CN109449110A - A kind of self-feeding unit of chip package arranging machine - Google Patents
A kind of self-feeding unit of chip package arranging machine Download PDFInfo
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- CN109449110A CN109449110A CN201811333235.7A CN201811333235A CN109449110A CN 109449110 A CN109449110 A CN 109449110A CN 201811333235 A CN201811333235 A CN 201811333235A CN 109449110 A CN109449110 A CN 109449110A
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- lifting
- cylinder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Specific Conveyance Elements (AREA)
Abstract
The self-feeding unit of of the invention and a kind of chip package arranging machine, including the locating module for locating core film magazine, the lifting module for chip cartridges lifting and the ejection module for one single chip output, for the ejection module after ejecting first chip, lifting module realizes that downwards second chip is placed on the ejection path of ejection module by stepping.After above structure, one single chip is sent out one by one by self-feeding unit, realize the automation of chip taking-up, worker is not used, the problem of to prevent wafer damage and contamination grease stain, spoilage of chip during packing is reduced, production efficiency is improved, reduces production cost.
Description
Technical field
The present invention relates to one of encapsulation technology field automation equipments, more particularly, to a kind of chip package screening
The self-feeding unit of machine.
Background technique
Encapsulation is the process integrated circuit assembly for chip final products, briefly, exactly the collection produced
It is placed at circuit die on the substrate that one piece is played the role of carrying, pin is extracted, then fixation is packaged into as an entirety.
It from chip production final molding, is shared out the work and helped one another to improve efficiency each company, some companies are only responsible for life
Chip is produced, and some companies are only responsible for being packaged, therefore realize chip from chip production quotient to core by transport in the process
Piece encapsulates the movement of quotient, during transportation usually using chip cartridges for loading chip, and in order to guarantee adjacent chip it
Between will not be damaged because of collision, multiple placement items for chip placement are set in chip cartridges, pass through place item
So that multiple chips arrange in the vertical direction, space can be saved, improves conevying efficiency；And when being packaged to chip,
Need to take out in chip slave chip cartridges one by one and be put into corresponding mold, this operation generally use manually come it is real
Existing, the manual operation firmly excessive damage for being likely to result in chip sometimes, being infected with upper grease stain sometimes influences the use of chip, people
Work operating efficiency is lower.
Summary of the invention
It is improved efficiency technical problem to be solved by the invention is to provide a kind of realization automatic operation and being less likely to be damaged
Chip package arranging machine self-feeding unit.
The technical scheme adopted by the invention to solve the technical problem is that: a kind of self-feeding of chip package arranging machine
Unit, including for locating core film magazine locating module, for chip cartridges lifting lifting module and for one single chip it is defeated
Ejection module out, for the ejection module after ejecting first chip, lifting module realizes downwards stepping by second
Chip is placed on the ejection path of ejection module.
Further specifically, the locating module includes positioning plate device and is set on positioning plate device and positions gas
Cylinder assembly；The positioning plate device is made of 4 L-shaped positioning plates, and the L shape opening of positioning plate described in 4 inwardly forms
Accommodate the cavity of chip cartridges.
Further specifically, the positioning cylinder device include the cylinder fixed block being set on positioning plate device and
Positioning cylinder in cylinder fixed block, the positioning cylinder push chip cartridges to be close to positioning plate device.
Further specifically, the lifting module includes two lifting sliding rails being vertically arranged on workbench, is located at
The lifting that lifter slide on lifting sliding rail, the hoistable platform on lifter slide and driving lifter slide move up and down is driven
Motivation structure, the chip cartridges are set on hoistable platform.
Further specifically, the lift drive mechanism include the lifting motor for being set to lifting sliding rail end, with
Elevating screw, the feed screw nut on elevating screw of lifting motor rotation, the feed screw nut are fixed on lifter slide
On.
It is respectively upper solid further specifically, lifting sliding rail fixed plate is arranged in the end of the lifting sliding rail described in two
Fixed board and bottom plate, the lifting motor are set on upper mounted plate, the elevating screw be set to upper mounted plate with
Between bottom plate.
Further specifically, the ejection module includes the ejection cylinder being set on locating module, is located at ejection gas
Ejection connecting plate in cylinder shaft and the mandril on ejection connecting plate, the mandril is for ejecting one single chip.
