CN108374146A - organic deposition device and method - Google Patents
organic deposition device and method Download PDFInfo
- Publication number
- CN108374146A CN108374146A CN201810054447.5A CN201810054447A CN108374146A CN 108374146 A CN108374146 A CN 108374146A CN 201810054447 A CN201810054447 A CN 201810054447A CN 108374146 A CN108374146 A CN 108374146A
- Authority
- CN
- China
- Prior art keywords
- mask
- laser
- cleaning part
- organic
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Abstract
The embodiment of the present invention is related to a kind of organic deposition device and method.The present invention organic deposition device include：Substrate support is used to support substrate；Mask support portion, by with the substrate it is facing in a manner of support mask；Evaporation source, by with the mask it is facing in a manner of arrange, and heat organic matter and make the organic matter evaporate；And mask cleaning part, it is arranged in the side of the evaporation source, and laser is irradiated to the mask.
Description
Technical field
The embodiment of the present invention is related to a kind of precipitation equipment and method, in particular to a kind of outfit mask cleaning part
Organic deposition devices and methods therefor.
Background technology
Organic electroluminescent device includes anode, cathode and organic layer.Injected holes and pass through by by anode
Cathode and injected electrons sends out light by energy difference during organic layer recombines.
Organic layer may include hole injection layer, hole transmission layer, luminescent layer, electron transfer layer and electron injecting layer, this
A little organic layers can usually be formed by vacuum deposition method.
The precipitation equipment for being used to form organic layer is configured to, and heats organic material and makes its evaporation, and makes evaporation
Material is deposited on substrate.The organic matter of evaporation can be selectively deposited to by mask on substrate.
Mask is typically configured to thin slice (sheet) form, and with the multiple slits for being imperceptibly arranged in pattern
(slit).Organic matter can be selectively deposited to by each slit on substrate.
In deposition process, organic matter can not only be deposited on substrate, can also be deposited on surface or the slit of mask.
Recently, as the resolution ratio of display device increases, the spacing between the size and slit of slit reduces, to because heavy
Product cause the reduction of slit size or the blocking of slit in the organic matter of mask surface, cause in defective products it is increased become
Gesture.
It is above-mentioned bad to prevent, it needs often to clean or replaces mask, however this can be such that process period shortens, and cause to produce
Ability reduces.
Invention content
Being designed to provide for the embodiment of the present invention a kind of can also clean mask during a process period
Organic deposition device and method.
The another object of the embodiment of the present invention is to provide a kind of making that can reduce the spare mask for replacement
The organic deposition device and method of cost.
The further object of the embodiment of the present invention, which is to provide, a kind of can increase having for unit process period and output
Machine object precipitation equipment and method.
Organic deposition device according to an aspect of the present invention for achieving the above object may include：It is used to support
Substrate；Mask support portion, by with the substrate it is facing in a manner of support mask；Evaporation source, with facing with the mask
Mode arrange, and heat organic matter and make the organic matter evaporate；And mask cleaning part, it is arranged in the one of the evaporation source
Side, and irradiate laser to the mask.
The mask cleaning part may include：Light source portion for generating the laser；For transmitting from the light source portion
The optical section of the laser of generation；And for the laser irradiation that the optical section transmits to the scanner section of the mask will to be passed through.
Organic deposition device can also include：Chamber provides the inner space for building deposition atmosphere, and described
Inner space is disposed with the substrate support, the mask support portion, the evaporation source and the mask cleaning part, and
The mask cleaning part may include：Optical section receives the transmission of the laser from the light source portion of the exterior thereto；Scanning
The laser transmitted by the optical section is irradiated in portion to the mask.
Organic deposition device according to another aspect of the present invention for achieving the above object may include：Substrate branch
Support part is used to support substrate；Mask support portion, by with substrate it is facing in a manner of support mask；Evaporation source, with the mask
Facing mode is arranged, and heats organic matter and the organic matter is made to evaporate；Chamber provides the inside for building deposition atmosphere
Space, and it is disposed with the substrate support, the mask support portion and the evaporation source in the inner space；And it covers
Membrane cleaning portion is arranged in the outside of the chamber, and irradiates laser to the mask.
The mask cleaning part may include：Light source portion for generating the laser；For transmitting from the light source portion
The optical section of the laser of generation；And for the laser irradiation that the optical section transmits to the scanner section of the mask will to be passed through.
The laser is any one in infrared ray (IR) laser and ultraviolet light (UV) laser.
