CN113664622A - AWG type optical fiber array grinding method for wavelength division multiplexer - Google Patents
AWG type optical fiber array grinding method for wavelength division multiplexer Download PDFInfo
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- 239000013307 optical fiber Substances 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000005498 polishing Methods 0.000 claims abstract description 74
- 239000000843 powder Substances 0.000 claims abstract description 70
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000835 fiber Substances 0.000 claims description 25
- 239000000463 material Substances 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000012797 qualification Methods 0.000 abstract description 6
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- 238000004891 communication Methods 0.000 description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910010271 silicon carbide Inorganic materials 0.000 description 8
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- 238000005516 engineering process Methods 0.000 description 6
- 239000006004 Quartz sand Substances 0.000 description 4
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- 230000003647 oxidation Effects 0.000 description 4
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical group [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 239000000725 suspension Substances 0.000 description 4
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/25—Preparing the ends of light guides for coupling, e.g. cutting
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
- G02B6/293—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
- G02B6/29304—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means operating by diffraction, e.g. grating
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention discloses a method for grinding an AWG type optical fiber array of a wavelength division multiplexer, which comprises the following steps: s1: pre-polishing the grinding machine; s2: proportioning the grinding powder, namely proportioning the grinding powder and water according to the weight ratio of 1: 10; s3: feeding the AWG type optical fiber array; s4: pouring the proportioned grinding powder into a grinder, and setting the rotating speed and the grinding time; s5: proportioning polishing powder, namely proportioning the polishing powder and water according to the weight ratio of 1: 15; s6: pouring the proportioned polishing powder into a grinding machine, and setting the rotating speed and the polishing time; s7: and finishing grinding. The invention can improve the qualification rate of the AWG type optical fiber array grinding process, improve the production efficiency of the process and reduce the consumable material.
Description
Technical Field
The invention relates to the technical field of optical fiber manufacturing, in particular to a method for grinding an AWG type optical fiber array of a wavelength division multiplexer.
Background
Optical fiber communications (optical fiber communications) stands out from optical communications, has become one of the main pillars of modern communications, and plays a very important role in modern telecommunication networks. As an emerging technology, optical fiber communication has a fast development speed in recent years, and a wide application range, which is rare in communication history, is also an important mark of the world new technology revolution and a main transmission tool of various information in the future information society.
The optical fiber is called optical fiber for short. Optical fiber communication is a communication mode in which light waves are used as information carriers and optical fibers are used as transmission media. In principle, the basic material elements constituting optical fiber communication are an optical fiber, a light source, and a photodetector. In addition to optical fibers classified by manufacturing process, material composition and optical characteristics, optical fibers are classified by their applications, and can be classified into optical fibers for communication and optical fibers for sensing. The transmission medium optical fiber is divided into general and special optical fibers, and the functional device optical fiber is an optical fiber for completing the functions of light wave amplification, shaping, frequency division, frequency multiplication, modulation, optical oscillation and the like, and is often presented in the form of a certain functional device.
Optical fiber communication is a communication method that uses light waves as carrier waves and optical fibers as transmission media to transmit information from one place to another, and is called "wired" optical communication. Nowadays, optical fiber has become the main transmission mode in world communication due to its wide transmission band, high interference immunity and reduced signal attenuation, which is far superior to the transmission of cable and microwave communication.
With the progress of optical fiber communication, for example, in optical modules and active optical cables for various optical communications: QSFP/QSFP +, SNAP12, HDMIAOC, AWG (Arrayed Waveguide Gratings, also called waveguiding Gratings), all need to use fiber arrays, AWG is composed of two multiport couplers and array waveguides connecting them, can be used as N1 wavelength division multiplexer, 1N wavelength division multiplexer, N type wavelength router, etc., is reciprocal, has the characteristics of many channels, low insertion loss, flat pass band, and easy integration on one substrate. However, the prior AWG type optical fiber array grinding process has the technical problems of high rejection rate, low efficiency, high material consumption and the like.
Disclosure of Invention
In order to solve the above problems, the present invention provides a method for grinding an AWG type optical fiber array of a wavelength division multiplexer, the method comprising the steps of:
s1: pre-polishing the grinding machine;
s2: proportioning the grinding powder, namely proportioning the grinding powder and water according to the weight ratio of 1: 10;
s3: feeding the AWG type optical fiber array;
s4: pouring the proportioned grinding powder into a grinder, and setting the rotating speed and the grinding time;
s5: proportioning polishing powder, namely proportioning the polishing powder and water according to the weight ratio of 1: 15;
s6: pouring the proportioned polishing powder into a grinding machine, and setting the rotating speed and the polishing time;
s7: and finishing grinding.
