CN108417738B - OLED device fabrication method - Google Patents

OLED device fabrication method Download PDF

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CN108417738B
CN108417738B CN201810232021.4A CN201810232021A CN108417738B CN 108417738 B CN108417738 B CN 108417738B CN 201810232021 A CN201810232021 A CN 201810232021A CN 108417738 B CN108417738 B CN 108417738B
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cathode contact
oled device
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CN108417738A (en
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邴一飞
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14Carrier transporting layers
    • H10K50/16Electron transporting layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • H10K59/8052Cathodes
    • H10K59/80522Cathodes combined with auxiliary electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本发明提供一种OLED器件的制作方法,在衬底基板上设置与阳极层相间隔的阴极接触层,在像素定义层上对应于阴极接触层的上方设置阴极接触孔,制作过程中电子传输层从像素开口内延伸到阴极接触孔内而将阴极层与阴极接触层间隔开,在器件正常工作之前,为了使阴极接触层与阴极层之间电导通,对阴极层和阳极层施加相等电势的正电压,同时对阴极接触层施加一个小于阴极层电势的电压,使阴极接触层和阴极层之间形成电势差,电子传输层在电场的作用下被击穿而导电,从而实现阴极层和阴极接触层的电导通,OLED器件在工作时,阴极接触孔层可以直接对阴极层提供电压电流补偿,进而能够防止OLED显示面板大面积出现压降而导致的亮度不均问题。

The invention provides a manufacturing method of an OLED device. A cathode contact layer spaced apart from an anode layer is arranged on a substrate substrate, a cathode contact hole is arranged on the pixel definition layer corresponding to the upper part of the cathode contact layer, and an electron transport layer is arranged in the manufacturing process. The cathode layer is spaced from the cathode contact layer by extending from the pixel opening to the cathode contact hole. Before the normal operation of the device, in order to make electrical conduction between the cathode contact layer and the cathode layer, equal potentials are applied to the cathode layer and the anode layer. At the same time, a voltage less than the potential of the cathode layer is applied to the cathode contact layer, so that a potential difference is formed between the cathode contact layer and the cathode layer, and the electron transport layer is broken down and conducts electricity under the action of the electric field, so as to realize the cathode layer and the cathode layer. The electrical conduction of the contact layer, when the OLED device is in operation, the cathode contact hole layer can directly provide voltage and current compensation to the cathode layer, thereby preventing the uneven brightness problem caused by voltage drop in a large area of the OLED display panel.

Description

OLED器件的制作方法OLED device fabrication method

技术领域technical field

本发明涉及显示技术领域,尤其涉及一种OLED器件的制作方法。The present invention relates to the field of display technology, and in particular, to a manufacturing method of an OLED device.

背景技术Background technique

有机电致发光二极体(Organic Light Emitting Diodes,OLED)属于一种新型电流型半导体发光器件,是通过控制该器件载流子的注入和复合激发有机材料发光显示,属于一种自主发光技术。与被动发光的液晶显示器 (Liquid Crystal Display,LCD)相比,自主发光的OLED显示器具有响应速度快、对比度高、视角广等优点,并且容易实现柔性显示,被业内普遍看好,业界一致认为OLED显示器极有可能成为下一代显示技术的主流产品。Organic Light Emitting Diodes (OLED) belongs to a new type of current-mode semiconductor light-emitting device, which is a kind of self-luminous technology by controlling the injection and recombination of carriers in the device to excite organic materials to emit light. Compared with passive luminescent liquid crystal displays (LCDs), self-luminous OLED displays have the advantages of fast response speed, high contrast ratio, wide viewing angle, etc., and easy to achieve flexible display. It is very likely to become the mainstream product of next-generation display technology.