Organic deposition device can also include：Optical window is arranged in the chamber corresponding in the mask cleaning part
The inside of room, and it is formed so that the laser transmission；And photochopper (chopper), it is arranged in the upper of the optical window
Portion, and equipped with opening portion, so that the laser passes through.
The optical window can be equipped with multiple regional transmissions, and can with so that each regional transmission sequentially with the screening
The corresponding mode in opening portion of light device is rotated；Or the optical window can be equipped with multiple regional transmissions, and can
It moves along a straight line by a manner of keeping each regional transmission in turn corresponding with the opening portion of the photochopper.
The chamber corresponding with the mask cleaning part can be equipped with laser transmission window.
In addition, organic deposition method according to another aspect of the invention for achieving the above object may include as
Lower step：Substrate and mask are respectively installed to substrate support and mask support portion；Make the organic matter in heating evaporation source and
The organic matter of gasification is deposited to by the mask on the substrate；By with the mask it is facing in a manner of arrange that mask is clear
Wash portion；Laser is set sequentially to be irradiated to the whole surface of the mask from the mask cleaning part.
The step of alloing the organic deposition, carries out under vacuum conditions.
In the step of making the organic deposition and the step of make the laser irradiation, can make the evaporation source with
And the mask cleaning part moves at a predetermined rate.
The laser can be any one in infrared laser and ultraviolet laser, and the mask surface has
Machine object can be detached from by the laser.
Organic deposition method can also include following step：It is disposed with described in confession on the top of the mask cleaning part
Swash light transmissive optical window, and photochopper is arranged on the optical window top, the photochopper is equipped with opening portion, for institute
Laser is stated to pass through.
Organic deposition method can also include the steps that so that the optical window is rotated or is moved along a straight line, and
The rotation of the optical window or the period of linear motion can be controlled according to the processing quantity of the substrate.
Organic deposition method can also include following step：Before irradiating the laser to the mask, from institute
It states substrate support and removes the substrate.
Organic deposition method can also include following step：Before the organic matter for heating the evaporation source, it will hide
Plate is arranged in the top of the mask cleaning part；And from the mask cleaning part irradiate laser before, make the shield to
It moves on the top of the evaporation source.
For organic deposition device according to an embodiment of the invention, since mask cleaning part is provided in chamber
Portion, so can also clean mask at any time in a process period.Due to compared to the mask replacement cycle can be reduced in the past,
So operation ratio can be improved and improve production capacity, and the quantity of the spare mask for replacement can be reduced, therefore can be with
Reduce production cost.
In addition, mask cleaning part according to an embodiment of the invention be configured to irradiation laser (laser) and remove have
Machine object, therefore the time needed for cleaning and cost can be reduced compared to the wet-cleaned for using chemical solvent, and can be to prevent
The only environmental pollution caused by the use of chemical solvent.
Description of the drawings
Fig. 1 and Fig. 2 is the sectional view for illustrating organic deposition device according to an embodiment of the invention.
Fig. 3 is the plan view of an embodiment of the mask for illustrating to be illustrated in Fig. 1.
Fig. 4 a and Fig. 4 b are the stereograms of the embodiment of the optical window and photochopper for illustrating to be illustrated in Fig. 1.
Fig. 5 a are the sectional views of the organic deposition device for illustrating first embodiment according to the present invention.
Fig. 5 b are the structures of the mask cleaning part of the organic deposition device for illustrating first embodiment according to the present invention
Cheng Tu.
Fig. 6 a are the sectional views for illustrating organic deposition device according to the second embodiment of the present invention.
Fig. 6 b are the structures of the mask cleaning part for illustrating organic deposition device according to the second embodiment of the present invention
Cheng Tu.
Fig. 7 and Fig. 8 is the sectional view for illustrating organic deposition device according to the third embodiment of the invention.
Symbol description
10：Substrate support 12：Substrate
20：Mask support portion 22：Mask
24：Gap 30：Evaporation source
32：Crucible 34：Heating part
36：Nozzle 40,40a：Organic matter
50：Mask cleaning part 50a：Laser
52、52a：Light source portion 54：Optical section
56：Scanner section 62：Optical window
62a：Regional transmission 64：Photochopper
64a：Opening portion 70：Shield
80、80a：Transferred unit 100,100a：Chamber
120：Outlet 140,140b：Laser transmissive window
200：Vacuum pump
Specific implementation mode
Hereinafter, the preferred embodiment of the present invention is described in detail with reference to attached drawing.Embodiment below is to make
The people with basic knowledge can fully understand the present invention and the embodiment of offer in this field, can be become with variform
Shape, and the scope of the invention is not limited to embodiment described below.
Fig. 1 and Fig. 2 is the sectional view for illustrating organic deposition device according to an embodiment of the invention.
Referring to FIG. 1 and FIG. 2, organic deposition device may include：It is used to support the substrate support 10 of substrate 12；Mask
Support portion 20 supports mask 22 in a manner of keeping mask 22 and substrate 12 facing；Evaporation source 30, with facing with mask 22
Mode is arranged, and heats organic matter and the organic matter is made to evaporate；Mask cleaning part 50, is arranged in the side of evaporation source 30, and to
Mask 22 irradiates laser.
Substrate support 10 can by so that substrate 12 depositional plane towards lower part in a manner of be arranged in the top of evaporation source 30.
Alternatively, can by so that substrate 12 depositional plane towards side in a manner of arrange substrate support 10, and with the substrate 12
Evaporation source 30 is arranged in the side of the facing substrate support 10 of depositional plane.
Substrate 12 can attach and be fixed on substrate support 10 by vacuum unit (not shown), or can be by
The fixed cell (not shown) that is equipped with along the marginal position of substrate support 10 and be supported and fix.
Mask support portion 20 is constituted in a manner of supporting and fixing the marginal position of mask 22, and can be to be tightly attached to substrate
12 depositional plane or the mode for being separated by preset space length from above-mentioned depositional plane support mask 22.
Fig. 3 is the plan view of the embodiment for illustrating mask 22.
With reference to Fig. 3, mask 22 is configured to lamellar form, and equipped with the multiple slits for being arranged in fine pattern
24.Organic matter is deposited on the substrate 12 by each slit 24, and accordingly, organic article pattern corresponding with the slit 24 can be with
It is formed on substrate 12.
At least one of substrate support 10 and mask support portion 20 are configured to (not show by alignment unit
Go out) and move, to which substrate 12 and mask 22 can be in alignment with each other.
Evaporation source 30 is deposition materials, for example, may include：Crucible 32, for accommodating organic matter 40；Heating part 34 is used
It is heated in crucible 32；And at least one nozzle 36, it is provided to the top of crucible 32.
Crucible 32 is heated by heating part 34, and accordingly, organic matter 40 can be by gasification and by nozzle 36 to outside
Injection.
Crucible 32 is can to accommodate the container of organic matter 40 in inner space, can be set in the outer wall of crucible 32 or outside
It is equipped with heating part 34.Heating part 34 can be for example made of hot line (hot wire).
Nozzle 36 can be arranged in the opening on 32 top of crucible.For example, (can not show in the cap for being incorporated into the opening
Go out) nozzle 36 is formed with preset space length.
A crucible 32 is illustrated only in the accompanying drawings, but the space inside crucible 32 for example can be by partition wall (not
Show) etc. and be divided into multiple spaces, or be configured to multiple crucibles 32 be connected and the structure that is formed.
Mask cleaning part 50 is configured to irradiate laser to mask 22 and remove the organic matter for being attached to 22 surface of mask.In order to
The organic matter is removed, it is preferable to use the laser with 500nm short wavelengths below.The laser can be that infrared ray (IR) swashs
Some in light and ultraviolet light (UV) laser.
Transparent optical window 62 is disposed on the top of mask cleaning part 50, so that the laser transmits, and in optics
The top of window 62 can be disposed with the photochopper (chopper) 64 for having opening portion 64a, so that the laser passes through.
Fig. 4 a and Fig. 4 b are the stereograms of the embodiment for illustrating optical window 62 and photochopper 64.
With reference to Fig. 4 a, optical window 62 can be rotated equipped with multiple regional transmission 62a, so that each
Regional transmission 62a is sequentially corresponding with the opening portion 64a of photochopper 64.
With reference to Fig. 4 b, optical window 62 has multiple regional transmission 62a, and can move along a straight line, so that each
It is in turn corresponding with the opening portion 64a of photochopper 64 to penetrate region 62a.
The organic matter evaporated in deposition process may be attached to optical window 62 by the opening portion 64a of photochopper 64
On, or can be attached to from the organic matter landing of the removal of mask 22 by the opening portion 64a of photochopper 64 in cleaning process
On optical window 62.Due to needing to manage, there are foreign matters to avoid on the path of irradiation laser, so when a regional transmission
When 62a is contaminated, optical window 62 should be made to rotate or move linearly, so that unpolluted another regional transmission 62a
It is corresponding with the opening portion 64a of photochopper 64, process efficiency can be improved accordingly.
The pollution level of the optical window 62 of the processing quantity based on substrate 12 can be grasped in advance and controls optical window
62 rotation or linear motion period.
