CN108305904B - Overlapping type solar cell module - Google Patents

Abstract

The present invention provides an efficient configuration for a solar cell module comprising solar cells conductively bonded to each other in a shingled manner to form super cells that can be arranged to efficiently utilize the solar energy module area, reduce series resistance and improve module efficiency. The front surface metallization pattern on the solar cell may be configured to enable single-step stencil printing, which is facilitated by the overlapping configuration of the solar cells in the super cell. A solar photovoltaic system may include two or more such high voltage solar cell modules electrically connected in parallel to each other and to an inverter.

Description

Stacked solar cell module

This application is a divisional application based on a Chinese patent application with an application date of May 26, 2015, an application number of 201580027878.7 (international application number of PCT/US2015/032472), and an invention-creation title of "shingled solar cell module" .

CROSS-REFERENCE TO RELATED APPLICATIONS

This international patent application claims priority to the following patent application: US Patent Application No. 14/530,405, filed October 31, 2014, entitled "Shingled Solar Cell Module," November 2014 U.S. Patent Application No. 14/532,293, filed on November 7, 2014, entitled "Shingled Solar Cell Module," and entitled "Shingled Solar Cell Module" U.S. Patent Application No. 14/536,486 to "Shingled Solar Cell Module", U.S. Patent Application No. 14/539,546, filed Nov. 12, 2014, Nov. 2014 U.S. Patent Application No. 14/543,580, filed Nov. 17, entitled "Shingled Solar Cell Module," and "Shingled Solar Cell Module," filed Nov. 19, 2014 U.S. Patent Application No. 14/548,081 to Solar Cell Module), U.S. Patent Application No. 14/550,676, filed Nov. 21, 2014, entitled "Shingled Solar Cell Module," 2014 U.S. Patent Application No. 14/552,761, filed Nov. 25, entitled "Shingled Solar Cell Module," and "Shingled Solar Cell Module," filed Dec. 4, 2014 US Patent Application No. 14/560,577 to Shingled Solar Cell Module, US Patent Application No. 14/566,278, filed December 10, 2014, entitled "Shingled Solar Cell Module," 2014 U.S. Patent Application No. 14/565,820, filed December 10, 2014, entitled "Shingled Solar Cell Module," shingled solar cell module Solar Cell Module) US Patent Application No. 14/577,593, US Patent Application No. 14/586,025, filed December 30, 2014, entitled "Shingled Solar Cell Module", 2014 U.S. Patent Application No. 14/585,917, filed Dec. 30, entitled "Shingled Solar Cell Module," and filed Jan. 12, 2015, entitled "Shingled Solar Cell Module." U.S. Patent Application No. 14/594,439 to Shingled Solar Cell Module, U.S. Patent Application No. 14/605,695, filed Jan. 26, 2015, entitled "Shingled SolarCell Module," 2014 U.S. Provisional Patent Application No. 62/003,223, filed May 27, 2014 entitled "Shingled Solar Cell Module" (Shingled Solar Cell Module) US Provisional Patent Application No. 62/036,215, filed Aug. 27, 2014, US No. 62/042,615 entitled "Shingled Solar Cell Module" Provisional Patent Application, U.S. Provisional Patent Application No. 62/048,858, filed Sep. 11, 2014, entitled "Shingled Solar Cell Module," filed Oct. 15, 2014, and entitled " U.S. Provisional Patent Application No. 62/064,260 to "Shingled Solar Cell Module", No. 62/064,260, filed Oct. 16, 2014, entitled "Shingled Solar Cell Module". 62/064,834 U.S. Provisional Patent Application No. 14/674,983, filed March 31, 2015, entitled "Shingled Solar Cell Panel Employing Hidden Taps", Submitted No. 62/081 titled "Solar Cell Panel Employing Hidden Taps" on November 18, 2014 , 200 U.S. Provisional Patent Application, U.S. Provisional Patent No. 62/113,250, filed Feb. 6, 2015, titled "Shingled Solar Cell Panel Employing Hidden Taps" Application, U.S. Provisional Patent Application No. 62/082,904, filed Nov. 21, 2014, entitled "High Voltage Solar Panel," and entitled "High Voltage Solar Panel," filed Jan. 15, 2015 " (High Voltage Solar Panel) U.S. Provisional Patent Application No. 62/103,816, filed February 4, 2015 U.S. Provisional Patent Application No. 62/111,757 entitled "High Voltage SolarPanel", U.S. Provisional Patent Application No. 62/134,176, filed March 17, 2015, entitled "Solar Cell Cleaving Tools and Methods," filed April 21, 2015, entitled " U.S. Provisional Patent Application No. 62/150,426 to "Shingled Solar CellPanel Comprising Stencil-Printed Cell Metallization" (a shingled solar panel including stencil-printed cell metallization), filed August 11, 2014 and entitled "Solar Cells with U.S. Provisional Patent Application No. 62/035,624 to "Reduced Edge Carrier Recombination", U.S. Design Patent Application No. 29/506,415, filed Oct. 15, 2014, Oct. 2014 US Design Patent Application No. 29/506,755, filed November 20, US Design Patent Application No. 29/508,323, November 5, 2014, US Design Patent Application No. 29/509,586, November 19, 2014 Patent Application, and US Design Patent Application No. 29/509,588, filed November 19, 2014. Each of the patent applications listed above is incorporated herein by reference in its entirety for all purposes.

technical field

The present invention generally relates to solar cell modules in which the solar cells are arranged in a stacked fashion.

Background technique

Humanity needs alternative energy sources to meet the increasing global energy demand. In many geographic areas, electricity generated from solar (eg, photovoltaic) cells, in part from solar resources, is sufficient to meet this demand.

SUMMARY OF THE INVENTION

Disclosed herein are efficient arrangements of solar cells in solar cell modules, and methods of making such solar modules.

In one aspect, a solar module includes a string of rectangular or substantially rectangular solar cells connected in series with a number N greater than or equal to 25, the solar cells having an average breakdown voltage greater than about 10 volts. The solar cells are assembled into one or more super cells, each super cell comprising two or more solar cells arranged in a line, wherein the long sides of adjacent solar cells overlap each other and are both electrically and thermally conductive. The adhesives are conductively bonded to each other. In the solar cell string, no single solar cell or groups of solar cells whose total number is less than N are individually electrically connected in parallel with bypass diodes. Along the super cell, there is efficient thermal conduction through the joined overlapping portions of adjacent solar cells, which facilitates safe and reliable operation of the solar module, and this efficient thermal conduction avoids or reduces the formation of hot spots in reverse-biased solar cells. The super cells can be encapsulated, for example, in thermoplastic olefin polymers sandwiched between glass front and glass back sheets to further enhance the module's resistance to thermal damage. In some variations, N may be greater than or equal to 30, 50, or 100.

A super cell, on the other hand, includes a plurality of silicon solar cells, wherein each silicon solar cell has a rectangular or substantially rectangular front (sun side) surface and a back surface shaped by opposing and parallel A long side, a second long side, and two short side boundaries disposed opposite to each other are defined. Each solar cell includes: a conductive front surface metallization pattern including at least one front surface contact pad disposed adjacent the first long side; and a conductive back surface metallization pattern including at least one front surface contact pad disposed adjacent the second long side back surface contact pad. The silicon solar cells are arranged in line with overlapping first and second long sides of adjacent silicon solar cells, and front and back surface contact pads on adjacent silicon solar cells overlap and are conductively bonded The adhesive bonding materials are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series. The front surface metallization pattern of each silicon solar cell includes a barrier configured to substantially confine the conductive adhesive bonding material to at least one of the conductive adhesive bonding materials prior to curing of the conductive adhesive bonding material during fabrication of the super cell Front surface contact pads.

A super cell, on the other hand, includes a plurality of silicon solar cells, wherein each silicon solar cell has a rectangular or substantially rectangular front (sun side) surface and a back surface shaped by opposing and parallel A long side, a second long side, and two short side boundaries disposed opposite to each other are defined. Each solar cell includes: a conductive front surface metallization pattern including at least one front surface contact pad disposed adjacent the first long side; and a conductive back surface metallization pattern including at least one front surface contact pad disposed adjacent the second long side back surface contact pad. The silicon solar cells are arranged in line with overlapping first and second long sides of adjacent silicon solar cells, and front and back surface contact pads on adjacent silicon solar cells overlap and are conductively bonded The adhesive bonding materials are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series. The back surface metallization pattern of each silicon solar cell includes a barrier configured to substantially confine the conductive adhesive bonding material to at least one of the conductive adhesive bonding materials prior to curing of the conductive adhesive bonding material during fabrication of the super cell back surface contact pad.

In another aspect, a method of making a string of solar cells includes cutting one or more pseudo-square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form a plurality of rectangular silicon solar cells, wherein each silicon solar cell The lengths of the cells along their major axis are substantially equal. The method also includes arranging the rectangular silicon solar cells in line with the long sides of adjacent solar cells overlapping and conductively bonded to each other, thereby electrically connecting the solar cells in series. The plurality of rectangular silicon solar cells include: at least one rectangular solar cell having two chamfers corresponding to corners or portions of corners of a pseudo-square wafer; and one or more rectangular silicon solar cells each lacking the chamfers Solar battery. The spacing between parallel lines along which the pseudo-square wafers are cut by making the width perpendicular to the long axis of the rectangular silicon solar cell including the chamfers greater than the width perpendicular to the long axis of the rectangular silicon solar cell lacking the chamfers Selected so as to compensate for the chamfer; thus, the front surface of each of the plurality of rectangular silicon solar cells in the solar cell string has substantially equal areas exposed to sunlight during operation of the solar cell string.

A super cell, on the other hand, includes a plurality of silicon solar cells arranged in line, wherein the ends of adjacent solar cells overlap and are conductively bonded to each other, thereby electrically connecting the solar cells in series. At least one silicon solar cell has a chamfer corresponding to a corner or a portion of a corner of a pseudo-square silicon wafer from which the silicon solar cell is cut; at least one silicon solar cell lacks a chamfer; during operation of the solar cell string, each The area of the front surface of each silicon solar cell exposed to sunlight is substantially equal.

In another aspect, a method of making two or more super cells includes cutting one or more pseudo-square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form a first multi-surface having chamfered corners. a rectangular silicon solar cell, and a second plurality of rectangular silicon solar cells lacking a chamfer, wherein the chamfer corresponds to a corner or a portion of a corner of a pseudo-square silicon wafer, the second plurality of rectangular silicon solar cells Each cell has a first length that spans equal to the full width of the pseudo-square silicon wafer. The method also includes removing the chamfer from each of the first plurality of rectangular silicon solar cells to form a third plurality of rectangular silicon solar cells lacking the chamfer, the third plurality of rectangular silicon solar cells Each cell has a second length that is shorter than the first length. The method also includes: arranging a second plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and electrically connecting the second plurality of rectangular silicon solar cells in series , thereby forming a solar cell string having a width equal to the first length; and arranging a third plurality of rectangular silicon solar cells in line such that the long sides of adjacent rectangular silicon solar cells overlap and are conductively bonded to each other, and the third plurality of rectangular silicon solar cells are aligned Three plurality of rectangular silicon solar cells are electrically connected in series, thereby forming a solar cell string having a width equal to the second length.

In another aspect, a method of making two or more super cells includes cutting one or more pseudo-square silicon wafers along a plurality of lines parallel to a long edge of each wafer to form a first multi-surface having chamfered corners. a plurality of rectangular silicon solar cells, and a second plurality of rectangular silicon solar cells lacking a chamfer, wherein the chamfer corresponds to a corner or a portion of a corner of a pseudo-square silicon wafer; arranging the first plurality of rectangular silicon solar cells in a straight line , the long sides of adjacent rectangular silicon solar cells are overlapped and conductively bonded to each other to electrically connect the first plurality of rectangular silicon solar cells in series; and the second plurality of rectangular silicon solar cells are arranged in a line such that the phase The long sides of adjacent rectangular silicon solar cells overlap and are conductively bonded to each other, electrically connecting the second plurality of rectangular silicon solar cells in series.

In another aspect, the super cell includes: a plurality of silicon solar cells arranged in line in the first direction, wherein ends of adjacent silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series; and an elongated flexible electrical interconnect, the long axis of which is oriented parallel to a second direction perpendicular to the first direction, the elongated flexible electrical interconnect having the following characteristics: at a plurality of discrete locations, conductively bonded to the front or back surface of a terminal silicon solar cell; extending at least the full width of the terminal solar cell in a second direction; measured perpendicular to the front or back surface of the terminal silicon solar cell , a conductor thickness of less than or equal to about 100 microns; provides a resistance of less than or equal to about 0.012 ohms to current flowing in the second direction; configured to provide flexibility over a temperature range of about -40°C to about 85°C , reconciling the non-uniform expansion in the second direction between the end silicon solar cell and the electrical interconnect.

For example, the conductor thickness of the flexible electrical interconnect can be less than or equal to about 30 microns, measured perpendicular to the front and back surfaces of the end silicon solar cell. The flexible electrical interconnect may extend beyond the super cell in the second direction to provide electrical interconnection in the solar module for at least a second super cell disposed in parallel adjacent to the super cell. Additionally or alternatively, the flexible electrical interconnect may extend beyond the super cell in the first direction to provide electrical interconnection in the solar module for a second super cell disposed in-line and parallel to the super cell.

In another aspect, a solar module includes a plurality of super cells arranged in two or more parallel rows spanning a width equal to the module, thereby forming the front surface of the module. Each super cell includes a plurality of silicon solar cells arranged in line, with ends of adjacent silicon solar cells overlapping and conductively bonded to each other, thereby electrically connecting the silicon solar cells in series. At least one end of a first super cell in the first row adjacent an edge of the module is electrically connected to one end of a second super cell in a second row adjacent the same edge of the module via a flexible electrical interconnect, the flexible The electrical interconnect has the following features: is bonded to the front surface of the first super cell by a conductive adhesive bonding material at a plurality of discrete locations; extends parallel to the edge of the module; and at least a portion thereof is folded over the said first super cell around one end and thus not visible from the front of the module.

In another aspect, a method of making a super cell includes: laser scribing one or more scribe lines on each of the one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cell; Applying a conductive adhesive bonding material to one or more of the scribed silicon solar cells at one or more locations adjacent to the long sides of each rectangular area; dividing the silicon solar cells along the scribed lines, resulting in a plurality of rectangles of silicon solar cells, each rectangular silicon solar cell has a portion of the conductive adhesive bonding material disposed on its front surface adjacent to the long side; a plurality of rectangular silicon solar cells are arranged in a straight line so that the phase The long sides of adjacent rectangular silicon solar cells are overlapped in an overlapping manner with a portion of the conductive adhesive bonding material disposed therebetween; the conductive bonding material is then cured to bond the adjacent overlapping rectangular silicon solar cells to each other and the cells Electrically connected in series.

In another aspect, a method of making a super cell includes: laser scribing one or more scribe lines on each of one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cell; A conductive adhesive bonding material is applied to portions of the top surface of one or more silicon solar cells; a vacuum is applied between the bottom surface of the one or more silicon solar cells and the curved support surface so that one or more The plurality of silicon solar cells are bent against the curved support surface, causing one or more of the silicon solar cells to be cut along the scribed lines, resulting in a plurality of rectangular silicon solar cells, each with a portion on the rectangular silicon solar cell The conductive adhesive bonding material is provided on the front surface thereof adjacent to the long sides; a plurality of rectangular silicon solar cells are arranged in a straight line, so that the long sides of the adjacent rectangular silicon solar cells are overlapped in an overlapping manner, and therebetween A portion of the conductive adhesive bonding material is provided; the conductive bonding material is then cured to bond adjacent overlapping rectangular silicon solar cells to each other and electrically connect the cells in series.

In another aspect, a method of making a solar module includes assembling a plurality of super cells, each super cell comprising a plurality of rectangular silicon solar cells arranged in a line with ends on long sides of adjacent rectangular silicon solar cells in a stacked manner Cover way overlap. The method also includes applying heat and pressure to the super cell to cure the conductive bonding material disposed between the overlapping ends of the adjacent rectangular silicon solar cells, thereby bonding the adjacent overlapping rectangular silicon solar cells to each other, and These batteries are electrically connected in series. The method also includes arranging and interconnecting the super cells into a layer stack with an encapsulant in a desired solar module configuration, and then applying heat and pressure to the layer stack to form a laminate structure.

Some variations of this method include curing or partially curing the conductive bonding material by applying heat and pressure to the super cell prior to applying heat and pressure to the layer stack to form the laminate structure, thereby forming a cured or partially cured super cell Batteries, as an intermediate product before forming a laminate structure. In some variations, when each additional rectangular silicon solar cell is added to the super cell during assembly of the super cell, the conductive adhesive bonding material between the newly added solar cell and the adjacent overlapping solar cell is first made Cured or partially cured before adding any other rectangular silicon solar cells to the super cell. Alternatively, some variations include curing or partially curing all of the conductive bonding material in the super cell in the same step.

If the super cell is formed as a partially cured intermediate product, the method may include completing the curing of the conductive bonding material while applying heat and pressure to the layer stack to form the laminate structure.

Some variations of this method include curing the conductive bonding material while applying heat and pressure to the layer stack to form the laminate without forming a cured or partially cured super cell as an intermediate product prior to forming the laminate.

The method may include cutting one or more standard sized silicon solar cells into a smaller area rectangular shape to provide rectangular silicon solar cells. The conductive adhesive bonding material may be applied to the one or more silicon solar cells prior to dicing the one or more silicon solar cells to provide rectangular silicon solar cells pre-applied with the conductive adhesive bonding material. Alternatively, one or more silicon solar cells may be cut to provide rectangular silicon solar cells before the conductive adhesive bonding material is applied to the rectangular silicon solar cells.

In one aspect, a solar module includes a plurality of super cells arranged in two or more parallel rows. Each super cell includes a plurality of rectangular or substantially rectangular silicon solar cells arranged in line, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded directly to each other, thereby electrically connecting the silicon solar cells in series. The solar panel also includes: a first hidden tap contact pad on the back surface of the first solar cell located midway along the first super cell; and conductively bonded to the first solar cell A first electrical interconnection of the hidden tap contact pads. The first electrical interconnect includes stress relief features that accommodate uneven thermal expansion between the electrical interconnect and the silicon solar cell to which the electrical interconnect is bonded. The term "stress relief feature", as used herein in connection with an interconnect, may refer to geometric features, such as kinks, loops, or slots, and may also refer to the thickness (eg, extremely thin) of the interconnect and/or the ductility of the interconnect . For example, stress relief features may refer to interconnects being formed from very thin copper tape.

The solar module may include a second hidden tap contact pad on the back surface of a second solar cell located adjacent to the first solar cell and located along the second in adjacent rows of super cells An intermediate position of the super cell, where the first hidden tap contact pad is electrically connected to the second hidden tap contact pad through the first electrical interconnect. In such cases, the first electrical interconnect may extend through the gap between the first super cell and the second super cell and be conductively bonded to the second hidden tap contact pad. Alternatively, the electrical connection between the first hidden tap contact pad and the second hidden tap contact pad may include another electrical interconnect conductively bonded to the second hidden tap The taps of the contact pads and are electrically connected (eg, conductively bonded) to the first electrical interconnect. Either interconnection scheme can optionally extend through additional rows of super cells. For example, either interconnection scheme can optionally extend across the full width of the module, interconnecting the solar cells in each row via hidden tap contact pads.

The solar module may include: a second hidden tap contact pad on a back surface of a second solar cell located at another intermediate location along the first super cell; conductively bonded to the first super cell; a second electrical interconnection of two hidden tap contact pads; and a bypass diode utilizing the first electrical interconnection and the second electrical interconnection to communicate with the first hidden tap contact pad and the second electrical interconnection The solar cells are electrically connected in parallel between the two hidden tap contact pads.

In any of the above variations, the first hidden tap contact pads may be a plurality of hidden taps arranged on the back surface of the first solar cells in a row extending parallel to the long axis of the first solar cells one of the tap contact pads wherein the first electrical interconnect is conductively bonded to each of the plurality of hidden contacts and has a span along the long axis substantially equal to the first solar cell length. Additionally or alternatively, the first hidden contact pad may be one of a plurality of hidden tap contact pads arranged on the back surface of the first solar cell in a row extending perpendicular to the long axis of the first solar cell One. In the latter case, for example, the row of hidden tap contact pads may be located adjacent to the short edge of the first solar cell. The first hidden contact pad may be one of a plurality of hidden tap contact pads arranged in a two-dimensional array on the back surface of the first solar cell.

Alternatively, in any of the above variations, the location of the first hidden tap contact pad may be adjacent to the short side of the back surface of the first solar cell, wherein the first electrical interconnect is not along the The long axis of the solar cell extends substantially inwardly from the hidden tap contact pad, and the back surface metallization pattern on the first solar cell provides a conductive path for the interconnect, the conductive path preferably having less than or Sheet resistance equal to about 5 ohms per square, or less than or equal to about 2.5 ohms per square. In such cases, the first interconnect may include, for example, two protrusions disposed on opposite sides of the stress relief feature, one of which conductively engages to the first hidden tap contact pad. The two protrusions may have different lengths.

In any of the above variations, the first electrical interconnect may include alignment features for identifying ideal alignment with the first hidden tap contact pad, with the first super cell is ideally aligned with the edge of , or used to identify whether it is ideally aligned with both the first hidden tap contact pad and the edge of the first super cell.

In another aspect, a solar module includes a glass front sheet, a back sheet, and a plurality of super cells arranged in two or more parallel rows between the glass front sheet and the back sheet. Each super cell comprises a plurality of rectangular or substantially rectangular silicon solar cells arranged in line, wherein the long sides of adjacent silicon solar cells overlap and are both flexibly and conductively bonded directly to each other, thereby connecting the silicon solar cells in series electrical connection. The first flexible electrical interconnect is rigidly, conductively bonded to the first super cell. Flexible conductive junctions between overlapping solar cells provide mechanical plasticity to the super cells to mediate between the super cells and the glass front sheet in a direction parallel to the super cell row in the temperature range of about -40°C to about 100°C the thermal expansion mismatch, so that the thermal expansion mismatch will not damage the solar module. The rigid conductive bond between the first super cell and the first flexible electrical interconnect forces the first flexible electrical interconnect in a temperature range of about -40°C to about 180°C, in a direction perpendicular to the row of super cells The thermal expansion mismatch between the first super cell and the first flexible electrical interconnect is such that the thermal expansion mismatch does not damage the solar module.

Different conductive adhesives may be utilized for conductive bonds between overlapping adjacent solar cells within a super cell and conductive bonds between the super cells and the flexible electrical interconnect. Conductive bonds on one side of at least one solar cell within a super cell and conductive bonds on the other side of the solar cell may utilize different conductive adhesives. For example, the conductive adhesive that forms the rigid bond between the super cell and the flexible electrical interconnect may be solder. In some variations, the conductive bonds between overlapping solar cells within the super cells are formed with a non-solder conductive adhesive, and the conductive bonds between the super cells and the flexible electrical interconnects are formed with solder of.

In some variations utilizing the two different conductive adhesives just described, the two conductive adhesives may be cured in the same processing step (eg, at the same temperature, at the same pressure, and/or at the same curing time interval).

Conductive bonding between overlapping adjacent solar cells is adjustable and, for example, greater than or equal to about 15 microns of differential motion between each cell and the glass front sheet.

For example, the conductive bond between overlapping adjacent solar cells may have a thickness perpendicular to the solar cell of less than or equal to about 50 microns, while the thermal conductivity perpendicular to the solar cell may be greater than or equal to about 1.5 W /(m-K).

For example, the first flexible electrical interconnect can itself withstand thermal expansion or contraction greater than or equal to about 40 microns.

The portion of the first flexible electrical interconnect that is conductively bonded to the super cell may be ribbon-shaped, formed of copper, and may, for example, have a thickness in a direction perpendicular to the surface where it is bonded to the solar cell, less than or equal to about 30 microns, or less than or equal to about 50 microns. The first flexible electrical interconnect may include an integral conductive copper portion that is not bonded to the solar cell and provides higher conductivity than that portion of the first flexible electrical interconnect that is conductively bonded to the solar cell sex. The thickness of the first flexible electrical interconnect in a direction perpendicular to the surface it engages with the solar cell may be less than or equal to about 30 microns, or less than or equal to about 50 microns, and in the plane in which the surface of the solar cell lies, at The width in a direction perpendicular to the current flowing through the electrical interconnect is greater than or equal to about 10 mm. The first flexible electrical interconnect may be conductively bonded to a conductor that provides higher conductivity in the vicinity of the solar cell than the first electrical interconnect.

In another aspect, a solar module includes a plurality of super cells arranged in two or more parallel rows. Each super cell includes a plurality of rectangular or substantially rectangular silicon solar cells arranged in line, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded directly to each other, thereby electrically connecting the silicon solar cells in series. Hidden tap contact pads that do not conduct large currents during normal operation are located on the back surface of the first solar cell midway along the first super cell in the first row of super cells. The hidden tap contact pads are electrically connected in parallel to at least a second solar cell in the second row of super cells.

The solar module may include electrical interconnects that bond to the hidden tap contact pads and electrically interconnect the hidden tap contact pads to the second solar cell. In some variations, the span of the electrical interconnect is not substantially equal to the length of the first solar cell, and the back surface metallization pattern on the first solar cell provides a conductive path for hidden tap contact pads, which The conductive path has a sheet resistance of less than or equal to about 5 ohms per square.

The plurality of super cells may be arranged in three or more parallel rows with a span equal to the width of the solar module in a direction perpendicular to the rows, and with hidden tap contact pads electrically connected to each super cell Hidden contact pads on at least one solar cell in the row to electrically connect all rows of super cells in parallel. In such variations, the solar module may include at least one bus connection connected to at least one hidden tap contact pad or to an interconnect between the hidden tap contact pads, the bus connection being connected to a bypass diode or Other electronic device connections.

The solar module may include a flexible electrical interconnect conductively bonded to the hidden tap contact pad, thereby electrically connecting the hidden tap contact pad to the second solar cell. The portion of the flexible electrical interconnect that is conductively bonded to the hidden tap contact pads may be, for example, tape-shaped, formed of copper, and may have a thickness less than or equal to the thickness in the direction perpendicular to the surface it engages with the solar cell about 50 microns. The conductive bond between the hidden tap contact pads and the flexible electrical interconnect can force the flexible electrical interconnect to withstand a thermal expansion mismatch between the first solar cell and the flexible electrical interconnect, and at about -40°C to In a temperature range of about 180° C., the relative movement between the first solar cell and the second solar cell caused by thermal expansion is adjusted so that the relative movement will not damage the solar module.

In some variations, the first hidden contact pads may conduct more current than can be generated in any single solar cell when the solar module is in operation.

Typically, the front surface of the first solar cell overlying the first hidden tap contact pad is not occupied by the contact pad or any other interconnect feature. Typically, any area on the front surface of the first solar cell that is not overlapped by a portion of an adjacent solar cell in the first super cell is not occupied by contact pads or any other interconnect features.

In some variations, most of the cells in each super cell do not have hidden tap contact pads. In such variations, cells with hidden tap contact pads may have a larger light collection area than cells without hidden tap contact pads.

In another aspect, a solar module includes a glass front sheet, a back sheet, and a plurality of super cells arranged in two or more parallel rows between the glass front sheet and the back sheet. Each super cell comprises a plurality of rectangular or substantially rectangular silicon solar cells arranged in line, wherein the long sides of adjacent silicon solar cells overlap and are both flexibly and conductively bonded directly to each other, thereby connecting the silicon solar cells in series electrical connection. The first flexible electrical interconnect is rigidly, conductively bonded to the first super cell. A flexible conductive bond between the overlapping solar cells is formed by a first conductive adhesive having a shear modulus of less than or equal to about 800 megapascals. The rigid conductive bond between the first super cell and the first flexible electrical interconnect is formed by a second conductive adhesive having a shear modulus greater than or equal to about 2000 megapascals.

The first conductive adhesive can have, for example, a glass transition temperature of less than or equal to about 0°C.

In some variations, the first conductive adhesive and the second conductive adhesive are different, but both conductive adhesives can be cured in the same processing step.

In some variations, the conductive bonds between overlapping adjacent solar cells have a thickness perpendicular to the solar cells of less than or equal to about 50 microns and a thermal conductivity perpendicular to the solar cells of greater than or equal to about 1.5W/(m-K).

In one aspect, the solar module includes a number N of greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows. Each super cell includes a plurality of silicon solar cells arranged in line, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series. The super cells are electrically connected to provide a high DC voltage greater than or equal to about 90 volts.

In a variant, the solar module includes one or more flexible electrical interconnects arranged to electrically connect a plurality of super cells in series to provide a high direct current voltage. The solar module may include module-level power electronics including an inverter for converting a high DC voltage to an AC voltage. Module level power electronics can sense high DC voltages and can operate solar modules at the optimal current-voltage power point.

In another variation, a solar module includes module-level power electronics electrically connected to each pair of adjacent series-connected super-cell rows for electrically connecting one or more pairs of super-cell rows in series to provide a high DC voltage, the Module-level power electronics include inverters for converting high DC voltages to AC voltages. Optionally, the module level power electronics can sense the voltage across each individual pair of super cell rows and can operate each individual pair of super cell rows at the optimal current-voltage power point. Optionally, if the voltage across an individual pair of super cell rows falls below a threshold, the module-level power electronics can disconnect the pair of super cell rows from the circuit providing the high DC voltage.

In another variation, a solar module includes module-level power electronics electrically connected to each individual super cell row for electrically connecting two or more super cell rows in series to provide a high DC voltage, the module Stage power electronics include inverters for converting high DC voltages to AC voltages. Optionally, module-level power electronics can sense the voltage across each individual super cell row and can operate each individual super cell row at an optimal current-voltage power point. Optionally, if the voltage across an individual row of super cells is below a threshold, module-level power electronics may disconnect the individual row of super cells from the circuit providing the high DC voltage.

In another variation, the solar module includes module level power electronics electrically connected to each individual super cell for electrically connecting two or more super cells in series to provide a high DC voltage, the module level power The electronics include inverters for converting high DC voltages to AC voltages. Optionally, module-level power electronics can sense the voltage across each individual super cell and can operate each individual super cell at an optimal current-voltage power point. Optionally, if the voltage across an individual super cell is below a threshold, the module level power electronics can disconnect the individual super cell from the circuit providing the high DC voltage.

In another variation, each super cell within a module is electrically segmented into multiple segments by hidden taps. The solar module includes module-level power electronics electrically connected to each segment in each super cell through hidden taps for electrically connecting two or more segments in series to provide a high DC voltage, the module-level Power electronics include inverters for converting high DC voltages to AC voltages. Optionally, the module level power electronics can sense the voltage across each individual segment in each super cell and can operate each individual segment at the optimal current-voltage power point. Optionally, if the voltage across an individual segment is below a threshold, the module-level power electronics may disconnect the individual segment from the circuit providing the high DC voltage.

In any of the above variations, the optimum current-voltage power point may be the maximum current-voltage power point.

In any of the above variations, the module-level power electronics may lack DC-to-DC boost components.

In any of the above variations, N can be greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to About 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

In any of the above variations, the high DC voltage may be greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, greater than or equal to about 360 volts, greater than or equal to about Equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

In another aspect, a solar photovoltaic system includes two or more solar modules electrically connected in parallel, and an inverter. Each solar module includes a number N of greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows. Each super cell in each module includes two or more silicon solar cells arranged in line in the module, with the long sides of adjacent silicon solar cells overlapping and conductively bonded to each other, thereby connecting The silicon solar cells are electrically connected in series. The super cells in each module are electrically connected for the module to provide a high voltage DC output greater than or equal to about 90 volts. An inverter is electrically connected to the two or more solar modules to convert the high voltage DC output of the modules into AC power.

Each solar module may include one or more flexible electrical interconnects arranged to electrically connect the super cells in the solar module in series to provide a high voltage DC output of the solar module.

The solar photovoltaic system may include at least a third solar module electrically connected in series with a first solar module of the two or more solar modules electrically connected in parallel. In such cases, the third solar module may include a number N' greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged in two or more parallel rows Multiple super batteries. Each super cell in the third solar module includes two or more silicon solar cells arranged in line in the module, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other, Thereby, the silicon solar cells are electrically connected in series. The super cells in the third solar module are electrically connected for the module to provide a high voltage DC output greater than or equal to about 90 volts.

Variations that include a third solar module just described electrically connected in series with a first of the two or more solar modules, and may also include two or more solar modules electrically connected in parallel The second solar module is electrically connected in series with at least a fourth solar module. A fourth solar module may include a number N" greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows. Each super cell in the four solar modules includes two or more silicon solar cells arranged in line in the module, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other, thereby The silicon solar cells are electrically connected in series. The super cells in the fourth solar module are electrically connected for the module to provide a high voltage DC output greater than or equal to about 90 volts.

The solar photovoltaic system may comprise fuses and/or blocking diodes arranged to prevent any one solar module from dissipating power generated by the other solar modules due to a short circuit.

The solar photovoltaic system may include a positive bus and a negative bus to which two or more solar modules are electrically connected in parallel and to which an inverter is also electrically connected. Alternatively, the solar photovoltaic system may comprise a combiner box to which two or more solar modules are electrically connected by separate conductors. The combiner box electrically connects the solar modules in parallel and may optionally include fuses and/or blocking diodes arranged to prevent dissipation due to a short circuit in either solar module Power produced by other solar modules.

The inverter may be configured to operate the solar module at a DC voltage above a minimum value set to avoid reverse biasing the solar module.

The inverter may be configured to recognize a reverse bias condition occurring in one or more solar modules and operate the solar modules at a voltage that avoids the occurrence of the reverse bias condition.

The solar photovoltaic system may be placed on a roof.

In any of the above variations, N, N', N" can be greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to About 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700. The values of N, N', N" can be the same or different.

In any of the above variations, the high DC voltage provided by the solar module may be greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

In another aspect, a solar photovoltaic system includes a first solar module including a number N greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged in two or multiple super cells in parallel rows. Each super cell includes a plurality of silicon solar cells arranged in line, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series. The system also includes an inverter. The inverter can be, for example, a micro-inverter integrated with the first solar module. The super cells in the first solar module are electrically connected to provide a high DC voltage greater than or equal to about 90 volts to an inverter, which in turn converts the DC power to AC power.

The first solar module may include one or more flexible electrical interconnects arranged to electrically connect the super cells in the solar module in series to provide a high voltage DC output of the solar module.

The solar photovoltaic system may include at least a second solar module electrically connected in series with the first solar module. The second solar module may include a number N' greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows. Each super cell in the second solar module includes two or more silicon solar cells arranged in line in the module, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other, Thereby, the silicon solar cells are electrically connected in series. The super cells in the second solar module are electrically connected for the module to provide a high voltage DC output greater than or equal to about 90 volts.

Inverters (eg, microinverters) may lack DC-to-DC boost components.

In any of the above variations, N and N' can be greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, Greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700. The values of N and N' may be the same or different.

In any of the above variations, the high DC voltage provided by the solar module may be greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

In another aspect, a solar module includes a number N of greater than or equal to about 250 rectangular or substantially rectangular silicon solar cells arranged as a plurality of tandem super cells in two or more parallel rows. Each super cell includes a plurality of silicon solar cells arranged in a line, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded directly to each other by an adhesive that is both electrically and thermally conductive, thereby bonding the super cell to the super cell. The silicon solar cells are electrically connected in series. In a solar module, less than one bypass diode is included for every 25 solar cells. Adhesives that are both electrically and thermally conductive form bonds between adjacent solar cells having a thickness perpendicular to the solar cells of less than or equal to about 50 microns and a thermal conductivity perpendicular to the solar cells greater than or equal to Equal to about 1.5W/(m-K).

The super cells can be encapsulated in a thermoplastic olefin layer between the front and back sheets. The super cell and its encapsulant can be sandwiched between a glass front sheet and a glass back sheet.

In a solar module, for example, every 30 solar cells may include less than one bypass diode, every 50 solar cells may include less than one bypass diode, or every 100 solar cells may include less than one bypass diode. One. A solar module may, for example, include no bypass diodes, only a single bypass diode, no more than three bypass diodes, no more than six bypass diodes, or no more than ten bypass diodes.

The conductive bonding between the overlapping solar cells can optionally provide mechanical plasticity to the super cells to reconcile the super cells with the glass front in a direction parallel to the super cell row over a temperature range of about -40°C to about 100°C The thermal expansion mismatch between the panels is such that the thermal expansion mismatch does not damage the solar module.

In any of the above variations, N can be greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to About 600, greater than or equal to about 650, or greater than or equal to about 700.

In any of the above variations, the super cells can be electrically connected to provide about 120 volts or more, about 180 volts or more, about 240 volts or more, about 300 volts or more, or about 360 volts or more. Volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts high DC voltage.

A solar energy system may include a solar module of any of the above variations and an inverter (eg, a micro-inverter), wherein the inverter is electrically connected to the solar module and configured to convert the DC output from the solar module, thereby Provides AC output. The inverter may be missing a DC-to-DC boost part. The inverter may be configured to operate the solar module at a DC voltage above a minimum value set to avoid reverse biasing the solar cells. The minimum voltage value may depend on temperature. The inverter may be configured to recognize the reverse biased state and operate the solar module at a voltage that avoids the reversed biased state. For example, the inverter may be configured to operate the solar module within a local maximum region of the solar module's voltage-current power curve to avoid a reverse bias condition.

This specification discloses a solar cell cutting tool and a solar cell cutting method.

In one aspect, a method of making a solar cell includes advancing a solar cell wafer along a curved surface and then applying a vacuum between the curved surface and a bottom surface of the solar cell wafer to bend the solar cell wafer against the curved surface to follow a strip of The solar cell wafer is diced by a plurality of previously prepared scribe lines, thereby separating a plurality of solar cells from the solar cell wafer. The solar cell wafer may, for example, be continuously advanced along a curved surface. Alternatively, the solar cell wafer may be advanced discretely multiple times along the curved surface.

The curved surface may be, for example, a curved portion of the upper surface of a vacuum manifold that applies a vacuum to the bottom surface of the solar cell wafer. The vacuum applied by the vacuum manifold to the bottom surfaces of the solar cell wafers can vary along the direction of travel of the solar cell wafers and can, for example, reach maximum intensity in the areas where the solar cell wafers are sequentially cut in the vacuum manifold.

The method may include transporting the solar cell wafer along the curved upper surface of the vacuum manifold using a perforated belt, during which vacuum is applied to the bottom surface of the solar cell wafer through perforations in the perforated belt. The perforations may optionally be arranged on the porous belt such that the leading and trailing edges of the solar cell wafer along its own direction of travel must overlie at least one perforation of the perforated belt, thus being pulled by the vacuum towards the curved surface , but this is not required.

The method may include advancing the solar cell wafer along a flat region of the upper surface of the vacuum manifold to a transitional curved region having a first curvature in the upper surface of the vacuum manifold; then advancing the solar cell wafer into the upper surface of the vacuum manifold In the dicing region of the sequential dicing of the solar cell wafer, the dicing region of the vacuum manifold has a second curvature that is tighter than the first curvature. The method may also include advancing the cut solar cell into a post-cut region in the vacuum manifold having a third curvature that is more tightly retracted than the second curvature.

In any of the above variations, the method may include applying a stronger vacuum between the solar cell wafer and the curved surface, first at one end of each scribed line, and then at the other end of each scribed line, in order to Provides an asymmetric stress distribution along each scribe line, thereby facilitating the formation of the core of a single cut crack along each scribe line and the propagation of a single cut crack along each scribe line. Additionally or alternatively, in any of the above variations, the method may include orienting the scribe lines on the solar cell wafer at an angle to the vacuum manifold such that for each scribe line, one end of the scribe line is compared to the other end Reach the curved cut area of the vacuum manifold earlier.

In any of the above variations, the method may include removing the cut solar cells from the curved surface before the edges of the cut solar cells contact the curved surface. For example, the method may include removing the battery in a direction tangential or approximately tangential to the curved surface of the manifold at a speed greater than the speed at which the battery travels along the manifold. This can be done, for example, with a tangentially arranged moving belt, or with any other suitable mechanism.

In any of the above variations, the method may include scoring a plurality of scribe lines on the solar cell wafer and then applying a conductive adhesive bonding material to portions of the top or bottom surface of the solar cell wafer , and then cut the solar cell wafer along the scribed lines. At this point, each resulting cut solar cell may be provided with a portion of the conductive adhesive bonding material along the cut edge of its top or bottom surface. The scribed lines may be formed using any suitable scribing method before or after the conductive adhesive bonding material is applied. The scribed lines can be formed, for example, by laser scribing.

In any of the above variations, the solar cell wafer may be a square or pseudo-square silicon solar cell wafer.

On the other hand, a method of fabricating a solar cell string includes: arranging a plurality of rectangular solar cells in a straight line such that long sides of adjacent rectangular solar cells are overlapped in an overlapping manner with a conductive adhesive bonding material disposed therebetween; and then making The conductive bonding material cures, thereby bonding adjacent overlapping rectangular solar cells to each other and electrically connecting the cells in series. Solar cells can be produced, for example, by any of the variations of the methods described above for producing solar cells.

In one aspect, a method of fabricating a solar cell string includes forming a back surface metallization pattern on each of one or more square solar cells and then using a single stencil to metallize the complete front surface in a single stencil printing step A pattern stencil is printed onto each of the one or more square solar cells. The steps may be performed in any order, or simultaneously, if appropriate. By "complete front surface metallization pattern" it is meant that the front surface metallization can be accomplished without depositing additional metallization material onto the front surface of the square solar cell after the stencil printing step. The method further includes dividing each square solar cell into two or more rectangular solar cells, thereby forming a plurality of rectangular solar cells from the one or more square solar cells, each rectangular solar cell having a back surface metallization pattern and a complete front surface metallization pattern; arrange a plurality of rectangular solar cells in a straight line so that the long sides of adjacent rectangular solar cells overlap in an overlapping manner; then place the rectangles in each pair of adjacent overlapping rectangular solar cells The solar cells are conductively bonded to each other with a conductive bonding material disposed between the two rectangular solar cells for electrically connecting the front surface metallization pattern of one of the pair of rectangular solar cells to the pair of rectangular solar cells The back surface metallization pattern of the other cell in the series electrically connects the plurality of rectangular solar cells in series.

The stencil may be constructed such that all portions of the stencil that define the one or more features on the front surface metallization pattern on the one or more square solar cells are constrained to be located in the stencil during stencil printing and where the stencil is located. Physical connections to other parts of the plane.

The front surface metallization pattern on each rectangular solar cell may, for example, include a plurality of fingers oriented perpendicular to the long sides of the rectangular solar cell, but the front surface metallization pattern does not have the fingers in the front surface metallization pattern from each other physical connection.

This specification discloses solar cells with reduced loss of carrier recombination at the edges of solar cells, such solar cells, for example, that do not have cut edges that promote carrier recombination; methods for making such solar cells; Overlap) arrangements use such solar cells to form super cells.

In one aspect, a method of fabricating a plurality of solar cells comprises: depositing one or more front surface amorphous silicon layers on a front surface of a crystalline silicon wafer; depositing one or more back surface amorphous silicon layers on a back surface of the crystalline silicon wafer on the back surface, the back surface being on the opposite side of the front surface of the crystalline silicon wafer; patterning the one or more front surface amorphous silicon layers to form one or more front surface amorphous silicon layers in the one or more front surface amorphous silicon layers; front surface trenches; depositing a front surface passivation layer over the one or more front surface amorphous silicon layers and into the front surface trenches; patterning the one or more rear surface amorphous silicon layers to forming one or more back surface trenches in the one or more back surface amorphous silicon layers; and then depositing a back surface passivation layer over the one or more back surface amorphous silicon layers and into the back surface trenches. Each of the one or more back surface grooves is formed in line with a corresponding one of the front surface grooves. The method also includes dicing the crystalline silicon wafer at one or more dicing planes, each dicing plane being centered or substantially centered on a different pair of corresponding front and back surface trenches. When the obtained solar cell is in operation, the front surface amorphous silicon layer will be irradiated with light.

In some variations, only the front surface grooves are formed and the rear surface grooves are not formed. In other variations, only the rear surface grooves are formed, and no front surface grooves are formed.

The method may include forming one or more front surface trenches for penetrating the front surface amorphous silicon layer to the front surface of the crystalline silicon wafer, and/or forming one or more back surface trenches for penetrating One or more back surface amorphous silicon layers reach the back surface of the crystalline silicon wafer.

The method may include forming the front surface passivation layer and/or the back surface passivation layer with a transparent conductive oxide.

Cut points (eg, about 100 microns long) can be created using a pulsed laser or a diamond drill. Continuous wave lasers and cooling nozzles can be used sequentially to induce high compressive and tensile thermal stresses and to direct full propagation of the dicing in the crystalline silicon wafer, thereby slicing the crystalline silicon wafer at one or more cutting planes. Alternatively, a crystalline silicon wafer may be mechanically cut at one or more cutting planes. Any suitable cutting method can be used.

One or more front surface amorphous/crystalline silicon layers may form an n-p junction with the crystalline silicon wafer, in which case it may be preferable to cut it from the back surface side of the crystalline silicon wafer. Alternatively, one or more back surface amorphous/crystalline silicon layers may form an n-p junction with the crystalline silicon wafer, in which case it may be preferable to cut it from the front surface side of the crystalline silicon wafer.

In another aspect, a method of fabricating a plurality of solar cells includes: forming one or more trenches in a first surface of a crystalline silicon wafer; depositing one or more layers of amorphous silicon onto the first surface of the crystalline silicon wafer; depositing a passivation layer onto one or more layers of amorphous silicon in the trenches and on the first surface of the crystalline silicon wafer; depositing one or more layers of amorphous silicon onto the second surface of the crystalline silicon wafer , the second surface is on the opposite side of the first surface of the crystalline silicon wafer; the crystalline silicon wafer is then cut at one or more dicing planes, each dicing plane in the one or more trenches Centered or substantially centered on a different groove.

The method may include forming a passivation layer with a transparent conductive oxide.

A laser may be used to induce thermal stress in the crystalline silicon wafer to cut the crystalline silicon wafer at one or more cutting planes. Alternatively, a crystalline silicon wafer may be mechanically cut at one or more cutting planes. Any suitable cutting method can be used.

One or more front surface amorphous/crystalline silicon layers may form n-p junctions with the crystalline silicon wafer. Alternatively, one or more back surface amorphous/crystalline silicon layers may form n-p junctions with the crystalline silicon wafer.

On the other hand, a solar panel includes a plurality of super cells, each super cell including a plurality of solar cells arranged in a line, wherein the ends of adjacent solar cells are overlapped and conductively bonded to each other in an overlapping manner, thereby connecting The solar cells are electrically connected in series. Each solar cell includes: a crystalline silicon substrate; one or more first surface amorphous silicon layers disposed on the first surface of the crystalline silicon substrate to form n-p junctions; one or more second surface amorphous silicon layers a silicon layer disposed on a second surface of the crystalline silicon substrate, the second surface being on the opposite side of the first surface of the crystalline silicon substrate; and a passivation layer preventing edges of the first surface amorphous silicon layer Carrier recombination occurs at the edge of the amorphous silicon layer on the first surface or at the edge of the amorphous silicon layer on the second surface, or prevents carrier recombination at the edge of the amorphous silicon layer on the first surface and at the edge of the amorphous silicon layer on the second surface. The passivation layer may comprise a transparent conductive oxide.

Solar cells may be formed, for example, using any of the methods outlined above or otherwise disclosed in this specification.

These and other embodiments, features and advantages of the present invention will become more apparent to those skilled in the art upon reference to the following more detailed description of the invention, taken in conjunction with the accompanying drawings, which are first briefly described below.

Description of drawings

Figure 1 shows a schematic cross-sectional view of a string of solar cells arranged in a shingled fashion, connected in series, where the ends of adjacent solar cells overlap to form a shingled super cell.

2A shows a schematic diagram of the front (sun side) surface and front surface metallization pattern of an exemplary rectangular solar cell that can be used to form a shingled super cell.

2B and 2C show schematic diagrams of the front (sun side) surface and front surface metallization patterns of two exemplary rectangular solar cells with rounded corners that can be used to form shingled super cells.

2D and 2E show schematic diagrams of the back surface and an exemplary back surface metallization pattern of the solar cell shown in FIG. 2A.

Figures 2F and 2G show schematic diagrams of the back surface and an exemplary back surface metallization pattern of the solar cell shown in Figures 2B and 2C, respectively.

2H shows a schematic diagram of the front (sun side) surface and front surface metallization pattern of another exemplary rectangular solar cell that can be used to form a shingled super cell. The front surface metallization pattern includes discrete contact pads, each of which is surrounded by a barrier configured to prevent uncured conductive adhesive bonding material deposited on its contact pads from flowing away from the contact pads.

2I shows a cross-sectional view of the solar cell of FIG. 2H and identifies details of the front surface metallization pattern shown in both expanded views of FIGS. 2J and 2K, including contact pads and wraparound contacts Multiple parts of the barrier of the pad.

Figure 2J shows an expanded view of the detail in Figure 2I.

Figure 2K shows an expanded view of the detail in Figure 2I wherein the uncured conductive adhesive bonding material is substantially confined by the barrier to the location of the discrete contact pads.

2L shows a schematic diagram of the back surface and an exemplary back surface metallization pattern of the solar cell of FIG. 2H. The back surface metallization pattern includes discrete contact pads, each of which is surrounded by a barrier configured to prevent uncured conductive adhesive bonding material deposited on its contact pads from flowing away from the contact pads.

2M shows a cross-sectional view of the solar cell of FIG. 2L and identifies details of the back surface metallization pattern shown in the expanded view of FIG. 2N, including multiple contact pads and barriers surrounding the contact pads. part.

Figure 2N shows an expanded view of the detail in Figure 2M.

20 illustrates another variation of a metallization pattern including a barrier configured to prevent uncured conductive adhesive bonding material from flowing away from the contact pads. The barrier is close to one side of the contact pad and is higher than the contact pad.

FIG. 2P shows another variation of the metallization pattern of FIG. 2O, wherein the barriers abut at least two sides of the contact pads.

2Q shows a schematic diagram of the back surface of another exemplary rectangular solar cell and an exemplary back surface metallization pattern. The back surface metallization pattern includes continuous contact pads that extend along the edges of the solar cell substantially the length of the long sides of the solar cell. The contact pad is surrounded by a barrier configured to prevent uncured conductive adhesive bonding material deposited on the contact pad from flowing away from the contact pad.

2R shows a schematic diagram of the front (sun side) surface and front surface metallization pattern of another exemplary rectangular solar cell that can be used to form a shingled super cell. The front surface metallization pattern includes discrete contact pads arranged in a row along the edge of the solar cell, and elongated wires located inside and extending parallel to the row of contact pads. The elongated wires form a barrier configured to prevent uncured conductive adhesive bonding material deposited on its contact pads from flowing away from the contact pads and onto the active area of the solar cell.

FIG. 3A shows a schematic diagram of an exemplary method by which a pseudo-square silicon solar cell of standard shape and size can be divided (eg, cut or disassembled) into two different lengths that can be used to form a shingled super cell. Rectangular solar cells.

3B and 3C show schematic diagrams of another exemplary method by which pseudo-square silicon solar cells can be divided into rectangular solar cells. Figure 3B shows the front surface of the wafer and an exemplary front surface metallization pattern. Figure 3C shows the back surface of the wafer and an exemplary back surface metallization pattern.

3D and 3E show schematic diagrams of an exemplary method by which square silicon solar cells can be divided into rectangular solar cells. Figure 3D shows the front surface of the wafer and an exemplary front surface metallization pattern. Figure 3E shows the back surface of the wafer and an exemplary back surface metallization pattern.

4A shows a partial view of the front surface of an exemplary rectangular super cell including rectangular solar cells such as shown in FIG. 2A arranged in a lapped arrangement as shown in FIG. 1 .

Figures 4B and 4C show front and rear views, respectively, of an exemplary rectangular super cell comprising "V-shaped" rectangular solar cells with chamfered corners, such as shown in Figure 2B, which are The overlapping arrangement shown in Figure 1.

5A shows a schematic diagram of an exemplary rectangular solar module including a plurality of stacked rectangular super cells, wherein the length of the long side of each super cell is approximately equal to half the length of the short side of the solar module. Pairs of super cells are arranged end-to-end to form rows, with the long sides of the super cells parallel to the short sides of the module.

5B shows a schematic diagram of another exemplary rectangular solar module including a plurality of stacked rectangular super cells, wherein the length of the long side of each super cell is approximately equal to the length of the short side of the solar module. The super cells are arranged with their long sides parallel to the short sides of the modules.

5C shows a schematic diagram of another exemplary rectangular solar module including a plurality of stacked rectangular super cells, wherein the length of the long side of each super cell is approximately equal to the length of the long side of the solar module. The super cells are arranged with their long sides parallel to the long sides of the modules.

5D shows a schematic diagram of an exemplary rectangular solar module including a plurality of shingled rectangular super cells, wherein the length of the long side of each super cell is approximately equal to half the length of the long side of the solar module. Pairs of super cells are arranged end-to-end to form rows with the long sides of the super cells parallel to the long sides of the module.

5E shows a schematic diagram of another exemplary rectangular solar module constructed similarly to FIG. 5C, wherein all the solar cells forming the super cells are V-shaped solar cells with chamfered corners that are different from the ones segmented therefrom. The corners of the pseudo-square wafer of solar cells correspond.

