CN108376040A - Input module and terminal - Google Patents
Input module and terminal Download PDFInfo
- Publication number
- CN108376040A CN108376040A CN201810162035.3A CN201810162035A CN108376040A CN 108376040 A CN108376040 A CN 108376040A CN 201810162035 A CN201810162035 A CN 201810162035A CN 108376040 A CN108376040 A CN 108376040A
- Authority
- CN
- China
- Prior art keywords
- input module
- support edge
- protrusion
- case ring
- encapsulation part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
- G06F3/0487—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser
- G06F3/0488—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures
- G06F3/04883—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures for inputting data by handwriting, e.g. gesture or text
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Casings For Electric Apparatus (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The invention discloses a kind of input module and terminals.Input module includes case ring and fingerprint chip-packaging structure.Case ring includes rosette and support edge.The inner wall of support edge self-chambering circlets extends internally.Fingerprint chip-packaging structure is housed in rosette and is supported on support edge.Case ring includes the outwardly extending flange of outer wall of self-chambering circlets, and fingerprint chip-packaging structure includes：Packaging body, packaging body include bottom surface and connect the side of bottom surface, and the junction of bottom surface and side is formed with recessed portion, and support edge is housed in recessed portion；And the fingerprint recognition chip being arranged in packaging body.In the input module of embodiment of the present invention, the support edge of case ring can support and location fingerprint chip-packaging structure, to improve the efficiency of assembling of fingerprint chip-packaging structure and case ring.
Description
Technical field
The present invention relates to field of terminal more particularly to a kind of input module and terminals.
Background technology
In the related art, certain mobile phones include fingerprint chip-packaging structure and case ring, and fingerprint chip-packaging structure is set
It sets in case ring so that the appearance of mobile phone is more beautiful.But the position in case ring is arranged in fingerprint chip-packaging structure
It sets and is difficult to determine, efficiency of assembling when causing in the setting to case ring of fingerprint chip-packaging structure is relatively low.
Invention content
The present invention is directed at least solve one of the technical problems existing in the prior art.For this purpose, present invention offer is a kind of defeated
Enter component and a kind of terminal.
The input module of embodiment of the present invention includes case ring and fingerprint chip-packaging structure.Case ring includes rosette
And support edge.The inner wall of support edge self-chambering circlets extends internally.Fingerprint chip-packaging structure is housed in rosette and is supported on
On support edge.Case ring includes the outwardly extending flange of outer wall of self-chambering circlets, and fingerprint chip-packaging structure includes：Packaging body,
Packaging body includes bottom surface and connects the side of bottom surface, and the junction of bottom surface and side is formed with recessed portion, and support edge is housed in recessed
In concave portion；And the fingerprint recognition chip being arranged in packaging body.
In the input module of embodiment of the present invention, the support edge of case ring can support and location fingerprint chip package knot
Structure, to improve the efficiency of assembling of fingerprint chip-packaging structure and case ring.In addition, flange and recessed portion cooperation can reduce it is defeated
The thickness for entering module, is conducive to terminal miniaturization
In some embodiments, the rosette includes the roof being connect with the inner wall, and the roof includes direction
Guide ramp in the case ring.
In some embodiments, the support edge is formed with avoid holes.
In some embodiments, the rounded rectangle of the avoid holes, the side wall of the avoid holes is along the avoid holes
Axial direction is formed with escape groove, and the escape groove is connected to the avoid holes.
In some embodiments, the rosette includes the outwardly extending flange of outer wall from the rosette.
In some embodiments, the flange includes the second protrusion of the first protrusion and connection first protrusion, institute
It includes first and second to state the first protrusion, second connection first and second protrusion, and described second
Portion is convexly equipped in described first and second protrusion.
In some embodiments, the either flush of the top surface of first protrusion and second protrusion, described first
The thickness in portion is more than the thickness of second protrusion.
In some embodiments, the rosette is in oblong, and the outer wall of the rosette includes parallel two straight
Two bending sections of line segment and the described two straightways of connection, described first is arranged in one of them described described straightway
On, described second is arranged on described two bending sections.
In some embodiments, the fingerprint chip-packaging structure includes：
Packaging body, the packaging body include the side of bottom surface and the connection bottom surface, the company of the bottom surface and the side
The place of connecing is formed with recessed portion, and the support edge is housed in the recessed portion；And
The fingerprint recognition chip being arranged in the packaging body.
