CN108305904B - Overlapping type solar cell module - Google Patents

Abstract

The present invention provides an efficient configuration for a solar cell module, the configuration comprising solar cells conductively bonded to each other in a shingled manner to form a super cell, which can be arranged to efficiently utilize the area of the solar module, reduce series resistance, and improve module efficiency. The front surface metallization pattern on the solar cell may be configured to enable single step stencil printing, which is facilitated by the overlapping configuration of the solar cells in the super cell. A solar photovoltaic system may include two or more such high voltage solar cell modules electrically connected in parallel with each other and electrically connected to an inverter.

Description

Overlapping type solar cell module

The present application is a divisional application based on chinese patent application having an application date of 2015, 5 and 26, and an application number of 201580027878.7 (international application number of PCT/US2015/032472), entitled "stacked solar cell module".

Cross Reference to Related Applications

This international patent application claims priority to the following patent applications: us patent application No.14/530,405 entitled "shifted Solar Cell Module" filed 31/10/2014, us patent application No.14/532,293 entitled "shifted Solar Cell Module" filed 4/11/2014, us patent application No.14/536,486 entitled "shifted Solar Cell Module" filed 7/11/2014, us patent application No.14/539,546 entitled "shifted Solar Cell Module" filed 12/11/2014, us patent application No.14/543,580 entitled "shifted Solar Cell Module" filed 17/11/2014, us patent application No.14/548,081 entitled "shifted Solar Cell Module" filed 19/11/2014, us patent application No.14/550,676 entitled "shifted Solar Cell Module" filed on 21/11/2014, us patent application No.14/552,761 entitled "shifted Solar Cell Module" filed on 25/11/2014, us patent application No.14/560,577 entitled "shifted Solar Cell Module" filed on 4/12/2014, us patent application No.14/566,278 entitled "shifted Solar Cell Module" filed on 10/12/2014, us patent application No.14/565,820 entitled "shifted Solar Cell Module" filed on 10/12/2014, us patent application No.14/572,206 entitled "shifted Solar Cell Module" filed on 16/12/2014, united states patent application No.14/577,593 entitled "shifted Solar Cell Module" filed on 19/12/2014, united states patent application No.14/586,025 entitled "shifted Solar Cell Module" filed on 30/12/2014, united states patent application No.14/585,917 entitled "shifted Solar Cell Module" filed on 30/12/2014, united states patent application No.14/594,439 entitled "shifted Solar Cell Module" filed on 12/1/2015, united states patent application No. 2015 38 entitled "shifted Solar Cell Module" filed on 12/1/2015, united states patent application No.14/605,695 entitled "shifted Solar Cell Module" filed on 27/5/2014, united states patent application No.62/003,223 entitled "shifted Solar Cell Module" (stacked Solar Cell Module), united states provisional patent application No.62/036,215 entitled "shifted Solar Cell Module" filed on 12/8/2014, united states provisional patent application No.62/042,615 entitled "shifted Solar Cell Module" filed on 27/8/2014, united states provisional patent application No.62/048,858 entitled "shifted Solar Cell Module" filed on 11/9/2014, united states provisional patent application No.62/064,260 entitled "shifted Solar Cell Module" filed on 15/10/2014, united states provisional patent application No.62/064,834 entitled "shifted Solar Cell Module" filed on 10/16/10/2014, united states provisional patent application No.62/064,834 filed on 31/3/31 entitled "shifted Solar Cell Module" filed on concealed Solar Cell Module "filed on 14/31/10 674,983 U.S. patent application Ser. No.62/081,200 entitled "Solar Cell Panel Employing High Voltage Taps" (Solar Panel with Hidden Taps) filed on 11, 18, 2014, No.62/113,250 entitled "shifted Solar Cell Panel Employing High Voltage Taps" (overlapping Solar Panel with Hidden Taps) filed on 2,6, 2015, No.62/082,904 entitled "High Voltage Solar Panel" (High Voltage Solar Panel) filed on 11, 21, 2014, No.62/103,816 entitled "High Voltage Solar Panel" (High Voltage Solar Panel) filed on 11, 15, 2015, No.62/111,757 entitled "Solar Panel" (High Voltage Solar Panel) filed on 2, 4, 62/134,176 U.S. provisional patent application entitled "Solar Cell cleaning Tools and Methods" filed on 3/17/2015, 62/150,426 U.S. provisional patent application entitled "shifted Solar Cell Panel compounding step-Printed Cell validation" (Solar Cell panels including Stencil Printed Cell Metallization) filed on 4/21/2015, 62/035,624 U.S. provisional patent application entitled "Solar Cells with Reduced Edge Carrier combination" filed on 8/11/2014, 29/506,415 U.S. design patent application filed on 10/15/2014, 29/506,755 U.S. design patent application filed on 10/20/2014, 29/508,323 U.S. design patent application filed on 11/2014, the U.S. design patent application No.29/509,586 filed 11/19/2014, and the U.S. design patent application No.29/509,588 filed 11/19/2014. Each of the patent applications listed above is incorporated by reference herein in its entirety for all purposes.

Technical Field

The present invention generally relates to solar cell modules in which the solar cells are arranged in an overlapping manner.

Background

Humans need alternative energy sources to meet the increasing energy demand worldwide. In many geographic areas, electricity generated from solar (e.g., photovoltaic) cells, in part by means of solar resources, is sufficient to meet this demand.

Disclosure of Invention

Disclosed herein are efficient arrangements of solar cells in solar cell modules, and methods of making such solar modules.

In one aspect, a solar module includes a string of rectangular or substantially rectangular solar cells, N greater than or equal to 25, connected in series with each other, having an average breakdown voltage greater than about 10 volts. The solar cells are grouped into one or more super cells, each of which includes two or more solar cells arranged in a line, wherein long sides of adjacent solar cells overlap each other and are conductively bonded to each other by an adhesive that is both electrically and thermally conductive. In the string of solar cells, no single solar cell or group of solar cells having a total number less than N are individually electrically connected in parallel with the bypass diode. The overlapping portions along the super cell, which are bonded across adjacent solar cells, provide efficient thermal conduction that prevents or reduces the formation of hot spots in the reverse bias solar cell, which facilitates safe and reliable operation of the solar module. The super cell may be encapsulated in, for example, a thermoplastic olefin polymer sandwiched between a glass front sheet and a glass back sheet to further enhance the resistance of the module to thermal damage. In some variations, N may be greater than or equal to 30, 50, or 100.

In another aspect, a super cell comprises a plurality of silicon solar cells, wherein each silicon solar cell has rectangular or substantially rectangular front (sun facing side) and back surfaces, the shape of these surfaces being defined by first and second oppositely disposed and parallel long sides, and two oppositely disposed short sides. Each solar cell includes: a conductive front surface metallization pattern comprising at least one front surface contact pad disposed adjacent the first long side; and a conductive back surface metallization pattern comprising at least one back surface contact pad disposed adjacent the second long side. The silicon solar cells are arranged in a line with the first and second long sides of adjacent silicon solar cells overlapping, and the front and back surface contact pads on adjacent silicon solar cells overlapping and conductively bonded to each other by a conductive adhesive bonding material, thereby electrically connecting the silicon solar cells in series. The front surface metallization pattern of each silicon solar cell includes a barrier configured to substantially confine the conductive adhesive bonding material to at least one front surface contact pad prior to curing of the conductive adhesive bonding material during fabrication of the super cell.

In another aspect, a super cell comprises a plurality of silicon solar cells, wherein each silicon solar cell has rectangular or substantially rectangular front (sun facing side) and back surfaces, the shape of these surfaces being defined by first and second oppositely disposed and parallel long sides, and two oppositely disposed short sides. Each solar cell includes: a conductive front surface metallization pattern comprising at least one front surface contact pad disposed adjacent the first long side; and a conductive back surface metallization pattern comprising at least one back surface contact pad disposed adjacent the second long side. The silicon solar cells are arranged in a line with the first and second long sides of adjacent silicon solar cells overlapping, and the front and back surface contact pads on adjacent silicon solar cells overlapping and conductively bonded to each other by a conductive adhesive bonding material, thereby electrically connecting the silicon solar cells in series. The back surface metallization pattern of each silicon solar cell includes a barrier configured to substantially confine the conductive adhesive bonding material to at least one back surface contact pad prior to curing of the conductive adhesive bonding material during fabrication of the super cell.

In another aspect, a method of fabricating a solar cell string includes: one or more quasi-square silicon wafers are cut along a plurality of lines parallel to the long edge of each wafer to form a plurality of rectangular silicon solar cells, wherein the length of each silicon solar cell along its long axis is substantially equal. The method further includes arranging the rectangular silicon solar cells in a line with the long sides of adjacent solar cells overlapping and conductively bonded to each other, thereby electrically connecting the solar cells in series. The plurality of rectangular silicon solar cells includes: at least one rectangular solar cell having two chamfers, the chamfers corresponding to corners or a portion of corners of a quasi-square wafer; and one or more rectangular silicon solar cells each lacking a chamfer. Selecting a spacing between parallel lines along which the quasi-square wafer is cut so as to compensate for the chamfer by making a width perpendicular to a long axis of the rectangular silicon solar cell including the chamfer larger than a width perpendicular to a long axis of the rectangular silicon solar cell lacking the chamfer; therefore, during operation of the solar cell string, the front surface of each of the plurality of rectangular silicon solar cells in the solar cell string is substantially equal in area exposed to sunlight.

On the other hand, a super cell includes a plurality of silicon solar cells arranged in a line, wherein end portions of adjacent solar cells overlap and are conductively bonded to each other, thereby electrically connecting the solar cells in series. At least one silicon solar cell has a chamfer corresponding to a corner or a portion of a corner of a quasi-square silicon wafer from which the silicon solar cell is cut; at least one silicon solar cell lacks a chamfer; during operation of the string of solar cells, the front surface of each silicon solar cell is exposed to sunlight over substantially equal areas.

In another aspect, a method of making two or more super cells comprises: cutting one or more quasi-square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form a first plurality of rectangular silicon solar cells having a chamfer corresponding to a corner or a portion of a corner of the quasi-square silicon wafer, and a second plurality of rectangular silicon solar cells lacking a chamfer, each cell of the second plurality of rectangular silicon solar cells having a first length spanning a full width of the quasi-square silicon wafer. The method also includes removing the chamfer from each of the first plurality of rectangular silicon solar cells to form a third plurality of rectangular silicon solar cells lacking chamfers, each of the third plurality of rectangular silicon solar cells having a second length that is shorter than the first length. The method further comprises the following steps: arranging a second plurality of rectangular silicon solar cells in a line with long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, while electrically connecting the second plurality of rectangular silicon solar cells in series, thereby forming a solar cell string having a width equal to the first length; and arranging the third plurality of rectangular silicon solar cells in a line with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, while electrically connecting the third plurality of rectangular silicon solar cells in series, thereby forming a solar cell string having a width equal to the second length.

In another aspect, a method of making two or more super cells comprises: cutting one or more quasi-square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form a first plurality of rectangular silicon solar cells having a chamfer corresponding to a corner or a portion of a corner of the quasi-square silicon wafer, and a second plurality of rectangular silicon solar cells lacking a chamfer; arranging a first plurality of rectangular silicon solar cells in a line with long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, while electrically connecting the first plurality of rectangular silicon solar cells in series; and arranging the second plurality of rectangular silicon solar cells in a line with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, while electrically connecting the second plurality of rectangular silicon solar cells in series.

In another aspect, a super cell includes: a plurality of silicon solar cells arranged in a line in a first direction, wherein end portions of adjacent silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series; and an elongate flexible electrical interconnect having a long axis oriented parallel to a second direction perpendicular to the first direction, the elongate flexible electrical interconnect having the following features: conductively bonded to the front or back surface of the end one silicon solar cell at a plurality of discrete locations arranged along the second direction; extending at least the full width of the terminal solar cell in a second direction; a conductor thickness of less than or equal to about 100 micrometers measured perpendicular to a front surface or a back surface of the terminal silicon solar cell; providing a resistance of less than or equal to about 0.012 ohms to current flowing in a second direction; is configured to provide flexibility that accommodates differential expansion between the terminal silicon solar cell and the electrical interconnect in a second direction over a temperature range of about-40 ℃ to about 85 ℃.

For example, the conductor thickness of the flexible electrical interconnect can be less than or equal to about 30 microns, measured perpendicular to the front and back surfaces of the terminal silicon solar cell. The flexible electrical interconnect may extend beyond the super cell in the second direction to provide electrical interconnection in the solar module for at least a second super cell disposed in parallel adjacent to the super cell. Additionally or alternatively, the flexible electrical interconnect may extend beyond the super cell in the first direction to provide electrical interconnection in the solar module for a second super cell arranged in line parallel with the super cell.

In another aspect, a solar module includes a plurality of super cells arranged in two or more parallel rows spanning a width equal to the module, thereby forming a front surface of the module. Each super cell includes a plurality of silicon solar cells arranged in a line, wherein ends of adjacent silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series. At least one end of a first super cell in a first row adjacent to an edge of the module is electrically connected to an end of a second super cell in a second row adjacent to the same edge of the module via a flexible electrical interconnect having the following features: bonding to the front surface of the first super cell at a plurality of discrete locations by a conductive adhesive bonding material; extending parallel to the edges of the module; at least a portion of which is folded around the one end of the first super cell and is thus not visible from the front of the module.

In another aspect, a method of making a super cell comprises: scribing one or more scribe lines with a laser on each of the one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells; applying a conductive adhesive bonding material to the one or more scribed silicon solar cells at one or more locations adjacent the long side of each rectangular region; dividing the silicon solar cells along the scribing lines to obtain a plurality of rectangular silicon solar cells, wherein a part of conductive adhesive bonding material is arranged on the front surface of each rectangular silicon solar cell and is adjacent to the long side; arranging a plurality of rectangular silicon solar cells in a line such that long sides of adjacent rectangular silicon solar cells overlap in an overlapping manner with a portion of conductive adhesive bonding material disposed therebetween; the conductive bonding material is then cured, thereby bonding adjacent overlapping rectangular silicon solar cells to each other and electrically connecting the cells in series.

In another aspect, a method of making a super cell comprises: scribing one or more scribe lines with a laser on each of the one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells; applying a conductive adhesive bonding material to portions of the top surface of the one or more silicon solar cells; applying a vacuum between the bottom surface of the one or more silicon solar cells and the curved support surface to bend the one or more silicon solar cells against the curved support surface to cause the one or more silicon solar cells to be cut along the scribe lines, thereby resulting in a plurality of rectangular silicon solar cells, each having a portion of electrically conductive adhesive bonding material disposed on a front surface thereof adjacent the long sides; arranging a plurality of rectangular silicon solar cells in a line such that long sides of adjacent rectangular silicon solar cells overlap in an overlapping manner with a portion of conductive adhesive bonding material disposed therebetween; the conductive bonding material is then cured, thereby bonding adjacent overlapping rectangular silicon solar cells to each other and electrically connecting the cells in series.

In another aspect, a method of making a solar module includes assembling a plurality of super cells, each super cell including a plurality of rectangular silicon solar cells arranged in a line with ends overlapping in an overlapping manner on long sides of adjacent rectangular silicon solar cells. The method further includes applying heat and pressure to the super cells to cure the conductive bonding material disposed between the overlapping ends of adjacent rectangular silicon solar cells, thereby bonding the adjacent overlapping rectangular silicon solar cells to each other and electrically connecting the cells in series. The method further includes arranging and interconnecting the super cells into a stacked stack with an encapsulant, and then applying heat and pressure to the stacked stack to form a laminated structure, in a desired solar module configuration.

Some variations of the method include curing or partially curing the conductive bonding material by applying heat and pressure to the super cell prior to applying heat and pressure to the stack to form the laminate structure, thereby forming a cured or partially cured super cell as an intermediate product prior to forming the laminate structure. In some variations, when each additional rectangular silicon solar cell is added to the super cell during assembly of the super cell, the conductive adhesive bonding material between the newly added solar cell and the adjacent overlapping solar cell is cured or partially cured before any other rectangular silicon solar cells are added to the super cell. Alternatively, some variations include curing or partially curing all of the conductive bonding material in the super cell in the same step.

If the super cell is formed as a partially cured intermediate product, the method may include completing the curing of the conductive bonding material while applying heat and pressure to the stacked stack to form the laminate structure.

Some variations of the method include curing the conductive bonding material while applying heat and pressure to the stack to form the laminate structure, without forming a cured or partially cured super cell as an intermediate product prior to forming the laminate structure.

The method may include cutting one or more standard size silicon solar cells into a smaller area rectangular shape to provide rectangular silicon solar cells. A conductive adhesive bonding material can be applied to the one or more silicon solar cells prior to dicing the one or more silicon solar cells to provide rectangular silicon solar cells pre-applied with the conductive adhesive bonding material. Alternatively, one or more silicon solar cells may be diced to provide rectangular silicon solar cells before the conductive adhesive bonding material is applied to the rectangular silicon solar cells.

In one aspect, a solar module includes a plurality of super cells arranged in two or more parallel rows. Each super cell comprises a plurality of rectangular or substantially rectangular silicon solar cells arranged in a line, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded directly to each other, thereby electrically connecting the silicon solar cells in series. The solar panel further includes: a first hidden tap contact pad located on a back surface of a first solar cell, the first solar cell located at an intermediate position along a first super cell; and a first electrical interconnect conductively bonded to the first hidden tap contact pad. The first electrical interconnect includes a stress relief feature that accommodates differential thermal expansion between the electrical interconnect and a silicon solar cell to which the electrical interconnect is bonded. The term "stress relief feature" as used herein in connection with an interconnect may refer to a geometric feature, such as a kink, loop, or slot, and may also refer to the thickness (e.g., very thin) of the interconnect and/or the ductility of the interconnect. For example, a stress relief feature may refer to an interconnect formed from an extremely thin strip of copper.

The solar module may include a second hidden tap contact pad located on a back surface of a second solar cell located adjacent to the first solar cell and located at an intermediate position along a second one of the adjacent rows of super cells, wherein the first hidden tap contact pad is electrically connected to the second hidden tap contact pad by a first electrical interconnect. In such cases, the first electrical interconnect may extend through a gap between the first super cell and the second super cell and be conductively bonded to the second hidden tap contact pad. Alternatively, the electrical connection between the first hidden tap contact pad and the second hidden tap contact pad may comprise another electrical interconnect conductively bonded to the second hidden tap contact pad and electrically connected (e.g., conductively bonded) to the first electrical interconnect. Either interconnection scheme may optionally extend through additional rows of super cells. For example, either interconnection scheme may optionally extend across the full width of the module, interconnecting the solar cells in each row via hidden tap contact pads.

The solar module may include: a second hidden tap contact pad located on a back surface of a second solar cell, the second solar cell located at another intermediate position along the first super cell; a second electrical interconnect conductively bonded to a second hidden tap contact pad; and a bypass diode electrically connected in parallel with the solar cell between the first hidden tap contact pad and the second hidden tap contact pad using the first electrical interconnect and the second electrical interconnect.

In any of the variations described above, the first hidden tap contact pad may be one of a plurality of hidden tap contact pads disposed on the back surface of the first solar cell in a row extending parallel to the long axis of the first solar cell, wherein the first electrical interconnect is conductively bonded to each of the plurality of hidden contacts and has a span along the long axis that is substantially equal to the length of the first solar cell. Additionally or alternatively, the first hidden contact pad may be one of a plurality of hidden tap contact pads arranged on the back surface of the first solar cell in a row extending perpendicular to the long axis of the first solar cell. In the latter case, for example, the hidden row of tap contact pads may be located adjacent to the short edge of the first solar cell. The first hidden contact pad may be one of a plurality of hidden tap contact pads arranged in a two-dimensional array on the back surface of the first solar cell.

Alternatively, in any of the variations described above, the first hidden tap contact pad may be positioned adjacent a short side of the back surface of the first solar cell, wherein the first electrical interconnect does not extend substantially inward from the hidden tap contact pad along the long axis of the solar cell, and the back surface metallization pattern on the first solar cell provides a conductive path for the interconnect, preferably having a sheet resistance of less than or equal to about 5 ohms per square, or less than or equal to about 2.5 ohms per square. In such cases, the first interconnect may include, for example, two tabs disposed on opposite sides of the stress relief feature, with one tab conductively bonded to the first hidden tap contact pad. The two projections may have different lengths.

In either of the above variations, the first electrical interconnect may include an alignment feature for identifying whether it is ideally aligned with the first hidden tap contact pad, with the edge of the first super cell, or for identifying whether it is ideally aligned with both the first hidden tap contact pad and the edge of the first super cell.

In another aspect, a solar module includes a glass front sheet, a back sheet, and a plurality of super cells arranged in two or more parallel rows between the glass front sheet and the back sheet. Each super cell comprises a plurality of rectangular or substantially rectangular silicon solar cells arranged in a line, wherein the long sides of adjacent silicon solar cells overlap and are both flexibly and conductively bonded directly to each other, thereby electrically connecting the silicon solar cells in series. The first flexible electrical interconnect is rigidly conductively bonded to the first super cell. The flexible conductive bond between the overlapping solar cells provides mechanical compliance to the super cells to accommodate thermal expansion mismatch between the super cells and the glass front sheet in a direction parallel to the rows of super cells over a temperature range of about-40 ℃ to about 100 ℃ without damaging the solar module. The rigid conductive bond between the first super cell and the first flexible electrical interconnect forces the first flexible electrical interconnect to accommodate a thermal expansion mismatch between the first super cell and the first flexible electrical interconnect in a direction perpendicular to the row of super cells in a temperature range of about-40 ℃ to about 180 ℃ so that the thermal expansion mismatch does not damage the solar module.

Conductive bonds between overlapping adjacent solar cells within a super cell and between the super cell and the flexible electrical interconnect may utilize different conductive adhesives. The conductive bond on one side of at least one solar cell within a super cell and the conductive bond on the other side of the solar cell may utilize different conductive adhesives. For example, the conductive adhesive that forms the rigid bond between the super cell and the flexible electrical interconnect may be solder. In some variations, the conductive bond between overlapping solar cells within a super cell is formed with a non-solder conductive adhesive, while the conductive bond between the super cell and the flexible electrical interconnect is formed with solder.

In some variations that utilize two different conductive adhesives as just described, the two conductive adhesives may be cured in the same processing step (e.g., cured at the same temperature, the same pressure, and/or within the same time interval).

The conductive engagement between overlapping adjacent solar cells can accommodate differential motion of greater than or equal to about 15 microns between each cell and the glass front sheet, for example.

For example, the conductive bond between overlapping adjacent solar cells may have a thickness in the direction perpendicular to the solar cells of less than or equal to about 50 microns, while the thermal conductivity in the direction perpendicular to the solar cells may be greater than or equal to about 1.5W/(m-K).

For example, the first flexible electrical interconnect itself can withstand thermal expansion or contraction of greater than or equal to about 40 microns.

The portion of the first flexible electrical interconnect conductively bonded to the super cell can be ribbon-shaped, formed of copper, and can have a thickness in a direction perpendicular to a surface thereof bonded to the solar cell of, for example, less than or equal to about 30 microns, or less than or equal to about 50 microns. The first flexible electrical interconnect can include an integral conductive copper portion that is not bonded to the solar cell and that provides a higher conductivity than the portion of the first flexible electrical interconnect that is conductively bonded to the solar cell. The first flexible electrical interconnect can have a thickness of less than or equal to about 30 microns, or less than or equal to about 50 microns, in a direction perpendicular to a surface thereof that engages the solar cell, and a width, in a plane of the surface of the solar cell, of greater than or equal to about 10mm in a direction perpendicular to a current flowing through the electrical interconnect. The first flexible electrical interconnect can be conductively bonded to a conductor proximate the solar cell that provides a higher conductivity than the first electrical interconnect.

In another aspect, a solar module includes a plurality of super cells arranged in two or more parallel rows. Each super cell comprises a plurality of rectangular or substantially rectangular silicon solar cells arranged in a line, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded directly to each other, thereby electrically connecting the silicon solar cells in series. A hidden tap contact pad that does not conduct large currents during normal operation is located on the back surface of a first solar cell located midway along a first super cell in the first row of super cells. The hidden tap contact pad is electrically connected in parallel to at least a second solar cell in the second row of super cells.

The solar module may include the following electrical interconnects: the electrical interconnect is bonded to the hidden tap contact pad and electrically interconnects the hidden tap contact pad to the second solar cell. In some variations, the span of the electrical interconnect is not substantially equal to the length of the first solar cell, and the back surface metallization pattern on the first solar cell provides a conductive path for the hidden tap contact pad having a sheet resistance of less than or equal to about 5 ohms per square.

The plurality of super cells may be arranged in three or more parallel rows having a span equal to the width of the solar module in a direction perpendicular to the rows, and the hidden tap contact pad is electrically connected to the hidden contact pad on at least one solar cell in each super cell row, thereby electrically connecting all the super cell rows in parallel. In such variations, the solar module may include at least one bussing connection connected to at least one hidden tap contact pad or to an interconnect between hidden tap contact pads, the bussing connection being connected with a bypass diode or other electronic device.

The solar module may include the following flexible electrical interconnects: the flexible electrical interconnect is conductively bonded to the hidden tap contact pad, thereby electrically connecting the hidden tap contact pad to the second solar cell. The portion of the flexible electrical interconnect conductively bonded to the hidden tap contact pad may be, for example, ribbon-shaped, formed of copper, and may have a thickness in a direction perpendicular to a surface to which it is bonded to the solar cell of less than or equal to about 50 microns. The conductive engagement between the hidden tap contact pad and the flexible electrical interconnect may force the flexible electrical interconnect to withstand a thermal expansion mismatch between the first solar cell and the flexible electrical interconnect and accommodate relative movement between the first solar cell and the second solar cell caused by thermal expansion within a temperature range of about-40 ℃ to about 180 ℃ without damaging the solar module.

In some variations, the first hidden contact pad may conduct a current greater than a current generated in any individual solar cell when the solar module is in operation.

Typically, the front surface of the first solar cell overlying the first hidden tap contact pad is not occupied by a contact pad or any other interconnect feature. Typically, any area on the front surface of the first solar cell that is not overlapped by a portion of an adjacent solar cell in the first super cell is not occupied by contact pads or any other interconnect features.

In some variations, most of the cells in each super cell do not have hidden tap contact pads. In such variations, cells with hidden tap contact pads may have a larger light collection area than cells without hidden tap contact pads.

In another aspect, a solar module includes a glass front sheet, a back sheet, and a plurality of super cells arranged in two or more parallel rows between the glass front sheet and the back sheet. Each super cell comprises a plurality of rectangular or substantially rectangular silicon solar cells arranged in a line, wherein the long sides of adjacent silicon solar cells overlap and are both flexibly and conductively bonded directly to each other, thereby electrically connecting the silicon solar cells in series. The first flexible electrical interconnect is rigidly, conductively bonded to the first super cell. The flexible conductive bond between the overlapping solar cells is formed from a first conductive adhesive having a shear modulus of less than or equal to about 800 megapascals. A rigid conductive bond between the first super cell and the first flexible electrical interconnect is formed from a second conductive adhesive having a shear modulus greater than or equal to about 2000 megapascals.

The first conductive adhesive can have, for example, a glass transition temperature of less than or equal to about 0 ℃.

In some variations, the first conductive adhesive and the second conductive adhesive are different, but the two conductive adhesives may be cured in the same processing step.

In some variations, the conductive bond between overlapping adjacent solar cells has a thickness in the direction perpendicular to the solar cells of less than or equal to about 50 microns and a thermal conductivity in the direction perpendicular to the solar cells of greater than or equal to about 1.5W/(m-K).

In one aspect, a solar module includes a number N of greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows. Each super cell comprises a plurality of silicon solar cells arranged in a line, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series. The super cell is electrically connected for providing a high dc voltage of greater than or equal to about 90 volts.

In one variant, the solar module comprises one or more flexible electrical interconnects arranged for electrically connecting a plurality of super cells in series, thereby providing a high direct voltage. The solar module may include module-level power electronics including an inverter for converting a high dc voltage to an ac voltage. The module level power electronics can sense high dc voltages and can operate the solar module at an optimal current-voltage power point.

In another variation, the solar module includes module level power electronics electrically connected to each pair of adjacent rows of series super cells for electrically connecting one or more pairs of rows of super cells in series to provide a high dc voltage, the module level power electronics including an inverter for converting the high dc voltage to an ac voltage. Optionally, the module-level power electronics may sense the voltage across each individual pair of rows of super cells, and may operate each individual pair of rows of super cells at an optimal current-voltage power point. Optionally, the module-level power electronics may disconnect a pair of super cell ranks from the circuit providing the high dc voltage if the voltage across the individual pair of super cell ranks is below a threshold.

In another variation, the solar module includes module-level power electronics electrically connected to each individual row of super cells for electrically connecting two or more rows of super cells in series to provide a high dc voltage, the module-level power electronics including an inverter for converting the high dc voltage to an ac voltage. Optionally, the module-level power electronics may sense the voltage across each individual row of super cells, and may operate each individual row of super cells at an optimal current-voltage power point. Optionally, the module-level power electronics may disconnect an individual super cell bank from the circuit providing the high dc voltage if the voltage across the individual super cell bank is below a threshold.

In another variation, the solar module includes module-level power electronics electrically connected to each individual super cell for electrically connecting two or more super cells in series to provide a high dc voltage, the module-level power electronics including an inverter for converting the high dc voltage to an ac voltage. Optionally, the module-level power electronics may sense the voltage across each individual super cell and may operate each individual super cell at an optimal current-voltage power point. Optionally, the module-level power electronics may disconnect an individual super cell from the circuit providing the high dc voltage if the voltage across the individual super cell is below a threshold.

In another variation, each of the super cells within the module is electrically segmented into a plurality of segments by hidden taps. The solar module includes module level power electronics electrically connected to each segment in each super cell by a hidden tap for electrically connecting two or more segments in series to provide a high dc voltage, the module level power electronics including an inverter for converting the high dc voltage to an ac voltage. Optionally, the module-level power electronics may sense the voltage across each individual segment in each super cell, and may operate each individual segment at an optimal current-voltage power point. Optionally, the module-level power electronics may disconnect an individual segment from the circuit providing the high dc voltage if the voltage across the individual segment is below a threshold.

In any of the above variations, the optimal current-voltage power point may be a maximum current-voltage power point.

In either of the above variations, the module-level power electronics may lack dc-to-dc boost components.

In any of the above variations, N may be greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

In any of the above variations, the high dc voltage may be greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

In another aspect, a solar photovoltaic system includes two or more solar modules electrically connected in parallel, and an inverter. Each solar module includes a number N of greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows. Each super cell in each module comprises two or more silicon solar cells arranged in line in the module, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series. The super cells in each module are electrically connected for the module to provide a high voltage dc output of greater than or equal to about 90 volts. The inverter is electrically connected to two or more solar modules, thereby converting the high voltage dc output of these modules to ac power.

Each solar module may comprise one or more flexible electrical interconnects arranged to electrically connect the super cells in the solar module in series, thereby providing a high voltage direct current output of the solar module.

The solar photovoltaic system can include at least a third solar module electrically connected in series with a first of the two or more solar modules electrically connected in parallel. In such cases, the third solar module can include a number N' of greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows. Each super cell in a third solar module comprises two or more silicon solar cells arranged in line in the module, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series. The super cells in the third solar module are electrically connected for the module to provide a high voltage dc output of greater than or equal to about 90 volts.

Including the variation just described of a third solar module electrically connected in series with a first of the two or more solar modules, may also include at least a fourth solar module electrically connected in series with a second of the two or more solar modules electrically connected in parallel. The fourth solar module can include a number N "of greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows. Each super cell in the fourth solar module comprises two or more silicon solar cells arranged in line in the module, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series. The super cells in the fourth solar module are electrically connected for the module to provide a high voltage dc output of greater than or equal to about 90 volts.

The solar photovoltaic system may include fuses and/or current blocking diodes arranged to prevent power generated by any one solar module from being dissipated by short circuiting the other solar module.

The solar photovoltaic system may include a positive bus to which two or more solar modules are electrically connected in parallel and a negative bus to which an inverter is also electrically connected. Alternatively, the solar photovoltaic system may comprise a combiner box to which two or more solar modules are electrically connected by separate conductors. The combiner box electrically connects the solar modules in parallel and may optionally include fuses and/or current blocking diodes arranged to prevent power generated by any one solar module from being dissipated by a short circuit to the other solar modules.

The inverter may be configured to operate the solar module at a dc voltage above a minimum value set to avoid reverse biasing of the solar module.

The inverter may be configured to identify a reverse bias condition occurring in one or more solar modules and operate the solar modules at a voltage that avoids the reverse bias condition.

The solar photovoltaic system may be disposed on a roof.

In any of the above variations, N, N', N "may be greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700. N, N' and N "may be the same or different.

In any of the above variations, the high dc voltage provided by the solar module may be greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

In another aspect, a solar photovoltaic system includes a first solar module comprising a number N of greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows. Each super cell comprises a plurality of silicon solar cells arranged in a line, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series. The system also includes an inverter. The inverter may be, for example, a micro-inverter integrated with the first solar module. The super cells in the first solar module are electrically connected for providing a high dc voltage of greater than or equal to about 90 volts to an inverter, which in turn converts the dc power to ac power.

The first solar module may comprise one or more flexible electrical interconnects arranged to electrically connect the super cells in the solar module in series, thereby providing a high voltage direct current output of the solar module.

The solar photovoltaic system can include at least a second solar module electrically connected in series with the first solar module. The second solar module can include a number N' of greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows. Each super cell in a second solar module comprises two or more silicon solar cells arranged in line in the module, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series. The super cells in the second solar module are electrically connected for the module to provide a high voltage dc output of greater than or equal to about 90 volts.

Inverters (e.g., micro-inverters) may lack dc-to-dc boost components.

In any of the above variations, N and N' may be greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700. N, N' may be the same or different.

In any of the above variations, the high dc voltage provided by the solar module may be greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

In another aspect, a solar module includes a number N of greater than or equal to about 250 rectangular or substantially rectangular silicon solar cells arranged as a plurality of series super cells in two or more parallel rows. Each super cell comprises a plurality of silicon solar cells arranged in a line, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded directly to each other by an adhesive that is both electrically and thermally conductive, thereby electrically connecting the silicon solar cells in the super cell in series. In a solar module, less than one bypass diode is included per 25 solar cells. The adhesive, which is both electrically and thermally conductive, forms bonds between adjacent solar cells, the bonds having a thickness perpendicular to the solar cells of less than or equal to about 50 microns and a thermal conductivity perpendicular to the solar cells of greater than or equal to about 1.5W/(m-K).

The super cell may be encapsulated in a thermoplastic olefin layer between the front and back plates. The super cell and its encapsulant may be sandwiched between a glass front plate and a glass back plate.

In solar modules, for example: there may be less than one bypass diode per 30 solar cells, less than one bypass diode per 50 solar cells, or less than one bypass diode per 100 solar cells. The solar module may, for example, include no bypass diodes, only a single bypass diode, no more than three bypass diodes, no more than six bypass diodes, or no more than ten bypass diodes.

The conductive bond between the overlapping solar cells may optionally provide mechanical compliance to the super cells to accommodate thermal expansion mismatch between the super cells and the glass front sheet in a direction parallel to the rows of super cells in a temperature range of about-40 ℃ to about 100 ℃ without damaging the solar module.

In any of the above variations, N may be greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

In either variation, the super cells can be electrically connected to provide a high dc voltage of greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

The solar energy system may include a solar module of any of the variations described above and an inverter (e.g., a micro-inverter), wherein the inverter is electrically connected to the solar module and is configured to convert a direct current output from the solar module to provide an alternating current output. The inverter may lack a dc-to-dc boost component. The inverter may be configured to operate the solar module at a dc voltage above a minimum value set to avoid solar cell back-biasing. The minimum voltage value may depend on the temperature. The inverter may be configured to identify a reverse bias condition and operate the solar module at a voltage that avoids the reverse bias condition. For example, the inverter may be configured to operate the solar module within a local maximum region of a voltage-current power curve of the solar module to avoid a reverse bias condition.

The present specification discloses a cutting tool for a solar cell and a cutting method for a solar cell.

In one aspect, a method of fabricating a solar cell includes: the solar cell wafer is advanced along the curved surface and a vacuum is then applied between the curved surface and the bottom surface of the solar cell wafer to bend the solar cell wafer against the curved surface to cut the solar cell wafer along one or more previously prepared scribe lines, thereby separating a plurality of solar cells from the solar cell wafer. The solar cell wafer may be continuously advanced, for example, along a curved surface. Alternatively, the solar cell wafer may be advanced along the curved surface multiple times separately.

The curved surface can be, for example, a curved portion of an upper surface of a vacuum manifold that applies a vacuum to a bottom surface of the solar cell wafer. The vacuum applied by the vacuum manifold to the bottom surface of the solar cell wafer may vary along the direction of travel of the solar cell wafer and may, for example, reach a maximum intensity within the regions of the vacuum manifold where the solar cell wafer is sequentially cut.

The method may include transporting the solar cell wafer along the curved upper surface of the vacuum manifold using a porous belt, during which a vacuum is applied to a bottom surface of the solar cell wafer through perforations in the porous belt. The perforations may optionally be arranged on a porous belt such that the leading and trailing edges of the solar cell wafer in its own direction of travel must overlie at least one perforation of the porous belt, thus being pulled by vacuum towards the curved surface, but this is not essential.

The method can comprise the following steps: advancing a solar cell wafer along a flat region of an upper surface of a vacuum manifold to a transitional curved region having a first curvature in the upper surface of the vacuum manifold; the solar cell wafer is then advanced into a dicing area of the upper surface of the vacuum manifold that sequentially dice the solar cell wafer, the dicing area of the vacuum manifold having a second curvature that is tighter than the first curvature. The method may further include advancing the diced solar cells into a post-dicing region of the vacuum manifold having a third curvature, the third curvature being tighter than the second curvature.

In any of the above variations, the method may include applying a stronger vacuum between the solar cell wafer and the curved surface, first at one end of each scribe line, and then at the other end of each scribe line, to provide an asymmetric stress distribution along each scribe line, to facilitate formation of a core of a single cut crack along each scribe line, and to facilitate propagation of a single cut crack along each scribe line. Additionally or alternatively, in any of the above variations, the method may include orienting the scribe lines on the solar cell wafer at an angle to the vacuum manifold such that, for each scribe line, one end reaches the curved cut region of the vacuum manifold earlier than the other end.

In any of the above variations, the method may include removing the diced solar cells from the curved surface before the edges of the diced solar cells contact the curved surface. For example, the method may include removing the cells in a direction tangential or approximately tangential to the curved surface of the manifold at a speed greater than the speed at which the cells travel along the manifold. This may be done with a moving belt, e.g. arranged tangentially, or with any other suitable mechanism.

In any of the above variations, the method may include scribing a plurality of scribe lines on the solar cell wafer, then applying the conductive adhesive bonding material to portions of the top or bottom surface of the solar cell wafer, and then cutting the solar cell wafer along the scribe lines. At this time, each of the resulting diced solar cells may be provided with a portion of conductive adhesive bonding material along the cut edge of the top or bottom surface thereof. The scribe lines can be formed using any suitable scribing method, either before or after application of the conductive adhesive bonding material. The scribe line may be formed, for example, by laser scribing.

In any of the above variations, the solar cell wafer may be a square or quasi-square silicon solar cell wafer.

In another aspect, a method of fabricating a solar cell string includes: arranging a plurality of rectangular solar cells in a line such that long sides of adjacent rectangular solar cells overlap in an overlapping manner with a conductive adhesive bonding material disposed therebetween; the conductive bonding material is then cured, thereby bonding adjacent overlapping rectangular solar cells to each other and electrically connecting the cells in series. The solar cell can be produced, for example, by any of the variants of the method for producing a solar cell described above.

In one aspect, a method of fabricating a solar cell string includes: a back surface metallization pattern is formed on each of the one or more square solar cells and then the entire front surface metallization pattern is stencil printed onto each of the one or more square solar cells in a single stencil printing step using a single stencil. These steps may be performed in any order, or simultaneously, if appropriate. By "complete front surface metallization pattern", it is meant that the front surface metallization is completed without depositing additional metallization material onto the front surface of the square solar cell after the stencil printing step. The method further comprises the following steps: dividing each square solar cell into two or more rectangular solar cells, thereby forming a plurality of rectangular solar cells from one or more square solar cells, each rectangular solar cell having a back surface metallization pattern and a complete front surface metallization pattern; arranging a plurality of rectangular solar cells in a line such that long sides of adjacent rectangular solar cells overlap in an overlapping manner; the rectangular solar cells in each pair of adjacent overlapping rectangular solar cells are then conductively bonded to each other with a conductive bonding material disposed between the two rectangular solar cells for electrically connecting the front surface metallization pattern of one cell of the pair of rectangular solar cells to the back surface metallization pattern of the other cell of the pair of rectangular solar cells, thereby electrically connecting the plurality of rectangular solar cells in series.

The stencil may be configured such that all portions of the one or more features of the stencil used to define the front surface metallization pattern on the one or more square solar cells are constrained to physically connect with other portions of the stencil lying in the plane of the stencil during stencil printing.

The front surface metallization pattern on each rectangular solar cell may for example comprise a plurality of fingers oriented perpendicular to the long sides of the rectangular solar cell, but the front surface metallization pattern does not physically connect the fingers in the front surface metallization pattern to each other.

This specification discloses solar cells with reduced carrier recombination losses at the edges of the solar cell, such as solar cells without cut edges that promote carrier recombination; methods for manufacturing such solar cells; and using such solar cells in an overlapping (overlapping) arrangement to form a super cell.

In one aspect, a method of fabricating a plurality of solar cells includes: depositing one or more front surface amorphous silicon layers onto the front surface of the crystalline silicon wafer; depositing one or more back surface amorphous silicon layers onto a back surface of the crystalline silicon wafer, the back surface being on an opposite side of the front surface of the crystalline silicon wafer; patterning the one or more front surface amorphous silicon layers to form one or more front surface trenches in the one or more front surface amorphous silicon layers; depositing a front surface passivation layer over the one or more front surface amorphous silicon layers and into the front surface trench; patterning the one or more back surface amorphous silicon layers to form one or more back surface trenches in the one or more back surface amorphous silicon layers; a back surface passivation layer is then deposited over the one or more back surface amorphous silicon layers and into the back surface trench. Each of the one or more rear surface grooves is formed in line with a corresponding one of the front surface grooves. The method also includes cutting the crystalline silicon wafer at one or more cut planes, each cut plane centered or substantially centered on a different pair of corresponding front surface grooves and back surface grooves. When the obtained solar cell works, the front surface amorphous silicon layer is irradiated by light.

In some variations, only the front surface grooves are formed, and the rear surface grooves are not formed. In other variations, only the back surface grooves are formed, and the front surface grooves are not formed.

The method can comprise the following steps: one or more front surface trenches are formed for penetrating the front surface amorphous silicon layer to the front surface of the crystalline silicon wafer and/or one or more back surface trenches are formed for penetrating the one or more back surface amorphous silicon layer to the back surface of the crystalline silicon wafer.

The method may include forming a front surface passivation layer and/or a back surface passivation layer with a transparent conductive oxide.

A pulsed laser or diamond drill bit may be used to create a cutting point (e.g., approximately 100 microns long). The continuous wave laser and cooling nozzle may be used sequentially to induce high compressive and tensile thermal stresses and to guide the full propagation of the cut in the crystalline silicon wafer, thereby dividing the crystalline silicon wafer at one or more cut planes. Alternatively, the crystalline silicon wafer may be mechanically cut at one or more cutting planes. Any suitable cutting method may be used.

One or more front surface amorphous/crystalline silicon layers may form an n-p junction with the crystalline silicon wafer, in which case it may be preferable to cut it from the back surface side of the crystalline silicon wafer. Alternatively, one or more back surface amorphous silicon layer/crystalline silicon layer may form an n-p junction with the crystalline silicon wafer, in which case it may be preferable to cut it from the front surface side of the crystalline silicon wafer.

In another aspect, a method of fabricating a plurality of solar cells includes: forming one or more trenches in a first surface of a crystalline silicon wafer; depositing one or more layers of amorphous silicon onto a first surface of a crystalline silicon wafer; depositing a passivation layer into the trench and onto the one or more amorphous silicon layers on the first surface of the crystalline silicon wafer; depositing one or more amorphous silicon layers onto a second surface of the crystalline silicon wafer, the second surface being on an opposite side of the first surface of the crystalline silicon wafer; the crystalline silicon wafer is then cut at one or more cut planes, each cut plane centered or substantially centered on a different one of the one or more trenches.

The method may include forming a passivation layer with a transparent conductive oxide.

A laser may be used to induce thermal stress in the crystalline silicon wafer to cut the crystalline silicon wafer at one or more cutting planes. Alternatively, the crystalline silicon wafer may be mechanically cut at one or more cutting planes. Any suitable cutting method may be used.

The one or more front surface amorphous silicon/crystalline silicon layers may form an n-p junction with the crystalline silicon wafer. Alternatively, one or more back surface amorphous silicon/crystalline silicon layers may form an n-p junction with the crystalline silicon wafer.

In another aspect, a solar panel includes a plurality of super cells, each comprising a plurality of solar cells arranged in a line, wherein ends of adjacent solar cells overlap and are conductively bonded to each other in a shingled manner, thereby electrically connecting the solar cells in series. Each solar cell includes: a crystalline silicon substrate; one or more first surface amorphous silicon layers disposed on a first surface of a crystalline silicon substrate to form an n-p junction; one or more second surface amorphous silicon layers disposed on a second surface of the crystalline silicon substrate, the second surface being on an opposite side of the first surface of the crystalline silicon substrate; and a passivation layer preventing carrier recombination from occurring at an edge of the first surface amorphous silicon layer or an edge of the second surface amorphous silicon layer, or both of the first surface amorphous silicon layer and the second surface amorphous silicon layer. The passivation layer may comprise a transparent conductive oxide.

The solar cell may be formed, for example, using any of the methods outlined above or otherwise disclosed in this specification.

These and other embodiments, features and advantages of the present invention will become more readily apparent to those skilled in the art after reviewing the following more detailed description of the invention taken in conjunction with the accompanying drawings, which are first briefly described.

Drawings

Fig. 1 shows a schematic cross-sectional view of a string of solar cells arranged in an overlapping, series connection, wherein the ends of adjacent solar cells overlap, forming an overlapping super cell.

Fig. 2A shows a schematic of front (sunny side) surface and front surface metallization patterns of an exemplary rectangular solar cell that may be used to form a clamshell super cell.

Fig. 2B and 2C show schematic diagrams of front (sunny side) surface and front surface metallization patterns of two exemplary rectangular solar cells with rounded corners that can be used to form a clamshell super cell.

Fig. 2D and 2E show schematic diagrams of the back surface and exemplary back surface metallization patterns of the solar cell shown in fig. 2A.

Fig. 2F and 2G show schematic diagrams of the back surface and exemplary back surface metallization patterns of the solar cell shown in fig. 2B and 2C, respectively.

Fig. 2H shows a schematic diagram of front (sunny side) surface and front surface metallization patterns of another exemplary rectangular solar cell that may be used to form a clamshell super cell. The front surface metallization pattern includes discrete contact pads, each of which is surrounded by a barrier configured to prevent uncured conductive adhesive bonding material deposited on its contact pad from flowing away from the contact pad.

Fig. 2I shows a cross-sectional view of the solar cell of fig. 2H, and identifies details of the front surface metallization pattern, which are shown in both expanded views of fig. 2J and 2K, including contact pads and portions of the barrier surrounding the contact pads.

Fig. 2J shows an expanded view of the detail in fig. 2I.

Fig. 2K shows an expanded view of the detail in fig. 2I, wherein the uncured conductive adhesive bonding material is substantially confined to the location of the discrete contact pads by the barrier.

Fig. 2L shows a schematic diagram of the back surface and an exemplary back surface metallization pattern of the solar cell of fig. 2H. The back surface metallization pattern includes discrete contact pads, each of which is surrounded by a barrier configured to prevent uncured conductive adhesive bonding material deposited on its contact pad from flowing away from the contact pad.

Fig. 2M shows a cross-sectional view of the solar cell of fig. 2L, and identifies details of the back surface metallization pattern, which are shown in the expanded view of fig. 2N, including contact pads and portions of the barrier surrounding the contact pads.

Fig. 2N shows an expanded view of the details in fig. 2M.

Fig. 2O illustrates another variation of a metallization pattern that includes a barrier configured to prevent uncured conductive adhesive bonding material from flowing away from the contact pads. The barrier is adjacent to one side of the contact pad and is higher than the contact pad.

Fig. 2P shows another variation of the metallization pattern of fig. 2O, wherein a barrier abuts at least two sides of the contact pad.

Fig. 2Q shows a schematic diagram of the back surface of another exemplary rectangular solar cell and an exemplary back surface metallization pattern. The back surface metallization pattern comprises continuous contact pads extending substantially the length of the long side of the solar cell along the edges of the solar cell. The contact pads are surrounded by a barrier configured to prevent uncured conductive adhesive bonding material deposited on the contact pads from flowing away from the contact pads.

Fig. 2R shows a schematic of front (sunny side) surface and front surface metallization patterns of another exemplary rectangular solar cell that may be used to form a clamshell super cell. The front surface metallization pattern comprises discrete contact pads arranged in a row along an edge of the solar cell, and elongated conductive lines located inside and extending parallel to the row of contact pads. The elongated conductive wires form a barrier configured to prevent uncured conductive adhesive bonding material deposited on their contact pads from flowing away from the contact pads and then onto the active area of the solar cell.

Fig. 3A shows a schematic diagram of an exemplary method by which a standard shape-sized quasi-square silicon solar cell can be divided (e.g., cut or broken into) into two rectangular solar cells of different lengths that can be used to form a stacked lid super cell.

Fig. 3B and 3C show schematic diagrams of another exemplary method by which quasi-square silicon solar cells can be divided into rectangular solar cells. Fig. 3B shows the front surface of the wafer and an exemplary front surface metallization pattern. Fig. 3C shows the back surface of the wafer and an exemplary back surface metallization pattern.

Fig. 3D and 3E show schematic diagrams of an exemplary method by which square silicon solar cells can be divided into rectangular solar cells. Fig. 3D shows the front surface of the wafer and an exemplary front surface metallization pattern. Fig. 3E shows the back surface of the wafer and an exemplary back surface metallization pattern.

Fig. 4A illustrates a partial view of the front surface of an exemplary rectangular super cell comprising rectangular solar cells arranged in an overlapping manner as shown in fig. 1, such as shown, for example, in fig. 2A.

Fig. 4B and 4C show front and back views, respectively, of an exemplary rectangular super cell comprising "V-shaped" rectangular solar cells with chamfers, as shown, for example, in fig. 2B, arranged in an overlapping manner as shown in fig. 1.

Fig. 5A shows a schematic diagram of an exemplary rectangular solar module comprising a plurality of clamshell rectangular super cells, wherein the length of the long side of each super cell is approximately equal to half the length of the short side of the solar module. Pairs of super cells are arranged end-to-end to form rows with the long sides of the super cells parallel to the short sides of the module.

FIG. 5B shows a schematic of another exemplary rectangular solar module comprising a plurality of clamshell rectangular super cells, wherein the length of the long side of each super cell is approximately equal to the length of the short side of the solar module. The super cells are arranged with their long sides parallel to the short sides of the module.

FIG. 5C shows a schematic view of another exemplary rectangular solar module comprising a plurality of clamshell rectangular super cells, wherein the length of the long side of each super cell is approximately equal to the length of the long side of the solar module. The super cells are arranged with their long sides parallel to the long sides of the module.

Fig. 5D shows a schematic diagram of an exemplary rectangular solar module comprising a plurality of clamshell rectangular super cells, wherein the length of the long side of each super cell is approximately equal to half the length of the long side of the solar module. Pairs of super cells are arranged end-to-end to form rows with the long sides of the super cells parallel to the long sides of the module.

Fig. 5E shows a schematic diagram of another exemplary rectangular solar module similar in construction to fig. 5C, in which all of the solar cells forming the super cell are V-shaped solar cells with chamfers corresponding to the corners of the quasi-square wafers from which the solar cells are singulated.

Fig. 5F shows a schematic diagram of another exemplary rectangular solar module similar in construction to fig. 5C, in which the solar cells forming the super cell comprise a hybrid of V-shaped solar cells and rectangular solar cells arranged to replicate the shape of the quasi-square wafers from which they are singulated.

Fig. 5G shows a schematic view of another exemplary rectangular solar module similar in construction to fig. 5E, except that adjacent V-shaped solar cells in the super cell are arranged as mirror images of each other so that their overlapping edges are of equal length.

Fig. 6 shows an exemplary arrangement of three rows of super cells interconnected with a flexible electrical interconnect for connecting the super cells within each row in series with each other and for connecting the rows in parallel with each other. These rows may be, for example, three rows in the solar module of fig. 5D.

Fig. 7A illustrates an exemplary flexible interconnect that can be used to interconnect the super cells in series or parallel. Some examples present pattern structures that increase the flexibility (mechanical compliance) of the examples along the long axis, the short axis, or both the long and short axes of the examples. Fig. 7A illustrates exemplary stress relief long interconnect configurations that can be used in both concealed taps connected to a super cell as described herein and as interconnects connected to terminal contacts on the front or back surface of a super cell. 7B-1 and 7B-2 illustrate examples of out-of-plane stress relief features. Fig. 7B-1 and 7B-2 illustrate exemplary long interconnect configurations that include out-of-plane stress relief features that can be used both in hidden taps connected to a super cell and as interconnects connected to terminal contacts on the front or back surface of a super cell.

Fig. 8A shows detail a of fig. 5D (i.e., the cross-sectional view of the exemplary solar module of fig. 5D), particularly showing cross-sectional details of the flexible electrical interconnects bonded to the back surface terminal contacts of the rows of super cells.

Fig. 8B shows detail C of fig. 5D (i.e., a cross-sectional view of the exemplary solar module of fig. 5D), particularly showing cross-sectional details of the flexible electrical interconnect bonded to the front (sunny side) surface terminal contacts of each row of super cells.

Fig. 8C shows detail B of fig. 5D (i.e., a cross-sectional view of the exemplary solar module of fig. 5D), particularly showing a cross-sectional detail of a flexible interconnect arranged for interconnecting two super cells in a row in series.

Fig. 8D-8G show additional examples of electrical interconnects bonded to the front terminal contacts of the super cells adjacent the edge of the solar module at one end of a row of super cells. These exemplary interconnects are configured to occupy only a small area on the front surface of the module.

Fig. 9A shows a schematic view of another exemplary rectangular solar module comprising six clamshell rectangular super cells, wherein the length of the long side of each super cell is approximately equal to the length of the long side of the solar module. The super cells are arranged in six rows electrically connected in parallel with each other and with bypass diodes provided in a junction box on the rear surface of the solar module. The electrical connection between the super cell and the bypass diode is made by solder strips through the laminate structure of the embedded module.

Fig. 9B shows a schematic of another exemplary rectangular solar module comprising six clamshell rectangular super cells, wherein the length of the long side of each super cell is approximately equal to the length of the long side of the solar module. The super cells are arranged in six rows electrically connected in parallel with each other and also electrically connected in parallel with bypass diodes provided in a junction box near one edge on the rear surface of the solar module. The second junction box is located near an opposite edge on the rear surface of the solar module. The electrical connection between the super cell and the bypass diode is made through an external cable between the two junction boxes.

Fig. 9C shows an exemplary double-sided glass rectangular solar module comprising six clamshell rectangular super cells, where the length of the long side of each super cell is approximately equal to the length of the long side of the solar module. The super cells are arranged in six rows electrically connected in parallel to each other. Two junction boxes are mounted on opposite edges of the module to maximize the effective area of the module.

Fig. 9D shows a side view of the solar module shown in fig. 9C.

Fig. 9E shows another exemplary solar module comprising six clamshell rectangular super cells, wherein the length of the long side of each super cell is approximately equal to the length of the long side of the solar module. The super cells are arranged in six rows, three pairs of rows of cells each connected to a power management device on the solar module.

Fig. 9F shows another exemplary solar module comprising six clamshell rectangular super cells, wherein the length of the long side of each super cell is approximately equal to the length of the long side of the solar module. The super cells are arranged in six rows, each row being individually connected to a power management device on the solar module.

Fig. 9G and 9H illustrate other embodiments of architectures for module level power management using a stacked lid super cell.

Fig. 10A shows an exemplary electrical schematic of the solar module shown in fig. 5B.

FIGS. 10B-1 and 10B-2 illustrate exemplary physical layouts of various electrical interconnections of the solar module shown in FIG. 5B with the circuit schematic of FIG. 10A.

Fig. 11A illustrates an exemplary circuit schematic of the solar module shown in fig. 5A.

11B-1 and 11B-2 illustrate exemplary physical layouts of various electrical interconnections of the solar module shown in FIG. 5A with the circuit schematic of FIG. 11A.

11C-1 and 11C-2 illustrate another exemplary physical layout of various electrical interconnections of the solar module shown in FIG. 5A with the circuit schematic of FIG. 11A.

Fig. 12A illustrates another exemplary electrical schematic of the solar module shown in fig. 5A.

12B-1 and 12B-2 illustrate exemplary physical layouts of various electrical interconnections of the solar module shown in FIG. 5A with the circuit schematic of FIG. 12A.

12C-1, 12C-2, and 12C-3 illustrate another exemplary physical layout of various electrical interconnections of the solar module shown in FIG. 5A with the circuit schematic of FIG. 12A.

Fig. 13A illustrates another exemplary electrical schematic of the solar module shown in fig. 5A.

Fig. 13B illustrates another exemplary electrical schematic of the solar module shown in fig. 5B.

Fig. 13C-1 and 13C-2 illustrate exemplary physical layouts of various electrical interconnections of the solar module shown in fig. 5A with the circuit schematic of fig. 13A. The physical layout of fig. 13C-1 and 13C-2 is slightly modified to be suitable for use in a solar module as shown in fig. 5B with the circuit schematic of fig. 13B.

FIG. 14A shows a schematic view of another exemplary rectangular solar module comprising a plurality of clamshell rectangular super cells, wherein the length of the long side of each super cell is approximately equal to half the length of the short side of the solar module. Pairs of super cells are arranged end-to-end to form rows with the long sides of the super cells parallel to the short sides of the module.

Fig. 14B shows an exemplary electrical schematic of the solar module shown in fig. 14A.

14C-1 and 14C-2 illustrate exemplary physical layouts of various electrical interconnections of the solar module shown in FIG. 14A with the circuit schematic of FIG. 14B.

FIG. 15 illustrates another exemplary physical layout of various electrical interconnections of the solar module shown in FIG. 5B with the circuit schematic of FIG. 10A.

Fig. 16 shows an exemplary arrangement of an intelligent switch interconnecting two solar modules in series.

FIG. 17 shows a flow diagram of an exemplary method of fabricating a solar module using a super cell.

FIG. 18 shows a flow diagram of another exemplary method of fabricating a solar module using a super cell.

Fig. 19A-19D illustrate an exemplary arrangement in which a super cell may be cured using heat and pressure.

Fig. 20A-20C schematically illustrate an exemplary apparatus that may be used to cut a scribed solar cell. The apparatus may be particularly advantageous when used to cut scribed supercells that are coated with conductive adhesive bonding material.

Fig. 21 shows an exemplary white back plate with dark lines plus "zebra stripes" that can be used in solar modules including parallel rows of super cells to mitigate visual contrast between the super cells and portions of the back plate that are visible from the front of the module.

Fig. 22A shows a plan view of a conventional module using a conventional ribbon connection in a hot spot state. FIG. 22B illustrates a plan view of a module utilizing a thermal diffusion method according to various embodiments also in a hot spot state.

Fig. 23A to 23B show examples of super cell string layouts with chamfered cells.

Fig. 24-25 show simplified cross-sectional views of an array comprising a plurality of modules assembled in a stacked configuration.

Fig. 26 shows a schematic of the back (back female) surface of a solar module illustrating exemplary electrical interconnection of terminal electrical contacts on the front (male) surface of the overlapping super cells to a junction box on the back side of the module.

Fig. 27 shows a schematic view of the back (back-female) surface of a solar module showing an exemplary electrical interconnection of two or more overlapping super cells in parallel, with terminal electrical contacts on the front (male) surface of the super cells connected to each other and to a junction box on the back side of the module.

Fig. 28 shows a schematic view of the back (back, female) surface of a solar module showing another exemplary electrical interconnection of two or more overlapping super cells in parallel, where the terminal electrical contacts on the front (male) surface of the super cells are connected to each other and to a junction box on the back side of the module.

Fig. 29 illustrates a partial cross-sectional perspective view of two super cells showing the use of a flexible interconnect sandwiched between overlapping ends of adjacent super cells to electrically connect the super cells in series and provide an electrical connection to a junction box. Fig. 29A shows an enlarged view of the region of interest in fig. 29.

Fig. 30A shows an exemplary super cell with electrical interconnects coupled to its front and back surface terminal contacts. Fig. 30B shows two of the super cells shown in fig. 30A interconnected in parallel.

Fig. 31A-31C show schematic diagrams of exemplary back surface metallization patterns that may be used to form hidden taps connected to a super cell as described herein.

Fig. 32-33 show examples of using hidden taps with interconnects that extend approximately the full width of the super cell.

Fig. 34A-34C show examples of interconnects bonded to terminal contacts on the rear surface (fig. 34A) and the front surface (fig. 34B-34C) of a super cell.

Fig. 35-36 show examples of using hidden taps with short interconnects that span the gap between adjacent super cells, but do not extend substantially inward along the long axis of the rectangular solar cell.

Fig. 37A-1 to 37F-3 illustrate an exemplary configuration of a hidden tap short interconnect including an in-plane stress relief feature.

Fig. 38A-1-38B-2 illustrate an exemplary configuration of a hidden tap short interconnect including out-of-plane stress relief features.

Fig. 39A-1 and 39A-2 illustrate an exemplary configuration of a hidden tap shorting interconnect including alignment features. FIGS. 39B-1 and 39B-2 illustrate an exemplary configuration of hidden tap shorting interconnects with asymmetric tab lengths.

Fig. 40 and 42A-44B illustrate exemplary solar module layouts employing hidden taps.

Fig. 41 shows an exemplary electrical schematic diagram of the solar module layout of fig. 40 and 42A-44B.

Fig. 45 shows current flow in an exemplary solar module with bypass diodes conducting.

Fig. 46A-46B illustrate relative movement between solar module components caused by thermal cycling in the solar module in a direction parallel to the rows of super cells and in a direction perpendicular to the rows of super cells, respectively.

Fig. 47A-47B illustrate another exemplary solar module layout and corresponding electrical schematic, respectively, employing hidden taps.

Fig. 48A-48B illustrate additional solar cell module layouts using hidden taps in combination with embedded bypass diodes.

Fig. 49A-49B show block diagrams of a solar module for providing a conventional dc voltage to a micro-inverter and a high voltage solar module for providing a high dc voltage to a micro-inverter as described herein, respectively.

Fig. 50A-50B illustrate exemplary physical layouts and electrical circuit schematics of exemplary high voltage solar modules incorporating bypass diodes.

Fig. 51A-55B illustrate an exemplary architecture of a high voltage solar module including a stacked lid super cell for module level power management.

Fig. 56 shows an exemplary arrangement of six super cells in six parallel rows, with the ends of adjacent rows staggered and interconnected in series by flexible electrical interconnects.

Fig. 57A schematically illustrates a photovoltaic system including a plurality of high dc voltage stacked solar cell modules electrically connected in parallel with each other and to a string inverter. Fig. 57B illustrates the photovoltaic system of fig. 57A deployed on a roof.

Fig. 58A-58D illustrate an arrangement of current limiting fuses and current blocking diodes that may be used to prevent short circuiting of a high dc voltage stacked solar cell module, thereby avoiding dissipation of a significant amount of power generated by other high dc voltage stacked solar cell modules electrically connected in parallel by the module due to such short circuiting.

Fig. 59A-59B illustrate an exemplary arrangement of two or more high dc voltage clamshell solar cell modules electrically connected in parallel in a combiner box, which may include current limiting fuses and current blocking diodes.

Fig. 60A to 60B each show a current versus voltage graph and a power versus voltage graph of a plurality of high dc voltage stacked cover type solar cell modules electrically connected in parallel. The graph of fig. 60A is for an exemplary case where none of the modules includes a reverse bias solar cell. The graph of fig. 60B is for an exemplary case where some modules include one or more reverse biased solar cells.

Fig. 61A shows an example of a solar module utilizing about 1 bypass diode per super cell. Fig. 61C shows an example of a solar module utilizing a nested configuration of bypass diodes. Fig. 61B shows an exemplary configuration of a bypass diode connected between two adjacent super cells using a flexible electrical interconnect.

Fig. 62A-62B schematically illustrate a side view and a top view, respectively, of another exemplary cutting tool.

Fig. 63A schematically illustrates the use of an exemplary asymmetric vacuum arrangement to control the nucleation of cracks along a scribe line and to control the propagation of cracks along the scribe line as the wafer is diced. Fig. 63B schematically illustrates the use of an exemplary symmetric vacuum arrangement, providing less control over cutting than the arrangement of fig. 63A.

Fig. 64 schematically illustrates a top view of a portion of an exemplary vacuum manifold that may be used in the cutting tool of fig. 62A-62B.

Fig. 65A and 65B provide a schematic top view and a schematic perspective view, respectively, of the exemplary vacuum manifold of fig. 64 covered by a porous belt.

Fig. 66 schematically illustrates a side view of an exemplary vacuum manifold that may be used in the cutting tool of fig. 62A-62B.

Figure 67 schematically shows a diced solar cell overlaid on an exemplary arrangement of porous ribbons and vacuum manifolds.

Fig. 68 schematically illustrates the relative position and relative orientation of a diced solar cell and an uncut portion on a standard size wafer from which the solar cell was diced in an exemplary dicing process.

Fig. 69A to 69G schematically illustrate an apparatus and method by which cut solar cells can be continuously removed from a cutting tool.

Fig. 70A-70C provide orthogonal views of another variation of the exemplary cutting tool of fig. 62A-62B.

Fig. 71A and 71B provide perspective views of the exemplary cutting tool of fig. 70A-70C at two different stages of the cutting process.

Fig. 72A-74B illustrate details of the porous belt and vacuum manifold of the exemplary cutting tool of fig. 70A-70C.

Fig. 75A-75G illustrate details of several exemplary hole patterns of a porous vacuum belt that may be used in the exemplary cutting tools of fig. 10A-10B-1 and 10B-2.

Fig. 76 shows an exemplary front surface metallization pattern on a rectangular solar cell.

Fig. 77A-77B illustrate exemplary back surface metallization patterns on a rectangular solar cell.

Fig. 78 illustrates an exemplary front surface metallization pattern on a square solar cell that can be cut into a plurality of rectangular solar cells, each having the front surface metallization pattern illustrated in fig. 76.

Fig. 79 illustrates an exemplary back surface metallization pattern on a square solar cell that can be cut into a plurality of rectangular solar cells, each having the back surface metallization pattern shown in fig. 77A.

Fig. 80 is a schematic diagram of a conventionally sized HIT solar cell that is cut into narrow strips using conventional cutting methods, resulting in cut edges that promote carrier recombination.

Fig. 81A-81J schematically illustrate steps in an exemplary method of cutting a conventionally sized HIT solar cell into narrow strips that lack cut edges that promote carrier recombination.

Fig. 82A-82J schematically illustrate steps in another exemplary method of cutting a conventionally sized HIT solar cell into narrow strips of solar cells lacking cut edges that promote carrier recombination.

Detailed Description

The following detailed description should be read with reference to the drawings, in which like reference numerals refer to like elements throughout. The drawings, which are not necessarily to scale, depict selected embodiments and are not intended to limit the scope of the invention. The detailed description illustrates by way of example, and not by way of limitation, the principles of the invention. This detailed description describes several embodiments, adaptations, variations, alternatives, and uses of the invention, including what is presently believed to be the best mode of carrying out the invention; a method of manufacturing the solar cell module of the present invention using the technology of the present invention will be apparent to those skilled in the art after reading this detailed description.

As used in this specification and the appended claims, the singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. Furthermore, the term "parallel" is used to mean "parallel or substantially parallel" to encompass minor deviations from parallel geometry, and does not require that any parallel arrangement described herein be perfectly parallel. The term "perpendicular" is used to refer to "perpendicular or substantially perpendicular" and encompasses minor deviations from perpendicular geometry, without requiring that any of the perpendicular arrangements described herein be perfectly perpendicular. The term "square" is used to refer to "square or substantially square" and encompasses minor deviations from square, such as a substantially square shape with rounded corners or other truncated corners. The term "rectangular" is used to refer to "rectangular or substantially rectangular" and encompasses slight deviations from rectangular shapes, such as substantially rectangular shapes having rounded corners or other truncated corners.

The present specification discloses efficient, overlapping arrangements of silicon solar cells in solar cell modules, and front surface metallization patterns, back surface metallization patterns, and interconnects of solar cells that can be used in such arrangements. Methods of making such solar modules are also disclosed. Solar modules can be advantageously used under "one sun" (non-concentrated) illumination, the physical size and electrical specifications of which enable them to replace conventional silicon solar modules.

Fig. 1 shows a cross-sectional view of a string of solar cells 10 connected in series, arranged in an overlapping manner and electrically connected to form a super cell 100, wherein the ends of adjacent solar cells overlap. Each solar cell 10 includes a semiconductor diode structure and electrical contacts connected to the semiconductor diode structure through which electrical current generated in the solar cell 10 when it is irradiated with light can be supplied to an external load.

In the examples described herein, each solar cell 10 is a crystalline silicon solar cell having a front (sunnyside) surface metallization pattern disposed on a semiconductor layer of n-type conductivity and a back (shady side) surface metallization pattern disposed on a semiconductor layer of p-type conductivity, the metallization patterns providing electrical contacts to opposite sides of an n-p junction. However, any other suitable solar cell utilizing any other suitable material system, diode structure, physical dimensions or electrical contact arrangement may be used instead of or in addition to the solar cell 10 in the solar module described in this specification. For example, a front (sunnyside) surface metallization pattern may be disposed on a semiconductor layer of p-type conductivity and a back (shady side) surface metallization pattern may be disposed on a semiconductor layer of n-type conductivity.

Referring again to fig. 1, in the super cell 100, adjacent solar cells 10 are conductively bonded to each other in regions where they overlap by means of a conductive bonding material that electrically connects the front surface metallization pattern of one solar cell to the back surface metallization pattern of the adjacent solar cell. Suitable conductive bonding materials may include, for example, conductive adhesives, conductive adhesive films and conductive adhesive tapes, as well as conventional solders. Preferably, the conductive bonding material provides mechanical compliance in the bond between adjacent solar cells, thereby accommodating stresses due to a mismatch of the Coefficient of Thermal Expansion (CTE) of the conductive bonding material and the CTE of the solar cells (e.g., the CTE of silicon). To provide this mechanical compliance, in some variations, the conductive bonding material is selected to have a glass transition temperature less than or equal to about 0 ℃. To further reduce and accommodate the stresses parallel to the overlapping edges of the solar cells due to CTE mismatch, the conductive bonding material may optionally be applied only at discrete locations along the overlapping regions of the solar cells, and not as a continuous line extending substantially the length of the solar cell edges.

The thickness of the conductive bond formed between adjacent overlapping solar cells by the conductive bonding material may be, for example, less than about 0.1mm, measured perpendicular to the front and back surfaces of the solar cells. Such a thin bond reduces resistive losses at the inter-cell interconnect and also promotes heat flow along the super cell from any hot spots that may occur therein during operation of the super cell. The thermal conductivity of the junction between the solar cells can be, for example, greater than or equal to about 1.5W/(m-K).

Fig. 2A shows the front surface of an exemplary rectangular solar cell 10 that may be used in a super cell 100. Other shapes of solar cells 10 may also be used, if appropriate. In the illustrated example, the front surface metallization pattern of the solar cell 10 comprises a bus bar 15 and fingers 20, the bus bar 15 being arranged adjacent to an edge of one long side of the solar cell 10 and extending substantially parallel to the long side for the length of the long side; the fingers 20 are attached perpendicularly to the bus bars, extending not only parallel to each other, but also parallel to the short sides of the solar cell 10 substantially the length of the short sides.

In the example of fig. 2A, the solar cell 10 is approximately 156mm long and approximately 26mm wide, so the aspect ratio (short side length/long side length) is approximately 1: 6. Six such solar cells may be fabricated on a standard size 156mm x 156mm silicon wafer and subsequently singulated (diced) to provide the illustrated solar cells. In other variations, eight solar cells 10 having dimensions of about 19.5mm by 156mm, and thus an aspect ratio of about 1:8, may be prepared from standard silicon wafers. More generally, the solar cells 10 may have an aspect ratio of, for example, about 1:2 to about 1:20, and may be fabricated from standard size wafers or any other suitably sized wafers.

Fig. 3A illustrates an exemplary method by which a standard size square silicon solar cell wafer 45 may be cut, broken down, or otherwise separated to form the rectangular solar cell just described. In this example, several full width rectangular solar cells 10L are cut from the central portion of the wafer, and furthermore, several shorter rectangular solar cells 10S are cut from the end portions of the wafer, and the chamfered or rounded corners of the wafer are discarded. Solar cell 10L may be used to form a single width of stacked super cell and solar cell 10S may be used to form a narrower width of stacked super cell.

Alternatively, a chamfer (e.g., rounded corner) may remain on the solar cell that is cut from the end of the wafer. Fig. 2B-2C show the front surface of an exemplary "V" rectangular solar cell 10, which is substantially similar to the front surface of fig. 2A, but with chamfers that remain from the wafer from which the solar cell was cut. In fig. 2B, the bus bar 15 is arranged adjacent to the shorter of the two long sides and extends substantially parallel to this side for its length and then at both ends at least partially around the chamfer of the solar cell. In fig. 2C, the bus 15 is disposed adjacent to the longer of the two long sides and extends substantially parallel to this side for its length. Fig. 3B-3C show front and back views of a quasi-square wafer 45, the quasi-square wafer 45 being diced along the dashed lines shown in fig. 3C to provide a plurality of solar cells 10 having a front surface metallization pattern similar to that shown in fig. 2A, and two chamfered solar cells 10 having a front surface metallization pattern similar to that shown in fig. 2B.

In the exemplary front surface metallization pattern shown in fig. 2B, the two ends of the bus bar 15 extending around the chamfers of the cells may each have a gradually decreasing (gradually narrowing) width as the distance from the portion of the bus bar located near the long side of the cell increases. Similarly, in the exemplary front surface metallization pattern shown in fig. 3B, the two ends of the thin wires interconnecting the discrete contact pads 15 extend around the chamfer of the solar cell and taper with increasing distance from the long side of the solar cell along which the discrete contact pads are arranged. This tapering is optional, but advantageously reduces the metal used and the shading of the active area of the solar cell without significantly increasing the resistive losses.

Fig. 3D-3E show front and back views of a perfectly square wafer 47, the perfectly square wafer 47 being cuttable along the dashed lines shown in fig. 3E to provide a plurality of solar cells 10 having a front surface metallization pattern similar to that shown in fig. 2A.

Chamfered rectangular solar cells may be used to form a super cell comprising only chamfered solar cells. Additionally or alternatively, one or more such chamfered rectangular solar cells may be used in combination with one or more non-chamfered rectangular solar cells (e.g., fig. 2A) to form a super cell. For example, the end solar cell of a super cell may be a chamfered solar cell, while the middle solar cell thereof may be an un-chamfered solar cell. If a combination of chamfered and non-chamfered solar cells is used in a super cell (or more generally in a solar module), it may be advantageous to select the following dimensions for these solar cells: during operation of the solar cell, the areas of the front surfaces of both the chamfered and non-chamfered solar cells exposed to sunlight are equal. Matching the areas of the two solar cells in this manner matches the currents generated in the chamfered and non-chamfered solar cells, thereby improving the performance of a series string comprising both chamfered and non-chamfered solar cells. The areas of the chamfered and non-chamfered solar cells cut from the same quasi-square wafer can be matched to compensate for missing corners on the chamfered solar cell, for example, by adjusting the position of the lines along which the wafer is cut so that the chamfered solar cell is slightly wider than the non-chamfered solar cell in a direction perpendicular to the long axis of the solar cell.

A solar module may include only the following three types of super cells: a super cell formed only of un-chamfered rectangular solar cells, a super cell formed only of chamfered rectangular solar cells, or a super cell including both chamfered and un-chamfered solar cells; any combination of the three variants of the super cell described above may also be included.

In some cases, the portion of a standard sized square or quasi-square solar cell wafer (e.g., wafer 45 or wafer 47) near the edge of the wafer may be less efficient at converting light to electricity than the portion of the wafer away from the edge. To improve the efficiency of the resulting rectangular solar cell, in some variations, one or more edges of the wafer are trimmed, such that the less efficient portions are removed prior to dicing the wafer. The width of the portion trimmed from the edge of the wafer may be, for example, about 1mm to about 5 mm. In addition, as shown in fig. 3B and 3D, the two end solar cells 10 that will be cut from the wafer can be oriented with their front surface busses (or discrete contact pads) 15 along their outer edges, and thus along both edges of the wafer. Since in the super cell disclosed in this specification the bus bar (or discrete contact pad) 15 typically overlaps with the adjacent solar cell, the low light conversion efficiency along both edges of the wafer does not affect the performance of the solar cell. Thus, in some variations, the edges on the square or quasi-square wafer oriented parallel to the short sides of the rectangular solar cells are trimmed as just described, but the edges on the wafer oriented parallel to the long sides of the rectangular solar cells are not trimmed. In other variations, one, two, three, or four edges of a square wafer (e.g., wafer 47 in fig. 3D) are trimmed as just described. In other variations, one, two, three or four long edges of the quasi-square wafer are trimmed as just described.

Elongated solar cells (as shown) with large aspect ratios, 156mm by 156mm less than standard solar cells in area, can be advantageously used to reduce I in the solar cell modules disclosed in this specification ² R resistive power loss. In particular, as the area of the solar cell 10 is reduced compared to a standard size silicon solar cell, the current produced by the solar cell is reduced, thereby directly reducing resistive power losses in the series string of solar cells and such solar cells. In addition, arranging such rectangular solar cells in the super cell 100 so that current flows through the super cell in parallel to the short sides of the solar cell can shorten electricityThe distance that the flow must travel through the semiconductor material to reach the fingers 20 in the front surface metallization pattern and the necessary length of the fingers can be shortened, so that resistive power losses can also be reduced.

As described above, the solar cells are bonded to each other in the overlapping region of the overlapping solar cells 10 to thereby electrically connect the solar cells in series, shortening the length of electrical connection between adjacent solar cells as compared to the conventional series solar cell string having the protrusion portion. This also reduces resistive power losses.

Referring again to fig. 2A, in the illustrated example, the front surface metallization pattern on the solar cell 10 includes optional bypass wires 40 extending parallel to and spaced apart from the bus lines 15. (such bypass conductors may optionally also be used in the metallization patterns shown in fig. 2B-2C, 3B and 3D, but are also shown in fig. 2Q, when used in combination with discrete contact pads 15 rather than a continuous bus). Bypass wire 40 interconnects fingers 20 to enable cracks to form between current bypass bus 15 and bypass wire 40. Such cracks may block the fingers 20 at multiple locations near the bus bars 15, so multiple regions of the solar cell 10 may be otherwise isolated from the bus bars 15. Bypass wires provide an alternative electrical path between such blocked fingers and the bus. The illustrated example shows bypass conductors 40 arranged parallel to the bus 15, the bypass conductors 40 extending approximately the full length of the bus and interconnecting each finger 20. Such an arrangement may be preferred, but is not required. If present, the bypass conductors need not extend parallel to the bus, nor need they extend the full length of the bus. In addition, the bypass wire interconnects at least two fingers, but need not interconnect all fingers. Two or more shorter bypass conductors may be used, for example, instead of a longer bypass conductor. Any suitable arrangement of bypass conductors may be used. The use of such bypass wires is described in more detail in U.S. patent application No.13/371,790 entitled "Solar Cell With Metallization patterning For Or front Cracking" (Solar Cell With Metallization pattern to compensate Or avoid Cracking) filed on 13/2/2012, which is incorporated herein by reference in its entirety.

The exemplary front surface metallization pattern of fig. 2A also includes optional terminal leads 42 interconnecting fingers 20 at distal ends of fingers 20 opposite busses 15. (such terminal leads may also optionally be used in the metallization patterns shown in fig. 2B-2C, 3B, 3D, and 2Q). The width of the wire 42 may be, for example, approximately the same as that of the finger 20. Wires 42 interconnect fingers 20 so as to electrically bypass cracks that may form between bypass wires 40 and wires 42, thereby providing a current path to bus 15 for areas of solar cell 10 that may otherwise be electrically isolated by such cracks.

Although some of the illustrated examples show the front bus bars 15 being uniform in width and extending substantially the length of the long side of the solar cell 10, this is not required. For example, as described above, the front bus 15 may be replaced by two or more discrete contact pads 15 on the front surface, which discrete contact pads 15 may be arranged in line with each other, for example, along one side of the solar cell 10, e.g., as shown in fig. 2H, 2Q, and 3B. Such discrete contact pads may optionally be interconnected by thin conductive lines extending therebetween, as shown, for example, in the figures just mentioned. In such variants, the width of the contact pads, measured perpendicular to the long sides of the solar cell, may be, for example, about 2 to about 20 times the width of the thin wires interconnecting the contact pads. There may be a separate (e.g., small) contact pad for each finger in the front surface metallization pattern, or each contact pad may be connected to two or more fingers. For example, the front surface contact pads 15 may be square, or rectangular elongated parallel to the edges of the solar cell. The width of the front surface contact pad 15 is perpendicular to the long side of the solar cell and may be, for example, about 1mm to about 1.5 mm; the length of which is parallel to the long side of the solar cell, may for example be about 1mm to about 10 mm. The spacing between the contact pads 15 may be, for example, about 3mm to about 30mm, measured parallel to the long sides of the solar cell.

Alternatively, the solar cell 10 may lack the front bus 15 and discrete front contact pads 15, and thus include the fingers 20 only in the front surface metallization pattern. In such variants, the current collecting function, which would otherwise be performed by the front bus bar 15 or the front contact pads 15, may be performed entirely or partially by the conductive material joining the two solar cells 10 to each other in the above-described overlapping configuration.

Solar cells lacking both bus 15 and contact pads 15 may or may not include bypass conductors 40. If the bus 15 and contact pads 15 are not present, the bypass wire 40 may be arranged to bypass a crack formed between the bypass wire and the portion of the front surface metallization pattern conductively bonded to the overlapping solar cells.

The front surface metallization pattern comprising bus or discrete contact pads 15, fingers 20, bypass conductors 40 (if present) and end conductors 42 (if present) may be formed, for example, from silver paste conventionally used for such purposes, and then deposited, for example, using conventional screen printing methods. Alternatively, the front surface metallization pattern may be formed of electroplated copper. Any other suitable materials and processes may also be used. In variations where the front surface metallization pattern is formed of silver, the use of discrete front surface contact pads 15 rather than a continuous bus 15 along the cell edge reduces the amount of silver on the solar cell, which can advantageously reduce cost. In variations where the front surface metallization pattern is formed of copper or another conductor that is less expensive than silver, the continuous bus 15 may be used without a cost penalty.

Fig. 2D-2G, 3C, and 3E illustrate exemplary back surface metallization patterns of a solar cell. In these examples, the back surface metallization pattern includes discrete back surface contact pads 25 arranged along one long edge of the back surface of the solar cell, and metal contacts 30 covering substantially all of the remaining area of the back surface of the solar cell. In a stacked super cell, the contact pads 25 are for example bonded to a bus bar or discrete contact pads arranged along the edge of the upper surface of adjacent overlapping solar cells, thereby electrically connecting the two solar cells in series. For example, each discrete back surface contact pad 25 may be aligned with a corresponding discrete front surface contact pad 15 on the front surface of the overlying solar cell and bonded to the corresponding discrete front surface contact pad 15 by a conductive bonding material applied only to the discrete contact pad. For example, the discrete contact pads 25 may be square (fig. 2D), or rectangular elongated parallel to the edges of the solar cell (fig. 2E-2G, 3C, 3E). The width of the contact pad 25 is perpendicular to the long side of the solar cell, and may be, for example, about 1mm to about 5 mm; the length of which is parallel to the long side of the solar cell, may for example be about 1mm to about 10 mm. The spacing between the contact pads 25 may be, for example, about 3mm to about 30mm, measured parallel to the long sides of the solar cell.

The contacts 30 may be formed, for example, from aluminum and/or electroplated copper. The aluminum back contact 30 is formed to generally provide a back surface field for mitigating back surface recombination in the solar cell, thereby improving solar cell efficiency. If the contacts 30 are formed of copper instead of aluminum, the contacts 30 may be used in combination with another passivation scheme (e.g., aluminum oxide) to similarly mitigate back surface recombination. The discrete contact pads 25 may be formed of silver paste, for example. The use of discrete silver contact pads 25 rather than continuous silver contact pads along the cell edges reduces the amount of silver in the back surface metallization pattern, which can advantageously reduce cost.

In addition, if the solar cell relies on the back surface field provided by the formed aluminum contacts to mitigate back surface recombination, using discrete silver contacts instead of continuous silver contacts can improve solar cell efficiency. This is because the silver back surface contacts do not provide a back surface field and therefore tend to promote carrier recombination and create dead (dead) volumes above the silver contacts in the solar cell. In solar cell strings conventionally having ribbon-shaped protrusions, these dead volumes are typically obscured by solder ribbons and/or busbars on the front surface of the solar cell, and therefore do not cause any additional efficiency loss. However, in the solar cells and supercells disclosed herein, the volume of the solar cell above the back surface silver contact pad 25 is typically completely uncovered by the front surface metallization pattern, so any dead volume created by using the silver back surface metallization pattern will reduce the efficiency of the cell. Thus, the use of discrete silver contact pads 25 rather than continuous silver contact pads along the edges of the rear surface of the solar cell reduces the volume of any corresponding dead space, thus increasing the efficiency of the solar cell.

In variations that do not rely on a back surface field to mitigate back surface recombination, the back surface metallization pattern may employ a continuous bus 25 extending along the length of the solar cell rather than discrete contact pads 25, e.g., as inFIG. 2QAs shown. Such a bus 25 may be formed, for example, of tin or silver.

Other variations of the back surface metallization pattern may employ discrete tin contact pads 25. Variations of the back surface metallization pattern may employ finger-like contacts similar to those shown in the front surface metallization pattern of fig. 2A-2C, and may lack contact pads and busses.

Although the particular exemplary solar cell shown in the figures is described as having a particular combination of front surface metallization patterns and back surface metallization patterns, more generally, any suitable combination of front surface metallization patterns and back surface metallization patterns may be used. For example, one suitable combination may employ a front surface metallization pattern of silver including discrete contact pads 15, fingers 20, and optional bypass conductive lines 40, and a back surface metallization pattern including aluminum contacts 30 and discrete silver contact pads 25. Another suitable combination may employ a copper front surface metallization pattern including continuous bus 15, fingers 20, and optional bypass conductive lines 40, and a back surface metallization pattern including continuous bus 25 and copper contacts 30.

In the process of manufacturing a super cell (described in more detail below), the conductive bonding material used to bond adjacent overlapping solar cells in the super cell may be dispensed only (discretely or continuously) onto the contact pads at the edges of the front or back surface of the solar cell, and not onto the surrounding portions of the solar cell. This reduces the amount of material used and, as described above, can reduce or accommodate stress due to CTE mismatch of the conductive bonding material and the solar cell. However, during or after deposition and prior to curing, portions of the conductive bonding material may tend to spread out of the contact pads and then onto corresponding portions of the solar cell. For example, the adhesive resin portion of the conductive bonding material may be drawn out of the contact pad by capillary force and then spread onto an adjacent textured or porous portion on the surface of the solar cell. In addition, during the deposition process, some of the conductive bonding material may not reach the contact pads, but is deposited onto adjacent portions of the solar cell surface, from which they may subsequently spread towards the surroundings. Such spreading and/or deposition inaccuracies of the conductive bonding material may weaken the bond between overlapping solar cells and may damage those portions of the solar cells onto which the conductive bonding material is spread or erroneously deposited. Such spreading of the conductive bonding material may be mitigated or prevented, for example, by a metallization pattern that forms a barrier or barrier near or around each contact pad, thereby substantially holding the conductive bonding material in place.

As shown in fig. 2H-2K, for example, the front surface metallization pattern may include discrete contact pads 15, fingers 20, and barriers 17, wherein each barrier 17 surrounds a corresponding contact pad 15 and acts as a barrier, forming a moat between the contact pad and the barrier. The portion 19 of the uncured conductive adhesive bonding material 18 that flows from the contact pad or does not reach the contact pad when dispensed onto the solar cell may be confined by the barrier 17 within the moat. This prevents the conductive adhesive bonding material from spreading further from the contact pads onto the surrounding portions of the cell. The barrier 17 may be formed, for example, of the same material as the fingers 20 and contact pads 15 (e.g., silver), may have a height of, for example, about 10 microns to about 40 microns, and a width of, for example, about 30 microns to about 100 microns. The moat formed between the barrier 17 and the contact pad 15 may have a width of, for example, about 100 microns to about 2 millimeters. Although the illustrated example has only a single barrier 17 around each front contact pad 15, in other variations, two or more such barriers may be provided concentrically around each contact pad, for example. The front surface contact pad and its surrounding barrier or barriers may form a shape similar to a "bulls-eye" target, for example. As shown in fig. 2H, for example, the barrier 17 may be interconnected with the fingers 20 and may be interconnected with thin conductive lines that interconnect the contact pads 15.

Similarly, as shown in fig. 2L-2N, for example, the back surface metallization pattern may include discrete back contact pads 25 (e.g., of silver), contacts 30 (e.g., of aluminum) covering substantially all of the remaining area of the back surface of the solar cell, and barriers 27 (e.g., of silver), wherein each barrier 17 surrounds a corresponding back contact pad 25 and acts as a barrier, thereby forming a moat between the contact pad and the barrier. As shown, a portion of the contact 30 may fill the moat. Portions of the uncured conductive adhesive bonding material that flow from the contact pads 25 or do not reach the contact pads when dispensed onto the solar cell may be confined within the moat by the barrier 27. This prevents the conductive adhesive bonding material from spreading further from the contact pads onto the surrounding portions of the cell. The barrier 27 may, for example, have a height of about 10 microns to about 40 microns and a width of about 50 microns to about 500 microns. The moat formed between the barrier 27 and the contact pad 25 may have a width of, for example, about 100 microns to about 2 millimeters. Although the illustrated example has only a single barrier 27 around each rear surface contact pad 25, in other variations, two or more such barriers may be provided, for example concentrically around each contact pad. The back surface contact pad and its surrounding barrier or barriers may form a shape similar to a "bulls-eye" target, for example.

A continuous bus bar or contact pad extending substantially the length of the solar cell edge may also be surrounded by a barrier that prevents the spreading of the conductive adhesive bonding material. For example, fig. 2Q shows such a barrier 27 around the back surface bus 25. A front surface bus (e.g., bus 15 in fig. 2A) may similarly be surrounded by a barrier. Similarly, a row of front or rear surface contact pads may be surrounded by such a barrier as a whole, rather than being surrounded by separate barriers.

The features of the front surface metallization pattern or the back surface metallization pattern may form a barrier extending substantially the length of the solar cell parallel to the overlapping edges of the solar cell, rather than surrounding the bus bars or one or more contact pads as just described, when the bus bars or contact pads are disposed between the barrier and the edges of the solar cell. This barrier may serve a dual function (as described above) as a bypass conductor. For example, in fig. 2R, the bypass wire 40 provides a barrier that helps prevent uncured conductive adhesive bonding material on the contact pad 15 from spreading over the active area of the front surface of the solar cell. A similar arrangement may be used for the back surface metallization pattern.

The barrier preventing spreading of the conductive adhesive bonding material may be spaced from the contact pads or busses to form the moat just described, but this is not required. Alternatively, such barriers may be in close proximity to contact pads or busses, for example as shown in fig. 2O or fig. 2P. In such variations, the barrier is preferably taller than the contact pads or busses to retain the uncured conductive adhesive bonding material on the contact pads or busses. Although fig. 2O and 2P show portions on the front surface metallization pattern, a similar arrangement may be used for the back surface metallization pattern.

The barrier preventing spreading of the conductive adhesive bonding material and/or the moat between such barrier and the contact pad or bus bar, as well as any conductive adhesive bonding material that has spread into such moat, may optionally be located on the surface of the solar cell in a region overlapping an adjacent solar cell in the super cell, and thus not visible, and shielded from exposure to solar radiation.

Instead of or in addition to using a barrier as just described, a mask or any other suitable method (e.g., screen printing) may be used to deposit the conductive bonding material, thereby enabling accurate deposition, reducing the amount of conductive bonding material that may spread out of or not reach the contact pads during deposition.

More generally, the solar cell 10 may employ any suitable front surface metallization pattern and back surface metallization pattern.

Fig. 4A shows a portion of the front surface of an exemplary rectangular super cell 100 comprising solar cells 10 as shown in fig. 2A, the solar cells 10 being arranged in an overlapping manner as shown in fig. 1. Due to the overlapping geometry, there is no physical gap between the pairs of solar cells 10. Additionally, although the bus bars 15 of the solar cells 10 at one end of the super cell 100 can be seen, the bus bars (or front surface contact pads) of other solar cells are hidden under the overlapping portions of adjacent solar cells. Thus, the super cell 100 effectively uses the area occupied in the solar module. In particular, a larger portion of this area is available for generating electrical power than is the case with the conventional solar cell arrangement with protrusions and solar cell arrangements comprising many visible buses on the illuminated surface of the solar cell. Fig. 4B-4C show front and back views, respectively, of another exemplary super cell 100, the super cell 100 primarily comprising a chamfered V-shaped rectangular silicon solar cell, but otherwise similar to fig. 4A.

In the example shown in fig. 4A, the bypass conductor 40 is hidden by the overlapping portion of the adjacent cells. Alternatively, the solar cells including the bypass wire 40 may overlap similar to that shown in fig. 4A, but not cover the bypass wire.

The front surface bus 15 exposed at one end of the super cell 100 and the rear surface metallization of the solar cell at the other end of the super cell 100 provide the super cell with negative (terminal) and positive (terminal) terminal contacts that can be used to electrically connect the super cell 100 to other super cells and/or to electrically connect the super cell 100 to other electrical components as needed.

Adjacent solar cells in the super cell 100 can overlap by any suitable amount, such as from about 1mm to about 5 mm.

As shown in fig. 5A-5G, for example, the overlapping super cell just described can effectively fill the area of the solar module. Such solar modules may be square or rectangular, for example. The rectangular solar module shown in fig. 5A to 5G may have a length of a short side of about 1 meter, for example, and a length of a long side of about 1.5 meters to about 2.0 meters, for example. Any other suitable shape and size may also be selected for the solar module. Any suitable arrangement of super cells may be employed in the solar module.

In square or rectangular solar modules, the super cells are typically arranged in rows parallel to the short or long sides of the solar module. Each row may include one, two, or more super cells arranged end-to-end. The super cell 100 forming part of such a solar module may comprise any suitable number of solar cells 10 and have any suitable length. In some variations, the individual lengths of the super cells 100 are approximately equal to the length of the short sides of the rectangular solar module of which they form a part. In other variations, the length of each of the super cells 100 is approximately equal to half the length of the short side of the rectangular solar module of which they form a part. In other variations, the length of each of the super cells 100 is approximately equal to the length of the long side of the rectangular solar module of which they form a part. In other variants, the length of each of the super cells 100 is approximately equal to half the length of the long side of the rectangular solar module of which they form a part. The number of solar cells required to make these lengths of super cells naturally depends on the size of the solar module, the size of the solar cells, and the amount of overlap of adjacent solar cells. Any other suitable length may be selected for the super cell.

In a variation where the length of the super cell 100 is approximately equal to the length of the short side of a rectangular solar module, the super cell may comprise, for example, 56 rectangular solar cells having dimensions of about 19.5mm by about 156mm, with adjacent solar cells overlapping by about 3 mm. Eight such rectangular solar cells can be singulated from a conventional square or quasi-square 156mm x 156mm wafer. Alternatively, such a super cell may comprise, for example, 38 rectangular solar cells having dimensions of about 26mm by about 156mm, with adjacent solar cells overlapping by about 2 mm. Six such rectangular solar cells can be separated from a conventional square or quasi-square 156mm x 156mm wafer. In a variation where the length of the super cell 100 is approximately equal to half the length of the short side of a rectangular solar module, the super cell may comprise, for example, 28 rectangular solar cells having dimensions of about 19.5mm by about 156mm, with adjacent solar cells overlapping by about 3 mm. Alternatively, such a super cell may comprise, for example, 19 rectangular solar cells having dimensions of about 26mm by about 156mm, with adjacent solar cells overlapping by about 2 mm.

In a variant where the length of the super cell 100 is approximately equal to the length of the long side of the rectangular solar module, the super cell may for example comprise 72 rectangular solar cells with dimensions of about 26mm by about 156mm, where adjacent solar cells overlap by about 2 mm. In a variant where the length of the super cell 100 is approximately equal to half the length of the long side of the rectangular solar module, the super cell may comprise, for example, 36 rectangular solar cells having dimensions of about 26mm by about 156mm, with adjacent solar cells overlapping by about 2 mm.

Fig. 5A shows an exemplary rectangular solar module 200 comprising 20 rectangular super cells 100, wherein the length of each rectangular super cell is approximately equal to half the length of the short side of the solar module. The super cells are arranged in pairs end-to-end to form ten rows of super cells, wherein both the rows and the long sides of the super cells are oriented parallel to the short sides of the solar module. In other variations, each row of super cells may include three or more super cells. Additionally, similarly configured solar modules may include more or fewer rows of super cells than shown in this example. (for example, fig. 14A shows a solar module comprising twenty-four rectangular super cells arranged in twelve rows of two each).

In a variation where the super cells in each row are arranged such that at least one of the super cells has a front surface end contact at an end adjacent to another super cell in the row, the gap 210 shown in fig. 5A facilitates making electrical contact to the front surface end contact (e.g., exposed bus or discrete contact 15) of the super cell 100 along the centerline of the solar module. For example, two super cells in a row may be arranged such that one super cell has a front surface terminal contact along the centerline of the solar module and the other super cell has a back surface terminal contact along the centerline of the solar module. With this arrangement, two super cells in a row can be electrically connected in series by an interconnect disposed along the centerline of the solar module and joined to the front surface terminal contact of one super cell and the back surface terminal contact of another super cell. (see, e.g., FIG. 8C, discussed below). In variations where each row of super cells comprises three or more super cells, additional gaps may exist between the super cells, and these additional gaps may similarly assist in making electrical contact to the front surface end contacts away from the sides of the solar module.

Fig. 5B shows an exemplary rectangular solar module 300 comprising 10 rectangular super cells 100, wherein the length of each rectangular super cell is approximately equal to the length of the short side of the solar module. The super cells are arranged in parallel ten rows with the long sides oriented parallel to the short sides of the module. Similarly constructed solar modules may also include such side lengths of super cells, but in more or less rows than shown in this example.

Fig. 5B also shows the appearance of the solar module 200 of fig. 5A in a situation where there is no gap between adjacent super cells in each row of super cells. The gap 210 of fig. 5A can be eliminated, for example, by arranging the super cells such that both super cells in each row have back surface end contacts along the centerline of the module. In this case, the super cells may be arranged almost immediately next to each other with little or no additional clearance between them, since there is no need to touch the front surface of the super cells along the centerline of the module. Alternatively, two super cells 100 in a row may be arranged such that one super cell has a front surface end contact along one edge of the module and a rear surface end contact along the centerline of the module, another super cell has a front surface end contact along the centerline of the module and a rear surface end contact along the opposite edge of the module, and the adjacent ends of the two super cells overlap. The flexible interconnect can be sandwiched between overlapping ends of the super cells so that it does not obscure any portion of the front surface of the solar module for providing an electrical connection to the front surface end contact of one super cell and the back surface end contact of another super cell. In the case of a bank containing three or more super cells, both approaches may be used in concert.

The super cells and rows of super cells shown in fig. 5A-5B may be interconnected by any suitable combination of series electrical connection and parallel electrical connection, for example, as described further below in connection with fig. 10A-15. The interconnection between the super cells may be accomplished, for example, using a flexible interconnect similar to that described below in connection with fig. 5C-5G and subsequent figures. As demonstrated by many of the examples described in this specification, the super cells in the solar modules described herein can be interconnected by a combination of series and parallel connections, providing an output voltage to the module that is substantially equal to the output voltage of a conventional solar module. In such cases, the output current from the solar modules described herein may also be substantially equal to the output current of conventional solar modules. Alternatively, as described further below, the super cells in the solar module may be interconnected while an output voltage that is significantly increased compared to the output voltage of conventional solar modules is provided by the solar module.

Fig. 5C shows an exemplary rectangular solar module 350 comprising 6 rectangular super cells 100, wherein the length of each rectangular super cell is approximately equal to the length of the long side of the solar module. The super cells are arranged in parallel six rows with the long sides oriented parallel to the long sides of the module. Similarly constructed solar modules may also include such side lengths of super cells, but in more or less rows than shown in this example. Each of the super cells in this example (and several examples below) included 72 rectangular solar cells, each having a width approximately equal to 1/6 times the width of a 156mm by 156mm square or quasi-square wafer. Any other suitable number of rectangular solar cells having any other suitable dimensions may also be used. In this example, the front surface terminal contacts of the super cells are electrically connected to each other by means of a flexible interconnect 400, the flexible interconnect 400 being disposed adjacent to and extending parallel to an edge of one short side of the module. The rear-surface terminal contacts of the super cells are similarly electrically connected to each other by means of flexible interconnects arranged behind the solar module adjacent to and extending parallel to the edge of the other short side of the module. The back surface interconnect is not visible in fig. 5C. This arrangement electrically connects six super cells of equal length to the module in parallel. Details of the flexible interconnects and their arrangement in this and other solar module configurations are discussed in more detail below in conjunction with fig. 6-8G.

Fig. 5D shows an exemplary rectangular solar module 360 comprising 12 rectangular super cells 100, wherein each rectangular super cell has a length approximately equal to half the length of the long side of the solar module. The super cells are arranged end-to-end in pairs to form six rows of super cells, wherein both the rows and the long sides of the super cells are oriented parallel to the long sides of the solar module. In other variations, each row of super cells may include three or more super cells. Additionally, similarly configured solar modules may include more or fewer rows of super cells than shown in this example. Each of the super cells in this example (and several examples below) includes 36 rectangular solar cells, each having a width approximately equal to 1/6 times the width of a 156mm by 156mm square or quasi-square wafer. Any other suitable number of rectangular solar cells having any other suitable dimensions may also be used. The gap 410 helps to make electrical contact to the front surface termination contacts of the super cell 100 along the center line of the solar module. In this example, a flexible interconnect 400 disposed adjacent to and extending parallel to the edge of one short side of the module electrically interconnects the front surface terminal contacts of six super cells. Similarly, a flexible interconnect disposed behind the module adjacent to and extending parallel to the edge of the other short side of the module electrically connects the rear surface terminal contacts of the other six super cells. Flexible interconnects (not shown in this figure) disposed along the gaps 410 interconnect each pair of super cells in a row in series and optionally extend laterally to interconnect adjacent rows in parallel. This arrangement electrically connects six rows of super cells in parallel. Optionally, in the first group of super cells, the first super cell in each row is electrically connected in parallel with the first super cell in each other row; in the second group of super cells, the second super cell in each row is electrically connected in parallel with the second super cell in each of the other rows, and the two groups of super cells are electrically connected in series. With the latter arrangement, each of the two groups of super cells can be connected in parallel with a bypass diode, respectively.

Detail a in fig. 5D identifies the location of the cross-sectional view shown in fig. 8A where the rear surface terminal contacts of the super cell are interconnected along the edge of one short side of the module. Detail B similarly identifies the location of the cross-sectional view shown in fig. 8B where the front surface terminal contacts of the super cells are interconnected along the edge of the other short side of the module. Detail C identifies the location of the cross-sectional view shown in fig. 8C where the supercells within a row are interconnected in series along the gap 410.

Fig. 5E shows an exemplary rectangular solar module 370 similar in construction to fig. 5C, however in this example all of the solar cells forming the super cell are V-shaped solar cells with chamfers corresponding to the corners of the quasi-square wafers from which the solar cells are singulated.

Fig. 5F shows another exemplary rectangular solar module 380 similar in construction to fig. 5C, however in this example the solar cells forming the super cell comprise a hybrid of V-shaped solar cells and rectangular solar cells arranged to replicate the shape of the quasi-square wafers from which they are singulated. In the example of fig. 5F, the V-shaped solar cell may be wider than the rectangular solar cell in a direction perpendicular to its long axis to compensate for the missing corners of the V-shaped cell, so that the effective areas of the V-shaped solar cell and the rectangular solar cell exposed to solar radiation during module operation are equal, thus providing the two cells with matching currents.

Fig. 5G shows another exemplary rectangular solar module similar in construction to fig. 5E (i.e., including only V-shaped solar cells), but in the solar module of fig. 5G, adjacent V-shaped solar cells in the super cell are arranged as mirror images of each other so that their overlapping edges are equal in length. This arrangement maximizes the length of each overlapping joint, thus facilitating heat flow through the super cell.

Other configurations of rectangular solar modules may include one or more rows of super cells formed from only rectangular (non-chamfered) solar cells, and one or more rows of super cells formed from only chamfered solar cells. For example, a rectangular solar module may be constructed similar to that of fig. 5C, except that the outer two rows of super cells are each replaced by a row of super cells formed from chamfered solar cells only. The chamfered solar cells in these rows may, for example, be arranged in a mirror pair, as shown in fig. 5G.

In the exemplary solar modules shown in fig. 5C-5G, the current along each row of super cells is about 1/6 for the current in a conventional solar module of equal area, since the active area of the rectangular solar cells forming the super cells is about 1/6 for the active area of a conventionally sized solar cell. However, since six rows of super cells are electrically connected in parallel in these examples, the total current generated by the exemplary solar module may be equal to the total current generated by a conventional solar module of the same area. This facilitates replacing conventional solar modules with the exemplary solar modules of fig. 5C-5G (and other examples described below).

Fig. 6 shows in more detail than fig. 5C-5G an exemplary arrangement of three rows of super cells interconnected with a flexible electrical interconnect, for connecting the super cells within each row in series with each other, and for connecting the rows in parallel with each other. These rows may be, for example, three rows in the solar module of fig. 5D. In the example of fig. 6, each super cell 100 has one flexible interconnect 400 conductively coupled to its front surface terminal contact and another flexible interconnect conductively coupled to its back surface terminal contact. The two super cells in each row are electrically connected in series by a common flexible interconnect that is conductively bonded to the front surface terminal contact of one super cell and the back surface terminal contact of the other super cell. Each flexible interconnect is disposed adjacent to and extends parallel to one end of the super cell to which it is bonded, and may extend laterally beyond the super cells of the flexible interconnect to be conductively bonded to the super cells in adjacent rows, thereby electrically connecting the adjacent rows in parallel. The dashed lines in fig. 6 depict portions of the flexible interconnect that are obscured from view by the covered portion of the super cell, or portions of the super cell that are obscured from view by the covered portion of the flexible interconnect.

The flexible interconnect 400 can be conductively bonded to the super cell by, for example, a mechanically compliant conductive bonding material used to bond overlapping solar cells as described above. Optionally, the conductive bonding material may be located only at a plurality of discrete locations along the edge of the super cell, without forming a continuous line extending substantially the length of the edge of the super cell, with the aim of reducing or accommodating stresses in a direction parallel to the edge of the super cell due to a mismatch between the coefficient of thermal expansion of the conductive bonding material or interconnect and the coefficient of thermal expansion of the super cell.

The flexible interconnect 400 may be formed from or include a thin copper sheet, for example. The flexible interconnect 400 may optionally be patterned or otherwise configured to increase its mechanical compliance (flexibility) in both directions perpendicular and parallel to the edge of the super cell, thereby reducing or accommodating stresses in the directions perpendicular and parallel to the edge of the super cell due to CTE mismatch of the interconnect and the CTE of the super cell. Such patterning may include, for example, forming slits, slots, or holes. The thickness of the conductive portion of the interconnect 400 can be, for example, less than about 100 microns, less than about 50 microns, less than about 30 microns, or less than about 25 microns to increase the flexibility of the interconnect. The mechanical compliance of the flexible interconnect and its bond to the super cell should be sufficiently large to enable the interconnected super cells to remain intact under stresses due to CTE mismatch during the lamination process (described in more detail below in connection with the method of manufacturing a clamshell solar cell module) and also under stresses due to CTE mismatch during temperature cycling tests in the range of about-40 ℃ to about 85 ℃.

Preferably, the flexible interconnect 400 exhibits a resistance to current flow in a direction parallel to the end of the super cell to which it is joined that is less than or equal to about 0.015 ohms, less than or equal to about 0.012 ohms, or less than or equal to about 0.01 ohms.

Fig. 7A illustrates several exemplary configurations that may be suitable for the flexible interconnect 400, which are identified by reference numerals 400A through 400T, respectively.

As shown, for example, in the cross-sectional views of fig. 8A-8C, the solar modules described herein generally have a laminated structure in which the super cells and one or more encapsulant materials 4101 are sandwiched between a transparent front sheet 420 and a back sheet 430. The transparent front plate may be, for example, glass. Optionally, the back plate may also be transparent, which enables operation of both sides of the solar module. The back plate may be, for example, a polymer plate. Alternatively, the solar module may be a double-sided glass module having both a glass front plate and a glass back plate.

The cross-sectional view of fig. 8A (detail a of fig. 5D) shows an example of a flexible interconnect 400, the flexible interconnect 400 conductively bonded to the back surface terminal contacts of the super cell near the edge of the solar module and extending in the down direction of the super cell and thus not visible from the front of the solar module. Additional strips of encapsulant may be disposed between the interconnects 400 and the rear surface of the super cell, as shown.

The cross-sectional view of fig. 8B (detail B of fig. 5B) shows an example of a flexible interconnect 400 conductively bonded to a front surface terminal contact of a super cell.

The cross-sectional view of fig. 8C (detail C of fig. 5B) shows an example of a shared flexible interconnect 400, the shared flexible interconnect 400 being conductively bonded to a front surface terminal contact of one super cell and a back surface terminal contact of another super cell, thereby electrically connecting the two super cells in series.

The flexible interconnects that are electrically connected to the front surface terminal contacts of the super cells can be constructed or arranged to occupy a narrow width on the front surface of the solar module only, which can be located, for example, near the edges of the solar module. The area on the front surface of the module occupied by such interconnects may be narrow in width in a direction perpendicular to the edge of the super cell, for example less than or equal to about 10mm, less than or equal to about 5mm, or less than or equal to about 3 mm. In an arrangement such as that shown in fig. 8B, the flexible interconnect 400 may be configured such that its length extending beyond the end of the super cell does not exceed such a distance. Fig. 8D-8G show additional examples of arrangements for electrically connecting the flexible interconnect to the front surface terminal contacts of the super cell, which may occupy a narrow width only on the front surface of the module. Such an arrangement facilitates efficient use of the front surface area of the module to generate electricity.

Fig. 8D shows the flexible interconnect 400 conductively bonded to the front surface terminal contacts of the super cell and folded around the edge of the super cell to the rear of the super cell. An insulating film 435, which may be pre-coated on the flexible interconnect 400, may be disposed between the flexible interconnect 400 and the rear surface of the super cell.

Fig. 8E shows a flexible interconnect 400 that includes a thin narrow strip 440, where the thin narrow strip 440 is conductively bonded not only to the front surface terminal contacts of the super cell, but also to a thin wide strip 445 that extends behind the back surface of the super cell. An insulating film 435, which may be pre-coated on the thin wide band 445, may be disposed between the thin wide band 445 and the rear surface of the super cell.

Fig. 8F shows the flexible interconnect 400 bonded to the front surface terminal contacts of the super cell and rolled into a flat coil, the flexible interconnect 400 occupying a narrow width only on the front surface of the solar module.

Fig. 8G shows a flexible interconnect 400 that includes thin strip portions conductively bonded to the front surface terminal contacts of the super cell, and a thicker cross-section portion located near the super cell.

In fig. 8A-8G, the flexible interconnect 400 can extend along the entire length of the edge of the super cell (e.g., into the page of the drawing) as shown, for example, in fig. 6.

Optionally, the portions of the flexible interconnect 400 that would otherwise be visible from the front of the module may be covered by a dark film or coating, or otherwise dyed, to reduce the visual contrast between the interconnect and the super cell as perceived by a normal-color observer. For example, in fig. 8C, an optional dark film or coating 425 covers the portion of the interconnect 400 that would otherwise be visible from the front of the module. The portions of interconnect 400 shown in other figures that are otherwise visible may be similarly covered or dyed.

Conventional solar modules typically include three or more bypass diodes, where each bypass diode is connected in parallel with a group of 18 to 24 silicon solar cells connected in series. This is done to limit the amount of power that may be dissipated as heat in the reverse biased solar cell. Solar cells may become reverse biased because they have defects, become dirty on the front surface, or are unevenly illuminated, reducing their ability to pass the current generated in the string. The amount of heat generated in a reverse biased solar cell depends on the voltage across the solar cell and the current flowing through the solar cell. If the voltage across the reverse biased solar cell exceeds the breakdown voltage of the solar cell, the amount of heat dissipated in the cell will be equal to the breakdown voltage multiplied by the full current generated in the cell string. Silicon solar cells typically have a breakdown voltage of 16 to 30 volts. Since each silicon solar cell produces a voltage of about 0.64 volts when operating, a string of more than 24 solar cells can produce a voltage across the reverse biased solar cell that exceeds the breakdown voltage.

In conventional solar modules where the solar cells are separated from each other and interconnected by solder ribbons, heat is not readily transported away from the heat generating solar cells. Thus, the power dissipated by the solar cell at the breakdown voltage may create hot spots in the solar cell, resulting in significant thermal damage and perhaps a fire. In conventional solar modules, therefore, a bypass diode is required for each set of 18 to 24 series-connected solar cells to ensure that none of the solar cells in the string can be reverse biased beyond the breakdown voltage.

Applicants have discovered that heat is readily transported along the silicon super cell through the relatively thin, electrically and thermally conductive bonds between adjacent overlapping silicon solar cells. Furthermore, the current flowing through the super cells in the solar modules described herein is typically less than the current flowing through a string of conventional solar cells, since the super cells described herein are typically formed of overlapping rectangular solar cells, wherein the active area of each rectangular solar cell is less than the active area of a conventional solar cell (e.g., 1/6 for the latter). In addition, the rectangular aspect ratio of the solar cells as generally used herein provides an extended thermal contact area between adjacent solar cells. Thus, solar cells reverse biased to breakdown voltage dissipate less heat and the heat is readily spread through the super cell and solar module without creating dangerous hot spots. Applicants have thus recognized that solar modules formed from super cells as described herein can use far fewer bypass diodes than conventionally thought necessary.

For example, in some variations of the solar modules as described herein, a super cell comprising a number of solar cells N greater than 25, greater than or equal to about 30, greater than or equal to about 50, greater than or equal to about 70, or greater than or equal to about 100 may be used, wherein no single solar cell or group of solar cells having a total number of less than N are individually electrically connected in parallel with the bypass diode. Optionally, these lengths of complete super cells may be electrically connected in parallel with a single bypass diode. Optionally, super cells of these lengths may be used without bypass diodes.

Several additional and optional design features may make solar modules using supercells as described herein more resistant to heat dissipated in reverse-biased solar cells. Referring again to fig. 8A-8C, encapsulant 4101 can be or can include a thermoplastic olefin (TPO) polymer that is more stable to light and heat than standard Ethylene Vinyl Acetate (EVA) encapsulants. EVA turns brown when heated or irradiated by ultraviolet rays, causing a problem of hot spots in the current limiting battery. With TPO encapsulants, these problems are reduced or avoided altogether. Further, the solar module may have a double-sided glass structure in which the transparent front plate 420 and the rear plate 430 are both glass. This double-sided glass structure enables the solar module to operate safely at higher temperatures than conventional polymeric back sheets can withstand. Additionally, the junction box may be mounted on one or more edges of the solar module rather than behind the solar module, which would be above the module if mounted behind the solar module, adding additional insulation to the solar cells within the module.

Fig. 9A shows an exemplary rectangular solar module comprising six clamshell rectangular super cells arranged in six rows, wherein each row extends the length of the long side of the solar module. The six super cells are electrically connected in parallel with each other and with bypass diodes provided in a junction box 490 on the rear surface of the solar module. The electrical connection between the super cell and the bypass diode is made through solder ribbons 450 embedded in the module laminate structure.

Fig. 9B shows another exemplary rectangular solar module comprising six clamshell rectangular super cells arranged in six rows, wherein each row extends the length of the long side of the solar module. The super cells are electrically connected in parallel with each other. Separate positive and negative terminal junction boxes 490P, 490N are provided at opposite ends of the solar module on the rear surface of the solar module. The super cell is electrically connected in parallel with a bypass diode located in one of the junction boxes by means of an external cable 455 extending between the two junction boxes.

Fig. 9C-9D include exemplary double-sided glass rectangular solar modules comprising six clamshell rectangular super cells arranged in six rows, wherein each row extends the length of the long side of the solar module in a laminated structure comprising a glass front sheet and a glass back sheet. The super cells are electrically connected in parallel with each other. Separate positive and negative terminal junction boxes 490P, 490N are mounted on opposite edges of the solar module.

The use of overlapping super cells in the module layout provides unique opportunities for installation of module level power management devices (e.g., DC/AC micro-inverters, DC/DC module power optimizers, voltage smart switches, and related devices). A key feature of the module level power management system is that power can be optimized. A super cell as described and used herein may produce a higher voltage than a conventional panel. In addition, the super cell module layout may also partition the modules. The voltage is increased and the area is increased, which are potential benefits for optimizing power.

Fig. 9E illustrates an exemplary architecture for module level power management using a stacked super cell. In this figure, an exemplary rectangular solar module includes six clamshell rectangular super cells arranged in six rows, where each row extends the length of the long side of the solar module. Three pairs of super cells are individually connected to the power management system 460, so that the power of the module can be optimized more discretely.

Fig. 9F illustrates another exemplary architecture for module level power management using a stacked super cell. In this figure, an exemplary rectangular solar module includes six clamshell rectangular super cells arranged in six rows, where each row extends the length of the long side of the solar module. Six super cells are individually connected to power management system 460, so the power of the module can be optimized more discretely.

Fig. 9G illustrates another exemplary architecture for module level power management using a stacked super cell. In this figure, an exemplary rectangular solar module includes six or more clamshell rectangular super cells 998 arranged in six or more rows, with three or more pairs of super cells individually connected to bypass diodes or power management system 460, thus enabling more discrete optimization of the power of the module.

Fig. 9H illustrates another exemplary architecture for module level power management using a stacked super cell. In this figure, an exemplary rectangular solar module includes six or more clamshell rectangular super cells 998 arranged in six or more rows, with every two super cells connected in series and all super cell pairs connected in parallel. A bypass diode or power management system 460 is connected in parallel to all super cell pairs, allowing the power of the module to be optimized.

In some variants, due to the implementation of module level power management, it allows to omit all bypass diodes on the solar module, while also eliminating the risk of hot spots. This is achieved by integrating voltage intelligence at the module level. By monitoring the voltage output of a solar cell circuit (e.g., one or more super cells) in a solar module, a "smart switching" power management device can determine whether the circuit includes any number of reverse biased solar cells. If the presence of a reverse biased solar cell is detected, the power management device may disconnect the corresponding circuit from the electrical system using, for example, a relay switch or other component. For example, if the voltage of the monitored solar cell circuit drops to a predetermined threshold (V) _Limit ) As follows, electricityThe source management device will break the circuit (open it) while ensuring that the module or string of modules remains connected.

In some embodiments, a circuit will be shut down if its voltage drops by more than a certain percentage or magnitude (e.g., 20% or 10V) compared to other circuits in the same solar array. The electronics will detect this change as the modules communicate with each other.

Implementations of this voltage intelligence may be integrated into existing module level power management solutions (e.g., solutions proposed by phase Energy, soleede Technologies, inc., tigo Energy, inc.) or custom circuit designs.

Showing how the threshold voltage V can be calculated _Limit One example of (a) is:

CellVoc _{@Low Irr&High Temp} ×N _{number of cells in series} –Vrb _{Reverse breakdown voltage} ≤V _Limit ，

wherein:

·CellVoc _{@Low Irr&High Temp} open circuit voltage of a cell operating at low radiation and high temperature (lowest expected operating Voc);

·N _{number of cells in series} the number of batteries connected in series in each super battery being monitored;

·Vrb _{Reverse breakdown voltage} the reverse polarity voltage required to carry current through the battery.

This approach to module level power management using intelligent switches may allow, for example, over 100 silicon solar cells to be connected in series within a single module without affecting safety and module reliability. In addition, such intelligent switches may be used to limit the string voltage entering the central inverter. Longer strings of modules can be installed without having to worry about voltage related safety issues or permission limitations. If the string voltage rises to a limit, the module with the weakest current may be bypassed (turned off).

Fig. 10A, 11A, 12A, 13B, and 14B, which will be described below, provide additional exemplary electrical schematic diagrams for solar modules employing overlapping super cells. Fig. 10B-1, 10B-2, 11B-1, 11B-2, 11C-1, 11C-2, 12B-1, 12B-2, 12C-1, 12C-2, 12C-3, 13C-1, 13C-2, 14C-1, and 14C-2 provide exemplary physical layouts corresponding to these circuit schematics. In describing the physical layout, it is assumed that the front surface end contact of each super cell has a negative polarity and the back surface end contact of each super cell has a positive polarity. If, in contrast, the super cell used by the module has a front surface end contact of positive polarity and a back surface end contact of negative polarity, the following discussion of the physical layout can be modified by reversing the positive and negative and reversing the orientation of the bypass diode. Some of the various busses mentioned in the description of these figures may be formed, for example, from the interconnect 400 described above. The other buses described in these figures can be implemented, for example, with solder ribbons embedded in the laminate structure of the solar module or with external cables.

Fig. 10A shows an exemplary electrical schematic of the solar module shown in fig. 5B, wherein the solar module includes 10 rectangular super cells 100, and the length of each rectangular super cell 100 is approximately equal to the length of the short side of the solar module. The super cells are arranged in a solar module with their long sides oriented parallel to the short sides of the module. All super cells are electrically connected in parallel with bypass diode 480.

Fig. 10B-1 and 10B-2 illustrate exemplary physical layouts of the solar module of fig. 10A. Bus 485N connects the negative (front face) end contact of super cell 100 to the positive terminal of bypass diode 480 located in junction box 490 on the back face of the module. Bus 485P connects the front (back surface) end contact of the super cell 100 to the negative terminal of bypass diode 480. Bus 485P may be located entirely behind the super cell. The bus 485N and/or the interconnection of the bus 485N with the super cell occupies a portion of the front face of the module.

Fig. 11A shows an exemplary electrical schematic of the solar module shown in fig. 5A, wherein the solar module includes 20 rectangular super cells 100, each rectangular super cell 100 having a length approximately equal to one-half of the length of the short side of the solar module, and the super cells are arranged end-to-end in pairs to form ten rows of super cells. The first super cell in each bank is connected in parallel with the first super cell in the other bank and in parallel with the bypass diode 500. The second super cell in each bank is connected in parallel with the second super cell in the other bank and in parallel with bypass diode 510. Two groups of super batteries are connected in series, and two bypass diodes are also connected in series.

11B-1 and 11B-2 illustrate an exemplary physical layout of the solar module of FIG. 11A. In this arrangement, the first super cell in each row has a front surface (negative) end contact along a first side of the module and a back surface (positive) end contact along the module centerline, and the second super cell in each row has a front surface (negative) end contact along the module centerline and a back surface (positive) end contact along a second side of the module opposite the first side. Bus 515N connects the front surface (negative) end contact of the first super cell in each row to the positive terminal of bypass diode 500. The bus 515P connects the back surface (positive) end contact of the second super cell in each row to the negative terminal of the bypass diode 510. Bus 520 connects the back surface (positive) end contact of the first super cell in each row and the front surface (negative) end contact of the second super cell in each row to the negative terminal of bypass diode 500 and the positive terminal of bypass diode 510.

Bus 515P may be located entirely behind the super cell. Bus 515N and/or the interconnection of bus 515N to the super cell occupies a portion of the front face of the module. Bus 520 may occupy a portion of the front surface of the module, thus requiring gap 210 as shown in fig. 5A. Alternatively, the bus 520 may be located entirely behind the super cell and electrically connected to the super cell by means of a hidden interconnect sandwiched between overlapping ends of the super cell. In this case, only a small gap 210 is required, or no gap at all is required.

11C-1, 11C-2, and 11C-3 illustrate another exemplary physical layout of the solar module of FIG. 11A. In this arrangement, the first super cell in each row has a front surface (negative) end contact along a first side of the module and a back surface (positive) end contact along the module centerline, and the second super cell in each row has a back surface (positive) end contact along the module centerline and a positive surface (negative) end contact along a second side of the module opposite the first side. Bus 525N connects the front surface (negative) end contact of the first super cell in each row to the positive terminal of bypass diode 500. Bus 530N connects the front (negative) end contact of the second cell in each row to the negative terminal of bypass diode 500 and the positive terminal of bypass diode 510. Bus 535P connects the back surface (positive) end contact of the first cell in each row to the negative terminal of bypass diode 500 and the positive terminal of bypass diode 510. Bus 540P connects the back surface (positive) end contact of the second cell in each row to the negative terminal of bypass diode 510.

Bus 535P and bus 540P may be located entirely behind the super cell. Bus 525N and bus 530N and/or the interconnection of the two buses with the super cell occupy a portion of the front face of the module.

Fig. 12A shows another exemplary electrical schematic of the solar module shown in fig. 5A, wherein the solar module includes 20 rectangular super cells 100, each rectangular super cell 100 having a length approximately equal to one-half of the length of the short side of the solar module, and the super cells are arranged end-to-end in pairs to form ten rows of super cells. In the circuit shown in fig. 12A, the super cells are arranged in four groups: in the first group, the first super cells in the upper five rows are connected in parallel with each other and with bypass diode 545; in the second group, the second super cells in the upper five rows are connected in parallel with each other and with bypass diode 550; in the third group, the first super cells of the lower five rows are connected in parallel with each other and with the bypass diode 560; in the fourth group, the second super cells in the lower five rows are connected in parallel with each other and with bypass diode 555. The four groups of super cells are connected in series with each other. Four bypass diodes are also connected in series.

Fig. 12B-1 and 12B-2 illustrate an exemplary physical layout of the solar module of fig. 12A. In this layout, a first group of super cells has front surface (negative) end contacts along a first side of the module and back surface (positive) end contacts along the module centerline; the second group of super cells has front surface (negative) end contacts along the module centerline and back surface (positive) end contacts along a second edge of the module opposite the first edge; the third group of super cells has a back surface (positive) end contact along the first side of the module and a front surface (negative) end contact along the centerline of the module; a fourth group of super cells has a back surface (positive) end contact along the module centerline and a front surface (negative) end contact along the module second side.

Bus 565N connects the front surface (negative) end contacts of the super cells in the first group of super cells to each other and also connects these end contacts to the positive terminal of bypass diode 545. Bus 570 connects the back surface (positive) end contacts of the super cells in the first set of super cells and the front surface (negative) end contacts of the super cells in the second set of super cells to each other, and also connects these end contacts to the negative terminal of bypass diode 545 and the positive terminal of bypass diode 550. Bus 575 connects the back surface (positive) end contacts of the super cells in the second set of super cells and the front surface (negative) end contacts of the super cells in the fourth set of super cells to each other, and also connects these end contacts to the negative terminal of bypass diode 550 and the positive terminal of bypass diode 555. Bus 580 connects the back surface (positive) end contacts of the super cells in the fourth group of super cells and the front surface (negative) end contacts of the super cells in the third group of super cells to each other, and also connects these end contacts to the negative terminal of bypass diode 555 and the positive terminal of bypass diode 560. The bus 585P connects the rear surface (positive) end contacts of the super cells in the third set of super cells to each other and also connects these end contacts to the negative terminal of the bypass diode 560.

The portion of bus 575 that is connected to a super cell in the second set of super cells and bus 585P may be located entirely behind the super cells. The remainder of bus 575 and the interconnection of bus 565N and/or both with the super cell occupy a portion of the front surface of the module.

The bus 570 and bus 580 may occupy a portion of the front surface of the module and therefore require the gap 210 as shown in fig. 5A. Alternatively, the two buses may be located entirely behind the super cell back and electrically connected to the super cell by means of hidden interconnects sandwiched between the overlapping ends of the super cell. In this case, only a small gap 210 is required, or no gap at all is required.

Fig. 12C-1, 12C-2, and 12C-3 illustrate alternative physical layouts of the solar module of fig. 12A. This arrangement uses two terminal blocks 490A and 490B instead of the single terminal block 490 shown in fig. 12B-1 and 12B-2, but is otherwise identical to fig. 12B-1 and 12B-2.

Fig. 13A shows another exemplary electrical schematic of the solar module shown in fig. 5A, wherein the solar module includes 20 rectangular super cells 100, each rectangular super cell 100 having a length approximately equal to one-half of the length of the short side of the solar module, and the super cells are arranged end-to-end in pairs to form ten rows of super cells. In the circuit shown in fig. 13A, the super cells are arranged in four groups: in the first group, the first super cells of the upper five rows are connected in parallel with each other; in the second group, the second super cells of the upper five rows are connected in parallel with each other; in the third group, the first super cells of the next five rows are connected in parallel with each other; in the fourth group, the second super cells of the next five rows are connected in parallel with each other. The first and second sets are connected in series with each other and thus in parallel with bypass diode 590. The third and fourth groups are connected in series with each other and thus in parallel with another bypass diode 595. The first and second groups are connected in series with the third and fourth groups, and the two bypass diodes are also connected in series.

Fig. 13C-1 and 13C-2 illustrate an exemplary physical layout of the solar module of fig. 13A. In this layout, a first group of super cells has front surface (negative) end contacts along a first side of the module and back surface (positive) end contacts along the module centerline; the second group of super cells has front surface (negative) end contacts along the module centerline and back surface (positive) end contacts along a second edge of the module opposite the first edge; a third group of super cells has a back surface (positive) end contact along the first edge of the module and a front surface (negative) end contact along the centerline of the module; a fourth group of super cells has a back surface (positive) end contact along the module centerline and a front surface (negative) end contact along the module second edge.

Bus 600 connects the front surface (negative) end contacts of the first group of super cells to each other and also connects these end contacts to the back surface (positive) end contacts of the third group of super cells, the positive terminal of bypass diode 590 and the negative terminal of bypass diode 595. The bus 605 connects the back surface (positive) end contacts of the first group of super cells to each other and also connects these end contacts to the front surface (negative) end contacts of the second group of super cells. Bus 610P connects the back surface (positive) end contacts of the second group of super cells to each other and also connects these end contacts to the negative terminal of bypass diode 590. Bus 615N connects the front surface (negative) terminal contacts of the fourth group of super cells to each other and also connects these terminal contacts to the positive terminal of bypass diode 595. The bus 620 connects the front surface (negative) end contacts of the third group of super cells to each other and also connects these end contacts to the back surface (positive) end contacts of the fourth group of super cells.

The portion of bus 600 that is connected to the super cells in the third set of super cells and bus 610P may be located entirely behind the super cells. The remainder of bus 600 and the interconnection of bus 615N and/or both to the super cell occupy a portion of the front surface of the module.

Bus 605 and bus 620 occupy a portion of the front face of the module and therefore require a gap 210 as shown in fig. 5A. Alternatively, the two buses may be located entirely behind the super cell back and electrically connected to the super cell by means of hidden interconnects sandwiched between the overlapping ends of the super cell. In this case, only a small gap 210 is required, or no gap at all is required.

Fig. 13B shows an exemplary electrical schematic of the solar module shown in fig. 5B, wherein the solar module includes 10 rectangular super cells 100, each rectangular super cell 100 having a length approximately equal to the length of the short side of the solar module. The super cells are arranged in a solar module with their long sides oriented parallel to the short sides of the module. In the circuit shown in fig. 13B, the super cells are arranged in two groups: in the first group, the top five super cells are connected in parallel with each other and with bypass diode 590; in the second group, the next five super cells are connected in parallel with each other and with bypass diode 595. The two groups of super cells are connected in series with each other. Two bypass diodes are also connected in series.

The circuit schematic of fig. 13B differs from that of fig. 13A in that a single super cell replaces two super cells in each row of fig. 13A. Thus, the physical layout of the solar module of FIG. 13B can be as shown in FIGS. 13C-1, 13C-2, and 13C-3, but with bus 605 and bus 620 omitted.

Fig. 14A shows an exemplary rectangular solar module 700 comprising 24 rectangular super cells 100, wherein the length of each rectangular super cell is approximately equal to half the length of the short side of the solar module. The super cells are arranged in pairs end-to-end to form twelve rows of super cells, wherein both the rows and the long sides of the super cells are oriented parallel to the short sides of the solar module.

Fig. 14B shows an exemplary electrical schematic of the solar module shown in fig. 14A. In the circuit shown in fig. 14B, the super cells are arranged in three groups: in the first group, the first super cells of the top eight rows are connected in parallel with each other and with bypass diode 705; in the second group, the super cells of the lower four rows are connected in parallel with each other and with the bypass diode 710; in the third group, the second super cells of the top eight rows are connected in parallel with each other and with the bypass diode 715. These three groups of super cells are connected in series. Three bypass diodes are also connected in series.

Fig. 14C-1 and 14C-2 illustrate an exemplary physical layout of the solar module of fig. 14B. In this arrangement, the first group of super cells has front surface (negative) end contacts along the first side of the module and back surface (positive) end contacts along the centerline of the module. In the second group of super cells, the first super cell in each of the lower four rows has a back surface (positive) end contact along the first edge of the module and a front surface (negative) end contact along the module centerline, and the second super cell in each of the lower four rows has a front surface (negative) end contact along the module centerline and a back surface (positive) end contact along the second edge of the module opposite the first edge. The third group of super cells has a back surface (positive) end contact along the module centerline and a back surface (negative) end contact along the module second edge.

Bus 720N connects the front surface (negative) end contacts of the third group of super cells to each other and also connects these end contacts to the positive terminal of bypass diode 705. Bus 725 connects the back surface (positive) end contact of the first group of super cells to the front surface (negative) end contact of the second group of super cells, the negative terminal of bypass diode 705, and the positive terminal of bypass diode 710. The bus 730P connects the rear surface (positive) end contacts of the third group of super cells to each other and also connects these end contacts to the negative terminal of the bypass diode 715. The bus 735 connects the front surface (negative) end contacts of the third group of super cells to each other, and also connects these end contacts to the back surface (positive) end contacts of the second group of super cells, the negative terminal of the bypass diode 710, and the positive terminal of the bypass diode 715.

The portion of bus 725 connected to the super cells in the first group of super cells, bus 730P, and the portion of bus 735 connected to the super cells in the second group of super cells may be located entirely behind the super cells. The interconnection of the remainder of bus 725, the remainder of bus 735, and bus 720N and/or all three with the super cell occupies a portion of the front face of the module.

Some of the examples described above house the bypass diodes within one or more junction boxes on the rear surface of the solar module. But this is not essential. For example, some or all of the bypass diodes may be disposed coplanar with the super cells around the perimeter of the solar module, may be disposed within the gaps between the super cells, and may also be disposed behind the super cells. In such cases, the bypass diode may be disposed, for example, within a laminate structure in which the super cell is packaged. Thus, the position of the bypass diodes may be distributed and the bypass diodes may be removed from the junction box, which facilitates replacing the central junction box comprising both the module positive terminal and the module negative terminal with two separate single-terminal junction boxes, which may be located near the outer edge of the solar module, for example, on the rear surface of the solar module. This approach generally shortens the length of the current path in the ribbon wires within the solar modules and the current path in the wiring between solar modules, which can both reduce material costs and increase module power (due to reduced resistive power losses).

For example, referring to fig. 15, the physical layout of the various electrical interconnections for the solar module shown in fig. 5B and having the circuit schematic of fig. 10A may employ a bypass diode 480 located within the super cell laminate structure and two single terminal junction boxes 490P, 490N. FIG. 15 can be better appreciated by comparing FIG. 15 with FIGS. 10B-1 and 10B-2. The other module layouts described above may be similarly modified.

The use of the reduced current (reduced area) rectangular solar cell described above may be advantageous for the use of bypass diodes within the laminate structure as just described, since the reduced current solar cell may dissipate less power in the forward biased bypass diode than would be the case if a conventionally sized solar cell were used. Thus, the bypass diodes in the solar modules described herein may need to dissipate less heat than is conventional, and so may be removed from the junction box on the rear surface of the module and moved into the laminate structure.

A single solar module may include interconnects, other wires, and/or bypass diodes that support two or more electrical configurations, e.g., support two or more electrical configurations as described above. In such cases, the particular configuration for operating the solar module may be selected from two or more alternatives, for example using switches and/or jumpers. Different configurations may connect different numbers of super cells in series and/or parallel, with different combinations of voltage and current outputs provided by the solar module. Thus, such solar modules may be configured at the factory or installation site to be able to select from two or more different voltage-current combinations, for example, between a high voltage-low current configuration and a low voltage-high current configuration.

Fig. 16 shows an exemplary arrangement of an intelligent switch module level power management device 750 located between two solar modules as described above.

Referring now to fig. 17, an exemplary method 800 for fabricating a solar module as disclosed herein includes the following steps. In step 810, a conventionally sized solar cell (e.g., 156mm x 156mm, or 125mm x 125mm) is slit and/or diced, resulting in a narrower rectangular solar cell "strip". (see also, e.g., fig. 3A-3E, and the related description above). The resulting solar cell strips may optionally be tested and then classified according to their current-voltage performance. Batteries with matched or approximately matched current-voltage performance can advantageously be used in the same super-battery or in the same row of series-connected super-batteries. For example, it may be advantageous for cells connected in series within a super cell or within a row of super cells to produce matching or approximately matching currents under the same illumination conditions.

In step 815, the solar cell strip is assembled into a super cell using a conductive adhesive bonding material disposed between overlapping portions of adjacent solar cells in the super cell. The conductive adhesive bonding material may be applied, for example, by ink jet printing or screen printing.

In step 820, heat and pressure are applied to cure or partially cure the conductive adhesive bonding material between the solar cells in the super cell. In one variation, after each additional solar cell is added to the super cell, the conductive adhesive bonding material between the newly added solar cell and the adjacent overlapping solar cell (already part of the super cell) is cured or partially cured before the next solar cell is added to the super cell. In another variation, two or more of the solar cells or all of the solar cells in the super cell may be placed in a desired overlapping manner before the conductive adhesive bonding material is cured or partially cured. The resulting super-cell from this step may optionally be tested and then classified according to its current-voltage performance. The matched or nearly matched current-voltage performance of the super cells can be advantageously used in the same row of super cells or in the same solar module. For example, it may be advantageous for the super cells or rows of super cells electrically connected in parallel to produce matching or approximately matching voltages under the same illumination conditions.

In step 825, the cured or partially cured super cells are arranged and interconnected in a layered structure comprising the encapsulant, the transparent front (sunny side) plate and the (optionally transparent) back plate in the desired module configuration. The layered structure may include, for example, a first layer of encapsulant on a glass substrate, interconnected super cells (sun side down) disposed onto the first layer of encapsulant, a second layer of encapsulant on the layer of super cells, and a back plate on the second layer of encapsulant. Any other suitable arrangement may also be used.

In the laminating step 830, heat and pressure are applied to the layered structure to form a cured laminated structure.

In a variation of the method shown in fig. 17, conventionally sized solar cells are divided into strips of solar cells, and then a conductive adhesive bonding material is applied to each individual solar cell strip. In an alternative variation, the conductive adhesive bonding material is applied to conventionally sized solar cells prior to dividing the solar cells into solar cell strips.

In the curing step 820, the conductive adhesive bonding material may be fully cured or only partially cured. If only partially cured, the conductive adhesive bonding material may be initially partially cured (to a degree sufficient to facilitate moving and interconnecting the super cells) in step 820, and then fully cured in a subsequent lamination step 830.

In some variations, the super cell 100 assembled as an intermediate product of the method 800 includes a plurality of rectangular solar cells 10, the rectangular solar cells 10 being arranged with the long sides of adjacent solar cells overlapping and conductively bonded as described above, and interconnects bonded to terminal contacts at opposite ends of the super cell.

Fig. 30A shows an exemplary super cell with electrical interconnects coupled to its front and back surface terminal contacts. The electrical interconnects extend parallel to the terminal edges of the super cells and laterally beyond the super cells to facilitate electrical interconnection with adjacent super cells.

Fig. 30B shows two of the super cells shown in fig. 30A interconnected in parallel. The portions of the interconnects that would otherwise be visible from the front of the module can be covered or colored (e.g., darkened) to mitigate visual contrast between the interconnects and the super cells as perceived by a normal-color observer. In the example shown in fig. 30A, an interconnect 850 is conductively joined to a front terminal contact of a first polarity (e.g., + or-) at one end of the super cell (right side of the figure), and another interconnect 850 is conductively joined to a back terminal contact of the opposite polarity at the other end of the super cell (left side of the figure). The interconnect 850, like the other interconnects described above, may be conductively bonded to the super cell, for example, by the same conductive adhesive bonding material used between solar cells, but this is not required. In the illustrated example, a portion of each interconnect 850 extends beyond the edge of the super cell 100 in a direction perpendicular to the long axis of the super cell (and parallel to the long axis of the solar cell 10). This allows two or more super cells 100 to be arranged side by side with the interconnects 850 of one super cell overlapping and conductively engaging the corresponding interconnects 850 of an adjacent super cell, thereby electrically interconnecting the two super cells in parallel, as shown in fig. 30B. Interconnecting several of these just described interconnects 850 in series can form a bus for the module. For example, if the individual super cells extend the full width or length of the module (e.g., fig. 5B), such an arrangement may be well suited. Additionally, the interconnect 850 can also be used to electrically connect terminal contacts of two adjacent super cells in a row of super cells in series. Similar to the overlapping and conductively joining interconnects 850 in one row with interconnects 850 in an adjacent row as shown in fig. 30B, pairs or longer strings of such interconnected super cells in one row can be electrically connected in parallel with super cells interconnected in an adjacent row in a similar manner.

The interconnects 850 may be die cut, for example from a conductive sheet, and then optionally patterned to increase their mechanical compliance in both perpendicular and parallel directions to the edge of the super cell, thereby reducing or accommodating stresses in both perpendicular and parallel directions to the edge of the super cell due to CTE mismatch of the interconnects and the CTE of the super cell. Such patterning may include, for example, forming slits, slots, or holes (not shown). The mechanical compliance of the interconnect 850 and its bond or bonds to the super cell should be sufficiently large to enable the connection of the super cell to remain intact under stresses due to CTE mismatch during lamination (described in more detail below). The interconnect 850 can be bonded to the super cell by, for example, a mechanically compliant conductive bonding material as described above for bonding overlapping solar cells. Optionally, the conductive bonding material may be located only at a plurality of discrete locations along the edge of the super cell, without forming a continuous line extending substantially the length of the edge of the super cell, with the aim of reducing or accommodating stresses in a direction parallel to the edge of the super cell due to a mismatch between the coefficient of thermal expansion of the conductive bonding material or interconnect and the coefficient of thermal expansion of the super cell.

The interconnect 850 can be cut from a thin copper sheet, for example, and if the super cell 100 is formed from a solar cell that is smaller in area than a standard silicon solar cell and thus operates at a lower current than conventional, the interconnect 850 can be thinner than a conventional conductive interconnect. For example, the interconnects 850 may be formed from copper sheets having a thickness of about 50 microns to about 300 microns. The interconnect 850 may be thin enough and flexible enough to fold back around the edge of the super cell to which it is bonded, similar to the interconnect described above.

Fig. 19A-19D illustrate several exemplary arrangements by which the conductive adhesive bonding material between adjacent solar cells in a super cell may be cured or partially cured by applying heat and pressure during the method 800. Any other suitable arrangement may be used.

In fig. 19A, heat and localized pressure are applied to cure or partially cure the conductive adhesive bonding material 12 in one bond (overlap region) at a time. The super cell may be supported by surface 1000 and may mechanically apply pressure to the joint from above, for example, with a rod, pin, or other mechanical contact. Heat may be applied to the joint, for example, with hot air (or other hot gas), infrared lamps, or by mechanical contact where heat applies localized pressure to the joint.

In fig. 19B, the arrangement of fig. 19A is generalized to a batch process that applies heat and local pressure to multiple joints in a super cell simultaneously.

In fig. 19C, the uncured super cell is sandwiched between a release liner 1015 and a reusable thermoplastic sheet 1020 and placed on a carrier sheet 1010 supported by surface 1000. The thermoplastic material of the thermoplastic sheet 1020 is selected to be capable of melting at the temperature at which the super cell is solidified. The release liner 1015 may be formed, for example, from glass fibers and PTFE and is no longer attached to the super cell after the curing process. Preferably, the release liner 1015 is formed of a material having a coefficient of thermal expansion that matches or substantially matches the coefficient of thermal expansion of the solar cell (e.g., the CTE of silicon). This is because if the CTE of the release liner is too different from the CTE of the solar cell, the solar cell and release liner will elongate by different amounts during curing, which tends to tear the super cell in the longitudinal direction at the joint. A vacuum bladder 1005 overlies the arrangement. The uncured super cell is heated from below, for example by heating surface 1000 and carrier plate 1010, and then a vacuum is pulled between bladder 1005 and support surface 1000. Thus, the vacuum bladder 1005 applies hydrostatic pressure to the super cell through the melted thermoplastic sheet 1020.

In fig. 19D, the uncured super cell is carried by the perforated moving belt 1025 through an oven 1035, which heats the super cell. The vacuum applied through the perforations in the ribbon pulls the solar cells 10 toward the moving ribbon, applying pressure to the joints between the cells. The conductive adhesive bonding material in these bonds cures during the passage of the super cell through the oven. Preferably, the porous belt 1025 is formed of a material that has a CTE that matches or substantially matches the CTE of the solar cell (e.g., the CTE of silicon). This is because if the CTE of the porous belt 1025 differs too much from the CTE of the solar cell, the solar cell and porous belt will elongate by different amounts within the oven 1035, which tends to tear the super cell longitudinally at the joint.

The method 800 of fig. 17 includes different steps of curing the super cell and laminating the super cell, thereby creating an intermediate product of the super cell. In contrast, the method 900 shown in fig. 18 combines the steps of curing the super cell and laminating the super cell. In step 910, a conventional size solar cell (e.g., 156mm x 156mm, or 125mm x 125mm) is slit and/or diced, resulting in a narrower rectangular solar cell strip. The resulting solar cell strips may optionally be tested and then sorted.

In step 915, the solar cell strips are arranged in a layered structure comprising an encapsulant, a transparent front (sunny side) plate and a back plate in the desired module configuration. The solar cell strips are arranged into the super cells using an uncured conductive adhesive bonding material disposed between overlapping portions of adjacent solar cells in the super cells. (the conductive adhesive bonding material may be applied, for example, by ink jet printing or screen printing). The interconnects are then placed, electrically interconnecting the uncured super cells in the desired configuration. The layered structure may include, for example, a first layer of encapsulant on a glass substrate, interconnected super cells (sun side down) disposed onto the first layer of encapsulant, a second layer of encapsulant on the layer of super cells, and a back plate on the second layer of encapsulant. Any other suitable arrangement may also be used.

In the lamination step 920, heat and pressure are applied to the layered structure to cure the conductive adhesive bonding material in the super cell, thereby forming a cured laminated structure. The conductive adhesive bonding material used to bond the interconnect to the super cell may also be cured in this step.

In one variation of the method 900, conventionally sized solar cells are divided into strips of solar cells, and a conductive adhesive bonding material is then applied to each individual solar cell strip. In an alternative variation, the conductive adhesive bonding material is applied to conventionally sized solar cells prior to dividing the solar cells into solar cell strips. For example, a plurality of conventionally sized solar cells may be placed on a large template, followed by dispensing a conductive adhesive bonding material onto the solar cells while the solar cells are separated into strips of solar cells using a large fixture. The resulting solar cell strips can then be transported in groups and arranged as described above in the desired module configuration.

As described above, in some variations of methods 800 and 900, a conductive adhesive bonding material is applied to conventionally sized solar cells prior to separating the solar cells into solar cell strips. When conventionally sized solar cells are singulated to form solar cell strips, the conductive adhesive bonding material is uncured (i.e., still "wet"). In some of these variations, a conductive adhesive bonding material is applied to a conventionally sized solar cell (e.g., by ink jet printing or screen printing), followed by scribing on the solar cell using a laser, defining with the scribed lines where the solar cell will be cut to form a strip of solar cells, and then cutting the solar cell along the scribed lines. In these variations, the laser power and/or the distance between the scribe lines and the adhesive bonding material may be selected to avoid the heat generated by the laser from incidentally curing or partially curing the conductive adhesive bonding material. In other variations, a laser is used to scribe on conventionally sized solar cells, the scribe lines are used to define the locations where the solar cells will be cut to form strips of solar cells, then a conductive adhesive bonding material is applied to the solar cells (e.g., by ink jet printing or screen printing), and the solar cells are then diced along the scribe lines. In the pre-scribed variant, it may be preferable not to incidentally cut or destroy the scribed solar cell during the completion of the step of applying the conductive adhesive bonding material.

Referring again to fig. 20A-20C, fig. 20A schematically illustrates a side view of an exemplary apparatus 1050 that may be used to cut a scribed solar cell to which a conductive adhesive bonding material has been applied. (the order of the two steps of performing the scribing and applying the conductive adhesive bonding material may be different). In this apparatus, a conventional size solar cell 45 that has been applied with a conductive adhesive bonding material and scribed is transported by a porous moving belt 1060 through the curved portion of the vacuum manifold 1070. As the solar cells 45 pass over the curved portion of the vacuum manifold, the vacuum applied through the holes in the ribbon pulls the bottom surface of the solar cells 45 toward the vacuum manifold, thus bending the solar cells. The radius of curvature R of the curved portion of the vacuum manifold can be selected so that when the solar cell 45 is bent in this manner, the solar cell is cut along the scribe line. The benefit of using this method is that the solar cells 45 can be cut without having to contact the top surface of the solar cells 45 to which the conductive adhesive bonding material has been applied.

If it is preferred to start the cut at one end of the scribe line (i.e., at one edge of the solar cell 45), this can be accomplished using the apparatus 1050 of fig. 20A by, for example, arranging the scribe line at an angular orientation θ with the vacuum manifold such that for each scribe line one end reaches the curved portion of the vacuum manifold earlier than the other end. As shown in fig. 20B, for example, the solar cell can be oriented with its scribe line at an angle to the direction of travel of the porous belt, while the manifold is oriented perpendicular to the direction of travel of the porous belt. As another example, fig. 20C shows the cell oriented with its scribe line perpendicular to the direction of travel of the porous belt, while the manifold is oriented at an angle to the direction of travel of the porous belt.

Any other suitable apparatus may be used to cut the scribed solar cells with the conductive adhesive bonding material applied thereto to form a solar cell strip pre-applied with the conductive adhesive bonding material. Such an apparatus may, for example, use rollers to apply pressure to the top surface of the solar cell to which the conductive adhesive bonding material has been applied. In such cases, it is preferred that the roller only contact the top surface of the solar cell in areas where the conductive adhesive bonding material has not been applied.

In some variations, the solar module includes super cells arranged in rows on a white or reflective back sheet, so that a portion of the solar radiation that is not initially absorbed by the solar cells and then passes through the solar cells can be reflected by the back sheet back to the solar cells, thereby generating electricity. A reflective back plate may be visible through the gaps between rows of super cells, which may cause the solar module to appear as if there are multiple rows of parallel bright lines (e.g., white lines) extending across its front surface. For example, referring to fig. 5B, if the super cells 100 are arranged on a white rear panel, parallel dark lines extending between rows of super cells 100 may look like white lines. This phenomenon can be unsightly when the solar module is used in some applications, for example, on a roof.

Referring to fig. 21, to improve the aesthetics of the solar module, some variations employ a white back plate 1100 that includes dark stripes 1105 located at positions corresponding to the gaps between the rows of super cells to be arranged on the back plate. The stripe 1105 is wide enough so that the white portion on the back plate is not visible through the gaps between the rows of super cells in the assembled module. This mitigates the visual contrast between the super cell and the back plate as perceived by a normal-color observer. Therefore, although the resulting module includes a white rear plate, the appearance of the front surface thereof may be similar to that of the module shown in fig. 5A to 5B, for example. The dark stripe 1105 may be formed, for example, from multiple dark bands, or may be formed in any other suitable manner.

As previously described, shading individual cells within a solar module may generate "hot spots" where the power of the unmasked cells is dissipated in the shaded cells. This dissipated power generates local temperature peaks that may degrade the performance of the module.

To minimize the serious consequences that these hot spots may have, it is common practice to embed bypass diodes as part of the module. The maximum number of cells between the bypass diodes is set to limit the maximum temperature of the module and to prevent irreversible damage to the module. In a standard layout of silicon cells, one bypass diode can be utilized for every 20 or 24 cells, the specific number being determined by the typical breakdown voltage of the silicon cells. In certain embodiments, the breakdown voltage may be in the range of about 10V to 50V. In certain embodiments, the breakdown voltage may be about 10V, about 15V, about 20V, about 25V, about 30V, or about 35V.

According to various embodiments, the cut solar cell strips overlap with a thin thermally conductive adhesive, improving thermal contact between the solar cells. Due to the enhanced thermal contact, the degree of thermal diffusion is higher than in conventional interconnect technologies. In contrast to conventional designs, in which each bypass diode can only act on 24 or less than 24 solar cells at the most, with such a thermal diffusion design based on the overlap, each bypass diode can act on a longer string of solar cells. According to various embodiments, since the overlap promotes thermal diffusion, thereby eliminating the need for as many bypass diodes as possible, which may provide one or more benefits. For example, a modular layout with a multiplicity of solar cell string lengths can be formed, since it is no longer necessary to provide a large number of bypass diodes.

According to various embodiments, thermal diffusion is achieved by maintaining a physical and thermal bond with adjacent cells. This allows sufficient heat to be dissipated through the joint.

In certain embodiments, the thickness of such junctions is maintained at about 200 microns or less, and such junctions extend the length of the solar cell in segments. According to embodiments, the thickness of such a joint may be about 200 microns or less, about 150 microns or less, about 125 microns or less, about 100 microns or less, about 90 microns or less, about 80 microns or less, about 70 microns or less, about 50 microns or less, or about 25 microns or less.

It may be important to accurately perform the curing process on the adhesive, as this may ensure that a reliable joint is maintained while reducing its thickness, thereby promoting heat diffusion between the joined cells.

Allowing longer strings of cells (e.g., over 24 cells) to be installed, makes the design of solar cells and modules more flexible. For example, certain embodiments may utilize strings of diced solar cells assembled in an overlapping manner. Each module of such a configuration may have significantly more batteries available than conventional modules.

If the thermal diffusion property is absent, a bypass diode is required for every 24 cells. With 1/6 solar cell reduction, the number of bypass diodes in each module would be 6 times that in a conventional module (consisting of 3 uncut cells), for a total of 18 diodes. Thus, the number of bypass diodes is significantly reduced by thermal diffusion.

In addition, a bypass circuit is required for each bypass diode to complete the bypass electrical path. Each diode requires two interconnection points and wiring of wires connecting it to these interconnection points. This creates a complex circuit resulting in high cost expenses for the standard layout associated with assembling the solar module.

In contrast, with thermal diffusion technology, only one bypass diode is required per module, or even no bypass diode is required at all. This configuration simplifies the module assembly process, allowing layout fabrication steps to be performed using simple automated tools.

The battery module becomes easier to manufacture since there is no need to provide a bypass protection every 24 cells. Complicated branching (tap-out) among the modules is also avoided, and long parallel connections do not need to be formed in the bypass circuit. This heat diffusion is carried out by forming overlapping long battery strips that extend the width and/or length of the module.

The overlapping configuration according to various embodiments can reduce the intensity of the current dissipated in the solar cell, thereby improving hot spot performance, in addition to providing thermal diffusion. In particular, the amount of current dissipated in the solar cell during a hot spot condition depends on the cell area.

Since the overlapping configuration can divide the cell into smaller regions, the amount of current flowing through one cell in a hot spot state is a function of the division size. During the hot spot condition, current flows through the path of lowest resistance (typically the cell level defect interface or grain boundary). Reducing this current is beneficial in that the risk of reliability failure in hot spot conditions is minimized.

Fig. 22A shows a plan view of a conventional module 2200 using a conventional ribbon bond 2201 in a hot spot state. Here, the shielding 2202 on one cell 2204 causes heat to be locally concentrated in a single cell.

In contrast, fig. 22B shows a plan view when the module using thermal diffusion is also in a hot spot state. Here, the shield 2250 on the cell 2252 generates heat within the cell. However, this heat diffuses to other both electrically and thermally bonded cells 2254 within the module 2256.

It should be further noted that the benefits of reducing the dissipation current are multiplied for polycrystalline solar cells. It is known that such polycrystalline cells have poor performance in hot spot conditions due to the presence of high-grade defect interfaces.

As described above, particular embodiments may utilize a chamfered cut cell overlap configuration. In such cases, along the bond line between each cell and the adjacent cell, the heat spreading advantage is reflected.

This maximizes the engagement length of each overlapping engagement portion. Since the joint is the primary interface where heat diffuses from the cell to the cell, maximizing this length ensures that the best heat diffusion effect is achieved.

Fig. 23A shows one example of a super cell string layout 2300 with chamfered cells 2302. In this configuration, the chamfer cells are oriented in the same direction, so all joint conduction paths are the same (125 mm).

A shield 2306 on one cell 2304 causes the cell to reverse bias. The heat is then diffused to the adjacent cells. The unbonded end 2304a of the chamfered cell becomes hottest because its conduction path to the next cell is the longest.

Fig. 23B shows another example of a super cell string layout 2350 with chamfered cells 2352. In this configuration, the chamfered cells are oriented in different directions with some of the long edges of the chamfered cells facing each other. This results in a conductive path of the joint of two lengths: 125mm and 156 mm.

Where cell 2354 experiences shadowing 2356, the configuration of fig. 23B exhibits improved heat spreading effects along the longer bond length. Thus, fig. 23B illustrates heat diffusion in a super cell having chamfered cells facing each other.

The above discussion has focused on assembling a plurality of solar cells (which may be diced solar cells) in an overlapping fashion on a common substrate. This results in a module having a single electrical interconnect-junction box (or j-box).

However, in order to collect a sufficient amount of solar energy to be used, it is often necessary to install a plurality of such modules assembled together themselves. According to various embodiments, a plurality of solar cell modules may also be assembled in an overlapping manner, thereby increasing the area efficiency of the array.

In particular embodiments, the module may be characterized as having a top conductive solder strip in a direction facing the solar energy and a bottom conductive solder strip in a direction facing away from the solar energy.

The bottom solder strip is buried under the battery. Thus, the bottom solder strips do not block incident light and do not adversely affect the area efficiency of the module. In contrast, the top solder strip is exposed and may block incident light, thereby adversely affecting efficiency.

According to various embodiments, the modules themselves may overlap such that the top solder strips are covered by adjacent modules. Fig. 24 shows a simplified cross-sectional view of such an arrangement 2400 where the ends 2401 of adjacent modules 2402 are used to overlap the top solder strips 2404 of the current module 2406. Each module itself comprises a plurality of clamshell solar cells 2407.

The bottom solder strips 2408 of the current module 2406 are buried. The bottom solder strips 2408 are located on the elevated side of the current clamshell module to overlap the next adjacent clamshell module.

This overlapping module configuration may also provide additional area on the module for mounting other components without adversely affecting the final exposed area of the module array. Examples of modular elements that may be disposed in the overlap region may include, but are not limited to, junction boxes (j-box)2410 and/or bus solder strips.

Fig. 25 illustrates another embodiment of a stacked module configuration 2500. Here, the junction boxes 2502, 2504 corresponding to adjacent overlapping modules 2506 and 2508 present a mating structure 2510 to enable electrical connection between the two. This eliminates wiring and thus simplifies the construction of the array of overlapping modules.

In some embodiments, the junction box may be reinforced with and/or combined with additional structural standoff studs. This configuration may result in an integrated tilting module roof-mount solution, where the size of the junction box determines the tilt. Such an embodiment may be particularly useful if an array of overlapping modules is to be mounted on a roof deck.

In the case where the module includes a glass substrate and a glass cover plate (which is a double-sided glass module), by shortening the total length of the module (and thus shortening the exposed length L due to the overlap), the module can be used without an additional frame member. By shortening the overall length of the module, the modules of the slanted array can remain intact under expected physical loads (e.g., snow load limit of 5400 Pa) without breaking under strain.

It should be emphasized that using a super cell structure comprising a plurality of individual solar cells assembled in an overlapping manner, it is easy to accommodate changes to the length of the module to conform to the specific length specified by the physical load and other requirements.

Fig. 26 shows a schematic of the back (back female) surface of a solar module illustrating exemplary electrical interconnection of terminal electrical contacts on the front (male) surface of the overlapping super cells to a junction box on the back side of the module. The front surface terminal contacts of the overlapping super cells may be located near the edge of the module.

Fig. 26 illustrates the use of a flexible interconnect 400 to electrically connect the front surface end contacts of the super cell 100. In the illustrated example, the flexible interconnect 400 includes a ribbon portion 9400A and fingers 9400B, where the ribbon portion 9400A extends parallel to the end of the super cell 100 near the end and the fingers 9400B extend perpendicular to the ribbon portion to contact the front surface metallization pattern (not shown) of the terminal solar cell of the super cell to which it is conductively bonded. Ribbon wires 9410 conductively bonded to the interconnects 9400 pass behind the super cell 100 for electrically connecting the interconnects 9400 to electrical components (e.g., bypass diodes in a junction box and/or module terminals) on the rear surface of the solar module of which the super cell 100 forms a part. An insulating film 9420 may be provided between the wire 9410 and the edge and rear surface of the super cell 100 for electrically isolating the ribbon wire 9410 from the super cell 100.

The interconnect 400 can optionally be folded around the edge of the super cell such that the strap portion 9400A is located at or partially behind the super cell. In such cases, an electrically insulating layer is typically disposed between the interconnect 400 and the edge and back surface of the super cell 100.

The interconnect 400 may be die cut, for example from a conductive sheet, and then optionally patterned to increase its mechanical compliance in both directions perpendicular and parallel to the edge of the super cell, thereby reducing or accommodating stresses in the directions perpendicular and parallel to the edge of the super cell due to CTE mismatch of the interconnect and the CTE of the super cell. Such patterning may include, for example, forming slits, slots, or holes (not shown). The mechanical compliance of the interconnect 400 and its bond to the super cell should be large enough to enable the connection of the super cell to remain intact under stresses due to CTE mismatch during lamination (described in more detail below). The interconnect 400 may be bonded to the super cell by, for example, a mechanically compliant conductive bonding material as described above for bonding overlapping solar cells. Optionally, the conductive bonding material may be located only at a plurality of discrete locations along the edge of the super cell (e.g., a plurality of locations corresponding to discrete contact pads of an end solar cell) without forming a continuous line extending substantially the length of the edge of the super cell, in order to reduce or accommodate stress caused by a mismatch in the coefficient of thermal expansion of the conductive bonding material or interconnect and the coefficient of thermal expansion of the super cell in a direction parallel to the edge of the super cell.

The interconnect 400 can be cut from a thin copper sheet, for example, and if the super cell 100 is formed from a solar cell that is smaller in area than a standard silicon solar cell and thus operates at a lower current than conventional, the interconnect 400 can be thinner than a conventional conductive interconnect. For example, the interconnect 400 may be formed from a copper sheet having a thickness of about 50 microns to about 300 microns. The interconnect 400 may be thin enough, even if not patterned as described above, to accommodate stresses in directions perpendicular and parallel to the edge of the super cell due to CTE mismatch of the interconnect and the CTE of the super cell. The ribbon wire 9410 may be formed of copper, for example.

Fig. 27 shows a schematic view of the back (back-female) surface of a solar module showing an exemplary electrical interconnection of two or more overlapping super cells in parallel, with terminal electrical contacts on the front (male) surface of the super cells connected to each other and to a junction box on the back side of the module. The front surface terminal contacts of the overlapping super cells may be located near the edge of the module.

Fig. 27 shows the use of two flexible interconnects 400 just described to make electrical contact with the front surface terminal contacts of two adjacent super cells 100. Bus 9430, which extends parallel to the ends of the super cell 100 near the ends, is conductively bonded to two flexible interconnects, electrically connecting the super cells in parallel. This scheme can be generalized to interconnect additional super cells 100 in parallel, as desired. Bus 9430 may be formed, for example, from copper tape.

Similar to that described above in connection with fig. 26, the interconnect 400 and bus 9430 can optionally be folded around the edge of the super cell such that the strap portion 9400A and bus 9430 are located at or partially behind the super cell. In such cases, an electrically insulating layer is typically disposed between the interconnect 400 and the edge and back surface of the super cell 100, and between the bus 9430 and the edge and back surface of the super cell 100.

Fig. 28 shows a schematic view of the back (back, female) surface of a solar module showing another exemplary electrical interconnection of two or more overlapping super cells in parallel, where the terminal electrical contacts on the front (male) surface of the super cells are connected to each other and to a junction box on the back side of the module. The front surface terminal contacts of the overlapping super cells may be located near the edge of the module.

Fig. 28 illustrates the use of another exemplary flexible interconnect 9440 to electrically connect the front surface end contacts of the super cell 100. In this example, the flexible interconnect 9440 includes a strap portion 9440A, a finger 9440B, and a finger 9440C, where the strap portion 9440A extends parallel to the end of the super cell 100 near that end; the fingers 9440B extend perpendicular to the ribbon portion and make contact with the front surface metallization pattern (not shown) of the end solar cell of the super cell to which they are conductively bonded; the fingers 9440C extend perpendicular to the ribbon section and are located at the back of the super cell. The fingers 9440C are conductively coupled to the bus 9450. Bus 9450 extends parallel to the ends of the super cell 100 along the rear surface of the super cell 100 near the ends of the super cell 100 and may extend to overlap with adjacent super cells to which it may be similarly electrically connected, thereby connecting the super cells in parallel. Ribbon wires 9410, conductively bonded to bus 9450, electrically interconnect the super cells to electrical components on the rear surface of the solar module (e.g., bypass diodes in the junction box and/or module terminals). Electrically insulating film 9420 may be disposed between the fingers 9440C and the edges and rear surface of the super cell 100, between the bus 9450 and the rear surface of the super cell 100, and between the ribbon wire 9410 and the rear surface of the super cell 100.

The interconnects 9440 can be die cut, for example, from a conductive sheet, and then optionally patterned to increase their mechanical compliance in both the directions perpendicular and parallel to the edges of the super cells, thereby reducing or accommodating stresses in the directions perpendicular and parallel to the edges of the super cells due to CTE mismatch of the interconnects and the CTE of the super cells. Such patterning may include, for example, forming slits, slots, or holes (not shown). The mechanical compliance of the interconnect 9440 and its bond to the super cell should be large enough to enable the connection of the super cell to remain intact under stresses due to CTE mismatch during lamination (described in more detail below). The interconnects 9440 can be bonded to the super cells by, for example, a mechanically compliant conductive bonding material as described above for bonding overlapping solar cells. Optionally, the conductive bonding material may be located only at a plurality of discrete locations along the edge of the super cell (e.g., a plurality of locations corresponding to discrete contact pads of an end solar cell) without forming a continuous line extending substantially the length of the edge of the super cell, in order to reduce or accommodate stress caused by a mismatch in the coefficient of thermal expansion of the conductive bonding material or interconnect and the coefficient of thermal expansion of the super cell in a direction parallel to the edge of the super cell.

The interconnect 9440 can be cut from a thin copper sheet, for example, and if the super cell 100 is formed from a solar cell that is smaller in area than a standard silicon solar cell and thus operates at less than conventional current, the interconnect 400 can be thinner than a conventional conductive interconnect. For example, the interconnects 9440 may be formed from copper sheets having a thickness of about 50 microns to about 300 microns. The interconnects 9440 can be sufficiently thin to accommodate stresses in directions perpendicular and parallel to the edge of the super cell due to CTE mismatch of the interconnects and the CTE of the super cell, even if not patterned as described above. Bus 9450 may be formed, for example, from copper tape.

After the fingers 9440B are bonded to the front surface of the super cell 100, the fingers 9440C may be bonded to the bus 9450. In such cases, once fingers 9440C are joined to bus 9450, they may be bent away from the rear surface of super cell 100 (e.g., perpendicular to super cell 100). The fingers 9440C can then be bent to extend along the rear surface of the super cell 100, as shown in FIG. 28.

Fig. 29 illustrates a partial cross-sectional perspective view of two super cells showing the use of a flexible interconnect sandwiched between overlapping ends of adjacent super cells to electrically connect the super cells in series and provide an electrical connection to a junction box. Fig. 29A shows an enlarged view of the region of interest in fig. 29.

Fig. 29 and 29A illustrate the use of an exemplary flexible interconnect 2960 that is partially sandwiched between and electrically interconnects overlapping ends of two super cells 100 to provide an electrical connection for the front surface end contact of one super cell and the back surface end contact of another super cell, thereby interconnecting the super cells in series. In the illustrated example, the interconnects 2960 are not visible from the front of the solar module because they are hidden by the upper portions of the two overlapping solar cells. In another variation, the adjacent ends of the two super cells do not overlap so that the portion of the interconnect 2960 that is connected to the front surface end contact of one of the two super cells is visible from the front surface of the solar module. Optionally, in such variations, portions of the interconnects that would otherwise be visible from the front of the module may be covered or dyed (e.g., darkened) to mitigate visual contrast between the interconnects and the super cells as perceived by a normal-color observer. The interconnects 2960 may extend parallel to the adjacent edges of two super cells beyond the side edges of the super cells, electrically connecting pairs of super cells in parallel with pairs of super cells similarly arranged in adjacent rows.

Ribbon wires 2970 can be conductively bonded to interconnects 2960 as shown to electrically connect adjacent ends of two super cells to electrical components on the rear surface of the solar module (e.g., bypass diodes and/or module terminals in the junction box). In another variation (not shown), the ribbon wire 2970 can be electrically connected to a back surface contact on one of the overlapping super cells distal to its overlapping end without conductively engaging the interconnect 2960. This configuration may also provide a hidden tap to one or more bypass diodes or other electrical components on the back surface of the solar module.

The interconnects 2960 may optionally be die cut from a conductive sheet, for example, and then may optionally be patterned to increase their mechanical compliance in both directions perpendicular and parallel to the edge of the super cell, thereby reducing or accommodating stresses in the directions perpendicular and parallel to the edge of the super cell due to CTE mismatch of the interconnects and the CTE of the super cell. Such patterning may include, for example, forming slits, slots (as shown), or holes. The mechanical compliance of the flexible interconnect and its bond to the super cell should be large enough to enable the interconnected super cells to remain intact under stresses due to CTE mismatch during the lamination process (described in more detail below). The flexible interconnect can be bonded to the super cell by, for example, a mechanically compliant conductive bonding material as described above for bonding overlapping solar cells. Optionally, the conductive bonding material may be located only at a plurality of discrete locations along the edge of the super cell, without forming a continuous line extending substantially the length of the edge of the super cell, with the aim of reducing or accommodating stresses in a direction parallel to the edge of the super cell due to a mismatch between the coefficient of thermal expansion of the conductive bonding material or interconnect and the coefficient of thermal expansion of the super cell. The interconnects 2960 may be cut from a thin copper sheet, for example.

Embodiments may include one or more of the features described in the following U.S. patent publications: U.S. patent publication No. 2014/0124013; and U.S. patent publication No.2014/0124014, both of which are incorporated by reference herein in their entirety for all purposes.

The present specification discloses high efficiency solar modules comprising silicon solar cells arranged in a stacked manner and electrically connected in series to form super cells, wherein the super cells are arranged in physically parallel rows in the solar module. For example, the length of the super cells may span substantially the full length or width of the solar module, or two or more super cells may be arranged end-to-end in a row. This arrangement hides the electrical interconnections between solar cells and can therefore be used to form visually appealing solar modules with little or no difference between adjacent series connected solar cells.

The super cell may include any number of solar cells, in some embodiments, at least nineteen solar cells, and, for example, in certain embodiments, greater than or equal to 100 silicon solar cells. Electrical contacts at intermediate locations along the super cell may require the super cell to be electrically segmented into two or more serially connected segments while maintaining a physically continuous super cell. This specification discloses arrangements in which such electrical connections are made to the back surface contact pads of one or more silicon solar cells in a super cell, so as to provide electrical taps that are not visible from the front of the solar module, and are therefore referred to herein as "hidden taps". The hidden tap is an electrical connection between the back side of the solar cell and the conductive interconnect.

The present specification also discloses the use of flexible interconnects to electrically interconnect the front surface super cell terminal contact pads, the back surface super cell terminal contact pads, or the hidden tap contact pads to other solar cells or other electrical components in the solar module.

Further, the present specification discloses the use of a conductive adhesive to directly bond adjacent solar cells to each other in a super cell so as to provide a mechanically compliant conductive bond that accommodates thermal expansion mismatch between the super cell and a glass front plate of a solar module, in combination with the use of a conductive adhesive to bond a flexible interconnect to the super cell through a mechanically rigid bond that forces the flexible interconnect to accommodate thermal expansion mismatch between the flexible interconnect and the super cell. This avoids damage to the solar module that may occur due to thermal cycling of the solar module.

As described further below, the electrical connections to the hidden tap contact pads may be used to electrically connect a segment of a super cell in parallel with a corresponding segment of one or more super cells in an adjacent row and/or provide electrical connections to the solar module circuitry for various applications including, but not limited to, power optimization (e.g., bypass diodes, AC/DC micro-inverters, DC/DC converters) and reliability applications.

The use of hidden taps as just described may further enhance the aesthetic appearance of the solar cells by providing a substantially all black appearance to the solar module in combination with hidden inter-cell connections, and may also increase the efficiency of the solar module by allowing a greater portion of the module surface area to be filled by the active area of the solar cells.

Turning now to the drawings for a more detailed understanding of the solar modules described herein, fig. 1 shows a cross-sectional view of a string of solar cells 10 arranged in an overlapping, series-connected fashion, with the ends of adjacent solar cells overlapping and electrically connected, thereby forming a super cell 100. Each solar cell 10 includes a semiconductor diode structure and electrical contacts connected to the semiconductor diode structure through which electrical current generated in the solar cell 10 when it is irradiated with light can be supplied to an external load.

In the examples described in this specification, each solar cell 10 is a rectangular crystalline silicon solar cell having a front surface (sunny side) metallization pattern disposed on a semiconductor layer of n-type conductivity and a back surface (back-negative side) metallization pattern disposed on a semiconductor layer of p-type conductivity, the metallization patterns providing electrical contact to opposite sides of an n-p junction. However, other material systems, diode structures, physical dimensions, or electrical contact arrangements may be used, if appropriate. For example, a front (sunnyside) surface metallization pattern may be disposed on a semiconductor layer of p-type conductivity and a back (shady side) surface metallization pattern may be disposed on a semiconductor layer of n-type conductivity.

Referring again to fig. 1, in the super cell 100, adjacent solar cells 10 are conductively bonded directly to each other in the areas where they overlap by conductive bonding material that electrically connects the front surface metallization pattern of one solar cell to the back surface metallization pattern of the adjacent solar cell. Suitable conductive bonding materials may include, for example, conductive adhesives, conductive adhesive films and conductive adhesive tapes, as well as conventional solders.

The flexible interconnect is partially sandwiched between and electrically interconnects the overlapping ends of two super cells 100 to provide an electrical connection for the front surface end contact of a super cell and the back surface end contact of another super cell, thereby interconnecting the super cells in series. The interconnects are not visible from the front of the solar module, as they are hidden by the upper parts of the two overlapping solar cells. In another variant, the adjacent ends of the two super cells do not overlap, so that the portion of the interconnect that is connected to the front surface terminal contact of one of the two super cells is visible from the front surface of the solar module. Optionally, in such variations, portions of the interconnects that would otherwise be visible from the front of the module may be covered or dyed (e.g., darkened) to mitigate visual contrast between the interconnects and the super cells as perceived by a normal-color observer. The interconnect may extend parallel to the adjacent edges of two super cells beyond the side edges of the super cells, electrically connecting pairs of super cells in parallel with pairs of super cells similarly arranged in adjacent rows.

Ribbon wires can be conductively bonded to the interconnect to electrically connect adjacent ends of the two super cells to electrical components on the rear surface of the solar module (e.g., bypass diodes and/or module terminals in the junction box). In another variation, the ribbon wire can be electrically connected to a back surface contact on one of the overlapping super cells distal from its overlapping end without conductively engaging the interconnect. This configuration may also provide a hidden tap to one or more bypass diodes or other electrical components on the back surface of the solar module.

Fig. 2 shows an exemplary rectangular solar module 200 comprising six rectangular super cells 100, each having a length approximately equal to the length of a long side of the solar module. The super cells are arranged in parallel six rows with their long sides oriented parallel to the long sides of the module. Similarly constructed solar modules may also include such side lengths of super cells, but in more or less rows than shown in this example. In other variants, the individual lengths of the super cells may be approximately equal to the length of the short sides of a rectangular solar module, and the super cells are arranged in parallel rows with their long sides oriented parallel to the short sides of the module. In still other arrangements, each bank may include two or more super cells electrically interconnected in series. The modules may have short sides of a length of, for example, about 1 meter, and long sides of a length of, for example, about 1.5 to about 2.0 meters. Any other suitable shape (e.g., square) and size may also be selected for the solar module.

Each super cell in this example comprises 72 rectangular solar cells, each having a width approximately equal to 1/6 of the width of an 156mm square or quasi-square wafer. Any other suitable number of rectangular solar cells having any other suitable dimensions may also be used.

Elongated solar cells with large aspect ratios and smaller area than standard 156mm solar cells (as shown) may be advantageously used to reduce I in the solar cell modules disclosed in this specification ² R resistive power loss. In particular, since the area of the solar cell 10 is reduced compared to a standard-sized silicon solar cell, electricity generated from the solar cell is reducedThe flow is reduced, directly reducing resistive power losses in solar cells and series strings of such solar cells.

For example, hidden taps connected to the back surface of the super cell can be made using electrical interconnects conductively bonded to one or more hidden tap contact pads located only in the edge portions of the back surface metallization pattern of the solar cell. Alternatively, the hidden taps may be made using interconnects that extend along substantially the entire length of the solar cell (perpendicular to the long axis of the super cell) and are conductively bonded to a plurality of hidden tap contact pads distributed in a back surface metallization pattern along the length of the solar cell.

Fig. 31A shows an exemplary solar cell back surface metallization pattern 3300 suitable for use with edge-connected hidden taps. The metallization pattern includes continuous aluminum electrical contacts 3310, a plurality of silver contact pads 3315 arranged parallel and adjacent to the long edge of the back surface of the solar cell, and silver hidden tap contact pads 3320 each arranged parallel to the adjacent edge of one of the short sides of the back surface of the solar cell. When the solar cells are arranged in a super cell, the contact pads 3315 overlap and are directly bonded to the front surface of the adjacent rectangular solar cell. The interconnect may be conductively bonded to one or the other of the hidden tap contact pads 3320 to provide a hidden tap for the super cell. (two such interconnects may be used, if desired, to provide two hidden taps).

In the arrangement shown in fig. 31A, the current flowing to the hidden tap passes through the back surface cell metallization to the interconnect aggregation point (contact 3320) approximately parallel to the long side of the solar cell. To facilitate current flow along this path, the back surface metallization sheet resistance is preferably less than or equal to about 5 ohms per square, or less than or equal to about 2.5 ohms per square.

Fig. 31B illustrates another exemplary solar cell back surface metallization pattern 3301 suitable for use with hidden taps employing bussing interconnects along the length of the solar cell back surface. The metallization pattern includes continuous aluminum electrical contacts 3310, a plurality of silver contact pads 3315 arranged parallel to and adjacent to the long edge edges of the back surface of the solar cell, and a plurality of silver hidden tap contact pads 3325 arranged in a row parallel to the long edge of the solar cell and approximately centered on the back surface of the solar cell. An interconnect extending along substantially the entire length of the solar cell may be conductively bonded to the hidden tap contact pad 3325 to provide a hidden tap for the super cell. The current flowing to the hidden tap passes primarily through the bussing interconnect, making the conductivity of the back surface metallization pattern less important for the hidden tap.

The location and number of hidden tap contact pads to which hidden tap interconnects on the back surface of the solar cell are bonded affects the length of the current path through the back surface metallization, hidden tap contact pads, and interconnects of the solar cell. Thus, the arrangement of the hidden tap contact pads may be selected to minimize the resistance to current collection in the current path to and through the hidden tap interconnect. In addition to the configurations shown in fig. 31A-31B (and fig. 31C discussed below), suitable hidden tap contact pad arrangements may also include, for example, two-dimensional arrays and rows perpendicular to the long axis of the solar cell. In the latter case, for example, the hidden row of tap contact pads may be located adjacent to the short edge of the first solar cell.

Fig. 31C illustrates another exemplary solar cell back surface metallization pattern 3303 suitable for use with edge-connected hidden taps or hidden taps employing bussing interconnects along the length of the solar cell back surface. The metallization pattern includes continuous copper contact pads 3315 arranged parallel and adjacent to the long edge edges of the back surface of the solar cell; a plurality of copper fingers 3317 connected to and extending perpendicularly from the contact pads 3315; and a continuous copper bus hidden tap contact pad 3325 that extends parallel to the long side of the solar cell and is approximately centered on the back surface of the solar cell. Edge-connected interconnects may be bonded to the ends of the copper bus 3325 to provide a hidden tap for the super cell. (if desired, two such interconnects may be used at either end of the copper bus 3325 to provide two hidden taps). Alternatively, interconnects extending substantially along the entire length of the solar cell may be conductively bonded to the copper bus 3325 to provide a hidden tap for the super cell.

The interconnects used to form the hidden taps may be bonded to the hidden tap contact pads in the back surface metallization pattern by soldering, conductive adhesive, or in any other suitable manner. For metallization patterns employing silver pads as shown in fig. 31A-31B, the interconnects may be formed of tin-plated copper, for example. Another approach is to form the hidden tap directly to the aluminum back surface contact 3310 using an aluminum wire that forms an aluminum-to-aluminum bond, which may be formed, for example, by electrical or laser welding, soldering, or a conductive adhesive. In some embodiments, the contact may comprise tin. In the case just described, the back surface metallization of the solar cell would lack the silver contact pads 3320 (fig. 31A) or 3325 (fig. 31B), but the edge connections or bussing aluminum interconnects may be bonded to the aluminum (or tin) contacts 3310 at locations corresponding to these contact pads.

Differential thermal expansion between the hidden tap interconnect (or the interconnect in contact with the front or back surface super cell terminals) and the silicon solar cells and resulting stresses on the solar cells and interconnect can cause cracking and other failure modes, potentially reducing the performance of the solar module. Thus, there is a need to configure hidden taps and other interconnects to accommodate such differential expansion without creating significant stress. For example, the interconnect may provide stress and thermal expansion relief by being formed from a high ductility material (e.g., soft copper, extremely thin copper sheets), from a low coefficient of thermal expansion material (e.g., Kovar, Invar, or other low coefficient of thermal expansion iron nickel alloys), or from a material having a coefficient of thermal expansion that substantially matches that of silicon, incorporating in-plane geometric expansion features (such as slits, grooves, holes, or truss structures) that accommodate differential thermal expansion between the interconnect and the silicon solar cell, and/or employing out-of-plane geometric features (such as kinks, bumps, or dimples) that accommodate such differential thermal expansion. The portion of the interconnect bonded to the hidden tap contact pad (or to a super cell front surface or back surface terminal contact pad, as described below) may have a thickness of, for example, less than about 100 microns, less than about 50 microns, less than about 30 microns, or less than about 25 microns to increase the flexibility of the interconnect.

Referring again to fig. 7A, 7B-1, and 7B-2, these figures illustrate several exemplary interconnect configurations, indicated by reference numerals 400A-400U, that employ stress relief geometric features and that may be suitable for use as an interconnect for hidden taps or for electrical connection with front or rear surface super cell terminal contacts. The length of these interconnects is typically approximately equal to the length of the long side of the rectangular solar cell to which they are bonded, but they may have any other suitable length. The exemplary interconnects 400A-400T shown in fig. 7A employ various in-plane stress relief features. The exemplary interconnect 400U shown in the in-plane (x-y) view of FIG. 7B-1 and the out-of-plane (x-z) view of FIG. 7B-2 uses the bend 3705 as an out-of-plane stress relief feature in the thin metal strip. The bend 3705 reduces the nominal tensile stiffness of the metal strip. The bend allows the strap material to bend locally rather than stretch only when the strap is under tension. For thin weld beads, this may result in a significant reduction in nominal tensile stiffness, for example, by 90% or more. The exact amount of reduction in the nominal tensile stiffness depends on several factors including the number of bends, the geometry of the bends, and the thickness of the belt. The interconnects may also use a combination of in-plane and out-of-plane stress relief features.

Fig. 37A-1-38B-2, discussed further below, illustrate several exemplary interconnect configurations that employ in-plane and/or out-of-plane stress relief geometries and may be suitable as edge-connected interconnects for hidden taps.

To reduce or minimize the number of conductor distributions required to connect each hidden tap, a hidden tap interconnect bus may be utilized. This method connects hidden tap contact pads of adjacent super cells to each other by using hidden tap interconnects. (the electrical connection is typically positive to positive or negative to negative, i.e., the polarity at each end is the same).

For example, fig. 32 shows: a first hidden tap interconnect 3400 extending along substantially the entire width of the solar cell 10 in the first super cell 100 and conductively bonded to hidden tap contact pads 3325 arranged as shown in fig. 31B; and a second hidden tap interconnect 3400 extending along the entire width of a corresponding solar cell in the super cell 100 in an adjacent row and similarly conductively bonded to hidden tap contact pads 3325 arranged as shown in fig. 31B. The two interconnects 3400 are arranged in line with each other and optionally abut or overlap each other, and may be conductively bonded to or otherwise electrically connected to each other to form a bus interconnecting two adjacent super cells. This solution can be extended over other rows (e.g. all rows) of super cells to form parallel segments of solar modules comprising several adjacent super cell segments, as desired. Fig. 33 shows a perspective view of a portion of the super cell of fig. 32.

Fig. 35 shows an example of super cells in adjacent rows interconnected by short interconnects 3400 that span the gap between super cells and are conductively bonded to a hidden tap contact pad 3320 on one super cell and another hidden tap contact pad 3320 on another super cell, where the contact pads are arranged as shown in fig. 31A. Fig. 36 shows a similar arrangement, where the short interconnects span the gap between two super cells in adjacent rows and are conductively bonded to the end of the central copper bus section of the back surface metallization on one super cell and the adjacent end of the central copper bus section of the back surface metallization of the other super cell, where the copper back surface metallization is configured as shown in fig. 31C. In both examples, the interconnection scheme may extend over other rows (e.g., all rows) of super cells to form parallel segments of solar modules comprising several adjacent super cell segments, as desired.

Fig. 37A-1 to 37F-3 show in-plane (x-y) and out-of-plane (x-z) views of an exemplary short hidden tap interconnect 3400 including in-plane stress relief features 3405. (the x-y plane is the plane of the solar cell back surface metallization pattern). In the example of fig. 37A-1-37E-2, each interconnect 3400 includes protrusions 3400A and 3400B disposed on opposite sides of one or more in-plane stress relief features. Exemplary in-plane stress relief features include one, two or more hollow diamond shapes, a zig-zag arrangement, and an arrangement of one, two or more grooves.

The term "in-plane stress relief feature" as used herein may also refer to the thickness or ductility of an interconnect or a portion of an interconnect. For example, the interconnect 3400 shown in fig. 37F-1 to 37F-3 is formed from a length of flat, thin copper tape or foil having a thickness T in the x-y plane of, for example, less than or equal to about 100 microns, less than or equal to about 50 microns, less than or equal to about 30 microns, or less than or equal to about 25 microns to increase the flexibility of the interconnect. The thickness T may be, for example, about 50 microns. The length L of the interconnect may be, for example, about 8 centimeters (cm), and the width W of the interconnect may be, for example, about 0.5 cm. Fig. 37F-3 and 37F-1 show front and back surface views, respectively, of the interconnect in the x-y plane. The front surface of the interconnect faces the rear surface of the solar module. Since the interconnect can span the gap between two parallel rows of super cells in the solar module, a portion of the interconnect is visible through the gap from the front of the solar module. Optionally, this visible portion of the interconnect may be darkened, for example by coating with a black polymer layer to reduce its visibility. In the example shown, the central portion 3400C of the front surface of an interconnect having a length L2 of about 0.5cm is coated with a thin black polymer layer. Typically, L2 is greater than or equal to the width of the gap between the rows of super cells. The thickness of the black polymer layer may be, for example, about 20 microns. Such thin copper tape interconnects may also optionally use in-plane or out-of-plane stress relief features, as described above. For example, the interconnects may include stress relief plane out-bends, as described above in connection with fig. 7B-1 and 7B-2.

Fig. 38A-1-38B-2 show in-plane (x-y) and out-of-plane (x-z) views of an exemplary short hidden tap interconnect 3400 including out-of-plane stress relief features 3407. In an example, each interconnect 3400 includes protrusions 3400A and 3400B disposed on opposite sides of one or more out-of-plane stress relief features. Exemplary out-of-plane stress relief features include an arrangement of one, two or more bends, kinks, dimples, bumps, or ridges.

The type and arrangement of stress relief features shown in fig. 37A-1 through 37E-2 and 38A-1 through 38B-2, as well as the interconnect tape thickness described above in connection with fig. 37F-1 through 37F-3, can also be used in long hidden tap interconnects as described above, and if appropriate, interconnects bonded to the rear or front surface terminal contacts of a super cell. The interconnects may include a combination of in-plane and out-of-plane stress relief features. In-plane and out-of-plane stress relief features are designed to reduce or minimize the effects of tension and stress on the solar cell junctions, and thereby form highly reliable and resilient electrical connections.

Fig. 39A-1 and 39A-2 illustrate exemplary configurations for short hidden tap interconnects that include cell contact pad alignment features and super cell edge alignment features, facilitate automation and accurate placement, and ease of manufacture. Fig. 39B-1 and 39B-2 illustrate exemplary configurations for short hidden tap interconnects with asymmetric tab lengths. Such asymmetric interconnects may be used in opposite orientations to avoid wire overlap that extends parallel to the long axis of the super cell. (see discussion of FIGS. 42A-42B below).

Hidden taps as described herein may form the electrical connections required in the module layout to provide the desired module circuitry. For example, hidden tap connections may be made at intervals of 12, 24, 36 or 48 solar cells along the super cell, or at any other suitable interval. The spacing between hidden taps may be determined according to the particular application.

Each super cell typically includes a front surface terminal contact at one end of the super cell and a back surface terminal contact at the other end of the super cell. In variations where the super cell spans the length or width of the solar module, the terminal contacts are disposed adjacent opposing edges of the solar module.

The flexible interconnect can be conductively bonded to the front or back surface terminal contacts of the super cell to electrically connect the super cell to other solar cells or to other electrical components in the module. For example, fig. 34A shows a cross-sectional view of an exemplary solar module in which interconnects 3410 are conductively bonded to back surface terminal contacts at the ends of the super cells. The back surface terminal contact interconnects 3410 may be or include, for example, a thin copper strip or foil having a thickness perpendicular to the surface of the solar cell to which it is bonded that is less than or equal to about 100 microns, less than or equal to about 50 microns, less than or equal to about 30 microns, or less than or equal to about 25 microns to increase the flexibility of the interconnect. The interconnect may have a width, in a plane of the solar cell surface, in a direction perpendicular to a current flow direction through the interconnect, for example, greater than or equal to about 10mm to improve conduction. As shown, the back surface terminal contact interconnects 3410 may be located behind the solar cells where no portion of the interconnects extend outside the super cells in a direction parallel to the rows of super cells.

Similar interconnects may be used to connect to the front surface terminal contacts. Alternatively, to reduce the front surface area occupied by the front surface terminal interconnects in the solar module, the front surface interconnects may include thin flexible portions bonded directly to the super cells and thicker portions that provide higher conductivity. This arrangement reduces the interconnect width necessary to achieve the desired conductivity. For example, the thicker portion of the interconnect may be an integral portion of the interconnect or may be a separate component bonded to the thinner portion of the interconnect. For example, fig. 34B-34C each show a cross-sectional view of an exemplary interconnect 3410 conductively joined to a front surface terminal contact at an end of a super cell. In both examples, the thin flexible portion 3410A of the interconnect directly bonded to the super cell comprises a thin copper strip or foil having a thickness perpendicular to the surface of the solar cell to which it is bonded that is less than or equal to about 100 microns, less than or equal to about 50 microns, less than or equal to about 30 microns, or less than or equal to about 25 microns. Thicker copper strip portions 3410B of the interconnect are joined to the thin portions 3410A to improve the conductivity of the interconnect. In fig. 34B, conductive tape 3410C on the back surface of the thin interconnect 3410A bonds the thin interconnect to the super cell and the thick interconnect 3410B. In fig. 34C, thin interconnect 3410A is bonded to thick interconnect 3410B using conductive adhesive 3410D and to the super cell using conductive adhesive 3410E. The conductive adhesives 3410D and 3410E may be the same or different. The conductive adhesive 3410E may be, for example, solder.

The solar modules described herein can comprise a laminated structure as shown in fig. 34A, wherein a super cell and one or more encapsulant materials 3610 are sandwiched between a transparent front sheet 3620 and a back sheet 3630. The transparent front plate may be, for example, glass. The back plate may also be glass or any other suitable material. Additional package strips may be disposed between the back surface terminal interconnects 3410 and the back surface of the super cell, as shown.

As described above, the hidden tap provides an "all black" appearance of the module. Since these connections are formed using wires that are typically highly reflective, they will generally have a high contrast ratio compared to the attached solar cells. However, by forming connections on the rear surface of the solar cell, and by also routing other wires in the solar module circuit behind the solar cell, the various wires are not visible. This would allow multiple connection points (hidden taps) while still maintaining an "all black" appearance.

Hidden taps may be used to form various module layouts. In the example of fig. 40 (physical layout) and 41 (electrical schematic), the solar module includes six super cells, each extending the length of the module. The hidden tap contact pads and short interconnects 3400 divide each super cell into three sections and electrically connect adjacent super cell segments in parallel, thereby forming three sets of parallel connected super cell segments. Each set is connected in parallel with a different one of the bypass diodes 1300A-1300C incorporated (embedded) into the laminated construction of the module. The bypass diode may be located, for example, directly behind the super cells or between the super cells. For example, the bypass diodes may be disposed substantially along a solar module centerline parallel to the long sides of the solar module.

In the example of fig. 42A-42B (also corresponding to the schematic electrical diagram of fig. 41), the solar module includes six super cells, each extending the length of the module. The hidden tap contact pads and short interconnects 3400 divide each super cell into three segments and electrically connect adjacent super cell segments in parallel, forming three sets of parallel connected super cell segments. Each set is connected in parallel with a different one of the bypass diodes 1300A-1300C by a bussing connection 1500A-1500C located at the rear of the super cell and connecting hidden tap contact pads and short interconnects to the bypass diodes located at the rear of the module within the junction box.

Fig. 42B provides a detailed connection view of the short hidden tap interconnect 3400 and the conductive lines 1500B and 1500C. As shown, the wires do not overlap each other. In the example shown, this is achieved by using asymmetric interconnects 3400 arranged in a relative orientation. An alternative method to avoid wire overlap is to use a first symmetric interconnect 3400 with one length of protrusions and a second symmetric interconnect 3400 with another length of protrusions.

In the example of fig. 43 (which also corresponds to the circuit schematic of fig. 41), the solar module is configured similar to that shown in fig. 42A, except that the hidden tap interconnect 3400 forms a continuous bus that extends substantially the entire width of the solar module. Each bus can be a single long interconnect 3400 conductively bonded to the back surface metallization of each super cell. Alternatively, the bus may include a plurality of individual interconnects, each spanning a single super cell, conductively bonded to each other, or otherwise electrically interconnected, as described above in connection with fig. 41. Fig. 43 also shows: a super cell terminal interconnect 3410 forming a continuous bus along one end of the solar module to electrically connect the front surface terminal contacts of the super cell; and additional super cell terminal interconnects 3410 that form a continuous bus along opposite ends of the solar module to electrically connect the back surface terminal contacts of the super cells.

The exemplary solar module of fig. 44A-44B also corresponds to the electrical schematic of fig. 41. This example employs a short hidden tap interconnect 3400 as in fig. 42A, and an interconnect 3410 that forms a continuous bus for the front and back surface terminal contacts of the super cell, as shown in fig. 43.

In the example of fig. 47A (physical layout) and 47B (electrical schematic), the solar module includes six super cells, each extending the entire length of the solar module. The hidden tap contact pads and short interconnects 3400 segment each super cell into 2/3 length portions and 1/3 length portions. Interconnects 3410 (as shown in the figures) at the lower edge of the solar module interconnect the left three rows in parallel with each other, the right three rows in parallel with each other, and the left three rows in series with the right three rows. This arrangement forms three groups of super cell segments connected in parallel, where each super cell group is 2/3 the length of the super cell. Each set being connected in parallel with a different one of the bypass diodes 2000A-2000C. This arrangement provides about twice the voltage and about half the current of the same super cell if they are electrically connected as shown in fig. 41.

As described above in connection with fig. 34A, the interconnects that are bonded to the rear surface terminal contacts of the super cell can be located entirely behind the super cell and not visible from the front side (sun side) of the solar module. The interconnect 3410 bonded to the front surface terminal contacts of the super cell is visible in a back view of the solar module (e.g., as in fig. 43) because it extends beyond the end of the super cell (e.g., as in fig. 44A) or because it is folded around and under the end of the super cell.

The use of hidden taps helps to group the small number of solar cells per bypass diode. In the example of fig. 48A-48B (each showing a physical layout), the solar module includes six super cells, each extending the length of the module. The hidden tap contact pads and short interconnects 3400 segment each super cell into five and electrically connect adjacent super cell segments in parallel, forming five sets of parallel connected super cell segments. Each set is connected in parallel with a different one of the bypass diodes 2100A-2100E incorporated (embedded) into the laminated construction of the module. The bypass diode may be located, for example, directly behind the super cells or between the super cells. The super cell terminal interconnects 3410 form a continuous bus along one end of the solar module to electrically connect the front surface terminal contacts of the super cells; and additional super cell terminal interconnects 3410 form a continuous bus along the opposite ends of the solar module to electrically connect the back surface terminal contacts of the super cells. In the example of fig. 48A, a single junction box 2110 is electrically connected to the front-face and back-face terminal interconnect busses by wires 2115A and 2115B. However, there are no diodes in the junction box, so instead (fig. 48B), the long loop wires 2215A and 2115B may be eliminated and the single junction box 2110 replaced with two unipolar (+ or-) junction boxes 2110A-2110B located, for example, at opposite edges of the module. This eliminates resistive losses in long loop wires.

Although the examples described herein use hidden taps to electrically segment each super cell into three or five groups of solar cells, these examples are intended to be illustrative and not limiting. More generally, hidden taps may be used to electrically segment the super cell into more or fewer groups of solar cells than the number and/or into more or fewer groups of solar cells than the number.

In normal operation of the solar module described herein, little or no current passes through any hidden tap contact pads since there is no bypass diode forward bias and conduction. Instead, current flows through the length of each super cell through the cell-to-cell conductive bonds formed between adjacent overlapping solar cells. In contrast, fig. 45 shows the current when a portion of the solar module is bypassed by a forward biased bypass diode. As shown by the arrows, in this example, the current in the leftmost super cell flows along the super cell until it reaches the tapped solar cell, then flows through the back surface metallization of that solar cell, the hidden tap contact pad (not shown), the interconnect 3400 with the second solar cell in the adjacent super cell, another hidden tap contact pad (not shown) on the second solar cell to which the interconnect is bonded, flows through the back surface metallization of the second solar cell, and flows through the additional hidden tap contact pad, interconnect, and solar cell back surface metallization to reach the bus connection 1500 to the bypass diode. The current flow through the other super cells is similar. As can be seen from the figures, in this case the hidden tap contact pads may conduct current from two or more rows of super cells and thereby conduct a current that is greater than the current generated in any single solar cell in the module.

Typically, there are no bus bars, contact pads, or other light blocking elements on the front surface of the solar cell opposite the hidden tap contact pad (except for the front surface metallization fingers or overlapping portions of adjacent solar cells). Thus, if the hidden tap contact pad is formed of silver on a silicon solar cell, the photoconversion efficiency of the solar cell in the area of the hidden tap contact pad may be reduced, with the silver contact pad mitigating the effect of the back surface field preventing back surface carrier recombination. To avoid this loss of efficiency, typically most solar cells in a super cell do not include hidden tap contact pads. (e.g., in some variations, only those solar cells that require hidden tap contact pads for the bypass diode circuit will include such hidden tap contact pads). Furthermore, to match current generation in a solar cell including a hidden tap contact pad to current generation in a solar cell lacking a hidden tap contact pad, a solar cell including a hidden tap contact pad may have a larger light collection area than a solar cell lacking a hidden tap contact pad.

The rectangular dimensions of the individual hidden tap contact pads may be, for example, less than or equal to about 2mm by less than or equal to about 5 mm.

During operation and during testing, the solar modules are subjected to temperature cycling due to temperature variations in the installation environment. As shown in fig. 46A, during such temperature cycling, thermal expansion mismatches between the silicon solar cells in the super cells and other parts of the module (e.g., the glass front plate of the module) cause relative motion between the super cells and the other parts of the module along the long axis of the row of super cells. This mismatch tends to stretch or compress the super cells and may damage the solar cells or the conductive bonds between the solar cells in the super cells. Similarly, as shown in fig. 46B, during temperature cycling, thermal expansion mismatch between the interconnects bonded to the solar cells and the solar cells causes relative motion between the interconnects and the solar cells in a direction perpendicular to the rows of super cells. Such mismatch can strain and potentially damage the solar cells, interconnects, and conductive bonds therebetween. This may occur for interconnects that are bonded to hidden tap contact pads and to the front or back surface terminal contacts of the super cell.

Similarly, the cyclic mechanical loading of the solar module can create local shear forces at the inter-cell junctions within the super cell and at the junctions between the solar cells and the interconnects, for example, during shipping or depending on weather (e.g., wind and snow). These shear forces may also damage the solar module.

To prevent problems caused by relative motion between the super cells and other parts of the solar module along the long axis of the row of super cells, the conductive adhesive used to bond adjacent overlapping solar cells to each other can be selected to form a flexible conductive bond 3515 (fig. 46A) between the overlapping solar cells that provides mechanical compliance to the super cells to accommodate thermal expansion mismatch between the super cells and the glass front plate of the module in a direction parallel to the row of super cells within a temperature range of about-40 ℃ to about 100 ℃ without damaging the solar module. The conductive adhesive may be selected to form a conductive bond having a shear modulus, for example, of less than or equal to about 100 megapascals (MPa), less than or equal to about 200 megapascals, less than or equal to about 300 megapascals, less than or equal to about 400 megapascals, less than or equal to about 500 megapascals, less than or equal to about 600 megapascals, less than or equal to about 700 megapascals, less than or equal to about 800 megapascals, less than or equal to about 900 megapascals, or less than or equal to about 1000 megapascals under standard test conditions (i.e., 25 ℃). The flexible conductive bond between overlapping adjacent solar cells can accommodate differential motion of greater than or equal to about 15 microns between each cell and the glass front sheet, for example. Suitable Conductive adhesives may include, for example, ECM 1541-S3, available from Engineered Conductive Materials LLC.

To promote heat flow along the super cell, so as to reduce the risk of damage to the solar module from hot spots that may occur during operation of the solar module in the event that the solar cells in the module are reverse biased due to shading or some other reason, the conductive bond between overlapping adjacent solar cells may be formed, for example, to a thickness of less than or equal to about 50 microns in the direction perpendicular to the solar cells, and to a thermal conductivity of greater than or equal to about 1.5W/(m-K) in the direction perpendicular to the solar cells.

To prevent problems caused by relative motion between the interconnect and the solar cell to which it is bonded, the conductive adhesive used to bond the interconnect to the solar cell can be selected to form a conductive bond between the solar cell and the interconnect that is sufficiently rigid to force the interconnect to accommodate thermal expansion mismatches between the solar cell and the interconnect in a temperature range of about-40 ℃ to about 180 ℃ so that the thermal expansion mismatches do not damage the solar module. Such conductive adhesives may be selected to form a conductive bond having a shear modulus, for example, of greater than or equal to about 1800MPa, greater than or equal to about 1900MPa, greater than or equal to about 2000MPa, greater than or equal to about 2100MPa, greater than or equal to about 2200MPa, greater than or equal to about 2300MPa, greater than or equal to about 2400MPa, greater than or equal to about 2500MPa, greater than or equal to about 2600MPa, greater than or equal to about 2700MPa, greater than or equal to about 2800MPa, greater than or equal to about 2900MPa, greater than or equal to about 3000MPa, greater than or equal to about 3100MPa, greater than or equal to about 3200MPa, greater than or equal to about 3300MPa, greater than or equal to about 3400MPa, greater than or equal to about 3500MPa, greater than or equal to about 3600MPa, greater than or equal to about 3700MPa, greater than or equal to about 3800MPa, greater than or equal to about 3900MPa, or greater than or equal to about 4000 MPa. In such variations, for example, the interconnect can withstand thermal expansion or contraction of the interconnect greater than or equal to about 40 microns. Suitable conductive adhesives may include, for example, Hitachi CP-450 and solder.

Thus, conductive bonds between overlapping adjacent solar cells within a super cell and between the super cell and the flexible electrical interconnect may utilize different conductive adhesives. For example, the conductive bond between the super cell and the flexible electrical interconnect can be formed by solder, while the conductive bond between overlapping adjacent solar cells can be formed by a non-solder conductive adhesive. In some variations, both conductive adhesives may be cured by a single processing step, for example, in a processing window of about 150 ℃ to about 180 ℃.

The above discussion has focused on assembling a plurality of solar cells (which may be diced solar cells) in an overlapping fashion on a common substrate. This results in the formation of a module.

However, in order to collect a sufficient amount of solar energy to be used, it is often necessary to install a plurality of such modules assembled together themselves. According to various embodiments, a plurality of solar cell modules may also be assembled in an overlapping manner, thereby increasing the area efficiency of the array.

In particular embodiments, the module may be characterized as having a top conductive solder strip in a direction facing the solar energy and a bottom conductive solder strip in a direction facing away from the solar energy.

The bottom solder strip is buried under the battery. Thus, the bottom solder strips do not block incident light and do not adversely affect the area efficiency of the module. In contrast, the top solder strip is exposed and may block incident light, thereby adversely affecting efficiency.

According to various embodiments, the modules themselves may overlap such that the top solder strips are covered by adjacent modules. This overlapping module configuration may also provide additional area on the module for mounting other components without adversely affecting the final exposed area of the module array. Examples of modular elements that may be disposed in the overlap region may include, but are not limited to, junction boxes and/or bus solder strips.

In certain embodiments, the junction boxes of respective adjacent clamshell modules are in a mated arrangement to enable electrical connection therebetween. This eliminates wiring and thus simplifies the construction of the array of overlapping modules.

In some embodiments, the junction box may be reinforced with and/or combined with additional structural standoff studs. This configuration may result in an integrated tilting module roof-mount solution, where the size of the junction box determines the tilt. Such an embodiment may be particularly useful if an array of overlapping modules is to be mounted on a roof deck.

The use of overlapping super cells in the module layout provides unique opportunities for installation of module level power management devices (e.g., DC/AC micro-inverters, DC/DC module power optimizers, voltage smart switches, and related devices). A feature of the module level power management system is power optimization. A super cell as described and used herein may produce a higher voltage than a conventional panel. In addition, the super cell module layout may also partition the modules. The voltage is increased and the area is increased, which are potential benefits for optimizing power.

The present specification discloses high efficiency solar modules (i.e., solar panels) comprising narrow rectangular silicon solar cells arranged in a stack and electrically connected in series to form super cells, wherein the super cells are arranged in physically parallel rows in the solar module. For example, the length of the super cells may span substantially the full length or width of the solar module, or two or more super cells may be arranged end-to-end in a row. Each super cell may include any number of solar cells, including in some variations at least nineteen solar cells, and for example, in some variations, greater than or equal to 100 silicon solar cells. Each solar module may be of conventional size and shape, and also include hundreds of silicon solar cells, allowing the super cells in a single solar module to be electrically interconnected to provide Direct Current (DC) voltage, for example, of about 90 volts (V) to about 450V or more.

As described further below, this high DC voltage facilitates conversion from direct current to Alternating Current (AC) by an inverter (e.g., a micro-inverter located on a solar module) by eliminating or reducing the need for DC-DC boost (DC voltage boost) prior to conversion to AC by the inverter. As also described further below, the high DC voltage also facilitates the use of an arrangement in which DC/AC conversion is performed by a central inverter that receives high voltage DC output from two or more high voltage stacked solar cell modules electrically connected in parallel with each other.

Turning now to the drawings for a more detailed understanding of the solar modules described herein, fig. 1 shows a cross-sectional view of a string of solar cells 10 arranged in an overlapping, series-connected fashion, with the ends of adjacent solar cells overlapping and electrically connected, thereby forming a super cell 100. Each solar cell 10 includes a semiconductor diode structure and electrical contacts connected to the semiconductor diode structure through which electrical current generated in the solar cell 10 when it is irradiated with light can be supplied to an external load.

In the examples described in this specification, each solar cell 10 is a rectangular crystalline silicon solar cell having a front surface (sun-facing side) metallization pattern disposed on a semiconductor layer of n-type conductivity and a back surface (back-cathode side) metallization pattern disposed on a semiconductor layer of p-type conductivity, the metallization patterns providing electrical contact to opposite sides of an n-p junction. However, other material systems, diode structures, physical dimensions, or electrical contact arrangements may be used, if appropriate. For example, a front (sunnyside) surface metallization pattern may be disposed on a semiconductor layer of p-type conductivity and a back (shady side) surface metallization pattern may be disposed on a semiconductor layer of n-type conductivity.

Referring again to fig. 1, in the super cell 100, adjacent solar cells 10 are conductively bonded to each other in regions where they overlap by means of a conductive bonding material that electrically connects the front surface metallization pattern of one solar cell to the back surface metallization pattern of the adjacent solar cell. Suitable conductive bonding materials may include, for example, conductive adhesives, conductive adhesive films and conductive adhesive tapes, as well as conventional solders.

Fig. 2 shows an exemplary rectangular solar module 200 comprising six rectangular super cells 100, each having a length approximately equal to the length of a long side of the solar module. The super cells are arranged in parallel six rows with the long sides oriented parallel to the long sides of the module. Similarly constructed solar modules may also include such side lengths of super cells, but in more or less rows than shown in this example. In other variants, the individual lengths of the super cells may be approximately equal to the length of the short sides of a rectangular solar module, and the super cells are arranged in parallel rows with their long sides oriented parallel to the short sides of the module. In still other arrangements, each bank may include two or more super cells electrically interconnected in series. The modules may have short sides of a length of, for example, about 1 meter, and long sides of a length of, for example, about 1.5 to about 2.0 meters. Any other suitable shape (e.g., square) and size may also be selected for the solar module.

In some variations, the conductive bond between the overlapping solar cells provides mechanical compliance to the super cells, thereby accommodating a thermal expansion mismatch between the super cells and the glass front sheet of the solar module in a direction parallel to the rows of super cells in a temperature range of about-40 ℃ to about 100 ℃ without damaging the solar module.

Each super cell in the example shown comprises 72 rectangular solar cells, each rectangular solar cell having a width equal to or approximately equal to 1/6 the width of a conventionally sized 156mm square or quasi-square silicon wafer and a length equal to or approximately equal to the width of a square or quasi-square wafer. Further, in general, the rectangular silicon solar cells used in the solar modules described herein can have a length, for example, equal to or approximately equal to the width of a conventionally sized square or quasi-square silicon wafer, and a width, for example, equal to or approximately equal to 1/M of the width of a conventionally sized square or quasi-square wafer, where M is any integer ≦ 20. M may be, for example, 3, 4, 5, 6 or 12. M may also be greater than 20. The super cell may comprise any suitable number of such rectangular solar cells.

The super cells in the solar module 200 can be interconnected in series by electrical interconnects (optionally, flexible electrical interconnects) or module level power electronics as described below, to provide higher than conventional voltages through conventionally sized solar modules, because the overlap approach just described incorporates many more cells per module than is conventional. For example, a conventional size solar module comprising a super cell consisting of 1/8 cut silicon solar cells may comprise more than 600 solar cells/module. In contrast, a conventionally sized solar module comprising conventionally sized and interconnected silicon solar cells typically comprises about 60 solar cells/module. In conventional silicon solar modules, square or quasi-square solar cells are typically interconnected by braze strips and spaced apart from each other to accommodate interconnects. In this case, dicing a regular sized square or quasi-square wafer into narrow rectangles would reduce the total amount of active solar cell area in the module, thereby reducing module power because additional inter-cell interconnects are required. In contrast, in the solar modules disclosed herein, the shingled arrangement hides the electrical interconnections between cells below the active solar cell area. Thus, the solar modules described herein can provide high output voltages without reducing module output power because there is little or no tradeoff between module power and the number of solar cells (and required inter-cell interconnects) in the solar module.

When all solar cells are connected in series, for example, a stacked solar cell module as described herein can provide a DC voltage in the range of about 90 volts to about 450 volts or more. As described above, such a high DC voltage may be advantageous.

For example, micro-inverters disposed on or near solar modules may be used for module level power optimization and DC to AC conversion. Referring now to fig. 49A-49B, typically a micro-inverter 4310 receives 25V to 40V DC input from a single solar module 4300 and outputs 230V AC output to match the connected grid. Micro-inverters generally include two main components: DC/DC boost and DC/AC inversion. DC/DC boost is used to increase the DC bus voltage required for DC/AC conversion and is typically very expensive and costly (2% efficiency loss). Because the solar modules described herein provide a high voltage output, the need for DC/DC boosting can be reduced or eliminated (fig. 49B). This may reduce costs and increase the efficiency and reliability of the solar module 200.

In conventional arrangements using a central ("string") inverter rather than a micro-inverter, conventional low DC output solar modules are electrically connected in series with each other and to the string inverter. The voltage generated by the string of solar modules is equal to the sum of the individual module voltages, since the modules are connected in series. The allowable voltage range determines the maximum and minimum number of modules in the string. The maximum number of modules is determined by the module voltage and the regulatory voltage limit: e.g. N _max ×V _oc <600V (American House Standard) or N _max ×V _oc <1,000V (commercial standard). The minimum number of modules in the string is determined by the module voltage and the minimum operating voltage required by the string inverter: n is a radical of _min ×V _mp >V _Invertermin . Minimum operating voltage (V) required for string-type inverters (e.g., Fronius, Powerone, or SMA inverters) _Invertermin ) Typically between about 180V and about 250V. Typically, the optimum operating voltage of the string inverter is about 400V.

A single high DC voltage stacked solar cell module as described herein can produce a voltage greater than the minimum operating voltage required by the string inverter, and optionally at or near the optimal operating voltage of the string inverter. Thus, the high DC voltage stacked solar cell modules described herein may be electrically connected to the string inverter in parallel with each other. This avoids the string length requirement of a string of modules connected in series, which can complicate system design and installation. Furthermore, in series-connected strings of solar modules, the lowest current module dominates, and the system does not operate efficiently if different modules in the string receive different illumination, as may happen with modules on different roof slopes or due to tree shadows. The parallel high voltage module configuration described herein may also avoid these problems because the current through each solar module is independent of the current through the other solar modules. Furthermore, such an arrangement does not require module level power electronics and can therefore improve the reliability of the solar module, which is particularly important in variants where the solar module is deployed on a roof.

Referring now to fig. 50A-50B, as described above, the super cells may extend substantially the entire length or width of the solar module. To achieve electrical connection along the length of the super cell, hidden (from a front view) electrical tapping points can be integrated into the solar module construction. This can be achieved by connecting electrical leads to the back surface metallization of the solar cell at the ends or intermediate locations of the super cell. Such hidden taps allow for electrical segmentation of the super cell and enable interconnection of the super cell or segments of the super cell to bypass diodes, module level power electronics (e.g., micro-inverters, power optimizers, voltage smart switches, and related devices), or other components. The use of hidden taps is further described in U.S. provisional application No.62/081,200, U.S. provisional application No.62/133,205, and U.S. application No.14/674,983, each of which is incorporated herein by reference in its entirety.

In the example of fig. 50A (exemplary physical layout) and 50B (exemplary electrical schematic), the solar modules 200 shown each include six super cells 100 electrically connected in series to provide a high DC voltage. Each super cell is electrically segmented into groups of solar cells by hidden taps 4400, where each group of solar cells is electrically connected in parallel with a different bypass diode 4410. In these examples, the bypass diode is disposed within the solar module laminate structure, i.e., the solar cell is in the encapsulant between the front surface transparent sheet and the back sheet. Alternatively, the bypass diodes may be provided in a junction box located on the rear surface or edge of the solar module and interconnected by wire routing to the hidden taps.

In the example of fig. 51A (physical layout) and 51B (corresponding electrical schematic diagrams), the illustrated solar module 200 also includes six super cells 100 electrically connected in series to provide a high DC voltage. In this example, the solar module is electrically segmented into three pairs of series-connected super cells, with each pair of super cells being electrically connected in parallel with a different bypass diode. In this example, the bypass diode is disposed within a junction box 4500 located on the back surface of the solar module. The bypass diode may alternatively be located in the solar module laminate structure or in an edge mounted junction box.

In the example of fig. 50A-51B, in normal operation of the solar module, each solar cell is forward biased, and therefore all bypass diodes are reverse biased and do not conduct. However, if one or more solar cells in a group are reverse biased to a sufficiently high voltage, the bypass diode corresponding to that group will turn on and current through the module will bypass the reverse biased solar cell. This will prevent dangerous hot spots from forming at the shaded or malfunctioning solar cell.

Alternatively, the bypass diode function may be accomplished within module level power electronics (e.g., micro-inverters) disposed on or near the solar module. (module-level power electronics and its use may also be referred to herein as module-level power management apparatus or system and module-level power management). Such module-level power electronics, optionally integrated with solar modules, can optimize power from the super cell stack, from each super cell, or from each individual super cell segment of the electrically segmented super cells (e.g., by operating the super cell stack, super cell, or super cell segment at an optimal power point), thereby enabling discrete power optimization within the module. The module level power electronics may eliminate the need for any bypass diodes within the module, as the power electronics may determine when to bypass the entire module, a particular super cell set, one or more particular individual super cells, and/or one or more particular super cell segments.

This can be done, for example, by integrating voltage intelligence at the module level. By monitoring the voltage output of a solar cell circuit (e.g., one or more super cells or super cell segments) in a solar module, a "smart switching" power management device can determine whether the circuit includes any solar cells that are reverse biased. If the presence of a reverse biased solar cell is detected, the power management device may disconnect the corresponding circuit from the electrical system using, for example, a relay switch or other component. For example, if the voltage of the monitored solar cell circuit drops below a predetermined threshold, the power management device will shut the circuit off (open). The predetermined threshold may be, for example, a percentage or magnitude (e.g., 20% or 10V) compared to normal operation of the circuit. Such voltage intelligence may be incorporated into existing module-level power electronics products (e.g., from end Energy, solared Technologies, Tigo Energy, inc.) or implemented by custom circuit designs.

Fig. 52A (physical layout) and 52B (corresponding electrical schematic diagrams) illustrate one exemplary architecture for module-level power management of a high voltage solar module including a stacked super cell. In this example, the rectangular solar module 200 includes six rectangular overlapping super cells 100 arranged in six rows that extend the length of the long side of the solar module. Six super cells are electrically connected in series to provide a high DC voltage. The module level power electronics 4600 may perform voltage sensing, power management, and/or DC/AC conversion for the entire module.

Fig. 53A (physical layout) and 53B (corresponding electrical schematic diagrams) illustrate another exemplary architecture for module-level power management of a high voltage solar module including a stacked super cell. In this example, the rectangular solar module 200 includes six rectangular overlapping super cells 100 arranged in six rows that extend the length of the long side of the solar module. The six super cells are electrically aggregated into three pairs of series-connected super cells. Each pair of super cells is individually connected to module level power electronics 4600 so that voltage sensing and power optimization can be performed on each pair of super cells, two or more of them are connected in series to provide a high DC voltage, and/or DC/AC conversion is performed.

Fig. 54A (physical layout) and 54B (corresponding electrical schematic diagrams) illustrate another exemplary architecture for module-level power management of a high voltage solar module including a stacked super cell. In this example, the rectangular solar module 200 includes six rectangular overlapping super cells 100 arranged in six rows that extend the length of the long side of the solar module. Each super cell is individually connected to module level power electronics 4600 so that voltage sensing and power optimization can be performed on each super cell, two or more of them connected in series to provide a high DC voltage, and/or DC/AC conversion can be performed.

Fig. 55A (physical layout) and 55B (corresponding electrical schematic diagrams) illustrate another exemplary architecture for module-level power management of a high voltage solar module including a stacked super cell. In this example, the rectangular solar module 200 includes six rectangular overlapping super cells 100 arranged in six rows that extend the length of the long side of the solar module. Each super cell is electrically segmented into two or more groups of solar cells by the hidden taps 4400. Each resulting solar cell set is individually connected to module level power electronics 4600 so that voltage sensing and power optimization can be performed on each solar cell set, multiple sets connected in series to provide a high DC voltage, and/or DC/AC conversion can be performed.

In some variations, two or more high voltage DC stacked solar cell modules as described herein are electrically connected in series to provide a high voltage DC output, which is converted to AC by an inverter. For example, the inverter may be a micro-inverter integrated with one of the solar modules. In this case, the micro-inverter may optionally be a component of the module level power management electronics that also performs the additional sensing and connection functions as described above. Alternatively, the inverter may be a central "string" inverter, as discussed further below.

As shown in fig. 56, when the super cells are serially connected in a solar module, the super cells of adjacent rows may be slightly offset along their long axes in a staggered manner. This staggering allows adjacent ends of rows of super cells to be electrically connected in series by interconnects 4700 bonded to the top of one super cell and to the bottom of another super cell, while saving module area (space/length) and simplifying manufacturing. For example, adjacent rows of super cells may be offset by about 5 millimeters.

Differential thermal expansion between the electrical interconnect 4700 and the silicon solar cells and the resulting stresses on the solar cells and interconnects can cause cracking and other failure modes, potentially reducing the performance of the solar module. Accordingly, it is desirable that the interconnects be flexible and configured to accommodate such differential expansion without developing significant stress. For example, the interconnect may provide stress and thermal expansion relief by being formed from a high ductility material (e.g., soft copper, thin copper sheet), from a low coefficient of thermal expansion material (e.g., Kovar, Invar, or other low coefficient of thermal expansion iron nickel alloy), or from a material having a coefficient of thermal expansion that substantially matches that of silicon, incorporating in-plane geometric expansion features (such as slits, grooves, holes, or truss structures) that accommodate differential thermal expansion between the interconnect and the silicon solar cell, and/or employing out-of-plane geometric features (such as kinks, bumps, or dimples) that accommodate such differential thermal expansion. The conductive portion of the interconnect can have a thickness of, for example, less than about 100 microns, less than about 50 microns, less than about 30 microns, or less than about 25 microns to increase the flexibility of the interconnect. (the low currents typically present in these solar modules enable the use of thin flexible conductive solder ribbons without excessive power loss due to the resistance of the thin interconnects).

In some variations, the conductive bond between the super cell and the flexible electrical interconnect forces the flexible electrical interconnect to accommodate thermal expansion mismatches between the super cell and the flexible electrical interconnect in a temperature range of about-40 ℃ to about 180 ℃ so that the thermal expansion mismatches do not damage the solar module.

Fig. 7A (as discussed above) illustrates several exemplary interconnect configurations using in-plane stress relief geometries, indicated by reference numerals 400A-400T, and fig. 7B-1 and 7B-2 (also discussed above) illustrate exemplary interconnect configurations using out-of-plane stress relief geometries, indicated by reference numerals 400U and 3705. Any one or any combination of these interconnect configurations employing stress relief features may be suitable for electrically interconnecting the super cells in series to provide a high DC voltage, as described herein.

The discussion with respect to fig. 51A-55B focuses on module level power management, where possible DC/AC conversion of high DC module voltages is performed by module level power electronics to provide AC output from the modules. As described above, the DC/AC conversion of the high DC voltage from the stacked solar cell modules as described herein may alternatively be performed by a center string inverter. For example, fig. 57A schematically illustrates a photovoltaic system 4800 including a plurality of high DC voltage stacked solar cell modules 200 electrically connected in parallel to each other to a string inverter 4815 via a high DC voltage negative bus 4820 and a high DC voltage positive bus 4810. Typically, each solar module 200 includes a plurality of clamshell super cells electrically connected in series with electrical interconnects to provide a high DC voltage, as described above. For example, the solar module 200 may optionally include bypass diodes arranged as described above. Fig. 57B shows an exemplary deployment of photovoltaic system 4800 on a roof.

In some variations of photovoltaic system 4800, two or more short series-connected strings of high DC voltage stacked solar cell modules may be electrically connected in parallel with a string-type inverter. Referring again to fig. 57A, for example, each solar module 200 may be replaced with a series-connected string of two or more high DC voltage stacked solar cell modules 200. This may be done, for example, to maximize the voltage provided to the inverter while complying with regulatory standards.

Conventional solar modules typically produce about 8 amps Isc (short circuit current), about 50Voc (open circuit voltage), and about 35Vmp (maximum power point voltage). As discussed above, a high DC voltage stacked solar cell module as described herein comprising a conventional number of M times solar cells produces approximately M times higher voltage and 1/M of the current of a conventional solar module than a conventional solar module, wherein the area of each solar cell is about 1/M of the area of a conventional solar cell. As noted above, M can be any suitable integer, typically ≦ 20, but may be greater than 20. M may be, for example, 3, 4, 5, 6 or 12.

If M is 6, Voc for a high DC voltage stacked solar cell module may be, for example, about 300V. Connecting two such modules in series provides approximately 600V DC to the bus, thereby complying with the maximum set point of the united states residence standard. If M is 4, Voc for a high DC voltage stacked solar cell module may be, for example, about 200V. Connecting three such modules in series provides approximately 600V DC to the bus. If M is 12, Voc for a high DC voltage stacked solar cell module may be, for example, about 600V. The system may also be configured to have a bus voltage of less than 600V. In such variants, the high DC voltage stacked solar cell modules may be connected, for example, in pairs or triplets in a combiner box or in any other suitable combination, in order to provide an optimal voltage for the inverter.

The problems caused by the parallel arrangement of the above-described high DC voltage stacked solar cell modules are: if one solar module has a short circuit, the other solar modules may interrupt the power on the short circuit module (i.e., drive current through the short circuit module and dissipate the power in the short circuit module) and create a hazard. This problem may be avoided, for example, by using a current blocking diode arranged to prevent other modules from driving current through the short-circuited module, using a current limiting fuse, or using a combination of a current limiting fuse and a current blocking diode. Fig. 57B schematically illustrates the use of two current limiting fuses 4830 on the positive and negative terminals of the high DC voltage stacked solar cell module 200.

The protection arrangement of the choke diodes and/or fuses may depend on whether the inverter includes a transformer or not. Systems using inverters including transformers typically ground the negative conductor. Systems using transformerless inverters typically do not ground the negative conductor. For a transformerless inverter, it may be preferable to line a current limiting fuse with the positive terminal of the solar module and another current limiting fuse with the negative terminal.

A current blocking diode and/or a current limiting fuse may be placed, for example, with each module in the junction box or in a module laminate structure. Suitable junction boxes, choke diodes (e.g., embedded choke diodes), and fuses (e.g., embedded fuses) may include those available from Shoals Technology Group, inc.

Fig. 58A shows an exemplary high voltage DC stacked solar cell module including a junction box 4840, with a choke diode 4850 in line with the positive terminal of the solar module. The junction box does not include current limiting fuses. This configuration may preferably be used in conjunction with one or more current limiting fuses that are in line with the positive and/or negative terminals of the solar module elsewhere (e.g., in the combiner box) (e.g., see fig. 58D below). Fig. 58B shows an exemplary high voltage DC stacked solar cell module including a junction box 4840, with a current blocking diode in line with the positive terminal of the solar module and a current limiting fuse 4830 in line with the negative terminal. Fig. 58C shows an exemplary high voltage DC stacked solar cell module including a junction box 4840, with a current limiting fuse 4830 in line with the positive terminal of the solar module and another current limiting fuse 4830 in line with the negative terminal. Fig. 58D shows an exemplary high voltage DC stacked solar cell module including a junction box 4840 configured as shown in fig. 58A and fuses located outside the junction box in line with the positive and negative terminals of the solar module.

Referring now to fig. 59A-59B, instead of the above-described configuration, current blocking diodes and/or current limiting fuses for all high DC voltage stacked solar cell modules may be placed together in a combiner box 4860. In these variations, one or more individual wires extend individually from each module to the combiner box. As shown in fig. 59A, in one option, a single conductor of one polarity (e.g., negative as shown) is shared between all modules. In another option (fig. 59B), both polarities have separate wires for each module. Although fig. 59A-59B only show fuses located in the combiner box 4860, any suitable combination of fuses and/or choke diodes may be located in the combiner box. Furthermore, for example, electronics performing other functions such as monitoring, maximum power point tracking, and/or disconnection of individual modules or groups of modules may be implemented in the combiner box.

Reverse bias operation of the solar module may occur when one or more solar cells in the solar module are shaded or otherwise generate a low current, and the solar module operates at a voltage current point that drives a current through the low current solar cell that is greater than the current that the low current solar cell can handle. The reverse biased solar cells may become hot and create hazardous conditions. For example, as shown in fig. 58A, the parallel arrangement of high DC voltage stacked solar cell modules may allow the modules to be protected from reverse bias operation by setting the appropriate operating voltage for the inverter. This is illustrated, for example, by fig. 60A to 60B.

Figure 60A shows a graph 4870 of current versus voltage and a graph 4880 of power versus current for a parallel-connected string of approximately ten high DC voltage stacked solar modules. These curves are calculated for a model where none of the solar modules includes a reverse biased solar cell. Since the solar modules are electrically connected in parallel, they all have the same operating voltage and their currents add up. Typically, the inverter will vary the load on the circuit in order to explore the power-voltage curve, identify the maximum point on the curve, and then operate the module circuit at that point to maximize the output power.

In contrast, fig. 60B shows a current versus voltage graph 4890 and a power versus voltage graph 4900 for the model system of fig. 60A for the case where some of the solar modules in the circuit include one or more reverse biased solar cells. The reverse bias module emerges in an exemplary current-voltage curve by forming a knee in which a transition is made from about 10 amps operation at voltages as low as about 210 volts to about 16 amps operation at voltages below about 200 volts. At voltages below about 210 volts, the shaded module includes a reverse biased solar cell. The back bias module also shows up in the power-voltage curve by the presence of two maxima: a maximum absolute value at about 200 volts and a local maximum at about 240 volts. The inverter may be configured to identify such signatures for reverse biased solar modules and operate the solar modules at an absolute or local maximum power point voltage without module reverse bias. In the example of fig. 60B, the inverter may operate the module at a local maximum power point to ensure that there is no module back bias. Additionally or alternatively, a minimum operating voltage may be selected for the inverter below which it is unlikely that any module will reverse bias. The minimum operating voltage may be adjusted based on other parameters, such as ambient temperature, operating current, and calculated or measured solar module temperature, as well as other information received from external sources, such as irradiance.

In some embodiments, the high DC voltage solar modules themselves may overlap, with adjacent solar modules arranged in a partially overlapping manner and optionally electrically interconnected in their overlapping regions. Such a clamshell configuration may optionally be used for high voltage solar modules electrically connected in parallel providing a high DC voltage to a string inverter, or for high voltage solar modules each comprising a micro-inverter converting the high DC voltage of the solar module to an AC module output. For example, a pair of high voltage solar modules may overlap as just described and be electrically connected in series to provide the required DC voltage.

Conventional string inverters are typically required to have a fairly wide range of potential input voltages (or "dynamic range"), which isBecause 1) they must be compatible with different series-connected module string lengths, 2) some modules in the string may be completely or partially shielded, and 3) changes in ambient temperature and radiation can change module voltages. In a system employing a parallel architecture as described herein, the length of the series-connected string of solar modules does not affect the voltage. Further, for the case where some modules are partially occluded and some are not, it may be decided to operate the system at the voltage of the unoccluded modules (e.g., as described above). Thus, the input voltage range of the inverters in the parallel architecture system may only need to accommodate the "dynamic range" of the 3 rd factor (i.e., temperature and radiation variation). Since this is less, for example, the inverter requires about 30% of the conventional dynamic range, the inverter for a parallel architecture system as described herein may have a narrower MPPT (maximum power point tracking) range, for example between about 250 volts under standard conditions and about 175 volts under high temperature and low irradiance, or for example between about 450 volts under standard conditions and about 350 volts under high temperature and low irradiance (in this case, 450 volt MPPT operation may correspond to 600 volts in lowest temperature operation _OC ). Furthermore, as described above, the inverter may receive sufficient DC voltage to be directly converted to AC without a boost phase. Thus, the string inverter used in a parallel architecture system as described herein may be simpler, less costly, and operate at a higher efficiency than string inverters used in conventional systems.

For micro-inverters and string-type inverters for high voltage DC overlay solar cell modules as described herein, to eliminate the DC boost requirement of the inverter, the solar modules (or short series-connected strings of solar modules) are preferably configured to provide an operating (e.g., maximum power point Vmp) DC voltage above the peak-to-peak value of the AC. For example, for 120V AC, the peak-to-peak value is sqrt (2) × 120V ═ 170V. Thus, for example, a solar module may be configured to provide a minimum Vmp of about 175V. The Vmp under standard conditions may be about 212V (assuming a negative voltage temperature coefficient of 0.35%, the maximum operating temperature is 75 ℃) and the Vmp under the lowest temperature operating conditions (e.g., -15 ℃) will be about 242V, thus Voc is below about 300V (depending on the module fill factor). All of these numbers are doubled for split-phase 120V AC (or 240V AC), which is convenient because 600V DC is the maximum allowed in the United states for many residential applications. For commercial applications, higher voltages are required and permitted, and these numbers can be further increased.

A high voltage stacked solar cell module as described herein can be configured to be used in a photovoltaic cell>600V _OC Or>1000V _OC In this case, the module may include integrated power electronics that prevent the external voltage provided by the module from exceeding specification requirements. This arrangement may enable operation V _mp Sufficient for phase separation of 120V (240V, about 350V is required), and over 600V there is no V at low temperatures _OC To a problem of (a).

When the building is disconnected from the grid, for example by a firefighter, the solar module that provides power to the building (e.g., on the building roof) can still generate power if the sun is shining. This causes the following problems: such solar modules may "charge" the roof with a dangerous voltage after the building is disconnected from the grid. To address this issue, the high voltage dc shingled solar cell modules described herein may optionally include a break, for example, in or adjacent to the module junction box. The break may be, for example, a physical break or a solid break. The disconnect may be configured to be, for example, "normally closed" such that when certain signals (e.g., from the inverter) are lost, it will disconnect the high voltage output of the solar module from the rooftop circuit. Communication with the disconnection portion may be realized, for example, by a high voltage cable, by a separate wire, or wirelessly.

A significant advantage of the overlap for high voltage solar modules is the heat diffusion between the solar cells in the overlapped super cell. Applicants have discovered that heat can be readily transported along the silicon super cell through the relatively thin, electrically and thermally conductive bond between adjacent overlapping silicon solar cells. The thickness of the conductive bond between adjacent overlapping solar cells formed of the conductive bonding material, measured perpendicular to the front and back surfaces of the solar cells, can be, for example, less than or equal to about 200 microns, or less than or equal to about 150 microns, or less than or equal to about 125 microns, or less than or equal to about 100 microns, or less than or equal to about 90 microns, or less than or equal to about 80 microns, or less than or equal to about 70 microns, or less than or equal to about 60 microns, or less than or equal to about 50 microns, or less than or equal to about 25 microns. This thinner bond reduces resistive losses at the interconnects between the cells and also promotes heat flow along the super cell from any hot spots in the super cell that may form during operation. The thermal conductivity of the junction between the solar cells can be, for example, greater than or equal to about 1.5W/(m-K). Furthermore, the rectangular aspect ratio of the solar cells as generally used herein provides an extended area of thermal contact between adjacent solar cells.

In contrast, in conventional solar modules employing ribbon interconnects between adjacent solar cells, heat generated in one solar cell is not readily diffused through the ribbon interconnects to other solar cells in the module. This makes conventional solar modules easier to form hot spots than the solar modules described herein.

Additionally, the current through the solar cells in the solar modules described herein is typically less than the current through a string of conventional solar cells, because the super cells described herein are typically formed of overlapping rectangular solar cells, each rectangular solar cell having an active area that is less than (e.g., 1/6) the conventional solar cells.

Thus, in the solar modules disclosed herein, less heat is dissipated in the reverse biased solar cells at breakdown voltage, and the heat may readily diffuse through the super cells and solar module without creating dangerous hot spots.

Several additional and optional features may make high voltage solar modules employing super cells as described herein more resistant to the heat dissipated in reverse biased solar cells. For example, the super cell may be encapsulated in a thermoplastic olefin (TPO) polymer. TPO encapsulants are more photo-thermally stable than standard ethylene-vinyl acetate (EVA) encapsulants. EVA turns brown when heated or irradiated by ultraviolet rays, causing a problem of hot spots in the current limiting battery. Furthermore, the solar module may have a double glass structure, wherein the encapsulated super cells are sandwiched between a glass front plate and a glass back plate. Such a dual glass structure enables safe operation of the solar module at higher temperatures than the conventional polymeric back sheet can withstand. Furthermore, the junction box, if present, may be mounted on one or more edges of the solar module, rather than behind the solar module, with the junction box adding additional insulation to the solar cells in the module above.

Thus, applicants have recognized that high voltage solar modules formed from super cells as described herein can employ significantly fewer bypass diodes than conventional solar modules, as the heat flow through the super cells can allow the module to operate with reverse bias of one or more solar cells without significant risk. For example, in some variations, a high voltage solar module as described herein uses less than one bypass diode per 25 solar cells, less than one bypass diode per 30 solar cells, less than one bypass diode per 50 solar cells, less than one bypass diode per 75 solar cells, less than one bypass diode per 100 solar cells, or only a single bypass diode, or no bypass diodes.

Referring now to fig. 61A-61C, an exemplary high voltage solar module using bypass diodes is provided. When a portion of the solar module is shaded, damage to the module may be prevented or reduced by using a bypass diode. For the exemplary solar module 4700 shown in fig. 61A, 10 super cells 100 are connected in series. As shown, 10 super cells are arranged in parallel rows. Each super cell contains 40 solar cells 10 connected in series, with each of the 40 solar cells being formed from square or quasi-square 1/6, as described herein. In normal unobstructed operation, current flows from junction box 4716, through each of the super cells 100 connected in series by wires 4715, and then current flows out through junction box 4717. Optionally, a single junction box may be used, rather than separate junction boxes 4716 and 4717, to return current to one junction box. The example shown in fig. 61A shows an implementation of approximately one bypass diode per super cell. As shown, a single bypass diode is electrically connected between a pair of adjacent super cells at a point approximately along the middle of the super cell (e.g., a single bypass diode 4901A is electrically connected between the 22 th solar cell of a first super cell and an adjacent solar cell in a second super cell, a second bypass diode 4901B is electrically connected between the second super cell and a third super cell, and so on). The first string of cells and the last string of cells have only about half the number of solar cells in the super cell for each bypass diode. For the example shown in fig. 61A, each bypass diode in the first and last strings of cells corresponds to only 22 cells. The total number of bypass diodes (11) used for the variant of the high voltage solar module shown in fig. 61A is equal to the number of super cells plus 1 additional bypass diode.

For example, each bypass diode may be incorporated into a flexible circuit. Referring now to fig. 61B, an expanded view of the bypass diode connection area of two adjacent super cells is shown. The view of fig. 61B originates from the non-sunny side. As shown, two solar cells 10 on adjacent super cells are electrically connected using a flexible circuit 4718 that includes a bypass diode 4720. The flexible circuit 4718 and the bypass diode 4720 are electrically connected to the solar cell 10 using contact pads 4719 located on the rear surface of the solar cell. (see also further discussion below regarding the use of hidden contact pads to provide hidden taps to bypass diodes). Additional bypass diode electrical connection schemes may be used to reduce the number of solar cells per bypass diode. One example is shown in fig. 61C. As shown, a bypass diode is electrically connected between each pair of adjacent super cells approximately along the middle of the super cells. A bypass diode 4901A is electrically connected between adjacent solar cells on the first and second super cells, a bypass diode 4901B is electrically connected between adjacent solar cells on the second and third super cells, a bypass diode 4901C is electrically connected between adjacent solar cells on the third and fourth super cells, and so on. A second set of bypass diodes may be included to reduce the number of solar cells that will bypass in the case of partial shading. For example, bypass diode 4902A is electrically connected between the first and second super cells at a point intermediate between bypass diodes 4901A and 4901B, bypass diode 4902B is electrically connected between the second and third super cells at a point intermediate between bypass diodes 4901B and 4901C, and so on, thereby reducing the number of cells per bypass diode. Optionally, the bypass diodes of a further group may be electrically connected in order to further reduce the number of solar cells to be bypassed in case of partial shading. A bypass diode 4903A is electrically connected between the first and second super cells at a point midway between bypass diodes 4902A and 4901B, and a bypass diode 4903B is electrically connected between the second and third super cells at a point midway between bypass diodes 4902B and 4901C, thereby further reducing the number of cells per bypass diode. This configuration forms a nested configuration of bypass diodes, allowing a small number of battery packs to be bypassed during partial shading. The additional diodes may be electrically connected in this manner until the number of solar cells required for each bypass diode is reached, for example, about 8, about 6, about 4, or about 2 solar cells per bypass diode. In some modules, about 4 solar cells are required per bypass diode. If desired, one or more of the bypass diodes shown in FIG. 61C may be incorporated into a hidden flexible interconnect, as shown in FIG. 61B.

The present specification discloses a cutting tool for solar cells and a cutting method for solar cells that can be used, for example, to divide a square or quasi-square solar cell of conventional size into a plurality of narrow rectangular or substantially rectangular solar cells. These cutting tools and methods apply a vacuum between the bottom surface of the conventionally sized solar cell and the curved support surface to bend the conventionally sized solar cell against the curved support surface to cut the solar cell along the previously prepared scribe line. An advantage of these cutting tools and cutting methods is that they do not require physical contact with the upper surface of the solar cell. Thus, these cutting tools and methods may be used to cut solar cells that contain soft and/or uncured materials on their upper surface that can be damaged by physical contact. Furthermore, in some variations, these cutting tools and cutting methods may need to be in contact with only a portion of the bottom surface of the solar cell. In such variations, these cutting tools and methods may be used to cut solar cells that include soft and/or uncured materials on portions of the bottom surface that do not contact the cutting tool.

For example, one solar cell fabrication method utilizing a cutting tool and method disclosed herein comprises: scribing one or more scribe lines with a laser on each of one or more conventionally sized silicon solar cells to define a plurality of rectangular areas on the silicon solar cells; applying a conductive adhesive bonding material to portions of the top surface of the one or more silicon solar cells; and applying a vacuum between the bottom surface of the one or more silicon solar cells and the curved support surface to bend the one or more silicon solar cells against the curved support surface to cause the one or more silicon solar cells to be cut along the scribe lines, thereby resulting in a plurality of rectangular silicon solar cells, each having a portion of the conductive adhesive bonding material disposed on the front surface thereof adjacent the long side. The conductive adhesive bonding material can be applied to a conventionally sized silicon solar cell before or after laser scribing the solar cell.

The resulting plurality of rectangular silicon solar cells may be arranged in a line with the long sides of adjacent rectangular silicon solar cells overlapping in an overlapping manner with a portion of the conductive adhesive bonding material disposed therebetween. The conductive bonding material may then be cured in order to bond adjacent overlapping rectangular silicon solar cells to each other and electrically connect them in series. This process will form a clamshell "super cell" as described in the patent applications listed above in the cross-reference to related applications.

Turning now to the drawings to better understand the cutting tools and methods disclosed herein, fig. 20A schematically illustrates a side view of an exemplary apparatus 1050 that can be used to cut scribed solar cells. In this apparatus, a scribed conventional size solar cell wafer 45 is carried by a moving porous belt 1060 through a curved portion of a vacuum manifold 1070. As the solar cell wafer 45 passes the curved portion of the vacuum manifold, the vacuum applied through the holes in the porous belt pulls the bottom surface of the solar cell wafer 45 toward the vacuum manifold, thereby bending the solar cell. The radius of curvature R of the curved portion of the vacuum manifold may be selected such that bending the solar cell wafer 45 in this manner will cut the solar cells along the scribe lines to form rectangular solar cells 10. The rectangular solar cell 10 may be used, for example, in a super cell, as shown in fig. 1 and 2. The solar cell wafer 45 can be cut in this way without contacting the top surface of the solar cell wafer 45 to which the conductive adhesive bonding material has been applied.

The cutting may preferentially start at one end of the scribe line (i.e., at one edge of the solar cell 45), for example by arranging the scribe line at an angle θ to the vacuum manifold such that for each scribe line one end reaches the curved portion of the vacuum manifold before the other end. As shown in fig. 20B, for example, the solar cell may be oriented such that its scribed line is at an angle to the direction of travel of the porous belt and to the curved cut portion of the manifold, which is oriented perpendicular to the direction of travel of the porous belt. As another example, fig. 20C shows the cell oriented such that its scribe line is perpendicular to the direction of travel of the porous belt, and the curved split portion of the manifold is oriented at an angle to the direction of travel of the porous belt.

For example, the cutting tool 1050 may use a single moving porous belt 1060 having a width perpendicular to the direction of travel that is approximately equal to the width of the solar cell wafer 45. Alternatively, the tool 1050 may include two, three, four, or more moving porous belts 1060, which may be arranged side-by-side, e.g., in parallel, and optionally spaced apart from each other. The cutting tool 1050 may use a single vacuum manifold that may, for example, have a width perpendicular to the direction of travel of the solar cells that is approximately equal to the width of the solar cell wafer 45. Such a vacuum manifold may be used, for example, with a single full width moving porous belt 1060, or with two or more such porous belts arranged side-by-side in parallel and optionally spaced apart from each other, for example.

Cutting tool 1050 may include two or more curved vacuum manifolds arranged side-by-side in parallel and spaced apart from each other, where each vacuum manifold has the same curvature. Such an arrangement may be used, for example, with a single full width moving porous belt 1060, or with two or more such porous belts arranged side-by-side in parallel and optionally spaced apart from each other. For example, the tool may include a moving porous belt 1060 for each vacuum manifold. In the latter arrangement, the vacuum manifold and its corresponding moving porous belt may be arranged to contact the bottom of the solar cell wafer only along two narrow strips defined by the width of the porous belt. In this case, the solar cell may comprise a soft material in the region of the bottom surface of the solar cell wafer that does not contact the porous strip, so that there is no risk of damage to the soft material during the dicing process.

Any suitable configuration of moving porous belts and vacuum manifolds may be used in the cutting tool 1050.

In some variations, the scribed solar cell wafer 45 includes uncured conductive adhesive bonding material and/or other soft material on its top and/or bottom surface prior to dicing using the dicing tool 1050. Scribing of the solar cell wafer and application of the soft material can be done in either order.

Fig. 62A schematically illustrates a side view and fig. 62B illustrates a top view of another exemplary cutting tool 5210 similar to cutting tool 1050 described above. In use of the cutting tool 5210, a conventionally-sized scribed solar cell wafer 45 is placed on a pair of parallel spaced porous belts 5230 which are moved at a constant speed over a corresponding pair of parallel and spaced vacuum manifolds 5235. The vacuum manifolds 5235 generally have the same curvature. As the wafer travels with the porous belt over the vacuum manifold through the cutting region 5235C, the wafer is bent around a cutting radius defined by the curved support surface of the vacuum manifold by the force of the vacuum pulling on the bottom of the wafer. When the wafer is bent around the cutting radius, the scribe lines become cracks that separate the wafer into individual rectangular solar cells. As described further below, the curvature of the vacuum manifold is arranged such that adjacent diced rectangular solar cells are not coplanar, and therefore, after the dicing process occurs, the edges of adjacent diced rectangular solar cells do not contact each other. The cut rectangular solar cells may be continuously unloaded from the porous ribbon using any suitable method, several examples of which are described below. Typically, the unloading process further separates adjacent diced solar cells from each other to prevent them from contacting each other when subsequently coplanar.

Still referring to fig. 62A-62B, each vacuum manifold may include, for example: flat regions 5235F, which provide no vacuum, low vacuum, or high vacuum; an optional curved transition region 5235T which provides a low vacuum or a high vacuum, or transitions from a low vacuum to a high vacuum along its length; a cutting region 5235C providing a high vacuum; and a smaller radius post-cut region 5235PC that provides a low vacuum. The porous strip 5230 transports the wafer 45 from the planar region 5235F to and through the transition region 5235T, then into the dicing region 5235C, where the wafer is diced, and then transports the resulting diced solar cells 10 away from the dicing region 5235C and into the post-dicing region 5235 PC.

The flat regions 5235F typically operate under a low vacuum sufficient to confine the wafer 45 to the porous belt and vacuum manifold. The vacuum here may be lower (or absent) to reduce friction and thus reduce the required porous belt tension, since it is easier to restrain the wafer 45 to a flat surface than to a curved surface. The vacuum in the flat regions 5235F can be, for example, about 1 to about 6 inches of mercury.

The transition region 5235T provides a transition curvature from the flat region 5235F to the cut region 5235C. One or more of the transition regions 5235T have a radius of curvature that is greater than the radius of curvature in the cutting regions 5235C. For example, the bend in the transition region 5235T can be a portion of an ellipse, but any suitable bend can be used. Having the wafer 45 approach the cut region 5235C with a smaller change in curvature through the transition region 5235T, rather than transitioning directly from a flat orientation in the region 5235F to a cut radius in the cut region 5235C, helps ensure that the edge of the wafer 45 does not lift and break the vacuum, which can make it difficult to constrain the wafer to the cut radius in the cut region 5235C. The vacuum in the transition region 5235T can be, for example, the same as in the cutting region 5235C, intermediate the regions 5235F and 5235C, or transition between the regions 5235F and 5235C along the length of the region 5235T. The vacuum in the transition region 5235T can be, for example, about 2 to about 8 inches of mercury.

The cut regions 5235C can have a varying radius of curvature, or optionally a constant radius of curvature. Such a constant radius of curvature may be, for example, about 11.5 inches, about 12.5 inches, or between about 6 inches and about 18 inches. Any suitable range of curvature may be used and may be selected based in part on the thickness of wafer 45 and the depth and geometry of the scribe lines in wafer 45. Generally, the thinner the wafer, the shorter the radius of curvature required to bend the wafer sufficiently to break it along the scribe line. The scribe line can have a depth of, for example, about 60 microns to about 140 microns, but any other suitable shallower or deeper scribe line depth can be used. Generally, the shallower the scribe line, the shorter the radius of curvature required to bend the wafer sufficiently to break it along the scribe line. The cross-sectional shape of the scribe line will also affect the desired radius of curvature. A scribe line with a wedge or wedge-shaped bottom may concentrate stress more effectively than a scribe line with a rounded or rounded bottom. The scribe lines that concentrate stress more effectively allow the radius of curvature in the cutting region to be less than that of scribe lines that concentrate stress less effectively.

The vacuum in the dicing area 5235C for at least one of the two parallel vacuum manifolds is typically higher than in the other areas to ensure that the wafer is properly constrained to the dicing radius of curvature to maintain a constant bending stress. Optionally, and as further explained below, in this region, one manifold may provide a higher vacuum than the other manifold, in order to better control cracking along the scribed lines. The vacuum in the cutting area 5235C can be, for example, about 4 to about 15 inches of mercury, or about 4 to about 26 inches of mercury.

The post-cut region 5235PC typically has a smaller radius of curvature than the cut region 5235C. This facilitates transfer of the diced solar cells from the porous ribbon 5230 without allowing the fractured surfaces of adjacent diced solar cells to rub or contact (which could lead to solar cell failure due to cracking or other failure modes). In particular, a smaller radius of curvature provides greater spacing between the edges of adjacent cut solar cells on the porous ribbon. The vacuum in the post-dicing regions 5235PC can be lower (e.g., similar or the same as in the flat regions 5235F) because the wafer 45 has been cleaved into solar cells 10, thus eliminating the need to constrain the solar cells to the bend radius of the vacuum manifold. For example, the edges of the cut solar cells 10 may be removed from the porous strip 5230. Furthermore, it may be desirable not to over-tension the cut solar cells 10.

The flat, transition, cut and post-cut regions of the vacuum manifold may be discrete portions of different curves, and their ends mated. For example, the upper surface of each manifold may include a flat planar portion, a portion of an ellipse for the transition zone, a circular arc for the cutting zone, and another circular arc or a portion of an ellipse for the post-cutting zone. Alternatively, some or all of the curved portions of the upper surface of the manifold may comprise a continuous geometric function of gradually increasing curvature (decreasing diameter of the osculating circle). Such suitable functions may include, but are not limited to, spiral functions (e.g., clothoids) and natural log functions. Clothoid curves are curves in which the curvature increases linearly along the length of the curved path. For example, in some variations, the transition region, the cut region, and the post-cut region are all part of a single clothoid having one end matching the flat region. In some other variations, the transition region is a clothoid having one end matching the flat region and the other end matching the cutting region, the cutting region having a circular curvature. In the latter variant, the post-cutting region may have, for example, a circular curvature of smaller radius or a clothoid curvature of smaller radius.

As described above and schematically shown in fig. 62B and 63A, in some variations one manifold provides a high vacuum in the cutting area 5235C and the other manifold provides a low vacuum in the cutting area 5235C. The high vacuum manifold fully constrains the end of the wafer it supports to the curvature of the manifold, thereby providing sufficient stress at the end of the scribe line overlying the high vacuum manifold to initiate a crack along the scribe line. The rough manifold does not fully constrain the end of the wafer it supports to the curvature of the manifold, and therefore the wafer on that side has a radius of curvature that is not small enough to develop the stress required to initiate a crack in the scribe line. However, the stress is high enough to propagate a crack that starts at the other end of the scribe line that covers the high vacuum manifold. Without some vacuum on the "low vacuum" side to partially and sufficiently constrain the end of the wafer to the curvature of the manifold, there may be the following risks: cracks that initiate at the opposite "high vacuum" end of the wafer do not propagate all the way across the wafer. In a variation as just described, a manifold may optionally provide a low vacuum along its entire length, from the land area 5235F through the post-cut area 5235 PC.

As just described, the asymmetric vacuum arrangement in cutting region 5235C provides asymmetric stresses along the scribe line that control the nucleation of cracks formed along the scribe line and control the propagation of cracks along the scribe line. Referring to, for example, fig. 63B, if, instead, two vacuum manifolds provide equal (e.g., high) vacuum in the dicing area 5235C, a core of cracks can form at both ends of the wafer, which can propagate toward each other and meet somewhere in the central region of the wafer. In this case, there is the following risk: the cracks are not in line with each other and, therefore, they are potential points of mechanical failure where the cracks meet in the resulting cut cell.

Alternatively, or in addition to the asymmetric vacuum arrangement described above, the cutting may preferentially start at one end of the scribe line by arranging one end of the scribe line to reach the cutting region of the manifold before the other end. This may be accomplished, for example, by orienting the solar cell wafer at an angle to the vacuum manifold, as described above in connection with fig. 20B. Alternatively, the vacuum manifolds may be arranged such that the cut region of one of the two manifolds extends further along the porous belt path than the cut region of the other vacuum manifold. For example, two vacuum manifolds having the same curvature may be slightly offset in the direction of travel of the moving porous belt so that the solar cell wafer reaches the cutting region of one manifold before reaching the cutting region of the other vacuum manifold.

Referring now to fig. 64, in the example shown, each vacuum manifold 5235 includes a through-hole 5240 arranged in a straight line along the center of the vacuum channel 5245. As shown in fig. 65A-65B, the vacuum channels 5245 are recessed into the upper surface of the manifold that supports the porous strips 5230. Each vacuum manifold also includes a center post 5250 placed between the through-holes 5240 and arranged in line along the center of the vacuum channels 5245. The central strut 5250 effectively divides the vacuum channel 5245 into two parallel vacuum channels located on either side of a row of central struts. The central struts 5250 also provide support for the porous strips 5230. Without the central strut 5250, the porous strip 5230 would be exposed to longer unsupported regions and could be sucked down toward the through-holes 5240. This can result in a three-dimensional bending of the wafer 45 (bending at and perpendicular to the cutting radius) that can damage the solar cells and interfere with the cutting process.

As shown in fig. 65A to 65B and 66 to 67, in the illustrated example, the through-hole 5240 communicates with a low vacuum chamber 5260L (a flat region 5235F and a transition region 5235T in fig. 62A), communicates with a high vacuum chamber 5260H (a cut region 5235C in fig. 62A), and communicates with another low vacuum chamber 5260L (a post-cut region 5235PC in fig. 62A). This arrangement provides a smooth transition between the low vacuum region and the high vacuum region in the vacuum passage 5245. The through holes 5240 provide sufficient flow resistance so that if the area corresponding to the hole is fully open, the airflow will not be fully deflected to the hole and allow the other areas to maintain a vacuum. The vacuum channels 5245 help ensure that the vacuum porous strips' holes 5255 will always have a vacuum and will not be in a dead center when disposed between the through holes 5240.

Referring again to fig. 65A-65B and also to fig. 67, the porous strip 5230 can comprise, for example, two rows of holes 5255, optionally arranged such that the leading and trailing edges 527 of the wafer 45 or diced solar cells 10 are always maintained under vacuum as the porous strip is advanced along the manifold. Specifically, the staggered arrangement of the holes 5255 in the illustrated example ensures that the edge of the wafer 45 or diced solar cells 10 always overlaps at least one hole 5255 in each porous strip 5230. This helps prevent the edges of the wafer 45 or the diced solar cells 10 from being lifted away from the porous strips 5230 and the manifold 5235. Any other suitable arrangement of apertures 5255 may also be used. In some variations, the arrangement of the holes 5255 may not ensure that the edges of the wafer 45 or the diced solar cells 10 are always kept under vacuum.

The moving porous belt 5230 in the illustrated example of the cutting tool 5210 contacts the bottom of the solar cell wafer 45 only along two narrow strips defined by the width of the porous belt along the lateral edges of the solar cell wafer. Thus, the solar cell wafer may contain a soft material (such as an uncured adhesive) that does not contact the porous tape 5230, for example, in the region of the bottom surface of the solar cell wafer, so that there is no risk of damaging the soft material during dicing.

In an alternative variant, for example, the cutting tool 5210 can use a single moving porous belt 5230 having a width perpendicular to the direction of travel that is approximately equal to the width of the solar cell wafer 45, rather than two moving porous belts as just described. Alternatively, the cutting tool 5210 can comprise three, four, or more moving porous strips 5230, which can be arranged side-by-side in parallel and optionally spaced apart from one another. The cutting tool 5210 may use a single vacuum manifold 5235, which may, for example, have a width perpendicular to the direction of travel of the solar cells that is approximately equal to the width of the solar cell wafer 45. Such a vacuum manifold may be used, for example, with a single full width moving porous belt 5230, or with two or more such porous belts arranged side-by-side in parallel and optionally spaced apart from each other. The cutting tool 5210 can include a single moving porous strip 5230 supported along opposing lateral edges, for example, by two curved vacuum manifolds 5235 that are arranged side-by-side in parallel and spaced apart from each other, and each vacuum manifold has the same curvature. The cutting tool 5210 can comprise three or more curved vacuum manifolds 5235 arranged side-by-side in parallel and spaced apart from each other, wherein each vacuum manifold has the same curvature. Such an arrangement may be used, for example, with a single full width moving porous belt 5230, or with three or more such porous belts arranged side-by-side in parallel and optionally spaced apart from each other. For example, the cutting tool may include a moving porous strip 5230 for each vacuum manifold.

Any suitable configuration of moving porous belts and vacuum manifolds may be used in the cutting tool 5210.

As described above, in some variations, the scribed solar cell wafer 45 cut with the cutting tool 5210 comprises uncured conductive adhesive bonding material and/or other soft material on its top and/or bottom surfaces prior to cutting. Scribing of the solar cell wafer and application of the soft material can be done in either order.

The porous belt 5230 in the cutting tool 5210 (and the porous belt 1060 in the cutting tool 1050) can transport the solar cell wafer 45 at the following speeds: for example, from about 40 millimeters per second (mm/s) to about 2000mm/s or more, or from about 40mm/s to about 500mm/s or more, or about 80mm/s or more. The solar cell wafer 45 can be more easily cut at higher speeds than at lower speeds.

Referring now to fig. 68, once cut, there will be some spacing between the leading and trailing edges 527 of adjacent cut cells 10 due to the geometry of the curve around, which will form a wedge-shaped gap between adjacent cut solar cells. If the cut cells are allowed to return to a flat, coplanar orientation without first increasing the spacing between the cut cells, the edges of adjacent cut cells may contact and damage each other. Therefore, it is advantageous to remove the cut cells from the porous strip 5230 (or porous strip 1060) while they are still supported by the curved surface.

Fig. 69A-69G schematically illustrate several apparatuses and methods whereby cut solar cells can be removed from the porous belt 5230 (or porous belt 1060) and transported to one or more additional moving porous belts or moving surfaces, wherein the spacing between the cut solar cells is increased. In the example of fig. 69A, the cut solar cells 10 are collected from the porous belt 5230 by one or more conveyor belts 5265, which move faster than the porous belt 5230 and thereby increase the spacing between the cut solar cells 10. For example, the conveyor belt 5265 can be disposed between two porous belts 5230. In the example of fig. 69B, the cut wafer 10 is divided by sliding along a slide conveyor 5270 disposed between two porous belts 5230. In this example, the porous belt 5230 advances each diced cell 10 into a low vacuum (e.g., no vacuum) region of the manifold 5235 in order to release the diced cell to the sled 5270 while the uncut portion of the wafer 45 remains held by the porous belt 5230. Providing an air cushion between the cut cells 10 and the sled 5270 helps to ensure that the cells and sled are not worn during operation, and also allows the cut cells 10 to slide faster away from the wafer 45, allowing for faster dicing tape operating speeds.

In the example of fig. 69C, rotating the bracket 5275A in the "bull wheel" arrangement 5275 transfers the cut solar cells 10 from the ribbons 5230 to one or more ribbons 5280.

In the example of fig. 69D, a rotating roller 5285 applies a vacuum through an actuator 5285A in order to pick up cut solar cells 10 from the ribbon 5230 and place them on the ribbon 5280.

In the example of fig. 69E, the carriage actuator 5290 comprises a carriage 5290A and a telescoping actuator 5290B mounted on the carriage. The carriage 5290A is translated back and forth in order to place the actuator 5290B to remove the cut solar cells 10 from the strip 5230, and then the actuator 5290B is positioned to place the cut solar cells on the strip 5280.

In the example of fig. 69F, the bracket track arrangement 5295 includes a bracket 5295A attached to a moving strip 5300 that positions the bracket 5295A to remove the cut solar cells 10 from the strip 5230, and then positions the bracket 5295A to place the cut solar cells 10 on the strip 5280, which occurs when the bracket is dropped or pulled away from the strip 5280 due to the path of the strip 5230.

In the example of fig. 69G, the inverted vacuum belt arrangement 5305 applies a vacuum through one or more moving porous belts to transfer the cut solar cells 10 from the belt 5230 to the belt 5280.

Fig. 70A-70C provide orthogonal views of other variations of the exemplary tool described above in connection with fig. 62A-62B and subsequent figures. This variant 5310 uses a conveyor belt 5265, as in the example of fig. 69A, to remove the diced solar cells 10 from a porous belt 5230 that transports the uncut wafer 45 into the dicing area of the tool. Fig. 71A to 71B are perspective views showing a variant of the cutting tool in two different operating stages. In fig. 71A, the uncut wafer 45 is approaching the cutting area of the tool, and in fig. 71B, the wafer 45 has entered the cutting area, and the two cut solar cells 10 have been separated from the wafer, and then further separated from each other as they are transported by the conveyor belt 5265.

In addition to the features previously described, fig. 70A-71B illustrate a plurality of vacuum ports 5315 on each manifold. The use of multiple ports per manifold allows for better control of the variation in vacuum along the length of the upper surface of the manifold. For example, different vacuum ports 5315 can optionally communicate with different vacuum chambers (e.g., 5260L and 5260H in fig. 66 and 72B) and/or be optionally connected to different vacuum pumps to provide different vacuum pressures along the manifold. Fig. 70A-70B also show the complete path of the porous strip 5230, which circulates around the wheel 5325, the upper surface of the vacuum manifold 5235, and the wheel 5320. For example, the belt 5230 can be driven by wheel 5320 or wheel 5325.

Fig. 72A and 72B show perspective views of a portion of the vacuum manifold 5235 covered by a portion of the porous strip 5230 for the variation of fig. 70A-71B, where fig. 72A provides a close-up view of a portion of fig. 72B. Fig. 73A shows a top view of a portion of the vacuum manifold 5235 covered by the porous strip 5230, and fig. 73B shows a cross-sectional view of the same vacuum manifold and porous strip arrangement taken along line C-C shown in fig. 73A. As shown in fig. 73B, the relative orientation of the through-holes 5240 can vary along the length of the vacuum manifold such that each through-hole is arranged perpendicular to the portion of the upper surface of the manifold that is directly above the through-hole. Fig. 74A shows another top view of a portion of the vacuum manifold 5235 covered by the porous strip 5230, with the vacuum chambers 5260L and 5260H shown in perspective. Fig. 74B shows a close-up view of a portion of fig. 74A.

Fig. 75A-75G illustrate several exemplary hole patterns that may optionally be used for the vacuum porous belt 5230. A common feature of these patterns is that the straight edge of the wafer 45 or diced solar cells 10 passing through the pattern at any position on the ribbon perpendicular to the long axis of the ribbon will always overlap with at least one hole 5255 in each of the ribbons. For example, the pattern may include two or more staggered rows of square or rectangular holes (fig. 75A, 75D), two or more staggered rows of circular holes (fig. 75B, 75E, 75G), two or more slanted rows of grooves (fig. 75C, 75F), or any other suitable hole arrangement.

The present specification discloses high efficiency solar modules comprising silicon solar cells arranged in an overlapping stack and electrically connected in series by conductive bonds between adjacent overlapping solar cells, thereby forming super cells arranged in physically parallel rows in the solar module. The super cell may include any suitable number of solar cells. For example, the length of the super cells may span substantially the full length or width of the solar module, or two or more super cells may be arranged end-to-end in a row. This arrangement hides the electrical interconnections between solar cells and can therefore be used to form visually appealing solar modules with little or no difference between adjacent series connected solar cells.

The present specification also discloses cell metallization patterns that facilitate printing of metallization stencils onto the front (and optionally back) surface of solar cells. As used herein, "stencil printing" of cell metallization refers to the application of a metallization material (e.g., silver paste) onto a solar cell surface through patterned openings in an otherwise impermeable sheet of material. For example, the stencil may be a patterned stainless steel plate. The patterned openings in the stencil are completely free of stencil material and, for example, do not include any mesh or screen. As used herein, "stencil printing" can be distinguished from "screen printing" because there is no mesh or screen material in the patterned stencil openings. In contrast, in screen printing, the metallization material is applied to the solar cell surface through a screen (e.g., mesh) that supports a patterned permeable material. The pattern includes openings in the impermeable material through which the metallization material is applied to the solar cell. The support screen extends through an opening in the impermeable material.

Stencil printing of battery metallization patterns offers several advantages over screen printing, including narrower line widths, higher aspect ratios (line height and width), better line uniformity and definition, and longer stencil life than screen printing. However, stencil printing cannot print the "islands" needed in conventional three bus metallization designs at once. Furthermore, stencil printing does not allow for a single print of a metallization pattern requiring the stencil to include unsupported structures that are not confined to the plane of the stencil during printing and that may interfere with the placement and use of the stencil. For example, stencil printing cannot print a metallization pattern at once, where metallization fingers arranged in parallel are interconnected by busbars or other metallization features extending perpendicular to the fingers, because a single stencil of this design would include unsupported sheet tabs bounded by openings for the busbars and openings for the fingers. The tabs will not be confined to the plane of the stencil during printing by physical connection with other parts of the stencil and will likely move out of plane and cause variations in stencil placement and use.

Therefore, attempting to use stencils for printing conventional solar cells requires two different stencils for front side metallization, or a stencil printing step in combination with a screen printing step, which increases the total number of printing steps per cell and also creates a "stitching" problem, where two prints overlap and result in a double height. The stitching complicates further processing and the additional printing and associated steps add cost. Therefore, screen printing is not commonly used for solar cells.

As described further below, the front surface metallization pattern described herein may include an array of fingers (e.g., parallel lines) that are not connected to one another by the front surface metallization pattern. These patterns can be stencil printed once with a single stencil because the desired stencil need not include unsupported portions or structures (e.g., tabs). Such front surface metallization patterns may be disadvantageous for standard sized solar cells and strings of solar cells in which spaced-apart solar cells are interconnected by braze strips, because the metallization patterns themselves do not provide substantial current distribution or electrical conduction perpendicular to the fingers. However, the front surface metallization pattern described herein is extremely effective in an overlapping arrangement of rectangular solar cells as described herein, wherein a portion of the front surface metallization pattern of a solar cell overlaps and is conductively bonded to the back surface metallization pattern of an adjacent solar cell. This is because the overlapping back surface metallization of adjacent solar cells can provide current distribution and electrical conduction perpendicular to the fingers in the front surface metallization pattern.

Turning now to the drawings for a more detailed understanding of the solar modules described herein, fig. 1 shows a cross-sectional view of a string of solar cells 10 arranged in an overlapping, series-connected fashion, with the ends of adjacent solar cells overlapping and electrically connected, thereby forming a super cell 100. Each solar cell 10 includes a semiconductor diode structure and electrical contacts connected to the semiconductor diode structure through which an electric current generated in the solar cell 10 when it is irradiated with light can be supplied to an external load.

In the examples described in this specification, each solar cell 10 is a rectangular crystalline silicon solar cell having a front surface (sunny side) metallization pattern disposed on a semiconductor layer of n-type conductivity and a back surface (back-negative side) metallization pattern disposed on a semiconductor layer of p-type conductivity, the metallization patterns providing electrical contact to opposite sides of an n-p junction. However, other material systems, diode structures, physical dimensions, or electrical contact arrangements may be used, if appropriate. For example, a front (sunnyside) surface metallization pattern may be disposed on a semiconductor layer of p-type conductivity and a back (shady side) surface metallization pattern may be disposed on a semiconductor layer of n-type conductivity.

Referring again to fig. 1, in the super cell 100, adjacent solar cells 10 are conductively bonded directly to each other in the areas where they overlap by means of a conductive bonding material that electrically connects the front surface metallization pattern of one solar cell to the back surface metallization pattern of the adjacent solar cell. Suitable conductive bonding materials may include, for example, conductive adhesives, conductive adhesive films and tapes, and conventional solders.

Referring again to fig. 2, fig. 2 shows an exemplary rectangular solar module 200 comprising six rectangular super cells 100, each having a length approximately equal to the length of a long side of the solar module. The super cells are arranged in parallel six rows with the long sides oriented parallel to the long sides of the module. Similarly constructed solar modules may also include such side length super cells, but in more or less rows than shown in this example. In other variants, the individual lengths of the super cells may be approximately equal to the length of the short sides of a rectangular solar module, and the super cells are arranged in parallel rows with their long sides oriented parallel to the short sides of the module. In still other arrangements, each bank may include two or more super cells, which may be electrically interconnected, for example, in series. The modules may have short sides of a length of, for example, about 1 meter, and long sides of a length of, for example, about 1.5 to about 2.0 meters. Any other suitable shape (e.g., square) and size may also be selected for the solar module. In this example, each super cell includes 72 rectangular solar cells, each rectangular solar cell having a width approximately equal to 1/6 of the width of an 156 millimeter (mm) square or quasi-square wafer and a length of approximately 156 mm. Any other suitable number and any other suitable size of rectangular solar cells may also be used.

Fig. 76 illustrates an exemplary front surface metallization pattern on a rectangular solar cell 10 that facilitates stencil printing as described above. The front surface metallization pattern may be formed from, for example, silver paste. In the example of fig. 76, the front surface metallization pattern comprises a plurality of fingers 6015 that extend parallel to each other, parallel to the short sides of the solar cell and perpendicular to the long sides of the solar cell. The front-surface metallization pattern also includes an optional row of contact pads 6020 extending parallel to and adjacent to the long edge of the solar cell, where each contact pad 6020 is located at an end of a finger 6015. Where present, each contact pad 6020 provides an area for a separate bead of conductive adhesive (ECA), solder, or other conductive bonding material used to conductively bond the front surface of the illustrated solar cell to the overlapping portion of the back surface of an adjacent solar cell. The pad may, for example, have a circular, square or rectangular shape, but any suitable pad shape may be used. Instead of using separate beads of conductive bonding material, solid or dashed lines of ECA, solder, conductive tape, or other conductive bonding material disposed along the long edge of the solar cell may interconnect some or all of the fingers, as well as bond the solar cell to an adjacent overlapping solar cell. Such a dashed or solid line conductive bonding material may be used in conjunction with the conductive pads at the ends of the fingers, or without such conductive pads.

The solar cell 10 may have a length of, for example, about 156mm, a width of about 26mm, and thus an aspect ratio (length of short side/length of long side) of about 1: 6. Six such solar cells may be fabricated on a standard size 156mm x 156mm silicon wafer and subsequently singulated (diced) to provide the illustrated solar cells. In other variations, eight solar cells 10 having dimensions of about 19.5mm by 156mm, and thus an aspect ratio of about 1:8, may be prepared from standard silicon wafers. More generally, the solar cell 10 may have an aspect ratio of, for example, about 1:2 to about 1:20, and may be fabricated from standard size wafers or any other suitably sized wafers.

Referring again to fig. 76, the front surface metallization pattern may comprise, for example, about 60 to about 120 fingers, such as about 90 fingers, per 156mm wide cell. Fingers 6015 may have a width of, for example, about 10 to about 90 microns, such as about 30 microns. The fingers 6015 may have a height perpendicular to the surface of the solar cell, for example, from about 10 to about 50 microns. The finger height may be, for example, about 10 microns or greater, about 20 microns or greater, about 30 microns or greater, about 40 microns or greater, or about 50 microns or greater. The diameter (circular) or side length (square or rectangular) of the pad 6020 may be, for example, about 0.1mm to about 1mm, such as about 0.5 mm.

The back surface metallization pattern for a rectangular solar cell 10 may comprise, for example, a row of discrete contact pads, a row of interconnected contact pads, or a continuous bus parallel to and adjacent to the long edge of the solar cell. However, such contact pads or busses are not necessary. If the front surface metallization pattern comprises contact pads 6020 arranged along an edge of one of the long sides of the solar cell, then the row or bus of contact pads (if present) in the back surface metallization pattern is arranged along an edge of the other long side of the solar cell. The back surface metallization pattern may also include a metal back contact that covers substantially all of the remaining back surface of the solar cell. The exemplary back surface metallization pattern of fig. 77A includes an array of discrete contact pads 6025 and metal back side contacts 6030 as just described, and the exemplary back surface metallization pattern of fig. 77B includes a continuous bus 35 and metal back side contacts 6030 as just described.

In a stacked super cell, the front surface metallization pattern of a solar cell is conductively bonded to the overlapping portion of the back surface metallization pattern of an adjacent solar cell. For example, if the solar cell includes front-surface metallization contact pads 6020, each contact pad 6020 may be aligned with and bonded to a corresponding back-surface metallization contact pad 6025 (if present), or aligned with and bonded to a back-surface metallization bus 35 (if present), or bonded to a metal back contact 6030 (if present) on an adjacent solar cell. This may be done, for example, by discrete portions (e.g., beads) of conductive bonding material disposed on each contact pad 6020, or by dashed or solid line conductive bonding material extending parallel to the edge of the solar cell and optionally electrically interconnecting two or more of the contact pads 6020.

If the solar cell lacks a front-surface metallization contact pad 6020, each front-surface metallization pattern finger 6015 may be aligned with and bonded to a corresponding back-surface metallization contact pad 6025 (if present), or bonded to a back-surface metallization bus 35 (if present), or bonded to a metal back contact 6030 on an adjacent solar cell, for example. This may be done, for example, by discrete portions (e.g., beads) of conductive bonding material disposed on overlapping ends of each finger 6015, or by a dashed or solid line of conductive bonding material that extends parallel to the edge of the solar cell and optionally electrically interconnects two or more of the fingers 6015.

As described above, portions of overlapping back-surface metallization of adjacent solar cells may provide current distribution and electrical conduction perpendicular to the fingers in the front-surface metallization pattern, for example, if the back-surface bus 35 and/or the back-surface metal contacts 6030 are present. In variations using a dashed or solid line conductive bonding material as described above, the conductive bonding material may provide current distribution and electrical conduction perpendicular to the fingers in the front surface metallization pattern. The overlapping back surface metallization and/or conductive bonding material may, for example, carry current to bypass damaged fingers or other finger interference in the front surface metallization pattern.

The back surface metallization contact pads 6025 and bus lines 35, if present, may be formed from, for example, a silver paste that may be applied using stencil printing, screen printing, or any other suitable method. The metal back contact 6030 may be formed of, for example, aluminum.

Any other suitable back surface metallization pattern and material may also be used.

Fig. 78 illustrates an exemplary front surface metallization pattern on a square solar cell 6300 that can be cut into a plurality of rectangular solar cells, each having the front surface metallization pattern illustrated in fig. 76.

Fig. 79 illustrates an exemplary back surface metallization pattern on a square solar cell 6300 that can be cut into a plurality of rectangular solar cells, each having the back surface metallization pattern shown in fig. 77A.

The front surface metallization pattern described herein may enable stencil printing of front surface metallization on a standard three printer solar cell production line. For example, the production process may include: stencil or screen printing a silver paste onto the back surface of the square solar cell using a first printer to form a back surface contact pad or a back surface silver bus; then drying the rear surface silver paste; then stencil or screen printing an aluminum contact onto the back surface of the solar cell using a second printer; subsequently, drying the aluminum contact; then printing the silver paste onto the front surface of the solar cell in a single plate-making step using a single stencil by a third printer to form a complete front surface metallization pattern; then drying the silver paste; the solar cell is then baked. These printing and related steps may be performed in any other order, or omitted, as appropriate.

The use of a stencil to print the front surface metallization pattern enables the production of narrower fingers than would be possible by screen printing, which can improve solar cell efficiency and reduce the use of silver, thus reducing production costs. Stencil printing of the front surface metallization pattern through a single stencil in a single stencil printing step enables the production of a front surface metallization pattern having a uniform height, e.g. no stitching, which may occur if multiple stencils or stencil printing are used in combination with screen printing to overlap print to define features extending in different directions.

After the front and back surface metallization patterns are formed on the square solar cells, each square solar cell may be divided into two or more rectangular solar cells. This may be done, for example, by laser scribing followed by dicing, or by any other suitable method. Rectangular solar cells may be arranged in an overlapping, overlapping fashion and conductively bonded to each other as described above to form a super cell. The present specification discloses methods for fabricating solar cells with reduced carrier recombination losses at the edges of the solar cell, e.g., without cut edges that promote carrier recombination. The solar cell may be, for example, a silicon solar cell, and more particularly, may be an HIT silicon solar cell. The present specification also discloses a stacked (overlapping) super cell arrangement of such solar cells. Individual solar cells in such super cells may have a narrow rectangular geometry (e.g., a stripe shape) in which the long sides of adjacent solar cells are arranged to overlap.

A major challenge in implementing high efficiency solar cells, such as HIT solar cells, in a cost-effective manner is that it is generally believed that a large amount of metal is required to carry a large current from one such high efficiency solar cell to an adjacent series-connected high efficiency solar cell. Such high efficiency solar cells are cut into narrow rectangular solar cell strips, and the resulting solar cells are then arranged in an overlapping (shingled) pattern with conductive bonds between overlapping portions of adjacent solar cells to form strings of series-connected solar cells in a super cell, providing an opportunity to reduce module cost through process simplification. This is because the fixing process normally required to interconnect adjacent solar cells with metal solder strips can be eliminated. This method of overlap may also improve module efficiency by reducing the current through the solar cells (since a single solar cell strip may have a smaller active area than conventional), and by reducing the length of the current path between adjacent solar cells, both of which may reduce resistive losses. The reduced current may also allow for the replacement of more expensive but less resistive wires (e.g., silver) with less expensive but more resistive wires (e.g., copper) without significant loss of performance. In addition, this overlapping approach can reduce dead module area by eliminating the interconnect ribbons and associated contacts from the front surface of the solar cell.

A conventionally sized solar cell may have, for example, substantially square front and back surfaces that are sized about 156 millimeters (mm) by about 156 mm. In the overlap scheme just described, such solar cells are cut into two or more (e.g., two to twenty) strips of 156mm long solar cells. A potential difficulty with this overlapping approach is that slitting a conventional size solar cell into thin strips increases the cell edge length per active area of the solar cell compared to a conventional size solar cell, which may degrade performance due to carrier recombination at the edges.

For example, fig. 80 schematically illustrates that a HIT solar cell 7100 having front and back surface dimensions of about 156mm by about 156mm is cut into several solar cell strips (7100a, 7100b, 7100c, and 7100d), each having narrow rectangular front and back surfaces having dimensions of about 156mm by about 40 mm. (the 156mm long side of the solar cell strip extends into the page). In the example shown, the HIT cell 7100 includes an n-type monocrystalline substrate 5105, which may, for example, have a thickness of about 180 microns and front and rear square surfaces measuring about 156mm by about 156 mm. An about 5 nanometer (nm) thick intrinsic amorphous Si: H (a-Si: H) layer and an about 5nm thick n + doped a-Si: H layer (both layers are indicated by reference numeral 7110) are disposed on the front surface of the crystalline silicon substrate 7105. An approximately 65nm thick Transparent Conductive Oxide (TCO) film 5120 is disposed on the a-Si: H layer 7110. Conductive metal grid lines 7130 disposed on the TCO layer 7120 provide electrical contact to the front surface of the solar cell. An about 5nm thick intrinsic a-S i: H layer and an about 5nm thick p + doped a-Si: H layer (both layers are indicated by reference numeral 7115) are disposed on the back surface of the crystalline silicon substrate 7105. A Transparent Conductive Oxide (TCO) film 7125 about 65nm thick is disposed on the a-Si: H layer 7115, and a conductive metal gridline 7135 disposed on the TCO layer 7125 provides an electrical contact to the back surface of the solar cell. (the above dimensions and materials are intended to be illustrative rather than limiting and may be varied if appropriate).

Still referring to fig. 80, if the HIT solar cell 7100 is cut by conventional methods to form stripe-shaped solar cells 7100a, 7100b, 7100c, and 7100d, the newly cut edge 7140 is not passivated. These unpassivated edges contain a high density of dangling chemical bonds that promote carrier recombination and reduce the performance of the solar cell. In particular, the cut surface 7145 exposing the n-p junction and the cut surface (in layer 7110) exposing the heavily doped front surface region are not passivated and can significantly promote carrier recombination. Furthermore, if a conventional laser cutting or laser scribing process is used to cut the solar cell 7100, thermal damage may occur on the newly formed edges, such as recrystallization 7150 of amorphous silicon. Due to unpassivated edges and thermal damage, new edges formed on the diced solar cells 7100a, 7100b, 7100c, and 7100d are expected to reduce short circuit current, open circuit voltage, and pseudo fill factor of the solar cells if conventional manufacturing processes are used. This corresponds to a significant reduction in the performance of the solar cell.

By the method illustrated in fig. 81A-81J, the formation of recombination-promoting edges during the dicing of conventional-sized HIT solar cells into narrower solar cell strips can be avoided. This approach uses isolation trenches on the front and back surfaces of a conventionally sized solar cell 7100 to electrically isolate the p-n junction and the heavily doped front surface region from cut edges that might otherwise act as recombination sites for minority carriers. The trench edges are not defined by conventional dicing, but are patterned using chemical etching or laser, followed by deposition of a passivation layer, such as TCO, which passivates the front and back trenches. The substrate doping is sufficiently low compared to the heavily doped regions so that electrons in the junction are less likely to reach the unpassivated cut edge of the substrate. In addition, a low-scribe wafer dicing technique, laser thermal singulation (TLS), may be used to dice the wafer, thereby avoiding potential thermal damage.

In the example shown in fig. 81A-81J, the starting material is a square, n-type, raw single crystal silicon, cut wafer of about 156mm, which may have a bulk resistivity of, for example, about 1 to about 3 ohm-cm and may be, for example, about 180 microns thick. (wafer 7105 forms the substrate of the solar cell).

Referring to fig. 81A, an as-cut wafer 7105 is typically subjected to texture etching, pickling, rinsing and drying.

Next, in FIG. 81B, an about 5nm thick intrinsic a-Si: H layer and an about 5nm thick doped n + a-Si: H layer (both layers are indicated by reference numeral 7110) are deposited on the front surface of the wafer 7105 by, for example, Plasma Enhanced Chemical Vapor Deposition (PECVD) at a temperature of, for example, about 150 ℃ to about 200 ℃.

Next, in FIG. 81C, an about 5nm thick intrinsic a-Si: H layer and an about 5nm thick doped p + a-Si: H layer (both layers are indicated by reference numeral 7115) are deposited on the back surface of the wafer 7105 by, for example, PECVD at a temperature of, for example, about 150 ℃ to about 200 ℃.

Next, in fig. 81D, the front a-Si: H layer 7110 is patterned to form an isolation trench 7112. The isolation trench 7112 typically penetrates through the layer 7110 to reach the wafer 7105 and may have a width of, for example, about 100 microns to about 1000 microns, such as about 200 microns. Typically, the trenches have a minimum width that can be used, depending on the accuracy of the patterning technique and the subsequently applied cutting technique. Patterning of the trench 7112 can be done, for example, using laser patterning or chemical etching (e.g., inkjet wet patterning).

Next, in fig. 81E, the post a-Si: H layer 7115 is patterned to form an isolation trench 7117. Similar to isolation trench 7112, isolation trench 7117 typically penetrates layer 7115 to reach wafer 7105 and may have a width of, for example, about 100 microns to about 1000 microns, for example, about 200 microns. Patterning of the trench 7117 can be done, for example, using laser patterning or chemical etching (e.g., inkjet wet patterning). Each groove 7117 is aligned with a corresponding groove 7112 on the front surface of the structure.

Next, in FIG. 81F, an approximately 65nm thick TCO layer 7120 is deposited over the patterned front a-Si: H layer 7110. This may be done, for example, by Physical Vapor Deposition (PVD) or ion plating. The TCO layer 7120 fills the trench 7112 in the a-Si H layer 7110 and covers the outer edges of the layer 7110, thereby passivating the surface of the layer 7110. The TCO layer 7120 also serves as an antireflective coating.

Next, in FIG. 81G, an approximately 65nm thick TCO layer 7125 is deposited on the patterned post a-Si: H layer 7115. This may be done, for example, by PVD or ion plating. The TCO layer 7125 fills the trench 7117 in the a-Si H layer 7115 and covers the outer edge of the layer 115, thereby passivating the surface of the layer 7115. The TCO layer 7125 also serves as an antireflective coating.

Next, in fig. 81H, conductive (e.g., metallic) front surface grid lines 7130 are screen printed onto the TCO layer 7120. Grid lines 7130 may be formed, for example, from a low temperature silver paste.

Next, in fig. 81I, the conductive (e.g., metal) back surface grid lines 7135 are screen printed onto the TCO layer 7125. Grid lines 7135 may be formed from, for example, a low temperature silver paste.

Next, after depositing grid lines 7130 and grid lines 7135, the solar cell is cured, for example, at a temperature of about 200 ℃ for about 30 minutes.

Next, in fig. 81J, the solar cells are separated into solar cell bars 7155a, 7155b, 7155c and 7155d by cutting the solar cells at the center of the trench. The dicing may be done at the center of the trench, for example, by conventional laser scribing and mechanical dicing to dice the solar cell in alignment with the trench. Alternatively, the dicing may be done using a laser thermal dicing method (e.g. developed by Jenoptik AG), where laser induced heating at the center of the trench causes mechanical stress that causes the solar cell to be diced in alignment with the trench. The latter method can avoid thermal damage to the edges of the solar cell.

The resulting strip-shaped solar cells 7155a to 7155d are different from the strip-shaped solar cells 7100a to 7100d shown in fig. 80. Specifically, the edges of the a-Si: H layer 7110 and the a-Si: H layer 7115 in the solar cells 7140a-7140d are formed by etching or laser patterning, rather than by mechanical cutting. In addition, the edges of layers 7110 and 7115 in solar cells 7155a-7155d are passivated by the TCO layers. Thus, the solar cells 7140a-7140d lack the cut edges present in the solar cells 7100a-7100d that promote carrier recombination.

The methods described in connection with fig. 81A-81J are intended to be illustrative, not limiting. Steps described as performed in a particular order may be performed in other orders or in parallel, as appropriate. Steps and material layers may be omitted, added or substituted, if appropriate. For example, if copper plated metallization is used, additional patterning and seed layer deposition steps may be included in the process. Furthermore, in some variations, only the front a-Si: H layer 7110 is patterned to form isolation trenches, while the back a-Si: H layer 7115 does not form isolation trenches. In other variations, only the back a-Si: H layer 7115 is patterned to form isolation trenches, while the front a-Si: H layer 7115 does not form isolation trenches therein. As in the examples of fig. 81A to 81J, in these modifications, the cutting is also performed at the center of the groove.

The formation of recombination-promoting edges during dicing of conventional-sized HIT solar cells into narrower solar cell strips may also be avoided by the method illustrated in fig. 82A-82J, which also uses isolation trenches, similar to those used in the method described in connection with fig. 81A-81J.

Referring to fig. 82A, in this example, the starting material is again an approximately 156mm square n-type single crystal bulk cut wafer 7105 which can have a bulk resistivity of, for example, about 1 to about 3 ohm-cm and can be, for example, about 180 microns thick.

Referring to fig. 82B, a trench 7160 is formed in the front surface of the wafer 7105. The trenches may have a depth of, for example, about 80 microns to about 150 microns, such as about 90 microns, and may have a width of, for example, about 10 microns to about 100 microns. The isolation trench 7160 defines the geometry of the solar cell strip to be formed from the wafer 7105. As will be explained below, the wafer 7105 will be cut in line with these grooves. The trench 7160 can be formed by, for example, conventional laser wafer scribing.

Next, in fig. 82C, the wafer 7105 is typically subjected to texture etching, acid washing, rinsing and drying. The etching typically removes damage originally present in the surface of the as-cut wafer 7105 or damage caused during the formation of the trench 7160. The etch may also widen and deepen the trench 7160.

Next, in FIG. 82D, an about 5nm thick intrinsic a-Si: H layer and an about 5nm thick doped n + a-Si: H layer (both layers are indicated by reference numeral 7110) are deposited on the front surface of the wafer 7105 by, for example, PECVD at a temperature of, for example, about 150 ℃ to about 200 ℃.

Next, in FIG. 82E, an about 5nm thick intrinsic a-Si: H layer and an about 5nm thick doped p + a-Si: H layer (both layers are indicated by reference numeral 7115) are deposited on the back surface of the wafer 7105 by, for example, PECVD at a temperature of, for example, about 150 ℃ to about 200 ℃.

Next, in FIG. 82F, an approximately 65nm thick TCO layer 7120 is deposited over the front a-Si: H layer 7110. This may be done, for example, by Physical Vapor Deposition (PVD) or ion plating. The TCO layer 7120 may fill the trench 7160 and generally cover the walls and bottom of the trench 7160 and the outer edges of the layer 7110, thereby passivating the covered surface. The TCO layer 7120 also serves as an antireflective coating.

Next, in FIG. 82G, an approximately 65nm thick TCO layer 7125 is deposited over the post a-Si: H layer 7115. This may be done, for example, by PVD or ion plating. The TCO layer 7125 passivates the surface (e.g., including the outer edges) of the layer 7115 and also serves as an antireflective coating.

Next, in fig. 82H, the conductive (e.g., metallic) front surface grid lines 7130 are screen printed onto the TCO layer 7120. Grid lines 7130 may be formed, for example, from a low temperature silver paste.

Next, in fig. 82I, the conductive (e.g., metal) back surface grid lines 7135 are screen printed onto the TCO layer 7125. Grid lines 7135 may be formed from, for example, a low temperature silver paste.

Next, after depositing grid lines 7130 and grid lines 7135, the solar cell is cured, for example, at a temperature of about 200 ℃ for about 30 minutes.

Next, in fig. 82J, the solar cells are separated into solar cell bars 7165a, 7165b, 7165c and 7165d by cutting the solar cells at the center of the grooves. The cutting may be done at the center of the trench, for example, by conventional mechanical cutting, to align the trench to cut the solar cell. Alternatively, the cutting may be done, for example, using a laser thermal splitting method as described above.

The resulting strip-shaped solar cells 7165a to 7165d are different from the strip-shaped solar cells 7100a to 7100d shown in fig. 80. Specifically, the edges of the a-Si H layer 7110 in the solar cells 7165a-7165d are formed by etching, rather than by mechanical cutting. In addition, the edges of the layers 7110 in the solar cells 7165a-7165d are passivated by the TCO layer. Thus, the solar cells 7165a-7165d lack the cut edges present in the solar cells 7100a-7100d that promote carrier recombination.

The methods described in connection with fig. 82A-82J are intended to be illustrative, and not limiting. Steps described as performed in a particular order may be performed in other orders or in parallel, as appropriate. Steps and material layers may be omitted, added or substituted, if appropriate. For example, if copper plated metallization is used, additional patterning and seed layer deposition steps may be included in the process. Furthermore, in some variations, the grooves 7160 may be formed in the back surface of the wafer 7105 rather than the front surface of the wafer 7105.

The methods described above in connection with fig. 81A to 81J and 82A to 82J are applicable to both n-type and p-type HIT solar cells. The solar cell may be a front emitter or a rear emitter. The segmentation process may preferably be performed on the side without the emitter. Furthermore, the use of isolation trenches and passivation layers as described above to reduce recombination on the edge of a diced wafer is also applicable to other solar cell designs, and to solar cells employing material systems other than silicon.

Referring again to fig. 1, a string of series-connected solar cells 10 formed using the above-described method may advantageously be arranged in an overlapping manner, with the ends of adjacent solar cells overlapping and electrically connected to form a super cell 100. In the super cell 100, adjacent solar cells 10 are conductively bonded to each other in their overlapping regions by a conductive bonding material that electrically connects the front surface metallization pattern of one solar cell to the back surface metallization pattern of the adjacent solar cell. Suitable conductive bonding materials may include, for example, conductive adhesives, conductive adhesive films and conductive adhesive tapes, as well as conventional solders.

Referring again to fig. 5A-5B, fig. 5A shows an exemplary rectangular solar module 200 comprising 20 rectangular super cells 100, wherein each rectangular super cell has a length approximately equal to half the length of the short side of the solar module. The super cells are arranged in pairs end-to-end to form ten rows of super cells, wherein both the rows and the long sides of the super cells are oriented parallel to the short sides of the solar module. In other variations, each row of super cells may include three or more super cells. Furthermore, in other variants, the super cells may be arranged in rows end-to-end, with the rows and long sides of the super cells being oriented parallel to the long sides of rectangular solar modules or parallel to the sides of square solar modules. Further, the solar module may include more or fewer super cells and more or fewer rows of super cells than shown in this example.

In variations where the super cells in each row are arranged such that at least one of them has a front surface terminal contact on the end of the super cell adjacent to another super cell in the row, there may be an optional gap 210 shown in fig. 5A to facilitate making electrical contact with the front surface terminal contact of the super cell 100 along the centerline of the solar module. In variations where each row of super cells comprises three or more super cells, additional gaps may exist between the super cells to similarly facilitate making electrical contact with the front surface terminal contacts away from the sides of the solar module.

Fig. 5B shows another exemplary rectangular solar module 300 comprising 10 rectangular super cells 100, wherein the length of each rectangular super cell is approximately equal to the length of the short side of the solar module. The super cells are arranged with their long sides oriented parallel to the short sides of the module. In other variations, the length of the super cells may be approximately equal to the length of the long sides of a rectangular solar module, and the super cells are oriented such that their long sides are parallel to the long sides of the solar module. The length of the super cells may also be approximately equal to the side length of a square solar module and the super cells are oriented such that their long sides are parallel to the sides of the solar module. Furthermore, the solar module may include more or fewer such side lengths of super cells than shown in this example.

Fig. 5B also shows the appearance of the solar module 200 of fig. 5A in a situation where there is no gap between adjacent super cells in each row of super cells. Any other suitable arrangement of the super cells 100 in the solar module may also be used.

The paragraphs listed below provide additional non-limiting aspects of the present disclosure.

1. A solar module, comprising:

A string of N (N ≧ 25) rectangular or substantially rectangular solar cells connected in series, the solar cells having an average breakdown voltage greater than about 10 volts, the solar cells grouped into one or more super cells, each super cell comprising two or more solar cells arranged in a line with the long sides of adjacent solar cells overlapping and conductively bonded to each other with an adhesive that is both electrically and thermally conductive;

wherein no single solar cell or a total of less than N solar cell groups are individually electrically connected in parallel with a bypass diode in the string of solar cells.

2. The solar module of clause 1, wherein N is greater than or equal to 30.

3. The solar module of clause 1, wherein N is greater than or equal to 50.

4. The solar module of clause 1, wherein N is greater than or equal to 100.

5. The solar module of clause 1, wherein the adhesive forms a bond between adjacent solar cells, the bond having a thickness perpendicular to the solar cells of less than or equal to about 0.1mm and a thermal conductivity perpendicular to the solar cells of greater than or equal to about 1.5 w/m/k.

6. The solar module of clause 1, wherein the N solar cells are grouped into a single super cell.

7. The solar module of clause 1, wherein the super cell is encapsulated in a polymer.

7A. The solar module of clause 7, wherein the polymer comprises a thermoplastic olefin polymer.

7B. The solar module of clause 7, wherein the polymer is sandwiched between a glass front sheet and a back sheet.

And 7C. The solar module of clause 7B, wherein the back sheet comprises glass.

8. The solar module of clause 1, wherein the solar cells are silicon solar cells.

9. A solar module, comprising:

a super cell spanning substantially the entire length or width of the solar module parallel to an edge of the solar module, the super cell comprising a string of N rectangular or substantially rectangular solar cells connected in series, the solar cells having an average breakdown voltage greater than about 10 volts, the solar cells arranged in a line with long sides of adjacent solar cells overlapping and conductively bonded to each other with an adhesive that is both electrically and thermally conductive;

wherein no single solar cell or a total of less than N solar cell groups are individually electrically connected in parallel with the bypass diode in the super cell.

10. The solar module of clause 9, wherein N > 24.

11. The solar module of clause 9, wherein the super cell has a length in the direction of current flow of at least about 500 mm.

12. The solar module of clause 9, wherein the super cell is encapsulated in a thermoplastic olefin polymer sandwiched between a glass front sheet and a back sheet.

13. A super cell, comprising:

a plurality of silicon solar cells, each silicon solar cell comprising:

a rectangular or substantially rectangular front and back surface, the shape of the surface being defined by oppositely disposed and parallel first and second long sides and two oppositely disposed short sides, at least part of the front surface being exposed to solar radiation during operation of the solar cell string;

a conductive front surface metallization pattern disposed on the front surface and comprising at least one front surface contact pad disposed adjacent the first long side; and

a conductive back surface metallization pattern disposed on the back surface and including at least one back surface contact pad disposed adjacent the second long side;

wherein the silicon solar cells are arranged in a line with the first and second long sides of adjacent silicon solar cells overlapping, and the front and back surface contact pads on adjacent silicon solar cells overlapping and conductively bonded to each other by a conductive adhesive bonding material, thereby electrically connecting the silicon solar cells in series. And

Wherein the front surface metallization pattern of each silicon solar cell comprises a barrier configured to substantially confine the conductive adhesive bonding material to at least one front surface contact pad prior to curing of the conductive adhesive bonding material during fabrication of the super cell.

14. The super cell of clause 13, wherein for each pair of adjacent and overlapping silicon solar cells, the barrier on the front surface of one of the silicon solar cells overlaps and is hidden by a portion of the other silicon solar cell, thereby substantially confining the conductive adhesive bonding material to the overlapping region of the front surfaces of the silicon solar cells prior to curing of the conductive adhesive bonding material during fabrication of the super cell.

15. The super cell of clause 13, wherein the barrier comprises a continuous conductive line parallel to and running substantially the entire length of the first long side, wherein the at least one front surface contact pad is located between the continuous conductive line and the first long side of the solar cell.

16. The super cell of clause 15, wherein the front surface metallization pattern comprises fingers electrically connected to the at least one front surface contact pad and running perpendicular to the first long side, and a continuous conductive line electrically interconnects the fingers to provide a plurality of conductive paths from each finger to the at least one front surface contact pad.

17. The super cell of clause 13, wherein the front surface metallization pattern comprises a plurality of discrete contact pads arranged in a row adjacent and parallel to the first long side, and the barrier comprises a plurality of features that form a separate barrier for each discrete contact pad that substantially confines the conductive adhesive bonding material to the discrete contact pads prior to curing of the conductive adhesive bonding material during manufacture of the super cell.

18. The super cell of clause 17, wherein the individual barriers abut and are higher than the corresponding discrete contact pads.

19. A super cell, comprising:

a plurality of silicon solar cells, each silicon solar cell comprising:

a rectangular or substantially rectangular front and back surface, the shape of the surface being defined by oppositely disposed and parallel first and second long sides and two oppositely disposed short sides, at least part of the front surface being exposed to solar radiation during operation of the solar cell string;

a conductive front surface metallization pattern disposed on the front surface and comprising at least one front surface contact pad disposed adjacent the first long side; and

A conductive back surface metallization pattern disposed on the back surface and including at least one back surface contact pad disposed adjacent the second long side;

wherein the silicon solar cells are arranged in a line with the first and second long sides of adjacent silicon solar cells overlapping, and the front and back surface contact pads on adjacent silicon solar cells overlapping and conductively bonded to each other by a conductive adhesive bonding material, thereby electrically connecting the silicon solar cells in series. And

wherein the back surface metallization pattern of each silicon solar cell comprises a barrier configured to substantially confine the conductive adhesive bonding material to at least one back surface contact pad prior to curing of the conductive adhesive bonding material during fabrication of the super cell.

20. The super cell of clause 19, wherein the back surface metallization pattern comprises one or more discrete contact pads arranged in a row adjacent and parallel to the second long side, and the barrier comprises a plurality of features that form a separate barrier for each discrete contact pad that substantially confines the conductive adhesive bonding material to the discrete contact pads prior to curing of the conductive adhesive bonding material during manufacture of the super cell.

21. The super cell of clause 20, wherein the individual barrier abuts and is higher than the corresponding discrete contact pad.

22. A method of fabricating a string of solar cells, the method comprising:

cutting one or more quasi-square silicon wafers along a plurality of lines parallel to the long edge of each wafer to form a plurality of rectangular silicon solar cells, wherein the length of each silicon solar cell along its long axis is substantially equal; and

arranging rectangular silicon solar cells in a line with long sides of adjacent solar cells overlapping and conductively bonded to each other, thereby electrically connecting the solar cells in series;

wherein the plurality of rectangular silicon solar cells comprises: at least one rectangular solar cell having two chamfers, the chamfers corresponding to corners or a portion of corners of a quasi-square wafer; and one or more rectangular silicon solar cells each lacking a chamfer. And

wherein the spacing between parallel lines along which the aligned square wafers are cut is selected so as to compensate for the chamfer by making the width perpendicular to the long axis of the rectangular silicon solar cell including the chamfer larger than the width perpendicular to the long axis of the rectangular silicon solar cell lacking the chamfer; therefore, during operation of the solar cell string, the front surface of each of the plurality of rectangular silicon solar cells in the solar cell string is substantially equal in area exposed to sunlight.

23. A string of solar cells, comprising:

a plurality of silicon solar cells arranged in a line, wherein end portions of adjacent solar cells overlap and are conductively bonded to each other, thereby electrically connecting the solar cells in series;

wherein at least one silicon solar cell has a chamfer corresponding to a corner or a portion of a corner of a quasi-square silicon wafer from which the silicon solar cell is cut; at least one silicon solar cell lacks a chamfer; during operation of the string of solar cells, the front surface of each silicon solar cell is exposed to sunlight over substantially equal areas.

24. A method of fabricating two or more strings of solar cells, the method comprising:

cutting one or more quasi-square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form a first plurality of rectangular silicon solar cells having a chamfer corresponding to a corner or a portion of a corner of the quasi-square silicon wafer, and a second plurality of rectangular silicon solar cells lacking a chamfer, each cell of the second plurality of rectangular silicon solar cells having a first length spanning a full width of the quasi-square silicon wafer;

Removing the chamfer from each of the first plurality of rectangular silicon solar cells to form a third plurality of rectangular silicon solar cells lacking chamfers, each of the third plurality of rectangular silicon solar cells having a second length that is shorter than the first length;

arranging a second plurality of rectangular silicon solar cells in a line with long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, while electrically connecting the second plurality of rectangular silicon solar cells in series, thereby forming a solar cell string having a width equal to the first length; and

the third plurality of rectangular silicon solar cells are arranged in a line with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and are electrically connected in series, thereby forming a solar cell string having a width equal to the second length.

25. A method of fabricating two or more strings of solar cells, the method comprising:

cutting one or more quasi-square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form a first plurality of rectangular silicon solar cells having a chamfer corresponding to a corner or a portion of a corner of the quasi-square silicon wafer, and a second plurality of rectangular silicon solar cells lacking a chamfer;

Arranging a first plurality of rectangular silicon solar cells in a line with long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, while electrically connecting the first plurality of rectangular silicon solar cells in series; and

the second plurality of rectangular silicon solar cells are arranged in a line with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, while the second plurality of rectangular silicon solar cells are electrically connected in series.

26. A method of making a solar module, the method comprising:

cutting each of one or more quasi-square silicon wafers along a plurality of lines parallel to a long edge of the wafer to form a plurality of rectangular silicon solar cells having chamfers from the plurality of quasi-square silicon wafers, and a plurality of rectangular silicon solar cells lacking chamfers, wherein the chamfers correspond to corners of the quasi-square silicon wafers;

arranging at least some of the rectangular silicon solar cells lacking chamfers, forming a first plurality of super cells, each super cell comprising only rectangular silicon solar cells lacking chamfers arranged in a line, wherein the long sides of the rectangular silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series;

Arranging at least some of the rectangular silicon solar cells having the chamfers, forming a second plurality of super cells, each super cell comprising only rectangular silicon solar cells having chamfers arranged in a line, wherein long sides of the rectangular silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series; and

arranging the super cells in parallel rows of super cells having substantially equal lengths forming a front surface of the solar module, wherein each row comprises only super cells of the first plurality of super cells or only super cells of the second plurality of super cells.

27. The solar module of clause 26, wherein two of the rows of super cells adjacent to the parallel opposing edges of the solar module include only super cells of the second plurality of super cells, and all other rows of super cells include only super cells of the first plurality of super cells.

28. The solar module of clause 27, wherein the solar module comprises a total of six rows of super cells.

29. A super cell, comprising:

a plurality of silicon solar cells arranged in a line in a first direction, wherein end portions of adjacent silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series; and

An elongated flexible electrical interconnect having a long axis oriented parallel to a second direction perpendicular to the first direction, the elongated flexible electrical interconnect having the following features: conductively bonded to the front or back surface of the end one silicon solar cell at three or more discrete locations arranged along the second direction; extending at least a full width of the terminal solar cell in a second direction; a wire thickness of less than or equal to about 100 micrometers measured perpendicular to a front surface or a back surface of the terminal silicon solar cell; providing a resistance of less than or equal to about 0.012 ohms to current flowing in a second direction; is configured to provide flexibility that accommodates differential expansion between the terminal silicon solar cell and the electrical interconnect in a second direction over a temperature range of about-40 ℃ to about 85 ℃.

30. The super cell of clause 29, wherein the wire thickness of the flexible electrical interconnect is less than or equal to about 30 microns measured perpendicular to the front and back surfaces of the terminal silicon solar cell.

31. The super cell of clause 29, wherein the flexible electrical interconnect extends beyond the super cell in the second direction so as to provide electrical interconnect to at least a second super cell placed parallel and adjacent to the super cell in a solar module.

32. The super cell of clause 29, wherein the flexible electrical interconnect extends beyond the super cell in the first direction to provide electrical interconnection in the solar module for a second super cell disposed in line parallel with the super cell.

33. A solar module, comprising:

a plurality of super cells arranged in two or more parallel rows spanning a width equal to the module, thereby forming a front surface of the module, each super cell comprising a plurality of silicon solar cells arranged in a line with ends of adjacent silicon solar cells overlapping and conductively bonded to each other, thereby electrically connecting the silicon solar cells in series;

wherein at least one end of a first super cell in a first row adjacent to an edge of the module is electrically connected to one end of a second super cell in a second row adjacent to the same edge of the module via a flexible electrical interconnect having the following features: bonding to the front surface of the first super cell at a plurality of discrete locations by a conductive adhesive bonding material; extending parallel to the edges of the module; at least a portion of which is folded around the one end of the first super cell and is thus not visible from the front of the module.

34. The solar module of clause 33, wherein the surface of the flexible electrical interconnect on the front surface of the module is covered or dyed to mitigate visual contrast with the super cell.

35. The solar module of clause 33, wherein the two or more parallel rows of super cells are arranged on a white back sheet forming a front surface of the solar module to be irradiated by solar radiation during operation of the solar module, the white back sheet comprising parallel dark stripes having a position and a width corresponding to the position and the width of the gaps between the parallel rows of super cells, and the white portions of the back sheet are not visible through the gaps between the rows.

36. A method of fabricating a string of solar cells, the method comprising:

scribing one or more scribe lines with a laser on each of the one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells;

applying a conductive adhesive bonding material to the one or more scribed silicon solar cells at one or more locations adjacent the long side of each rectangular region;

dividing the silicon solar cells along the drawing lines to obtain a plurality of rectangular silicon solar cells, wherein a part of conductive adhesive bonding material is arranged on the front surface of each rectangular silicon solar cell and is adjacent to the long side;

Arranging a plurality of rectangular silicon solar cells in a line such that long sides of adjacent rectangular silicon solar cells overlap in an overlapping manner with a portion of conductive adhesive bonding material disposed therebetween; and

the conductive bonding material is cured to bond adjacent overlapping rectangular silicon solar cells to each other and electrically connect the cells in series.

37. A method of fabricating a string of solar cells, the method comprising:

laser scribing one or more scribe lines on each of the one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells, each solar cell comprising a top surface and an oppositely disposed bottom surface;

applying a conductive adhesive bonding material to portions of the top surface of the one or more silicon solar cells;

applying a vacuum between the bottom surface of the one or more silicon solar cells and the curved support surface to bend the one or more silicon solar cells against the curved support surface to cause the one or more silicon solar cells to be cut along the scribe lines, thereby resulting in a plurality of rectangular silicon solar cells, each having a portion of electrically conductive adhesive bonding material disposed on a front surface thereof adjacent the long sides;

Arranging a plurality of rectangular silicon solar cells in a line such that long sides of adjacent rectangular silicon solar cells overlap in an overlapping manner with a portion of conductive adhesive bonding material disposed therebetween; and

the conductive bonding material is cured to bond adjacent overlapping rectangular silicon solar cells to each other and electrically connect the cells in series.

38. The method of clause 37, including applying a conductive adhesive bonding material to the one or more silicon solar cells and then scribing one or more scribe lines with a laser on each of the one or more silicon solar cells.

39. The method of clause 37, including scribing one or more scribe lines with a laser on each of the one or more silicon solar cells and then applying a conductive adhesive bonding material to the one or more silicon solar cells.

40. A solar module, comprising:

a plurality of super cells arranged in two or more parallel rows forming a front surface of the solar module, each super cell comprising a plurality of silicon solar cells arranged in a line with end portions of adjacent silicon solar cells overlapping and conductively bonded to each other thereby electrically connecting the silicon solar cells in series, each super cell comprising a front surface terminal contact at one end of the super cell and a back surface terminal contact having an opposite polarity at an opposite end of the super cell;

Wherein the first row of super cells comprises a first super cell arranged with its front surface end contact adjacent and parallel to a first edge of the solar module, and the solar module comprises a first flexible electrical interconnect which is elongate and has the following features: extending parallel to a first edge of the solar module; conductively bonded to a front surface terminal contact of the first super cell; occupying only a narrow portion of the front surface of the solar module adjacent the first edge of the solar module; the width, measured perpendicular to the first edge of the solar module, is no more than about 1 centimeter.

41. The solar module of clause 40, wherein a portion of the first flexible electrical interconnect extends around an end of the first super cell nearest the first edge of the solar module and is located behind the first super cell.

42. The solar module of clause 40, wherein the first flexible interconnect comprises a thin strip portion conductively bonded to the front surface end contact of the first super cell, and a thicker portion extending parallel to the first edge of the solar module.

43. The solar module of clause 40, wherein the first flexible interconnect comprises a thin strip portion conductively bonded to the front surface end contact of the first super cell, and a rolled strip portion extending parallel to a first edge of the solar module.

44. The solar module of clause 40, wherein the second row of super cells comprises a second super cell arranged such that its front surface end contact is adjacent and parallel to the first edge of the solar module, and the front surface end contact of the first super cell is electrically connected to the front surface end contact of the second super cell via a first flexible electrical interconnect.

45. The solar module of clause 40, wherein the back surface end contact of the first super cell is adjacent and parallel to a second edge of the solar module opposite the first edge of the solar module, the back surface end contact comprising a second flexible electrical interconnect that is elongate and has the following characteristics: extending parallel to the second edge of the solar module; conductively bonded to a back surface end contact of the first super cell; and is located entirely behind the super cell.

46. The solar module of clause 45, wherein:

the second row of super cells comprises a second super cell arranged such that its front surface end contact is adjacent and parallel to the first edge of the solar module and its back surface end contact is adjacent and parallel to the second edge of the solar module;

The front surface end contact of the first super cell is electrically connected to the front surface end contact of the second super cell via a first flexible electrical interconnect; and

the back surface end contact of the first super cell is electrically connected to the back surface end contact of the second super cell via a second flexible electrical interconnect.

47. The solar module of clause 40, comprising:

a second super cell arranged in series with the first super cell in the first row of super cells and having a back surface end contact adjacent a second edge of the solar module opposite the first edge of the solar module; and

a second flexible electrical interconnect that is elongate and has the following features: extending parallel to the second edge of the solar module; conductively bonded to a back surface end contact of the first super cell; and is located entirely behind the super cell.

48. The solar module of clause 47, wherein:

the second row of super cells comprises a third super cell and a fourth super cell arranged in series, wherein a front surface end contact of the third super cell is adjacent to the first edge of the solar module and a back surface end contact of the fourth super cell is adjacent to the second edge of the solar module; and

The front surface end contact of the first super cell is electrically connected to the front surface end contact of the third super cell via a first flexible electrical interconnect, and the back surface end contact of the second super cell is electrically connected to the back surface end contact of the fourth super cell via a second flexible electrical interconnect.

49. The solar module of clause 40, wherein the super cells are arranged on a white back sheet, the white back sheet comprising parallel dark stripes having positions and widths corresponding to the positions and widths of the gaps between the parallel rows of super cells, and the white portions of the back sheet are not visible through the gaps between the rows.

50. The solar module of clause 40, wherein all portions of the first flexible electrical interconnect located on the front surface of the solar module are covered or dyed to mitigate visual contrast with the super cell.

51. The solar module of clause 40, wherein:

each silicon solar cell comprises:

a rectangular or substantially rectangular front and back surface, the shape of the surface being defined by oppositely disposed and parallel first and second long sides and two oppositely disposed short sides, at least part of the front surface being exposed to solar radiation during operation of the solar cell string;

A conductive front surface metallization pattern disposed on the front surface and comprising a plurality of fingers extending perpendicular to the long edges and a plurality of discrete front surface contact pads disposed in a row adjacent the first long edge, each front surface contact pad being electrically connected to at least one of the fingers; and

a conductive back surface metallization pattern disposed on the back surface and comprising a plurality of discrete back surface contact pads disposed in a row adjacent the second long edge; and

within each super cell, the silicon solar cells are arranged in a line with the first and second long sides of adjacent silicon solar cells overlapping and corresponding discrete front and back surface contact pads on adjacent silicon solar cells aligned with, overlapping and conductively bonded to each other by a conductive adhesive bonding material, thereby electrically connecting the silicon solar cells in series.

52. The solar module of clause 51, wherein the front surface metallization pattern of each silicon solar cell comprises a plurality of thin conductive lines electrically interconnecting adjacent discrete front surface contact pads, and each thin conductive line is thinner than a discrete contact pad width measured perpendicular to the long side of the solar cell.

53. The solar module of clause 51, wherein the conductive adhesive bonding material is generally localized to the locations of the discrete front surface contact pads by features of the front surface metallization pattern that form one or more barriers adjacent the discrete front surface contact pads.

54. The solar module of clause 51, wherein the conductive adhesive bonding material is generally localized to the location of the discrete back surface contact pads by features of the back surface metallization pattern that form one or more barriers adjacent the discrete back surface contact pads.

55. A method of making a solar module, the method comprising:

assembling a plurality of super cells, each super cell comprising a plurality of rectangular silicon solar cells arranged in a line with ends overlapping in an overlapping manner on the long sides of adjacent rectangular silicon solar cells;

applying heat and pressure to the super cells to cure the conductive bonding material disposed between the overlapping ends of adjacent rectangular silicon solar cells, thereby bonding the adjacent overlapping rectangular silicon solar cells to each other and electrically connecting the cells in series;

arranging and interconnecting the super cells into a stacked stack with encapsulant in a desired solar module configuration; and

Heat and pressure are applied to the stack to form a laminate structure.

56. The method of clause 55, including curing or partially curing the electrically conductive bonding material by applying heat and pressure to the super cell prior to applying heat and pressure to the stacked stack to form the laminate structure, thereby forming a cured or partially cured super cell as an intermediate product prior to forming the laminate structure.

57. The method of clause 56, wherein when each additional rectangular silicon solar cell is added to the super cell during assembly of the super cell, the conductive adhesive bonding material between the newly added solar cell and the adjacent overlapping solar cell is cured or partially cured before another rectangular silicon solar cell is added to the super cell.

58. The method of clause 56, including curing or partially curing all of the conductive bonding material in the super cell in the same step.

59. The method of clause 56, including:

partially curing the electrically conductive bonding material by applying heat and pressure to the super cell prior to applying heat and pressure to the stack to form a laminate structure, thereby forming a partially cured super cell as an intermediate product prior to forming the laminate structure; and

Curing of the conductive bonding material is completed while applying heat and pressure to the stack of layers to form a laminated structure.

60. The method of clause 55, including curing the conductive bonding material while applying heat and pressure to the stacked stack to form the laminate structure, without forming a cured or partially cured super cell as an intermediate product prior to forming the laminate structure.

61. The method of clause 55, comprising cutting one or more silicon solar cells into a rectangular shape to provide rectangular silicon solar cells.

62. The method of clause 61, comprising applying a conductive adhesive bonding material to the one or more silicon solar cells prior to cutting the one or more silicon solar cells to provide rectangular silicon solar cells pre-applied with the conductive adhesive bonding material.

63. The method of clause 62, including applying a conductive adhesive bonding material to one or more silicon solar cells, then scribing one or more lines with a laser on each of the one or more silicon solar cells, and then cutting the one or more silicon solar cells along the scribed lines.

64. The method of clause 62, comprising scribing one or more lines with a laser on each of the one or more silicon solar cells, then applying a conductive adhesive bonding material onto the one or more silicon solar cells, and then cutting the one or more silicon solar cells along the scribe lines.

65. The method of clause 62, wherein applying a conductive adhesive bonding material onto the top surface of each of the one or more silicon solar cells and not onto the oppositely disposed bottom surface of each of the one or more silicon solar cells comprises applying a vacuum between the bottom surface of the one or more silicon solar cells and the curved support surface to bend the one or more silicon solar cells against the curved support surface to cut the one or more silicon solar cells along the scribe line.

66. The method of clause 61, comprising applying a conductive adhesive bonding material to the rectangular silicon solar cells after cutting the one or more silicon solar cells to provide rectangular silicon solar cells.

67. The method of clause 55, wherein the conductive adhesive bonding material has a glass transition temperature less than or equal to about 0 ℃.

1A. A solar module, comprising:

a plurality of super cells arranged in two or more parallel rows forming a front surface of the solar module, each super cell comprising a plurality of silicon solar cells arranged in a line with end portions of adjacent silicon solar cells overlapping and conductively bonded to each other thereby electrically connecting the silicon solar cells in series, each super cell comprising a front surface terminal contact at one end of the super cell and a back surface terminal contact having an opposite polarity at an opposite end of the super cell;

wherein the first row of super cells comprises a first super cell arranged with its front surface end contact adjacent and parallel to a first edge of the solar module, and the solar module comprises a first flexible electrical interconnect which is elongate and has the following features: extending parallel to a first edge of the solar module; conductively bonded to a front surface terminal contact of the first super cell; occupies only a narrow portion of the front surface of the solar module adjacent the first edge of the solar module; the width, measured perpendicular to the first edge of the solar module, is no more than about 1 centimeter.

2A. The solar module of clause 1A, wherein a portion of the first flexible electrical interconnect extends around an end of the first super cell nearest the first edge of the solar module and is located behind the first super cell.

3A. The solar module of clause 1A, wherein the first flexible interconnect includes a thin strip portion conductively bonded to the front surface end contact of the first super cell, and a thicker portion extending parallel to the first edge of the solar module.

4A. The solar module of clause 1A, wherein the first flexible interconnect comprises a thin strip portion conductively bonded to the front surface end contact of the first super cell, and a rolled strip portion extending parallel to a first edge of the solar module.

5A. The solar module of clause 1A, wherein the second row of super cells comprises a second super cell arranged such that its front surface end contact is adjacent and parallel to the first edge of the solar module, and the front surface end contact of the first super cell is electrically connected to the front surface end contact of the second super cell via a first flexible electrical interconnect.

6A. The solar module of clause 1A, wherein a back surface end contact of a first super cell is adjacent and parallel to a second edge of the solar module opposite the first edge of the solar module, the back surface end contact comprising a second flexible electrical interconnect that is elongated and has the following characteristics: extending parallel to the second edge of the solar module; conductively bonded to a back surface end contact of the first super cell; and is located entirely behind the super cell.

7A. The solar module of clause 6A, wherein:

the second row of super cells comprises a second super cell arranged such that its front surface end contact is adjacent and parallel to the first edge of the solar module and its back surface end contact is adjacent and parallel to the second edge of the solar module;

the front surface end contact of the first super cell is electrically connected to the front surface end contact of the second super cell via a first flexible electrical interconnect; and

the back surface end contact of the first super cell is electrically connected to the back surface end contact of the second super cell via a second flexible electrical interconnect.

8A. The solar module of clause 1A, comprising:

a second super cell arranged in series with the first super cell in the first row of super cells and having a back surface end contact adjacent a second edge of the solar module opposite the first edge of the solar module; and

a second flexible electrical interconnect that is elongate and has the following features: extending parallel to the second edge of the solar module; conductively bonded to a back surface end contact of the first super cell; and is located entirely behind the super cell.

9A. The solar module of clause 8A, wherein:

the second row of super cells comprises a third super cell and a fourth super cell arranged in series, wherein a front surface end contact of the third super cell is adjacent to the first edge of the solar module and a back surface end contact of the fourth super cell is adjacent to the second edge of the solar module; and

the front surface end contact of the first super cell is electrically connected to the front surface end contact of the third super cell via a first flexible electrical interconnect, and the back surface end contact of the second super cell is electrically connected to the back surface end contact of the fourth super cell via a second flexible electrical interconnect.

10A. The solar module of clause 1A, wherein away from the outer edge of the solar module, there are no electrical interconnections between the super cells that would reduce the active area of the front surface of the module.

11A. The solar module of clause 1A, wherein at least one pair of super cells are arranged in a line in a row, and the back surface contact end of one of the pair of super cells is adjacent to the back surface contact end of the other of the pair of super cells.

12A. The solar module of clause 1A, wherein:

at least one pair of super cells arranged in a line in a row, and adjacent ends of the two super cells having end contacts of opposite polarity;

the adjacent ends of the pair of super cells overlap; and

the super cells of the pair of super cells are electrically connected in series by a flexible interconnect, the first interconnect being sandwiched between overlapping ends of the super cells and not obscuring the front surface.

13A. The solar module of clause 1A, wherein the super cells are arranged on a white back sheet, the white backing sheet comprises parallel dark stripes having positions and widths corresponding to the positions and widths of the gaps between the parallel rows of super cells, and the white portions of the backing sheet are not visible through the gaps between the rows.

14A. The solar module of clause 1A, wherein all portions of the first flexible electrical interconnect on the front surface of the solar module are covered or dyed to mitigate visual contrast with the super cell.

15A. The solar module of clause 1A, wherein:

each silicon solar cell comprises:

a rectangular or substantially rectangular front and back surface, the shape of the surface being defined by oppositely disposed and parallel first and second long sides and two oppositely disposed short sides, at least part of the front surface being exposed to solar radiation during operation of the solar cell string;

a conductive front surface metallization pattern disposed on the front surface and comprising a plurality of fingers extending perpendicular to the long edges and a plurality of discrete front surface contact pads disposed in a row adjacent the first long edge, each front surface contact pad being electrically connected to at least one of the fingers; and

a conductive back surface metallization pattern disposed on the back surface and comprising a plurality of discrete back surface contact pads disposed in a row adjacent the second long edge; and

within each super cell, the silicon solar cells are arranged in a line with the first and second long sides of adjacent silicon solar cells overlapping and corresponding discrete front and back surface contact pads on adjacent silicon solar cells aligned with, overlapping and conductively bonded to each other by a conductive adhesive bonding material, thereby electrically connecting the silicon solar cells in series.

16A. The solar module of clause 15A, wherein the front surface metallization pattern of each silicon solar cell comprises a plurality of thin conductive lines electrically interconnecting adjacent discrete front surface contact pads, and each thin conductive line is thinner than a discrete contact pad width measured perpendicular to the long side of the solar cell.

17A. The solar module of clause 15A, wherein the conductive adhesive bonding material is generally localized to the locations of the discrete front surface contact pads by features of the front surface metallization pattern that form a barrier around each discrete front surface contact pad.

18A. The solar module of clause 15A, wherein the conductive adhesive bonding material is generally localized to the locations of the discrete back surface contact pads by features of the back surface metallization pattern that form a barrier around each discrete back surface contact pad.

19A. The solar module of clause 15A, wherein the discrete back surface contact pads are discrete silver back surface contact pads, and the back surface metallization pattern of each silicon solar cell does not include silver contacts at any location under a portion of the front surface of the solar cell that does not overlap an adjacent silicon solar cell, other than the discrete silver back surface contact pads.

20A. A solar module, comprising:

a plurality of super cells, each super cell comprising a plurality of silicon solar cells arranged in a line, wherein ends of adjacent silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series;

wherein each silicon solar cell comprises:

a rectangular or substantially rectangular front and back surface, the shape of the surface being defined by oppositely disposed and parallel first and second long sides and two oppositely disposed short sides, at least part of the front surface being exposed to solar radiation during operation of the solar cell string;

a conductive front surface metallization pattern disposed on the front surface and comprising a plurality of fingers extending perpendicular to the long edges and a plurality of discrete front surface contact pads disposed in a row adjacent the first long edge;

each front surface contact pad electrically connected to at least one of the fingers; and a conductive back surface metallization pattern disposed on the back surface and comprising a plurality of discrete back surface contact pads disposed in a row adjacent the second long side;

wherein within each super cell, the silicon solar cells are arranged in a line with the first and second long sides of adjacent silicon solar cells overlapping and corresponding discrete front and back surface contact pads on adjacent silicon solar cells aligned with, overlapping and conductively bonded to each other by a conductive adhesive bonding material, thereby electrically connecting the silicon solar cells in series. And

Wherein the super cells are arranged in a single row or two or more parallel rows substantially across the length or width of the solar module, forming a solar module front surface to be irradiated by solar radiation during operation of the solar module.

21A. The solar module of clause 20A, wherein the discrete back surface contact pads are discrete silver back surface contact pads, and the back surface metallization pattern of each silicon solar cell does not include silver contacts at any location under a portion of the front surface of the solar cell that does not overlap an adjacent silicon solar cell, other than the discrete silver back surface contact pads.

22A. The solar module of clause 20A, wherein the front surface metallization pattern of each silicon solar cell comprises a plurality of thin conductive lines electrically interconnecting adjacent discrete front surface contact pads, and each thin conductive line is thinner than a discrete contact pad width measured perpendicular to the long side of the solar cell.

23A. The solar module of clause 20A, wherein the conductive adhesive bonding material is generally localized to the locations of the discrete front surface contact pads by features of the front surface metallization pattern that form a barrier around each discrete front surface contact pad.

24A. The solar module of clause 20A, wherein the conductive adhesive bonding material is generally localized to the locations of the discrete back surface contact pads by features of the back surface metallization pattern that form a barrier around each discrete back surface contact pad.

25A. A super cell, comprising:

a plurality of silicon solar cells, each silicon solar cell comprising:

a rectangular or substantially rectangular front and back surface, the shape of the surface being defined by oppositely disposed and parallel first and second long sides and two oppositely disposed short sides, at least part of the front surface being exposed to solar radiation during operation of the solar cell string;

a conductive front surface metallization pattern disposed on the front surface and comprising a plurality of fingers extending perpendicular to the long edges and a plurality of discrete front surface contact pads disposed in a row adjacent the first long edge, each front surface contact pad being electrically connected to at least one of the fingers; and

a conductive back surface metallization pattern disposed on the back surface and comprising a plurality of discrete silver back surface contact pads disposed in rows adjacent the second long edge;

wherein the silicon solar cells are arranged in a line with the first and second long sides of adjacent silicon solar cells overlapping and corresponding discrete front and back surface contact pads on adjacent silicon solar cells aligned with, overlapping and conductively bonded to each other by a conductive adhesive bonding material, thereby electrically connecting the silicon solar cells in series.

26A. The solar module of clause 25A, wherein the discrete back surface contact pads are discrete silver back surface contact pads, and the back surface metallization pattern of each silicon solar cell does not include silver contacts at any location under a portion of the front surface of the solar cell that does not overlap an adjacent silicon solar cell, other than the discrete silver back surface contact pads.

27A. The string of solar cells of clause 25A, wherein the front surface metallization pattern comprises a plurality of thin conductive lines electrically interconnecting adjacent discrete front surface contact pads, and each thin conductive line is thinner than a discrete contact pad width measured perpendicular to the long side of the solar cell.

28A. The string of solar cells of clause 25A, wherein the conductive adhesive bonding material is substantially localized to the locations of the discrete front surface contact pads by features of the front surface metallization pattern that form a barrier around each discrete front surface contact pad.

29A. The string of solar cells of clause 25A, wherein the conductive adhesive bonding material is generally localized to the locations of the discrete back surface contact pads by features of the back surface metallization pattern that form a barrier around each discrete back surface contact pad.

30A. The solar cell string of clause 25A, wherein the conductive adhesive bonding material has a glass transition temperature of less than or equal to about 0 ℃.

31A. A method of making a solar module, the method comprising:

assembling a plurality of super cells, each super cell comprising a plurality of rectangular silicon solar cells arranged in a line with ends overlapping in an overlapping manner on the long sides of adjacent rectangular silicon solar cells;

applying heat and pressure to the super cells to cure the conductive bonding material disposed between the overlapping ends of adjacent rectangular silicon solar cells, thereby bonding the adjacent overlapping rectangular silicon solar cells to each other and electrically connecting the cells in series;

arranging and interconnecting the super cells into a stacked stack with encapsulant in a desired solar module configuration; and

heat and pressure are applied to the stack to form a laminate structure.

32A. The method of clause 31A, including curing or partially curing the conductive bonding material by applying heat and pressure to the super cell prior to applying heat and pressure to the stacked stack to form the laminate structure, thereby forming a cured or partially cured super cell as an intermediate product prior to forming the laminate structure.

33A. The method of clause 32A, wherein when each additional rectangular silicon solar cell is added to the super cell during assembly of the super cell, the conductive adhesive bonding material between the newly added solar cell and the adjacent overlapping solar cell is cured or partially cured before another rectangular silicon solar cell is added to the super cell.

34A. The method of clause 32A, including curing or partially curing all of the conductive bonding material in the super cell in the same step.

35A. The method of clause 32A, including:

partially curing the electrically conductive bonding material by applying heat and pressure to the super cell prior to applying heat and pressure to the stack to form a laminate structure, thereby forming a partially cured super cell as an intermediate product prior to forming the laminate structure; and

curing of the conductive bonding material is completed while applying heat and pressure to the stack of layers to form a laminated structure.

36A. The method of clause 31A, including curing the conductive bonding material while applying heat and pressure to the stacked stack to form the laminate structure without forming a cured or partially cured super cell as an intermediate product prior to forming the laminate structure.

37A. The method of clause 31A, comprising cutting one or more silicon solar cells into a rectangular shape to provide rectangular silicon solar cells.

38A. The method of clause 37A, comprising applying a conductive adhesive bonding material to one or more silicon solar cells prior to cutting the one or more silicon solar cells to provide rectangular silicon solar cells pre-applied with conductive adhesive bonding material.

39A. The method of clause 38A, including applying a conductive adhesive bonding material to one or more silicon solar cells, then scribing one or more lines with a laser on each of the one or more silicon solar cells, and then cutting the one or more silicon solar cells along the scribe lines.

40A. The method of clause 38A, comprising scribing one or more lines with a laser on each of the one or more silicon solar cells, then applying a conductive adhesive bonding material to the one or more silicon solar cells, and then cutting the one or more silicon solar cells along the scribe lines.

41A. The method of clause 38A, wherein applying a conductive adhesive bonding material onto the top surface of each of the one or more silicon solar cells and not onto the oppositely disposed bottom surface of each of the one or more silicon solar cells comprises applying a vacuum between the bottom surface of the one or more silicon solar cells and the curved support surface to bend the one or more silicon solar cells against the curved support surface to cut the one or more silicon solar cells along the scribe line.

42A. The method of clause 37A, including applying a conductive adhesive bonding material to a rectangular silicon solar cell after dicing one or more silicon solar cells to provide rectangular silicon solar cells.

43A. The method of clause 31A, wherein the conductive adhesive bonding material has a glass transition temperature less than or equal to about 0 ℃.

44A. A method of fabricating a solar cell, the method comprising:

scribing one or more scribe lines with a laser on each of the one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells; applying a conductive adhesive bonding material to one or more scribed silicon solar cells at one or more locations adjacent a long side of each rectangular region;

dividing the silicon solar cells along the drawing lines to obtain a plurality of rectangular silicon solar cells, wherein a part of conductive adhesive bonding material is arranged on the front surface of each rectangular silicon solar cell and is adjacent to the long side;

arranging a plurality of rectangular silicon solar cells in a line such that long sides of adjacent rectangular silicon solar cells overlap in an overlapping manner with a portion of conductive adhesive bonding material disposed therebetween; and

The conductive bonding material is cured to bond adjacent overlapping rectangular silicon solar cells to each other and electrically connect the cells in series.

45A. A method of fabricating a solar cell, the method comprising:

laser scribing one or more scribe lines on each of the one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells, each solar cell comprising a top surface and an oppositely disposed bottom surface;

applying a conductive adhesive bonding material to portions of the top surface of the one or more silicon solar cells;

applying a vacuum between the bottom surface of the one or more silicon solar cells and the curved support surface to bend the one or more silicon solar cells against the curved support surface to cause the one or more silicon solar cells to be cut along the scribe lines, thereby resulting in a plurality of rectangular silicon solar cells, each having a portion of electrically conductive adhesive bonding material disposed on a front surface thereof adjacent the long sides;

arranging a plurality of rectangular silicon solar cells in a line such that long sides of adjacent rectangular silicon solar cells overlap in an overlapping manner with a portion of conductive adhesive bonding material disposed therebetween; and

The conductive bonding material is cured to bond adjacent overlapping rectangular silicon solar cells to each other and electrically connect the cells in series.

46A. A method of fabricating a solar cell, the method comprising:

cutting one or more quasi-square silicon wafers along a plurality of lines parallel to the long edge of each wafer to form a plurality of rectangular silicon solar cells, wherein the length of each silicon solar cell along its long axis is substantially equal; and

arranging rectangular silicon solar cells in a line with long sides of adjacent solar cells overlapping and conductively bonded to each other, thereby electrically connecting the solar cells in series;

wherein the plurality of rectangular silicon solar cells comprises: at least one rectangular solar cell having two chamfers, the chamfers corresponding to corners or a portion of corners of a quasi-square wafer; and one or more rectangular silicon solar cells each lacking a chamfer. And

wherein the spacing between parallel lines along which the aligned square wafers are cut is selected so as to compensate for the chamfer by making the width perpendicular to the long axis of the rectangular silicon solar cell including the chamfer larger than the width perpendicular to the long axis of the rectangular silicon solar cell lacking the chamfer; therefore, during operation of the solar cell string, the front surface of each of the plurality of rectangular silicon solar cells in the solar cell string is substantially equal in area exposed to sunlight.

47A. A super-battery comprising:

a plurality of silicon solar cells arranged in a line, wherein end portions of adjacent solar cells overlap and are conductively bonded to each other, thereby electrically connecting the solar cells in series;

wherein at least one silicon solar cell has a chamfer corresponding to a corner or a portion of a corner of a quasi-square silicon wafer from which the silicon solar cell is cut; at least one silicon solar cell lacks a chamfer; during operation of the string of solar cells, the front surface of each silicon solar cell is exposed to sunlight over substantially equal areas.

48A. A method of fabricating two or more super cells, the method comprising:

cutting one or more quasi-square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form a first plurality of rectangular silicon solar cells having a chamfer corresponding to a corner or a portion of a corner of the quasi-square silicon wafer, and a second plurality of rectangular silicon solar cells lacking a chamfer, each cell of the second plurality of rectangular silicon solar cells having a first length spanning a full width of the quasi-square silicon wafer;

Removing the chamfer from each of the first plurality of rectangular silicon solar cells to form a third plurality of rectangular silicon solar cells lacking chamfers, each of the third plurality of rectangular silicon solar cells having a second length that is shorter than the first length;

arranging a second plurality of rectangular silicon solar cells in a line with long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, while electrically connecting the second plurality of rectangular silicon solar cells in series, thereby forming a solar cell string having a width equal to the first length; and

the third plurality of rectangular silicon solar cells are arranged in a line with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and are electrically connected in series, thereby forming a solar cell string having a width equal to the second length.

49A. A method of fabricating two or more super cells, the method comprising:

cutting one or more quasi-square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form a first plurality of rectangular silicon solar cells having a chamfer corresponding to a corner or a portion of a corner of the quasi-square silicon wafer, and a second plurality of rectangular silicon solar cells lacking a chamfer;

Arranging a first plurality of rectangular silicon solar cells in a line with long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, while electrically connecting the first plurality of rectangular silicon solar cells in series; and

the second plurality of rectangular silicon solar cells are arranged in a line with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, while the second plurality of rectangular silicon solar cells are electrically connected in series.

50A. A solar module, comprising:

a string of N ≧ 25 rectangular or substantially rectangular solar cells connected in series, the solar cells having, on average, a breakdown voltage greater than about 10 volts, the solar cells grouped into one or more super cells, each super cell comprising two or more solar cells arranged in a line with the long sides of adjacent solar cells overlapping and conductively bonded to each other with an adhesive that is both electrically and thermally conductive;

wherein no single solar cell or a total of less than N solar cell groups are individually electrically connected in parallel with a bypass diode in the string of solar cells.

51A. The solar module of clause 50A, wherein N is greater than or equal to 30.

52A. The solar module of clause 50A, wherein N is greater than or equal to 50.

53A. The solar module of clause 50A, wherein N is greater than or equal to 100.

54A. The solar module of clause 50A, wherein the adhesive forms a bond between adjacent solar cells, the bond having a thickness perpendicular to the solar cells of less than or equal to about 0.1mm and a thermal conductivity perpendicular to the solar cells of greater than or equal to about 1.5 w/m/k.

55A. The solar module of clause 50A, wherein the N solar cells are grouped into a single super cell.

56A. The solar module of clause 50A, wherein the solar cells are silicon solar cells.

57A. A solar module, comprising:

a super cell spanning substantially the entire length or width of the solar module parallel to an edge of the solar module, the super cell comprising a string of N rectangular or substantially rectangular solar cells connected in series, the solar cells having an average breakdown voltage greater than about 10 volts, the solar cells arranged in a line with long sides of adjacent solar cells overlapping and conductively bonded to each other with an adhesive that is both electrically and thermally conductive;

Wherein no single solar cell or a total of less than N solar cell groups are individually electrically connected in parallel with the bypass diode in the super cell.

58A. The solar module of clause 57A, wherein N > 24.

59A. The solar module of clause 57A, wherein the super cell has a length in the direction of current flow of at least about 500 mm.

60A. A super cell, comprising:

a plurality of silicon solar cells, each silicon solar cell comprising:

a rectangular or substantially rectangular front and back surface, the shape of the surface being defined by oppositely disposed and parallel first and second long sides and two oppositely disposed short sides, at least part of the front surface being exposed to solar radiation during operation of the solar cell string;

a conductive front surface metallization pattern disposed on the front surface and comprising at least one front surface contact pad disposed adjacent the first long side; and

a conductive back surface metallization pattern disposed on the back surface and including at least one back surface contact pad disposed adjacent the second long side;

wherein the silicon solar cells are arranged in a line with the first and second long sides of adjacent silicon solar cells overlapping, and the front and back surface contact pads on adjacent silicon solar cells overlapping and conductively bonded to each other by a conductive adhesive bonding material, thereby electrically connecting the silicon solar cells in series. And

Wherein the front surface metallization pattern of each silicon solar cell comprises a barrier configured to substantially confine the conductive adhesive bonding material to at least one front surface contact pad prior to curing of the conductive adhesive bonding material during fabrication of the super cell.

61A. The super-cell of clause 60A, wherein for each pair of adjacent and overlapping silicon solar cells, the barrier on the front surface of one of the silicon solar cells overlaps and is hidden by a portion of the other silicon solar cell, thereby substantially confining the conductive adhesive bonding material to the overlapping region of the front surfaces of the silicon solar cells prior to curing of the conductive adhesive bonding material during fabrication of the super-cell.

62A. The super cell of clause 60A, wherein the barrier comprises a continuous conductive line parallel to and running substantially the entire length of the first long side, wherein the at least one front surface contact pad is located between the continuous conductive line and the first long side of the solar cell.

63A. The super cell of clause 62A, wherein the front surface metallization pattern comprises fingers electrically connected to the at least one front surface contact pad and running perpendicular to the first long side, and a continuous conductive line electrically interconnects the fingers to provide a plurality of conductive paths from each finger to the at least one front surface contact pad.

64A. The super cell of clause 60A, wherein the front surface metallization pattern comprises a plurality of discrete contact pads arranged in a row adjacent and parallel to the first long side, and the barrier comprises a plurality of features that form a separate barrier for each discrete contact pad that substantially confines the conductive adhesive bonding material to the discrete contact pads prior to curing of the conductive adhesive bonding material during manufacture of the super cell.

65A. The super cell of clause 64A, wherein the individual barriers abut and are higher than the corresponding discrete contact pads.

66A. A super cell, comprising:

a plurality of silicon solar cells, each silicon solar cell comprising:

a rectangular or substantially rectangular front and back surface, the shape of the surface being defined by oppositely disposed and parallel first and second long sides and two oppositely disposed short sides, at least part of the front surface being exposed to solar radiation during operation of the solar cell string;

a conductive front surface metallization pattern disposed on the front surface and comprising at least one front surface contact pad disposed adjacent the first long side; and

A conductive back surface metallization pattern disposed on the back surface and including at least one back surface contact pad disposed adjacent the second long side;

wherein the silicon solar cells are arranged in a line with the first and second long sides of adjacent silicon solar cells overlapping, and the front and back surface contact pads on adjacent silicon solar cells overlapping and conductively bonded to each other by a conductive adhesive bonding material, thereby electrically connecting the silicon solar cells in series. And

wherein the back surface metallization pattern of each silicon solar cell comprises a barrier configured to substantially confine the conductive adhesive bonding material to at least one back surface contact pad prior to curing of the conductive adhesive bonding material during fabrication of the super cell.

67A. The super cell of clause 66A, wherein the back surface metallization pattern comprises one or more discrete contact pads arranged in a row adjacent and parallel to the second long side, and the barrier comprises a plurality of features that form a separate barrier for each discrete contact pad that substantially confines the conductive adhesive bonding material to the discrete contact pads prior to curing of the conductive adhesive bonding material during manufacture of the super cell.

68A. The super cell of clause 67A, wherein the individual barriers abut and are higher than the corresponding discrete contact pads.

69A. A method of fabricating a string of solar cells, the method comprising:

cutting one or more quasi-square silicon wafers along a plurality of lines parallel to the long edge of each wafer to form a plurality of rectangular silicon solar cells, wherein the length of each silicon solar cell along its long axis is substantially equal; and

arranging rectangular silicon solar cells in a line with long sides of adjacent solar cells overlapping and conductively bonded to each other, thereby electrically connecting the solar cells in series;

wherein the plurality of rectangular silicon solar cells comprises: at least one rectangular solar cell having two chamfers, the chamfers corresponding to corners or a portion of corners of a quasi-square wafer; and one or more rectangular silicon solar cells each lacking a chamfer. And

wherein the spacing between parallel lines along which the aligned square wafers are cut is selected so as to compensate for the chamfer by making the width perpendicular to the long axis of the rectangular silicon solar cell including the chamfer larger than the width perpendicular to the long axis of the rectangular silicon solar cell lacking the chamfer; therefore, during operation of the solar cell string, the front surface of each of the plurality of rectangular silicon solar cells in the solar cell string is substantially equal in area exposed to sunlight.

70A. A string of solar cells, comprising:

a plurality of silicon solar cells arranged in a line, wherein end portions of adjacent solar cells overlap and are conductively bonded to each other, thereby electrically connecting the solar cells in series;

wherein at least one silicon solar cell has a chamfer corresponding to a corner or a portion of a corner of a quasi-square silicon wafer from which the silicon solar cell is cut; at least one silicon solar cell lacks a chamfer; during operation of the solar cell string, the area of the front surface of each silicon solar cell exposed to sunlight is substantially equal.

71A. A method of fabricating two or more strings of solar cells, the method comprising:

cutting one or more quasi-square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form a first plurality of rectangular silicon solar cells having a chamfer corresponding to a corner or a portion of a corner of the quasi-square silicon wafer, and a second plurality of rectangular silicon solar cells lacking a chamfer, each cell of the second plurality of rectangular silicon solar cells having a first length spanning a full width of the quasi-square silicon wafer;

Removing the chamfer from each of the first plurality of rectangular silicon solar cells to form a third plurality of rectangular silicon solar cells lacking chamfers, each of the third plurality of rectangular silicon solar cells having a second length that is shorter than the first length;

arranging a second plurality of rectangular silicon solar cells in a line with long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, while electrically connecting the second plurality of rectangular silicon solar cells in series, thereby forming a solar cell string having a width equal to the first length; and

the third plurality of rectangular silicon solar cells are arranged in a line with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and are electrically connected in series, thereby forming a solar cell string having a width equal to the second length.

72A. A method of fabricating two or more strings of solar cells, the method comprising:

cutting one or more quasi-square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form a first plurality of rectangular silicon solar cells having a chamfer corresponding to a corner or a portion of a corner of the quasi-square silicon wafer, and a second plurality of rectangular silicon solar cells lacking a chamfer;

Arranging a first plurality of rectangular silicon solar cells in a line with long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, while electrically connecting the first plurality of rectangular silicon solar cells in series; and

the second plurality of rectangular silicon solar cells are arranged in a line with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, while the second plurality of rectangular silicon solar cells are electrically connected in series.

73A. A method of making a solar module, the method comprising:

cutting each of one or more quasi-square silicon wafers along a plurality of lines parallel to a long edge of the wafer to form a plurality of rectangular silicon solar cells having chamfers from the plurality of quasi-square silicon wafers, and a plurality of rectangular silicon solar cells lacking chamfers, wherein the chamfers correspond to corners of the quasi-square silicon wafers;

arranging at least some of the rectangular silicon solar cells lacking chamfers, forming a first plurality of super cells, each super cell comprising only rectangular silicon solar cells lacking chamfers arranged in a line, wherein the long sides of the rectangular silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series;

Arranging at least some of the rectangular silicon solar cells with chamfers, forming a second plurality of super cells, each super cell comprising only rectangular silicon solar cells with chamfers arranged in a line, wherein long sides of the rectangular silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series; and

arranging the super cells in parallel rows of super cells having substantially equal lengths forming a front surface of the solar module, wherein each row comprises only super cells of the first plurality of super cells or only super cells of the second plurality of super cells.

74A. The solar module of clause 73A, wherein two of the rows of super cells adjacent to the parallel opposing edges of the solar module comprise only super cells of the second plurality of super cells, and all other rows of super cells comprise only super cells of the first plurality of super cells.

75A. The solar module of clause 74A, wherein the solar module comprises a total of six rows of super cells.

76A. A super cell, comprising:

a plurality of silicon solar cells arranged in a line in a first direction, wherein end portions of adjacent silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series; and

An elongated flexible electrical interconnect having a long axis oriented parallel to a second direction perpendicular to the first direction, the elongated flexible electrical interconnect having the following features:

conductively bonded to the front or back surface of the end one silicon solar cell at three or more discrete locations arranged along the second direction; extending at least the full width of the terminal solar cell in a second direction; a wire thickness of less than or equal to about 100 micrometers measured perpendicular to a front surface or a back surface of the terminal silicon solar cell; providing a resistance of less than or equal to about 0.012 ohms to current flowing in a second direction; is configured to provide flexibility that accommodates differential expansion between the terminal silicon solar cell and the electrical interconnect in a second direction over a temperature range of about-40 ℃ to about 85 ℃.

77A. The super cell of clause 76A, wherein the lead thickness of the flexible electrical interconnect is less than or equal to about 30 microns measured perpendicular to the front and back surfaces of the terminal silicon solar cell.

78A. The super cell according to clause 76A, wherein the flexible electrical interconnect extends beyond the super cell in the second direction to provide electrical interconnection in the solar module for at least a second super cell disposed in parallel adjacent to the super cell.

79A. The super cell according to clause 76A, wherein the flexible electrical interconnect extends beyond the super cell in a first direction to provide electrical interconnection in the solar module for a second super cell disposed in line parallel with the super cell.

80A. A solar module, comprising:

a plurality of super cells arranged in two or more parallel rows spanning a width equal to the module, thereby forming a front surface of the module, each super cell comprising a plurality of silicon solar cells arranged in a line with ends of adjacent silicon solar cells overlapping and conductively bonded to each other, thereby electrically connecting the silicon solar cells in series;

wherein at least one end of a first super cell in a first row adjacent to an edge of the module is electrically connected to one end of a second super cell in a second row adjacent to the same edge of the module via a flexible electrical interconnect having the following features: bonding to the front surface of the first super cell at a plurality of discrete locations by a conductive adhesive bonding material; extending parallel to the edges of the module; at least a portion of which is folded around the one end of the first super cell and is thus not visible from the front of the module.

81A. The solar module of clause 80A, wherein a surface of the flexible electrical interconnect on the front surface of the module is covered or dyed to mitigate visual contrast with the super cell.

82A. The solar module of clause 80A, wherein the two or more parallel rows of super cells are arranged on a white backing sheet forming a solar module front surface to be irradiated by solar radiation during operation of the solar module, the white backing sheet comprising parallel dark stripes having a position and a width corresponding to the position and the width of the gaps between the parallel rows of super cells, and the white portions of the backing sheet are not visible through the gaps between the rows.

83A. A method of fabricating a string of solar cells, the method comprising:

scribing one or more scribe lines with a laser on each of the one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells;

applying a conductive adhesive bonding material to the one or more scribed silicon solar cells at one or more locations adjacent the long side of each rectangular region;

dividing the silicon solar cells along the drawing lines to obtain a plurality of rectangular silicon solar cells, wherein a part of conductive adhesive bonding material is arranged on the front surface of each rectangular silicon solar cell and is adjacent to the long side;

Arranging a plurality of rectangular silicon solar cells in a line such that long sides of adjacent rectangular silicon solar cells overlap in an overlapping manner with a portion of conductive adhesive bonding material disposed therebetween; and

the conductive bonding material is cured to bond adjacent overlapping rectangular silicon solar cells to each other and electrically connect the cells in series.

84A. A method of fabricating a string of solar cells, the method comprising:

laser scribing one or more scribe lines on each of the one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells, each solar cell comprising a top surface and an oppositely disposed bottom surface;

applying a conductive adhesive bonding material to portions of the top surface of the one or more silicon solar cells;

applying a vacuum between the bottom surface of the one or more silicon solar cells and the curved support surface to bend the one or more silicon solar cells against the curved support surface to cause the one or more silicon solar cells to be cut along the scribe lines, thereby resulting in a plurality of rectangular silicon solar cells, each having a portion of electrically conductive adhesive bonding material disposed on a front surface thereof adjacent the long sides;

Arranging a plurality of rectangular silicon solar cells in a line such that long sides of adjacent rectangular silicon solar cells overlap in an overlapping manner with a portion of conductive adhesive bonding material disposed therebetween; and

the conductive bonding material is cured to bond adjacent overlapping rectangular silicon solar cells to each other and electrically connect the cells in series.

85A. The method of clause 84A, including applying a conductive adhesive bonding material to the one or more silicon solar cells and then scribing one or more scribe lines with a laser on each of the one or more silicon solar cells.

86A. The method of clause 84A, including scribing one or more scribe lines with a laser on each of the one or more silicon solar cells and then applying a conductive adhesive bonding material to the one or more silicon solar cells.

1B. An apparatus, comprising:

a string of at least 25 solar cells connected in series, the string of solar cells connected in parallel with a common bypass diode, each solar cell having a breakdown voltage greater than about 10 volts and grouped into a super cell comprising the solar cells, the solar cells arranged such that long sides of adjacent solar cells overlap and are conductively joined by an adhesive.

And 2B. The apparatus of clause 1B, wherein N is greater than or equal to 30.

And 3B. The apparatus of clause 1B, wherein N is greater than or equal to 50.

4B. The apparatus of clause 1B, wherein N is greater than or equal to 100.

And 5B. The apparatus of clause 1B, wherein the adhesive has a thickness of less than or equal to about 0.1mm and has a thermal conductivity of greater than or equal to about 1.5W/m/K.

6B. The apparatus of clause 1B, wherein the N solar cells are grouped into a single super cell.

7B. The apparatus of clause 1B, wherein the N solar cells are grouped into a plurality of super cells on the same backing.

8B. The apparatus of clause 1B, wherein the solar cell is a silicon solar cell.

9B. The device of clause 1B, wherein the super cell has a length in the direction of current flow of at least about 500 mm.

10B. The device of clause 1B, wherein the super battery includes a feature configured to limit adhesive spreading.

11B. The apparatus of clause 10B, wherein the feature comprises a raised feature.

12B. The apparatus of clause 10B, wherein the feature comprises metallization.

13B. The apparatus of clause 12B, wherein the metallization comprises a line extending the full length of the first long side, the apparatus further comprising at least one contact pad located between the line and the first long side.

14B. The apparatus of clause 13B, wherein:

the metallization further comprises a finger electrically connected to the at least one contact pad and extending perpendicular to the first long side; and

conductive lines interconnect the fingers.

15B, and (3). The apparatus of clause 10B, wherein the feature is located on a front side of the solar cell.

16B. The apparatus of clause 10B, wherein the feature is located on a back side of the solar cell.

17B. The apparatus of clause 10B, wherein the feature comprises a recessed feature.

18B. The apparatus of clause 10B, wherein the feature is hidden by an adjacent solar cell of the super cell.

19B. The device of clause 1B, wherein a first solar cell of the super cell has a chamfer, a second solar cell of the super cell lacks a chamfer, and the first and second solar cells have the same area exposed to sunlight.

20B. The apparatus of clause 1B, further comprising a flexible electrical interconnect having a long axis parallel to a second direction perpendicular to the first direction, the flexible electrical interconnect conductively bonded to a surface of the solar cell and accommodating thermal expansion of the solar cell in two dimensions.

21B. The apparatus of clause 20B, wherein the flexible electrical interconnect has a thickness of less than or equal to about 100 microns to provide a resistance of less than or equal to about 0.012 ohms.

22B are provided. The apparatus of clause 20B, wherein the surface comprises a back surface.

23B. The apparatus of clause 20B, wherein the flexible electrical interconnect contacts another super cell.

24B. The apparatus of clause 23B, wherein the other super cell is in line with the super cell.

25B. The apparatus of clause 23B, wherein the other super cell is adjacent to the super cell.

26B. The apparatus of clause 20B, wherein a first portion of the interconnect is folded around an edge of the super cell such that a remaining second interconnect portion is located on the back side of the super cell.

27B. The apparatus of clause 20B, wherein the flexible electrical interconnect is electrically connected to a bypass diode.

28B. The apparatus of clause 1B, wherein a plurality of super cells are arranged in two or more parallel rows on a backing sheet forming a solar module front surface, wherein the backing sheet is white and comprises dark stripes, the position and width of which correspond to the gaps between the super cells.

29B. The apparatus of clause 1B, wherein the super battery comprises at least one pair of battery strings connected to a power management system.

30B. The apparatus of clause 1B, further comprising a power management device in electrical communication with the super battery and configured to:

receiving a voltage output of the super battery;

determining whether the solar cell is in reverse bias based on the voltage; and

disconnecting the reverse biased solar cell from the super cell module circuit.

31B are formed. The apparatus of clause 1B, wherein the super cell is disposed on a first liner to form a first module having a top conductive strip on a first side facing the solar direction, the apparatus further comprising:

another super cell arranged on a second liner to form a second module, the different module having a bottom strip on a second side facing away from the direction of solar energy,

wherein the second module overlaps and is joined to a portion of the first module including the top belt.

32B. The apparatus of clause 31B, wherein the second module is joined to the first module by an adhesive.

33B, respectively. The device of clause 31B, wherein the second module is joined to the first module by a mating arrangement.

34B. The apparatus of clause 31B, further comprising a junction box overlapping the second module.

35B. The apparatus of clause 34B, wherein the second module is joined to the first module by a mating arrangement.

36B, respectively. The apparatus of clause 35B, wherein the mating arrangement is located between the junction box and another junction box on a second module.

37B. The apparatus of clause 31B, wherein the first liner comprises glass.

38B. The apparatus of clause 31B, wherein the first liner comprises non-glass.

39B. The apparatus of clause 1B, wherein the solar cell comprises a chamfered portion cut from a larger piece.

40B. The device of clause 39B, wherein the super cell further comprises another solar cell having a chamfered portion, wherein the long side of the solar cell is in electrical contact with the long side of the other solar cell having a similar length.

1C 1. A method, comprising:

forming a super cell comprising a string of at least N ≧ 25 solar cells connected in series on the same pad, each solar cell having a breakdown voltage greater than about 10 volts and arranged such that long sides of adjacent solar cells overlap and are conductively bonded with an adhesive; and

Each super cell is connected to at most a single bypass diode.

2C 1. The method of clause 1C1, wherein N is greater than or equal to 30.

3C 1. The method of clause 1C1, wherein N is greater than or equal to 50.

4C 1. The method of clause 1C1, wherein N is greater than or equal to 100.

5C 1. The method of clause 1C1, wherein the adhesive has a thickness of less than or equal to about 0.1mm and has a thermal conductivity of greater than or equal to about 1.5 w/m/k.

6C 1. The method of clause 1C1, wherein the solar cell is a silicon solar cell.

7C 1. The method of clause 1C1, wherein the super cell has a length in the direction of current flow of at least about 500 mm.

8C 1. The method of clause 1C1, wherein a first solar cell of the super cell has a chamfer, a second solar cell of the super cell lacks a chamfer, and the areas of the first and second solar cells exposed to sunlight are the same.

9C 1. The method of clause 1C1, further comprising using a feature of the solar cell surface to limit the spread of the adhesive.

10C 1. The method of clause 9C1, wherein the feature comprises a raised feature.

11C 1. The method of clause 9C1, wherein the feature comprises metallization.

12C 1. The method of clause 11C1, wherein the metallization comprises a line extending the full length of the first long side, at least one contact pad located between the line and the first long side.

13C 1. The method of clause 12C1, wherein:

the metallization further comprises a finger electrically connected to the at least one contact pad and extending perpendicular to the first long side; and is

Conductive lines interconnect the fingers.

14C 1. The method of clause 9C1, wherein the feature is located on a front side of a solar cell.

15C 1. The method of clause 9C1, wherein the feature is located on a back side of a solar cell.

16C 1. The method of clause 9C1, wherein the feature comprises a recessed feature.

17C 1. The method of clause 9C1, wherein the feature is hidden by an adjacent solar cell of the super cell.

18C 1. The method of clause 1C1, further comprising forming another super cell on the same gasket.

19C 1. The method of clause 1C1, further comprising:

conductively bonded to a surface of the solar cell, the flexible electrical interconnect having a long axis parallel to a second direction, the second direction perpendicular to the first direction; and

Such that the flexible electrical interconnect accommodates thermal expansion of the solar cell in two dimensions.

20C 1. The method of clause 19C1, wherein the flexible electrical interconnect has a thickness of less than or equal to about 100 microns to provide a resistance of less than or equal to about 0.012 ohms.

21C 1. The method of clause 19C1, wherein the surface comprises a back surface.

22C 1. The method of clause 19C1, further comprising contacting another super cell with the flexible electrical interconnect.

23C 1. The method of clause 22C1, wherein the other super cell is in-line with the super cell.

24C 1. The method of clause 22C1, wherein the other super cell is adjacent to the super cell.

25C 1. The method of clause 19C1, further comprising folding a first portion of the interconnect around an edge of the super cell such that a remaining second interconnect portion is located on a back side of the super cell.

26C 1. The method of clause 19C1, further comprising electrically connecting the flexible electrical interconnect to a bypass diode.

27C 1. The method of clause 1C1, further comprising:

arranging a plurality of super cells in two or more parallel rows on the same pad to form a solar module front surface, wherein the backing plate is white and comprises dark stripes corresponding to the position and width of the gaps between the super cells.

28C 1. The method of clause 1C1, further comprising connecting at least one pair of battery strings to a power management system.

29C 1. The method of clause 1C1, further comprising:

electrically connecting a power management device with the super battery;

causing the power management device to receive a voltage output of the super cell;

based on the voltage, causing the power management device to determine whether the solar cell is in reverse bias; and

causing the power management device to disconnect the reverse biased solar cell from the super cell module circuit.

30C 1. The method of clause 1C1, wherein the super cell is disposed on a gasket to form a first module having a top conductive strip on a first side facing in a solar direction, the method further comprising:

disposing another super cell on another pad to form a second module having a bottom strip on a second side facing away from the direction of solar energy,

wherein the second module overlaps and is joined to a portion of the first module including the top belt.

31C 1. The method of clause 30C1, wherein the second module is joined to the first module by an adhesive.

32C 1. The method of clause 30C1, wherein the second module is joined to the first module by a mating arrangement.

33C 1. The method of clause 30C1, further comprising overlapping the junction box with the second module.

34C 1. The method of clause 33C1, wherein the second module is joined to the first module by a mating arrangement.

35C 1. The method of clause 34C1, wherein the mating arrangement is located between the junction box and another junction box on a second module.

36C 1. The method of clause 30C1, wherein the liner comprises glass.

37C 1. The method of clause 30C1, wherein the liner comprises non-glass.

38C 1. The method of clause 30C1, further comprising:

electrically connecting a relay switch in series between the first module and the second module;

sensing, by a controller, an output voltage of a first module; and

and when the output voltage is lower than the limit, starting a relay switch by using a controller.

39C 1. The method of clause 1C1, wherein the solar cell includes a chamfered portion that is cut from a larger piece.

40C 1. The method of clause 39C1, wherein forming the super cell comprises placing a long side of the solar cell in electrical contact with a long side of similar length of another solar cell having a chamfered portion.

1C 2. An apparatus, comprising:

a solar module comprising a front surface comprising at least 19 solar cells connected in series in a first string grouped into a first super cell, the first super cell being arranged such that long sides of adjacent solar cells overlap and are conductively bonded with an adhesive; and

a ribbon wire electrically connected to the back surface contact of the first super cell to provide a hidden tap to an electrical component.

2C 2. The apparatus of clause 1C2, wherein the electrical components include bypass diodes.