Figure 5F shows a schematic diagram of another exemplary rectangular solar module constructed similar to Figure 5C, wherein the solar cells forming the super cells comprise a mixture of V-shaped solar cells and rectangular solar cells arranged to reproduce The shape of the pseudo-square wafer from which these solar cells are singulated.

5G shows a schematic diagram of another exemplary rectangular solar module constructed similar to that of FIG. 5E, except that adjacent V-shaped solar cells in a super cell are arranged as mirror images of each other, so that their overlapping edge lengths are equal.

Figure 6 shows an exemplary arrangement of three rows of super cells interconnected with flexible electrical interconnects for connecting the super cells in each row in series with each other and for connecting the rows in parallel with each other. The rows may be, for example, the three rows in the solar module of Figure 5D.

7A illustrates exemplary flexible interconnects that can be used to interconnect super cells in series or parallel. Some examples exhibit pattern structures that increase the flexibility (mechanical plasticity) of the example along the long axis of the example, the short axis, or both along the long axis of the example and the short axis of the example. Figure 7A illustrates exemplary strain relief long interconnect configurations that can be used both in connection to a hidden tap as described herein for a super cell, and for connection to the front surface or back of a super cell Interconnects for terminal contacts on the surface. 7B-1 and 7B-2 illustrate examples of out-of-plane stress relief features. FIGS. 7B-1 and 7B-2 illustrate an exemplary long interconnect configuration that includes out-of-plane stress relief features, both for use in hidden taps connecting to super cells, and for connecting to Interconnection of terminal contacts on the front or rear surface of a super cell.

8A shows Detail A of FIG. 5D (ie, the cross-sectional view of the exemplary solar module of FIG. 5D ), specifically showing the cross-section of the flexible electrical interconnects bonded to the rear surface terminal contacts of each row of super cells detail.

8B shows detail C of FIG. 5D (ie, the cross-sectional view of the exemplary solar module of FIG. 5D ), specifically showing the flexible electrical interconnects bonded to the front (sun side) surface terminal contacts of each row of super cells Detail of the cross section of the piece.

8C shows detail B of FIG. 5D (ie, a cross-sectional view of the exemplary solar module of FIG. 5D ), specifically showing flexible interconnects arranged to interconnect two super cells in series in a row cross-sectional details.

8D-8G illustrate additional examples of electrical interconnects bonded to the front terminal contacts of the super cells at one end of a row of super cells, adjacent the edge of the solar module. These exemplary interconnects are configured to occupy only a small area on the front surface of the module.

9A shows a schematic diagram of another exemplary rectangular solar module comprising six shingled rectangular super cells, wherein the length of the long side of each super cell is approximately equal to the length of the long side of the solar module. The super cells are arranged in six rows that are electrically connected in parallel with each other and with bypass diodes provided in the junction box on the rear surface of the solar module. The electrical connection between the super cell and the bypass diode is made through solder ribbons embedded in the module laminate.

9B shows a schematic diagram of another exemplary rectangular solar module comprising six shingled rectangular super cells, wherein the length of the long side of each super cell is approximately equal to the length of the long side of the solar module. The super cells are arranged in six rows that are electrically connected in parallel with each other and with bypass diodes provided in a junction box near one edge on the rear surface of the solar module. The second junction box is located near the opposite edge on the rear surface of the solar module. The electrical connection between the super cell and the bypass diode is made through an external cable between these two junction boxes.

9C illustrates an exemplary double-sided glass rectangular solar module including six shingled rectangular super cells, wherein the length of the long side of each super cell is approximately equal to the length of the long side of the solar module. The super cells are arranged in six rows that are electrically connected in parallel with each other. Two junction boxes are mounted on opposite edges of the module, thus maximizing the effective area of the module.

Figure 9D shows a side view of the solar module shown in Figure 9C.

9E illustrates another exemplary solar module comprising six shingled rectangular super cells, wherein the length of the long side of each super cell is approximately equal to the length of the long side of the solar module. The super cells are arranged in six rows, and three pairs of battery rows are each connected to a power management device on the solar module.

9F illustrates another exemplary solar module including six shingled rectangular super cells, wherein the length of the long side of each super cell is approximately equal to the length of the long side of the solar module. The super cells are arranged in six rows, each of which is connected to a power management device on the solar module.

9G and 9H illustrate other embodiments of architectures for module-level power management using shingled super cells.

Figure 10A shows an exemplary circuit schematic of the solar module shown in Figure 5B.

10B-1 and 10B-2 illustrate exemplary physical layouts of various electrical interconnections for the solar module shown in FIG. 5B with the circuit schematic of FIG. 10A.

FIG. 11A shows an exemplary circuit schematic of the solar module shown in FIG. 5A.

11B-1 and 11B-2 illustrate exemplary physical layouts of various electrical interconnections for the solar module shown in FIG. 5A with the circuit schematic of FIG. 11A.

11C-1 and 11C-2 illustrate another exemplary physical layout of the various electrical interconnections of the solar module shown in FIG. 5A with the circuit schematic of FIG. 11A.

FIG. 12A shows another exemplary circuit schematic of the solar module shown in FIG. 5A.

12B-1 and 12B-2 illustrate exemplary physical layouts of various electrical interconnections for the solar module shown in FIG. 5A with the circuit schematic of FIG. 12A.

Figures 12C-1, 12C-2, and 12C-3 illustrate another exemplary physical layout of various electrical interconnections for the solar module shown in Figure 5A with the circuit schematic of Figure 12A.

FIG. 13A shows another exemplary circuit schematic of the solar module shown in FIG. 5A.

FIG. 13B shows another exemplary circuit schematic diagram of the solar module shown in FIG. 5B .

Figures 13C-1 and 13C-2 illustrate exemplary physical layouts of various electrical interconnections for the solar module shown in Figure 5A with the circuit schematic of Figure 13A. The physical layouts of Figures 13C-1 and 13C-2 are slightly modified to apply to the solar module shown in Figure 5B with the circuit schematic of Figure 13B.

14A shows a schematic diagram of another exemplary rectangular solar module comprising a plurality of shingled rectangular super cells, wherein the length of the long side of each super cell is approximately equal to half the length of the short side of the solar module. Pairs of super cells are arranged end-to-end to form rows, with the long sides of the super cells parallel to the short sides of the module.

Figure 14B shows an exemplary circuit schematic of the solar module shown in Figure 14A.

Figures 14C-1 and 14C-2 illustrate exemplary physical layouts of various electrical interconnections for the solar module shown in Figure 14A with the circuit schematic of Figure 14B.

15 illustrates another exemplary physical layout of the various electrical interconnections of the solar module shown in FIG. 5B with the circuit schematic of FIG. 10A.

Figure 16 shows an exemplary arrangement of a smart switch interconnecting two solar modules in series.

17 shows a flowchart of an exemplary method of fabricating a solar module using super cells.

18 shows a flowchart of another exemplary method of fabricating a solar module using super cells.

19A-19D illustrate exemplary arrangements in which super cells can be cured using heat and pressure.

20A-20C schematically illustrate exemplary apparatus that may be used to cut a scribed solar cell. The apparatus may be particularly advantageous when used to cut scribed super cells to which a conductive adhesive bonding material is applied.

Figure 21 shows an exemplary white back panel with dark lines added with "zebra stripes" that can be used in a solar module that includes parallel rows of super cells to reduce the distance between the super cells and the back panel from the front of the module Visual contrast between visible parts.

Figure 22A shows a plan view of a conventional module utilizing conventional ribbon connections in a hotspot state. FIG. 22B shows a plan view when a module utilizing the thermal diffusion method according to various embodiments is also in a hot spot state.

23A-23B show examples of super cell string layouts with chamfered cells.

24-25 show simplified cross-sectional views of an array including multiple modules assembled in a stacked configuration.

Figure 26 shows a schematic view of the rear (shade side) surface of a solar module showing an example of terminal electrical contacts on the front (sun side) surface of a shingled super cell to a junction box on the rear side of the module electrical interconnection.

Figure 27 shows a schematic diagram of the back (shade side) surface of a solar module showing exemplary electrical interconnection of two or more shingled super cells in parallel, with the super cell front (sun side) The terminal electrical contacts on the surface are connected to each other and to the junction box on the rear side of the module.

Figure 28 shows a schematic diagram of the rear (shade side) surface of a solar module showing another exemplary electrical interconnection of two or more shingled super cells in parallel, where the super cell front ( The terminal electrical contacts on the male side) surface are connected to each other and to the junction box on the rear side of the module.

Figure 29 shows a partial cross-sectional perspective view of two super cells showing the use of flexible interconnects sandwiched between overlapping ends of adjacent super cells to electrically connect super cells in series and electrically Connections are provided to the junction box. FIG. 29A shows an enlarged view of the region of interest in FIG. 29 .

30A shows an exemplary super cell with electrical interconnects joined to its front and rear surface terminal contacts. Figure 30B shows two super cells of Figure 30A interconnected in parallel.

31A-31C show schematic diagrams of exemplary back surface metallization patterns that may be used to form hidden taps connected to super cells as described herein.

Figures 32-33 illustrate an example of the use of hidden taps with interconnects extending approximately the full width of the super cell.

Figures 34A-34C show examples of interconnects bonded to terminal contacts on the rear surface (Figure 34A) and front surface (Figures 34B-34C) of a super cell.

Figures 35-36 show examples of using hidden taps with short interconnects that span the gap between adjacent super cells but are not substantially along the long axis of the rectangular solar cell Extend upwards inwards.

37A-1 through 37F-3 illustrate exemplary configurations of hidden tap short interconnects including in-plane stress relief features.

38A-1 through 38B-2 illustrate exemplary constructions of hidden tap short interconnects that include out-of-plane stress relief features.

39A-1 and 39A-2 illustrate an example construction of a hidden tap short interconnect that includes alignment features. 39B-1 and 39B-2 illustrate exemplary configurations of hidden tap short interconnects with asymmetric protrusion lengths.

Figure 40 and Figures 42A-44B illustrate exemplary solar module layouts employing hidden taps.

41 shows an exemplary circuit diagram of the solar module layout of FIGS. 40 and 42A-44B.

Figure 45 shows current flow in an exemplary solar module with bypass diode conducting.

46A-46B illustrate relative motion between solar module components caused by thermal cycling in the solar module in a direction parallel to the rows of super cells and perpendicular to the rows of super cells, respectively.

47A-47B respectively illustrate another exemplary solar module layout employing hidden taps and corresponding circuit diagrams.

48A-48B illustrate additional solar cell module layouts using hidden taps in conjunction with embedded bypass diodes.

49A-49B show block diagrams, respectively, of a solar module for supplying a conventional DC voltage to a microinverter and a high voltage solar module for supplying a high DC voltage to a microinverter as described herein.

50A-50B show an example physical layout and circuit diagram of an example high voltage solar module assembled with bypass diodes.

51A-55B illustrate exemplary architectures for module-level power management of high voltage solar modules including shingled super cells.

Figure 56 shows an exemplary arrangement of six super cells in six parallel rows where the ends of adjacent rows are staggered and interconnected in series by flexible electrical interconnects.

57A schematically illustrates a photovoltaic system including a plurality of high DC voltage shingled solar cell modules electrically connected in parallel with each other and to a string inverter. Figure 57B shows the photovoltaic system of Figure 57A deployed on a roof.

Figures 58A to 58D illustrate arrangements of current limiting fuses and blocking diodes that can be used to prevent short circuits in high DC voltage shingled solar cell modules, thereby avoiding loss of power due to such short circuits It dissipates a large amount of power generated by other high DC voltage shingled solar cell modules to which the module is electrically connected in parallel.

59A-59B illustrate an exemplary arrangement in which two or more high DC voltage shingled solar cell modules are electrically connected in parallel in a combiner box, which may include current limiting fuses and blocking diodes.

60A-60B each show a current versus voltage graph and a power versus voltage graph for a plurality of high DC voltage shingled solar cell modules electrically connected in parallel. The graph of FIG. 60A is for the exemplary case where none of the modules include reverse biased solar cells. The graph of FIG. 60B is for an exemplary case where some modules include one or more reverse biased solar cells.

Figure 61A shows an example of a solar module utilizing approximately 1 bypass diode per super cell. 61C shows an example of a solar module utilizing bypass diodes in a nested configuration. 61B shows an exemplary configuration of a bypass diode connected between two adjacent super cells using flexible electrical interconnects.

62A-62B schematically illustrate side and top views, respectively, of another exemplary cutting tool.

63A schematically illustrates the use of an exemplary asymmetric vacuum arrangement to control the formation of crack cores and control crack propagation along the scribe lines while dicing the wafer. Figure 63B schematically illustrates the use of an exemplary symmetrical vacuum arrangement that provides less control over cutting than the arrangement of Figure 63A.

64 schematically illustrates a top view of a portion of an exemplary vacuum manifold that may be used in the cutting tool of FIGS. 62A-62B.

65A and 65B provide a schematic top view and a schematic perspective view, respectively, of the exemplary vacuum manifold shown in FIG. 64 covered by a perforated belt.

66 schematically illustrates a side view of an exemplary vacuum manifold that may be used in the cutting tool of FIGS. 62A-62B.

Figure 67 schematically shows a cut solar cell overlaid on an exemplary arrangement of perforated belts and vacuum manifolds.

Figure 68 schematically illustrates the relative position and relative orientation of a diced solar cell and an uncut portion on a standard size wafer from which the solar cell was cut in an exemplary dicing process.

69A-69G schematically illustrate an apparatus and method that can continuously remove cut solar cells from a cutting tool.

Figures 70A-70C provide orthogonal views of another variation of the exemplary cutting tool of Figures 62A-62B.

Figures 71A and 71B provide perspective views of the exemplary cutting tool of Figures 70A-70C at two different stages of the cutting process.

Figures 72A-74B show details of the perforated belt and vacuum manifold of the exemplary cutting tool of Figures 70A-70C.

75A-75G illustrate details of several exemplary hole patterns that may be used in the porous vacuum belt in the exemplary cutting tools of FIGS. 10A-10B-1 and 10B-2.

Figure 76 shows an exemplary front surface metallization pattern on a rectangular solar cell.

77A-77B illustrate exemplary back surface metallization patterns on rectangular solar cells.

FIG. 78 shows an exemplary front surface metallization pattern on a square solar cell that can be cut into a plurality of rectangular solar cells, each rectangular solar cell having the front surface metallization pattern shown in FIG. 76 .

Figure 79 shows an exemplary back surface metallization pattern on a square solar cell that can be cut into a plurality of rectangular solar cells, each rectangular solar cell having the back surface metallization pattern shown in Figure 77A.

80 is a schematic diagram of a conventionally sized HIT solar cell cut into narrow strip solar cells using conventional cutting methods to create cut edges that promote carrier recombination.

Figures 81A-81J schematically illustrate steps in an exemplary method of cutting a conventional sized HIT solar cell into narrow strip solar cells lacking cutting edges that promote carrier recombination.

Figures 82A-82J schematically illustrate steps in another exemplary method of cutting a conventional sized HIT solar cell into narrow strip solar cells lacking cutting edges that promote carrier recombination.

Detailed ways

The following detailed description should be read with reference to the accompanying drawings, in which like reference numerals refer to like elements throughout the different drawings. The drawings, which are not necessarily to scale, depict alternative embodiments and are not intended to limit the scope of the invention. The detailed description illustrates the principles of the present invention by way of example and not limitation. This detailed description describes several embodiments of the invention, several adaptations, variations, alternatives and uses, including what is presently believed to be the best mode for carrying out the invention; those skilled in the art after reading this detailed description , a method of manufacturing the solar cell module of the present invention using the technology of the present invention will be clearly understood.

As used in this specification and the appended claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Furthermore, the term "parallel" is used to mean "parallel or substantially parallel" and encompasses minor deviations from parallel geometries, without requiring that any parallel arrangement described herein be completely parallel. The term "vertical" is used to mean "vertical or substantially vertical" and covers minor deviations from vertical geometry without requiring that any vertical arrangement described herein be completely vertical. The term "square" is used to mean "square or substantially square" and encompasses subtle deviations from square, such as substantially square shapes with chamfered corners (eg, rounded corners or other truncated corners). The term "rectangular" is used to mean "rectangular or substantially rectangular" and encompasses subtle deviations from rectangular, such as substantially rectangular shapes with chamfered corners (eg, rounded or other truncated corners).

This specification discloses efficient shingled arrangements of silicon solar cells in solar cell modules, as well as front surface metallization patterns, rear surface metallization patterns, and interconnects for solar cells that can be used in such arrangements. The present specification also discloses methods of making such solar modules. Solar cell modules can be advantageously used under "one sun" (non-concentrated) illumination, and their physical dimensions and electrical specifications enable them to replace conventional silicon solar cell modules.

1 shows a cross-sectional view of a string of solar cells 10 connected in series, arranged in a shingled fashion and electrically connected to form a super cell 100, where the ends of adjacent solar cells overlap. Each solar cell 10 includes a semiconductor diode structure and electrical contacts connected to the semiconductor diode structure through which a current generated in the solar cell 10 when illuminated by light can be supplied to an external load.

In the example described in this specification, each solar cell 10 is a crystalline silicon solar cell having a front (sun side) surface metallization pattern and a back (shade side) surface metallization pattern, the front surface metallization pattern being set at n On the semiconductor layer of p-type conductivity, back surface metallization patterns are provided on the semiconductor layer of p-type conductivity, the metallization patterns providing electrical contacts to opposite sides of the n-p junction. However, any other suitable solar cell utilizing any other suitable material system, diode structure, physical size or arrangement of electrical contacts may be used in place of or as the solar cell 10 in the solar module described in this specification. Supplement to solar cells. For example, the front (sun side) surface metallization pattern can be provided on the p-type conductivity semiconductor layer, and the back (cathode side) surface metallization pattern can be provided on the n-type conductivity semiconductor layer.

Referring again to FIG. 1, in super cell 100, adjacent solar cells 10 are conductively bonded to each other in regions where they overlap by means of a conductive bonding material that electrically patterns the front surface metallization of one solar cell. Connect to the back surface metallization pattern of adjacent solar cells. Suitable conductive bonding materials may include, for example, conductive adhesives, conductive adhesive films, and conductive adhesive tapes, as well as conventional solders. Preferably, the conductive bonding material provides mechanical plasticity in the bonding between adjacent solar cells, thereby reconciling the stress due to the mismatch between the coefficient of thermal expansion (CTE) of the conductive bonding material and the CTE of the solar cells (eg, CTE of silicon) . To provide this mechanical plasticity, in some variations, the conductive bonding material is selected to have a glass transition temperature of less than or equal to about 0°C. To further reduce and reconcile the stress parallel to the overlapping edges of the solar cells due to CTE mismatch, the conductive bonding material may optionally be applied only in discrete locations along the overlapping regions of the solar cells, not Apply as a continuous line extending substantially the length of the edge of the solar cell.

The thickness of the conductive bond formed by the conductive bonding material between adjacent overlapping solar cells may be, for example, less than about 0.1 mm, measured perpendicular to the front and back surfaces of the solar cells. Such thin joints reduce resistive losses at the cell-to-cell interconnects and also facilitate the flow of heat along the super cell from any hot spots that may arise therein during operation of the super cell. The thermal conductivity of the junction between solar cells may be, for example, greater than or equal to about 1.5 W/(m-K).

FIG. 2A shows the front surface of an exemplary rectangular solar cell 10 that may be used in a super cell 100 . Other shapes of solar cells 10 may also be used, if appropriate. In the illustrated example, the front surface metallization pattern of the solar cell 10 includes bus bars 15 and fingers 20, the bus bars 15 being disposed adjacent to the edge of one of the long sides of the solar cell 10 and extending substantially parallel to the long sides of the long sides Length; the fingers 20 are attached perpendicularly to the bus, extending not only parallel to each other, but parallel to the short sides of the solar cells 10 for substantially the length of the short sides.

In the example of FIG. 2A , the solar cell 10 is about 156 mm long and 26 mm wide, so the aspect ratio (short side length/long side length) is about 1:6. Six of these solar cells can be prepared on a standard size silicon wafer of 156 mm x 156 mm, which is subsequently divided (diced) to provide the solar cells shown. In other variations, eight solar cells 10 with dimensions of approximately 19.5 mm x 156 mm, and thus an aspect ratio of approximately 1:8, may be fabricated from standard silicon wafers. More generally, solar cell 10 may have an aspect ratio of, for example, about 1:2 to about 1:20, and may be fabricated from standard size wafers or any other suitable size wafers.

FIG. 3A illustrates an exemplary method by which a standard-shaped and dimensioned pseudo-square silicon solar cell wafer 45 may be cut, disassembled, or otherwise separated to form the rectangular solar cells just described. In this example, several full width rectangular solar cells 10L are cut from the central portion of the wafer, in addition, several shorter rectangular solar cells 10S are cut from the ends of the wafer, and the chamfers or rounds of the wafer are discarded corner. The solar cell 10L can be used to form a one-width shingled super cell, and the solar cell 10S can be used to form a narrower width shingled super cell.

Alternatively, chamfers (eg, rounded corners) may remain on the solar cells cut from the ends of the wafer. Figures 2B-2C illustrate the front surface of an exemplary "V-shaped" rectangular solar cell 10 that is substantially similar to the front surface of Figure 2A, but with chamfers that are cut from the solar cell wafers remain. In Figure 2B, the bus 15 is disposed adjacent to the shorter of the two long sides and extends substantially its length parallel to this side, and then extends at least partially around the chamfer of the solar cell at both ends. In FIG. 2C, the bus 15 is disposed adjacent to the longer of the two long sides and extends substantially its length parallel to this side. FIGS. 3B-3C show front and rear views of a pseudo-square wafer 45 that can be cut along the dashed lines shown in FIG. 3C to provide multiple front surface metallization patterns similar to those shown in FIG. 2A . solar cells 10, and two chamfered solar cells 10 with a front surface metallization pattern similar to that shown in FIG. 2B.

In the exemplary front surface metallization pattern shown in FIG. 2B , the two ends of the bus 15 extending around the chamfer of the cell may each have a gradual The width of the smaller (gradually narrower). Similarly, in the exemplary front surface metallization pattern shown in FIG. 3B , the ends of the thin wires interconnecting the discrete contact pads 15 extend around the chamfer of the solar cell, with the distance from where the discrete contact pads are arranged. The distance along the long side of the solar cell increases and gradually decreases. This tapering is optional, but can advantageously reduce the metal used and the shading of the active area of the solar cell without significantly increasing resistive losses.

Figures 3D-3E show front and rear views of a perfect square wafer 47, which may be cut along the dashed lines shown in Figure 3E to provide multiple front surface metallization patterns similar to those shown in Figure 2A. 10 solar cells.

Chamfered rectangular solar cells can be used to form super cells that include only chamfered solar cells. Additionally or alternatively, one or more such chamfered rectangular solar cells may be used in combination with one or more unchamfered rectangular solar cells (eg, FIG. 2A ) to form a super cell. For example, the end solar cells of the super cell can be chamfered solar cells, while the middle solar cells can be unchamfered solar cells. If a combination of chamfered and unchamfered solar cells is used in super cells (or more generally in solar modules), it may be advantageous to choose the following dimensions for these solar cells: during operation of the solar cells, the inverted The front surfaces of both corner solar cells and unchamfered solar cells have equal areas exposed to sunlight. Matching the areas of the two solar cells in this manner matches the currents produced in the chamfered and unchamfered solar cells, thereby improving tandem cells including both chamfered and unchamfered solar cells String performance. Cutting from the same quasi-square wafer can be achieved, for example, by adjusting the positions of the lines along which the wafer is cut so that the chamfered solar cells are slightly wider than the unchamfered solar cells in the direction perpendicular to the long axis of the solar cells. The areas of the lower chamfered and unchamfered solar cells are matched, thereby compensating for the missing corners on the chamfered solar cells.

Solar modules may include only the following three types of super cells: super cells formed from only unchamfered rectangular solar cells, super cells formed from only chamfered rectangular solar cells, or both chamfered and unchamfered solar cells The super battery can also include any combination of the above three variants of the super battery.

In some cases, the portion of a standard sized square or pseudo-square solar cell wafer (eg, wafer 45 or wafer 47) near the edge of the wafer may be less efficient at converting light to electricity than the portion of the wafer further from the edge. To improve the efficiency of the resulting rectangular solar cells, in some variations, one or more edges of the wafer are trimmed to remove the less efficient portions prior to dicing the wafer. The width of the trimmed portion from the wafer edge may be, for example, from about 1 mm to about 5 mm. Additionally, as shown in Figures 3B and 3D, the two end solar cells 10 cut from the wafer can be oriented with their front surface busses (or discrete contact pads) 15 along their outer edges, thus along the two sides of the wafer. an edge. Since in the super cells disclosed in this specification, the bus lines (or discrete contact pads) 15 typically overlap adjacent solar cells, the low light conversion efficiency along these two edges of the wafer does not affect the performance of the solar cells. Thus, in some variations, edges on a square or pseudo-square wafer oriented parallel to the short sides of the rectangular solar cells are trimmed as just described, but edges on the wafer oriented parallel to the long sides of the rectangular solar cells are not trimmed. In other variations, one, two, three or four edges of a square wafer (eg, wafer 47 in Figure 3D) are trimmed as just described. In other variations, one, two, three or four long edges of the quasi-square wafer are trimmed as just described.

An elongated solar cell (as shown) with a large aspect ratio and an area smaller than a standard 156mm x 156mm solar cell can be advantageously used to reduce ^I2R resistive power loss in the solar cell modules disclosed in this specification . In particular, as the area of the solar cell 10 is reduced compared to a standard sized silicon solar cell, the current produced by the solar cell is reduced, thereby directly reducing the resistive power in the solar cell and in series strings of such solar cells loss. Additionally, arranging such rectangular solar cells in the super cell 100 so that the current flows through the super cell parallel to the short sides of the solar cell can shorten the time necessary for the current to pass through the semiconductor material to the fingers 20 in the front surface metallization pattern The distance traversed can be reduced and the necessary length of the fingers can be shortened, which can also reduce resistive power loss.

As described above, the solar cells 10 are joined to each other in their overlapping regions, thereby electrically connecting the solar cells in series, shortening adjacent solar cells as compared to conventional series strings of solar cells having protrusions The length of the electrical connection between. This also reduces resistive power losses.

Referring again to FIG. 2A , in the illustrated example, the front surface metallization pattern on the solar cell 10 includes optional bypass wires 40 extending parallel to and spaced apart from the bus bars 15 . (Such bypass wires can also optionally be used in the metallization patterns shown in FIGS. 2B-2C, 3B, and 3D, and are also shown in FIG. 2Q, when they are separate from the discrete contact pads 15 is not used in combination with a continuous bus). Bypass wire 40 interconnects fingers 20 to allow current to bypass cracks that may form between bus 15 and bypass wire 40 . Such cracks may isolate fingers 20 at various locations near bus 15, and so may otherwise isolate regions of solar cell 10 from bus 15. Bypass wires provide an alternate electrical path between such isolated fingers and the bus. The illustrated example shows bypass conductors 40 disposed parallel to bus 15 , extending approximately the full length of the bus, and interconnecting each finger 20 . This arrangement may be preferred, but is not required. If there is a bypass wire, it does not need to run parallel to the bus, nor does it need to extend the full length of the bus. Additionally, the bypass wire interconnects at least two fingers, but need not interconnect all fingers. The longer bypass wires may be replaced, for example, with two or more shorter bypass wires. Any suitable arrangement of bypass wires can be used. The use of such bypass wires is reported in No. 13/2012 titled "Solar Cell With Metallization Compensating For Or Preventing Cracking" (Solar Cells with Metallization Patterns to Compensate or Avoid Cracking) This is described in more detail in US Patent Application 371,790, which is incorporated herein by reference in its entirety.

The exemplary front surface metallization pattern of FIG. 2A also includes optional end wires 42 interconnecting the fingers 20 at the distal ends of the fingers 20 opposite the busses 15 . (Such end wires may also optionally be used in the metallization patterns shown in Figures 2B-2C, 3B, 3D, and 2Q). The width of the wires 42 may be approximately the same as that of the fingers 20, for example. Wires 42 interconnect fingers 20 such that cracks that may form between bypass wires 40 and wires 42 are electrically bypassed so that for areas of solar cell 10 that may otherwise be electrically isolated by such cracks, the The current path is provided to the bus 15 .

While some of the illustrated examples show front bus bars 15 being uniform in width and extending substantially the length of the long sides of solar cell 10, this is not required. For example, as described above, the front bus bar 15 may be replaced by two or more discrete contact pads 15 on the front surface, which may be arranged in line with each other, eg, along one side of the solar cell 10, eg, as 2H, 2Q and 3B. Such discrete contact pads may optionally be interconnected by thin wires extending between them, as shown, for example, in the figures just mentioned. In such variations, the contact pads may be, for example, about 2 to about 20 times wider than the thin wires interconnecting the contact pads, measured perpendicular to the long side of the solar cell. There may be separate (eg, small) contact pads for each finger in the front surface metallization pattern, or each contact pad may be connected to two or more fingers. For example, the front surface contact pads 15 may be square, or rectangular elongated parallel to the edge of the solar cell. The width of the front surface contact pad 15 is perpendicular to the long side of the solar cell, for example, about 1 mm to about 1.5 mm; and its length is parallel to the long side of the solar cell, for example, about 1 mm to about 10 mm. The spacing between the contact pads 15 may be, for example, about 3 mm to about 30 mm, measured parallel to the long sides of the solar cells.

Alternatively, solar cell 10 may lack front bus bars 15 and discrete front contact pads 15, thus including fingers 20 only in the front surface metallization pattern. In such variations, the current collection function originally performed by the front bus bar 15 or the front contact pads 15 may be performed, in whole or in part, by the conductive material that joins the two solar cells 10 to each other in the overlapping configuration described above.

A solar cell lacking both bus 15 and contact pads 15 may or may not include bypass wire 40 . If bus 15 and contact pads 15 are not present, bypass wire 40 may be arranged to bypass cracks formed between the bypass wire and that portion of the front surface metallization pattern that is conductively bonded to the overlapping solar cells.

The front surface metallization pattern including bus or discrete contact pads 15, fingers 20, bypass wires 40 (if present), and end wires 42 (if present) may be formed, for example, from silver paste conventionally used for such purposes , and then deposited, for example using conventional screen printing methods. Alternatively, the front surface metallization pattern may be formed of electroplated copper. Any other suitable materials and processes may also be used. In a variation in which the front surface metallization pattern is formed of silver, the use of discrete front surface contact pads 15 rather than a continuous bus line 15 along the cell edge reduces the amount of silver on the solar cell, which can advantageously reduce cost. In a variant where the front surface metallization pattern is formed from copper or another conductor that is less expensive than silver, a continuous bus 15 can be used without a cost disadvantage.

2D-2G, 3C, and 3E illustrate exemplary back surface metallization patterns for solar cells. In these examples, the back surface metallization pattern includes discrete back surface contact pads 25 arranged along one long edge of the solar cell back surface, and metal contacts 30 that cover substantially all remaining area of the solar cell back surface. In a shingled super cell, the contact pads 25 are, for example, bonded to bus bars or discrete contact pads arranged along the edges of the upper surfaces of adjacent overlapping solar cells, thereby electrically connecting the two solar cells in series. For example, each discrete rear surface contact pad 25 may be aligned with a corresponding discrete front surface contact pad 15 on the front surface of the overlapping solar cell and bonded to the said discrete contact pad by a conductive bonding material applied only to the discrete contact pads. Corresponding discrete front surface contact pads 15 . For example, the discrete contact pads 25 may be square (FIG. 2D), or rectangular elongated parallel to the edges of the solar cell (FIGS. 2E-2G, 3C, 3E). The width of the contact pad 25 is perpendicular to the long side of the solar cell, for example, about 1 mm to about 5 mm; the length of the contact pad 25 is parallel to the long side of the solar cell, for example, about 1 mm to about 10 mm. The spacing between the contact pads 25 may be, for example, about 3 mm to about 30 mm, measured parallel to the long sides of the solar cells.

Contacts 30 may be formed, for example, of aluminum and/or electroplated copper. The formed aluminum back contact 30 typically provides a back surface field for mitigating back surface recombination in the solar cell, thereby improving solar cell efficiency. If the contacts 30 are formed from copper instead of aluminum, the contacts 30 can be used in combination with another passivation scheme (eg, aluminum oxide) to similarly alleviate back surface recombination. The discrete contact pads 25 may be formed, for example, from silver paste. Using discrete silver contact pads 25 instead of continuous silver contact pads along the cell edge reduces the amount of silver in the back surface metallization pattern, which can advantageously reduce cost.

Additionally, the use of discrete silver contacts rather than continuous silver contacts can improve solar cell efficiency if the solar cell relies on the back surface field provided by the formed aluminum contacts to mitigate back surface recombination. This is because the silver back surface contacts do not provide back surface fields and thus tend to promote carrier recombination and create dead (inactive) volumes above the silver contacts in solar cells. In solar cell strings that conventionally have ribbon-like protrusions, these dead volumes are usually obscured by the ribbons and/or busses on the front surface of the solar cells and thus do not cause any additional loss of efficiency. However, in the solar cells and super cells disclosed herein, the volume in the solar cell above the back surface silver contact pads 25 is generally not obscured by the front surface metallization pattern at all, so the resulting Any dead volume will reduce the efficiency of the battery. Thus, the use of discrete silver contact pads 25 rather than continuous silver contact pads along the edge of the solar cell rear surface reduces the volume of any corresponding dead space, thereby increasing the efficiency of the solar cell.

In variations that do not rely on the back surface field to mitigate back surface recombination, the back surface metallization pattern may employ a continuous bus line 25 extending along the length of the solar cell rather than discrete contact pads 25, as shown, for example, in Figure 2Q . Such bus lines 25 may be formed, for example, of tin or silver.

Other variations of the back surface metallization pattern may employ discrete tin contact pads 25 . Variations of the back surface metallization pattern may employ finger contacts similar to those shown in the front surface metallization pattern of Figures 2A-2C, and may lack contact pads and busses.

Although the particular example solar cells shown in the figures are described as having a particular combination of front and back metallization patterns, more generally, a combination of front and back metallization patterns may be used. any suitable combination. For example, one suitable combination may employ a silver front surface metallization pattern including discrete contact pads 15 , fingers 20 and optional bypass wires 40 , and a rear surface including aluminum contacts 30 and discrete silver contact pads 25 Surface metallization pattern. Another suitable combination may employ a copper front surface metallization pattern including continuous bus 15 , fingers 20 and optional bypass wires 40 , and a rear surface metallization pattern including continuous bus 25 and copper contacts 30 .

In the process of fabricating super cells (described in more detail below), the conductive bonding material used to bond adjacent overlapping solar cells in a super cell may be dispensed (discretely or continuously) only to the front surface or the back of the solar cells on the contact pads at the edges of the surface, but not on the surrounding part of the solar cell. This reduces the amount of material used and, as described above, reduces or reconciles the stress caused by the mismatch between the CTE of the conductive bonding material and the CTE of the solar cell. However, during or after deposition and before curing, portions of the conductive bonding material may tend to spread out of the contact pads and then onto corresponding portions of the solar cell. For example, the adhesive resin portion of the conductive bonding material can be drawn out of the contact pad by capillary forces and then spread onto adjacent textured or porous portions on the surface of the solar cell. Additionally, during the deposition process, some of the conductive bonding material may not reach the contact pads, but rather be deposited onto adjacent portions of the solar cell surface, from which it may then spread around. Such spreading and/or deposition inaccuracies of the conductive bonding material may weaken the bond between overlapping solar cells and may damage those portions of the solar cell on which the conductive bonding material is spread or erroneously deposited. Such scattering of the conductive bonding material can be mitigated or prevented, for example, by metallization patterns that form barriers or barriers near or around each contact pad, thereby substantially holding the conductive bonding material in place.

As shown in FIGS. 2H-2K, for example, the front surface metallization pattern may include discrete contact pads 15, fingers 20, and barriers 17, where each barrier 17 surrounds a corresponding contact pad 15 and acts as a barrier to prevent contact during contact A moat is formed between the pad and the barrier. Portions 19 of the uncured conductive adhesive bonding material 18 that flow from the contact pads or that do not reach the contact pads when dispensed onto the solar cell may be confined within the moat by the barrier 17 . This prevents further spreading of the conductive adhesive bonding material from the contact pads onto the surrounding portion of the cell. Barrier 17 may, for example, be formed of the same material as fingers 20 and contact pads 15 (eg, silver), and may be, for example, about 10 to about 40 microns in height and about 30 to about 100 microns in width, for example. The moat formed between barrier 17 and contact pad 15 may have a width of, for example, about 100 micrometers to about 2 millimeters. Although the illustrated example has only a single barrier 17 around each front contact pad 15, in other variations, two or more such barriers may be arranged concentrically around each contact pad, for example. The front surface contact pad and one or more barriers around it may form, for example, a shape similar to a "bull's eye" target. As shown in FIG. 2H , for example, the barrier 17 may be interconnected with the fingers 20 and may be interconnected with thin wires that interconnect the contact pads 15 .

Similarly, as shown in FIGS. 2L-2N, for example, the back surface metallization pattern may include discrete back contact pads 25 (eg, silver), (eg, aluminum) covering substantially all remaining area of the solar cell rear surface Contacts 30, and (eg, silver) barriers 27, each of which surrounds the corresponding rear contact pad 25 and acts as a barrier, forming a moat between the contact pad and the barrier. As shown, a portion of the contacts 30 may fill the moat. Portions of the uncured conductive adhesive bonding material that flow from the contact pads 25 or do not reach the contact pads when dispensed onto the solar cell may be confined within the moat by the barrier 27 . This prevents further spreading of the conductive adhesive bonding material from the contact pads onto the surrounding portion of the cell. The height of the barrier 27 may be, for example, about 10 micrometers to about 40 micrometers, and the width thereof may be, for example, about 50 micrometers to about 500 micrometers. The moat formed between barrier 27 and contact pad 25 may have a width of, for example, about 100 micrometers to about 2 millimeters. Although the illustrated example has only a single barrier 27 around each rear surface contact pad 25, in other variations, two or more such barriers may be provided concentrically around each contact pad, for example. The rear surface contact pad and one or more barriers around it may form, for example, a shape similar to a "bull's eye" target.

A continuous bus or contact pad extending substantially the length of the edge of the solar cell can also be surrounded by a barrier that prevents the spread of the conductive adhesive bonding material. For example, FIG. 2Q shows such a barrier 27 surrounding the rear surface bus 25 . A front surface bus (eg, bus 15 in Figure 2A) may similarly be surrounded by a barrier. Similarly, a row of front surface contact pads or rear surface contact pads may be surrounded by such a barrier as a whole, rather than individually surrounded by divided barriers.

The features of the front surface metallization pattern or the back surface metallization pattern can form a barrier that extends substantially the length of the solar cell parallel to the overlapping edges of the solar cell, rather than surrounding a bus or one or more contact pads as just described, which When the bus or contact pad is placed between the barrier and the edge of the solar cell. Such a barrier may serve a dual role as a bypass wire (as described above). For example, in Figure 2R, bypass wire 40 provides a barrier that helps prevent uncured conductive adhesive bonding material on contact pad 15 from spreading over the active area of the front surface of the solar cell. A similar arrangement can be used for the back surface metallization pattern.

Barriers to the spread of conductive adhesive bonding material may be spaced from the contact pads or busses to form the moat just described, but this is not required. Alternatively, such barriers may abut contact pads or busses, eg, as shown in Figure 2O or Figure 2P. In such variations, the barrier is preferably higher than the contact pads or busses to retain uncured conductive adhesive bonding material on the contact pads or busses. Although Figures 2O and 2P show portions on the front surface metallization pattern, a similar arrangement can be used for the back surface metallization pattern.

Barriers to prevent spread of conductive adhesive bonding material and/or trenches between such barriers and contact pads or busses, as well as any conductive adhesive bonding material that has been spread into such trenches, may optionally Located on the surface of a solar cell in an area that overlaps with an adjacent solar cell in a super cell and is therefore invisible and shielded from exposure to solar radiation.

As an alternative to or in addition to using a barrier as just described, a mask or any other suitable method (eg, screen printing) can be used to deposit the conductive bonding material, thereby enabling accurate deposition, thereby reducing the potential for spreading during deposition The amount of conductive bonding material outside or not reaching the contact pads.

More generally, the solar cell 10 may employ any suitable front surface metallization pattern and back surface metallization pattern.

FIG. 4A shows a portion of the front surface of an exemplary rectangular super cell 100 including solar cells 10 as shown in FIG. 2A arranged in a lapped arrangement as shown in FIG. 1 . Due to the lapped geometry, there are no physical gaps between pairs of solar cells 10. Additionally, although the bus 15 of the solar cell 10 at one end of the super cell 100 is visible, the bus (or front surface contact pads) of other solar cells are hidden under the overlapping portion of adjacent solar cells. Thus, the super cell 100 effectively uses the area occupied in the solar module. In particular, a larger portion of this area is available for power generation than is the case with conventional solar cell arrangements having protrusions and solar cell arrangements that include many visible busses on the illuminated surface of the solar cells. FIGS. 4B-4C show front and rear views, respectively, of another exemplary super cell 100 , which essentially includes a chamfered V-shaped rectangular silicon solar cell, but is otherwise similar to FIG. 4A .

In the example shown in Figure 4A, the bypass wires 40 are hidden by overlapping portions of adjacent cells. Alternatively, the solar cells including the bypass wires 40 may overlap as shown in Figure 4A, but not cover the bypass wires.

The exposed front surface busses 15 at one end of the super cell 100 and the back surface metallization of the solar cells at the other end of the super cell 100 provide the super cell with negative (terminal) end contacts and positive (terminal) end contacts, which end contacts Points may be used to electrically connect super cell 100 to other super cells, and/or to other electrical components as desired.

Adjacent solar cells in super cell 100 may overlap by any suitable amount, such as about 1 mm to about 5 mm.

As shown in Figures 5A-5G, for example, the shingled super cells just described can effectively fill the area of a solar module. Such solar modules can be square or rectangular, for example. As shown in FIGS. 5A-5G , the length of the short side of the rectangular solar module may be, for example, about 1 meter, and the length of the long side may be, for example, about 1.5 meters to about 2.0 meters. Any other suitable shape and size may also be selected for the solar module. Any suitable arrangement of super cells may be employed in a solar module.

In square or rectangular solar modules, the super cells are typically arranged in rows parallel to the short or long sides of the solar module. Each row may include one, two or more super cells arranged end-to-end. The super cells 100 forming part of such a solar module may comprise any suitable number of solar cells 10 and have any suitable length. In some variations, the length of each of the super cells 100 is approximately equal to the length of the short side of the rectangular solar module of which the super cells form part. In other variations, the length of each of the super cells 100 is approximately equal to half the length of the short side of the rectangular solar module of which the super cells form a part. In other variations, the length of each of the super cells 100 is approximately equal to the length of the long side of the rectangular solar module of which the super cells form part. In other variations, the length of each of the super cells 100 is approximately equal to half the length of the long side of the rectangular solar module of which the super cells form a part. The number of solar cells required to make super cells of these lengths naturally depends on the size of the solar module, the size of the solar cells, and the amount of overlap between adjacent solar cells. Any other suitable length may also be selected for the super cell.

In variations where the length of super cell 100 is approximately equal to the length of the short sides of a rectangular solar module, the super cell may include, for example, 56 rectangular solar cells measuring about 19.5 mm by about 156 mm, with adjacent solar cells overlapping by about 3 mm. Eight such rectangular solar cells can be singulated from conventional square or pseudo-square 156mm x 156mm wafers. Alternatively, such a super cell may comprise, for example, 38 rectangular solar cells measuring about 26 mm by about 156 mm, with adjacent solar cells overlapping by about 2 mm. Six such rectangular solar cells can be singulated from conventional square or pseudo-square 156mm x 156mm wafers. In variations where the length of super cell 100 is approximately equal to half the length of the short sides of a rectangular solar module, the super cell may include, for example, 28 rectangular solar cells measuring about 19.5 mm by about 156 mm, with adjacent solar cells overlapping by about 3 mm. Alternatively, such a super cell may comprise, for example, 19 rectangular solar cells measuring about 26 mm by about 156 mm, with adjacent solar cells overlapping by about 2 mm.

In variations where the length of super cell 100 is approximately equal to the length of the long sides of a rectangular solar module, the super cell may, for example, comprise 72 rectangular solar cells measuring about 26 mm by about 156 mm, with adjacent solar cells overlapping by about 2 mm. In variations where the length of super cell 100 is approximately equal to half the length of the long sides of a rectangular solar module, the super cell may include, for example, 36 rectangular solar cells measuring about 26 mm by about 156 mm, with adjacent solar cells overlapping by about 2 mm.

5A illustrates an exemplary rectangular solar module 200 including 20 rectangular super cells 100, where each rectangular super cell has a length approximately equal to half the length of the short side of the solar module. The super cells are arranged in pairs end-to-end to form ten rows of super cells, with the rows and long sides of the super cells oriented parallel to the short sides of the solar module. In other variations, each row of super cells may include three or more super cells. Additionally, similarly constructed solar modules may include more or fewer rows of super cells than shown in this example. (For example, Figure 14A shows a solar module comprising twenty-four rectangular super cells arranged in twelve rows of two).

In variations where the super cells in each row are arranged such that at least one of the super cells has a front surface end contact at the end adjacent to the other super cell in the row, the gap 210 shown in FIG. 5A has Facilitates electrical contact to the front surface end contacts (eg, exposed bus or discrete contacts 15 ) of the super cell 100 along the centerline of the solar module. For example, two super cells in a row can be arranged such that one super cell has front surface terminal contacts along the centerline of the solar module and the other super cell has rear surface terminals along the centerline of the solar module contact. With this arrangement, two super cells in a row can be electrically connected in series by interconnects that are arranged along the centerline of the solar module and bonded to the front surface terminal contacts of one super cell and the other Rear surface terminal contacts of super cells. (See, eg, Figure 8C, discussed below). In variations where each row of super cells includes three or more super cells, there may be additional gaps between the super cells, and these additional gaps may similarly contribute to the formation of the front surface away from the sides of the solar module Electrical contact of end contacts.

5B shows an exemplary rectangular solar module 300 including 10 rectangular super cells 100, where each rectangular super cell has a length approximately equal to the length of the short sides of the solar module. The super cells are arranged in ten parallel rows with the long sides oriented parallel to the short sides of the modules. A similarly constructed solar module may also include such side-length super cells, but with more or fewer rows than shown in this example.

5B also shows the appearance of the solar module 200 of FIG. 5A without gaps between adjacent super cells within each row of super cells. Gaps 210 of Figure 5A can be eliminated, for example, by arranging the super cells such that both super cells in each row have back surface end contacts along the centerline of the module. In this case, since there is no need to reach the front surface of the super cells along the centerline of the module, the super cells can be arranged nearly next to each other with little or no additional clearance therebetween. Alternatively, two super cells 100 in a row may be arranged such that one super cell has front surface end contacts along one side of the module and rear surface end contacts along the centerline of the module, and the other super cell has a rear surface end contact along the centerline of the module. There are front surface end contacts along the centerline of the module and rear surface end contacts along opposite sides of the module, and adjacent ends of the two super cells overlap. A flexible interconnect can be sandwiched between overlapping ends of the super cells so that it does not obscure any part of the front surface of the solar module for providing electrical connections to the front surface end contacts of one super cell and the other super cell. Terminal contacts on the rear surface of the battery. For platoons containing three or more super cells, both approaches can be used together.

The super cells and rows of super cells shown in FIGS. 5A-5B may be interconnected by any suitable combination of series and parallel electrical connections, eg, as described further below in connection with FIGS. 10A-15 . Interconnection between super cells may be achieved, for example, using flexible interconnects similar to those described below in connection with Figures 5C-5G and subsequent figures. As demonstrated by the many examples described in this specification, the super cells in the solar modules described herein may be interconnected by a combination of series and parallel connections to provide the module with an output voltage that is substantially equal to that of a conventional solar module . In such cases, the output current from the solar modules described herein may also be substantially equal to that of conventional solar modules. Alternatively, as described further below, the super cells in a solar module may be interconnected, with the solar module providing a significantly higher output voltage than conventional solar modules.

FIG. 5C shows an exemplary rectangular solar module 350 including 6 rectangular super cells 100, where each rectangular super cell has a length approximately equal to the length of the long side of the solar module. The super cells are arranged in six parallel rows with their long sides oriented parallel to the long sides of the modules. A similarly constructed solar module may also include such side-length super cells, but with more or fewer rows than shown in this example. Each super cell in this example (and several that follow) includes 72 rectangular solar cells, each rectangular solar cell having a width approximately equal to 1/6 the width of a 156mm x 156mm square or pseudo-square wafer. Any other suitable number of rectangular solar cells of any other suitable size may also be used. In this example, the front surface terminal contacts of the super cells are electrically connected to each other by means of flexible interconnects 400 disposed adjacent to and extending parallel to an edge of one of the short sides of the module. The rear surface terminal contacts of the super cells are similarly electrically connected to each other by means of flexible interconnects disposed at the rear of the solar module adjacent to and extending parallel to the edge of the other short side of the module. The back surface interconnect is not visible in Figure 5C. This arrangement electrically connects six super cells of equal length to the module in parallel. Details of the flexible interconnects and their arrangement in this solar module construction and other solar module constructions are discussed in more detail below in conjunction with Figures 6-8G.

FIG. 5D shows an exemplary rectangular solar module 360 including 12 rectangular super cells 100, where each rectangular super cell has a length approximately equal to half the length of the long side of the solar module. The super cells are arranged in pairs end-to-end to form six rows of super cells with the rows and long sides of the super cells oriented parallel to the long sides of the solar module. In other variations, each row of super cells may include three or more super cells. Additionally, similarly constructed solar modules may include more or fewer rows of super cells than shown in this example. Each super cell in this example (and several that follow) includes 36 rectangular solar cells, each rectangular solar cell having a width approximately equal to 1/6 the width of a 156mm x 156mm square or pseudo-square wafer. Any other suitable number of rectangular solar cells of any other suitable size may also be used. The gap 410 facilitates making electrical contact to the front surface end contacts of the super cell 100 along the centerline of the solar module. In this example, a flexible interconnect 400 disposed adjacent to and extending parallel to an edge of one of the short sides of the module electrically interconnects the front surface terminal contacts of the six super cells. Similarly, a flexible interconnect located at the rear of the module adjacent to and extending parallel to the edge of the other short side of the module electrically connects the rear surface terminal contacts of the other six super cells. Flexible interconnects (not shown in this figure) disposed along gap 410 interconnect each pair of super cells in a row in series and optionally extend laterally to interconnect adjacent rows in parallel. This arrangement electrically connects six rows of super cells in parallel. Optionally, in the first group of super cells, the first super cell in each row is electrically connected in parallel with the first super cell in each other row; in the second group of super cells, the second super cell in each row One super cell is electrically connected in parallel with the second super cell in each of the other rows, and the two sets of super cells are electrically connected in series. With the latter arrangement, each of the two sets of super cells can be individually connected in parallel with a bypass diode.

Detail A in Figure 5D identifies the location of the cross-sectional view shown in Figure 8A where the rear surface terminal contacts of the super cells are interconnected along the edge of one of the short sides of the module. Detail B similarly identifies the location of the cross-sectional view shown in FIG. 8B where the front surface terminal contacts of the super cells are interconnected along the edge of the other short side of the module. Detail C identifies the location of the cross-sectional view shown in FIG. 8C where the super cells within a row are interconnected in series along gap 410 .

FIG. 5E shows an exemplary rectangular solar module 370 similar in construction to FIG. 5C , except that in this example, all solar cells forming the super cells are V-shaped solar cells with chamfered corners that are separated from the The corners of the pseudo-square wafer out of the solar cells correspond.

FIG. 5F shows another exemplary rectangular solar module 380 constructed similarly to FIG. 5C, except that in this example the solar cells forming the super cells comprise a mixture of V-shaped solar cells and rectangular solar cells that are Arranged to reproduce the shape of the pseudo-square wafer from which the solar cells were singulated. In the example of Figure 5F, the V-shaped solar cell may be wider than the rectangular solar cell in the direction perpendicular to its long axis to compensate for the missing corners of the V-shaped solar cell, so that during module operation, the V-shaped solar cell and the rectangular solar cell are exposed The effective area of solar radiation is equal, so the two cells have matching current.

Figure 5G illustrates another exemplary rectangular solar module constructed similarly to Figure 5E (ie, including only V-shaped solar cells), except that in the solar module of Figure 5G, adjacent V-shaped solar cells in a super cell are Arranged as mirror images of each other, so their overlapping edges are equal lengths. This arrangement maximizes the length of each overlapping junction, thus facilitating heat flow through the super cell.

Other configurations of rectangular solar modules may include one or more rows of super cells formed from only rectangular (non-chamfered) solar cells, and one or more rows of super cells formed from only chamfered solar cells. For example, a rectangular solar module can be constructed similar to that of Figure 5C, except that the outer two rows of super cells are each replaced by a row of super cells formed from only chamfered solar cells. The chamfered solar cells in these rows can be arranged, for example, in mirror image pairs, as shown in Figure 5G.