有源矩阵有机电致发光二极体(Active-matrix organic light emittingdiode,AMOLED)与LCD两种面板的显示原理基本相同,都是通过控制每个子像素的薄膜晶体管(Thin Film Transistor,TFT)开关状态来实现显示的。两者的区别在于:AMOLED显示是通过TFT控制OLED上的电流改变其发光亮度;LCD显示是通过TFT控制加载在液晶盒两端的电压调整其背光的透射率。两者相比,对TFT的驱动电流能力,AMOLED显示器要求更高。OLED对其驱动电流非常灵敏,微弱的电流变化会影响其发光强度,因此要求TFT驱动管能持续稳定地提供工作电流。这对AMOLED驱动电路的稳定性提出了严格的要求,该要求也提高了对AMOLED驱动电路的设计目标。Active-matrix organic light emitting diodes (AMOLEDs) have basically the same display principle as LCD panels, both by controlling the switching state of the thin film transistor (TFT) of each sub-pixel to achieve display. The difference between the two is: AMOLED display uses TFT to control the current on the OLED to change its luminous brightness; LCD display uses TFT to control the voltage loaded on both ends of the liquid crystal cell to adjust the transmittance of its backlight. Compared with the two, AMOLED displays have higher requirements on the driving current capability of TFT. OLED is very sensitive to its driving current, and weak current changes will affect its luminous intensity, so it is required that the TFT drive tube can continuously and stably provide operating current. This imposes strict requirements on the stability of the AMOLED driver circuit, which also improves the design goals of the AMOLED driver circuit.

常温下,金属导体电阻为非零值,经过导体的电流会产生一定的电压降,这一现象被称为压降(IR Drop)。金属导线上的IR Drop会导致在距离输入端的不同位置存在电位差异。在大面积显示的面板上,这种IR Drop会使得处于不同位置的OLED上的电流产生差异,进而导致面板发光不均匀,影像图像显示质量。At room temperature, the resistance of metal conductors is non-zero, and the current passing through the conductor will produce a certain voltage drop, which is called IR Drop. IR Drop on metal wires can cause potential differences at different locations from the input. On a large-area display panel, this IR Drop will cause differences in the currents on the OLEDs in different positions, resulting in uneven light emission of the panel and display quality of images and images.

发明内容SUMMARY OF THE INVENTION

本发明的目的在于提供一种OLED器件的制作方法,能够有效的防止 OLED器件发生IR Drop,进而改善OLED显示面板的亮度不均问题。The purpose of the present invention is to provide a manufacturing method of an OLED device, which can effectively prevent the IR Drop of the OLED device, thereby improving the uneven brightness of the OLED display panel.

为实现上述目的,本发明提供了一种OLED器件的制作方法,包括以下步骤:In order to achieve the above purpose, the present invention provides a method for manufacturing an OLED device, comprising the following steps:

步骤S1、提供衬底基板,在衬底基板上形成相间隔的阳极层和阴极接触层;Step S1, providing a base substrate, and forming a spaced anode layer and a cathode contact layer on the base substrate;

步骤S2、在衬底基板、阳极层及阴极接触层上形成像素定义层,所述像素定义层在所述阳极层上围出像素开口并在所述阴极接触层上方对应设有阴极接触孔;Step S2, forming a pixel definition layer on the base substrate, the anode layer and the cathode contact layer, the pixel definition layer enclosing a pixel opening on the anode layer and correspondingly provided with a cathode contact hole above the cathode contact layer;

步骤S3、在所述阳极层上由下至上依次形成空穴注入层、空穴传输层、发光层及电子传输层,所述电子传输层从所述像素开口内延伸到阴极接触孔内并与所述阴极接触层相接触;Step S3, forming a hole injection layer, a hole transport layer, a light emitting layer and an electron transport layer in sequence on the anode layer from bottom to top, the electron transport layer extends from the pixel opening to the cathode contact hole and is connected to the cathode contact hole. the cathode contact layers are in contact;

步骤S4、在所述电子传输层上形成阴极层,所述阴极层覆盖阴极接触层,所述电子传输层将阴极层与阴极接触层间隔开;Step S4, forming a cathode layer on the electron transport layer, the cathode layer covering the cathode contact layer, and the electron transport layer separating the cathode layer from the cathode contact layer;

步骤S5、对所述阳极层和阴极层施加相等电势的电压,同时对阴极接触层施加电势小于阴极层电势的电压,使阴极接触层和阴极层之间形成电势差,所述电子传输层在电场的作用下被击穿而导电,从而使所述阴极层和阴极接触层电导通。Step S5, applying a voltage of equal potential to the anode layer and the cathode layer, and simultaneously applying a voltage with a potential smaller than the potential of the cathode layer to the cathode contact layer, so that a potential difference is formed between the cathode contact layer and the cathode layer, and the electron transport layer is in the electric field. It is broken down and conducts electricity under the action of the action, so that the cathode layer and the cathode contact layer are electrically connected.

