CN108342611A - A kind of preparation method of high-strength copper based alloy blank - Google Patents
A kind of preparation method of high-strength copper based alloy blank Download PDFInfo
- Publication number
- CN108342611A CN108342611A CN201810491519.2A CN201810491519A CN108342611A CN 108342611 A CN108342611 A CN 108342611A CN 201810491519 A CN201810491519 A CN 201810491519A CN 108342611 A CN108342611 A CN 108342611A
- Authority
- CN
- China
- Prior art keywords
- powder
- ingot
- pure niobium
- melt
- based alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D7/00—Casting ingots, e.g. from ferrous metals
- B22D7/005—Casting ingots, e.g. from ferrous metals from non-ferrous metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D7/00—Casting ingots, e.g. from ferrous metals
- B22D7/06—Ingot moulds or their manufacture
- B22D7/064—Cooling the ingot moulds
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1036—Alloys containing non-metals starting from a melt
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1036—Alloys containing non-metals starting from a melt
- C22C1/1047—Alloys containing non-metals starting from a melt by mixing and casting liquid metal matrix composites
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/12—Making non-ferrous alloys by processing in a semi-solid state, e.g. holding the alloy in the solid-liquid phase
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Composite Materials (AREA)
- Conductive Materials (AREA)
- Continuous Casting (AREA)
Abstract
The invention discloses a kind of preparation methods of high-strength copper based alloy blank, include the following steps:(1) it is 97wt%, pure niobium ingot 1wt%, pure niobium powder 1wt%, graphene powder 1wt% at fine copper ingot is grouped into using fine copper ingot, pure niobium ingot, pure niobium powder, graphene powder as raw material;(2) 1300 DEG C are heated to after first mixing fine copper ingot, pure niobium ingot; it is set to be melted into alloy melt; after keeping the temperature 10min; melt liquid level is protected using argon gas; and pure niobium powder, graphene powder is added, 5min is sufficiently stirred to alloy melt, while alloy melt temperature is reduced to 1200 DEG C; and 10 15min are kept the temperature, make alloy melt quick solidification and forms the melt of semisolid line and staff control;(3) melt cast of semisolid line and staff control is prepared in using the grinding tool of circulating water and forms ingot casting, be cooled to room temperature with the speed of 190 DEG C/min, obtain the high-intensity high-conductivity copper based alloy blank of graphene-containing;Wherein, a diameter of 0.05 100 μm of pure niobium powder.Acid bronze alloy blank prepared by the present invention has the advantages that intensity is high.
Description
Technical field
The invention belongs to copper-based alloy material technical fields, and in particular to a kind of preparation side of high-strength copper based alloy blank
Method.
Background technology
Copper and copper alloy length are used for the fields such as lead frame, electrical contact, high ferro cable and motor electric wire, but traditional
Copper and copper it is total intensity it is not high, therefore the copper alloy of high strength and high conductivity is researched and developed.Common high strength high conducting copper
The intensifying method of alloy has processing hardening, solution strengthening, refined crystalline strengthening and second-phase strength, wherein solution strengthening is to pass through conjunction
Gold element incorporates Copper substrate and generates distortion of lattice, improves the reinforcing means of alloy strength to hinder dislocation motion, but formed
When solid solution, alloy conductive performance can reduce, and the distortion distortion of solvent lattice destroys the periodicity of potential field of lattice, only a small number of
The micro influences being added in copper to copper resistance rate of element such as Cd, Zn, Ag, Ni, Pb, Sn, Nb are little, and it is strong can also to improve matrix
Degree.
There is higher conductivity and tensile strength by the copper microcomposite of representative of Cu-Nb, Cu-Ag, be most may be used
It can realize the resistance to conductor materials for rushing high-intensity magnetic field of 100T, but the solid solubility of Nb and Ag in Cu is extremely low, elasticity capacity is sufficiently close to,
High electric conductivity and toughness can also be obtained.A kind of high intensity, highly conductive, high temperature resistance disclosed in Chinese patent CN101818273B
The preparation method of the Cu-Nb alloys of softening performance grinds copper powder and the Nb spheres of powder to obtain Cu-Nb Nanocrystalline Solid Solution powder, through moving back
It is mixed with boron powder after fire, vacuum-sintering obtains Cu-Nb alloy billets, is finally sealed with copper clad, hot extrusion obtains product.The party
When institutional framework being reached nano-scale in method, high strength & high electric-conduction energy is obtained, boron powder improves Cu-Nb circle under nanoscale
The stability in face.A kind of Cu-Ni-Si based alloys disclosed in Chinese patent CN102703754 and preparation method thereof, by fine copper, pure
Silicon, pure nickel and pure vanadium melting pour to obtain blank, then nearly annealing, hot rolling, cold rolling, solid solution and ageing treatment obtain product.By existing
Have technology it is found that at present acid bronze alloy to prepare raw material all be metal powder, can not directly prepare the copper alloy blank of thin product, it is raw
The production period is long, cannot achieve mass production.
Invention content
The technical problem to be solved in the present invention is to provide a kind of preparation methods of high-strength copper based alloy blank.
In order to solve the above technical problems, the technical scheme is that:
A kind of preparation method of high-strength copper based alloy blank, includes the following steps:
(1) using fine copper ingot, pure niobium ingot, pure niobium powder, graphene powder as raw material, it is at fine copper ingot is grouped into
97wt%, pure niobium ingot 1wt%, pure niobium powder 1wt%, graphene powder 1wt%;
(2) 1300 DEG C are heated to after first mixing fine copper ingot, pure niobium ingot, it is made to be melted into alloy melt, keeps the temperature 10min
Afterwards, melt liquid level is protected using argon gas, and pure niobium powder, graphene powder is added, 5min is sufficiently stirred to alloy melt, together
When alloy melt temperature is reduced to 1200 DEG C, and keep the temperature 10-15min, make alloy melt quick solidification and form semisolid
The melt of line and staff control;
(3) melt cast of semisolid line and staff control is prepared in using the grinding tool of circulating water and forms ingot casting, with
The speed of 190 DEG C/min is cooled to room temperature, and obtains the high-intensity high-conductivity copper based alloy blank of graphene-containing.
Wherein, a diameter of 0.05-100 μm of pure niobium powder.
Preferably, pure niobium powder is 30 μm in the step (1), and takes out its oxide on surface by reduction treatment.
Preferably, in the step (1) graphene powder a diameter of 20nm, thickness be 5 carbon atom thickness.
Preferably, the particle diameter of fine copper powder is 0.05-100 μm in the step (1).
Preferably, the particle diameter of pure niobium powder is 0.5-30 μm in the step (1).
Preferably, the particle diameter of fine silver powder is 25-50nm in the step (1).
Specific implementation mode
The present embodiment 1:
(1) using fine copper ingot, fine silver ingot, fine copper powder, graphene powder as raw material, it is at fine copper ingot is grouped into
85wt%, fine silver ingot 12wt%, fine copper powder 2wt%, graphene powder 1wt%, total amount 100%, wherein fine copper powder
A diameter of 0.5 μm, and take out its oxide on surface by reduction treatment.
(2) 1100 DEG C are heated to after first mixing fine copper ingot, fine silver ingot, it is made to be melted into alloy melt, keeps the temperature 10min
Afterwards, melt liquid level is protected using argon gas, and fine copper powder, graphene powder is added, it is molten to alloy using mechanical agitation mode
Body is sufficiently stirred 3min, while alloy melt temperature is reduced to 900 DEG C, and keeps the temperature 10min, makes alloy melt quick solidification simultaneously
And form the melt of semisolid line and staff control.
(3) melt cast of semisolid line and staff control is prepared in using the grinding tool of circulating water and forms ingot casting, with
The speed of 80 DEG C/min is cooled to room temperature, and obtains the high-intensity high-conductivity copper based alloy blank of graphene-containing.
(4) by the high-intensity high-conductivity copper based alloy blank heating of graphene-containing to 710 DEG C, keep the temperature 1h, by ingot casting along
Forging molding longitudinally, laterally is carried out with axial three orthogonal directions distribution, forging drafts 30% in each direction then will
Forging stock is air-cooled to room temperature, then forging stock is heated to 500 DEG C of heat preservation 1h, along longitudinally, laterally with axial three orthogonal directions distribution
Forging molding is carried out, forging stock is then air-cooled to room temperature, then forging stock is heated to by forging drafts 30% in each direction
400 DEG C of heat preservation 1h carry out forging molding, forging in each direction along being longitudinally, laterally distributed with axial three orthogonal directions
Forging stock is then air-cooled to room temperature, then forging stock is heated to 300 DEG C of heat preservation 1h by drafts 30%, along longitudinally, laterally and axial
Three orthogonal direction distributions carry out forging molding, and forging stock is then air-cooled to room temperature by forging drafts 30% in each direction.
Embodiment 2:
(1) using fine copper ingot, pure niobium ingot, pure niobium powder, graphene powder as raw material, it is at fine copper ingot is grouped into
97wt%, pure niobium ingot 1wt%, pure niobium powder 1wt%, graphene powder 1wt%, total amount 100%, wherein pure niobium powder is straight
Diameter is 30 μm, and takes out its oxide on surface by reduction treatment.
(2) 1300 DEG C are heated to after first mixing fine copper ingot, pure niobium ingot, it is made to be melted into alloy melt, keeps the temperature 10min
Afterwards, melt liquid level is protected using argon gas, and pure niobium powder, graphene powder is added, it is molten to alloy using mechanical agitation mode
Body is sufficiently stirred 5min, while alloy melt temperature is reduced to 1200 DEG C, and keeps the temperature 15min, makes alloy melt quick solidification
And form the melt of semisolid line and staff control.
(3) melt cast of semisolid line and staff control is prepared in using the grinding tool of circulating water and forms ingot casting, with
The speed of 190 DEG C/min is cooled to room temperature, and obtains the high-intensity high-conductivity copper based alloy blank of graphene-containing.
Embodiment 3:
(1) using fine copper ingot, fine silver ingot, fine silver powder, graphene powder as raw material, it is at fine copper ingot is grouped into
87wt%, fine silver ingot 10wt%, fine silver powder 2wt%, graphene powder 1wt%, total amount 100%, wherein fine silver powder
A diameter of 25 μm, and take out its oxide on surface by reduction treatment.
(2) 1100 DEG C are heated to after first mixing fine copper ingot, fine silver ingot, it is made to be melted into alloy melt, keeps the temperature 10min
Afterwards, melt liquid level is protected using argon gas, and fine silver powder, graphene powder is added, it is molten to alloy using mechanical agitation mode
Body is sufficiently stirred 3min, while alloy melt temperature is reduced to 1000 DEG C, and keeps the temperature 10min, makes alloy melt quick solidification
And form the melt of semisolid line and staff control.
(3) melt cast of semisolid line and staff control is prepared in using the grinding tool of circulating water and forms ingot casting, with
The speed of 100 DEG C/min is cooled to room temperature, and obtains the high-intensity high-conductivity copper based alloy blank of graphene-containing.
(4) by the high-intensity high-conductivity copper based alloy blank heating of graphene-containing to 720 DEG C, keep the temperature 1h, by ingot casting along
Forging molding longitudinally, laterally is carried out with axial three orthogonal directions distribution, forging drafts 20% in each direction then will
Forging stock is air-cooled to room temperature, then forging stock is heated to 500 DEG C of heat preservation 1h, along longitudinally, laterally with axial three orthogonal directions distribution
Forging molding is carried out, forging stock is then air-cooled to room temperature, then forging stock is heated to by forging drafts 20% in each direction
400 DEG C of heat preservation 1h carry out forging molding, forging in each direction along being longitudinally, laterally distributed with axial three orthogonal directions
Forging stock is then air-cooled to room temperature, then forging stock is heated to 300 DEG C of heat preservation 1h by drafts 20%, along longitudinally, laterally and axial
Three orthogonal direction distributions carry out forging molding, and forging stock is then air-cooled to room temperature by forging drafts 20% in each direction.
Embodiment 4:
(1) using fine copper ingot, fine silver ingot, fine copper powder, graphene powder as raw material, it is at fine copper ingot is grouped into
65wt%, fine silver ingot 30wt%, fine copper powder 4wt%, graphene powder 1wt%, total amount 100%, wherein fine copper powder
A diameter of 50 μm, and take out its oxide on surface by reduction treatment.
(2) 1050 DEG C are heated to after first mixing fine copper ingot, fine silver ingot, it is made to be melted into alloy melt, keeps the temperature 10min
Afterwards, melt liquid level is protected using argon gas, and fine copper powder, graphene powder is added, it is molten to alloy using mechanical agitation mode
Body is sufficiently stirred 5min, while alloy melt temperature is reduced to 900 DEG C, and keeps the temperature 10min, makes alloy melt quick solidification simultaneously
And form the melt of semisolid line and staff control.
(3) melt cast of semisolid line and staff control is prepared in using the grinding tool of circulating water and forms ingot casting, with
The speed of 100 DEG C/min is cooled to room temperature, and obtains the high-intensity high-conductivity copper based alloy blank of graphene-containing.
(4) by the high-intensity high-conductivity copper based alloy blank heating of graphene-containing to 710 DEG C, keep the temperature 1h, by ingot casting along
Forging molding longitudinally, laterally is carried out with axial three orthogonal directions distribution, forging drafts 40% in each direction then will
Forging stock is air-cooled to room temperature, then forging stock is heated to 500 DEG C of heat preservation 1h, along longitudinally, laterally with axial three orthogonal directions distribution
Forging molding is carried out, forging stock is then air-cooled to room temperature, then forging stock is heated to by forging drafts 10% in each direction
400 DEG C of heat preservation 1h carry out forging molding, forging in each direction along being longitudinally, laterally distributed with axial three orthogonal directions
Forging stock is then air-cooled to room temperature, then forging stock is heated to 300 DEG C of heat preservation 1h by drafts 30%, along longitudinally, laterally and axial
Three orthogonal direction distributions carry out forging molding, and forging stock is then air-cooled to room temperature by forging drafts 30% in each direction.
Embodiment 5:
(1) using fine copper ingot, pure niobium ingot, pure niobium powder, graphene powder as raw material, it is at fine copper ingot is grouped into
83.5wt%, pure niobium ingot 12.5wt%, pure niobium powder 2.5wt%, graphene powder 1.5wt%, total amount 100%, wherein pure
A diameter of 2 μm of niobium powder, and take out its oxide on surface by reduction treatment.
(2) 1600 DEG C are heated to after first mixing fine copper ingot, pure niobium ingot, it is made to be melted into alloy melt, keeps the temperature 10min
Afterwards, melt liquid level is protected using argon gas, and pure niobium powder, graphene powder is added, it is molten to alloy using mechanical agitation mode
Body is sufficiently stirred 5min, while alloy melt temperature is reduced to 1500 DEG C, and keeps the temperature 10min, makes alloy melt quick solidification
And form the melt of semisolid line and staff control.
(3) melt cast of semisolid line and staff control is prepared in using the grinding tool of circulating water and forms ingot casting, with
The speed of 180 DEG C/min is cooled to room temperature, and obtains the high-intensity high-conductivity copper based alloy blank of graphene-containing.
Embodiment 6:
(1) using fine copper ingot, fine silver ingot, fine silver powder, graphene powder as raw material, it is at fine copper ingot is grouped into
75wt%, fine silver ingot 14wt%, fine silver powder 10wt%, graphene powder 1wt%, total amount 100%, wherein fine silver powder
A diameter of 50 μm, and take out its oxide on surface by reduction treatment.
(2) 1700 DEG C are heated to after first mixing fine copper ingot, fine silver ingot, it is made to be melted into alloy melt, keeps the temperature 10min
Afterwards, melt liquid level is protected using argon gas, and fine silver powder, graphene powder is added, it is molten to alloy using mechanical agitation mode
Body is sufficiently stirred 3min, while alloy melt temperature is reduced to 1600 DEG C, and keeps the temperature 10min, makes alloy melt quick solidification
And form the melt of semisolid line and staff control.
(3) melt cast of semisolid line and staff control is prepared in using the grinding tool of circulating water and forms ingot casting, with
The speed of 200 DEG C/min is cooled to room temperature, and obtains the high-intensity high-conductivity copper based alloy blank of graphene-containing.
(4) by the high-intensity high-conductivity copper based alloy blank heating of graphene-containing to 720 DEG C, keep the temperature 1h, by ingot casting along
Forging molding longitudinally, laterally is carried out with axial three orthogonal directions distribution, forging drafts 40% in each direction then will
Forging stock is air-cooled to room temperature, then forging stock is heated to 500 DEG C of heat preservation 1h, along longitudinally, laterally with axial three orthogonal directions distribution
Forging molding is carried out, forging stock is then air-cooled to room temperature, then forging stock is heated to by forging drafts 20% in each direction
400 DEG C of heat preservation 1h carry out forging molding, forging in each direction along being longitudinally, laterally distributed with axial three orthogonal directions
Forging stock is then air-cooled to room temperature, then forging stock is heated to 300 DEG C of heat preservation 1h by drafts 30%, along longitudinally, laterally and axial
Three orthogonal direction distributions carry out forging molding, and forging stock is then air-cooled to room temperature by forging drafts 10% in each direction.
After testing, embodiment 1-6 prepare graphene-containing high-intensity high-conductivity copper based alloy blank microscopic structure its
Average crystal grain diameter, yield strength, tensile strength, the result of conductivity are as follows:
Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 | |
Its average crystal grain diameter (μm) of microscopic structure | 25 | 30 | 15 | 25 | 10 | 20 |
Yield strength (MPa) | 820 | 950 | 710 | 890 | 1120 | 920 |
Tensile strength (MPa) | 980 | 1300 | 900 | 1040 | 1700 | 1230 |
Conductivity (%IACS) | 78 | 90 | 89 | 83 | 85 | 81 |
Compared with prior art, the invention has the advantages that:
(1) the high-intensity high-conductivity copper based alloy blank of graphene-containing prepared by the present invention is combined using solid-liquid double-phase solidification
Pure copper powder/pure niobium powder and/or fine silver powder and Graphene powder are added in acid bronze alloy melt, and stirs for semi-solid casting technology
It mixes to form microstructure of semisolid, notable refining alloy as-cast microstructure, is that more niobiums, silver and graphene are more solid-solution in copper
In matrix, it is more advantageous to microstructure thinning technique during deformation after unloading and lays a good foundation, and pass through drawing, rolling mill practice
Prepare the acid bronze alloy that microstructure thinning causes Nano grade.
(2) the high-intensity high-conductivity copper based alloy blank of graphene-containing prepared by the present invention is directly to prepare crystallite dimension
Tiny large size copper based alloy blank, improves the processing efficiency of copper alloy blank, also the specification for acid bronze alloy blank has
More washabilitys, and there is very high strength and electric conductivity, expand the application field of copper-based material.
(3) preparation method of the invention improve copper-based alloy material preparation it is horizontal, improve mass prepare it is copper-based
The possibility of alloy material improves the big production of technology of copper-based alloy material.
It should be understood that the above-mentioned specific implementation mode of the present invention is used only for exemplary illustration or explains the present invention's
Principle, but not to limit the present invention.Therefore, that is done without departing from the spirit and scope of the present invention is any
Modification, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.In addition, appended claims purport of the present invention
Covering the whole variations fallen into attached claim scope and boundary or this range and the equivalent form on boundary and is repairing
Change example.
Claims (6)
1. a kind of preparation method of high-strength copper based alloy blank, which is characterized in that include the following steps:
(1) using fine copper ingot, pure niobium ingot, pure niobium powder, graphene powder as raw material, at be grouped into fine copper ingot be 97wt%,
Pure niobium ingot 1wt%, pure niobium powder 1wt%, graphene powder 1wt%;
(2) 1300 DEG C are heated to after first mixing fine copper ingot, pure niobium ingot, it is made to be melted into alloy melt, after keeping the temperature 10min,
Melt liquid level is protected using argon gas, and pure niobium powder, graphene powder is added, 5min is sufficiently stirred to alloy melt, simultaneously
Alloy melt temperature is reduced to 1200 DEG C, and keeps the temperature 10-15min, make alloy melt quick solidification and forms semisolid is mixed
It is combined the melt knitted;
(3) melt cast of semisolid line and staff control is prepared in using the grinding tool of circulating water and forms ingot casting, with 190
DEG C/speed of min is cooled to room temperature, obtain the high-intensity high-conductivity copper based alloy blank of graphene-containing.
Wherein, a diameter of 0.05-100 μm of pure niobium powder.
2. a kind of preparation method of high-strength copper based alloy blank according to claim 1, which is characterized in that the step
(1) pure niobium powder is 30 μm in, and takes out its oxide on surface by reduction treatment.
3. a kind of preparation method of high-strength copper based alloy blank according to claim 1, which is characterized in that the step
(1) a diameter of 20nm of graphene powder in, thickness are 5 carbon atom thickness.
4. a kind of preparation method of high-strength copper based alloy blank according to claim 1, which is characterized in that the step
(1) particle diameter of fine copper powder is 0.05-100 μm in.
5. a kind of preparation method of high-strength copper based alloy blank according to claim 1, which is characterized in that the step
(1) particle diameter of pure niobium powder is 0.5-30 μm in.
6. a kind of preparation method of high-strength copper based alloy blank according to claim 1, which is characterized in that the step
(1) particle diameter of fine silver powder is 25-50nm in.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810491519.2A CN108342611A (en) | 2017-03-22 | 2017-03-22 | A kind of preparation method of high-strength copper based alloy blank |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710173452.3A CN107012356B (en) | 2017-03-22 | 2017-03-22 | A kind of high-intensity high-conductivity copper based alloy blank of graphene-containing and preparation method thereof |
CN201810491519.2A CN108342611A (en) | 2017-03-22 | 2017-03-22 | A kind of preparation method of high-strength copper based alloy blank |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710173452.3A Division CN107012356B (en) | 2017-03-22 | 2017-03-22 | A kind of high-intensity high-conductivity copper based alloy blank of graphene-containing and preparation method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108342611A true CN108342611A (en) | 2018-07-31 |
Family
ID=59439657
Family Applications (12)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810488791.5A Withdrawn CN108504894A (en) | 2017-03-22 | 2017-03-22 | A kind of acid bronze alloy blank that tensile strength is high |
CN201810485109.7A Withdrawn CN108611521A (en) | 2017-03-22 | 2017-03-22 | A method of preparing acid bronze alloy blank |
CN201810494473.XA Withdrawn CN108425033A (en) | 2017-03-22 | 2017-03-22 | A method of preparing high-yield strength acid bronze alloy blank |
CN201810485102.5A Withdrawn CN108570573A (en) | 2017-03-22 | 2017-03-22 | A kind of preparation method of high-tensile acid bronze alloy blank |
CN201810485103.XA Withdrawn CN108342609A (en) | 2017-03-22 | 2017-03-22 | A kind of acid bronze alloy blank of graphene-containing |
CN201810491520.5A Withdrawn CN108570575A (en) | 2017-03-22 | 2017-03-22 | A kind of acid bronze alloy blank and preparation method thereof |
CN201810488807.2A Withdrawn CN108570574A (en) | 2017-03-22 | 2017-03-22 | A method of preparing the acid bronze alloy blank of graphene-containing |
CN201710173452.3A Expired - Fee Related CN107012356B (en) | 2017-03-22 | 2017-03-22 | A kind of high-intensity high-conductivity copper based alloy blank of graphene-containing and preparation method thereof |
CN201810565872.0A Pending CN108677057A (en) | 2017-03-22 | 2017-03-22 | A kind of acid bronze alloy blank and preparation method thereof |
CN201810494229.3A Withdrawn CN108677040A (en) | 2017-03-22 | 2017-03-22 | A kind of preparation method of the acid bronze alloy blank to conduct electricity very well |
CN201810491519.2A Withdrawn CN108342611A (en) | 2017-03-22 | 2017-03-22 | A kind of preparation method of high-strength copper based alloy blank |
CN201810491518.8A Withdrawn CN108342610A (en) | 2017-03-22 | 2017-03-22 | A kind of acid bronze alloy blank that conductivity is good |
Family Applications Before (10)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810488791.5A Withdrawn CN108504894A (en) | 2017-03-22 | 2017-03-22 | A kind of acid bronze alloy blank that tensile strength is high |
CN201810485109.7A Withdrawn CN108611521A (en) | 2017-03-22 | 2017-03-22 | A method of preparing acid bronze alloy blank |
CN201810494473.XA Withdrawn CN108425033A (en) | 2017-03-22 | 2017-03-22 | A method of preparing high-yield strength acid bronze alloy blank |
CN201810485102.5A Withdrawn CN108570573A (en) | 2017-03-22 | 2017-03-22 | A kind of preparation method of high-tensile acid bronze alloy blank |
CN201810485103.XA Withdrawn CN108342609A (en) | 2017-03-22 | 2017-03-22 | A kind of acid bronze alloy blank of graphene-containing |
CN201810491520.5A Withdrawn CN108570575A (en) | 2017-03-22 | 2017-03-22 | A kind of acid bronze alloy blank and preparation method thereof |
CN201810488807.2A Withdrawn CN108570574A (en) | 2017-03-22 | 2017-03-22 | A method of preparing the acid bronze alloy blank of graphene-containing |
CN201710173452.3A Expired - Fee Related CN107012356B (en) | 2017-03-22 | 2017-03-22 | A kind of high-intensity high-conductivity copper based alloy blank of graphene-containing and preparation method thereof |
CN201810565872.0A Pending CN108677057A (en) | 2017-03-22 | 2017-03-22 | A kind of acid bronze alloy blank and preparation method thereof |
CN201810494229.3A Withdrawn CN108677040A (en) | 2017-03-22 | 2017-03-22 | A kind of preparation method of the acid bronze alloy blank to conduct electricity very well |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810491518.8A Withdrawn CN108342610A (en) | 2017-03-22 | 2017-03-22 | A kind of acid bronze alloy blank that conductivity is good |
Country Status (1)
Country | Link |
---|---|
CN (12) | CN108504894A (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107511469A (en) * | 2017-10-13 | 2017-12-26 | 安阳恒安电机有限公司 | A kind of squirrel cage motor rotor low pressure cast copper equipment, cast copper and its cast copper method |
CN108950288A (en) * | 2017-11-14 | 2018-12-07 | 盐城金麦穗科技发展有限公司 | Rice wheat straw graphene copper alloy and its production method |
CN107988513B (en) * | 2017-12-01 | 2019-10-29 | 无锡华能电缆有限公司 | The method that graphene enhances Cu-base composites and its injection molding |
CN110791676B (en) * | 2019-10-25 | 2021-06-18 | 西安工业大学 | Self-lubricating copper-based composite material for guide rail and preparation method thereof |
CN111809078B (en) * | 2020-07-21 | 2021-06-04 | 深圳市中金岭南科技有限公司 | Composite copper-silver alloy wire and preparation method thereof |
CN113073223B (en) * | 2021-03-25 | 2022-03-01 | 南昌工程学院 | Preparation method of graphene deformation Cu-Cr series in-situ composite material |
CN113976656A (en) * | 2021-10-26 | 2022-01-28 | 江西云泰铜业有限公司 | Preparation method of high-strength bending-resistant copper wire |
CN114318047A (en) * | 2021-12-03 | 2022-04-12 | 深圳市帝兴晶科技有限公司 | Superconductive copper and production method thereof |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103614583B (en) * | 2013-09-29 | 2016-04-13 | 魏玲 | A kind of Novel high-conductivity, high-strength graphene/copper material and preparation method thereof |
JP2016000843A (en) * | 2014-06-11 | 2016-01-07 | 片野染革株式会社 | Spherical composite metal fine particle and manufacturing method therefor |
JP2016207723A (en) * | 2015-04-16 | 2016-12-08 | Jx金属株式会社 | Copper heat radiation material, copper foil for the same or copper alloy foil, laminate, shield material, electronic apparatus, and manufacturing method of copper heat radiation material |
CN104862512B (en) * | 2015-04-21 | 2018-03-06 | 中国科学院宁波材料技术与工程研究所 | Improve graphene and the method for Copper substrate adhesion in copper-base graphite alkene composite |
CN105063405A (en) * | 2015-06-25 | 2015-11-18 | 中国航空工业集团公司北京航空材料研究院 | Preparation method of copper matrix graphene alloy |
CN105112710A (en) * | 2015-06-25 | 2015-12-02 | 中国航空工业集团公司北京航空材料研究院 | Copper-based graphene alloy |
CN105648264B (en) * | 2016-01-13 | 2017-07-28 | 盐城工学院 | Highly conductive high abrasion graphene/Cu-base composites and preparation method thereof |
CN105714139B (en) * | 2016-02-22 | 2018-06-08 | 宁波博威合金材料股份有限公司 | Copper-graphite alkene composite material and preparation method thereof |
CN105695776B (en) * | 2016-02-26 | 2017-06-06 | 济南大学 | A kind of Graphene strengthens the preparation method of copper-based electrical contact material |
CN106191507B (en) * | 2016-08-23 | 2017-10-24 | 江西理工大学 | A kind of graphene for preparing strengthens the method for Cu-base composites |
-
2017
- 2017-03-22 CN CN201810488791.5A patent/CN108504894A/en not_active Withdrawn
- 2017-03-22 CN CN201810485109.7A patent/CN108611521A/en not_active Withdrawn
- 2017-03-22 CN CN201810494473.XA patent/CN108425033A/en not_active Withdrawn
- 2017-03-22 CN CN201810485102.5A patent/CN108570573A/en not_active Withdrawn
- 2017-03-22 CN CN201810485103.XA patent/CN108342609A/en not_active Withdrawn
- 2017-03-22 CN CN201810491520.5A patent/CN108570575A/en not_active Withdrawn
- 2017-03-22 CN CN201810488807.2A patent/CN108570574A/en not_active Withdrawn
- 2017-03-22 CN CN201710173452.3A patent/CN107012356B/en not_active Expired - Fee Related
- 2017-03-22 CN CN201810565872.0A patent/CN108677057A/en active Pending
- 2017-03-22 CN CN201810494229.3A patent/CN108677040A/en not_active Withdrawn
- 2017-03-22 CN CN201810491519.2A patent/CN108342611A/en not_active Withdrawn
- 2017-03-22 CN CN201810491518.8A patent/CN108342610A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
CN108611521A (en) | 2018-10-02 |
CN108342609A (en) | 2018-07-31 |
CN108504894A (en) | 2018-09-07 |
CN108342610A (en) | 2018-07-31 |
CN108570574A (en) | 2018-09-25 |
CN107012356B (en) | 2018-08-14 |
CN108425033A (en) | 2018-08-21 |
CN108570573A (en) | 2018-09-25 |
CN108677057A (en) | 2018-10-19 |
CN107012356A (en) | 2017-08-04 |
CN108677040A (en) | 2018-10-19 |
CN108570575A (en) | 2018-09-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107012356B (en) | A kind of high-intensity high-conductivity copper based alloy blank of graphene-containing and preparation method thereof | |
Huang et al. | Optimizing the strength, ductility and electrical conductivity of a Cu-Cr-Zr alloy by rotary swaging and aging treatment | |
CN101531149B (en) | Preparation method of overlength Cu-Cr-Zr alloyed contact line | |
CN104975211B (en) | Strength aluminum alloy conductive monofilament in a kind of high conductivity heat treatment type | |
WO2018045695A1 (en) | Softening resistant copper alloy, preparation method, and application thereof | |
CN105609155A (en) | High-conductivity hard aluminum conductor single wire and manufacturing method thereof | |
CN102888525A (en) | Processing method of high-obdurability and high-conductivity copper magnesium alloy | |
CN104278171A (en) | CuTi-series elastic copper alloy and preparation method thereof | |
CN106676313B (en) | A kind of preparation method of high-strength high-conductivity Cu-Nb alloy blanks | |
CN106676334A (en) | High-strength high-conductivity aluminum-scandium alloy as well as preparation method thereof and use thereof | |
CN105839038A (en) | Preparation method for high-strength high-conductivity Cu-Ag-Fe alloy | |
CN111809079A (en) | High-strength high-conductivity copper alloy wire material and preparation method thereof | |
Yang et al. | Microstructure and properties of cold-drawn Cu and Cu-Fe alloy wires | |
CN106676314B (en) | A kind of preparation method of high-strength high-conductivity Cu-Ag alloys | |
CN107828985A (en) | Cu Cr Zr Ni Al copper alloys, wire rod and preparation method thereof | |
CN106086505B (en) | A kind of preparation method of superpower high-conductivity copper alloy as more than 400 kilometers high-speed railway contact line materials applications of speed per hour | |
CN114657410B (en) | High-strength high-conductivity copper-iron alloy and preparation method thereof | |
CN110066939B (en) | High-strength high-conductivity copper-chromium-zirconium alloy and low-temperature deformation preparation method thereof | |
CN113073223B (en) | Preparation method of graphene deformation Cu-Cr series in-situ composite material | |
CN111440964B (en) | High-strength high-conductivity Cu-Fe alloy short-process preparation method | |
CN113073227B (en) | Preparation method of high-conductivity deformed Cu-Fe series in-situ composite material | |
JP4779100B2 (en) | Manufacturing method of copper alloy material | |
CN113969364A (en) | High-strength high-conductivity copper-niobium alloy and preparation method thereof | |
JP5252722B2 (en) | High strength and high conductivity copper alloy and method for producing the same | |
Huang et al. | Effect of cryorolling on microstructure evolution and mechanical properties of spray deposited Cu-Fe alloy |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180731 |
|
WW01 | Invention patent application withdrawn after publication |