In the exemplary solar module shown in Figures 5C-5G, the current along each row of super cells is approximately 1/6 of the current in a conventional solar module of equal area due to the effective area of the rectangular solar cells forming the super cells About 1/6 of the effective area of conventional-sized solar cells. However, since the six rows of super cells are electrically connected in parallel in these examples, the total current generated by the exemplary solar module may be equal to the total current generated by a conventional solar module of the same area. This facilitates the replacement of conventional solar modules with the exemplary solar modules of Figures 5C-5G (and other examples described below).

Figure 6 shows, in greater detail than Figures 5C-5G, an exemplary arrangement of three rows of super cells interconnected with flexible electrical interconnects for connecting the super cells in each row in series with each other and for use in Connect the rows in parallel with each other. The rows may be, for example, the three rows in the solar module of Figure 5D. In the example of Figure 6, each super cell 100 has one flexible interconnect 400 conductively engaged to its front surface terminal contacts and another flexible interconnect conductively engaged to its rear surface terminal contacts point. The two super cells in each row are electrically connected in series by a common flexible interconnect that is conductively bonded to the front surface terminal contacts of one super cell and the rear surface terminal contacts of the other super cell point. Each flexible interconnect is disposed adjacent to and extends parallel to one end of the super cell to which it is joined, and can extend laterally to the super cell of the flexible interconnect to be conductively joined to the super cell in an adjacent row , thereby electrically connecting adjacent rows in parallel. The dashed lines in Figure 6 depict the portion of the flexible interconnect that is hidden from view by the cover portion of the super cell, or the portion of the super cell that is hidden from view by the cover portion of the flexible interconnect.

The flexible interconnect 400 may be conductively bonded to the super cell by, for example, the mechanically plastic conductive bonding material described above for bonding overlapping solar cells. Optionally, the conductive bonding material may be located only at discrete locations along the edge of the super cell, rather than forming a continuous line that extends substantially the length of the edge of the super cell, intended to reduce or moderate in a direction parallel to the edge of the super cell On the other hand, the stress caused by the mismatch between the thermal expansion coefficient of the conductive bonding material or interconnect and the thermal expansion coefficient of the super cell.

The flexible interconnect 400 may, for example, be formed from or include thin copper sheets. The flexible interconnect 400 may optionally be patterned or otherwise constructed to increase its mechanical plasticity (flexibility) in both directions perpendicular to and parallel to the edges of the super cell, thereby reducing or commensurate with the The stress in the directions perpendicular and parallel to the edges of the super cell due to the mismatch between the CTE of the interconnect and the CTE of the super cell. Such patterning may include, for example, forming slits, slots or holes. The thickness of the conductive portion of interconnect 400 may be, for example, less than about 100 microns, less than about 50 microns, less than about 30 microns, or less than about 25 microns, to increase the flexibility of the interconnect. The mechanical plasticity of the flexible interconnect and its bond to the super cell should be large enough to enable the interconnected super cell to be able to be undamaged in the lamination process (described in more detail below in connection with the method of making the shingled solar cell module). Stress due to CTE mismatch remains intact and can remain intact under stress due to CTE mismatch during temperature cycling testing in the range of about -40°C to about 85°C.

Preferably, the flexible interconnect 400 exhibits a resistance to current flow that is less than or equal to about 0.015 ohms, less than or equal to about 0.012 ohms, or less than or equal to about 0.012 ohms in a direction parallel to the end of the super cell to which it is joined about 0.01 ohms.

7A illustrates several exemplary configurations that may be suitable for flexible interconnect 400, designated by reference numerals 400A to 400T, respectively.

As shown, for example, in the cross-sectional views of Figures 8A-8C, the solar modules described in this specification typically have a laminate structure in which super cells and one or more encapsulation materials 4101 are sandwiched between a transparent front sheet 420 and a back between plates 430 . The transparent front panel can be, for example, glass. Optionally, the back sheet can also be transparent, which enables both sides of the solar module to work. The back plate can be, for example, a polymer plate. Alternatively, the solar module may be a double-sided glass module with both a glass front sheet and a glass back sheet.

The cross-sectional view of FIG. 8A (detail A of FIG. 5D ) shows an example of a flexible interconnect 400 conductively bonded to the back surface terminal contacts of the super cell near the edge of the solar module, and Extends inwardly below the super cell and is therefore not visible from the front of the solar module. Additional strips of encapsulant may be disposed between interconnect 400 and the rear surface of the super cell, as shown.

The cross-sectional view of FIG. 8B (detail B of FIG. 5B ) shows an example of a flexible interconnect 400 conductively bonded to the front surface terminal contacts of a super cell.

The cross-sectional view of FIG. 8C (detail C of FIG. 5B ) shows an example of a common flexible interconnect 400 conductively bonded to the front surface terminal contacts of one super cell and the other rear surface terminal contacts of the super cells, thereby electrically connecting the two super cells in series.

The flexible interconnects electrically connected to the front surface terminal contacts of the super cells may be constructed or arranged to occupy only a narrow width on the front surface of the solar module, which may for example be located near the edge of the solar module. The area on the front surface of the module occupied by such interconnects may have a narrow width in a direction perpendicular to the edge of the super cell, eg, less than or equal to about 10 mm, less than or equal to about 5 mm, or less than or equal to about 3 mm. In an arrangement such as that shown in Figure 8B, the flexible interconnect 400 may be configured such that it does not extend beyond this distance beyond the end of the super cell. 8D-8G illustrate additional examples of arrangements for electrically connecting flexible interconnects to front surface terminal contacts of super cells, which arrangements may occupy only a narrow width on the front surface of the module. Such an arrangement helps to efficiently utilize the front surface area of the module to generate electricity.

Figure 8D shows the flexible interconnect 400 conductively bonded to the front surface terminal contacts of the super cell and folded around the edges of the super cell to the rear of the super cell. An insulating film 435, which may be pre-coated on the flexible interconnect 400, may be disposed between the flexible interconnect 400 and the rear surface of the super cell.

Figure 8E shows a flexible interconnect 400 comprising thin narrow strips 440 that are conductively bonded not only to the front surface terminal contacts of the super cell, but also to conductively bonded surfaces extending behind the back surface of the super cell. Thin Broadband 445. An insulating film 435, which may be pre-coated on the thin broadband 445, may be disposed between the thin broadband 445 and the rear surface of the super cell.

Figure 8F shows a flexible interconnect 400 bonded to the front surface terminal contacts of a super cell and rolled into a flat coil, the flexible interconnect 400 occupying only a narrow width on the front surface of the solar module.

The flexible interconnect 400 shown in FIG. 8G includes a thin strip portion that is conductively bonded to the front surface terminal contacts of the super cell, and a portion that is thicker in cross-section near the super cell.

In each of FIGS. 8A-8G, the flexible interconnect 400 may extend along the full length of the edge of the super cell (eg, into the drawing page) as shown, for example, in FIG. 6 .

Optionally, portions of the flexible interconnect 400 that would otherwise be visible from the front of the module may be covered with a dark film or coating, or otherwise dyed, to reduce the perception of the interconnect and superimpose by an observer with normal color vision. Visual contrast between batteries. For example, in Figure 8C, an optional dark film or coating 425 covers the portion of interconnect 400 that would otherwise be visible from the front of the module. Portions of interconnect 400 shown in other figures that would otherwise be visible may be similarly covered or colored.

Conventional solar modules typically include three or more bypass diodes, where each bypass diode is connected in parallel with a set of 18 to 24 silicon solar cells connected in series. This is done to limit the amount of electricity that may be dissipated as heat in a reverse biased solar cell. A solar cell can become reverse biased due to defects in the solar cell, a dirty front surface, or uneven illumination that reduces its ability to deliver the current generated in the string. The heat generated in a reverse biased solar cell depends on the voltage across the solar cell and the current flowing through the solar cell. If the voltage across a reverse biased solar cell exceeds the breakdown voltage of the solar cell, the heat dissipated in the cell will be equal to the breakdown voltage multiplied by the full current generated in the string. Silicon solar cells typically have a breakdown voltage of 16 to 30 volts. Since each silicon solar cell generates about 0.64 volts during operation, a string of more than 24 solar cells can generate voltages in excess of the breakdown voltage across reverse biased solar cells.

In conventional solar modules in which solar cells are separated from each other and interconnected by ribbons, heat is not easily transported away from the heat generating solar cells. Therefore, the power dissipated by the solar cell at the breakdown voltage can create hot spots in the solar cell, resulting in significant thermal damage and perhaps a fire. So in a conventional solar module, a bypass diode is required for each group of 18 to 24 solar cells connected in series to ensure that no solar cell in the string can be reverse biased beyond the breakdown voltage.

Applicants have discovered that heat is readily transported along silicon super cells through relatively thin electrically and thermally conductive junctions between adjacent overlapping silicon solar cells. In addition, the current flowing through the super cells in the solar modules described herein is typically less than the current flowing through a string of conventional solar cells because the super cells described herein are typically formed from shingled rectangular solar cells, where each rectangular The effective areas of solar cells are all smaller than those of conventional solar cells (for example, 1/6 of the latter). Additionally, the rectangular aspect ratios of solar cells generally used herein allow for extended thermal contact areas between adjacent solar cells. Thus, a solar cell reverse biased to a breakdown voltage dissipates less heat, and the heat is easily spread across the super cell and solar module without the formation of dangerous hot spots. Applicants have thus recognized that solar modules formed from super cells as described herein may use far fewer bypass diodes than is conventionally thought necessary.

For example, in some variations of solar modules as described herein, the number N of included solar cells may be used to include a number N of greater than 25, greater than or equal to about 30, greater than or equal to about 50, greater than or equal to about 70, or greater than or equal to about A super cell of 100, wherein no single solar cell in the super cell or a group of solar cells whose total number is less than N are individually electrically connected in parallel with the bypass diode. Optionally, complete super cells of these lengths can be electrically connected in parallel with a single bypass diode. Optionally, super cells of these lengths can be used without bypass diodes.

Several additional and optional design features can make solar modules using super cells as described herein more resistant to heat dissipated in reverse biased solar cells. Referring again to Figures 8A-8C, the encapsulant 4101 may be or may comprise a thermoplastic olefin (TPO) polymer, which is more light and thermally stable than standard ethylene vinyl acetate (EVA) encapsulant. When EVA is heated or exposed to UV light, it turns brown, causing hot spots in current-limiting batteries. With TPO encapsulants, these problems are mitigated or avoided altogether. In addition, the solar module may have a double-sided glass structure in which the transparent front panel 420 and the rear panel 430 are both glass. This double-sided glass structure enables solar modules to operate safely at higher temperatures than conventional polymer backsheets can withstand. Alternatively, the junction box can be mounted on one or more edges of the solar module instead of the back of the solar module, if installed behind the solar module, the junction box will be above the module, adding additional insulation to the solar cells within the module Floor.

9A illustrates an exemplary rectangular solar module comprising six shingled rectangular super cells arranged in six rows, where each row extends the length of a long side of the solar module. The six super cells are electrically connected in parallel with each other and with bypass diodes provided in the junction box 490 on the rear surface of the solar module. The electrical connections between the super cells and the bypass diodes are made through ribbons 450 embedded in the module laminate structure.

9B illustrates another exemplary rectangular solar module comprising six shingled rectangular super cells arranged in six rows, where each row extends the length of a long side of the solar module. These super cells are electrically connected in parallel with each other. Separate positive terminal junction boxes 490P and negative terminal junction boxes 490N are provided at opposite ends of the solar module on the rear surface of the solar module. The super cell is electrically connected in parallel with a bypass diode located in one of the junction boxes by means of an external cable 455 extending between the two junction boxes.

FIGS. 9C-9D include an exemplary double-sided glass rectangular solar module comprising six shingled rectangular super cells arranged in six rows, wherein each row extends the solar energy in a laminate structure including a glass front sheet and a glass back sheet The length of the long side of the module. These super cells are electrically connected in parallel with each other. Separate positive terminal junction boxes 490P and negative terminal junction boxes 490N are mounted on opposite edges of the solar module.

The use of stacked super cells in a module layout provides a unique opportunity to install module-level power management devices such as DC/AC microinverters, DC/DC module power optimizers, voltage smart switches, and related devices. A key feature of a module-level power management system is power optimization. Super cells as described and used herein can produce higher voltages than conventional panels. In addition, the super battery module layout can also partition the modules. Increased voltage, increased partitioning, these are all potential benefits of optimizing power.

Figure 9E illustrates an exemplary architecture for module-level power management using shingled super cells. In this figure, an exemplary rectangular solar module includes six shingled rectangular super cells arranged in six rows, where each row extends the length of a long side of the solar module. The three pairs of super cells are individually connected to the power management system 460 so that the power of the modules can be optimized more discretely.

FIG. 9F illustrates another exemplary architecture for module-level power management using shingled super cells. In this figure, an exemplary rectangular solar module includes six shingled rectangular super cells arranged in six rows, where each row extends the length of a long side of the solar module. The six super cells are individually connected to the power management system 460 so that the power of the modules can be optimized more discretely.

9G illustrates another exemplary architecture for module-level power management using shingled super cells. In this figure, an exemplary rectangular solar module includes six or more shingled rectangular super cells 998 arranged in six or more rows, with three or more pairs of super cells individually connected to bypasses The diode or power management system 460 can then optimize the power of the modules more discretely.

Figure 9H illustrates another exemplary architecture for module-level power management using shingled super cells. In this figure, an exemplary rectangular solar module includes six or more shingled rectangular super cells 998 arranged in six or more rows, where every two super cells are connected in series and all pairs of super cells are connected in parallel . Bypass diodes or power management systems 460 are connected in parallel to all pairs of super cells, allowing the power of the modules to be optimized.

In some variations, the implementation of module-level power management allows all bypass diodes on the solar module to be omitted, while also eliminating the risk of hot spots. This is achieved by incorporating voltage intelligence at the module level. By monitoring the voltage output of a solar cell circuit (eg, one or more super cells) in a solar module, a "smart switch" power management device can determine whether the circuit includes any number of reverse-biased solar cells. If the presence of a reverse biased solar cell is detected, the power management device may use, for example, a relay switch or other component to disconnect the corresponding circuit from the electrical system. For example, if the voltage of a monitored solar cell circuit falls below a predetermined threshold (V _Limit ), the power management device will shut down (open) the circuit, while ensuring that the module or string of modules remains connected.

In some embodiments, if the voltage of a circuit drops by more than a certain percentage or magnitude (eg, 20% or 10V) compared to other circuits in the same solar array, the circuit will be cut off. Since the modules communicate with each other, the electronics will detect this change.

Implementations of this voltage intelligence can be integrated into existing module-level power management solutions (eg, those proposed by Enphase Energy Ltd., Solaredge Technologies Ltd., TigoEnergy Ltd.) or custom circuit designs.

An example showing how the threshold voltage V _Limit can be calculated is:

CellVoc _{@Low Irr&High Temp} ×N _{number of cells in series} –Vrb _{Reverse breakdown voltage} ≤V _Limit ,

in:

CellVoc _{@Low Irr & High Temp} = open circuit voltage of a cell operating at low radiation and high temperature (lowest expected operating Voc);

N _{number of cells in series} = number of cells connected in series in each super cell being monitored;

• Vrb _{Reverse breakdown voltage} = reverse polarity voltage required to transfer current through the battery.

This approach to module-level power management using smart switches could allow, for example, more than 100 silicon solar cells to be connected in series within a single module without compromising safety and module reliability. Additionally, this smart switch can be used to limit the string voltage entering the central inverter. Longer strings of modules can thus be installed without worrying about voltage-related safety issues or licensing restrictions. If the string voltage rises to the limit, the module with the weakest current can be bypassed (turned off).

10A, 11A, 12A, 13A, 13B, and 14B, described below, provide additional exemplary circuit schematics for solar modules employing shingled super cells. Figure 10B-1, Figure 10B-2, Figure 11B-1, Figure 11B-2, Figure 11C-1, Figure 11C-2, Figure 12B-1, Figure 12B-2, Figure 12C-1, Figure 12C-2, Figures 12C-3, 13C-1, 13C-2, 14C-1, and 14C-2 provide exemplary physical layouts corresponding to these circuit schematics. In describing the physical layout, it is assumed that the front surface end contacts of each super cell have negative polarity and the rear surface end contacts of each super cell have positive polarity. If, on the contrary, the module uses super cells with positive front surface end contacts and negative back surface end contacts, then reversing the positive and negative and reversing the orientation of the bypass diodes changes the following physical A discussion of the layout. Some of the various buses mentioned in the description of these figures may be formed, for example, by the interconnect 400 described above. The other busses depicted in these figures can be implemented, for example, with solder tape embedded in the solar module's laminate structure or with external cables.

10A shows an exemplary circuit schematic of the solar module shown in FIG. 5B, wherein the solar module includes 10 rectangular super cells 100, each rectangular super cell 100 having a length approximately equal to the length of the short side of the solar module. Super cells are arranged in solar modules with their long sides oriented parallel to the short sides of the module. All super cells are electrically connected in parallel with bypass diode 480 .

10B-1 and 10B-2 illustrate an exemplary physical layout of the solar module of FIG. 10A. Bus 485N connects the negative (front surface) end contact of super cell 100 to the positive terminal of bypass diode 480 located within junction box 490 on the rear surface of the module. Bus 485P connects the positive (rear surface) end contact of super cell 100 to the negative terminal of bypass diode 480 . The bus 485P can be located entirely behind the super battery. Bus 485N and/or the interconnection of bus 485N to the super cells occupies a portion of the front surface of the module.

FIG. 11A shows an exemplary circuit schematic of the solar module shown in FIG. 5A, wherein the solar module includes 20 rectangular super cells 100, each rectangular super cell 100 having a length approximately equal to half the length of the short side of the solar module, and these The super cells are arranged in pairs end-to-end to form ten rows of super cells. The first super cell in each row is connected in parallel with the first super cell in the other rows and in parallel with bypass diode 500 . The second super cell in each row is connected in parallel with the second super cell in the other rows and in parallel with bypass diode 510 . Two sets of super cells are connected in series, as are two bypass diodes.

11B-1 and 11B-2 illustrate an exemplary physical layout of the solar module of FIG. 11A. In this layout, the first super cell in each row has front surface (negative) end contacts along the first side of the module and rear surface (positive) end contacts along the centerline of the module, and the The second super cell has a front surface (negative) end contact along the centerline of the module and a rear surface (positive) end contact along a second side of the module opposite the first side. Bus 515N connects the front surface (negative) end contact of the first super cell in each row to the positive terminal of bypass diode 500 . Bus 515P connects the rear surface (positive) end contact of the second super cell in each row to the negative terminal of bypass diode 510. Bus 520 connects the back surface (positive) end contact of the first super cell in each row and the front surface (negative) end contact of the second super cell in each row to the negative terminal of bypass diode 500 and the bypass Positive terminal of diode 510 .

The bus 515P can be located entirely behind the super battery. Bus 515N and/or the interconnection of bus 515N to the super cells occupies a portion of the front surface of the module. The bus 520 may occupy a portion of the front surface of the module, thus requiring the gap 210 as shown in FIG. 5A. Alternatively, bus 520 may be located entirely behind the super cells and be electrically connected to the super cells by means of hidden interconnects sandwiched between overlapping ends of the super cells. In this case, only a small gap 210 is required, or no gap at all.

11C-1, 11C-2, and 11C-3 illustrate another exemplary physical layout of the solar module of FIG. 11A. In this layout, the first super cell in each row has front surface (negative) end contacts along the first side of the module and rear surface (positive) end contacts along the centerline of the module, and the The second super cell has a rear surface (positive) end contact along the centerline of the module and a positive surface (negative) end contact along a second side of the module opposite the first side. Bus 525N connects the front surface (negative) end contact of the first super cell in each row to the positive terminal of bypass diode 500 . Bus 530N connects the front surface (negative) end contact of the second cell in each row to the negative terminal of bypass diode 500 and the positive terminal of bypass diode 510. Bus 535P connects the rear surface (positive) end contact of the first cell in each row to the negative terminal of bypass diode 500 and the positive terminal of bypass diode 510 . Bus 540P connects the rear surface (positive) end contact of the second cell in each row to the negative terminal of bypass diode 510 .

The bus 535P and the bus 540P may be located entirely behind the super battery. Bus 525N and bus 530N and/or their interconnection with the super cells occupy a portion of the front surface of the module.

FIG. 12A shows another exemplary circuit diagram of the solar module shown in FIG. 5A, wherein the solar module includes 20 rectangular super cells 100, each rectangular super cell 100 having a length approximately equal to half the length of the short side of the solar module , and these super cells are arranged in pairs end-to-end to form ten rows of super cells. In the circuit shown in Figure 12A, the super cells are arranged in four groups: in the first group, the first super cells of the upper five rows are connected in parallel with each other and with the bypass diode 545; in the second group , the second super cells of the upper five rows are connected in parallel with each other and with the bypass diode 550; in the third group, the first super cells in the lower five rows are connected in parallel with each other and with the bypass diode 560 ; In the fourth group, the second super cells of the lower five rows are connected in parallel with each other and in parallel with the bypass diode 555. The four sets of super cells are connected in series with each other. The four bypass diodes are also connected in series.

12B-1 and 12B-2 illustrate an exemplary physical layout of the solar module of FIG. 12A. In this layout, the first group of super cells has front surface (negative) end contacts along the first side of the module and rear surface (positive) end contacts along the centerline of the module; the second group of super cells has along the Front surface (negative) end contacts of the module centerline and rear surface (positive) end contacts along a second side of the module opposite the first side; the third group of super cells has rear surface (positive) end contacts along the first side of the module Surface (positive) end contacts and front surface (negative) end contacts along the module centerline; the fourth group of super cells has rear surface (positive) end contacts along the module centerline and along the second side of the module The front surface (negative) terminal contact.

Bus 565N connects the front surface (negative) end contacts of the super cells in the first group of super cells to each other and to the positive terminal of bypass diode 545 . Bus 570 connects the back surface (positive) end contacts of the super cells in the first group of super cells and the front surface (negative) end contacts of the super cells in the second group of super cells to each other and also connects these end contacts to the negative terminal of bypass diode 545 and the positive terminal of bypass diode 550 . Bus 575 connects the back surface (positive) end contacts of the super cells in the second group of super cells and the front surface (negative) end contacts of the super cells in the fourth group of super cells to each other and also connects these end contacts to the negative terminal of bypass diode 550 and the positive terminal of bypass diode 555 . Bus 580 connects the back surface (positive) end contacts of the super cells in the fourth group of super cells and the front surface (negative) end contacts of the super cells in the third group of super cells to each other and also connects these end contacts to the negative terminal of bypass diode 555 and the positive terminal of bypass diode 560 . Bus 585P connects the rear surface (positive) end contacts of the super cells in the third group of super cells to each other and to the negative terminal of bypass diode 560 .

The portion of bus 575 connected to the super cells in the second set of super cells and bus 585P may be located entirely behind the super cells. The remainder of bus 575 and bus 565N and/or the interconnection of both with the super cells occupy a portion of the front surface of the module.

Bus 570 and bus 580 may occupy a portion of the front surface of the module, thus requiring gap 210 as shown in FIG. 5A. Alternatively, the two buses may be located entirely behind the super cells and electrically connected to the super cells by means of hidden interconnects sandwiched between the overlapping ends of the super cells. In this case, only a small gap 210 is required, or no gap at all.

Figures 12C-1, 12C-2, and 12C-3 illustrate alternative physical layouts of the solar module of Figure 12A. This layout uses two junction boxes 490A and 490B in place of the single junction box 490 shown in Figures 12B-1 and 12B-2, but is otherwise identical to Figures 12B-1 and 12B-2.

FIG. 13A shows another exemplary circuit diagram of the solar module shown in FIG. 5A, wherein the solar module includes 20 rectangular super cells 100, each rectangular super cell 100 having a length approximately equal to half the length of the short side of the solar module , and these super cells are arranged in pairs end-to-end to form ten rows of super cells. In the circuit shown in Figure 13A, the super cells are arranged in four groups: in the first group, the first super cells of the upper five rows are connected in parallel with each other; in the second group, the second super cells of the upper five rows are connected in parallel with each other; The cells are connected in parallel with each other; in the third group, the first super cells in the lower five rows are connected in parallel with each other; in the fourth group, the second super cells in the lower five rows are connected in parallel with each other. The first and second groups are connected in series with each other and thus in parallel with the bypass diode 590 . The third and fourth groups are connected in series with each other and thus in parallel with another bypass diode 595 . The first and second groups are connected in series with the third and fourth groups, and the two bypass diodes are also connected in series.

13C-1 and 13C-2 illustrate an exemplary physical layout of the solar module of FIG. 13A. In this layout, the first group of super cells has front surface (negative) end contacts along the first side of the module and rear surface (positive) end contacts along the centerline of the module; the second group of super cells has along the Front surface (negative) end contacts of the module centerline and rear surface (positive) end contacts along a second side of the module opposite the first side; the third group of super cells has rear surface (positive) end contacts along the first side of the module Surface (positive) end contacts and front surface (negative) end contacts along the module centerline; the fourth group of super cells has rear surface (positive) end contacts along the module centerline and along the second side of the module The front surface (negative) terminal contact.

Bus 600 connects the front surface (negative) end contacts of the first group of super cells to each other, and also connects these end contacts to the back surface (positive) end contacts of the third group of super cells, the positive terminal of bypass diode 590 and the negative terminal of bypass diode 595. Bus 605 connects the back surface (positive) end contacts of the first group of super cells to each other and also connects these end contacts to the front surface (negative) end contacts of the second group of super cells. Bus 610P connects the rear surface (positive) end contacts of the second group of super cells to each other and to the negative terminal of bypass diode 590 . Bus 615N connects the front surface (negative) end contacts of the fourth group of super cells to each other and to the positive terminal of bypass diode 595 . Bus 620 connects the front surface (negative) end contacts of the third group of super cells to each other and also connects these end contacts to the rear surface (positive) end contacts of the fourth group of super cells.

The portion of bus 600 connected to the super cells in the third group of super cells and bus 610P may be located entirely behind the super cells. The remainder of bus 600 and bus 615N and/or the interconnection of both with the super cells occupy a portion of the front surface of the module.

Bus 605 and bus 620 occupy a portion of the front surface of the module, thus requiring gap 210 as shown in FIG. 5A. Alternatively, the two buses may be located entirely behind the super cells and electrically connected to the super cells by means of hidden interconnects sandwiched between the overlapping ends of the super cells. In this case, only a small gap 210 is required, or no gap at all.

Figure 13B shows an exemplary circuit schematic of the solar module shown in Figure 5B, wherein the solar module includes 10 rectangular super cells 100, each rectangular super cell 100 having a length approximately equal to the length of the short side of the solar module. Super cells are arranged in solar modules with their long sides oriented parallel to the short sides of the module. In the circuit shown in Figure 13B, the super cells are arranged in two groups: in the first group, the upper five super cells are connected in parallel with each other and with the bypass diode 590; in the second group, the lower five The super cells are connected in parallel with each other and with bypass diodes 595 . The two sets of super cells are connected in series with each other. The two bypass diodes are also connected in series.

The circuit schematic of FIG. 13B differs from that of FIG. 13A by replacing two super cells per row in FIG. 13A with a single super cell. Thus, the physical layout of the solar module of Figure 13B may be as shown in Figures 13C-1, 13C-2, and 13C-3, but with bus 605 and bus 620 omitted.

14A shows an exemplary rectangular solar module 700 including 24 rectangular super cells 100, where each rectangular super cell has a length approximately equal to half the length of the short side of the solar module. The super cells are arranged in pairs end-to-end to form twelve rows of super cells with the rows and long sides of the super cells oriented parallel to the short sides of the solar module.

Figure 14B shows an exemplary circuit schematic of the solar module shown in Figure 14A. In the circuit shown in Figure 14B, the super cells are arranged in three groups: in the first group, the first super cells of the upper eight rows are connected in parallel with each other and in parallel with the bypass diode 705; in the second group , the super cells in the lower four rows are connected in parallel with each other and with the bypass diode 710 ; in the third group, the second super cells in the upper eight rows are connected in parallel with each other and with the bypass diode 715 . The three sets of super cells are connected in series. Three bypass diodes are also connected in series.

14C-1 and 14C-2 illustrate an exemplary physical layout of the solar module of FIG. 14B. In this layout, the first group of super cells has front surface (negative) end contacts along the first side of the module and rear surface (positive) end contacts along the centerline of the module. In the second group of super cells, the first super cell in each of the lower four rows has rear surface (positive) end contacts along the first side of the module and front surface (negative) end contacts along the module centerline point, the second super cell in each of the lower four rows has a front surface (negative) end contact along the centerline of the module and a rear surface (positive) end along a second side of the module opposite the first side contact. The third group of super cells has back surface (positive) end contacts along the centerline of the module and back surface (negative) end contacts along the second side of the module.

Bus 720N connects the front surface (negative) end contacts of the third group of super cells to each other and to the positive terminal of bypass diode 705 . Bus 725 connects the back surface (positive) end contacts of the first group of super cells to the front surface (negative) end contacts of the second group of super cells, the negative terminal of bypass diode 705 and the positive terminal of bypass diode 710 . Bus 730P connects the rear surface (positive) end contacts of the third group of super cells to each other and to the negative terminal of bypass diode 715 . Bus 735 connects the front surface (negative) end contacts of the third group of super cells to each other and to the rear surface (positive) end contacts of the second group of super cells, the negative terminal of bypass diode 710 and the positive terminal of bypass diode 715.

The portion of bus 725 connected to the super cells in the first group of super cells, bus 730P, and the portion of bus 735 connected to the super cells in the second group of super cells may be located entirely behind the super cells. The remainder of bus 725, the remainder of bus 735, and bus 720N and/or the interconnection of these three to the super cells occupy a portion of the front surface of the module.

Some of the above examples house the bypass diodes in one or more junction boxes on the rear surface of the solar module. But this is not required. For example, some or all of the bypass diodes may be positioned coplanar with the super cells around the perimeter of the solar module, within the gaps between the super cells, or behind the super cells. In such cases, bypass diodes may, for example, be disposed within the laminate structure in which the super cells are encapsulated. Therefore, the location of the bypass diodes can be dispersed and the bypass diodes can be removed from the terminal box, which helps to replace the center terminal box containing both the module positive terminal and the module negative terminal with two separate single terminal terminal boxes, The two separate single terminal junction boxes may be located near the outer edge of the solar module, for example on the rear surface of the solar module. This approach generally reduces the length of the current paths in the ribbon conductors within the solar module and the current paths in the wiring between the solar modules, which can both reduce material costs and increase module power (due to reduced electrical resistance). power loss).

For example, referring to FIG. 15, the physical layout of the various electrical interconnections for the solar module shown in FIG. 5B and having the circuit schematic of FIG. 10A may employ bypass diodes 480 within the super cell laminate structure and two single-terminal connections Box 490P, 490N. Fig. 15 can be well understood by comparing Fig. 15 with Fig. 10B-1 and Fig. 10B-2. The other module layouts described above can be similarly modified.

Using the reduced current (reduced area) rectangular solar cells described above may facilitate the use of bypass diodes within the laminate structure as just described, since the reduced current solar cells dissipate in forward biased bypass diodes. The power dissipated may be less than the power dissipated with conventional sized solar cells. Therefore, the bypass diodes in the solar modules described in this specification may need to dissipate less heat than is conventional, so can be moved out of the junction box on the rear surface of the module and into the laminate structure.

A single solar module may include interconnects, other wires, and/or bypass diodes that support two or more electrical configurations, eg, two or more of the electrical configurations described above. In such cases, the particular configuration for operating the solar module may be selected from two or more alternatives, eg, using switches and/or jumpers. Different configurations may connect different numbers of super cells in series and/or parallel while the solar modules provide different combinations of voltage output and current output. Thus, such solar modules can be configured at the factory or at the installation site to be able to select from two or more different voltage and current combinations, for example, between a high voltage low current configuration and a low voltage high current configuration .

Figure 16 shows an exemplary arrangement of a smart switch module level power management device 750 between two solar modules as described above.

Referring now to FIG. 17, an exemplary method 800 for making a solar module as disclosed herein includes the following steps. In step 810, conventional sized solar cells (eg, 156mm x 156mm, or 125mm x 125mm) are cut and/or cut, resulting in narrower rectangular solar cell "strips". (See also, eg, Figures 3A-3E, and related descriptions above). The resulting solar cell strips can optionally be tested and then classified according to their current-voltage properties. Cells with matched or nearly matched current-voltage performance can be advantageously used in the same super cell, or in the same row of super cells connected in series. For example, it may be advantageous for cells connected in series within a super cell or within a row of super cells to produce matched or approximately matched currents under the same illumination conditions.

In step 815, the solar cell strips are assembled into super cells using a conductive adhesive bonding material disposed between overlapping portions of adjacent solar cells in the super cells. The conductive adhesive bonding material can be applied, for example, by ink jet printing or screen printing.

In step 820, heat and pressure are applied to cure or partially cure the conductive adhesive bonding material between the solar cells in the super cell. In a variation, after each additional solar cell is added to the super cell, the conductive adhesive between the newly added solar cell and the adjacent overlapping solar cell (which is already part of the super cell) is made first The bonding material is cured or partially cured before adding the next solar cell to the super cell. In another variation, more than two solar cells or all of the solar cells in the super cell may be arranged in a desired overlapping manner prior to curing or partially curing the conductive adhesive bonding material. The resulting super cells from this step can optionally be tested and then classified according to their current-voltage properties. Super cells with matched or nearly matched current-voltage performance can be advantageously used in the same row of super cells, or in the same solar module. For example, it may be advantageous for super cells or rows of super cells electrically connected in parallel to produce matched or approximately matched voltages under the same illumination conditions.

In step 825, the cured or partially cured super cells are arranged and interconnected in the desired module configuration in a layered structure including an encapsulation material, a transparent front (sunny side) sheet, and (optionally) transparent) back panel. The layered structure may include, for example, a first layer of encapsulant on a glass substrate, interconnected super cells (sun side down) disposed on a first layer of encapsulant, a second layer of encapsulation on a super cell layer agent, and the backplate on the second layer of encapsulant. Any other suitable arrangement may also be used.

In a lamination step 830, heat and pressure are applied to the layered structure to form a cured laminated structure.

In one variation of the method shown in Figure 17, a regular sized solar cell is divided into solar cell strips and then a conductive adhesive bonding material is applied to each individual solar cell strip. In an alternative variation, the conductive adhesive bonding material is applied to conventional sized solar cells prior to dividing the solar cells into solar cell strips.

In the curing step 820, the conductive adhesive bonding material may be fully cured or only partially cured. If only partially cured, the conductive adhesive bonding material may initially be partially cured in step 820 (cured to an extent sufficient to facilitate moving and interconnecting the super cells), and then fully cured in a subsequent lamination step 830 .

In some variations, the super cell 100 assembled as an intermediate product of the method 800 includes a plurality of rectangular solar cells 10 arranged such that the long sides of adjacent solar cells overlap and are conductively bonded as described above , and the interconnects are joined to the terminal contacts at opposite ends of the super cell.

30A shows an exemplary super cell with electrical interconnects joined to its front and rear surface terminal contacts. The electrical interconnects extend parallel to the terminal edges of the super cells and laterally beyond the super cells to facilitate electrical interconnection with adjacent super cells.

Figure 30B shows two super cells of Figure 30A interconnected in parallel. Portions of the interconnect that would otherwise be visible from the front of the module may be covered or stained (eg, darkened) to reduce the visual contrast between the interconnect and the super cell as perceived by a viewer with normal color vision. In the example shown in Figure 30A, the interconnect 850 is conductively bonded to the front terminal contact of the first polarity (eg, + or -) at one end of the super cell (right side of the figure) and the other Connector 850 is conductively joined to the opposite polarity rear terminal contact at the other end of the super cell (left side of the figure). Similar to the other interconnects described above, interconnect 850 may be conductively bonded to the super cell, for example, with the same conductive adhesive bonding material used between the solar cells, but this is not required. In the illustrated example, a portion of each interconnect 850 extends beyond the edge of the super cell 100 in a direction perpendicular to the long axis of the super cell (and parallel to the long axis of the solar cell 10). As shown in Figure 30B, this allows two or more super cells 100 to be placed side-by-side with the interconnect 850 of one super cell overlapping and conductively engaging the corresponding interconnect 850 of an adjacent super cell, thereby The two super cells are electrically interconnected in parallel. A bus of modules can be formed by interconnecting several such interconnects 850 just described in series. For example, this arrangement may work well if each super cell extends the full width or length of the module (eg, Figure 5B). Additionally, interconnect 850 may also be used to electrically connect the terminal contacts of two adjacent super cells in a row of super cells in series. Similar to the overlapping and conductive bonding of interconnects 850 in one row with interconnects 850 in an adjacent row as shown in FIG. 30B , pairs or longer strings of such interconnected super cells within a row are Electrical connections may be made in parallel with similarly interconnected super cells in adjacent rows.

The interconnect 850 can be die cut, for example, from a conductive plate, and then optionally patterned to increase its mechanical plasticity in both directions perpendicular and parallel to the edges of the super cell, thereby reducing or commensurate with the Stress in directions perpendicular and parallel to the edge of the super cell due to the mismatch between the CTE of the interconnect and the CTE of the super cell. Such patterning may include, for example, forming slits, slots or holes (not shown). The mechanical plasticity of the interconnect 850 and its engagement with one or more of the super cells should be sufficiently large to allow the super cell connections to be susceptible to changes caused by CTE mismatch during the lamination process (described in more detail below). Remains intact under stress. The interconnect 850 may be bonded to the super cell by, for example, the mechanically plastic conductive bonding material described above for bonding overlapping solar cells. Optionally, the conductive bonding material may be located only in discrete locations along the edge of the super cell, rather than forming a continuous line that extends substantially the length of the edge of the super cell, intended to reduce or moderate in a direction parallel to the edge of the super cell On the other hand, the stress caused by the mismatch between the thermal expansion coefficient of the conductive bonding material or interconnect and the thermal expansion coefficient of the super cell.

Interconnects 850 may be cut, for example, from thin copper sheets, and may be more conductive than conventional if super cells 100 are formed from solar cells that are smaller in area than standard silicon solar cells and thus operate at less than conventional currents. Interconnects are thin. For example, interconnects 850 may be formed from copper sheets having a thickness of about 50 microns to about 300 microns. The interconnect 850 can be thin enough and flexible enough to be folded behind the edge around the super cell to which it is joined, similar to the interconnect described above.

19A-19D illustrate several exemplary arrangements in which the application of heat and pressure during method 800 can cure the conductive adhesive bonding material between adjacent solar cells in a super cell or partially cured. Any other suitable arrangement may also be employed.

In Figure 19A, heat and localized pressure are applied to cure or partially cure the conductive adhesive bonding material 12 within one joint (overlapping area) at a time. The super cells can be supported by the surface 1000, and pressure can be applied mechanically to the joint from above, eg, with rods, pins, or other mechanical contacts. Heat can be applied to the joint, for example, with hot air (or other hot gas), infrared lamps, or by heating a mechanical contact that applies localized pressure to the joint.

In Figure 19B, the arrangement of Figure 19A is generalized to a batch process that simultaneously applies heat and localized pressure to multiple junctions in a super cell.

In FIG. 19C , an uncured super cell is sandwiched between a release liner 1015 and a reusable thermoplastic sheet 1020 and is disposed on a carrier sheet 1010 supported by a surface 1000 . The thermoplastic material of thermoplastic sheet 1020 is selected to melt at the temperature at which the super cell is cured. The release liner 1015 can be formed, for example, from fiberglass and PTFE and is no longer attached to the super cell after the curing process. Preferably, the release liner 1015 is formed of a material having a coefficient of thermal expansion that matches or substantially matches that of the solar cell (eg, the CTE of silicon). This is because if the CTE of the release liner is too different from the CTE of the solar cell, the solar cell and release liner will elongate by different amounts during curing, which tends to tear the super cell longitudinally at the junction. A vacuum bladder 1005 overlies this arrangement. The uncured super cells are heated from below, for example by heating the surface 1000 and the carrier plate 1010 , and then a vacuum is drawn between the bladder 1005 and the support surface 1000 . Thus, the vacuum bladder 1005 applies hydrostatic pressure to the super cell through the melted thermoplastic sheet 1020 .

In Figure 19D, the uncured super cells are transported by a perforated moving belt 1025 through an oven 1035, which heats the super cells. The vacuum applied through the perforations in the belt pulls the solar cells 10 toward the moving belt, thereby applying pressure to the junctions between the cells. During the passage of the super cell through the oven, the conductive adhesive joint material in these joints cures. Preferably, the porous belt 1025 is formed of a material whose CTE matches or substantially matches the CTE of the solar cell (eg, the CTE of silicon). This is because if the CTE of the porous belt 1025 differs too much from the CTE of the solar cell, the solar cell and the porous belt will be elongated by different amounts within the oven 1035, which tends to tear the super cell longitudinally at the junction.

The method 800 of FIG. 17 includes different steps of curing the super cells and laminating the super cells, thereby producing an intermediate product of the super cells. In contrast, the method 900 shown in FIG. 18 combines the steps of curing the super cells and laminating the super cells. In step 910, a conventional sized solar cell (eg, 156mm x 156mm, or 125mm x 125mm) is cut and/or cut, resulting in a narrower rectangular solar cell strip. The resulting solar cell strips can optionally be tested and then sorted.

In step 915, the solar cell strips are arranged in the desired module configuration in a layered structure including an encapsulant, a transparent front (sun side) sheet, and a back sheet. The solar cell strips are arranged into super cells using an uncured conductive adhesive bonding material disposed between overlapping portions of adjacent solar cells in the super cells. (The conductive adhesive bonding material can be applied, for example, by ink jet printing or screen printing). Interconnects are then arranged to electrically interconnect the uncured super cells in the desired configuration. The layered structure may include, for example, a first layer of encapsulant on a glass substrate, interconnected super cells (sun side down) disposed on a first layer of encapsulant, a second layer of encapsulation on a super cell layer agent, and the backplate on the second layer of encapsulant. Any other suitable arrangement may also be used.

In lamination step 920, heat and pressure are applied to the layered structure to cure the conductive adhesive bonding material in the super cell to form a cured laminate structure. The conductive adhesive bonding material used to bond the interconnect to the super cell may also be cured in this step.

In one variation of method 900, conventional sized solar cells are divided into solar cell strips, and a conductive adhesive bonding material is then applied to each individual solar cell strip. In an alternative variation, the conductive adhesive bonding material is applied to conventional sized solar cells prior to dividing the solar cells into solar cell strips. For example, a plurality of conventional sized solar cells can be placed on a large template and then the conductive adhesive bonding material can be dispensed onto the solar cells while the large jig is used to separate the solar cells into solar cell strips. The resulting solar cell strips can then be shipped in groups and arranged as described above in the desired module configuration.

As described above, in some variations of method 800 and method 900, the conductive adhesive bonding material is applied to conventional sized solar cells prior to dividing the solar cells into solar cell strips. The conductive adhesive bonding material is uncured (ie, still "wet") when dicing conventional sized solar cells to form solar cell strips. In some of these variations, the conductive adhesive bonding material is applied to conventionally sized solar cells (eg, by ink jet printing or screen printing), and subsequently scribed on the solar cells using a laser, using these The scribed lines define where the solar cells will be cut to form solar cell strips, and the solar cells are then cut along the scribed lines. In these variations, the laser power and/or the distance between the scribe lines and the adhesive bonding material may be selected to avoid incidental curing or partial curing of the conductive adhesive bonding material by the heat generated by the laser. In other variations, a laser is used to scribe on conventional sized solar cells, the scribe lines are used to define where the solar cells will be cut to form solar cell strips, and a conductive adhesive bonding material is subsequently applied to the solar cells on (eg by means of ink jet printing or screen printing), then the solar cells are cut along the scribed lines. In a pre-scribed variant, it may be preferred that the scribed solar cell is not incidentally cut or damaged during the step of applying the conductive adhesive bonding material is completed.

Referring again to Figures 20A-20C, Figure 20A schematically illustrates a side view of an exemplary apparatus 1050 that may be used to cut a scribed solar cell to which a conductive adhesive bonding material has been applied. (The order in which the two steps of scribing and applying the conductive adhesive bonding material may be performed may vary). In this apparatus, a conductive adhesive bonding material has been applied and regular sized solar cells 45 that have been scribed are carried by a perforated moving belt 1060 through a curved portion of a vacuum manifold 1070 . As the solar cell 45 passes over the curved portion of the vacuum manifold, the vacuum applied through the holes in the belt pulls the bottom surface of the solar cell 45 towards the vacuum manifold, thereby bending the solar cell. The radius of curvature R of the curved portion of the vacuum manifold can be selected so that when the solar cells 45 are bent in this manner, the solar cells are cut along the scribed lines. The benefit of using this method is that the solar cell 45 can be cut without touching the top surface of the solar cell 45 to which the conductive adhesive bonding material has been applied.

If it is preferred to start the cut at one end of the scribe line (ie, at one edge of the solar cell 45), then using the apparatus 1050 of FIG. 20A, by, for example, arranging the scribe line at an angle theta to the vacuum manifold This is accomplished by orienting each scribed line such that one end reaches the bend of the vacuum manifold earlier than the other end. As shown in Figure 20B, for example, the solar cells can be oriented with their scribe lines at an angle to the direction of travel of the porous belt, while the manifolds are oriented perpendicular to the direction of travel of the porous belt. As another example, Figure 20C shows that the cells are oriented with their scribe lines perpendicular to the direction of travel of the porous belt, while the manifolds are oriented at an angle to the direction of travel of the porous belt.

Any other suitable equipment may also be used to cut the scribed solar cells to which the conductive adhesive bonding material has been applied to form solar cell strips pre-applied with the conductive adhesive bonding material. Such an apparatus may, for example, use a roller to apply pressure to the top surface of the solar cell to which the conductive adhesive bonding material has been applied. In such cases, it is preferred that the rollers contact the top surface of the solar cell only in areas on the top surface of the solar cell where the conductive adhesive bonding material has not been applied.

In some variations, the solar module includes super cells arranged in rows on a white or reflective back sheet, so that a portion of the solar radiation that is not initially absorbed by the solar cells and then passes through the solar cells can be reflected back to the solar cells by the back sheet , thereby generating electricity. A reflective back sheet may be visible through the gaps between the rows of super cells, which can cause the solar module to appear to have rows of parallel bright lines (eg, white lines) extending across its front surface. For example, referring to FIG. 5B, if the super cells 100 are arranged on a white back panel, the parallel dark lines extending between the rows of super cells 100 may appear as white lines. This phenomenon may cause unsightly when the solar module is used in some occasions, for example, when used on the roof.

Referring to FIG. 21, to improve the aesthetics of the solar module, some variations employ a white back panel 1100 including dark stripes 1105 at positions corresponding to the rows of super cells to be arranged on the back panel. gap. The stripes 1105 are wide enough that the white portion of the rear panel cannot be seen through the gaps between the rows of super cells in the assembled module. This alleviates the visual contrast between the supercell and the backplate as perceived by a color-vision observer. Therefore, although the resulting module includes a white back panel, the appearance of its front surface may be similar to that of the module shown in, for example, Figures 5A-5B. The dark stripes 1105 may be formed, for example, with multiple segments of dark strips, or in any other suitable manner.

As previously discussed, shading individual cells within a solar module may create "hot spots" where the power of the unshaded cells is dissipated in the shaded cells. This dissipated power generates localized temperature spikes that can degrade the performance of the module.

To minimize the potentially severe consequences of these hot spots, it is common practice to embed bypass diodes as part of the module. Sets the maximum number of cells between bypass diodes, used to limit the maximum temperature of the module and prevent irreversible damage to the module. In the standard layout of silicon cells, one bypass diode is available for every 20 or 24 cells, depending on the typical breakdown voltage of the silicon cell. In certain embodiments, the breakdown voltage may be in the range of about 10V to 50V. In certain embodiments, the breakdown voltage may be about 10V, about 15V, about 20V, about 25V, about 30V, or about 35V.

According to various embodiments, the cut solar cell strips are overlaid with a thin thermally conductive adhesive, improving thermal contact between the solar cells. Due to the enhanced thermal contact, the degree of thermal diffusion is higher than with conventional interconnect technologies. In contrast to conventional designs where each bypass diode can only act on a maximum of 24 or less solar cells, with this thermal spreading design based on the overlay, each bypass diode can act on longer strings of solar cells. According to various embodiments, since the overlay promotes thermal diffusion, as many bypass diodes are no longer required, which may provide one or more benefits. For example, since it is no longer necessary to provide a large number of bypass diodes, module layouts of various solar cell string lengths can be formed.

According to various embodiments, thermal diffusion is achieved by maintaining physical and thermal bonding with adjacent cells. This allows sufficient heat to be dissipated through the joint.

In certain embodiments, the thickness of such junctions is maintained at about 200 microns or less, and such junctions extend the length of the solar cell in segments. According to embodiments, the thickness of such a joint may be about 200 microns or less, about 150 microns or less, about 125 microns or less, about 100 microns or less, about 90 microns or less, about 80 microns or less, about 70 microns or less, about 50 microns or less, or about 25 microns or less.

Accurately curing the adhesive can be important as this ensures that a reliable joint is maintained while reducing its thickness, thereby promoting thermal diffusion between the joined cells.

Allows longer strings of cells (eg, more than 24 cells) to be installed, making the design of solar cells and modules more flexible. For example, certain embodiments may utilize strings of cut solar cells assembled in a shingled fashion. Each module of such a configuration can utilize significantly more batteries than conventional modules.

In the absence of thermal spreading properties, a bypass diode would be required for every 24 cells. With 1/6 fewer solar cells, the number of bypass diodes in each module will be 6 times that in a conventional module (consisting of 3 uncut cells), for a total of 18 diodes. Therefore, the heat spread allows a significant reduction in the number of bypass diodes.

Additionally, for each bypass diode, a bypass circuit is required to complement the bypass electrical path. Each diode requires two interconnect points, as well as the wire routing that connects it to those interconnect points. This creates a complex circuit, resulting in high costs associated with the standard layouts associated with assembling solar modules.

In contrast, with thermal diffusion technology, only one bypass diode is required per module, or no bypass diodes are required at all. This configuration simplifies the module assembly process, allowing the use of simple automated tools to perform the layout manufacturing steps.

The battery module becomes easier to manufacture by eliminating the need for bypass protection every 24 cells. It also avoids complex tap-outs among the modules and eliminates the need for long parallel connections in bypass circuits. This heat spreading is carried out by forming long stacked battery strips extending the width and/or length of the module.

In addition to providing thermal diffusion, the stacked construction according to various embodiments can also reduce the intensity of the current dissipated in the solar cell, thereby improving hot spot performance. Specifically, during hotspot conditions, the amount of current dissipated in the solar cell depends on the cell area.

The amount of current flowing through a cell in a hotspot state is a function of the size of the division, since the stacked construction divides the cell into smaller areas. During the hotspot state, current flows through the path of least resistance (usually the cell-level defect interface or grain boundary). Reducing this current has the benefit of minimizing the risk of reliability failures in hot-spot conditions.

Figure 22A shows a plan view of a conventional module 2200 utilizing a conventional ribbon connection 2201 in a hotspot state. Here, the shielding 2202 on one cell 2204 causes heat to locally concentrate in a single cell.

In contrast, FIG. 22B shows a plan view when a module utilizing thermal diffusion is also in a hot spot state. Here, the shield 2250 on the battery 2252 generates heat within the battery. However, this heat spreads to other cells 2254 within the module 2256 that are both electrically and thermally bonded.

It should be further noted that for polycrystalline solar cells, the benefit of reducing the dissipation current is multiplied. Such polycrystalline cells are known to perform poorly when in hotspot conditions due to the presence of high-level defect interfaces.

As noted above, certain embodiments may utilize chamfer cut cell stacking configurations. In such cases, along the bond line between each cell and an adjacent cell, the thermal diffusion advantage is reflected.

This maximizes the joint length of each overlapping joint. Since the junction is the primary interface for heat dissipation from cell to cell, maximizing this length ensures optimum heat dissipation.

23A shows an example of a super cell string layout 2300 with chamfered cells 2302. In this configuration, the chamfered cells are oriented in the same direction, so all junction conduction paths are the same (125mm).

A shield 2306 on a cell 2304 causes the cell to be reverse biased. The heat then spreads to adjacent cells. The unbonded end 2304a of the chamfered cell becomes the hottest because it has the longest conduction path to the next cell.

FIG. 23B shows another example of a super cell string layout 2350 with chamfered cells 2352. In this configuration, the chamfered cells are oriented in different directions, with some of the long edges of the chamfered cells facing each other. This results in two lengths of conduction path for the junction: 125mm and 156mm.

With the cell 2354 undergoing shading 2356, the configuration of Figure 23B exhibits improved thermal diffusion along the longer bond length. Thus, Figure 23B shows thermal diffusion in a super cell with chamfered cells facing each other.

The above discussion has focused on assembling multiple solar cells (which may be cut out solar cells) in a stacked fashion on a common substrate. This results in a module having a single electrical interconnect - junction box (or j-box).

However, in order to collect sufficient solar energy to be used, it is often necessary to install multiple such modules assembled together themselves. According to various embodiments, multiple solar cell modules may also be assembled in a stacked manner, thereby increasing the area efficiency of the array.

In certain embodiments, a module may feature a top conductive ribbon in a direction facing the solar energy and a bottom conductive ribbon in a direction facing away from the solar energy.

