CN108329786B - 光固化绝缘涂料组合物 - Google Patents
光固化绝缘涂料组合物 Download PDFInfo
- Publication number
- CN108329786B CN108329786B CN201711486560.2A CN201711486560A CN108329786B CN 108329786 B CN108329786 B CN 108329786B CN 201711486560 A CN201711486560 A CN 201711486560A CN 108329786 B CN108329786 B CN 108329786B
- Authority
- CN
- China
- Prior art keywords
- photo
- coating composition
- insulating coating
- acrylate
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000008199 coating composition Substances 0.000 title claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 239000011347 resin Substances 0.000 claims abstract description 41
- 238000000016 photochemical curing Methods 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000000945 filler Substances 0.000 claims abstract description 11
- 239000000178 monomer Substances 0.000 claims abstract description 3
- 239000012752 auxiliary agent Substances 0.000 claims abstract 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 19
- -1 polytetrafluoroethylene Polymers 0.000 claims description 18
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical group C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 9
- 150000002009 diols Chemical class 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 7
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 claims description 6
- 244000028419 Styrax benzoin Species 0.000 claims description 6
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 6
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 6
- 229960002130 benzoin Drugs 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 235000019382 gum benzoic Nutrition 0.000 claims description 6
- 150000003512 tertiary amines Chemical class 0.000 claims description 6
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 claims description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 5
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 claims description 5
- 150000004056 anthraquinones Chemical class 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 5
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 claims description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 4
- KOMDZQSPRDYARS-UHFFFAOYSA-N cyclopenta-1,3-diene titanium Chemical compound [Ti].C1C=CC=C1.C1C=CC=C1 KOMDZQSPRDYARS-UHFFFAOYSA-N 0.000 claims description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 4
