CN109047759B - Laser scanning method for improving interlayer strength and reducing warping deformation - Google Patents
Laser scanning method for improving interlayer strength and reducing warping deformation Download PDFInfo
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- CN109047759B CN109047759B CN201810927924.4A CN201810927924A CN109047759B CN 109047759 B CN109047759 B CN 109047759B CN 201810927924 A CN201810927924 A CN 201810927924A CN 109047759 B CN109047759 B CN 109047759B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/36—Process control of energy beam parameters
- B22F10/366—Scanning parameters, e.g. hatch distance or scanning strategy
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/141—Processes of additive manufacturing using only solid materials
- B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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Abstract
The invention provides a laser scanning method for improving interlayer strength and reducing warping deformation, which divides a powder layer into a plurality of sub-parts, sequentially scans each sub-part, makes the laser scanning path angle of each sub-part different from that of the adjacent sub-parts, meanwhile, the scanning path of at least one part of each subsection is connected with the scanning path of at least one part of the adjacent subsection end to end, the next powder layer is scanned by adopting the same method after the scanning of one powder layer is finished until the whole printing is finished, this reduces the amount of warp deformation as a whole because the scan path varies and therefore the thermal stresses in adjacent sub-sections are all different, meanwhile, as the scanning path of at least one part of each subsection is connected with the scanning path of at least one part of the adjacent subsection end to end, the interconnectivity between the subsections is enhanced, and the interlayer strength is improved.
Description
Technical Field
The invention belongs to the technical field of additive manufacturing, and particularly relates to a laser scanning method for improving interlayer strength and reducing warping deformation.
Background
Additive Manufacturing (AM) is commonly known as 3D printing, combines computer-aided design, material processing and forming technologies, and is a Manufacturing technology for Manufacturing solid articles by stacking special metal materials, non-metal materials and medical biomaterials layer by layer in modes of extrusion, sintering, melting, photocuring, spraying and the like through a software and numerical control system on the basis of a digital model file. Compared with the traditional processing mode of removing, cutting and assembling raw materials, the method is a manufacturing method through material accumulation from bottom to top, and is from top to bottom. This enables the manufacture of complex structural components that were previously constrained by conventional manufacturing methods and were not possible. Additive manufacturing prints three-dimensional objects in a layered fashion. Typically, the 3D CAD model is cut into multiple layers of uniform thickness and then sent to a printer to print out the three-dimensional model.
Selective Laser Sintering (SLS) and Selective Laser Melting (SLM) are conventional techniques for additive manufacturing to fabricate parts and complex objects in a layered fashion. The dense powder stack is placed with a uniform powder layer thickness and then the powder is sintered under selective laser melting or melted under a laser of the energy of selective laser sintering. For the entire manufacturing process, the three-dimensional CAD model is converted into multiple two-dimensional planes of uniform thickness in two dimensions, and the materials are stacked together as required for the part or article, allowing complex geometries to be manufactured due to the simplicity of the 2D layers.
The Selective Laser Sintering (SLS) technology mainly utilizes the basic principle of high-temperature sintering of powder materials under laser irradiation, realizes accurate positioning by controlling a light source positioning device through a computer, and then sinters, piles and forms layer by layer.
SLS uses infrared laser to sinter powder, firstly uses a powder-spreading roller to spread a layer of powder material, heats it to a certain temperature just below the sintering point of the powder by a constant temperature facility in a printing device, then irradiates laser beam on the powder layer to make the temperature of the irradiated powder rise to the melting point, and sinters and bonds with the formed part below. And after one layer is sintered, the printing platform descends by one layer thickness, the powder laying system lays new powder materials for the printing platform, then controls the laser beam to irradiate again for sintering, and the steps are repeated in such a circulating way and are stacked layer by layer until the printing work of the whole three-dimensional object is completed.
The SLM technology is a technology of using metal powder to be completely melted under the heat action of laser beam and formed by cooling and solidifying, a layer of metal powder is processed and fused into a shape by using high-power laser beam, after the fusion is completed, the distance of one layer of layer thickness is downwards adjusted by an operation platform, the next layer of powder is continuously processed, the step is repeated until all the defined (selected to be processed) area is fused, and a three-dimensional compound is obtained. The desired product (part) is built up by machining layer by layer. Under the action of high laser energy density, the metal powder is completely melted, and can be welded with solid metal after heat dissipation and cooling. The SLM technology is a rapid forming technology for forming a three-dimensional entity layer by layer through the process.
The size and uniformity of the powder particles is critical to the process of deposition and laser melting of each layer of powder. Such articles or objects are manufactured by laser energy in a material powder which melts layer by layer in a specific manner, the non-uniformity of grain size causing a cracking effect in the powder layer, simultaneously spreading to the interlayer connection and leading to non-uniformity of the hot-melt material bond.
Each print is required to define a scan speed for which the laser energy will be applied to the material being processed for a long time and vice versa. Thus, the scanning speed is another key factor affecting sintering and melting of the powder layer, and for very fast scanning speeds, the layer is not sintered or melted due to insufficient energy supply, which ultimately leads to the occurrence of structural porosity and insufficient melting. Also, if the scan speed is slower than desired, more energy will be supplied to the material, which will result in excessive melting, and the increase in thermal stress will also result in warping and cracking.
The laser scanning strategy is an important factor for controlling the melting trend of the material powder under the action of laser energy, and the material powder generates thermal stress around a laser action point, so that if all action points of adjacent layers are overlapped, strong thermal stress is generated, and the thermal stress finally generates a buckling effect with cracks, and finally the structure fails. In the category of laser scanning strategies, the most common scanning methods include unidirectional scanning, zigzag scanning and cross scanning strategies.
As shown in fig. 1, which is a schematic diagram of the most commonly used unidirectional scanning, zigzag scanning and cross scanning strategies, the stack is scanned layer by layer along the z-axis direction, the black arrow indicates the direction of the scanning path, fig. (b) shows the unidirectional scanning, as shown in the upper surface thereof, there are multiple scanning path arrows along the positive direction of the x-axis, the scanning paths of the scanning mode are unified along the positive direction of the x-axis, that is, after the previous scanning path along the positive direction of the x-axis is finished, the laser returns to the negative direction of the x-axis and then continues to the next scanning path, and each scanning path is the same; fig. (a) shows zigzag scanning, which is different from unidirectional scanning in that after the previous scanning path in the positive direction of the x-axis is finished, the laser is scanned back from the positive direction of the x-axis to the negative direction to form the next scanning path, so that a reciprocating zigzag back-and-forth scanning mode is repeatedly formed; fig. (a) shows a cross scan, that is, the scan of the previous layer and the scan of the next layer are crossed, and the scan of the previous layer is a zigzag scan along the x-axis, and the scan of the next layer is a zigzag scan along the y-axis, so that the scan is repeated.
Laser overlap is an overlap between two adjacent lines during scanning, typically partially overlapping scan paths, which is an important phenomenon because overlap will merge print paths together and additional overlap will cause re-melting of the powder material, which can affect efficiency and time. Also, a small overlap may be the cause of the incomplete bonding of adjacent melt channels.
When various materials are produced by using the additive manufacturing technology, high energy is applied to a powder layer due to a laser spot with a certain diameter, disturbance and breakage of the powder can be observed due to the existence of thermal stress, and structural defects (such as warping and cracks) are easily generated after the materials are melted.
Laser power (watts), scan speed (mm/s), material overlap (%) and scan spacing (mm) are factors that affect SLM technology material formation.
Because most rapid prototyping techniques produce parts in a layered manufacturing fashion, the thickness, surface quality and profile of each layer define important factors that define the quality of the product. If the first layer has a rough surface quality and an irregular surface profile, the subsequent layers are also affected, which ultimately leads to poor structural porosity and interlayer bonding. As shown in fig. 2, is a comparative test of zig-zag and cross-scanned gold samples. The average thickness of the sample was analyzed and the analysis showed that the thickness of the cross-scan layer was 358 μm (i.e., the thickness of the layer immediately above and this layer that crossed) which was greater than the value of the zig-zag scan strategy, 278 μm (i.e., the thickness of two identical layers of the zig-zag scan layer) due to the scan melting some of the excess powder in the second scan. The same scan parameters have been scanned twice in the same layer in the cross scan, so more heat is supplied to the powder, causing more powder to sinter to the bottom. Therefore, we can find the phenomenon of layer thickness increase in the cross scanning strategy, so the zigzag scanning strategy has the advantage of improving the strength of interlayer connection (i.e. interlayer bonding is closer to the interval), but because of thermal residual stress in the same direction of each layer, warpage deformation occurs between layers, the warpage deformation increases with the increase of the number of printing layers, and the warpage effect increases with the increase of the thermal stress of each layer, and the same is true of unidirectional scanning. In the cross-scan strategy, a layer of material powder is always irradiated by laser light in a direction perpendicular to the previous layer. This laser scanning has the great advantage of reducing the amount of warp distortion, since each layer is actually perpendicular to the previous layer, and therefore the thermal stress direction of each layer is not the same and does not add up. However, since each layer is actually perpendicular to the previous layer, the printed layer is not built on the previous laser scan line, but in the perpendicular direction to the previous layer. The interlayer strength is reduced and the interlayer strength is poor (i.e., the interlayer bonding is not tight enough and the spacing is large).
Therefore, the scanning mode which is common in the prior art can be found to have the defects of poor interlayer strength or warping deformation.
Disclosure of Invention
The invention provides a laser scanning method for improving interlayer strength and reducing warpage, which overcomes the defects of poor interlayer strength or warpage in the prior art.
The technical solution for realizing the purpose of the invention is as follows: a laser scanning method for improving interlayer strength and reducing warpage comprises the following steps:
step 1: dividing a powder layer into N x M sub-parts (N is more than or equal to 2, M is more than or equal to 2), and performing laser scanning on a first sub-part in a unidirectional scanning mode to ensure that the first sub-part comprises a plurality of laser scanning paths with a first angle, wherein each laser scanning path comprises a starting point and an end point;
step 2: performing laser scanning on a second sub-part adjacent to the first sub-part in a unidirectional scanning mode, so that the second sub-part comprises a plurality of laser scanning paths with a second angle, each laser scanning path comprises a starting point and an end point, and the second angle is different from the first angle;
and step 3: and (3) scanning the rest sub-parts in sequence by adopting the scanning mode of the step (2) so as to complete the scanning of the whole layer, keeping the angle of the laser scanning path of each sub-part different from that of the adjacent previous sub-part, and enabling the starting point and/or the ending point of the laser scanning path of at least one part of each sub-part to be the ending point and/or the starting point of the laser scanning path of the adjacent sub-part.
Preferably, the laser scanning is Selective Laser Sintering (SLS) or Selective Laser Melting (SLM).
Preferably, the angle of the laser scanning path of each subsection differs from the angle of the laser scanning path of an adjacent preceding subsection by more than 5 degrees.
Preferably, the angle of the laser scan path of each subsection is within 15 degrees of the angle of the laser scan path of an adjacent previous subsection.
Preferably, for the first sub-portion, the minimum angle of the laser scan path is greater than or equal to 10 degrees.
Preferably, for the first sub-portion, the maximum angle of the laser scan path is less than or equal to 45 degrees.
A laser scanning method for reducing warp distortion, comprising the steps of:
step 1: performing laser scanning on the first layer of powder in a unidirectional scanning mode, so that the first layer of powder comprises a plurality of laser scanning paths with first angles, and each laser scanning path comprises a starting point and an end point;
step 2: performing laser scanning on the second layer of powder in a unidirectional scanning mode, so that the second layer of powder comprises a plurality of laser scanning paths with second angles, each laser scanning path comprises a starting point and an end point, and the second angle is different from the first angle;
and step 3: sequentially scanning the remaining powder layers such that each layer of powder includes a plurality of laser scan paths having an angle, each of the laser scan paths including a start point and an end point, wherein the angle of the laser scan path of each layer of powder is different from the angles of the laser scan paths of the powder of the previous and subsequent layers.
Preferably, the laser scanning is Selective Laser Sintering (SLS) or Selective Laser Melting (SLM).
Preferably, the angle of the laser scanning path of each powder layer is different from the angle of the laser scanning path of the adjacent previous layer by more than 5 degrees.
Preferably, the angle of the laser scanning path of each powder layer is within 15 degrees of the angle of the laser scanning path of the adjacent previous layer.
Preferably, for the first layer of powder, the minimum angle of the laser scan path is greater than or equal to 10 degrees.
Preferably, for the first layer of powder, the maximum angle of the laser scan path is less than or equal to 45 degrees.
The invention has the following beneficial effects:
(1) the invention divides a powder layer into a plurality of subsections, scans each subsection in turn, and makes the angle of the laser scanning path of each subsection different from that of the adjacent subsection, and at the same time, the scanning path of at least one part of each subsection is connected with the scanning path of at least one part of the adjacent subsection end to end, and then scans the next powder layer by adopting the same method after completing the scanning of one powder layer until completing the whole printing, thus the thermal stress of the adjacent subsections is different because the scanning path is changed continuously, thus the warping deformation is reduced on the whole, and meanwhile, the interconnection between the subsections is enhanced because the scanning path of at least one part of each subsection is connected with the scanning path of at least one part of the adjacent subsections end to end, thus the interlayer strength is improved;
(2) in the invention, a multi-layer-by-layer printing mode is adopted, and the angle of the laser scanning path of each layer of powder is different from the angles of the laser scanning paths of the powder of the previous layer and the powder of the next layer, so that the thermal stress of the adjacent layers is different due to the continuous change of the angles of the scanning paths of the adjacent layers, and the warping deformation is reduced integrally.
In addition to the objects, features and advantages described above, other objects, features and advantages of the present invention are also provided. The present invention will be described in further detail below with reference to the drawings.
Drawings
FIG. 1 is a schematic illustration of a unidirectional scan, zig-zag scan, and cross-scan strategy.
FIG. 2 is a graph of comparative tests of zig-zag and cross-wise scanned gold samples.
Fig. 3 is a schematic view of a laser scanning structure of a powder layer of the present invention.
Detailed Description
In order to better understand the technical content of the invention, specific embodiments are specifically illustrated in the following description in conjunction with the accompanying drawings.
Example 1
With reference to fig. 3, a laser scanning method for improving interlayer strength and reducing warpage includes the following steps: step 1: dividing a powder layer into 6-5 sub-parts (each small square is a sub-part in the figure), and performing laser scanning on a first sub-part in a unidirectional scanning mode, so that the first sub-part comprises a plurality of laser scanning paths with first angles (as shown by arrows in the sub-parts in the figure), and each laser scanning path comprises a starting point and an end point; step 2: performing laser scanning on a second sub-part adjacent to the first sub-part in a unidirectional scanning mode, so that the second sub-part comprises a plurality of laser scanning paths with a second angle, each laser scanning path comprises a starting point and an end point, and the second angle is different from the first angle; and step 3: and (3) sequentially scanning the 3 rd to 30 th sub-parts by adopting the scanning mode of the step (2) so as to complete the scanning of the whole layer, keeping the angle of the laser scanning path of each sub-part different from the angle of the laser scanning path of the adjacent previous sub-part, and enabling the starting point and/or the ending point of the laser scanning path of at least one part of each sub-part to be the ending point and/or the starting point of the laser scanning path of the sub-part adjacent to the starting point.
Fig. 3 shows a schematic structure of a whole layer after scanning is completed, which includes 30 sub-portions, wherein each sub-portion includes a plurality of laser scanning paths, the angle of the laser scanning path of each sub-portion is different from the angle of the laser scanning path of its adjacent sub-portion, and the starting point and/or the ending point of the laser scanning path of at least one part of each sub-portion is the ending point and/or the starting point of the laser scanning path of its adjacent sub-portion.
In the embodiment, a powder layer is divided into a plurality of sub-parts, each sub-part is scanned in sequence, the angle of a laser scanning path of each sub-part is different from that of the adjacent sub-part, at the same time, the scanning path of at least one part of each sub-part is connected with the scanning path of at least one part of the adjacent sub-part end to end, and the next powder layer is scanned by adopting the same method after the scanning of one powder layer is completed until the whole printing is completed.
Example 2
A laser scanning method for reducing warping deformation comprises the following steps: step 1: performing laser scanning on the first layer of powder in a unidirectional scanning mode, so that the first layer of powder comprises a plurality of laser scanning paths with first angles, and each laser scanning path comprises a starting point and an end point; step 2: performing laser scanning on the second layer of powder in a unidirectional scanning mode, so that the second layer of powder comprises a plurality of laser scanning paths with second angles, each laser scanning path comprises a starting point and an end point, and the second angle is different from the first angle; and step 3: sequentially scanning the remaining powder layers such that each layer of powder includes a plurality of laser scan paths having an angle, each of the laser scan paths including a start point and an end point, wherein the angle of the laser scan path of each layer of powder is different from the angles of the laser scan paths of the powder of the previous and subsequent layers.
In this embodiment, a multi-layer-by-layer printing mode is adopted, and the angle of the laser scanning path of each layer of powder is different from the angles of the laser scanning paths of the powder of the previous layer and the powder of the next layer, so that the thermal stresses of the adjacent layers are different due to the fact that the angles of the scanning paths of the adjacent layers are changed continuously, and the warping deformation is reduced on the whole.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (2)
1. A laser scanning method for improving interlayer strength and reducing warpage is characterized by comprising the following steps:
step 1: dividing a powder layer into N x M sub-parts, wherein N is more than or equal to 2, M is more than or equal to 2, and performing laser scanning on a first sub-part in a unidirectional scanning mode to enable the first sub-part to comprise a plurality of laser scanning paths with a first angle, and each laser scanning path comprises a starting point and an end point;
step 2: performing laser scanning on a second sub-part adjacent to the first sub-part in a unidirectional scanning mode, so that the second sub-part comprises a plurality of laser scanning paths with a second angle, each laser scanning path comprises a starting point and an end point, and the second angle is different from the first angle;
and step 3: and (3) scanning the rest of the sub-parts in sequence by adopting the scanning mode of the step (2) so as to complete the scanning of the whole layer, keeping that the angle of the laser scanning path of each sub-part is different from the angle of the laser scanning path of the adjacent previous sub-part, and the starting point of the laser scanning path of at least one part of each sub-part is the end point of the laser scanning path of the adjacent sub-part and/or the end point of the laser scanning path of at least one part of each sub-part is the starting point of the laser scanning path of the adjacent sub-part, wherein the angle of the laser scanning path of each sub-part is different from the angle of the laser scanning path of the adjacent previous sub-part by more than 5 degrees and.
2. The method of claim 1, wherein the laser scanning is Selective Laser Sintering (SLS) or Selective Laser Melting (SLM).
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CN114951697B (en) * | 2022-05-13 | 2023-07-25 | 南京铖联激光科技有限公司 | 3D printing scanning method based on SLM technology |
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