In some embodiments, the packaging body includes the second envelope of the first encapsulation part and connection first encapsulation part
Dress portion, first encapsulation part include the bottom surface, and second encapsulation part includes the side；
The support edge is formed with avoid holes, and first encapsulation part wears the avoid holes, the second encapsulation part branch
Support is on the support edge.
In some embodiments, second encapsulation part includes the top surface being connect with the side, the fingerprint chip
Encapsulating structure includes fixed cover plate on the top surface.
In some embodiments, the recessed portion includes second face in the first face and connection first face, and described the
On one side perpendicular to second face, second encapsulation part includes first face, and first encapsulation part includes described second
Face.
In some embodiments, the input module includes sealing element, and the sealing element setting is in second encapsulation
Between portion and the support edge, the sealing element seals the gap between the support edge and second encapsulation part.
In some embodiments, the input module includes touch panel, and the touch panel offers mounting hole, institute
It states case ring to be set in the mounting hole, and is fixedly connected with the touch panel.
The terminal of embodiment of the present invention includes the input module described in any of the above embodiment.
In the input module of embodiment of the present invention, the support edge of case ring can support and location fingerprint chip package knot
Structure, to improve the efficiency of assembling of fingerprint chip-packaging structure and case ring.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obviously, or practice through the invention is recognized.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, wherein：
Fig. 1 is the floor map of the terminal of embodiment of the present invention；
Fig. 2 is the diagrammatic cross-section of the input module of embodiment of the present invention；
Fig. 3 is the stereoscopic schematic diagram of the case ring of embodiment of the present invention；
Fig. 4 is the diagrammatic cross-section of the case ring of embodiment of the present invention；
Fig. 5 is the floor map of the case ring of embodiment of the present invention；
Fig. 6 is the perspective exploded view of the case ring of embodiment of the present invention；
Fig. 7 is another perspective exploded view of the case ring of embodiment of the present invention；
Fig. 8 is the stereoscopic schematic diagram of the fingerprint chip-packaging structure of embodiment of the present invention；
Fig. 9 is the diagrammatic cross-section of the fingerprint chip-packaging structure of embodiment of the present invention；
Figure 10 is the floor map of the fingerprint chip-packaging structure of embodiment of the present invention.
Specific implementation mode
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term "center", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, do not indicate or imply the indicated device or element must have a particular orientation, with spy
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.
In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
Can also be to be electrically connected or can mutually communicate to be mechanical connection；It can be directly connected, it can also be by between intermediary
It connects connected, can be the interaction relationship of the connection or two elements inside two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or "lower"
It may include that the first and second features are in direct contact, can also not be to be in direct contact but pass through it including the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " include first special
Sign is right over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include fisrt feature immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
It please refers to Fig.1 and Fig. 2, the input module 100 of embodiment of the present invention includes touch panel 10, case ring 20 and refer to
Line chip-packaging structure 30.
The input module 100 of embodiment of the present invention can be applied to terminal 1000, and terminal 1000 is, for example, mobile phone or tablet
The electronic devices such as computer.It is appreciated that terminal 1000 includes but not limited to the example of present embodiment.
Specifically, touch panel 10 includes upper surface 12 and lower surface 14.Upper surface 12 is opposite with lower surface 14.It can manage
Solution, the upper surface 12 of touch panel 10 is the appearance of input module 100, towards user.User can be enterprising in upper surface 12
Row gesture operation, such as click or slide and corresponding function is realized with control terminal 1000.
The material of touch panel 10 can be made of translucent materials such as glass, ceramics or sapphires.Due to touch panel 10
Due to the input part as terminal 1000, touch panel 10 is often subject to the contacts such as collide or scratch.For example, user is by terminal
1000 when being put into pocket, and touch panel 10 may be scratched by the key in user's pocket and be damaged.
Therefore, the larger material of hardness, such as above-described sapphire material may be used in the material of touch panel 10.
It is of course also possible to set up upper cover sheet in the upper surface of touch panel 10 12 to prevent touch panel 10 to be scraped off.
Further, touch panel 10 includes display area 15 and non-display area 16.Normally, in touch panel 10
Between region be arranged around display area 15 as display area 15, non-display area 16.For example, non-display area 16 is arranged
Top side or bottom side in display area 15.
Since touch panel 10 is made of translucent material, user can check terminal 1000 by display area 15
Screen shown by content.
In order to enable terminal 1000 is more beautiful, ink, ink can be sprayed in the lower surface of non-display area 16 14
Color to be, for example, colors, the concrete condition such as white, black or blue can be arranged according to actual demand.Ink not only can be with
Meet demand of the user to the terminal 1000 of different colours, the structure inside terminal 1000 can also be covered to reach beautification terminal
1000 effect.
It is appreciated that the shape of touch panel 10 can specifically be designed according to the shape of terminal 1000, for example, fillet square
Shape.
Further, touch panel 10 offers mounting hole 17.In present embodiment, mounting hole 17 is through upper surface 12
And the through-hole of lower surface 14.In other embodiments, mounting hole 17 can be formed in the blind hole of lower surface 14.
In present embodiment, mounting hole 17 is in the oval bodily form.Certainly, in other embodiments, mounting hole 17 can root
According to specific requirements design take on a different shape, such as round or ellipse shape.Therefore, the mounting hole 17 of present embodiment
The example of shape is not considered as limiting the invention.
In some embodiments, case ring 20 is set in mounting hole 17, and is fixedly connected with touch panel 10.Refer to
Line chip-packaging structure 30 is housed in case ring 20, and is fixedly connected with case ring 20.
Usually, the top area in terminal 1000 is arranged in the receiver of terminal 1000.Therefore, mounting hole 17 in order to prevent
It is interfered with receiver, preferably, mounting hole 17 is opened in the bottom section of touch panel 10, to carrying for mounting hole 17
For larger design space.Further, mounting hole 17 is opened in the non-display area 16 of touch panel 10.
Preferably, mounting hole 17 is opened in the centre position of 10 bottom section of touch panel so that touch panel 10 is in big
Cause symmetrical structure.So so that terminal 1000 is more beautiful, two is user-friendly.
It, can be first by case ring 20 from touch panel 10 when manufacturing input module 100 when mounting hole 17 is through-hole
Lower section is packed into mounting hole 17, and then glue is clicked and entered in the gap between the inner wall of mounting hole 17 and case ring 20, so that case ring
20 are fixedly connected with touch panel 10.
Fingerprint chip-packaging structure 30 is packed into from the top of touch panel 10 in case ring 20 later, and solid using colloid
Surely connection fingerprint chip-packaging structure 30 and case ring 20.
When mounting hole 17 is blind hole, first fingerprint chip-packaging structure 30 can be packed into case ring 20, then refer to band
The case ring 20 of line chip-packaging structure 30 is packed into mounting hole 17, and usable glue is adhesively fixed case ring 20 and touch panel
10。
It please join Fig. 3-Fig. 5, in some embodiments, case ring 20 includes rosette 21 and support edge 22.Support edge 22
The inner wall 211 of self-chambering circlets 21 extends internally.
The support edge 22 of the case ring 20 of embodiment of the present invention can support and location fingerprint chip-packaging structure 30, from
And improve the efficiency of assembling of fingerprint chip-packaging structure 30 and case ring 20.
In other words, fingerprint chip-packaging structure 30 is supported on support edge 22.Fingerprint chip-packaging structure 30 is packed into
When in rosette 21, fingerprint chip-packaging structure 30 can be pressed from top to bottom, if the position of fingerprint chip-packaging structure 30
It cannot move again, then it represents that fingerprint chip-packaging structure 30 has been resisted against on support edge 22, and is installed into precalculated position.
It is appreciated that rosette 21 is formed with accommodating hole 212, support edge 22 is located in accommodating hole 212.Accommodating hole 212 can
To be in right cylinder shape, in other words, inner wall 211 is linearly, in order to which fingerprint chip-packaging structure 30 is rapidly packed into accommodating hole 212
It is interior.
The material that accommodating hole 212 and support edge 22 can be removed on part by way of machining is formed, can also
It is formed by modes such as castings.
In order to ensure the intensity of case ring 20, preferably, the material of case ring 20 is metal, such as stainless steel material, from
And meet the intensity requirement of case ring 20, also there is corrosion resistance, improve the service life of case ring 20.Certainly, case ring 20
The other materials such as plastics can be used to be made.
In some embodiments, further, fingerprint chip-packaging structure 30 is housed in rosette 21 and is supported on
On support edge 22.
