CN108374146B - Organic matter deposition apparatus and method - Google Patents
Organic matter deposition apparatus and method Download PDFInfo
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- CN108374146B CN108374146B CN201810054447.5A CN201810054447A CN108374146B CN 108374146 B CN108374146 B CN 108374146B CN 201810054447 A CN201810054447 A CN 201810054447A CN 108374146 B CN108374146 B CN 108374146B
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- 230000008021 deposition Effects 0.000 title claims abstract description 60
- 239000005416 organic matter Substances 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 81
- 238000004140 cleaning Methods 0.000 claims abstract description 79
- 238000001704 evaporation Methods 0.000 claims abstract description 55
- 230000008020 evaporation Effects 0.000 claims abstract description 54
- 239000000126 substance Substances 0.000 claims abstract description 29
- 238000000151 deposition Methods 0.000 claims description 83
- 230000003287 optical effect Effects 0.000 claims description 60
- 230000005540 biological transmission Effects 0.000 claims description 24
- 230000001678 irradiating effect Effects 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000011368 organic material Substances 0.000 claims description 12
- 239000012044 organic layer Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 239000010410 layer Substances 0.000 description 6
- 238000005137 deposition process Methods 0.000 description 5
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- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000004148 unit process Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000005192 partition Methods 0.000 description 1
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- 238000005215 recombination Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The embodiment of the invention relates to an organic matter deposition device and method. The organic matter deposition apparatus of the present invention includes: a substrate supporting part for supporting a substrate; a mask supporting part supporting a mask in a manner of facing the substrate; an evaporation source that is disposed so as to face the mask and heats an organic substance to evaporate the organic substance; and a mask cleaning unit disposed on one side of the evaporation source and configured to irradiate the mask with laser light.
Description
Technical Field
Embodiments of the present invention relate to a deposition apparatus and method, and more particularly, to an organic deposition apparatus equipped with a mask cleaning part and method thereof.
Background
The organic electroluminescent element includes a positive electrode, a negative electrode, and an organic layer. In the process of recombination of the holes injected through the positive electrode and the electrons injected through the negative electrode in the organic layer, light is emitted by the energy difference.
The organic layers may include a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer, and may be generally formed by a vacuum deposition method.
The deposition apparatus for forming an organic layer is configured to heat and evaporate an organic material and to deposit the evaporated material on a substrate. The evaporated organics may be selectively deposited onto the substrate via a mask.
The mask is generally configured in the form of a sheet (sheet) and has a plurality of slits (slit) finely arranged in a pattern. Organic substances may be selectively deposited on the substrate through the respective slits.
In the deposition process, the organic matter can be deposited not only on the substrate but also on the surface of the mask or the slit.
Recently, as the resolution of the display device increases, the size of the slits and the distance between the slits decrease, and thus, the size of the slits decreases or the slits are clogged due to organic substances deposited on the surface of the mask, which tends to increase defective products.
In order to prevent the above-mentioned defects, it is necessary to frequently clean or replace the mask, which, however, shortens the process cycle and leads to a reduction in productivity.
Disclosure of Invention
An object of embodiments of the present invention is to provide an organic deposition apparatus and method capable of cleaning a mask during one process cycle.
It is another object of embodiments of the present invention to provide an organic deposition apparatus and method that can reduce the manufacturing cost of a replacement spare mask.
It is still another object of embodiments of the present invention to provide an organic matter deposition apparatus and method capable of increasing a unit process cycle and a throughput.
An organic matter depositing apparatus according to an aspect of the present invention for achieving the above object may include: for supporting a substrate; a mask supporting part supporting a mask in a manner of facing the substrate; an evaporation source that is disposed so as to face the mask and heats an organic substance to evaporate the organic substance; and a mask cleaning unit disposed on one side of the evaporation source and configured to irradiate the mask with laser light.
The mask cleaning part may include: a light source unit for generating the laser light; an optical unit for transmitting the laser light generated from the light source unit; and a scanning portion for irradiating the mask with the laser light transmitted through the optical portion.
The organic matter deposition apparatus may further include: a chamber providing an inner space for creating a deposition atmosphere, and in which the substrate supporting part, the mask supporting part, the evaporation source, and the mask cleaning part are disposed, and the mask cleaning part may include: an optical unit that receives the laser light from a light source unit outside the chamber; and a scanning unit that irradiates the mask with the laser light transmitted through the optical unit.
An organic matter depositing apparatus according to another aspect of the present invention for achieving the above object may include: a substrate supporting part for supporting a substrate; a mask supporting portion supporting the mask in a manner of facing the substrate; an evaporation source that is disposed so as to face the mask and heats an organic substance to evaporate the organic substance; a chamber that provides an inner space for creating a deposition atmosphere and in which the substrate support part, the mask support part, and the evaporation source are disposed; and a mask cleaning portion that is disposed outside the chamber and irradiates the mask with laser light.
The mask cleaning part may include: a light source unit for generating the laser light; an optical unit for transmitting the laser light generated from the light source unit; and a scanning portion for irradiating the mask with the laser light transmitted through the optical portion.
The laser is any one of an Infrared (IR) laser and an Ultraviolet (UV) laser.
The organic matter deposition apparatus may further include: an optical window disposed inside the chamber corresponding to the mask cleaning part and formed to transmit the laser light; and a shutter (chopper) disposed at an upper portion of the optical window and provided with an opening portion through which the laser light passes.
The optical window may be provided with a plurality of transmission regions, and may be rotationally moved in such a manner that the respective transmission regions sequentially correspond to the opening portions of the shutters; alternatively, the optical window may be provided with a plurality of transmission regions, and the transmission regions may be linearly moved so as to sequentially correspond to the opening portions of the shutters.
The chamber corresponding to the mask cleaning portion may be provided with a laser transmission window.
Further, an organic matter deposition method according to still another aspect of the present invention for achieving the above object may include the steps of: mounting the substrate and the mask to the substrate supporting part and the mask supporting part, respectively; depositing organic matter vaporized by heating the organic matter of the evaporation source on the substrate through the mask; disposing a mask cleaning portion in a manner to face the mask; laser light is sequentially irradiated from the mask cleaning portion to the entire surface of the mask.
The step of depositing the organic matter may be performed in a vacuum state.
In the step of depositing the organic substance and the step of irradiating the laser, the evaporation source and the mask cleaning unit may be moved at a predetermined speed.
The laser may be any one of an infrared laser and an ultraviolet laser, and the organic matter on the surface of the mask may be desorbed by the laser.
The organic deposition method may further include the steps of: an optical window through which the laser light is transmitted is disposed on an upper portion of the mask cleaning portion, and a shutter provided with an opening portion through which the laser light passes is disposed on an upper portion of the optical window.
The organic deposition method may further include the step of rotating or linearly moving the optical window, and the period of the rotation or linear movement of the optical window may be controlled according to the processed number of the substrate.
The organic deposition method may further include the steps of: removing the substrate from the substrate supporting part before irradiating the mask with the laser light.
The organic deposition method may further include the steps of: disposing a shutter on an upper portion of the mask cleaning part before heating the organic matter of the evaporation source; and moving the shutter plate to an upper portion of the evaporation source before the mask cleaning unit is irradiated with the laser beam.
In the organic deposition apparatus according to the embodiment of the present invention, since the mask cleaning unit is provided inside the chamber, the mask can be cleaned at any time in one process cycle. Since the mask replacement cycle can be reduced as compared with the conventional one, the throughput can be improved by increasing the operation rate, and the number of spare masks for replacement can be reduced, so that the production cost can be reduced.
Further, the mask cleaning part according to the embodiment of the present invention is configured to be able to remove organic matter by irradiating laser (laser), so that time and cost required for cleaning can be reduced compared to wet cleaning using a chemical solvent, and environmental pollution caused by the use of the chemical solvent can be prevented.
Drawings
Fig. 1 and 2 are sectional views for explaining an organic deposition apparatus according to an embodiment of the present invention.
Fig. 3 is a plan view for explaining an embodiment of the mask illustrated in fig. 1.
Fig. 4a and 4b are perspective views for explaining an embodiment of the optical window and shutter illustrated in fig. 1.
Fig. 5a is a sectional view for explaining an organic matter depositing apparatus according to a first embodiment of the present invention.
Fig. 5b is a view for explaining the configuration of a mask cleaning part of the organic matter deposition apparatus according to the first embodiment of the present invention.
Fig. 6a is a sectional view for explaining an organic matter depositing apparatus according to a second embodiment of the present invention.
FIG. 6b is a view for explaining the structure of a mask cleaning part of an organic deposition apparatus according to a second embodiment of the present invention.
Fig. 7 and 8 are sectional views for explaining an organic matter deposition apparatus according to a third embodiment of the present invention.
Description of the symbols
10: substrate supporting part 12: substrate
20: mask supporting part 22: mask film
24: gap 30: evaporation source
32: crucible 34: heating part
36: nozzles 40, 40 a: organic matter
50: mask cleaning portion 50 a: laser
52. 52 a: light source section 54: optical part
56: the scanner 62: optical window
62 a: transmissive area 64: light chopper
64 a: opening 70: shield plate
80. 80 a: transfer portions 100, 100 a: chamber
120: discharge ports 140, 140 b: laser transmission window
200: vacuum pump
Detailed Description
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided to enable those having a basic knowledge in the art to sufficiently understand the present invention, and may be modified in various forms, and the scope of the present invention is not limited to the embodiments described below.
Fig. 1 and 2 are sectional views for explaining an organic deposition apparatus according to an embodiment of the present invention.
Referring to fig. 1 and 2, the organic matter deposition apparatus may include: a substrate support part 10 for supporting a substrate 12; a mask support part 20 that supports the mask 22 so that the mask 22 faces the substrate 12; an evaporation source 30 which is disposed so as to face the mask 22 and heats organic substances to evaporate the organic substances; the mask cleaning unit 50 is disposed on one side of the evaporation source 30, and irradiates the mask 22 with laser light.
The substrate support 10 may be disposed at an upper portion of the evaporation source 30 in such a manner that the deposition surface of the substrate 12 faces the lower portion. Alternatively, the substrate support 10 may be disposed such that the deposition surface of the substrate 12 faces the side portion, and the evaporation source 30 may be disposed at the side portion of the substrate support 10 facing the deposition surface of the substrate 12.
The substrate 12 may be attached and fixed to the substrate supporting part 10 by a vacuum unit (not shown), or may be supported and fixed by a fixing unit (not shown) provided along an edge position of the substrate supporting part 10.
The mask support portion 20 is configured to support and fix an edge position of the mask 22, and may support the mask 22 in close contact with the deposition surface of the substrate 12 or at a predetermined distance from the deposition surface.
Fig. 3 is a plan view for explaining an embodiment of the mask 22.
Referring to fig. 3, the mask 22 is configured in a sheet form and includes a plurality of slits 24 arranged in a fine pattern. Organic substances are deposited on the substrate 12 through the respective slits 24, and accordingly, an organic substance pattern corresponding to the slits 24 may be formed on the substrate 12.
At least one of the substrate support part 10 and the mask support part 20 is configured to be movable by an alignment unit (not shown) so that the substrate 12 and the mask 22 may be aligned with each other.
The evaporation source 30 is a deposition material, and may include, for example: a crucible 32 for containing organic matter 40; a heating section 34 for heating the crucible 32; and at least one nozzle 36 provided at an upper portion of the crucible 32.
The crucible 32 is heated by the heating unit 34, and the organic material 40 is vaporized and sprayed to the outside through the nozzle 36.
The crucible 32 is a container capable of containing the organic material 40 in an internal space, and a heating portion 34 may be provided on an outer wall or an outer side of the crucible 32. The heating unit 34 may be formed of a hot wire (hot wire), for example.
Only one crucible 32 is shown in the drawing, but the space inside the crucible 32 may be divided into a plurality of spaces by partition walls (not shown) or the like, for example, or may be configured as a structure in which a plurality of crucibles 32 are connected.
The mask cleaning unit 50 is configured to irradiate the mask 22 with laser light to remove organic substances adhering to the surface of the mask 22. In order to remove the organic substance, a laser having a short wavelength of 500nm or less is preferably used. The laser may be one of an Infrared (IR) laser and an Ultraviolet (UV) laser.
A transparent optical window 62 is disposed on an upper portion of the mask cleaning portion 50 to transmit the laser light, and a chopper (chopper)64 having an opening portion 64a may be disposed on an upper portion of the optical window 62 to pass the laser light.
Fig. 4a and 4b are perspective views for explaining embodiments of the optical window 62 and the shutter 64.
Referring to fig. 4a, the optical window 62 is provided with a plurality of transmissive areas 62a, and can perform a rotational movement such that the respective transmissive areas 62a sequentially correspond to the opening portions 64a of the shutters 64.
Referring to fig. 4b, the optical window 62 includes a plurality of transmissive regions 62a, and is linearly movable such that the transmissive regions 62a sequentially correspond to the openings 64a of the shutters 64.
Organic matter evaporated during deposition may adhere to the optical window 62 through the opening 64a of the shutter 64, or organic matter removed from the mask 22 during cleaning may fall and adhere to the optical window 62 through the opening 64a of the shutter 64. Since it is necessary to manage to avoid the existence of foreign matter on the path of the irradiated laser light, when one of the transmission regions 62a is contaminated, the optical window 62 should be rotated or linearly moved so that the other transmission region 62a that is not contaminated corresponds to the opening 64a of the shutter 64, whereby the process efficiency can be improved.
The rotation or linear movement period of the optical window 62 can be controlled by grasping the degree of contamination of the optical window 62 based on the number of processes of the substrate 12 in advance.
A shutter 70 that can selectively block the evaporation source 30 and the mask cleaning part 50 may be provided above the evaporation source 30 and the mask cleaning part 50.
Fig. 1 shows a state where the organic matter 40a is evaporated from the evaporation source 30, and at this time, the shutter 70 is disposed at an upper portion of the mask cleaning part 50 to prevent the organic matter 40a from adhering to the mask cleaning part 50. The shutter 70 is preferably disposed at an upper portion of the shutter 64.
Fig. 2 shows a state where the mask cleaning unit 50 is irradiated with the laser beam 50a to clean the mask 22. At this time, the shutter 70 is disposed at an upper portion of the evaporation source 30, thereby preventing the organic matter removed from the mask 22 from adhering to the evaporation source 30 and preventing the organic matter 40a from evaporating from the evaporation source 30 toward the substrate 12.
The evaporation source 30 and the mask cleaning unit 50 may be configured to be capable of reciprocating by the transfer unit 80.
Fig. 1 shows a state where the organic matter 40a is evaporated from the evaporation source 30 and deposited on the substrate 12, at which time the evaporation source 30 and the mask cleaning section 50 can be moved in one direction (e.g., from left to right) at a predetermined speed by the transfer section 80.
Fig. 2 shows a state in which the evaporation source 30 and the mask cleaning unit 50 are returned to the original positions by the transfer unit 80 after the organic deposition process is completed. At this time, the substrate 12 on which deposition is completed is removed from the substrate support part 10, and the laser light 50a is irradiated from the cleaning part 50 while the evaporation source 30 and the mask cleaning part 50 are moved in another direction (e.g., from the right side to the left side) at a predetermined speed by the transfer part 80, so that the mask 22 can be cleaned.
Fig. 5a is a sectional view for explaining an organic matter deposition apparatus according to a first embodiment of the present invention, and fig. 5b is a detailed configuration diagram of a mask cleaning part 50.
Referring to fig. 5a, the organic deposition apparatus may be disposed inside the chamber 100.
The chamber 100 provides an inner space for creating a deposition atmosphere, and a substrate support part 10, a mask support part 20, an evaporation source 30, and a mask cleaning part 50 may be disposed in the inner space.
The inner space of the chamber 100 may maintain a vacuum atmosphere, and for this, an exhaust port 120 may be provided at one side of the chamber 100, and a vacuum pump 200 may be connected to the exhaust port 120.
Referring to fig. 5b, in the organic deposition apparatus according to the first embodiment, the mask cleaning part 50 may include: a light source unit 52 for generating the laser beam; an optical unit 54 for transmitting the laser light generated from the light source unit 52; and a scanning section 56 for irradiating the mask 22 with the laser light transmitted through the optical section 54.
The light source unit 52 may be configured to be capable of generating one of an Infrared (IR) laser and an Ultraviolet (UV) laser.
The optical unit 54 changes the path while maintaining the output of the laser beam, and may include an optical lens, a reflection lens, and the like.
The scanning unit 56 may be configured to sequentially irradiate the laser light transmitted through the optical unit 54 onto the entire surface of the mask 22.
Hereinafter, an embodiment of the present invention will be described in more detail through a process of depositing organic substances on the substrate 12 using the organic substance deposition apparatus configured as described above.
Referring to fig. 5a, the substrate 12 and the mask 22 are respectively provided inside the chamber 100 to be mounted to the substrate supporting part 10 and the mask supporting part 20. The substrate 12 and the mask 22 may be aligned with each other by an alignment unit.
At this time, the organic material 40 is filled into the crucible 32 of the evaporation source 30, and an optical window 62 and a shutter 64 may be disposed on an upper portion of the mask cleaning part 50.
The interior of the chamber 100 may be formed, for example, 10 by operating the vacuum pump 200-4High vacuum state of pascal (Pa).
When the power is applied to the heating unit 34 of the evaporation source 30 to heat the organic material 40, the vaporized organic material 40a is evaporated toward the mask 22 by the nozzle 36, and selectively deposited on the substrate 12 through the slit 24 of the mask 22 to form an organic layer.
Before heating the organic substance 40 of the evaporation source 30, the shutter 70 is disposed at an upper portion of the mask cleaning part 50, so that the organic substance 40a may not be attached to the light shield 64 or the mask cleaning part 50.
As shown in fig. 1, the evaporation source 30 and the mask cleaning section 50 may be moved in one direction (e.g., from left to right) at a predetermined speed by the moving section 80, so that an organic layer may be formed in a predetermined thickness on the entire substrate 12. The thickness of the deposited organic layer can be controlled by adjusting the speed.
The organic layer may be a light emitting layer of a red (R), green (G), blue (B), or white (W) pixel constituting an organic light emitting element. In the above embodiments, the organic layer of the organic electroluminescent element is described as an example, but the present invention is not limited to this, and any of the embodiments can be applied as long as deposition of the organic layer is required.
If the deposition process is completed, the shutter 70 is moved toward the upper portion of the evaporation source 30 so that the organic material 40a is not evaporated toward the substrate 12.
During the deposition process repeated for a plurality of substrates 12, the organic material 40a may be deposited on the surface of the mask 22. Therefore, it may be necessary to clean the mask 22.
Referring to fig. 2, the light source unit 52 is operated in a state where the mask cleaning unit 50 is located at a position facing the mask 22, so that laser light can be generated. The generated laser light 50a is changed in path by the optical portion 54 and then transmitted to the scanning portion 56, and the scanning portion 56 can sequentially irradiate the laser light 50a to the entire surface of the mask 22.
The bonds between atoms of the organic substance 40 deposited on the surface of the mask 22 are broken by the laser light 50a, resulting in weakening of the coupling force, and thus, the detachment from the mask 22 is possible.
As shown in fig. 2, the evaporation source 30 and the mask cleaning section 50 are moved in one direction (e.g., from the left side to the right side) at a predetermined speed by the transfer section 80, so that the entire surface of the mask 22 can be cleaned.
The thickness of the organic material 40 deposited on the surface of the mask 22 is proportional to the number of depositions. The moving speed of the mask cleaning part 50 may be controlled according to the thickness and position of the organic material 40 deposited on the surface of the mask 22. Further, in the case where the laser light 50a is directly irradiated to the mask 22, deformation may occur, and therefore, it is preferable to adjust the output, focal length, and irradiation angle of the laser light 50 a.
In the organic deposition apparatus according to the first embodiment, since the mask cleaning unit 50 is provided inside the chamber 100 together with the evaporation source 30, the mask 22 can be cleaned as needed at any time during the unit process cycle.
Fig. 6a is a sectional view for explaining an organic matter deposition apparatus according to a second embodiment of the present invention, and fig. 6b is a detailed configuration diagram of a mask cleaning part 50.
Referring to fig. 6a, the organic deposition apparatus may be disposed inside the chamber 100.
The chamber 100 provides an inner space capable of creating a deposition atmosphere, and a substrate support part 10, a mask support part 20, an evaporation source 30, and a mask cleaning part 50 may be disposed in the inner space.
The inner space of the chamber 100 may be maintained in a vacuum atmosphere, and for this, one side of the chamber 100 may be provided with an exhaust port 120, and a vacuum pump 200 may be connected to the exhaust port 120.
Referring to fig. 6b, in the organic deposition apparatus according to the second embodiment, the mask cleaning part 50 may include: an optical unit 54 that receives the laser light from the light source unit 52a outside the chamber 100; the scanner unit 56 irradiates the mask 22 with the laser beam transmitted through the optical unit 54.
The light source unit 52a may be configured to be capable of generating one of an Infrared (IR) laser and an Ultraviolet (UV) laser, and may be disposed outside the chamber 100.
A laser transmission window 140 may be provided in the chamber 100 to enable laser light to pass from the light source portion 52a outside the chamber 100 to the optical portion 54 inside the chamber 100. The laser transmission window 140 is configured to maintain a vacuum state inside the chamber 100 and to allow laser light to be transmitted to the inside of the chamber 100 in a direct manner.
The light source part 52a may be equipped with a position adjusting unit or an output adjusting unit so that a predetermined output laser light can be accurately transmitted to the optical part 54 also in the process of the mask cleaning part 50 moving inside the chamber 100.
The optical unit 54 changes the path while maintaining the output of the laser beam, and may include an optical lens, a reflection lens, and the like.
The scanner unit 56 may be configured to sequentially irradiate the laser light transmitted through the optical unit 54 onto the entire surface of the mask 22.
In the organic matter deposition apparatus according to the second embodiment, a process of depositing organic matter on the substrate 12 is similar to that described through the first embodiment, and thus a description thereof is omitted.
According to the organic matter deposition apparatus of the second embodiment, since the light source portion 52a for generating laser light is disposed outside the chamber 100, there is an advantage in that maintenance and repair of the light source portion 52a having a relatively complicated structure are facilitated.
Fig. 7 and 8 are sectional views for explaining an organic matter deposition apparatus according to a third embodiment of the present invention.
Referring to fig. 7 and 8, the organic matter deposition apparatus may include: a substrate support part 10 for supporting a substrate 12; a mask support part 20 that supports the mask 22 so that the mask 22 faces the substrate 12; an evaporation source 30 which is disposed so as to face the mask 22 and heats organic substances to evaporate the organic substances; a chamber 100a providing an inner space for creating a deposition atmosphere, and in which a substrate support part 10, a mask support part 20, and an evaporation source 30 are disposed; and a mask cleaning portion 50 disposed outside the chamber 100a and irradiating the mask 22 with laser light.
The specific configurations of the substrate support part 10, the mask support part 20, and the evaporation source 30 have been described in the first and second embodiments, and therefore, the description thereof is omitted here. In the organic deposition apparatus according to the third embodiment, the substrate support part 10 and the mask support part 20 may be configured to be capable of reciprocating by the transfer part 80a, and the evaporation source 30 may be fixed to one surface of the chamber 100a so as to face the mask support part 20.
Fig. 7 shows a state where the organic matter 40a is evaporated from the evaporation source 30 to be deposited on the substrate 12, at which time the substrate supporting part 10 and the mask supporting part 20 may be moved in one direction (e.g., from left to right) at a predetermined speed by the transfer part 80 a.
Fig. 8 shows a state in which the substrate supporting part 10 and the mask supporting part 20 are moved by the transfer part 80a to be located at positions facing the mask cleaning part 50 after the organic deposition process is completed as shown in fig. 7. At this time, if the substrate 12 on which deposition is completed is removed from the substrate support part 10, the laser light 50a is irradiated from the mask cleaning part 50, so that the mask 22 can be cleaned.
A transparent optical window 62 is disposed inside the chamber 100a corresponding to the mask cleaning part 50 to transmit the laser light, and a shutter 64 may be disposed on an upper portion of the optical window 62, the shutter 64 having an opening 64a formed to pass the laser light. Further, a shutter 70 capable of selectively shielding the evaporation source 30 and the mask cleaning part 50 may be provided at an upper portion of the evaporation source 30 and inside the chamber 100a corresponding to the mask cleaning part 50. The shutter 70 is preferably disposed at an upper portion of the shutter 64.
In order to allow the shutter 70 to freely reciprocate above the evaporation source 30 and the shutter 64, a part of the chamber 100a, for example, a part where the mask cleaning part 50 is disposed may be configured to have a step. A mask cleaning part 50 may be disposed at the stepped portion, and a chamber 100a corresponding to the mask cleaning part 50 may be provided with a laser transmission window 140b for transmitting laser to the chamber 100 a.
The specific configurations of the optical window 62 and the shutter 64 have been described with reference to fig. 4a and 4b, and therefore, the description thereof will be omitted.
In the organic matter deposition apparatus according to the third embodiment, a process of depositing organic matter onto the substrate 12 is similar to that described through the first embodiment, and thus a description thereof is omitted.
The organic matter deposition apparatus according to the third embodiment has the following advantages: since the mask cleaning portion 50 is disposed outside the chamber 100a, maintenance and repair of the mask cleaning portion 50 are convenient.
As described above, the preferred embodiments of the present invention have been disclosed through the detailed description and the accompanying drawings. The terms used are used for the purpose of describing the present invention, and are not used for the purpose of limiting the meaning or limiting the scope of the present invention described in the claims. Therefore, it is to be understood that various modifications and equivalent embodiments can be made from the above-described embodiments by those having ordinary knowledge in the art. Therefore, the true technical scope of the present invention should be determined according to the technical idea of the claims.
Claims (16)
1. An organic matter deposition apparatus comprising:
a substrate supporting part for supporting a substrate;
a mask supporting part supporting a mask in a manner of facing the substrate;
an evaporation source that is disposed so as to face the mask and heats an organic substance to evaporate the organic substance;
a mask cleaning unit that is disposed on one side of the evaporation source and irradiates the mask with laser light;
an optical window disposed at an upper portion of the mask cleaning part and provided with a plurality of transparent transmission regions to transmit the laser light; and
a shutter disposed at an upper portion of the optical window and provided with an opening portion through which the laser light passes,
wherein the optical window performs a rotational motion or a linear motion in such a manner that the plurality of transmission regions sequentially correspond to the opening portion of the shutter, so that when one transmission region is contaminated, the other transmission region, which is not contaminated, corresponds to the opening portion of the shutter.
2. The organic matter deposition apparatus as claimed in claim 1,
the mask cleaning part includes:
a light source unit for generating the laser light;
an optical unit for transmitting the laser light generated from the light source unit; and
and a scanning part for irradiating the laser transmitted through the optical part to the mask.
3. The organic matter deposition apparatus as claimed in claim 1,
the laser is any one of an infrared laser and an ultraviolet laser.
4. The organic matter deposition apparatus as claimed in claim 1, further comprising:
a chamber providing an inner space for creating a deposition atmosphere, and in which the substrate supporting part, the mask supporting part, the evaporation source, and the mask cleaning part are disposed,
the mask cleaning part includes:
an optical unit that receives the laser light from a light source unit outside the chamber;
and a scanning unit that irradiates the mask with the laser light transmitted through the optical unit.
5. An organic matter deposition apparatus comprising:
a substrate supporting part for supporting a substrate;
a mask supporting portion supporting the mask in a manner of facing the substrate;
an evaporation source that is disposed so as to face the mask and heats an organic substance to evaporate the organic substance;
a chamber that provides an inner space for creating a deposition atmosphere and in which the substrate support part, the mask support part, and the evaporation source are disposed;
a mask cleaning section arranged outside the chamber and irradiating the mask with laser light;
an optical window disposed inside the chamber corresponding to the mask cleaning part and provided with a plurality of transparent transmission regions to transmit the laser light; and
a shutter disposed at an upper portion of the optical window and provided with an opening portion through which the laser light passes,
wherein the optical window performs a rotational motion or a linear motion in such a manner that the plurality of transmission regions sequentially correspond to the opening portion of the shutter, so that when one transmission region is contaminated, the other transmission region, which is not contaminated, corresponds to the opening portion of the shutter.
6. The organic matter deposition apparatus as claimed in claim 5,
the mask cleaning part includes:
a light source unit for generating the laser light;
an optical unit for transmitting the laser light generated from the light source unit;
and a scanning portion for irradiating the mask with the laser light transmitted through the optical portion.
7. The organic matter deposition apparatus as claimed in claim 5,
the laser is any one of an infrared laser and an ultraviolet laser.
8. The organic matter deposition apparatus as claimed in claim 5,
the chamber corresponding to the mask cleaning portion is provided with a laser transmission window.
9. An organic deposition method comprising the steps of:
mounting the substrate and the mask to the substrate supporting part and the mask supporting part, respectively;
depositing the organic material vaporized by heating the organic material in the evaporation source on the substrate through the mask;
disposing a mask cleaning portion in a manner to face the mask;
an optical window provided with a plurality of transmission regions through which laser light is transmitted is disposed on an upper portion of the mask cleaning portion, and a shutter provided with an opening portion through which the laser light passes is disposed on an upper portion of the optical window;
sequentially irradiating laser light to the entire surface of the mask from the mask cleaning portion;
the optical window is caused to perform a rotational motion or a linear motion in such a manner that the plurality of transmission areas sequentially correspond to the opening portion of the shutter, so that when one transmission area is contaminated, the other transmission area that is not contaminated corresponds to the opening portion of the shutter.
10. The organic deposition method of claim 9,
the step of depositing the organic matter is performed under a vacuum state.
11. The organic deposition method of claim 9,
in the step of depositing the organic substance and the step of irradiating the laser beam, the evaporation source and the mask cleaning unit are moved at a predetermined speed.
12. The organic deposition method of claim 9,
the laser is any one of an infrared laser and an ultraviolet laser.
13. The organic deposition method of claim 9,
organic matter on the surface of the mask is detached by the laser.
14. The organic deposition method of claim 9,
controlling a period of the rotation or linear motion of the optical window according to the processed number of the substrate.
15. The organic deposition method of claim 9, further comprising the steps of:
removing the substrate from the substrate supporting part before irradiating the mask with the laser light.
16. The organic deposition method of claim 9, further comprising the steps of:
disposing a shutter on an upper portion of the mask cleaning part before heating the organic matter of the evaporation source; and
before the mask cleaning unit is irradiated with the laser beam, the shutter is moved to an upper portion of the evaporation source.
Applications Claiming Priority (2)
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KR1020170013989A KR20180089603A (en) | 2017-01-31 | 2017-01-31 | Apparatus and method for depositing organic material |
KR10-2017-0013989 | 2017-01-31 |
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CN108374146B true CN108374146B (en) | 2022-04-15 |
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KR20200078737A (en) * | 2018-12-21 | 2020-07-02 | 삼성디스플레이 주식회사 | Apparatus for cleaning mask member and system for cleaning mask member |
CN110034248B (en) * | 2019-04-17 | 2021-09-03 | 京东方科技集团股份有限公司 | Mask equipment, method for preparing OLED device and method for preparing OLED display panel |
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JP2002241925A (en) * | 2001-02-21 | 2002-08-28 | Ulvac Japan Ltd | Organic vapor deposition system, and organic thin film manufacturing method |
JP2006169573A (en) * | 2004-12-14 | 2006-06-29 | Laser Gijutsu Sogo Kenkyusho | Method and device for cleaning vapor deposition mask, and method and apparatus for manufacturing organic el element |
CN1908807A (en) * | 2005-07-13 | 2007-02-07 | 索尼株式会社 | Method for producing transmissive screen, apparatus for producing transmissive screen, and transmissive screen |
CN104756276A (en) * | 2012-08-06 | 2015-07-01 | 铣益系统有限责任公司 | Organic material deposition apparatus, and organic material deposition method using same |
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JP2001003155A (en) * | 1999-06-21 | 2001-01-09 | Matsushita Electric Ind Co Ltd | Vapor deposition device and vapor deposition method |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002241925A (en) * | 2001-02-21 | 2002-08-28 | Ulvac Japan Ltd | Organic vapor deposition system, and organic thin film manufacturing method |
JP2006169573A (en) * | 2004-12-14 | 2006-06-29 | Laser Gijutsu Sogo Kenkyusho | Method and device for cleaning vapor deposition mask, and method and apparatus for manufacturing organic el element |
CN1908807A (en) * | 2005-07-13 | 2007-02-07 | 索尼株式会社 | Method for producing transmissive screen, apparatus for producing transmissive screen, and transmissive screen |
CN104756276A (en) * | 2012-08-06 | 2015-07-01 | 铣益系统有限责任公司 | Organic material deposition apparatus, and organic material deposition method using same |
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