- 239000003112 inhibitor Substances 0.000 claims description 4
- 239000011256 inorganic filler Substances 0.000 claims description 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 4
- 239000012766 organic filler Substances 0.000 claims description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- 238000006116 polymerization reaction Methods 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 239000005056 polyisocyanate Substances 0.000 claims description 3
- 229920001228 polyisocyanate Polymers 0.000 claims description 3
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 claims description 2
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 claims description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 claims description 2
- 239000005995 Aluminium silicate Substances 0.000 claims description 2
- 229920001730 Moisture cure polyurethane Polymers 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- 239000002318 adhesion promoter Substances 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 235000012211 aluminium silicate Nutrition 0.000 claims description 2
- 239000002518 antifoaming agent Substances 0.000 claims description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 2
- 229910002113 barium titanate Inorganic materials 0.000 claims description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 2
- 239000012965 benzophenone Substances 0.000 claims description 2
- 229930006711 bornane-2,3-dione Natural products 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000004927 clay Substances 0.000 claims description 2
- 229910052570 clay Inorganic materials 0.000 claims description 2
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 238000005886 esterification reaction Methods 0.000 claims description 2
- 150000004820 halides Chemical class 0.000 claims description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 2
- 239000001095 magnesium carbonate Substances 0.000 claims description 2
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims description 2
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- 150000001451 organic peroxides Chemical class 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000003211 polymerization photoinitiator Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 abstract description 28