所述步骤S5中,所述阴极接触层和阴极层之间形成的电势差为10V- 30V。In the step S5, the potential difference formed between the cathode contact layer and the cathode layer is 10V-30V.

所述步骤S5中,保持所述阴极接触层和阴极层存在电势差的状态5分钟 -30分钟。In the step S5, the state in which the cathode contact layer and the cathode layer have a potential difference is maintained for 5 minutes to 30 minutes.

所述步骤S5中,对所述阳极层和阴极层施加的电压为10V-30V,对所述阴极接触层施加的电压为-20V-20V。In the step S5, the voltage applied to the anode layer and the cathode layer is 10V-30V, and the voltage applied to the cathode contact layer is -20V-20V.

所述步骤S3中,所述电子传输层由蒸镀材料通过蒸镀法制作形成。In the step S3, the electron transport layer is formed from an evaporation material by an evaporation method.

所述步骤S3中,所述空穴注入层、空穴传输层及发光层分别采用蒸镀法或喷墨打印法制作形成。In the step S3, the hole injection layer, the hole transport layer and the light emitting layer are respectively formed by vapor deposition method or inkjet printing method.

所述阳极层和阴极接触层的材料为亲水性的导电材料,所述像素定义层的材料为疏水性材料。The material of the anode layer and the cathode contact layer is a hydrophilic conductive material, and the material of the pixel definition layer is a hydrophobic material.

所述步骤S3中,所述空穴注入层、空穴传输层及发光层形成于所述像素开口内。In the step S3, the hole injection layer, the hole transport layer and the light emitting layer are formed in the pixel opening.

所述阴极接触层通过像素定义层同时与阳极层、空穴注入层、空穴传输层、发光层分离。The cathode contact layer is simultaneously separated from the anode layer, the hole injection layer, the hole transport layer and the light emitting layer through the pixel definition layer.

所述步骤S1中,所述阳极层和阴极接触层之间相隔10μm-20μm。In the step S1, the anode layer and the cathode contact layer are separated by 10 μm-20 μm.

本发明的有益效果:本发明提供的一种OLED器件的制作方法,在衬底基板上设置与阳极层相间隔的阴极接触层,在像素定义层上对应于阴极接触层的上方设置阴极接触孔,制作过程中电子传输层从像素开口内延伸到阴极接触孔内而将阴极层与阴极接触层间隔开,在器件正常工作之前,为了使阴极接触层与阴极层之间电导通,对阴极层和阳极层施加相等电势的正电压,同时对阴极接触层施加一个小于阴极层电势的电压,使阴极接触层和阴极层之间形成电势差,电子传输层在电场的作用下被击穿而导电,从而实现阴极层和阴极接触层的电导通,OLED器件在工作时,阴极接触孔层可以直接对阴极层提供电压电流补偿,进而能够防止OLED显示面板大面积出现IR Drop而导致的亮度不均问题。Beneficial effects of the present invention: The present invention provides a method for manufacturing an OLED device, wherein a cathode contact layer spaced apart from the anode layer is arranged on the base substrate, and a cathode contact hole is arranged on the pixel definition layer corresponding to the upper part of the cathode contact layer During the production process, the electron transport layer extends from the pixel opening to the cathode contact hole to separate the cathode layer from the cathode contact layer. Before the device works normally, in order to make electrical conduction between the cathode contact layer and the cathode layer, the cathode A positive voltage of equal potential is applied to the layer and the anode layer, and a voltage less than the potential of the cathode layer is applied to the cathode contact layer, so that a potential difference is formed between the cathode contact layer and the cathode layer, and the electron transport layer is broken down under the action of the electric field and conducts electricity , so as to realize the electrical conduction between the cathode layer and the cathode contact layer. When the OLED device is working, the cathode contact hole layer can directly provide voltage and current compensation to the cathode layer, thereby preventing the OLED display panel from appearing in a large area. The uneven brightness caused by IR Drop question.

为了能更进一步了解本发明的特征以及技术内容,请参阅以下有关本发明的详细说明与附图,然而附图仅提供参考与说明用,并非用来对本发明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings, however, the accompanying drawings are only for reference and illustration, and are not intended to limit the present invention.

附图说明Description of drawings

下面结合附图,通过对本发明的具体实施方式详细描述,将使本发明的技术方案及其它有益效果显而易见。The technical solutions and other beneficial effects of the present invention will be apparent through the detailed description of the specific embodiments of the present invention with reference to the accompanying drawings.

附图中,In the attached drawing,

图1为本发明的OLED器件的制作方法的流程图;FIG. 1 is a flow chart of the manufacturing method of the OLED device of the present invention;

图2为本发明的OLED器件的制作方法的步骤1的示意图;FIG. 2 is a schematic diagram of step 1 of the manufacturing method of the OLED device of the present invention;

图3为本发明的OLED器件的制作方法的步骤2的示意图;FIG. 3 is a schematic diagram of step 2 of the manufacturing method of the OLED device of the present invention;

图4为本发明的OLED器件的制作方法的步骤3的示意图;FIG. 4 is a schematic diagram of step 3 of the manufacturing method of the OLED device of the present invention;

图5为本发明的OLED器件的制作方法的步骤4的示意图;FIG. 5 is a schematic diagram of step 4 of the manufacturing method of the OLED device of the present invention;

图6为本发明的OLED器件的制作方法的步骤5的示意图。FIG. 6 is a schematic diagram of step 5 of the manufacturing method of the OLED device of the present invention.

具体实施方式Detailed ways

为更进一步阐述本发明所采取的技术手段及其效果,以下结合本发明的优选实施例及其附图进行详细描述。In order to further illustrate the technical means adopted by the present invention and its effects, a detailed description is given below in conjunction with the preferred embodiments of the present invention and the accompanying drawings.

请参阅图1,本发明提供一种OLED器件的制作方法,包括以下步骤:Referring to FIG. 1, the present invention provides a method for fabricating an OLED device, comprising the following steps:

步骤S1、如图2所示,提供衬底基板10,在衬底基板10上形成相间隔的阳极层21和阴极接触层30。Step S1 , as shown in FIG. 2 , a base substrate 10 is provided, and a spaced anode layer 21 and a cathode contact layer 30 are formed on the base substrate 10 .

具体地,所述衬底基板10为玻璃基板。Specifically, the base substrate 10 is a glass substrate.

具体地,所述步骤S1中,所述阳极层21和阴极接触层30之间相隔10 μm-20μm,且相互没有连接。Specifically, in the step S1, the anode layer 21 and the cathode contact layer 30 are separated by 10 μm-20 μm, and are not connected to each other.

具体地,所述阳极层21和阴极接触层30的材料为亲水性的导电材料。Specifically, the materials of the anode layer 21 and the cathode contact layer 30 are hydrophilic conductive materials.

步骤S2、如图3所示,在衬底基板10、阳极层21及阴极接触层30上形成像素定义层40,所述像素定义层40在所述阳极层21上围出像素开口41 并在所述阴极接触层30上方对应设有阴极接触孔45。Step S2 , as shown in FIG. 3 , a pixel definition layer 40 is formed on the base substrate 10 , the anode layer 21 and the cathode contact layer 30 , and the pixel definition layer 40 surrounds the pixel opening 41 on the anode layer 21 and is on the anode layer 21 . A cathode contact hole 45 is correspondingly provided above the cathode contact layer 30 .

具体地,所述像素定义层40的材料为疏水性材料。Specifically, the material of the pixel definition layer 40 is a hydrophobic material.

具体地,所述阴极接触层30通过像素定义层40与阳极层21分离。Specifically, the cathode contact layer 30 is separated from the anode layer 21 by the pixel definition layer 40 .

步骤S3、如图4所示,在所述阳极层21上由下至上依次形成空穴注入层(HoleInject Layer,HIL)24、空穴传输层(Hole Transport Layer,HTL) 25、发光层(Emittinglayer,EML)26及电子传输层(Electron Transport Layer,ETL)27,所述电子传输层27从所述像素开口41内延伸到阴极接触孔45内并与所述阴极接触层30相接触。Step S3, as shown in FIG. 4, forming a hole injection layer (Hole Inject Layer, HIL) 24, a hole transport layer (Hole Transport Layer, HTL) 25, an emitting layer (Emitting layer) on the anode layer 21 from bottom to top sequentially , EML) 26 and an electron transport layer (Electron Transport Layer, ETL) 27, the electron transport layer 27 extends from the pixel opening 41 to the cathode contact hole 45 and is in contact with the cathode contact layer 30.

具体地,所述步骤S3中,所述电子传输层27由蒸镀材料通过蒸镀法制作形成。需要说明的是,在实际应用蒸镀法制作OLED时,由于技术上无法实现独立的电子传输层27的制备,所以阴极接触层30后续无法直接与阴极层23相连,阴极接触孔层30无法实现工作。Specifically, in the step S3, the electron transport layer 27 is formed from an evaporation material by an evaporation method. It should be noted that, in the actual application of the evaporation method to manufacture OLEDs, since the preparation of the independent electron transport layer 27 cannot be achieved technically, the cathode contact layer 30 cannot be directly connected to the cathode layer 23 subsequently, and the cathode contact hole layer 30 cannot be realized. Work.

具体地,所述电子传输层27设置在阳极层21和阴极接触层30上方,并且不受像素定义层40的分离,位于像素开口41内的电子传输层27与位于阴极接触孔45内的电子传输层27在像素定义层40上相连。Specifically, the electron transport layer 27 is disposed above the anode layer 21 and the cathode contact layer 30 , and is not separated by the pixel definition layer 40 , the electron transport layer 27 located in the pixel opening 41 and the electron transport layer 27 located in the cathode contact hole 45 The transport layer 27 is connected on the pixel definition layer 40 .

具体地,所述步骤S3中,所述空穴注入层24、空穴传输层25及发光层 26形成于所述像素开口41内;所述像素定义层40同时将阴极接触层30与空穴注入层24、空穴传输层25、发光层26分离。Specifically, in the step S3, the hole injection layer 24, the hole transport layer 25 and the light emitting layer 26 are formed in the pixel opening 41; the pixel definition layer 40 simultaneously connects the cathode contact layer 30 and the hole The injection layer 24, the hole transport layer 25, and the light emitting layer 26 are separated.

具体地,所述步骤S3中,所述空穴注入层24、空穴传输层25及发光层 26分别采用蒸镀法或喷墨打印法(Ink-jet Print,IJP)制作形成。Specifically, in the step S3, the hole injection layer 24, the hole transport layer 25 and the light emitting layer 26 are formed by vapor deposition or ink-jet printing (IJP), respectively.

步骤S4、如图5所示,在所述电子传输层27上形成阴极层23,所述阴极层23覆盖阴极接触层30,所述电子传输层27将阴极层23与阴极接触层 30间隔开。Step S4, as shown in FIG. 5, a cathode layer 23 is formed on the electron transport layer 27, the cathode layer 23 covers the cathode contact layer 30, and the electron transport layer 27 separates the cathode layer 23 from the cathode contact layer 30 .

具体地,所述阴极层23高于像素定义层40并且不受像素定义层40的分离,位于像素开口41上方和阴极接触孔45上方的阴极层23在像素定义层 40上方相连,为整面结构。Specifically, the cathode layer 23 is higher than the pixel definition layer 40 and is not separated by the pixel definition layer 40 , and the cathode layer 23 located above the pixel opening 41 and above the cathode contact hole 45 is connected above the pixel definition layer 40 , forming a whole surface structure.

步骤S5、如图6所示,对所述阳极层21和阴极层23施加相等电势的范围在10V-30V之间的电压,同时对阴极接触层30施加电势小于阴极层23电势的范围在-20V-20V的电压,使阴极接触层30和阴极层23之间形成一个 10V-30V的电势差并保持5分钟-30分钟,所述电子传输层27在电场的作用下被击穿而导电,从而使所述阴极层23和阴极接触层30电导通。Step S5, as shown in FIG. 6, apply the voltage in the range of equal potential to the anode layer 21 and the cathode layer 23 between 10V-30V, while the potential applied to the cathode contact layer 30 is smaller than the potential range of the cathode layer 23 at- The voltage of 20V-20V makes a potential difference of 10V-30V between the cathode contact layer 30 and the cathode layer 23 and keeps it for 5-30 minutes, the electron transport layer 27 is broken down under the action of the electric field and conducts electricity, thereby The cathode layer 23 and the cathode contact layer 30 are brought into electrical conduction.

本发明的OLED器件的制作方法通过在衬底基板10上设置与阳极层21 相间隔的阴极接触层30,在像素定义层40上对应于阴极接触层30的上方设置阴极接触孔45,制作过程中电子传输层27从像素开口41内延伸到阴极接触孔45内而将阴极层23与阴极接触层30间隔开,在器件正常工作之前,为了使阴极接触层30与阴极层23之间电导通,对阴极层23和阳极层21施加相等电势的正电压,同时对阴极接触层30施加一个小于阴极层23电势的负电压,使阴极接触层30和阴极层之间形成电势差,电子传输层27在电场的作用下被击穿而导电,从而实现阴极层23和阴极接触层30的电导通,从而所制作的OLED器件应用于OLED显示面板且在工作时,阳极层21上施加正电压,阴极层23和阴极接触孔层30上分别施加相同的负电压,阴极接触孔层30可以直接对阴极层23提供电压电流补偿,由于每个像素的OLED器件上均设有阴极接触层30与阴极层23电导通,进而能够防止OLED显示面板大面积出现IRDrop而导致的亮度不均问题。The manufacturing method of the OLED device of the present invention includes disposing a cathode contact layer 30 spaced from the anode layer 21 on the base substrate 10, and disposing a cathode contact hole 45 on the pixel definition layer 40 corresponding to the cathode contact layer 30 above. The electron transport layer 27 extends from the pixel opening 41 to the cathode contact hole 45 to separate the cathode layer 23 from the cathode contact layer 30. Before the device operates normally, in order to make electrical conduction between the cathode contact layer 30 and the cathode layer 23 , a positive voltage of equal potential is applied to the cathode layer 23 and the anode layer 21, and a negative voltage less than the potential of the cathode layer 23 is applied to the cathode contact layer 30 at the same time, so that a potential difference is formed between the cathode contact layer 30 and the cathode layer, and the electron transport layer 27 Under the action of the electric field, it is broken down and conducts electricity, so as to realize the electrical conduction between the cathode layer 23 and the cathode contact layer 30, so that the fabricated OLED device is applied to the OLED display panel and during operation, a positive voltage is applied to the anode layer 21, and the cathode The same negative voltage is applied to the layer 23 and the cathode contact hole layer 30 respectively. The cathode contact hole layer 30 can directly provide voltage and current compensation to the cathode layer 23. Since the OLED device of each pixel is provided with the cathode contact layer 30 and the cathode layer 23 electrical conduction, which can prevent the uneven brightness caused by IRDrop in a large area of the OLED display panel.