The top of evaporation source 30 and mask cleaning part 50 can be provided with optionally block evaporation source 30 and
The shield 70 of mask cleaning part 50.
Fig. 1 shows the state that organic matter 40a is evaporated from evaporation source 30, at this point, shield 70 is arranged in mask cleaning part 50
Top and prevent organic matter 40a to be attached to mask cleaning part 50.Shield 70 is preferably disposed at the top of photochopper 64.
Fig. 2 shows the state of laser 50a is irradiated from mask cleaning part 50 in order to clean mask 22.At this point, 70 cloth of shield
It is placed in the top of evaporation source 30, to prevent the organic matter removed from mask 22 to be attached to evaporation source 30, and prevents organic matter 40a
It is evaporated from evaporation source 30 to 12 direction of substrate.
Evaporation source 30 and mask cleaning part 50 are configured to move back and forth by transferred unit 80.
Fig. 1 show organic matter 40a from evaporation source 30 evaporate and deposit to the state on substrate 12, at this point, evaporation source 30 with
And mask cleaning part 50 can be moved along a direction (for example, from left side to right side) at a predetermined velocity by transferred unit 80
It is dynamic.
Fig. 2 shows after the completion of organic deposition process evaporation source 30 and mask cleaning part 50 by transferred unit 80 and
Back to the state in home position.At this point, the substrate 12 for completing deposition is removed from substrate support 10, and in evaporation source 30 and
Mask cleaning part 50 is by transferred unit 80 and at a predetermined velocity along the process of other direction (for example, from right side to left side) movement
In from cleaning part 50 irradiate laser 50a, can be cleaned to mask 22.
Fig. 5 a are the sectional views of the organic deposition device for illustrating first embodiment according to the present invention, and Fig. 5 b
It is the detailed composition figure of mask cleaning part 50.
With reference to Fig. 5 a, organic deposition device can be arranged in the inside of chamber 100.
Chamber 100 provides the inner space for building deposition atmosphere, and can be disposed with substrate in the inner space
Support portion 10, mask support portion 20, evaporation source 30 and mask cleaning part 50.
The inner space of chamber 100 can maintain vacuum, for this purpose, can be equipped with discharge in the side of chamber 100
Mouth 120, and can be connected with vacuum pump 200 in outlet 120.
With reference to Fig. 5 b, in organic deposition device according to first embodiment, mask cleaning part 50 may include：For
Generate the light source portion 52 of the laser；Optical section 54 for transmitting the laser generated from light source portion 52；And for that will pass through
Scanner section 56 of the laser irradiation that optical section 54 transmits to mask 22.
Light source portion 52 is configured to generate a certain kind in infrared ray (IR) laser and ultraviolet light (UV) laser and swashs
Light.
Optical section 54 is used to maintain the output of the laser and alternative routing, may include optical lens, mirror lens etc..
Scanner section 56 is configured to the laser that transmitted by optical section 54 are sequentially irradiated to mask 22
All surfaces.
Hereinafter, depositing the mistake of organic matter on the substrate 12 by using the organic deposition device constituted as described above
The embodiment of the present invention is described in more detail in journey.
With reference to Fig. 5 a, substrate 12 and mask 22 are provided respectively to inside chamber 100, to attach it to substrate branch
Support part 10 and mask support portion 20.Substrate 12 and mask 22 can be in alignment with each other by alignment unit.
At this point, organic matter 40 is filled into the crucible 32 of evaporation source 30, and can be arranged on the top of mask cleaning part 50
There are optical window 62 and photochopper 64.
The inside of chamber 100 is formed as by being worked by making vacuum pump 200, for example, 10-4Pascal (Pa) degree
High vacuum state.
If applying power supply to the heating part 34 of evaporation source 30 and heating organic matter 40, the organic matter 40a to gasify passes through spray
Mouth 36 and evaporated to 22 direction of mask, and be selectively deposited on substrate 12 by the slit of mask 22 24, to be formed
Organic layer.
Before the organic matter 40 for heating the evaporation source 30, shield 70 is arranged in the top of mask cleaning part 50, from
And it can make organic matter 40a that can not attach to photochopper 64 or mask cleaning part 50.
As shown in Figure 1, evaporation source 30 and mask cleaning part 50 can be by moving portion 80 and at a predetermined velocity along one
Direction (for example, from left side to right side) is mobile, so as to form organic layer in the whole of substrate 12 with predetermined thickness.Deposition
The thickness of organic layer can be controlled by adjusting the speed.
The organic layer can be the red (R) for constituting organic illuminating element, green (G), blue (B) or white (W)
The luminescent layer of pixel.In the described embodiment, the organic layer of organic electroluminescent device is illustrated as an example, so
And be not limited thereto, the embodiment of the present invention can be used as long as the case where being the need for the deposition of machine layer.
If completing the deposition process, shield 70 is set to be moved to the top of evaporation source 30, to make organic matter 40a not
It is re-directed towards the direction evaporation of substrate 12.
In a period of the deposition process is repeated for multiple substrates 12, it is also possible to sink on the surface of mask 22
Product organic matter 40a.Accordingly, it is possible to may require that cleaning mask 22.
With reference to Fig. 2, light source portion 52 works in the state that mask cleaning part 50 is located at the position facing with mask 22, from
And laser can be generated.The laser 50a generated is passed to scanner section 56 by optical section 54 and after the generation change of path,
And scanner section 56 can sequentially irradiate the laser 50a to the whole surface of mask 22.
The interatomic combination for being deposited on the organic matter 40 on 22 surface of mask is destroyed by the laser 50a, leads to connecting forces
It is weakened, so as to be detached from from mask 22.
As shown in Fig. 2, evaporation source 30 and mask cleaning part 50 are by transferred unit 80 and along a direction (for example, from a left side
Lateral right side) it moves at a predetermined velocity, it can be cleaned to the overall surface of mask 22.
The thickness for being deposited on the organic matter 40 on 22 surface of mask is proportional to frequency of depositing.It can be according to being deposited on mask 22
Thickness and the position of the organic matter 40 on surface and the movement speed for controlling mask cleaning part 50.In addition, direct in the laser 50a
It may deform in the case of being irradiated to mask 22, it is therefore preferred to adjust output, focal length and the irradiation of the laser 50a
Angle.
For organic deposition device according to first embodiment, since mask cleaning part 50 and evaporation source 30 are matched together
It is standby in the inside of chamber 100, so mask 22 can also be cleaned as needed and at any time during the unit process period.
Fig. 6 a are the sectional views for illustrating organic deposition device according to the second embodiment of the present invention, and Fig. 6 b are to cover
The detailed composition in Membrane cleaning portion 50 is schemed.
With reference to Fig. 6 a, organic deposition device can be arranged in inside chamber 100.
Chamber 100 provides the inner space that can build deposition atmosphere, and can be disposed with substrate in the inner space
Support portion 10, mask support portion 20, evaporation source 30 and mask cleaning part 50.
The inner space of chamber 100 can keep vacuum, for this purpose, the side of chamber 100 can be equipped with outlet
120, and can be connected with vacuum pump 200 in outlet 120.
With reference to Fig. 6 b, in organic deposition device according to second embodiment, mask cleaning part 50 may include：Optics
Portion 54 receives the transmission of laser from the light source portion 52a outside chamber 100；Scanner section 56 passes through optical section 54 to the irradiation of mask 22
The laser of transmission.
Light source portion 52a is configured to generate a certain kind in infrared ray (IR) laser and ultraviolet light (UV) laser and swashs
Light, and it is arranged in the outside of chamber 100.
It can be equipped with laser transmissive window 140, so that laser can be from the light source portion 52a outside chamber 100 in chamber 100
The optical section 54 being transferred to inside chamber 100.The laser transmissive window 140 should be configured to, and be able to maintain that inside chamber 100
Vacuum state, and laser is enable to be transferred to the inside of chamber 100 in a manner of with direct projection.
Light source portion 52a can adjust unit equipped with position regulating unit or output, to exist when mask cleaning part 50
During the inside movement of chamber 100, also the laser of scheduled output can be accurately transferred to optical section 54.
Optical section 54 is used to maintain output and the alternative routing of the laser, may include optical lens, mirror lens etc..
Scanner section 56, which is configured to sequentially irradiate to the whole surface of mask 22, passes through what optical section 54 transmitted
The laser.
In the organic deposition device according to the second embodiment, process and lead to that organic matter deposits on the substrate 12
It crosses that the content that first embodiment illustrates is similar, therefore omits to this explanation.
Organic deposition device according to second embodiment, since the light source portion 52a for generating laser is arranged in chamber
Outside 100, therefore have the advantages that convenient for safeguarding and repairing the light source portion 52a with more complicated structure.
Fig. 7 and Fig. 8 is the sectional view for illustrating organic deposition device according to the third embodiment of the invention.
With reference to Fig. 7 and Fig. 8, organic deposition device may include：It is used to support the substrate support 10 of substrate 12；Mask
Support portion 20 supports mask 22 in a manner of keeping mask 22 and substrate 12 facing；Evaporation source 30, with facing with mask 22
Mode is arranged, and heats organic matter and the organic matter is made to evaporate；Chamber 100a, the inside provided for building deposition atmosphere are empty
Between, and it is disposed with substrate support 10, mask support portion 20 and evaporation source 30 in the inner space；And mask cleaning part
50, it is arranged in the outside of chamber 100a, and laser is irradiated to mask 22.
Substrate support 10, mask support portion 20 and evaporation source 30 specific composition above-mentioned first embodiment with
And be illustrated in second embodiment, therefore the explanation to this is omitted herein.However, the organic deposition of 3rd embodiment
In device, substrate support 10 and mask support portion 20 are configured to move back and forth by transferred unit 80a,
And evaporation source 30 can be to be fixed on the one side of chamber 100a with mask support portion 20 in a manner of facing.
Fig. 7 shows that organic matter 40a evaporates from evaporation source 30 and deposits to the state on substrate 12, at this point, substrate support
10 and mask support portion 20 can be by transferred unit 80a and at a predetermined velocity along a direction (for example, from left side to right side)
It is mobile.
Fig. 8 is shown, after completing organic deposition process as illustrated in fig. 7, substrate support 10 and mask support portion
20 mobile by transferred unit 80a and states positioned at the position facing with mask cleaning part 50.At this point, if completing deposition
Substrate 12 is removed from substrate support 10, then irradiates laser 50a from mask cleaning part 50, to which mask 22 can be cleaned.
It is disposed with transparent optical window 62 in the inside of chamber 100a corresponding with mask cleaning part 50, so that laser is saturating
Penetrate, and photochopper 64 can be disposed on the top of optical window 62, the photochopper 64 in order to make the laser by by formed
There is opening portion 64a.In addition, can be set in the inside on the top of evaporation source 30 and chamber 100a corresponding with mask cleaning part 50
The shield 70 of evaporation source 30 and mask cleaning part 50 can selectively be blocked by being equipped with.Shield 70 is preferably disposed at photochopper
64 top.
In order to enable shield 70 freely to move back and forth on the top of evaporation source 30 and photochopper 64, chamber 100a
A part, for example, the part for being disposed with mask cleaning part 50 is configured to ladder.The stepped portion can be with cloth
Be equipped with mask cleaning part 50, and chamber 100a corresponding with mask cleaning part 50 can equipped with laser transmissive window 140b, for
Laser transfer is to chamber 100a.
Explanation was carried out by Fig. 4 a and Fig. 4 b for the specific composition of optical window 62 and photochopper 64, therefore
It omits to this explanation.
In the organic deposition device according to the 3rd embodiment, process on organic deposition to substrate 12 with it is logical
It crosses that the content that first embodiment illustrates is similar, therefore omits to this explanation.
Organic deposition device according to third embodiment has the following advantages：Since mask cleaning part 50 is arranged in chamber
The outside of room 100a, so the maintenance and repairing of mask cleaning part 50 are more convenient.
As described above, disclosing most highly preferred embodiment of the invention by detailed description and attached drawing.Used term
Simply to illustrate that the present invention and uses, be not the restriction for meaning or be recorded in the scope of the present invention of claims
Restriction purpose and use.Therefore, as long as there is the people of basic knowledge, being then appreciated that can be from above-mentioned reality in this field
It applies example and realizes various deformation and equivalent other embodiment.Therefore, real technical protection scope of the invention should basis
The technological thought of claims determines.
Claims (20)
1. a kind of organic deposition device, including：
Substrate support is used to support substrate；
Mask support portion, by with the substrate it is facing in a manner of support mask；
Evaporation source, by with the mask it is facing in a manner of arrange, and heat organic matter and make the organic matter evaporate；And
Mask cleaning part is arranged in the side of the evaporation source, and irradiates laser to the mask.
2. organic deposition device as described in claim 1, wherein
The mask cleaning part includes：
Light source portion for generating the laser；
Optical section for transmitting the laser generated from the light source portion；And
For the laser irradiation that the optical section transmits to the scanner section of the mask will to be passed through.
3. organic deposition device as described in claim 1, wherein
The laser is any one in infrared laser and ultraviolet laser.
4. organic deposition device as described in claim 1, wherein further include：
Optical window, is arranged in the top of the mask cleaning part, and is formed as transparent so that the laser transmission；And
Photochopper is arranged in the top of the optical window, and equipped with opening portion, so that the laser passes through.
5. organic deposition device as described in claim 1, wherein further include：
Chamber, provide for build deposition atmosphere inner space, and the inner space be disposed with the substrate support,
The mask support portion, the evaporation source and the mask cleaning part,
The mask cleaning part includes：
Optical section receives the transmission of the laser from the light source portion of the exterior thereto；
Scanner section irradiates the laser transmitted by the optical section to the mask.
6. a kind of organic deposition device, including：
Substrate support is used to support substrate；
Mask support portion, by with substrate it is facing in a manner of support mask；
Evaporation source, by with the mask it is facing in a manner of arrange, and heat organic matter and make the organic matter evaporate；
Chamber, provide for build deposition atmosphere inner space, and the inner space be disposed with the substrate support,
The mask support portion and the evaporation source；And
Mask cleaning part is arranged in the outside of the chamber, and irradiates laser to the mask.
7. organic deposition device as claimed in claim 6, wherein
The mask cleaning part includes：
Light source portion for generating the laser；
Optical section for transmitting the laser generated from the light source portion；
And for the laser irradiation that the optical section transmits to the scanner section of the mask will to be passed through.
8. organic deposition device as claimed in claim 6, wherein
The laser is any one in infrared laser and ultraviolet laser.
9. organic deposition device as claimed in claim 6, wherein further include：
Optical window, is arranged in the inside of the chamber corresponding with the mask cleaning part, and is formed as transparent so that described
Laser transmits；And
Photochopper is arranged in the top of the optical window, and equipped with opening portion, so that the laser passes through.
10. organic deposition device as claimed in claim 6, wherein
In the chamber corresponding with the mask cleaning part equipped with laser transmission window.
11. a kind of organic deposition method, includes the following steps：
Substrate and mask are respectively installed to substrate support and mask support portion；
The organic matter that the organic matter in heating evaporation source heats and gasifies is set to be deposited on the substrate by the mask；
By with the mask it is facing in a manner of arrange mask cleaning part；
Laser is set sequentially to be irradiated to the whole surface of the mask from the mask cleaning part.
12. organic deposition method as claimed in claim 11, wherein
The step of making the organic deposition, carries out under vacuum conditions.
13. organic deposition method as claimed in claim 11, wherein
In the step of making the organic deposition and the step of make the laser irradiation, makes the evaporation source and described cover
Membrane cleaning portion moves at a predetermined rate.
14. organic deposition method as claimed in claim 11, wherein
The laser is any one in infrared laser and ultraviolet laser.
15. organic deposition method as claimed in claim 11, wherein
The organic matter of the mask surface is detached from by the laser.
16. organic deposition method as claimed in claim 11, wherein further include following step：
It is disposed on the top of the mask cleaning part and swashs light transmissive optical window for described, and on the optical window top
Arrange photochopper, the photochopper is equipped with opening portion, so that the laser passes through.
17. organic deposition method as claimed in claim 16, wherein further include following step：
The optical window is set to rotate or move along a straight line.
18. organic deposition method as claimed in claim 17, wherein
The rotation of the optical window or the period of linear motion are controlled according to the processing quantity of the substrate.
19. organic deposition method as claimed in claim 11, wherein further include following step：
Before irradiating the laser to the mask, the substrate is removed from the substrate support.
20. organic deposition method as claimed in claim 11, wherein further include following step：
Before the organic matter for heating the evaporation source, shield is arranged in the top of the mask cleaning part；And
Before irradiating laser from the mask cleaning part, the shield is made to be moved to the top of the evaporation source.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170013989A KR20180089603A (en) | 2017-01-31 | 2017-01-31 | Apparatus and method for depositing organic material |
| KR10-2017-0013989 | 2017-01-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108374146A true CN108374146A (en) | 2018-08-07 |
| CN108374146B CN108374146B (en) | 2022-04-15 |
Family
ID=63016627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810054447.5A Active CN108374146B (en) | 2017-01-31 | 2018-01-19 | Organic matter deposition apparatus and method |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20180089603A (en) |
| CN (1) | CN108374146B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110034248A (en) * | 2019-04-17 | 2019-07-19 | 京东方科技集团股份有限公司 | A kind of exposure mask equipment, preparation OLED device and the method for preparing OLED display panel |
| CN111346861A (en) * | 2018-12-21 | 2020-06-30 | 三星显示有限公司 | Mask member cleaning device and mask member cleaning system |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001003155A (en) * | 1999-06-21 | 2001-01-09 | Matsushita Electric Ind Co Ltd | Vapor deposition device and vapor deposition method |
| JP2002241925A (en) * | 2001-02-21 | 2002-08-28 | Ulvac Japan Ltd | Organic vapor deposition system, and organic thin film manufacturing method |
| JP2006169573A (en) * | 2004-12-14 | 2006-06-29 | Laser Gijutsu Sogo Kenkyusho | Method and device for cleaning vapor deposition mask, and method and apparatus for manufacturing organic el element |
| CN1908807A (en) * | 2005-07-13 | 2007-02-07 | 索尼株式会社 | Method for producing transmissive screen, apparatus for producing transmissive screen, and transmissive screen |
| CN104756276A (en) * | 2012-08-06 | 2015-07-01 | 铣益系统有限责任公司 | Organic material deposition apparatus, and organic material deposition method using same |
-
2017
- 2017-01-31 KR KR1020170013989A patent/KR20180089603A/en not_active Application Discontinuation
-
2018
- 2018-01-19 CN CN201810054447.5A patent/CN108374146B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001003155A (en) * | 1999-06-21 | 2001-01-09 | Matsushita Electric Ind Co Ltd | Vapor deposition device and vapor deposition method |
| JP2002241925A (en) * | 2001-02-21 | 2002-08-28 | Ulvac Japan Ltd | Organic vapor deposition system, and organic thin film manufacturing method |
| JP2006169573A (en) * | 2004-12-14 | 2006-06-29 | Laser Gijutsu Sogo Kenkyusho | Method and device for cleaning vapor deposition mask, and method and apparatus for manufacturing organic el element |
| CN1908807A (en) * | 2005-07-13 | 2007-02-07 | 索尼株式会社 | Method for producing transmissive screen, apparatus for producing transmissive screen, and transmissive screen |
| CN104756276A (en) * | 2012-08-06 | 2015-07-01 | 铣益系统有限责任公司 | Organic material deposition apparatus, and organic material deposition method using same |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111346861A (en) * | 2018-12-21 | 2020-06-30 | 三星显示有限公司 | Mask member cleaning device and mask member cleaning system |
| CN111346861B (en) * | 2018-12-21 | 2023-09-22 | 三星显示有限公司 | Mask part cleaning device and mask part cleaning system |
| CN110034248A (en) * | 2019-04-17 | 2019-07-19 | 京东方科技集团股份有限公司 | A kind of exposure mask equipment, preparation OLED device and the method for preparing OLED display panel |
| CN110034248B (en) * | 2019-04-17 | 2021-09-03 | 京东方科技集团股份有限公司 | Mask equipment, method for preparing OLED device and method for preparing OLED display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180089603A (en) | 2018-08-09 |
| CN108374146B (en) | 2022-04-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100637714B1 (en) | Apparatus for treating substrate | |
| US8802200B2 (en) | Method and apparatus for cleaning organic deposition materials | |
| CN101332535B (en) | Laser processing device, fragment collecting mechanism and method and manufacture method of display panel | |
| KR101281909B1 (en) | Thin film deposition device | |
| CN108374146A (en) | organic deposition device and method | |
| US9174250B2 (en) | Method and apparatus for cleaning organic deposition materials | |
| JP2012216373A (en) | Vacuum vapor-deposition device and method for manufacturing organic el display device | |
| JP2013223877A (en) | Laser sealing apparatus and method of manufacturing organic luminescence display device using the same | |
| CN102826762A (en) | Thin film forming apparatus and thin film forming method | |
| KR102113564B1 (en) | Mask cleaning apparatus and mask cleaning method | |
| KR101127583B1 (en) | Cleaning method and cleaning system of organic materials | |
| JP2002241925A (en) | Organic vapor deposition system, and organic thin film manufacturing method | |
| CN109690809A (en) | Cleaning masks device and cleaning masks method | |
| KR101000908B1 (en) | Substrate processing apprtus and system | |
| JP2011062650A (en) | Method of cleaning mask for organic el, program, device for cleaning mask for organic el, device for manufacturing organic el display, and organic el display | |
| JP4661404B2 (en) | Vacuum deposition apparatus and electro-optical device manufacturing method | |
| CN102191486B (en) | Laser processing device | |
| JP5240466B2 (en) | FPD substrate manufacturing method and apparatus | |
| KR101009558B1 (en) | Equipments for forming layers in vacuum condition | |
| KR101276268B1 (en) | Evaporation device for manufacturing of OLED | |
| CN113853447A (en) | Deposition apparatus system | |
| JPWO2020174845A1 (en) | Film deposition equipment | |
| KR20230077086A (en) | Inkjet Print Equipment | |
| KR102158138B1 (en) | Deposition apparatus | |
| JP2011219808A (en) | Mask dry cleaning apparatus and mask dry cleaning method, and apparatus for manufacturing mask dry |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |