CN108347866B - Heat radiation plate - Google Patents
Heat radiation plate Download PDFInfo
- Publication number
- CN108347866B CN108347866B CN201810275799.3A CN201810275799A CN108347866B CN 108347866 B CN108347866 B CN 108347866B CN 201810275799 A CN201810275799 A CN 201810275799A CN 108347866 B CN108347866 B CN 108347866B
- Authority
- CN
- China
- Prior art keywords
- cavity
- heat
- medium flow
- medium
- pipe joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005855 radiation Effects 0.000 title abstract description 9
- 239000007788 liquid Substances 0.000 claims abstract description 65
- 238000005192 partition Methods 0.000 claims abstract description 40
- 239000002826 coolant Substances 0.000 claims abstract description 34
- 238000005452 bending Methods 0.000 claims abstract description 32
- 230000017525 heat dissipation Effects 0.000 claims abstract description 24
- 230000000903 blocking effect Effects 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000004891 communication Methods 0.000 claims description 7
- 230000002528 anti-freeze Effects 0.000 claims description 3
- 239000003507 refrigerant Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- -1 antifreeze Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000276425 Xiphophorus maculatus Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/202—Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Abstract
In order to solve the problem that the temperature difference of different positions of the existing heat dissipation plate is large, so that the temperature difference of different positions of a heat source is caused, the invention provides a heat dissipation plate which comprises a heat conduction shell and a partition plate, wherein a cavity for cooling medium to flow is formed in the heat conduction shell; the heat conduction shell is provided with a first liquid port and a second liquid port; the partition plate comprises a bending part, a plurality of first medium flow passages are formed on one side surface of the bending part, a plurality of second medium flow passages are formed on the other side surface of the bending part, and the first medium flow passages and the second medium flow passages are arranged at intervals side by side. The heat radiation plate provided by the invention can promote heat exchange of the internal cooling medium, reduce the working temperature difference of the heat source contacted with the surface of the heat radiation plate, and is beneficial to improving the working efficiency of the heat source.
Description
Technical Field
The invention belongs to the technical field of heat management equipment, and particularly relates to a heat dissipation plate.
Background
In the fields of electric automobiles, industrial electronics, consumer electronics, machine rooms, data servers and the like, equipment or devices can generate a large amount of heat during operation, if the heat cannot be timely dissipated, the temperature or the ambient temperature of the equipment can be continuously increased, and the high temperature can seriously influence the operation stability and the service life of the equipment, so that various heat management needs to be performed, and the equipment can work in a proper temperature range.
One of the main heat dissipation modes commonly used at present is to arrange a heat dissipation plate at a heat dissipation end for heat dissipation, contact a heat source with the heat dissipation plate, and circulate and flow a cooling medium in the heat dissipation plate to transfer heat generated by the heat source away so as to avoid heat accumulation of the heat source. The existing heat radiation plate is simple in structure, cooling medium flows from a liquid inlet to a liquid outlet mainly through a flow channel in the heat radiation plate, and the temperature of the cooling medium gradually rises from the liquid inlet to the liquid outlet due to continuous heat exchange of the cooling medium and a heat source, so that the surface temperature difference of the heat radiation plate at different positions is large, the heat radiation efficiency of the heat source at different contact positions on the heat radiation plate is influenced, the working temperature difference of the heat source at different positions is large, and adverse effects are generated on some heat sources with high requirements on the working temperature, such as a CPU (central processing unit).
Disclosure of Invention
Aiming at the problem that the temperature difference of different positions of a heat source is caused by large surface temperature difference of different positions of the existing heat dissipation plate, the invention provides the heat dissipation plate.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the heat dissipation plate comprises a heat conduction shell and a partition board, wherein a cavity for cooling medium to flow is formed in the heat conduction shell, the partition board is positioned in the cavity, and the cavity is divided into a first cavity and a second cavity by the partition board; at the end part of the partition board, the first cavity and the second cavity are communicated with each other; the heat conduction shell is provided with a first liquid port communicated with the first cavity and a second liquid port communicated with the second cavity;
the partition plate comprises a bending part, a plurality of first medium flow channels are formed on one side surface of the bending part facing the first cavity, a plurality of second medium flow channels are formed on the other side surface of the bending part facing the second cavity, and the first medium flow channels and the second medium flow channels are arranged at intervals side by side.
