CN108437455A - More Laser Scannings for increasing material manufacturing - Google Patents
More Laser Scannings for increasing material manufacturing Download PDFInfo
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- CN108437455A CN108437455A CN201810403444.8A CN201810403444A CN108437455A CN 108437455 A CN108437455 A CN 108437455A CN 201810403444 A CN201810403444 A CN 201810403444A CN 108437455 A CN108437455 A CN 108437455A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/141—Processes of additive manufacturing using only solid materials
- B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2791/00—Shaping characteristics in general
- B29C2791/004—Shaping under special conditions
- B29C2791/009—Using laser
Abstract
The present invention relates to a kind of more Laser Scannings for increasing material manufacturing, according to the position relationship of each laser scanning head in more laser scanning systems, each discrete layer obtained after being sliced to threedimensional model carries out corresponding scanning area division, the Overlap-scanning line for corresponding adjacent laser probe common scan is formed between adjacent scan areas per layer scattering layer, the Overlap-scanning line is non-rectilinear；Projection of at least partly Overlap-scanning line on adjacent discrete layer Overlap-scanning line corresponding on the adjacent discrete layer at least one layer of discrete layer is misaligned.The present invention can be substantially reduced because sintering energy concentrates the apparent splicing trace brought and performance to decline, to improve more laser sintering and moulding workpiece surface qualities and properties.
Description
Technical field
The present invention relates to selective laser sintering fields, and in particular to a kind of more laser scanning sides for increasing material manufacturing
Method.
Background technology
The basic process of selective laser sintering technique is：According to parts to be formed, corresponding threedimensional model is built,
And hierarchy slicing and discrete processes are executed to the model, thus to obtain the model silhouette of each discrete layer.Dust feeder is by one
Powder quantitatively is sent to work top, and one layer of dusty material is laid on moulding cylinder by power spreading device, and heating device heats powder
To the temperature of setting, galvanometer system control laser is scanned powder bed according to the cross section profile of first layer discrete layer, makes
Powder melts and realizes bonding；After the first layer cross section has been sintered, workbench declines the thickness of a layer, and power spreading device is having become
Uniformly densely powder, the scanning for carrying out a new layer cross section are sintered layer overlay on the section of type, if the scanning superposition of warp dried layer, directly
To the entire raw basin of completion.
In above-mentioned technical process, a laser is usually controlled by a galvanometer system to realize the scanning of whole cross section
Sintering.With the development of industrialization and laser printing technology, the area of section in sinter molding region gradually increases, in addition to molding
The continuous promotion of efficiency requirements, traditional list is laser sintered to have cannot be satisfied demand, therefore the scanning of more laser subregions sinters into
It is selective laser moulding process for of new generation moulding process of the increasing material manufacturing towards high efficiency, large scale and batch micro operations
The new trend of development.
Unavoidably there are the scannings of adjacent scan areas to overlap line for the scanning of multi-laser subregion, i.e., is swept for adjacent laser
The Overlap-scanning line for retouching a common scan, due to exist repeat be sintered, the stress of scanning area is larger, and surface quality also compared with
Difference.
Invention content
Based on this, it is necessary to provide a kind of reduction splicing regions stress and improve splicing regions surface quality for increasing
More Laser Scannings of material manufacture.
A kind of more Laser Scannings for increasing material manufacturing, according to the position of each laser scanning head in more laser scanning systems
Relationship is set, each discrete layer obtained after being sliced to threedimensional model carries out corresponding scanning area division, per the adjacent of layer scattering layer
The Overlap-scanning line for corresponding adjacent laser probe common scan is formed between scanning area, the Overlap-scanning line is non-
Straight line；Projection of at least partly Overlap-scanning line on adjacent discrete layer at least one layer of discrete layer is corresponding on the adjacent layer
Overlap-scanning line it is misaligned.