- 239000011248 coating agent Substances 0.000 abstract description 23
- 239000003973 paint Substances 0.000 abstract description 17
- 239000000203 mixture Substances 0.000 abstract description 15
- 239000002904 solvent Substances 0.000 abstract description 9
- 238000001723 curing Methods 0.000 abstract description 7
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000003999 initiator Substances 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 10
- 239000007788 liquid Substances 0.000 description 10
- 238000003786 synthesis reaction Methods 0.000 description 10
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 8
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000005336 cracking Methods 0.000 description 8
- 230000035939 shock Effects 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 5
- 210000003298 dental enamel Anatomy 0.000 description 5
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 5
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000003618 dip coating Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- FEIQOMCWGDNMHM-KBXRYBNXSA-N (2e,4e)-5-phenylpenta-2,4-dienoic acid Chemical compound OC(=O)\C=C\C=C\C1=CC=CC=C1 FEIQOMCWGDNMHM-KBXRYBNXSA-N 0.000 description 1
- CDUQMGQIHYISOP-RMKNXTFCSA-N (e)-2-cyano-3-phenylprop-2-enoic acid Chemical compound OC(=O)C(\C#N)=C\C1=CC=CC=C1 CDUQMGQIHYISOP-RMKNXTFCSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- CCJAYIGMMRQRAO-UHFFFAOYSA-N 2-[4-[(2-hydroxyphenyl)methylideneamino]butyliminomethyl]phenol Chemical compound OC1=CC=CC=C1C=NCCCCN=CC1=CC=CC=C1O CCJAYIGMMRQRAO-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- CYUZOYPRAQASLN-UHFFFAOYSA-N 3-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)CCOC(=O)C=C CYUZOYPRAQASLN-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- JKZFRKHYUVIIFN-UHFFFAOYSA-N 4-(furan-2-yl)but-2-enoic acid Chemical compound OC(=O)C=CCC1=CC=CO1 JKZFRKHYUVIIFN-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- OKOBUGCCXMIKDM-UHFFFAOYSA-N Irganox 1098 Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NCCCCCCNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 OKOBUGCCXMIKDM-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 125000006226 butoxyethyl group Chemical group 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000003074 decanoyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C(*)=O 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- MEGHWIAOTJPCHQ-UHFFFAOYSA-N ethenyl butanoate Chemical compound CCCC(=O)OC=C MEGHWIAOTJPCHQ-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- KCWDJXPPZHMEIK-UHFFFAOYSA-N isocyanic acid;toluene Chemical class N=C=O.N=C=O.CC1=CC=CC=C1 KCWDJXPPZHMEIK-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical group 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- UGVYTRVYOYKZSO-UHFFFAOYSA-N n-butoxy-2-methylprop-2-enamide Chemical compound CCCCONC(=O)C(C)=C UGVYTRVYOYKZSO-UHFFFAOYSA-N 0.000 description 1
- DYLMGWPMAXPGEB-UHFFFAOYSA-N n-ethoxy-2-methylprop-2-enamide Chemical compound CCONC(=O)C(C)=C DYLMGWPMAXPGEB-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229940068918 polyethylene glycol 400 Drugs 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09D133/062—Copolymers with monomers not covered by C09D133/06
- C09D133/064—Copolymers with monomers not covered by C09D133/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09D133/062—Copolymers with monomers not covered by C09D133/06
- C09D133/068—Copolymers with monomers not covered by C09D133/06 containing glycidyl groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/18—Fireproof paints including high temperature resistant paints
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
本发明提供了一种光固化绝缘涂料组合物,所述组合物包括以下重量份数的各组分:光固化树脂15~60份,光聚合引发剂1~15份,光聚合单体5~100份,助剂0~5份,填料5~80份。所述光固化绝缘涂料组合物使用过程中既有光固化绝缘漆的高生产效率、低溶剂排放,添加填料有利于减少涂层瞬间固化的内应力,提高涂层附着,同时提高涂层耐热、硬度、耐刮、绝缘等特性。
Description
技术领域
本发明涉及绝缘涂料技术领域,具体涉及一种光固化绝缘涂料组合物。
背景技术
绝缘漆是漆类中的一种特种漆,是以高分子聚合物为基础,能在一定的条件下固化成绝缘膜或绝缘整体的重要绝缘材料。
绝缘漆主要应用于漆包线漆,漆包线漆主要用于漆包线芯的涂覆绝缘。由于导线在绕制线圈、嵌线等过程中,将经受热、化学和多种机械力的作用,因此要求漆包线漆具有良好的涂覆性(即能均匀涂覆),漆膜附着力强,表面光滑柔软有韧性,有一定的耐磨性和弹性,电气性能好,耐热,耐溶性,对导体无腐蚀等特性。传统的漆包线漆为溶剂型,采用热固化的工艺,使用过程中大量有机溶剂挥发到空气中造成环境污染,同时消耗大量热能,操作环境恶劣。
而采用光固化绝缘漆虽能解决使用过程中的溶剂排放问题,但光固化涂层瞬间固化内应力较大,且大多数金属基材表面已产生一层氧化膜,金属氧化物的表面能低,造成光固化涂料对金属基材的附着力差,而漆包线又对漆膜的附着力要求高,同时要有良好的力学及电学性能。
发明内容
针对现有技术中的缺陷,本发明提供了一种光固化绝缘涂料组合物,形成的固化膜具有良好的耐热性、耐酸性、耐溶剂性、密合性及硬度,添加填料有利于减少涂层瞬间固化的内应力,提高涂层附着,进一步提高涂层的耐磨性和弹性,电气性能好,耐热,耐溶剂等特点。
本发明的目的是通过以下技术方案实现的:
