CN108428656B - Substrate conveying device, system and method - Google Patents
Substrate conveying device, system and method Download PDFInfo
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- CN108428656B CN108428656B CN201810200982.7A CN201810200982A CN108428656B CN 108428656 B CN108428656 B CN 108428656B CN 201810200982 A CN201810200982 A CN 201810200982A CN 108428656 B CN108428656 B CN 108428656B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The invention relates to a substrate conveying device, a system and a method. The control unit is electrically connected with the conveying unit, the bearing unit and the camera shooting unit respectively; the carrying unit is used for receiving the substrate from the first process chamber conveyed by the conveying unit; the camera shooting unit is used for shooting the substrate on the bearing unit and sending the shot image to the control unit; the control unit is used for controlling the bearing unit to position and adjust the substrate according to the image and controlling the conveying unit to convey the positioned substrate to a second process chamber. When the substrate conveying device, the substrate conveying system and the substrate conveying method are used for positioning and adjusting the substrate, the edge of the substrate cannot contact with the positioning mechanism, so that the phenomenon that the edge of the substrate is broken due to the fact that the edge of the substrate contacts with the positioning mechanisms such as the positioning pins in the traditional positioning mode can be avoided.
Description
Technical Field
The invention relates to the technical field of display screens, in particular to a substrate conveying device, a substrate conveying system and a substrate conveying method.
Background
In the evaporation process of an OLED (Organic Light-Emitting Diode) display screen, several chambers are usually required, for example, a substrate carrying-in chamber, a mask chamber, an evaporation process chamber, a substrate carrying-out chamber, a channel, and the like. The entire deposition equipment line usually has a length of 100 m or more because it involves a plurality of deposition processes, including, for example, deposition of an HIL (Hole injection Layer), deposition of an HTL (Hole transport Layer), deposition of an EML (organic light Emitting Layer), and the like. In the whole evaporation process, in order to ensure that the patterns of the substrate and the mask plate correspond to each other during evaporation, the substrate needs to be positioned in the process of conveying the substrate from the previous process chamber to the next process chamber. In a conventional positioning method, a substrate is usually positioned by a positioning mechanism such as a positioning pin, however, this method easily causes a risk of breaking the substrate.
Disclosure of Invention
In view of the above, it is necessary to provide a substrate conveying apparatus, a substrate conveying system and a substrate conveying method, which solve the problem that the substrate is easily broken by the conventional positioning method.
A substrate conveying device is controlled by a control unit; the substrate conveying device comprises a conveying unit, a bearing unit and an image pickup unit; the control unit is electrically connected with the conveying unit, the bearing unit and the camera shooting unit respectively;
the carrying unit is used for receiving the substrate from the first process chamber conveyed by the conveying unit; the camera shooting unit is used for shooting the substrate on the bearing unit and sending the shot image to the control unit; the control unit is used for controlling the bearing unit to position and adjust the substrate according to the image and controlling the conveying unit to convey the positioned substrate to a second process chamber.
In one embodiment, the substrate handling apparatus further comprises a positioning chamber; the bearing unit and the camera shooting unit are both positioned in the positioning cavity, and the camera shooting unit is installed at the top of the positioning cavity and faces the bottom of the positioning cavity.
In one embodiment, the camera unit is located above the bearing unit.
In one embodiment, a moving mechanism electrically connected with the control unit is further arranged in the positioning cavity; the bearing unit is arranged on the moving mechanism;
the moving mechanism is used for driving the bearing unit to move from an original position to the position below the camera unit after the bearing unit receives the substrate under the control of the control unit, and driving the bearing unit to move to the original position after the substrate is conveyed to the second process chamber; wherein the camera unit is located between the home position and the second process chamber.
In one embodiment, the substrate is provided with positioning marks; and the control unit is used for controlling the bearing unit to adjust the state of the substrate according to the positioning mark so as to complete positioning.
In one embodiment, the handling unit is a robot.
A substrate carrying system comprises a control unit and a substrate carrying device; the substrate conveying device is controlled by the control unit.
A substrate carrying method is used for controlling the operation of a substrate carrying device; the substrate conveying device comprises a conveying unit, a bearing unit and an image pickup unit; the method comprises the following steps:
controlling the carrying unit to carry the substrate from the first process chamber to the bearing unit;
controlling the camera unit to shoot the substrate on the bearing unit and receiving an image from the camera unit; and
and controlling the bearing unit to position and adjust the substrate according to the image, and controlling the conveying unit to convey the positioned substrate to a second process chamber.
In one embodiment, the substrate carrying device further includes a positioning chamber, the carrying unit and the camera unit are both located in the positioning chamber, and the camera unit is mounted on the top of the chamber and faces the bottom of the positioning chamber.
In one embodiment, a moving mechanism electrically connected with the control unit is further arranged in the positioning cavity; the bearing unit is arranged on the moving mechanism;
and, between the step of controlling the transfer unit to transfer the substrate from the first process chamber onto the carrier unit and the step of controlling the imaging unit to image the substrate on the carrier unit and receive the image from the imaging unit, the method further comprises:
controlling the moving mechanism to drive the bearing unit to move from the original position to the position below the camera shooting unit;
after the step of controlling the carrying unit to position and adjust the substrate according to the image and controlling the conveying unit to convey the positioned substrate to a second process chamber, the method further includes:
and controlling the moving mechanism to drive the bearing unit to move to the original position.
In the above substrate conveying apparatus, system and method, after the carrying unit receives the substrate from the first process chamber, the image capturing unit captures an image of the substrate, the control unit controls the carrying unit to position and adjust the substrate according to the image captured by the image capturing unit, and the positioned substrate is conveyed to the next process chamber (i.e., the second process chamber) by the conveying unit. Therefore, when the substrate conveying device, the substrate conveying system and the substrate conveying method are used for positioning and adjusting the substrate, the edge of the substrate does not contact with the positioning mechanism, and the phenomenon that the edge of the substrate is broken due to the fact that the edge of the substrate contacts with the positioning mechanisms such as the positioning pins in the traditional positioning mode can be avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings of the embodiments can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of a conventional evaporation apparatus;
FIG. 2 is a schematic line diagram of a conventional evaporation apparatus;
fig. 3 is a circuit block diagram relating to a substrate transfer system according to an embodiment;
FIG. 4 is a schematic view of the substrate conveying device in the substrate conveying system of the embodiment shown in FIG. 3;
FIG. 5 is a schematic structural diagram of the substrate conveying device shown in FIG. 4 after positioning is completed;
FIG. 6 is a circuit block diagram of one embodiment of the substrate handling system of the embodiment shown in FIG. 3;
FIG. 7 is a schematic structural diagram of the substrate conveying apparatus of the embodiment shown in FIG. 6 before positioning;
FIG. 8 is a schematic structural diagram of the substrate transportation device shown in FIG. 7 during positioning;
FIG. 9 is a schematic structural diagram of the substrate transportation device shown in FIG. 7 after positioning is completed;
FIG. 10 is a schematic structural view of the substrate transportation device shown in FIG. 7 after positioning is completed and the carrying unit returns to the original position;
fig. 11 is a flowchart of a substrate transfer method according to another embodiment;
fig. 12 is a flowchart of one example of the substrate transfer method according to the embodiment shown in fig. 11.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In a conventional OLED evaporation process, a substrate is transported by a robot to sequentially enter a plurality of process chambers to complete an evaporation process. Referring to fig. 1, the chambers involved in the substrate evaporation Process include, for example, a substrate loading Chamber (Loader), a Mask Chamber (Mask Stocker), an evaporation Process Chamber (Process Chamber), a substrate unloading Chamber (Un-Loader), a Passage (Passage), and the like. In the whole evaporation equipment line, a plurality of structures as shown in fig. 1 are usually included to complete each evaporation process in sequence, as shown in fig. 2, and the length of the whole evaporation equipment line can reach 100 meters. Based on the above characteristics that the evaporation equipment line has, in the actual production process, carry the in-process of carrying the base plate to the next process chamber with the former process chamber and need fix a position the base plate to make base plate and mask plate aim at. In a conventional positioning method, a plurality of positioning pins surrounding a substrate are arranged to position the substrate, however, in such a positioning method, the edge of the substrate may contact the positioning pins, which may cause the substrate to be broken.
In order to improve the above-mentioned defects of the conventional positioning method, one embodiment provides a substrate conveying system for positioning a substrate. Referring to fig. 3, 4 and 7, the substrate transportation system includes a substrate transportation device and a control unit 100. The substrate transfer apparatus is controlled by the control unit 100. The substrate transfer device may be located between two adjacent process chambers, for example, between a substrate carry-in chamber and a mask chamber. It can be understood that, in the whole evaporation equipment line, one substrate conveying device can be respectively arranged between a plurality of groups of two adjacent process chambers.
The control unit 100 may include one or more controllers, among others. The Controller is, for example, a PLC (Programmable Logic Controller). In this embodiment, the operation of all the mechanisms in the substrate transport apparatus may be controlled by one controller, or the operation of different mechanisms in the substrate transport apparatus may be controlled by different controllers, and the controllers may communicate with each other.
The substrate transfer apparatus includes a transfer unit 200, a carrier unit 300, and an imaging unit 400. The control unit 100 is electrically connected to the conveyance unit 200, the carrier unit 300, and the imaging unit 400, respectively.
The transfer unit 200 can transfer the substrate 700 under the control of the control unit 100. Specifically, the carrying unit 200 is, for example, a robot or other automatic handling device.
The carrier unit 300 is used to receive the substrate 700 from the first process chamber, which is carried by the carrying unit 200. The carrier unit 300 may also perform an operation such as rotation under the control of the control unit 100 to change the posture of the substrate 700. For example: the carrying unit 300 may include a supporting platform and a rotating mechanism, and the supporting platform is mounted on the rotating mechanism. The rotating mechanism can be realized by a conventional structure and is electrically connected to the control unit 100, and the rotating mechanism can rotate under the control of the control unit 100 to drive the supporting platform to rotate. The supporting platform is used for placing the substrate 700, so that the substrate 700 can be driven to rotate correspondingly. The specific implementation of the carrier unit 300 is not limited to the above, as long as the substrate 700 can be carried and the posture of the substrate 700 can be adjusted.
Note that the substrate 700 according to the present embodiment is a finished product or a semi-finished product that is in a predetermined state in a production process and is transferred from a previous process chamber, and therefore, a specific configuration included in the substrate 700 is related to a process performed in the previous process chamber, for example: if the previous process chamber is used for evaporation of the HIL layer, the substrate 700 coming out of the previous process chamber includes a glass substrate and the HIL layer covering the glass substrate.
The image capturing unit 400 is configured to capture an image of the substrate 700 placed on the carrier unit 300 and send the captured image to the control unit 100. The image capturing unit 400 includes, for example, a camera, such as a CCD (Charge-coupled Device) camera or a CMOS (Complementary Metal Oxide Semiconductor) camera.
The control unit 100 is configured to control the carrying unit 300 to position and adjust the substrate 700 according to the image, and control the conveying unit 200 to convey the positioned substrate 700 to the second process chamber. The purpose of the positioning adjustment is to align the adjusted substrate 700 with the pattern of the mask plate after the adjusted substrate enters the next evaporation process. For example: if the control unit 100 determines that the substrate 700 is rotated in the counterclockwise direction by the first angle due to a malfunction or other factors while being transferred through the image photographed by the photographing unit 400, the control unit 100 controls the carrier unit 300 to rotate in the clockwise direction by the first angle, so that the substrate 700 is restored to an accurate posture. In addition, the first process chamber and the second process chamber only represent two adjacent process chambers, and are not limited to which specific process chamber is.
Therefore, the substrate conveying system according to the present embodiment can position and adjust the substrate 700 by using the image capturing unit 400, the control unit 100, and the carrying unit 300, and in the process of positioning and adjusting, the edge of the substrate 700 does not contact with the positioning mechanism, so that the phenomenon of breakage caused by the contact of the edge of the substrate with the positioning mechanism such as a positioning pin in the conventional positioning method can be avoided.
In one embodiment, referring to fig. 4, the substrate transportation apparatus further includes a positioning chamber 500. The carrying unit 300 and the camera unit 400 are both located in the positioning chamber 500, and the camera unit 400 is mounted at the top of the positioning chamber 500 and faces the bottom of the positioning chamber 500. If the carrier unit 300 is located below the image pickup unit 400, the image pickup unit 400 can photograph the substrate 700 at an angle in a plan view.
The two ends of the positioning chamber 500 may respectively reach the first process chamber and the second process chamber through the channels. Specifically, one end of the positioning chamber 500 facing the first process chamber and one end facing the second process chamber may be open, that is, two ends of the positioning chamber 500 are directly communicated with the channel; or, a door assembly is respectively disposed at one end of the positioning chamber 500 facing the first process chamber and one end facing the second process chamber, and the control unit 100 is configured to control the door assembly to open or close. The door body assembly includes, for example, a gate valve. The gate valve can realize opening and closing functions under the control of the control unit 100. Alternatively, the door assembly may also be implemented by using other conventional mechanical assemblies capable of being opened or closed automatically, for example, the mechanical assemblies include a driving unit, a transmission unit and a door, and the control unit 100 controls the driving unit to enable the transmission unit to drive the door to open or close.
It is to be understood that the substrate transfer apparatus is not limited to the positioning chamber 500, and for example, the carrier unit 300 and the camera unit 400 may be directly disposed on a passage between the first process chamber and the second process chamber, and the camera unit 400 may be mounted by a mechanical structure such as a bracket.
Specifically, on the premise that the substrate transportation apparatus includes the positioning chamber 500, please refer to fig. 4 for one implementation of the structures in the positioning chamber 500. The image pickup unit 400 is located above the carrier unit 300. Specifically, the image capturing unit 400 includes two cameras, and the two cameras are respectively located above diagonals of the surface of the carrying unit 300.
The positioning implementation principle of the structure shown in fig. 4 is as follows: the transfer unit 200 transfers the substrate 700 from a previous process chamber (i.e., a first process chamber) onto the carrier unit 300. After that, the image pickup unit 400 starts image pickup of the substrate 700 and transmits the picked-up image to the control unit 100. The control unit 100 receives the image from the imaging unit 400, analyzes the image, and controls the carrier unit 300 to adjust the posture of the substrate 700 to an ideal state if it is determined that the substrate 700 is deviated from the ideal state (i.e., a state suitable for the next deposition process). After the adjustment of the carrier unit 300 is completed, the control unit 100 controls the transfer unit 200 to transfer the substrate 700 to the next process chamber (i.e., the second process chamber), please refer to fig. 5.
Specifically, on the premise that the substrate conveying apparatus includes the positioning chamber 500, please refer to fig. 6 and 7 for another implementation manner of each structure in the positioning chamber 500. The positioning chamber 500 is also provided with a moving mechanism 600 electrically connected to the control unit 100. The carrier unit 300 is mounted on the moving mechanism 600.
The moving mechanism 600 may move the carrying unit 300 within the positioning chamber 500. The specific implementation of the moving mechanism 600 is, for example: moving mechanism 600 includes servo motor, hold-in range, installs a plurality of slides on the hold-in range, and wherein, servo motor is connected with the control unit 100 electricity, and the load cell 300 is installed on corresponding slide, so, under the control of control unit 100, servo motor control hold-in range operation, and then drives load cell 300 through the slide on the hold-in range and remove.
In this embodiment, the moving mechanism 600 is used for driving the carrying unit 300 to move from the original position to the position below the image capturing unit 400 after the carrying unit 300 receives the substrate 700 under the control of the control unit 100, and driving the carrying unit 300 to move to the original position after the substrate 700 is transferred to the second process chamber. Wherein the camera unit 400 is located between the home position and the second process chamber. In other words, the home position is near the first process chamber, and the camera unit 400 is near the second process chamber. Thus, the carrier unit 300 is initially in a home position to receive the substrate 700 from the first process chamber. After the positioning is completed, the carrying unit 300 is now close to the second process chamber, so that the transfer unit 200 can transfer the positioned substrate 700 to the second process chamber.
The positioning implementation principle of the structure shown in fig. 7 is as follows: the carrier unit 300 is initially located at an original position. The control unit 100 controls the transfer unit 200 to transfer the substrate 700 from the first process chamber onto the carrier unit 300. Then, the control unit 100 controls the moving mechanism 600 to drive the carrying unit 300 to move to the lower side of the image capturing unit 400, and then controls the image capturing unit 400 to capture an image of the substrate 700. When the control unit 100 receives the image from the image capturing unit 400, the image is analyzed, and if it is determined that the substrate 700 is shifted from an ideal state (i.e., a state suitable for the next deposition process), the carrier unit 300 is controlled to adjust the posture of the substrate 700 to the ideal state, as shown in fig. 8. After the adjustment of the carrier unit 300 is completed, the control unit 100 controls the transfer unit 200 to transfer the substrate 700 to the second process chamber, as shown in fig. 9. Finally, the control unit 100 controls the moving mechanism 600 to move the carrier unit 300 to the original position to receive the next substrate 700, as shown in fig. 10.
In one embodiment, the substrate 700 is provided with positioning marks. And, the control unit 100 is used for controlling the carrying unit 300 to adjust the state of the substrate 700 according to the positioning mark to complete the positioning. In this embodiment, by providing the positioning mark, the control unit 100 can visually detect the deviation of the substrate 700, and the speed of positioning adjustment can be increased.
It is understood that in other embodiments, if the speed requirement for positioning is low, the substrate 700 may not have positioning marks, and the control unit 100 may directly compare the actual image of the substrate 700 with the standard image to identify the deviation of the substrate 700.
Another embodiment provides a substrate transfer method for controlling the operation of the substrate transfer apparatus in the above embodiments. The substrate conveying device comprises a conveying unit, a bearing unit and an image pick-up unit. The specific structure of the substrate transfer device is the same as that of the previous embodiment, and will not be described herein.
The substrate transfer method may be executed by the control unit 100 in the previous embodiment. Referring to fig. 11, the substrate transfer method includes the following steps.
Step S100, controlling the transfer unit to transfer the substrate from the first process chamber onto the carrier unit.
And step S300, controlling the image pickup unit to shoot the substrate on the bearing unit and receiving the image from the image pickup unit.
Step S400, the carrying unit is controlled to position and adjust the substrate according to the image, and the conveying unit is controlled to convey the positioned substrate to the second process chamber.
Note that the substrate transfer method according to this embodiment is the same as the operation principle of the control unit 100 according to the previous embodiment, and will not be described here again.
Therefore, in the substrate conveying method provided by the embodiment, the substrate can be positioned and adjusted by using the image pickup unit, the control unit and the bearing unit, and in the positioning and adjusting process, the edge of the substrate does not contact with the positioning mechanism, so that the phenomenon that the edge of the substrate is broken due to contact with the positioning mechanism such as the positioning pin in the traditional positioning mode can be avoided.
In one embodiment, the substrate conveying device further includes a positioning chamber, the carrying unit and the camera unit are both located in the positioning chamber, and the camera unit is mounted at the top of the chamber and faces the bottom of the positioning chamber.
Furthermore, a moving mechanism electrically connected with the control unit is arranged in the positioning cavity. The bearing unit is installed on the moving mechanism.
Also, referring to fig. 12, between step S100 and step S300, the method further includes:
step S200, controlling the moving mechanism to drive the carrying unit to move from the original position to the lower side of the camera device.
Meanwhile, after step S400, the method further includes:
step S500, controlling the moving mechanism to drive the carrying unit to move to the original position.
It should be noted that the substrate carrying method provided in this embodiment is the same as the operation principle of the control unit 100 corresponding to fig. 7 to 10 in the previous embodiment, and will not be described again here.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (6)
1. A substrate conveying device is characterized in that the substrate conveying device is controlled by a control unit; the substrate conveying device comprises a conveying unit, a bearing unit and an image pickup unit; the control unit is electrically connected with the conveying unit, the bearing unit and the camera shooting unit respectively;
the carrying unit is used for receiving the substrate from the first process chamber conveyed by the conveying unit; the camera shooting unit is used for shooting the substrate on the bearing unit and sending the shot image to the control unit; the control unit is used for controlling the bearing unit to position and adjust the substrate according to the image, the edge of the substrate does not contact with the positioning mechanism during adjustment, and the conveying unit is controlled to convey the positioned substrate to a second process chamber;
the substrate conveying device also comprises a positioning chamber; the bearing unit and the camera shooting unit are both positioned in the positioning cavity, and the camera shooting unit is arranged at the top of the positioning cavity and faces the bottom of the positioning cavity;
a moving mechanism electrically connected with the control unit is also arranged in the positioning cavity; the bearing unit is arranged on the moving mechanism;
the moving mechanism is used for driving the bearing unit to move from an original position to the position below the camera unit after the bearing unit receives the substrate under the control of the control unit, and driving the bearing unit to move to the original position after the substrate is conveyed to the second process chamber; wherein the camera unit is located between the home position and the second process chamber.
2. The substrate carrier device according to claim 1, wherein the imaging unit is located above the carrying unit.
3. The substrate carrier device according to claim 1 or 2, wherein a positioning mark is provided on the substrate; and the control unit is used for controlling the bearing unit to adjust the state of the substrate according to the positioning mark so as to complete positioning.
4. The substrate carrier device according to claim 1 or 2, wherein the carrier unit is a robot.
5. A substrate carrying system characterized by comprising a control unit and the substrate carrying device according to any one of claims 1 to 4; the substrate conveying device is controlled by the control unit.
6. A substrate carrying method is characterized in that the method is used for controlling the operation of a substrate carrying device; the substrate conveying device is controlled by a control unit and comprises a conveying unit, a bearing unit and a camera shooting unit; the substrate carrying device also comprises a positioning cavity, the bearing unit and the camera shooting unit are both positioned in the positioning cavity, and the camera shooting unit is arranged at the top of the cavity and faces to the bottom of the positioning cavity; a moving mechanism electrically connected with the control unit is also arranged in the positioning cavity; the bearing unit is arranged on the moving mechanism; the method comprises the following steps:
controlling the carrying unit to carry the substrate from the first process chamber to the bearing unit;
controlling the camera unit to shoot the substrate on the bearing unit and receiving an image from the camera unit; and
controlling the bearing unit to position and adjust the substrate according to the image, wherein the edge of the substrate does not contact with a positioning mechanism during adjustment, and controlling the conveying unit to convey the positioned substrate to a second process chamber;
and, between the step of controlling the transfer unit to transfer the substrate from the first process chamber onto the carrier unit and the step of controlling the imaging unit to image the substrate on the carrier unit and receive the image from the imaging unit, the method further comprises:
controlling the moving mechanism to drive the bearing unit to move from the original position to the position below the camera shooting unit;
after the step of controlling the carrying unit to position and adjust the substrate according to the image and controlling the conveying unit to convey the positioned substrate to a second process chamber, the method further includes:
and controlling the moving mechanism to drive the bearing unit to move to the original position.
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| CN201810200982.7A CN108428656B (en) | 2018-03-12 | 2018-03-12 | Substrate conveying device, system and method |
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| CN201810200982.7A CN108428656B (en) | 2018-03-12 | 2018-03-12 | Substrate conveying device, system and method |
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| CN107548518A (en) * | 2015-07-22 | 2018-01-05 | 应用材料公司 | For the device and method for the optical correction that wafer placement is carried out by robot |
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