The bottom solder ribbon is buried under the battery. Therefore, the bottom ribbon does not block incident light and does not adversely affect the area efficiency of the module. In contrast, the top ribbon is exposed and so may block incoming light, thus adversely affecting efficiency.

According to various embodiments, the modules themselves may overlap such that the top ribbon is covered by adjacent modules. FIG. 24 shows a simplified cross-sectional view of such an arrangement 2400 in which the ends 2401 of adjacent modules 2402 are used to overlap the top ribbons 2404 of the current module 2406 . Each module itself includes a plurality of shingled solar cells 2407 .

Bottom ribbon 2408 of current module 2406 is buried. Bottom ribbon 2408 is located on the raised side of the current shingle module so as to overlap the next adjacent shingle module.

This stacked module configuration can also provide additional area on the module for mounting other components without adversely affecting the final exposed area of the module array. Examples of modular elements that may be disposed in the overlapping area may include, but are not limited to, j-boxes 2410 and/or bus ribbons.

FIG. 25 shows another embodiment of a shingled module configuration 2500. Here, the junction boxes 2502, 2504 corresponding to the adjacent stacked modules 2506 and 2508 exhibit a mating structure 2510 in order to achieve electrical connection between the two. This eliminates wiring, thus simplifying the construction of the array of stacked modules.

In certain embodiments, the junction box may be reinforced with and/or combined with additional structural standoffs. This configuration results in an integrated sloped modular roof mount solution, where the size of the junction box determines the slope. This embodiment may be particularly useful if an array of stacked modules is to be mounted on a roof deck.

In the case of a module comprising a glass substrate and a glass cover plate (being a double-sided glass module), by shortening the overall length of the module (and thus shortening the exposed length L due to overlapping), it is possible to avoid additional frame members without additional frame members Use modules below. By shortening the overall length of the modules, the modules of the tilted array are able to remain intact under expected physical loads (eg, a snow load limit of 5400Pa) without cracking under strain.

It should be emphasized that the use of a super cell structure comprising a plurality of individual solar cells assembled in a shingled manner makes it easy to accommodate changes to the length of the module to meet the specific length specified by physical loads and other requirements.

Figure 26 shows a schematic view of the rear (shade side) surface of a solar module showing an example of terminal electrical contacts on the front (sun side) surface of a shingled super cell to a junction box on the rear side of the module electrical interconnection. The front surface terminal contacts of the stacked super cells can be located near the edge of the module.

26 shows the use of flexible interconnects 400 to electrically connect the front surface end contacts of super cells 100. In the illustrated example, flexible interconnect 400 includes strap portion 9400A extending parallel to the end of super cell 100 near the end of super cell 100 and fingers 9400B perpendicular to the strap The like portion extends into contact with a front surface metallization pattern (not shown) in the terminal solar cell of the super cell to which it is conductively bonded. Ribbon wire 9410 conductively bonded to interconnect 9400 passes behind super cell 100 for electrically connecting interconnect 9400 to electrical components on the rear surface of the solar module of which super cell 100 forms a part (eg, bypass diodes and/or module terminals in the junction box). An insulating film 9420 may be disposed between the wires 9410 and the edge and rear surface of the super cell 100 for electrically isolating the ribbon wires 9410 from the super cell 100 .

The interconnect 400 may optionally be folded around the edges of the super cell such that the strip portion 9400A is located or partially behind the super cell. In such cases, an electrically insulating layer is typically disposed between the interconnect 400 and the edge and rear surfaces of the super cell 100 .

The interconnect 400 may be die cut, for example, from a conductive plate, and then optionally patterned to increase its mechanical plasticity in both directions perpendicular and parallel to the edges of the super cell, thereby reducing or commensurate with the Stress in directions perpendicular and parallel to the edge of the super cell due to the mismatch between the CTE of the interconnect and the CTE of the super cell. Such patterning may include, for example, forming slits, slots or holes (not shown). The mechanical plasticity of the interconnect 400 and its bond to the super cell should be large enough to allow the super cell connection to remain intact under stress due to CTE mismatch during the lamination process (described in more detail below) . The interconnect 400 may be bonded to the super cell by, for example, the mechanically plastic conductive bonding material described above for bonding overlapping solar cells. Optionally, the conductive bonding material may be located only in discrete locations along the edge of the super cell (eg, corresponding to the locations of discrete contact pads of the end solar cell) without forming substantially the length of the edge of the super cell. A continuous line designed to reduce or reconcile stresses in a direction parallel to the edge of the super cell due to a mismatch between the thermal expansion coefficient of the conductive bonding material or interconnect and the thermal expansion coefficient of the super cell.

Interconnect 400 may be, for example, cut from a thin copper sheet, and may be more conductive than conventional if super cell 100 is formed from a smaller area solar cell than a standard silicon solar cell and thus operates at less than conventional current. Interconnects are thin. For example, interconnect 400 may be formed from a copper sheet having a thickness of about 50 microns to about 300 microns. The interconnect 400 may be thin enough to accommodate stress in directions perpendicular and parallel to the edges of the super cell due to mismatches between the CTE of the interconnect and the CTE of the super cell, even if not patterned as described above. Ribbon 9410 may be formed of copper, for example.

Figure 27 shows a schematic diagram of the back (shade side) surface of a solar module showing exemplary electrical interconnection of two or more shingled super cells in parallel, with the super cell front (sun side) The terminal electrical contacts on the surface are connected to each other and to the junction box on the rear side of the module. The front surface terminal contacts of the stacked super cells can be located near the edge of the module.

FIG. 27 illustrates the use of two flexible interconnects 400 just described to form electrical contact to the front surface terminal contacts of two adjacent super cells 100 . A bus 9430 extending parallel to the ends of the super cells 100 is conductively joined to two flexible interconnects near the ends of the super cells 100, electrically connecting the super cells in parallel. This scheme can be extended to interconnect additional super cells 100 in parallel as needed. Bus 9430 may be formed, for example, from copper tape.

Similar to that described above in connection with FIG. 26, the interconnect 400 and bus 9430 can optionally be folded around the edges of the super cell such that the ribbon portion 9400A and bus 9430 are located or partially behind the super cell. In such cases, electrically insulating layers are typically disposed between interconnect 400 and the edge and rear surface of super cell 100 , and between bus 9430 and the edge and rear surface of super cell 100 .

Figure 28 shows a schematic diagram of the rear (shade side) surface of a solar module showing another exemplary electrical interconnection of two or more shingled super cells in parallel, where the super cell front ( The terminal electrical contacts on the male side) surface are connected to each other and to the junction box on the rear side of the module. The front surface terminal contacts of the stacked super cells can be located near the edge of the module.

FIG. 28 illustrates the use of another exemplary flexible interconnect 9440 to electrically connect the front surface end contacts of the super cell 100. In this example, flexible interconnect 9440 includes strap portion 9440A, finger 9440B, and finger 9440C, with strap portion 9440A extending parallel to the end of super cell 100 near the end; finger 9440B Extends perpendicular to the ribbon portion in contact with the front surface metallization pattern (not shown) in the end solar cell of the super cell that it conductively engages; finger 9440C extends perpendicular to the ribbon portion and is behind the super cell . Finger 9440C is conductively coupled to bus 9450. The bus 9450 extends parallel to the end of the super cell 100 along the rear surface of the super cell 100 near the end of the super cell 100 and can extend to overlap the adjacent super cell to which it can be similarly electrically connected, thereby connecting the super cell. connected in parallel. Ribbon wires 9410 conductively bonded to busses 9450 electrically interconnect the super cells to electrical components (eg, bypass diodes and/or module terminals in the junction box) on the rear surface of the solar module. Electrical insulating films 9420 may be disposed between fingers 9440C and the edge and rear surface of super cell 100 , between bus 9450 and the rear surface of super cell 100 , and between ribbon conductors 9410 and the rear surface of super cell 100 .

The interconnect 9440 can be die cut, for example, from a conductive plate, and then optionally patterned to increase its mechanical plasticity in both directions perpendicular to and parallel to the edges of the super cell, thereby reducing or reconciling the Stress in directions perpendicular and parallel to the edge of the super cell due to the mismatch between the CTE of the interconnect and the CTE of the super cell. Such patterning may include, for example, forming slits, slots or holes (not shown). The mechanical plasticity of the interconnect 9440 and its bond to the super cell should be sufficiently large to allow the super cell connection to remain intact under stress due to CTE mismatch during the lamination process (described in more detail below) . The interconnect 9440 may be bonded to the super cell by, for example, the mechanically plastic conductive bonding material described above for bonding overlapping solar cells. Optionally, the conductive bonding material may be located only in discrete locations along the edge of the super cell (eg, corresponding to the locations of discrete contact pads of the end solar cell) without forming substantially the length of the edge of the super cell. A continuous line designed to reduce or reconcile stresses in a direction parallel to the edge of the super cell due to a mismatch between the thermal expansion coefficient of the conductive bonding material or interconnect and the thermal expansion coefficient of the super cell.

Interconnect 9440 may be cut, for example, from a thin copper sheet, and interconnect 400 may be more conductive than conventional if super cell 100 is formed from a smaller area solar cell than a standard silicon solar cell, and thus operates at less than conventional current. Interconnects are thin. For example, interconnects 9440 may be formed from copper sheets having a thickness of about 50 microns to about 300 microns. The interconnect 9440 can be thin enough to accommodate stress in directions perpendicular and parallel to the edges of the super cell due to mismatches in the CTE of the interconnect and the CTE of the super cell, even if not patterned as described above. Bus 9450 may be formed, for example, from copper tape.

After the fingers 9440B are attached to the front surface of the super cell 100 , the fingers 9440C can be attached to the bus bar 9450 . In such cases, once fingers 9440C are engaged to bus 9450, they can be bent away from the rear surface of super cell 100 (eg, perpendicular to super cell 100). Thereafter, the fingers 9440C can be bent to extend along the rear surface of the super cell 100 as shown in FIG. 28 .

Figure 29 shows a partial cross-sectional perspective view of two super cells showing the use of flexible interconnects sandwiched between overlapping ends of adjacent super cells to electrically connect super cells in series and electrically Connections are provided to the junction box. FIG. 29A shows an enlarged view of the region of interest in FIG. 29 .

Figures 29 and 29A illustrate the use of an exemplary flexible interconnect 2960 partially sandwiched between and electrically interconnecting overlapping ends of two super cells 100, to provide electrical connections for the front surface end contacts of one super cell and the rear surface end contacts of the other super cell, thereby interconnecting the super cells in series. In the illustrated example, the interconnect 2960 is not visible from the front of the solar module because it is hidden by the upper portion of the two overlapping solar cells. In another variation, adjacent ends of the two super cells do not overlap, so the portion of interconnect 2960 that connects to the front surface end contact of one of the two super cells is accessible from the front surface of the solar module See. Optionally, in such variations, portions of the interconnect that would otherwise be visible from the front of the module may be covered or stained (eg, darkened) to reduce the perception of the interconnect and superimpose by an observer with normal color vision. Visual contrast between batteries. Interconnects 2960 may extend parallel to adjacent edges of the two super cells beyond the side edges of the super cells, thereby electrically connecting pairs of super cells in parallel with pairs of super cells similarly arranged in adjacent rows.

Ribbon wire 2970 may be conductively bonded to interconnect 2960 as shown to electrically connect adjacent ends of two super cells to electrical components on the rear surface of the solar module (eg, a bypass in a junction box) diodes and/or module terminals). In another variation (not shown), ribbon wire 2970 may be electrically connected to a rear surface contact on one of the overlapping super cells remote from its overlapping end without conductively engaging interconnect 2960 . This configuration may also provide hidden taps to one or more bypass diodes or other electrical components on the rear surface of the solar module.

The interconnect 2960 can optionally be die cut, for example, from a conductive plate, and can then optionally be patterned to increase its mechanical plasticity in both directions perpendicular to and parallel to the edges of the super cell, thereby reducing Or to reconcile the stress in directions perpendicular and parallel to the edge of the super cell due to the mismatch between the CTE of the interconnect and the CTE of the super cell. Such patterning may include, for example, forming slits, slots (as shown) or holes. The mechanical plasticity of the flexible interconnect and its bond to the super cell should be large enough to allow the interconnected super cell to remain under stress due to CTE mismatch during the lamination process (described in more detail below) intact. The flexible interconnect may be bonded to the super cell by, for example, the mechanically plastic conductive bonding material described above for bonding overlapping solar cells. Optionally, the conductive bonding material may be located only at discrete locations along the edge of the super cell, rather than forming a continuous line that extends substantially the length of the edge of the super cell, intended to reduce or moderate in a direction parallel to the edge of the super cell On the other hand, the stress caused by the mismatch between the thermal expansion coefficient of the conductive bonding material or interconnect and the thermal expansion coefficient of the super cell. Interconnects 2960 may be cut, for example, from thin copper sheets.

Embodiments may include one or more of the features described in the following US Patent Publications: US Patent Publication No. 2014/0124013; and US Patent Publication No. 2014/0124014, both of which are incorporated by reference in their entirety this article for all purposes.

This specification discloses high efficiency solar modules comprising silicon solar cells arranged in a shingled fashion and electrically connected in series to form super cells, wherein the super cells are arranged in physically parallel rows in the solar module. For example, the length of the super cells may span substantially the full length or width of the solar module, or two or more super cells may be arranged end-to-end in a row. This arrangement hides the electrical interconnections between the solar cells and thus can be used to form visually appealing solar modules with little or no difference between adjacent series connected solar cells.

A super cell can include any number of solar cells, in some embodiments, at least nineteen solar cells, and, for example, in some embodiments, greater than or equal to 100 silicon solar cells. Electrical contacts at intermediate locations along the super cell may require electrically segmenting the super cell into two or more serially connected segments, while maintaining a physically continuous super cell. This specification discloses arrangements in which such electrical connections are made to the back surface contact pads of one or more silicon solar cells in a super cell in order to provide electrical tap points that are not visible from the front of the solar module, and are therefore herein Called "hidden taps". Hidden taps are the electrical connections between the backside of the solar cell and the conductive interconnect.

This specification also discloses the use of flexible interconnects to electrically interconnect front surface super cell terminal contact pads, rear surface super cell terminal contact pads, or hidden tap contact pads to other solar cells or other electrical components in a solar module.

Furthermore, the present specification discloses the use of conductive adhesives to directly bond adjacent solar cells to each other in super cells in order to provide a mechanically compliant conductive bond that reconciles thermal expansion mismatches between the super cells and the glass front sheet of the solar module, The flexible interconnect is joined to the super cell by a mechanically rigid bond that forces the flexible interconnect to reconcile the thermal expansion mismatch between the flexible interconnect and the super cell in conjunction with the use of a conductive adhesive. This avoids solar module damage that may occur due to thermal cycling of the solar module.

As described further below, electrical connections to hidden tap contact pads may be used to electrically connect segments of super cells in parallel with corresponding segments of one or more super cells in adjacent rows, and/or for various Applications, including but not limited to power optimization (eg, bypass diodes, AC/DC microinverters, DC/DC converters) and reliability applications, provide electrical connections to solar module circuits.

The use of hidden taps as just described can further enhance the aesthetic appearance of the solar cell by providing the solar module with a substantially all black appearance in conjunction with hidden inter-cell connections, and by allowing a larger portion of the module surface area to be covered by the solar cell's Active area filling can also improve the efficiency of solar modules.

Turning now to the drawings for a more detailed understanding of the solar modules described in this specification, FIG. 1 shows a cross-sectional view of a string of solar cells 10 arranged in a shingled fashion, connected in series, with ends of adjacent solar cells The parts are overlapped and electrically connected to form the super cell 100 . Each solar cell 10 includes a semiconductor diode structure and electrical contacts connected to the semiconductor diode structure through which a current generated in the solar cell 10 when illuminated by light can be supplied to an external load.

In the example described in this specification, each solar cell 10 is a rectangular crystalline silicon solar cell having a front surface (sun side) metallization pattern and a back surface (cathode side) metallization pattern, the front surface metallization pattern being disposed at On the semiconductor layer of n-type conductivity, back surface metallization patterns are provided on the semiconductor layer of p-type conductivity, the metallization patterns providing electrical contact to opposite sides of the n-p junction. However, other material systems, diode structures, physical dimensions or electrical contact arrangements may be used if appropriate. For example, the front (sun side) surface metallization pattern can be provided on the p-type conductivity semiconductor layer, and the back (cathode side) surface metallization pattern can be provided on the n-type conductivity semiconductor layer.

Referring again to FIG. 1, in super cell 100, adjacent solar cells 10 are conductively bonded directly to each other in regions where they overlap by a conductive bonding material that metallizes the front surface of one solar cell Electrically connected to the back surface metallization pattern of adjacent solar cells. Suitable conductive bonding materials may include, for example, conductive adhesives, conductive adhesive films, and conductive adhesive tapes, as well as conventional solders.

The flexible interconnect is partially sandwiched between the overlapping ends of the two super cells 100 and electrically interconnects them to provide for the front surface end contact of the super cell and the rear surface end contact of the other super cell electrical connections, thereby interconnecting the super cells in series. The interconnect is not visible from the front of the solar module because it is hidden by the upper part of the two overlapping solar cells. In another variation, the adjacent ends of the two super cells do not overlap, so the portion of the interconnect that connects to the front surface end contact of one of the two super cells is visible from the front surface of the solar module arrive. Optionally, in such variations, portions of the interconnect that would otherwise be visible from the front of the module may be covered or stained (eg, darkened) to reduce the perception of the interconnect and superimpose by an observer with normal color vision. Visual contrast between batteries. The interconnects may extend parallel to adjacent edges of the two super cells beyond the side edges of the super cells, thereby electrically connecting pairs of super cells in parallel with pairs of super cells similarly arranged in adjacent rows.

Ribbon wires can be conductively bonded to interconnects to electrically connect adjacent ends of two super cells to electrical components on the rear surface of the solar module (eg, bypass diodes and/or module terminals in the junction box) ). In another variation, the ribbon wire may be electrically connected to a rear surface contact on one of the overlapping super cells remote from its overlapping end without conductively engaging the interconnect. This configuration may also provide hidden taps to one or more bypass diodes or other electrical components on the rear surface of the solar module.

2 illustrates an exemplary rectangular solar module 200 including six rectangular super cells 100, each rectangular super cell having a length approximately equal to the length of the long sides of the solar module. The super cells are arranged in six parallel rows with their long sides oriented parallel to the long sides of the modules. A similarly constructed solar module may also include such side-length super cells, but with more or fewer rows than shown in this example. In other variations, the respective lengths of the super cells may be approximately equal to the length of the short sides of the rectangular solar module, and the super cells are arranged in parallel rows with their long sides oriented parallel to the short sides of the module. In yet other arrangements, each row may include two or more super cells electrically interconnected in series. The modules may have short sides, eg, about 1 meter in length, and long sides, eg, about 1.5 to about 2.0 meters in length. Any other suitable shape (eg, square) and size may also be selected for the solar module.

Each super cell in this example includes 72 rectangular solar cells, each rectangular solar cell having a width approximately equal to 1/6 of the width of a 156 mm square or pseudo-square wafer. Any other suitable number of rectangular solar cells of any other suitable size may also be used.

Elongated solar cells with high aspect ratios and areas smaller than standard 156mm x 156mm solar cells (as shown) can be advantageously used to reduce ^I2R resistive power losses in the solar cell modules disclosed in this specification. In particular, as the area of the solar cell 10 is reduced compared to a standard sized silicon solar cell, the current produced by the solar cell is reduced, thereby directly reducing the resistive power in the solar cell and in series strings of such solar cells loss.

For example, hidden tap contact pads connected to the back surface of the super cell may be fabricated using electrical interconnects conductively bonded to one or more hidden tap contact pads located only in the edge portion of the back surface metallization pattern of the solar cell. taps. Alternatively, a plurality of hidden taps extending along substantially the entire length of the solar cell (perpendicular to the long axis of the super cell) and conductively bonded to a plurality of hidden taps distributed in the back surface metallization pattern along the length of the solar cell may be used Interconnects of contact pads to make hidden taps.

FIG. 31A shows an exemplary solar cell back surface metallization pattern 3300 suitable for use with edge-connected hidden taps. The metallization pattern includes a continuous aluminum electrical contact 3310, a plurality of silver contact pads 3315 arranged parallel to and adjacent to the long side edges of the solar cell back surface, and each arranged with one of the short sides of the solar cell back surface Silver hidden tap contact pads 3320 with adjacent edges parallel. When the solar cells are arranged in a super cell, the contact pads 3315 overlap and bond directly to the front surfaces of adjacent rectangular solar cells. The interconnect can be conductively bonded to one or the other of the hidden tap contact pads 3320 to provide a hidden tap for the super cell. (If desired, two such interconnects can be used to provide two hidden taps).

In the arrangement shown in Figure 31A, the current flowing to the hidden taps passes through the back surface cell metallization approximately parallel to the long sides of the solar cells to the interconnect convergence point (contact 3320). To facilitate current flow along this path, the back surface metallization sheet resistance is preferably less than or equal to about 5 ohms per square, or less than or equal to about 2.5 ohms per square.

31B illustrates another exemplary solar cell back surface metallization pattern 3301 suitable for use with hidden taps employing bus-like interconnects along the length of the solar cell back surface. The metallization pattern includes a continuous aluminum electrical contact 3310, a plurality of silver contact pads 3315 arranged parallel to and adjacent to the long side edge of the solar cell back surface, and arranged in a row parallel to the long side of the solar cell and in the solar cell. A plurality of silver hidden tap contact pads 3325 approximately centered on the back surface of the battery. Interconnects extending substantially the entire length of the solar cell may be conductively bonded to hidden tap contact pads 3325 to provide hidden taps for the super cell. The current flowing to the hidden taps mainly passes through the bus-like interconnects, making the conductivity of the back surface metallization pattern less critical for the hidden taps.

The location and number of hidden tap contact pads to which hidden tap interconnects are engaged on the back surface of the solar cell affects the current flow through the back surface metallization of the solar cell, the hidden tap contact pads, and the interconnects The length of the path. Accordingly, the arrangement of the hidden tap contact pads can be selected to minimize resistance to current collection in the current path to and through the hidden tap interconnect. In addition to the configurations shown in Figures 31A-31B (and Figure 31C discussed below), suitable hidden tap contact pad arrangements may include, for example, two-dimensional arrays and rows perpendicular to the long axis of the solar cells. In the latter case, for example, the row of hidden tap contact pads may be located adjacent to the short edge of the first solar cell.

31C illustrates another exemplary solar cell back surface metallization pattern 3303 suitable for use with edge connected hidden taps or hidden taps employing bus-like interconnects along the length of the solar cell back surface. The metallization pattern includes a continuous copper contact pad 3315 arranged parallel to and adjacent to the long edge of the back surface of the solar cell; a plurality of copper fingers 3317 connected to and extending vertically from the contact pad 3315 ; and a continuous copper bus hidden tap contact pad 3325 that extends parallel to the long sides of the solar cell and is approximately centered on the back surface of the solar cell. Edge-connected interconnects can be bonded to the ends of the copper busses 3325 to provide hidden taps for the super cells. (If desired, two such interconnects can be used at either end of the copper bus 3325 to provide two hidden taps). Alternatively, interconnects extending substantially the entire length of the solar cell may be conductively bonded to the copper bus 3325 to provide hidden taps for the super cells.

The interconnects used to form the hidden taps may be joined to the hidden tap contact pads in the back surface metallization pattern by soldering, solder repair, conductive adhesive, or in any other suitable manner. For metallization patterns employing silver pads as shown in FIGS. 31A-31B , the interconnects may be formed of tinned copper, for example. Another approach is to form hidden taps directly to the aluminum back surface contact 3310 using aluminum wires that form an aluminum-to-aluminum bond, which may be formed, for example, by electrical or laser welding, weld repair, or conductive adhesive. In some embodiments, the contacts may contain tin. In the case just described, the back surface metallization of the solar cell will lack silver contact pads 3320 (FIG. 31A) or 3325 (FIG. 31B), but edge connections or bus-like aluminum interconnects may be located corresponding to these contact pads bonded to aluminum (or tin) contacts 3310 at the location.

Different thermal expansion between the hidden tap interconnects (or interconnects with front or back surface super cell terminal contacts) and the silicon solar cells and the resulting stress on the solar cells and interconnects can lead to cracks and other failure mode, which may degrade the performance of the solar module. Accordingly, there is a need to configure hidden taps and other interconnects to moderate such differential expansion without creating significant stress. For example, by forming from highly ductile materials (eg, soft copper, very thin copper sheets), from low thermal expansion materials (eg, Kovar, Invar, or other low thermal expansion iron-nickel alloys) ), or by in-plane geometric expansion features (such as slits, grooves, holes, or trusses) with thermal expansion coefficients that roughly match silicon, incorporating different thermal expansions between the harmonic interconnect and the silicon solar cell, and/or Or formed with materials that accommodate out-of-plane geometric features of such differing thermal expansion, such as kinks, asperities, or dimples, the interconnect may provide stress and thermal expansion relief. Portions of interconnects bonded to hidden tap contact pads (or bonded to super cell front or rear surface terminal contact pads, as described below) may have, for example, less than about 100 microns, less than about 50 microns, less than about 30 microns. microns or less than about 25 microns in thickness to increase the flexibility of the interconnect.

Referring again to FIGS. 7A, 7B-1, and 7B-2, these figures illustrate several exemplary interconnect configurations, indicated by reference numerals 400A-400U, which employ stress relief geometry and may be adapted to Use as an interconnect for hidden taps or for electrical connection to front or rear surface super cell terminal contacts. The lengths of these interconnects are generally approximately equal to the length of the long sides of the rectangular solar cells they join, but they may have any other suitable length. The example interconnects 400A-400T shown in FIG. 7A employ various in-plane stress relief features. The example interconnect 400U shown in the in-plane (x-y) view of FIG. 7B-1 and the out-of-plane (x-z) view of FIG. 7B-2 uses bend 3705 as an out-of-plane stress relief feature in the thin metal strip . The bends 3705 reduce the nominal tensile stiffness of the metal strip. The bends allow the belt material to bend locally, rather than only elongate when the belt is under tension. For thin ribbons, this can result in a significant reduction in nominal tensile stiffness, eg, 90% or more. The exact amount of nominal tensile stiffness reduction depends on several factors, including the number of bends, the geometry of the bends, and the thickness of the belt. Interconnects can also use a combination of in-plane and out-of-plane stress relief features.

37A-1 to 38B-2, discussed further below, illustrate several exemplary interconnect configurations that employ in-plane and/or out-of-plane stress relief geometric features and may be suitable for use as edge-connected interconnects for hidden taps .

To reduce or minimize the number of wire distributions required to connect each hidden tap, the bus can be interconnected with hidden taps. This approach connects the hidden tap contact pads of adjacent super cells to each other by using hidden tap interconnects. (The electrical connections are usually positive-to-positive or negative-to-negative, ie, the same polarity at each end).

For example, FIG. 32 shows a first hidden tap interconnect 3400 that extends substantially the entire width of the solar cells 10 in the first super cell 100 and is conductively bonded to an arrangement arranged as shown in FIG. 31B . and a second hidden tap interconnect 3400 that extends along the entire width of the corresponding solar cell in the super cells 100 in adjacent rows and is similarly conductively bonded to the arranged A hidden tap contact pad 3325 as shown in Figure 31B is formed. The two interconnects 3400 are arranged in line with each other and optionally abut or overlap each other, and may be conductively bonded to each other or otherwise electrically connected to form a bus interconnecting two adjacent super cells . As desired, this scheme can be extended over other rows of super cells (eg, all rows) to form parallel segments of a solar module comprising several adjacent super cell segments. FIG. 33 shows a perspective view of a portion of the super cell of FIG. 32 .

Figure 35 shows an example of super cells in adjacent rows interconnected by short interconnects 3400 spanning the gaps between the super cells and conductively bonded to a hidden on one super cell A tap contact pad 3320 on the other super cell and another hidden tap contact pad 3320 on another super cell, where the contact pads are arranged as shown in Figure 31A. Figure 36 shows a similar arrangement in which the short interconnect spans the gap between two super cells in adjacent rows and is conductively bonded to the end of the back surface metallized central copper bus portion on one super cell and adjacent ends of the central copper bus portion of the back surface metallization of another super cell, where the copper back surface metallization is configured as shown in Figure 31C. In both examples, the interconnection scheme can be extended over other rows (eg, all rows) of super cells to form parallel segments of a solar module comprising several adjacent super cell segments, as desired.

37A-1 through 37F-3 illustrate in-plane (x-y) and out-of-plane (x-z) views of an exemplary short hidden tap interconnect 3400 including in-plane stress relief features 3405. (The x-y plane is the plane of the metallization pattern on the back surface of the solar cell). In the example of FIGS. 37A-1 through 37E-2, each interconnect 3400 includes protrusions 3400A and 3400B disposed on opposite sides of one or more in-plane stress relief features. Exemplary in-plane stress relief features include arrangements of one, two or more hollow diamond shapes, zigzags, and arrangements of one, two or more grooves.

The term "in-plane stress relief feature" as used herein may also refer to the thickness or ductility of an interconnect or a portion of an interconnect. For example, the interconnect 3400 shown in FIGS. 37F-1 to 37F-3 is formed from a flat length of thin copper tape or foil having a thickness T in the x-y plane, eg, less than or equal to about 100 microns, less than or equal to about 50 microns, less than or equal to about 30 microns, or less than or equal to about 25 microns to increase the flexibility of the interconnect. The thickness T may be, for example, about 50 microns. The length L of the interconnect may be, for example, about 8 centimeters (cm), and the width W of the interconnect may be, for example, about 0.5 cm. Figures 37F-3 and 37F-1 show front and rear surface views, respectively, of the interconnect in the x-y plane. The front surface of the interconnect faces the rear surface of the solar module. Since the interconnect can span the gap between two parallel rows of super cells in the solar module, a portion of the interconnect can be seen from the front of the solar module through the gap. Optionally, this visible portion of the interconnect can be darkened, eg, coated with a black polymer layer, to reduce its visibility. In the example shown, the central portion 3400C of the front surface of the interconnect having a length L2 of about 0.5 cm is coated with a thinner black polymer layer. Typically, L2 is greater than or equal to the width of the gaps between the super cell rows. The thickness of the black polymer layer may be, for example, about 20 microns. Such thin copper ribbon interconnects may also optionally use in-plane or out-of-plane stress relief features, as described above. For example, the interconnect may include a stress relief out-of-plane bend, as described above in connection with FIGS. 7B-1 and 7B-2.

38A-1-38B-2 illustrate in-plane (x-y) and out-of-plane (x-z) views of an exemplary short hidden tap interconnect 3400 including out-of-plane stress relief features 3407. In an example, each interconnect 3400 includes protrusions 3400A and 3400B disposed on opposite sides of one or more out-of-plane stress relief features. Exemplary out-of-plane stress relief features include arrangements of one, two, or more bends, kinks, dimples, bumps, or ridges.

The types and arrangements of stress relief features shown in FIGS. 37A-1 through 37E-2 and FIGS. 38A-1 through 38B-2 and the interconnect ribbon thicknesses described above in connection with FIGS. 37F-1 through 37F-3 It may also be used in long hidden tap interconnects as described above and, if appropriate, in interconnects joined to super cell rear or front surface terminal contacts. The interconnect may include a combination of in-plane and out-of-plane stress relief features. The in-plane and out-of-plane stress relief features are designed to reduce or minimize strain and stress effects on the solar cell junction and thereby form a highly reliable and resilient electrical connection.

39A-1 and 39A-2 illustrate exemplary configurations for short hidden tap interconnects including cell contact pad alignment features and super cell edge alignment Features that facilitate automation and accurate placement and ease of manufacture. 39B-1 and 39B-2 illustrate exemplary configurations for short hidden tap interconnects with asymmetric protrusion lengths. Such asymmetric interconnects can be used in opposite orientations to avoid overlapping wires extending parallel to the long axis of the super cell. (See discussion of Figures 42A-42B below).

Hidden taps as described herein may form the electrical connections required in the module layout in order to provide the required module circuitry. For example, hidden tap connections may be made along the super cells at intervals of 12, 24, 36 or 48 solar cells, or at any other suitable interval. The spacing between hidden taps can be determined according to the specific application.

Each super cell typically includes a front surface terminal contact at one end of the super cell and a rear surface terminal contact at the other end of the super cell. In variations where the super cell spans the length or width of the solar module, these terminal contacts are positioned adjacent opposite edges of the solar module.

The flexible interconnects can be conductively bonded to the front or back surface terminal contacts of the super cells to electrically connect the super cells to other solar cells or to other electrical components in the module. For example, FIG. 34A shows a cross-sectional view of an exemplary solar module with interconnects 3410 conductively bonded to back surface terminal contacts at the ends of the super cells. The back surface terminal contact interconnect 3410 may be or include, for example, a thin copper tape or foil having a thickness perpendicular to the surface of the solar cell to which it is bonded, the thickness being less than or equal to about 100 microns, less than or about 50 microns, less than or equal to about 30 microns, or less than or equal to about 25 microns to increase the flexibility of the interconnect. In the plane of the solar cell surface, the interconnect may have a width, eg, greater than or equal to about 10 mm, in a direction perpendicular to the direction of current flow through the interconnect, to improve conduction. As shown, the rear surface terminal contact interconnects 3410 may be located behind the solar cells with no portion of the interconnect extending beyond the super cells in a direction parallel to the row of super cells.

Similar interconnects can be used to connect to the front surface terminal contacts. Alternatively, to reduce the front surface area occupied by the front surface terminal interconnects in the solar module, the front surface interconnects may include thin flexible portions that bond directly to the super cells and thicker portions that provide higher conductivity. This arrangement reduces the interconnect width necessary to achieve the desired conductivity. For example, the thicker portion of the interconnect may be an integral portion of the interconnect, or it may be a separate component bonded to the thinner portion of the interconnect. For example, FIGS. 34B-34C each illustrate a cross-sectional view of an exemplary interconnect 3410 conductively bonded to a front surface terminal contact at an end of a super cell. In both examples, the thin flexible portion 3410A of the interconnect directly bonded to the super cell comprises a thin copper tape or foil having a thickness perpendicular to the surface of the solar cell to which it is bonded, the The thickness is less than or equal to about 100 microns, less than or equal to about 50 microns, less than or equal to about 30 microns, or less than or equal to about 25 microns. The thicker copper tape portion 3410B of the interconnect is bonded to the thin portion 3410A to improve the conductivity of the interconnect. In Figure 34B, conductive tape 3410C on the back surface of thin interconnect portion 3410A joins the thin interconnect portion to the super cell and thick interconnect portion 3410B. In Figure 34C, thin interconnect portion 3410A is bonded to thick interconnect portion 3410B using conductive adhesive 3410D, and to the super cell using conductive adhesive 3410E. The conductive adhesives 3410D and 3410E may be the same or different. The conductive adhesive 3410E may be, for example, solder.

The solar modules described in this specification may comprise a laminate structure as shown in FIG. 34A, with super cells and one or more encapsulant materials 3610 sandwiched between a transparent front sheet 3620 and a back sheet 3630. The transparent front panel can be, for example, glass. The back panel can also be glass or any other suitable material. Additional encapsulation strips may be provided between the rear surface terminal interconnects 3410 and the rear surface of the super cell, as shown.

As mentioned above, the hidden taps provide an "all black" module appearance. Since these connections are made using wires that are often highly reflective, they will generally have high contrast compared to the attached solar cells. However, by making connections on the back surface of the solar cell, and by also routing other wires in the solar module circuit behind the solar cell, the various wires are invisible. This will allow for multiple connection points (hidden taps) while still maintaining the "all black" look.

Hidden taps can be used to form various module layouts. In the example of Figure 40 (physical layout) and Figure 41 (circuit schematic), the solar module includes six super cells, each extending the length of the module. Hidden tap contact pads and short interconnects 3400 divide each super cell into three segments and electrically connect adjacent super cell segments in parallel, forming three sets of parallel connected super cell segments. Each set is connected in parallel with a different one of the bypass diodes 1300A-1300C incorporated (embedded) into the laminated construction of the module. The bypass diodes may be located, for example, directly behind the super cells or between the super cells. For example, the bypass diodes may be positioned generally along the centerline of the solar module that is parallel to the long sides of the solar module.

In the example of FIGS. 42A-42B (which also correspond to the circuit diagram of FIG. 41 ), the solar module includes six super cells, each extending the length of the module. Hidden tap contact pads and short interconnects 3400 divide each super cell into three segments and electrically connect adjacent super cell segments in parallel, forming three sets of parallel connected super cell segments. Each set is connected in parallel with a different one of the bypass diodes 1300A-1300C by bus connections 1500A-1500C that are located behind the super cells and connect hidden tap contact pads and short interconnects to Bypass diode located at the rear of the module in the junction box.

Figure 42B provides a detailed connection view of short hidden tap interconnect 3400 and wires 1500B and 1500C. As shown, these wires do not overlap each other. In the example shown, this is accomplished using asymmetric interconnects 3400 arranged in opposite orientations. An alternative method to avoid wire overlap is to use a first symmetrical interconnect 3400 with protrusions of one length and a second symmetrical interconnect 3400 with protrusions of another length.

In the example of FIG. 43 (which also corresponds to the circuit diagram of FIG. 41 ), the solar module is configured similar to that shown in FIG. 42A , except that the hidden tap interconnects 3400 are formed to extend substantially the entire width of the solar module continuous bus. Each bus can be a single long interconnect 3400 conductively bonded to the back surface metallization of each super cell. Alternatively, the bus may include multiple individual interconnects, each interconnect spanning a single super cell, conductively bonded to each other, or otherwise electrically interconnected, as described above in connection with FIG. 41 . Figure 43 also shows: super cell terminal interconnects 3410, which form a continuous bus along one end of the solar module to electrically connect the front surface terminal contacts of the super cells; and additional super cell terminal interconnects 3410, which run along one end of the solar module. Opposite ends of the solar modules form a continuous bus to electrically connect the rear surface terminal contacts of the super cells.

The exemplary solar module of FIGS. 44A-44B also corresponds to the circuit diagram of FIG. 41 . This example employs short hidden tap interconnects 3400 as in FIG. 42A , and interconnects 3410 that form continuous busses for super cell front and rear surface terminal contacts, as shown in FIG. 43 .

In the example of Figures 47A (physical layout) and 47B (circuit schematic), the solar module includes six super cells, each super cell extending the entire length of the solar module. Hidden tap contact pads and short interconnects 3400 segment each super cell into 2/3 length sections and 1/3 length sections. Interconnects 3410 at the lower edge of the solar module (as shown in the figures) interconnect the left three rows in parallel with each other, the right three rows in parallel with each other, and the left three rows in series with the right three rows . This arrangement forms three groups of super cell segments connected in parallel, where each super cell group is 2/3 the length of the super cell. Each group is connected in parallel with a different one of the bypass diodes 2000A-2000C. If they are electrically connected as shown in Figure 41, this arrangement provides about twice the voltage and about half the current of the same super cell.

As described above in connection with FIG. 34A, the interconnects bonded to the terminal contacts on the rear surface of the super cell may be located entirely behind the super cell and not visible from the front side (sunny side) of the solar module. Interconnects 3410 joined to the super cell front surface terminal contacts are visible in the rear view of the solar module (eg, as in Figure 43 ) as it extends beyond the ends of the super cells (eg, as in Figure 44A ) ) or because it surrounds the end of the super cell and folds below said end.

Using hidden taps helps to group a small number of solar cells per bypass diode. In the example of FIGS. 48A-48B (showing the physical layout, respectively), the solar module includes six super cells, each extending the length of the module. Hidden tap contact pads and short interconnects 3400 segment each super cell into five pieces and electrically connect adjacent super cell segments in parallel to form five sets of parallel connected super cell segments. Each set is connected in parallel with a different one of the bypass diodes 2100A-2100E incorporated (embedded) into the laminated construction of the module. The bypass diodes may be located, for example, directly behind the super cells or between the super cells. Super cell terminal interconnects 3410 form a continuous bus along one end of the solar module to electrically connect the front surface terminal contacts of the super cells; and additional super cell terminal interconnects 3410 form a continuous bus along the opposite end of the solar module to electrically connect the front surface terminal contacts of the super cells; Electrically connect the rear surface terminal contacts of the super battery. In the example of Figure 48A, a single junction box 2110 is electrically connected to the front and rear surface terminal interconnect busses by wires 2115A and 2115B. However, there are no diodes in the junction box, so instead (FIG. 48B), the long return wires 2215A and 2115B can be eliminated and two unipolar (+ or -) junction boxes 2110A-2110B located, eg, at opposite edges of the module, can be used Replaces a single junction box 2110. This eliminates resistive losses in long loop wires.

Although the examples described herein use hidden taps to electrically segment each super cell into groups of three or five solar cells, these examples are intended to be illustrative and not limiting. More generally, hidden taps may be used to electrically segment super cells into more or fewer sets of solar cells than described, and/or into more or fewer sets of solar cells than described. .

In normal operation of the solar modules described herein, little or no current flows through any hidden tap contact pads since there is no bypass diode forward biasing and conduction. Instead, current flows through the length of each super cell through cell-to-cell conductive junctions formed between adjacent overlapping solar cells. In contrast, Figure 45 shows the current flow when a portion of a solar module is bypassed by a forward biased bypass diode. As indicated by the arrows, in this example, the current in the leftmost super cell flows along the super cell until it reaches the tapped solar cell and then through the back surface metallized, hidden tap contact of the solar cell pads (not shown), interconnect 3400 with a second solar cell in an adjacent super cell, another hidden tap contact pad (not shown) on the second solar cell to which the interconnect is joined, Flow through the back surface metallization of the second solar cell, and through additional hidden tap contact pads, interconnects, and solar cell back surface metallization, to bus connection 1500, to bypass diodes. The current flowing through other super cells is similar. As can be seen from the figure, in this case the hidden tap contact pads can conduct current from two or more rows of super cells, and thus more current than generated in any single solar cell in the module large current.

Typically, there are no bus lines, contact pads, or other light blocking elements (other than front surface metallization fingers or overlapping portions of adjacent solar cells) on the front surface of the solar cell opposite the hidden tap contact pads. Therefore, if the hidden tap contact pads are formed from silver on a silicon solar cell, the effect of the hidden tap contact pads can be reduced as the silver contact pads mitigate the effect of the back surface field preventing back surface carrier recombination. Photoconversion efficiency of solar cells in the area. To avoid this loss of efficiency, typically most solar cells in super cells do not include hidden tap contact pads. (For example, in some variations, only those solar cells that require hidden tap contact pads for bypass diode circuits will include such hidden tap contact pads). Furthermore, in order to match the current generation in the solar cell including the hidden tap contact pads with the current generation in the solar cell lacking the hidden tap contact pads, the solar cell including the hidden tap contact pads may have a higher Hidden tap contact pads for larger light collection area of the solar cell.

The rectangular dimensions of the individual hidden tap contact pads may be, for example, less than or equal to about 2 mm by less than or equal to about 5 mm.

During operation and during testing, the solar modules are subjected to temperature cycling due to temperature changes in the installation environment. As shown in Figure 46A, during such temperature cycling, thermal expansion mismatch between the silicon solar cells in the super cell and the rest of the module (eg, the glass front sheet of the module) results in a thermal expansion mismatch between the super cell and the rest of the module Relative motion along the long axis of the super cell row occurs. This mismatch tends to stretch or compress the super cell and can damage the solar cell or the conductive bonds between the solar cells in the super cell. Similarly, as shown in Figure 46B, thermal expansion mismatches between the interconnects bonded to the solar cells and the solar cells cause the interconnects to the solar cells to occur in a direction perpendicular to the row of super cells during temperature cycling relative motion. This mismatch can strain and potentially damage the solar cells, interconnects, and conductive bonds between them. This can happen for interconnects that are bonded to hidden tap contact pads and to terminal contacts on the front or back surface of the super cell.

Similarly, cyclic mechanical loading of solar modules can create local shears at inter-cell junctions within super cells and at junctions between solar cells and interconnects, such as during shipment or depending on the weather (eg, wind and snow). cutting force. These shear forces can also damage the solar module.

To prevent problems caused by relative motion between the super cells and the rest of the solar module along the long axis of the super cell row, the conductive adhesive used to bond adjacent overlapping solar cells to each other can be selected , in order to form a flexible conductive bond 3515 (FIG. 46A) between the overlapping solar cells that provides mechanical plasticity to the super cell to harmonize parallel The thermal expansion mismatch between the super cells and the glass front plate of the module in the direction of the super cell row is such that the thermal expansion mismatch does not damage the solar module. The conductive adhesive can be selected to form a conductive bond that has a shear modulus, eg, less than or equal to about 100 megapascals (MPa), less than or equal to about 100 megapascals (MPa), under standard test conditions (ie, 25°C). equal to about 200 MPa, less than or equal to about 300 MPa, less than or equal to about 400 MPa, less than or equal to about 500 MPa, less than or equal to about 600 MPa, less than or equal to about 700 MPa, less than or equal to about 800 MPa, less than or equal to about 900 MPa, or less than or equal to about 1000 MPa. The flexible conductive bonds between overlapping adjacent solar cells are adjustable and, for example, greater than or equal to about 15 microns of differential motion between each cell and the glass front sheet. A suitable conductive adhesive may include, for example, ECM 1541-S3 from Engineered Conductive Materials LLC.

To facilitate heat flow along the super cells to reduce the risk of damaging the solar module from hot spots that may arise during operation of the solar module in the event that the solar cells in the module are reverse biased due to shading or some other reason, the overlapping phases The conductive bond between adjacent solar cells can be formed, for example, with a thickness perpendicular to the solar cell of less than or equal to about 50 microns and a thermal conductivity perpendicular to the solar cell of greater than or equal to about 1.5 W/(m-K ).

In order to prevent problems caused by relative motion between the interconnect and the solar cell to which it is bonded, the conductive adhesive used to bond the interconnect to the solar cell can be selected to form a bond between the solar cell and the interconnect. A conductive bond that is sufficiently rigid to force the interconnect to reconcile the thermal expansion mismatch between the solar cell and the interconnect over a temperature range of about -40°C to about 180°C Will not damage the solar module. Such conductive adhesives can be selected to form conductive bonds having a shear modulus, eg, greater than or equal to about 1800 MPa, greater than or equal to about 1900 MPa, under standard test conditions (ie, 25°C). , greater than or equal to about 2000MPa, greater than or equal to about 2100MPa, greater than or equal to about 2200MPa, greater than or equal to about 2300MPa, greater than or equal to about 2400MPa, greater than or equal to about 2500MPa, greater than or equal to about 2600MPa, greater than or equal to about 2700MPa, greater than or equal to about 2800 MPa, greater than or equal to about 2900 MPa, greater than or equal to about 3000 MPa, greater than or equal to about 3100 MPa, greater than or equal to about 3200 MPa, greater than or equal to about 3300 MPa, greater than or equal to about 3400 MPa, greater than or equal to about 3500 MPa, greater than or equal to About 3600 MPa, greater than or equal to about 3700 MPa, greater than or equal to about 3800 MPa, greater than or equal to about 3900 MPa, or greater than or equal to about 4000 MPa. In such variations, for example, the interconnect can withstand greater than or equal to about 40 microns of thermal expansion or contraction of the interconnect. Suitable conductive adhesives may include, for example, Hitachi CP-450 and solder.

Thus, the conductive bond between overlapping adjacent solar cells within a super cell and the conductive bond between the super cell and the flexible electrical interconnect may utilize different conductive adhesives. For example, conductive bonds between super cells and flexible electrical interconnects may be formed from solder, while conductive bonds between overlapping adjacent solar cells may be formed from a non-solder conductive adhesive. In some variations, both conductive adhesives can be cured in a single processing step, eg, in a processing window of about 150°C to about 180°C.

The above discussion has focused on assembling multiple solar cells (which may be cut out solar cells) in a stacked fashion on a common substrate. This leads to the formation of modules.

However, in order to collect sufficient solar energy to be used, it is often necessary to install multiple such modules assembled together themselves. According to various embodiments, multiple solar cell modules may also be assembled in a stacked manner, thereby increasing the area efficiency of the array.

In certain embodiments, a module may feature a top conductive ribbon in a direction facing the solar energy and a bottom conductive ribbon in a direction facing away from the solar energy.

The bottom solder ribbon is buried under the battery. Therefore, the bottom ribbon does not block incident light and does not adversely affect the area efficiency of the module. In contrast, the top ribbon is exposed and so may block incoming light, thus adversely affecting efficiency.

According to various embodiments, the modules themselves may overlap such that the top ribbon is covered by adjacent modules. This stacked module configuration can also provide additional area on the module for mounting other components without adversely affecting the final exposed area of the module array. Examples of modular elements that may be disposed in the overlapping area may include, but are not limited to, junction boxes and/or bus ribbons.

In certain embodiments, the junction boxes of respective adjacent stackable modules are in a mating arrangement to enable electrical connection therebetween. This eliminates wiring, thus simplifying the construction of the array of stacked modules.

In certain embodiments, the junction box may be reinforced with and/or combined with additional structural standoffs. This configuration results in an integrated sloped modular roof mount solution, where the size of the junction box determines the slope. This embodiment may be particularly useful if an array of stacked modules is to be mounted on a roof deck.

The use of stacked super cells in a module layout provides a unique opportunity to install module-level power management devices such as DC/AC microinverters, DC/DC module power optimizers, voltage smart switches, and related devices. A feature of the module-level power management system is power optimization. Super cells as described and used herein can produce higher voltages than conventional panels. In addition, the super battery module layout can also partition the modules. Increased voltage, increased partitioning, these are all potential benefits of optimizing power.

The present specification discloses high-efficiency solar modules (ie, solar panels) comprising narrow rectangular silicon solar cells arranged in a shingled fashion and electrically connected in series to form super cells, wherein the super cells are in the solar module are arranged in physically parallel rows. For example, the length of the super cells may span substantially the full length or width of the solar module, or two or more super cells may be arranged end-to-end in a row. Each super cell may include any number of solar cells, in some variations, at least nineteen solar cells, and, for example, in some variations, greater than or equal to 100 silicon solar cells. Each solar module can be of conventional size and shape and also include hundreds of silicon solar cells, allowing the super cells in a single solar module to be electrically interconnected to provide, for example, about 90 volts (V) to about 450 V or more of direct current (DC) voltage.

As described further below, this high DC voltage helps by eliminating or reducing the need for DC-DC boost (DC voltage boost) prior to conversion to AC by the inverter A microinverter on the module) converts from direct current to alternating current (AC). Also as described further below, the high DC voltage also facilitates the use of arrangements where DC/AC conversion is performed by a central inverter that receives solar energy from two or more high voltage shingles electrically connected in parallel with each other High voltage DC output for battery modules.

Turning now to the drawings for a more detailed understanding of the solar modules described in this specification, FIG. 1 shows a cross-sectional view of a string of solar cells 10 arranged in a shingled fashion, connected in series, with ends of adjacent solar cells The parts are overlapped and electrically connected to form the super cell 100 . Each solar cell 10 includes a semiconductor diode structure and electrical contacts connected to the semiconductor diode structure through which a current generated in the solar cell 10 when illuminated by light can be supplied to an external load.

In the example described in this specification, each solar cell 10 is a rectangular crystalline silicon solar cell having a front surface (sun side) metallization pattern and a back surface (cathode side) metallization pattern, the front surface metallization pattern being disposed at On the semiconductor layer of n-type conductivity, back surface metallization patterns are provided on the semiconductor layer of p-type conductivity, the metallization patterns providing electrical contact to opposite sides of the n-p junction. However, other material systems, diode structures, physical dimensions or electrical contact arrangements may be used if appropriate. For example, the front (sun side) surface metallization pattern can be provided on the p-type conductivity semiconductor layer, and the back (cathode side) surface metallization pattern can be provided on the n-type conductivity semiconductor layer.

Referring again to FIG. 1, in super cell 100, adjacent solar cells 10 are conductively bonded to each other in regions where they overlap by means of a conductive bonding material that electrically patterns the front surface metallization of one solar cell. Connect to the back surface metallization pattern of adjacent solar cells. Suitable conductive bonding materials may include, for example, conductive adhesives, conductive adhesive films, and conductive adhesive tapes, as well as conventional solders.

2 illustrates an exemplary rectangular solar module 200 including six rectangular super cells 100, each rectangular super cell having a length approximately equal to the length of the long sides of the solar module. The super cells are arranged in six parallel rows with their long sides oriented parallel to the long sides of the modules. A similarly constructed solar module may also include such side-length super cells, but with more or fewer rows than shown in this example. In other variations, the respective lengths of the super cells may be approximately equal to the length of the short sides of the rectangular solar module, and the super cells are arranged in parallel rows with their long sides oriented parallel to the short sides of the module. In yet other arrangements, each row may include two or more super cells electrically interconnected in series. The modules may have short sides, eg, about 1 meter in length, and long sides, eg, about 1.5 to about 2.0 meters in length. Any other suitable shape (eg, square) and size may also be selected for the solar module.

In some variations, the conductive bonding between the overlapping solar cells provides mechanical plasticity for the super cells to reconcile the super cells with The thermal expansion mismatch between the glass front sheets of the solar module prevents the thermal expansion mismatch from damaging the solar module.

