CN108436682A - The mill and special purpose grinder of sheet wafer processing - Google Patents

Abstract

The invention discloses a kind of grinding machines for being exclusively used in sheet wafer and processing being thinned, including lathe microscope carrier, one carrier for clamping product is removably installed on the lathe microscope carrier, mill is equipped with above carrier, the mill includes ontology, the ontology lower face is equipped with mounting groove, sub- abrading block is equipped in mounting groove, the circumferential direction of the lower face upper edge mounting groove of the ontology is evenly distributed with multiple feed tanks, for housing mortar, it is connected by an arc surface transition positioned at the madial wall corresponding to the opposite direction of ontology rotation direction and between the lower face of ontology in the slot inner wall of the feed tank, the mill is installed on lathe driving shaft and is rotated with lathe driving shaft.The present invention provides a kind of grinding machine for being exclusively used in sheet wafer and processing being thinned, its clamping process is simple and reliable, and since fragment rate caused by clamping is low, and the grinding accuracy of mill is good, nothing directly contacts firmly between mill and product, therefore good processing precision of products, qualification rate are high.

Description

The mill and special purpose grinder of sheet wafer processing

Technical field

The present invention relates to the technical field of wafer processing, the specifically a kind of mills and Special grinding of the processing of sheet wafer Bed.

Background technology

Sheet wafer, especially thickness are less than the wafer of 1mm, generally require first to face during being processed When be bonded on a slide glass wafer, to improve the intensity of function wafer, in order to be processed, such as be thinned beat Mill, etching, cutting etc., finally detach function wafer with slide glass wafer, complete the processing of function wafer.

And it is processed into the prior art for the ease of the separation of function wafer and slide glass wafer and also to reduce Originally, what above-mentioned slide glass wafer was more uses engineering plastics, and slide glass wafer made of this engineering plastics is cut with function wafer The process cut synchronously completes cutting, therefore slide glass wafer made of this engineering plastics in the prior art is mostly disposable consumption Material.

But the product this function wafer and slide glass wafer are bonded in the prior art temporarily after passes through on machining tool Conventional mechanical angle carries out easily causing function wafer fragmentation during clamping, therefore difficulty of processing is big.And select intensity and Hardness performance more preferably engineering plastics, then can lead to the raising of processing cost, be unfavorable for enterprise production and management.

Invention content

The present invention is directed to solve first technical problem in the related technology at least to a certain extent：A kind of sheet is provided The mill of wafer processing is polished between mill and product by the grinding particle contained in mortar, thus mill with Product is without directly hard contact, therefore fragment rate is low, and the precision of final products processing is good, and qualification rate is high.

The present invention is directed to solve second technical problem in the related technology at least to a certain extent：It provides a kind of special The grinding machine of processing is thinned in sheet wafer, clamping process is simple and reliable, since fragment rate caused by clamping is low, and mill Grinding accuracy is good, and nothing directly contacts firmly between mill and product, therefore good processing precision of products, qualification rate are high.

For this purpose, proposing that a kind of sheet wafer processing is used it is an object of the present invention to be directed to above-mentioned first technical problem Mill, the center of including discoid ontology, the ontology lower face is equipped with a mounting groove, son mill is equipped in mounting groove The circumferential direction of block, the lower face upper edge mounting groove of the ontology is evenly distributed with multiple feed tanks, for housing mortar, the feed flow It is located in the slot inner wall of slot between the madial wall and the lower face of ontology corresponding to the opposite direction of ontology rotation direction and passes through one Arc surface transition connects.By mortar so that forming screed between the lower face of ontology and the work surface of product, pass through Thus the work surface of screed abrasive product not only can be very good to complete the thinned grinding for product, but also mill It is not contacted firmly directly between product, therefore, avoids the impact force of mill and product contact initial stage and lead to sheet product Fragmentation.

According to an example of the present invention, the position in the ontology corresponding to each feed tank is equipped with liquid feeding pipeline, institute Liquid feeding pipeline is stated to be connected to feed tank.

According to an example of the present invention, on the lower face of the ontology one is equipped between arbitrary two neighboring feed tank Backflash, the lower face of the ontology are equipped with the main return flow line of annular, whole backflashes radially extend to master Return flow line is connected to.The ontology lower end that mortar after grinding can be recycled by backflash and main return flow line, while being also The pressure of screed between face and product obtains dynamic equilibrium.

According to an example of the present invention, it is equipped with and is used for close to the position where ontology outer rim on the lower face of the ontology The locating slot in gap between the lower face and product work surface of control ontology, the ontology is interior to be equipped with for supplying locating slot The pipeline of high-pressure medium.High-pressure medium in locating slot can make between remaining certain between mill ontology and product Gap.

According to an example of the present invention, the sub- abrading block is slidably matched with mounting groove, the sub- abrading block and mounting groove Slot inner wall between surround to form an adjusting cavity, the pipeline being connected to adjusting cavity is equipped in the ontology.It is pushed by adjusting cavity Sub- abrading block carries out reconditioning to the work surface of product.

For this purpose, it is another object of the present invention to propose a kind of grinding machine for being exclusively used in sheet wafer and processing being thinned, including Lathe microscope carrier is removably equipped with a carrier for clamping product on the lathe microscope carrier, above-mentioned power is equipped with above carrier Profit requires any one of 1 to 5 mill, the mill to be installed on lathe driving shaft and rotated with lathe driving shaft.

According to an example of the present invention, the carrier includes the shell of opening direction upward, is equipped with and is used in shell The regulating mechanism at Product Level inclination angle is adjusted, magnetorheological fluid is poured into the shell, so that the regulating mechanism is immersed in magnetic In rheology liquid, when the lower part of product is connected on regulating mechanism, the regulating mechanism is quiet after driving product to be rocked to setting position It sets, and the part to be processed of the product is located at the top of magnetorheological fluid liquid level, the shell is equipped with magnetic field generator, is used for The magnetorheological fluid in shell is driven to cure or be reset in fluid state.It is to be added that regulating mechanism adjusting product so that product is rocked to The position of work and static, then makes magnetorheological fluid cure by magnetic field generator, and passing through the magnetorheological fluid after solidification will be originally The product for being partially submerged in magnetorheological fluid fixes limit, and this completes the clampings of product.The function of product is brilliant in the process Circle is placed on the ullage of magnetorheological fluid, therefore does not interfere with the processing for function wafer.

According to an example of the present invention, the regulating mechanism includes at least three cylinders, and whole cylinders are in the horizontal direction Interval setting, and the lower end of each cylinder is connect with shell, and a central passage is equipped in the cylinder, the interior sliding of central passage is matched Conjunction has a piston rod, the lower face of piston rod and the inner surface of central passage to surround to form control chamber, and the upper end edge of piston rod is perpendicular Histogram is to being placed on above cylinder, and the end that exposes to above cylinder of piston rod is equipped with the company for connecting or disengaging with product Fitting.It is used as three fulcrums by three connectors to adjusting and positioning product.

According to an example of the present invention, it is equipped with a partition board in the shell, the madial wall of the partition board and shell surrounds A closed reserve chamber is formed, the bottom of reserve chamber is equipped with the infusion channel being connected to the inner cavity of shell, and the infusion is logical Road is located at below the liquid level of magnetorheological fluid in shell, and the side wall of the reserve chamber is equipped with for deposit chamber air or court to be discharged The gas nozzle of air is filled in reserve chamber.Pouring air by gas nozzle can make the magnetorheological fluid in reserve chamber pass through infusion channel It is replenished to the interior intracavitary of shell, so that the liquid level of magnetorheological fluid overflows in shell, the stream of surface layer liquid level is driven by overflow The dynamic removal completed for magnetorheological fluid surface layer impurity in shell.

According to an example of the present invention, the lateral wall of the shell is equipped with an overflow launder, and the overflow launder is along shell Circumferentially extending structure in a ring.The magnetorheological fluid that wafer can be processed to the impurity particle and spilling that generate by overflow launder converges It flows and is discharged.

The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description Obviously, or practice through the invention is recognized.

Above-mentioned technical proposal has the following advantages that or advantageous effect：First, it is ground by mortar between mill and product It cuts, therefore without directly contacting firmly between mill and product, it is excessive and make product fragmentation not easily cause impact force, next, grinding machine In carrier die cavity is formed by curing using magnetorheological fluid so that product is partially submerged into, not only firm position, but also not Can be excessive and lead to deformation of products fragmentation due to the chucking power of part, thirdly, the intensity and just of wafer is uploaded for product It is low to spend performance requirement, therefore the cost of material is low for slide glass wafer, the cost for reducing integral product processing finally passes through reserve chamber Magnetorheological fluid fill into so that the impurity particle on surface layer is removed with the overflow on magnetorheological fluid surface layer, therefore may be implemented continuous Processing avoids the additional effort for needing manual cleaning surface impurity to bring after repeatedly production, and quantity-produced is imitated Rate also further increases.

Description of the drawings

Fig. 1 is the structural schematic diagram for being exclusively used in sheet wafer and the grinding machine of processing being thinned of the present invention.

Fig. 2 is the structural schematic diagram under another working condition of grinding machine in Fig. 1.

Fig. 3 is the close-up schematic view in region " A " in Fig. 2.

Fig. 4 is the close-up schematic view in region " B " in Fig. 3.

Fig. 5 is the structural schematic diagram of mill part in the present invention.

Fig. 6 is the structural schematic diagram in direction " C-C " in Fig. 5.

Fig. 7 is the structural schematic diagram in direction " D-D " in Fig. 5.

Wherein, 1, shell, 2, product, 2.1, function wafer, 2.2, slide glass wafer, 2.3, bonding glue, 3, regulating mechanism, 3.1, cylinder, 3.2, piston rod, 3.3, control chamber, 3.4, sucker, 3.5, connecting tube, 3.6, step surface, 4, magnetorheological fluid, 5, control Tubulation, 6, universal joint, 7, groove, 8, partition board, 9, reserve chamber, 10, infusion channel, 11, gas nozzle, 12, inlet tube, 13, master encourages Magnetic device, 14, additive excitation winding, 15, overflow launder, 16, pump, 17, pressure sensor, 18, ontology, 19, mounting groove, 20, son Abrading block, 21, feed tank, 22, arc surface, 23, liquid feeding pipeline, 24, backflash, 25, main return flow line, 26, locating slot, 27, adjust Save chamber, 28, lathe driving shaft.

Specific implementation mode

The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached The embodiment of figure description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.

Below with reference to the accompanying drawings the grinding machine processed is thinned the sheet wafer according to the ... of the embodiment of the present invention that is exclusively used in is described in detail.

The present invention provides a kind of grinding machine for being exclusively used in sheet wafer and processing being thinned, including lathe microscope carrier, the lathe microscope carrier On a carrier for clamping product 2 is removably installed, mill is equipped with above carrier, the mill is installed on lathe actively It is rotated on axis 28 and with lathe driving shaft 28.

Embodiment one：

Preferably, above-mentioned mill includes discoid ontology 18, the center of 18 lower face of the ontology is equipped with One mounting groove 19, mounting groove 19 is interior to be equipped with sub- abrading block 20, and the circumferential of the lower face upper edge mounting groove 19 of the ontology 18 is uniformly divided Multiple feed tanks 21 are furnished with, for housing mortar, are located at the opposite of 18 rotation direction of ontology in the slot inner wall of the feed tank 21 It is connected by 22 transition of an arc surface between madial wall corresponding to direction and the lower face of ontology 18.

Above-mentioned mortar refers to also being ground the suspension of particle, such as the grinding fluid containing quartz sand particle.In ontology During 18 rotate relative to product 2, mortar in feed tank 21 rotated with ontology 18 during from 22 institute of arc surface It is squeezed between the lower face of ontology 18 and the upper surface of product 2 in position, in the upper end of the lower face of ontology 18 and product 2 Screed is formed between face, completing grinding eventually by the friction of the upper surface of screed and product 2 is thinned.

Embodiment two：

It is identical as one general structure of embodiment, difference lies in：Position in the ontology 18 corresponding to each feed tank 19 is equal Equipped with liquid feeding pipeline 23, the liquid feeding pipeline 23 is connected to feed tank 19.Liquid feeding pipeline 23 passes through external hose and external mortar Bucket is connected to, so that volume mortar is pumped in feed tank 19 in bucket.

Embodiment three：

It is identical as two general structure of embodiment, difference lies in：Arbitrary neighborhood on the lower face of the ontology 18 as shown in Figure 5 A backflash 24 is equipped between two feed tanks 21, the lower face of the ontology 18 is equipped with the main return flow line 25 of annular, Whole backflashes 24, which is radially extended to main return flow line 25, to be connected to.

Example IV：

It is identical as three general structure of embodiment, difference lies in：Close to 18 outer rim institute of ontology on the lower face of the ontology 18 Position be equipped with 2 work surface of the lower face for controlling ontology 18 and product between gap locating slot 26, described The pipeline for supplying 26 high-pressure medium of locating slot is equipped in body 18.Above-mentioned high-pressure medium can be the coolant liquid of high pressure, It can be compressed air, be pumped in locating slot 26 by booster pump, thus high-pressure medium is in the upper surface of product 2 and mill sheet Gap is formed between the lower face of body 18, the pressure value by adjusting the high-pressure medium in locating slot 26 not only can be very good to adjust The gap between the upper surface and the lower face of mill ontology 18 of product 2 is saved, and is played at the initial stage of 18 downlink of mill ontology Cushioning effect avoids 18 overtravel of ontology impact product from leading to product fragmentation.

Embodiment five：

It is identical as example IV general structure, difference lies in：The sub- abrading block 20 is slidably matched with mounting groove 19, described It surrounds to form an adjusting cavity 27 between sub- abrading block 20 and the slot inner wall of mounting groove 19, is equipped in the ontology 18 and connects with adjusting cavity 27 Logical pipeline.The adjusting cavity 27 can be connected to by controlling hose with external metering pump, and pass through controller tune The pressure value of adjusting cavity 27 is saved, it is final to realize the control resetted for the downlink or uplink of sub- abrading block 20.

Embodiment six：

Preferably, above-mentioned carrier includes the shell 1 of opening direction upward, the removable lathe that is installed on of shell 1 carries It is equipped with the regulating mechanism 3 for adjusting 2 level inclination of product on platform, in shell 1, magnetorheological fluid 4 is poured into the shell 1, with So that the regulating mechanism 3 is immersed in magnetorheological fluid 4, the adjusting machine when the lower part of product 2 is connected on regulating mechanism 3 Structure 3 is stood after driving product 2 to be rocked to setting position, and the part to be processed of the product 2 is located at the upper of 4 liquid level of magnetorheological fluid Side, the shell 1 are equipped with magnetic field generator, for driving the magnetorheological fluid 4 in shell 1 to cure or being reset in flow-like State.

Above-mentioned setting position refers to be processed position of the product on lathe, is added with to wafer be thinned by mill For work, it is parallel with the grinding surface of mill that the predeterminated position of product refers to that the face to be processed of product is rocked to.In general, on The setting position stated it is more refer to product datum plane be horizontal where position, certainly for gang tool Speech, can also complete the processing for inclined surface.

Above-mentioned product 2 is a laminar function wafer 2.1 as shown in Figure 1,2 and 3, the function wafer 2.1 from On be attached to down on a slide glass wafer 2.2, to improve the intensity of function wafer 2.1, convenient for function wafer 2.1 carry out table Face working process, such as be thinned, etch etc..Specifically, by being bonded glue between the function wafer 2.1 and slide glass wafer 2.2 2.3 bonding.

Above-mentioned level inclination refers to the angle between datum plane and horizontal plane on product 2, this datum plane can be with It is the upper surface of product 2, since the function wafer 2.1 in product 2 is relatively mostly transparent material, the datum plane also may be used To be the binding face between function wafer 2.1 and slide glass wafer 2.2, glue is bonded after specifically referring to function wafer 2.1 and solidification Binding face between 2.3.

Embodiment seven：

It is identical as six general structure of embodiment, difference lies in：The regulating mechanism 3 includes at least three cylinders 3.1, specifically Preferably be four cylinders 3.1, the 3.1 horizontally spaced setting of whole cylinders, and the lower end of each cylinder 3.1 with shell 1 Connection, the cylinder 3.1 is interior to be equipped with a central passage, and a piston rod 3.2 is sliding combined in central passage, piston rod 3.2 The inner surface of lower face and central passage surrounds to form control chamber 3.3, and the upper end of piston rod 3.2 is vertically placed on cylinder 3.1 tops, and piston rod 3.2 exposes to the end of 3.1 top of cylinder equipped with the connector for connecting or disengaging with product 2.

It is identical as six general structure of embodiment, difference lies in：The regulating mechanism 3 includes a cylinder 3.1, cylinder 3.1 Lower end be fixedly connected with shell 1, the upper end of cylinder 3.1 vertically extends upward, and a center is equipped in the cylinder 3.1 Channel is sliding combined with a piston rod 3.2 in central passage, and the lower face of piston rod 3.2 and the inner surface of central passage surround Control chamber 3.3 is formed, the upper end of piston rod 3.2 is vertically placed on 3.1 top of cylinder, and piston rod 3.2 exposes to cylinder The end of 3.1 top of body is equipped with the manipulator that can be swung along the arbitrary plane where 3.2 central axes of piston rod, is set on manipulator There is the suction nozzle for connecting or disengaging with product 2.

It is identical as six general structure of embodiment, difference lies in：The regulating mechanism 3 can be the manipulator of waterproof, pass through Manipulator grabs my product and adjusts product to horizontal position, in order to which clamping is fixed to product in magnetorheological fluid.

It is identical as six general structure of embodiment, difference lies in：The regulating mechanism 3 can be fixedly installed in shell 1 Standard base station, on the basis of the upper surface of base station face, the product 2 when the lower part of product 2 is immersed in the magnetorheological fluid 4 of shell 1 The lower face of slide glass wafer 2.2 of lower face, that is, product 2 be bonded with the upper surface of above-mentioned base station, to complete for product 2 The automatic calibration of level inclination.

Embodiment eight：

It is identical as seven general structure of embodiment, difference lies in：The connector is the sucker 3.4 of opening direction upward.

Embodiment nine：

It is identical as eight general structure of embodiment, difference lies in：Connecting tube 3.5, connecting tube are equipped in the piston rod 3.2 3.5 upper end is connected to the inner cavity of sucker 3.4, and the lower end of connecting tube 3.5 is connected to control chamber 3.3, and the control chamber 3.3 passes through Control pipe 5 is connect with the pressure regulating system outside shell 1.As illustrated in fig. 1 and 2, the pressure regulating system includes 16 Hes of pump One end of pressure sensor 17, control pipe 5 is connected to control chamber 3.3, and the other end of control pipe 5 is connected to the output end of pump 16, The pressure sensor 17 is installed in control pipe 5 for detecting the pressure values in control pipe, may be used also on certain controller To be provided with the solenoid valve (not shown) for 5 flow of adjusting control pipe and pressure value, the pressure sensor 17 will Signal transmission is detected to controller (not shown), the power and/or solenoid valve of pump 16 are adjusted by controller.

Embodiment ten：

It is identical as nine general structure of embodiment, difference lies in：The sucker 3.4 is an integral structure with piston rod 3.2, institute The lower end for stating cylinder 3.1 is rotatably assorted by universal joint 6 and shell 1.

Preferably, the sucker 3.4 is made with piston rod 3.2 of hard material, sucker 3.4 is far from piston rod 3.2 The edge of opening is coated with an elastic sealant.The actuation effect of sucker is not only increased by elastic sealant, and when work Stopper rod 3.2 swings certain angle so that sucker 3.4 and the lower face of product pass through elastic sealant when being in angle state Deformation so that attracting state can be kept between sucker and product, accomplishes adaptive.

Preferably, hinged by globe joint between the sucker 3.4 and piston rod 3.2.The globe joint Universal joint is can be understood as, so that sucker 3.4 can be rotated relative to piston rod 3.2.

Preferably, being connected by elastic component between the sucker 3.4 and piston rod 3.2.Such as vulcanized by integral type Rubber parts.

Embodiment 11：

It is identical as ten general structure of embodiment, difference lies in：The top surface of the control chamber 3.3 vertically indent upward Opening direction groove 7 directed downwardly is formed, the magnetorheological fluid 4 in the shell 1 sequentially passes through in sucker 3.4 and piston rod 3.2 Connecting tube 3.5 pour into control chamber 3.3, the magnetorheological fluid 4 in the control chamber 3.3 is in the notch position of groove 7 or recessed Fluid-tight is formed in slot 7, so that forming the air cavity for keeping in gas in the groove 7.

As shown in figure 4, the central passage be located on the madial wall corresponding to control chamber 3.3 in the horizontal direction inscribed figure at The step surface of annular, the step surface are vertically recessed opening direction groove 7 directed downwardly upward.

Preferably, above-mentioned top surface may also mean that the lower face of piston rod 3.2, the lower face of the piston rod 3.2 Vertically be recessed opening direction groove 7 directed downwardly upward, when being equipped with connecting tube 3.5 in the piston rod 3.2 described in Groove 7 is annular groove, and annular groove 7 is placed in the horizontal direction outside connecting tube 3.5.

Embodiment 12：

It is identical as six general structure of embodiment, difference lies in：A partition board 8, the partition board 8 and shell are equipped in the shell 1 The madial wall of body 1 surrounds to form a closed reserve chamber 9, and it is logical that the bottom of reserve chamber 9 is equipped with the infusion being connected to the inner cavity of shell 1 Road 10, and the infusion channel 10 is located at below the liquid level of magnetorheological fluid 4 in shell 1, the side wall of the reserve chamber 9 is equipped with For air in reserve chamber 9 to be discharged or towards the gas nozzle 11 for being filled with air in reserve chamber 9.

Preferably, being equipped with upper liquid level sensor for detecting the liquid level upper limit in the reserve chamber 9 and for detecting liquid The lower liquid level sensor of position lower limit, the lower liquid level sensor are vertically higher than the position where infusion channel 10, institute It states liquid level sensor and is vertically less than 11 position of gas nozzle.

Embodiment 13：

It is identical as 12 general structure of embodiment, difference lies in：The side wall of the reserve chamber 9 is equipped with inlet tube 12, institute Inlet tube 12 is stated to be connected to reserve chamber 9 for injecting magnetorheological fluid towards reserve chamber 9 is interior.

Embodiment 14：

It is identical as 13 general structure of embodiment, difference lies in：The magnetic field generator includes that the master being placed in shell 1 encourages Magnetic device 13 and the additive excitation winding 14 being integrated in partition board 8.It is produced when main excitation unit 13 and additive excitation winding 14 are powered The magnetorheological fluid in shell 1 is driven to cure by magnetic field when raw magnetic field, when main excitation unit 13 and additive excitation winding 14 are disconnected It is in fluid state that magnetorheological fluid when electric in shell 1, which resets,.

Embodiment 15：

It is identical as six general structure of embodiment, difference lies in：The lateral wall of the shell 1 is equipped with an overflow launder 15, institute State circumferentially extending in a ring structure of the overflow launder 15 along shell 1.Magnetorheological fluid in the overflow launder 15 is after purification and impurity removal It is connected with inlet tube 12 by triple valve.

What needs to be explained here is that in the description of the present invention, it is to be understood that, term "center", " longitudinal direction ", " cross To ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", The orientation or positional relationship of the instructions such as "bottom" "inner", "outside", " clockwise ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " is It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of description of the present invention and simplification of the description, rather than instruction or dark Show that signified device or element must have a particular orientation, with specific azimuth configuration and operation, therefore should not be understood as pair The limitation of the present invention.

In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or Implicitly include one or more this feature.In the description of the present invention, the meaning of " plurality " is two or more, unless separately There is clearly specific restriction.

In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc. Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；Can be that machinery connects It connects, can also be electrical connection；It can be directly connected, can also can be indirectly connected through an intermediary in two elements The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings Condition understands the concrete meaning of above-mentioned term in the present invention.

In the present invention unless specifically defined or limited otherwise, fisrt feature can be with "above" or "below" second feature It is that the first and second features are in direct contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be One feature is directly under or diagonally below the second feature, or is merely representative of fisrt feature level height and is less than second feature.

In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office It can be combined in any suitable manner in one or more embodiments or example.In addition, without conflicting with each other, the skill of this field Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples It closes and combines.

Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned Embodiment is changed, changes, replacing and modification.

For a person skilled in the art, after reading above description, various changes and modifications undoubtedly will be evident. Therefore, appended claims should regard the whole variations and modifications for covering the true intention and range of the present invention as.It is weighing The range and content of any and all equivalences within the scope of sharp claim, are all considered as still belonging to the intent and scope of the invention.

Claims (10)

1. a kind of mill of sheet wafer processing, it is characterised in that：Including discoid ontology (18), under the ontology (18) The center of end face is equipped with a mounting groove (19), and sub- abrading block (20), the lower end of the ontology (18) are equipped in mounting groove (19) The circumferential direction of face upper edge mounting groove (19) is evenly distributed with multiple feed tanks (21), for housing mortar, the feed tank (21) Lead to positioned at the madial wall corresponding to the opposite direction of ontology (18) rotation direction and between the lower face of ontology (18) in slot inner wall Cross an arc surface (22) transition connection.

2. the mill of sheet wafer processing according to claim 1, it is characterised in that：Correspond in the ontology (18) The position of each feed tank (19) is equipped with liquid feeding pipeline (23), and the liquid feeding pipeline (23) is connected to feed tank (19).

3. the mill of sheet wafer processing according to claim 2, it is characterised in that：The lower face of the ontology (18) A backflash (24) is equipped between upper arbitrary two neighboring feed tank (21), the lower face of the ontology (18) is equipped with annular Main return flow line (25), whole backflash (24) radially extends to main return flow line (25) and is connected to.

4. the mill of sheet wafer processing according to claim 3, it is characterised in that：The lower face of the ontology (18) The upper position close to where ontology (18) outer rim be equipped with lower face and product (2) work surface for controlling ontology (18) it Between gap locating slot (26), the pipeline for supplying locating slot (26) high-pressure medium is equipped in the ontology (18).

5. the mill of sheet wafer processing according to claim 4, it is characterised in that：The sub- abrading block (20) and peace Tankage (19) is slidably matched, and surrounds to form an adjusting cavity (27) between the sub- abrading block (20) and the slot inner wall of mounting groove (19), The pipeline being connected to adjusting cavity (27) is equipped in the ontology (18).

6. a kind of grinding machine for being exclusively used in sheet wafer and processing being thinned, including lathe microscope carrier, it is characterised in that：On the lathe microscope carrier It is dismountable that a carrier for clamping product (2) is installed, it is equipped with any one of the claims 1 to 5 above carrier Mill, the mill be installed on lathe driving shaft (28) and with lathe driving shaft (28) rotate.

7. the grinding machine according to claim 6 for being exclusively used in sheet wafer and processing being thinned, it is characterised in that：The carrier includes The shell (1) of opening direction upward, the interior regulating mechanism (3) being equipped with for adjusting product (2) level inclination of shell (1) are described Magnetorheological fluid (4) is poured into shell (1), so that the regulating mechanism (3) is immersed in magnetorheological fluid (4), when product (2) Lower part is stood when being connected on regulating mechanism (3) after the regulating mechanism (3) drives product (2) to be rocked to setting position, and institute The part to be processed for stating product (2) is located at the top of magnetorheological fluid (4) liquid level, and the shell (1) is equipped with magnetic field generator, uses In driving magnetorheological fluid (4) in shell (1) to cure or be reset in fluid state.

8. the grinding machine according to claim 7 for being exclusively used in sheet wafer and processing being thinned, it is characterised in that：The regulating mechanism (3) include at least three cylinders (3.1), the horizontally spaced setting of whole cylinders (3.1), and the lower end of each cylinder (3.1) It is connect with shell (1), a central passage is equipped in the cylinder (3.1), a piston rod is sliding combined in central passage (3.2), the lower face of piston rod (3.2) and the inner surface of central passage surround to form control chamber (3.3), piston rod (3.2) Upper end is vertically placed on above cylinder (3.1), and the end that piston rod (3.2) exposes to above cylinder (3.1) is equipped with Connector for connecting or disengaging with product (2).

9. the grinding machine according to claim 7 for being exclusively used in sheet wafer and processing being thinned, it is characterised in that：The shell (1) It is inside equipped with a partition board (8), the partition board (8) and the madial wall of shell (1) surround to form a closed reserve chamber (9), reserve chamber (9) bottom is equipped with the infusion channel (10) being connected to the inner cavity of shell (1), and the infusion channel (10) is located at shell (1) below the liquid level of interior magnetorheological fluid (4), the side wall of the reserve chamber (9) be equipped with for be discharged the interior air of reserve chamber (9) or The gas nozzle (11) of air is filled in towards reserve chamber (9).

10. the grinding machine according to claim 1 for being exclusively used in sheet wafer and processing being thinned, it is characterised in that：The shell (1) Lateral wall be equipped with an overflow launder (15), circumferentially extending in a ring structure of the overflow launder (15) along shell (1).