Specifically, in step S1, the grinder is idled for 5 revolutions to perform pre-grinding.
Specifically, step S3 is to perform self-check after the AWG fiber array is fed, including checking that the AWG fiber array cover plate is outward, and the side surface of the AWG fiber array abuts against the grinding fixture.
Specifically, in step S4, the rotation speed is set to 1 rpm per second, the rotation speed is set to 5 rpm, the grinding is performed for 5 minutes, the rotation speed is set to 15 rpm, and the grinding is performed for 15-20 minutes.
Specifically, in step S4, the rotation speed is set to 1 rpm per second, the rotation speed is idle for 5 rpm, the grinding is performed for 5 minutes, the rotation speed is idle for 15 rpm, and the grinding is performed for 16-19 minutes.
Specifically, step S6 sets the rotation speed to 1 revolution per second, idles for 15 revolutions, and polishes for 20-25 minutes.
Specifically, step S6 sets the rotation speed to 1 revolution per second, idles for 15 revolutions, and polishes for 21-24 minutes.
Specifically, after the polishing in step S7 is completed, the octave surface and the end surface of the AWG-type optical fiber array are detected.
The invention has the beneficial effects that: the qualification rate of the AWG type optical fiber array grinding process can be improved, the production efficiency of the process is improved, and the consumable material is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a flow chart of the present invention;
FIG. 2 is a schematic diagram of an AWG type optical fiber array structure;
in the figure: 1-cover plate, 2-tail glue, 3-optical fiber ribbon, 4-V-Groovo substrate and 5-head glue.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "outward" and "close" indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed in use, and are used for convenience in describing the present invention and for simplicity in description, but do not indicate or imply that the devices or elements that are referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it is also to be noted that, unless otherwise explicitly specified or limited, the term "connected" is to be interpreted broadly, e.g. as a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Example 1:
referring to fig. 1-2, a method for grinding AWG type optical fiber array of a wavelength division multiplexer includes the steps of:
s1: pre-polishing the grinding machine;
s2: proportioning the grinding powder, namely proportioning the grinding powder and water according to the weight ratio of 1: 10;
s3: feeding the AWG type optical fiber array;
s4: pouring the proportioned grinding powder into a grinder, and setting the rotating speed and the grinding time;
s5: proportioning polishing powder, namely proportioning the polishing powder and water according to the weight ratio of 1: 15;
s6: pouring the proportioned polishing powder into a grinding machine, and setting the rotating speed and the polishing time;
s7: and finishing grinding.
Further, in the present embodiment, the grinder is idled for 5 revolutions at step S1 to perform pre-grinding.
Further, in this embodiment, step S3 is performed by performing a self-check after the AWG fiber array is loaded, which includes checking that the AWG fiber array cover is outward and the side of the AWG fiber array is close to the grinding fixture.
Further, in this embodiment, step S4 sets the rotation speed to 1 rpm, idles for 5 rpm, grinds for 5 minutes, idles for 15 rpm, and grinds for 15 minutes. The grinding machine can be idled to uniformly distribute the grinding powder, so that the grinding work is more convenient.
Further, in the present embodiment, step S6 sets the rotation speed to 1 revolution per second, idles for 15 revolutions, and polishes for 20 minutes. The grinding machine is idled to uniformly distribute polishing powder, so that the polishing work is more convenient.
Further, in this embodiment, after the polishing in step S7 is completed, the octave surface and the end surface of the AWG-type optical fiber array are inspected.
Further, in the embodiment, the grinder adopts Shenzhen research technology, and the model is YRP-380P type grinder.
Further, in this embodiment, the grinding powder is PGC1500, and the PGC series grinding powder is silicon carbide, which is also called carborundum or refractory sand, prepared by high-temperature smelting quartz sand, petroleum coke (or coal coke), wood dust and other raw materials in a resistance furnace. Has the characteristics of high hardness, excellent heat conduction and electric conduction performance and oxidation resistance at high temperature.
Furthermore, in this embodiment, the polishing powder is a PR1600 type polishing powder, which is a high-quality brownish red polishing powder, and since the crystal grains are fine and uniform and the suspension performance is good, a high polishing efficiency can be obtained at a low concentration, and the polished lens has a clean surface without scratches, is suitable for components with high polishing precision requirements, is suitable for polishing soft and hardware materials, and has good versatility.
Further, the AWG (Arrayed Waveguide grating) includes an optical Fiber Array (FA), a single fiber, and a chip. The AWG type optical fiber array structure is shown in figure 2 and comprises a V-Groovo substrate 4, wherein a cover plate 1 and tail rubber 2 are arranged on the V-Groovo substrate 4, the cover plate 1 is connected with the tail rubber 2, a cavity is formed between the cover plate 1 and the V-Groovo substrate 4, an optical fiber ribbon 3 is arranged in the cavity, and head rubber 5 is arranged between the optical fiber ribbon 3 and the cover plate 1 and between the optical fiber ribbon 3 and the V-Groovo substrate 4.
The qualification rate of the AWG type optical fiber array product produced by the embodiment can reach 96 percent (the original process is 90 percent), the process production efficiency is improved by 35 percent, and the consumable material is saved by 42 percent.
Example 2:
a method for grinding AWG type optical fiber array of wavelength division multiplexer includes the following steps:
s1: pre-polishing the grinding machine;
s2: proportioning the grinding powder, namely proportioning the grinding powder and water according to the weight ratio of 1: 10;
s3: feeding the AWG type optical fiber array;
s4: pouring the proportioned grinding powder into a grinder, and setting the rotating speed and the grinding time;
s5: proportioning polishing powder, namely proportioning the polishing powder and water according to the weight ratio of 1: 15;
s6: pouring the proportioned polishing powder into a grinding machine, and setting the rotating speed and the polishing time;
s7: and finishing grinding.
Further, in the present embodiment, the grinder is idled for 5 revolutions at step S1 to perform pre-grinding.
Further, in this embodiment, step S3 is performed by performing a self-check after the AWG fiber array is loaded, which includes checking that the AWG fiber array cover is outward and the side of the AWG fiber array is close to the grinding fixture.
Further, in this embodiment, step S4 sets the rotation speed to 1 rpm, idles for 5 rpm, grinds for 5 minutes, idles for 15 rpm, and grinds for 16 minutes. The grinding machine can be idled to uniformly distribute the grinding powder, so that the grinding work is more convenient.
Further, in the present embodiment, step S6 sets the rotation speed to 1 revolution per second, idles for 15 revolutions, and polishes for 21 minutes. The grinding machine is idled to uniformly distribute polishing powder, so that the polishing work is more convenient.
Further, in this embodiment, after the polishing in step S7 is completed, the octave surface and the end surface of the AWG-type optical fiber array are inspected.
Further, in the embodiment, the grinder adopts Shenzhen research technology, and the model is YRP-380P type grinder.
Further, in this embodiment, the grinding powder is PGC1500, and the PGC series grinding powder is silicon carbide, which is also called carborundum or refractory sand, prepared by high-temperature smelting quartz sand, petroleum coke (or coal coke), wood dust and other raw materials in a resistance furnace. Has the characteristics of high hardness, excellent heat conduction and electric conduction performance and oxidation resistance at high temperature.
Furthermore, in this embodiment, the polishing powder is a PR1600 type polishing powder, which is a high-quality brownish red polishing powder, and since the crystal grains are fine and uniform and the suspension performance is good, a high polishing efficiency can be obtained at a low concentration, and the polished lens has a clean surface without scratches, is suitable for components with high polishing precision requirements, is suitable for polishing soft and hardware materials, and has good versatility.
Further, the AWG (Arrayed Waveguide grating) includes an optical Fiber Array (FA), a single fiber, and a chip. The AWG type optical fiber array structure is shown in figure 2 and comprises a V-Groovo substrate 4, wherein a cover plate 1 and tail rubber 2 are arranged on the V-Groovo substrate 4, the cover plate 1 is connected with the tail rubber 2, a cavity is formed between the cover plate 1 and the V-Groovo substrate 4, an optical fiber ribbon 3 is arranged in the cavity, and head rubber 5 is arranged between the optical fiber ribbon 3 and the cover plate 1 and between the optical fiber ribbon 3 and the V-Groovo substrate 4.
The qualification rate of the AWG type optical fiber array product produced by the embodiment can reach 96 percent (the original process is 90 percent), the process production efficiency is improved by 34 percent, and the consumable material is saved by 40 percent.
Example 3:
a method for grinding AWG type optical fiber array of wavelength division multiplexer includes the following steps:
s1: pre-polishing the grinding machine;
s2: proportioning the grinding powder, namely proportioning the grinding powder and water according to the weight ratio of 1: 10;
s3: feeding the AWG type optical fiber array;
s4: pouring the proportioned grinding powder into a grinder, and setting the rotating speed and the grinding time;
s5: proportioning polishing powder, namely proportioning the polishing powder and water according to the weight ratio of 1: 15;
s6: pouring the proportioned polishing powder into a grinding machine, and setting the rotating speed and the polishing time;
s7: and finishing grinding.
Further, in the present embodiment, the grinder is idled for 5 revolutions at step S1 to perform pre-grinding.
Further, in this embodiment, step S3 is performed by performing a self-check after the AWG fiber array is loaded, which includes checking that the AWG fiber array cover is outward and the side of the AWG fiber array is close to the grinding fixture.
Further, in this embodiment, step S4 sets the rotation speed to 1 rpm, idles for 5 rpm, grinds for 5 minutes, idles for 15 rpm, and grinds for 19 minutes. The grinding machine can be idled to uniformly distribute the grinding powder, so that the grinding work is more convenient.
Further, in the present embodiment, step S6 sets the rotation speed to 1 revolution per second, idles for 15 revolutions, and polishes for 24 minutes. The grinding machine is idled to uniformly distribute polishing powder, so that the polishing work is more convenient.
Further, in this embodiment, after the polishing in step S7 is completed, the octave surface and the end surface of the AWG-type optical fiber array are inspected.
Further, in the embodiment, the grinder adopts Shenzhen research technology, and the model is YRP-380P type grinder.
Further, in this embodiment, the grinding powder is PGC1500, and the PGC series grinding powder is silicon carbide, which is also called carborundum or refractory sand, prepared by high-temperature smelting quartz sand, petroleum coke (or coal coke), wood dust and other raw materials in a resistance furnace. Has the characteristics of high hardness, excellent heat conduction and electric conduction performance and oxidation resistance at high temperature.
Furthermore, in this embodiment, the polishing powder is a PR1600 type polishing powder, which is a high-quality brownish red polishing powder, and since the crystal grains are fine and uniform and the suspension performance is good, a high polishing efficiency can be obtained at a low concentration, and the polished lens has a clean surface without scratches, is suitable for components with high polishing precision requirements, is suitable for polishing soft and hardware materials, and has good versatility.
Further, the AWG (Arrayed Waveguide grating) includes an optical Fiber Array (FA), a single fiber, and a chip. The AWG type optical fiber array structure is shown in figure 2 and comprises a V-Groovo substrate 4, wherein a cover plate 1 and tail rubber 2 are arranged on the V-Groovo substrate 4, the cover plate 1 is connected with the tail rubber 2, a cavity is formed between the cover plate 1 and the V-Groovo substrate 4, an optical fiber ribbon 3 is arranged in the cavity, and head rubber 5 is arranged between the optical fiber ribbon 3 and the cover plate 1 and between the optical fiber ribbon 3 and the V-Groovo substrate 4.
The qualification rate of the AWG type optical fiber array product produced by the embodiment can reach 97% (the original process is 90%), the process production efficiency is improved by 32%, and consumables are saved by 40%.
Example 4:
a method for grinding AWG type optical fiber array of wavelength division multiplexer includes the following steps:
s1: pre-polishing the grinding machine;
s2: proportioning the grinding powder, namely proportioning the grinding powder and water according to the weight ratio of 1: 10;
s3: feeding the AWG type optical fiber array;
s4: pouring the proportioned grinding powder into a grinder, and setting the rotating speed and the grinding time;
s5: proportioning polishing powder, namely proportioning the polishing powder and water according to the weight ratio of 1: 15;
s6: pouring the proportioned polishing powder into a grinding machine, and setting the rotating speed and the polishing time;
s7: and finishing grinding.
Further, in the present embodiment, the grinder is idled for 5 revolutions at step S1 to perform pre-grinding.
Further, in this embodiment, step S3 is performed by performing a self-check after the AWG fiber array is loaded, which includes checking that the AWG fiber array cover is outward and the side of the AWG fiber array is close to the grinding fixture.
Further, in this embodiment, step S4 sets the rotation speed to 1 rpm, idles for 5 rpm, grinds for 5 minutes, idles for 15 rpm, and grinds for 20 minutes. The grinding machine can be idled to uniformly distribute the grinding powder, so that the grinding work is more convenient.
Further, in the present embodiment, step S6 sets the rotation speed to 1 revolution per second, idles for 15 revolutions, and polishes for 25 minutes. The grinding machine is idled to uniformly distribute polishing powder, so that the polishing work is more convenient.
Further, in this embodiment, after the polishing in step S7 is completed, the octave surface and the end surface of the AWG-type optical fiber array are inspected.
Further, in the embodiment, the grinder adopts Shenzhen research technology, and the model is YRP-380P type grinder.
Further, in this embodiment, the grinding powder is PGC1500, and the PGC series grinding powder is silicon carbide, which is also called carborundum or refractory sand, prepared by high-temperature smelting quartz sand, petroleum coke (or coal coke), wood dust and other raw materials in a resistance furnace. Has the characteristics of high hardness, excellent heat conduction and electric conduction performance and oxidation resistance at high temperature.
Furthermore, in this embodiment, the polishing powder is a PR1600 type polishing powder, which is a high-quality brownish red polishing powder, and since the crystal grains are fine and uniform and the suspension performance is good, a high polishing efficiency can be obtained at a low concentration, and the polished lens has a clean surface without scratches, is suitable for components with high polishing precision requirements, is suitable for polishing soft and hardware materials, and has good versatility.
Further, the AWG (Arrayed Waveguide grating) includes an optical Fiber Array (FA), a single fiber, and a chip. The AWG type optical fiber array structure is shown in figure 2 and comprises a V-Groovo substrate 4, wherein a cover plate 1 and tail rubber 2 are arranged on the V-Groovo substrate 4, the cover plate 1 is connected with the tail rubber 2, a cavity is formed between the cover plate 1 and the V-Groovo substrate 4, an optical fiber ribbon 3 is arranged in the cavity, and head rubber 5 is arranged between the optical fiber ribbon 3 and the cover plate 1 and between the optical fiber ribbon 3 and the V-Groovo substrate 4.
The qualification rate of the AWG type optical fiber array product produced by the embodiment can reach 98 percent (the original process is 90 percent), the process production efficiency is improved by 30 percent, and the consumable material is saved by 40 percent.
It should be noted that, for simplicity of description, the foregoing embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the present application is not limited by the order of acts, as some steps may occur in other orders or concurrently depending on the application. Further, those skilled in the art will appreciate that the embodiments described in the specification are presently preferred and that no particular act is required to implement the invention.
In the above embodiments, the basic principle and the main features of the present invention and the advantages of the present invention are described. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, and that modifications and variations can be made by one skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. A method for grinding an AWG type optical fiber array of a wavelength division multiplexer is characterized by comprising the following steps:
s1: pre-polishing the grinding machine;
s2: proportioning the grinding powder, namely proportioning the grinding powder and water according to the weight ratio of 1: 10;
s3: feeding the AWG type optical fiber array;
s4: pouring the proportioned grinding powder into a grinder, and setting the rotating speed and the grinding time;
s5: proportioning polishing powder, namely proportioning the polishing powder and water according to the weight ratio of 1: 15;
s6: pouring the proportioned polishing powder into a grinding machine, and setting the rotating speed and the polishing time;
s7: and finishing grinding.
2. The method for grinding AWG type optical fiber array of wavelength division multiplexer according to claim 1, wherein step S1 is to idle the grinder for 5 revolutions for pre-grinding.
3. The method for grinding AWG type optical fiber array of wavelength division multiplexer according to claim 1, wherein step S3 is a self-check after the AWG type optical fiber array is loaded, which includes checking that the cover plate (1) of AWG type optical fiber array is outward, and the side of AWG type optical fiber array is tightly close to the grinding fixture.
4. The method for lapping AWG type fiber array of wavelength division multiplexer according to claim 1, wherein step S4 is to set the rotation speed at 1 rpm, 5 rpm idle, 5 minutes lapping, 15 rpm idle, and 15-20 minutes lapping.
5. The method for lapping AWG type fiber array of wavelength division multiplexer according to claim 1, wherein step S4 is to set the rotation speed at 1 rpm, 5 rpm idle, 5 minutes lapping, 15 rpm idle, and 16-19 minutes lapping.
6. The method for lapping the AWG type fiber array of a wavelength division multiplexer according to claim 1, wherein step S6 is performed by setting the rotation speed to 1 revolution per second, idling for 15 revolutions, and polishing for 20-25 minutes.
7. The method for lapping the AWG type fiber array of a wavelength division multiplexer according to claim 1, wherein step S6 is performed by setting the rotation speed to 1 revolution per second, idling for 15 revolutions, and polishing for 21-24 minutes.
8. The method of claim 1, wherein after the step S7, the octave and end faces of the AWG fiber array are inspected.
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Application publication date: 20211119 |