CN108322998A - A kind of temperature sensor composite circuit board - Google Patents
A kind of temperature sensor composite circuit board Download PDFInfo
- Publication number
- CN108322998A CN108322998A CN201810235090.0A CN201810235090A CN108322998A CN 108322998 A CN108322998 A CN 108322998A CN 201810235090 A CN201810235090 A CN 201810235090A CN 108322998 A CN108322998 A CN 108322998A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- composite circuit
- temperature sensor
- plate
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 41
- 239000002184 metal Substances 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000007769 metal material Substances 0.000 claims abstract description 5
- 238000007747 plating Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims abstract description 3
- 239000002356 single layer Substances 0.000 claims abstract description 3
- 230000027455 binding Effects 0.000 claims description 23
- 238000009739 binding Methods 0.000 claims description 23
- 239000000203 mixture Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000002411 adverse Effects 0.000 abstract 1
- 238000006073 displacement reaction Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 238000010897 surface acoustic wave method Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000006071 cream Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention provides a kind of temperature sensor composite circuit board, including metal heat-conducting plate and circuit board, it is characterised in that：Single-layer or multi-layer press fit of circuit boards is bonded in metal heat-conducting plate, and from circuit boring to heat conduction plate interiors, bore inner is by plating conductive metallic material connection circuit plate and heat-conducting plate.The configuration of the present invention is simple, it is easy to use, it is highly practical.The heat conductivility of circuit board is not only increased, and compactness is strong, avoids the adverse effects such as displacement occur when production.
Description
Technical field
The present invention relates to temperature sensor fields, more specifically to passive wireless temperature sensor field.
Background technology
Temperature sensor using surface acoustic wave (SAW) technology has the advantages of passive and wireless, can be directly installed on electric power
On the component that equipment is easily generated heat, the temperature of on-line monitoring power equipment is realized, without staff to live inspection.
Using the temperature sensor of surface acoustic wave (SAW) technology mainly by metal heat-conducting plate, circuit board, SAW chip, spiral
Antenna and shell composition.
Since temperature is mainly to be reached in the SAW chip of welding on circuit boards by thermal conductive metal plate, then pass through spiral day
Line is in close contact so must assure that between metal heat-conducting plate and circuit board to temperature acquisition system transmission data.
Based on connection thermal conductive metal plate and circuit board is mainly welded by tin cream at present, it will produce during actual fabrication
Connect insecure, circuit board shifts；Tin cream smearing is uneven, and metal heat-conducting plate and circuit board cannot come into full contact with；Tin cream
Excessively, the problems such as location hole is plugged.
To manufacture bring it is many inconvenience while, heat conductivility is also bad always, can not quickly conduct in time
Heat.
Therefore, because there are above-mentioned technological deficiencies for the prior art, it is those skilled in that art's urgent problem to be solved.
Invention content
The present invention provides a kind of temperature sensor composite circuit boards, it is intended to solve in the prior art thermal conductive metal plate with
Circuit board connection type is not close, the problem of heat transfer not in time.
In order to solve the above technical problems, the present invention adopts the following technical scheme that：A kind of temperature sensor composite circuit board,
It including metal heat-conducting plate and circuit board, single-layer or multi-layer press fit of circuit boards or is bonded in metal heat-conducting plate, from circuit boring
To heat conduction plate interiors, bore inner is by plating conductive metallic material connection circuit plate and heat-conducting plate.
Preferably, board area is equal to or less than metal heat-conducting plate suqare in told composite circuit board.
Preferably, the composite circuit board is binding type composite circuit board, the binding type composite circuit board includes flat
Whole and binding portion, the binding portion is formed by being located at the binding notch that metal heat-conducting plate opens up.
Preferably, rounded corner processing is made at four angles of the binding type composite circuit board.
Preferably, the binding type composite circuit board four corners region is equipped with location hole.
Preferably, the composite circuit board is tuning-fork-type, the tuning-fork-type composite circuit board includes evener and tuning fork
There is C-shaped gap in portion, the tuning fork portion.
Preferably, rounded corner processing is made in the corner of the tuning-fork-type composite circuit board.
Preferably, circuit board and the four corners region of heat-conducting plate overlapping region are equal in the tuning-fork-type composite circuit board
Equipped with location hole.
Description of the drawings
It, below will be to the required attached drawing of embodiment for the clearer technical solution for illustrating the embodiment of the present invention
It is briefly described, it is clear that, drawings in the following description are only some embodiments of the invention, for this field skill
For art personnel, without creative efforts, other drawings may also be obtained based on these drawings.
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is a kind of structural schematic diagram of embodiment of the binding type composite circuit board of the present invention；
Fig. 3 is a kind of structural schematic diagram of embodiment of the tuning-fork-type composite circuit board of the present invention；
In figure：1 circuit board；11 easy conductive metal materials；2 metal heat-conducting plates；3 binding type eveners；4 location holes；5 bindings
Notch；6 binding portions；7 tuning-fork-type eveners；8 tuning fork portions；9 location holes；10C type notches.
Specific implementation mode
The present invention provides a kind of composite circuit boards for temperature sensor, and the configuration of the present invention is simple is easy to use, real
It is strong with property.
With reference to the attached drawing in the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear and detailed
Description, it is clear that, embodiment in being described below is only a part of the embodiment of the present invention, rather than whole realities
Apply example.Based on the embodiments of the present invention, those skilled in the art are obtained under the premise of not making the creative labor
Other all embodiments, shall fall within the protection scope of the present invention.
The present invention, a kind of temperature sensor composite circuit board, including metal heat-conducting plate 2 are illustrated with reference to Fig. 1
With circuit board 1, circuit board 1 is pressed or is bonded in metal heat-conducting plate 2, inside the drilling to metal heat-conducting plate 2 of circuit board 1, is bored
By plating conductive metallic material 11, connection circuit plate and heat-conducting plate inside hole.
Embodiment 1
As shown in Fig. 2, the composite circuit board is binding type composite circuit board, the binding type composite circuit board includes bundle
Tie up type evener 3 and binding portion 6.Evener 3 by part metals heat-conducting plate and circuit board group at composite circuit board constitute.Binding
Portion 6 is made of part metals heat-conducting plate.3 four corners of told evener all change into fillet, and there are four location holes 4 on the inside of fillet
For positioning protection cap.Respectively there are one binding notches 5 for connecting testee at 3 both ends of binding portion.
Embodiment 2
As shown in figure 3, the composite circuit board is tuning-fork-type composite circuit board, the tuning-fork-type composite circuit board includes flat
Whole 7 and tuning fork portion 8.Evener 7 by part metals heat-conducting plate and circuit board group at composite circuit board constitute.Tuning fork portion 8 by
Part metals heat-conducting plate is constituted.7 two corners of told evener and 8 corner of tuning fork portion all change into fillet, in 7 four angles of evener
There are four location holes 9 for positioning protection cap for side.There are one C-shaped gaps for connecting testee in the tuning fork portion 8.
The invention has the beneficial effects that：The present invention is compared with the existing technology, close with circuit board by metal heat-conducting plate
It is joined together to form an entirety, avoids shifting in production, connection is not close；Metal heat-conducting plate passes when normal work
The problems such as passing heat not in time.The configuration of the present invention is simple, it is easy to use, it is highly practical.
Embodiments disclosed above is only presently preferred embodiments of the present invention, rather than the applicable model for limiting the present invention
It encloses.Related technical personnel modify with the embodiment of the present invention and are obtained with reference to the present invention without making creative work
Other all embodiments obtained, shall fall within the protection scope of the present invention.
Claims (8)
1. a kind of temperature sensor composite circuit board, including metal heat-conducting plate and circuit board, it is characterised in that：Single-layer or multi-layer
Press fit of circuit boards is bonded in metal heat-conducting plate, and from circuit boring to heat conduction plate interiors, bore inner is conductive by plating
Metal material communication line plate and heat-conducting plate.
2. temperature sensor composite circuit board according to claim 1, it is characterised in that：It is electric in the composite circuit board
Road plate suqare is equal to or less than metal heat-conducting plate suqare.
3. temperature sensor composite circuit board according to claim 1, it is characterised in that：The composite circuit board is bundle
Type composite circuit board is tied up, the binding type composite circuit board includes evener and binding portion, and the binding portion is led by being located at metal
The binding notch composition that hot plate opens up.
4. temperature sensor composite circuit board according to claim 3, it is characterised in that：The binding type compound circuit
Make rounded corner processing in four angles of plate.
5. temperature sensor composite circuit board according to claim 3, it is characterised in that：The binding type compound circuit
Plate four corners region is equipped with location hole.
6. temperature sensor composite circuit board according to claim 1, it is characterised in that：The composite circuit board is sound
Forked type, the tuning-fork-type composite circuit board include evener and tuning fork portion, and there is C-shaped gap in the tuning fork portion.
7. temperature sensor composite circuit board according to claim 6, it is characterised in that：The tuning-fork-type compound circuit
Make rounded corner processing in the corner of plate.
8. temperature sensor composite circuit board according to claim 6, it is characterised in that：The tuning-fork-type compound circuit
Circuit board and the four corners region of heat-conducting plate overlapping region are equipped with location hole in plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810235090.0A CN108322998A (en) | 2018-03-21 | 2018-03-21 | A kind of temperature sensor composite circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810235090.0A CN108322998A (en) | 2018-03-21 | 2018-03-21 | A kind of temperature sensor composite circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108322998A true CN108322998A (en) | 2018-07-24 |
Family
ID=62899042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810235090.0A Withdrawn CN108322998A (en) | 2018-03-21 | 2018-03-21 | A kind of temperature sensor composite circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108322998A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110252984A1 (en) * | 2010-04-14 | 2011-10-20 | Prince Castle, Inc. | Temperature Sensor for a Food Holding Cabinet |
| CN205647093U (en) * | 2016-04-27 | 2016-10-12 | 广东威灵电机制造有限公司 | Termination , motor and electrical equipment |
| CN106163114A (en) * | 2015-04-15 | 2016-11-23 | 深南电路股份有限公司 | A kind of metal-base circuit plate structure and processing method thereof |
| CN205861239U (en) * | 2016-07-15 | 2017-01-04 | 中科微声（天津）传感技术有限公司 | A kind of wireless and passive temperature measuring equipment |
-
2018
- 2018-03-21 CN CN201810235090.0A patent/CN108322998A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110252984A1 (en) * | 2010-04-14 | 2011-10-20 | Prince Castle, Inc. | Temperature Sensor for a Food Holding Cabinet |
| CN106163114A (en) * | 2015-04-15 | 2016-11-23 | 深南电路股份有限公司 | A kind of metal-base circuit plate structure and processing method thereof |
| CN205647093U (en) * | 2016-04-27 | 2016-10-12 | 广东威灵电机制造有限公司 | Termination , motor and electrical equipment |
| CN205861239U (en) * | 2016-07-15 | 2017-01-04 | 中科微声（天津）传感技术有限公司 | A kind of wireless and passive temperature measuring equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180724 |