Each super cell in the example shown includes 72 rectangular solar cells, each rectangular solar cell having a width equal to or approximately equal to 1/6 the width of a conventional sized 156mm square or pseudo-square silicon wafer and a length equal to or approximately equal to The width of a square or quasi-square wafer. Furthermore, in general, the length of rectangular silicon solar cells used in the solar modules described herein may be, for example, equal to or approximately equal to the width of a conventionally sized square or pseudo-square silicon wafer, and the width of, for example, equal to or approximately equal to a conventionally sized square or pseudo-square silicon wafer. 1/M of the width of a square or pseudo-square wafer, where M is any integer < 20. M can be, for example, 3, 4, 5, 6 or 12. M can also be greater than 20. Super cells may include any suitable number of such rectangular solar cells.

The super cells in solar module 200 may be interconnected in series by electrical interconnects (optionally, flexible electrical interconnects) or by module-level power electronics as described below, in order to provide higher than conventional voltages through conventionally sized solar modules. Higher voltages because the stacking method just described allows each module to incorporate significantly more cells than conventional. For example, a regular size solar module including super cells consisting of 1/8 cut silicon solar cells may include over 600 solar cells/module. In contrast, conventional sized solar modules comprising conventional sized and interconnected silicon solar cells typically comprise about 60 solar cells/module. In conventional silicon solar modules, square or pseudo-square solar cells are typically interconnected by brazed ribbons and spaced apart from each other to accommodate the interconnects. In this case, dicing a regular sized square or pseudo-square wafer into narrow rectangles would reduce the total amount of active solar cell area in the module and thus reduce module power because of the need for additional inter-cell interconnects. In contrast, in the solar modules disclosed herein, the shingled arrangement hides the electrical interconnects between cells below the active solar cell area. Thus, the solar modules described herein can provide high output voltages without reducing the module output power because there is a small correlation between module power and the number of solar cells in the solar module (and required inter-cell interconnects) A compromise or no compromise exists.

When all solar cells are connected in series, for example, a shingled solar cell module as described herein can provide a DC voltage in the range of about 90 volts to about 450 volts or more. As mentioned above, this high DC voltage may be advantageous.

For example, micro-inverters placed on or near solar modules can be used for module-level power optimization and DC-to-AC conversion. Referring now to Figures 49A-49B, typically a micro-inverter 4310 receives a 25V to 40V DC input from a single solar module 4300 and outputs a 230V AC output to match the connected grid. A microinverter usually consists of two main components: DC/DC boost and DC/AC inversion. DC/DC boost is used to increase the DC bus voltage required for DC/AC conversion, and is typically very expensive and lossy (2% efficiency loss). Since the solar modules described herein provide high voltage outputs, the need for DC/DC boost can be reduced or eliminated (FIG. 49B). This can reduce costs and increase the efficiency and reliability of the solar module 200 .

In conventional arrangements using central ("string") inverters rather than micro-inverters, conventional low DC output solar modules are electrically connected in series with each other and to the string inverter. The voltage produced by a string of solar modules is equal to the sum of the individual module voltages because the modules are connected in series. The allowable voltage range determines the maximum and minimum number of modules in the string. The maximum number of modules is determined by module voltage and regulatory voltage limits: for example, N _max ×V _oc < 600V (US residential standard) or N _max ×V _oc <1,000V (commercial standard). The minimum number of modules in a string is determined by the module voltage and the minimum operating voltage required by the string inverter: N _min ×V _mp >V _Invertermin . The minimum operating voltage (V _Invertermin ) required for string inverters (eg, Fronius, Powerone, or SMA inverters) is typically between about 180V and about 250V. Typically, the optimum operating voltage for a string inverter is about 400V.

A single high DC voltage shingled solar cell module as described herein can generate voltages greater than the minimum operating voltage required by the string inverter, and optionally at or near optimal operation of the string inverter Voltage. Accordingly, the high DC voltage shingled solar cell modules described herein can be electrically connected to a string inverter in parallel with each other. This avoids the string length requirement of a string of modules connected in series, which can complicate system design and installation. Furthermore, in a series connected string of solar modules, the lowest current module predominates and the system does not operate efficiently if different modules in the string receive different illumination, as can happen with modules on different roof slopes or due to tree shade . The parallel high voltage module configuration described herein also avoids these problems because the current through each solar module is independent of the current through the other solar modules. Furthermore, this arrangement does not require module-level power electronics and thus can improve the reliability of the solar module, which is especially important in the variant where the solar module is deployed on a roof.

Referring now to Figures 50A-50B, as described above, the super cells may extend approximately the entire length or width of the solar module. To enable electrical connections along the length of the super cells, hidden (viewed from the front) electrical taps can be integrated into the solar module construction. This can be achieved by attaching electrical leads to the back surface metallization of the solar cell at the ends or in the middle of the super cell. Such hidden taps allow electrical segmentation of super cells and enable interconnection of super cells or segments of super cells to bypass diodes, module-level power electronics (eg, microinverters, power optimizers, voltage intelligent switches and related devices) or other components. The use of hidden taps is further described in US Provisional Application No. 62/081,200, US Provisional Application No. 62/133,205, and US Application No. 14/674,983, each of which is incorporated by reference in its entirety. into this article.

In the examples of FIGS. 50A (exemplary physical layout) and 50B (exemplary circuit diagrams), the illustrated solar modules 200 each include six super cells 100 that are electrically connected in series to provide a high DC voltage. Each super cell is electrically segmented by hidden taps 4400 into groups of solar cells, where each group of solar cells is electrically connected in parallel with a different bypass diode 4410. In these examples, the bypass diodes are disposed within the solar module laminate, ie, the solar cells are in the encapsulant between the front surface transparent sheet and the back sheet. Alternatively, bypass diodes may be provided in a junction box located on the rear surface or edge of the solar module and interconnected by wire routing to hidden taps.

In the example of FIGS. 51A (physical layout) and 51B (corresponding circuit diagrams), the illustrated solar module 200 also includes six super cells 100 that are electrically connected in series to provide a high DC voltage. In this example, the solar module is electrically segmented into three pairs of super cells connected in series, where each pair of super cells is electrically connected in parallel with a different bypass diode. In this example, the bypass diodes are provided within the junction box 4500 located on the back surface of the solar module. The bypass diode may alternatively be located in the solar module laminate or in an edge mounted junction box.

In the example of Figures 50A-51B, in normal operation of the solar module, each solar cell is forward biased and therefore all bypass diodes are reverse biased and non-conducting. However, if one or more solar cells in a group are reverse biased to a high enough voltage, the bypass diode corresponding to that group will turn on and the current through the module will bypass the reverse biased solar cells. This will prevent dangerous hot spots from forming at shaded or failed solar cells.

Alternatively, the bypass diode function can be accomplished within module-level power electronics (eg, microinverters) disposed on or near the solar module. (Module level power electronics and their use may also be referred to herein as module level power management devices or system and module level power management). Such module-level power electronics, optionally integrated with the solar module, can optimize the power from the super cell stack, from each super cell, or from each individual super cell segment of an electrically segmented super cell (eg, by Operate the super battery pack, super cell or super cell segment) at the optimal power point, enabling discrete power optimization within the module. Module-level power electronics can eliminate the need for any bypass diodes within the module, as the power electronics can determine when to bypass the entire module, a specific super battery pack, one or more specific individual super cells, and/or a or multiple specific super cell segments.

For example, this can be done by incorporating voltage intelligence at the module level. By monitoring the voltage output of a solar cell circuit (eg, one or more super cells or super cell segments) in a solar module, a "smart switch" power management device can determine whether the circuit includes any solar cells that are reverse biased. If the presence of a reverse biased solar cell is detected, the power management device may use, for example, a relay switch or other component to disconnect the corresponding circuit from the electrical system. For example, if the voltage of a monitored solar cell circuit falls below a predetermined threshold, the power management device will cut the circuit (open circuit). The predetermined threshold may be, for example, a certain percentage or magnitude (eg, 20% or 10V) compared to the normal operation of the circuit. Such voltage intelligence can be incorporated into existing module-level power electronics products (eg, from Enphase Energy Corporation, Solaredge Technologies Corporation, Tigo Energy Corporation) or implemented through custom circuit designs.

Figures 52A (physical layout) and 52B (corresponding circuit diagrams) illustrate one exemplary architecture for module-level power management for high voltage solar modules including shingled super cells. In this example, a rectangular solar module 200 includes six rectangular shingled super cells 100 arranged in six rows extending the length of the long sides of the solar module. Six super cells are electrically connected in series to provide high DC voltage. Module-level power electronics 4600 may perform voltage sensing, power management, and/or DC/AC conversion for the entire module.

Figures 53A (physical layout) and 53B (corresponding circuit diagrams) illustrate another exemplary architecture for module-level power management for high voltage solar modules including shingled super cells. In this example, a rectangular solar module 200 includes six rectangular shingled super cells 100 arranged in six rows extending the length of the long sides of the solar module. The six super cells are electrically assembled into three pairs of super cells connected in series. Each pair of super cells is individually connected to module-level power electronics 4600 so that voltage sensing and power optimization can be performed on each pair of super cells, connecting two or more of them in series to provide high DC voltages, and/or Or perform DC/AC conversion.

Figures 54A (physical layout) and 54B (corresponding circuit diagrams) illustrate another exemplary architecture for module-level power management for high voltage solar modules including shingled super cells. In this example, a rectangular solar module 200 includes six rectangular shingled super cells 100 arranged in six rows extending the length of the long sides of the solar module. Each super cell is individually connected to module level power electronics 4600 so that voltage sensing and power optimization can be performed on each super cell, connecting two or more of them in series to provide high DC voltages, and/or Or perform DC/AC conversion.

Figures 55A (physical layout) and 55B (corresponding schematic circuit diagrams) illustrate another exemplary architecture for module-level power management for high voltage solar modules including shingled super cells. In this example, a rectangular solar module 200 includes six rectangular shingled super cells 100 arranged in six rows extending the length of the long sides of the solar module. Each super cell is electrically segmented by hidden taps 4400 into two or more groups of solar cells. Each resulting solar array is individually connected to module-level power electronics 4600 so that voltage sensing and power optimization can be performed on each solar array, multiple arrays can be connected in series to provide high DC voltages, and/or perform DC/AC conversion.

In some variations, two or more high voltage DC shingled solar cell modules as described herein are electrically connected in series to provide a high voltage DC output that is converted to AC by an inverter. For example, the inverter may be a micro-inverter integrated with one of the solar modules. In this case, the microinverter may optionally be a component of module-level power management electronics that also perform additional sensing and connection functions as described above. Alternatively, the inverter may be a central "string" inverter, as discussed further below.

As shown in Figure 56, when super cells are strung in series in a solar module, adjacent rows of super cells can be slightly offset in a staggered fashion along their long axes. This staggering allows adjacent ends of a row of super cells to be electrically connected in series by interconnects 4700 bonded to the top of one super cell and bonded to the bottom of another super cell, while saving module area (space/length) and simplifying made. For example, adjacent rows of super cells can be offset by about 5 mm.

The differential thermal expansion between the electrical interconnect 4700 and the silicon solar cells and the resulting stress on the solar cells and interconnects can lead to cracks and other failure modes, potentially reducing the performance of the solar module. Accordingly, there is a need for the interconnects to be flexible and configured to accommodate such differential expansion without creating significant stress. For example, by forming from high ductility materials (eg, soft copper, thin copper sheets), by forming from low thermal expansion coefficient materials (eg, Kovar, Invar, or other low thermal expansion coefficient iron-nickel alloys) , or by in-plane geometric expansion features (such as slits, grooves, holes, or trusses) with thermal expansion coefficients that roughly match silicon, incorporating the different thermal expansions between the harmonic interconnect and the silicon solar cell, and/or using Formed from materials that reconcile such different thermal expansion out-of-plane geometric features, such as kinks, asperities, or dimples, the interconnect can provide stress and thermal expansion relief. The conductive portion of the interconnect may have a thickness of, for example, less than about 100 microns, less than about 50 microns, less than about 30 microns, or less than about 25 microns, to increase the flexibility of the interconnect. (The low currents typically found in these solar modules enable the use of thin flexible conductive ribbons without excessive power losses due to the resistance of the thin interconnects).

In some variations, the conductive bond between the super cell and the flexible electrical interconnect forces the flexible electrical interconnect to reconcile between the super cell and the flexible electrical interconnect in a temperature range of about -40°C to about 180°C the thermal expansion mismatch, so that the thermal expansion mismatch will not damage the solar module.

Figure 7A (discussed above) shows several example interconnect configurations using in-plane stress relief geometric features, indicated by reference numerals 400A-400T, and Figures 7B-1 and 7B-2 (also discussed above) Exemplary interconnect configurations using out-of-plane stress relief geometry are shown, indicated by reference numerals 400U and 3705 . Any one or any combination of these interconnect configurations employing stress relief features may be suitable for electrically interconnecting super cells in series to provide high DC voltages, as described herein.

The discussion with respect to FIGS. 51A-55B has focused on module-level power management, where possible DC/AC conversion of high DC module voltages is performed by module-level power electronics to provide AC output from the module. As described above, the DC/AC conversion of high DC voltages from shingled solar cell modules as described herein may alternatively be performed by a central string inverter. For example, FIG. 57A schematically illustrates a photovoltaic system 4800 including a plurality of high DC voltage shingled solar cell modules 200 via a high DC voltage negative bus 4820 and a high DC voltage positive bus 4810 They are electrically connected to string inverters 4815 in parallel with each other. Typically, each solar module 200 includes a plurality of shingled super cells that are electrically connected in series with electrical interconnects to provide high DC voltages, as described above. For example, solar module 200 may optionally include bypass diodes arranged as described above. Figure 57B shows an exemplary deployment of a photovoltaic system 4800 on a rooftop.

In some variations of photovoltaic system 4800, two or more short series connected strings of high DC voltage shingled solar cell modules may be electrically connected in parallel with a string inverter. Referring again to Figure 57A, for example, each solar module 200 may be replaced with a series connected string of two or more high DC voltage shingled solar cell modules 200. This may be done, for example, to maximize the voltage supplied to the inverter while complying with regulatory standards.

Conventional solar modules typically produce about 8 amps of Isc (short circuit current), about 50 Voc (open circuit voltage), and about 35 Vmp (maximum power point voltage). As discussed above, a high DC voltage shingled solar cell module as described herein comprising M times the conventional number of solar cells produces approximately M times the voltage and 1/M the current of the conventional solar module. , where the area of each solar cell is about 1/M that of a conventional solar cell. As noted above, M may be any suitable integer, typically < 20, but may be greater than 20. M can be, for example, 3, 4, 5, 6 or 12.

If M=6, the Voc for a high DC voltage shingled solar cell module may be, for example, about 300V. Connecting two of these modules in series would provide approximately 600V DC to the bus, complying with the maximum setting for US residential standards. If M=4, the Voc for a high DC voltage shingled solar cell module may be, for example, about 200V. Connecting three of these modules in series provides about 600V DC to the bus. If M=12, the Voc for a high DC voltage shingled solar cell module can be, for example, about 600V. The system can also be configured to have bus voltages less than 600V. In such variants, the high DC voltage shingled solar cell modules may be connected, for example, in a combiner box in pairs or groups of three or in any other suitable combination in order to provide the inverter with the optimum voltage.

The problem with the parallel configuration of the high DC voltage shingled solar modules described above is that if one solar module has a short circuit, the other solar modules may interrupt power on the shorted module (ie, drive current through the shorted module and dissipate it). dissipate power in the short-circuit module) and create a hazard. This problem can be avoided, for example, by using blocking diodes arranged to prevent other modules from driving current through the shorted module, using current limiting fuses, or a combination of current limiting fuses and blocking diodes. 57B schematically illustrates the use of two current limiting fuses 4830 on the positive and negative terminals of the high DC voltage shingled solar cell module 200.

The protective arrangement of blocking diodes and/or fuses may depend on whether the inverter includes a transformer. Systems using inverters that include transformers typically have the negative conductor grounded. Systems using transformerless inverters typically do not ground the negative lead. For transformerless inverters, it may be preferable to have a current limiting fuse in line with the positive terminal of the solar module and another current limiting fuse in line with the negative terminal.

A blocking diode and/or a current limiting fuse may be placed with each module in a junction box or in a module stack, for example. Suitable junction boxes, blocking diodes (eg, inline blocking diodes), and fuses (eg, inline fuses) may include those available from Shoals Technology Group.

Figure 58A shows an exemplary high voltage DC shingled solar cell module including a junction box 4840 with a blocking diode 4850 in-line with the positive terminal of the solar module. The junction box does not include current limiting fuses. This configuration may preferably be used in conjunction with one or more current limiting fuses that are in line with the positive and/or negative terminals of the solar module elsewhere (eg, in the combiner box) (eg, See Figure 58D below). 58B shows an exemplary high voltage DC shingled solar cell module including a junction box 4840 with a blocking diode in line with the positive terminal of the solar module and a current limiting fuse 4830 in line with the negative terminal. 58C shows an exemplary high voltage DC shingled solar cell module including a junction box 4840 with a current limiting fuse 4830 in line with the positive terminal of the solar module and another current limiting fuse 4830 in line with the negative terminal . 58D illustrates an exemplary high voltage DC shingled solar cell module including a junction box 4840 configured as shown in FIG. 58A and a fuse located outside the junction box, the fuse being connected to the positive terminal of the solar module and the The negative terminal is in a straight line.

Referring now to FIGS. 59A-59B , as an alternative to the above configuration, the blocking diodes and/or current limiting fuses for all high DC voltage shingled solar cell modules may be placed together in combiner box 4860 . In these variations, one or more individual conductors run individually from each module to the combiner box. As shown in Figure 59A, in one option, a single wire of one polarity (eg, negative as shown) is shared among all modules. In another option (FIG. 59B), the two polarities have separate wires for each module. Although FIGS. 59A-59B only show fuses located in combiner box 4860, any suitable combination of fuses and/or blocking diodes may be located in the combiner box. Additionally, for example, electronics that perform other functions such as monitoring, maximum power point tracking, and/or disconnection of individual modules or groups of modules may be implemented in the combiner box.

Reverse bias operation of the solar module can occur when one or more solar cells in the solar module are shaded or otherwise generate low current, and the solar module is driving more current through the solar module than the low current solar cells can handle. Too low current solar cell voltage current point to operate. Reverse-biased solar cells can heat up and create hazardous conditions. For example, as shown in Figure 58A, the parallel arrangement of high DC voltage shingled solar cell modules can allow the modules to be protected from reverse biased operation by setting the inverter with an appropriate operating voltage. This is illustrated, for example, by Figures 60A-60B.

60A shows a current versus voltage graph 4870 and a power versus current graph 4880 for a parallel connected string of about ten high DC voltage shingled solar modules. These curves are calculated for a model where none of the solar modules include reverse-biased solar cells. Since the solar modules are electrically connected in parallel, they all have the same operating voltage and their currents add up. Typically, the inverter will vary the load on the circuit in order to explore the power-voltage curve, identify the maximum point on the curve, and then operate the module circuit at that point to maximize output power.

In contrast, FIG. 60B shows a current versus voltage plot 4890 and power versus voltage for the model system of FIG. 60A for the case where some of the solar modules in the circuit include one or more reverse biased solar cells Graph 4900. The reverse biased module is revealed in an exemplary current-voltage curve by forming a knee, transitioning from about 10 amp operation at voltages as low as about 210 volts to about 16 amp operation at voltages below about 200 volts. At voltages below about 210 volts, the shaded module includes reverse biased solar cells. The reverse biased module is also revealed in the power-voltage curve by the presence of two maxima: an absolute maximum at about 200 volts and a local maximum at about 240 volts. The inverter may be configured to recognize such signatures of reverse-biased solar modules, and to operate the solar modules without absolute or local maximum power point voltages of the modules being reverse-biased. In the example of Figure 60B, the inverter may operate the modules at the local maximum power point to ensure that no modules are reverse biased. Additionally or alternatively, a minimum operating voltage may be selected for the inverter below which any module will be less likely to be reverse biased. The minimum operating voltage may be adjusted based on other parameters such as ambient temperature, operating current and calculated or measured solar module temperature, and other information received from external sources such as irradiance.

In some embodiments, the high DC voltage solar modules themselves may overlap, with adjacent solar modules arranged in a partially overlapping manner and optionally electrically interconnected in their overlapping regions. Such a shingled configuration can optionally be used in parallel electrically connected high voltage solar modules that provide high DC voltage for string inverters, or in high voltage solar modules each comprising a micro-inverter, the micro-inverters. The inverter converts the high DC voltage of the solar modules into the AC module output. For example, a pair of high voltage solar modules can be stacked as just described and electrically connected in series to provide the desired DC voltage.

Conventional string inverters are often required to have a fairly wide range of potential input voltages (or "dynamic range") because 1) they must be compatible with different string lengths of series-connected modules, and 2) some modules in the string can be fully or partial shading, and 3) changes in ambient temperature and radiation will change the module voltage. In a system employing a parallel architecture as described herein, the length of the string of solar modules connected in series does not affect the voltage. Furthermore, for situations where some modules are partially occluded and some modules are not, it may be decided to operate the system at the voltage of the unoccluded modules (eg, as described above). Therefore, the input voltage range of an inverter in a parallel architecture system may only need to accommodate the "dynamic range" of the third factor (ie, temperature and radiation variations). Since this is relatively small, for example, inverters require about 30% of the normal dynamic range, inverters used in parallel architecture systems as described herein may have a narrower MPPT (maximum power point tracking) range, such as between between about 250 volts at standard conditions and about 175 volts at high temperature and low radiation, or, for example, between about 450 volts at standard conditions and about 350 volts at high temperature and low radiation (in which case, The 450 volt MPPT operation may correspond to a V _oc at 600 volts in the lowest temperature operation). Also, as mentioned above, the inverter can receive enough DC voltage to convert directly to AC without a boost stage. Thus, string inverters used in parallel architecture systems as described herein may be simpler, less expensive, and operate with higher efficiency than string inverters used in conventional systems.

For microinverters and string inverters used in high voltage DC shingled solar cell modules as described herein, in order to eliminate the need for the inverter's DC boost, it is preferable to connect the solar modules (or short series of solar modules) connected string) is configured to provide a peak-to-peak operating (eg, maximum power point Vmp) DC voltage above AC. For example, for 120V AC, the peak-to-peak value is sqrt(2)*120V=170V. Thus, for example, a solar module might be configured to provide a minimum Vmp of about 175V. The Vmp under standard conditions can then be about 212V (assuming a negative voltage temperature coefficient of 0.35% and a maximum operating temperature of 75°C), and the Vmp at the lowest temperature operating condition (eg, -15°C) will be about 242V, so Voc Below about 300V (depending on module fill factor). All of these numbers are doubled for split-phase 120V AC (or 240V AC), which is more convenient since 600V DC is the maximum allowed in the US in many residential applications. For commercial applications, higher voltages are required and permitted, and these numbers can be increased further.

High voltage shingled solar cell modules as described herein may be configured to operate at >600V _OC or >1000V _OC , in which case the module may include integrated power electronics that prevent external voltages supplied by the module from exceeding specification requirements device. This arrangement can make operating _Vmp sufficient for split phase 120V (240V, requires about 350V), while over 600V there is no problem with V _OC at low temperatures.

When the building is disconnected from the grid, eg, by firefighters, the solar modules that provide power to the building (eg, on the roof of the building) can still generate electricity if the sun is shining. This creates the following problem: After the building is disconnected from the grid, such solar modules can "live" the roof with dangerous voltages. To address this problem, the high voltage DC shingled solar cell modules described herein may optionally include a disconnect, eg, in or adjacent to the module junction box. The disconnection may be, for example, a physical disconnection or a solid state disconnection. The disconnect may be configured, for example, to be "normally closed" so that when certain signals are lost (eg, from the inverter), it disconnects the high voltage output of the solar modules from the rooftop circuit. Communication with the disconnection can be accomplished, for example, by high-voltage cables, by separate wires, or wirelessly.

A significant advantage of shingles for high voltage solar modules is the thermal diffusion between solar cells in shingled super cells. Applicants have discovered that heat can be readily transported along silicon super cells through relatively thin electrically and thermally conductive junctions between adjacent overlapping silicon solar cells. The thickness of the conductive bonds between adjacent overlapping solar cells formed from the conductive bonding material can be, for example, less than or equal to about 200 microns, or less than or equal to about 150 microns, or less than or about 125 microns, or less than or equal to about 100 microns, or less than or equal to about 90 microns, or less than or equal to about 80 microns, or less than or equal to about 70 microns, or less than or equal to about 60 microns, or less than or equal to About 50 microns, or less than or equal to about 25 microns. This thinner bond reduces resistive losses at the interconnects between cells and also promotes heat flow along the super cell from any hot spots in the super cell that may form during operation. The thermal conductivity of the junction between solar cells may be, for example, greater than or equal to about 1.5 W/(m-K). In addition, the rectangular aspect ratio of solar cells generally used herein provides an extended area of thermal contact between adjacent solar cells.

In contrast, in conventional solar modules employing ribbon interconnects between adjacent solar cells, the heat generated in one solar cell cannot readily diffuse through the ribbon interconnects to other solar cells in the module. This makes conventional solar modules more prone to hot spots than the solar modules described herein.

Additionally, the current through the solar cells in the solar modules described herein is typically less than through a string of conventional solar cells because the super cells described herein are typically formed from shingled rectangular solar cells, each rectangular solar cell Has an active area smaller (eg, 1/6) than a conventional solar cell.

Thus, in the solar modules disclosed herein, less heat is dissipated in reverse-biased solar cells at breakdown voltage, and the heat may readily diffuse through the super cells and solar modules without forming dangerous hot spots.

Several additional and optional features can make high voltage solar modules employing super cells as described herein more resistant to heat dissipated in reverse biased solar cells. For example, super cells can be encapsulated in thermoplastic olefin (TPO) polymers. TPO encapsulant is more photothermally stable than standard ethylene vinyl acetate (EVA) encapsulant. When EVA is heated or exposed to UV light, it turns brown, causing hot spots in current-limiting batteries. In addition, the solar module can have a double glass structure in which the encapsulated super cells are sandwiched between a glass front sheet and a glass back sheet. Such double-glass structures allow solar modules to operate safely at higher temperatures than conventional polymer backsheets can withstand. Additionally, a junction box, if present, may be mounted on one or more edges of the solar module, rather than at the back of the solar module, where the junction box adds additional insulation to the solar cells in the module above.

Accordingly, Applicants have recognized that high voltage solar modules formed from super cells as described herein can employ far fewer bypass diodes than conventional solar modules because the heat flow through the super cells can allow the module to operate at one or more Each solar cell is reverse-biased without significant risk. For example, in some variations, a high voltage solar module as described herein uses less than one bypass diode per 25 solar cells, less than one bypass diode per 30 solar cells, less than one bypass diode per 50 solar cells Less than one bypass diode, less than one bypass diode per 75 solar cells, less than one bypass diode per 100 solar cells, or only a single bypass diode, or no bypass diode.

Referring now to Figures 61A-61C, exemplary high voltage solar modules using bypass diodes are provided. When a portion of a solar module is shaded, damage to the module can be prevented or reduced by using bypass diodes. For the exemplary solar module 4700 shown in Figure 61A, 10 super cells 100 are connected in series. As shown, 10 super cells are arranged in parallel rows. Each super cell contains 40 solar cells 10 connected in series, where each of the 40 solar cells is formed from 1/6 of a square or pseudo-square, as described herein. In normal unshaded operation, current flows in from junction box 4716 , through each of the super cells 100 connected in series by wires 4715 , and then flows out through junction box 4717 . Optionally, a single junction box may be used instead of separate junction boxes 4716 and 4717, allowing current to return to one junction box. The example shown in Figure 61A shows an implementation of approximately one bypass diode per super cell. As shown, a single bypass diode is electrically connected between a pair of adjacent super cells at a point approximately along the middle of the super cell (eg, a single bypass diode 4901A is electrically connected at the 22nd of the first super cell Between one solar cell and an adjacent one of the second super cells, a second bypass diode 4901B is electrically connected between the second super cell and the third super cell, and so on). The first and last strings of cells have only about half the number of solar cells in the super cell for each bypass diode. For the example shown in Figure 61A, there are only 22 cells per bypass diode in the first and last strings of cells. The total number of bypass diodes (11) used for the variant of the high voltage solar module shown in Figure 61A is equal to the number of super cells plus 1 additional bypass diode.

For example, each bypass diode can be incorporated into the flex circuit. Referring now to FIG. 61B, an expanded view of the bypass diode connection area of two adjacent super cells is shown. The view of Figure 61B originates from the non-sun facing side. As shown, two solar cells 10 on adjacent super cells are electrically connected using a flex circuit 4718 including bypass diodes 4720. The flex circuit 4718 and bypass diode 4720 are electrically connected to the solar cell 10 using contact pads 4719 located on the rear surface of the solar cell. (See also further discussion below on using hidden contact pads to provide hidden taps to bypass diodes). Additional bypass diode electrical connection schemes can be used to reduce the number of solar cells per bypass diode. An example is shown in Figure 61C. As shown, a bypass diode is electrically connected between each pair of adjacent super cells approximately along the middle of the super cells. Bypass diode 4901A is electrically connected between adjacent solar cells on the first and second super cells, and bypass diode 4901B is electrically connected between adjacent solar cells on the second and third super cells, Bypass diode 4901C is electrically connected between adjacent solar cells on the third and fourth super cells, and so on. A second set of bypass diodes can be included to reduce the number of solar cells that would be bypassed in the event of partial shading. For example, bypass diode 4902A is electrically connected between the first super cell and the second super cell at the midpoint between bypass diodes 4901A and 4901B, and bypass diode 4902B is electrically connected at the midpoint between bypass diodes 4901B and 4901C is electrically connected between the second super cell and the third super cell, and so on, thereby reducing the number of cells per bypass diode. Optionally, a further set of bypass diodes may be electrically connected to further reduce the number of solar cells to be bypassed in the event of partial shading. Bypass diode 4903A is electrically connected between the first and second super cells at an intermediate point between bypass diodes 4902A and 4901B, and bypass diode 4903B is electrically connected at an intermediate point between bypass diodes 4902B and 4901C. Connected between the second super cell and the third super cell, further reducing the number of cells per bypass diode. This configuration creates a nested configuration of bypass diodes, allowing a small number of battery packs to be bypassed during partial shading. Additional diodes may be electrically connected in this manner until the desired number of solar cells per bypass diode is reached, eg, about 8, about 6, about 4, or about 2 solar cells per bypass diode. In some modules, about 4 solar cells are required per bypass diode. If desired, one or more of the bypass diodes shown in Figure 61C can be incorporated into a hidden flexible interconnect, as shown in Figure 61B.

The present specification discloses a solar cell cutting tool and a solar cell cutting method that can be used, for example, to divide a regular sized square or pseudo-square solar cell into a plurality of narrow rectangular or substantially rectangular solar cells. These cutting tools and methods apply a vacuum between the bottom surface of the regular sized solar cell and the curved support surface to bend the regular sized solar cell against the curved support surface to cut the regular sized solar cell along the previously prepared scribe line Solar cell cutting. The advantage of these cutting tools and cutting methods is that they do not require physical contact with the upper surface of the solar cell. Accordingly, these cutting tools and methods can be used to cut solar cells that contain soft and/or uncured materials on their upper surfaces that can be damaged by physical contact. Furthermore, in some variations, these cutting tools and cutting methods may require only partial contact with the bottom surface of the solar cell. In such variations, these cutting tools and methods may be used to cut solar cells containing soft and/or uncured materials on portions of the bottom surface of the solar cells that do not contact the cutting tools.

For example, one solar cell fabrication method disclosed herein utilizing cutting tools and methods includes laser scribing one or more scribe lines on each of one or more conventional sized silicon solar cells, thereby defining a plurality of rectangular regions on the silicon solar cells; applying a conductive adhesive bonding material to portions of the top surface of the one or more silicon solar cells; and connecting the bottom surface of the one or more silicon solar cells with the A vacuum is applied between the curved support surfaces to bend the one or more silicon solar cells against the curved support surfaces, causing the one or more silicon solar cells to be cut along the scribed lines, thus resulting in a plurality of rectangular silicon solar cells , each rectangular silicon solar cell has a portion of the conductive adhesive bonding material disposed on its front surface adjacent to the long side. The conductive adhesive bonding material can be applied to conventional sized silicon solar cells before or after laser scribing of the solar cells.

The resulting plurality of rectangular silicon solar cells may be arranged in a straight line with the long sides of adjacent rectangular silicon solar cells overlapping in an overlapping manner and a portion of the conductive adhesive bonding material disposed therebetween. The conductive bonding material can then be cured to bond adjacent overlapping rectangular silicon solar cells to each other and to electrically connect them in series. This process will form a shingled "super cell," as described in the patent applications listed above under "Cross Reference to Related Applications."

Turning now to the drawings for a better understanding of the cutting tools and methods disclosed herein, FIG. 20A schematically illustrates a side view of an exemplary apparatus 1050 that may be used to cut a scribed solar cell. In this apparatus, a scribed regular size solar cell wafer 45 is carried by a moving perforated belt 1060 through a curved portion of a vacuum manifold 1070. As the solar cell wafer 45 passes through the curved portion of the vacuum manifold, the vacuum applied through the holes in the porous belt pulls the bottom surface of the solar cell wafer 45 towards the vacuum manifold, thereby bending the solar cells. The radius of curvature R of the curved portion of the vacuum manifold can be selected such that bending the solar cell wafer 45 in this manner cuts the solar cells along the scribed lines, forming rectangular solar cells 10 . Rectangular solar cells 10 may be used, for example, in super cells, as shown in FIGS. 1 and 2 . The solar cell wafer 45 can be cut in this way without contacting the top surface of the solar cell wafer 45 to which the conductive adhesive bonding material has been applied.

Cutting can be initiated preferentially at one end of the scribe line (ie, at one edge of the solar cell 45), for example by arranging the scribe lines at an angle θ to the vacuum manifold, such that for each scribe line , one end reaches the bend of the vacuum manifold before the other end. As shown in Figure 20B, for example, the solar cell can be oriented such that its scribe line is at an angle with the direction of travel of the porous belt and with the curved cut portion of the manifold oriented perpendicular to the direction of travel of the porous belt. As another example, Figure 20C shows the cell oriented such that its scribe line is perpendicular to the direction of travel of the porous belt, and the curved split portion of the manifold is oriented at an angle to the direction of travel of the porous belt.

For example, the cutting tool 1050 may use a single moving porous belt 1060 having a width perpendicular to the direction of travel that is approximately equal to the width of the solar cell wafer 45 . Alternatively, the tool 1050 may comprise two, three, four or more moving perforated belts 1060 which may be arranged side by side in parallel and optionally spaced apart from each other, for example. Cutting tool 1050 may use a single vacuum manifold, which may, for example, have a width perpendicular to the direction of travel of the solar cells that is approximately equal to the width of solar cell wafer 45 . Such a vacuum manifold can be used, for example, with a single full width moving perforated belt 1060, or with two or more such perforated belts arranged side by side in parallel and optionally spaced from each other, for example.

The cutting tool 1050 may include two or more curved vacuum manifolds arranged side by side in parallel and spaced apart from each other, wherein each vacuum manifold has the same curvature. Such an arrangement may be used, for example, with a single full width moving perforated belt 1060, or with two or more such perforated belts arranged side-by-side in parallel and optionally spaced from each other. For example, the tool may include a moving perforated belt 1060 for each vacuum manifold. In the latter arrangement, the vacuum manifold and its corresponding moving perforated belt may be arranged to contact the bottom of the solar cell wafer only along two narrow strips bounded by the width of the perforated belt. In this case, the solar cells may contain soft material in the region of the bottom surface of the solar cell wafer that does not contact the porous belt, so that there is no risk of damaging the soft material during cutting.

Any suitable configuration of moving perforated belts and vacuum manifolds may be used in cutting tool 1050 .

In some variations, the scribed solar cell wafer 45 includes uncured conductive adhesive bonding material and/or other soft materials on its top and/or bottom surfaces prior to dicing using dicing tool 1050 . The scribing of the solar cell wafer and the application of the soft material can be performed in either order.

Figure 62A schematically shows a side view of another exemplary cutting tool 5210 similar to cutting tool 1050 described above, and Figure 62B shows a top view. In use of the dicing tool 5210, a regular sized scribed solar cell wafer 45 is placed on a pair of parallel spaced perforated belts 5230 at a constant speed in a pair of corresponding parallel and spaced vacuums Manifold 5235 moves up. Vacuum manifold 5235 generally has the same curvature. As the wafer travels through the cutting region 5235C with the porous belt over the vacuum manifold, the wafer is bent around the cutting radius defined by the curved support surface of the vacuum manifold by the force of the vacuum pulling on the bottom of the wafer. As the wafer is bent around the cutting radius, the scribe lines become cracks that separate the wafer into individual rectangular solar cells. As described further below, the curvature of the vacuum manifold is arranged such that adjacent cut rectangular solar cells are not coplanar, and thus, the edges of adjacent cut rectangular solar cells do not touch each other after the cutting process occurs. The cut rectangular solar cells can be continuously unloaded from the porous belt using any suitable method, several examples of which are described below. Typically, the unloading method further divides adjacent cut solar cells from each other to prevent them from contacting each other when they are subsequently coplanar.

Still referring to Figures 62A-62B, each vacuum manifold may include, for example: a flat region 5235F, which provides no vacuum, low vacuum, or high vacuum; an optional curved transition region 5235T, which provides low or high vacuum, Or transition from low vacuum to high vacuum along its length; cutting region 5235C providing high vacuum; and post-cutting region 5235PC of smaller radius providing low vacuum. The perforated belt 5230 transports the wafer 45 from the flat region 5235F to the transition region 5235T and through the region, and then into the dicing region 5235C, where the wafer is diced, and the resulting diced solar cells 10 are then transported out of the dicing region 5235C and into In the post-cut area 5235PC.

Flat region 5235F typically operates at a low vacuum sufficient to confine wafer 45 to the porous belt and vacuum manifold. The vacuum here may be lower (or absent) to reduce friction and thus the required belt tension, since it is easier to constrain the wafer 45 to a flat surface than to a curved surface. The vacuum in the flat region 5235F may be, for example, about 1 to about 6 inches of mercury.

Transition region 5235T provides a transition curvature from flat region 5235F to cut region 5235C. The one or more radii of curvature in the transition region 5235T are greater than the radii of curvature in the cutting region 5235C. For example, the curvature in transition region 5235T may be part of an ellipse, but any suitable curvature may be used. Having wafer 45 approach dicing region 5235C with a smaller change in curvature through transition region 5235T, rather than transitioning directly from the flat orientation in region 5235F to the dicing radius in dicing region 5235C, helps ensure that the edge of wafer 45 does not lift and Breaking the vacuum, lifting and breaking the vacuum may make it difficult to constrain the wafer to the cutting radius in the cutting region 5235C. The vacuum in transition region 5235T may, for example, be the same as in cutting region 5235C, intermediate regions 5235F and 5235C, or transition between region 5235F and region 5235C along the length of region 5235T. The vacuum in transition region 5235T may be, for example, about 2 to about 8 inches of mercury.

Cut region 5235C may have a varying radius of curvature, or optionally a constant radius of curvature. This constant radius of curvature may be, for example, about 11.5 inches, about 12.5 inches, or between about 6 inches and about 18 inches. Any suitable range of curvature may be used and may be selected based in part on the thickness of wafer 45 and the depth and geometry of the scribed lines in wafer 45 . In general, the thinner the wafer, the shorter the radius of curvature required to bend the wafer enough to break it along the scribe line. The scribe lines may have a depth of, for example, about 60 microns to about 140 microns, although any other suitable shallower or deeper scribe line depths may be used. Generally, the shallower the scribe line, the shorter the radius of curvature required to bend the wafer enough to break it along the scribe line. The cross-sectional shape of the scribe line also affects the desired radius of curvature. A scribe with a wedge or wedge-shaped base can concentrate stress more effectively than a scribe with a rounded or rounded base. A scribe that concentrates stress more effectively allows the radius of curvature in the cut region to not need to be as small as a scribe that concentrates less effectively.

The vacuum in the cutting region 5235C for at least one of the two parallel vacuum manifolds is typically higher than in the other regions to ensure that the wafer is properly constrained to the cutting radius of curvature to maintain constant bending stress. Optionally, and as further explained below, one manifold may provide a higher vacuum than the other in this region for better control of rupture along the scribe line. The vacuum in the cutting region 5235C may be, for example, about 4 to about 15 inches of mercury, or about 4 to about 26 inches of mercury.

The post-cut area 5235PC generally has a smaller radius of curvature than the cut area 5235C. This facilitates transferring the cut solar cells from the porous belt 5230 without allowing the fractured surfaces of adjacent cut solar cells to rub or contact (which could lead to solar cell failure due to cracks or other failure modes). Specifically, the smaller radius of curvature provides greater spacing between the edges of adjacent cut solar cells on the porous ribbon. The vacuum in post-cut region 5235PC may be lower (eg, similar or the same as in flat region 5235F) because wafer 45 has already been cleaved into solar cells 10, so constraining the solar cells to the bend radius of the vacuum manifold is no longer required. For example, the edge of the cut solar cell 10 can be removed from the porous belt 5230. Furthermore, it may be desirable not to over strain the cut solar cell 10 .

The flat, transition, cut and post-cut areas of the vacuum manifold can be discrete sections of different curves with their ends matched. For example, the upper surface of each manifold may include a flat planar portion, a portion of an ellipse for a transition region, an arc for a cut region, and another arc or portion of an ellipse for a cut region . Alternatively, some or all of the curved portions of the upper surface of the manifold may comprise a continuous geometric function of progressively increasing curvature (decreasing diameter of an approximation circle). Such suitable functions may include, but are not limited to, helical functions (eg, clothoids) and natural logarithmic functions. A clothoid is a curve whose curvature increases linearly along the length of a curved path. For example, in some variations, the transition region, the cut region, and the post-cut region are all part of a single clothoid with one end matching the flat region. In some other variations, the transition region is a clothoid with one end matching the flat region and the other end matching the cut region, the cut region having a circular curvature. In the latter variant, the post-cut area may have, for example, a smaller radius circular curvature or a smaller radius clothoid curvature.

As described above and shown schematically in Figures 62B and 63A, in some variations, one manifold provides a high vacuum in the cutting region 5235C and another manifold provides a low vacuum in the cutting region 5235C . The high vacuum manifold fully constrains the ends of the wafers it supports to the curvature of the manifold, providing sufficient stress at the end of the scribe line covering the high vacuum manifold to initiate cracking along the scribe line. The low vacuum manifold does not fully constrain the end of the wafer it supports to the curvature of the manifold, so the bend radius of the wafer on that side is not small enough to create the stress required to initiate cracking in the scribe line. However, the stress is high enough to propagate the crack that started at the other end of the scribe line covering the high vacuum manifold. Without some vacuum on the "low vacuum" side to partially and fully constrain this end of the wafer to the curvature of the manifold, there may be a risk of crack initiation on the opposite "high vacuum" end of the wafer Doesn't scale across the wafer all the time. In variations as just described, one manifold may optionally provide a low vacuum along its entire length, from platform region 5235F through post-cut region 5235PC.

As just described, the asymmetric vacuum arrangement in the cutting region 5235C provides asymmetric stress along the scribe line that controls the formation of the core of the crack along the scribe line and the propagation of the crack along the scribe line. See, eg, FIG. 63B, if instead two vacuum manifolds provide equal (eg, high) vacuum in the dicing region 5235C, then cracks can be nucleated at both ends of the wafer, the cracks can propagate toward each other, and in the wafer meet somewhere in the central area. In this case, there is a risk that the cracks are not aligned with each other and, therefore, they are a potential point of mechanical failure where the cracks meet in the resulting cut cell.

As an alternative to, or in addition to, the asymmetric vacuum arrangement described above, cutting may preferentially begin at one end of the scribe line by arranging one end of the scribe line to reach the cutting area of the manifold before the other end. For example, this can be accomplished by orienting the solar cell wafer at an angle to the vacuum manifold, as described above in connection with Figure 20B. Alternatively, the vacuum manifolds may be arranged such that the cut area of one of the two manifolds extends further along the perforated belt path than the cut area of the other vacuum manifold. For example, two vacuum manifolds with the same curvature can be slightly offset in the direction of travel of the moving perforated belt so that the solar cell wafer reaches the cut area of one manifold before reaching the cut area of the other vacuum manifold.

Referring now to FIG. 64 , in the example shown, each vacuum manifold 5235 includes through holes 5240 arranged in line along the center of the vacuum channel 5245 . As shown in FIGS. 65A-65B , the vacuum channels 5245 are recessed into the upper surface of the manifold supporting the porous belt 5230. Each vacuum manifold also includes a center strut 5250 placed between the through holes 5240 and arranged in-line along the center of the vacuum channel 5245 . Center struts 5250 effectively divide vacuum channel 5245 into two parallel vacuum channels on either side of a row of center struts. The center post 5250 also provides support for the perforated belt 5230. Without the center post 5250, the perforated strip 5230 would be exposed to a longer unsupported area and may be drawn down towards the through holes 5240. This can result in three-dimensional bending of the wafer 45 (bending at and perpendicular to the cutting radius), potentially damaging the solar cells and interfering with the cutting process.

As shown in FIGS. 65A-65B and 66-67, in the example shown, the through hole 5240 communicates with the low vacuum chamber 5260L (flat region 5235F and transition region 5235T in FIG. 62A) and communicates with the high vacuum chamber 5260H ( Cut area 5235C in Figure 62A) communicates with another low vacuum chamber 5260L (post cut area 5235PC in Figure 62A). This arrangement provides a smooth transition between the low and high vacuum regions in the vacuum channel 5245. The through holes 5240 provide sufficient flow resistance so that if the area corresponding to the hole is fully open, the airflow will not be fully deflected to that hole and allow other areas to maintain a vacuum. The vacuum channels 5245 help to ensure that the holes 5255 of the vacuum porous belt will always have a vacuum and will not be in dead center when positioned between the through holes 5240.

Referring again to Figures 65A-65B and also to Figure 67, the perforated belt 5230 may include, for example, two rows of holes 5255, optionally arranged such that the wafer 45 or the diced solar energy is removed as the perforated belt advances along the manifold. The leading and trailing edges 527 of the cell 10 are kept under vacuum at all times. Specifically, the staggered arrangement of holes 5255 in the example shown ensures that the edge of the wafer 45 or diced solar cell 10 always overlaps at least one hole 5255 in each porous belt 5230. This helps prevent the edge of the wafer 45 or diced solar cell 10 from being lifted away from the porous belt 5230 and the manifold 5235. Any other suitable arrangement of holes 5255 may also be used. In some variations, the arrangement of holes 5255 does not ensure that the edges of wafer 45 or diced solar cells 10 remain under vacuum at all times.

The moving perforated belt 5230 in the illustrated example of the cutting tool 5210 contacts the bottom of the solar cell wafer 45 only along two narrow strips bounded by the width of the perforated belt along the lateral edges of the solar cell wafer. Thus, the solar cell wafer may contain a soft material (such as an uncured adhesive) that does not contact the porous belt 5230, for example in the region of the bottom surface of the solar cell wafer, so that there is no risk of damage to the soft material during dicing.

In alternative variations, for example, the cutting tool 5210 may use a single moving perforated belt 5230, rather than two moving perforated belts as just described, having a width perpendicular to the direction of travel that is approximately equal to The width of the solar cell wafer 45 . Alternatively, the cutting tool 5210 may include three, four or more moving perforated belts 5230, which may be arranged side by side in parallel and optionally spaced apart from each other. Cutting tool 5210 may use a single vacuum manifold 5235, which may, for example, have a width perpendicular to the direction of travel of the solar cells that is approximately equal to the width of solar cell wafer 45. Such a vacuum manifold can be used, for example, with a single full width moving perforated belt 5230, or with two or more such perforated belts arranged side by side in parallel and optionally spaced from each other. Cutting tool 5210 may include, for example, a single moving perforated belt 5230 supported along opposing lateral edges by two curved vacuum manifolds 5235 arranged side by side in parallel and spaced apart from each other, and each vacuum manifold The tubes have the same curvature. Cutting tool 5210 may include three or more curved vacuum manifolds 5235 arranged in parallel side-by-side and spaced apart from each other, wherein each vacuum manifold has the same curvature. Such an arrangement may be used, for example, with a single full width moving perforated belt 5230, or with three or more such perforated belts arranged side by side in parallel and optionally spaced from each other. For example, the cutting tool may include a moving perforated belt 5230 for each vacuum manifold.

Any suitable configuration of moving perforated belts and vacuum manifolds may be used in cutting tool 5210.

As described above, in some variations, the scribed solar cell wafer 45 diced with dicing tool 5210 contains uncured conductive adhesive bonding material and/or on its top and/or bottom surfaces prior to dicing other soft materials. The scribing of the solar cell wafer and the application of the soft material can be performed in either order.

The porous belt 5230 in the cutting tool 5210 (and the porous belt 1060 in the cutting tool 1050) can transport the solar cell wafer 45 at a speed of, for example, about 40 millimeters per second (mm/s) to about 2000 mm/s or more, or about 40mm/s to about 500mm/s or more, or about 80mm/s or more. The solar cell wafer 45 can be cut more easily at higher speeds than at lower speeds.

Referring now to Figure 68, once cut, due to the curved geometry around the curve, there will be some spacing between the leading and trailing edges 527 of adjacent cut cells 10, which will create a wedge between adjacent cut solar cells gap. If the cut cells are allowed to return to a flat coplanar orientation without first increasing the spacing between the cut cells, the edges of adjacent cut cells may touch and damage each other. Therefore, it is advantageous to remove the cut cells from the porous belt 5230 (or the porous belt 1060) while they are still supported by the curved surface.

Figures 69A-69G schematically illustrate several apparatus and methods whereby cut solar cells may be removed from the perforated belt 5230 (or perforated belt 1060) and conveyed to one or more additional moving perforated belts or moving surface, where the spacing between the cut solar cells increases. In the example of FIG. 69A, the cut solar cells 10 are collected from a perforated belt 5230 by one or more conveyor belts 5265 that move faster than the perforated belt 5230 and thereby increase the spacing between the cut solar cells 10 . For example, a conveyor belt 5265 may be positioned between the two perforated belts 5230. In the example of FIG. 69B , the diced wafer 10 is divided by sliding along the slide conveyor 5270 disposed between the two porous belts 5230 . In this example, the perforated belt 5230 advances each diced cell 10 into a low vacuum (eg, no vacuum) area of the manifold 5235 to release the diced cells to the slide 5270 while the wafer 45 is uncut Portions are still held by the perforated belt 5230. Providing an air cushion between the diced cells 10 and the slide feeder 5270 helps ensure that the cells and slide feeder are not worn during operation, and also allows the diced cells 10 to slide away from the wafer 45 more quickly, allowing for faster Cutting belt operating speed.

In the example of FIG. 69C , the carriage 5275A in the rotating “big wheel” arrangement 5275 transfers the cut solar cells 10 from belt 5230 to one or more belts 5280 .

In the example of FIG. 69D , rotating rollers 5285 apply vacuum through actuator 5285A to pick up cut solar cells 10 from belt 5230 and place them on belt 5280 .

In the example of Figure 69E, the carriage actuator 5290 includes a carriage 5290A and a retractable actuator 5290B mounted on the carriage. The carriage 5290A is translated back and forth to place the actuator 5290B to remove the cut solar cell 10 from the belt 5230 and then the actuator 5290B is positioned to place the cut solar cell on the belt 5280.

In the example of FIG. 69F , the carrier rail arrangement 5295 includes a carrier 5295A attached to a moving belt 5300 that configures the carrier 5295A to remove the cut solar cells 10 from the belt 5230 and subsequently The carrier 5295A is configured to place the cut solar cells 10 on the belt 5280, the latter of which occurs when the carrier is dropped or pulled from the belt 5280 due to the path of the belt 5230.

In the example of FIG. 69G , an inverted vacuum belt arrangement 5305 applies vacuum through one or more moving perforated belts in order to transfer the cut solar cells 10 from belt 5230 to belt 5280.

Figures 70A-70C provide orthogonal views of other variations of the exemplary tool described above in connection with Figures 62A-62B and subsequent figures. This variation 5310 uses a conveyor belt 5265, as in the example of Figure 69A, to remove the diced solar cells 10 from the porous belt 5230 that transports the uncut wafers 45 into the cutting area of the tool. The perspective views of Figures 71A-71B show a variant of the cutting tool in two different stages of operation. In FIG. 71A, the uncut wafer 45 is approaching the cutting area of the tool, and in FIG. 71B, the wafer 45 has entered the cutting area, and the two cut solar cells 10 have been separated from the wafer, and subsequently as they are transported by the conveyor 5265 are further divided from each other.

In addition to the previously described features, Figures 70A-71B show a plurality of vacuum ports 5315 on each manifold. The use of multiple ports per manifold allows for better control of the variation of vacuum along the length of the upper surface of the manifold. For example, different vacuum ports 5315 may optionally communicate with different vacuum chambers (eg, 5260L and 5260H in FIGS. 66 and 72B ) and/or optionally connect to different vacuum pumps to provide along the manifold Different vacuum pressures. 70A-70B also show the complete path of the perforated belt 5230 that circulates around the wheel 5325, the upper surface of the vacuum manifold 5235, and the wheel 5320. For example, belt 5230 may be driven by wheels 5320 or wheels 5325.

Figures 72A and 72B show perspective views of a portion of vacuum manifold 5235 covered by a portion of perforated belt 5230 for the variation of Figures 70A-71B, wherein Figure 72A provides a close-up view of a portion of Figure 72B. Figure 73A shows a top view of a portion of vacuum manifold 5235 covered by perforated belt 5230, and Figure 73B shows a cross-section of the same vacuum manifold and perforated belt arrangement taken along line C-C shown in Figure 73A picture. As shown in Figure 73B, the relative orientation of the through holes 5240 may vary along the length of the vacuum manifold such that each through hole is arranged perpendicular to the portion of the upper surface of the manifold directly above the through hole. 74A shows another top view of a portion of vacuum manifold 5235 covered by perforated belt 5230, with vacuum chambers 5260L and 5260H shown in perspective. Figure 74B shows a close-up view of a portion of Figure 74A.

75A-75G illustrate several exemplary hole patterns that may optionally be used in vacuum porous belt 5230. A common feature of these patterns is that a straight edge of a wafer 45 or cut solar cell 10 passing through the pattern at any point on the belt perpendicular to the long axis of the belt will always overlap at least one hole 5255 in each belt. For example, the pattern may include two or more rows of staggered square or rectangular holes (FIGS. 75A, 75D), two or more rows of Row or more rows of inclined grooves (FIGS. 75C, 75F), or any other suitable hole arrangement.

The present specification discloses high-efficiency solar modules comprising silicon solar cells arranged in an overlapped manner and electrically connected in series by conductive junctions between adjacent overlapped solar cells to form super cells that are The solar modules are arranged in physically parallel rows. Super cells can include any suitable number of solar cells. For example, the length of the super cells may span substantially the full length or width of the solar module, or two or more super cells may be arranged end-to-end in a row. This arrangement hides the electrical interconnections between the solar cells and thus can be used to form visually appealing solar modules with little or no difference between adjacent series connected solar cells.

This specification also discloses cell metallization patterns that facilitate printing the metallization stencil onto the front (and optionally) rear surface of the solar cell. As used herein, "stencil printing" of cell metallization refers to the application of a metallization material (eg, silver paste) onto a solar cell surface through patterned openings in an otherwise impermeable sheet of material. For example, the stencil may be a patterned stainless steel plate. The patterned openings in the stencil are completely free of stencil material and, for example, do not include any mesh or wire mesh. As used herein, "stencil printing" can be distinguished from "screen printing" due to the absence of mesh or screen material in the patterned stencil openings. In screen printing, by contrast, metallized material is applied to the solar cell surface through a screen (eg, mesh) that supports a patterned permeable material. The pattern includes openings in the impermeable material through which the metallized material is applied to the solar cell. The support wire mesh extends through openings in the impermeable material.

Stencil printing of battery metallization patterns offers several advantages over screen printing, including narrower line widths, higher aspect ratios (line height to width), better line uniformity and boundaries, and stencils are superior to silk The net has a longer lifespan. However, stencil printing cannot print the "islands" required in conventional three bus metallization designs at once. Furthermore, stencil printing cannot print a metallization pattern in one pass that requires the stencil to include unsupported structures that are not limited to the plane of the stencil during printing and may interfere with placement and use of the stencil. For example, stencil printing cannot print a metallization pattern in one pass where parallel-arranged metallization fingers are interconnected by bus lines or other metallization features extending perpendicular to the fingers, because a single stencil of such a design would include The opening for the bus and the opening for the fingers define an unsupported sheet tongue. The tongue will not be confined to the plane of the stencil during printing due to physical connection to other parts of the stencil, and will likely move out of plane and change the placement and use of the stencil.

Therefore, attempting to use stencils for printing conventional solar cells would require two printings of the front side metallization with two different stencils, or a stencil printing step combined with a screen printing step, which would increase the total printing steps per cell number and also creates a "press fit" problem where two prints overlap and result in double heights. The lamination complicates further processing, and additional printing and related steps add cost. Therefore, screen printing is not commonly used for solar cells.

As described further below, the front surface metallization patterns described herein may include an array of fingers (eg, parallel lines) that are not connected to each other by the front surface metallization patterns. These patterns can be stenciled once with a single stencil because the desired stencil need not include unsupported portions or structures (eg, tongues). For standard size solar cells and solar cell strings in which the spaced solar cells are interconnected by brazing ribbons, this front surface metallization pattern can be disadvantageous, since the metallization pattern itself does not provide perpendicular to the fingers A large amount of current distribution or electrical conduction through a substance. However, the front surface metallization patterns described herein are extremely effective in overlapping arrangements of rectangular solar cells, as described herein, where a portion of the front surface metallization pattern of a solar cell overlaps the rear surface metallization pattern of an adjacent solar cell Overlaid and conductively bonded to the back surface metallization pattern. This is because overlapping back surface metallizations of adjacent solar cells can provide current distribution and electrical conduction perpendicular to the fingers in the front surface metallization pattern.

Turning now to the drawings for a more detailed understanding of the solar modules described in this specification, FIG. 1 shows a cross-sectional view of a string of solar cells 10 arranged in a shingled fashion, connected in series, with ends of adjacent solar cells The parts are overlapped and electrically connected to form the super cell 100 . Each solar cell 10 includes a semiconductor diode structure and electrical contacts connected to the semiconductor diode structure through which a current generated in the solar cell 10 when illuminated by light can be supplied to an external load.

In the example described in this specification, each solar cell 10 is a rectangular crystalline silicon solar cell having a front surface (sun side) metallization pattern and a back surface (cathode side) metallization pattern, the front surface metallization pattern being disposed at On the semiconductor layer of n-type conductivity, back surface metallization patterns are provided on the semiconductor layer of p-type conductivity, the metallization patterns providing electrical contact to opposite sides of the n-p junction. However, other material systems, diode structures, physical dimensions or electrical contact arrangements may be used if appropriate. For example, the front (sun side) surface metallization pattern can be provided on the p-type conductivity semiconductor layer, and the back (cathode side) surface metallization pattern can be provided on the n-type conductivity semiconductor layer.

Referring again to FIG. 1, in super cell 100, adjacent solar cells 10 are conductively bonded directly to each other in regions where they overlap by means of a conductive bonding material that metallizes the front surface of one solar cell Electrically connected to the back surface metallization pattern of adjacent solar cells. Suitable conductive bonding materials may include, for example, conductive adhesives, conductive adhesive films and tapes, and conventional solders.

Referring again to FIG. 2, FIG. 2 illustrates an exemplary rectangular solar module 200 including six rectangular super cells 100, each rectangular super cell having a length approximately equal to the length of the long sides of the solar module. The super cells are arranged in six parallel rows with their long sides oriented parallel to the long sides of the modules. A similarly constructed solar module may also include such side-length super cells, but with more or fewer rows than shown in this example. In other variations, the respective lengths of the super cells may be approximately equal to the length of the short sides of the rectangular solar module, and the super cells are arranged in parallel rows with their long sides oriented parallel to the short sides of the module. In still other arrangements, each row may include two or more super cells, which may be electrically interconnected, eg, in series. The modules may have short sides, eg, about 1 meter in length, and long sides, eg, about 1.5 to about 2.0 meters in length. Any other suitable shape (eg, square) and size may also be selected for the solar module. In this example, each super cell includes 72 rectangular solar cells, each rectangular solar cell having a width approximately equal to 1/6 the width of a 156 millimeter (mm) square or pseudo-square wafer, and a length of approximately 156 mm. Any other suitable number and any other suitable size of rectangular solar cells may also be used.

Figure 76 shows an exemplary front surface metallization pattern on a rectangular solar cell 10 that facilitates stencil printing as described above. The front surface metallization pattern can be formed from, for example, silver paste. In the example of Figure 76, the front surface metallization pattern includes a plurality of fingers 6015 that extend parallel to each other, parallel to the short sides of the solar cell, and perpendicular to the long sides of the solar cell. The front surface metallization pattern also includes an optional row of contact pads 6020 extending parallel to and adjacent to the long side edges of the solar cell, where each contact pad 6020 is located at the end of a finger 6015. Where present, each contact pad 6020 is an electrically conductive adhesive (ECA), solder, or other conductive material used to conductively bond the front surface of the illustrated solar cell to the overlapping portion of the rear surface of an adjacent solar cell Individual beads of bonding material provide areas. The pads may, for example, have a circular, square or rectangular shape, although any suitable pad shape may be used. Instead of using individual beads of conductive bonding material, solid or dashed lines of ECA, solder, conductive tape, or other conductive bonding material placed along the long edge of the solar cell may interconnect some or all of the fingers , and bonding solar cells to adjacent overlapping solar cells. This dashed or solid line of conductive bonding material may be used in conjunction with conductive pads at the ends of the fingers, or in the absence of such conductive pads.

The solar cell 10 may have, for example, a length of about 156 mm, a width of about 26 mm, and thus an aspect ratio (length of short side/length of long side) of about 1:6. Six of these solar cells can be prepared on a standard size silicon wafer of 156 mm x 156 mm, which is subsequently divided (diced) to provide the solar cells shown. In other variations, eight solar cells 10 with dimensions of approximately 19.5 mm x 156 mm, and thus an aspect ratio of approximately 1:8, may be fabricated from standard silicon wafers. More generally, solar cell 10 may have an aspect ratio of, for example, about 1:2 to about 1:20, and may be fabricated from standard size wafers or any other suitable size wafers.

Referring again to Figure 76, the front surface metallization pattern may include, for example, about 60 to about 120 fingers, such as about 90 fingers, per 156 mm wide cell. The width of the fingers 6015 may be, for example, about 10 to about 90 microns, such as about 30 microns. The fingers 6015 may have a height perpendicular to the surface of the solar cell, eg, about 10 to about 50 microns. The finger height can be, for example, about 10 microns or more, about 20 microns or more, about 30 microns or more, about 40 microns or more, or about 50 microns or more. The diameter (circle) or side length (square or rectangle) of the pad 6020 may be, for example, about 0.1 mm to about 1 mm, such as about 0.5 mm.

The back surface metallization pattern for the rectangular solar cell 10 may include, for example, a row of discrete contact pads, a row of interconnected contact pads, or a continuous bus line parallel to and adjacent to the long side edges of the solar cell. However, such contact pads or busses are not required. If the front surface metallization pattern includes contact pads 6020 arranged along the edge of one of the long sides of the solar cell, then the row or bus line (if present) of contact pads in the back surface metallization pattern is along the other of the solar cell's long sides. The edge arrangement of the long side. The back surface metallization pattern may also include metal back contacts that cover substantially all of the remaining back surface of the solar cell. The exemplary back surface metallization pattern of FIG. 77A includes a row of discrete contact pads 6025 and metal backside contacts 6030 as just described, and the exemplary back surface metallization pattern of FIG. 77B includes continuous bus lines 35 and a continuous bus line 35 as just described Metal back contact 6030.

In a shingled super cell, the front surface metallization patterns of a solar cell are conductively bonded to overlapping portions of the back surface metallization patterns of adjacent solar cells. For example, if the solar cell includes front surface metallized contact pads 6020, then each contact pad 6020 may be aligned with and bonded to a corresponding back surface metallized contact pad 6025 (if present), or with the back surface metallized contact pad 6025. Alignment bus 35 (if present) is aligned and bonded to the bus, or to metal back contacts 6030 (if present) on adjacent solar cells. This can be accomplished, for example, by discrete portions of conductive bonding material (eg, beads) disposed on each contact pad 6020, or by extending parallel to the edge of the solar cell and optionally connecting two or more of the contact pads 6020 The electrical interconnection of multiple contact pads is accomplished by dashed or solid lines of conductive bonding material.

If the solar cell lacks front surface metallization contact pads 6020, for example, each front surface metallization pattern finger 6015 can be aligned with and bonded to a corresponding rear surface metallization contact pad 6025 (if present) , or to the back surface metallization bus 35 (if present), or to the metal back contact 6030 (if present) on the adjacent solar cell. This can be accomplished, for example, by discrete portions (eg, beads) of conductive bonding material disposed on the overlapping ends of each finger 6015, or by extending parallel to the edge of the solar cell and optionally inserting the fingers 6015 into the finger 6015. The two or more fingers are electrically interconnected by dashed or solid lines of conductive bonding material.

As described above, for example, if back surface busses 35 and/or back metal contacts 6030 are present, multiple portions of overlapping back surface metallizations of adjacent solar cells may be provided with fingers in the front surface metallization pattern Vertical current distribution and electrical conduction. In variations using dashed or solid line conductive bonding material as described above, the conductive bonding material may provide current distribution and electrical conduction perpendicular to the fingers in the front surface metallization pattern. The overlapping back surface metallization and/or conductive bonding material may, for example, carry current to bypass damaged fingers or other finger interference in the front surface metallization pattern.

If present, back surface metallized contact pads 6025 and busses 35 may be formed from, for example, a silver paste, which may be applied using stencil printing, screen printing, or any other suitable method. Metal back contact 6030 may be formed of aluminum, for example.

Any other suitable back surface metallization patterns and materials may also be used.

FIG. 78 shows an exemplary front surface metallization pattern on a square solar cell 6300 that can be cut into a plurality of rectangular solar cells, each rectangular solar cell having the front surface metallization pattern shown in FIG. 76 .

Figure 79 shows an exemplary back surface metallization pattern on a square solar cell 6300 that can be cut into a plurality of rectangular solar cells, each rectangular solar cell having the back surface metallization pattern shown in Figure 77A .

The front surface metallization patterns described herein can enable stencil printing of the front surface metallization on a standard three-press solar cell production line. For example, the production process may include: stencil printing or screen printing silver paste onto the back surface of square solar cells using a first printer to form back surface contact pads or back surface silver busses; drying; then stencil or screen print the aluminum contacts onto the back surface of the solar cell using a second printer; then dry the aluminum contacts; then use a single stencil on a third printer to stencil the silver in a single platemaking step The paste is printed onto the front surface of the solar cell to form a complete front surface metallization pattern; the silver paste is subsequently dried; and the solar cell is then baked. These printing and related steps may be performed in any other order, or omitted, if appropriate.

Using a stencil to print the front surface metallization pattern enables the production of narrower fingers than is possible by screen printing, which can improve solar cell efficiency and reduce silver usage, thereby reducing production costs. Stencil printing of the front surface metallization pattern with a single stencil in a single stencil printing step enables the production of a front surface metallization pattern of uniform height, eg no pressing occurs if multiple stencils are used in combination or stencil printing and screen printing are performed Overprinting to define features that extend in different directions, then stitching can occur.

After the front and rear surface metallization patterns are formed on the square solar cells, each square solar cell may be divided into two or more rectangular solar cells. This can be done, for example, by laser scribing followed by cutting, or by any other suitable method. The rectangular solar cells can then be arranged in an overlapping lap and conductively bonded to each other as described above to form a super cell. The present specification discloses methods for fabricating solar cells with reduced carrier recombination losses at the edges of the solar cell, eg, no cutting edges that promote carrier recombination. The solar cell may be, for example, a silicon solar cell, and more specifically a HIT silicon solar cell. This specification also discloses shingled (overlapped) super cell arrangements of such solar cells. The individual solar cells in such super cells may have narrow rectangular geometries (eg, bar-like shapes), where the long sides of adjacent solar cells are arranged to overlap.

The main challenge in cost-effectively implementing high-efficiency solar cells such as HIT solar cells is that it is generally considered necessary to use large amounts of metal to carry large currents from one such high-efficiency solar cell to an adjacent series-connected one. High-efficiency solar cells. Such high-efficiency solar cells are cut into narrow rectangular solar cell strips, and the resulting solar cells are subsequently arranged in an overlapping (tilted) pattern with conductive bonds between overlapping portions of adjacent solar cells to form series connections in super cells of solar cell strings, thereby providing an opportunity to reduce module costs through process simplification. This is because the fixing process normally required to interconnect adjacent solar cells with metal ribbons can be eliminated. By reducing the current through the solar cells (since individual solar cell strips can have a smaller active area than conventional), and by reducing the current path length between adjacent solar cells, both may reduce resistive losses, making this stack The lid approach can also improve module efficiency. The reduced current may also allow for the replacement of more expensive but less resistive wires (eg, silver) with less expensive but more resistive wires (eg, copper) without significant loss of performance. Additionally, this overlay method can reduce dead module area by eliminating interconnect ribbons and associated contacts from the front surface of the solar cell.

Conventional sized solar cells may have, for example, substantially square front and back surfaces measuring about 156 millimeters (mm) by about 156 mm. In the shingling scheme just described, such solar cells are cut into two or more (eg, two to twenty) 156 mm long solar cell strips. A potential difficulty with this overlay method is that slicing conventional sized solar cells into thin strips increases the cell edge length per active area of the solar cell compared to conventional sized solar cells, which may result from current carrying at the edges. sub-compound and degrade performance.

For example, Figure 80 schematically illustrates cutting a HIT solar cell 7100 having front and back surface dimensions of about 156 mm x about 156 mm into several solar cell strips (7100a, 7100b, 7100c, and 7100d), each solar cell strip Has narrow rectangular front and rear surfaces measuring about 156mm x about 40mm. (The 156mm long side of the solar cell strip extends into the page). In the example shown, HIT cell 7100 includes an n-type single crystal substrate 5105, which may, for example, have a thickness of about 180 microns and front and back square surfaces with dimensions of about 156 mm by about 156 mm. An approximately 5 nanometer (nm) thick intrinsic amorphous Si:H (a-Si:H) layer and an approximately 5 nm thick n+ doped a-Si:H layer (both layers are indicated by reference numeral 7110) are disposed on the crystal. on the front surface of the silicon substrate 7105. A transparent conductive oxide (TCO) film 5120 about 65 nm thick is disposed on the a-Si:H layer 7110. Conductive metal gridlines 7130 disposed on the TCO layer 7120 provide electrical contacts to the front surface of the solar cell. An approximately 5 nm thick intrinsic a-Si:H layer and an approximately 5 nm thick p+ doped a-Si:H layer (both layers are indicated by reference numeral 7115) are disposed on the back surface of the crystalline silicon substrate 7105. A transparent conductive oxide (TCO) film 7125 about 65 nm thick is disposed on the a-Si:H layer 7115, and conductive metal grid lines 7135 disposed on the TCO layer 7125 provide electrical contacts for the back surface of the solar cell . (The above dimensions and materials are intended to be illustrative and not limiting, and may vary if appropriate).

Still referring to Figure 80, if HIT solar cell 7100 is cut by conventional methods to form strip solar cells 7100a, 7100b, 7100c, and 7100d, the newly cut edges 7140 are not passivated. These non-passivated edges contain a high density of dangling chemical bonds that promote carrier recombination and degrade solar cell performance. Specifically, the cut surface 7145 exposing the n-p junction and the cut surface (in layer 7110) exposing the heavily doped front surface region are not passivated and can significantly promote carrier recombination. Furthermore, if conventional laser cutting or laser scribing processes are used to cut the solar cell 7100, thermal damage, such as recrystallization 7150 of amorphous silicon, may occur on the newly formed edges. Due to non-passivated edges and thermal damage, new edges formed on cut solar cells 7100a, 7100b, 7100c, and 7100d are expected to reduce short circuit current, open circuit voltage, and pseudo-fill factor of the solar cells if conventional manufacturing processes are used. This corresponds to a significant reduction in the performance of the solar cell.

By the method shown in FIGS. 81A-81J , the formation of recombination-promoting edges during the cutting of conventional sized HIT solar cells into narrower solar cell strips can be avoided. This approach uses isolation trenches on the front and back surfaces of a conventionally sized solar cell 7100 to separate the p-n junction and heavily doped front surface region with cutting edges that might otherwise act as recombination sites for minority carriers Electrical isolation. The trench edges are not defined by conventional cutting, but chemical etching or laser patterning is used, followed by deposition of a passivation layer, such as TCO, which passivates the front and back trenches. The substrate doping is low enough that electrons in the junction have little chance of reaching the unpassivated cut edge of the substrate compared to the heavily doped regions. Additionally, a scratch-less wafer dicing technique, Laser Thermal Separation (TLS), can be used to singulate wafers, thereby avoiding potential thermal damage.

In the example shown in FIGS. 81A-81J, the starting material is an approximately 156 mm square n-type monocrystalline silicon as-cut wafer, which may have, for example, a volume resistivity of about 1 to about 3 ohm-cm and may be For example about 180 microns thick. (Wafer 7105 forms the substrate of the solar cell).

Referring to Figure 81A, as-cut wafer 7105 is typically texture etched, pickled, rinsed and dried.

Next, in FIG. 81B, an about 5 nm thick intrinsic a-Si:H layer and about 5 nm thick doping A hetero n+a-Si:H layer (both layers are indicated by reference numeral 7110) is deposited on the front surface of the wafer 7105.

Next, in FIG. 81C, an about 5 nm thick intrinsic a-Si:H layer and about 5 nm thick doped p+a-Si: Layers H (both layers are indicated by reference numeral 7115 ) are deposited on the back surface of wafer 7105 .

Next, in FIG. 81D, the front a-Si:H layer 7110 is patterned to form isolation trenches 7112. Isolation trenches 7112 typically penetrate layer 7110 to reach wafer 7105, and may have a width of, for example, about 100 microns to about 1000 microns, such as about 200 microns. Typically, trenches have a minimum width that can be used, depending on the accuracy of the patterning technique and subsequently applied dicing technique. Patterning of trenches 7112 can be accomplished, for example, using laser patterning or chemical etching (eg, inkjet wet patterning).

Next, in FIG. 81E, the rear a-Si:H layer 7115 is patterned to form isolation trenches 7117. Similar to isolation trenches 7112, isolation trenches 7117 generally penetrate layer 7115 to reach wafer 7105, and may have a width of, for example, about 100 microns to about 1000 microns, such as about 200 microns. Patterning of trenches 7117 can be accomplished, for example, using laser patterning or chemical etching (eg, ink jet wet patterning). Each trench 7117 is in line with a corresponding trench 7112 on the front surface of the structure.

Next, in FIG. 81F, an approximately 65 nm thick TCO layer 7120 is deposited over the patterned front a-Si:H layer 7110. This can be done, for example, by physical vapor deposition (PVD) or ion plating. The TCO layer 7120 fills the trenches 7112 in the a-Si:H layer 7110 and covers the outer edges of the layer 7110, thereby passivating the surface of the layer 7110. The TCO layer 7120 also acts as an anti-reflection coating.

Next, in FIG. 81G, an approximately 65 nm thick TCO layer 7125 is deposited over the patterned back a-Si:H layer 7115. This can be done, for example, by PVD or ion plating. The TCO layer 7125 fills the trenches 7117 in the a-Si:H layer 7115 and covers the outer edges of the layer 115, thereby passivating the surface of the layer 7115. The TCO layer 7125 also acts as an anti-reflection coating.

Next, in FIG. 81H, conductive (eg, metallic) front surface gridlines 7130 are screen printed onto the TCO layer 7120. The grid lines 7130 may be formed of, for example, a low temperature silver paste.

Next, in FIG. 81I, conductive (eg, metallic) back surface gridlines 7135 are screen printed onto the TCO layer 7125. The grid lines 7135 may be formed from, for example, a low temperature silver paste.

Next, after the gridlines 7130 and 7135 are deposited, the solar cells are cured, for example, at a temperature of about 200° C. for about 30 minutes.

Next, in Figure 81J, the solar cells are divided into solar cell strips 7155a, 7155b, 7155c, and 7155d by cutting the solar cells at the center of the trenches. Cutting can be done at the center of the trench, for example by conventional laser scribing and mechanical cutting, to cut the solar cell in alignment with the trench. Alternatively, the dicing can be done using a laser thermal singulation method (eg, developed by Jenoptik AG), where laser-induced heating at the center of the trench induces mechanical stress that aligns the trench The slot will cut the solar cell. The latter method avoids thermal damage to the edges of the solar cell.

The resulting strip solar cells 7155a-7155d differ from the strip solar cells 7100a-7100d shown in FIG. Specifically, the edges of a-Si:H layer 7110 and a-Si:H layer 7115 in solar cells 7140a-7140d are formed by etching or laser patterning, rather than by mechanical cutting. In addition, the edges of layers 7110 and 7115 in solar cells 7155a-7155d are passivated by the TCO layer. Thus, solar cells 7140a-7140d lack the cutting edges that promote carrier recombination present in solar cells 7100a-7100d.

The methods described in conjunction with FIGS. 81A-81J are intended to be illustrative, not limiting. Steps described as being performed in a particular order may be performed in other orders or in parallel, if appropriate. Steps and layers of materials may be omitted, added or replaced as appropriate. For example, if copper-plated metallization is used, additional patterning and seed layer deposition steps may be included in the process. Furthermore, in some variations, only the front a-Si:H layer 7110 is patterned to form isolation trenches, and no isolation trenches are formed in the rear a-Si:H layer 7115. In other variations, only the rear a-Si:H layer 7115 is patterned to form isolation trenches, and no isolation trenches are formed in the front a-Si:H layer 7115. As in the example of FIGS. 81A to 81J , in these variants, the cutting is also made at the center of the trench.

The formation of recombination-promoting edges during dicing of conventional sized HIT solar cells into narrower solar cell strips can also be avoided by the method shown in FIGS. 82A-82J , which also uses isolation trenches, similar to the bonding diagrams. as used in the methods described in 81A to 81J.

Referring to Figure 82A, in this example, the starting material is again an approximately 156 mm square n-type monocrystalline silicon as-cut wafer 7105, which may have, for example, a volume resistivity of about 1 to about 3 ohm-cm and may be, for example, About 180 microns thick.

Referring to FIG. 82B, trenches 7160 are formed in the front surface of wafer 7105. The trenches may have, for example, a depth of about 80 microns to about 150 microns, such as about 90 microns, and a width of, for example, about 10 microns to about 100 microns. Isolation trenches 7160 define the geometry of the solar cell strips to be formed from wafer 7105. As will be explained below, the wafer 7105 will be cut in line with these trenches. The trenches 7160 may be formed, for example, by conventional laser wafer scribing.

Next, in Figure 82C, the wafer 7105 is typically texture etched, pickled, rinsed and dried. Etching typically removes damage initially present in the surface of the as-cut wafer 7105 or damage caused during the formation of trenches 7160 . Etching can also widen and deepen trench 7160.

Next, in FIG. 82D, an about 5 nm thick intrinsic a-Si:H layer and about 5 nm thick doped n+a-Si: Layers H (both layers are indicated by reference numeral 7110) are deposited on the front surface of wafer 7105.

Next, in Figure 82E, an about 5 nm thick intrinsic a-Si:H layer and about 5 nm thick doped p+a-Si: Layers H (both layers are indicated by reference numeral 7115 ) are deposited on the back surface of wafer 7105 .

Next, in FIG. 82F, an approximately 65 nm thick TCO layer 7120 is deposited over the front a-Si:H layer 7110. This can be done, for example, by physical vapor deposition (PVD) or ion plating. TCO layer 7120 may fill trench 7160 and generally cover the walls and bottom of trench 7160 and the outer edges of layer 7110, thereby passivating the overlying surface. The TCO layer 7120 also acts as an anti-reflection coating.

Next, in FIG. 82G, a TCO layer 7125 about 65 nm thick is deposited on the back a-Si:H layer 7115. This can be done, for example, by PVD or ion plating. The TCO layer 7125 passivates the surface of the layer 7115 (eg, including the outer edges) and also acts as an anti-reflective coating.

Next, in Figure 82H, conductive (eg, metallic) front surface gridlines 7130 are screen printed onto the TCO layer 7120. The grid lines 7130 may be formed of, for example, a low temperature silver paste.

Next, in FIG. 82I, conductive (eg, metallic) back surface gridlines 7135 are screen printed onto the TCO layer 7125. The grid lines 7135 may be formed from, for example, a low temperature silver paste.

Next, after the gridlines 7130 and 7135 are deposited, the solar cells are cured, for example, at a temperature of about 200° C. for about 30 minutes.

Next, in Figure 82J, the solar cells are divided into solar cell strips 7165a, 7165b, 7165c, and 7165d by cutting the solar cells at the center of the trenches. Cutting can be done at the center of the trench, for example by conventional mechanical cutting, to cut the solar cell in alignment with the trench. Alternatively, cutting can be done, for example, using a laser thermal singulation method as described above.

The resulting strip solar cells 7165a-7165d differ from the strip solar cells 7100a-7100d shown in FIG. Specifically, the edges of the a-Si:H layer 7110 in the solar cells 7165a-7165d are formed by etching, rather than by mechanical cutting. In addition, the edges of layer 7110 in solar cells 7165a-7165d are passivated by the TCO layer. Thus, solar cells 7165a-7165d lack the cutting edges that promote carrier recombination present in solar cells 7100a-7100d.

The methods described in connection with Figures 82A-82J are intended to be illustrative, not limiting. Steps described as being performed in a particular order may be performed in other orders or in parallel, if appropriate. Steps and layers of materials may be omitted, added or replaced as appropriate. For example, if copper-plated metallization is used, additional patterning and seed layer deposition steps may be included in the process. Furthermore, in some variations, trenches 7160 may be formed in the back surface of wafer 7105 instead of the front surface of wafer 7105 .

The methods described above in connection with Figures 81A-81J and 82A-82J are applicable to n-type and p-type HIT solar cells. Solar cells can be front or rear emitters. The segmentation process may preferably be performed on the side without the transmitter. In addition, the use of isolation trenches and passivation layers as described above to reduce recombination on the edge of the diced wafer is also applicable to other solar cell designs, and to solar cells employing material systems other than silicon.

Referring again to FIG. 1 , a string of serially connected solar cells 10 formed using the methods described above can advantageously be arranged in a shingled fashion, wherein the ends of adjacent solar cells overlap and are electrically connected to form a super cell 100 . In super cell 100, adjacent solar cells 10 are conductively bonded to each other in their overlapping regions by a conductive bonding material that electrically connects the front surface metallization pattern of one solar cell to the adjacent solar cell metallization pattern on the rear surface. Suitable conductive bonding materials may include, for example, conductive adhesives, conductive adhesive films, and conductive adhesive tapes, as well as conventional solders.

Referring again to FIGS. 5A-5B, FIG. 5A illustrates an exemplary rectangular solar module 200 including 20 rectangular super cells 100, where each rectangular super cell has a length approximately equal to half the length of the short side of the solar module. The super cells are arranged in pairs end-to-end to form ten rows of super cells, with the rows and long sides of the super cells oriented parallel to the short sides of the solar module. In other variations, each row of super cells may include three or more super cells. Furthermore, in other variations, the super cells may be arranged in rows end-to-end, with the rows and long sides of the super cells oriented parallel to the long sides of a rectangular solar module, or parallel to the sides of a square solar module. Additionally, the solar module may include more or fewer super cells and more or fewer rows of super cells than shown in this example.

In a variation where the super cells in each row are arranged such that at least one of them has a front surface end contact on the end of the super cell adjacent to the other super cell in the row, there may be An optional gap 210 is shown to facilitate making electrical contact to the front surface end contacts of the super cell 100 along the centerline of the solar module. In variations where each row of super cells includes three or more super cells, there may be additional gaps between the super cells to similarly facilitate electrical contact with the front surface end contacts remote from each side of the solar module touch.

5B illustrates another exemplary rectangular solar module 300 including 10 rectangular super cells 100, where each rectangular super cell has a length approximately equal to the length of the short side of the solar module. The super cells are arranged with their long sides oriented parallel to the short sides of the modules. In other variations, the length of the super cells may be approximately equal to the length of the long sides of the rectangular solar modules, and the super cells are oriented such that their long sides are parallel to the long sides of the solar module. The length of the super cells may also be approximately equal to the side length of a square solar module, and the super cells are oriented such that their long sides are parallel to the sides of the solar module. Furthermore, the solar module may include more or fewer super cells of such side lengths than shown in this example.

5B also shows the appearance of the solar module 200 of FIG. 5A without gaps between adjacent super cells within each row of super cells. Any other suitable arrangement of super cells 100 in a solar module may also be used.

The following enumerated paragraphs provide additional non-limiting aspects of the present disclosure.

1. A solar module comprising:

Strings of N (N > 25) rectangular or substantially rectangular solar cells connected in series, the solar cells having an average breakdown voltage greater than about 10 volts, the solar cells aggregated into one or more super cells, each Super cells each include two or more solar cells arranged in line, wherein the long sides of adjacent solar cells overlap and are conductively bonded to each other with an adhesive that is both electrically and thermally conductive;

Wherein in the solar cell string, no single solar cell or a total number of solar cell groups less than N are individually electrically connected in parallel with the bypass diodes.

2. The solar module of clause 1, wherein N is greater than or equal to 30.

3. The solar module of clause 1, wherein N is greater than or equal to 50.

4. The solar module of clause 1, wherein N is greater than or equal to 100.

5. The solar module of clause 1, wherein the adhesive forms a bond between adjacent solar cells that has a thickness of less than or equal to about 0.1 mm in a direction perpendicular to the solar cells and in a direction perpendicular to the solar cells The thermal conductivity is greater than or equal to about 1.5w/m/k.

6. The solar module of clause 1, wherein the N solar cells are aggregated into a single super cell.

7. The solar module of clause 1, wherein the super cell is encapsulated in a polymer.

7A. The solar module of clause 7, wherein the polymer comprises a thermoplastic olefin polymer.

7B. The solar module of clause 7, wherein the polymer is sandwiched between a glass front sheet and a back sheet.

7C. The solar module of clause 7B, wherein the back panel comprises glass.

8. The solar module of clause 1, wherein the solar cell is a silicon solar cell.

9. A solar module comprising:

a super cell spanning substantially the entire length or width of the solar module parallel to the edges of the solar module, the super cell comprising N rectangular or substantially rectangular strings of solar cells connected in series, the solar cells having an average breakdown voltage greater than about 10 volts, the solar cells being arranged in a straight line wherein the long sides of adjacent solar cells overlap and are conductively bonded to each other with an adhesive that is both electrically and thermally conductive;

Wherein in the super cell, no single solar cell or a total number of solar cell groups less than N are individually electrically connected in parallel with bypass diodes.

10. The solar module of clause 9, wherein N>24.

11. The solar module of clause 9, wherein the super cell has a length in the direction of current flow of at least about 500 mm.

12. The solar module of clause 9, wherein the super cell is encapsulated in a thermoplastic olefin polymer sandwiched between a glass front sheet and a back sheet.

13. A super battery comprising:

Multiple silicon solar cells, each silicon solar cell including:

Rectangular or substantially rectangular front and back surfaces, said surfaces having a shape defined by opposite and parallel first and second long sides and two opposite short sides, said front surface at least partially at exposure to solar radiation during operation of the solar cell string;

a conductive front surface metallization pattern disposed on the front surface and including at least one front surface contact pad disposed adjacent the first long side; and

a conductive back surface metallization pattern disposed on the back surface and including at least one back surface contact pad disposed adjacent the second long side;

wherein the silicon solar cells are arranged in a straight line, the first and second long sides of adjacent silicon solar cells overlap, and the front surface contact pads and the back surface contact pads on the adjacent silicon solar cells overlap and are bonded by a conductive adhesive The mixture bonding materials are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series. as well as

wherein the front surface metallization pattern of each silicon solar cell includes a barrier configured to substantially confine the conductive adhesive bonding material to at least the conductive adhesive bonding material prior to curing of the conductive adhesive bonding material during fabrication of the super cell A front surface contact pad.

14. The super cell of clause 13, wherein for each pair of adjacent and overlapping silicon solar cells, the barrier on the front surface of one of the silicon solar cells is connected to a portion of the other silicon solar cell Overlapped and hidden by the portion, during manufacture of the super cell, the conductive adhesive bonding material is generally confined to the overlapping area of the front surface of the silicon solar cell before the conductive adhesive bonding material is cured.

15. The super cell of clause 13, wherein the barrier comprises a continuous conductive line parallel to the first long side and running substantially the entire length of the first long side, wherein the at least one front surface The contact pad is located between the continuous conductive line and the first long side of the solar cell.

16. The super cell of clause 15, wherein the front surface metallization pattern includes fingers electrically connected to the at least one front surface contact pad and running perpendicular to the first long side and being continuous Conductive lines electrically interconnect the fingers to provide multiple conductive paths from each finger to the at least one front surface contact pad.

17. The super cell of clause 13, wherein the front surface metallization pattern includes a plurality of discrete contact pads arranged in a row adjacent and parallel to the first long side, and the barrier includes a plurality of discrete contact pads forming a separate barrier for each discrete contact pad features that generally confine the conductive adhesive bonding material to discrete contact pads prior to curing the conductive adhesive bonding material during fabrication of the super cell.

18. The super cell of clause 17, wherein the individual barriers abut and are higher than corresponding discrete contact pads.

19. A super battery comprising:

Multiple silicon solar cells, each silicon solar cell including:

Rectangular or substantially rectangular front and back surfaces, said surfaces having a shape defined by opposite and parallel first and second long sides and two opposite short sides, said front surface at least partially at exposure to solar radiation during operation of the solar cell string;

a conductive front surface metallization pattern disposed on the front surface and including at least one front surface contact pad disposed adjacent the first long side; and

a conductive back surface metallization pattern disposed on the back surface and including at least one back surface contact pad disposed adjacent the second long side;

wherein the silicon solar cells are arranged in a straight line, the first and second long sides of adjacent silicon solar cells overlap, and the front surface contact pads and the back surface contact pads on the adjacent silicon solar cells overlap and are bonded by a conductive adhesive The mixture bonding materials are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series. as well as

wherein the back surface metallization pattern of each silicon solar cell includes a barrier configured to substantially confine the conductive adhesive bonding material to at least the conductive adhesive bonding material prior to curing of the conductive adhesive bonding material during fabrication of the super cell A back surface contact pad.

20. The super cell of clause 19, wherein the back surface metallization pattern includes one or more discrete contact pads arranged in a row adjacent and parallel to the second long side, and the barrier includes forming a separate barrier for each discrete contact pad features that generally confine the conductive bonding material to discrete contact pads prior to curing the conductive adhesive bonding material during fabrication of the super cell.

twenty one. The super cell of clause 20, wherein the individual barriers abut and are higher than corresponding discrete contact pads.

twenty two. A method of making a solar cell string, the method comprising:

cutting one or more pseudo-square silicon wafers along a plurality of lines parallel to the long edges of each wafer to form a plurality of rectangular silicon solar cells, wherein each silicon solar cell has a substantially equal length along its long axis; as well as

arranging the rectangular silicon solar cells in a straight line such that the long sides of adjacent solar cells overlap and are conductively bonded to each other, thereby electrically connecting the solar cells in series;

wherein the plurality of rectangular silicon solar cells includes: at least one rectangular solar cell having two chamfers, the chamfers corresponding to a corner or a portion of a corner of a pseudo-square wafer; and one or more rectangles each lacking a chamfer Silicon solar cells. as well as

wherein by making the width perpendicular to the long axis of the rectangular silicon solar cell including the chamfer greater than the width perpendicular to the long axis of the rectangular silicon solar cell lacking the chamfer, the spacing between parallel lines along which the pseudo-square wafer is cut is aligned The selection is made to compensate for the chamfer; thus, the front surface of each of the plurality of rectangular silicon solar cells in the solar cell string has substantially equal areas exposed to sunlight during operation of the solar cell string.

twenty three. A solar cell string, comprising:

a plurality of silicon solar cells arranged in line, wherein ends of adjacent solar cells overlap and are conductively bonded to each other, thereby electrically connecting the solar cells in series;

wherein at least one silicon solar cell has a chamfer corresponding to a corner or a portion of a corner of the pseudo-square silicon wafer from which the silicon solar cell is cut; at least one silicon solar cell lacks a chamfer; during operation of the solar cell string, The area of the front surface of each silicon solar cell exposed to sunlight is substantially equal.

twenty four. A method of making two or more solar cell strings, the method comprising:

One or more pseudo-square silicon wafers are cut along lines parallel to the long edges of each wafer to form a first plurality of rectangular silicon solar cells having chamfers and a second plurality of rectangular silicon lacking chamfers A solar cell, wherein the chamfer corresponds to a corner or a portion of a corner of a pseudo-square silicon wafer, each of the second plurality of rectangular silicon solar cells has a first length that spans equal to The full width of a quasi-square silicon wafer;

The chamfers are removed from each of the first plurality of rectangular silicon solar cells to form a third plurality of rectangular silicon solar cells lacking the chamfers, each of the third plurality of rectangular silicon solar cells being has a second length shorter than the first length;

arranging a second plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and electrically connecting the second plurality of rectangular silicon solar cells in series, thereby forming a width a string of solar cells equal to the first length; and

A third plurality of rectangular silicon solar cells are arranged in a line such that long sides of adjacent rectangular silicon solar cells overlap and are conductively bonded to each other, and the third plurality of rectangular silicon solar cells are electrically connected in series, thereby forming a width equal to the second length of the solar cell string.

25. A method of making two or more solar cell strings, the method comprising:

One or more pseudo-square silicon wafers are cut along lines parallel to the long edges of each wafer to form a first plurality of rectangular silicon solar cells having chamfers and a second plurality of rectangular silicon lacking chamfers A solar cell, wherein the chamfer corresponds to a corner or a portion of a corner of a pseudo-square silicon wafer;

arranging the first plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, electrically connecting the first plurality of rectangular silicon solar cells in series; and

The second plurality of rectangular silicon solar cells are arranged in line with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and the second plurality of rectangular silicon solar cells are electrically connected in series.

26. A method of making a solar module, the method comprising:

Cutting each of the one or more pseudo-square silicon wafers along a plurality of lines parallel to the long edges of the wafer to form a plurality of rectangular silicon solar cells with chamfered corners from the plurality of pseudo-square silicon wafers, and lacking a plurality of rectangular silicon solar cells with chamfered corners, wherein the chamfered corners correspond to corners of a pseudo-square silicon wafer;

Arranging at least some of the rectangular silicon solar cells lacking chamfers to form a first plurality of super cells, each super cell comprising only rectangular silicon solar cells lacking chamfers arranged in line, wherein the rectangular silicon solar cells have a length of the sides overlap and are conductively bonded to each other to electrically connect the silicon solar cells in series;

arranging at least some of the rectangular silicon solar cells with chamfered corners to form a second plurality of super cells, each super cell including only rectangular silicon solar cells with chamfered corners arranged in a straight line, wherein the length of the rectangular silicon solar cells is the sides overlap and are conductively bonded to each other to electrically connect the silicon solar cells in series; and

Arranging the super cells in parallel rows of super cells of substantially equal length forming the front surface of the solar module, wherein each row includes only super cells of the first plurality of super cells or only super cells of the second plurality of super cells super battery.

27. The solar module of clause 26, wherein two of the rows of super cells adjacent parallel opposite edges of the solar module include only super cells of the second plurality of super cells, and all other rows of super cells include only the first plurality Super cells in super cells.

28. The solar module of clause 27, wherein the solar module includes a total of six rows of super cells.

29. A super battery comprising:

a plurality of silicon solar cells arranged in line in the first direction, wherein ends of adjacent silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series; and

An elongated flexible electrical interconnect having a long axis oriented parallel to a second direction perpendicular to the first direction, the elongated flexible electrical interconnect having the following characteristics: at one or more discrete locations, conductively bonded to the front or back surface of a terminal silicon solar cell; extending at least the full width of the terminal solar cell in a second direction; perpendicular to the front surface of the terminal silicon solar cell or Wire thickness is less than or equal to about 100 microns, measured on the rear surface; provides a resistance of less than or equal to about 0.012 ohms to current flowing in the second direction; is configured to provide flexibility at temperatures of about -40°C to about 85°C Over the temperature range, the non-uniform expansion in the second direction between the end silicon solar cell and the electrical interconnect is reconciled.

30. The super cell of clause 29, wherein the wire thickness of the flexible electrical interconnect is less than or equal to about 30 microns, measured perpendicular to the front and back surfaces of the end silicon solar cell.

31. The super cell of clause 29, wherein the flexible electrical interconnect extends beyond the super cell in the second direction to provide electrical interconnect to the super cell placed in a solar module Parallel and adjacent at least a second super cell.

32. The super cell of clause 29, wherein the flexible electrical interconnect extends beyond the super cell in the first direction to provide electrical interconnection in the solar module for a second super cell disposed in-line and parallel to the super cell .

33. A solar module comprising:

a plurality of super cells arranged in two or more parallel rows spanning a width of the module to form the front surface of the module, each super cell comprising a plurality of silicon solar cells arranged in line cells, wherein ends of adjacent silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series;

wherein at least one end of a first super cell in the first row adjacent to the edge of the module is electrically connected to one end of a second super cell in the second row adjacent the same edge of the module via a flexible electrical interconnect, the The flexible electrical interconnect has the following characteristics: is bonded to the front surface of the first super cell by a conductive adhesive bonding material at a plurality of discrete locations; extends parallel to the edge of the module; and at least a portion thereof is folded over all of the first super cell. around one end and therefore not visible from the front of the module.

34. The solar module of clause 33, wherein the surfaces of the flexible electrical interconnects on the front surface of the module are covered or dyed to reduce visual contrast with the super cells.

35. The solar module of clause 33, wherein the two or more parallel rows of super cells are arranged on a white back sheet forming a front surface of the solar module to be illuminated by solar radiation during operation of the solar module, the The white backplate includes parallel dark stripes whose positions and widths correspond to the positions and widths of the gaps between the parallel rows of super cells, and the white portion of the backplate is not visible through the gaps between the rows .

36. A method of making a solar cell string, the method comprising:

laser scribe one or more scribe lines on each of the one or more silicon solar cells, thereby defining a plurality of rectangular regions on the silicon solar cell;

applying a conductive adhesive bonding material to the one or more scribed silicon solar cells at one or more locations adjacent to the long sides of each rectangular area;

Dividing the silicon solar cells along the scribed lines to obtain a plurality of rectangular silicon solar cells, each rectangular silicon solar cell has a part of the conductive adhesive bonding material disposed on the front surface adjacent to the long side;

arranging a plurality of rectangular silicon solar cells in a straight line such that the long sides of adjacent rectangular silicon solar cells overlap in an overlapping manner with a portion of the conductive adhesive bonding material disposed therebetween; and

The conductive bonding material is cured to bond adjacent overlapping rectangular silicon solar cells to each other and electrically connect the cells in series.

37. A method of making a solar cell string, the method comprising:

One or more scribed lines are lasered on each of the one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells, each solar cell including a top surface and an opposing arrangement the bottom surface of the;

applying a conductive adhesive bonding material to portions of the top surface of the one or more silicon solar cells;

A vacuum is applied between the bottom surface of the one or more silicon solar cells and the curved support surface to bend the one or more silicon solar cells against the curved support surface, causing the one or more silicon solar cells to follow the engraving drawing and cutting, thus obtaining a plurality of rectangular silicon solar cells, each rectangular silicon solar cell has a part of the conductive adhesive bonding material disposed on the front surface adjacent to the long side;

arranging a plurality of rectangular silicon solar cells in a straight line such that the long sides of adjacent rectangular silicon solar cells overlap in an overlapping manner with a portion of the conductive adhesive bonding material disposed therebetween; and

The conductive bonding material is cured to bond adjacent overlapping rectangular silicon solar cells to each other and electrically connect the cells in series.

38. The method of clause 37, comprising applying a conductive adhesive bonding material to one or more silicon solar cells and then laser scribing one or more silicon solar cells on each of the one or more silicon solar cells engraved line.

39. The method of clause 37, comprising laser scribing one or more scribed lines on each of the one or more silicon solar cells and then applying a conductive adhesive bonding material to the one or more silicon solar cells on silicon solar cells.

40. A solar module comprising:

a plurality of super cells arranged in two or more parallel rows forming the front surface of the solar module, each super cell comprising a plurality of silicon solar cells arranged in a line with adjacent silicon solar cells The ends of the solar cells are overlapped and conductively bonded to each other to electrically connect the silicon solar cells in series, each super cell including a front surface end contact at one end of the super cell and an opposite pole at an opposite end of the super cell Sexual back surface terminal contacts;

wherein the first row of super cells includes first super cells arranged such that their front surface end contacts are adjacent and parallel to a first edge of the solar module, and the solar module includes a first flexible electrical interconnect, The first flexible electrical interconnect is elongated and has the following characteristics: extends parallel to the first edge of the solar module; conductively engages the front surface end contacts of the first super cell; occupies only the front surface of the solar module A narrower portion adjacent the first edge of the solar module; measured perpendicular to the first edge of the solar module, not more than about 1 cm wide.

41. The solar module of clause 40, wherein a portion of the first flexible electrical interconnect extends around the end of the first super cell closest to the first edge of the solar module and is located behind the first super cell.

42. The solar module of clause 40, wherein the first flexible interconnect includes a thin strip portion conductively bonded to a front surface end contact of the first super cell, and a thicker extending parallel to the first edge of the solar module part.

43. The solar module of clause 40, wherein the first flexible interconnect comprises a thin strip portion conductively bonded to the front surface end contact of the first super cell and extending parallel to a first edge of the solar module part of the winding belt.

44. The solar module of clause 40, wherein the second row of super cells comprises second super cells arranged such that their front surface end contacts are adjacent and parallel to the first edge of the solar module, and the first The front surface end contact of the super cell is electrically connected to the front surface end contact of the second super cell via the first flexible electrical interconnect.

45. The solar module of clause 40, wherein a back surface end contact of the first super cell is adjacent and parallel to a second edge of the solar module opposite the first edge of the solar module, the back surface end contact comprising a second flexible electrical an interconnect, the second flexible electrical interconnect being elongated and having the following characteristics: extending parallel to the second edge of the solar module; conductively bonded to the back surface end contact of the first super cell; and fully behind the super battery.

46. A solar module according to clause 45, wherein:

The second row of super cells includes second super cells arranged such that their front surface end contacts are adjacent and parallel to the first edge of the solar module and their back surface end contacts are adjacent and parallel to the solar module the second edge of the module;

the front surface end contact of the first super cell is electrically connected to the front surface end contact of the second super cell via the first flexible electrical interconnect; and

The back surface end contact of the first super cell is electrically connected to the back surface end contact of the second super cell via a second flexible electrical interconnect.

47. A solar module according to clause 40, comprising:

A second super cell arranged in series with the first super cell in the first row of super cells and with a back surface end contact of the second super cell adjacent to the opposite side of the first edge of the solar module the solar module second edge; and

A second flexible electrical interconnect that is elongated and has the following characteristics: extending parallel to the second edge of the solar module; conductively bonded to the back surface end contact of the first super cell point; and completely behind the super cell.

48. A solar module according to clause 47, wherein:

The second row of super cells includes a third super cell and a fourth super cell arranged in series, wherein the front surface end contact of the third super cell is adjacent to the first edge of the solar module and the back surface end contact of the fourth super cell is adjacent the second edge of the solar module; and

The front surface end contact of the first super cell is electrically connected to the front surface end contact of the third super cell via a first flexible electrical interconnect, and the back surface end contact of the second super cell is electrically connected via a second flexible electrical interconnect. The connector is electrically connected to the back surface end contacts of the fourth super cell.

49. The solar module of clause 40, wherein the super cells are arranged on a white back sheet comprising parallel dark stripes, the positions and widths of the dark stripes corresponding to the positions of the gaps between the parallel rows of super cells and width, and the white portion of the rear panel is not visible through the gaps between the rows.

50. The solar module of clause 40, wherein all portions of the first flexible electrical interconnect located on the front surface of the solar module are covered or dyed to reduce visual contrast with the super cell.

51. A solar module according to clause 40, wherein:

Each silicon solar cell includes:

Rectangular or substantially rectangular front and back surfaces, said surfaces having a shape defined by opposite and parallel first and second long sides and two opposite short sides, said front surface at least partially at exposure to solar radiation during operation of the solar cell string;

a conductive front surface metallization pattern disposed on the front surface and comprising a plurality of fingers extending perpendicular to the long side and a plurality of discrete front surface contact pads arranged in a row adjacent the first long side, each front surface contact pad electrically connected to at least one of the fingers; and

a conductive back surface metallization pattern disposed on the back surface and including a plurality of discrete back surface contact pads disposed in rows adjacent to the second long side; and

Within each super cell, the silicon solar cells are arranged in-line with first and second long sides of adjacent silicon solar cells overlapping and corresponding discrete front surface contact pads and discrete front surface contact pads on adjacent silicon solar cells The back surface contact pads are aligned, overlapped, and conductively bonded to each other by a conductive adhesive bonding material to electrically connect the silicon solar cells in series.

52. The solar module of clause 51, wherein the front surface metallization pattern of each silicon solar cell includes a plurality of thin wires electrically interconnecting adjacent discrete front surface contact pads, and each thin wire is more than perpendicular to the solar cell The discrete contact pad width is thinner as measured on the long side.

53. The solar module of clause 51, wherein the conductive adhesive bonding material is generally confined to the locations of the discrete front surface contact pads by features of the front surface metallization pattern, the features forming one of the adjacent discrete front surface contact pads or multiple barriers.

54. The solar module of clause 51, wherein the conductive adhesive bonding material is generally confined to the locations of the discrete back surface contact pads by features of the back surface metallization pattern that form one of the adjacent discrete back surface contact pads or multiple barriers.

55. A method of making a solar module, the method comprising:

Assembling a plurality of super cells, each super cell comprising a plurality of rectangular silicon solar cells arranged in a line, and the ends overlap in an overlapping manner on the long sides of the adjacent rectangular silicon solar cells;

Applying heat and pressure to the super cell cures the conductive bonding material disposed between the overlapping ends of adjacent rectangular silicon solar cells, thereby bonding adjacent overlapping rectangular silicon solar cells to each other and connecting the cells in series electrical connection;

Arranging and interconnecting the super cells as a layer stack with encapsulant in the desired solar module configuration; and

Heat and pressure are applied to the layer stack to form a laminate structure.