本发明提供了一种光固化绝缘涂料组合物,其特征在于,所述组合物包括以下重量份数的各组分:
优选地,所述组合物包括以下重量份数的各组分:
优选地,所述光固化树脂为分子中含有至少两个乙烯型不饱和键的感光性树脂,所述光固化树脂的合成方法包括以下步骤(1)至(4)中的任一种:
(1)分子中具有两个以上环氧基的多官能团的环氧化合物(a)和不饱和单羧酸(b)进行酯化反应;
(2)(甲基)丙烯酸和其它具有乙烯型不饱和键的共聚单体(d)反应形成的共聚物与(甲基)丙烯酸缩水甘油酯反应;
(3)(甲基)丙烯酸缩水甘油酯和其它具有乙烯型不饱和键的共聚单体(d)的共聚物与不饱和单羧酸(b)反应;
(4)多异氰酸酯(e)和长链二醇(f)反应得到聚氨酯预聚物(g)再与羟基官能化丙烯酸酯(h)反应。
优选地,所述光固化树脂包括所述步骤(1)至(4)方法合成的树脂中的至少两种以上的组合物。
优选地,所述光固化树脂包括所述步骤(1)方法合成的树脂,还包括步骤(2)至(4)方法合成的树脂中的至少一种。
优选地,所述光固化树脂中,步骤(1)方法合成的树脂的质量百分含量为25-75%。
优选地,步骤(1)中,所述环氧化合物(a)包括:双酚A型环氧树脂、氢化双酚A型环氧树脂、双酚F型环氧树脂、双酚S型环氧树脂、可溶可熔酚醛环氧树脂、甲酚可溶环氧树脂、联苯酚型环氧树脂、三酚基甲烷型环氧树脂和N‐缩水甘油型环氧树脂中的至少一种。上述环氧化合物可以单独使用也可以两种以上混合使用。所述双酚A型环氧树脂包括双酚A的可溶可熔环氧树脂、联二甲苯酚型环氧树脂。其中,这些环氧化合物中的双酚A的可溶可熔环氧树脂,因其可以得到具有附着力好以及耐试剂性等性能而优选使用。
优选地,步骤(1)和(3)中,所述不饱和单羧酸(b)包括:丙烯酸、丙烯酸的二聚物、甲基丙烯酸、β-苯乙烯基丙烯酸、β-糠基丙烯酸、丁烯酸、α-氰基肉桂酸、肉桂酸,以及饱和或不饱和二元酸酐与分子中含有一个羟基的(甲基)丙烯酸酯类的反应物或者饱和或不饱和二元酸与不饱和单缩水甘油化合物的反应物半酯类中的至少一种。考虑到光固化性,在这些不饱和单羧酸中优选使用丙烯酸或甲基丙烯酸。
优选地,步骤(2)和(3)中,所述具有乙烯型不饱和键的共聚单体(d)包括:苯乙烯;氯苯乙烯;α-甲基苯乙烯;由甲基、乙基、丙基、异丙基、正丁基、异丁基、叔丁基、氨基、2-乙基己基、辛基、癸酰、壬基、癸基、十二烷基、十六烷基、十八烷基、环己基、异冰片基、甲氧基乙基、丁氧基乙基、2-羟基乙基、2-羟基丙基和3-氯-2-羟基丙基中的至少一种取代的丙烯酸酯或甲基丙烯酸酯;聚乙二醇的单丙烯酸酯或单甲基丙烯酸酯;聚丙二醇的单丙烯酸酯或单甲基丙烯酸酯;醋酸乙烯酯;丁酸乙烯酯;苯甲酸乙烯酯;丙烯酰胺;甲基丙烯酰胺;N-羟基甲基丙烯酰胺;N-甲氧基甲基丙烯酰胺;N-乙氧基甲基丙烯酰胺;N-丁氧基甲基丙烯酰胺;丙烯腈或马来酸酐等中的至少一种。这些共聚单体(d)可以单独使用也可以两种以上混合使用。
优选地,步骤(4)中,所述多异氰酸酯(e)包括:甲苯二异氰酸酯(TDI)、六亚甲基二异氰酸酯(HDI)、异氟尔酮二异氰酸酯(IPDI)或氢化苯基甲烷二异氰酸酯(HMDI)等中的至少一种,更优选为IPDI和/或HMDI。最优选为HMDI;
所述长链二醇(f)包括聚醚二醇、聚酯二醇两大类,其中聚醚二醇包括聚乙二醇、聚丙二醇、环氧乙烷-环氧丙烷共聚物、聚(1,4-丁二醇)中的至少一种;聚酯二醇为二元羧酸(或酸酐)同二元醇缩聚反应制备。更优选为聚醚二醇;
所述羟基官能化丙烯酸酯(h)包括:(甲基)丙烯酸-2-羟乙酯、(甲基)丙烯酸-2-羟丙酯、三羟甲基丙烷二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯中的至少一种,更优选为丙烯酸-2-羟乙酯、丙烯酸-2-羟丙酯中的至少一种。
本发明光固化绝缘涂料组合物中的光固化树脂并不限于以上所述的物质,只要是分子中具有至少两个乙烯型不饱和键都可以在本发明中使用。上述物质也可以混合使用。优选光固化树脂中两种或两种以上组合而成,且组合中优选含有(1)中反应得到的光固化树脂。
优选地,所述填料(E)的平均粒径为1~10微米。更优选3~10微米。粒径太小起不到减小涂层固化后内应力的作用,粒径太大影响涂层的绝缘性。
优选地,所述填料(E)为无机填料、有机填料中的至少一种;所述无机填料选自石英粉、二氧化硅、硫酸钡、钛酸钡、氧化硅粉末、滑石粉、粘土、碳酸镁、碳酸钙、氧化铝、氢氧化铝、云母、高岭土中的至少一种;所述有机填料选自聚四氟乙烯粉末、聚酰亚胺粉末中的至少一种。
优选地,所述光聚合引发剂(B)为苯偶姻、苯偶姻烷基醚、苯乙酮类光引发剂、蒽醌类光引发剂、噻吨酮类光引发剂、缩酮类光引发剂、有机过氧化物、硫醇化合物、有机卤化物、二苯酮类光引发剂、2,4,6‐三甲基苯甲酰基二苯基磷氧化物、双[2,6‐二氟‐3‐(1H‐吡咯基‐1)苯基]钛茂、双(五氟苯基)钛茂、蒽醌/叔胺光引发体系、樟脑醌/叔胺光引发体系、3‐酮基香豆素/叔胺光引发体系、2‐甲基‐1‐[4‐(甲基硫代)苯基]‐2‐吗啉基丙酮‐1、2‐苄基‐2‐二甲基胺基‐1‐(4‐吗啉基苯基)‐丁烷‐1‐酮中的一种或几种的混合。
更优选地,所述光聚合光引发剂(B)为苯偶姻、苯偶姻烷基醚、苯乙酮类光引发剂、蒽醌类光引发剂中的至少一种。
优选地,所述光聚合单体(C为(甲基)丙烯酸-2-羟乙酯、(甲基)丙烯酸-2-羟丙酯、1,6-己二醇二丙烯酸酯、三丙二醇二丙烯酸酯中的一种或两种。更优选含有(甲基)丙烯酸-2-羟乙酯的组合。
优选地,所述助剂(D)为流平剂、消泡剂、阻聚剂、光引发助剂、附着力促进剂中的一种或几种。
本发明所使用术语含义如下:
“(甲基)丙烯酸”系指丙烯酸、甲基丙烯酸以及其混合物的总称,其它类似的表示含义相仿。
“乙烯型不饱和键”系指分子中含有乙烯键。
与传统绝缘漆技术相比,本发明具有如下的有益效果:
1、无烘烤环节,减少能源消耗;
2、快速固化,提高生产效率;
3、采用百分百固含UV配方,无溶剂挥发,环境友好。
与类似的光固化绝缘漆相比,本发明具有如下的有益效果:
组合物添加填料有利于提高涂层耐热、硬度、耐刮、绝缘等特性。
具体实施方式
下面结合具体实施例对本发明进行详细说明。以下实施例将有助于本领域的技术人员进一步理解本发明,但不以任何形式限制本发明。应当指出的是,对本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进。这些都属于本发明的保护范围。
合成例1紫外光固化树脂A1的合成
在反应器中加入100克双酚A的可溶可熔环氧树脂(E51树脂,环氧当量200)(无锡树脂厂生产)、40克丙烯酸、0.5克对苯二酚和2克N,N-二甲基苄氨,并在95-98℃的温度反应15小时,测定其酸值小于3。得到浅黄色的树脂液A1。
合成例2紫外光固化树脂A2的合成
在反应器中按照摩尔比为1:2:1的比例加入甲基丙烯酸甲酯、甲基丙烯酸丁酯和丙烯酸,溶剂使用卡必醇醋酸酯,催化剂使用偶氮二异丁腈(AIBN),在80℃搅拌4小时,得到树脂溶液。
冷却该树脂液,使用甲基氢醌作为阻聚剂,三苯基膦作为催化剂,在90-95℃条件下与甲基丙烯酸缩水甘油酯反应,甲基丙烯酸缩水甘油酯与第一步反应丙烯酸的摩尔比为1:1,反应进行16小时,冷却后将生成物树脂液A2。
合成例3紫外光固化树脂A3的合成
在反应器中按照摩尔比为1:1:1的比例加入甲基丙烯酸缩水甘油酯、甲基丙烯酸甲酯和甲基丙烯酸丁酯,催化剂使用偶氮二异丁腈(AIBN),在80℃搅拌4小时,得到树脂液。
冷却该树脂液,使用甲基氢醌作为阻聚剂,三苯基膦作为催化剂,在90-95℃条件下与丙烯酸反应,丙烯酸与第一步反应中所用的甲基丙烯酸缩水甘油酯的摩尔比为1:1,反应进行16小时,冷却后将生成物树脂液A3取出。
合成例4紫外光固化树脂A4的合成
在反应器中按照摩尔比为2:1的比例加入六亚甲基二异氰酸酯(HDI)、聚乙二醇400,在75~80℃下,在乙酸乙酯中反应2-3小时,得到双端异氰酸酯基的聚氨酯树脂液,然后加入与HDI等摩尔的丙烯酸羟乙酯,在75~80℃下进行封端反应1-2小时,得到树脂液A4取出。
合成例5紫外光固化树脂A5的合成
在反应器中加入100g双((3,4-环氧环己基)甲基)己二酸酯(UVR-6128,环氧当量190-210)(湖北新景新材料有限公司生产),40克丙烯酸、0.5克对苯二酚和2克N,N-二甲基苄氨,并在95-98℃的温度反应15小时,测定其酸值小于3。得到浅黄色的树脂液A5。
实施例1~7
实施例1~7分别提供了一种光固化绝缘涂料组合物,各组合物对应的原料组分及重量份数如表1所示;
分别将各实施例对应的原料组分按其重量份数混合,中速分散2小时,过滤,即得对应的一种光固化绝缘涂料组合物。
对比例1~6
对比例1~6各提供了一种光固化绝缘涂料组合物,各组合物对应的原料组分及重量份数如表1所示;其制备方法包括如下步骤:
(a)按照表1所示的组分及重量份数备料;
(b)将所述原料组分混合,中速分散2小时,过滤,即得一种光固化绝缘涂料组合物。
表1
注1:购自德国巴斯夫的抗氧化剂Irganox1010,四[β-(3,5-二叔丁基-4-羟基苯基)丙酸]季戊四醇酯;
注2:购自德国巴斯夫的抗氧化剂Irganox1098,N,N’-1,6-亚己基-二-[3,5-二叔丁基-4-羟基苯丙酰胺];
注3:购自台湾双键化工股份有限公司的光引发剂Doublecure184,α-羟基酮;
注4:购自迪高公司的Tego410。
性能检测
为了本发明与现有技术的涂料进行比较,用下面的方法进行涂布,测定涂料的平整度、附着力、镀铝牢度、样张外观、耐温。
一、外观
用浸涂法将光固化绝缘涂料组合物涂布在退火后的铜线上,采用300mJ/cm2的紫外光光照固化,然后目测涂层外观。
评价方法:外观有针孔及刮痕为差;外观光滑无漆瘤为优。
二、电性能
用浸涂法将光固化绝缘涂料组合物涂布在退火后的铜线上,做成测试漆包线,取漆包线0.5m对折一次,将对折部分剪断并刮去四根线漆皮,将对折后的漆包线拧成麻花状,分别用高压仪测试同一端两根线头的高压。
评价方法:
击穿电压在2700V以下为差;
击穿电压在2700V-5000V为良;
击穿电压在5000V以上为优。
三、附着力
用刮涂法将涂料涂布在退火后的铜线上,做成测试漆包线,将漆包线与相对应的绕上十圈,检验漆膜有无开裂脱落。
评估方法:完全没有开裂脱落为优,有开裂无脱落为良,有开裂脱落为差。
四、伸长率
用浸涂法将光固化绝缘涂料组合物涂布在退火后的铜线上,做成测试漆包线,按照GBT 4074.1-2008标准使用拉伸仪测试拉伸率。
计算方法:(拉伸后的长度-拉伸前的长度)/拉伸前的长度
评估方法:拉伸率超过30%为优,拉伸率低于30%为差。
五、急拉断
按照GBT 4074.1-2008标准每秒2米的速度急拉,检验漆膜有无开裂。