According to the heat dissipation plate provided by the invention, the cavity is divided into the first cavity and the second cavity which are communicated with each other by the partition plate, the cooling medium flows in from the first liquid through hole, flows into the second medium through the plurality of first medium flow channels, flows out from the second medium flow channels to the second liquid through hole, the plurality of first medium flow channels and the plurality of second medium flow channels are respectively formed on two surfaces of the bending part of the partition plate, and the plurality of first medium flow channels and the plurality of second medium flow channels are arranged at intervals side by side, so that the cooling medium in the first medium flow channels and the cooling medium in the second medium flow channels exchange heat with each other in the reciprocating flow process, the bending part is arranged on the partition plate, so that the heat exchange areas of the first medium flow channels and the second medium flow channels are favorably improved, the temperatures of the heat dissipation plate at different positions tend to be consistent, the temperature difference at different positions is reduced, the working temperature difference of a heat source contacted with the surface of the heat dissipation plate is reduced, and the working efficiency of the heat source is favorably improved.
Optionally, the partition plate further comprises a flat plate part, and the flat plate part is connected with the bending part; a first converging channel is formed on one side surface of the flat plate part, one end of the first medium channel is communicated with the first converging channel, and the other end of the first medium channel is provided with a communication port; the other side surface of the flat plate part is provided with a second converging channel, one end of the second medium channel is communicated with the second converging channel, and the other end of the second medium channel is communicated with the first converging channel through the communication port.
Optionally, the bending part with dull and stereotyped portion parallel and level sets up, first medium runner with the position that the second is converged and is connected is provided with first separation blade and shutoff, the second medium runner with the position that the first is converged and is connected is provided with the second separation blade and shutoff.
Optionally, the first medium flow channels linearly extend on one side surface of the bending part, and a plurality of the first medium flow channels are parallel to each other; the second medium flow channels linearly extend on the other side surface of the bending part, and a plurality of second medium flow channels are parallel to each other.
Optionally, the heat conducting shell is plate-shaped, and the first liquid port and the second liquid port are positioned on the same side surface of the heat conducting shell;
a first pipe joint is arranged at the first liquid through hole, one end of the first pipe joint is connected to the first liquid through hole and communicated with the first confluence channel, and the other end of the first pipe joint extends to the outside of the heat conducting shell;
the flat plate part is provided with a first pipe joint, the flat plate part is provided with a first liquid outlet, the first pipe joint penetrates into the first liquid outlet, one end of the first pipe joint is connected to the first liquid outlet and communicated with the first confluence channel, and the other end of the first pipe joint extends to the outside of the heat conducting shell.
Optionally, the first pipe joint and the second pipe joint are respectively located at two ends of the flat plate portion.
Optionally, the partition board may be accommodated in the cavity in a vertically-biased manner.
Optionally, the heat conducting housing includes a first housing and a second housing, and the first housing and the second housing are abutted up and down to form the cavity between the first housing and the second housing.
Optionally, the cooling medium is water, antifreeze, air or refrigerant.
Optionally, the heat conducting shell is a metal shell, and the partition plate is a metal plate.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipating plate according to an embodiment of the present invention;
fig. 2 is an exploded view of a heat dissipating plate according to an embodiment of the present invention;
FIG. 3 is an enlarged schematic view at A in FIG. 2;
FIG. 4 is an enlarged schematic view at B in FIG. 2;
fig. 5 is an exploded view of a partition plate of a heat dissipating plate according to an embodiment of the present invention;
FIG. 6 is an enlarged schematic view at C in FIG. 5;
FIG. 7 is a side view of a heat sink provided by an embodiment of the present invention;
FIG. 8 is a cross-sectional view taken along the plane D-D in FIG. 7;
FIG. 9 is an enlarged schematic view at E in FIG. 8;
fig. 10 is an enlarged schematic view at F in fig. 8.
Reference numerals in the drawings of the specification are as follows:
1. a thermally conductive housing; 11. a first housing; 111. a first liquid port; 112. a second liquid port; 12. a second housing; 121. a receiving groove; 122. a seal ring; 2. a first pipe joint; 3. a second pipe joint; 4. a partition plate; 41. a flat plate portion; 411. a via hole; 412. a first flow converging channel; 413. a second flow converging channel; 42. a bending part; 421. a first media flow path; 422. a second medium flow path; 423. a first baffle; 424. a second baffle; 425. a communication port; 5. a cavity; 51. a first cavity; 52. and a second cavity.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects solved by the invention more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Referring to fig. 1 to 6, an embodiment of the present invention provides a heat dissipating plate, including a heat conductive housing 1 and a partition plate 4, wherein a cavity 5 through which a cooling medium flows is formed inside the heat conductive housing 1, the partition plate 4 is located in the cavity 5, and the cavity 5 is partitioned into a first cavity 51 and a second cavity 52 by the partition plate 4; at the end position of the partition plate 4, the first cavity 51 and the second cavity 52 communicate with each other; the heat conducting shell 1 is provided with a first liquid port 111 communicated with the first cavity 51 and a second liquid port 112 communicated with the second cavity 52;
the partition board 4 includes a bending portion 42, a plurality of first medium flow channels 421 are formed on a surface of the bending portion 42 facing the first cavity 51, a plurality of second medium flow channels 422 are formed on a surface of the bending portion 42 facing the second cavity 52, and the plurality of first medium flow channels 421 and the plurality of second medium flow channels 422 are arranged at intervals side by side.
It should be noted that, the first liquid port 111 and the second liquid port 112 are used for introducing and discharging a cooling medium, respectively, where the first liquid port 111 may be a liquid inlet or a liquid outlet, and is not particularly limited, and in the description of the present invention, for convenience of understanding, the first liquid port 111 is used as a liquid inlet, and the second liquid port 112 is used as a liquid outlet.
According to the heat dissipation plate provided by the invention, the cavity 5 is divided into the first cavity 51 and the second cavity 52 which are mutually communicated by the partition plate 4, the cooling medium flows in from the first liquid through hole 111, flows into the second medium flow channel 422 through the plurality of first medium flow channels 421, flows out from the second medium flow channel 422 to the second liquid through hole 112, the plurality of first medium flow channels 421 and the plurality of second medium flow channels 422 are respectively formed on two surfaces of the bending part 42 of the partition plate 4, and the plurality of first medium flow channels 421 and the plurality of second medium flow channels 422 are arranged at intervals side by side, so that the cooling medium in the first medium flow channels 421 and the cooling medium in the second medium flow channels 422 exchange heat with each other in the reciprocating flow process, and the bending part 42 is arranged on the partition plate 4, so that the temperature trend of the heat dissipation plate at different positions is consistent, the temperature difference at different positions is reduced, the working temperature difference of the heat source contacted with the surface of the heat source is reduced, and the working efficiency of the heat source is improved.
As shown in fig. 5 and 7 to 10, in one embodiment, the separator 4 further includes a flat plate portion 41, and the flat plate portion 41 is connected to the bending portion 42; a first converging channel 412 is formed on one surface of the flat plate portion 41, one end of the first medium channel 421 is communicated with the first converging channel 412, and the other end of the first medium channel 421 is provided with a communication port 425; a second flow converging passage 413 is formed on the other surface of the flat plate portion 41, one end of the second medium flow passage 422 is communicated with the second flow converging passage 413, and the other end of the second medium flow passage 422 is communicated with the first flow converging passage 412 through the communication port 425.
The cooling medium flowing into the first liquid passage 111 enters the first liquid converging passage 412, and is split into each first medium passage 421 through the first liquid converging passage 412, the flowing directions of the cooling medium in the first medium passage 421 and the cooling medium in the second medium passage 422 are opposite, the cooling medium in each second medium passage 422 is converged into the second liquid converging passage 413, and then flows out of the second liquid passage 112 through the second liquid converging passage 413.
As shown in fig. 6, the bending portion 42 is bent in a shape of an arc or a wave, a plurality of mutually spaced wave crests and a plurality of mutually spaced wave troughs are formed, the wave troughs form the first medium flow channel 421, the wave crests form the second medium flow channel 422, the first medium flow channel 421 and the second medium flow channel 422 have a flow guiding effect on a cooling medium, the bending portion 42 has a thin-wall structure, and heat exchange is performed between the first medium flow channel 421 and the second medium flow channel 422 through the bending portion 42.
