CN108425113B - Oscillator and its manufacturing method - Google Patents
Oscillator and its manufacturing method Download PDFInfo
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- CN108425113B CN108425113B CN201810148158.1A CN201810148158A CN108425113B CN 108425113 B CN108425113 B CN 108425113B CN 201810148158 A CN201810148158 A CN 201810148158A CN 108425113 B CN108425113 B CN 108425113B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/024—Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of oscillator and its manufacturing method, manufacturing method is the following steps are included: the oscillator ontology with predetermined structure is made in S1, injection molding；S2, mechanical coarsening processing, ultrasonic cleaning are carried out to the surface of the oscillator ontology；S3, chemical nickel plating is carried out to the oscillator ontology, forms electroless nickel layer on the surface of the oscillator ontology；S4, laser laser carving forms barrier line in the electroless nickel layer, to be separated out electroplating region and electroless coating area in the oscillator body surface；S5, plating Copper treatment, form copper plate on the electroplating region of the oscillator ontology；S6, chemical nickel processing is moved back, removes the electroless nickel layer in the electroless coating area of the oscillator ontology；S7, electrotinning processing form plating tin layers on the copper plate and carry out tin protection processing.The manufacturing method of oscillator of the invention combines carry out coating using chemical plating and plating, compared to full chemistry plating the mode time is short, process costs are low, improve production efficiency.
Description
Technical field
The present invention relates to communication antenna technical field more particularly to a kind of oscillator and its manufacturing methods.
Background technique
With the continuous development and network upgrade of 4G/5G wireless communication industry, it is higher and higher to wirelessly communicate the frequency used,
Demand is more and more.Structure design, selection, manufacturing method and the packaging technology of antenna are antenna performance reliability, stability
With the guarantee of robustness.
Oscillator is the mostly important functional parts of inner antenna, and general structure design is complex.The tradition of oscillator is raw
Producing manufacturing process is using metal material (aluminium alloy or kirsite) die cast or sheet metal component, plastic fixtures and circuit
The mode that board group is closed.
What antenna industry plastics oscillator had been introduced into volume production at present is LDS technique (laser direct structuring technique), main
Technique includes: injection molding, laser laser carving, ultrasonic cleaning, quick copper, chemical copper, pickling, chemical nickel, chemical gold etc..So
And existing LDS technique has the disadvantage that
1, current LDS technique is using LDS-LCP material, density 1.81g/cm3, weight is larger and material cost
It is high.
2, LDS-LCP material to the mold temperature of injection molding process, barrel temperature, penetrate pressure, firing rate and molding cycle etc.
It is required that it is very high, it is typically chosen the full electric injection molding machine stable with small screw high rate of fire performance；When raw material stop in screw rod
Between no more than 10 minutes, long time material is easy carbonization, and product is easy the fracture that becomes fragile after molding；LDS-LCP material
Occurs defective products after there is the defects of easy peeling, batch cutting edge of a knife or a sword, will affect to plate, yields is generally 85%, Shooting Technique cost
It is higher.
3, need to carry out laser laser carving processing, laser carving higher cost using all coating surfaces of LDS technique.
4, LDS technological coating requires Cu8 μm-Ni2 μm-Au0.05 μm, the technique for all using chemical plating, wherein changing copper facing
(Cu) time needs 3-4 hours, changes nickel plating (Ni) and needs half an hour, changes gold-plated (Au) and needs half an hour, integration plating production
Process time is long, low efficiency and high process cost.
In view of this, in need improve existing manufacturing method.
Summary of the invention
The technical problem to be solved in the present invention is that providing a kind of manufacture of oscillator for improving production efficiency, reducing cost
Method and oscillator obtained.
The technical solution adopted by the present invention to solve the technical problems is: a kind of manufacturing method of oscillator is provided, including with
Lower step:
The oscillator ontology with predetermined structure is made in S1, injection molding；
S2, mechanical coarsening processing, ultrasonic cleaning are carried out to the surface of the oscillator ontology；
S3, chemical nickel plating is carried out to the oscillator ontology, forms electroless nickel layer on the surface of the oscillator ontology；
S4, laser laser carving forms barrier line in the electroless nickel layer, to be separated out plating in the oscillator body surface
Area and electroless coating area；
S5, plating Copper treatment, form copper plate on the electroplating region of the oscillator ontology；
S6, chemical nickel processing is moved back, removes the electroless nickel layer in the electroless coating area of the oscillator ontology；
S7, electrotinning processing form plating tin layers on the copper plate and carry out tin protection processing.
Preferably, in step S1, the raw material of the oscillator ontology includes fiberglass reinforced polyphenylene sulfide or liquid crystal polymer.
Preferably, in step S1, after the oscillator ontology is made, the oscillator ontology is made annealing treatment.
Preferably, in step S2, by roughness Ra≤6.3 μm of mechanical coarsening treated oscillator body surface.
Preferably, in step S2, mechanical coarsening processing is carried out using surface of the sandblasting to the oscillator ontology；
The material of sandblasting uses the Brown Alundum of 80#-120#.
Preferably, in step S3, chemical nickel plating uses the chemical nickel of phosphorus content >=8%；Electroless nickel layer thickness≤1 of formation
μm。
Preferably, in step S5, copper pre-plating, the bright burnt copper of plating and coke-plated copper are successively carried out on the electroplating region, respectively shape
It successively covers at preplating layers of copper, bright burnt layers of copper and burnt layers of copper, three and forms the copper plate.
Preferably, in step S5, thickness >=9 μm of the copper plate.
Preferably, in step S7, stannous is electroplated on the copper plate, forms plating stannous layer；
Oscillator ontology with plating stannous layer is passivated processing, to form passivating film on the plating stannous layer
Carry out tin protection.
The present invention also provides a kind of oscillators, are made using manufacturing method described in any of the above item.
Beneficial effects of the present invention: combining carry out coating using chemical plating and plating, compared to the mode of full chemistry plating
Time is short, process costs are low, improves production efficiency.
In addition, reducing the product cost of raw material by selecting the lesser plastic material of density, improving production yields.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples, in attached drawing:
Fig. 1 is the flow chart of the manufacturing method of the oscillator of one embodiment of the invention.
Specific embodiment
For a clearer understanding of the technical characteristics, objects and effects of the present invention, now control attached drawing is described in detail
A specific embodiment of the invention.
With reference to Fig. 1, the manufacturing method of the oscillator of one embodiment of the invention is at least included the following steps:
The oscillator ontology with predetermined structure is made in S1, injection molding.
Wherein, injection molding is carried out as raw material using the engineering plastics of high temperature resistant electrodepositable, which may include glass
Enhance polyphenylene sulfide or liquid crystal polymer (LCP) etc..Oscillator body construction shape in corresponding mold according to antenna actual requirement
At.
Fiberglass reinforced polyphenylene sulfide preferably 40% fiberglass reinforced polyphenylene sulfide (PPS+40%GF), the density of the material are
1.66g/cm3, oscillator ontology obtained in weight be less than LDS-LCP material made from oscillator ontology, and price also below
LDS-LCP material is conducive to reduce material cost.Oscillator ontology made from 40% fiberglass reinforced polyphenylene sulfide is also relatively steady in structure
The defects of determining, being not in easy peeling, the burr of LDS-LCP material is conducive to improve product yield.
After oscillator ontology is made in injection molding, also oscillator ontology is made annealing treatment, discharges oscillator ontology internal stress.It moves back
Fire processing may be selected to toast 60min-80min under 260 DEG C of -270 DEG C of high temperature.
S2, mechanical coarsening processing, and ultrasonic cleaning are carried out to the surface (all surface) of oscillator ontology.
By roughness Ra≤6.3 μm of mechanical coarsening treated oscillator body surface, it is therefore intended that guarantee subsequent
Coating adhesion is not in that coating such as falls off and blister at the situations in welding.
Sandblasting mode may be selected in mechanical coarsening handle.Sand-blast material and the automatic blasting equipment of progress sandblasting are without magnetic
The metal component of property, in order to avoid residual magnetic composition influence electric property on oscillator ontology after sandblasting.80#- can be used in sand-blast material
The Brown Alundum of 120# (mesh number).Selection and transmission speed, air pressure, the spray gun hunting frequency of sandblasting procedures in conjunction with sand-blast material etc.
Parameter ensures the uniformity and roughness of sandblasting, so that oscillator body surface obtains scheduled roughness.
Oscillator ontology after will be mechanical coarsening carries out ultrasonic cleaning, removes sandblasting remained on surface.
S3, chemical nickel plating is carried out to oscillator ontology, forms electroless nickel layer on the surface of oscillator ontology.
Before chemical nickel plating, also oscillator ontology is roughened, the heavy pretreatment such as target and activation, those processing can adopt
It is realized with the prior art.
Chemical nickel plating preferably use in high-phosphorus chemical nickel, the i.e. chemical nickel of phosphorus content >=8%, this kind of chemical nickel formed change
Mutual tone pitch (PIM value) effect for learning nickel layer is preferable.
Electroless nickel layer thickness≤1 μm.
S4, laser laser carving forms barrier line in electroless nickel layer, to be separated out electroplating region and non-electrical in oscillator body surface
Plate area.
When laser laser carving, laser laser carving is carried out on barrier line institute position to be formed, removal barrier line institute is to be formed
Electroless nickel layer on position forms barrier line after removal.Barrier line can be 0.5mm wide, mainly fall in electroless coating area, do not destroy
Or reduce the predetermined shape or area of electroplating region.
When laser laser carving, it can be used equipped with manipulator 3D laser laser carving equipment, multiple needs on oscillator ontology can be completed
The case where surface of laser laser carving, corner laser carving line can link completion, be not in dislocation.
S5, plating Copper treatment, form copper plate on the electroplating region of oscillator ontology.
It is electroplated in Copper treatment, copper pre-plating, the bright burnt copper of plating and coke-plated copper is successively carried out on the electroplating region of oscillator ontology, respectively
Preplating layers of copper, bright burnt layers of copper and burnt layers of copper, three is formed successively to cover and form uniform copper plate.
Thickness >=9 μm of copper plate, wherein bright coke layers of copper and burnt layers of copper can be 4 μm or so respectively, preplating copper layer thickness pole
It is small.
S6, chemical nickel processing is moved back, the electroless nickel layer in the electroless coating area of oscillator ontology is removed, thus non-electrical on oscillator ontology
Plating area surface is raw material surface.
Chemical nickel processing is moved back using etching mode.In etching, all surface of oscillator ontology is etched, by 1 μ
Also the surface layer of general 1 μ m-thick of copper plate is removed while the electroless nickel layer stripping of m thickness.
S7, electrotinning processing form plating tin layers on copper plate and carry out tin protection processing.
Thickness >=8 μm of tin layers are electroplated.
Preferably, electrotinning uses stannous, and stannous is electroplated on copper plate, forms plating stannous layer.It will be sub- with plating
The oscillator ontology of tin layers is passivated processing (passivating solution), carries out tin protection to form passivating film on plating stannous layer.
It is to be appreciated that in the manufacturing method of the present invention, after oscillator ontology chemical nickel plating, after laser laser carving, electro-coppering
It after processing, moves back after chemical nickel is handled and after electrotinning processing, is also cleaned respectively.Laser laser carving, is degenerated at plating Copper treatment
The concrete operations for learning nickel processing and electrotinning processing can be implemented by using the prior art.
In the manufacturing method of the present invention, oscillator ontology is carried out in plating Copper treatment, required time is 30min or so, right
In the plating tin layers of 8 μ m thicks, required time about 15min, so that overall time reduces compared with existing full chemistry depositing process
3-4 hours, substantially increase production efficiency.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (8)
1. a kind of manufacturing method of oscillator, which comprises the following steps:
S1, the obtained oscillator sheet with predetermined structure of injection molding is carried out as raw material using the engineering plastics of high temperature resistant electrodepositable
Body；The raw material includes fiberglass reinforced polyphenylene sulfide or liquid crystal polymer；
S2, mechanical coarsening processing, ultrasonic cleaning are carried out to the surface of the oscillator ontology；
S3, chemical nickel plating is carried out to the oscillator ontology, forms electroless nickel layer on the surface of the oscillator ontology；Wherein, chemical
Nickel plating uses the chemical nickel of phosphorus content >=8%；Electroless nickel layer thickness≤1 μm of formation；
S4, in the electroless nickel layer laser laser carving formed barrier line, with the oscillator body surface be separated out electroplating region and
Electroless coating area；
S5, plating Copper treatment, form copper plate on the electroplating region of the oscillator ontology；
S6, chemical nickel processing is moved back, removes the electroless nickel layer in the electroless coating area of the oscillator ontology；
S7, electrotinning processing form plating tin layers on the copper plate and carry out tin protection processing.
2. the manufacturing method of oscillator according to claim 1, which is characterized in that in step S1, the oscillator ontology is made
Afterwards, the oscillator ontology is made annealing treatment.
3. the manufacturing method of oscillator according to claim 1, which is characterized in that in step S2, by mechanical coarsening processing
Roughness Ra≤6.3 μm of oscillator body surface afterwards.
4. the manufacturing method of oscillator according to claim 1, which is characterized in that in step S2, using sandblasting to the vibration
The surface of sub- ontology carries out mechanical coarsening processing；
The material of sandblasting uses the Brown Alundum of 80#-120#.
5. the manufacturing method of oscillator according to claim 1, which is characterized in that in step S5, successively in the electroplating region
Upper progress copper pre-plating, the bright burnt copper of plating and coke-plated copper are respectively formed preplating layers of copper, bright burnt layers of copper and burnt layers of copper, three and successively cover
Form the copper plate.
6. the manufacturing method of oscillator according to claim 1, which is characterized in that in step S5, the thickness of the copper plate
≥9μm。
7. the manufacturing method of oscillator according to claim 1, which is characterized in that in step S7,
The electrotinning on the copper plate forms plating tin layers；
Oscillator ontology with plating tin layers is passivated processing, carries out tin guarantor to form passivating film in the plating tin layers
Shield.
8. a kind of oscillator, which is characterized in that be made using the described in any item manufacturing methods of claim 1-7.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3243190A1 (en) * | 1982-11-23 | 1984-05-24 | Bayer Ag, 5090 Leverkusen | METHOD FOR PRODUCING METALIZED TEXTILE AREAS |
| CN102206817A (en) * | 2011-03-17 | 2011-10-05 | 比亚迪股份有限公司 | Preparation method of plastic product |
| CN102268704A (en) * | 2011-07-18 | 2011-12-07 | 深圳市飞荣达科技股份有限公司 | Double-laser opposite etching blockage selective electroplating method |
| CN103741148A (en) * | 2013-12-25 | 2014-04-23 | 中国电子科技集团公司第三十六研究所 | Metallization process for honeycomb epoxy glass fiber reinforced plastic antenna |
| CN206650168U (en) * | 2017-01-09 | 2017-11-17 | 佛山市波谱达通信科技有限公司 | A kind of radiating doublet and spotlight antenna |
-
2018
- 2018-02-13 CN CN201810148158.1A patent/CN108425113B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3243190A1 (en) * | 1982-11-23 | 1984-05-24 | Bayer Ag, 5090 Leverkusen | METHOD FOR PRODUCING METALIZED TEXTILE AREAS |
| CN102206817A (en) * | 2011-03-17 | 2011-10-05 | 比亚迪股份有限公司 | Preparation method of plastic product |
| CN102268704A (en) * | 2011-07-18 | 2011-12-07 | 深圳市飞荣达科技股份有限公司 | Double-laser opposite etching blockage selective electroplating method |
| CN103741148A (en) * | 2013-12-25 | 2014-04-23 | 中国电子科技集团公司第三十六研究所 | Metallization process for honeycomb epoxy glass fiber reinforced plastic antenna |
| CN206650168U (en) * | 2017-01-09 | 2017-11-17 | 佛山市波谱达通信科技有限公司 | A kind of radiating doublet and spotlight antenna |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4071281A4 (en) * | 2019-12-12 | 2023-01-04 | ZTE Corporation | Method for surface metallization of oscillator and metallized oscillator |
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| CN108425113A (en) | 2018-08-21 |
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Inventor after: Zhang Quanhong Inventor after: Chen Feng Inventor before: Chen Feng |