CN113529078A - Method for manufacturing shielding cover and shielding cover - Google Patents
Method for manufacturing shielding cover and shielding cover Download PDFInfo
- Publication number
- CN113529078A CN113529078A CN202110630944.7A CN202110630944A CN113529078A CN 113529078 A CN113529078 A CN 113529078A CN 202110630944 A CN202110630944 A CN 202110630944A CN 113529078 A CN113529078 A CN 113529078A
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- China
- Prior art keywords
- cover body
- shielding cover
- shielding
- manufacturing
- nickel
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title description 35
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 115
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 57
- 238000007747 plating Methods 0.000 claims abstract description 44
- 238000009713 electroplating Methods 0.000 claims abstract description 40
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910052802 copper Inorganic materials 0.000 claims abstract description 37
- 239000010949 copper Substances 0.000 claims abstract description 37
- 239000000126 substance Substances 0.000 claims abstract description 34
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 27
- 239000003054 catalyst Substances 0.000 claims abstract description 24
- 238000010329 laser etching Methods 0.000 claims abstract description 19
- 238000005488 sandblasting Methods 0.000 claims abstract description 19
- 238000000151 deposition Methods 0.000 claims abstract description 14
- 230000008021 deposition Effects 0.000 claims abstract description 12
- 238000006386 neutralization reaction Methods 0.000 claims abstract description 9
- 229920006351 engineering plastic Polymers 0.000 claims abstract description 5
- 239000000243 solution Substances 0.000 claims description 28
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 26
- 238000007788 roughening Methods 0.000 claims description 21
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 6
- 239000011574 phosphorus Substances 0.000 claims description 6
- 229910052698 phosphorus Inorganic materials 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000012459 cleaning agent Substances 0.000 claims description 4
- 229910052593 corundum Inorganic materials 0.000 claims description 4
- 239000010431 corundum Substances 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 239000011259 mixed solution Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 57
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 38
- 229910052763 palladium Inorganic materials 0.000 description 22
- 239000002253 acid Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 230000004913 activation Effects 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000004891 communication Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- -1 palladium ions Chemical class 0.000 description 6
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 5
- 239000004576 sand Substances 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 229920007019 PC/ABS Polymers 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000005422 blasting Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 2
- 229910052705 radium Inorganic materials 0.000 description 2
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 2
- 230000001235 sensitizing effect Effects 0.000 description 2
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910001432 tin ion Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910021205 NaH2PO2 Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 229910001430 chromium ion Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000002198 insoluble material Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/06—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for producing matt surfaces, e.g. on plastic materials, on glass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a manufacturing method of a shielding cover, which comprises the following steps: manufacturing a shielding cover body with a preset shape by using engineering plastics; carrying out sand blasting treatment on the shielding cover body to coarsen the surface of the shielding cover body; placing the shielding cover body in an ultrasonic cleaning solution for ultrasonic cleaning; sequentially carrying out chemical coarsening, neutralization, catalyst deposition, dispergation and chemical nickel plating treatment on the shielding cover body; removing the nickel layer between the inner side wall and the outer side wall of the shielding cover body through laser etching; and arranging the shielding cover body on an electroplating hanger, enabling a conductive pin on the electroplating hanger to abut against the inner side wall of the shielding cover body, and then placing the shielding cover body into an electroplating pool for copper plating to form a copper shielding layer. The shielding cover manufactured by the manufacturing method is light in weight and has good shielding performance.
Description
Technical Field
The invention relates to the technical field of electronic equipment processing, in particular to a manufacturing method of a shielding cover and the shielding cover manufactured by the manufacturing method.
Background
In the field of automobile manufacturing technology, a housing, particularly a cover, of a device such as a communication device and a battery in an automobile has a high requirement for shielding property to prevent interference with other devices. Conventional automobile part suppliers generally adopt metal materials to manufacture the covers, so as to ensure good shielding performance.
For example, a vehicle-mounted T-BOX (telematics BOX) is used as an important part in an internet of vehicles system, and is mainly used for communicating with a background system/a mobile phone APP to realize vehicle information display and control of the mobile phone APP. After a user sends a control command through a mobile phone end APP, the TSP background CAN send a monitoring request command to the vehicle-mounted T-BOX, after the vehicle obtains the control command, the vehicle sends a control message through the CAN bus and realizes control over the vehicle, and finally an operation result is fed back to the mobile phone APP of the user, so that only the function CAN help the user to remotely start the vehicle, open an air conditioner, adjust a seat to a proper position and the like. The vehicle-mounted T-BOX is essentially a gateway, i.e., a communication device. In the practical application process, in order to avoid the phenomenon that signals are mutually interfered with other communication equipment in an automobile, a cover body of the vehicle-mounted T-BOX is usually set to be a metal cover body to play a role in shielding the signals.
However, with the development of more and more automobiles in the direction of ultra-light weight, automobile manufacturers do not only limit the parameter indexes of parts in the automobiles to the functional aspect, but also make certain requirements on the weight, so that the weight of the whole automobile is reduced as much as possible. In view of this, a conventional metal-pressed vehicle-mounted T-BOX cover needs to be improved to reduce the weight.
Disclosure of Invention
The present invention has been made to solve the above-mentioned problems, and an object thereof is to provide a method for manufacturing a shield cover, which can manufacture a shield cover having a light weight and a good shielding performance.
In order to achieve the above object, the present invention provides a method for manufacturing a shield cover, including:
manufacturing a shielding cover body with a preset shape by using engineering plastics;
carrying out sand blasting treatment on the shielding cover body to coarsen the surface of the shielding cover body;
placing the shielding cover body in an ultrasonic cleaning solution for ultrasonic cleaning;
sequentially carrying out chemical coarsening, neutralization, catalyst deposition, dispergation and chemical nickel plating treatment on the shielding cover body;
removing the nickel layer between the inner side wall and the outer side wall of the shielding cover body through laser etching;
and arranging the shielding cover body on an electroplating hanger, enabling a conductive pin on the electroplating hanger to abut against the inner side wall of the shielding cover body, and then placing the shielding cover body into an electroplating pool for copper plating to form a copper shielding layer.
Preferably, when the shielding cover body is subjected to sand blasting treatment, white corundum with 60-120 meshes is adopted as a blasting material, the sand blasting pressure is 0.3-0.6Mpa, the walking speed of the shielding cover body is 15-30mm/s, and the swing speed of a sand blasting head is 30-60 mm/s.
Preferably, when the shielding cover body is placed in an ultrasonic cleaning solution for ultrasonic cleaning, the content of the ultrasonic cleaning agent is 20-50g/L, the temperature is 40-50 ℃, the cleaning time is 3-5min, and the ultrasonic frequency is 20-40 KHZ.
Preferably, when the shielding cover body is subjected to chemical roughening, a mixed solution of chromic anhydride and sulfuric acid is adopted, wherein the concentration of chromic anhydride is 200-400g/L, the concentration of sulfuric acid is 200-400g/L, the roughening temperature is 60-80 ℃, and the roughening time is 10-30 min. Preferably, the inner side of the shielding cover body is provided with more than one accommodating cavity;
and before the shielding cover body is placed on an electroplating hanger, performing laser etching to remove the nickel layer between the accommodating cavities.
Preferably, when the shielding cover body with the preset shape is manufactured, a boss for fixing the conductive pin is further arranged in the accommodating cavity, and the boss is provided with a fixing hole.
Preferably, the shield cover body is continuously vibrated in the catalyst solution while the catalyst is deposited.
Preferably, when the laser etching treatment is carried out, the power of the laser etching machine is 20-80W, the frequency is 10-30KHZ, and the speed is 3000-5000 mm/s.
Preferably, after the shielding cover body is plated with copper, the shielding cover body is further subjected to nickel stripping treatment, high phosphorus nickel electroplating and nickel hole sealing treatment in sequence.
In addition, the invention also relates to a shielding cover which is manufactured by the manufacturing method of the shielding cover.
According to the above description and practice, the method for manufacturing the shielding cover of the invention can form the copper shielding layer by sequentially performing sand blasting, ultrasonic cleaning, chemical roughening, neutralization, catalyst deposition, glue release, chemical nickel plating, laser etching to remove part of the nickel layer and copper electroplating on the prefabricated shielding cover body, so that the shielding cover body made of engineering plastics has shielding property. The shielding cover manufactured by the method is light in weight and has good shielding performance.
In addition, the manufacturing method adds a laser etching process, an insulating tape can be arranged on the shielding cover body, an electroplating area and a non-electroplating area can be distinguished, and the shielding layer can be selectively electroplated during subsequent electroplating, namely, the shielding layer is electroplated only at a required position.
In addition, two coarsening procedures of sand blasting and chemical coarsening are arranged in the manufacturing method, so that the surface of the shielding cover body is ensured to have good roughness, and the phenomena of whitening, blackening, colorful and the like caused by too long chemical coarse speech time can be avoided.
Drawings
Fig. 1 is a schematic flow chart of a method for manufacturing a shield cover according to an embodiment of the present invention.
Fig. 2 is a schematic structural view of a shield cover according to an embodiment of the present invention.
In the figure: 1. the shielding cover comprises a shielding cover body 2, a containing cavity 3 and a boss.
Detailed Description
Exemplary embodiments will now be described more fully with reference to the accompanying drawings. The exemplary embodiments, however, may be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Fig. 1 is a schematic flow chart of a method for manufacturing a shield cover according to an embodiment of the present invention. As shown in fig. 1, the manufacturing method of the shielding cover includes the following steps:
step S1: the shield cover body with a preset shape is made of engineering plastics.
In this embodiment, a PC/ABS material (a mixture of polycarbonate and acrylonitrile butadiene styrene) is used, and a process of injection molding is used to form a shield cover body having a predetermined shape. Fig. 2, for example, shows one structure of the shield cover body 1 in this embodiment. The shield cover body 1 is applied to a vehicle-mounted T-BOX, and therefore, a plurality of communication devices need to be provided inside thereof. Referring to fig. 2, a plurality of accommodating cavities 2 are disposed on the inner side of the shielding cover body 1 for accommodating different communication devices, and signal interference does not need to be ensured between the communication devices in each accommodating cavity 2, so that a shielding layer needs to be disposed on the inner side wall of each accommodating cavity 2.
It should be noted that, in this embodiment, the method for manufacturing the shielding cover is described as the shielding cover of the vehicle-mounted T-BOX, and in other embodiments, when there is only one device to be shielded inside the shielding cover, the plurality of accommodating cavities need not be provided inside the shielding cover body. In addition, the manufacturing method is described in the embodiment with respect to the shielding cover made of PC/ABS material, and the manufacturing method is also applicable to the shielding cover body made of other engineering materials.
Step S2: the shield cover body 1 is subjected to sand blasting to roughen the surface thereof.
In this step, the shield cover body 1 is physically roughened, specifically by a sand blasting method. By carrying out physical roughening on the shielding cover body 1, the time for carrying out chemical roughening on the shielding cover body 1 in the follow-up process can be reduced, and meanwhile, the surface of the shielding cover body 1 can be ensured to have high-density microscopic pits before chemical plating treatment, so that the anchor effect required by chemical plating is achieved.
When the sand is sprayed, if the sprayed material is too fine, the roughness of the surface of the shielding cover body 1 cannot meet the requirement, and if the sprayed material is too coarse, the surface of the shielding cover body 1 is too rough, so that the appearance of the shielding cover body is affected. In addition, the speed of the shield cover body also affects the coarsening degree. In addition, because there are a plurality of holding chambeies in the inboard of shield lid body 1, traditional sand blasting can not ensure that all positions of shield lid body 1 can obtain the coarsing. Therefore, the sand blasting head is added with the swinging motion during the sand blasting, and the surface of the shielding cover body 1 can be ensured to be uniformly roughened.
Specifically, in the sand blasting process, white corundum with 60-120 meshes is used as a blasting material, the sand blasting pressure is 0.3-0.6Mpa, the speed of the shielding cover body is 15-30mm/s, and the swing speed of a sand blasting head is 30-60 mm/s.
In one embodiment, 80-mesh white corundum is used as a spraying material, the sand spraying pressure is 0.6Mpa, the speed of the shielding cover body is 20mm/s, and the swinging speed of the sand spraying head is 40mm/s, so that a better coarsening effect can be achieved.
Step S3, the shield cover body 1 is placed in an ultrasonic cleaning solution to be subjected to ultrasonic cleaning, so as to remove sand and grease remaining on the shield cover body 1.
In actual operation, the ultrasonic cleaning time is too long, microscopic pits on the surface of the shielding cover body 1 are abraded, the roughness is reduced, and the binding force of a subsequent chemical plating layer is influenced; the ultrasonic cleaning time is too short, and sand dust particles on the surface of a product are difficult to clean, so that the surface of the product has no adhesive force, and the binding force of a subsequent chemical plating layer is also influenced.
Specifically, during ultrasonic cleaning, the content of ultrasonic cleaning agent in the ultrasonic cleaning solution is 20-50g/L, the temperature is 40-50 ℃, the cleaning time is 3-5min, and the ultrasonic frequency is 20-40KHZ
The ultrasonic cleaning liquid contains surfactant components, and can be directionally and uniformly arranged on the surface of the shielding cover body 1, so that the surface of the shielding cover body 1 can be fully and uniformly contacted with a solution for chemical roughening during subsequent chemical roughening treatment, and the efficiency and uniformity of chemical roughening are improved. Meanwhile, the organic solvent in the ultrasonic cleaning liquid can eliminate partial residual stress in the shielding cover body 1, so that the structure of the shielding cover is more stable.
Step S4, sequentially performing chemical roughening, neutralization, catalyst deposition, dispergation, and chemical nickel plating on the shield cover body 1.
Wherein, the chemical coarsening adopts a mixed solution of chromic anhydride and sulfuric acid, the concentration of chromic anhydride is 200-400g/L, the concentration of sulfuric acid is 200-400g/L, the coarsening temperature is 60-80 ℃, and the coarsening time is 10-30 min.
The chemical coarsening can make the surface of the material of the shielding cover body 1 present microscopic coarseness, increase the contact area of the subsequent plating layer and the shielding cover body 1 and provide an anchor effect; meanwhile, the surface of the shielding cover body 1 is changed from hydrophobicity to hydrophilicity, so that the electroplating solution can be more conveniently infiltrated on the surface; the surface of the shielding cover body 1 is negatively charged after coarsening, and Sn is easily adsorbed2+、Ag+Plasma is carried out, so that subsequent neutralization, catalyst deposition and chemical nickel plating can be smoothly carried out. However, in the chemical roughening process, too long roughening time may cause the color of the shield cover body 1 to change, and the shield cover body to appear white, black, colorful, and the like, while too short roughening time may affect the adhesion of the plating layer, and the plating layer may directly fall off in severe cases.
The requirement of the shielding cover body 1 on the appearance is high, so that the problem of color change caused by overlong chemical roughening time is avoided. Therefore, in the manufacturing method, the treatment time of chemical roughening is shortened, and physical roughening is introduced before chemical roughening, so that sufficient microscopic pits are ensured on the surface of the shielding cover body 1, and sufficient anchoring force is improved for subsequent plating layers.
The purpose of neutralization is to remove the hexavalent chromium remaining in the surface micropores of the shield cap body 1 after chemical roughening and the hexavalent chromiumIt is an impurity. The hexavalent chromium remained in the shielding cover body 1 can influence the adsorption of the surface of the shielding cover body on palladium ions, so that plating leakage is caused; meanwhile, hexavalent ions can oxidize tin and colloidal palladium, the hexavalent chromium and impurities enter the palladium tank to cause the decomposition of the palladium tank, and trivalent chromium ions can not oxidize Sn in the palladium tank solution2+The poisoning effect on the colloid palladium is reduced.
Specifically, an isopropanol solution with the concentration of 5-15% (volume ratio) is adopted in the neutralization process, and the neutralization treatment is carried out for 5-10min at the temperature of 40-60 ℃, so that the hexavalent chromium remained on the surface of the shielding cover body in the coarsening way can be neutralized, and the absorption of palladium ions by the shielding cover body in the subsequent working procedures is facilitated.
The deposited catalyst combines the sensitizing and activating process to replace two steps of sensitizing and ionic activating, and this can raise the binding force of the coating. In the embodiment, a palladium catalyst solution is adopted, the concentration of palladium in the palladium catalyst solution is 30-60ppm, the content of hydrochloric acid is 250-350ml/L, the temperature of the deposited catalyst is 25-35 ℃, and the time is 5-15 min. The palladium catalyst solution contains tin/palladium colloid and other ions, the palladium ions are attached to the surface of the shielding cover body after soaking and are surrounded by stannous hydrolysis ions, and excessive tin (stannous chloride) in the solution is firstly brought with the Cr6+Or O in air2The tin colloid is generated by oxidation, and NaCl in the solution can improve the stability of the solution and help acid to absorb palladium ions to the surface of the shielding cover body.
In one embodiment, in order to improve the deposition effect of palladium, the concentration of palladium in the palladium catalyst solution was set to 60ppm, the temperature of the deposited catalyst was set to 35 ℃, and the time was set to 15 min.
In addition, in this embodiment, since a metal layer needs to be electroplated on the shielding cover body to form the shielding layer, and the conventional electroplating process needs to hang the test piece to be electroplated on the hanger, a hole is formed on the test piece, thereby affecting the shielding performance of the shielding layer. Therefore, a boss 3 for fixing a conductive pin on the electroplating hanger is arranged on the inner side of the shielding cover body, a fixing hole is formed in the boss 3, and the diameter of the fixing hole is not more than 3 mm. When in use, the conductive needle is arranged in the fixed hole in a penetrating way. Because the inner diameter of the fixed hole is smaller, air is easy to exist in the fixed hole when the catalyst is deposited, no palladium ion deposition exists on the inner surface of the fixed hole, namely the inner surface of the fixed hole is not metalized, and finally the plating leakage phenomenon occurs during subsequent chemical nickel plating and electroplating. Therefore, when depositing the catalyst, the shielding cover body needs to be continuously vibrated to exhaust the air in the fixing holes, so as to ensure that the surface of the shielding cover body can be completely metalized.
After the deposition of the catalyst, since the surface of the shield cover body 1 is coated with divalent tin ions (Sn) around the colloidal palladium adsorbed in the palladium catalyst solution2+) Encapsulated, rendering the colloidal palladium catalytically inactive. Therefore, it is necessary to dissolve divalent tin ions around palladium ions by a dispergation process so that the palladium ions are exposed and have catalytic activity.
In the dispergation process, the content of dispergator in dispergator solution is 10-30% (volume ratio), the temperature is 45-55 deg.C, and the time is 1-5 min.
The chemical nickel plating is to pre-plate a layer of metal nickel on the surface of the shielding cover body 1, so that the surface of the shielding cover body 1 has conductivity, and the subsequent copper electroplating process is convenient.
In this step, Ni is contained in the solution used for electroless nickel plating2+The content of (A) is 4.5-6.5g/L, NaH2PO2·H2The content of O is 10-15g/L, pH value is 8-9, temperature is 40-50 deg.C, and time is 1-5 min. It should be noted that, because the follow-up still is equipped with radium carving process, the thickness of the nickel layer of plating should not be too thick in the chemical nickel plating process, otherwise radium carving can't get rid of the nickel layer completely and form insulating partition, and the thickness of the nickel layer of plating should not the undersize simultaneously, otherwise the nickel layer drops easily in the follow-up process, produces the phenomenon of plating leakage. Therefore, the thickness of the nickel layer should be controlled between 0.5-1 μm when the nickel is chemically plated.
In addition, moisture may exist on the neutralized shield cover body 1, and if the neutralized shield cover body directly enters the subsequent deposition catalyst process, the water may be decomposed (ionized) to form hydrated ions, and in order to prevent neutral moisture from being brought into the subsequent deposition catalyst process, the shield cover body 1 is placed in an acidic solution to be pre-soaked, and then the deposition catalyst process is performed. Specifically, the presoaking adopts hydrochloric acid solution, wherein the concentration of the hydrochloric acid is 10-20% (volume ratio), the temperature is room temperature, and the presoaking time is 1-5 min.
Step S5, removing the nickel layer between the inner side wall and the outer side wall of the shielding cover body through laser etching.
In the step, a laser etching process is adopted to remove the nickel layer between the inner side wall and the outer side wall of the shielding cover body to form an insulating strip, and during subsequent copper electroplating, selective copper electroplating can be realized only on the inner side wall of the shielding cover body.
In one embodiment, a plurality of receiving cavities are formed inside the shielding cover body 1, and shielding layers between the receiving cavities need to be insulated from each other. Therefore, the nickel layer on the surface is removed by laser etching among all the accommodating cavities, so that the inner side walls of all the accommodating cavities are mutually insulated.
When laser etching treatment is carried out, the energy and frequency of the laser etching are too low, the nickel layer is not easy to cut off, and the overflow plating phenomenon is easy to occur during subsequent electroplating; when the laser etching energy is too large, metal particles and the shielding cover body are easily burnt. Therefore, the power of the laser etching machine should be controlled at 20-80W, the frequency set at 10-30KHZ, and the speed set at 3000-.
In addition, before laser etching, in order to make the shielding cover body in a dry state, the shielding cover body with the surface residual moisture needs to be dried to remove the moisture on the surface.
Step S6, the shielding cover body 1 is placed on an electroplating hanger, so that the conductive pins on the electroplating hanger are abutted against the inner side wall of the shielding cover body, and then the shielding cover body is placed into an electroplating pool for copper plating to form a copper shielding layer.
During electroplating, a plating metal (copper in this embodiment) or other insoluble material is used as an anode, and a workpiece to be plated (i.e., the shield cover body 1) is used as a cathode. Therefore, a workpiece to be plated needs to be placed on an electroplating hanger, and a conductive needle is hung on a region to be electroplated, so that the plating leakage phenomenon can occur if the conductive needle is hung in a leakage manner. In this embodiment, the inner side of the shielding cover body 1 is provided with a boss 3 for fixing the conductive pin on the electroplating hanger, the boss 3 is provided with a fixing hole, the diameter of the fixing hole is not more than 3mm, and when in use, the conductive pin is inserted into the fixing hole, thereby ensuring that the plating leakage phenomenon cannot occur in the electroplating process.
The copper is plated by adopting an electroplating process, so that a layer of copper is plated on the surface of the nickel layer, and the conductivity and the shielding property of the shielding cover body 1 are enhanced. The surface resistance of the shielding cover body 1 is smaller than 1 ohm/square centimeter, and the shielding effect can reach 30dB-60 dB. In addition, the electroplated copper layer also plays a role in repairing the damage of the surface, so that the surface has better flatness, luster and smoothness.
When the copper is electroplated, the phenomenon of over-plating and copper particles is easy to occur when the current is too large, and the phenomenon of acid reverse corrosion of an alkali nickel layer is easy to occur when the current is too small, so that the plating leakage is caused. Therefore, during electroplating, the copper sulfate content in the solution is 150-250g/L, the sulfuric acid is 80-120g/L, the chlorine ion concentration is 70-130ppm, the cylinder opening agent is 1-30ml/L, the light agent is 1-30ml/L, the temperature is 20-40 ℃, the time is 1-2 hours, and the current is 5A/dm2. At this parameter, the plated copper layer is uniform in thickness, has a good appearance, and has a resistance of less than 1 ohm per square centimeter of plating.
In one embodiment, the shield cover body is also subjected to ultrasonic cleaning and acid pickling activation in sequence before the electrolytic copper plating. The ultrasonic cleaning liquid contains surfactant components, and can be directionally and uniformly arranged on the surface of the shielding cover body 1 to remove grease and dirt on the surface of the shielding cover body. So as to prevent the surface of the shielding cover body from influencing the binding force between the nickel layer and the electroplated copper layer due to the existence of impurities such as grease and the like during subsequent electroplating of copper. Specifically, during ultrasonic cleaning, the content of the ultrasonic cleaning agent in the ultrasonic cleaning solution is 20-50g/L, the temperature is 40-50 ℃, the cleaning time is 5-10min, and the ultrasonic frequency is 20-40 KHZ.
The acid washing activation aims to clean an oxide layer on the surface of the nickel layer and prevent the nickel layer from forming an oxide film in the air, so that poor binding force between coatings or peeling between the nickel layer and a copper layer is caused. Specifically, the acid washing activation adopts sulfuric acid solution, wherein the concentration of the sulfuric acid is 3-5% (volume ratio), the temperature is room temperature, and the time is 1-5 minutes.
In yet another embodiment, there are high demands on the appearance of the outer side of the shield cover body 1, requiring removal of the nickel layer thereon, leaving only the plastic appearance. Therefore, after the copper electroplating is finished, the shielding cover body 1 is also subjected to nickel stripping treatment to strip the nickel layer outside the electroplating region and retain the metal coating of the electroplating region, and the surface of the shielding cover body after nickel stripping has no spots and no damage and has a smooth and attractive appearance. When the nickel is removed, the copper coating is corroded at the same time to generate a plating leakage phenomenon due to too long time, the plating removal time is too short, the nickel coating is not completely removed, and the appearance of the product is influenced. Therefore, the nickel stripping adopts liquid medicines such as citric acid, sulfuric acid, sodium persulfate, copper corrosion inhibitor and the like, the content of the citric acid is set to be 30-50g/L, the content of the sodium persulfate is set to be 30-50g/L, the content of the sulfuric acid is set to be 30-60g/L, the content of the copper corrosion inhibitor is set to be 80-120ml/L, the temperature is set to be 45-55 ℃, and the time is set to be 3-15 min. Under the environment, the nickel layer can be removed, and the corrosion amount of the copper layer is ensured to be less than 1 mu m.
In another embodiment, the shielding cover body 1 has a higher shielding performance requirement, so a layer of high phosphorus nickel is further electroplated on the surface of the copper layer. High phosphorous nickel is most excellent in shielding performance in all metal plating layers. For occasions with higher shielding requirements, copper plating is generally carried out first and nickel plating is carried out, and the copper plating and the nickel plating are combined to achieve an excellent shielding effect. In addition, the high-phosphorus nickel alloy has the characteristics of uniform plating layer, high bonding force, high hardness, excellent wear resistance and corrosion resistance, and can prolong the service life of the shielding cover body. Specifically, when the high-phosphorus nickel is electroplated, the content of nickel in the solution is 50-70g/L, the content of boric acid is 30-50g/L, the content of the high-phosphorus nickel is 40-90g/L, the content of the additive is 1-50ml/L (the additive is formed by chemical liquid such as bright leveling agent), the pH value is 1-2, the temperature is 30-35 ℃, and the time is 1-40 min.
In addition, before the high-phosphorus nickel is electroplated, the shielding cover body is also subjected to acid washing activation, and the acid washing activation aims to clean an oxidation layer on the surface of a copper layer and prevent the copper layer from forming an oxidation film in the air, so that poor bonding force between plating layers or peeling between the high-phosphorus nickel layer and the copper layer is avoided. Specifically, the acid washing activation adopts sulfuric acid solution, wherein the concentration of the sulfuric acid is 3 percent (volume ratio), the temperature is room temperature, and the time is 3-10 minutes.
In another embodiment, in order to increase the corrosion resistance of the electroplated coating, the shielding cover body is further subjected to nickel sealing treatment, and a protective layer in a nanometer level is formed on the surface of the electroplated coating. The nickel hole sealing treatment adopts acrylic acid and other solutions, the concentration of the nickel hole sealing is 1-20% (volume ratio), the temperature is 25-35 ℃, and the time is 30-60 seconds.
And finally, drying the shielding cover body to ensure that the shielding cover is fully dried and is in a waterless state, thereby preventing the shielding cover from discoloring, water stain and the like. Specifically, the drying temperature is set to be 60-85 ℃, and the time is set to be 120-180 min.
In yet another embodiment, a shielding cover is provided, which is manufactured by the method. The shielding cover body 1 is as shown in fig. 2, which shows a structure of an inner side surface of the shielding cover body 1, in this embodiment, the inner side surface of the shielding cover body 1 is provided with a plurality of accommodating cavities 2, shielding layers need to be arranged in the accommodating cavities 2, and the shielding layers are insulated from each other. In order to facilitate electroplating treatment, the surface of the accommodating cavity 2 is also provided with a boss 3 with a fixing hole, and the inner diameter of the fixing hole is smaller than 3 mm. When in use, the conductive pin in the electroplating process is inserted into the fixing hole on the boss 3.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein, and any reference signs in the claims are not intended to be construed as limiting the claim concerned.
Claims (10)
1. A manufacturing method of a shielding cover is characterized by comprising the following steps:
manufacturing a shielding cover body with a preset shape by using engineering plastics;
carrying out sand blasting treatment on the shielding cover body to coarsen the surface of the shielding cover body;
placing the shielding cover body in an ultrasonic cleaning solution for ultrasonic cleaning;
sequentially carrying out chemical coarsening, neutralization, catalyst deposition, dispergation and chemical nickel plating treatment on the shielding cover body;
removing the nickel layer between the inner side wall and the outer side wall of the shielding cover body through laser etching;
and arranging the shielding cover body on an electroplating hanger, enabling a conductive pin on the electroplating hanger to abut against the inner side wall of the shielding cover body, and then placing the shielding cover body into an electroplating pool for copper plating to form a copper shielding layer.
2. The method of manufacturing a shield cover according to claim 1,
when the shielding cover body is subjected to sand blasting treatment, white corundum with 60-120 meshes is adopted as a spraying material, the sand blasting pressure is 0.3-0.6Mpa, the walking speed of the shielding cover body is 15-30mm/s, and the swing speed of a sand blasting head is 30-60 mm/s.
3. The method of manufacturing a shield cover according to claim 1,
when the shielding cover body is placed in ultrasonic cleaning liquid for ultrasonic cleaning, the content of the ultrasonic cleaning agent is 20-50g/L, the temperature is 40-50 ℃, the cleaning time is 3-5min, and the ultrasonic frequency is 20-40 KHZ.
4. The method of manufacturing a shield cover according to claim 1,
when the shielding cover body is subjected to chemical roughening, a mixed solution of chromic anhydride and sulfuric acid is adopted, wherein the concentration of chromic anhydride is 200-400g/L, the concentration of sulfuric acid is 200-400g/L, the roughening temperature is 60-80 ℃, and the roughening time is 10-30 min.
5. The method of manufacturing a shield cover according to claim 1,
the inner side of the shielding cover body is provided with more than one accommodating cavity;
and before the shielding cover body is placed on an electroplating hanger, performing laser etching to remove the nickel layer between the accommodating cavities.
6. The method of manufacturing a shield cover according to claim 5,
when the shielding cover body with the preset shape is manufactured, a boss for fixing the conductive pin is arranged in the accommodating cavity, and a fixing hole is formed in the boss.
7. The method of manufacturing a shield cover according to claim 6,
the shield cover body is continuously vibrated in the catalyst solution while depositing the catalyst.
8. The method of manufacturing a shield cover according to claim 1 or 5,
when the laser etching treatment is carried out, the power of the laser etching machine is 20-80W, the frequency is 10-30KHZ, and the speed is 3000-5000 mm/s.
9. The method of manufacturing a shield cover according to any one of claims 1 to 7,
after the shielding cover body is plated with copper, the shielding cover body is sequentially subjected to nickel stripping treatment, high-phosphorus nickel electroplating and nickel hole sealing treatment.
10. A shield cover, characterized by being manufactured by the method of manufacturing a shield cover according to any one of claims 1 to 9.
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| CN202110630944.7A CN113529078A (en) | 2021-06-07 | 2021-06-07 | Method for manufacturing shielding cover and shielding cover |
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Application publication date: 20211022 |