评估方法:无开裂为优,开裂为差。
六、热冲击
按照GBT 4074.1-2008标准将卷绕漆包线放在烘箱中烘0.5小时,烘完以后检验漆膜有无开裂。
评估方法:无开裂为优,开裂为差。
七、高温高湿测试
将与上述测试一的方式制备的测试漆包线在85℃、95%湿度的环境下放置72h。
评估方法:完全没有开裂脱落为优,有开裂但没有脱落为良,有开裂脱落为差。
性能检测结果如表2所示:
表2性能检测情况
由表2可知,实施例1~7制得的一种光固化绝缘涂料组合物与对比例1~6的光固化绝缘涂料组合物相比:实施例制备的组合物在电性能、附着力、热冲击、高温高湿性能这四方面性能突出。
对比例1-2与实施例1相比,因没有树脂液A1,制备的组合物电性能、热冲击、高温高湿性能都较差。对比例3与实施例3相比,因仅含有树脂液A1,制备的组合物的电性能、热冲击、高温高湿性能同样较差。对比例5与实施例1的对比可知,采用树脂液A1与非本发明的其他树脂液A2-A4混合,同样难以获得本发明的电性能、热冲击、高温高湿性能。因此,上述对比说明将树脂液A1仅与树脂液A2-A4混合后,可显著提高涂料组合物的电性能、热冲击、高温高湿性能。
对比例4与实施例3相比,因未添加填料,制备的组合物附着力、热冲击、高温高湿性能较差。而对比例6与实施例6相比,因添加的填料过多,同样导致制备的组合物附着力、热冲击、高温高湿性能变差。
综上所述,本发明的一种光固化绝缘涂料组合物使用过程中既有光固化绝缘漆的高生产效率、低溶剂排放,添加填料有利于减少涂层瞬间固化的内应力,提高涂层附着,同时提高涂层耐热、硬度、耐刮、绝缘等特性。
本发明具体应用途径很多,以上所述仅是本发明的优选实施方式。应当指出,以上实施例仅用于说明本发明,而并不用于限制本发明的保护范围。对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进,这些改进也应视为本发明的保护范围。
Claims (5)
1.一种光固化绝缘涂料组合物,其特征在于,所述组合物由以下重量份数的各组分组成:
所述填料的平均粒径为1~10微米;
所述助剂为流平剂、消泡剂、阻聚剂、光引发助剂、附着力促进剂中的一种或几种;
所述光固化树脂包括所述步骤(1)方法合成的树脂,还包括步骤(2)至(4)方法合成的树脂中的至少一种;
步骤(1)至(4)分别为:
(1)分子中具有两个以上环氧基的多官能团的环氧化合物(a)和不饱和单羧酸(b)进行酯化反应;
(2)(甲基)丙烯酸和其它具有乙烯型不饱和键的共聚单体(d)反应形成的共聚物与(甲基)丙烯酸缩水甘油酯反应;
(3)(甲基)丙烯酸缩水甘油酯和其它具有乙烯型不饱和键的共聚单体(d)的共聚物与不饱和单羧酸(b)反应;
(4)多异氰酸酯(e)和长链二醇(f)反应得到聚氨酯预聚物(g)再与羟基官能化丙烯酸酯(h)反应。
2.根据权利要求1所述的光固化绝缘涂料组合物,其特征在于,所述光固化树脂中,所述步骤(1)方法合成的树脂的质量百分含量为25-75%。
3.根据权利要求1所述的光固化绝缘涂料组合物,其特征在于,所述填料为无机填料、有机填料中的至少一种;所述无机填料选自石英粉、二氧化硅、硫酸钡、钛酸钡、氧化硅粉末、滑石粉、粘土、碳酸镁、碳酸钙、氧化铝、氢氧化铝、云母、高岭土中的至少一种;所述有机填料选自聚四氟乙烯粉末、聚酰亚胺粉末中的至少一种。
4.根据权利要求1所述的光固化绝缘涂料组合物,其特征在于,所述光聚合光引发剂为苯偶姻、苯偶姻烷基醚、苯乙酮类光引发剂、蒽醌类光引发剂、噻吨酮类光引发剂、缩酮类光引发剂、有机过氧化物、硫醇化合物、有机卤化物、二苯酮类光引发剂、2,4,6-三甲基苯甲酰基二苯基磷氧化物、双[2,6-二氟-3-(1H-吡咯基-1)苯基]钛茂、双(五氟苯基)钛茂、蒽醌/叔胺光引发体系、樟脑醌/叔胺光引发体系、3-酮基香豆素/叔胺光引发体系、2-甲基-1-[4-(甲基硫代)苯基]-2-吗啉基丙酮-1、2-苄基-2-二甲基胺基-1-(4-吗啉基苯基)-丁烷-1-酮中的一种或几种的混合。
5.根据权利要求1所述的光固化绝缘涂料组合物,其特征在于,所述光聚合单体为(甲基)丙烯酸-2-羟乙酯、(甲基)丙烯酸-2-羟丙酯、1,6-己二醇二丙烯酸酯、三丙二醇二丙烯酸酯中的一种或两种。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711486560.2A CN108329786B (zh) | 2017-12-29 | 2017-12-29 | 光固化绝缘涂料组合物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711486560.2A CN108329786B (zh) | 2017-12-29 | 2017-12-29 | 光固化绝缘涂料组合物 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108329786A CN108329786A (zh) | 2018-07-27 |
CN108329786B true CN108329786B (zh) | 2020-06-26 |
Family
ID=62924664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711486560.2A Expired - Fee Related CN108329786B (zh) | 2017-12-29 | 2017-12-29 | 光固化绝缘涂料组合物 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108329786B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102141376B1 (ko) * | 2018-09-07 | 2020-08-05 | 아라까와 가가꾸 고교 가부시끼가이샤 | 활성 에너지선 경화형 수지조성물, 경화물 및 적층체 |
CN109321024B (zh) * | 2018-09-26 | 2021-02-12 | 上海乘鹰新材料有限公司 | 一种适合led固化的光固化热固化绝缘底漆组合物及其制备 |
CN115785713A (zh) * | 2022-12-09 | 2023-03-14 | 中创新航科技股份有限公司 | 绝缘涂料及包括其的电池 |
CN117126334A (zh) * | 2023-09-20 | 2023-11-28 | 佛山市优唯特新材料有限公司 | 一种3d打印光固化树脂 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1160995A (ja) * | 1997-08-25 | 1999-03-05 | Toyo Ink Mfg Co Ltd | 紫外線硬化型樹脂組成物及びその利用 |
JP3771711B2 (ja) * | 1998-03-31 | 2006-04-26 | 互応化学工業株式会社 | フォトソルダーレジストインクの製造方法 |
CN104312414B (zh) * | 2014-09-28 | 2017-06-16 | 上海乘鹰新材料有限公司 | Uv‑镭射转移涂料组合物及其用途 |
CN106497346A (zh) * | 2016-10-26 | 2017-03-15 | 上海乘鹰新材料有限公司 | 光固化绝缘底漆组合物及其在漆包线中的应用 |
CN107216776B (zh) * | 2017-06-02 | 2019-11-22 | 上海维凯光电新材料有限公司 | 一种光热双重固化绝缘涂料组合物及其应用 |
-
2017
- 2017-12-29 CN CN201711486560.2A patent/CN108329786B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN108329786A (zh) | 2018-07-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108329786B (zh) | 光固化绝缘涂料组合物 | |
TW201345940A (zh) | 胺基甲酸酯(甲基)丙烯酸酯及防濕絕緣塗料 | |
CN107667154B (zh) | 车用水溶性涂料组合物 | |
JP5215897B2 (ja) | 塗膜形成方法 | |
CN106118320A (zh) | 一种紫外光固化绝缘底漆组合物及其应用 | |
CN110003441B (zh) | 一种uv固化水性异氰酸酯接枝氟硅氧烷改性环氧丙烯酸树脂的制备方法 | |
CN109321024B (zh) | 一种适合led固化的光固化热固化绝缘底漆组合物及其制备 | |
CN115975496A (zh) | 一种uv固化压制成型涂料 | |
JP2003192750A (ja) | 紫外線硬化性樹脂組成物 | |
CN111675999A (zh) | 一种可光固化的胶层组合物及其保护膜 | |
CN105086605B (zh) | 一种光固化热固化组合物油墨、用途及含有其的线路板 | |
CN102385254B (zh) | 感光树脂组合物 | |
CN106497346A (zh) | 光固化绝缘底漆组合物及其在漆包线中的应用 | |
TW201610028A (zh) | 活性能量線硬化型組成物 | |
CN110922603B (zh) | 一种不同链段改性的光固化树脂及其制备方法和应用 | |
CN113185909B (zh) | 一种光固化涂料及其制备方法和应用 | |
JPH11181041A (ja) | 光硬化性樹脂組成物及び塗料 | |
KR101400120B1 (ko) | 광경화형 도료 조성물 | |
JP5450922B2 (ja) | 活性エネルギー線硬化被膜形成組成物用の表面調整剤 | |
CN114790148B (zh) | 一种多官能度活性稀释剂、其制备方法及应用 | |
JP2002275226A (ja) | 光硬化性樹脂組成物、これを用いた塗料及び硬化膜 | |
JP4171154B2 (ja) | 光硬化性樹脂組成物 | |
JP2001200024A (ja) | 光硬化性樹脂組成物 | |
JP5125100B2 (ja) | 重合性不飽和結合を有するアクリル系重合体の製造方法 | |
CN115074016B (zh) | 水性单涂uv固化铝粉漆及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200626 |