As shown in fig. 5 and 6, in an embodiment, the bending portion 42 and the flat plate portion 41 are located on the same plane, a first blocking piece 423 is provided at a position where the first medium flow path 421 and the second converging path 413 are connected to each other for blocking, and a second blocking piece 424 is provided at a position where the second medium flow path 422 and the first converging path 412 are connected to each other for blocking.
The first blocking piece 423 is used for blocking the first medium flow channel 421 and the second converging channel 413, so that the cooling medium between the first medium flow channel 421 and the second converging channel 413 is prevented from being in series flow; the second blocking piece 424 is used for blocking the second medium flow channel 422 and the first converging channel 412, so as to avoid the cooling medium between the second medium flow channel 422 and the first converging channel 412 from flowing in series.
In other embodiments, the bending portion and the flat plate portion may be integrally formed, and specifically, one end of the bending portion may be flattened to form the flat plate portion.
As shown in fig. 2 to 4, in an embodiment, the first medium flow channels 421 linearly extend on one side surface of the bending portion 42, and the plurality of first medium flow channels 421 are parallel to each other; the second medium flow path 422 extends linearly on the other side surface of the bent portion 42, and a plurality of the second medium flow paths 422 are parallel to each other.
The first medium flow channel 421 is perpendicular to the first converging channel 412, and the second medium flow channel 422 is perpendicular to the second converging channel 413.
As shown in fig. 7 to 10, in an embodiment, the heat-conducting housing 1 is plate-shaped, both surfaces of the heat-conducting housing 1 may be used as contact surfaces with a heat source, and the first liquid through-hole 111 and the second liquid through-hole 112 are located on the same side surface of the heat-conducting housing 1.
The first liquid through hole 111 is provided with a first pipe joint 2, one end of the first pipe joint 2 is connected to the first liquid through hole 111 and is communicated with the first converging channel 412, and the other end of the first pipe joint 2 extends to the outside of the heat conducting shell 1.
The second liquid port 112 is provided with a second pipe joint 3, the flat plate portion 41 is provided with a through hole 411, the second pipe joint 3 penetrates into the second liquid port 112, one end of the second pipe joint 3 is connected to the through hole 411 and is communicated with the second converging channel 413, and the other end of the second pipe joint 3 extends to the outside of the heat conducting shell 1.
The first pipe joint 2 and the second pipe joint 3 are used for being connected with a liquid inlet pipe and a liquid outlet pipe outside the heat dissipation plate so as to form circulation inside the heat dissipation plate.
The first pipe joint 2 is in sealing connection with the first liquid through hole 111, and the second pipe joint 3 is in sealing connection with the second liquid through hole 112, so as to avoid leakage of cooling liquid.
The first pipe joint 2 and the second pipe joint 3 are respectively positioned at two ends of the flat plate portion 41
In other embodiments, the first liquid inlet 111 and the second liquid inlet 112 may be disposed on different side surfaces of the heat conductive housing 1.
Because the first liquid port 111 and the second liquid port 112 need to be led out of the first pipe joint 2 and the second pipe joint 3 respectively, compared with the scheme that the first liquid port 111 and the second liquid port 112 are arranged on different side surfaces of the heat conducting shell 1, the first liquid port 111 and the second liquid port 112 are arranged on the same side surface of the heat conducting shell 1, the heat dissipation plate can be conveniently thinned, the bottom of the heat dissipation plate is flat, and the influence on the installation of the heat dissipation plate is avoided.
In one embodiment, the partition 4 is accommodated in the cavity 5 so as to be capable of swinging up and down.
Specifically, the partition board 4 is in a thin-wall plate shape, and because the partition board 4 is in a non-fixed arrangement capable of deflecting up and down, the partition board 4 can deflect up and down in the cavity 5 under the action of fluid pressure, and because the flow resistance of the cooling medium in the cooling board is related to the flow cross-sectional areas of the cooling medium in the first cavity 51 and the second cavity 52, the partition board 4 can deflect up and down under the action of the pressure of the cooling medium at two sides by means of the non-fixed arrangement of the partition board 4, so that the flow resistance of the cooling medium in the first cavity 51 and the second cavity 52 can be balanced, the overall flow resistance of the cooling medium in the cooling board is reduced, the flow speed of the cooling medium is improved, and the heat dissipation efficiency of the cooling board is improved.
