CN108395748A - Soft board cover board for flexible circuit board processing and the soft board cover board technological process - Google Patents
Soft board cover board for flexible circuit board processing and the soft board cover board technological process Download PDFInfo
- Publication number
- CN108395748A CN108395748A CN201810269755.XA CN201810269755A CN108395748A CN 108395748 A CN108395748 A CN 108395748A CN 201810269755 A CN201810269755 A CN 201810269755A CN 108395748 A CN108395748 A CN 108395748A
- Authority
- CN
- China
- Prior art keywords
- substrate body
- plate body
- board
- cover board
- resin plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/03—Powdery paints
- C09D5/033—Powdery paints characterised by the additives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Abstract
The present invention discloses a kind of soft board cover board for flexible circuit board processing, including substrate body and resin plate body；Because resin plate body is to form plate body after being cured by fine particle；The substrate body includes cold punching plate or brown paper or aluminum.When use, since resin plate body can make to hold small drill point in small drill point contact pressure resin plate body surface moment when drilling, reduce deflection, generation cutting powder is converted into dust and is sucked away after being cut simultaneously by small drill point, so that in boring procedure best hole site precision can be provided for drilling, to reach under the premise of meeting the hole position precision of drilling, improve in the processing small drill point broken needle problems of 0.075 0.10mm.In addition, soft board cover board of the present invention also has effects that processing is simple and convenient.
Description
【Technical field】
The present invention relates to it is a kind of for wiring board processing consumptive material in terms of for flexible circuit board processing soft board cover board and
The soft board cover board technological process.
【Background technology】
As social constantly progress and development forward, the requirement of the adjoint high precision int to electronic product are higher and higher.Electricity
The high-precision development of sub- product directly proposes more high-precision requirement to wiring board processing, meanwhile, but also to the hole of wiring board
The positioning accuracy of position and hole position quality requirements are higher and higher.However, when flexible circuit board drills in the prior art, it is general using existing
There is traditional cold punching plate as flexible board (FPC) cover board, since the cold punching plate hardness is high, easily in processing 0.075-
Broken needle is serious when 0.10mm small drill points, causes drill point and plank scrap cost quite high.
【Invention content】
The present invention technical purpose be in order to solve the above-mentioned problems of the prior art, provide it is a kind of meet drilling
Under the premise of the precision of hole position, improves in the processing small drill point broken needle problems of 0.075-0.10mm, scrapped into reducing drill point and plank
This soft board cover board for flexible circuit board processing.
The other technical purpose offer of the present invention is a kind of to process simply and easily soft board cover board technique
In order to realize above-mentioned technical problem, a kind of soft board cover board for flexible circuit board processing provided by the present invention,
Using in terms of adagio wiring board (FPC) cover board consumptive material above when drilling for adagio wiring board (FPC), including substrate body with
And it is set to the resin plate body on substrate body surface；The resin plate body is by after the fine fine particle solidification of a plurality of height
Being formed has the plate body of high rigidity, high-wear resistance and high scratch resistance；The substrate body includes cold punching plate or brown paper or aluminum；
The resin plate body includes major ingredient, auxiliary agent, diluent and filler；The component prescription mass ratio is divided into 45% master
Material, 45% diluent, 5% auxiliary agent, 5% auxiliary agent；The major ingredient is acrylate, and the diluent is isophthalic two
Ammonium, the auxiliary agent are acrylonitrile, and the filler is mute point；The resin plate body is formed by heat cured resin.
The technological process of a kind of soft board cover board for flexible circuit board processing is：The first step, to the surface of substrate body
Quality is detected, and whether detection substrate body surface has flash or burr, then, the substrate body is put into pickling on feeder
Slot internal washing, dust, impurity and the oil stain on substrate body surface to be removed, you can become the substrate body of qualified semi-finished product；The
Two steps, by according to the acrylate of component prescription proportion requirement, isophthalic diammonium, auxiliary agent is that acrylonitrile and mute point are respectively put into
It inside container, is sufficiently stirred so that material is thoroughly mixed together graininess coating to be become；Third walks, by the particle
Shape coating is poured into inside three-roll grinder and is ground, and waits for that the material fusion of graininess coating becomes powder type coating preparation together,
；4th step, the powder type coating preparation are coated on by roller applications on substrate body surface, which mainly passes through
Coating idler wheel controls coating layer thickness；5th step, the substrate body for being coated with powder type coating preparation are sent to inside tunnel type baking oven,
200 degrees Celsius of baking temperature and baking time are to cure to the powder type coating preparation on substrate body surface under conditions of 120 seconds,
Wait for that substrate body surface forms one layer of plate body layer with thickness, the as described soft board cover board；6th step, by soft board lid described in finished product
Plate is wound, and is examined, warehousing finished products.
Beneficial effects of the present invention：Because the resin plate body is by shape after the fine fine particle solidification of a plurality of height
At with high rigidity, the plate body of high-wear resistance and high scratch resistance；The substrate body includes cold punching plate or brown paper or metallic aluminium
Piece or aluminium foil.In use, steady in small drill point contact pressure resin plate body surface moment when can make drilling due to the resin plate body
Firmly small drill point reduces deflection, while being converted into dust by generation cutting powder after the cutting of small drill point and being sucked away so that was drilling
Best hole site precision can be provided for drilling in journey, to reach under the premise of meeting the hole position precision of drilling, improved
The small drill point broken needle problems of 0.075-0.10mm are processed, with the effect reduced up to drill point and plank scrap cost.In addition, with existing
The technique of cold punching plate in technology is compared to each other, and soft board cover board of the present invention also has effects that processing is simple and convenient.
With reference to the accompanying drawings and examples, technical scheme of the present invention will be described in further detail.
【Description of the drawings】
Fig. 1 is the schematic diagram of the soft board cover board for flexible circuit board processing in the present invention.
【Specific embodiment】
Shown in please referring to Fig.1, illustrate a kind of soft board cover board for flexible circuit board processing with reference to embodiment, including
Substrate body 1 and the resin plate body 2 for being set to substrate body surface.The substrate body 1 forms the soft board with resin plate body 2
Cover board is mainly used in when adagio wiring board (FPC) processing in terms of used consumptive material, and the soft board cover board use is soft
Plate wiring board (FPC) is above.
The resin plate body 2 is formed with high rigidity after being cured by the fine fine particle of a plurality of height, high resistance to
Grind the plate body of performance and high scratch resistance.The resin plate body 2 includes major ingredient, auxiliary agent, diluent and filler.The ingredient
Prescription quality ratio is divided into 45% major ingredient, 45% diluent, 5% auxiliary agent, 5% auxiliary agent.The major ingredient is acrylic acid
Ester, the diluent are isophthalic diammonium, and the auxiliary agent is acrylonitrile, and the filler is mute point.The resin plate body 2 is
It is formed by heat cured resin.The substrate body 1 includes cold punching plate or brown paper or aluminum.
Graft reaction occurs between the performance monomer and elastomer of the acrylate, forms toughness solidfied material, improves stripping
From intensity and impact strength and adhesive force.It is with room temperature fast-curing, and adhesive strength is high, and heat-resist, heat resistance can reach
200℃.Impact property is strong, and impact strength can be increased to 14.8J/cm2.Acrylonitrile has adjustment, improves durability, attachment
Power, corrosion protection, wearability are tough.M-phenylene diamine (MPD) can promote the heat resistance of solidfied material, chemical resistance, and heat resistance compares phenolic aldehyde
Resin cured matter is 50 DEG C high.Acrylic acid ester oligomer have good flexibility and chemical-resistant, to various base materials have compared with
Good adhesive force.Since cold punching plate surface polarity is relatively low, the propylene acid esters has good adhesive force and flexibility,
It reduces the contraction to base material after forming a film, ensure the original integrality of base material.Levelling agent is mainly the stream improved before coating film forming
Dynamic property, forms smooth, smooth, a uniform film.Diluent is arranged for cooperated technique for producing, and the viscous of coating is controlled
Consistency makes coating reach ideal Construction State.The mute point of surface gloss for being mainly used for adjusting coating.
In the present embodiment, the soft board cover board technological process is：The first step carries out the surface quality of substrate body 1
Whether detection, 1 surface of detection substrate body have flash or burr, then, the substrate body 1 are put on feeder inside descaling bath
Cleaning, dust, impurity and the oil stain on 1 surface of substrate body to be removed, you can become the substrate body of qualified semi-finished product；Second step,
By according to the acrylate of component prescription proportion requirement, isophthalic diammonium, auxiliary agent is that acrylonitrile and mute point are respectively put into container
Portion is sufficiently stirred so that material is thoroughly mixed together, graininess coating to be become；Third walks, by the graininess coating
It is poured into inside three-roll grinder and is ground, wait for that the material fusion of graininess coating becomes powder type coating preparation together, you can；The
Four steps, the powder type coating preparation are coated on by roller applications on 1 surface of substrate body, which is mainly rolled by coating
Wheel control coating layer thickness；5th step, the substrate body 1 for being coated with powder type coating preparation are sent to inside tunnel type baking oven, are toasting
200 degrees Celsius of temperature and baking time are to cure to the powder type coating preparation on 1 surface of substrate body under conditions of 120 seconds, wait for base
1 surface of material body forms one layer of plate body layer with thickness, the as described soft board cover board；6th step, by soft board cover board described in finished product
Winding is examined, warehousing finished products.
The substrate body 1 is process by isolation material or insulating matter.The resin plate body 2 is by a plurality of high
The plate body with high rigidity, high-wear resistance and high scratch resistance is formed after spending fine fine particle solidification.The plate body be by
Water-soluble or heat cured resin is formed.The resin plate body 2 is attached to the upper surface of substrate body 1.Resin plate body 2, base material
Body 1 toasts to form soft board cover board by roller coating, which can reduce the broken needle caused by torsion, can also improve precision
Contraposition extends the drill point service life.This soft board cover board adds the repeatability of soft board cover board by reducing the tolerance of insulator inherence itself
Energy.This soft board cover board, which is lain on adagio wiring board, need not wear gloves and any special operation requirement so that can reach
It is easy to operate.This adagio wiring board can be kept by covering tube effect well into the hole of knife face and lamination exit face position
Precision.The resin plate body 2 can hold small drill point in small drill point contact plate face moment, deflection be reduced, by small brill
Produced cutting powder is converted into dust and is sucked away after needle cutting.In boring procedure and splendid vision can be presented later to imitate
Fruit so that best hole site precision can be provided for drilling.It is placed steadily in printed circuit laminate, is notheated softening,
Gloves or any specialized processing techniques are not necessarily to when being operated to soft board cover board, it is easy to operate to reach.
In conclusion because the resin plate body 2 is that had by being formed after the fine fine particle solidification of a plurality of height
The plate body of high rigidity, high-wear resistance and high scratch resistance；The substrate body 1 includes cold punching plate or brown paper or aluminum.In use,
Since the resin plate body 2 can make to hold small drill point in small 2 surface moment of drill point contact pressure resin plate body when drilling, reduce inclined
Tiltedly, generation cutting powder is converted into dust and is sucked away after while being cut by small drill point so that can be drilling in boring procedure
Best hole site precision is provided, is improved in the processing small brills of 0.075-0.10mm under the premise of the hole position precision to meet drilling
Needle broken needle problem, in addition mutual with the technique of cold punching plate in the prior art up to the effect of drill point and the reduction of plank scrap cost
Compare, soft board cover board of the present invention also has effects that processing is simple and convenient.
To those skilled in the art, it can be modified or changed according to the above description, and all these
Modifications and variations should belong to the present invention and apply within the scope of protecting.
Claims (2)
1. it is a kind of for flexible circuit board processing soft board cover board, be used for adagio wiring board (FPC) drilling when use in adagio
In terms of the cover board consumptive material of wiring board (FPC) above, including substrate body and the resin plate body for being set to substrate body surface；Its feature
It is：The resin plate body is by being formed with high rigidity, high-wearing feature after the fine fine particle solidification of a plurality of height
Energy and the plate body of high scratch resistance；The substrate body includes cold punching plate or brown paper or aluminum；The resin plate body is by thermosetting property
Resin formed；The resin plate body includes major ingredient, auxiliary agent, diluent and filler；The component prescription mass ratio point
For 45% major ingredient, 45% diluent, 5% auxiliary agent, 5% auxiliary agent；The major ingredient is acrylate, the diluent
For isophthalic diammonium, the auxiliary agent is acrylonitrile, and the filler is mute point.
2. a kind of technological process of the soft board cover board as described in claim 1 for flexible circuit board processing is：The first step is right
The surface quality of substrate body is detected, and whether detection substrate body surface has flash or burr, and then, the substrate body is put into
Descaling bath internal washing on feeder, dust, impurity and the oil stain on substrate body surface to be removed, you can become qualified semi-finished product
Substrate body；Second step, by according to the acrylate of component prescription proportion requirement, isophthalic diammonium, auxiliary agent is acrylonitrile and mute
It is respectively put into inside container, is sufficiently stirred so that material is thoroughly mixed together, graininess coating to be become；Third
Step, which is poured into inside three-roll grinder and is ground, and waits for that the material fusion of graininess coating becomes together
Powder type coating preparation, you can；4th step, the powder type coating preparation are coated on by roller applications on substrate body surface, the roller coating side
Formula mainly controls coating layer thickness by coating idler wheel；5th step, the substrate body for being coated with powder type coating preparation are sent to tunnel
Inside formula oven, under conditions of 200 degrees Celsius of baking temperature and baking time are 120 seconds, to the powdered of substrate body surface
Coating is cured, and waits for that substrate body surface forms one layer of plate body layer with thickness, the as described soft board cover board；6th step, will
Soft board cover board described in finished product is wound, and is examined, warehousing finished products.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810269755.XA CN108395748A (en) | 2018-03-29 | 2018-03-29 | Soft board cover board for flexible circuit board processing and the soft board cover board technological process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810269755.XA CN108395748A (en) | 2018-03-29 | 2018-03-29 | Soft board cover board for flexible circuit board processing and the soft board cover board technological process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108395748A true CN108395748A (en) | 2018-08-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810269755.XA Pending CN108395748A (en) | 2018-03-29 | 2018-03-29 | Soft board cover board for flexible circuit board processing and the soft board cover board technological process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108395748A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109760133A (en) * | 2019-01-29 | 2019-05-17 | 深圳市柳鑫实业股份有限公司 | A kind of cover board and the preparation method and application thereof |
| CN110121241A (en) * | 2019-05-10 | 2019-08-13 | 深圳市宏宇辉科技有限公司 | Soft board cover board and the soft board cover board process flow for flexible circuit board processing |
| CN112888162A (en) * | 2021-01-12 | 2021-06-01 | 深圳市宏宇辉科技有限公司 | Double-sided composite aluminum sheet |
| CN113573485A (en) * | 2021-09-27 | 2021-10-29 | 福莱盈电子股份有限公司 | Method for improving broken filaments of soft and hard combined plate to knife face |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101993656A (en) * | 2010-11-29 | 2011-03-30 | 北京高盟新材料股份有限公司 | Conformal coating for protecting printed circuit board, preparation method and curing method thereof |
| CN105537090A (en) * | 2016-02-01 | 2016-05-04 | 深圳市宏宇辉科技有限公司 | Coating aluminum sheet and technological process for manufacturing same |
| CN106658948A (en) * | 2017-01-06 | 2017-05-10 | 安徽鹏展电子科技有限公司 | Radiating flexible circuit board and surface coating thereof |
-
2018
- 2018-03-29 CN CN201810269755.XA patent/CN108395748A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101993656A (en) * | 2010-11-29 | 2011-03-30 | 北京高盟新材料股份有限公司 | Conformal coating for protecting printed circuit board, preparation method and curing method thereof |
| CN105537090A (en) * | 2016-02-01 | 2016-05-04 | 深圳市宏宇辉科技有限公司 | Coating aluminum sheet and technological process for manufacturing same |
| CN106658948A (en) * | 2017-01-06 | 2017-05-10 | 安徽鹏展电子科技有限公司 | Radiating flexible circuit board and surface coating thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109760133A (en) * | 2019-01-29 | 2019-05-17 | 深圳市柳鑫实业股份有限公司 | A kind of cover board and the preparation method and application thereof |
| CN110121241A (en) * | 2019-05-10 | 2019-08-13 | 深圳市宏宇辉科技有限公司 | Soft board cover board and the soft board cover board process flow for flexible circuit board processing |
| CN112888162A (en) * | 2021-01-12 | 2021-06-01 | 深圳市宏宇辉科技有限公司 | Double-sided composite aluminum sheet |
| CN112888162B (en) * | 2021-01-12 | 2024-02-06 | 深圳市宏宇辉科技有限公司 | Double-sided composite aluminum sheet |
| CN113573485A (en) * | 2021-09-27 | 2021-10-29 | 福莱盈电子股份有限公司 | Method for improving broken filaments of soft and hard combined plate to knife face |
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Legal Events
| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20200722 Address after: 518000 Shajingjie Street Shatou Community Shajingxi Ring Road Democracy Jiujiu Industrial Zone 409, Baoan District, Shenzhen City, Guangdong Province Applicant after: SHENZHEN HONGYUHUI TECHNOLOGY Co.,Ltd. Address before: 422000 Shaoyang province Hunan city Daxiang District Tan Jiang Xiang Shuangjiang village 6 Group No. 255 of No. 2 Applicant before: Zhu Dasheng |
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| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180814 |
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| RJ01 | Rejection of invention patent application after publication |