CN111254468A - Method for manufacturing vibrator - Google Patents
Method for manufacturing vibrator Download PDFInfo
- Publication number
- CN111254468A CN111254468A CN202010067192.3A CN202010067192A CN111254468A CN 111254468 A CN111254468 A CN 111254468A CN 202010067192 A CN202010067192 A CN 202010067192A CN 111254468 A CN111254468 A CN 111254468A
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- main body
- vibrator
- manufacturing
- copper
- copper layer
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/364—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith using a particular conducting material, e.g. superconductor
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
Abstract
The application discloses a method for manufacturing a vibrator, which comprises the steps of manufacturing a vibrator main body, and carrying out mechanical roughening and chemical roughening on the surface of the vibrator main body; carrying out chemical copper plating on the oscillator main body to obtain a chemical copper layer; performing laser etching on the chemical copper layer to form an electroplating area and an non-electroplating area on the surface of the oscillator main body; carrying out copper electroplating treatment on the electroplating area, and carrying out copper stripping treatment on the electroless copper layer on the non-electroplating area; and carrying out electrotinning and tin protection treatment on the oscillator main body. The manufacturing method of the oscillator can eliminate the adverse effect of the nickel layer on signal transmission, reduce the workload, avoid the waste of the copper layer and reduce the production cost.
Description
Technical Field
The invention belongs to the technical field of communication antennas, and particularly relates to a manufacturing method of a vibrator.
Background
With the continuous development and network upgrade of the 4G/5G wireless communication industry, the frequency of wireless communication is higher and higher, and the demand is more and more. The structural design, material selection, manufacturing method and assembly process of the antenna guarantee the reliability, stability and durability of the antenna performance. The oscillator is the most important functional component in the antenna, is called as an antenna oscillator in the whole, has the functions of guiding and amplifying electromagnetic waves, and enables electromagnetic signals received by the antenna to be stronger, and the oscillator is complex in structural design. The vibrator in the prior art is manufactured by adopting a die-casting molding process of a metal material (aluminum alloy or zinc alloy) or a combination mode of a sheet metal part, a plastic fixing part and a circuit board.
At present, the plastic vibrator used in the latest plastic vibrator production process in the antenna industry adopts a PPS plastic electroplating mode, and the main process comprises the following steps: injection molding, roughening treatment, ultrasonic cleaning, chemical roughening, palladium precipitation, chemical nickel, laser etching, copper electroplating, chemical nickel stripping and tin electroplating. It can be seen that the nickel plating process is used in the prior art, because the stability of chemical nickel plating is higher than that of chemical copper plating, the liquid medicine is convenient to control, and moreover, in laser etching, the laser etching nickel layer is lower than the laser etching copper layer in difficulty.
However, the above process has the following disadvantages: the metal nickel layer in the vibrator is magnetic, so that the signal transmission of the antenna is adversely affected, and the Passive Intermodulation (PIM) value of the antenna is affected; the oscillator is subjected to laser etching after chemical nickel plating, the retention time of a nickel layer in air is long, the oxidation phenomenon is serious, and the nickel layer needs to be subjected to activation treatment before copper plating, so that an oxidation film is removed; moreover, the chemical nickel-stripping adopts a scheme that strong acid is used for reinforcing an oxidizing agent and a surfactant (protecting a copper layer), and the copper layer stripped off is thicker than the nickel layer while the nickel is stripped off, so that waste is generated.
Disclosure of Invention
In order to solve the problems, the invention provides a method for manufacturing a vibrator, which can eliminate the adverse effect of a nickel layer on signal transmission, reduce the workload, avoid the waste of a copper layer and reduce the production cost.
The invention provides a method for manufacturing a vibrator, which comprises the following steps:
manufacturing a vibrator main body, and performing mechanical roughening and chemical roughening on the surface of the vibrator main body;
carrying out chemical copper plating on the oscillator main body to obtain a chemical copper layer;
performing laser etching on the chemical copper layer to form an electroplating area and an non-electroplating area on the surface of the oscillator main body;
carrying out copper electroplating treatment on the electroplating area, and carrying out copper stripping treatment on the electroless copper layer on the non-electroplating area;
and carrying out electrotinning and tin protection treatment on the oscillator main body.
Preferably, in the method of manufacturing a resonator, the oscillator body is plated with electroless copper to obtain an electroless copper layer including:
and carrying out chemical copper plating on the oscillator main body by adopting chemical copper of a copper sulfate system to obtain a chemical copper layer with the thickness not more than 0.5 micron.
Preferably, in the method for manufacturing a resonator, the laser etching the electroless copper layer to form a plated region and an electroless plated region on the surface of the resonator body includes:
and performing laser etching on the chemical copper layer by using infrared laser, removing the copper layer at the position where the barrier line is to be formed, forming the barrier line with the width of 0.5mm, and forming an electroplating area and an non-electroplating area.
Preferably, in the above method for manufacturing a resonator, the step of performing electrolytic copper plating on the plating region includes:
and carrying out electro-coppering treatment on the electroplating area by adopting acid copper plating, wherein the thickness of the electro-coppering area is not less than 8 microns.
Preferably, in the method for manufacturing a resonator, the step of performing a copper stripping process on the electroless copper layer on the electroless plating region includes:
and carrying out complete copper stripping treatment on the electroless copper layer on the non-electroplating area by adopting a microetching mode, and exposing the surface of the raw material.
Preferably, in the method for manufacturing a resonator, the step of performing the electrolytic tinning and tin protection treatment on the resonator body includes:
adopting a methanesulfonic acid or stannous sulfate system to carry out electrotinning on the oscillator main body, wherein the electrotinning is not less than 8 microns;
and soaking the oscillator main body with the tin layer in tin protective liquid to form a protective film on the surface of the oscillator main body.
Preferably, in the method for manufacturing a vibrator, the manufacturing of the vibrator main body includes:
and manufacturing the vibrator main body in an injection molding mode, and performing stress relief treatment on the vibrator main body.
Preferably, in the method of manufacturing a resonator, the surface of the resonator body is mechanically roughened to:
and mechanically roughening the surface of the vibrator main body to obtain a surface with the roughness Ra of less than or equal to 5 micrometers.
Preferably, in the method of manufacturing a resonator, the surface of the resonator body is chemically roughened to:
and cleaning and metallizing the surface of the vibrator main body.
As can be seen from the above description, the method for manufacturing the vibrator according to the present invention includes the steps of firstly manufacturing a vibrator main body, and mechanically roughening and chemically roughening the surface of the vibrator main body; then, carrying out chemical copper plating on the oscillator main body to obtain a chemical copper layer; performing laser etching on the chemical copper layer to form an electroplating area and an non-electroplating area on the surface of the oscillator main body; performing copper electroplating treatment on the electroplating area, and performing copper stripping treatment on the chemical copper layer on the non-electroplating area; finally, the oscillator main body is subjected to electrotinning and tin protection treatment, and thus, the scheme replaces nickel with copper, so that the adverse effect of a nickel layer on signal transmission can be eliminated, the workload is reduced, the waste of a copper layer is avoided, and the production cost is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic diagram of a method for manufacturing a vibrator provided by the present application.
Detailed Description
The core of the invention is to provide a method for manufacturing the oscillator, which can eliminate the adverse effect of a nickel layer on signal transmission, reduce the workload, avoid the waste of a copper layer and reduce the production cost.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1 is a schematic view of a method for manufacturing a vibrator, where the method includes the following steps:
s1: manufacturing a vibrator main body, and performing mechanical roughening and chemical roughening on the surface of the vibrator main body;
in a specific scheme, engineering plastics can be used as raw materials, the raw materials can comprise glass fiber reinforced polyphenylene sulfide or Liquid Crystal Polymer (LCP) and the like, an oscillator main body is manufactured in an injection molding mode, an oscillator main body structure is formed in a corresponding mold according to the actual requirement of an antenna, stress removal treatment is carried out on the oscillator main body, and the stress removal treatment can be carried out for 60min at the high temperature of 150 ℃.
S2: carrying out chemical copper plating on the oscillator main body to obtain a chemical copper layer;
it can be seen that this step is the key point of the present solution, and copper is used to replace nickel in the prior art.
S3: performing laser etching on the chemical copper layer to form an electroplating area and an non-electroplating area on the surface of the oscillator main body;
it should be noted that the laser etching technology has been developed to perform laser etching on the electroless copper layer, so that the nickel layer does not need to be laser etched as before.
S4: carrying out copper electroplating treatment on the electroplating area, and carrying out copper stripping treatment on the chemical copper layer on the non-electroplating area;
specifically, the copper in the electroplating area is thickened, and the copper in the non-electroplating area is removed.
S5: and carrying out electrotinning and tin protection treatment on the oscillator main body.
As can be seen from the above description, in the embodiments of the method for manufacturing the resonator provided by the present application, since the method includes the steps of firstly manufacturing the resonator main body, and performing mechanical roughening and chemical roughening on the surface of the resonator main body; then, carrying out chemical copper plating on the oscillator main body to obtain a chemical copper layer; performing laser etching on the chemical copper layer to form an electroplating area and an non-electroplating area on the surface of the oscillator main body; performing copper electroplating treatment on the electroplating area, and performing copper stripping treatment on the chemical copper layer on the non-electroplating area; finally, the oscillator main body is subjected to electrotinning and tin protection treatment, and thus, the scheme replaces nickel with copper, so that the adverse effect of a nickel layer on signal transmission can be eliminated, the workload is reduced, the waste of a copper layer is avoided, and the production cost is reduced.
In a specific embodiment of the above method for manufacturing a resonator, electroless copper plating is performed on the resonator body to obtain an electroless copper layer:
and carrying out chemical copper plating on the oscillator main body by adopting chemical copper of a copper sulfate system to obtain a chemical copper layer with the thickness not more than 0.5 micron, wherein the thickness is convenient for the subsequent laser etching process.
Specifically, the chemical copper plating liquid medicine system is divided into a copper nitrate system, a copper chloride system and a copper sulfate system. The copper nitrate system electroplating industry in the three systems is not used, the main stream is the liquid medicine of a copper sulfate and copper chloride system, further, the chemical copper plating binding force of the copper sulfate system is more stable, and the binding force between a plastic matrix and chemical copper can be ensured by matching with online analysis and automatic adding equipment.
In another specific embodiment of the above method for manufacturing a resonator, the laser etching is performed on the electroless copper layer, and the formation of the plated area and the non-plated area on the surface of the resonator body is as follows:
and performing laser etching on the chemical copper layer by using infrared laser, removing the copper layer at the position where the barrier line is to be formed, forming the barrier line with the width of 0.5mm, and forming an electroplating area and an electroless plating area. It should be noted that the laser radium carving process can adopt 3D laser radium carving equipment with a mechanical arm, can finish the surfaces of multiple required laser radium carving on the oscillator main body, and the corner radium carving line can be finished in a linkage mode, so that the dislocation situation cannot occur.
In another embodiment of the above method for manufacturing a resonator, the step of performing copper electroplating on the electroplating region may be: the electroplating zone is subjected to an electroplating copper treatment with a thickness of not less than 8 μm by acid copper plating, which is a step of thickening the copper layer, since the electroless copper layer previously produced is thin and thus the main film thickness of the final copper layer structure is derived from the acid copper plating layer. It should be noted that the acid copper plating has the characteristics of good filling and leveling property, small internal stress and the like, and the dye-free additive process is adopted, so that the copper layer is a semi-bright plating layer to ensure the binding force between the copper layer and the plastic base material.
In a preferred embodiment of the method for manufacturing a resonator, the step of performing copper stripping on the electroless copper layer on the electroless plating area may be: and carrying out complete copper stripping treatment on the electroless copper layer on the non-electroplating area by adopting a microetching mode to expose the surface of the raw material. In the microetching, all the surfaces of the transducer body were etched, and the electroless copper layer having a thickness of 0.5 μm was removed and the surface of the copper-plated layer was also removed by about 0.5 μm.
In another preferred embodiment of the above method for manufacturing a vibrator, the electroplating and tin protecting process performed on the vibrator body may specifically be: adopting a methanesulfonic acid or stannous sulfate system to carry out electrotinning on the oscillator main body, wherein the electrotinning is not less than 8 microns, the tin has good weldability and corrosion resistance, and the electrotinning on the copper plating layer can protect the copper layer from being damaged by the external environment; the vibrator main body with the tin layer is soaked in the tin protective liquid to form the protective film on the surface of the vibrator main body, so that the corrosion resistance of the tin layer can be improved.
In the method for manufacturing the vibrator, the mechanically roughening the surface of the vibrator body may specifically be: and mechanically roughening the surface of the vibrator main body to obtain a surface with the roughness Ra of less than or equal to 5 micrometers. Specifically, the roughness Ra of the surface of the vibrator after mechanical roughening treatment is less than or equal to 5 micrometers so as to ensure the adhesion of a subsequent coating, the mechanical roughening treatment can select a sand blasting mode, sand blasting materials can adopt 80# -120# (mesh number) white corundum, glass sand and the like, automatic sand blasting equipment is adopted, parameters such as transmission speed, air pressure, spray gun swing frequency and the like in the sand blasting process are controlled so as to ensure the uniformity and the roughness of sand blasting, the surface of the plastic vibrator obtains preset roughness, and the sand blasting air pressure can adopt 0.7-1.0 MPa.
In the method for manufacturing the resonator, the chemically roughening the surface of the resonator body may specifically be: the surface of the vibrator main body is cleaned and metallized, and particularly, the surface of the plastic vibrator can be cleaned, chemically roughened, subjected to surface charge adjustment, subjected to palladium precipitation or conductive film precipitation and the like.
To sum up, in the above-mentioned embodiment that this application provided, can promote the stability of liquid medicine through chemical copper's automatic control system to guarantee to replace nickel with copper, can reduce chemical copper plated thickness moreover, can also solve radium carving problem of separation line through the adjustment to the parameter of laser radium carving machine, this use of having just avoided nickel, thereby have following many-sided advantage: the adverse effect of the nickel layer on signal transmission is eliminated, the workload is reduced, the waste of the copper layer is avoided, and the production cost is reduced.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A method for manufacturing a vibrator, comprising:
manufacturing a vibrator main body, and performing mechanical roughening and chemical roughening on the surface of the vibrator main body;
carrying out chemical copper plating on the oscillator main body to obtain a chemical copper layer;
performing laser etching on the chemical copper layer to form an electroplating area and an non-electroplating area on the surface of the oscillator main body;
carrying out copper electroplating treatment on the electroplating area, and carrying out copper stripping treatment on the electroless copper layer on the non-electroplating area;
and carrying out electrotinning and tin protection treatment on the oscillator main body.
2. The vibrator manufacturing method according to claim 1, wherein the vibrator body is subjected to electroless copper plating to obtain an electroless copper layer:
and carrying out chemical copper plating on the oscillator main body by adopting chemical copper of a copper sulfate system to obtain a chemical copper layer with the thickness not more than 0.5 micron.
3. The vibrator manufacturing method according to claim 1, wherein the forming of the plated area and the non-plated area on the surface of the vibrator body by laser etching the electroless copper layer comprises:
and performing laser etching on the chemical copper layer by using infrared laser, removing the copper layer at the position where the barrier line is to be formed, forming the barrier line with the width of 0.5mm, and forming an electroplating area and an non-electroplating area.
4. The vibrator manufacturing method of claim 1, wherein the step of performing electro-coppering treatment on the plating area comprises:
and carrying out electro-coppering treatment on the electroplating area by adopting acid copper plating, wherein the thickness of the electro-coppering area is not less than 8 microns.
5. The vibrator manufacturing method of claim 1, wherein the step of performing copper stripping treatment on the electroless copper layer on the electroless plating area comprises:
and carrying out complete copper stripping treatment on the electroless copper layer on the non-electroplating area by adopting a microetching mode, and exposing the surface of the raw material.
6. The vibrator manufacturing method of any of claims 1-5, wherein the electroplating and tin protecting treatment of the vibrator body comprises:
adopting a methanesulfonic acid or stannous sulfate system to carry out electrotinning on the oscillator main body, wherein the electrotinning is not less than 8 microns;
and soaking the oscillator main body with the tin layer in tin protective liquid to form a protective film on the surface of the oscillator main body.
7. The transducer manufacturing method according to any one of claims 1 to 5, wherein the transducer main body is manufactured by:
and manufacturing the vibrator main body in an injection molding mode, and performing stress relief treatment on the vibrator main body.
8. The transducer manufacturing method according to any one of claims 1 to 5, wherein the mechanical roughening is performed on the surface of the transducer body to:
and mechanically roughening the surface of the vibrator main body to obtain a surface with the roughness Ra of less than or equal to 5 micrometers.
9. The transducer manufacturing method according to any one of claims 1 to 5, wherein the surface of the transducer body is chemically roughened to:
and cleaning and metallizing the surface of the vibrator main body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010067192.3A CN111254468A (en) | 2020-01-20 | 2020-01-20 | Method for manufacturing vibrator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010067192.3A CN111254468A (en) | 2020-01-20 | 2020-01-20 | Method for manufacturing vibrator |
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| CN111254468A true CN111254468A (en) | 2020-06-09 |
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| CN202010067192.3A Pending CN111254468A (en) | 2020-01-20 | 2020-01-20 | Method for manufacturing vibrator |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112779536A (en) * | 2020-12-30 | 2021-05-11 | 深圳市信维通信股份有限公司 | Plastic metallization method and product |
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| CN112779536A (en) * | 2020-12-30 | 2021-05-11 | 深圳市信维通信股份有限公司 | Plastic metallization method and product |
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Application publication date: 20200609 |