CN108417516B - Detection system and detection method for wafer back foreign matter - Google Patents
Detection system and detection method for wafer back foreign matter Download PDFInfo
- Publication number
- CN108417516B CN108417516B CN201810364765.1A CN201810364765A CN108417516B CN 108417516 B CN108417516 B CN 108417516B CN 201810364765 A CN201810364765 A CN 201810364765A CN 108417516 B CN108417516 B CN 108417516B
- Authority
- CN
- China
- Prior art keywords
- wafer
- height
- foreign matters
- detection device
- alarm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a wafer back foreign body detection system, which comprises: a detection device and a processing control device; the detection device is vertically arranged on a fixed plane above the tray, measures the wafer below the detection device, and sends the measurement data to the processing control device; and the processing control device judges whether foreign matters exist between the wafer and the wafer tray according to the measurement data, and sends out an alarm if the foreign matters exist. The invention also discloses a method for detecting the foreign matters on the back surface of the wafer. The invention can judge whether foreign matters exist between the back of the wafer and the tray, and position the foreign matters in time, thereby avoiding the wafer from cracking caused by stress on the wafer in the subsequent production process, improving the yield of products and avoiding the waste chips from being continuously produced.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a wafer back foreign matter detection system. The invention also relates to a method for detecting the foreign matters on the back surface of the wafer.
Background
Wafer testing is required during the manufacture of semiconductor wafers, and foreign matter may adhere to the back of a wafer placed on a test probe station due to environmental or process reasons. When the foreign matter adheres, the foreign matter on the back of the wafer generates an upward reaction force to the wafer under the combined action of the vacuum suction force of the tray on the wafer and the probe pressure of the probe in the test process, and the two forces may cause local deformation to the wafer, so that the wafer is locally cracked near the foreign matter. As the thickness of the test wafer is getting thinner, the probability of such cracking is higher.
Such foreign matter is also generally likely to adhere to the tray, and affects a plurality of wafers that are continuously operated. The existing means for preventing the foreign matter adhesion phenomenon mainly comprises strengthening the cleaning treatment of the surface of the probe station tray and avoiding the introduction of foreign matter particles in the operation process. However, the above method can only reduce the frequency of accidents, and once foreign matter adhesion occurs, since there is no effective means to detect and alarm in time, it is often found after the multiple wafers are cracked.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a detection system capable of detecting foreign matters on the back of a wafer, so as to avoid wafer cracking caused by the foreign matters. The invention also provides a method for detecting the foreign matters on the back surface of the wafer.
In order to solve the above technical problem, the present invention provides a wafer backside foreign object detection system, which includes: a detection device and a processing control device;
the detection device is vertically arranged on a fixed plane above the tray, measures the wafer below the detection device, and sends the measurement data to the processing control device;
and the processing control device judges whether foreign matters exist between the wafer and the wafer tray according to the measurement data, and sends out an alarm if the foreign matters exist.
In the detection system for the foreign matters on the back of the wafer, a detection device carries out full-coverage ranging on the wafer below the detection device;
and the processing control device converts the ranging data of the detection device into relative height by taking the plane of the surface of the wafer as a reference plane, draws a three-dimensional height graph of the surface of the wafer, judges that foreign matters exist on the back of the wafer if the height of a certain position of the surface of the wafer deviates from the average height of the surface of the wafer, and gives an alarm.
In a further improvement, the detection system for the foreign matters on the back surface of the wafer judges that the foreign matters exist on the back surface of the wafer and sends out an alarm if the height of a certain position on the surface of the wafer deviates from the average height of the surface of the wafer and is greater than or equal to a preset height threshold value.
The wafer back foreign matter detection system is further improved in that when wafer back foreign matter judgment is carried out through full coverage ranging, the detection device is a range finder and comprises but is not limited to a laser range finder, an infrared range finder or a radar range finder, and the processing control device is a computer.
The invention provides a method for detecting foreign matters on the back surface of a wafer, which comprises the following steps;
measuring the wafer on a fixed plane above the wafer;
and judging whether foreign matters exist between the wafer and the wafer tray according to the measurement data, and giving an alarm if the foreign matters exist.
The wafer back foreign matter detection method is further improved, full coverage ranging is conducted on the wafer, ranging data are converted into relative heights by taking the plane where the surface of the wafer is located as a reference, a height three-dimensional graph of the surface of the wafer is drawn, if the height of a certain position of the surface of the wafer deviates from the average height of the surface of the wafer, it is judged that foreign matter exists on the back of the wafer, and an alarm is sent out.
Further improved, the method for detecting the foreign matter on the back surface of the wafer judges that the foreign matter exists on the back surface of the wafer and sends out an alarm if the height of a certain position on the surface of the wafer deviates from the average height value of the surface of the wafer and is greater than or equal to a preset height threshold value.
In the production process, for a thin wafer, especially for a wafer with foreign matters on the back surface, deformation can be generated. In the wafer testing stage, the wafer is loaded on the bearing tray by operating the probe station. Before the contact test of the wafer and the probe, the processing control device controls the detection device to perform height detection, so that the detection device performs height detection (scanning) of full coverage on the wafer in a certain horizontal plane above the wafer. And converting the obtained vertical distance data into relative height values of all positions on the surface of the wafer by taking the plane of the wafer as a reference plane (the reference plane can be set randomly), and drawing and outputting a three-dimensional graph of the height of the surface of the wafer in the processing control device. When the local height value of any area deviates from the surface average height value and reaches or exceeds a preset height threshold value, the existence of foreign matters on the back surface of the wafer (between the wafer and the tray) is judged, an alarm signal is sent out, and the height abnormal position is marked in a height map of the surface of the wafer.
The invention can judge whether foreign matters exist between the back of the wafer and the tray, can avoid the wafer from cracking caused by stress on the wafer in the subsequent production process, improves the yield of products and avoids the waste chips from being continuously produced.
Drawings
The invention will be described in further detail with reference to the following detailed description and accompanying drawings:
fig. 1 is a schematic view of the overall structure of an embodiment of the present invention.
Fig. 2 is a first highly three-dimensional drawing of the wafer surface showing a highly three-dimensional drawing without foreign matter according to the present invention.
FIG. 3 is a second high level three dimensional view of the wafer surface showing the presence of foreign objects according to the present invention.
Description of the reference numerals
1 is a detection device
2 is a process control device
3 is a tray
4 is a wafer
Detailed Description
As shown in fig. 1, a first embodiment of a system for detecting a foreign object on a backside of a wafer according to the present invention includes: a detection device 1 and a processing control device 2. The embodiment is suitable for a thin wafer, and the thickness of the wafer is thinner and thinner along with the technical progress of the technology, so that the embodiment has higher and higher applicability, and is particularly suitable for the condition that foreign matters between the back surface of the wafer and the tray can deform the wafer.
In the present embodiment, the detecting device 1 is a range finder, including but not limited to a laser range finder, an infrared range finder or a radar range finder, and the processing and controlling device is a computer. The illustration in fig. 1 is only a connection situation, and wireless transmission technology can also be used between the detection device 1 and the process control device 2. For example, bluetooth, WIFI, etc. are commonly used as wireless transmission technologies.
Vertically arranging a distance meter on a fixed plane above the tray, performing full-coverage distance measurement on a wafer below the distance meter in the plane by using the distance meter, and sending obtained distance measurement data to a computer;
and the processing control device converts the ranging data of the detection device into relative height by taking the plane of the surface of the wafer as a reference plane, draws a three-dimensional height graph of the surface of the wafer, judges that foreign matters exist on the back of the wafer if the height of a certain position of the surface of the wafer deviates from the average height of the surface of the wafer, and gives an alarm.
The second embodiment of the system for detecting the foreign matter on the back of the wafer provided by the invention comprises: a detection device 1 and a processing control device 2. Accordingly, the second embodiment is also applicable to a relatively thin wafer, and the applicability of the embodiment is higher and higher as the thickness of the wafer is thinner and thinner along with the technical progress of the technology, and is particularly applicable to the situation that the wafer is deformed by a foreign matter between the back surface of the wafer and the tray.
In the second embodiment, the detecting device 1 is a range finder including, but not limited to, a laser range finder, an infrared range finder or a radar range finder, and the processing and controlling device is a computer. Referring to fig. 1 showing only one connection case of the present second embodiment, a wireless transmission technique may also be employed between the detection apparatus 1 and the process control apparatus 2. For example, bluetooth, WIFI, etc. are commonly used as wireless transmission technologies.
Vertically arranging a distance meter on a fixed plane above the tray, performing full-coverage distance measurement on a wafer below the distance meter in the plane by using the distance meter, and sending obtained distance measurement data to a computer;
and the processing control device converts the ranging data of the detection device into relative height by taking the plane of the surface of the wafer as a reference plane, draws a three-dimensional height graph of the surface of the wafer, judges that foreign matters exist on the back of the wafer if the height of a certain position of the surface of the wafer deviates from the average height of the surface of the wafer and is greater than or equal to a preset height threshold value, and gives an alarm.
In the second embodiment of the present invention, the computer converts the distance measurement data of the distance meter into a relative height (the reference plane can be set arbitrarily) by using the plane where the wafer surface is located as the reference plane, and the relative height is drawn as a three-dimensional height map of the wafer surface. And the computer measures and calculates the height three-dimensional graph, and if the height of a certain position in the height three-dimensional graph is greater than or equal to a preset height threshold value, the wafer back is judged to have foreign matters, and an alarm is sent. The design here is that if the height of a certain position deviates from the average height of the surface of the wafer and is more than or equal to a preset height threshold value, the purpose of judging that foreign matters exist on the back surface of the wafer is to avoid misjudgment. On the premise that the precision of the distance measuring instrument is high enough, the heights of all parts of the surface of the wafer are not completely the same, so that the average height of the surface of the wafer is used for eliminating misjudgment.
The method is suitable for thin wafers, the thickness of the wafers is thinner along with the technical progress of the technology, the applicability of the embodiment is higher and higher, the method is particularly suitable for the condition that the foreign matters between the back of the wafer and the tray can deform the wafer, whether the foreign matters exist between the back of the thin wafer and the tray can be judged, the positions of the foreign matters can be timely positioned, the wafer cracking caused by stress on the wafer in the subsequent production process is avoided, the product yield is improved, and the waste sheets are prevented from being continuously produced.
The invention provides a first embodiment of a method for detecting foreign matters on the back surface of a wafer, which comprises the following steps;
and arranging the distance measuring instrument on a fixed plane above the tray, performing full-coverage distance measurement on the wafer by using the distance measuring instrument, and sending distance measurement data to the computer.
And converting the distance measurement data into relative height by taking the plane of the surface of the wafer as a reference, drawing a three-dimensional height graph of the surface of the wafer, judging that foreign matters exist on the back of the wafer if the height of a certain position of the surface of the wafer deviates from the average height of the surface of the wafer, and giving an alarm.
The invention provides a second embodiment of a method for detecting foreign matters on the back surface of a wafer, which comprises the following steps;
and arranging the distance measuring instrument on a fixed plane above the tray, performing full-coverage distance measurement on the wafer by using the distance measuring instrument, and sending distance measurement data to the computer.
The computer establishes a reference plane, such as a plane on which the surface of the wafer is located, and converts the ranging data of the range finder into relative height. The relative heights are plotted as a height three-dimensional map of the wafer surface. And the computer measures and calculates the height three-dimensional graph, and if the height of a certain position in the height three-dimensional graph is greater than or equal to a preset height threshold value, the wafer back is judged to have foreign matters, and an alarm is sent. The design here is that if the height of a certain position deviates from the average height of the surface of the wafer and is more than or equal to a preset height threshold value, the purpose of judging that foreign matters exist on the back surface of the wafer is to avoid misjudgment. On the premise that the precision of the distance measuring instrument is high enough, the heights of all parts of the surface of the wafer are not completely the same, so that the average height of the surface of the wafer is used for eliminating misjudgment.
The present invention has been described in detail with reference to the specific embodiments and examples, but these are not intended to limit the present invention. Many variations and modifications may be made by one of ordinary skill in the art without departing from the principles of the present invention, which should also be considered as within the scope of the present invention.
Claims (5)
1. A wafer backside foreign object detection system, comprising: a detection device and a processing control device;
the detection device is vertically arranged on a fixed plane above the tray, measures the wafer below the detection device, and sends the measurement data to the processing control device;
the processing control device judges whether foreign matters exist between the wafer and the wafer tray according to the measurement data, and sends out an alarm if the foreign matters exist;
wherein, the detection device carries out full coverage ranging on a wafer below the detection device;
and the processing control device converts the ranging data of the detection device into relative height by taking the plane of the surface of the wafer as a reference plane, draws a three-dimensional height graph of the surface of the wafer, judges that foreign matters exist on the back of the wafer if the height of a certain position of the surface of the wafer deviates from the average height of the surface of the wafer, and gives an alarm.
2. The system for detecting foreign matter on the back surface of a wafer as claimed in claim 1, wherein: if the height of a certain position on the surface of the wafer deviates from the average height of the surface of the wafer and is greater than or equal to the preset height threshold value, judging that foreign matters exist on the back surface of the wafer, and giving an alarm.
3. The system for detecting foreign matter on the back surface of a wafer according to any one of claims 1 and 2, wherein:
the detection device is a distance meter, and the processing control device is a computer.
4. A method for detecting foreign matters on the back surface of a wafer is characterized by comprising the following steps;
measuring the wafer on a fixed plane above the wafer;
judging whether foreign matters exist between the wafer and the wafer tray according to the measurement data, and giving an alarm if the foreign matters exist;
and carrying out full coverage ranging on the wafer, converting ranging data into relative height by taking the plane of the surface of the wafer as a reference, drawing a three-dimensional height graph of the surface of the wafer, judging that foreign matters exist on the back of the wafer if the height of a certain position on the surface of the wafer deviates from the average height of the surface of the wafer, and giving an alarm.
5. The method for detecting the foreign matter on the back surface of the wafer as claimed in claim 4, wherein: if the height of a certain position on the surface of the wafer deviates from the average height value of the surface of the wafer and is larger than or equal to the preset height threshold value, judging that foreign matters exist on the back surface of the wafer, and giving an alarm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810364765.1A CN108417516B (en) | 2018-04-23 | 2018-04-23 | Detection system and detection method for wafer back foreign matter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810364765.1A CN108417516B (en) | 2018-04-23 | 2018-04-23 | Detection system and detection method for wafer back foreign matter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108417516A CN108417516A (en) | 2018-08-17 |
| CN108417516B true CN108417516B (en) | 2020-08-11 |
Family
ID=63136400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810364765.1A Active CN108417516B (en) | 2018-04-23 | 2018-04-23 | Detection system and detection method for wafer back foreign matter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108417516B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110221351A (en) * | 2019-06-27 | 2019-09-10 | 韩华新能源（启东）有限公司 | Cell piece Superficial Foreign Body detection device and the device for improving the quick-fried version of cell piece silk-screen |
| CN110246787B (en) * | 2019-06-27 | 2023-08-08 | 韩华新能源（启东）有限公司 | Battery piece surface foreign matter cleaning device |
| CN110400762B (en) * | 2019-07-05 | 2021-09-03 | Tcl华星光电技术有限公司 | Foreign matter repairing method, device and storage medium |
| JP2022133631A (en) | 2021-03-02 | 2022-09-14 | 株式会社東京精密 | Particle measurement device, three-dimensional shape measurement device, prober device, particle measurement system, and particle measurement method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06273343A (en) * | 1993-03-17 | 1994-09-30 | Fujitsu Ltd | Foreign matter inspection equipment |
| US6259960B1 (en) * | 1996-11-01 | 2001-07-10 | Joel Ltd. | Part-inspecting system |
| CN101657893A (en) * | 2007-04-25 | 2010-02-24 | 株式会社Snu精密 | The foreign matter detection of semiconductor crystal wafer and repair system and method thereof |
| CN102192915A (en) * | 2010-03-12 | 2011-09-21 | 东京毅力科创株式会社 | Back impurity inspection method, back impurity inspection device and coating device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5644393A (en) * | 1995-10-19 | 1997-07-01 | Hitachi Electronics Engineering Co., Ltd. | Extraneous substance inspection method and apparatus |
| CN101163960B (en) * | 2005-04-19 | 2011-02-16 | 松下电器产业株式会社 | Method for inspecting a foreign matter on mirror-finished substrate |
| JP5596925B2 (en) * | 2009-01-20 | 2014-09-24 | 株式会社山梨技術工房 | Foreign object inspection apparatus and inspection method |
-
2018
- 2018-04-23 CN CN201810364765.1A patent/CN108417516B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06273343A (en) * | 1993-03-17 | 1994-09-30 | Fujitsu Ltd | Foreign matter inspection equipment |
| US6259960B1 (en) * | 1996-11-01 | 2001-07-10 | Joel Ltd. | Part-inspecting system |
| CN101657893A (en) * | 2007-04-25 | 2010-02-24 | 株式会社Snu精密 | The foreign matter detection of semiconductor crystal wafer and repair system and method thereof |
| CN102192915A (en) * | 2010-03-12 | 2011-09-21 | 东京毅力科创株式会社 | Back impurity inspection method, back impurity inspection device and coating device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108417516A (en) | 2018-08-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108417516B (en) | Detection system and detection method for wafer back foreign matter | |
| US20140208850A1 (en) | Apparatus and method of detecting a defect of a semiconductor device | |
| CN106996759B (en) | For measuring the thickness degree of wafer stacking and the measuring device and method of lattice defect | |
| CN102522350B (en) | Method and device for detecting failed production machine platforms | |
| US6779386B2 (en) | Method and apparatus for detecting topographical features of microelectronic substrates | |
| US20090114018A1 (en) | Panel inspection apparatus and inspection method | |
| CN103779165B (en) | Plasma apparatus and location of workpiece detection method | |
| CN117080139B (en) | Wafer conveying control method and conveying control system based on vacuum adsorption technology | |
| CN102832152B (en) | A kind of method of on-line checkingi contact hole | |
| CN103646899A (en) | Wafer defect detection method | |
| CN111816582A (en) | Wafer bonding defect position positioning method and manufacturing method of semiconductor device sample | |
| CN103311146A (en) | Defect inspection method | |
| CN111640685B (en) | Semiconductor device and workpiece state detection method | |
| CN107170701B (en) | Manipulator, semiconductor processing equipment and method for detecting working state of manipulator | |
| CN110364461B (en) | Wafer state detection equipment and method and wafer loading and unloading chamber | |
| CN105762093A (en) | Technological cavity and method for judging whether position of wafer on tray is abnormal or not | |
| CN209804602U (en) | wafer conductive film processing equipment | |
| CN116417379A (en) | Wafer detection structure and wafer detection method | |
| CN103646898A (en) | Method for detecting defects of wafer with the use of electron beam | |
| CN104103544B (en) | Wafer defect monitoring method | |
| CN101097835A (en) | Methods of detecting an abnormal operation of processing apparatus and systems thereof | |
| CN110850690B (en) | Stripping equipment, thimble monitoring method and stripping process | |
| CN108364882B (en) | Method for obtaining wafer back scratch source | |
| CN104241158A (en) | Method for monitoring small-size particle defects on annealing device | |
| CN106816391A (en) | Bonding die detection method and system, reaction chamber and semiconductor processing equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |