CN108372457B - A kind of grinding and cutting process of low pass channel array waveguide grating multiplexer chip - Google Patents
A kind of grinding and cutting process of low pass channel array waveguide grating multiplexer chip Download PDFInfo
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- CN108372457B CN108372457B CN201810098587.2A CN201810098587A CN108372457B CN 108372457 B CN108372457 B CN 108372457B CN 201810098587 A CN201810098587 A CN 201810098587A CN 108372457 B CN108372457 B CN 108372457B
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- 238000005520 cutting process Methods 0.000 title claims abstract description 33
- 239000011521 glass Substances 0.000 claims abstract description 66
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 19
- 239000010703 silicon Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000003860 storage Methods 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 6
- 239000012188 paraffin wax Substances 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 4
- 238000012797 qualification Methods 0.000 claims description 4
- 238000001514 detection method Methods 0.000 abstract description 11
- 230000002950 deficient Effects 0.000 abstract description 5
- 208000037656 Respiratory Sounds Diseases 0.000 abstract description 4
- 238000005498 polishing Methods 0.000 abstract description 3
- 230000001681 protective effect Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 4
- 230000002411 adverse Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000006059 cover glass Substances 0.000 description 2
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- 230000000694 effects Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention relates to a kind of grinding and cutting process of low pass channel array waveguide grating multiplexer chip, two end faces are ground on grinder and be polished in two end faces in strip Chip-wide direction from the upper surface of the first glass cover-plate respectively at different predetermined angles, thus realize single chip input end face and output end face from the upper surface of the first glass cover-plate respectively at different predetermined angles；Strip chip size is larger, convenient for grinding and polishing, and carries out angle detection to two end faces in strip Chip-wide direction, that is, the angle detection to multiple single chip input end faces and output end face can be achieved at the same time, improve detection efficiency；In addition, need to do over again, can integrally do over again, do over again high-efficient if the detection of strip chip angle is unqualified；During the grinding process, silicon base chip upper surface is all covered with glass cover-plate to strip chip, and glass cover-plate plays certain protective role to silicon base chip, and the fraction defectives such as chipping in process of lapping, crackle are effectively reduced.
Description
Technical field
The present invention relates to optical communication technology field, in particular to a kind of low pass channel array waveguide grating multiplexer chip
Grinding and cutting process.
Background technique
With the development of communication service and the surge of transmission capacity, CWDM (coarse wavelength division multiplexing systems) is increasingly by people
Attention.Early stage is applied to the CWDM of North America backbone network, is rapidly advanced to the whole world now, and be widely applied to
Among Metropolitan Area Network (MAN).The CWDM technology developed both at home and abroad is there are mainly three types of type at present, they be based respectively on array waveguide grating,
Dielectric coating filter and Fiber Bragg Grating technology.Array waveguide grating is a kind of plane waveguiding device, is using PLC technology in chip
It is made on substrate.At present compared with dielectric coating filter and fiber grating, array waveguide grating has integrated level height, channel
Number is more, insertion loss is small, is easy to the advantages that batch automatic production.
But for low pass channel array waveguide grating multiplexer, as four-way arrayed waveguide grating multiplexer,
Eight channel array waveguide grating multiplexers, the structure of single chip include silicon base chip and are covered on silicon base chip upper surface
Glass cover-plate, and the non-cover glass cover board of output end silicon base chip upper surface predetermined width of single chip, single chip
Input end face and output end face are from the upper surface of glass cover-plate respectively at different predetermined angles.Because single chip size is small, lead
It is high to cause angle fraction defective after input end face and output end face grinding, and single chip is done over again one by one, low efficiency of doing over again, entire process
Scrappage is high；In addition, the non-cover glass cover board in output end silicon base chip upper surface, output end face is ground because silicon base chip material is more crisp
Chipping, crackle fraction defective are high during mill, and product rejection rate is high.
Summary of the invention
It is an object of the present invention to provide a kind of grinding and cutting process of low pass channel array waveguide grating multiplexer chip, solutions
Certainly the above-mentioned problems in the prior art.
The technical scheme to solve the above technical problems is that
A kind of grinding and cutting process of low pass channel array waveguide grating multiplexer chip, includes the following steps:
Step 1, silicon base chip wafer is cut into chip into strips；
Step 2, will be equal with the strip chip length, the first glass cover-plate that width is less than predetermined width uses UV glue
Water is bonded in the upper surface of the strip chip, the bonding location of first glass cover-plate guarantee the strip chip cutting at
After single chip, predetermined width described in the output end silicon base chip upper surface of the single chip does not cover first glass cover
Plate；
Step 3, the strip chip is heated to 110 DEG C ± 10 DEG C；
Step 4, will be equal with the strip chip length, the second glass cover-plate that width is equal to the predetermined width uses
The upper surface that paraffin is bonded in the strip chip does not cover at first glass cover-plate position, so that first glass cover
The upper surface of the strip chip is completely covered in plate and second glass cover-plate just；
Step 5, two are ground on grinder and be polished in two end faces in strip Chip-wide direction
End face from the upper surface of first glass cover-plate respectively at different predetermined angles so that the input end face of the single chip
With output end face from the upper surface of first glass cover-plate respectively at different predetermined angles；
Step 6, the angle and appearance for detecting the strip chip then follow the steps 7 if qualified；
Step 7, by the strip chip cutting at the single chip；
Step 8, the size of the single chip is detected, if qualified, thens follow the steps 9；
Step 9, the single chip is impregnated into the first preset time in 90 DEG C of Micro-90 cleaning solutions, then in clear water
The second preset time is impregnated, to wash second glass cover-plate in the single chip；
Step 10, the size and appearance for detecting the single chip, if qualified, qualification storage.
The beneficial effects of the present invention are: two end faces in strip Chip-wide direction are ground and are thrown on grinder
Light to two end faces from the upper surface of the first glass cover-plate respectively at different predetermined angles, to realize the input of single chip
End face and output end face are from the upper surface of the first glass cover-plate respectively at different predetermined angles；Strip chip size is larger, just
In grinding and polishing；And angle detection is carried out to two end faces in strip Chip-wide direction, that is, it can be achieved at the same time to multiple lists
The detection of the angle of chips input end face and output end face, improves detection efficiency；In addition, if the detection of strip chip angle does not conform to
Lattice need to do over again, and can integrally do over again, and do over again high-efficient.The upper surface that second glass cover-plate is bonded in strip chip is not covered
At one glass cover-plate position, to guarantee strip chip during the grinding process, silicon base chip upper surface is all covered with glass cover-plate,
Glass cover-plate plays certain protective role to silicon base chip, and the fraction defectives such as chipping in process of lapping, crackle are effectively reduced；In addition, the
Two glass cover-plates are bonded on strip chip using paraffin, after later period strip chip cutting, by single chip in 90 DEG C of Micro-
The first preset time is impregnated in 90 cleaning solutions, then impregnates the second preset time in clear water, that is, is completely removed in single chip
The second glass cover-plate, structure and performance to single chip will not generate any adverse effect.
Based on the above technical solution, the present invention can also be improved as follows.
Further, the cutting in the step 1 and the step 7 is all made of the progress of hi-precision cutting machine.
Further, the step 6 further includes, when detecting the angle and unqualified appearance of the strip chip, judging institute
State whether strip chip can do over again；It is to then follow the steps 5；It is no, then the strip chip rejection is put in storage.
Further, the step 8 further includes, when detecting the off-dimension of the single chip, by the single core
Piece scraps storage.
Further, the step 10 further includes, will be described when detecting the size and unqualified appearance of the single chip
Single chip scraps storage.
Further, first preset time and the second preset time are respectively 90 minutes and 30 minutes.
Detailed description of the invention
Fig. 1 is a kind of process of the grinding and cutting process of low pass channel array waveguide grating multiplexer chip of the present invention
Figure；
Fig. 2 is strip core in a kind of grinding and cutting process of low pass channel array waveguide grating multiplexer chip of the present invention
The structural schematic diagram of piece bonding the first glass cover-plate and the second glass cover-plate；
Fig. 3 is four-way in a kind of grinding and cutting process of low pass channel array waveguide grating multiplexer chip of the present invention
The structural schematic diagram of arrayed waveguide grating multiplexer chip.
Specific embodiment
The principle and features of the present invention will be described below with reference to the accompanying drawings, and the given examples are served only to explain the present invention, and
It is non-to be used to limit the scope of the invention.
As shown in Figure 1, a kind of grinding and cutting process of low pass channel array waveguide grating multiplexer chip, including it is as follows
Step:
Step 1, silicon base chip wafer is cut into chip into strips；
Step 2, will be equal with the strip chip length, the first glass cover-plate that width is less than predetermined width uses UV glue
Water is bonded in the upper surface of the strip chip, the bonding location of first glass cover-plate guarantee the strip chip cutting at
After single chip, predetermined width described in the output end silicon base chip upper surface of the single chip does not cover first glass cover
Plate；
Step 3, the strip chip is heated to 110 DEG C ± 10 DEG C；
Step 4, will be equal with the strip chip length, the second glass cover-plate that width is equal to the predetermined width uses
The upper surface that paraffin is bonded in the strip chip does not cover at first glass cover-plate position, so that first glass cover
The upper surface of the strip chip is completely covered in plate and second glass cover-plate just；
Step 5, two are ground on grinder and be polished in two end faces in strip Chip-wide direction
End face from the upper surface of first glass cover-plate respectively at different predetermined angles so that the input end face of the single chip
With output end face from the upper surface of first glass cover-plate respectively at different predetermined angles；
Step 6, the angle and appearance for detecting the strip chip then follow the steps 7 if qualified；
Step 7, by the strip chip cutting at the single chip；
Step 8, the size of the single chip is detected, if qualified, thens follow the steps 9；
Step 9, the single chip is impregnated into the first preset time in 90 DEG C of Micro-90 cleaning solutions, then in clear water
The second preset time is impregnated, to wash second glass cover-plate in the single chip；
Step 10, the size and appearance for detecting the single chip, if qualified, qualification storage.
Two end faces and first are ground on grinder and be polished in two end faces in strip Chip-wide direction
The upper surface of glass cover-plate is respectively at different predetermined angles, to realize the input end face and output end face and of single chip
The upper surface of one glass cover-plate is respectively at different predetermined angles；Strip chip size is larger, convenient for grinding and polishing；And to item
Two end faces in shape Chip-wide direction carry out angle detection, that is, can be achieved at the same time to multiple single chip input end faces and output
The angle of end face detects, and improves detection efficiency；In addition, need to do over again, can integrally do over again if the detection of strip chip angle is unqualified,
It does over again high-efficient.The upper surface that second glass cover-plate is bonded in strip chip is not covered at the first glass cover-plate position, thus
Guarantee strip chip during the grinding process, silicon base chip upper surface is all covered with glass cover-plate, and glass cover-plate plays silicon base chip
To certain protective role, the fraction defectives such as chipping in process of lapping, crackle are effectively reduced；In addition, the second glass cover-plate is viscous using paraffin
It connects on strip chip, after later period strip chip cutting, it is pre- that single chip is impregnated to first in 90 DEG C of Micro-90 cleaning solutions
If the time, then the second preset time is impregnated in clear water, that is, the second glass cover-plate being completely removed in single chip, to single
The structure and performance of chip will not generate any adverse effect.
Cutting in the step 1 and the step 7 is all made of the progress of hi-precision cutting machine, guarantees cutting accuracy.
The step 6 further includes, when detecting the angle and unqualified appearance of the strip chip, judging the strip core
Whether piece can do over again；It is to then follow the steps 5；It is no, then the strip chip rejection is put in storage.To the strip core that can be done over again
Piece carries out reworked processing, reduces the scrappage of strip chip.
The step 8 further includes, when detecting the off-dimension of the single chip, by the single chip scrap into
Library.
The step 10 further includes, when detecting the size and unqualified appearance of the single chip, by the single core
Piece scraps storage.
First preset time and the second preset time are respectively 90 minutes and 30 minutes；Single core of removal is effectively ensured
Second glass cover-plate of on piece.
Embodiment: the grinding and cutting of four-way arrayed waveguide grating multiplexer chip
Step 1, by the cutting of silicon base chip wafer, chip, the width value of this strip chip are single four-way battle array into strips
The length value of 8.6~9.2mm of length of train wave Waveguide Grating multiplexex chip, this strip chip are more than or equal to single four-way
Twice of 1.4~1.75mm of width of channel array waveguide grating multiplexer chip, the height value of this strip chip are single
Four-way arrayed waveguide grating multiplexer chip does not include the height 1mm of glass cover-plate；
Step 2, will be equal with this strip chip length, width is highly 0.138~0.142mm less than 0.9~1.1mm
The first glass cover-plate using UV glue be bonded in the left end of the upper surface of this strip chip, as shown in Figure 2；
Step 3, this strip chip is heated to 110 DEG C ± 10 DEG C；
Step 4, will be equal with this strip chip length, the second glass cover-plate that width is 0.9~1.1mm is viscous using paraffin
The right end in the upper surface of this strip chip is connect, as shown in Figure 2；
Step 5, left side is ground on grinder and be polished in two end faces in this strip Chip-wide direction
Angle with the upper surface of the first glass cover-plate is 81.7 °~82.3 °, the angle of the upper surface of right side and the first glass cover-plate
It is 40.7 °~41.3 °；So that an input end face (i.e. left side in Fig. 3 for single four-way arrayed waveguide grating multiplexer chip
End face) it with the angle of the upper surface of the first glass cover-plate is 81.7 °~82.3 °, output end face (i.e. right side in Fig. 3) and the
The angle of the upper surface of one glass cover-plate is 40.7 °~41.3 °, as shown in figure 3, since the first glass cover-plate is parallel flat,
The angle of the upper surface of output end face and the first glass cover-plate is equal to the angle of output end face and silicon base chip upper surface；
Step 6, the angle and appearance for detecting this strip chip then follow the steps 7 if qualified；If unqualified, sentence
Whether this strip chip that breaks can do over again；It is to then follow the steps 5, it is no, then this strip chip rejection is put in storage；In specific implementation,
Whether this strip chip can do over again, according to the angle of the upper surface of input end face and output end face and the first glass cover-plate come really
It is fixed；If two angles are excessive, it can do over again, return step 5 is further ground and polished, so that angle subtracts
It is small to arrive standard value；If there is an angle too small, then can not do over again；
Step 7, this strip chip dotted line along Fig. 2 is cut into single chip；
Step 8, the size of single chip is detected, if qualified, thens follow the steps 9；It, will be underproof if unqualified
Single chip scraps storage；
Step 9, qualified single chip is impregnated 90 minutes in 90 DEG C of Micro-90 cleaning solutions, then is impregnated in clear water
30 minutes, to wash the second glass cover-plate in this single chip；
Step 10, the size and appearance for detecting single chip, if qualified, qualification storage；If unqualified, scrap
Storage.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (6)
1. a kind of grinding and cutting process of low pass channel array waveguide grating multiplexer chip, which is characterized in that including as follows
Step:
Step 1, silicon base chip wafer is cut into chip into strips；
Step 2, will be equal with the strip chip length, the first glass cover-plate that width is less than predetermined width is viscous using UV glue
It connects in the upper surface of the strip chip, the bonding location of first glass cover-plate guarantees the strip chip cutting at single
After chip, predetermined width described in the output end silicon base chip upper surface of the single chip does not cover first glass cover-plate；
Step 3, the strip chip is heated to 110 DEG C ± 10 DEG C；
Step 4, will be equal with the strip chip length, the second glass cover-plate that width is equal to the predetermined width uses paraffin
The upper surface for being bonded in the strip chip does not cover at first glass cover-plate position so that first glass cover-plate and
The upper surface of the strip chip is completely covered in second glass cover-plate just；
Step 5, two end faces are ground on grinder and be polished in two end faces in strip Chip-wide direction
From the upper surface of first glass cover-plate respectively at different predetermined angles, so that the input end face of the single chip and defeated
End face is from the upper surface of first glass cover-plate respectively at different predetermined angles out；
Step 6, the angle and appearance for detecting the strip chip then follow the steps 7 if qualified；
Step 7, by the strip chip cutting at the single chip；
Step 8, the size of the single chip is detected, if qualified, thens follow the steps 9；
Step 9, the single chip is impregnated into the first preset time in 90 DEG C of Micro-90 cleaning solutions, then is impregnated in clear water
Second preset time, to wash second glass cover-plate in the single chip；
Step 10, the size and appearance for detecting the single chip, if qualified, qualification storage.
2. a kind of grinding and cutting process of low pass channel array waveguide grating multiplexer chip according to claim 1,
It is characterized in that, the cutting in the step 1 and the step 7, is all made of the progress of hi-precision cutting machine.
3. a kind of grinding and cutting process of low pass channel array waveguide grating multiplexer chip according to claim 1,
It is characterized in that, the step 6 further includes, when detecting the angle and unqualified appearance of the strip chip, judging the strip
Whether chip can do over again；It is to then follow the steps 5；It is no, then the strip chip rejection is put in storage.
4. a kind of grinding and cutting process of low pass channel array waveguide grating multiplexer chip according to claim 1,
It is characterized in that, the step 8 further includes, when detecting the off-dimension of the single chip, the single chip being scrapped
Storage.
5. a kind of grinding and cutting process of low pass channel array waveguide grating multiplexer chip according to claim 1,
It is characterized in that, the step 10 further includes, when detecting the size and unqualified appearance of the single chip, by the single core
Piece scraps storage.
6. according to claim 1 to a kind of 5 any grinding and cuttings of low pass channel array waveguide grating multiplexer chip
Method, which is characterized in that first preset time and the second preset time are respectively 90 minutes and 30 minutes.
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| CN110451009B (en) * | 2019-07-26 | 2020-11-24 | 中国科学院长春光学精密机械与物理研究所 | Method for protecting diffraction grating |
| CN113664622A (en) * | 2021-08-20 | 2021-11-19 | 四川天邑康和通信股份有限公司 | AWG type optical fiber array grinding method for wavelength division multiplexer |
| CN113552667A (en) * | 2021-09-18 | 2021-10-26 | 武汉驿路通科技股份有限公司 | Grinding and bonding method of waveguide array grating chip |
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| CN1109757C (en) * | 2000-10-10 | 2003-05-28 | 陆祖宏 | Compound micro path array chip and its preparing method |
| JP3892703B2 (en) * | 2001-10-19 | 2007-03-14 | 富士通株式会社 | Semiconductor substrate jig and semiconductor device manufacturing method using the same |
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Denomination of invention: Grinding and cutting method for chip of low-channel arrayed waveguide grating wavelength division multiplexer Effective date of registration: 20200618 Granted publication date: 20190816 Pledgee: Guanggu Branch of Wuhan Rural Commercial Bank Co.,Ltd. Pledgor: WUHAN YILUT TECHNOLOGY Co.,Ltd. Registration number: Y2020420000033 |
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Denomination of invention: A grinding and cutting method for low channel arrayed waveguide grating wavelength division multiplexer chip Effective date of registration: 20210827 Granted publication date: 20190816 Pledgee: Guanggu Branch of Wuhan Rural Commercial Bank Co.,Ltd. Pledgor: WUHAN YILUT TECHNOLOGY Co.,Ltd. Registration number: Y2021420000082 |
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Denomination of invention: A kind of grinding and cutting method of low-channel arrayed waveguide grating wavelength division multiplexer chip Effective date of registration: 20220829 Granted publication date: 20190816 Pledgee: Guanggu Branch of Wuhan Rural Commercial Bank Co.,Ltd. Pledgor: WUHAN YILUT TECHNOLOGY Co.,Ltd. Registration number: Y2022420000279 |
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Date of cancellation: 20230922 Granted publication date: 20190816 Pledgee: Guanggu Branch of Wuhan Rural Commercial Bank Co.,Ltd. Pledgor: WUHAN YILUT TECHNOLOGY Co.,Ltd. Registration number: Y2022420000279 |
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Denomination of invention: A Grinding and Cutting Method for Low Channel Array Waveguide Grating Wavelength Division Multiplexer Chip Effective date of registration: 20230928 Granted publication date: 20190816 Pledgee: Guanggu Branch of Wuhan Rural Commercial Bank Co.,Ltd. Pledgor: WUHAN YILUT TECHNOLOGY Co.,Ltd. Registration number: Y2023980059838 |