On the other hand, due to certain fluctuation of the pressure of the introduced cooling medium, the partition plate 4 is subjected to deflection vibration, so that a turbulence effect is achieved, the discharge of bubbles in the cooling plate is facilitated, and the influence of the stay of the bubbles in the cooling plate on the cooling effect is avoided.
In an embodiment, the heat conductive housing 1 includes a first housing 11 and a second housing 12, and the first housing 11 and the second housing 12 are abutted up and down to form the cavity 5 between the first housing 11 and the second housing 12.
The first casing 11 and the second casing 12 are square platy structures with shape matching, a containing groove 121 is formed in one face of the second casing 12 facing the first casing 11, a sealing ring 122 is formed on the periphery of the containing groove 121, the first casing 11 covers the sealing ring 122 to seal the top opening of the containing groove 121, so that the cavity 5 is formed, the first pipe joint 2 and the second pipe joint 3 are located on two sides of the same end portion of the first casing 11, and the first casing 11 and the second casing 12 can be connected and sealed in a welding or bolt connection mode.
In one embodiment, the cooling medium is water, antifreeze, air or refrigerant.
It should be noted that, in other embodiments, the cooling medium may be replaced by other fluids that perform the same heat exchange function.
In one embodiment, the heat conducting housing 1 is a metal housing, and the partition board 4 is a metal plate.
Preferably, a metal with good thermal conductivity is used as the material of the heat conductive housing 1 and the partition board 4, for example, a metal such as aluminum, copper, and an alloy thereof, and in other embodiments, other non-metallic materials with good thermal conductivity may be used as the material of the heat conductive housing 1 and the partition board 4.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (8)
1. The heat dissipation plate is characterized by comprising a heat conduction shell and a partition plate, wherein a cavity for cooling medium to flow is formed in the heat conduction shell, the partition plate is positioned in the cavity, and the cavity is divided into a first cavity and a second cavity by the partition plate; at the end part of the partition board, the first cavity and the second cavity are communicated with each other; the heat conduction shell is provided with a first liquid port communicated with the first cavity and a second liquid port communicated with the second cavity;
the partition plate comprises a bending part, a plurality of first medium flow channels are formed on one side surface of the bending part facing the first cavity, a plurality of second medium flow channels are formed on the other side surface of the bending part facing the second cavity, and the first medium flow channels and the second medium flow channels are arranged side by side at intervals;
the partition board can be accommodated in the cavity in a vertically-deflecting manner;
the partition plate further comprises a flat plate part, and the flat plate part is connected with the bending part; a first converging channel is formed on one side surface of the flat plate part, one end of the first medium channel is communicated with the first converging channel, and the other end of the first medium channel is provided with a communication port; the other side surface of the flat plate part is provided with a second converging channel, one end of the second medium channel is communicated with the second converging channel, and the other end of the second medium channel is communicated with the first converging channel through the communication port.
2. The heat dissipating plate according to claim 1, wherein the bending portion and the flat plate portion are arranged flush, a first blocking piece is arranged at a position where the first medium flow passage is connected with the second confluence passage for blocking, and a second blocking piece is arranged at a position where the second medium flow passage is connected with the first confluence passage for blocking.
3. The heat dissipating plate according to any one of claims 1 to 2, wherein the first medium flow passage extends linearly on a side surface of the bent portion, and a plurality of the first medium flow passages are parallel to each other; the second medium flow channels linearly extend on the other side surface of the bending part, and a plurality of second medium flow channels are parallel to each other.
4. The heat dissipating plate according to claim 1, wherein the heat conductive housing is plate-shaped, and the first liquid passage and the second liquid passage are located on the same side surface of the heat conductive housing;
a first pipe joint is arranged at the first liquid through hole, one end of the first pipe joint is connected to the first liquid through hole and communicated with the first confluence channel, and the other end of the first pipe joint extends to the outside of the heat conducting shell;
the flat plate part is provided with a first pipe joint, the flat plate part is provided with a first liquid outlet, the first pipe joint penetrates into the first liquid outlet, one end of the first pipe joint is connected to the first liquid outlet and communicated with the first confluence channel, and the other end of the first pipe joint extends to the outside of the heat conducting shell.
5. The heat dissipating plate according to claim 4, wherein the first pipe joint and the second pipe joint are located at both ends of the flat plate portion, respectively.
6. The heat dissipating plate according to claim 1, wherein the heat conductive housing includes a first housing and a second housing, the first housing and the second housing being butted up and down to form the cavity between the first housing and the second housing.
7. The heat dissipating plate according to claim 1, wherein the cooling medium is water, an antifreeze, air, or a refrigerant.
8. The heat dissipating plate according to claim 1, wherein the heat conductive case is a metal case, and the separator is a metal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810275799.3A CN108347866B (en) | 2018-03-30 | 2018-03-30 | Heat radiation plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810275799.3A CN108347866B (en) | 2018-03-30 | 2018-03-30 | Heat radiation plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108347866A CN108347866A (en) | 2018-07-31 |
| CN108347866B true CN108347866B (en) | 2024-03-08 |
Family
ID=62957833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810275799.3A Active CN108347866B (en) | 2018-03-30 | 2018-03-30 | Heat radiation plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108347866B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108826780B (en) * | 2018-09-12 | 2024-02-13 | 上海宝冶工程技术有限公司 | Cooling device of high-temperature corrosive medium valve |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025134A (en) * | 2012-12-21 | 2013-04-03 | 中国北车集团大连机车研究所有限公司 | Double-wall efficient water-cooling base plate |
| CN208079634U (en) * | 2018-03-30 | 2018-11-09 | 肖立峰 | A kind of heat sink |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1195196C (en) * | 2002-01-10 | 2005-03-30 | 杨洪武 | Integzated type heat pipe and heat exchange method |
-
2018
- 2018-03-30 CN CN201810275799.3A patent/CN108347866B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025134A (en) * | 2012-12-21 | 2013-04-03 | 中国北车集团大连机车研究所有限公司 | Double-wall efficient water-cooling base plate |
| CN208079634U (en) * | 2018-03-30 | 2018-11-09 | 肖立峰 | A kind of heat sink |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108347866A (en) | 2018-07-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6257320B1 (en) | Heat sink device for power semiconductors | |
| US7331378B2 (en) | Microchannel heat sink | |
| US11248848B1 (en) | Liquid-cooling heat dissipation apparatus | |
| US20080314559A1 (en) | Heat exchange structure and heat dissipating apparatus having the same | |
| CN211831654U (en) | Efficient liquid cooling plate and equipment | |
| US11849569B2 (en) | Ultra-compact configurable double-sided manifold micro-channel cold plate | |
| TW201839345A (en) | Integrated liquid cooling heat radiation system making installation easier, enhancing sealing effect of pipeline circulation of coolant and prolonging service life without causing liquid leakage | |
| US7992625B1 (en) | Fluid-operated heat transfer device | |
| CN208079634U (en) | A kind of heat sink | |
| CN111490448B (en) | Laser module | |
| CN203896658U (en) | Water-cooled plate heat radiator | |
| CN108347866B (en) | Heat radiation plate | |
| CN111678364A (en) | Micro-channel heat exchanger | |
| CN113939152B (en) | Water-cooling heat dissipation module and electronic equipment | |
| CN112234430A (en) | Semiconductor laser device | |
| CN107403775B (en) | Micro-channel heat dissipation device and electronic equipment | |
| CN212253773U (en) | Micro-channel heat exchanger | |
| CN211125625U (en) | Liquid cooling heat dissipation assembly, liquid cooling heat dissipation device and power electronic equipment | |
| CN211831625U (en) | Combined type high-heat-conductivity cold plate | |
| CN114828598A (en) | Liquid cooling radiator, electric drive controller and car | |
| CN112968342A (en) | End-pumped laser crystal microchannel water-cooling structure for heat dissipation | |
| CN107230929B (en) | Radiator, radiating component, radiating chassis and laser | |
| AU2021102059A4 (en) | A laser module | |
| CN114025142B (en) | Liquid cooling heat dissipation cold head, liquid cooling heat dissipation system and laser television | |
| CN216532315U (en) | Liquid cooling device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190618 Address after: 518000 Room 902, Building B, New Generation Information Technology Industrial Park, No. 8 Baoqing Road, Longgang Street, Shenzhen City, Guangdong Province Applicant after: SHENZHEN YIWEIPAI TECHNOLOGY Co.,Ltd. Address before: 518000 Shenzhen, Guangdong, Pingshan New District, Hai Ke Hing strategic emerging industrial park, building 1, 3 3. Applicant before: Xiao Lifeng |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |