CN109348636A - A kind of circuit board processing method - Google Patents
A kind of circuit board processing method Download PDFInfo
- Publication number
- CN109348636A CN109348636A CN201811260410.4A CN201811260410A CN109348636A CN 109348636 A CN109348636 A CN 109348636A CN 201811260410 A CN201811260410 A CN 201811260410A CN 109348636 A CN109348636 A CN 109348636A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- board processing
- conducting layer
- region
- processing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention provides a kind of circuit board processing methods, for enclosing metal conducting layer on non-metallic products surface according to demand, comprising: S1, be fixed on the worktable the substrate for being coated with the first metal conducting layer；Non-selective region on S2, control laser beam irradiation substrate, melts the first metal conducting layer in the non-selective region；S3, electroplating processes are carried out to the substrate surface, so that selection region plates the second metal conducting layer.The present invention on substrate using first the first metal layer is covered, and by laser ablation non-selective region, the mode for retaining the upper second metal layer of selection region plating carries out circuit board processing, improves production efficiency.
Description
Technical field
The present invention relates to electronic technology fields, more particularly to a kind of circuit board processing method.
Background technique
With the continuous development of electronic technology field, the demand to various circuit boards is increasing, processes and goes to circuit board
For industry, it is necessary to which the circuit board processing method of higher efficiency and higher precision is provided.Traditional circuit board processing industry is generally all
It is that metal covering is formed by circuit on substrate by chemical plating or plating.But the problem is that electroless plating time compared with
Long, efficiency is too low；Electroplating time is relatively short, but more demanding to the preprocessing of substrate.
Existing electroplating processing process mainly with the substrate containing metal is processed into substrate, then to the surface of substrate into
The certain processing of row forms required selection region, allows internal metal to be exposed to outer, then by carrying out electricity to the substrate
Plating allows tin plating in exposed metallic region position.
In actual operation, because containing metal in substrate, the circuit board that certain pairs of magnetism require can not make the program
With, and since it is desired that being pre-processed to substrate, higher cost improved efficiency is little.
Summary of the invention
In view of the above problems, it proposes on the present invention overcomes the above problem or at least be partially solved in order to provide one kind
State a kind of circuit board processing method of problem.
To solve the above-mentioned problems, the invention discloses a kind of circuit board processing methods, comprising:
A kind of circuit board processing method, for enclosing metal conducting layer on non-metallic products surface according to demand, comprising:
S1, the substrate for being coated with the first metal conducting layer is fixed on the worktable；
Non-selective region on S2, control laser beam irradiation substrate, melts the first metallic conduction in the non-selective region
Layer；
S3, electroplating processes are carried out to the substrate surface, so that selection region plates the second metal conducting layer.
Further, before the step S1 further include:
Blank substrate surface is plated into the first metal conducting layer.
Further, the step S2 further include:
Control laser beam irradiation substrate on non-selective region contour edge fixed width region formed formulate width every
From band, the first metal conducting layer of the isolation strip of non-selective region edge fixed width is melted.
Further, after the step S2 further include:
Increase conductive hole in selection region.
Further, the step S3 includes:
Electricity, which is connect, by the conductive hole carries out electroplating processes.
Further, the step S2 further include:
It controls two laser beams and forms crosspoint in non-selective region, control the crosspoint ablation non-selective region.
The present invention includes the following advantages:
The present invention, by laser ablation non-selective region, retains selection area using first the first metal layer is covered on substrate
The mode that upper second metal layer is electroplated in domain carries out circuit board processing, improves production efficiency.
Detailed description of the invention
Fig. 1 is a kind of flow diagram of circuit board processing method of the invention；
Fig. 2 is the schematic diagram of circuit board in a kind of circuit board processing method of the embodiment of the present invention.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing and specific real
Applying mode, the present invention is described in further detail.
It referring to Fig.1, is a kind of flow chart of circuit board processing method of the embodiment of the present invention；
In embodiments of the present invention, preparatory chemical plating is first carried out to common substrate；
Step 101 plates the first metal conducting layer for common substrate by way of chemical plating；
The first metal conducting layer is done using copper in embodiments of the present invention.Ready substrate is placed on pre-configured
Chemical plating medicament in be kept fixed the time, take out after the substrate surface good attachment metal layer and dry.
The substrate for being coated with the first metal conducting layer is fixed on workbench by step 102；
Workbench is fixed on after the substrate of the first metal conducting layer of surface good attachment is dried, the workbench can be machine
Tool arm.
Non-selective region in step 103, control laser beam irradiation substrate；
After substrate is fixed on the worktable, position and the angle of substrate are adjusted, laser beam is allowed to be radiated at base
Non-selective region on plate melts the first metal conducting layer of the non-selective region, also by the irradiation of laser beam in this way
It is copper.Making the copper coating on non-selective region in this way, all ablation is fallen.
An isolation out can also be melted using the fringe region laser beam irradiation in non-selective region in step 103
Band keeps apart non-selective region and selection region；Then the conduction of plating can be stamped in selection region after step 103
Hole.
Further, in the step 103 to non-selective region carry out laser irradiation ablation when, in order to improve efficiency and safety
Property, crosspoint can be formed in non-selective region using two laser beams of control, control the crosspoint ablation non-selective region.
The power of such two beams laser beam can be relatively lower, but the crosspoint of two beam laser beams can form higher temperature satisfaction
It is more than the temperature of single beam laser to improve efficiency that ablation demand, which can even allow temperature,.
Step 104 carries out electroplating processes to the substrate surface, so that selection region plates the second metal conducting layer.
If punched to selection region after step 103, electrode can be fixed in electroplating hole, if do not had
Electrode can be fixed on selection region surface in other ways by punching, be then placed into electroplate liquid and be electroplated, made
The second metal conducting layer can be plated by obtaining selection region, and the second metal conducting layer half is metallic tin.If in step 103
Non-selective region all has been melted, then completion is electroplated later with regard to end step.If only having melted non-selection area in step 103
The edge in domain, in plating because of non-selective region no power, non-selective region will not be plated the second metallic conduction
Layer, but later can handle by other means the circuit board after plating of plating completion can eliminate non-selective region
The first metal conducting layer, such as by chemical attack etc..
In embodiments of the present invention, then non-by laser ablation by one layer of metal layer in chemical plating first on substrate
Selection region only allows selection region to carry out the conductive layer attachment that plating completes circuit, improves production efficiency.
It is the circuit board schematic diagram produced in the embodiment of the present invention referring to Fig. 2；
Substrate 10 is the substrate for being attached to the first metal conducting layer in figure；Non-selective region 20 is in board design
In should non-cohesive metal conducting layer region；Isolation strip 21 is the marginal portion of the non-selective region 20, non-to be isolated
Selection region 20 and selection region 30.
In conjunction with Fig. 1, all standing chemical plating can be done to substrate 10 in a step 101, substrate 10 is placed in deployed
In chemical medicinal liquid, the surface of substrate 10 is waited all to cover the first metal conducting layer, first metal conducting layer can be copper；
In actual operation, if 30 covering surface of selection region and little, can the chemical plating the step of in only meet all selections
Region 30 is all immersed in chemical medicinal liquid, and the surface of all selection regions 30 is allowed all to cover the first metal conducting layer.
In step 103, it can all be melted using laser irradiation for non-selective region 20, it can also be to non-selection area
The fringe region in domain 20 is irradiated ablation, so that the edge of non-selective region 20 forms the isolation strip 21 of one fixed width, allows non-
Selection region 20 and selection region 30 are isolated.Conductive hole 31 can be formed by way of punching in selection region 30；In this way
Electrode can be fixed on conductive hole 31 at step 104 and carry out energization electroplating operations.
In embodiments of the present invention, then non-by laser ablation by one layer of metal layer in chemical plating first on substrate
Selection region only allows selection region to carry out the conductive layer attachment that plating completes circuit, improves production efficiency.
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that process, method, article or terminal device including a series of elements not only wrap
Those elements are included, but also including other elements that are not explicitly listed, or further includes for this process, method, article
Or the element that terminal device is intrinsic.In the absence of more restrictions, being wanted by what sentence "including a ..." limited
Element, it is not excluded that there is also other identical elements in process, method, article or the terminal device for including the element.
It above to a kind of chip thermal cycle simulation provided by the present invention, is described in detail, tool used herein
Principle and implementation of the present invention are described for body example, the above embodiments are only used to help understand this hair
Bright method and its core concept；At the same time, for those skilled in the art, according to the thought of the present invention, specific real
Apply in mode and application range that there will be changes, in conclusion the content of the present specification should not be construed as to limit of the invention
System.
Claims (8)
1. a kind of circuit board processing method, for enclosing metal conducting layer on non-metallic products surface according to demand, feature exists
In, comprising:
S1, the substrate for being coated with the first metal conducting layer is fixed on the worktable；
Non-selective region on S2, control laser beam irradiation substrate, melts the first metal conducting layer in the non-selective region；
S3, electroplating processes are carried out to the substrate surface, so that selection region plates the second metal conducting layer.
2. circuit board processing method according to claim 1, which is characterized in that before the step S1 further include:
Blank substrate surface is plated into the first metal conducting layer.
