk to facilitate directly packing conveying, greatly improves product packaging efficiency.

Description

The two-in-one automatic loading/unloading equipment of solar silicon wafers
Technical field
It the utility model is related to a kind of automation equipment, more particularly to a kind of dry method system for silicon chip of solar cell The two-in-one automatic loading/unloading equipment of solar silicon wafers in the handling process such as suede, PECVD plated films.
Background technology
Environmental requirement more and more higher in the last few years, the pollution problem of fossil energy are increasingly taken seriously, and due to changing The stone energy it is non-renewable, it is extremely urgent to seek new energy form.In numerous novel energies, the de- grain husk of photovoltaic power generation technology And go out.Silicon chip is core parts in photovoltaic power generation technology, and the process for producing solar silicon wafers is various, including from its early stage Silicon materials purification, ingot casting, evolution, section, to processes such as the making herbs into wool in later stage, diffusion, cleaning, PECVD plated films, printing, sintering, That is after silicon ingot is cut into silicon chip, it will also pass through the electricity that the processing of many processes can just become generating function Pond piece.Because the production requirement of silicon chip is higher, and it has a frangible attribute, circulation of the silicon chip between each process into Problem.
The Chinese utility model patent of Application No. 201110167739.8 is disclosed on a kind of online full-automatic silicon wafer Blanking machine, it includes PLC, feeder, blanking machine and online silicon chip processing equipment, feeder, blanking machine and online silicon chip Processing equipment is electrically connected with PLC, and the feeding of silicon chip, silicon chip are realized under the control of the program set in PLC PROCESS FOR TREATMENT and silicon slice charging online fully-automatic production, feeder include feed mechanism, cross drive detent mechanism, on Material lifting changement and feeding longitudinal direction feed belt;Blanking machine includes blanking longitudinal direction feed belt, blanking lifting changement With blanking cross drive detent mechanism;Longitudinal feed belt, lifting changement and cross drive detent mechanism three have coordinated Commutation into the shapes of the L twice direction of silicon chip transmits.The feeder of the utility model is located at online silicon chip work respectively with blanking machine The both sides of skill processing equipment, i.e. feeding are individually completed with blanking, thus can not effectively realize the association of charging equipment and blanking equipment With turnover, there is limitation.
The Chinese utility model patent of Application No. 201110458861.0 discloses one kind and is used for board-like PECVD equipment Silicon chip automatic loading and unloading system, the system includes being installed on the mainframe of charging side of PECVD equipment, control system, treats The sideways transfer mechanism of silicon chip feed mechanism, processed silicon chip discharging mechanism, silicon chip transshipment acitivity and silicon chip is handled, it is pending Silicon chip feed mechanism and the longitudinally parallel both lateral sides for being arranged in mainframe of processed silicon chip discharging mechanism, silicon chip transshipment acitivity It is longitudinally arranged and be installed between pending silicon chip feed mechanism and processed silicon chip discharging mechanism, the sideways transfer of silicon chip Mechanism is installed on mainframe and is across pending silicon chip feed mechanism, silicon chip transshipment acitivity, processed silicon chip discharging mechanism Top.The utility model using sideways transfer mechanism due to being installed on mainframe and being across pending silicon chip feeder Structure, silicon chip transshipment acitivity, processed silicon chip discharging mechanism top structure, thus its pending silicon chip and processed silicon chip Turn around time is longer.
It is automatic that the Chinese utility model of Application No. 201210579113.2 is related to a kind of silicon chip for PECVD equipment Handling equipment, manipulator is rotatablely equipped with frame, sucker is installed on a robotic arm, in the frame on the outside of manipulator First silicon box conveying mechanism, the first hoistable platform mechanism, guiding mechanism, the first slice carrying mechanism, the first storing are installed Mechanism, first conveyor structure, the first trolley positioning mechanism, the first graphite boat detent mechanism and the first floor truck, in frame Inner side is provided with the second silicon box conveying mechanism, the second hoistable platform mechanism, slice conveying mechanism, the second slice carrying implement Structure, the second material storage mechanism, second conveyor structure, the second trolley positioning mechanism, the second graphite boat detent mechanism are carried small with second Car.The utility model has two sets of silicon chip automatic loading and unloading devices be arrangeding in parallel to correspond to two sets of PECVD equipment respectively, and Realized among two sets of silicon chip automatic loading and unloading devices using manipulator untreated with processed silicon chip turnover, two complete equipments are only It is vertical to run and the turnover of empty magazine, unprocessed wafer and processed silicon chip between two complete equipments is realized by manipulator, but can not Form revolving structure and effective collaboration can not be realized.
The Chinese utility model of Application No. 201520524820.0 discloses a kind of silicon chip handling equipment, and it includes silicon Film magazine, graphite boat, frame, silicon box conveying mechanism, silicon box elevating mechanism, the first pipeline, the first storing transfer mechanism, take Piece manipulator, silicon box conveying mechanism, silicon box elevating mechanism, the first pipeline, the first storing transfer mechanism, take piece manipulator It is successively set in frame, silicon box is delivered on silicon box elevating mechanism through silicon box conveying mechanism, and will by the first pipeline Silicon chip in silicon box is transported to the first storing transfer mechanism, then by taking piece manipulator that silicon chip extracting is placed in graphite boat. The loading and unloading process of the utility model completes the week of untreated and processed silicon chip in same one end by graphite boat grasping mechanism Turn, its turn around time is long and less efficient.
The Chinese utility model of Application No. 201610388205.0 discloses a kind of full-automatic photovoltaic solar cell silicon Piece prints loading and unloading equipment, and cell piece in cell piece group is transported to specified location and carries out positioning arrangement, blanking die by feeding module The cell piece being completed for printing on printing equipment can export by group and auto loading is in the cell piece gaily decorated basket in hole, graphite frame Printing equipment can be sent the graphite frame lifted on module into and convey mould by graphite frame by conveying the upper strata conveying mechanism of module The graphite frame being completed for printing is sent on lifting module by lower floor's conveying mechanism of group, and lifting module can be by lower floor's conveying mechanism On graphite frame lifting on the conveying mechanism of upper strata, feeding conveying module can by the cell piece of positioning arrangement on feeding module by In the individual graphite frame being arranged on the conveying mechanism of lifting module upper strata, lifting module can be claimed conveyer by blanking conveying module Cell piece is sent into blanking module in graphite frame on structure.The lifting of the graphite frame of the utility model is independent using two sets with conveying Module, not only space-consuming is big for it, and two sets of independent turnover modules could complete graphite frame and be set in handling equipment and printing Turnover between standby, causes cycle longer and have impact on production efficiency.
For above-mentioned the deficiencies in the prior art, the utility model, which describes, a kind of is different from the two-in-one of above-mentioned prior art Handling equipment is automated, it, which is used to silicon chip being put on plane support plate, is delivered to dry method making herbs into wool process and by the complete silicon of making herbs into wool Piece carries out lamination to it again after technique is finished on plane support plate, and the direct pile of silicon chip is carried out into conveying packing into bulk.
The utility model can also be with some other techniques handled silicon chip, such as board-like filming equipment On.
The utility model, which is slightly transformed, can be used in the industry of some similar requirements, such as LED industry etc., so this Utility model, which has, compares wide application prospect.
Utility model content
Set in order to solve the above technical problems, the utility model provides a kind of two-in-one automatic loading/unloading of solar silicon wafers Standby, it is arranged on the charging discharge end of main equipment for the loading and unloading of main equipment, and it includes:Feeding module, transfer module, under Expect module and lifting platform;
Feeding module is located at the both sides of lifting platform, the discharging opening of feeding module and entering for cutting module with cutting module respectively Transfer module is correspondingly arranged on above material mouth respectively, lifting platform docks the charging discharge end of main equipment along support plate Y-direction traffic direction For circulation conveying of the support plate between lifting platform and main equipment, the discharging opening of feeding module and the charging aperture of cutting module point The X of main equipment charging discharge end is not corresponded to both sides, and the transfer module above feeding module discharging opening is used to move silicon chip Be loaded onto on the vacant support plate of main equipment charging discharge end, the transfer module above cutting module charging aperture be used for by silicon chip from Cutting module is transferred load on the support plate of main equipment charging discharge end;
Cutting module includes:The delivery track of corresponding transfer module, the CCD detection modules above delivery track, Device for eliminating installed in delivery track end, it is arranged on device for eliminating both sides and corresponds to the lamination of certified products contact pin station respectively The stacking mechanism of mechanism and corresponding defective work contact pin station, stacking mechanism and the magazine circulation of corresponding certified products contact pin station fill Put and be correspondingly arranged;
Stacking mechanism includes Pneumatic clamping jaw, and folding and symmetrically arranged two contact pin clamping jaws are controlled by Pneumatic clamping jaw, corresponding The proximity switch that two contact pin clamping jaw centre positions are set, it is arranged on two contact pin clamping jaws lower sections and the support bottom parallel with silicon chip Plate, the silicon chip baffle plate at support baseboard edge is vertically set on, is connected to lift cylinder and the rotating shaft of support baseboard bottom;
Lifting platform includes upper outlet station and bottom feed station, and upper outlet station Y-direction docking main equipment is fed out Expect the discharging opening above end, feed station Y-direction docking main equipment in bottom feeds the charging aperture below discharge end.
Wherein, feeding module includes:Qu Pian mechanisms, delivery track, catch mechanism, silicon chip hoisting mechanism, gaily decorated basket lift Structure and gaily decorated basket cycling mechanism, Qu Pian mechanisms are correspondingly arranged at the lower section of gaily decorated basket elevating mechanism, and delivery track is kept off to accessing piece mechanism Piece mechanism corresponds to liftable and is arranged on below delivery track, and silicon chip hoisting mechanism is arranged on the both sides of delivery track for by silicon Piece is promoted to the feeding position of corresponding transfer module, and gaily decorated basket cycling mechanism corresponds to circulation of the gaily decorated basket elevating mechanism for the gaily decorated basket.
Wherein, Qu Pian mechanisms include cylinder and the extendable conveyor being driven by the cylinder, and extendable conveyor is correspondingly arranged at flower Simultaneously dock delivery track in the lower section of basket elevating mechanism.
Wherein, catch mechanism includes cylinder and is driven by the cylinder the catch of lifting, and cylinder driving catch is in retracted mode And catch is driven to stretch out so that silicon chip slices position on delivery track when needing to position silicon chip.
Wherein, two sets of transfer modules include:Two electronic slide units be arrangeding in parallel, electricity is arranged on by the sliding block at both ends Crossbeam on dynamic slide unit, driving crossbeam is along the linearly moving motor of electronic slide unit, the lift cylinder on crossbeam, by At least one suction nozzle of lift cylinder driving lifting, and for compressed air to be delivered into lift cylinder and suction nozzle and by suction nozzle Sensor signal be delivered to the drag chain of master control circuit.
Further, in addition to centering cylinder;Multiple valves are slidably mounted on the slide rail by lift cylinder driving lifting, And multiple valves are linearly moved to adjust the spacing of multiple valves by centering cylinder drives edge slide rail.
Wherein, device for eliminating includes cylinder, and the extendable conveyor being driven by the cylinder;The contact pin clamping jaw pair of stacking mechanism The both ends of extendable conveyor are answered to set.
Wherein, lifting platform includes framework, is vertically mounted on the straight line module of framework side, is vertically mounted on framework both ends Guide rail, and the horizontal conveyer on the guide rail of both ends is arranged on by sliding block, straight line module drives horizontal conveyer along guide rail liter Drop, horizontal conveyer are run to discharging opening during upper outlet station above Y-direction docking main equipment charging discharge end, horizontal feed Machine is run to the charging aperture during feed station of bottom below Y-direction docking main equipment charging discharge end.
Pass through above-mentioned technical proposal, the utility model have the advantages that relative to prior art:
1. solving the problems, such as prior art feeding and blanking concertedness difference, the utility model is set by being correspondingly arranged at master Standby charging discharge end X is realized to the feeding of processed silicon chip on support plate and pending silicon chip to two sets of transfer module synchronizations of both sides Blowing, greatly improve operating efficiency;
2. solve the problems, such as that the turn around time of the pending silicon chip of prior art and processed silicon chip is longer, the utility model Discharge end X is fed to two sets of transfer modules of both sides respectively from the two of main equipment charging discharge end by being correspondingly arranged at main equipment Charging and discharging are completed in end, and charging is non-interference with discharging, and greatly shorten the charging discharging cycle;
3. solve the lifting of prior art support plate and conveying using two sets standalone modules and space-consuming is big and two sets only Vertical turnover module is used to realize the problem of turn around time between handling equipment and main equipment is long, and the utility model passes through X that main equipment charging discharge end is separately positioned on discharging will be fed and feed discharge end to both sides, and by lifting platform and main equipment Direct Y-direction docking, isosceles triangle, which is set, only needs a set of lifting platform that support plate lifting and the circulation between main equipment can be achieved, greatly Shorten support plate cycle period and improve operating efficiency, and save the device space;
4. by setting CCD detections and removing function in cutting module, it is possible to achieve to the Effective selection of silicon chip, and pass through Special lamination carries out lamination to the qualified and substandard product after screening, due to having between contact pin clamping jaw and support baseboard Certain altitude gap, the movement of falling object is done using silicon chip, the positice ground effect pair that the moment dropped is formed between upper lower silicon slice The silicon chip that drops plays cushioning effect and avoids damage to silicon wafer wool making velvet hair, and the principle that is automatically positioned using inclined-plane will fall off Silicon chip neatly stacks and makes the direct pile of silicon chip into bulk to facilitate directly packing conveying, in the gaily decorated basket and is conveyed without pile Hand press-packing is carried out to packaging platform, thus greatly improves product packing efficiency;
5. the utility model is reasonable in design, degree of integration is high, thus floor space is small, and low, automatic with energy consumption The advantages of change degree is high, fault rate is low and silicon chip fragment rate is low.
Brief description of the drawings
, below will be to needed for embodiment description in order to illustrate more clearly of the technical scheme in the embodiment of the utility model The accompanying drawing to be used is briefly described.
Fig. 1 integrally overlooks for the two-in-one automatic loading/unloading equipment of solar silicon wafers disclosed in the utility model embodiment to be shown It is intended to;
Fig. 2 is the feeding module overall structure schematic side view disclosed in the utility model embodiment;
Fig. 3 takes piece mechanism structure schematic diagram for the feeding module disclosed in the utility model embodiment;
Fig. 4 is the overall three-dimensional and close-up schematic view of feeding module disclosed in the utility model embodiment;
Fig. 5 is the transfer module dimensional structure diagram disclosed in the utility model embodiment;
Fig. 6 is the cutting module overall structure schematic side view disclosed in the utility model embodiment;
Fig. 7 is the rejecting mechanism schematic diagram of the cutting module disclosed in the utility model embodiment;
Fig. 8 and 9 is the stacking mechanism structural representation disclosed in the utility model embodiment;
Figure 10 is the lifting platform structural representation disclosed in the utility model embodiment.
Numeral and letter represent in figure:
10. the cutting module of 20. transfer module of feeding module 30.
40. the delivery track of 101. Qu Pian mechanisms of lifting platform 102.
103. the gaily decorated basket elevating mechanism of 104. silicon chip hoisting mechanism of catch mechanism 105.
106. the gaily decorated basket of 107. extendable conveyor of gaily decorated basket cycling mechanism 108.
The 201. electronic motors of 202. crossbeam of slide unit 203.
The suction nozzle of 204. lift cylinder, 205. centering cylinder 206.
The delivery track 302.CCD detection modules of 207. drag chain 301.
The magazine EGR of 303. device for eliminating, 304. stacking mechanism 305.
The contact pin clamping jaw of 306. extendable conveyor, 307. Pneumatic clamping jaw 308.
The baffle plate of 309. proximity switch, 310. support baseboard 311.
The supporting plate of 312. lift cylinder, 313. rotating shaft 314.
The cylinder 317. of 315. guide rail 316. is to penetrating optoelectronic switch
The air cushion of 318. top silicon chip, 319. bottom silicon chip 320.
I. the straight line module of certified products contact pin station II. defective work contact pin station 401.
The support plate of 402. guide rail, 403. horizontal conveyer 50.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out Clearly and completely describe.
With reference to figure 1, the two-in-one automatic loading/unloading equipment of solar silicon wafers provided by the utility model, it is arranged on main equipment Charging discharge end for the loading and unloading of main equipment, it includes:Feeding module 10, transfer module 20, cutting module 30 and liter Platform 40 drops;Feeding module 10 is located at the both sides of lifting platform 40, the discharging opening of feeding module 10 and blanking with cutting module 30 respectively Transfer module 20 is correspondingly arranged on above the charging aperture of module 30 respectively, lifting platform 40 is set along support plate Y-direction traffic direction docking master Circulation conveying of the standby charging discharge end for support plate 50 between lifting platform 40 and main equipment, the discharging opening of feeding module 10 With the charging aperture of cutting module 30 correspond to respectively main equipment charging discharge end X to both sides, on the discharging opening of feeding module 10 The transfer module 20 of side is used to silicon chip transferring load to the vacant support plate 50 of main equipment charging discharge end, enters positioned at cutting module 30 Transfer module 20 above material mouth is used to feed silicon chip from main equipment transfers load to cutting module 30 on the support plate 50 of discharge end;Rise Drop platform 40 includes upper outlet station and bottom feed station, upper outlet station Y-direction docking main equipment charging discharge end top Discharging opening, bottom feed station Y-direction docking main equipment charging discharge end below charging aperture.
With reference to figure 2, feeding module 10 includes:Qu Pian mechanisms 101, delivery track 102, catch mechanism 103, silicon chip elevator Structure 104, gaily decorated basket elevating mechanism 105 and gaily decorated basket cycling mechanism 106, Qu Pian mechanisms 101 are correspondingly arranged at gaily decorated basket elevating mechanism 105 Lower section, delivery track 102 are arranged on the lower section of delivery track 102, silicon to accessing piece mechanism 101, the corresponding liftable of catch mechanism 103 Piece hoisting mechanism 104 is arranged on the both sides of delivery track 102 for silicon chip to be promoted to the feeding position of corresponding transfer module 20 Put, the corresponding gaily decorated basket elevating mechanism 105 of gaily decorated basket cycling mechanism 106 for the gaily decorated basket 108 circulation.
With reference to figure 3, Qu Pian mechanisms 101 include cylinder and the extendable conveyor 107 being driven by the cylinder, extendable conveyor 107 It is correspondingly arranged at the lower section of gaily decorated basket elevating mechanism 105 and docks delivery track 102.
With reference to figure 4, catch mechanism 103 includes cylinder and is driven by the cylinder the catch of lifting, and cylinder driving catch is in contracting The state of returning simultaneously drives catch to stretch out so that silicon chip slices are carried out on delivery track 102 when needing to position silicon chip Positioning.
With reference to figure 5, two sets of transfer modules 20 include:Two electronic slide units 201 be arrangeding in parallel, pass through the sliding block at both ends Crossbeam 202 on electronic slide unit 201, driving crossbeam 202 are pacified along the linearly moving motor 203 of electronic slide unit 201 Lift cylinder 204 on crossbeam 202, multiple suction nozzles 206 of lifting are driven by lift cylinder 204, and for that will compress Air is delivered to lift cylinder 204 and suction nozzle 206 and the sensor signal of suction nozzle 206 is delivered to the drag chain 207 of master control circuit; Also include centering cylinder 205;Multiple valves 206 are slidably mounted on to be driven on the slide rail of lifting by lift cylinder 204, and multiple gas Mouth 206 is linearly moved to adjust the spacing of multiple valves 206 by the drives edge slide rail of centering cylinder 205.
With reference to figure 6, cutting module 30 includes:The delivery track 301 of corresponding transfer module 20, installed in delivery track 301 The CCD detection modules 302 of top, the device for eliminating 303 installed in the end of delivery track 301, it is arranged on the both sides of device for eliminating 303 And certified products contact pin station I stacking mechanism 304 and corresponding defective work contact pin station II stacking mechanism 304 are corresponded to respectively, Corresponding certified products contact pin station I stacking mechanism 304 is correspondingly arranged with magazine EGR 305;
With reference to figure 7, device for eliminating 303 includes cylinder, and the extendable conveyor 306 being driven by the cylinder;
With reference to figure 8 and 9, stacking mechanism 304 includes Pneumatic clamping jaw 307, is controlled folding by Pneumatic clamping jaw 307 and be symmetrical arranged Two contact pin clamping jaws 308, the proximity switch 309 that corresponding two centre positions of contact pin clamping jaw 308 are set, be arranged on two contact pin The lower section of clamping jaw 308 and the support baseboard 310 parallel with silicon chip, the silicon chip baffle plate 311 at the edge of support baseboard 310 is vertically set on, Lift cylinder 312 and the rotating shaft 313 of the bottom of support baseboard 310 are connected to, the contact pin clamping jaw 308 of stacking mechanism 304 is corresponding flexible The both ends of conveyer 306 are set;Also include straight line module, support baseboard 310 is slidably mounted on straight line module by supporting plate 314 Guide rail 315 on and pass through the driving lifting of the cylinder 316 of straight line module;Also include to penetrating optoelectronic switch 317, to penetrating optoelectronic switch 317 are located at the both sides of baffle plate 311 with the superiors' silicon chip height in corresponding baffle plate 310, and make the upper surface of the superiors' silicon chip with connecing There is constant space H between piece clamping jaw 308.
With reference to figure 10, lifting platform 40 includes the framework with upper outlet station and bottom feed station, is vertically mounted on The straight line module 401 of framework side, the guide rail 402 at framework both ends is vertically mounted on, and both ends guide rail is arranged on by sliding block Horizontal conveyer 403 on 402, straight line module 401 drive horizontal conveyer 403 to be lifted along guide rail 402, horizontal conveyer 403 Run to discharging opening during upper outlet station above Y-direction docking main equipment charging discharge end, horizontal conveyer 403 and run under Charging aperture during portion's feed station below Y-direction docking main equipment charging discharge end.
Utility model works principle:
With reference to figure 2-4, during work, the extendable conveyor 107 of Qu Pian mechanisms 101 extends the bottom of silicon chip in the gaily decorated basket 108, so Gaily decorated basket elevating mechanism 105 declines a lattice distance with the gaily decorated basket 108 is past afterwards, so that by extendable conveyor 107 by the gaily decorated basket 108 Silicon chip is blocks of to be taken out and is taken to delivery track 102, and silicon chip is carried out after the conveying of delivery track 102 when in need to silicon chip During positioning, the catch in retracted mode stretches out under cylinder driving and makes silicon chip is blocks of to be positioned in orbit, from And silicon chip stops in the upper defined position of delivery track 102, silicon chip in place is then promoted to one by silicon chip hoisting mechanism Fixed height, after silicon chip is lifted by silicon chip hoisting mechanism 104, the delivery track 102 of lower section can be used for conveying next group Silicon chip, the silicon chip after being then lifted out are taken away and are placed on support plate 50 on defined position by the suction nozzle of transfer module 20;Gaily decorated basket liter The effect of descending mechanism 105 is exactly that the silicon chip in the gaily decorated basket 108 is removed the certain height of a piece of rear decline, allows second to move to Station to be taken, Qu Pian mechanisms 101 are facilitated to carry out taking piece, after the completion of the silicon chip in the gaily decorated basket 108 is all taken piece, gaily decorated basket lift Structure 105 moves extreme lower position and starts the gaily decorated basket cycling mechanism 106 of bottom, and the empty gaily decorated basket 108 is delivered to and manually takes the sky gaily decorated basket 108 Position, the empty gaily decorated basket 108 waits being removed herein;
With reference to figure 5, transfer module 20 1 shares two sets, wherein a set of be used for feeding:The silicon that delivery track conveying is come Piece is captured and is placed on support plate 50;Other set is used for blanking:The silicon chip that handling process is finished on support plate 50 is captured and is placed on On delivery track;The inside of electronic slide unit 201 is made up of slide rail and Synchronous Transmission, and rotary motion is inputted in its end, electronic Sliding block on slide unit 201 can do accurate linear motion;Sliding block on electronic slide unit 201 is connected with crossbeam 202, is driving Under the drive of motor 203, lift cylinder 204, centering cylinder 205, the suction nozzle 206 etc. of crossbeam 202 and its underpart installation being capable of edges The slide direction for electronic slide unit 201 is done accurate mobile and stopped;In order to prevent suction nozzle 206 from preventing from bumping against in the process of running The other parts of machinery, the grade part of suction nozzle 206 are required to move up and down, when taking piece or film releasing in bottom, are being moved through Suction nozzle 206 in top, the effect of lift cylinder 204 is moved up and down with suction nozzle 206 in journey, ensures that suction nozzle 206 will not bump against Remaining parts;In order to save silicon chip occupied area on support plate 50, centre distance of the silicon chip on support plate 50 is very near, silicon Distance between piece edge only has 1mm, wants to allow silicon chip to ensure that this size has very big difficulty in delivery track during feeding, due to silicon chip Distance of the centre-to-centre spacing with silicon chip on delivery track on support plate 50 is inconsistent, so needing the centre-to-centre spacing energy between suction nozzle 206 Enough adjustment, the function are realized by centering cylinder 205;The effect of drag chain 207 be exactly by compressed air be delivered to lift cylinder 204, The gas point such as centering cylinder 205, suction nozzle 206, and the sensor signal of suction nozzle 206 etc. is delivered to master control circuit;
With reference to figure 6 and 7, the effect of cutting module 30 is after the silicon chip for finishing handling process is taken into piece via transfer module 20 Be placed on delivery track 301, to by CCD detection modules 302 detect it is qualified after silicon chip carry out lamination;During work, transfer The silicon chip for finishing handling process is removed and is placed on delivery track 301 by module 20 from support plate 50, and silicon chip is in belt conveyor Drive under be moved along;The CCD camera of the top of delivery track 301 is erected in real time the silicon chip on track take pictures point Analysis, for being that the silicon chip of defective work can be removed device 303 and carry out rejecting operation by analysis, for detecting qualified silicon chip It is delivered to rear end and lamination is carried out to it by stacking mechanism 304;After a certain amount being laminated to by defined data, magazine and silicon chip Tail end is delivered to together, and by being placed on after manually silicon chip is taken away in the packaging specified, empty magazine is entered by magazine EGR 305 Row circulation;If being judged as certified products by the CCD silicon chips detected, the extendable conveyor 306 of device for eliminating 303 stretches out and straight Connect and silicon chip is delivered to certified products contact pin station lamination is carried out by stacking mechanism 304;If it is determined by the CCD silicon chips detected For defective work, then the extendable conveyor 306 of device for eliminating 303 is retracted and is directly jammed at first contact pin clamping jaw 308, And NonConforming Parts Area is stacked in by stacking mechanism 304;
With reference to figure 8 and 9, silicon chip is conveyed forward under the conveying effect of extendable conveyor 306, and is entered by Pneumatic clamping jaw Between the contact pin clamping jaw 308 of 307 control foldings, now proximity switch 309 can send control signal, control solenoid directional control valve, make Pneumatic clamping jaw 307 opens, and contact pin clamping jaw 308 can also open under the drive of Pneumatic clamping jaw 307, silicon after contact pin clamping jaw 308 opens The movement of falling object is done in sector-meeting;After silicon chip drops on support baseboard 310, lift cylinder 312 can be under the control of magnetic valve It can retract, drive support baseboard 310 to carry out a certain degree of inclination around rotating shaft 313;Due to the He of top silicon chip 318 just dropped There is certain air the bottom silicon chip 319 to drop before between and form air cushion 320, the cushioning effect of air cushion 320 Make the meeting very little of the frictional force between top silicon chip 318 and bottom silicon chip 319 and avoid damage to the fine hair in silicon wafer wool making face, as long as one Individual smaller angle of inclination, top silicon chip 318 will move, profit towards silicon chip baffle plate 311 automatically toward incline direction movement The silicon chip that the principle being automatically positioned with inclined-plane will fall off neatly stacks;Silicon chip automatically after alignment lift cylinder 312 piston Rise, recover horizontality with support baseboard 310;Because silicon chip has certain thickness, thus quantity is folded can cause most more The silicon chip on upper strata is too high, so often fold a piece of silicon chip, the cylinder 316 of straight line module can all drive supporting plate 314 along under guide rail 315 A certain distance drops(About 2mm), support baseboard 310 and corresponding lift cylinder 312 is synchronous declines certain distance, then again up Rise, because top arranges that a pair pairs are penetrated optoelectronic switch 317, the silicon chip of the superiors can will be to penetrating optoelectronic switch in uphill process 317 photo-electric switches projected, now straight line module will stop moving upwards, this ensures that the silicon chip of the superiors presss from both sides with contact pin Pawl 308 keeps constant height, ensure that the distance H that every silicon chip is fallen down is steady state value, prevent silicon chip drop during silicon chip Damage.
With reference to figure 10, the effect of lifting platform 40 is exactly that to catch the support plate 50 that comes of main equipment conveying in upper outlet station right The lower transmission mechanism for dropping to bottom feed station afterwards and support plate 50 being delivered to main equipment realizes circulation;During work, straight line mould Horizontal conveyer 403 is promoted to top feed station and catches what main equipment conveying came by group 401 under the drive of motor Support plate 50, then straight line module 401 run and by support plate 50 along reversely drop to bottom discharging station after, pass through horizontal conveyer 403 are delivered to support plate 50 the lower transmission mechanism of main equipment, and the circulation of support plate 50 in the host is realized with this.
The foregoing description of the disclosed embodiments, professional and technical personnel in the field are enable to realize or new using this practicality Type.A variety of modifications to these embodiments will be apparent for those skilled in the art, determine herein The General Principle of justice can be realized in other embodiments in the case where not departing from spirit or scope of the present utility model.Cause This, the utility model is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein The most wide scope consistent with features of novelty.

Claims (8)

1. a kind of two-in-one automatic loading/unloading equipment of solar silicon wafers, it is arranged on the charging discharge end of main equipment and set for master Standby loading and unloading, it is characterised in that including:Feeding module, transfer module, cutting module and lifting platform;
The feeding module and the cutting module are located at the both sides of the lifting platform respectively, the discharging opening of the feeding module and It is correspondingly arranged on the transfer module above the charging aperture of the cutting module respectively, the lifting platform is along support plate Y-direction operation side To docking circulation of the charging discharge end of the main equipment for the support plate between the lifting platform and the main equipment Conveying, the discharging opening of the feeding module correspond to the main equipment charging discharge end respectively with the charging aperture of the cutting module X to both sides, for silicon chip to be transferred load into the main equipment enter by the transfer module above the feeding module discharging opening Expect on the vacant support plate of discharge end, the transfer module above the cutting module charging aperture be used for by silicon chip from The cutting module is transferred load on the support plate of the main equipment charging discharge end;
The cutting module includes:The delivery track of the corresponding transfer module, the CCD inspections above the delivery track Survey module, the device for eliminating installed in the delivery track end, be arranged on the device for eliminating both sides and correspond to respectively it is qualified The stacking mechanism of the stacking mechanism of product contact pin station and corresponding defective work contact pin station, the lamination of corresponding certified products contact pin station Mechanism is correspondingly arranged with magazine EGR;
The stacking mechanism includes Pneumatic clamping jaw, and folding and symmetrically arranged two contact pin clamping jaws are controlled by the Pneumatic clamping jaw, The proximity switch that corresponding two contact pin clamping jaw centre positions are set, it is arranged on two contact pin clamping jaws lower sections and and silicon chip Parallel support baseboard, the silicon chip baffle plate at the support baseboard edge is vertically set on, is connected to the support baseboard bottom Lift cylinder and rotating shaft;
The lifting platform includes upper outlet station and bottom feed station, and the upper outlet station Y-direction is docked the master and set Discharging opening above standby charging discharge end, the bottom feed station Y-direction dock entering below the main equipment charging discharge end Material mouth.
2. the two-in-one automatic loading/unloading equipment of solar silicon wafers according to claim 1, it is characterised in that the feeding mould Block includes:Qu Pian mechanisms, delivery track, catch mechanism, silicon chip hoisting mechanism, gaily decorated basket elevating mechanism and gaily decorated basket cycling mechanism, institute Shu Qupian mechanisms are correspondingly arranged at the lower section of the gaily decorated basket elevating mechanism, and the delivery track docks the Qu Pian mechanisms, described Catch mechanism corresponds to liftable and is arranged on below the delivery track, and the silicon chip hoisting mechanism is arranged on the delivery track For silicon chip to be promoted to the feeding position of the corresponding transfer module, the gaily decorated basket cycling mechanism corresponds to the gaily decorated basket for both sides Elevating mechanism for the gaily decorated basket circulation.
3. the two-in-one automatic loading/unloading equipment of solar silicon wafers according to claim 2, it is characterised in that described to take piece machine Structure includes cylinder and the extendable conveyor driven by the cylinder, and the extendable conveyor is correspondingly arranged at the gaily decorated basket lift Simultaneously dock the delivery track in the lower section of structure.
4. the two-in-one automatic loading/unloading equipment of solar silicon wafers according to claim 2, it is characterised in that the block machine Structure includes cylinder and the catch of lifting is driven by the cylinder, and the cylinder drives the catch to be in retracted mode and needing The catch is driven to stretch out when being positioned to silicon chip so that silicon chip slices position on the delivery track.
5. the two-in-one automatic loading/unloading equipment of solar silicon wafers according to claim 1, it is characterised in that two sets of shiftings Carrying module includes:Two electronic slide units be arrangeding in parallel, the crossbeam being arranged on by the sliding block at both ends on the electronic slide unit, The crossbeam is driven along the electronic linearly moving motor of slide unit, the lift cylinder on the crossbeam, by institute At least one suction nozzle of lift cylinder driving lifting is stated, and for compressed air to be delivered into the lift cylinder and suction nozzle simultaneously The sensor signal of suction nozzle is delivered to the drag chain of master control circuit.
6. the two-in-one automatic loading/unloading equipment of solar silicon wafers according to claim 5, it is characterised in that also including centering Cylinder;Multiple suction nozzles are slidably mounted on the slide rail by lift cylinder driving lifting, and multiple suction nozzles are by institute The linear movement of slide rail described in centering cylinder drives edge is stated to adjust the spacing of multiple suction nozzles.
7. the two-in-one automatic loading/unloading equipment of solar silicon wafers according to claim 1, it is characterised in that described to reject dress Put including cylinder, and the extendable conveyor driven by the cylinder;The contact pin clamping jaw of the stacking mechanism corresponds to described flexible The both ends of conveyer are set.
8. the two-in-one automatic loading/unloading equipment of solar silicon wafers according to claim 1, it is characterised in that the lifting Platform includes the framework with the upper outlet station and bottom feed station, is vertically mounted on the straight line mould of the framework side Group, the guide rail at the framework both ends is vertically mounted on, and the horizontal conveyer described in both ends on guide rail is arranged on by sliding block, The straight line module drives the horizontal conveyer, and along the lifting rail, the horizontal conveyer is run to the upper outlet Y-direction docks the discharging opening above the main equipment charging discharge end during station, and the horizontal conveyer is run to bottom feeder Y-direction docks the charging aperture below the main equipment charging discharge end during position.
CN201720551624.1U 2017-05-18 2017-05-18 The two-in-one automatic loading/unloading equipment of solar silicon wafers Active CN206864490U (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107093651A (en) * 2017-05-18 2017-08-25 江西比太科技有限公司 The two-in-one automatic loading/unloading equipment of solar silicon wafers
CN108447817A (en) * 2018-03-20 2018-08-24 君泰创新(北京)科技有限公司 Silicon chip lifting apparatus
CN108526516A (en) * 2018-06-20 2018-09-14 天津市莱斯特阀门有限公司 Valve oscillatory type hole-drilling system
CN108555395A (en) * 2018-06-20 2018-09-21 天津市莱斯特阀门有限公司 Valve oscillatory type reaming hole system
CN108608045A (en) * 2018-06-20 2018-10-02 天津市莱斯特阀门有限公司 The rounding angle system of valve rod
CN112864035A (en) * 2020-12-28 2021-05-28 天津爱旭太阳能科技有限公司 Automatic solar cell blanking machine and control method thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107093651A (en) * 2017-05-18 2017-08-25 江西比太科技有限公司 The two-in-one automatic loading/unloading equipment of solar silicon wafers
CN108447817A (en) * 2018-03-20 2018-08-24 君泰创新(北京)科技有限公司 Silicon chip lifting apparatus
CN108526516A (en) * 2018-06-20 2018-09-14 天津市莱斯特阀门有限公司 Valve oscillatory type hole-drilling system
CN108555395A (en) * 2018-06-20 2018-09-21 天津市莱斯特阀门有限公司 Valve oscillatory type reaming hole system
CN108608045A (en) * 2018-06-20 2018-10-02 天津市莱斯特阀门有限公司 The rounding angle system of valve rod
CN112864035A (en) * 2020-12-28 2021-05-28 天津爱旭太阳能科技有限公司 Automatic solar cell blanking machine and control method thereof

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