Further specifically, ejection sliding rail is arranged on the locating module, it is arranged on the ejection connecting plate
Ejection slider, the ejection slider slide on ejection sliding rail.
Further specifically, ejection limit sensors are arranged on the ejection connecting plate, in the locating module
The upper detection sensor being arranged for detecting mandril position.
Further specifically, the push mould for chip cartridges to be released to locating module is arranged below the locating module
Block；The pushing module includes push cylinder, positioned at the pushing plate in push cylinder shaft end portion and for locating core film magazine
Chip cartridges are pushed at locating rack by locating rack, the pushing plate in the movement of locating module lower part.
The beneficial effects of the present invention are: after using above structure, by self-feeding unit by one single chip one
One submitting, realizes the automation of chip taking-up, does not use worker, to prevent wafer damage and be infected with grease stain
Problem reduces spoilage of chip during packing, improves production efficiency, reduces production cost.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention；
Fig. 2 is the structural schematic diagram of self-feeding unit of the present invention;
Fig. 3 is the enlarged structure schematic diagram at the position A in Fig. 2；
Fig. 4 is the structural schematic diagram of locating module of the present invention；
Fig. 5 is the structural schematic diagram one of present invention lifting module；
Fig. 6 is the structural schematic diagram two of present invention lifting module；
Fig. 7 is the structural schematic diagram of pushing module of the present invention；
Fig. 8 is the structural schematic diagram of supply unit of the present invention；
Fig. 9 is the structural schematic diagram that the present invention automatically grabs unit；
Figure 10 is the enlarged structure schematic diagram of part B in Fig. 9；
Figure 11 is the structural schematic diagram of present invention crawl lifting module and handling module；
Figure 12 is the schematic cross-sectional view of present invention crawl lifting module and handling module；
Figure 13 is the structural schematic diagram that the present invention stacks unit；
Figure 14 is the enlarged structure schematic diagram of C portion in Figure 13；
Figure 15 is the structural schematic diagram that the present invention stacks fixed cylinder assembly.
In figure: 1, rack；2, workbench；3, self-feeding unit；4, supply unit；5, unit is automatically grabbed；6, it stacks
Unit；7, chip；8, chip cartridges；31, locating module；32, module is gone up and down；33, module is ejected；34, pushing module；311, it positions
Plate；312, cylinder fixed block；313, positioning cylinder；314, feeding positioning plate；321, lifting sliding rail；322, lifter slide；323,
Hoistable platform；324, lifting motor；325, elevating screw；326, feed screw nut；331, cylinder is ejected；332, connecting plate is ejected；
333, mandril；334, sliding rail is ejected；335, ejection slider；336, limit sensors are ejected；337, detection sensor；341, it pushes
Cylinder；342, pushing plate；343, locating rack；41, conveying；42, conveyor module；43, the first feeding sensor；44, second
Feeding sensor；45, cylinder is conveyed；46, horn mouth；411, preceding section guide rail；412, rear section guide rail；413, groove；421, actively
Wheel；422, driven wheel；423, feeder motor；51, XY mobile module；52, crawl lifting module；53, handling module；54, bracket；
511, X axis electric cylinders；512, X axis slide plate；513, Y-axis electric cylinders；514, Y-axis guide rail；521, lifting sliding rail is grabbed；522,
Grab fixed plate；523, lifting cylinder is grabbed；531, rotary grasping device；532, gripper equipment；5311, rotating electric machine；5312,
Grab swivel plate；5313, rotary mount is grabbed；5314, rotary shaft is grabbed；5315, rotating belt is grabbed；5321, handgrip is solid
Determine block；5322, handgrip bar；5323, handgrip；5324, cylinder is grabbed；5325, impeller；5326, connecting rod is grabbed；5327, it rolls
Wheel assembly；5328, handgrip guide rail；5329, handgrip sliding block；53210, sliding block positioning screw；61, locating piece is stacked；62, magazine；
63, positioning cylinder component is stacked；64, fixed cylinder assembly is stacked；621, locating piece；622, positioning column；631, positioning gas is stacked
Cylinder；632, positioning plate is stacked；641, fixed block is stacked；642, rotary shaft is stacked；643, fixed plate is stacked；644, fixed gas is stacked
Cylinder.
Specific embodiment
The present invention is explained in detail with reference to the accompanying drawing.
A kind of chip package arranging machine as shown in Figure 1, the workbench 2 including rack 1 and in rack 1, in institute
On the workbench 2 stated be arranged self-feeding unit 3, for crawl chip 7 automatically grab unit 5, stack unit 6 and control
The control unit of arranging machine processed movement, the self-feeding unit 3 and automatically grabs real by supply unit 4 between unit 5
The conveying of existing chip 7, chip cartridges 8 is placed into self-feeding unit 3, self-feeding unit 3 automatically conveys one single chip 7
To supply unit 4, automatically grabs unit 5 and grab one single chip 7 and be placed in and stack unit 6, above-mentioned movement passes through control unit
Driving realizes the automation of screening, improves screening efficiency.
Self-feeding unit 3 as shown in Figure 2 includes going up and down for the locating module 31 of locating core film magazine 8, for chip cartridges 8
Lifting module 32 and for one single chip 7 export ejection module 33, the ejection module 33 eject first core
After piece 7, lifting module 32 realizes that downwards second chip 7 is placed on the ejection path of ejection module 33 by stepping；Such as Fig. 4 institute
Show that the locating module 31 includes being mounted on the positioning plate device of feeding fixed plate 314 and being set on positioning plate device to determine
Position air cylinder device；The positioning plate device is made of 4 L-shaped positioning plates 311, and the L shape of positioning plate 311 described in 4 is opened
Mouth inwardly forms the cavity for accommodating chip cartridges 8；The positioning cylinder device includes that the cylinder being set on positioning plate device is consolidated
Determine block 312 and the positioning cylinder 313 in cylinder fixed block 312, the positioning cylinder 313 pushes chip cartridges 8 to be close to
Positioning plate device.Firstly, chip cartridges 8 are placed in the cavity that 4 L shape positioning plates 311 surround, 4 L shape positioning plates 311 to
Four vertical sides of chip cartridges 8 are inside just blocked, later, by driving positioning cylinder 313 to make cylinder fixed block 312 close
Two of them complete positioning operation with the positioning plate 311 on side.
Ejection module 33 includes the ejection cylinder 331 being set on locating module 31, is located at ejection as shown in Figure 2 and Figure 3
Ejection connecting plate 332 on cylinder axis and the mandril 333 on ejection connecting plate 332, the mandril 333 is for ejecting
One single chip 7；Chip cartridges 8 eject module 33 at this time and move, firstly, control unit after the completion of being positioned by locating module 31
Control ejection cylinder 331 moves, and ejection cylinder axis drives ejection connecting plate 332 to move, and ejection connecting plate 332 drives mandril 333
Movement ejection is located on a chip 7 to supply unit 4 in chip cartridges 8；In order to guarantee the stability of the movement of mandril 333,
Setting ejection sliding rail 334 on the locating module 31, is arranged ejection slider 335 on the ejection connecting plate 332, described
Ejection slider 335 ejection sliding rail 334 on slide, ejection the corresponding position of connecting plate 332 setting ejection limit sensors
336 for incuding the position of mandril 333, meanwhile, it is arranged in the inlet of 31 upper ejector pin 333 of locating module for detecting mandril
The detection sensor 337 of 333 positions, ejection limit sensors 336 are used to limit the position of the ejection of mandril 333, arrive and refer to when ejection
Positioning postpones, and ejection limit sensors 336 transmit signal to control unit, and control unit control ejection cylinder 331 is to mandril 333
Backhaul action is carried out, and after mandril 333 is fully drawn out from the inlet of 31 upper ejector pin 333 of locating module, detection sensor 337
Detect that mandril 333 extracts signal out and passes to control unit, control unit control lifting module 32 makees decline behaviour to chip cartridges 8
Make, meanwhile, control unit controls positioning cylinder 313 and unclamps chip cartridges 8, after chip cartridges 8 drop to a certain position, control unit
Control positioning cylinder 313 retightens chip cartridges 8.