3. circuit board processing method according to claim 2, which is characterized in that the step S2 further include:
The contour edge fixed width region for controlling non-selective region on laser beam irradiation substrate forms the isolation strip for formulating width,
Melt the first metal conducting layer of the isolation strip of non-selective region edge fixed width.
4. circuit board processing method according to claim 2, which is characterized in that after the step S2 further include:
Increase conductive hole in selection region.
5. circuit board processing method according to claim 4, which is characterized in that the step S3 includes:
Electricity, which is connect, by the conductive hole carries out electroplating processes.
6. circuit board processing method according to claim 1 or 3, which is characterized in that the step S2 further include:
It controls two laser beams and forms crosspoint in non-selective region, control the crosspoint ablation non-selective region.
7. circuit board processing method according to claim 1, which is characterized in that first conductive metal layer is copper.
8. circuit board processing method according to claim 7, which is characterized in that second conductive metal layer is tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811260410.4A CN109348636A (en) | 2018-10-26 | 2018-10-26 | A kind of circuit board processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811260410.4A CN109348636A (en) | 2018-10-26 | 2018-10-26 | A kind of circuit board processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109348636A true CN109348636A (en) | 2019-02-15 |
Family
ID=65312196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811260410.4A Pending CN109348636A (en) | 2018-10-26 | 2018-10-26 | A kind of circuit board processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109348636A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102268704A (en) * | 2011-07-18 | 2011-12-07 | 深圳市飞荣达科技股份有限公司 | Double-laser opposite etching blockage selective electroplating method |
| CN102904010A (en) * | 2012-10-17 | 2013-01-30 | 南京华格电汽塑业有限公司 | Antenna oscillator utilizing plastic as main material and manufacturing method of antenna oscillator |
| CN108425113A (en) * | 2018-02-13 | 2018-08-21 | 深圳市飞荣达科技股份有限公司 | Oscillator and its manufacturing method |
-
2018
- 2018-10-26 CN CN201811260410.4A patent/CN109348636A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102268704A (en) * | 2011-07-18 | 2011-12-07 | 深圳市飞荣达科技股份有限公司 | Double-laser opposite etching blockage selective electroplating method |
| CN102904010A (en) * | 2012-10-17 | 2013-01-30 | 南京华格电汽塑业有限公司 | Antenna oscillator utilizing plastic as main material and manufacturing method of antenna oscillator |
| CN108425113A (en) * | 2018-02-13 | 2018-08-21 | 深圳市飞荣达科技股份有限公司 | Oscillator and its manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101624715A (en) | Process flow for selective thick-gold electroplating without gold plated lead | |
| DE59900882D1 (en) | METHOD FOR METALLIC COATING OF SUBSTRATES | |
| CN101315961A (en) | LED conducting wire frame and method for producing the same | |
| CN109348636A (en) | A kind of circuit board processing method | |
| CN102373497A (en) | Electroplating apparatus and electroplating method thereof | |
| CN219260245U (en) | Electroplating jig for local plane of semiconductor electronic element | |
| CN204449554U (en) | A kind of board unit Reflow Soldering positioning tool | |
| CN106211595A (en) | A kind of printed circuit board processing method | |
| CN201509372U (en) | Magnetic carrying tool | |
| EP3329737B1 (en) | Connecting thermally-sprayed layer structures of heating devices | |
| DE2528000A1 (en) | Large area solder application - involves application of solder repellant grid over silvering paste and dip or flow soldering | |
| CN215898131U (en) | Tool for tin-coating process | |
| CN109396651A (en) | A kind of laser ablation processing method | |
| US3152388A (en) | Printed circuit processing | |
| US5063660A (en) | Method for manufacturing preforms coated with hard solder for repairing interconnect interruptions | |
| CN105491815A (en) | Reflow soldering template, template component, tin paste printing device and reflow soldering method | |
| CN218611445U (en) | Frock is pruned to connector pin | |
| CN107604423B (en) | A kind of clamping device suitable for more substrate high-precision plating | |
| CN107745211A (en) | Wiring board welding system and wiring board positioning tool | |
| CN206237692U (en) | The SMT production tools of flexible yielding PCB | |
| CN206509611U (en) | Corrosion-resistant solder horn | |
| US6502740B2 (en) | Soldering method | |
| CN221175883U (en) | Patch bridge wire type ignition resistor | |
| CN109561604A (en) | A kind of circuit board substrate processing method | |
| CN108811337A (en) | A kind of production method of double-sided PCB board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190215 |
|
| RJ01 | Rejection of invention patent application after publication |