综上所述,本发明提供的一种OLED器件的制作方法,在衬底基板上设置与阳极层相间隔的阴极接触层,在像素定义层上对应于阴极接触层的上方设置阴极接触孔,制作过程中电子传输层从像素开口内延伸到阴极接触孔内而将阴极层与阴极接触层间隔开,在器件正常工作之前,为了使阴极接触层与阴极层之间电导通,对阴极层和阳极层施加相等电势的正电压,同时对阴极接触层施加一个小于阴极层电势的电压,使阴极接触层和阴极层之间形成电势差,电子传输层在电场的作用下被击穿而导电,从而实现阴极层和阴极接触层的电导通,OLED器件在工作时,阴极接触孔层可以直接对阴极层提供电压电流补偿,进而能够防止OLED显示面板大面积出现IR Drop而导致的亮度不均问题。To sum up, the present invention provides a method for manufacturing an OLED device, wherein a cathode contact layer spaced apart from an anode layer is arranged on a base substrate, and a cathode contact hole is arranged on the pixel definition layer corresponding to the upper part of the cathode contact layer, During the production process, the electron transport layer extends from the pixel opening to the cathode contact hole to separate the cathode layer from the cathode contact layer. Before the device works normally, in order to make electrical conduction between the cathode contact layer and the cathode layer, the cathode layer A positive voltage of equal potential is applied to the anode layer, and a voltage less than the potential of the cathode layer is applied to the cathode contact layer, so that a potential difference is formed between the cathode contact layer and the cathode layer, and the electron transport layer is broken down under the action of the electric field and conducts electricity. In this way, the electrical conduction between the cathode layer and the cathode contact layer is realized. When the OLED device is working, the cathode contact hole layer can directly provide voltage and current compensation to the cathode layer, thereby preventing the problem of uneven brightness caused by IR Drop in a large area of the OLED display panel. .

以上所述,对于本领域的普通技术人员来说,可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形,而所有这些改变和变形都应属于本发明权利要求的保护范围。As mentioned above, for those of ordinary skill in the art, various other corresponding changes and deformations can be made according to the technical solutions and technical concepts of the present invention, and all these changes and deformations should belong to the protection scope of the claims of the present invention .

Claims (9)

1.一种OLED器件的制作方法,其特征在于,包括以下步骤:1. A method for making an OLED device, comprising the following steps: 步骤S1、提供衬底基板(10),在衬底基板(10)上形成相间隔的阳极层(21)和阴极接触层(30);Step S1, providing a base substrate (10), and forming a spaced anode layer (21) and a cathode contact layer (30) on the base substrate (10); 步骤S2、在衬底基板(10)、阳极层(21)及阴极接触层(30)上形成像素定义层(40),所述像素定义层(40)在所述阳极层(21)上围出像素开口(41)并在所述阴极接触层(30)上方对应设有阴极接触孔(45);Step S2, forming a pixel definition layer (40) on the base substrate (10), the anode layer (21) and the cathode contact layer (30), the pixel definition layer (40) surrounding the anode layer (21) A pixel opening (41) is provided and a cathode contact hole (45) is correspondingly provided above the cathode contact layer (30); 步骤S3、在所述阳极层(21)上由下至上依次形成空穴注入层(24)、空穴传输层(25)、发光层(26)及电子传输层(27),所述电子传输层(27)从所述像素开口(41)内延伸到阴极接触孔(45)内并与所述阴极接触层(30)相接触;Step S3, forming a hole injection layer (24), a hole transport layer (25), a light emitting layer (26) and an electron transport layer (27) on the anode layer (21) from bottom to top in sequence, and the electron transport layer (27) a layer (27) extending from the pixel opening (41) into the cathode contact hole (45) and in contact with the cathode contact layer (30); 步骤S4、在所述电子传输层(27)上形成阴极层(23),所述阴极层(23)覆盖阴极接触层(30),所述电子传输层(27)将阴极层(23)与阴极接触层(30)间隔开;Step S4, a cathode layer (23) is formed on the electron transport layer (27), the cathode layer (23) covers the cathode contact layer (30), and the electron transport layer (27) connects the cathode layer (23) with the cathode contact layer (30). the cathode contact layers (30) are spaced apart; 步骤S5、对所述阳极层(21)和阴极层(23)施加相等电势的电压,同时对阴极接触层(30)施加电势小于阴极层(23)电势的电压,使阴极接触层(30)和阴极层(23)之间形成电势差,所述电子传输层(27)在电场的作用下被击穿而导电,从而使所述阴极层(23)和阴极接触层(30)电导通;Step S5, applying a voltage of equal potential to the anode layer (21) and the cathode layer (23), and simultaneously applying a voltage with a potential smaller than the potential of the cathode layer (23) to the cathode contact layer (30), so that the cathode contact layer (30) A potential difference is formed between the cathode layer (23), the electron transport layer (27) is broken down under the action of the electric field and conducts electricity, so that the cathode layer (23) and the cathode contact layer (30) are electrically connected; 所述步骤S3中,所述电子传输层(27)由蒸镀材料通过蒸镀法制作形成。In the step S3, the electron transport layer (27) is formed from an evaporation material by an evaporation method. 2.如权利要求1所述的OLED器件的制作方法,其特征在于,所述步骤S5中,所述阴极接触层(30)和阴极层(23)之间形成的电势差为10V-30V。2 . The method for manufacturing an OLED device according to claim 1 , wherein, in the step S5 , the potential difference formed between the cathode contact layer ( 30 ) and the cathode layer ( 23 ) is 10V-30V. 3 . 3.如权利要求2所述的OLED器件的制作方法,其特征在于,所述步骤S5中,保持所述阴极接触层(30)和阴极层(23)存在电势差的状态5分钟-30分钟。3 . The method for manufacturing an OLED device according to claim 2 , wherein in the step S5 , the cathode contact layer ( 30 ) and the cathode layer ( 23 ) are kept in a state in which a potential difference exists for 5 minutes to 30 minutes. 4 . 4.如权利要求2所述的OLED器件的制作方法,其特征在于,所述步骤S5中,对所述阳极层(21)和阴极层(23)施加的电压为10V-30V,对所述阴极接触层(30)施加的电压为-20V-20V。4. The method for manufacturing an OLED device according to claim 2, wherein in the step S5, the voltage applied to the anode layer (21) and the cathode layer (23) is 10V-30V, and the voltage applied to the anode layer (21) and the cathode layer (23) is 10V-30V. The voltage applied to the cathode contact layer (30) is -20V-20V. 5.如权利要求1所述的OLED器件的制作方法,其特征在于,所述步骤S3中,所述空穴注入层(24)、空穴传输层(25)及发光层(26)分别采用蒸镀法或喷墨打印法制作形成。5. The method for manufacturing an OLED device according to claim 1, wherein in the step S3, the hole injection layer (24), the hole transport layer (25) and the light emitting layer (26) are respectively made of It is formed by evaporation method or inkjet printing method. 6.如权利要求1所述的OLED器件的制作方法,其特征在于,所述阳极层(21)和阴极接触层(30)的材料为亲水性的导电材料,所述像素定义层(40)的材料为疏水性材料。6. The method for manufacturing an OLED device according to claim 1, wherein the anode layer (21) and the cathode contact layer (30) are made of hydrophilic conductive materials, and the pixel definition layer (40) is made of a hydrophilic conductive material. ) is a hydrophobic material. 7.如权利要求1所述的OLED器件的制作方法,其特征在于,所述步骤S3中,所述空穴注入层(24)、空穴传输层(25)及发光层(26)形成于所述像素开口(41)内。7. The method for manufacturing an OLED device according to claim 1, wherein in the step S3, the hole injection layer (24), the hole transport layer (25) and the light emitting layer (26) are formed on inside the pixel opening (41). 8.如权利要求1所述的OLED器件的制作方法,其特征在于,所述阴极接触层(30)通过像素定义层(40)同时与阳极层(21)、空穴注入层(24)、空穴传输层(25)、发光层(26)分离。8. The method for manufacturing an OLED device according to claim 1, wherein the cathode contact layer (30) is simultaneously connected to the anode layer (21), the hole injection layer (24), the anode layer (21), the hole injection layer (24), The hole transport layer (25) and the light emitting layer (26) are separated. 9.如权利要求1所述的OLED器件的制作方法,其特征在于,所述步骤S1中,所述阳极层(21)和阴极接触层(30)之间相隔10μm-20μm。9 . The method for manufacturing an OLED device according to claim 1 , wherein, in the step S1 , the anode layer ( 21 ) and the cathode contact layer ( 30 ) are separated by 10 μm-20 μm. 10 .
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