3C 2. The apparatus of clause 2C2, wherein the bypass diode is located on a back surface of a solar module.

4C 2. The apparatus of clause 3C2, wherein the bypass diode is located outside of a junction box.

5C 2. The apparatus of clause 4C2, wherein the junction box comprises a single terminal.

6C 2. The apparatus of clause 3C2, wherein the bypass diode is positioned near an edge of a solar module.

7C 2. The apparatus of clause 2C2, wherein the bypass diode is positioned in a laminated structure.

8C 2. The device of clause 7C2, wherein the first super cell is packaged within a laminate structure.

9C 2. The apparatus of clause 2C2, wherein the bypass diodes are positioned around a perimeter of a solar module.

10C 2. The apparatus of clause 1C2, wherein the electrical components include module terminals, a junction box, a power management system, a smart switch, a relay, a voltage sensing controller, a central inverter, a DC/AC micro-inverter, or a DC/DC module power optimizer.

11C 2. The apparatus of clause 1C1, wherein the electrical components are located on a rear surface of the solar module.

12C 2. The apparatus of clause 1C1, wherein the solar module further comprises at least 19 solar cells connected in series in a second string grouped into a second super cell, the second super cell having a first end electrically connected in series to the first super cell.

13C 2. The device of clause 12C2, wherein the second super cell overlaps the first super cell and is electrically connected in series to the first super cell with a conductive adhesive.

14C 2. The apparatus of clause 12C2, wherein the back surface contact is located away from the first end.

15C 2. The apparatus of clause 12C2, further comprising a flexible interconnect between the first end and the first super cell.

16C 2. The apparatus of clause 15C2, wherein the flexible interconnect extends beyond side edges of the first and second super cells to electrically connect the first and second super cells in parallel with another super cell.

17C 2. The apparatus of clause 1C2, wherein the adhesive has a thickness of less than or equal to about 0.1mm and has a thermal conductivity greater than or equal to about 1.5 w/m/k.

18C 2. The apparatus of clause 1C2, wherein the solar cell is a silicon solar cell having a breakdown voltage greater than about 10V.

19C 2. The device of clause 1C2, wherein the first super cell has a length in the direction of current flow of at least about 500 mm.

20C 2. The device of clause 1C2, wherein the solar cell in the first super cell includes a feature configured to limit adhesive spreading.

21C 2. The apparatus of clause 20C2, wherein the feature comprises a raised feature.

22C 2. The apparatus of clause 21C2, wherein the feature comprises metallization.

23C 2. The apparatus of clause 22C2, wherein the metallization comprises a conductive line extending the full length of the first long side, the apparatus further comprising at least one contact pad located between the line and the first long side.

24C 2. The apparatus of clause 23C2, wherein:

the metallization further comprises a finger electrically connected to the at least one contact pad and extending perpendicular to the first long side; and is

Conductive lines interconnect the fingers.

25C 2. The apparatus of clause 20C2, wherein the feature is located on a front side of a solar cell.

26C 2. The apparatus of clause 20C2, wherein the feature is located on a back side of the solar cell.

27C 2. The apparatus of clause 20C2, wherein the feature comprises a recessed feature.

28C 2. The apparatus of clause 20C2, wherein the feature is hidden by an adjacent solar cell of the first super cell.

29C 2. The device of clause 1C2, wherein the solar cell of the first super cell includes a chamfered portion.

30C 2. The device of clause 29C2, wherein the first super cell further comprises another solar cell having a chamfered portion, and wherein the long side of the solar cell is in electrical contact with the long side of the other solar cell having a similar length.

31C 2. The device of clause 29C2, wherein the first super cell further comprises another solar cell lacking a chamfer, and the solar cell and the another solar cell are exposed to the same area of sunlight.

32C 2. The apparatus of clause 1C2, wherein:

the first super cell and the second super cell are arranged in a parallel row on the front surface of the backing plate; and is

The backing plate is white and includes dark stripes corresponding to the position and width of the gap between the first super cell and the second super cell.

33C 2. The apparatus of clause 1C2, wherein the first super-battery comprises at least one pair of battery strings connected to a power management system.

34C 2. The apparatus of clause 1C2, further comprising a power management device in electrical communication with the first super-battery and configured to:

receiving a voltage output of a first super cell;

determining whether the solar cell of the first super cell is reverse biased based on the voltage; and

disconnecting the reverse biased solar cell from the super cell module circuit.

35C 2. The apparatus of clause 34C2, wherein the power management device comprises a relay.

36C 2. The apparatus of clause 1C2, wherein a first super cell is disposed on a first liner to form a module having a top conductive strip on a first side facing in a solar direction, the apparatus further comprising:

Another super cell disposed on a second liner to form a different module having a bottom strip on a second side facing away from a direction of solar energy,

wherein the different module overlaps and is joined to a portion of the module comprising the top belt.

37C 2. The apparatus of clause 36C2, wherein the different modules are joined to the module by an adhesive.

38C 2. The apparatus of clause 36C2, wherein the different modules are joined to the module by a mating arrangement.

39C 2. The apparatus of clause 36C2, further comprising a junction box overlapping the different modules.

40C 2. The apparatus of clause 39C2, wherein the different module is joined to the module by a mating arrangement between the junction box and another junction box on a different solar module.

1C 3. An apparatus, comprising:

a first super cell disposed on the solar module front surface and comprising a plurality of solar cells, each solar cell having a breakdown voltage greater than about 10V;

a first ribbon wire electrically connected with a back surface contact of a first super cell to provide a first hidden tap to an electrical component;

A second super cell disposed on the solar module front surface and comprising a plurality of solar cells, each solar cell having a breakdown voltage greater than about 10V; and

a second ribbon wire electrically connected with a back surface contact of a second super cell to provide a second hidden tap.

2C 3. The apparatus of clause 1C3, wherein the electrical component comprises a bypass diode.

3C 3. The apparatus of clause 2C3, wherein the bypass diode is located on a solar module back surface.

4C 3. The apparatus of clause 3C3, wherein the bypass diode is located outside of a junction box.

5C 3. The apparatus of clause 4C3, wherein the junction box includes a single terminal.

6C 3. The apparatus of clause 3C3, wherein the bypass diode is positioned near an edge of a solar module.

7C 3. The apparatus of clause 2C3, wherein the bypass diode is positioned in a laminated structure.

8C 3. The device of clause 7C3, wherein the first super cell is packaged within a laminate structure.

9C 3. The apparatus of clause 8C3, wherein the bypass diodes are positioned around a solar module perimeter.

10C 3. The device of clause 1C3, wherein the first super cell is connected in series with the second super cell.

11C 3. The apparatus of clause 10C3, wherein:

the first super cell and the second super cell form a first pair; and is

The device further comprises two additional super cells in a second pair connected in parallel with the first pair.

12C 3. The apparatus of clause 10C3, wherein the second hidden tap is connected to the electrical component.

13C 3. The apparatus of clause 12C3, wherein the electrical component comprises a bypass diode.

14C 3. The device of clause 13C3, wherein the first super cell comprises no less than 19 solar cells.

15C 3. The apparatus of clause 12C3, wherein the electrical components include a power management system.

16C 3. The apparatus of clause 1C3, wherein the electrical component comprises a switch.

17C 3. The apparatus of clause 16C3, further comprising a voltage sensing controller in communication with the switch.

18C 3. The apparatus of clause 16C3, wherein the switch is in communication with a central inverter.

19C 3. The apparatus of clause 1C3, wherein the electrical components include a power management device configured to:

Receiving a voltage output of a first super cell;

determining whether the solar cell of the first super cell is reverse biased based on the voltage; and

disconnecting the reverse biased solar cell from the super cell module circuit.

20C 3. The apparatus of clause 1, wherein the electrical component comprises an inverter.

21C 3. The apparatus of clause 20C3, wherein the inverter comprises a DC/AC micro-inverter.

22C 3. The apparatus of clause 1C3, wherein the electrical components include solar module terminals.

23C 3. The apparatus of clause 22C3, wherein the solar module terminals are single solar module terminals within a junction box.

24C 3. The apparatus of clause 1C3, wherein the electrical components are located on the solar module back surface.

25C 3. The apparatus of clause 1C3, wherein the back surface contact is positioned away from an end of a first super cell that overlaps a second super cell.

26C 3. The device of clause 1C3, wherein the first super cell has a length in the direction of current flow of at least about 500 mm.

27C 3. The device of clause 1C3, wherein the solar cell in the first super cell includes a feature configured to limit adhesive spreading.

28C 3. The apparatus of clause 27C3, wherein the feature comprises a raised feature.

29C 3. The apparatus of clause 28C3, wherein the feature comprises metallization.

30C 3. The apparatus of clause 27C3, wherein the feature comprises a recessed feature.

31C 3. The apparatus of clause 27C3, wherein the feature is located on a back side of a solar cell.

32C 3. The apparatus of clause 27C3, wherein the feature is hidden by an adjacent solar cell of the first super cell.

33C 3. The device of clause 1C3, wherein the solar cell of the first super cell includes a chamfered portion.

34C 3. The device of clause 33C3, wherein the first super cell further comprises another solar cell having a chamfered portion, and wherein the long side of the solar cell is in electrical contact with the long side of the other solar cell having a similar length.

35C 3. The device of clause 33C3, wherein the first super cell further comprises another solar cell lacking a chamfer, and the solar cell and the another solar cell are exposed to the same area of sunlight.

36C 3. The apparatus of clause 1C3, wherein:

The first super cell and the second super cell are arranged in a parallel row on the front surface of the backing plate; and is

The backing plate is white and includes dark stripes corresponding to the position and width of the gap between the first and second super cells.

37C 3. The apparatus of clause 1C3, wherein a first super cell is disposed on a first liner to form a module having a top conductive strip on a front surface of the module facing in the direction of solar energy, the apparatus further comprising:

a third super cell disposed on the second liner to form a different module having a bottom strip on a second side facing away from the direction of solar energy,

wherein the different module overlaps and is joined to a portion of the module comprising the top belt.

38C 3. The apparatus of clause 37C3, wherein the different modules are joined to the module by an adhesive.

39C 3. The apparatus of clause 37C3, further comprising a junction box overlapping the different modules.

40C 3. The apparatus of clause 39C3, wherein the different module is joined to the module by a mating arrangement between the junction box and another junction box on the different module.

1C 4. An apparatus, comprising:

a solar module comprising a front surface comprising a first string of series-connected solar cells grouped into a first super cell, the first super cell arranged such that edges of adjacent solar cells overlap and are conductively bonded with an adhesive; and

configured to confine the solar cell surface features of the adhesive.

2C 4. The apparatus of clause 1C4, wherein the solar cell surface features comprise recessed features.

3C 4. The apparatus of clause 1C4, wherein the solar cell surface features comprise raised features.

4C 4. The apparatus of clause 3C4, wherein the raised features are located on a front surface of the solar cell.

5C 4. The apparatus of clause 4C4, wherein the raised features comprise a metallization pattern.

6C 4. The apparatus of clause 5C4, wherein the metallization pattern comprises conductive lines extending parallel to and generally along a long side of the solar cell.

7C 4. The device of clause 6C4, further comprising a contact pad between the conductive line and the long side.

8C 4. The apparatus of clause 7C4, wherein:

The metallization pattern further comprises a plurality of fingers; and is

The conductive lines electrically interconnect the fingers to provide a plurality of conductive paths from each finger to a contact pad.

9C 4. The apparatus of clause 7C4, further comprising a plurality of discrete contact pads arranged in a row adjacent and parallel to the long edge, the metallization pattern forming a plurality of individual barriers to confine the adhesive to the discrete contact pads.

10C 4. The apparatus of clause 8C4, wherein the plurality of individual barriers abut corresponding discrete contact pads.

11C 4. The apparatus of clause 8C4, wherein the plurality of individual barriers are taller than corresponding discrete contact pads.

12C 4. The apparatus of clause 1C4, wherein the solar cell surface features are hidden by an overlapping edge of another solar cell.

13C 4. The device of clause 12C4, wherein the other solar cell is part of the super cell.

14C 4. The device of clause 12C4, wherein the other solar cell is part of another super cell.

15C 4. The apparatus of clause 3C4, wherein the raised features are located on the back surface of the solar cell.

16C 4. The apparatus of clause 15C4, wherein the raised features comprise a metallization pattern.

17C 4. The apparatus of clause 16C4, wherein the metallization pattern forms a plurality of individual barriers to confine the adhesive to a plurality of discrete contact pads on a front surface of another solar cell that overlaps the solar cell.

18C 4. The apparatus of clause 17C4, wherein the plurality of individual barriers abut corresponding discrete contact pads.

19C 4. The apparatus of clause 17C4, wherein the plurality of individual barriers are taller than corresponding discrete contact pads.

20C 4. The device of clause 1C1, wherein each solar cell of the super cell has a breakdown voltage of 10V or greater.

21C 4. The device of clause 1C1, wherein the super cell has a length in the direction of current flow of at least about 500 mm.

22C 4. The device of clause 1C1, wherein the solar cell of the super cell includes a chamfered portion.

23C 4. The device of clause 22C4, wherein the super cell further comprises another solar cell having a chamfered portion, and wherein the long side of the solar cell is in electrical contact with the long side of the other solar cell having a similar length.

24C 4. The device of clause 22C4, wherein the super cell further comprises another solar cell lacking a chamfer, and the solar cell and the another solar cell have the same area exposed to sunlight.

25C 4. The device of clause 1C4, wherein the super cell and second super cell are arranged on a first backing plate front surface to form a first module.

26C 4. The apparatus of clause 25C4, wherein the backing plate is white and includes dark stripes corresponding to the location and width of the gap between the super cell and a second super cell.

27C 4. The apparatus of clause 25C4, wherein the first module has a top conductive strip on a first module front surface facing in the direction of solar energy, the apparatus further comprising:

a third super cell disposed on a second liner to form a second module having a bottom strip on a second module side facing away from the solar energy, and

wherein the second module overlaps and is joined to a portion of the first module including the top belt.

28C 4. The apparatus of clause 27C4, wherein the second module is joined to the first module by an adhesive.

29C 4. The apparatus of clause 27C4, further comprising a junction box overlapping the second module.

30C 4. The apparatus of clause 29C4, wherein the second module is joined to the first module by a mating arrangement disposed between the junction box and another junction box on the second module.

31C 4. The apparatus of clause 29C4, wherein the junction box houses a single module terminal.

32C 4. The apparatus of clause 27C4, further comprising a switch between the first module and the second module.

33C 4. The apparatus of clause 32C4, further comprising a voltage sensing controller in communication with the switch.

34C 4. The device of clause 27C4, wherein the super cell comprises no less than nineteen solar cells individually electrically connected in parallel with a single bypass diode.

35C 4. The apparatus of clause 34C4, wherein the single bypass diode is positioned near a first module edge.

36C 4. The apparatus of clause 34C4, wherein the single bypass diode is positioned in a laminated structure.

37C 4. The device of clause 36C4, wherein the super cell is packaged within a laminate structure.

38C 4. The apparatus of clause 34C4, wherein the single bypass diode is positioned around a first module perimeter.

39C 4. The apparatus of clause 25C4, wherein the super battery and the second super battery comprise a pair separately connected to a power management device.

40C 4. The apparatus of clause 25C4, further comprising a power management device configured to:

Receiving a voltage output of the super battery;

determining whether a solar cell of the super cell is reverse biased based on the voltage; and

disconnecting the reverse biased solar cell from the super cell module circuit.

1C 5. An apparatus, comprising:

a solar module comprising a front surface comprising a first string of series-connected silicon solar cells grouped into a first super cell, the first super cell comprising a first silicon solar cell having a chamfer and arranged such that an edge overlaps a second silicon solar cell and is conductively bonded to the second silicon solar cell with an adhesive.

2C 5. The device of clause 1C5, wherein the second silicon solar cell lacks a chamfer and the front surface area of each silicon solar cell of the first super cell exposed to sunlight is substantially equal.

3C 5. The apparatus of clause 2C5, wherein:

the first silicon solar cell and the second silicon solar cell have the same length; and is

The width of the first silicon solar cell is greater than the width of the second silicon solar cell.

4C 5. The apparatus of clause 3C5, wherein the length reproduces the shape of a quasi-square wafer.

5C 5. The apparatus of clause 3C5, wherein the length is 156 mm.

6C 5. The apparatus of clause 3C5, wherein the length is 125 mm.

7C 5. The apparatus of clause 3C5, wherein the aspect ratio between the width and the length of the first solar cell is between about 1:2 to about 1: 20.

8C 5. The apparatus of clause 3C5, wherein the first silicon solar cell overlaps the second silicon solar cell by about 1mm to about 5 mm.

9C 5. The apparatus of clause 3C5, wherein the first super cell comprises at least nineteen silicon solar cells, each silicon solar cell having a breakdown voltage greater than about 10 volts.

10C 5. The device of clause 3C5, wherein the first super cell has a length in the direction of current flow of at least about 500 mm.

11C 5. The apparatus of clause 3C5, wherein:

the first super cell and the second super cell are connected in parallel on the front surface; and is

The front surface includes a white pad characterized by dark stripes corresponding to the location and width of the gap between the first super cell and the second super cell.

12C 5. The apparatus of clause 1C5, wherein the second silicon solar cell comprises a chamfer.

13C 5. The apparatus of clause 12C5, wherein the long side of the first silicon solar cell overlaps the long side of the second silicon solar cell.

14C 5. The apparatus of clause 12C5, wherein the long side of the first silicon solar cell overlaps the short side of the second silicon solar cell.

15C 5. The apparatus of clause 1C5, wherein the front surface comprises:

a first row comprising a first super cell comprised of solar cells having a chamfer; and

a second row comprising a second string of series connected silicon solar cells grouped into a second super cell connected in parallel with the first super cell and comprised of solar cells lacking chamfers, the length of the second row being substantially equal to the length of the first row.

16C 5. The apparatus of clause 15C5, wherein the first row is adjacent to a module edge and the second row is not adjacent to a module edge.

17C 5. The device of clause 15C5, wherein the first super cell comprises at least nineteen solar cells having a breakdown voltage greater than about 10 volts, and the first super cell has a length in the direction of current flow of at least about 500 mm.

18C 5. The apparatus of clause 15C5, wherein the front surface comprises a white pad characterized by dark stripes corresponding to a position and a width of a gap between a first super cell and a second super cell.

19C 5. The apparatus of clause 1C5, further comprising a metallization pattern on the front side of the second solar cell.

20C 5. The apparatus of clause 19C5, wherein the metallization pattern includes a tapered portion extending around a chamfer.

21C 5. The apparatus of clause 19C5, wherein the metallization pattern includes raised features to limit spreading of the adhesive.

22C 5. The apparatus of clause 19C5, wherein the metallization pattern comprises:

a plurality of discrete contact pads;

a finger electrically connected to a plurality of discrete contact pads; and

conductive lines interconnecting the fingers.

23C 5. The apparatus of clause 22C5, wherein the metallization pattern forms a plurality of individual barriers to confine adhesive to discrete contact pads.

24C 5. The apparatus of clause 23C5, wherein the plurality of individual barriers abut and are higher than the corresponding discrete contact pads.

25C 5. The apparatus of clause 1C5, further comprising a flexible electrical interconnect conductively bonded to a surface of the first solar cell and accommodating thermal expansion of the first solar cell in two dimensions.

26C 5. The apparatus of clause 25C5, wherein the first portion of the interconnect is folded around an edge of the first super cell such that the remaining second interconnect portion is located on the back side of the first super cell.

27C 5. The apparatus of clause 1C5, wherein the module has a top conductive strip on a front surface facing in the direction of solar energy, the apparatus further comprising:

another module having a second super cell disposed on a front surface, a bottom strip on the other module facing away from the solar energy, and

wherein the second module overlaps and is joined to a portion of the first module including the top belt.

28C 5. The apparatus of clause 27C5, wherein the other module is joined to the module by an adhesive.

29C 5. The apparatus of clause 27C5, further comprising a junction box overlapping another module.

30C 5. The apparatus of clause 29C5, wherein the other module is joined to the module by a mating arrangement between the junction box and another junction box on the other module.

31C 5. The apparatus of clause 29C5, wherein the junction box houses a single module terminal.

32C 5. The apparatus of clause 27C5, further comprising a switch between the module and the other module.

33C 5. The apparatus of clause 32C5, further comprising a voltage sensing controller in communication with the switch.

34C 5. The device of clause 27C5, wherein the first super cell comprises no less than nineteen solar cells electrically connected to a single bypass diode.

35C 5. The apparatus of clause 34C5, wherein the single bypass diode is positioned near a first module edge.

36C 5. The apparatus of clause 34C5, wherein the single bypass diode is positioned in a laminated structure.

37C 5. The device of clause 36C5, wherein the super cell is packaged within a laminate structure.

38C 5. The apparatus of clause 34C5, wherein the single bypass diode is positioned around a first module perimeter.

39C 5. The apparatus of clause 27C5, wherein the first super-battery and the second super-battery comprise a pair connected to a power management device.

40C 5. The apparatus of clause 27C5, further comprising a power management device configured to:

receiving a voltage output of a first super cell;

Determining whether a solar cell of a first super cell is reverse biased based on the voltage; and

disconnecting the reverse biased solar cell from the super cell module circuit.

1C 6. An apparatus, comprising:

a solar module comprising a front surface comprising a first string of series-connected silicon solar cells grouped into a first super cell, the first super cell comprising a first silicon solar cell having a chamfer and arranged such that an edge overlaps a second silicon solar cell and is conductively bonded to the second silicon solar cell with an adhesive.

2C 6. The device of clause 1C6, wherein the second silicon solar cell lacks a chamfer and the front surface area of each silicon solar cell of the first super cell exposed to sunlight is substantially equal.

3C 6. The apparatus of clause 2C6, wherein:

the first silicon solar cell and the second silicon solar cell have the same length; and is

The width of the first silicon solar cell is greater than the width of the second silicon solar cell.

4C 6. The apparatus of clause 3C6, wherein the length reproduces the shape of a quasi-square wafer.

5C 6. The apparatus of clause 3C6, wherein the length is 156 mm.

6C 6. The apparatus of clause 3C6, wherein the length is 125 mm.

7C 6. The apparatus of clause 3C6, wherein the aspect ratio between the width and the length of the first solar cell is between about 1:2 to about 1: 20.

8C 6. The apparatus of clause 3C6, wherein the first silicon solar cell overlaps the second silicon solar cell by about 1mm to about 5 mm.

9C 6. The apparatus of clause 3C6, wherein the first super cell comprises at least nineteen silicon solar cells, each silicon solar cell having a breakdown voltage greater than about 10 volts.

10C 6. The device of clause 3C6, wherein the first super cell has a length in the direction of current flow of at least about 500 mm.

11C 6. The apparatus of clause 3C6, wherein:

the first super cell and the second super cell are connected in parallel on the front surface; and is

The front surface includes a white pad characterized by dark stripes corresponding to the location and width of the gap between the first super cell and the second super cell.

12C 6. The apparatus of clause 1C6, wherein the second silicon solar cell comprises a chamfer.

13C 6. The apparatus of clause 12C6, wherein the long side of the first silicon solar cell overlaps the long side of the second silicon solar cell.

14C 6. The apparatus of clause 12C6, wherein the long side of the first silicon solar cell overlaps the short side of the second silicon solar cell.

15C 6. The apparatus of clause 1C6, wherein the front surface comprises:

a first row comprising a first super cell comprised of solar cells having a chamfer; and

a second row comprising a second string of series connected silicon solar cells grouped into a second super cell connected in parallel with the first super cell and comprised of solar cells lacking chamfers, the length of the second row being substantially equal to the length of the first row.

16C 6. The apparatus of clause 15C6, wherein the first row is adjacent to a module edge and the second row is not adjacent to a module edge.

17C 6. The device of clause 15C6, wherein the first super cell comprises at least nineteen solar cells having a breakdown voltage greater than about 10 volts, and the first super cell has a length in the direction of current flow of at least about 500 mm.

18C 6. The apparatus of clause 15C6, wherein the front surface comprises a white pad characterized by dark stripes corresponding to a position and a width of a gap between a first super cell and a second super cell.

19C 6. The apparatus of clause 1C6, further comprising a metallization pattern on the front side of the second solar cell.

20C 6. The apparatus of clause 19C6, wherein the metallization pattern includes a tapered portion extending around a chamfer.

21C 6. The apparatus of clause 19C6, wherein the metallization pattern includes raised features to limit spreading of the adhesive.

22C 6. The apparatus of clause 19C6, wherein the metallization pattern comprises:

a plurality of discrete contact pads;

a finger electrically connected to a plurality of discrete contact pads; and

conductive lines interconnecting the fingers.

23C 6. The apparatus of clause 22C6, wherein the metallization pattern forms a plurality of individual barriers to confine adhesive to discrete contact pads.

24C 6. The apparatus of clause 23C6, wherein the plurality of individual barriers abut and are higher than the corresponding discrete contact pads.

25C 6. The apparatus of clause 1C6, further comprising a flexible electrical interconnect conductively bonded to a surface of the first solar cell and accommodating thermal expansion of the first solar cell in two dimensions.

26C 6. The apparatus of clause 25C6, wherein the first portion of the interconnect is folded around an edge of the first super cell such that the remaining second interconnect portion is located on the back side of the first super cell.

27C 6. The apparatus of clause 1C6, wherein the module has a top conductive strip on a front surface facing in the direction of solar energy, the apparatus further comprising:

another module having a second super cell disposed on a front surface, a bottom strip on the other module facing away from the solar energy, and

wherein the second module overlaps and is joined to a portion of the first module including the top belt.

28C 6. The apparatus of clause 27C6, wherein the other module is joined to the module by an adhesive.

29C 6. The apparatus of clause 27C6, further comprising a junction box overlapping another module.

30C 6. The apparatus of clause 29C6, wherein the other module is joined to the module by a mating arrangement between the junction box and another junction box on the other module.

31C 6. The apparatus of clause 29C6, wherein the junction box houses a single module terminal.

32C 6. The apparatus of clause 27C6, further comprising a switch between the module and the other module.

33C 6. The apparatus of clause 32C6, further comprising a voltage sensing controller in communication with the switch.

34C 6. The device of clause 27C6, wherein the first super cell comprises no less than nineteen solar cells electrically connected to a single bypass diode.

35C 6. The apparatus of clause 34C6, wherein the single bypass diode is positioned near a first module edge.

36C 6. The apparatus of clause 34C6, wherein the single bypass diode is positioned in a laminated structure.

37C 6. The device of clause 36C6, wherein the super cell is packaged within a laminate structure.

38C 6. The apparatus of clause 34C6, wherein the single bypass diode is positioned around a first module perimeter.

39C 6. The apparatus of clause 27C6, wherein the first super cell and the second super cell comprise a pair connected to a power management device.

40C 6. The apparatus of clause 27C6, further comprising a power management device configured to:

receiving a voltage output of a first super cell;

Determining whether the solar cell of the first super cell is reverse biased based on the voltage; and

disconnecting the reverse biased solar cell from the super cell module circuit.

1C 7. An apparatus, comprising:

a solar module comprising a front surface comprising a first string of at least nineteen silicon solar cells connected in series, each silicon solar cell having a breakdown voltage greater than about 10V, and grouped into a first super cell comprising a first silicon solar cell arranged such that an end overlaps and is conductively bonded to a second silicon solar cell with an adhesive; and

an interconnect conductively bonded to a surface of the solar cell.

2C 7. The apparatus of clause 1C7, wherein the solar cell surface comprises a back side of a first silicon solar cell.

3C 7. The apparatus of clause 2C7, further comprising a ribbon wire electrically connecting the super cell to an electrical component.

4C 7. The apparatus of clause 3C7, wherein the ribbon wire is conductively bonded to the surface of the solar cell distal to the overlapping end.

5C 7. The apparatus of clause 4C7, wherein the electrical components are located on the solar module back surface.

6C 7. The apparatus of clause 4C7, wherein the electrical component comprises a junction box.

7C 7. The apparatus of clause 6C7, wherein the junction box is matingly engaged with another junction box on a different module that overlaps the module.

8C 7. The apparatus of clause 4C7, wherein the electrical component comprises a bypass diode.

9C 7. The apparatus of clause 4C7, wherein the electrical components include module terminals.

10C 7. The apparatus of clause 4C7, wherein the electrical component includes an inverter.

11C 7. The apparatus of clause 10C7, wherein the inverter comprises a DC/AC micro-inverter.

12C 7. The apparatus of clause 11C7, wherein the DC/AC microinverter is located on a solar module back surface.

13C 7. The apparatus of clause 4C7, wherein the electrical component comprises a power management device.

14C 7. The apparatus of clause 13C7, wherein the power management device comprises a switch.

15C 7. The apparatus of clause 14C7, further comprising a voltage sensing controller in communication with the switch.

16C 7. The apparatus of clause 13C7, wherein the power management device is configured to:

receiving a voltage output of the super battery;

determining whether a solar cell of the super cell is reverse biased based on the voltage; and

disconnecting the reverse biased solar cell from the super cell module circuit.

17C 7. The apparatus of clause 16C7, wherein the power management device is in electrical communication with a central inverter.

18C 7. The apparatus of clause 13C7, wherein the power management device comprises a DC/DC module power optimizer.

19C 7. The apparatus of clause 3C7, wherein the interconnect is sandwiched between the super cell and another super cell on the front surface.

20C 7. The apparatus of clause 3C7, wherein the ribbon wire is conductively bonded to the interconnect.

21C 7. The apparatus of clause 3C7, wherein the interconnect provides a resistance of less than or equal to about 0.012 ohms to the current.

22C 7. The apparatus of clause 3C7, wherein the interconnect is configured to accommodate differential expansion between the first silicon solar cell and the interconnect for a temperature range between about-40 ℃ to about 85 ℃.

23C 7. The apparatus of clause 3C7, wherein the interconnect has a thickness less than or equal to about 100 microns.

24C 7. The apparatus of clause 3C7, wherein the interconnect has a thickness less than or equal to about 30 microns.

25C 7. The device of clause 3C7, wherein the super cell has a length in the direction of current flow of at least about 500 mm.

26C 7. The method of clause 3C7, further comprising another super cell on the front surface of the module.

27C 7. The apparatus of clause 26C7, wherein the interconnect connects the other super cell in series with the super cell.

28C 7. The apparatus of clause 26C7, wherein the interconnect connects the other super cell in parallel with the super cell.

29C 7. The apparatus of clause 26C7, wherein the front surface comprises a white pad characterized by dark stripes corresponding to location and width of a gap between the super cell and the other super cell.

30C 7. The apparatus of clause 3C7, wherein the interconnect comprises a pattern.

31C 7. The apparatus of clause 30C7, wherein the pattern comprises slits, grooves, and/or holes.

32C 7. The apparatus of clause 3C7, wherein a portion of the interconnect is dark colored.

33C 7. The apparatus of clause 3C7, wherein:

the first silicon solar cell comprises a chamfer;

the second silicon solar cell lacks a chamfer; and is

The front surface area of each silicon solar cell of the super cell exposed to sunlight is substantially equal.

34C 7. The apparatus of clause 3C7, wherein:

the first silicon solar cell comprises a chamfer;

the second silicon solar cell comprises a chamfer; and is

The sides include a long side that overlaps a long side of the second silicon solar cell.

35C 7. The apparatus of clause 3C7, wherein the interconnect forms a bus.

36C 7. The apparatus of clause 3C7, wherein the interconnect is conductively bonded to a solar cell surface at a glue joint.

37C 7. The apparatus of clause 3C7, wherein a first portion of the interconnect is folded around an edge of a super cell such that a remaining second portion is located on a back side of the super cell.

38C 7. The device of clause 3C7, further comprising a metallization pattern on the front surface and comprising a line extending along a long side, the device further comprising a plurality of discrete contact pads between the line and the long side.

39C 7. The apparatus of clause 38C7, wherein:

the metallization further comprises fingers electrically connected to the respective discrete contact pads and extending perpendicular to the long sides; and is

Conductive lines interconnect the fingers.

40C 7. The apparatus of clause 38C7, wherein the metallization pattern includes raised features to limit spreading of the adhesive.

1C 8. An apparatus, comprising:

a plurality of super cells arranged in rows on a front surface of a solar module, each super cell comprising at least nineteen silicon solar cells arranged in a line having a breakdown voltage of at least 10V, wherein end portions of adjacent silicon solar cells overlap and are conductively joined to electrically connect the silicon solar cells in series;

wherein the end of a first super cell adjacent the module edge in a first row is electrically connected to the end of a second super cell adjacent the module edge in a second row via a flexible electrical interconnect bonded to the front surface of the first super cell.

2C 8. The apparatus of clause 1C8, wherein a portion of the flexible electrical interconnect is covered by a dark colored film.

3C 8. The apparatus of clause 2C8, wherein the solar module front surface includes a backing plate that reduces visual contrast with the flexible electrical interconnects.

4C 98. The apparatus of clause 1C8, wherein a portion of the flexible electrical interconnect is colored.

5C 8. The apparatus of clause 4C8, wherein the solar module front surface includes a backing plate that reduces visual contrast with the flexible electrical interconnects.

6C 8. The apparatus of clause 1C8, wherein the solar module front surface comprises a white backing sheet.

7C 8. The apparatus of clause 6C8, further comprising dark stripes corresponding to the gaps between the rows.

8C 8. The apparatus of clause 6C8, wherein the n-type semiconductor layer of the silicon solar cell faces a backing plate.

9C 8. The apparatus of clause 1C8, wherein:

the solar module front surface comprises a backing plate; and is

The backing plate, the flexible electrical interconnect, the first super cell, and the encapsulant comprise a laminate structure.

10C 8. The apparatus of clause 9C8, wherein the encapsulant comprises a thermoplastic polymer.

11C 8. The apparatus of clause 10C8, wherein the thermoplastic polymer comprises a thermoplastic olefin polymer.

12C 8. The apparatus of clause 9C8, further comprising a glass front panel.

13C 8. The method of clause 12C8, wherein the backing plate comprises glass.

14C 8. The apparatus of clause 1C8, wherein the flexible electrical interconnect is bonded at a plurality of discrete locations.

15C 8. The apparatus of clause 1C8, wherein the flexible electrical interconnect is bonded with a conductive adhesive bonding material.

16C 8. The apparatus of clause 1C8, further comprising a glue joint.

17C 8. The apparatus of clause 1C8, wherein the flexible electrical interconnect extends parallel to the module edge.

18C 8. The apparatus of clause 1C8, wherein a portion of the flexible electrical interconnect is folded around the first super cell and hidden.

19C 8. The device of clause 1C8, further comprising a ribbon wire electrically connecting the first super cell to the electrical component.

20C 8. The apparatus of clause 19C8, wherein the ribbon wire is conductively bonded to a flexible electrical interconnect.

21C 8. The apparatus of clause 19C8, wherein the ribbon wire is conductively bonded to the surface of the solar cell distal to the overlapping end.

22C 8. The apparatus of clause 19C8, wherein the electrical components are located on the solar module back surface.

23C 8. The apparatus of clause 19C8, wherein the electrical component comprises a junction box.

24C 8. The apparatus of clause 23C8, wherein the junction box is mated with another junction box on a front surface of another solar module.

25C 8. The apparatus of clause 23C8, wherein the junction box comprises a single-terminal junction box.

26C 8. The apparatus of clause 19C8, wherein the electrical component comprises a bypass diode.

27C 8. The apparatus of clause 19C8, wherein the electrical component comprises a switch.

28C 8. The apparatus of clause 27C8, further comprising a voltage sensing controller configured to:

receiving a voltage output of a first super cell;

determining whether the solar cell of the first super cell is reverse biased based on the voltage; and is

Communicate with the switch to disconnect the reverse biased solar cell from the super cell module circuit.

29C 8. The device of clause 1C8, wherein a first super cell is in series with the super cell.

30C 8. The apparatus of clause 1C8, wherein:

the first silicon solar cell of the first super cell comprises a chamfer;

the second silicon solar cell of the first super cell lacks a chamfer; and is

Each silicon solar cell of the first super cell has a substantially equal front surface area exposed to sunlight.

31C 8. The apparatus of clause 1C8, wherein:

the first silicon solar cell of the first super cell comprises a chamfer;

the second silicon solar cell of the first super cell comprises a chamfer; and is

The long side of the first silicon solar cell overlaps the long side of the second silicon solar cell.

32C 8. The apparatus of clause 1C8, wherein the silicon solar cell of the first super cell comprises a strip having a length of about 156 mm.

33C 8. The apparatus of clause 1C8, wherein the silicon solar cell of the first super cell comprises a strip having a length of about 125 mm.

34C 8. The device of clause 1C8, wherein the silicon solar cells of the first super cell comprise strips having an aspect ratio between a width and a length of between about 1:2 and about 1: 20.

35C 8. The apparatus of clause 1C8, wherein overlapping adjacent silicon solar cells of a first super cell are conductively bonded with an adhesive, the apparatus further comprising a feature configured to limit adhesive spreading.

36C 8. The apparatus of clause 35C8, wherein the feature comprises a moat.

37C 8. The apparatus of clause 36C8, wherein the moat is formed by a metallization pattern.

38C 8. The apparatus of clause 37C8, wherein the metallization pattern comprises a line extending along a long side of the silicon solar cell, the apparatus further comprising a plurality of discrete contact pads located between the line and the long side.

39C 8. The apparatus of clause 37C8, wherein the metallization pattern is located on the front of the silicon solar cell of the first super cell.

40C 8. The apparatus of clause 37C8, wherein the metallization pattern is located on the back of the silicon solar cell of the second super cell.

1C 9. An apparatus, comprising:

a solar module comprising a front surface comprising series-connected silicon solar cells grouped into first super cells, the first super cells comprising first cut strips having a front side metallization pattern along a first outer edge overlapping with a second cut strip.

2C 9. The apparatus of clause 1C9, wherein the first and second cut bars have a length that reproduces the shape of the wafer from which the first cut bar was separated.

3C 9. The apparatus of clause 2C9, wherein the length is 156 mm.

4C 9. The apparatus of clause 2C9, wherein the length is 125 mm.

5C 9. The apparatus of clause 2C9, wherein the aspect ratio between the width and the length of the first cut strips is between about 1:2 and about 1: 20.

6C 9. The apparatus of clause 2C9, wherein the first cutting bar comprises a first chamfer.

7C 9. The apparatus of clause 6C9, wherein the first chamfer is along the first outer edge.

8C 9. The apparatus of clause 6C9, wherein the first chamfer is not along the first outer edge.

9C 9. The apparatus of clause 6C9, wherein the second cut strip includes a second chamfer.

10C 9. The apparatus of clause 9C9, wherein the overlapping edge of the second cut strip includes a second chamfer.

11C 9. The apparatus of clause 9C9, wherein the overlapping edge of the second cut strip does not include the second chamfer.

12C 9. The apparatus of clause 6C9, wherein the length reproduces the shape of a quasi-square wafer from which the first cut bars were separated.

13C 9. The apparatus of clause 6C9, wherein the width of the first cut strips is different than the width of the second cut strips such that the first cut strips and the second cut strips have substantially equal areas.

14C 9. The apparatus of clause 1C9, wherein the second cut strip overlaps the first cut strip by about 1mm to 5 mm.

15C 9. The apparatus of clause 1C9, wherein the frontside metallization pattern comprises a bus.

16C 9. The apparatus of clause 15C9, wherein the bus comprises a tapered portion.

17C 9. The apparatus of clause 1C9, wherein the front-side metallization pattern comprises discrete contact pads.

18C 9. The apparatus of clause 17C9, wherein:

the second cutting strip is joined to the first cutting strip by an adhesive; and is

The discrete contact pad also includes features to limit adhesive spreading.

19C 9. The apparatus of clause 18C9, wherein the feature comprises a moat.

20C 9. The apparatus of clause 1C9, wherein the front-side metallization pattern comprises bypass wires.

21C 9. The apparatus of clause 1C9, wherein the front-side metallization pattern comprises fingers.

22C 9. The apparatus of clause 1C9, wherein the first cut strip further comprises a backside metallization pattern along a second outer edge opposite the first outer edge.

23C 9. The apparatus of clause 22C9, wherein the backside metallization pattern comprises contact pads.

24C 9. The apparatus of clause 22C9, wherein the backside metallization pattern comprises a bus.

25C 9. The device of clause 1C9, wherein the super cell comprises at least nineteen silicon cut strips, each silicon cut strip having a breakdown voltage greater than about 10 volts.

26C 9. The method of clause 1C9, wherein the super cell is connected to another super cell on the front surface of the module.

27C 9. The apparatus of clause 26C9, wherein the module front surface comprises a white pad characterized by dark stripes corresponding to a gap between the super cell and the other super cell.

28C 9. The apparatus of clause 26C9, wherein:

the solar module front surface comprises a backing plate; and is

The backing plate, the interconnect, the super cell, and the encapsulant comprise a laminate structure.

29C 9. The apparatus of clause 28C9, wherein the encapsulant comprises a thermoplastic polymer.

30C 9. The apparatus of clause 29C9, wherein the thermoplastic polymer comprises a thermoplastic olefin polymer.

31C 9. The apparatus of clause 26C9, further comprising an interconnect between the super cell and the another super cell.

32C 9. The apparatus of clause 31C9, wherein a portion of the interconnect is covered by a dark film.

33C 9. The apparatus of clause 31C9, wherein a portion of the interconnect is colored.

34C 9. The apparatus of clause 31C9, further comprising a ribbon wire electrically connecting the super cell to an electrical component.

35C 9. The apparatus of clause 34C9, wherein the ribbon wire is conductively bonded to the back side of the first cutting bar.

36C 9. The apparatus of clause 34C9, wherein the electrical component comprises a bypass diode.

37C 9. The apparatus of clause 34C9, wherein the electrical component comprises a switch.

38C 9. The apparatus of clause 34C9, wherein the electrical component comprises a junction box.

39C 9. The device of clause 38C9, wherein the junction box overlaps another junction box and is in a mated arrangement.

40C 9. The device of clause 26C9, wherein the super cell and the another super cell are connected in series.

1C 10. A method, comprising:

laser scribing a scribe line on a silicon wafer to define a solar cell region;

applying a conductive adhesive bonding material to the top surface of the scribed silicon wafer adjacent the long edge of the solar cell region; and

the silicon wafer is singulated along the scribe lines to provide a solar cell strip comprising a portion of the conductive adhesive bonding material disposed adjacent a long side of the solar cell strip.

2C 10. The method of clause 1C10, further comprising providing the silicon wafer with a metallization pattern such that the segmenting produces a solar cell strip having the metallization pattern along the long side.

3C 10. The method of clause 2C10, wherein the metallization pattern comprises a bus or discrete contact pads.

4C 10. The method of clause 2C10, wherein the providing comprises printing the metallization pattern.

5C 10. The method of clause 2C10, wherein the providing comprises electroplating the metallization pattern.

6C 10. The method of clause 2C10, wherein the metallization pattern includes features configured to limit spreading of the conductive adhesive bonding material.

7C 10. The apparatus of clause 6C10, wherein the feature comprises a moat.

8C 10. The method of clause 1C10, wherein the applying comprises printing.

9C 10. The method of clause 1C10, wherein the applying comprises depositing using a mask.

10C 10. The method of clause 1C10, wherein the length of the long side of the solar cell strip replicates the shape of the wafer.

11C 10. The method of clause 10C10, wherein the length is 156mm or 125 mm.

12C 10. The method of clause 10C10, wherein the aspect ratio between the width and the length of the solar cell strip is between about 1:2 to about 1: 20.

13C 10. The method of clause 1C10, wherein the segmenting comprises:

a vacuum is applied between the bottom surface of the wafer and the curved support surface to bend the solar cell region against the curved support surface and thereby cut the silicon wafer along the scribe line.

14C 10. The method of clause 1C10, further comprising:

arranging a plurality of solar cell strips in a line with long sides of adjacent solar cell strips overlapping and a portion of conductive adhesive bonding material disposed therebetween; and

the conductive bonding material is cured, thereby bonding adjacent overlapping solar cell strips to each other and electrically connecting them in series.

15C 10. The method of clause 14C10, wherein the curing comprises applying heat.

16C 10. The method of clause 14C10, wherein the curing comprises applying pressure.

17C 10. The method of clause 14C10, wherein the arranging comprises forming a layered structure.

18C 10. The method of clause 17C10, wherein the curing comprises applying heat and pressure to the layered structure.

19C 10. The method of clause 17C10, wherein the layered structure comprises an encapsulant.

20C 10. The method of clause 19C10, wherein the encapsulant comprises a thermoplastic polymer.

21C 10. The method of clause 20C10, wherein the thermoplastic polymer comprises a thermoplastic olefin polymer.

22C 10. The method of clause 17C10, wherein the layered structure comprises a backing sheet.

23C 10. The method of clause 22C10, wherein:

the backing plate is white; and is

The layered structure further comprises dark stripes.

24C 10. The method of clause 14C10, wherein the arranging comprises arranging at least nineteen solar cell strips in a line.

25C 10. The method of clause 24C10, wherein each of the at least nineteen solar cell strips has a breakdown voltage of at least 10V.

26C 10. The method of clause 24C10, further comprising placing the at least nineteen solar cell strips in communication with only a single bypass diode.

27C 10. The method of clause 26C10, further comprising forming a ribbon wire between one of the at least nineteen solar cell strips and the single bypass diode.

28C 10. The method of clause 27C10, wherein the single bypass diode is located in a junction box.

29C 10. The method of clause 28C10, wherein the junction box is located on the back side of a solar module in a paired arrangement with another junction box of a different solar module.

30C 10. The method of clause 14C10, wherein an overlapping cell strip of the plurality of solar cell strips overlaps the solar cell strip by about 1mm to 5 mm.

31C 10. The method of clause 14C10, wherein the solar cell strip includes a first chamfer.

32C 10. The method of clause 31C10, wherein the long side of the plurality of overlapping solar cell strips does not include a second chamfer.

33C 10. The method of clause 32C10, wherein the width of the solar cell strip is greater than the width of the overlapping solar cell strip, such that the solar cell strip and the overlapping solar cell strip have approximately equal areas.

34C 10. The method of clause 31C10, wherein the long edge of the plurality of solar cell strips that overlap the solar cell strips comprises a second chamfer.

35C 10. The method of clause 34C10, wherein a long edge of the overlapping solar cell strips of the plurality of solar cell strips overlaps a long edge of a cell strip comprising a first chamfer.

36C 10. The method of clause 34C10, wherein a long side of the overlapping solar cell strips of the plurality of solar cell strips overlaps a long side of a cell strip that does not include a first chamfer.

37C 10. The method of clause 14C10, further comprising connecting the plurality of solar cell strips with another plurality of solar cell strips using an interconnect.

38C 10. The method of clause 37C10, wherein a portion of the interconnect is covered by a dark film.

39C 10. The method of clause 37C10, wherein a portion of the interconnect is colored.

40C 10. The method of clause 37C10, wherein the plurality of solar cell strips is connected in series with the another plurality of solar cell strips.

1C 11. A method, comprising:

providing a silicon wafer having a length;

scribing scribe lines on the silicon wafer to define a solar cell region;

applying a conductive adhesive bonding material to a surface of the silicon wafer; and

the silicon wafer is singulated along the scribe lines to provide a solar cell strip comprising a portion of the conductive adhesive bonding material disposed adjacent a long side of the solar cell strip.

2C 11. The method of clause 1C11, wherein the scribing comprises laser scribing.

3C 11. The method of clause 2C11, including laser scribing scribe lines and then applying a conductive adhesive bonding material.

4C 11. The method of clause 2C11, including applying a conductive adhesive bonding material to the wafer and then laser scribing the scribe line.

5C 11. The method of clause 4C11, wherein:

the applying comprises applying an uncured conductive adhesive bonding material; and is provided with

The laser scribing includes preventing heat from the laser from curing the uncured conductive adhesive bonding material.

6C 11. The method of clause 5C11, wherein the avoiding includes selecting a laser power and/or a distance between a scribe line and uncured conductive adhesive bonding material.

7C 11. The method of clause 1C11, wherein the applying comprises printing.

8C 11. The method of clause 1C11, wherein the applying comprises depositing using a mask.

9C 11. The method of clause 1C11, wherein the scribe line and conductive adhesive bonding material are located on the surface.

10C 11. The method of clause 1C11, wherein the segmenting comprises:

A vacuum is applied between the wafer surface and the curved support surface to bend the solar cell region against the curved support surface and thereby cut the silicon wafer along the scribe lines.

11C 11. The method of clause 10C11, wherein the segmenting comprises arranging the scribe line at an angle relative to the vacuum manifold.

12C 11. The method of clause 1C11, wherein the separating comprises applying pressure to the wafer using a roller.

13C 11. The method of clause 1C11, wherein the providing comprises providing a silicon wafer with a metallization pattern such that the segmenting produces a solar cell strip having a metallization pattern along a long side.

14C 11. The method of clause 13C11, wherein the metallization pattern comprises a bus or discrete contact pads.

15C 11. The method of clause 13C11, wherein the providing comprises printing the metallization pattern.

16C 11. The method of clause 13C11, wherein the providing comprises electroplating the metallization pattern.

17C 11. The method of clause 13C11, wherein the metallization pattern includes features configured to limit spreading of the conductive adhesive bonding material.

18C 11. The method of clause 1C11, wherein the length of the long side of the solar cell strip replicates the shape of the wafer.

19C 11. The method of clause 18C11, wherein the length is 156mm or 125 mm.

20C 11. The method of clause 18C11, wherein the aspect ratio between the width and the length of the solar cell strip is between about 1:2 to about 1: 20.

21C 11. The method of clause 1C11, further comprising:

arranging a plurality of solar cell strips in a line with long sides of adjacent solar cell strips overlapping and a portion of conductive adhesive bonding material disposed therebetween; and

the conductive bonding material is cured, thereby bonding adjacent overlapping solar cell strips to each other and electrically connecting them in series.

22C 11. The method of clause 21C11, wherein:

the arranging comprises forming a layered structure; and is

The curing includes applying heat and pressure to the layered structure.

23C 11. The method of clause 22C11, wherein the layered structure comprises a thermoplastic olefin polymer encapsulant.

24C 11. The method of clause 22C11, wherein the hierarchical structure comprises:

A white backing plate; and

dark stripes on the white backing plate.

25C 11. The method of clause 21C11, wherein:

a plurality of wafers are arranged on the template;

a conductive adhesive bonding material is dispensed on the plurality of wafers; and is

The plurality of wafers are cells that are simultaneously divided into a plurality of solar cell strips by a jig.

26C 11. The method of clause 25C11, further comprising transporting a plurality of solar cell strips as a group, and wherein the arranging comprises arranging a plurality of solar cell strips into a module.

27C 11. The method of clause 21C11, wherein the arranging comprises arranging at least nineteen solar cell strips having a breakdown voltage of at least 10V in line with only a single bypass diode.

28C 11. The method of clause 27C11, further comprising forming a ribbon wire between one of the at least nineteen solar cell strips and the single bypass diode.

29C 11. The method of clause 28C11, wherein the single bypass diode is located in a first junction box of a first solar module, the first junction box being in a paired arrangement with a second junction box of a second solar module.

30C 11. The method of clause 27C11, further comprising forming a ribbon wire between one of the at least nineteen solar cell strips and a smart switch.

31C 11. The method of clause 21C11, wherein an overlapping cell strip of the plurality of solar cell strips overlaps the solar cell strip by about 1mm to 5 mm.

32C 11. The method of clause 21C11, wherein the solar cell strip comprises a first chamfer.

33C 11. The method of clause 32C11, wherein the long side of the plurality of overlapping solar cell strips does not include a second chamfer.

34C 11. The method of clause 33C11, wherein the width of the solar cell strip is greater than the width of the overlapping solar cell strip, such that the solar cell strip and the overlapping solar cell strip have substantially equal areas.

35C 11. The method of clause 32C11, wherein the long edge of the plurality of solar cell strips that overlap the solar cell strip comprises a second chamfer.

36C 11. The method of clause 35C11, wherein a long side of the overlapping solar cell strips of the plurality of solar cell strips overlaps a long side of a cell strip comprising a first chamfer.

37C 11. The method of clause 35C11, wherein a long side of the overlapping solar cell strips of the plurality of solar cell strips overlaps a long side of a cell strip that does not include a first chamfer.

38C 11. The method of clause 21C11, further comprising connecting the plurality of solar cell strips with another plurality of solar cell strips using an interconnect.

39C 11. The method of clause 38C11, wherein a portion of the interconnect is covered by a dark colored film or is colored.

40C 11. The method of clause 38C11, wherein the plurality of solar cell strips is connected in series with the another plurality of solar cell strips.

1C 12. A method, comprising:

providing a silicon wafer having a length;

scribing scribe lines on the silicon wafer to define a solar cell region;

dividing the silicon wafer along the scribing lines to provide solar cell bars; and

a conductive adhesive bonding material disposed adjacent the long side of the solar cell strip is applied.

2C 12. The method of clause 1C12, wherein the scribing comprises laser scribing.

3C 12. The method of clause 1C12, wherein the applying comprises screen printing.

4C 12. The method of clause 1C12, wherein the applying comprises inkjet printing.

5C 12. The method of clause 1C12, wherein the applying comprises depositing using a mask.

6C 12. The method of clause 1C12, wherein the dividing comprises applying a vacuum between the surface of the wafer and the curved surface.

7C 12. The method of clause 6C12, wherein the curved surface comprises a vacuum manifold and the segmenting comprises orienting the scribe line at an angle relative to the vacuum manifold.

8C 12. The method of clause 7C12, wherein the angle is a right angle.

9C 12. The method of clause 7C12, wherein the angle is not a right angle.

10C 12. The method of clause 6C12, wherein the vacuum is applied by a moving belt.

11C 12. The method of clause 1C12, further comprising:

arranging a plurality of solar cell strips in a line with long sides of adjacent solar cell strips overlapping and a conductive adhesive bonding material disposed therebetween; and

the conductive bonding material is cured to electrically connect adjacent overlapping solar cell strips in series.

12C 12. The method of clause 11C12, wherein the disposing comprises forming a layered structure comprising an encapsulant, the method further comprising laminating the layered structure.

13C 12. The method of clause 12C12, wherein the curing is performed at least partially during lamination.

14C 12. The method of clause 12C12, wherein the curing is not performed simultaneously with laminating.

15C 12. The method of clause 12C12, wherein the laminating comprises applying a vacuum.

16C 12. The method of clause 15C12, wherein the vacuum is applied to a balloon.

17C 12. The method of clause 15C12, wherein the vacuum is applied to a belt.

18C 12. The method of clause 12C12, wherein the encapsulant comprises a thermoplastic olefin polymer.

19C 12. The method of clause 12C12, wherein the hierarchical structure comprises:

a white backing plate; and

dark stripes on the white backing plate.

20C 12. The method of clause 11C12, wherein the providing comprises providing a metallization pattern for a silicon wafer such that the segmenting produces a solar cell strip having a metallization pattern along a long side.

21C 12. The method of clause 20C12, wherein the metallization pattern comprises a bus or discrete contact pads.

22C 12. The method of clause 20C12, wherein the providing comprises printing or electroplating a metallization pattern.

23C 12. The method of clause 20C12, wherein the disposing comprises using features of a metallization pattern to limit propagation of a conductive adhesive bonding material.

24C 12. The method of clause 23C12, wherein the feature is located on the front side of the solar cell strip.

25C 12. The method of clause 23C12, wherein the feature is located on the back side of the solar cell strip.

26C 12. The method of clause 11C12, wherein the length of the long side of the solar cell strip replicates the shape of the wafer.

27C 12. The method of clause 26C12, wherein the length is 156mm or 125 mm.

28C 12. The method of clause 26C12, wherein the aspect ratio between the width and the length of the solar cell strip is between about 1:2 to about 1: 20.

29C 12. The method of clause 11C12, wherein the arranging comprises arranging at least nineteen solar cell strips having a breakdown voltage of at least 10V as first super cells in line with only a single bypass diode.

30C 12. The method of clause 29C12, further comprising applying a conductive adhesive bonding material between the first super cell and the interconnect.

31C 12. The method of clause 30C12, wherein the interconnect connects a first super cell in parallel with a second super cell.

32C 12. The method of clause 30C12, wherein the interconnect connects a first super cell in series with a second super cell.

33C 12. The method of clause 29C12, further comprising forming a ribbon wire between the first super cell and the single bypass diode.

34C 12. The method of clause 33C12, wherein the single bypass diode is located in a first junction box of a first solar module, the first junction box being in a paired arrangement with a second junction box of a second solar module.

35C 12. The method of clause 11C12, wherein the solar cell strip includes a first chamfer.

36C 12. The method of clause 35C12, wherein the long side of the plurality of overlapping solar cell strips does not include a second chamfer.

37C 12. The method of clause 36C12, wherein the width of the solar cell strip is greater than the width of the overlapping solar cell strip, such that the solar cell strip and the overlapping solar cell strip have substantially equal areas.

38C 12. The method of clause 35C12, wherein the long edge of the plurality of solar cell strips that overlap the solar cell strip comprises a second chamfer.

39C 12. The method of clause 38C12, wherein the overlapping solar cell strips of the plurality of solar cell strips have long edges that overlap long edges of the cell strips that include a first chamfer.

40C 12. The method of clause 38C12, wherein the overlapping solar cell strips of the plurality of solar cell strips have long edges that overlap long edges of the cell strips that do not include a first chamfer.

1C 13. An apparatus, comprising:

a semiconductor wafer having a first surface including a first metallization pattern along a first outer edge and a second metallization pattern along a second outer edge opposite the first outer edge, the semiconductor wafer further including a first scribe line between the first metallization pattern and the second metallization pattern.

2C 13. The apparatus of clause 1C13, wherein the first metallization pattern includes discrete contact pads.

3C 13. The apparatus of clause 1C13, wherein the first metallization pattern includes a first finger pointing away from the first outer edge toward the second metallization pattern.

4C 13. The device of clause 3C13, wherein the first metallization pattern further includes a bus extending along the first outer edge and intersecting the first finger.

5C 13. The apparatus of clause 4C13, wherein the second metallization pattern comprises:

a second finger pointing away from the second outer edge toward the first metallization pattern; and

a second bus extending along the second outer edge and intersecting the second finger.

6C 13. The device of clause 3C13, further comprising a conductive adhesive extending along the first outer edge and in contact with the first finger.

7C 13. The apparatus of clause 3C13, wherein the first metallization pattern further comprises a first bypass conductor.

8C 13. The apparatus of clause 3C13, wherein the first metallization pattern further includes a first end lead.

9C 13. The apparatus of clause 1C13, wherein the first metallization pattern comprises silver.

10C 13. The apparatus of clause 9C13, wherein the first metallization pattern comprises a silver paste.

11C 13. The apparatus of clause 9C13, wherein the first metallization pattern comprises discrete contacts.

12C 13. The apparatus of clause 1C13, wherein the first metallization pattern comprises tin, aluminum, or another conductive wire that is less expensive than silver.

13C 13. The apparatus of clause 1C13, wherein the first metallization pattern comprises copper.

14C 13. The apparatus of clause 13C13, wherein the first metallization pattern comprises electroplated copper.

15C 13. The apparatus of clause 13C13, further comprising a passivation scheme for mitigating recombination.

16C 13. The apparatus of clause 1C13, further comprising:

a third metallization pattern on the first surface of the semiconductor wafer not proximate to the first outer edge or the second outer edge; and

a second scribe line between the third metallization pattern and the second metallization pattern, wherein the first scribe line is between the first metallization pattern and the third metallization pattern.

17C 13. The apparatus of clause 16C13, wherein a ratio of a first width defined between a first scribe line and a second scribe line divided by a semiconductor wafer length is between about 1:2 and about 1: 20.

18C 13. The apparatus of clause 17C13, wherein the length is about 156mm or about 125 mm.

19C 13. The apparatus of clause 17C13, wherein the semiconductor wafer comprises a chamfer.

20C 13. The apparatus of clause 19C13, wherein:

the first scribe line and the first outer edge define a first rectangular region, the first rectangular region including two chamfers and a first metallization pattern, an area of the first rectangular region corresponding to a product of a length and a second width less a combined area of the two chamfers, the second width being greater than the first width; and is

The second scribe line and the first scribe line define a second rectangular region, the second rectangular region includes no chamfer and includes a third metallization pattern, and an area of the second rectangular region corresponds to a product of the length and the first width.

21C 13. The apparatus of clause 16C13, wherein the third metallization pattern includes fingers that point toward the second metallization pattern.

22C 13. The apparatus of clause 1C13, further comprising a third metallization pattern on a second surface of the semiconductor wafer opposite the first surface.

23C 13. The apparatus of clause 22C13, wherein the third metallization pattern includes a contact pad proximate to the first scribe line location.

24C 13. The apparatus of clause 1C13, wherein the first scribe line is formed by a laser.

25C 13. The apparatus of clause 1C13, wherein the first scribe line is located in the first surface.

26C 13. The apparatus of clause 1C13, wherein the first metallization pattern includes features configured to limit spreading of the conductive adhesive.

27C 13. The apparatus of clause 26C13, wherein the feature comprises a raised feature.

28C 13. The apparatus of clause 27C13, wherein the first metallization pattern includes a contact pad, and the feature includes a barrier abutting and above the contact pad.

29C 13. The apparatus of clause 26C13, wherein the feature comprises a recessed feature.

30C 13. The method of clause 29C13, wherein the recessed feature comprises a moat.

31C 13. The apparatus of clause 26C13, further comprising a conductive adhesive in contact with the first metallization pattern.

32C 13. The apparatus of clause 31C13, wherein the conductive adhesive is printed.

33C 13. The apparatus of clause 1C13, wherein the semiconductor wafer comprises silicon.

34C 13. The apparatus of clause 33C13, wherein the semiconductor wafer comprises crystalline silicon.

35C 13. The apparatus of clause 33C13, wherein the first front surface is of n-type conductivity.

36C 13. The apparatus of clause 33C13, wherein the first front surface is of p-type conductivity.

37C 13. The apparatus of clause 1C13, wherein:

the first metallization pattern is 5mm or less from the first outer edge; and is

The second metallization pattern is 5mm or less from the second outer edge.

38C 13. The apparatus of clause 1C13, wherein the semiconductor wafer includes a chamfer and the first metallization pattern includes a tapered portion extending around the chamfer.

39C 13. The apparatus of clause 38C13, wherein the tapered portion comprises a bus.

40C 13. The apparatus of clause 38C13, wherein the tapered portion comprises a wire connecting discrete contact pads.

1C 14. A method, comprising:

scribing a first scribing line on the wafer; and

the silicon wafer is divided along the first scribe line using vacuum to provide a solar cell strip.

2C 14. The method of clause 1C14, wherein the scribing comprises laser scribing.

3C 14. The method of clause 2C14, wherein the dividing comprises applying a vacuum between the surface of the wafer and the curved surface.

4C 14. The method of clause 3C14, wherein the curved surface comprises a vacuum manifold.

5C 14. The method of clause 4C14, wherein the wafer is supported on a belt, the belt is moved to a vacuum manifold, and the vacuum is applied through the belt.

6C 14. The method of clause 5C14, wherein the segmenting comprises:

orienting the first scribe line at an angle relative to the vacuum manifold; and

the cut is started at one end of the first scribe line.

7C 14. The method of clause 6C14, wherein the angle is substantially a right angle.

8C 14. The method of clause 6C14, wherein the angle is not substantially a right angle.

9C 14. The method of clause 3C14, further comprising applying an uncured conductive adhesive bonding material.

10C 14. The method of clause 9C14, wherein the first scribe line and the uncured conductive adhesive bonding material are located on the same surface of the wafer.

11C 14. The method of clause 10C14, wherein the laser scribing avoids curing the uncured conductive adhesive bonding material by selecting a laser power and/or a distance between the first scribe line and the uncured conductive adhesive bonding material.

12C 14. The method of clause 10C14, wherein the same surface is opposite a wafer surface, the wafer surface being supported by a belt moving the wafer to a curved surface.

13C 14. The method of clause 12C14, wherein the curved surface comprises a vacuum manifold.

14C 14. The method of clause 9C14, wherein the applying is performed after the scribing.

15C 14. The method of clause 9C14, wherein the applying is performed after the segmenting.

16C 14. The method of clause 9C14, wherein the applying comprises screen printing.

17C 14. The method of clause 9C14, wherein the applying comprises inkjet printing.

18C 14. The method of clause 9C14, wherein the applying comprises depositing using a mask.

19C 14. The method of clause 3C14, wherein the first scribe line is located between:

a first metallization pattern on the wafer surface along the first outer edge, and

a second metallization pattern on the wafer surface along the second outer edge.

20C 14. The method of clause 19C14, wherein the wafer further comprises a third metallization pattern on the surface of the semiconductor wafer not proximate the first outer edge or the second outer edge, and the method further comprises:

Drawing a second scribing line between the third metallization pattern and the second metallization pattern, so that the first scribing line is positioned between the first metallization pattern and the third metallization pattern; and

the silicon wafer is divided along the second scribe line to provide another solar cell strip.

21C 14. The method of clause 20C14, wherein the distance between the first scribe line and the second scribe line forms a width defining an aspect ratio of between about 1:2 and about 1:20, wherein the length of the wafer is about 125mm or about 156 mm.

22C 14. The method of clause 19C14, wherein the first metallization pattern comprises fingers that point to the second metallization pattern.

23C 14. The method of clause 22C14, wherein the first metallization pattern further comprises a bus intersecting the finger.

24C 14. The method of clause 23C14, wherein the bus is within 5mm of the first outer edge.

25C 14. The method of clause 22C14, further comprising an uncured conductive adhesive bonding material in contact with the fingers.

26C 14. The method of clause 19C14, wherein the first metallization pattern includes discrete contact pads.

27C 14. The method of clause 19C14, further comprising printing or electroplating the first metallization pattern on the wafer.

28C 14. The method of clause 3, further comprising:

arranging the solar cell strips in a first super cell comprising at least nineteen solar cell strips, each solar cell strip having a breakdown voltage of at least 10V, wherein the long sides of adjacent solar cell strips overlap, with a conductive adhesive bonding material disposed therebetween; and

the conductive bonding material is cured to electrically connect adjacent overlapping solar cell strips in series.

29C 14. The method of clause 28C14, wherein the disposing comprises forming a layered structure comprising an encapsulant, the method further comprising laminating the layered structure.

30C 14. The method of clause 29C14, wherein the curing is performed at least partially during lamination.

31C 14. The method of clause 29C14, wherein the curing is not performed simultaneously with laminating.

32C 14. The method of clause 29C14, wherein the encapsulant comprises a thermoplastic olefin polymer.

33C 14. The method of clause 29C14, wherein the hierarchical structure comprises:

a white backing plate; and

dark stripes on the white backing plate.

34C 14. The method of clause 28C14, wherein the disposing comprises using a metallization pattern feature to limit propagation of the conductive adhesive bonding material.

35C 14. The method of clause 34C14, wherein the metallization pattern features are located on a front surface of a solar cell strip.

36C 14. The method of clause 34C14, wherein the metallization pattern features are located on the back surface of the solar cell strip.

37C 14. The method of clause 28C14, further comprising applying a conductive adhesive bonding material between the first super cell and an interconnect connecting the second super cell in series.

38C 14. The method of clause 28C14, further comprising forming ribbon wires between individual bypass diodes of the first super cell, the individual bypass diodes located in a first junction box of the first solar module, the first junction box in a paired arrangement with a second junction box of the second solar module.

39C 14. The method of clause 28C14, wherein:

the solar cell strip comprises a first chamfer;

the long sides of the overlapping solar cell strips of the plurality of solar cell strips do not include a second chamfer; and is

The width of the solar cell strip is greater than the width of the overlapping solar cell strip, such that the solar cell strip and the overlapping solar cell strip have substantially equal areas.

40C 14. The method of clause 28C14, wherein:

the solar cell strip comprises a first chamfer;

the long side of the overlapping solar cell strips of the plurality of solar cell strips comprises a second chamfer; and is

The long sides of the overlapping solar cell strips of the plurality of solar cell strips overlap with the long sides of the solar cell strips that do not include the first chamfer.

1C 15. A method, comprising:

forming a first metallization pattern along a first outer edge of a first surface of a semiconductor wafer;

forming a second metallization pattern along a second outer edge of the first surface, the second outer edge being opposite the first outer edge; and

a first scribe line is formed between the first metallization pattern and the second metallization pattern.

2C 15. The method of clause 1C15, wherein:

the first metallization pattern comprises first fingers pointing towards the second metallization pattern; and is

The second metallization pattern comprises second fingers pointing towards the first metallization pattern.

3C 15. The method of clause 2C15, wherein:

the first metallization pattern further comprises a first bus intersecting the first finger and located within 5mm of the first outer edge; and is

The second metallization pattern includes a second bus intersecting the second finger and located within 5mm of the second outer edge.

4C 15. The method of clause 3C15, further comprising:

forming a third metallization pattern on the first surface not along the first outer edge or the second outer edge, the third metallization pattern comprising:

a third bus in parallel with the first bus, an

A third finger pointing to the second metallization pattern; and

and forming a second scribing line between the third metallization pattern and the second metallization pattern, wherein the first scribing line is between the first metallization pattern and the third metallization pattern.

5C 15. The method of clause 4C15, wherein the first scribe line and the second scribe line are separated by a width, the ratio of the width to the length of the semiconductor wafer being between about 1:2 and about 1: 20.

6C 15. The method of clause 5C15, wherein the semiconductor wafer is about 156mm or about 125mm in length.

7C 15. The method of clause 4C15, wherein the semiconductor wafer comprises a chamfer.

8C 15. The method of clause 7C15, wherein:

the first scribe line and the first outer edge define a first solar cell region comprising two chamfers and a first metallization pattern, the first solar cell region having a first area corresponding to a product of a length and a first width of the semiconductor wafer minus a combined area of the two chamfers; and is

The second scribe line and the first scribe line define a second solar cell region, the second solar cell region not including a chamfer and including a third metallization pattern, the second solar cell region having a second area corresponding to a product of the length and a second width narrower than the first width such that the first and second areas are approximately equal.

9C 15. The method of clause 8C15, wherein the length is about 156mm or about 125 mm.

10C 15. The method of clause 4C15, wherein forming the first scribe line and forming the second scribe line comprise laser scribing.

11C 15. The method of clause 4C15, wherein forming the first metallization pattern, forming the second metallization pattern, and forming the third metallization pattern comprises printing.

12C 15. The method of clause 11C15, wherein forming the first metallization pattern, forming the second metallization pattern, and forming the third metallization pattern comprises screen printing.

13C 15. The method of clause 11C15, wherein forming a first metallization pattern comprises forming a plurality of contact pads comprising silver.

14C 15. The method of clause 4C15, wherein forming the first metallization pattern, forming the second metallization pattern, and forming the third metallization pattern comprises electroplating.

15C 15. The method of clause 14C15, wherein the first metallization pattern, the second metallization pattern, and the third metallization pattern comprise copper.

16C 15. The method of clause 4C15, wherein the first metallization pattern comprises aluminum, tin, silver, copper, and/or a wire that is less expensive than silver.

17C 15. The method of clause 4C15, wherein the semiconductor wafer comprises silicon.

18C 15. The method of clause 17C15, wherein the semiconductor wafer comprises crystalline silicon.

19C 15. The method of clause 4C15, further comprising forming a fourth metallization pattern on the second surface of the semiconductor wafer between the first outer edge and within 5mm of the second scribed location.

20C 15. The method of clause 4C15, wherein the first surface comprises a first conductivity type and the second surface comprises a second conductivity type opposite the first conductivity type.

21C 15. The method of clause 4C15, wherein the fourth metallization pattern includes contact pads.

22C 15. The method of clause 3C15, further comprising applying a conductive adhesive to the semiconductor wafer.

23C 15. The method of clause 22C15, further comprising applying a conductive adhesive and contacting the first finger.

24C 15. The method of clause 23C15, wherein applying the conductive adhesive comprises screen printing or depositing with a mask.

25C 15. The method of clause 3C15, further comprising dicing the semiconductor wafer along the first scribe lines to form first solar cell bars comprising a first metallization pattern.

26C 15. The method of clause 25C15, wherein the segmenting comprises applying a vacuum to a first scribe line.

27C 15. The method of clause 26C15, further comprising disposing the semiconductor wafer on a belt moved to vacuum.

28C 15. The method of clause 25C15, further comprising applying a conductive adhesive to the first solar cell strip.

29C 15. The method of clause 25C15, further comprising:

arranging a first solar cell strip in a first super cell, the first super cell comprising at least nineteen solar cell strips, each solar cell strip having a breakdown voltage of at least 10V, wherein the long sides of adjacent solar cell strips overlap, with a conductive adhesive disposed therebetween; and

the conductive adhesive is cured to electrically connect adjacent overlapping solar cell strips in series.

30C 15. The method of clause 29C15, wherein the disposing comprises forming a layered structure comprising an encapsulant, the method further comprising laminating the layered structure.

31C 15. The method of clause 30C15, wherein the curing is performed at least partially during lamination.

32C 15. The method of clause 30C15, wherein the curing is not performed simultaneously with laminating.

33C 15. The method of clause 30C15, wherein the encapsulant comprises a thermoplastic olefin polymer.

34C 15. The method of clause 30C15, wherein the hierarchical structure comprises:

a white backing plate; and

dark stripes on the white backing plate.

35C 15. The method of clause 29C15, wherein the disposing comprises limiting propagation of the conductive adhesive with the metallization pattern feature.

36C 15. The method of clause 35C15, wherein the metallization pattern feature is located on the front surface of the first solar cell strip.

37C 15. The method of clause 29C15, further comprising applying a conductive adhesive between the first super cell and an interconnect connecting the second super cells in series.

38C 15. The method of clause 29C15, further comprising forming ribbon wires between individual bypass diodes of the first super cell, the individual bypass diodes located in a first junction box of the first solar module, the first junction box in a paired arrangement with a second junction box of the second solar module.

39C 15. The method of clause 29C15, wherein:

the first solar cell strip comprises a first chamfer;

the long side of the overlapping solar cell strip of the first super cell does not include a second chamfer; and is

The width of the first solar cell strip is greater than the width of the overlapping solar cell strips, such that the first solar cell strip and the overlapping solar cell strips have substantially equal areas.

40C 15. The method of clause 29C15, wherein:

the first solar cell strip comprises a first chamfer;

the long side of the overlapping solar cell strip of the first super cell comprises a second chamfer; and is

The long side of the overlapping solar cell strip overlaps the long side of the first solar cell strip that does not include the first chamfer.

1C 16. A method, comprising:

obtaining or providing a silicon wafer comprising a front surface metallization pattern comprising a first bus bar or row of contact pads arranged parallel to and adjacent to a first outer edge of the wafer, and a second bus bar or row of contact pads arranged parallel to and adjacent to a second outer edge of the wafer, the second outer edge of the wafer being opposite and parallel to the first edge;

dividing the silicon wafer along one or more scribe lines parallel to the first and second outer edges of the wafer to form a plurality of rectangular solar cells, wherein the first bus bar or row of contact pads is arranged parallel to and adjacent to a long outer edge of a first one of the rectangular solar cells and the second bus bar or row of contact pads is arranged parallel to and adjacent to a long outer edge of a second one of the rectangular solar cells; and is

Arranging the rectangular solar cells in a line with the long sides of adjacent solar cells overlapping and conductively bonded to each other to electrically connect the solar cells in series to form a super cell;

wherein the first bus or row of contact pads of the first rectangular solar cell overlaps and is conductively bonded to a bottom surface of an adjacent rectangular solar cell in the super cell.

2C 16. The method of clause 1C16, wherein a second bus bar or row of contact pads on a second rectangular solar cell overlaps and is conductively bonded to a bottom surface of an adjacent rectangular solar cell in the super cell.

3C 16. The method of clause 1C16, wherein the silicon wafer is a square or quasi-square silicon wafer.

4C 16. The method of clause 3C16, wherein the silicon wafer has sides of about 125mm in length or about 156mm in length.

5C 16. The method of clause 3C16, wherein the ratio of the length to the width of each rectangular solar cell is between about 2:1 and about 20: 1.

6C 16. The method of clause 1C16, wherein the silicon wafer is a crystalline silicon wafer.

7C 16. The method of clause 1C16, wherein the first bus bar or row of contact pads and the second bus bar or row of contact pads are located in an edge region of the silicon wafer that is less efficient at converting light to electricity than a center region of the silicon wafer.

8C 16. The method of clause 1C16, wherein the front surface metallization pattern includes a first plurality of parallel fingers electrically connected to a first bus or row of contact pads and extending inwardly from a first outer edge of the wafer, and a second plurality of parallel fingers electrically connected to a second bus or row of contact pads and extending inwardly from a second outer edge of the wafer.

9C 16. The method of clause 1C16, wherein the front surface metallization pattern includes at least a third bus bar or row of contact pads oriented parallel to and between the first bus bar or row of contact pads and the second bus bar or row of contact pads, and a third plurality of parallel fingers oriented perpendicular to and electrically connected to the third bus bar or row of contact pads, and the third bus bar or row of contact pads is arranged parallel to and adjacent to a long outer edge of a third rectangular solar cell after the silicon wafer is singulated to form the plurality of rectangular solar cells.

10C 16. The method of clause 1C16, including applying a conductive adhesive to a first bus bar or row of contact pads, thereby conductively bonding a first rectangular solar cell to an adjacent solar cell.

11C 16. The method of clause 10C16, wherein the metallization pattern comprises a barrier configured to limit conductive adhesive spread.

12C 16. The method of clause 10C16, including applying the conductive adhesive by screen printing.

13C 16. The method of clause 10C16, including applying the conductive adhesive by inkjet printing.

14C 16. The method of clause 10C16, wherein a conductive adhesive is applied before forming scribe lines in the silicon wafer.

15C 16. The method of clause 1C16, wherein dividing the silicon wafer along the one or more scribe lines comprises applying a vacuum between the bottom surface of the silicon wafer and the curved support surface to bend the silicon wafer against the curved support surface to cut the silicon wafer along the one or more scribe lines.

16C 16. The method of clause 1C16, wherein:

the silicon wafer is a quasi-square silicon wafer comprising chamfers, and the plurality of rectangular solar cells are formed after the silicon wafer is diced, one or more of the rectangular solar cells comprising one or more of the chamfers; and is

Selecting the spacing between the scribed lines to compensate for the chamfers by making the width perpendicular to the major axis of the rectangular solar cell comprising a chamfer larger than the width perpendicular to the major axis of the rectangular solar cell lacking a chamfer so that the area of each of the plurality of rectangular solar cells in the super cell exposed to sunlight is substantially equal during operation of the super cell.

17C 16. The method of clause 1C16, including disposing a super cell in a layered structure between a transparent front sheet and a back sheet, and laminating the layered structure.

18C 16. The method of clause 17C16, wherein laminating the layered structure completes curing of a conductive adhesive between adjacent rectangular solar cells disposed in a super cell to conductively bond the adjacent rectangular solar cells to each other.

19C 16. The method of clause 17C16, wherein the super cells are arranged in the layered structure in one of two or more parallel rows of super cells, and the back plate is a white plate comprising parallel dark stripes having locations and widths corresponding to the locations and widths of the gaps between the two or more parallel rows of super cells, such that the white portions of the back plate are not visible through the gaps between rows of super cells in an assembled module.

20C 16. The method of clause 17C16, wherein the front and back panels are glass panels and the super cell is encapsulated in a thermoplastic olefin layer sandwiched between the glass panels.

21C 16. The method of clause 1C16, including arranging a super cell in a first module including a junction box in a mating arrangement with a second junction box of a second solar module.

1D. A solar module, comprising:

a plurality of super cells arranged in two or more parallel rows, each super cell comprising a plurality of rectangular or substantially rectangular silicon solar cells arranged in a line, wherein the long sides of adjacent silicon solar cells overlap and are directly conductively bonded to each other to electrically connect the silicon solar cells in series;

a first hidden tap contact pad located on a back surface of a first solar cell, the first solar cell located at an intermediate position along a first super cell; and

a first electrical interconnect conductively bonded to the first hidden tap contact pad;

wherein the first electrical interconnect includes stress relief features that accommodate differential thermal expansion between the electrical interconnect and a silicon solar cell to which the electrical interconnect is bonded.

And 2D. The solar module of clause 1D, including a second hidden tap contact pad on a back surface of a second solar cell, the second solar cell located proximate to the first solar cell and at an intermediate position along the second super cell, wherein the first hidden tap contact pad is electrically connected to the second hidden tap contact pad by a first electrical interconnect.

And 3D. The solar module of clause 2D, wherein the first electrical interconnect extends through a gap between the first super cell and the second super cell and is conductively bonded to the second hidden tap contact pad.

And 4D. The solar module of clause 1D, comprising: a second hidden tap contact pad located on a back surface of a second solar cell, the second solar cell located at another intermediate position along the first super cell; a second electrical interconnect conductively bonded to a second hidden tap contact pad; and a bypass diode electrically connected in parallel with the solar cell between the first hidden tap contact pad and the second hidden tap contact pad using the first electrical interconnect and the second electrical interconnect.

And 5D. The solar module of clause 1D, wherein the first hidden tap contact pad is one of a plurality of hidden tap contact pads disposed on the back surface of the first solar cell in a row extending parallel to the long axis of the first solar cell, and wherein the first electrical interconnect is conductively bonded to each of the plurality of hidden contacts and has a span along the long axis that is substantially equal to the length of the first solar cell.

And 6D. The solar module of clause 1D, wherein a first hidden tap contact pad is positioned adjacent a short side of the back surface of the first solar cell, the first electrical interconnect does not extend substantially inward from the hidden tap contact pad along the long axis of the solar cell, and the back surface metallization pattern on the first solar cell provides a conductive path for the interconnect, the conductive path having a sheet resistance of less than or equal to about 5 ohms per square.

And 7D. The solar module of clause 6D, wherein the sheet resistance is less than or equal to about 2.5 ohms per square.

And 8D. The solar module of clause 6D, wherein the first interconnect comprises two tabs positioned on opposite sides of the stress relief feature, and wherein one tab is conductively bonded to the first hidden tap contact pad.

9D. The solar module of clause 8D, wherein the two tabs have different lengths.

10D. The solar module of clause 1D, wherein the first electrical interconnect includes an alignment feature that identifies a desired alignment with the first hidden tap contact pad.

11D. The solar module of clause 1D, wherein the first electrical interconnect comprises an alignment feature that identifies a desired alignment with an edge of the first super cell.

12D. The solar module according to clause 1D, being arranged in an overlapping manner with another solar module electrically connected thereto in an overlapping region.

13D. A solar module, comprising:

a glass front plate;

a back plate;

a plurality of super cells arranged in two or more parallel rows between the glass front and back plates, each super cell comprising a plurality of rectangular or substantially rectangular silicon solar cells arranged in a line, wherein long sides of adjacent silicon solar cells overlap and are directly flexibly conductively bonded to each other to electrically connect the silicon solar cells in series; and

a first flexible electrical interconnect rigidly, conductively bonded to a first of the plurality of super cells;

Wherein the flexible conductive bond between the overlapping solar cells provides mechanical compliance to the super cell to accommodate thermal expansion mismatch between the super cell and the glass front sheet in a direction parallel to the rows of super cells within a temperature range of about-40 ℃ to about 100 ℃ without damaging the solar module; and is

Wherein the rigid conductive bond between the first super cell and the first flexible electrical interconnect forces the first flexible electrical interconnect to accommodate a thermal expansion mismatch between the first super cell and the first flexible electrical interconnect in a direction perpendicular to the row of super cells within a temperature range of about-40 ℃ to about 180 ℃ without damaging the solar module.

14D. The solar module of clause 13D, wherein the conductive bond between overlapping adjacent solar cells within the super cell and the conductive bond between the super cell and the flexible electrical interconnect utilize different conductive adhesives.

15D, and (3) a step of removing the film. The solar module of clause 14D, wherein the two conductive adhesives are curable in the same processing step.

16D. The solar module of clause 13D, wherein the conductive bond on one side of at least one solar cell within a super cell utilizes a different conductive adhesive than the conductive bond on the other side of the solar cell.

17D. The solar module of clause 16D, wherein the two conductive adhesives are curable in the same processing step.

18D. The solar module of clause 13D, wherein the conductive engagement between overlapping adjacent solar cells accommodates differential motion between each cell and the glass front sheet of greater than or equal to about 15 microns.

19D. The solar module of clause 13D, wherein the conductive bond between overlapping adjacent solar cells has a thickness in the direction perpendicular to the solar cells of less than or equal to about 50 microns and a thermal conductivity in the direction perpendicular to the solar cells of greater than or equal to about 1.5W/(m-K).

20D. The solar module of clause 13D, wherein the first flexible electrical interconnect itself undergoes thermal expansion or contraction greater than or equal to about 40 microns.

21D. The solar module of clause 13D, wherein the portion of the first flexible electrical interconnect conductively bonded to the super cell is ribbon-shaped, formed of copper, and has a thickness perpendicular to a surface thereof bonded to the solar cell of less than or equal to about 50 microns.

22D. The solar module of clause 21D, wherein the portion of the first flexible electrical interconnect conductively bonded to the super cell is ribbon-shaped, formed of copper, and has a thickness perpendicular to a surface thereof bonded to the solar cell of less than or equal to about 30 microns.

23D. The solar module of clause 21D, wherein the first flexible electrical interconnect comprises an integral conductive copper portion that is not bonded to the solar cell and that provides a higher conductivity than the portion of the first flexible electrical interconnect that is conductively bonded to the solar cell.

24D. The solar module of clause 21D, wherein in the plane of the solar cell surface, the first flexible electrical interconnect has a width in a direction perpendicular to a current flow direction through the interconnect that is greater than or equal to about 10 mm.

25D. The solar module of clause 21D, wherein the first flexible electrical interconnect is conductively bonded to a wire in the vicinity of the solar cell that provides a higher conductivity than the first electrical interconnect.

26D. The solar module according to clause 13D, being arranged in overlapping fashion with another solar module electrically connected thereto in the overlapping region.

27D. A solar module, comprising:

a plurality of super cells arranged in two or more parallel rows, each super cell comprising a plurality of rectangular or substantially rectangular silicon solar cells arranged in a line, wherein the long sides of adjacent silicon solar cells overlap and are directly conductively bonded to each other to electrically connect the silicon solar cells in series; and

A hidden tap contact pad on the back surface of the first solar cell, the hidden tap contact pad not conducting a large current during normal operation;

wherein the first solar cell is located at an intermediate position along a first one of the super cells in a first row of the super cells and the hidden tap contact pad is electrically connected in parallel to at least a second one of the solar cells in a second row of the super cells.

28D. The solar module of clause 27D, including an electrical interconnect bonded to and electrically interconnecting a hidden tap contact pad to a second solar cell, wherein a span of the electrical interconnect is not substantially equal to a length of the first solar cell, and the back surface metallization pattern on the first solar cell provides a conductive path for the hidden tap contact pad, the conductive path having a sheet resistance of less than or equal to about 5 ohms per square.

29D. The solar module of clause 27D, wherein the plurality of super cells are arranged in three or more parallel rows having a span equal to the width of the solar module in a direction perpendicular to the rows, and the hidden tap contact pads are electrically connected to hidden contact pads on at least one solar cell in each super cell row to electrically connect the super cell rows in parallel, and at least one bus connection connected to at least one hidden tap contact pad or to an interconnect between hidden tap contact pads is connected to a bypass diode or other electronic device.

30D. The solar module of clause 27D, including a flexible electrical interconnect conductively bonded to the hidden tap contact pad to electrically connect it to a second solar cell, wherein:

a portion of the flexible electrical interconnect conductively bonded to the hidden tap contact pad is ribbon-shaped, formed of copper, and has a thickness in a direction perpendicular to the surface of the flexible electrical interconnect bonded to the solar cell of less than or equal to about 50 microns; and is

The conductive engagement between the hidden tap contact pad and the flexible electrical interconnect forces the flexible electrical interconnect to withstand a thermal expansion mismatch between the first solar cell and the flexible electrical interconnect and accommodates relative motion between the first solar cell and the second solar cell caused by thermal expansion within a temperature range of about-40 ℃ to about 180 ℃ without the relative motion damaging the solar module.

31D, and (3). The solar module of clause 27D, wherein the first hidden contact pad can conduct a current greater than a current generated in any individual solar cell when the solar module is in operation.

32D. The solar module of clause 27D, wherein the front surface of the first solar cell overlying the first hidden tap contact pad is not occupied by a contact pad or any other interconnect feature.

33D. The solar module of clause 27D, wherein any region on the front surface of the first solar cell that is not overlapped by a portion of an adjacent solar cell in the first super cell is not occupied by a contact pad or any other interconnect feature.

34D. The solar module of clause 27D, wherein a majority of the cells in each super cell do not have hidden tap contact pads.

35D. The solar module of clause 34D, wherein a cell with a hidden tap contact pad may have a larger light collection area than a cell without a hidden tap contact pad.

36D. The solar module according to clause 27D, being arranged in overlapping fashion with another solar module electrically connected thereto in the overlapping region.

37D. A solar module, comprising:

a glass front plate;

a back plate;

a plurality of super cells arranged in two or more parallel rows between the glass front and back plates, each super cell comprising a plurality of rectangular or substantially rectangular silicon solar cells arranged in a line, wherein long sides of adjacent silicon solar cells overlap and are directly flexibly conductively bonded to each other to electrically connect the silicon solar cells in series; and

A first flexible electrical interconnect rigidly, conductively bonded to a first of the plurality of super cells;

wherein the flexible conductive bond between the overlapping solar cells is formed from a first conductive adhesive and the flexible conductive bond has a shear modulus of less than or equal to about 800 megapascals. And is

Wherein the rigid conductive bond between the first super cell and the first flexible electrical interconnect is formed from a second conductive adhesive and has a shear modulus greater than or equal to about 2000 megapascals.

38D. The solar module of clause 37D, wherein the first conductive adhesive and the second conductive adhesive are different, but the two conductive adhesives can be cured in the same processing step.

39D. The solar module of clause 37D, wherein the conductive bond between overlapping adjacent solar cells has a thickness in the direction perpendicular to the solar cells of less than or equal to about 50 microns and a thermal conductivity in the direction perpendicular to the solar cells of greater than or equal to about 1.5W/(m-K).

40D. The solar module according to clause 37D, being arranged in overlapping fashion with another solar module electrically connected thereto in the overlapping region.

1E. A solar module, comprising: a number N of greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows, each super cell comprising a plurality of said silicon solar cells arranged in a line, wherein long sides of adjacent silicon solar cells overlap and are conductively bonded to each other to electrically connect said silicon solar cells in series; wherein the super cells are electrically connected to provide a high dc voltage of greater than or equal to about 90 volts.

And 2E. The solar module of clause 1E, comprising one or more flexible electrical interconnects arranged to electrically connect a plurality of super cells in series, thereby providing a high dc voltage.

And 3E. The solar module of clause 2E, comprising module-level power electronics including an inverter for converting a high direct current voltage to an alternating current voltage.

4E. The solar module of clause 3E, wherein the module level power electronics senses the high dc voltage and operates the module at an optimal current-voltage power point.

And 5E. The solar module of clause 1E, including module-level power electronics electrically connected to each pair of adjacent rows of series-connected super cells for electrically connecting one or more pairs of rows of super cells in series to provide the high dc voltage, the module-level power electronics including an inverter for converting the high dc voltage to an ac voltage.

And 6E. The solar module of clause 5E, wherein the module level power electronics sense the voltage across each individual pair of rows of super cells and operate each individual pair of rows of super cells at an optimal current-voltage power point.

And 7E. The solar module of clause 6E, wherein the module level power electronics disconnects a pair of rows of super cells from a circuit providing a high dc voltage if the voltage across the individual pair of rows of super cells is below a threshold.

And 8E. The solar module of clause 1E, comprising module-level power electronics electrically connected to each individual row of super cells for electrically connecting two or more rows of super cells in series to provide a high dc voltage, the module-level power electronics comprising an inverter for converting the high dc voltage to an ac voltage.

And 9E. The solar module of clause 8E, wherein the module level power electronics sense the voltage across each individual row of super cells and operate each individual row of super cells at an optimal current-voltage power point.

10E. The solar module of clause 9E, wherein the module level power electronics disconnects the individual row of super cells from the circuit providing the high dc voltage if the voltage across the individual row of super cells is below a threshold.

11E. The solar module of clause 1E, including module-level power electronics electrically connected to each individual super cell for electrically connecting two or more super cells in series to provide a high dc voltage, the module-level power electronics including an inverter for converting the high dc voltage to an ac voltage.

12E. The solar module of clause 11E, wherein the module level power electronics sense the voltage across each individual super cell and operate each individual super cell at an optimal current-voltage power point.

13E. The solar module of clause 12E, wherein the module level power electronics disconnects an individual super cell from the circuit providing the high dc voltage if the voltage across the individual super cell is below a threshold.

14E. The solar module of clause 1E, wherein each super cell is electrically segmented into a plurality of segments by hidden taps, the solar module comprising module level power electronics electrically connected to each segment in each super cell through the hidden taps for electrically connecting two or more segments in series to provide a high dc voltage, the module level power electronics comprising an inverter for converting the high dc voltage to an ac voltage.

15E, and (5). The solar module of clause 14E, wherein the module level power electronics sense the voltage across each individual segment in each super cell and operate each individual segment at an optimal current-voltage power point.

16E. The solar module of clause 15E, wherein the module level power electronics disconnects an individual segment from a circuit providing a high dc voltage if the voltage across the individual segment is below a threshold.

17E. The solar module of any of clauses 4E, 6E, 9E, 12E, or 15E, wherein the optimal current-voltage power point is a maximum current-voltage power point.

18E. The solar module of any of clauses 3E-17E, wherein the module level power electronics lacks a dc-to-dc boost component.

19E. The solar module of any of clauses 1E-18E, wherein N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

20E. The solar module of any of clauses 1E-19E, wherein the high direct current voltage is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

21E. A solar photovoltaic system, comprising:

two or more solar modules electrically connected in parallel; and

an inverter;

wherein each solar module comprises a number N of rectangular or substantially rectangular silicon solar cells greater than or equal to about 150, the silicon solar cells arranged in a plurality of super cells in two or more parallel rows, each super cell in each module comprising two or more of the silicon solar cells arranged in a line in the module, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other to electrically connect the silicon solar cells in series, and the super cells in each module are electrically connected such that the module provides a high voltage DC output of greater than or equal to about 90 volts; and is

Wherein the inverter is electrically connected to two or more solar modules to convert the high voltage dc output of the modules to ac power.

22E. The solar photovoltaic system of clause 21E, wherein each solar module comprises one or more flexible electrical interconnects arranged to electrically connect the super cells in the solar module in series, thereby providing a high voltage dc output of the solar module.

23E. The solar photovoltaic system of clause 21E, comprising at least a third solar module electrically connected in series with a first solar module of the two or more solar modules electrically connected in parallel, wherein the third solar module comprises a number N' of rectangular or substantially rectangular silicon solar cells greater than or equal to about 150, the silicon solar cells are arranged in a plurality of super cells in two or more parallel rows, each super cell in the third solar module comprises two or more of the silicon solar cells arranged in line in the module, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other to electrically connect the silicon solar cells in series, and the super cells in the third solar module are electrically connected such that the module provides a high voltage dc output of greater than or equal to about 90 volts.

24E. The solar photovoltaic system of clause 23E, comprising at least a fourth solar module electrically connected in series with a second solar module of the two or more solar modules electrically connected in parallel, wherein the fourth solar module comprises a number N' of rectangular or substantially rectangular silicon solar cells greater than or equal to about 150, the silicon solar cells are arranged in a plurality of super cells in two or more parallel rows, each super cell in the fourth solar module comprises two or more of the silicon solar cells arranged in a line in the module, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other to electrically connect the silicon solar cells in series, and the super cells in the fourth solar module are electrically connected such that the module provides a high voltage dc output of greater than or equal to about 90 volts.

25E. The solar photovoltaic system of clauses 21E-24E, comprising a fuse arranged to prevent power generated by any one solar module from being dissipated by a short circuit occurring to the other solar module.

26E. The solar photovoltaic system of any of clauses 21E-25E, comprising a current blocking diode arranged to prevent power generated by any one solar module from being dissipated by a short circuit occurring with the other solar module.

27E. The solar photovoltaic system of any of clauses 21E-26E, comprising a positive bus to which two or more solar modules are electrically connected in parallel and a negative bus to which an inverter is also electrically connected.

28E. The solar photovoltaic system of any of clauses 21E-26E, comprising a combiner box to which two or more solar modules are electrically connected by separate wires and which electrically connects solar modules in parallel.

29E. The solar photovoltaic system of clause 28E, wherein the combiner box comprises fuses arranged to prevent power generated by any one solar module from being dissipated by a short circuit to the other solar modules.

30E. The solar photovoltaic system of clause 28E or clause 29E, wherein the combiner box comprises a current blocking diode arranged to prevent power generated by other solar modules from being dissipated due to a short circuit occurring with any one solar module.

31E, and (3). The solar photovoltaic system of any of clauses 21E-30E, wherein the inverter is configured to operate the solar module at a direct current voltage above a minimum value, the minimum value set to avoid module back-biasing.

32E. The solar photovoltaic system of any of clauses 21E-30E, wherein the inverter is configured to identify a reverse bias condition and operate the solar module at a voltage that avoids the reverse bias condition.

33E. The solar module of any of clauses 21E-32E, wherein N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

34E. The solar module of any of clauses 21E-33E, wherein the high direct current voltage is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

35E. The solar photovoltaic system of any of clauses 21E-34E, positioned on a roof.

36E. A solar photovoltaic system, comprising:

A first solar module comprising a number N of greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows, each super cell comprising a plurality of said silicon solar cells arranged in a line, wherein long sides of adjacent silicon solar cells overlap and are conductively bonded to each other to electrically connect said silicon solar cells in series; and

an inverter;

wherein the super cell is electrically connected for providing a high DC voltage of greater than or equal to about 90 volts to an inverter which converts the DC power to AC power.

37E. The solar photovoltaic system of clause 36E, wherein the inverter is a micro-inverter integrated with the first solar module.

38E. The solar photovoltaic system of clause 36E, wherein the first solar module comprises one or more flexible electrical interconnects arranged to electrically connect the super cells in the solar module in series, thereby providing a high voltage dc output of the solar module.

39E. The solar photovoltaic system of any of clauses 36E-38E, comprising at least a second solar module electrically connected in series with the first solar module, wherein the second solar module comprises a number N' of greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows, each super cell in the second solar module comprising two or more of the silicon solar cells arranged in a line in the module, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other to electrically connect the silicon solar cells in series, and the super cells of the second solar module are electrically connected such that the module provides a high voltage dc output of greater than or equal to about 90 volts.

40E. The solar module of any of clauses 36E-39E, wherein the inverter lacks a dc-to-dc boost component.

41E. The solar module of any of clauses 36E-40E, wherein N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

42E. The solar module of any of clauses 36E-41E, wherein the high direct current voltage is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

43E. A solar module, comprising:

greater than or equal to about 250N rectangular or substantially rectangular silicon solar cells arranged in a plurality of series connected super cells in two or more parallel rows, each super cell comprising a plurality of said silicon solar cells arranged in a line, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other with an electrically and thermally conductive adhesive to electrically connect said silicon solar cells in said super cells in series; and

Less than one bypass diode per 25 solar cells;

wherein the adhesive that is both electrically and thermally conductive forms bonds between adjacent solar cells, the bonds having a thickness in a direction perpendicular to the solar cells of less than or equal to about 50 microns and a thermal conductivity in the direction perpendicular to the solar cells of greater than or equal to about 1.5W/(m-K).

44E. The solar module of clause 43E, wherein the super cell is encapsulated in a thermoplastic olefin layer between a front sheet and a back sheet.

45E. The solar module of clause 43E, wherein the super cell is encapsulated between a glass front sheet and a back sheet.

46E. The solar module of clause 43E, comprising less than one bypass diode per 30 solar cells, less than one bypass diode per 50 solar cells, or less than one bypass diode per 100 solar cells, or comprising only a single bypass diode, or comprising no bypass diode.

And 47E. The solar module of clause 43E, comprising no bypass diodes, only a single bypass diode, no more than three bypass diodes, no more than six bypass diodes, or no more than ten bypass diodes.

48E. The solar module of clause 43E, wherein the conductive bond between the overlapping solar cells provides mechanical compliance to the super cells, thereby accommodating a thermal expansion mismatch between the super cells and the glass front sheet in a direction parallel to the rows of super cells within a temperature range of about-40 ℃ to about 100 ℃ without damaging the solar module.

49E. The solar module of any of clauses 43E-48E, wherein N is greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

50E. The solar module of any of clauses 43E-49E, wherein the super cells are electrically connected to provide a high direct current voltage that is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

51E. A solar energy system comprising:

the solar module of clause 43E; and

an inverter electrically connected to the solar module and configured to convert a direct current output from the solar module to provide an alternating current output.

52E. The solar energy system of clause 51E, wherein the inverter lacks a dc-to-dc boost component.

53E. The solar energy system of clause 51E, wherein the inverter is configured to operate the solar module at a direct current voltage above a minimum value, the minimum value set to avoid solar cell reverse bias.

54E. The solar energy system of clause 53E, wherein the minimum voltage value is dependent on temperature.

55E. The solar energy system of clause 51E, wherein the inverter is configured to identify a reverse bias condition and operate the solar module at a voltage that avoids the reverse bias condition.

56E. The solar energy system of clause 55E, wherein the inverter is configured to operate the solar module within a local maximum region of a voltage-current power curve of the solar module to avoid a reverse bias condition.

57E. The solar energy system of any of clauses 51E-56E, wherein the inverter is a micro-inverter integrated with the solar module.

1F. A method of fabricating a solar cell, the method comprising:

advancing the solar cell wafer along the curved surface; and

a vacuum is applied between the curved surface and the bottom surface of the solar cell wafer to bend the solar cell wafer against the curved surface to cut the solar cell wafer along one or more previously prepared scribe lines, thereby separating a plurality of solar cells from the solar cell wafer.

And 2F. The method of clause 1F, wherein the curved surface is a curved portion of an upper surface of a vacuum manifold that applies a vacuum to a bottom surface of a solar cell wafer.

And 3F. The method of clause 2F, wherein the vacuum applied by the vacuum manifold to the bottom surface of the solar cell wafer varies along the direction of travel of the solar cell wafer and reaches a maximum intensity within the area of the vacuum manifold where the solar cell wafer is cut.

4F, and (5). The method of clause 2F or clause 3F, comprising transporting the solar cell wafer along the curved upper surface of the vacuum manifold using a porous belt, wherein a vacuum is applied to the bottom surface of the solar cell wafer through perforations in the porous belt.

And 5F. The method of clause 4F, wherein the perforations are arranged on the porous belt such that the leading and trailing edges of the solar cell wafer along its own direction of travel must overlie at least one perforation on the porous belt.

And 6F. The method of any of clauses 2F-5F, including: advancing a solar cell wafer along a flat region of an upper surface of a vacuum manifold to a transitional curved region having a first curvature in the upper surface of the vacuum manifold; the solar cell wafer is then advanced into a dicing area of the upper surface of the vacuum manifold where the solar cell wafer is diced, the dicing area of the vacuum manifold having a second curvature that is more tightly packed than the first curvature.

And 7F. The method of clause 6F, wherein the curvature of the transition region is defined by a continuous geometric function of increasing curvature.

And 8F. The method of clause 7F, wherein the curvature of the cut region is defined by a continuous geometric function of increasing curvature.

9F. The method of clause 6F, including advancing the diced solar cells into a vacuum manifold having a diced region with a third curvature, the third curvature being tighter than the second curvature.

10F. The method of clause 9F, wherein the curvatures of the transition bend region, the cut region, and the post-cut region are defined by a single continuous geometric function of increasing curvature.

11F. The method of clause 7F, clause 8F, or clause 10F, wherein the continuous geometric function of increasing curvature is a clothoid.

12F. The method of any of clauses 1-11F, including applying a stronger vacuum between the solar cell wafer and the curved surface first at one end of each scribe line and then at the other end of each scribe line to provide an asymmetric stress distribution along each scribe line to facilitate formation of a core of a single cut crack along each scribe line and propagation of the single cut crack along each scribe line.

13F, and (3). The method of any of clauses 1-12F, including removing the diced solar cells from the curved surface, wherein edges of the diced solar cells do not contact prior to removing the solar cells from the curved surface.

14F. The method of any of clauses 1F to 13F, including:

laser scribing the scribing lines on the solar cell wafer; and

applying a conductive adhesive bonding material to a top surface portion of the solar cell wafer prior to dicing the solar cell wafer along the scribe lines;

Wherein each diced solar cell includes a portion of conductive adhesive bonding material disposed along a dicing edge of a top surface thereof.

15F. The method of clause 14F, including laser scribing the scribe line followed by applying the conductive adhesive bonding material.

16F. The method of clause 14F, including applying a conductive adhesive bonding material followed by laser scribing scribe lines.

17F. A method of fabricating a string of solar cells from diced solar cells fabricated by the method of any of clauses 14F to 16F, wherein the diced solar cells are rectangular, the method comprising:

arranging a plurality of rectangular solar cells in a line, wherein long sides of adjacent rectangular solar cells overlap in an overlapping manner, wherein a portion of the conductive adhesive bonding material is disposed between the adjacent rectangular solar cells; and

the conductive bonding material is cured to bond adjacent overlapping rectangular solar cells to each other and electrically connect them in series.

18F. The method of any of clauses 1F-17F, wherein the solar cell wafer is a square or quasi-square silicon solar cell wafer.

And 1G. A method of fabricating a string of solar cells, the method comprising:

forming a back surface metallization pattern on each of the one or more square solar cells;

printing a complete front surface metallization pattern onto each of the one or more square solar cells in a single stencil printing step using a single stencil;

dividing each square solar cell into two or more rectangular solar cells, thereby forming a plurality of rectangular solar cells from the one or more square solar cells, each rectangular solar cell having a complete front surface metallization pattern and a complete back surface metallization pattern;

arranging a plurality of rectangular solar cells in a line, wherein long sides of adjacent rectangular solar cells overlap in an overlapping manner; and

conductively bonding the rectangular solar cells of each pair of adjacent overlapping rectangular solar cells to each other with a conductive bonding material disposed between the two rectangular solar cells for electrically connecting the front surface metallization pattern of one cell of the pair of rectangular solar cells to the back surface metallization pattern of the other cell of the pair of rectangular solar cells, thereby electrically connecting the plurality of rectangular solar cells in series.

And 2G. The method of clause 1G, wherein all portions of the stencil defining the one or more features of the front surface metallization pattern on the one or more square solar cells are restricted to physical connection with other portions of the stencil lying in a plane in which the stencil lies during stencil printing.

And 3G. The method of clause 1G, wherein the front surface metallization pattern on each rectangular solar cell comprises a plurality of fingers oriented perpendicular to the long sides of the rectangular solar cell, and none of the fingers in the front surface metallization pattern are physically connected to each other by the front surface metallization pattern.

And 4G. The method of clause 3G, wherein the fingers have a width of about 10 microns to about 90 microns.

And 5G. The method of clause 3G, wherein the fingers have a width of about 10 microns to about 50 microns.

And 6G. The method of clause 3G, wherein the fingers have a width of about 10 microns to about 30 microns.

And 7G. The method of clause 3G, wherein the fingers have a height of about 10 microns to about 50 microns perpendicular to a front surface of the rectangular solar cell.

And 8G. The method of clause 3G, wherein the fingers have a height of about 30 microns or greater perpendicular to a front surface of the rectangular solar energy.

And 9G. The method of clause 3G, wherein the front surface metallization pattern on each rectangular solar cell comprises a plurality of contact pads arranged parallel to and adjacent to the edges of the long sides of the rectangular solar cell, wherein each contact pad is located at an end corresponding to a finger.

10G. The method of clause 3G, wherein the back surface metallization pattern on each rectangular solar cell comprises a plurality of contact pads arranged in a row parallel to and adjacent to the edges of the long sides of the rectangular solar cells, and each pair of adjacent overlapping rectangular solar cells is arranged such that each back surface contact pad on one solar cell of the pair of rectangular solar cells is aligned with and electrically connected to a corresponding finger in the front surface metallization pattern on the other solar cell of the pair of rectangular solar cells.

11G. The method of clause 3G, wherein the back surface metallization pattern on each rectangular solar cell comprises a bus bar extending parallel to and adjacent to an edge of a long side of the rectangular solar cell, and each pair of adjacent overlapping rectangular solar cells is arranged such that the bus bar on one solar cell of the pair overlaps and is electrically connected to a finger in the front surface metallization pattern on the other solar cell of the pair.

12G. The method of clause 3G, wherein:

the front surface metallization pattern on each rectangular solar cell comprises a plurality of contact pads arranged parallel to and adjacent to the edges of the long sides of the rectangular solar cell, wherein each contact pad is located at an end corresponding to a finger;

the back surface metallization pattern on each rectangular solar cell comprises a plurality of contact pads arranged in a row parallel to and adjacent to the edges of the long sides of the rectangular solar cell; and is

Each pair of adjacent overlapping rectangular solar cells is arranged such that each of the back surface contact pads on one solar cell of the pair of rectangular solar cells is aligned with and electrically connected to a respective contact pad in the front surface metallization pattern on the other solar cell of the pair of rectangular solar cells.

13G. The method of clause 12G, wherein the rectangular solar cells in each pair of adjacent overlapping rectangular solar cells are conductively bonded to each other by discrete portions of electrically conductive bonding material disposed between the overlapping front and back surface contact pads.

14G. The method of clause 3G, wherein the rectangular solar cells in each pair of adjacent overlapping rectangular solar cells are conductively bonded to each other by discrete portions of conductive bonding material disposed between the front surface metallization pattern of one solar cell of the pair of rectangular solar cells and the overlapping ends of the fingers in the back surface metallization pattern of the other solar cell of the pair of rectangular solar cells.

15G. The method of clause 3G, wherein the rectangular solar cells in each pair of adjacent overlapping rectangular solar cells are conductively bonded to each other by a dashed-line or solid-line conductive bonding material disposed between the front-surface metallization pattern of one solar cell in the pair and the overlapping ends of the fingers in the back-surface metallization pattern of the other solar cell in the pair, the dashed-line or solid-line conductive bonding material electrically interconnecting one or more of the fingers.

16G. The method of clause 3G, wherein:

the front surface metallization pattern on each rectangular solar cell comprises a plurality of contact pads arranged parallel to and adjacent to the edges of the long sides of the rectangular solar cell, wherein each contact pad is located at an end corresponding to a finger; and is

The rectangular solar cells in each pair of adjacently overlapping rectangular solar cells are conductively bonded to each other by discrete portions of electrically conductive bonding material disposed between the front surface metallization pattern of one solar cell of the pair of rectangular solar cells and the contact pad in the back surface metallization pattern of the other solar cell of the pair of rectangular solar cells.

17G. The method of clause 3G, wherein:

the front surface metallization pattern on each rectangular solar cell comprises a plurality of contact pads arranged parallel to and adjacent to the edges of the long sides of the rectangular solar cell, wherein each contact pad is located at an end corresponding to a finger; and is

The rectangular solar cells in each pair of adjacently overlapping rectangular solar cells are conductively bonded to each other by a dashed or solid line conductive bonding material disposed between the front surface metallization pattern of one solar cell in the pair and the contact pad in the back surface metallization pattern of the other solar cell in the pair, the dashed or solid line conductive bonding material electrically interconnecting one or more of the fingers.

And 18G. The method of any of clauses 1G-17G, wherein the front surface metallization pattern is formed from a silver paste.

1H. A method of fabricating a plurality of solar cells, the method comprising:

depositing one or more front surface amorphous silicon layers on the front surface of the crystalline silicon wafer, the front surface amorphous silicon layers being irradiated with light during operation of the solar cell;

depositing one or more back surface amorphous silicon layers onto a back surface of a crystalline silicon wafer, the back surface being on an opposite side of a front surface of the crystalline silicon wafer;

patterning the one or more front surface amorphous silicon layers to form one or more front surface trenches in the one or more front surface amorphous silicon layers;

depositing a front surface passivation layer over the one or more front surface amorphous silicon layers and within the front surface trench;

patterning the one or more back surface amorphous silicon layers to form one or more back surface trenches in the one or more back surface amorphous silicon layers, each of the one or more back surface trenches being formed in line with a corresponding one of the front surface trenches;

depositing a back surface passivation layer over the one or more back surface amorphous silicon layers and within the back surface trench; and

The crystalline silicon wafer is cut at one or more cut planes, each cut plane centered or substantially centered on a different pair of corresponding front and back surface grooves.

2H, and (3) 2H. The method of clause 1H, including forming one or more front surface trenches to penetrate through the front surface amorphous silicon layer to the front surface of the crystalline silicon wafer.

And 3H, the reaction product is obtained. The method of clause 1H, including forming one or more back surface trenches to penetrate through the one or more back surface amorphous silicon layers to the back surface of the crystalline silicon wafer.

4H. The method of clause 1H, including forming a front surface passivation layer and a back surface passivation layer with a transparent conductive oxide.

And 5H. The method of clause 1H, including inducing thermal stress in the crystalline silicon wafer using a laser to cut the crystalline silicon wafer at one or more cutting planes.

And 6H. The method of clause 1H, including mechanically slicing the crystalline silicon wafer at one or more slicing planes.

And 7H. The method of clause 1H, wherein the one or more front surface amorphous/crystalline silicon layers form an n-p junction with the crystalline silicon wafer.

And 8H. The method of clause 7H, including cutting the crystalline silicon wafer from its back surface side.

And 9H. The method of clause 1H, wherein the one or more back surface amorphous/crystalline silicon layers form an n-p junction with the crystalline silicon wafer.

10H. The method of clause 9H, including cutting the crystalline silicon wafer from its front surface side.

11H. A method of fabricating a plurality of solar cells, the method comprising:

forming one or more trenches in a first surface of a crystalline silicon wafer;

depositing one or more layers of amorphous silicon onto a first surface of a crystalline silicon wafer;

depositing a passivation layer into the trench and onto the one or more amorphous silicon layers on the first surface of the crystalline silicon wafer;

depositing one or more amorphous silicon layers onto a second surface of the crystalline silicon wafer, the second surface being on an opposite side of the first surface of the crystalline silicon wafer;

cutting the crystalline silicon wafer at one or more cut planes, each cut plane centered or substantially centered on a different one of the one or more trenches.

12H. The method of clause 11H, including forming a passivation layer with a transparent conductive oxide.

13H. The method of clause 11H, including using a laser to induce thermal stress in the crystalline silicon wafer to cut the crystalline silicon wafer at one or more cutting planes.

14H. The method of clause 11H, including mechanically slicing the crystalline silicon wafer at one or more slicing planes.

15H, and (5). The method of clause 11H, wherein the one or more front surface amorphous/crystalline silicon layers form an n-p junction with the crystalline silicon wafer.

16H, and (3) carrying out the reaction. The method of clause 11H, wherein the one or more back surface amorphous/crystalline silicon layers form an n-p junction with the crystalline silicon wafer.

17H. The method of clause 11H, wherein the first surface of the crystalline silicon wafer is to be irradiated with light while the solar cell is in operation.

18H. The method of clause 11H, wherein the second surface of the crystalline silicon wafer is to be irradiated with light while the solar cell is in operation.

19H, and (3). A solar panel, comprising:

a plurality of super cells, each super cell comprising a plurality of solar cells arranged in a line, wherein ends of adjacent solar cells overlap and are conductively bonded to each other in an overlapping manner, thereby electrically connecting the solar cells in series.

Wherein each solar cell comprises: a crystalline silicon substrate; one or more first surface amorphous silicon layers disposed on a first surface of a crystalline silicon substrate to form an n-p junction; one or more second surface amorphous silicon layers disposed on a second surface of the crystalline silicon substrate, the second surface being on an opposite side of the first surface of the crystalline silicon substrate; and a passivation layer preventing carrier recombination from occurring at an edge of the first surface amorphous silicon layer or an edge of the second surface amorphous silicon layer, or both of the first surface amorphous silicon layer and the second surface amorphous silicon layer.

And 20H. The solar panel of clause 19H, wherein the passivation layer comprises a transparent conductive oxide.

21H, and (3). The solar panel according to clause 19H, wherein the super cells are arranged in a single row or in two or more parallel rows to form a front surface of the solar panel, which front surface is to be irradiated by solar radiation during operation of the solar panel.

Z1. A solar module, comprising:

greater than or equal to about 250N rectangular or substantially rectangular silicon solar cells arranged in a plurality of series connected super cells in two or more parallel rows, each super cell comprising a plurality of said silicon solar cells arranged in a line, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other with an electrically and thermally conductive adhesive to electrically connect said silicon solar cells in said super cells in series; and

one or more bypass diodes;

wherein each pair of adjacent parallel rows in the solar module are electrically connected by a bypass diode that is conductively bonded to a back surface electrical contact on a centrally located solar cell in one of the pair of parallel rows and to a back surface electrical contact on an adjacent solar cell in the other of the pair of parallel rows.

Z2. The solar module of clause Z1, wherein each pair of adjacent parallel rows is electrically connected by at least one other bypass diode conductively bonded to a back surface electrical contact on a solar cell in one of the pair of parallel rows and conductively bonded to a back surface electrical contact on an adjacent solar cell in the other of the pair of parallel rows.

Z3. The solar module of clause Z2, wherein each pair of adjacent parallel rows is electrically connected by at least one other bypass diode conductively bonded to a back surface electrical contact on a solar cell in one of the pair of parallel rows and conductively bonded to a back surface electrical contact on an adjacent solar cell in the other of the pair of parallel rows.

Z4. The solar module of clause Z1, wherein the adhesive that is both electrically and thermally conductive forms bonds between adjacent solar cells, the bonds having a thickness perpendicular to the solar cells of less than or equal to about 50 microns and a thermal conductivity perpendicular to the solar cells of greater than or equal to about 1.5W/(m-K).

Z5. The solar module of clause Z1, wherein the super cell is encapsulated in a thermoplastic olefin layer between a front glass sheet and a back glass sheet.

Z6. The solar module of clause Z1, wherein the conductive bond between the overlapping solar cells provides mechanical compliance to the super cells, accommodating a thermal expansion mismatch between the super cells and the glass front plate in a direction parallel to the rows of super cells in a temperature range of about-40 ℃ to about 100 ℃ so that the thermal expansion mismatch does not damage the solar module.

Z7. The solar module of any of clauses Z1-Z6, wherein N is greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

Z8. The solar module of any of clauses Z1-Z7, wherein the super cells are electrically connected to provide a high direct current voltage that is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

Z9. A solar energy system comprising:

the solar module according to clause Z1; and

an inverter electrically connected to the solar module and configured to convert a direct current output from the solar module to provide an alternating current output.

Z10. The solar energy system of clause Z9, wherein the inverter lacks a dc-to-dc boost component.

Z11. The solar energy system of clause Z9, wherein the inverter is configured to operate the solar module at a direct current voltage above a minimum value, the minimum value being set to avoid solar cell back bias.

Z12. The solar energy system of clause Z11, wherein the minimum voltage value is dependent on temperature.

Z13. The solar energy system of clause Z9, wherein the inverter is configured to identify a reverse bias condition and operate the solar module at a voltage that avoids the reverse bias condition.

Z14. The solar energy system of clause Z13, wherein the inverter is configured to operate the solar module within a local maximum region of a voltage-current power curve of the solar module to avoid a reverse bias condition.

Z15. The solar energy system of any of clauses Z9-Z14, wherein the inverter is a micro-inverter integrated with the solar module.

The disclosure is intended to be illustrative, and not limiting. Additional modifications will be apparent to those skilled in the art in view of this disclosure, and are intended to fall within the scope of the appended claims.

Claims (10)

1. An apparatus for a stacked solar cell, comprising:

a plurality of solar cell strips of a solar cell wafer, each solar cell strip comprising:

a first long edge away from a center of the solar cell wafer;

a second long edge near the center of the solar cell wafer;

a first short edge and a second short edge between the first long edge and the second long edge; and

one or more front metallization patterns arranged linearly along a first long edge away from a center of the solar wafer.

2. The apparatus of claim 1, further comprising:

and a plurality of scribe lines provided between two adjacent solar cell bars among the plurality of solar cell bars of the solar cell wafer.

3. The apparatus of claim 2, wherein,

the first long edge and the second long edge of one or more inner solar cell strips in the plurality of solar cell strips of the solar cell wafer are corresponding scribing lines in the plurality of scribing lines;

The second long edges of a plurality of outer solar cell bars in a plurality of solar cell bars of the solar cell wafer are corresponding scribing lines in the plurality of scribing lines; and

the first long edge of the plurality of outer solar cell strips is an outer edge of the solar cell wafer.

4. The apparatus of claim 3, wherein,

the outer solar cell strip comprises a chamfer between one or both of the first and second short edges and the first long edge.

5. The apparatus of claim 1, wherein,

the one or more pre-metallization patterns comprise one or more of the following features:

a continuous bus bar, a contact pad, a continuous conductive paste, or a discontinuous conductive paste.

6. The apparatus of claim 1, wherein,

the one or more front metallization patterns are disposed on the front surface of the solar cell strip, and each of the plurality of solar cell strips includes one or more back metallization patterns on the back surface thereof, the one or more back metallization patterns being linearly disposed along the second long edge near the center of the solar wafer.

7. The apparatus of claim 6, wherein,

the plurality of solar cell strips are arranged in an overlapping relationship such that the one or more front metallization patterns of the front surface of a first solar cell strip of the plurality of solar cell strips are electrically connected to the one or more back metallization patterns of the back surface of a second solar cell strip of the plurality of solar cell strips.

8. The apparatus of claim 1, wherein,

the one or more front metallization patterns form a mirror image on the front surface of the solar cell wafer relative to a planar line passing through a center of the front surface of the solar cell wafer.

9. The apparatus of claim 1, wherein,

the first long edge of the plurality of outer solar cell bars is the outer edge of the solar cell wafer.

10. The apparatus of claim 9, wherein,

the second long edge of an outer one of the plurality of solar cell bars of the solar cell wafer is a corresponding scribe line between adjacent ones of the plurality of solar cell bars on the front surface of the solar cell wafer.

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