Lifting module 32 includes two lifting sliding rails 321 being vertically arranged on workbench 2, is located at as shown in figs. 5 and 6
Lifter slide 322 on lifting sliding rail 321, the hoistable platform 323 on lifter slide 322 and driving lifter slide 322
The lift drive mechanism of up and down motion, the chip cartridges 8 are set on hoistable platform 323；The lift drive mechanism packet
It includes and is set to the lifting motor 324 of 322 end of lifting sliding rail, the elevating screw 325 rotated with lifting motor 324, is located at liter
Feed screw nut 326 on lead screw 325 drops, and the feed screw nut 326 is fixed on lifter slide 322；The liter described in two
Lifting sliding rail fixed plate, respectively upper mounted plate and bottom plate, the lifting motor 324 is arranged in the end for dropping sliding rail 321
It is set on upper mounted plate, the elevating screw 325 is set between upper mounted plate and bottom plate.When needing to chip cartridges
When the chip 7 of the second layer carries out ejection operation in 8, chip cartridges 8 is needed to drop to the position, at this point, control unit control lifting
Motor 324 moves, and the rotation of lifting motor 324 drives elevating screw 325 to rotate, and elevating screw 325 passes through 326 band of feed screw nut
Dynamic lifter slide 322 makees descending motion, drops to control 324 stop motion of lifting motor of designated position control unit；Lifting is flat
The platform board that platform 323 is fixed on lifter slide 322 by two forms, and platform board is in a strip shape, and chip cartridges 8 are across in two platform boards
On.Lift drive mechanism can also be presented by other structures form, such as servo motor driving lead screw or stepper motor drive
The modes such as dynamic.
Empty chip cartridges 8 are taken out in time for convenience, is arranged below the locating module 31 is used for as shown in Figure 7
Chip cartridges 8 are released to the pushing module 34 of locating module 31；The pushing module 34 includes push cylinder 341, is located at push
The pushing plate 342 of cylinder axis end and locating rack 343 for locating core film magazine 8, the pushing plate 342 is in locating module 31
Chip cartridges 8 are pushed at locating rack 343 by lower part movement.When hoistable platform 323 drops to extreme lower position, at this time in chip cartridges 8
The all ejections of chip 7, control unit control push cylinder 341 and move, push cylinder 341 drive pushing plate 342 by chip cartridges 8 from
The lower section of locating module 31 is pushed at locating rack 343, at this point, can be by manually taking out chip cartridges 8.
Supply unit 4 as shown in Figure 8 includes two conveyings 41 disposed in parallel, the conveying on conveying 41
Module 42, the conveyor module 42 push chip 7 to slide into designated position on conveying 41；The conveying 41
It being composed of preceding section guide rail 411 and rear section guide rail 412, the conveyor module 42 is located at the front end of preceding section guide rail 411,
The groove 413 for facilitating 5323 grab chips 7 of handgrip is offered in the rear section guide rail 412；Groove 413 is set as 4 in phase
Pair two after it is each in section guide rail 412 there are two；The conveyor module 42 includes driving wheel 421, driven wheel 422 and driving
The feeder motor 423 that driving wheel 421 rotates, the chip 7 pass through between driving wheel 421 and driven wheel 422 and realize transmission；
Conveyor module 42 have 2 groups be located at two described on conveying 41；Between the conveying 41 described in two into
Lower section setting at mouthful is used for the first feeding sensor 43 of induction chip 7；It is arranged between the conveying 41 described in two
For the second feeding sensor 44 and conveying cylinder 45 of induction chip 7, second feeding sensor 44 is set to defeated
It supplies gas on the cylinder axis of cylinder 45；A step is not arranged respectively in the opposite position top part of conveying 41 described in two, described
Chip 7 moves on step；Horn mouth 46 is set as in the entrance of the step.Supply unit 4 is entered in chip 7
When, chip 7 is received to step by horn mouth 46, chip 7 is propped up by two opposite steps, the first feeding sensor
43 sense that chip 7 enters on conveying 41, and control unit controls feeder motor 423 and moves, and feeder motor 423 passes through skin
Band drives driving wheel 421 to rotate, and driven wheel 422 is located at the top of driving wheel 421, and chip 7 passes through driving wheel 421 and driven wheel
It is entered between 422 in conveying 41,421 driving chip 7 of driving wheel, chip 7 drives driven wheel 422 to rotate, driven wheel 422
Main purpose is that so that it will not takeoff upwards to 7 pressure of chip；And it conveys cylinder 45 and is passed the second conveying according to the length of chip 7
Sensor 44 is set in designated position, and chip 7 enters the lower section for automatically grabbing unit 5, and when chip 7 leaves the second conveying completely
When sensor 44, signal is passed to control unit by the second feeding sensor 44, and control unit control automatically grabs the movement of unit 5
Grab chips 7；Convey cylinder 45 can according to 7 specification size of chip, be arranged and rapidly adjustment crawl the time, raising chip 7 into
The efficiency of row screening；And the track baffle for blocking chip 7 is set in the end of delivery track 41, prevent chip 7 from track
End is directly run out of, and using effect is influenced.
The crawl that unit 5 includes XY mobile module 51, moves horizontally with XY mobile module 51 is automatically grabbed as shown in Figure 9
Go up and down module 52 and as crawl goes up and down the vertically movable handling module 53 of module 52,53 grab chips of handling module
7 send to stacking unit 6；The XY mobile module 51 includes X axis mobile device and Y-axis mobile device, the X-axis
It include the X axis electric cylinders 511 being arranged in Y-axis mobile device and the X axis in X axis electric cylinders 511 to mobile device
Slide plate 512, the crawl lifting module 52 are set on X axis slide plate 512；The Y-axis mobile device includes setting
In Y-axis electric cylinders 513 and Y-axis guide rail 514, the first Y-axis slide plate for being set in Y-axis electric cylinders 513 on bracket 54
And it is set to the second Y-axis slide plate on Y-axis guide rail 514, the Y-axis electric cylinders 513 are parallel with Y-axis guide rail 514
Setting, the X axis electric cylinders 511 are across on Y-axis electric cylinders 513 and Y-axis guide rail 514 and are set to the first Y-axis and slide
On plate and the 2nd Y axial direction slide plate；Crawl lifting module 52 includes being set on XY mobile module 51 as shown in Figure 10
Grab lifting sliding rail 521, the crawl lifting slider on crawl lifting sliding rail 521, the crawl on crawl lifting slider
Fixed plate 522 and driving crawl fixed plate 522 is set on XY mobile module 51 with the crawl liter of crawl lifting slider movement
Sending down abnormally ascending cylinder 523；Firstly, chip 7 enters the lower section for automatically grabbing unit 5 by supply unit 4, it is mobile that control unit controls XY
X axis electric cylinders 511 and Y-axis electric cylinders 513 in module 51 drive crawl lifting module 52 and handling module 53 to move to
Designated position, at this time control unit control X axis electric cylinders 511 and 513 stop motion of Y-axis electric cylinders, control crawl lifting air
Cylinder 523 acts, and crawl lifting cylinder 523 drives crawl fixed plate 522 to move down on lifting sliding rail 521, grabs fixed plate
522 drive handling modules 53 move downward grab chips 7, and later, control unit control crawl lifting cylinder 523 drives crawl solid
Fixed board 522 and handling module 53 move up, meanwhile, control unit controls X axis electric cylinders 511 and Y-axis electric cylinders 513 are transported
It is dynamic, it drives crawl lifting module 52 and handling module 53 to move to and stacks 6 top of unit, at this point, control unit control crawl
Lifting cylinder 523 drives handling module 53 to move downward, and chip 7 is placed on by handling module 53 to be stacked in unit 6.
The handling module 53 as shown in Figure 11 and Figure 12 includes the rotary grasping device 531 being set in crawl lifting module 52
And the gripper equipment 532 on rotary grasping device 531；The rotary grasping device 531 includes being fixed on crawl admittedly
Rotating electric machine 5311 on fixed board 522 and the crawl swivel plate 5312 driven by rotating electric machine 5311；In the electric rotating
Setting crawl transmission component between machine 5311 and crawl swivel plate 5312, crawl transmission component are arranged in crawl fixed plate 522,
The crawl transmission component includes the crawl rotation for grabbing rotary mount 5313, being set in crawl rotary mount 5313
Axis 5314, the crawl rotating belt 5315 being connected on crawl rotary shaft 5314 and rotating electric machine 5311, grab swivel plate 5312
It is fixed on the end of crawl rotary shaft 5314；The gripper equipment 532 includes the handgrip component and use for grab chips 7
The crawl cylinder assembly of grasping movement is realized in driving handgrip 5323.Control unit drives handgrip component by crawl cylinder assembly
Chip 7 is grabbed, crawl lifting module 52 lifts handling module 53, at this point, control unit control rotating electric machine 5311 rotates,
Rotating electric machine 5311 drives crawl swivel plate 5312 to rotate to specific bit by crawl rotating belt 6315, crawl rotary shaft 5314
It sets, meanwhile, crawl lifting module 52 and handling module 53 are moved to and are stacked at unit 6, and control unit controls handgrip component will
Chip 7, which is placed on, to be stacked at unit 6.
Handgrip component as shown in figure 12 includes 4 handgrip fixed blocks 5321 being connected on rotary grasping device 531, setting
In the handgrip bar 5322 on handgrip fixed block 5321 and the handgrip 5323 being set on handgrip bar 5322；The crawl cylinder
Component includes the impeller 5325 for grabbing cylinder 5324, being set to crawl cylinder axis end, 5325 one end of impeller
Tapered, the crawl cylinder 5324 passes through the crawl connecting rod 5326 being set on crawl cylinder axis and connects impeller
5325, the crawl connecting rod 5326 passes through the center of crawl rotary shaft 5314, connects in crawl rotary shaft 5314 and crawl
Gap is set between bar 5326, guarantees that crawl connecting rod 5326 can axially be moved up and down in crawl rotary shaft 5314；Described in 4
Handgrip bar 5322 is in cross-shaped arrangement, wherein 2 handgrip bars 5322 are in the X axis arrangement of horizontal plane and conllinear, other 2 handgrips
Bar 5322 in the Y-axis arrangement of horizontal plane and conllinear, the impeller 5325 be set to 4 described in the formation of handgrip bar 5322
Criss-cross middle position, the impeller 5325 pushes one end of handgrip bar 5322 simultaneously to make its other end solid around handgrip
Determine the small-scale rotation of block 5321.Since chip 7 is more fragile, directly grabs, impact according to cylinder control handgrip 5323
Power is larger to will have a direct impact on chip 7, therefore pushes impeller 5325 to move up and down by crawl cylinder 5324, and impeller 5325
The conical surface pushes one end of handgrip bar 5322 to be rotated down, and the other end of handgrip bar 5322 is grabbed according to the lever principle realization that is upturned
Release is taken to operate, when needing to grab, crawl cylinder 5324 bounces back, so that impeller 5325 moves upwards, the conical surface is moved upwards,
Handgrip bar 5322 drives handgrip 5323 to close up simultaneously grab chips 7 since 5322 other end of gravity handgrip bar moves downward；Into
One step improves impeller 5325 and handgrip bar 5322 to guarantee to reduce friction between impeller 5325 and handgrip bar 5322
Service life, the handgrip bar 5322 close to impeller 5325 one end be arranged roll wheel assembly 5327, the idler wheel
Component 5327 includes the rotary shaft being fixed on handgrip bar 5322 and the idler wheel being set in rotary shaft, the end of handgrip bar 5322
Portion is outwardly formed the extension end of U-shaped, and the rotary shaft is arranged between extension end, and the idler wheel turns in the extension end of U-shaped
It is dynamic；The taper-face contact of the idler wheel and impeller 5325；Idler wheel rolls on the conical surface of impeller 5325, and sliding friction is changed
For rolling friction, using effect is improved.
Further, in order to adjusting the position of handgrip 5323, improve the quantity of 5323 grab chips of handgrip, 7 specification and
It can be realized quick adjusting, the tune for adjusting 5323 position of handgrip be set between the handgrip bar 5322 and handgrip 5323
Whole group part；The adjustment component include the handgrip guide rail 5328 being set on handgrip bar 5322 and be located at handgrip guide rail 5328
On handgrip sliding block 5329, the handgrip 5323 is set on handgrip sliding block 5329；In the lower section of the handgrip bar 5322
Equipped with the sliding block positioning screw 53210 for positioning handgrip sliding block 5329；Handgrip sliding block 5329 drives handgrip 5323 can be in handgrip
It slides on guide rail 5328, when sliding into designated position, is fixed by sliding block positioning screw 53210, realize and quickly adjust；For
Realize automation adjustment, the form that cylinder promotion can be used carries out.
Unit 6 is stacked as shown in figure 13 to include the stacking locating piece 61 being set on workbench 2, be set to stacking locating piece
The fixed device of stacking on 61 for holding the magazine 62 of chip 7 and stacking locating piece 61 for positioning and fixing；Described
Stacking fixed device includes stacking positioning cylinder component 63 and the fixed cylinder assembly 64 of stacking, the stacking positioning cylinder group
Part 63 includes the stacking positioning plate 632 stacked positioning cylinder 631 and be set to stacking positioning cylinder shaft end；Institute as shown in figure 15
The fixed cylinder assembly 64 of stacking include the stacking fixed block 641 being set on workbench 2, be set to and stack on fixed block 641
Stacking rotary shaft 642, be set to stack rotary shaft 642 on stacking fixed plate 643 and push stack fixed plate 643 rotate
The fixed cylinder 644 of stacking, stack fixed block 641 and stack reset spring is set between fixed plate 642, for fixing stacking
When cylinder 644 leaves stacking fixed plate 642, it can automatically reset；Stacking positioning plate 532 it is L-shaped；The stacking is fixed
Plate 642 is L-shaped for fixed one end for stacking locating piece 61.The magazine 62 can be set to multiple, we as needed
Case is set as four, is equipped with locating piece 621 by the magazine 62 as shown in figure 14, and positioning is equipped on the magazine 62
Column 622, the positioning column 622 and locating piece 621 cooperate；Location hole, the positioning column are set on the locating piece 621
622 insertion location holes realize positioning.It is stacked on locating piece 61 firstly, magazine 62 is placed into, passes through positioning column 622 and location hole
It realizes magazine 62 and stacks the positioning of locating piece 61, control unit is right by stacking the driving stacking positioning plate 632 of positioning cylinder 631
It stacks locating piece 61 to be positioned, the fixed driving of cylinder 644 of control stacking later is stacked fixed plate 643 and rotated, stacking fixed plate
643 L-shaped ends are stuck on the edge for stacking locating piece 61, and after fixed complete, control unit is by automatically grabbing list
First 5 grab chips 7 simultaneously arrange the corresponding position that chip 7 is placed into magazine 62.
To sum up, the chip package arranging machine is used, by taking out chip, transport chip, transfer chip and solid
Determine chip form and realize automatic operation, improves the efficiency of practical screening, save a large amount of manpower.
It is emphasized that: the above is only presently preferred embodiments of the present invention, not make in any form to the present invention
Limitation, any simple modification, equivalent change and modification to the above embodiments according to the technical essence of the invention,
All of which are still within the scope of the technical scheme of the invention.
Claims (10)
1. a kind of self-feeding unit of chip package arranging machine, which is characterized in that including determining for locating core film magazine (8)
Position module (31), the lifting module (32) for chip cartridges (8) lifting and the ejection module for one single chip (7) output
(33), for the ejection module (33) after ejecting first chip (7), lifting module (32) realizes downwards stepping by second
A chip (7) is placed on the ejection path of ejection module (33).
2. the self-feeding unit of chip package arranging machine according to claim 1, which is characterized in that the positioning
Module (31) includes positioning plate device and is set to positioning cylinder device on positioning plate device；The positioning plate device is by 4
The L shape opening of a L-shaped positioning plate (311) composition, positioning plate (311) described in 4 inwardly forms the chamber for accommodating chip cartridges (8)
Body.
3. the self-feeding unit of chip package arranging machine according to claim 2, which is characterized in that the positioning
Air cylinder device includes the cylinder fixed block (312) being set on positioning plate device and determines on cylinder fixed block (312)
Position cylinder (313), the positioning cylinder (313) push chip cartridges (8) to be close to positioning plate device.
4. the self-feeding unit of chip package arranging machine according to claim 1, which is characterized in that the lifting
Module (32) includes two lifting sliding rails (321) being vertically arranged on workbench (2), the liter on lifting sliding rail (321)
Slide plate (322), the hoistable platform (323) being located on lifter slide (322) and driving lifter slide (322) up and down motion are dropped
Lift drive mechanism, the chip cartridges (8) are set on hoistable platform (323).
5. the self-feeding unit of chip package arranging machine according to claim 4, which is characterized in that the lifting
Driving mechanism includes the lifting motor (324) for being set to lifting sliding rail (321) end, with the liter of lifting motor (324) rotation
The feed screw nut (326) for dropping lead screw (325), being located on elevating screw (325), the feed screw nut (326) are fixed on lifting
On slide plate (322).
6. the self-feeding unit of chip package arranging machine according to claim 5, which is characterized in that described in two
The end of lifting sliding rail (321) lifting sliding rail fixed plate, respectively upper mounted plate and bottom plate, the lifting electricity are set
Machine (324) is set on upper mounted plate, and the elevating screw (325) is set between upper mounted plate and bottom plate.
7. the self-feeding unit of chip package arranging machine according to claim 1, which is characterized in that the ejection
Module (33) includes the ejection cylinder (331) being set on locating module (31), the ejection connecting plate on ejection cylinder axis
(332) and it is located at the mandril (333) ejected on connecting plate (332), the mandril (333) is for ejecting one single chip (7).
8. the self-feeding unit of chip package arranging machine according to claim 7, which is characterized in that determine in described
Setting ejection sliding rail (334) in position module (31), is arranged ejection slider (335) on the ejection connecting plate (332), described
Ejection slider (335) ejection sliding rail (334) on slide.
9. the self-feeding unit of chip package arranging machine according to claim 7 or 8, which is characterized in that described
Ejection connecting plate (332) on setting ejection limit sensors (336), on the locating module (31) be arranged for detecting
The detection sensor (337) of mandril (333) position.
10. the self-feeding unit of chip package arranging machine according to claim 1, which is characterized in that described
Chip cartridges (8) for being released the pushing module (34) of locating module (31) by setting below locating module (31)；The push
Module (34) includes push cylinder (341), positioned at the pushing plate (342) in push cylinder shaft end portion and for locating core film magazine
(8) chip cartridges (8) are pushed into locating rack in the movement of locating module (31) lower part by locating rack (343), the pushing plate (342)
(343) at.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811333235.7A CN109449110A (en) | 2018-11-09 | 2018-11-09 | A kind of self-feeding unit of chip package arranging machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811333235.7A CN109449110A (en) | 2018-11-09 | 2018-11-09 | A kind of self-feeding unit of chip package arranging machine |
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| Publication Number | Publication Date |
|---|---|
| CN109449110A true CN109449110A (en) | 2019-03-08 |
Family
ID=65551326
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811333235.7A Pending CN109449110A (en) | 2018-11-09 | 2018-11-09 | A kind of self-feeding unit of chip package arranging machine |
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| Country | Link |
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| CN (1) | CN109449110A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115754671A (en) * | 2022-11-16 | 2023-03-07 | 江苏振宁半导体研究院有限公司 | Detection device and method for chip production |
| CN117524958A (en) * | 2024-01-08 | 2024-02-06 | 四川晁禾微电子有限公司 | Semiconductor packaging chip discharging device |
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| CN104876042A (en) * | 2015-04-22 | 2015-09-02 | 徐大林 | Transferring mechanism |
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| JPH0768441A (en) * | 1993-09-06 | 1995-03-14 | Sony Corp | Positioning device |
| CN201804900U (en) * | 2010-10-14 | 2011-04-20 | 深圳市新益昌自动化设备有限公司 | Automatic loading/unloading system for LED equipment |
| CN102820248A (en) * | 2012-08-15 | 2012-12-12 | 先进光电器材（深圳）有限公司 | Feeding system of die bonder |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115754671A (en) * | 2022-11-16 | 2023-03-07 | 江苏振宁半导体研究院有限公司 | Detection device and method for chip production |
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| CN117524958A (en) * | 2024-01-08 | 2024-02-06 | 四川晁禾微电子有限公司 | Semiconductor packaging chip discharging device |
| CN117524958B (en) * | 2024-01-08 | 2024-03-08 | 四川晁禾微电子有限公司 | Semiconductor packaging chip discharging device |
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