In some embodiments, inner wall 211 of the support edge 22 perpendicular to rosette 21.
In this way, support edge 22 is easy to be formed, the manufacturing cost of rosette 21 can be reduced.In addition, when manufacture input module
When 100, support edge 22 is horizontally situated, and the inner wall 211 of rosette 21 is located at vertical position so that is coordinated with support edge 22
The face of fingerprint chip-packaging structure 30 is horizontal plane, can simplify the fingerprint chip-packaging structure being supported on support edge 22 in this way
30 structure.
In some embodiments, rosette 21 includes the first bottom surface 213 being connect with inner wall 211, under support edge 22
Surface 221 is concordant with the first bottom surface 213.
In the rosette 21 of equal height, such as arrangement above, larger accommodating space can be formed in rosette 21, with
Ensure that fingerprint chip-packaging structure 30 can be housed in rosette 21.
In other words, in the case where the thickness of fingerprint chip-packaging structure 30 is constant, the height of rosette 21 is smaller, to
The thickness of input module 100 can be reduced, and then can be thinned for the thickness of terminal 1000 and design basis is provided.
In some embodiments, rosette 21 includes roof 214.Roof 214 is connect with inner wall 211.Roof 214 includes
Towards the guide ramp 2142 in case ring 20.
In this way, the finger that guide ramp 2142 can guide user can smoothly enter into rosette 21 to carry out fingerprint recognition behaviour
Make, the accuracy rate that user carries out fingerprint recognition operation can be improved.It is shinny it is possible to further be plated in guide ramp 2142
Metal layer (such as layers of chrome), so that rosette 21 is more beautiful.
It is appreciated that guide ramp 2142 is annular surface, user can be facilitated to be placed in finger from all directions in this way and decorated
To press fingerprint chip-packaging structure 30 in ring 21, to carry out fingerprint recognition operation.
In some embodiments, support edge 22 is formed with avoid holes 222.
In this way, avoid holes 222 are conducive to the cabling for the fingerprint flexible PCB 40 being connect with fingerprint chip-packaging structure 30
Layout.For example, fingerprint flexible PCB 40 can pass through avoid holes 222 connect with fingerprint chip-packaging structure 30 (such as Fig. 2 institutes
Show).
In some embodiments, 222 rounded rectangle of avoid holes, the side wall 2221 of avoid holes 222 is along avoid holes 222
Axial direction is formed with escape groove 2222, and escape groove 2222 is connected to avoid holes 222.
Such as shown in Fig. 2, after fingerprint flexible PCB 40 is connect with fingerprint chip-packaging structure 30, first to escape groove 2222
Direction extend, be then bent detour.Therefore, escape groove 2222 can prevent fingerprint flexible PCB 40 from occurring with side wall 2221
Interference is conducive to the wiring of fingerprint flexible PCB 40.
In some embodiments, the outwardly extending flange of the outer wall of case ring 20 including self-chambering circlets 21 23.
In this way, flange 23 can be resisted against the lower surface 14 of touch panel 10, so as to increase case ring 20 and touch surface
The connection area of plate 10 improves the reliability that case ring 20 is fixedly connected with touch panel 10.
In addition, when case ring 20 is packed into mounting hole 17 from the bottom up, flange 23 is resisted against under touch panel 10
When surface 14, then it represents that case ring 20 is already mounted to precalculated position.Therefore, the setting of flange 23 also improves input module 100
Efficiency of assembling, reduce the manufacturing cost of input module 100.
In some embodiments, diaphragm seal can be set between flange 23 and lower surface 14 to prevent water from case ring 20
Gap between mounting hole 17 enters in terminal 1000, to improve the waterproof effect of terminal 1000.
As Fig. 3-Fig. 5 embodiment in, flange 23 is an integral molding structure with rosette 21.And such as the reality of Fig. 6 and Fig. 7
It applies in mode, flange 23 is seperated molding structure with rosette 21.Specifically, rosette 21 includes socket part 24, socket part 24
Connect support edge 22.Flange 23 is set on socket part 24.The molding seperated with rosette 21 of flange 23 can reduce case ring 20
Manufacture difficulty so that when producing case ring 20 in batches, the consistency of each case ring 20 can be improved.
It should be pointed out that in some embodiments, socket part 24 can be offered to be passed through for fingerprint flexible PCB 40
Via 24a.
Specifically, socket part 24 includes connection side 241 and loading plate 242.It connects side 241 and connects support edge 22 and loading plate
242, connection side 241 is approximately perpendicular to support edge 22.Loading plate 242 is approximately perpendicular to connection side 241.Connection side 241 offers
Via 24a.
Socket part 24 is hollow partly or entirely to accommodate fingerprint chip-packaging structure 30.It should be noted that at certain
In a little embodiments, fingerprint chip-packaging structure 30 can be supported on loading plate 242.
Referring to Fig. 3-Fig. 5, in some embodiments, outer wall 215 of the flange 23 perpendicular to rosette 21.
In this way, 20 manufacturing process of case ring is simple, the contact area being connect with touch panel 10 can also be increased.
In some embodiments, flange 23 includes the first protrusion 231 and connects the second protrusion 232 of the first protrusion 231,
First protrusion 231 includes first 2311 and second 2312, second 2312 connection first 2311 and the second protrusion 232,
It is convexly equipped in first 2311 and the second protrusion 232 for second 2312.
After case ring 20 is packed into mounting hole 17, the longitudinal direction of first 2311 and the second protrusion 232 along touch panel 10
Extend, second 2312 extends along 10 horizontal direction of touch panel.
Since the accommodating space of 10 horizontal direction of touch panel is larger, second 2312 is convexly equipped in first 2311
And second protrusion 232 can increase the connection area of flange 23 and touch panel 10.
In addition, the width of first 2311 and the second protrusion 232 is smaller, it can be to avoid the non-display area of touch panel 10
16 longitudinal length is lengthened because of the width of first 2311 and the second protrusion 232, and is reduced the area of display area 15 and touched
The area ratio of panel 10 is touched, and then influences the appearance of terminal 1000.
In some embodiments, the top surface 231a of the first protrusion 231 is concordant with the top surface 232a of the second protrusion 232, the
One 2311 thickness is more than the thickness of the second protrusion 232.
It is appreciated that after case ring 20 is packed into mounting hole 17, relative to first 2311, the second protrusion 232 is closer to aobvious
Show region 15.In other words, it is arranged far from display area 15 for first 2311, the second protrusion 232 is arranged close to display area 15.
Part due to input module 100 close to the position of display area 15 is more, the thickness of the second protrusion 232
It is relatively thin to be interfered (as shown in Figure 2) with the other parts close to display area 15 to avoid the second protrusion 232.
As shown in Fig. 2, case ring 20 exists with the screen flexible PCB 50 of the screen that connect terminal 1000 and other parts
There is the part of overlapping in orthographic projection on the lower surface 14 of touch panel 10, the thinner thickness of the second protrusion 232 can to avoid with
Screen flexible PCB 50 and other parts interfere so that case ring 20 can be arranged closer to display area 15, decoration
Circle 20 even can be partly or entirely arranged in the display area of touch panel 10 15, to reduce the area of non-display area 16
With the ratio of the area of touch panel 10, increase the ratio of the area of display area 15 and the area of touch panel 10.
In some embodiments, rosette 21 is in oblong, and the outer wall 215 of rosette 21 includes two parallel straight lines
Section 2151 and two bending sections 2152 for connecting two straightways 2151, first 2311 is disposed therein a straightway 2151
On, second 2312 is arranged on two bending sections 2152.
In this way, rosette 21 is more beautiful.Specifically, transversely arranged (such as Fig. 1 of two bending sections 2152 along touch panel 10
In left and right to), two straightways 2151 along touch panel 10 longitudinal direction (with laterally it is vertical) arrange.
In some embodiments, second 2312 shape is matched with the shape of bending section 2152.
For example, second 2312 outer profile is also arc-shaped, and substantially it is arranged concentrically with bending section 2152.In this way may be used
So that the structure of case ring 20 is compacter.
Also referring to Fig. 8-Figure 10, in some embodiments, fingerprint chip-packaging structure 30 include packaging body 31 and
Fingerprint recognition chip 32.
Packaging body 31 includes the second bottom surface 311 and connects the side 312 of the second bottom surface 311, the second bottom surface 311 and side
312 junction is formed with recessed portion 33.Fingerprint recognition chip 32 is arranged in packaging body 31.
In the fingerprint chip-packaging structure 30 of embodiment of the present invention, recessed portion 33 can be with the support edge in case ring 20
22 cooperations, so as to location fingerprint chip-packaging structure 30, and then improve the efficiency of assembling of fingerprint chip-packaging structure 30.
In addition, recessed portion 33 coordinates the thickness that can also reduce fingerprint chip-packaging structure 30 with support edge 22, be conducive to
The terminal 1000 of employing fingerprint chip-packaging structure 30 minimizes.
Specifically, when user carries out the operation of unlocked by fingerprint terminal 1000, finger can be placed on and fingerprint recognition chip
32 corresponding positions.The signal of fingerprint recognition chip 32 acquires the fingerprint pattern of identification user through packaging body 31, by user
Fingerprint pattern matched with the fingerprint pattern to prestore, if successful match, unlock terminal 1000.
It is appreciated that the surface of fingerprint recognition chip 32 towards the finger of user is provided with sensor pixel array, with acquisition
The fingerprint pattern of user.Packaging body 31, which encapsulates fingerprint recognition chip 32, can reduce sensor pixel array when acquiring fingerprint pattern
It is influenced by other interference signals, to improve the accuracy rate of identification.
It should be noted that recessed portion 33 is used to coordinate so that fingerprint chip-packaging structure 30 passes through recess with support edge 22
Portion 33 is supported on support edge 22.
Recessed portion 33 coordinates with support edge 33, and in other words, support edge 22 is housed in recessed portion 33.
In the present embodiment, the structure in a ring of recessed portion 33, correspondingly, support edge 22 also in a ring structure so that recess
Portion 33 can accommodate support edge 22.
In other embodiments, recessed portion 33 can be circumferentially-spaced for the junction around the second bottom surface 311 and side 312
The multiple recessed portions 33 being arranged, correspondingly, support edge 22 are also around circumferentially spaced multiple support edges 22, multiple recessed portions
33 with 22 corresponding matching of multiple support edges.
Such as the quantity of recessed portion 33 is 3, two neighboring recessed portion 33 is arranged around circumferentially-spaced 120 degree, support edge 22
Quantity be also 3, and it is corresponding with 3 recessed portions in locations of structures.
It should be pointed out that the shape of recessed portion 33 and quantity are not limited to situation described above, if recessed portion 33 with
Support edge 22 coordinates so that support edge 22 can support fingerprint chip-packaging structure 30, and therefore, example described above is not
It is interpreted as limitation of the present invention.
Certainly, in other embodiments, when the thinner thickness of fingerprint chip-packaging structure 30, fingerprint chip package knot
Structure 30 can also omit recessed portion 33.
In some embodiments, packaging body 31 includes the first encapsulation part 313 and connects the second envelope of the first encapsulation part 313
Dress portion 314, the first encapsulation part 313 include the second bottom surface 311, and the second encapsulation part 314 includes side 312.
In this way, the first encapsulation part 313 is connect with the second encapsulation part 314 can form recessed portion 33.Packaging body 31 can pass through
The material on packaging body 31 is machined away to form recessed portion 33, can also be connected by the first encapsulation part 313 and the second encapsulation part 314
It connects to be formed.
It is appreciated that in order to form recessed portion 33, the cross-sectional area of the first encapsulation part 313 is less than the second encapsulation part 314
Cross-sectional area.
In some embodiments, the first encapsulation part 313 wears avoid holes 222, and the second encapsulation part 314 is supported on support edge
On 22.
In some embodiments, fingerprint recognition chip 32 is arranged in the first encapsulation part 313.
In this way, the circuit junction of fingerprint recognition chip 32 is easy to expose to connect with fingerprint flexible PCB 40.
In some embodiments, the form and dimension of the first encapsulation part 313 and the shape of fingerprint recognition chip 32 and big
Small cooperation.
In other words, the shape of fingerprint recognition chip 32 and the shape of the first encapsulation part 313 are similar or identical, for example, fingerprint
Identification chip 32 is in cuboid, and the shape of the first encapsulation part 313 is in cuboid or rounded cuboid shape.
The size of first encapsulation part 313 is slightly larger than the size of fingerprint recognition chip 32 to realize encapsulation fingerprint recognition chip 32
Effect.Therefore, the structure of fingerprint chip-packaging structure 30 can be made compacter in this way.
In some embodiments, the rounded cuboid of shape of the first encapsulation part 313.
In this way, the first encapsulation part 313 can preferably coordinate with fingerprint recognition chip 32.Further, the first encapsulation part
The shape of 313 shape and avoid holes 222 coordinates, that is to say, that the shape of avoid holes 222 also rounded cuboid.
In some embodiments, the second encapsulation part 314 includes the top surface 3141 being connect with side 312, fingerprint chip envelope
Assembling structure 30 includes the cover plate 34 being fixed on the top surface 3141 of the second encapsulation part 314.For example, cover plate 34 is solid by colloid
It is scheduled on the top surface 3141 of the second encapsulation part 314.
When carrying out fingerprint recognition operation, finger can press in cover plate 34 user.Cover plate 34 can protect envelope
It is without damage to fill body 31, to improve the reliability of fingerprint chip-packaging structure 30.
Cover plate 34 is touched due to being often subject to, the higher material of hardness can be used to be made for cover plate 34, such as with
On the sapphire material that refers to.
In some embodiments, the shape of the form and dimension of cover plate 34 and the top surface 3141 of the second encapsulation part 314
And size cooperation.
For example, the shape of top surface 3141 is in oblong, the shape of cover plate 34 is also in oblong.The area of cover plate 34 omits
More than the area of the top surface 3141 of the second encapsulation part 314.Therefore, the second encapsulation part 314 can be completely covered in cover plate 34.
In some embodiments, sealing element 60 is provided between the second encapsulation part 314 and support edge 22, sealing element 60 is close
Seal the gap between the second encapsulation part 314 and support edge 22.Sealing element 60 is for example made (as shown in Figure 2) of silica gel.
In this way, sealing element 60 can prevent the foreign matters such as water and dust between fingerprint chip-packaging structure 30 and case ring 20
Gap enter in terminal 1000, improve the water proof and dust proof effect of terminal 1000.
In some embodiments, recessed portion 33 includes the first face 331 and connects second face 332 in the first face 331, and first
Face 331 is perpendicular to the second face 332.
In this way, recessed portion 33 is easy to be formed, the first face 331 is easy to connect with support edge 22.First face 331 and the second face
332 vertically so that packaging body 31 is in step-like.
Specifically, sealing element 60 is arranged between the first face 331 and support edge 22.
In some embodiments, the rounded transition shape in the junction in the first face 331 and the second face 332.
In this way, the defects of crackle is less likely to occur for the junction in the first face 331 and the second face 332, and recessed portion 33 holds
Easily formed.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation
What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the present invention.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that：
Can these embodiments be carried out with a variety of variations in the case of not departing from the principle of the present invention and objective, modification, replace and become
Type, the scope of the present invention are limited by claim and its equivalent.
Claims (13)
1. a kind of input module, which is characterized in that including：
Case ring, the case ring include rosette and from the support edge that the inner wall of the rosette extends internally；And
Fingerprint chip-packaging structure, the fingerprint chip-packaging structure are housed in the rosette and are supported on the support edge
On；
The case ring includes the outwardly extending flange of outer wall from the rosette, and the fingerprint chip-packaging structure includes：
Packaging body, the packaging body include the side of bottom surface and the connection bottom surface, the junction of the bottom surface and the side
It is formed with recessed portion, the support edge is housed in the recessed portion；And
The fingerprint recognition chip being arranged in the packaging body.
2. input module as described in claim 1, which is characterized in that the rosette includes the top being connect with the inner wall
Wall, the roof include towards the guide ramp in the case ring.
3. input module as described in claim 1, which is characterized in that the support edge is formed with avoid holes.
4. input module as claimed in claim 3, which is characterized in that the rounded rectangle of avoid holes, the avoid holes
Side wall is formed with escape groove along the axial direction of the avoid holes, and the escape groove is connected to the avoid holes.
5. input module as described in claim 1, which is characterized in that the flange includes the first protrusion and connection described first
Second protrusion of protrusion, first protrusion include first and second, described first and described of second connection
Second protrusion, described second is convexly equipped in described first and second protrusion, described first and second protrusion edge
Touch panel is longitudinally extended, and described second is laterally extended along the touch panel.
6. input module as claimed in claim 5, which is characterized in that the top surface of first protrusion and second protrusion
Either flush, first thickness are more than the thickness of second protrusion.
7. input module as claimed in claim 5, which is characterized in that the rosette is in oblong, the rosette it is outer
Wall includes two bending sections of parallel two straightways and the described two straightways of connection, first setting it is described its
In on a straightway, described second is arranged on described two bending sections.
8. input module as described in claim 1, which is characterized in that the packaging body includes described in the first encapsulation part and connection
Second encapsulation part of the first encapsulation part, first encapsulation part include the bottom surface, and second encapsulation part includes the side；
The support edge is formed with avoid holes, and first encapsulation part wears the avoid holes, and second encapsulation part is supported on
On the support edge.
9. input module as claimed in claim 8, which is characterized in that the recessed portion includes the first face and connection described first
Second face in face, perpendicular to second face, second encapsulation part includes first face, first envelope in first face
Dress portion includes second face.
10. input module as claimed in claim 8, which is characterized in that the input module includes sealing element, the sealing element
It is arranged between second encapsulation part and the support edge, the sealing element seals the support edge and second encapsulation part
Between gap.
11. input module as described in claim 1, which is characterized in that the packaging body includes the top being connect with the side
Face, the fingerprint chip-packaging structure include fixed cover plate on the top surface.
12. input module as described in claim 1, which is characterized in that the input module includes touch panel, the touch
Panel offers mounting hole, and the case ring is set in the mounting hole, and is fixedly connected with the touch panel.
13. a kind of terminal, which is characterized in that including such as claim 1-12 any one of them input module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810162035.3A CN108376040B (en) | 2016-08-16 | 2016-08-16 | Input assembly and terminal |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610675796.XA CN106095195B (en) | 2016-08-16 | 2016-08-16 | Input module and terminal |
| CN201810162035.3A CN108376040B (en) | 2016-08-16 | 2016-08-16 | Input assembly and terminal |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610675796.XA Division CN106095195B (en) | 2016-08-16 | 2016-08-16 | Input module and terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108376040A true CN108376040A (en) | 2018-08-07 |
| CN108376040B CN108376040B (en) | 2021-05-14 |
Family
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610675796.XA Active CN106095195B (en) | 2016-08-16 | 2016-08-16 | Input module and terminal |
| CN201810162035.3A Active CN108376040B (en) | 2016-08-16 | 2016-08-16 | Input assembly and terminal |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610675796.XA Active CN106095195B (en) | 2016-08-16 | 2016-08-16 | Input module and terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN106095195B (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2705159T3 (en) | 2016-08-16 | 2019-03-22 | Guangdong Oppo Mobile Telecommunications Corp Ltd | Input and terminal assembly |
| US10565426B2 (en) * | 2016-08-16 | 2020-02-18 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint chip package structure, input assembly and terminal |
| EP3554055B1 (en) | 2016-12-26 | 2020-12-02 | Huawei Technologies Co., Ltd. | Housing assembly of a mobile terminal and method for assembling the housing assembly |
| CN108701212B (en) * | 2017-02-07 | 2021-08-31 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device |
| WO2018157687A1 (en) * | 2017-03-01 | 2018-09-07 | 广东欧珀移动通信有限公司 | Input component and electronic device |
| CN107016340A (en) * | 2017-03-01 | 2017-08-04 | 广东欧珀移动通信有限公司 | Input module and electronic installation |
| CN108664081B (en) * | 2017-03-31 | 2024-04-09 | 荣耀终端有限公司 | Fingerprint identification device and terminal equipment |
| CN107295128A (en) * | 2017-07-17 | 2017-10-24 | 广东欧珀移动通信有限公司 | Fingerprint recognition case ring fixation kit, assembly method and mobile terminal |
| US11379000B2 (en) | 2017-10-13 | 2022-07-05 | Huawei Technologies Co., Ltd. | Structure of electronic device and electronic device |
| WO2019075713A1 (en) * | 2017-10-20 | 2019-04-25 | 华为技术有限公司 | Fingerprint package chip and packaging method, fingerprint module and mobile terminal |
| CN110197539B (en) * | 2018-02-27 | 2022-07-12 | 江西欧迈斯微电子有限公司 | Fingerprint identification module and fingerprint identification lock |
| CN112466217A (en) * | 2020-12-16 | 2021-03-09 | 武汉华星光电半导体显示技术有限公司 | Flexible display device |
| US11665839B2 (en) | 2020-12-16 | 2023-05-30 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Flexible display device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN106095195A (en) | 2016-11-09 |
| CN108376040B (en) | 2021-05-14 |
| CN106095195B (en) | 2018-03-30 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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