The present invention, and will be in an at least layer scattering layer by the study found that by setting Overlap-scanning line to non-rectilinear
At least partly Overlap-scanning line be set as the Overlap-scanning line corresponding on the adjacent layer of the projection on adjacent discrete layer not
It overlaps, can significantly avoid concentrating the apparent splicing trace brought because of sintering energy, to improve more laser sintering and moulding workpiece tables
Face quality, and the performance because repeating sintering belt can significantly be avoided to decline, improve the thermal property of splicing regions, to improve
The mechanical property of splicing regions reduces deformation and the stress of workpiece.
Throwing of all Overlap-scanning lines at least one layer of discrete layer on adjacent discrete layer in one of the embodiments,
Shadow Overlap-scanning line corresponding on the adjacent layer is misaligned.
Throwing of at least partly Overlap-scanning line in all discrete layers on adjacent discrete layer in one of the embodiments,
Shadow Overlap-scanning line corresponding on the adjacent layer is misaligned.
In one of the embodiments, projection of all Overlap-scanning lines on adjacent discrete layer in all discrete layers with
Corresponding Overlap-scanning line is misaligned on the adjacent layer.
All Overlap-scanning lines in all discrete layers are corresponding on projection and this other discrete layers on other discrete layers
Overlap-scanning line it is misaligned.
In one of the embodiments, it is described it is misaligned for part it is misaligned and completely it is misaligned in one kind.
The corresponding Overlap-scanning wire shaped of adjacent discrete layer differs in one of the embodiments,.
In one of the embodiments, per the shape of the Overlap-scanning line on layer scattering layer in multistage broken line and curve
At least one.
There is between the adjacent scan areas of every layer scattering layer scanning overlap in one of the embodiments, it is corresponding
The Overlap-scanning line of adjacent laser probe is located in the scanning overlap.
In one of the embodiments, projection of the scanning overlap on adjacent discrete layer wherein in a layer scattering layer with
Corresponding scanning overlap overlaps on the adjacent layer.
In one of the embodiments, after being scanned region division, each laser scanning in more laser scanning systems
Head obtains the path coordinate of corresponding Overlap-scanning line in each discrete layer, and according to corresponding Overlap-scanning line in each discrete layer
Path coordinate successively scans its corresponding scanning area.
Description of the drawings
Fig. 1 is schematic top plan view when 1 method using the present invention of embodiment carries out first layer cross-sectional scans；
Fig. 2 is schematic top plan view when 1 method using the present invention of embodiment carries out second layer cross-sectional scans；
Fig. 3 is schematic top plan view when 1 method using the present invention of embodiment carries out third layer scanning cross-section；
Fig. 4 is schematic side view when 1 method using the present invention of embodiment is scanned molding；
Fig. 5 is schematic top plan view when 2 method using the present invention of embodiment is scanned molding；
Fig. 6 is schematic side view when 2 method using the present invention of embodiment is scanned molding.
Specific implementation mode
To facilitate the understanding of the present invention, below with reference to relevant drawings to invention is more fully described.In attached drawing
Give presently preferred embodiments of the present invention.But the present invention can realize in many different forms, however it is not limited to this paper institutes
The embodiment of description.Keep the understanding to the disclosure more thorough on the contrary, purpose of providing these embodiments is
Comprehensively.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the present invention
The normally understood meaning of technical staff is identical.Used term is intended merely to description tool in the description of the invention herein
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein "and/or" includes one or more phases
Any and all combinations of the Listed Items of pass.
The present invention provides more Laser Scannings for increasing material manufacturing of an embodiment, according to more laser scanning systems
The position relationship of each laser scanning head in system, each discrete layer obtained after being sliced to threedimensional model carry out corresponding scanning area and draw
Point, the Overlap-scanning for corresponding adjacent laser probe common scan is formed between the adjacent scan areas per layer scattering layer
Line, the Overlap-scanning line are non-rectilinear；At least partly Overlap-scanning line at least one layer of discrete layer is on adjacent discrete layer
Projection Overlap-scanning line corresponding on the adjacent layer it is misaligned.
Wherein, it is misaligned for part it is misaligned and completely it is misaligned in one kind.
The Overlap-scanning line of traditional technology is generally straight line, and the Overlap-scanning line in a layer scattering layer is in adjacent discrete layer
On corresponding on the adjacent layer Overlap-scanning line of projection be usually coincidence, thus sintering energy is excessively concentrated, and can be caused
Overlap-scanning regional stress and heat can not disperse, to affect the surface quality and mechanical property of product.Traditional technology has
Projection rotation respective angles of the linear type Overlap-scanning line in one layer scattering layer on adjacent discrete layer are obtained into adjacent layer pair
The Overlap-scanning line answered, practice have shown that, the splicing regions thermal property which scans the molding workpiece of sintering method improves
Limited, there are still larger deformation and stress for the splicing regions of workpiece.
The present invention, and will be in an at least layer scattering layer by the study found that by setting Overlap-scanning line to non-rectilinear
At least partly Overlap-scanning line be set as the Overlap-scanning line corresponding on the adjacent layer of the projection on adjacent discrete layer not
It overlaps, can substantially reduce because sintering energy concentrates the apparent splicing trace brought, to improve more laser sintering and moulding workpiece tables
Face quality, and can substantially reduce because the performance for repeating sintering belt declines, improve the thermal property of splicing regions, to improve
The mechanical property of splicing regions reduces deformation and the stress of workpiece.
In other embodiments, projection of all Overlap-scanning lines on adjacent discrete layer at least one layer of discrete layer
Overlap-scanning line corresponding on the adjacent layer is misaligned.It can be further reduced because sintering energy concentrates the workpiece surface brought
Quality and performance decline, and improve the mechanical property of splicing regions.
In other embodiments, projection of at least partly Overlap-scanning line in all discrete layers on adjacent discrete layer
Overlap-scanning line corresponding on the adjacent layer is misaligned.Also it can be further reduced because sintering energy concentrates the workpiece table brought
Face quality and performance decline, and improve the mechanical property of splicing regions.
In the present embodiment, projection of all Overlap-scanning lines on adjacent discrete layer in all discrete layers and the phase
Corresponding Overlap-scanning line is misaligned on adjacent bed.It can be greatly decreased because sintering energy concentrates the workpiece surface quality brought and property
It can decline, to greatly improve the mechanical property of splicing regions.
Further, in the present embodiment, all Overlap-scanning lines in all discrete layers are on other discrete layers
Projection Overlap-scanning line corresponding on other discrete layers is completely misaligned.It can utmostly reduce because sintering energy is concentrated
The workpiece surface quality and performance brought declines, to utmostly improve the mechanical property of splicing regions.
It wherein, can be corresponding on setting realization adjacent layer by mutually staggering adjacent discrete layer corresponding Overlap-scanning line
Overlap-scanning line is misaligned.Thus the corresponding Overlap-scanning wire shaped of adjacent discrete layer can be identical, can also differ.
In the present embodiment, the corresponding Overlap-scanning wire shaped of adjacent discrete layer differs, and can be further reduced because burning
Knot energy concentrates the workpiece surface quality brought and performance to decline, and improves the mechanical property of splicing regions.
Further, in the present embodiment, per layer scattering layer on Overlap-scanning line shape be selected from multistage broken line and
At least one of curve.Practice have shown that compared with the Overlap-scanning line of linear, shape is the scanning of multistage broken line and curve
Splicing line sintering energy is more dispersed.
In the present embodiment, there is scanning overlap between the adjacent scan areas of every layer scattering layer, it is corresponding adjacent
The Overlap-scanning line of laser scanning head is located in the scanning overlap.Setting scanning overlap, is conducive to rationally control each scanning
The size in region and convenient for position Overlap-scanning line position.
In the present embodiment, wherein projection and the phase of the scanning overlap on adjacent discrete layer in a layer scattering layer
Corresponding scanning overlap overlaps on adjacent bed.
In the present embodiment, after being scanned region division, make each laser scanning head in more laser scanning systems
The path coordinate for obtaining corresponding Overlap-scanning line in each discrete layer, control each laser scanning head to its corresponding scanning area into
Row successively scans, you can three-dimension object needed for molding.
Herein, common scan includes that scanning element overlaps or scan energy coincidence.
It is specific embodiment below
Embodiment 1
~Fig. 3 is please referred to Fig.1, the present embodiment uses two sets of galvanometer systems, galvanometer system 1 and galvanometer system 2, each galvanometer
System can be two axis combination field scarnning mirror systems, can also be three axis dynamic focusing scanning systems；To a certain discrete layer
After cross section profile carries out region division according to corresponding galvanometer system, each corresponding laser pair of galvanometer system independent control
The solid section powder bed of its corresponding region is scanned, make powder melt and it is Nian Jie with following molded part realization.
The corresponding forming area of galvanometer system independent scan is often covered, shaping area, another party on the one hand can be increased
Face can reduce housing depth to reduce device height, and two sets of galvanometer systems when being molded area requirements under the same conditions
System simultaneously or it is orderly be scanned, sintering sweep time can be obviously saved, to improve the shaping efficiency of entire workpiece.It must
Right, when using two sets and the above scanning system, there is the Bonding Problem between scanning partitioned area.
There are the regions that two sets of galvanometer systems can be carried out scanning, i.e. galvanometer system 1 between two sets of galvanometer systems
Projection of the scanning laser beam 3 sent out respectively in rotation limit position with the laser head of galvanometer system 2 on 4 surface of workpiece to be formed
Lap referred to as scans overlap 5, and scanning overlap 5 can be the shape of rule, can also be irregular shape；
This scanning overlap 5 can be the forming area of entire workpiece, can also be the subregion in forming area.Two sets of galvanometer systems
The scanning laser beam 3 of system can be overlapped or be spliced scanning in any position in scanning overlap 5.In present embodiment,
What is formed in scanning overlap 5 is an Overlap-scanning line 6, which is classified as first area and the secondth area
Domain, first area are scanned by first laser device, and second area is scanned by second laser.
More Laser Scannings for increasing material manufacturing of the present embodiment, include the following steps：
The first step calculates according to setting thickness parameter for shaping workpiece model and obtains workpiece successively scan slice information.
Second step is obtained according to the position relationship of the laser scanning head in double excitation galvanometer system after being sliced to threedimensional model
Each discrete layer obtained carries out corresponding scanning area division, is formed between the adjacent scan areas per layer scattering layer and supplies corresponding phase
The Overlap-scanning line 6 of adjacent laser scanning head common scan.
Third walks, and overlaps scanning area width and amount of lap with reference to setting, it then follows specific algorithm software is swept
Retouch the path coordinate of splicing line 6；
4th step finally controls double corresponding lasers of galvanometer system independent control by control software and is cut according to every layer
Piece information is scanned the powder in the scanning area that respectively divides, and powder is made to melt and be realized with following molded part
Bonding forms workpiece.
Attached drawing 1 is the schematic top plan view that the present embodiment carries out first layer cross-sectional scans.In currently sintering powder bed, two sets are shaken
The Overlap-scanning line 6 of mirror system is not single straightway or oblique line, it then follows software algorithm calculates sweeping for the Overlap-scanning line 6 obtained
Retouch path, the coordinate value of the Overlap-scanning lines 6 of two sets of galvanometer systems in the crosspoint of entire splicing regions is changing, and has
The XY coordinate values that body shows as each point of Overlap-scanning line are variations, and the variation relation of XY values is nor specific or line
Property, these splice points are connected the splicing line that will appear as one in more broken lines by simulation ground.
Attached drawing 2 is the schematic top plan view that the present embodiment carries out second layer cross-sectional scans.In currently sintering powder bed, scanning is spelled
Wiring 6 is nor single straight line or oblique line, but multistage broken line section, also, the Overlap-scanning line 6 of the second layer is on the first layer
Projection and first layer on Overlap-scanning line 6 completely it is misaligned.
Attached drawing 3 is the schematic top plan view that the present embodiment carries out third layer cross-sectional scans.In currently sintering powder bed, scanning is spelled
Wiring 6 is nor single straight line or oblique line, but multistage broken line section, also, the Overlap-scanning line 6 of third layer is on the first layer
Projection and first layer on Overlap-scanning line 6 it is completely misaligned, the projection of the Overlap-scanning line 6 of third layer on the second layer with
Overlap-scanning line 6 on the second layer is also completely misaligned.
4 scan method according to the invention of attached drawing, completes the laser scanning of remaining all powder layer, this obtained implementation
The schematic side view of the shaping workpiece of example.In the present embodiment, since all Overlap-scanning lines in all discrete layers are at other
Corresponding Overlap-scanning line is completely misaligned on projection and this other discrete layers on discrete layer, thus the molding workpiece of institute exists
Obtained longitudinal spliced line 7 on longitudinal section is nor single vertical segment, and the longitudinal spliced line can be more broken lines after simulation
Section, can also be more curved sections.The present embodiment is fitted to more broken lines.
Comparative example 1
A kind of more Laser Scannings for increasing material manufacturing of comparative example, it is essentially identical with 1 method of embodiment, no
It is only that with point, projection of the Overlap-scanning line in all discrete layers on other discrete layers and the scanning on other discrete layers
Splicing line is completely superposed and is straight line.
Comparative example 2
A kind of more Laser Scannings for increasing material manufacturing of comparative example, it is essentially identical with 1 method of comparative example, no
It is only that with point, the Overlap-scanning line of last layer discrete layer is discrete to last layer for the Overlap-scanning line projection of next layer scattering layer
On layer, 60 ° of gained are rotated further around its midpoint.
After testing, the surface quality in the Overlap-scanning area of the workpiece prepared using different material tests, embodiment 1, crystalline substance
Granularity, tensile strength, elongation at break etc. are superior to comparative example 1 and comparative example 2, wherein the properties of comparative example 1 are worst.
Overlap-scanning line as it can be seen that compared with traditional linear Overlap-scanning line, such as in each layer scattering layer is in phase
The case where projection on adjacent discrete layer Overlap-scanning line corresponding on the adjacent layer overlaps, or by the straight line in a layer scattering layer
Type Overlap-scanning line is the case where the projection rotation respective angles on adjacent discrete layer obtain adjacent layer corresponding Overlap-scanning line
(the linear ratio variation of slope of the Overlap-scanning line cluster formed in Z-direction), scan method of the invention can have
Effect ground reduces splicing trace, can more efficiently reduce mechanical stress etc., help to improve the surface matter of entire shaping workpiece
Amount and properties.
It is main in the specific embodiment realized according to how laser sintered splicing regions scanning strategy proposed by the present invention
It is characterized in that, the XY coordinate values of current layer Overlap-scanning line constantly change, and this variation can be well-regulated variation, can also
It is random variation；The XY coordinates of the splicing scan line of different layers also constantly change, and this variation can be well-regulated change
Change, can also be random variation, that is to say, that splicing scan line between layers does not overlap (including not to be weighed completely
Folded or part is not overlapped).
Embodiment 2
Please refer to Fig. 5~Fig. 6, the more Laser Scannings and 1 basic phase of embodiment for increasing material manufacturing of the present embodiment
Together, it only difference is that, the Overlap-scanning line 6 on each discrete layer is in more curved sections, as shown in Figure 5.Due to all discrete
All Overlap-scanning lines in layer on projection and this other discrete layers on other discrete layers corresponding Overlap-scanning line it is complete
It is complete misaligned, thus the molding workpiece of institute on longitudinal section obtained longitudinal spliced line 7 nor single vertical segment, this reality
It applies example and is fitted to more curved sections, as shown in Figure 6.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of more Laser Scannings for increasing material manufacturing, which is characterized in that according to each laser in more laser scanning systems
The position relationship of probe, each discrete layer obtained after being sliced to threedimensional model carry out corresponding scanning area division, per leafing
Formation is for the Overlap-scanning line of corresponding adjacent laser probe common scan, the scanning between dissipating the adjacent scan areas of layer
Splicing line is non-rectilinear；Projection of at least partly Overlap-scanning line on adjacent discrete layer at least one layer of discrete layer and the phase
Corresponding Overlap-scanning line is misaligned on adjacent discrete layer.
2. being used for more Laser Scannings of increasing material manufacturing as described in claim 1, which is characterized in that at least one layer of discrete layer
In projection with the adjacent discrete layer on corresponding Overlap-scanning line of all Overlap-scanning lines on adjacent discrete layer do not weigh
It closes.
3. being used for more Laser Scannings of increasing material manufacturing as described in claim 1, which is characterized in that in all discrete layers
At least partly projection of the Overlap-scanning line on adjacent discrete layer Overlap-scanning line corresponding on the adjacent discrete layer does not weigh
It closes.
4. being used for more Laser Scannings of increasing material manufacturing as described in claim 1, which is characterized in that in all discrete layers
Projection of all Overlap-scanning lines on adjacent discrete layer Overlap-scanning line corresponding on the adjacent discrete layer is misaligned.
5. being used for more Laser Scannings of increasing material manufacturing as claimed in claim 4, which is characterized in that in all discrete layers
All Overlap-scanning lines on projection and this other discrete layers on other discrete layers corresponding Overlap-scanning line it is misaligned.
6. as Claims 1 to 5 any one of them is used for more Laser Scannings of increasing material manufacturing, which is characterized in that described
It is misaligned for part it is misaligned and completely it is misaligned in one kind.
7. being used for more Laser Scannings of increasing material manufacturing as claimed in claim 6, which is characterized in that adjacent discrete layer corresponds to
The shape of Overlap-scanning line differ.
8. as Claims 1 to 5 any one of them is used for more Laser Scannings of increasing material manufacturing, which is characterized in that every layer
The shape of Overlap-scanning line on discrete layer is selected from least one of multistage broken line and curve.
9. as Claims 1 to 5 any one of them is used for more Laser Scannings of increasing material manufacturing, which is characterized in that every layer
There is scanning overlap, the Overlap-scanning line of corresponding adjacent laser probe to be located at institute between the adjacent scan areas of discrete layer
It states in scanning overlap.
10. as Claims 1 to 5 any one of them be used for increasing material manufacturing more Laser Scannings, which is characterized in that into
After row scanning area divides, each laser scanning head obtains corresponding Overlap-scanning line in each discrete layer in more laser scanning systems
Path coordinate, and according to the path coordinate of corresponding Overlap-scanning line in each discrete layer to its corresponding scanning area carry out by
Layer scanning.
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| CN113770380A (en) * | 2021-09-07 | 2021-12-10 | 贵州大学 | Multi-beam laser selective melting processing method and processing device |
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| CN114734058A (en) * | 2022-03-31 | 2022-07-12 | 西安航天发动机有限公司 | Multi-laser splicing scanning path planning method and multi-laser splicing scanning method |
| CN115138866A (en) * | 2022-06-23 | 2022-10-04 | 湖南华曙高科技股份有限公司 | Additive manufacturing multi-laser-profile lapping method and system |
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| CN113770380A (en) * | 2021-09-07 | 2021-12-10 | 贵州大学 | Multi-beam laser selective melting processing method and processing device |
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