56. The method of clause 55, comprising curing or partially curing the electrically conductive bonding material by applying heat and pressure to a super cell prior to applying heat and pressure to the layer stack to form a laminate structure to form a cured or partially cured , as an intermediate product before forming a laminate structure.

57. The method of clause 56, wherein when each additional rectangular silicon solar cell is added to the super cell during assembly of the super cell, the conductive bonding between the newly added solar cell and the adjacent overlapping solar cell is made first The adhesive bonding material is cured or partially cured, and another rectangular silicon solar cell is added to the super cell.

58. The method of clause 56, comprising curing or partially curing all of the conductive bonding material in the super cell in the same step.

59. A method according to clause 56, comprising:

The electrically conductive bonding material is partially cured by applying heat and pressure to the super cell prior to applying heat and pressure to the layer stack to form the laminate to form a partially cured super cell as an intermediate product prior to forming the laminate ;as well as

Curing of the conductive bonding material is accomplished while heat and pressure are applied to the layer stack to form the laminate structure.

60. A method according to clause 55, comprising curing the conductive bonding material while applying heat and pressure to the layer stack to form the laminate without forming a cured or partially cured super cell as an intermediate product prior to forming the laminate .

61. The method of clause 55, comprising cutting the one or more silicon solar cells into a rectangular shape to provide rectangular silicon solar cells.

62. The method of clause 61, comprising applying a conductive adhesive bonding material to the one or more silicon solar cells prior to cutting the one or more silicon solar cells to provide a pre-applied conductive adhesive bonding material for rectangular silicon solar cells.

63. The method of clause 62, comprising applying a conductive adhesive bonding material to one or more silicon solar cells and then laser scribing a strip on each of the one or more silicon solar cells or lines, the one or more silicon solar cells are then cut along the scribed lines.

64. The method of clause 62, comprising laser scribing one or more lines on each of the one or more silicon solar cells and then applying a conductive adhesive bonding material to the one or more silicon solar cells On the plurality of silicon solar cells, the one or more silicon solar cells are then cut along the scribed lines.

65. The method of clause 62, wherein the conductive adhesive bonding material is applied to the top surface of each of the one or more silicon solar cells but not to the one or more silicon solar cells on oppositely disposed bottom surfaces of each of the cells, including applying a vacuum between the bottom surface of the one or more silicon solar cells and the curved support surface to allow the one or more silicon solar cells The one or more silicon solar cells are cut along a scribed line by bending against the curved support surface.

66. The method of clause 61, comprising applying a conductive adhesive bonding material to the rectangular silicon solar cells after cutting the one or more silicon solar cells to provide the rectangular silicon solar cells.

67. The method of clause 55, wherein the conductive adhesive bonding material has a glass transition temperature of less than or equal to about 0°C.

1A. A solar module comprising:

a plurality of super cells arranged in two or more parallel rows forming the front surface of the solar module, each super cell comprising a plurality of silicon solar cells arranged in a line with adjacent silicon solar cells The ends of the solar cells are overlapped and conductively bonded to each other to electrically connect the silicon solar cells in series, each super cell including a front surface end contact at one end of the super cell and an opposite pole at an opposite end of the super cell Sexual back surface terminal contacts;

wherein the first row of super cells includes first super cells arranged such that their front surface end contacts are adjacent and parallel to a first edge of the solar module, and the solar module includes a first flexible electrical interconnect, The first flexible electrical interconnect is elongated and has the following characteristics: extends parallel to the first edge of the solar module; conductively engages the front surface end contacts of the first super cell; occupies only the front surface of the solar module A narrower portion adjacent the first edge of the solar module; measured perpendicular to the first edge of the solar module, not more than about 1 cm wide.

2A. The solar module of clause 1A, wherein a portion of the first flexible electrical interconnect extends around the end of the first super cell closest to the first edge of the solar module and is located behind the first super cell.

3A. The solar module of clause 1A, wherein the first flexible interconnect includes a thin strip portion conductively bonded to a front surface end contact of the first super cell, and a thicker extending parallel to the first edge of the solar module part.

4A. The solar module of clause 1A, wherein the first flexible interconnect includes a thin strip portion that is conductively bonded to the front surface end contact of the first super cell and extends parallel to a first edge of the solar module part of the winding belt.

5A. The solar module of clause 1A, wherein the second row of super cells comprises second super cells arranged such that their front surface end contacts are adjacent and parallel to the first edge of the solar module, and the first The front surface end contact of the super cell is electrically connected to the front surface end contact of the second super cell via the first flexible electrical interconnect.

6A. The solar module of clause 1A, wherein a back surface end contact of the first super cell is adjacent and parallel to a second edge of the solar module opposite the first edge of the solar module, the back surface end contact comprising a second flexible electrical an interconnect, the second flexible electrical interconnect being elongated and having the following characteristics: extending parallel to the second edge of the solar module; conductively bonded to the back surface end contact of the first super cell; and fully behind the super battery.

7A. A solar module according to clause 6A, wherein:

The second row of super cells includes second super cells arranged such that their front surface end contacts are adjacent and parallel to the first edge of the solar module and their back surface end contacts are adjacent and parallel to the solar module the second edge of the module;

the front surface end contact of the first super cell is electrically connected to the front surface end contact of the second super cell via the first flexible electrical interconnect; and

The back surface end contact of the first super cell is electrically connected to the back surface end contact of the second super cell via a second flexible electrical interconnect.

8A. A solar module according to clause 1A, comprising:

A second super cell arranged in series with the first super cell in the first row of super cells and with a back surface end contact of the second super cell adjacent to the opposite side of the first edge of the solar module the solar module second edge; and

A second flexible electrical interconnect that is elongated and has the following characteristics: extending parallel to the second edge of the solar module; conductively bonded to the back surface end contact of the first super cell point; and completely behind the super cell.

9A. A solar module according to clause 8A, wherein:

The second row of super cells includes a third super cell and a fourth super cell arranged in series, wherein the front surface end contact of the third super cell is adjacent to the first edge of the solar module and the back surface end contact of the fourth super cell is adjacent the second edge of the solar module; and

The front surface end contact of the first super cell is electrically connected to the front surface end contact of the third super cell via a first flexible electrical interconnect, and the back surface end contact of the second super cell is electrically connected via a second flexible electrical interconnect. The connector is electrically connected to the back surface end contacts of the fourth super cell.

10A. The solar module of clause 1A, wherein remote from the outer edges of the solar module, there are no electrical interconnections between the super cells that would reduce the active area of the front surface of the module.

11A. The solar module of clause 1A, wherein at least one pair of super cells is arranged in line in a row, and the back surface contact end of one of the super cells of the pair is adjacent to the back surface contact end of the other super cell of the pair .

12A. A solar module according to clause 1A, wherein:

at least one pair of super cells are arranged in line in a row, and adjacent ends of the two super cells have end contacts of opposite polarities;

Adjacent ends of the pair of super cells overlap; and

The super cells of the pair are electrically connected in series by flexible interconnects, the first interconnect being sandwiched between overlapping ends of the super cells and not obscuring the front surface.

13A. The solar module of clause 1A, wherein the super cells are arranged on a white backing sheet, the white backing sheet comprising parallel dark stripes, the positions and widths of the dark stripes corresponding to the width of the gaps between the parallel rows of super cells position and width, and the white portion of the backing plate is not visible through the gaps between the rows.

14A. The solar module of clause 1A, wherein all portions of the first flexible electrical interconnect located on the front surface of the solar module are covered or dyed to reduce visual contrast with the super cell.

15A. A solar module according to clause 1A, wherein:

Each silicon solar cell includes:

Rectangular or substantially rectangular front and back surfaces, said surfaces having a shape defined by opposite and parallel first and second long sides and two opposite short sides, said front surface at least partially at exposure to solar radiation during operation of the solar cell string;

a conductive front surface metallization pattern disposed on the front surface and comprising a plurality of fingers extending perpendicular to the long side and a plurality of discrete front surface contact pads arranged in a row adjacent the first long side, each front surface contact pad electrically connected to at least one of the fingers; and

a conductive back surface metallization pattern disposed on the back surface and including a plurality of discrete back surface contact pads disposed in rows adjacent to the second long side; and

Within each super cell, the silicon solar cells are arranged in-line with first and second long sides of adjacent silicon solar cells overlapping and corresponding discrete front surface contact pads and discrete front surface contact pads on adjacent silicon solar cells The back surface contact pads are aligned, overlapped, and conductively bonded to each other by a conductive adhesive bonding material to electrically connect the silicon solar cells in series.

16A. The solar module of clause 15A, wherein the front surface metallization pattern of each silicon solar cell includes a plurality of thin wires electrically interconnecting adjacent discrete front surface contact pads, and each thin wire is more than perpendicular to the solar cell The discrete contact pad width is thinner as measured on the long side.

17A. The solar module of clause 15A, wherein the conductive adhesive bonding material is generally confined to the locations of the discrete front surface contact pads by features of the front surface metallization pattern formed around each discrete front surface contact pad barrier.

18A. The solar module of clause 15A, wherein the conductive adhesive bonding material is generally confined to the locations of the discrete back surface contact pads by features of the back surface metallization pattern formed around each discrete back surface contact pad barrier.

19A. The solar module of clause 15A, wherein the discrete back surface contact pads are discrete silver back surface contact pads, and in addition to the discrete silver back surface contact pads, the back surface metallization pattern of each silicon solar cell does not include Silver contacts at any location below a portion of the solar cell front surface that does not overlap an adjacent silicon solar cell.

20A. A solar module comprising:

a plurality of super cells, each super cell comprising a plurality of silicon solar cells arranged in line, wherein ends of adjacent silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series;

Each of these silicon solar cells includes:

Rectangular or substantially rectangular front and back surfaces, said surfaces having a shape defined by opposite and parallel first and second long sides and two opposite short sides, said front surface at least partially at exposure to solar radiation during operation of the solar cell string;

a conductive front surface metallization pattern disposed on the front surface and including a plurality of fingers extending perpendicular to the long side and a plurality of discrete front surface contact pads arranged in a row adjacent the first long side;

each front surface contact pad electrically connected to at least one of the fingers; and a conductive back surface metallization pattern disposed on the back surface and comprising a plurality of arranged in a row adjacent the second long side Discrete back surface contact pads;

wherein within each super cell, the silicon solar cells are arranged in a line with first and second long sides of adjacent silicon solar cells overlapping and corresponding discrete front surface contact pads on adjacent silicon solar cells and The discrete back surface contact pads are aligned, overlapped, and conductively bonded to each other by a conductive adhesive bonding material to electrically connect the silicon solar cells in series. as well as

Where the super cells are arranged in a single row or two or more parallel rows substantially spanning the length or width of the solar module, forming the front surface of the solar module that will be illuminated by solar radiation during operation of the solar module.

21A. The solar module of clause 20A, wherein the discrete back surface contact pads are discrete silver back surface contact pads, and in addition to the discrete silver back surface contact pads, the back surface metallization pattern of each silicon solar cell does not include Silver contacts at any location below a portion of the solar cell front surface that does not overlap an adjacent silicon solar cell.

22A. The solar module of clause 20A, wherein the front surface metallization pattern of each silicon solar cell includes a plurality of thin wires electrically interconnecting adjacent discrete front surface contact pads, and each thin wire is more than perpendicular to the solar cell The discrete contact pad width is thinner as measured on the long side.

23A. The solar module of clause 20A, wherein the conductive adhesive bonding material is generally confined to the locations of the discrete front surface contact pads by features of the front surface metallization pattern formed around each discrete front surface contact pad barrier.

24A. The solar module of clause 20A, wherein the conductive adhesive bonding material is generally confined to the locations of the discrete back surface contact pads by features of the back surface metallization pattern formed around each discrete back surface contact pad barrier.

25A. A super battery comprising:

Multiple silicon solar cells, each silicon solar cell including:

Rectangular or substantially rectangular front and back surfaces, said surfaces having a shape defined by opposite and parallel first and second long sides and two opposite short sides, said front surface at least partially at exposure to solar radiation during operation of the solar cell string;

a conductive front surface metallization pattern disposed on the front surface and comprising a plurality of fingers extending perpendicular to the long side and a plurality of discrete front surface contact pads arranged in a row adjacent the first long side, each front surface contact pad electrically connected to at least one of the fingers; and

a conductive back surface metallization pattern disposed on the back surface and including a plurality of discrete silver back surface contact pads disposed in rows adjacent to the second long side;

wherein the silicon solar cells are arranged in a straight line, wherein first and second long sides of adjacent silicon solar cells overlap, and corresponding discrete front surface contact pads and discrete back surface contact pads on adjacent silicon solar cells face each other are aligned, overlapped and conductively bonded to each other by a conductive adhesive bonding material to electrically connect the silicon solar cells in series.

26A. The solar module of clause 25A, wherein the discrete back surface contact pads are discrete silver back surface contact pads, and in addition to the discrete silver back surface contact pads, the back surface metallization pattern of each silicon solar cell does not include Silver contacts at any location below a portion of the solar cell front surface that does not overlap an adjacent silicon solar cell.

27A. The solar cell string of clause 25A, wherein the front surface metallization pattern includes a plurality of thin wires electrically interconnecting adjacent discrete front surface contact pads, and wherein the ratio of each thin wire is measured perpendicular to a long side of the solar cell The discrete contact pad width is thinner.

28A. The solar cell string of clause 25A, wherein the conductive adhesive bonding material is generally confined to the locations of the discrete front surface contact pads by features of the front surface metallization pattern that form contacts around each discrete front surface Pad barrier.

29A. The solar cell string of clause 25A, wherein the conductive adhesive bonding material is generally confined to the locations of the discrete back surface contact pads by features of the back surface metallization pattern that form contacts around each discrete back surface Pad barrier.

30A. The solar cell string of clause 25A, wherein the conductive adhesive bonding material has a glass transition temperature of less than or equal to about 0°C.

31A. A method of making a solar module, the method comprising:

Assembling a plurality of super cells, each super cell comprising a plurality of rectangular silicon solar cells arranged in a line, and the ends overlap in an overlapping manner on the long sides of the adjacent rectangular silicon solar cells;

Applying heat and pressure to the super cell cures the conductive bonding material disposed between the overlapping ends of adjacent rectangular silicon solar cells, thereby bonding adjacent overlapping rectangular silicon solar cells to each other and connecting the cells in series electrical connection;

Arranging and interconnecting the super cells as a layer stack with encapsulant in the desired solar module configuration; and

Heat and pressure are applied to the layer stack to form a laminate structure.

32A. A method according to clause 31A, comprising curing or partially curing the conductive bonding material by applying heat and pressure to a super cell prior to applying heat and pressure to the layer stack to form a laminate structure, thereby forming a cured or partially cured , as an intermediate product before forming a laminate structure.

33A. The method of clause 32A, wherein when each additional rectangular silicon solar cell is added to the super cell during assembly of the super cell, a conductive bond between the newly added solar cell and the adjacent overlapping solar cell is made first The adhesive bonding material is cured or partially cured, and another rectangular silicon solar cell is added to the super cell.

34A. A method according to clause 32A, comprising curing or partially curing all of the conductive bonding material in the super cell in the same step.

35A. A method according to clause 32A, comprising:

The electrically conductive bonding material is partially cured by applying heat and pressure to the super cell prior to applying heat and pressure to the layer stack to form the laminate to form a partially cured super cell as an intermediate product prior to forming the laminate ;as well as

Curing of the conductive bonding material is accomplished while heat and pressure are applied to the layer stack to form the laminate structure.

36A. A method according to clause 31A, comprising curing the conductive bonding material while applying heat and pressure to the layer stack to form the laminate without forming a cured or partially cured super cell as an intermediate product prior to forming the laminate .

37A. The method of clause 31A, comprising cutting one or more silicon solar cells into a rectangular shape to provide rectangular silicon solar cells.

38A. The method of clause 37A, comprising applying a conductive adhesive bonding material to the one or more silicon solar cells prior to cutting the one or more silicon solar cells to provide a pre-applied conductive adhesive bonding material for rectangular silicon solar cells.

39A. The method of clause 38A, comprising applying a conductive adhesive bonding material to one or more silicon solar cells and then laser scribing a line across each of the one or more silicon solar cells or lines, the one or more silicon solar cells are then cut along the scribed lines.

40A. The method of clause 38A, comprising laser scribing one or more lines on each of the one or more silicon solar cells and then applying a conductive adhesive bonding material to the one or more silicon solar cells On the plurality of silicon solar cells, the one or more silicon solar cells are then cut along the scribed lines.

41A. The method of clause 38A, wherein the conductive adhesive bonding material is applied to the top surface of each of the one or more silicon solar cells and not to the one or more silicon solar cells on oppositely disposed bottom surfaces of each of the cells, including applying a vacuum between the bottom surface of the one or more silicon solar cells and the curved support surface to allow the one or more silicon solar cells The one or more silicon solar cells are cut along a scribed line by bending against the curved support surface.

42A. The method of clause 37A, comprising applying a conductive adhesive bonding material to the rectangular silicon solar cells after cutting the one or more silicon solar cells to provide the rectangular silicon solar cells.

43A. The method of clause 31A, wherein the conductive adhesive bonding material has a glass transition temperature of less than or equal to about 0°C.

44A. A method of making a solar cell, the method comprising:

Laser scribe one or more scribed lines on each of the one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cell; in one or more adjacent long sides of each rectangular region multiple locations for applying a conductive adhesive bonding material to one or more of the scribed silicon solar cells;

Dividing the silicon solar cells along the scribed lines to obtain a plurality of rectangular silicon solar cells, each rectangular silicon solar cell has a part of the conductive adhesive bonding material disposed on the front surface adjacent to the long side;

arranging a plurality of rectangular silicon solar cells in a straight line such that the long sides of adjacent rectangular silicon solar cells overlap in an overlapping manner with a portion of the conductive adhesive bonding material disposed therebetween; and

The conductive bonding material is cured to bond adjacent overlapping rectangular silicon solar cells to each other and electrically connect the cells in series.

45A. A method of making a solar cell, the method comprising:

One or more scribed lines are lasered on each of the one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells, each solar cell including a top surface and an opposing arrangement the bottom surface of the;

applying a conductive adhesive bonding material to portions of the top surface of the one or more silicon solar cells;

A vacuum is applied between the bottom surface of the one or more silicon solar cells and the curved support surface to bend the one or more silicon solar cells against the curved support surface, causing the one or more silicon solar cells to follow the engraving drawing and cutting, thus obtaining a plurality of rectangular silicon solar cells, each rectangular silicon solar cell has a part of the conductive adhesive bonding material disposed on the front surface adjacent to the long side;

arranging a plurality of rectangular silicon solar cells in a straight line such that the long sides of adjacent rectangular silicon solar cells overlap in an overlapping manner with a portion of the conductive adhesive bonding material disposed therebetween; and

The conductive bonding material is cured to bond adjacent overlapping rectangular silicon solar cells to each other and electrically connect the cells in series.

46A. A method of making a solar cell, the method comprising:

cutting one or more pseudo-square silicon wafers along a plurality of lines parallel to the long edges of each wafer to form a plurality of rectangular silicon solar cells, wherein each silicon solar cell has a substantially equal length along its long axis; as well as

arranging the rectangular silicon solar cells in a straight line such that the long sides of adjacent solar cells overlap and are conductively bonded to each other, thereby electrically connecting the solar cells in series;

wherein the plurality of rectangular silicon solar cells includes: at least one rectangular solar cell having two chamfers, the chamfers corresponding to a corner or a portion of a corner of a pseudo-square wafer; and one or more rectangles each lacking a chamfer Silicon solar cells. as well as

wherein by making the width perpendicular to the long axis of the rectangular silicon solar cell including the chamfer greater than the width perpendicular to the long axis of the rectangular silicon solar cell lacking the chamfer, the spacing between parallel lines along which the pseudo-square wafer is cut is aligned The selection is made to compensate for the chamfer; thus, the front surface of each of the plurality of rectangular silicon solar cells in the solar cell string has substantially equal areas exposed to sunlight during operation of the solar cell string.

47A. A super battery comprising:

a plurality of silicon solar cells arranged in line, wherein ends of adjacent solar cells overlap and are conductively bonded to each other, thereby electrically connecting the solar cells in series;

wherein at least one silicon solar cell has a chamfer corresponding to a corner or a portion of a corner of the pseudo-square silicon wafer from which the silicon solar cell is cut; at least one silicon solar cell lacks a chamfer; during operation of the solar cell string, The area of the front surface of each silicon solar cell exposed to sunlight is substantially equal.

48A. A method of making two or more super cells, the method comprising:

One or more pseudo-square silicon wafers are cut along lines parallel to the long edges of each wafer to form a first plurality of rectangular silicon solar cells having chamfers and a second plurality of rectangular silicon lacking chamfers A solar cell, wherein the chamfer corresponds to a corner or a portion of a corner of a pseudo-square silicon wafer, each of the second plurality of rectangular silicon solar cells has a first length that spans equal to The full width of a quasi-square silicon wafer;

The chamfers are removed from each of the first plurality of rectangular silicon solar cells to form a third plurality of rectangular silicon solar cells lacking the chamfers, each of the third plurality of rectangular silicon solar cells being has a second length shorter than the first length;

arranging a second plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and electrically connecting the second plurality of rectangular silicon solar cells in series, thereby forming a width a string of solar cells equal to the first length; and

A third plurality of rectangular silicon solar cells are arranged in a line such that long sides of adjacent rectangular silicon solar cells overlap and are conductively bonded to each other, and the third plurality of rectangular silicon solar cells are electrically connected in series, thereby forming a width equal to the second length of the solar cell string.

49A. A method of making two or more super cells, the method comprising:

One or more pseudo-square silicon wafers are cut along lines parallel to the long edges of each wafer to form a first plurality of rectangular silicon solar cells having chamfers and a second plurality of rectangular silicon lacking chamfers A solar cell, wherein the chamfer corresponds to a corner or a portion of a corner of a pseudo-square silicon wafer;

arranging the first plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, electrically connecting the first plurality of rectangular silicon solar cells in series; and

The second plurality of rectangular silicon solar cells are arranged in line with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and the second plurality of rectangular silicon solar cells are electrically connected in series.

50A. A solar module comprising:

A string of N > 25 rectangular or substantially rectangular solar cells connected in series, said solar cells having an average breakdown voltage greater than about 10 volts, assembled into one or more super cells, each super cell each comprising two or more solar cells arranged in line, wherein the long sides of adjacent solar cells overlap and are conductively bonded to each other with an adhesive that is both electrically and thermally conductive;

Wherein in the solar cell string, no single solar cell or a total number of solar cell groups less than N are individually electrically connected in parallel with the bypass diodes.

51A. The solar module of clause 50A, wherein N is greater than or equal to 30.

52A. The solar module of clause 50A, wherein N is greater than or equal to 50.

53A. The solar module of clause 50A, wherein N is greater than or equal to 100.

54A. The solar module of clause 50A, wherein the adhesive forms a bond between adjacent solar cells that has a thickness of less than or equal to about 0.1 mm in a direction perpendicular to the solar cells and a thickness perpendicular to the solar cells of less than or equal to about 0.1 mm The thermal conductivity is greater than or equal to about 1.5w/m/k.

55A. The solar module of clause 50A, wherein the N solar cells are aggregated into a single super cell.

56A. The solar module of clause 50A, wherein the solar cell is a silicon solar cell.

57A. A solar module comprising:

a super cell spanning substantially the entire length or width of the solar module parallel to the edges of the solar module, the super cell comprising N rectangular or substantially rectangular strings of solar cells connected in series, the solar cells having an average breakdown voltage greater than about 10 volts, the solar cells being arranged in a straight line wherein the long sides of adjacent solar cells overlap and are conductively bonded to each other with an adhesive that is both electrically and thermally conductive;

Wherein in the super cell, no single solar cell or a total number of solar cell groups less than N are individually electrically connected in parallel with bypass diodes.

58A. The solar module of clause 57A, wherein N>24.

59A. The solar module of clause 57A, wherein the super cell has a length in the direction of current flow of at least about 500 mm.

60A. A super battery comprising:

Multiple silicon solar cells, each silicon solar cell including:

Rectangular or substantially rectangular front and back surfaces, said surfaces having a shape defined by opposite and parallel first and second long sides and two opposite short sides, said front surface at least partially at exposure to solar radiation during operation of the solar cell string;

a conductive front surface metallization pattern disposed on the front surface and including at least one front surface contact pad disposed adjacent the first long side; and

a conductive back surface metallization pattern disposed on the back surface and including at least one back surface contact pad disposed adjacent the second long side;

wherein the silicon solar cells are arranged in a straight line, the first and second long sides of adjacent silicon solar cells overlap, and the front surface contact pads and the back surface contact pads on the adjacent silicon solar cells overlap and are bonded by a conductive adhesive The mixture bonding materials are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series. as well as

wherein the front surface metallization pattern of each silicon solar cell includes a barrier configured to substantially confine the conductive adhesive bonding material to at least the conductive adhesive bonding material prior to curing of the conductive adhesive bonding material during fabrication of the super cell A front surface contact pad.

61A. The super cell of clause 60A, wherein for each pair of adjacent and overlapping silicon solar cells, the barrier on the front surface of one of the silicon solar cells is connected to a portion of the other silicon solar cell Overlapped and hidden by the portion, during manufacture of the super cell, the conductive adhesive bonding material is generally confined to the overlapping area of the front surface of the silicon solar cell before the conductive adhesive bonding material is cured.

62A. The super cell of clause 60A, wherein the barrier comprises a continuous conductive line parallel to the first long side and running substantially the entire length of the first long side, wherein the at least one front surface The contact pad is located between the continuous conductive line and the first long side of the solar cell.

63A. The super cell of clause 62A, wherein the front surface metallization pattern includes fingers electrically connected to the at least one front surface contact pad and running perpendicular to the first long side and being continuous Conductive lines electrically interconnect the fingers to provide multiple conductive paths from each finger to the at least one front surface contact pad.

64A. The super cell of clause 60A, wherein the front surface metallization pattern includes a plurality of discrete contact pads arranged in a row adjacent and parallel to the first long side, and the barrier includes a plurality of discrete contact pads forming a separate barrier for each discrete contact pad features that generally confine the conductive adhesive bonding material to discrete contact pads prior to curing the conductive adhesive bonding material during fabrication of the super cell.

65A. The super cell of clause 64A, wherein the individual barriers abut and are higher than corresponding discrete contact pads.

66A. A super battery comprising:

Multiple silicon solar cells, each silicon solar cell including:

Rectangular or substantially rectangular front and back surfaces, said surfaces having a shape defined by opposite and parallel first and second long sides and two opposite short sides, said front surface at least partially at exposure to solar radiation during operation of the solar cell string;

a conductive front surface metallization pattern disposed on the front surface and including at least one front surface contact pad disposed adjacent the first long side; and

a conductive back surface metallization pattern disposed on the back surface and including at least one back surface contact pad disposed adjacent the second long side;

wherein the silicon solar cells are arranged in a straight line, the first and second long sides of adjacent silicon solar cells overlap, and the front surface contact pads and the back surface contact pads on the adjacent silicon solar cells overlap and are bonded by a conductive adhesive The mixture bonding materials are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series. as well as

wherein the back surface metallization pattern of each silicon solar cell includes a barrier configured to substantially confine the conductive adhesive bonding material to at least the conductive adhesive bonding material prior to curing of the conductive adhesive bonding material during fabrication of the super cell A back surface contact pad.

67A. The super cell of clause 66A, wherein the back surface metallization pattern includes one or more discrete contact pads arranged in a row adjacent and parallel to the second long side, and the barrier includes forming a separate barrier for each discrete contact pad features that generally confine the conductive bonding material to discrete contact pads prior to curing the conductive adhesive bonding material during fabrication of the super cell.

68A. The super cell of clause 67A, wherein the individual barriers abut and are higher than corresponding discrete contact pads.

69A. A method of making a solar cell string, the method comprising:

cutting one or more pseudo-square silicon wafers along a plurality of lines parallel to the long edges of each wafer to form a plurality of rectangular silicon solar cells, wherein each silicon solar cell has a substantially equal length along its long axis; as well as

arranging the rectangular silicon solar cells in a straight line such that the long sides of adjacent solar cells overlap and are conductively bonded to each other, thereby electrically connecting the solar cells in series;

wherein the plurality of rectangular silicon solar cells includes: at least one rectangular solar cell having two chamfers, the chamfers corresponding to a corner or a portion of a corner of a pseudo-square wafer; and one or more rectangles each lacking a chamfer Silicon solar cells. as well as

wherein by making the width perpendicular to the long axis of the rectangular silicon solar cell including the chamfer greater than the width perpendicular to the long axis of the rectangular silicon solar cell lacking the chamfer, the spacing between parallel lines along which the pseudo-square wafer is cut is aligned The selection is made to compensate for the chamfer; thus, the front surface of each of the plurality of rectangular silicon solar cells in the solar cell string has substantially equal areas exposed to sunlight during operation of the solar cell string.

70A. A solar cell string, comprising:

a plurality of silicon solar cells arranged in line, wherein ends of adjacent solar cells overlap and are conductively bonded to each other, thereby electrically connecting the solar cells in series;

wherein at least one silicon solar cell has a chamfer corresponding to a corner or a portion of a corner of the pseudo-square silicon wafer from which the silicon solar cell is cut; at least one silicon solar cell lacks a chamfer; during operation of the solar cell string, The area of the front surface of each silicon solar cell exposed to sunlight is substantially equal.

71A. A method of making two or more solar cell strings, the method comprising:

One or more pseudo-square silicon wafers are cut along lines parallel to the long edges of each wafer to form a first plurality of rectangular silicon solar cells having chamfers and a second plurality of rectangular silicon lacking chamfers A solar cell, wherein the chamfer corresponds to a corner or a portion of a corner of a pseudo-square silicon wafer, each of the second plurality of rectangular silicon solar cells has a first length that spans equal to The full width of a quasi-square silicon wafer;

The chamfers are removed from each of the first plurality of rectangular silicon solar cells to form a third plurality of rectangular silicon solar cells lacking the chamfers, each of the third plurality of rectangular silicon solar cells being has a second length shorter than the first length;

arranging a second plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and electrically connecting the second plurality of rectangular silicon solar cells in series, thereby forming a width a string of solar cells equal to the first length; and

A third plurality of rectangular silicon solar cells are arranged in a line such that long sides of adjacent rectangular silicon solar cells overlap and are conductively bonded to each other, and the third plurality of rectangular silicon solar cells are electrically connected in series, thereby forming a width equal to the second length of the solar cell string.

72A. A method of making two or more solar cell strings, the method comprising:

One or more pseudo-square silicon wafers are cut along lines parallel to the long edges of each wafer to form a first plurality of rectangular silicon solar cells having chamfers and a second plurality of rectangular silicon lacking chamfers A solar cell, wherein the chamfer corresponds to a corner or a portion of a corner of a pseudo-square silicon wafer;

arranging the first plurality of rectangular silicon solar cells in line with long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, electrically connecting the first plurality of rectangular silicon solar cells in series; and

The second plurality of rectangular silicon solar cells are arranged in line with the long sides of adjacent rectangular silicon solar cells overlapping and conductively bonded to each other, and the second plurality of rectangular silicon solar cells are electrically connected in series.

73A. A method of making a solar module, the method comprising:

Cutting each of the one or more pseudo-square silicon wafers along a plurality of lines parallel to the long edges of the wafer to form a plurality of rectangular silicon solar cells with chamfered corners from the plurality of pseudo-square silicon wafers, and lacking a plurality of rectangular silicon solar cells with chamfered corners, wherein the chamfered corners correspond to corners of a pseudo-square silicon wafer;

Arranging at least some of the rectangular silicon solar cells lacking chamfers to form a first plurality of super cells, each super cell comprising only rectangular silicon solar cells lacking chamfers arranged in line, wherein the rectangular silicon solar cells have a length of the sides overlap and are conductively bonded to each other to electrically connect the silicon solar cells in series;

arranging at least some of the rectangular silicon solar cells with chamfered corners to form a second plurality of super cells, each super cell including only rectangular silicon solar cells with chamfered corners arranged in a straight line, wherein the length of the rectangular silicon solar cells is the sides overlap and are conductively bonded to each other to electrically connect the silicon solar cells in series; and

Arranging the super cells in parallel rows of super cells of substantially equal length forming the front surface of the solar module, wherein each row includes only super cells of the first plurality of super cells or only super cells of the second plurality of super cells super battery.

74A. The solar module of clause 73A, wherein two of the rows of super cells adjacent parallel opposite edges of the solar module include only super cells of the second plurality, and all other rows of super cells include only the first plurality Super cells in super cells.

75A. The solar module of clause 74A, wherein the solar module includes a total of six rows of super cells.

76A. A super battery comprising:

a plurality of silicon solar cells arranged in line in the first direction, wherein ends of adjacent silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series; and

An elongated flexible electrical interconnect having a long axis oriented parallel to a second direction perpendicular to the first direction, the elongated flexible electrical interconnect having the following characteristics:

conductively bonded to the front or back surface of the end one silicon solar cell at three or more discrete locations arranged along the second direction; extending at least the full width of the end solar cell in the second direction; vertical Has a wire thickness of less than or equal to about 100 microns, measured on the front or back surface of the end silicon solar cell; provides a resistance of less than or equal to about 0.012 ohms to current flowing in the second direction; is configured to provide flexibility in The non-uniform expansion in the second direction between the end silicon solar cell and the electrical interconnect is accommodated in a temperature range of about -40°C to about 85°C.

77A. The super cell of clause 76A, wherein the wire thickness of the flexible electrical interconnect is less than or equal to about 30 microns measured perpendicular to the front and back surfaces of the end silicon solar cell.

78A. The super cell of clause 76A, wherein the flexible electrical interconnect extends beyond the super cell in the second direction to provide electrical interconnection in the solar module for at least a second super cell disposed in parallel adjacent to the super cell.

79A. The super cell of clause 76A, wherein the flexible electrical interconnect extends beyond the super cell in the first direction to provide electrical interconnection in the solar module for a second super cell disposed in-line and parallel to the super cell .

80A. A solar module comprising:

a plurality of super cells arranged in two or more parallel rows spanning a width of the module to form the front surface of the module, each super cell comprising a plurality of silicon solar cells arranged in line cells, wherein ends of adjacent silicon solar cells overlap and are conductively bonded to each other, thereby electrically connecting the silicon solar cells in series;

wherein at least one end of a first super cell in the first row adjacent to the edge of the module is electrically connected to one end of a second super cell in the second row adjacent the same edge of the module via a flexible electrical interconnect, the The flexible electrical interconnect has the following characteristics: is bonded to the front surface of the first super cell by a conductive adhesive bonding material at a plurality of discrete locations; extends parallel to the edge of the module; and at least a portion thereof is folded over all of the first super cell. around one end and therefore not visible from the front of the module.

81A. The solar module of clause 80A, wherein the surfaces of the flexible electrical interconnects on the front surface of the module are covered or dyed to reduce visual contrast with the super cells.

82A. The solar module of clause 80A, wherein the two or more parallel rows of super cells are arranged on a white backing sheet forming a front surface of the solar module to be illuminated by solar radiation during operation of the solar module, so The white backing plate includes parallel dark stripes whose positions and widths correspond to the positions and widths of the gaps between the parallel rows of super cells, and the white portion of the backing plate passes through the spaces between the rows. Gap is not visible.

83A. A method of making a solar cell string, the method comprising:

laser scribe one or more scribe lines on each of the one or more silicon solar cells, thereby defining a plurality of rectangular regions on the silicon solar cell;

applying a conductive adhesive bonding material to the one or more scribed silicon solar cells at one or more locations adjacent to the long sides of each rectangular area;

Dividing the silicon solar cells along the scribed lines to obtain a plurality of rectangular silicon solar cells, each rectangular silicon solar cell has a part of the conductive adhesive bonding material disposed on the front surface adjacent to the long side;

arranging a plurality of rectangular silicon solar cells in a straight line such that the long sides of adjacent rectangular silicon solar cells overlap in an overlapping manner with a portion of the conductive adhesive bonding material disposed therebetween; and

The conductive bonding material is cured to bond adjacent overlapping rectangular silicon solar cells to each other and electrically connect the cells in series.

84A. A method of making a solar cell string, the method comprising:

One or more scribed lines are lasered on each of the one or more silicon solar cells to define a plurality of rectangular regions on the silicon solar cells, each solar cell including a top surface and an opposing arrangement the bottom surface of the;

applying a conductive adhesive bonding material to portions of the top surface of the one or more silicon solar cells;

A vacuum is applied between the bottom surface of the one or more silicon solar cells and the curved support surface to bend the one or more silicon solar cells against the curved support surface, causing the one or more silicon solar cells to follow the engraving drawing and cutting, thus obtaining a plurality of rectangular silicon solar cells, each rectangular silicon solar cell has a part of the conductive adhesive bonding material disposed on the front surface adjacent to the long side;

arranging a plurality of rectangular silicon solar cells in a straight line such that the long sides of adjacent rectangular silicon solar cells overlap in an overlapping manner with a portion of the conductive adhesive bonding material disposed therebetween; and

The conductive bonding material is cured to bond adjacent overlapping rectangular silicon solar cells to each other and electrically connect the cells in series.

85A. A method according to clause 84A, comprising applying a conductive adhesive bonding material to one or more silicon solar cells and then laser scribing one or more silicon solar cells on each of the one or more silicon solar cells engraved line.

86A. The method of clause 84A, comprising laser scribing one or more scribed lines on each of the one or more silicon solar cells and then applying a conductive adhesive bonding material to the one or more silicon solar cells on silicon solar cells.

1B. A device comprising:

a string of at least 25 solar cells connected in series connected in parallel with a common bypass diode, each solar cell having a breakdown voltage greater than about 10 volts and assembled into a super cell comprising said solar cell, The solar cells are arranged such that the long sides of adjacent solar cells overlap and are conductively joined by an adhesive.

2B. The apparatus of clause 1B, wherein N is greater than or equal to 30.

3B. The apparatus of clause 1B, wherein N is greater than or equal to 50.

4B. The apparatus of clause 1B, wherein N is greater than or equal to 100.

5B. The apparatus of clause 1B, wherein the adhesive has a thickness of less than or equal to about 0.1 mm and a thermal conductivity of greater than or equal to about 1.5 W/m/K.

6B. The apparatus of clause IB, wherein the N solar cells are assembled into a single super cell.

7B. The apparatus of clause IB, wherein the N solar cells are aggregated into a plurality of super cells on the same backing.

8B. The apparatus of clause IB, wherein the solar cell is a silicon solar cell.

9B. The apparatus of clause IB, wherein the super cell has a length in the direction of current flow of at least about 500 mm.

10B. The device of clause 1B, wherein the super cell includes features configured to limit adhesive spread.

11B. The apparatus of clause 10B, wherein the features comprise raised features.

12B. The apparatus of clause 10B, wherein the feature comprises metallization.

13B. The apparatus of clause 12B, wherein the metallization comprises a wire extending the full length of the first long side, the apparatus further comprising at least one contact pad between the wire and the first long side.

14B. Apparatus according to clause 13B, wherein:

The metallization also includes fingers electrically connected to the at least one contact pad and extending perpendicular to the first long side; and

Conductive lines interconnect the fingers.

15B. The apparatus of clause 10B, wherein the feature is located on a front side of the solar cell.

16B. The apparatus of clause 10B, wherein the feature is located on the backside of the solar cell.

17B. The apparatus of clause 10B, wherein the feature comprises a recessed feature.

18B. The apparatus of clause 10B, wherein the feature is hidden by an adjacent solar cell of the super cell.

19B. The apparatus of clause 1B, wherein a first solar cell of the super cell has a chamfer, a second solar cell of the super cell lacks a chamfer, and the first solar cell and the second solar cell are exposed The area under sunlight is the same.

20B. The apparatus of clause 1B, further comprising a flexible electrical interconnect having a long axis parallel to a second direction perpendicular to the first direction, the flexible electrical interconnect conducting Bonds to the surface of the solar cell and modulates the thermal expansion of the solar cell in two dimensions.

21B. The apparatus of clause 20B, wherein the flexible electrical interconnect has a thickness of less than or equal to about 100 microns to provide a resistance of less than or equal to about 0.012 ohms.

22B. The apparatus of clause 20B, wherein the surface comprises a back surface.

23B. The apparatus of clause 20B, wherein the flexible electrical interconnect contacts another super cell.

24B. The apparatus of clause 23B, wherein the other super cell is in line with the super cell.

25B. The apparatus of clause 23B, wherein the other super cell is adjacent to the super cell.

26B. The apparatus of clause 20B, wherein the first portion of the interconnect is folded around an edge of the super cell such that the remaining second interconnect portion is on the backside of the super cell.

27B. The apparatus of clause 20B, wherein the flexible electrical interconnect is electrically connected to a bypass diode.

28B. The apparatus of clause 1B, wherein the plurality of super cells are arranged in two or more parallel rows on a backing sheet forming a solar module front surface, wherein the backing sheet is white and includes dark stripes, The positions and widths of the dark stripes correspond to the gaps between the super cells.

29B. The apparatus of clause 1B, wherein the super battery includes at least one pair of battery strings connected to a power management system.

30B. The apparatus of clause 1B, further comprising a power management device in electrical communication with the super battery and configured to:

Receive the voltage output of the super battery;

based on the voltage, determining whether the solar cell is in reverse bias; and

Disconnect reverse biased solar cells from the super cell module circuit.

31B. The apparatus of clause 1B, wherein the super cells are disposed on the first liner to form a first module having a top conductive tape on the first side facing the solar direction, the apparatus further comprising:

another super cell disposed on the second liner to form a second module, the different module having a bottom strip on a second side facing a direction away from the solar direction,

wherein the second module overlaps and is joined to a portion of the first module including the top strap.

32B. The apparatus of clause 31B, wherein the second module is bonded to the first module by an adhesive.

33B. The apparatus of clause 31B, wherein the second module is joined to the first module by a mating arrangement.

34B. The apparatus of clause 31B, further comprising a junction box overlapping the second module.

35B. The apparatus of clause 34B, wherein the second module is joined to the first module by a mating arrangement.

36B. The apparatus of clause 35B, wherein the mating arrangement is between the junction box and another junction box on the second module.

37B. The apparatus of clause 31B, wherein the first liner comprises glass.

38B. The apparatus of clause 31B, wherein the first liner comprises non-glass.

39B. The apparatus of clause IB, wherein the solar cell includes a chamfered portion cut from a larger piece.

40B. The apparatus of clause 39B, wherein the super cell further comprises another solar cell having a chamfered portion, wherein a long side of the solar cell is in electrical contact with a long side of the other solar cell of similar length.

1C1. A method that includes:

A super cell comprising a string of at least N ≥ 25 solar cells connected in series, each solar cell having a breakdown voltage greater than about 10 volts, is formed on the same pad and arranged such that the long sides of adjacent solar cells overlap and conductively engaged with the adhesive; and

Connect each super cell with at most a single bypass diode.

2C1. The method of clause 1C1 , wherein N is greater than or equal to 30.

3C1. The method of clause 1C1, wherein N is greater than or equal to 50.

4C1. The method of clause 1C1, wherein N is greater than or equal to 100.

5C1. The method of clause 1C1, wherein the adhesive has a thickness of less than or equal to about 0.1 mm and a thermal conductivity of greater than or equal to about 1.5 w/m/k.

6C1. The method of clause 1C1, wherein the solar cell is a silicon solar cell.

7C1. The method of clause 1C1, wherein the super cell has a length in the direction of current flow of at least about 500 mm.

8C1. The method of clause 1C1, wherein a first solar cell of the super cell has a chamfer, a second solar cell of the super cell lacks a chamfer, and the first solar cell and the second solar cell are exposed The same area under sunlight.

9C1. The method of clause 1C1, further comprising using features of the solar cell surface to limit the spread of the adhesive.

10C1. The method of clause 9C1, wherein the features comprise raised features.

11C1. The method of clause 9C1, wherein the feature comprises metallization.

12C1. The method of clause 11C1, wherein the metallization comprises a line extending the full length of the first long side, at least one contact pad between the line and the first long side.

13C1. A method according to clause 12C1, wherein:

The metallization also includes fingers electrically connected to the at least one contact pad and extending perpendicular to the first long side; and

Conductive lines interconnect the fingers.

14C1. The method of clause 9C1, wherein the feature is on the front side of the solar cell.

15C1. The method of clause 9C1, wherein the feature is on the backside of the solar cell.

16C1. The method of clause 9C1, wherein the features comprise recessed features.

17C1. The method of clause 9C1, wherein the feature is hidden by an adjacent solar cell of the super cell.

18C1. The method of clause 1C1, further comprising forming another super cell on the same liner.

19C1. A method according to clause 1C1, further comprising:

conductively bonded to the surface of the solar cell, the flexible electrical interconnect has a long axis parallel to a second direction, the second direction being perpendicular to the first direction; and

Enables flexible electrical interconnects to up-tune the thermal expansion of solar cells in two dimensions.

20C1. The method of clause 19C1, wherein the flexible electrical interconnect has a thickness of less than or equal to about 100 microns to provide a resistance of less than or equal to about 0.012 ohms.

21C1. The method of clause 19C1, wherein the surface comprises a back surface.

22C1. The method of clause 19C1, further comprising contacting another super cell with the flexible electrical interconnect.

23C1. The method of clause 22C1, wherein the other super cell is in-line with the super cell.

24C1. The method of clause 22C1, wherein the other super cell is adjacent to the super cell.

25C1. The method of clause 19C1, further comprising folding the first portion of the interconnect around an edge of the super cell such that the remaining second interconnect portion is on the backside of the super cell.

26C1. The method of clause 19C1, further comprising electrically connecting the flexible electrical interconnect to a bypass diode.

27C1. A method according to clause 1C1, further comprising:

A plurality of super cells are arranged in two or more parallel rows on the same backing to form the solar module front surface, wherein the backing sheet is white and includes a position and width corresponding to the gap between the super cells Dark stripes.

28C1. The method of clause 1C1, further comprising connecting at least one pair of battery strings to a power management system.

29C1. A method according to clause 1C1, further comprising:

electrically connecting the power management device with the super battery;

causing the power management device to receive the voltage output of the super battery;

based on the voltage, causing the power management device to determine whether the solar cell is in reverse bias; and

The power management device is caused to disconnect the reverse biased solar cell from the super cell module circuit.

30C1. The method of clause 1C1, wherein the super cells are disposed on a liner to form a first module having a top conductive tape on a first side facing a solar direction, the method further comprising:

disposing another super cell on another liner to form a second module having a bottom strap on a second side facing away from the direction of the solar energy,

wherein the second module overlaps and is joined to a portion of the first module including the top strap.

31C1. The method of clause 30C1, wherein the second module is bonded to the first module by an adhesive.

32C1. The method of clause 30C1, wherein the second module is joined to the first module by a mating arrangement.

33C1. The method of clause 30C1, further comprising overlapping the junction box with the second module.

34C1. The method of clause 33C1, wherein the second module is joined to the first module by a mating arrangement.

35C1. The method of clause 34C1, wherein the mating arrangement is between the junction box and another junction box on the second module.

36C1. The method of clause 30C1, wherein the liner comprises glass.

37C1. The method of clause 30C1, wherein the liner comprises non-glass.

38C1. A method according to clause 30C1, further comprising:

electrically connecting the relay switch in series between the first module and the second module;

sensing, by the controller, the output voltage of the first module; and

When the output voltage is below the limit, the relay switch is activated by the controller.

39C1. The method of clause 1C1, wherein the solar cell includes a chamfered portion cut from a larger piece.

40C1. The method of clause 39C1, wherein forming the super cell includes placing a long side of a solar cell in electrical contact with a long side of a similar length of another solar cell having a chamfered portion.

1C2. A device comprising:

A solar module comprising a front surface comprising at least 19 solar cells connected in series in a first string assembled into a first super cell arranged such that the length of adjacent solar cells is the edges are overlapped and conductively joined with an adhesive; and

Ribbon wires electrically connected to the back surface contacts of the first super cell to provide hidden taps to electrical components.

2C2. The apparatus of clause 1C2, wherein the electrical component comprises a bypass diode.

3C2. The apparatus of clause 2C2, wherein the bypass diode is located on a rear surface of the solar module.

4C2. The apparatus of clause 3C2, wherein the bypass diode is external to the junction box.

5C2. The apparatus of clause 4C2, wherein the junction box includes a single terminal.

6C2. The apparatus of clause 3C2, wherein the bypass diode is positioned near an edge of the solar module.

7C2. The apparatus of clause 2C2, wherein the bypass diode is positioned in the laminate structure.

8C2. The apparatus of clause 7C2, wherein the first super cell is encapsulated within a laminate.

9C2. The apparatus of clause 2C2, wherein the bypass diode is positioned around a perimeter of the solar module.

10C2. The apparatus of clause 1C2, wherein the electrical components comprise module terminals, junction boxes, power management systems, smart switches, relays, voltage sensing controllers, central inverters, DC/AC micro-inverters, or DC /DC module power optimizer.

11C2. The apparatus of clause 1C1, wherein the electrical components are located on a rear surface of the solar module.

12C2. The apparatus of clause 1C1, wherein the solar module further comprises a second string of at least 19 solar cells connected in series assembled into a second super cell, the second super cell having a series electrical connection to the first super cell first end.

13C2. The apparatus of clause 12C2, wherein the second super cell overlaps the first super cell and is electrically connected in series with the conductive adhesive to the first super cell.

14C2. The apparatus of clause 12C2, wherein the rear surface contact is positioned away from the first end.

15C2. The apparatus of clause 12C2, further comprising a flexible interconnect between the first end and the first super cell.

16C2. The apparatus of clause 15C2, wherein the flexible interconnect extends beyond side edges of the first and second super cells to electrically connect the first and second super cells in parallel with another super cell.

17C2. The apparatus of clause 1C2, wherein the adhesive has a thickness of less than or equal to about 0.1 mm and a thermal conductivity of greater than or equal to about 1.5 w/m/k.

18C2. The apparatus of clause 1C2, wherein the solar cell is a silicon solar cell having a breakdown voltage greater than about 10V.

19C2. The apparatus of clause 1C2, wherein the first super cell has a length in the direction of current flow of at least about 500 mm.

20C2. The apparatus of clause 1C2, wherein the solar cells in the first super cell include features configured to limit adhesive spread.

21C2. The apparatus of clause 20C2, wherein the features comprise raised features.

22C2. The apparatus of clause 21C2, wherein the feature comprises metallization.

23C2. The apparatus of clause 22C2, wherein the metallization comprises a conductive wire extending the full length of the first long side, the apparatus further comprising at least one contact pad between the wire and the first long side.

24C2. Apparatus according to clause 23C2, wherein:

The metallization also includes fingers electrically connected to the at least one contact pad and extending perpendicular to the first long side; and

Conductive lines interconnect the fingers.

25C2. The apparatus of clause 20C2, wherein the feature is on a front side of the solar cell.

26C2. The apparatus of clause 20C2, wherein the feature is on a backside of the solar cell.

27C2. The apparatus of clause 20C2, wherein the feature comprises a recessed feature.

28C2. The apparatus of clause 20C2, wherein the feature is hidden by an adjacent solar cell of the first super cell.

29C2. The apparatus of clause 1C2, wherein the solar cell of the first super cell includes a chamfered portion.

30C2. The apparatus of clause 29C2, wherein the first super cell further comprises another solar cell having a chamfered portion, and wherein a long side of the solar cell is in electrical contact with a long side of the other solar cell of similar length.

31C2. The apparatus of clause 29C2, wherein the first super cell further comprises another solar cell lacking the chamfer, and wherein the solar cell and the other solar cell have the same area exposed to sunlight.

32C2. Apparatus according to clause 1C2, wherein:

the first super cells and the second super cells are arranged in parallel rows on the front surface of the backing plate; and

The backing plate was white and included dark stripes corresponding to the position and width of the gap between the first super cell and the second super cell.

33C2. The apparatus of clause 1C2, wherein the first super cell includes at least one pair of battery strings connected to a power management system.

34C2. The apparatus of clause 1C2, further comprising a power management device in electrical communication with the first super cell and configured to:

receiving the voltage output of the first super cell;

based on the voltage, determining whether the solar cells of the first super cell are in reverse bias; and

Disconnect reverse biased solar cells from the super cell module circuit.

35C2. The apparatus of clause 34C2, wherein the power management device comprises a relay.

36C2. The apparatus of clause 1C2, wherein the first super cell is disposed on the first liner to form a module having a top conductive tape on the first side facing the solar direction, the apparatus further comprising:

another super cell disposed on the second liner to form a different module having a bottom strip on a second side facing a direction away from the solar direction,

wherein the different modules overlap and are joined to a portion of the module comprising the top strap.

37C2. The apparatus of clause 36C2, wherein the different modules are bonded to the modules by an adhesive.

38C2. The apparatus of clause 36C2, wherein the different modules are joined to the modules by a mating arrangement.

39C2. The apparatus of clause 36C2, further comprising a junction box overlapping the different modules.

40C2. Apparatus according to clause 39C2, wherein the different modules are joined to the modules by a mating arrangement between the junction box and another junction box on a different solar module.

1C3. A device comprising:

a first super cell disposed on the front surface of the solar module and comprising a plurality of solar cells, each solar cell having a breakdown voltage greater than about 10V;

a first ribbon conductor electrically connected to the rear surface contact of the first super cell to provide a first hidden tap to the electrical components;

a second super cell disposed on the front surface of the solar module and comprising a plurality of solar cells, each solar cell having a breakdown voltage greater than about 10V; and

A second ribbon conductor electrically connected to the rear surface contact of the second super cell to provide a second hidden tap.

2C3. The apparatus of clause 1C3, wherein the electrical component comprises a bypass diode.

3C3. The apparatus of clause 2C3, wherein the bypass diode is located on a solar module rear surface.

4C3. The apparatus of clause 3C3, wherein the bypass diode is external to the junction box.

5C3. The apparatus of clause 4C3, wherein the junction box includes a single terminal.

6C3. The apparatus of clause 3C3, wherein the bypass diode is positioned near an edge of the solar module.

7C3. The apparatus of clause 2C3, wherein the bypass diode is positioned in a laminate structure.

8C3. The apparatus of clause 7C3, wherein the first super cell is encapsulated within a laminate.

9C3. The apparatus of clause 8C3, wherein the bypass diode is positioned around a perimeter of the solar module.

10C3. The apparatus of clause 1C3, wherein the first super cell is connected in series with the second super cell.

11C3. Apparatus according to clause 10C3, wherein:

the first super cell and the second super cell form a first pair; and

The apparatus also includes two additional super cells in a second pair connected in parallel with the first pair.

12C3. The apparatus of clause 10C3, wherein the second hidden tap is connected to the electrical component.

13C3. The apparatus of clause 12C3, wherein the electrical component comprises a bypass diode.

14C3. The apparatus of clause 13C3, wherein the first super cell comprises no less than 19 solar cells.

15C3. The apparatus of clause 12C3, wherein the electrical component comprises a power management system.

16C3. The apparatus of clause 1C3, wherein the electrical component comprises a switch.

17C3. The apparatus of clause 16C3, further comprising a voltage sensing controller in communication with the switch.

18C3. The apparatus of clause 16C3, wherein the switch is in communication with a central inverter.

19C3. The apparatus of clause 1C3, wherein the electrical component comprises power management means configured to:

receiving the voltage output of the first super cell;

based on the voltage, determining whether the solar cells of the first super cell are in reverse bias; and

Disconnect reverse biased solar cells from the super cell module circuit.

20C3. The apparatus of clause 1, wherein the electrical component comprises an inverter.

21C3. The apparatus of clause 20C3, wherein the inverter comprises a DC/AC microinverter.

22C3. The apparatus of clause 1C3, wherein the electrical components comprise solar module terminals.

23C3. The apparatus of clause 22C3, wherein the solar module terminal is a single solar module terminal within a junction box.

24C3. The apparatus of clause 1C3, wherein the electrical components are located on the rear surface of the solar module.

25C3. The apparatus of clause 1C3, wherein the rear surface contact is positioned away from an end of the first super cell that overlaps the second super cell.

26C3. The apparatus of clause 1C3, wherein the first super cell has a length in the direction of current flow of at least about 500 mm.

27C3. The apparatus of clause 1C3, wherein the solar cells in the first super cell include features configured to limit adhesive spread.

28C3. The apparatus of clause 27C3, wherein the features comprise raised features.

29C3. The apparatus of clause 28C3, wherein the feature comprises metallization.

30C3. The apparatus of clause 27C3, wherein the feature comprises a recessed feature.

31C3. The apparatus of clause 27C3, wherein the feature is on a backside of the solar cell.

32C3. The apparatus of clause 27C3, wherein the feature is hidden by an adjacent solar cell of the first super cell.

33C3. The apparatus of clause 1C3, wherein the solar cell of the first super cell includes a chamfered portion.

34C3. The apparatus of clause 33C3, wherein the first super cell further comprises another solar cell having a chamfered portion, and wherein a long side of the solar cell is in electrical contact with a long side of the other solar cell of similar length.

35C3. The apparatus of clause 33C3, wherein the first super cell further comprises another solar cell lacking the chamfer, and wherein the solar cell and the other solar cell have the same area exposed to sunlight.

36C3. Apparatus according to clause 1C3, wherein:

the first super cells and the second super cells are arranged in parallel rows on the front surface of the backing plate; and

The backing plate was white and included dark stripes corresponding to the position and width of the gap between the first super cell and the second super cell.

37C3. The apparatus of clause 1C3, wherein the first super cell is disposed on the first liner to form a module having a top conductive strip on the front surface of the module facing the solar direction, the apparatus further comprising:

a third super cell disposed on the second liner to form a distinct module having a bottom strip on a second side facing a direction away from the solar direction,

wherein the different modules overlap and are joined to a portion of the module comprising the top strap.

38C3. Apparatus according to clause 37C3, wherein the different modules are bonded to the modules by an adhesive.

39C3. The apparatus of clause 37C3, further comprising a junction box overlapping the different modules.

40C3. Apparatus according to clause 39C3, wherein the different modules are joined to the modules by a mating arrangement between the junction box and another junction box on the different module.

1C4. A device comprising:

A solar module comprising a front surface comprising a first string of serially connected solar cells assembled into a first super cell arranged such that edges of adjacent solar cells overlap and are bonded with adhesive the mixture conductively engages; and

A solar cell surface feature configured to confine the adhesive.

2C4. The apparatus of clause 1C4, wherein the solar cell surface features comprise recessed features.

3C4. The apparatus of clause 1C4, wherein the solar cell surface features comprise raised features.

4C4. The apparatus of clause 3C4, wherein the raised features are on a front surface of the solar cell.

5C4. The apparatus of clause 4C4, wherein the raised features comprise metallization patterns.

6C4. The apparatus of clause 5C4, wherein the metallization pattern comprises conductive lines extending parallel to and generally along a long side of the solar cell.

7C4. The apparatus of clause 6C4, further comprising a contact pad between the conductive line and the long side.

8C4. Apparatus according to clause 7C4, wherein:

the metallization pattern further includes a plurality of fingers; and

The conductive lines electrically interconnect the fingers to provide multiple conductive paths from each finger to the contact pads.

9C4. The apparatus of clause 7C4, further comprising a plurality of discrete contact pads arranged in a row adjacent and parallel to a long edge, the metallization pattern forming a plurality of individual barriers to confine adhesive to the discrete contact pads.

10C4. The apparatus of clause 8C4, wherein the plurality of individual barriers abut corresponding discrete contact pads.

11C4. The apparatus of clause 8C4, wherein the plurality of individual barriers are higher than corresponding discrete contact pads.

12C4. The apparatus of clause 1C4, wherein the solar cell surface features are hidden by overlapping edges of another solar cell.

13C4. The apparatus of clause 12C4, wherein another solar cell is part of the super cell.

14C4. Apparatus according to clause 12C4, wherein the other solar cell is part of another super cell.

15C4. The apparatus of clause 3C4, wherein the raised features are located on the back surface of the solar cell.

16C4. The apparatus of clause 15C4, wherein the raised features comprise metallization patterns.

17C4. The apparatus of clause 16C4, wherein the metallization pattern forms a plurality of individual barriers to confine the adhesive to a plurality of discrete contact pads on a front surface of another solar cell overlapping the solar cell superior.

18C4. The apparatus of clause 17C4, wherein the plurality of individual barriers abut corresponding discrete contact pads.

19C4. The apparatus of clause 17C4, wherein the plurality of individual barriers are higher than corresponding discrete contact pads.

20C4. The apparatus of clause 1C1, wherein each solar cell of the super cell has a breakdown voltage of 10V or greater.

21C4. The apparatus of clause 1C1, wherein the super cell has a length in the direction of current flow of at least about 500 mm.

22C4. The apparatus of clause 1C1, wherein the solar cell of the super cell includes a chamfered portion.

23C4. The apparatus of clause 22C4, wherein the super cell further comprises another solar cell having a chamfered portion, and wherein a long side of the solar cell is in electrical contact with a long side of the other solar cell having a similar length.

24C4. The apparatus of clause 22C4, wherein the super cell further comprises another solar cell lacking the chamfer, and the solar cell and the other solar cell have the same area exposed to sunlight.

25C4. The apparatus of clause 1C4, wherein the super cell and the second super cell are arranged on the front surface of the first backing plate to form a first module.

26C4. The apparatus of clause 25C4, wherein the backing plate is white and includes dark stripes corresponding to the position and width of the gap between the super cell and the second super cell.

27C4. The apparatus of clause 25C4, wherein the first module has a top conductive strip on the front surface of the first module facing the solar direction, the apparatus further comprising:

a third super cell disposed on the second liner to form a second module having a bottom strap on the side of the second module facing away from the solar energy, and

wherein the second module overlaps and is joined to a portion of the first module including the top strap.

28C4. The apparatus of clause 27C4, wherein the second module is bonded to the first module by an adhesive.

29C4. The apparatus of clause 27C4, further comprising a junction box overlapping the second module.

30C4. Apparatus according to clause 29C4, wherein the second module is joined to the first module by a mating arrangement arranged between the junction box and another junction box on the second module.

31C4. The apparatus of clause 29C4, wherein the junction box houses a single module terminal.

32C4. The apparatus of clause 27C4, further comprising a switch between the first module and the second module.

33C4. The apparatus of clause 32C4, further comprising a voltage sensing controller in communication with the switch.

34C4. The apparatus of clause 27C4, wherein the super cell comprises no less than nineteen solar cells individually electrically connected in parallel with a single bypass diode.

35C4. The apparatus of clause 34C4, wherein the single bypass diode is positioned near an edge of the first module.

36C4. The apparatus of clause 34C4, wherein the single bypass diode is positioned in a laminate structure.

37C4. The device of clause 36C4, wherein the super cell is encapsulated within a laminate.

38C4. The apparatus of clause 34C4, wherein the single bypass diode is positioned around a perimeter of the first module.

39C4. The apparatus of clause 25C4, wherein the super cell and the second super cell comprise a pair individually connected to a power management device.

40C4. The apparatus of clause 25C4, further comprising power management means configured to:

Receive the voltage output of the super battery;

based on the voltage, determining whether the solar cells of the super cell are in reverse bias; and

Disconnect reverse biased solar cells from the super cell module circuit.

1C5. A device comprising:

A solar module comprising a front surface comprising a first string of series-connected silicon solar cells assembled into a first super cell, the first super cell comprising a first silicon solar cell, the first The silicon solar cell has chamfered corners and is arranged such that the side overlaps the second silicon solar cell and is conductively bonded to the second silicon solar cell with an adhesive.

2C5. The apparatus of clause 1C5, wherein the second silicon solar cell lacks a chamfer and each silicon solar cell of the first super cell has a substantially equal front surface area exposed to sunlight.

3C5. Apparatus according to clause 2C5, wherein:

the first silicon solar cell and the second silicon solar cell have the same length; and

The width of the first silicon solar cell is greater than the width of the second silicon solar cell.

4C5. The apparatus of clause 3C5, wherein the length reproduces the shape of a quasi-square wafer.

5C5. Apparatus according to clause 3C5, wherein the length is 156mm.

6C5. Apparatus according to clause 3C5, wherein the length is 125mm.

7C5. The apparatus of clause 3C5, wherein the aspect ratio between the width and the length of the first solar cell is between about 1 :2 to about 1 :20.

8C5. The apparatus of clause 3C5, wherein the first silicon solar cell overlaps the second silicon solar cell by about 1 mm to about 5 mm.

9C5. The apparatus of clause 3C5, wherein the first super cell comprises at least nineteen silicon solar cells, each silicon solar cell having a breakdown voltage greater than about 10 volts.

10C5. The apparatus of clause 3C5, wherein the first super cell has a length in the direction of current flow of at least about 500 mm.

11C5. Apparatus according to clause 3C5, wherein:

the first super cell and the second super cell are connected in parallel on the front surface; and

The front surface includes a white spacer characterized by dark stripes corresponding to the position and width of the gap between the first super cell and the second super cell.

12C5. The apparatus of clause 1C5, wherein the second silicon solar cell includes a chamfer.

13C5. The apparatus of clause 12C5, wherein a long side of the first silicon solar cell overlaps a long side of the second silicon solar cell.

14C5. The apparatus of clause 12C5, wherein a long side of the first silicon solar cell overlaps a short side of the second silicon solar cell.

15C5. The apparatus of clause 1C5, wherein the front surface comprises:

a first row, the first row including a first super cell consisting of solar cells having chamfered corners; and

a second row comprising a second string of series-connected silicon solar cells assembled into a second super cell connected in parallel with the first super cell and consisting of solar cells lacking chamfers, The length of the second row is substantially equal to the length of the first row.

16C5. The apparatus of clause 15C5, wherein the first row is adjacent to the module edge and the second row is not adjacent the module edge.

17C5. The apparatus of clause 15C5, wherein the first super cell comprises at least nineteen solar cells having a breakdown voltage greater than about 10 volts, and the first super cell has a length in the current direction of at least about 500 mm.

18C5. The apparatus of clause 15C5, wherein the front surface includes a white spacer characterized by dark stripes corresponding to the position and width of the gap between the first super cell and the second super cell.

19C5. The apparatus of clause 1C5, further comprising a metallization pattern on the front side of the second solar cell.

20C5. The apparatus of clause 19C5, wherein the metallization pattern includes a tapered portion extending around a chamfer.

21C5. The apparatus of clause 19C5, wherein the metallization pattern includes raised features to limit the spread of adhesive.

22C5. The apparatus of clause 19C5, wherein the metallization pattern comprises:

Multiple discrete contact pads;

fingers electrically connected to a plurality of discrete contact pads; and

Conductive wires interconnecting the fingers.

23C5. The apparatus of clause 22C5, wherein the metallization pattern forms a plurality of individual barriers to confine the adhesive to discrete contact pads.

24C5. The apparatus of clause 23C5, wherein the plurality of individual barriers abut and are higher than corresponding discrete contact pads.

25C5. The apparatus of clause 1C5, further comprising a flexible electrical interconnect conductively bonded to a surface of the first solar cell and regulating thermal expansion of the first solar cell in two dimensions.

26C5. The apparatus of clause 25C5, wherein the first portion of the interconnect is folded around an edge of the first super cell such that the remaining second interconnect portion is on the backside of the first super cell.

27C5. The apparatus of clause 1C5, wherein the module has a top conductive strip on the front surface facing the solar direction, the apparatus further comprising:

another module having a second super cell disposed on the front surface, a bottom strap facing away from the solar energy on the other module, and

wherein the second module overlaps and is joined to a portion of the first module including the top strap.

28C5. The apparatus of clause 27C5, wherein the further module is bonded to the module by an adhesive.

29C5. Apparatus according to clause 27C5, further comprising a junction box overlapping another module.

30C5. Apparatus according to clause 29C5, wherein the further module is joined to the module by a mating arrangement between the junction box and another junction box on the other module.

31C5. The apparatus of clause 29C5, wherein the junction box houses a single module terminal.

32C5. The apparatus of clause 27C5, further comprising a switch between the module and the another module.

33C5. The apparatus of clause 32C5, further comprising a voltage sensing controller in communication with the switch.

34C5. The apparatus of clause 27C5, wherein the first super cell includes no less than nineteen solar cells electrically connected to a single bypass diode.

35C5. The apparatus of clause 34C5, wherein the single bypass diode is positioned near an edge of the first module.

36C5. The apparatus of clause 34C5, wherein the single bypass diode is positioned in a laminate structure.

37C5. Apparatus according to clause 36C5, wherein the super cells are encapsulated within a laminate structure.

38C5. The apparatus of clause 34C5, wherein the single bypass diode is positioned around a perimeter of the first module.

39C5. The apparatus of clause 27C5, wherein the first super cell and the second super cell comprise a pair connected to a power management device.

40C5. The apparatus of clause 27C5, further comprising power management means configured to:

receiving the voltage output of the first super cell;

based on the voltage, determining whether the solar cells of the first super cell are in reverse bias; and

Disconnect reverse biased solar cells from the super cell module circuit.

1C6. A device comprising:

A solar module comprising a front surface comprising a first string of series-connected silicon solar cells assembled into a first super cell, the first super cell comprising a first silicon solar cell, the first The silicon solar cell has chamfered corners and is arranged such that the side overlaps the second silicon solar cell and is conductively bonded to the second silicon solar cell with an adhesive.

2C6. The apparatus of clause 1C6, wherein the second silicon solar cell lacks a chamfer and each silicon solar cell of the first super cell has a substantially equal front surface area exposed to sunlight.

3C6. Apparatus according to clause 2C6, wherein:

the first silicon solar cell and the second silicon solar cell have the same length; and

The width of the first silicon solar cell is greater than the width of the second silicon solar cell.

4C6. The apparatus of clause 3C6, wherein the length reproduces the shape of a quasi-square wafer.

5C6. Apparatus according to clause 3C6, wherein the length is 156mm.

6C6. Apparatus according to clause 3C6, wherein the length is 125mm.

7C6. The apparatus of clause 3C6, wherein the aspect ratio between the width and the length of the first solar cell is between about 1 :2 to about 1 :20.

8C6. The apparatus of clause 3C6, wherein the first silicon solar cell overlaps the second silicon solar cell by about 1 mm to about 5 mm.

9C6. The apparatus of clause 3C6, wherein the first super cell comprises at least nineteen silicon solar cells, each silicon solar cell having a breakdown voltage greater than about 10 volts.

10C6. The apparatus of clause 3C6, wherein the first super cell has a length in the direction of current flow of at least about 500 mm.

11C6. Apparatus according to clause 3C6, wherein:

the first super cell and the second super cell are connected in parallel on the front surface; and

The front surface includes a white spacer characterized by dark stripes corresponding to the position and width of the gap between the first super cell and the second super cell.

12C6. The apparatus of clause 1C6, wherein the second silicon solar cell includes a chamfer.

13C6. The apparatus of clause 12C6, wherein a long side of the first silicon solar cell overlaps a long side of the second silicon solar cell.

14C6. The apparatus of clause 12C6, wherein a long side of the first silicon solar cell overlaps a short side of the second silicon solar cell.

15C6. The apparatus of clause 1C6, wherein the front surface comprises:

a first row, the first row including a first super cell consisting of solar cells having chamfered corners; and

a second row comprising a second string of series-connected silicon solar cells assembled into a second super cell connected in parallel with the first super cell and consisting of solar cells lacking chamfers, The length of the second row is substantially equal to the length of the first row.

16C6. The apparatus of clause 15C6, wherein the first row is adjacent a module edge and the second row is not adjacent a module edge.

17C6. The apparatus of clause 15C6, wherein the first super cell comprises at least nineteen solar cells having a breakdown voltage greater than about 10 volts, and the first super cell has a length in the current direction of at least about 500 mm.

18C6. The apparatus of clause 15C6, wherein the front surface includes a white spacer characterized by dark stripes corresponding to the position and width of the gap between the first super cell and the second super cell.

19C6. The apparatus of clause 1C6, further comprising a metallization pattern on the front side of the second solar cell.

20C6. The apparatus of clause 19C6, wherein the metallization pattern includes a tapered portion extending around a chamfer.

21C6. The apparatus of clause 19C6, wherein the metallization pattern includes raised features to limit spread of the adhesive.

22C6. The apparatus of clause 19C6, wherein the metallization pattern comprises:

Multiple discrete contact pads;

fingers electrically connected to a plurality of discrete contact pads; and

Conductive wires interconnecting the fingers.

23C6. The apparatus of clause 22C6, wherein the metallization pattern forms a plurality of individual barriers to confine the adhesive to discrete contact pads.

24C6. The apparatus of clause 23C6, wherein the plurality of individual barriers abut and are higher than corresponding discrete contact pads.

25C6. The apparatus of clause 1C6, further comprising a flexible electrical interconnect conductively bonded to a surface of the first solar cell and two-dimensionally modulating thermal expansion of the first solar cell.

26C6. The apparatus of clause 25C6, wherein the first portion of the interconnect is folded around an edge of the first super cell such that the remaining second interconnect portion is on the backside of the first super cell.

27C6. The apparatus of clause 1C6, wherein the module has a top conductive strip on the front surface facing the solar direction, the apparatus further comprising:

another module having a second super cell disposed on the front surface, a bottom strap facing away from the solar energy on the other module, and

wherein the second module overlaps and is joined to a portion of the first module including the top strap.

28C6. The apparatus of clause 27C6, wherein the further module is bonded to the module by an adhesive.

29C6. Apparatus according to clause 27C6, further comprising a junction box overlapping another module.

30C6. Apparatus according to clause 29C6, wherein the further module is joined to the module by a mating arrangement between the junction box and another junction box on the other module.

31C6. The apparatus of clause 29C6, wherein the junction box houses a single module terminal.

32C6. The apparatus of clause 27C6, further comprising a switch between the module and the another module.

33C6. The apparatus of clause 32C6, further comprising a voltage sensing controller in communication with the switch.

34C6. The apparatus of clause 27C6, wherein the first super cell includes no less than nineteen solar cells in electrical connection with a single bypass diode.

35C6. The apparatus of clause 34C6, wherein the single bypass diode is positioned near an edge of the first module.

36C6. The apparatus of clause 34C6, wherein the single bypass diode is positioned in a laminate structure.

37C6. The device of clause 36C6, wherein the super cell is encapsulated within a laminate.

38C6. The apparatus of clause 34C6, wherein the single bypass diode is positioned around a perimeter of the first module.

39C6. The apparatus of clause 27C6, wherein the first super cell and the second super cell comprise a pair connected to a power management device.

40C6. The apparatus of clause 27C6, further comprising power management means configured to:

receiving the voltage output of the first super cell;

based on the voltage, determining whether the solar cells of the first super cell are in reverse bias; and

Disconnect reverse biased solar cells from the super cell module circuit.

1C7. A device comprising:

A solar module comprising a front surface comprising a first string of at least nineteen silicon solar cells connected in series, each silicon solar cell having a breakdown voltage greater than about 10V, and assembled into a first super a cell, the first super cell comprising a first silicon solar cell arranged such that the end portion overlaps the second silicon solar cell and is conductively bonded to the second silicon solar cell with an adhesive; as well as

An interconnect conductively bonded to the surface of the solar cell.

2C7. The apparatus of clause 1C7, wherein the solar cell surface comprises the backside of the first silicon solar cell.

3C7. The apparatus of clause 2C7, further comprising ribbon conductors electrically connecting the super cells to electrical components.

4C7. The apparatus of clause 3C7, wherein the ribbon conductor is conductively bonded to a surface of the solar cell remote from the overlapping end.

5C7. The apparatus of clause 4C7, wherein the electrical components are located on the rear surface of the solar module.

6C7. The apparatus of clause 4C7, wherein the electrical component comprises a junction box.

7C7. The apparatus of clause 6C7, wherein the junction box mates with another junction box on a different module overlapping the module.

8C7. The apparatus of clause 4C7, wherein the electrical component comprises a bypass diode.

9C7. The apparatus of clause 4C7, wherein the electrical component comprises a module terminal.

10C7. The apparatus of clause 4C7, wherein the electrical component comprises an inverter.

11C7. The apparatus of clause 10C7, wherein the inverter comprises a DC/AC microinverter.

12C7. The apparatus of clause 11C7, wherein the DC/AC microinverter is located on a solar module rear surface.

13C7. The apparatus of clause 4C7, wherein the electrical component comprises a power management device.

14C7. The apparatus of clause 13C7, wherein the power management device comprises a switch.

15C7. The apparatus of clause 14C7, further comprising a voltage sensing controller in communication with the switch.

16C7. The apparatus of clause 13C7, wherein the power management means is configured to:

Receive the voltage output of the super battery;

based on the voltage, determining whether the solar cells of the super cell are in reverse bias; and

Disconnect reverse biased solar cells from the super cell module circuit.

17C7. The apparatus of clause 16C7, wherein the power management device is in electrical communication with a central inverter.

18C7. The apparatus of clause 13C7, wherein the power management device comprises a DC/DC module power optimizer.

19C7. The apparatus of clause 3C7, wherein the interconnect is sandwiched between the super cell and another super cell on the front surface.

20C7. The apparatus of clause 3C7, wherein the ribbon conductor is conductively bonded to the interconnect.

21C7. The apparatus of clause 3C7, wherein the interconnect provides a resistance to the current of less than or equal to about 0.012 ohms.

22C7. The apparatus of clause 3C7, wherein the interconnect is configured to accommodate non-uniform expansion between the first silicon solar cell and the interconnect for a temperature range between about -40°C to about 85°C.

23C7. The apparatus of clause 3C7, wherein the interconnect has a thickness of less than or equal to about 100 microns.

24C7. The apparatus of clause 3C7, wherein the interconnect has a thickness of less than or equal to about 30 microns.

25C7. The apparatus of clause 3C7, wherein the super cell has a length in the direction of current flow of at least about 500 mm.

26C7. The method of clause 3C7, further comprising another super cell on the front surface of the module.

27C7. The apparatus of clause 26C7, wherein the interconnect connects the further super cell in series with the super cell.

28C7. The apparatus of clause 26C7, wherein the interconnect connects the other super cell in parallel with the super cell.

29C7. The apparatus of clause 26C7, wherein the front surface includes a white spacer characterized by dark stripes corresponding to the position and width of the gap between the super cell and the other super cell.

30C7. The apparatus of clause 3C7, wherein the interconnect comprises a pattern.

31C7. The apparatus of clause 30C7, wherein the pattern comprises slits, grooves and/or holes.

32C7. The apparatus of clause 3C7, wherein a portion of the interconnect is dark.

33C7. Apparatus according to clause 3C7, wherein:

the first silicon solar cell includes a chamfer;

The second silicon solar cell lacks a chamfer; and

The front surface area of each silicon solar cell of the super cell exposed to sunlight is substantially equal.

34C7. Apparatus according to clause 3C7, wherein:

the first silicon solar cell includes a chamfer;

The second silicon solar cell includes a chamfer; and

The sides include long sides overlapping the long sides of the second silicon solar cell.

35C7. The apparatus of clause 3C7, wherein the interconnects form a bus.

36C7. The apparatus of clause 3C7, wherein the interconnect is conductively bonded to the solar cell surface at a glued joint.

37C7. The apparatus of clause 3C7, wherein the first portion of the interconnect is folded around an edge of the super cell such that the remaining second portion is on the backside of the super cell.

38C7. The apparatus of clause 3C7, further comprising a metallization pattern on the front surface and including a line extending along a long edge, the apparatus further comprising a plurality of discretes located between the line and the long edge contact pads.

39C7. Apparatus according to clause 38C7, wherein:

The metallization also includes fingers electrically connected to corresponding discrete contact pads and extending perpendicular to the long sides; and

Conductive lines interconnect the fingers.

40C7. The apparatus of clause 38C7, wherein the metallization pattern includes raised features to limit spread of the adhesive.

1C8. A device comprising:

A plurality of super cells arranged in a row on the front surface of the solar module, each super cell comprising at least nineteen silicon solar cells having a breakdown voltage of at least 10V arranged in a line, wherein the end portions of adjacent silicon solar cells overlap and conductively joined to electrically connect the silicon solar cells in series;

Wherein the end of the first super cell adjacent to the edge of the module in the first row is electrically connected to the end of the second super cell adjacent to the edge of the module in the second row via a flexible electrical interconnect bonded to the front surface of the first super cell department.

2C8. The apparatus of clause 1C8, wherein a portion of the flexible electrical interconnect is covered by a dark film.

3C8. The apparatus of clause 2C8, wherein the solar module front surface includes a backing sheet that reduces visual contrast with the flexible electrical interconnect.

4C98. The apparatus of clause 1C8, wherein a portion of the flexible electrical interconnect is colored.

5C8. The apparatus of clause 4C8, wherein the solar module front surface includes a backing sheet that reduces visual contrast with the flexible electrical interconnect.

6C8. The apparatus of clause 1C8, wherein the solar module front surface includes a white backing sheet.

7C8. The apparatus of clause 6C8, further comprising dark stripes corresponding to the gaps between the rows.

8C8. The apparatus of clause 6C8, wherein the n-type semiconductor layer of the silicon solar cell faces a backing sheet.

9C8. Apparatus according to clause 1C8, wherein:

the solar module front surface includes a backing sheet; and

The backing sheet, the flexible electrical interconnect, the first super cell, and the encapsulant comprise a laminate structure.

10C8. The apparatus of clause 9C8, wherein the encapsulant comprises a thermoplastic polymer.

11C8. The apparatus of clause 10C8, wherein the thermoplastic polymer comprises a thermoplastic olefin polymer.

12C8. Apparatus according to clause 9C8, further comprising a glass front panel.

13C8. The method of clause 12C8, wherein the backing plate comprises glass.

14C8. The apparatus of clause 1C8, wherein the flexible electrical interconnects are joined at a plurality of discrete locations.

15C8. The apparatus of clause 1C8, wherein the flexible electrical interconnect is joined with a conductive adhesive bonding material.

16C8. Apparatus according to clause 1C8, further comprising a glued joint.

17C8. The apparatus of clause 1C8, wherein the flexible electrical interconnect extends parallel to the module edge.

18C8. The apparatus of clause 1C8, wherein a portion of the flexible electrical interconnect is folded around the first super cell and hidden.

19C8. The apparatus of clause 1C8, further comprising a ribbon conductor electrically connecting the first super cell to the electrical components.

20C8. The apparatus of clause 19C8, wherein the ribbon conductor is conductively bonded to a flexible electrical interconnect.

21C8. The apparatus of clause 19C8, wherein the ribbon wire is conductively bonded to a surface of the solar cell remote from the overlapping ends.

22C8. The apparatus of clause 19C8, wherein the electrical components are located on the rear surface of the solar module.

23C8. The apparatus of clause 19C8, wherein the electrical component comprises a junction box.

24C8. The apparatus of clause 23C8, wherein the junction box is mating engagement with another junction box on the front surface of another solar module.

25C8. The apparatus of clause 23C8, wherein the junction box comprises a single terminal junction box.

26C8. The apparatus of clause 19C8, wherein the electrical component comprises a bypass diode.

27C8. The apparatus of clause 19C8, wherein the electrical component comprises a switch.

28C8. The apparatus of clause 27C8, further comprising a voltage sensing controller configured to:

receiving the voltage output of the first super cell;

based on the voltage, determining whether the solar cells of the first super cell are in reverse bias; and

Communication with the switch to disconnect the reverse biased solar cell from the super cell module circuit.

29C8. The apparatus of clause 1C8, wherein a first super cell is connected in series with the super cell.

30C8. Apparatus according to clause 1C8, wherein:

The first silicon solar cell of the first super cell includes a chamfer;

the second silicon solar cell of the first super cell lacks a chamfer; and

The front surface area of each silicon solar cell of the first super cell exposed to sunlight is substantially equal.

31C8. Apparatus according to clause 1C8, wherein:

The first silicon solar cell of the first super cell includes a chamfer;

the second silicon solar cell of the first super cell includes a chamfer; and

The long sides of the first silicon solar cells overlap with the long sides of the second silicon solar cells.

32C8. The apparatus of clause 1C8, wherein the silicon solar cell of the first super cell comprises a strip having a length of about 156 mm.

33C8. The apparatus of clause 1C8, wherein the silicon solar cell of the first super cell comprises a strip having a length of about 125 mm.

34C8. The apparatus of clause 1C8, wherein the silicon solar cell of the first super cell comprises a strip having an aspect ratio between a width and a length of between about 1:2 and about 1:20.

35C8. The apparatus of clause 1C8, wherein overlapping adjacent silicon solar cells of the first super cell are conductively bonded with an adhesive, the apparatus further comprising features configured to limit adhesive spread.

36C8. The apparatus of clause 35C8, wherein the feature comprises a moat.

37C8. The apparatus of clause 36C8, wherein the moat is formed by a metallization pattern.

38C8. The apparatus of clause 37C8, wherein the metallization pattern comprises a line extending along a long side of the silicon solar cell, the apparatus further comprising a plurality of discrete contacts between the line and the long side pad.

39C8. The apparatus of clause 37C8, wherein the metallization pattern is on the front of the silicon solar cell of the first super cell.

40C8. The apparatus of clause 37C8, wherein the metallization pattern is on the backside of the silicon solar cell of the second super cell.

1C9. A device comprising:

A solar module comprising a front surface comprising series-connected silicon solar cells assembled into a first super cell, the first super cell comprising a first cut bar having a length along the The front side metallization pattern of the first outer edge overlapping the second cutting bar.

2C9. The apparatus of clause 1C9, wherein the first dicing bar and the second dicing bar have lengths that reproduce the shape of the wafer from which the first dicing bar was separated.

3C9. Apparatus according to clause 2C9, wherein the length is 156mm.

4C9. Apparatus according to clause 2C9, wherein the length is 125mm.

5C9. The apparatus of clause 2C9, wherein the aspect ratio between the width and the length of the first cutting strip is between about 1:2 and about 1:20.

6C9. The apparatus of clause 2C9, wherein the first cutting strip includes a first chamfer.

7C9. The apparatus of clause 6C9, wherein the first chamfer is along the first outer edge.

8C9. The apparatus of clause 6C9, wherein the first chamfer is not along the first outer edge.

9C9. The apparatus of clause 6C9, wherein the second cutting strip includes a second chamfer.

10C9. The apparatus of clause 9C9, wherein the overlapping edges of the second cutting strip include a second chamfer.

11C9. The apparatus of clause 9C9, wherein the overlapping edges of the second cutting strip do not include the second chamfer.

12C9. The apparatus of clause 6C9, wherein the length reproduces the shape of the pseudo-square wafer from which the first dicing bar is separated.

13C9. The apparatus of clause 6C9, wherein the width of the first cutting strip is different from the width of the second cutting strip such that the first cutting strip and the second cutting strip have substantially equal areas.

14C9. The apparatus of clause 1C9, wherein the second cutting strip overlaps the first cutting strip by about 1 mm to 5 mm.

15C9. The apparatus of clause 1C9, wherein the front side metallization pattern comprises a bus.

16C9. The apparatus of clause 15C9, wherein the bus includes a tapered portion.

17C9. The apparatus of clause 1C9, wherein the front side metallization pattern comprises discrete contact pads.

18C9. Apparatus according to clause 17C9, wherein:

The second cutting strip is joined to the first cutting strip by an adhesive; and

The discrete contact pads also include features to limit adhesive spread.

19C9. The apparatus of clause 18C9, wherein the feature comprises a moat.

20C9. The apparatus of clause 1C9, wherein the front side metallization pattern comprises bypass wires.

21C9. The apparatus of clause 1C9, wherein the front side metallization pattern comprises fingers.

22C9. The apparatus of clause 1C9, wherein the first cutting bar further comprises a backside metallization pattern along a second outer edge opposite the first outer edge.

23C9. The apparatus of clause 22C9, wherein the backside metallization pattern includes contact pads.

24C9. The apparatus of clause 22C9, wherein the backside metallization pattern comprises a bus.

25C9. The apparatus of clause 1C9, wherein the super cell includes at least nineteen dicing bars of silicon, each dicing bar of silicon having a breakdown voltage greater than about 10 volts.

26C9. The method of clause 1C9, wherein the super cell is connected to another super cell on the front surface of the module.

27C9. The apparatus of clause 26C9, wherein the module front surface includes a white spacer characterized by a dark stripe corresponding to a gap between the super cell and the other super cell.

28C9. Apparatus according to clause 26C9, wherein:

the solar module front surface includes a backing sheet; and

Backing sheets, interconnects, super cells, and encapsulants include laminate structures.

29C9. The apparatus of clause 28C9, wherein the encapsulant comprises a thermoplastic polymer.

30C9. The apparatus of clause 29C9, wherein the thermoplastic polymer comprises a thermoplastic olefin polymer.

31C9. The apparatus of clause 26C9, further comprising an interconnection between the super cell and the other super cell.

32C9. The apparatus of clause 31C9, wherein a portion of the interconnect is covered by a dark film.

33C9. The apparatus of clause 31C9, wherein a portion of the interconnect is colored.

34C9. The apparatus of clause 31C9, further comprising ribbon conductors electrically connecting the super cells to electrical components.

35C9. The apparatus of clause 34C9, wherein the ribbon conductor is conductively bonded to the rear side of the first cutting strip.

36C9. The apparatus of clause 34C9, wherein the electrical component comprises a bypass diode.

37C9. The apparatus of clause 34C9, wherein the electrical component comprises a switch.

38C9. The apparatus of clause 34C9, wherein the electrical component comprises a junction box.

39C9. Apparatus according to clause 38C9, wherein the junction box overlaps another junction box and is in a mating arrangement.

40C9. The apparatus of clause 26C9, wherein the super cell and the further super cell are connected in series.

1C10. A method that includes:

Laser scribe lines on silicon wafers to define solar cell areas;

applying a conductive adhesive bonding material to the top surface of the scribed silicon wafer adjacent the long sides of the solar cell region; and

The silicon wafer is divided along the scribed lines to provide solar cell strips that include a portion of a conductive adhesive bonding material disposed adjacent to the long sides of the solar cell strips.

2C10. The method of clause 1C10, further comprising providing the silicon wafer with a metallization pattern such that the dividing produces solar cell strips having the metallization pattern along the long sides.

3C10. The method of clause 2C10, wherein the metallization pattern comprises a bus line or discrete contact pads.

4C10. The method of clause 2C10, wherein the providing comprises printing the metallization pattern.

5C10. The method of clause 2C10, wherein the providing comprises electroplating the metallization pattern.

6C10. The method of clause 2C10, wherein the metallization pattern includes features configured to limit the spread of the conductive adhesive bonding material.

7C10. The apparatus of clause 6C10, wherein the feature comprises a moat.

8C10. The method of clause 1C10, wherein the applying comprises printing.

9C10. The method of clause 1C10, wherein the applying comprises depositing using a mask.

10C10. The method of clause 1C10, wherein the long side lengths of the solar cell strips reproduce the shape of the wafer.

11C10. The method of clause 10C10, wherein the length is 156mm or 125mm.

12C10. The method of clause 10C10, wherein an aspect ratio between a width and a length of the solar cell strip is between about 1 :2 to about 1 :20.

13C10. The method of clause 1C10, wherein the segmenting comprises:

A vacuum is applied between the bottom surface of the wafer and the curved support surface to bend the solar cell area against the curved support surface and thereby cut the silicon wafer along the scribe lines.

14C10. The method of clause 1C10, further comprising:

arranging a plurality of solar cell strips in a straight line, wherein the long sides of adjacent solar cell strips overlap and a portion of the conductive adhesive bonding material is disposed therebetween; and

The conductive bonding material is cured to bond adjacent overlapping solar cell strips to each other and electrically connect them in series.

15C10. The method of clause 14C10, wherein the curing comprises applying heat.

16C10. The method of clause 14C10, wherein the curing comprises applying pressure.

17C10. The method of clause 14C10, wherein the arranging includes forming a layered structure.

18C10. The method of clause 17C10, wherein the curing comprises applying heat and pressure to the layered structure.

19C10. The method of clause 17C10, wherein the layered structure comprises an encapsulant.

20C10. The method of clause 19C10, wherein the encapsulant comprises a thermoplastic polymer.

21C10. The method of clause 20C10, wherein the thermoplastic polymer comprises a thermoplastic olefin polymer.

22C10. The method of clause 17C10, wherein the layered structure includes a backing plate.

23C10. A method according to clause 22C10, wherein:

the backing plate is white; and

The layered structure also includes dark stripes.

24C10. The method of clause 14C10, wherein the arranging comprises arranging at least nineteen solar cell strips in a straight line.

25C10. The method of clause 24C10, wherein each of the at least nineteen solar cell strips has a breakdown voltage of at least 10V.

26C10. The method of clause 24C10, further comprising placing the at least nineteen solar cell strips in communication with only a single bypass diode.

27C10. The method of clause 26C10, further comprising forming a ribbon conductor between one of the at least nineteen solar cell strips and the single bypass diode.

28C10. The method of clause 27C10, wherein the single bypass diode is located in a junction box.

29C10. The method of clause 28C10, wherein the junction box is located on the backside of the solar module in a mating arrangement with another junction box of a different solar module.

30C10. The method of clause 14C10, wherein overlapping cell strips of the plurality of solar cell strips overlap the solar cell strips by about 1 mm to 5 mm.

31C10. The method of clause 14C10, wherein the solar cell strip includes a first chamfer.

32C10. The method of clause 31C10, wherein long sides of overlapping solar cell strips of the plurality of solar cell strips do not include a second chamfer.

33C10. The method of clause 32C10, wherein a width of the solar cell strips is greater than a width of the overlapping solar cell strips such that the solar cell strips and the overlapping solar cell strips have approximately equal areas.

34C10. The method of clause 31C10, wherein long sides of overlapping solar cell strips of the plurality of solar cell strips include a second chamfer.

35C10. The method of clause 34C10, wherein a long edge of the overlapping solar cell strips of the plurality of solar cell strips overlaps a long edge of a cell strip including a first chamfer.

36C10. The method of clause 34C10, wherein a long edge of the overlapping solar cell strips of the plurality of solar cell strips overlaps a long edge of a cell strip that does not include a first chamfer.

37C10. The method of clause 14C10, further comprising connecting the plurality of solar cell strips to another plurality of solar cell strips using an interconnect.

38C10. The method of clause 37C10, wherein a portion of the interconnect is covered with a dark film.

39C10. The method of clause 37C10, wherein a portion of the interconnect is colored.

40C10. The method of clause 37C10, wherein the plurality of solar cell strips are connected in series with the other plurality of solar cell strips.

1C11. A method that includes:

provide silicon wafers with lengths;

Scribing lines on silicon wafers to define solar cell areas;

applying a conductive adhesive bonding material to the surface of the silicon wafer; and

The silicon wafer is divided along the scribed lines to provide solar cell strips that include a portion of a conductive adhesive bonding material disposed adjacent to the long sides of the solar cell strips.

2C11. The method of clause 1C11, wherein the scribing comprises laser scribing.

3C11. The method of clause 2C11, comprising laser scribing scribed lines, and then applying a conductive adhesive bonding material.

4C11. The method of clause 2C11, comprising applying a conductive adhesive bonding material to a wafer, and then laser scribing a scribe line.

5C11. A method as described in clause 4C11, wherein:

the applying includes applying an uncured conductive adhesive bonding material; and

The laser scribing includes preventing heat from the laser from curing the uncured conductive adhesive bonding material.

6C11. The method of clause 5C11, wherein the avoiding comprises selecting a laser power and/or a distance between the scribe line and the uncured conductive adhesive bonding material.

7C11. The method of clause 1C11, wherein the applying comprises printing.

8C11. The method of clause 1C11, wherein the applying comprises depositing using a mask.

9C11. The method of clause 1C11, wherein a scribed line and a conductive adhesive bonding material are on the surface.

10C11. The method of clause 1C11, wherein the segmenting comprises:

A vacuum is applied between the wafer surface and the curved support surface to bend the solar cell area against the curved support surface and thereby cut the silicon wafer along the scribe lines.

11C11. The method of clause 10C11, wherein the dividing includes arranging the scribe lines at an angle relative to the vacuum manifold.

12C11. The method of clause 1C11, wherein the dividing includes applying pressure to the wafer using a roller.

13C11. The method of clause 1C11, wherein the providing comprises providing a silicon wafer with a metallization pattern such that the dividing produces solar cell strips having a metallization pattern along a long edge.

14C11. The method of clause 13C11, wherein the metallization pattern comprises a bus line or discrete contact pads.

15C11. The method of clause 13C11, wherein the providing comprises printing the metallization pattern.

16C11. The method of clause 13C11, wherein the providing comprises electroplating the metallization pattern.

17C11. The method of clause 13C11, wherein the metallization pattern includes features configured to limit the spread of the conductive adhesive bonding material.

18C11. The method of clause 1C11, wherein the long side lengths of the solar cell strips reproduce the shape of the wafer.

19C11. The method of clause 18C11, wherein the length is 156mm or 125mm.

20C11. The method of clause 18C11, wherein an aspect ratio between a width and a length of the solar cell strip is between about 1 :2 to about 1 :20.

21C11. A method according to clause 1C11, further comprising:

arranging a plurality of solar cell strips in a straight line, wherein the long sides of adjacent solar cell strips overlap and a portion of the conductive adhesive bonding material is disposed therebetween; and

The conductive bonding material is cured to bond adjacent overlapping solar cell strips to each other and electrically connect them in series.

22C11. A method according to clause 21C11, wherein:

the arranging includes forming a layered structure; and

The curing includes applying heat and pressure to the layered structure.

23C11. The method of clause 22C11, wherein the layered structure comprises a thermoplastic olefin polymer encapsulant.

24C11. The method of clause 22C11, wherein the hierarchical structure comprises:

white backing board; and

Dark stripes on the white backing plate.

25C11. A method according to clause 21C11, wherein:

A plurality of wafers are arranged on the template;

The conductive adhesive bonding material is dispensed on the plurality of wafers; and

Multiple wafers are cells that are simultaneously divided into multiple solar cell strips using a jig.

26C11. The method of clause 25C11, further comprising shipping the plurality of solar cell strips as a set, and wherein the arranging comprises arranging the plurality of solar cell strips into a module.

27C11. The method of clause 21C11, wherein the arranging comprises arranging at least nineteen solar cell strips having a breakdown voltage of at least 10V in line with only a single bypass diode.

28C11. The method of clause 27C11, further comprising forming a ribbon conductor between one of the at least nineteen solar cell strips and the single bypass diode.

29C11. The method of clause 28C11, wherein the single bypass diode is located in a first junction box of a first solar module, the first junction box being arranged in a pair with a second junction box of a second solar module.

30C11. The method of clause 27C11, further comprising forming a ribbon conductor between one of the at least nineteen solar cell strips and the smart switch.

31C11. The method of clause 21C11, wherein overlapping cell strips of the plurality of solar cell strips overlap the solar cell strips by about 1 mm to 5 mm.

32C11. The method of clause 21C11, wherein the solar cell strip includes a first chamfer.

33C11. The method of clause 32C11, wherein long sides of overlapping solar cell strips of the plurality of solar cell strips do not include a second chamfer.

34C11. The method of clause 33C11, wherein the width of the solar cell strips is greater than the width of the overlapping solar cell strips such that the solar cell strips and the overlapping solar cell strips have approximately equal areas.

35C11. The method of clause 32C11, wherein long sides of overlapping solar cell strips of the plurality of solar cell strips include a second chamfer.

36C11. The method of clause 35C11, wherein a long edge of the overlapping solar cell strips of the plurality of solar cell strips overlaps a long edge of a cell strip including a first chamfer.

37C11. The method of clause 35C11, wherein a long edge of the overlapping solar cell strips of the plurality of solar cell strips overlaps a long edge of a cell strip that does not include a first chamfer.

38C11. The method of clause 21C11, further comprising connecting the plurality of solar cell strips to another plurality of solar cell strips using an interconnect.

39C11. The method of clause 38C11, wherein a portion of the interconnect is covered with a dark-colored film or colored.

40C11. The method of clause 38C11, wherein the plurality of solar cell strips are connected in series with the other plurality of solar cell strips.

1C12. A method that includes:

provide silicon wafers with lengths;

Scribing lines on silicon wafers to define solar cell areas;

dividing the silicon wafer along the scribe lines to provide solar cell strips; and

A conductive adhesive bonding material is applied adjacent the long sides of the solar cell strips.

2C12. The method of clause 1C12, wherein the scribing comprises laser scribing.

3C12. The method of clause 1C12, wherein the applying comprises screen printing.

4C12. The method of clause 1C12, wherein the applying comprises ink jet printing.

5C12. The method of clause 1C12, wherein the applying comprises depositing using a mask.

6C12. The method of clause 1C12, wherein the dividing includes applying a vacuum between the surface of the wafer and the curved surface.

7C12. The method of clause 6C12, wherein the curved surface includes a vacuum manifold, and the dividing includes orienting the scribe line at an angle relative to the vacuum manifold.

8C12. The method of clause 7C12, wherein the angle is a right angle.

9C12. The method of clause 7C12, wherein the angle is not a right angle.

10C12. The method of clause 6C12, wherein the vacuum is applied by moving a belt.

11C12. A method according to clause 1C12, further comprising:

arranging a plurality of solar cell strips in a straight line, wherein the long sides of adjacent solar cell strips overlap and the conductive adhesive bonding material is disposed therebetween; and

The conductive bonding material is cured to electrically connect adjacent overlapping solar cell strips in series.

12C12. The method of clause 11C12, wherein the disposing comprises forming a layered structure, the layered structure comprising an encapsulant, the method further comprising pair laminating the layered structure.

13C12. The method of clause 12C12, wherein the curing occurs at least in part during lamination.

14C12. The method of clause 12C12, wherein the curing and laminating are not performed simultaneously.

15C12. The method of clause 12C12, wherein the laminating comprises applying a vacuum.

16C12. The method of clause 15C12, wherein the vacuum is applied to a balloon.

17C12. The method of clause 15C12, wherein the vacuum is applied to the belt.

18C12. The method of clause 12C12, wherein the encapsulant comprises a thermoplastic olefin polymer.

19C12. The method of clause 12C12, wherein the hierarchical structure comprises:

white backing board; and

Dark stripes on the white backing plate.

20C12. The method of clause 11C12, wherein the providing comprises providing the silicon wafer with a metallization pattern such that the dividing produces solar cell strips having a metallization pattern along a long edge.

21C12. The method of clause 20C12, wherein the metallization pattern comprises a bus line or discrete contact pads.

22C12. The method of clause 20C12, wherein the providing comprises printing or electroplating a metallization pattern.

23C12. The method of clause 20C12, wherein the disposing includes using features of the metallization pattern to limit the spread of the conductive adhesive bonding material.

24C12. The method of clause 23C12, wherein the feature is on a front side of the solar cell strip.

25C12. The method of clause 23C12, wherein the feature is on a backside of the solar cell strip.

26C12. The method of clause 11C12, wherein the long side lengths of the solar cell strips reproduce the shape of the wafer.

27C12. The method of clause 26C12, wherein the length is 156mm or 125mm.

28C12. The method of clause 26C12, wherein an aspect ratio between a width and a length of the solar cell strip is between about 1 :2 to about 1 :20.

29C12. The method of clause 11C12, wherein the arranging comprises arranging as first super cells at least nineteen solar cell strips having a breakdown voltage of at least 10V, in line with only a single bypass diode.

30C12. The method of clause 29C12, further comprising applying a conductive adhesive bonding material between the first super cell and the interconnect.

31C12. The method of clause 30C12, wherein the interconnect connects the first super cell and the second super cell in parallel.

32C12. The method of clause 30C12, wherein the interconnect connects the first super cell and the second super cell in series.

33C12. The method of clause 29C12, further comprising forming a ribbon conductor between the first super cell and the single bypass diode.

34C12. The method of clause 33C12, wherein the single bypass diode is located in a first junction box of a first solar module, the first junction box being arranged in a pair with a second junction box of a second solar module.

35C12. The method of clause 11C12, wherein the solar cell strip includes a first chamfer.

36C12. The method of clause 35C12, wherein long sides of overlapping solar cell strips of the plurality of solar cell strips do not include a second chamfer.

37C12. The method of clause 36C12, wherein the width of the solar cell strips is greater than the width of the overlapping solar cell strips such that the solar cell strips and the overlapping solar cell strips have approximately equal areas.

38C12. The method of clause 35C12, wherein long sides of overlapping solar cell strips of the plurality of solar cell strips include a second chamfer.

39C12. The method of clause 38C12, wherein a long edge of the overlapping solar cell strips of the plurality of solar cell strips overlaps a long edge of a cell strip including a first chamfer.

40C12. The method of clause 38C12, wherein a long edge of the overlapping solar cell strips of the plurality of solar cell strips overlaps a long edge of a cell strip that does not include a first chamfer.

1C13. A device comprising:

A semiconductor wafer having a first surface including a first metallization pattern along a first outer edge and a second metal along a second outer edge opposite the first outer edge The semiconductor wafer further includes a first scribe line between the first metallization pattern and the second metallization pattern.

2C13. The apparatus of clause 1C13, wherein the first metallization pattern comprises discrete contact pads.

3C13. The apparatus of clause 1C13, wherein the first metallization pattern includes a first finger pointing away from the first outer edge toward the second metallization pattern.

4C13. The apparatus of clause 3C13, wherein the first metallization pattern further comprises a bus line extending along the first outer edge and intersecting the first finger.

5C13. The apparatus of clause 4C13, wherein the second metallization pattern comprises:

a second finger pointing away from the second outer edge of the first metallization pattern; and

A second bus line extending along the second outer edge and intersecting the second finger.

6C13. The apparatus of clause 3C13, further comprising a conductive adhesive extending along the first outer edge and in contact with the first finger.

7C13. The apparatus of clause 3C13, wherein the first metallization pattern further includes a first bypass wire.

8C13. The apparatus of clause 3C13, wherein the first metallization pattern further includes a first end wire.

9C13. The apparatus of clause 1C13, wherein the first metallization pattern comprises silver.

10C13. The apparatus of clause 9C13, wherein the first metallization pattern comprises silver paste.

11C13. The apparatus of clause 9C13, wherein the first metallization pattern includes discrete contacts.

12C13. The apparatus of clause 1C13, wherein the first metallization pattern comprises tin, aluminum, or another wire that is less expensive than silver.

13C13. The apparatus of clause 1C13, wherein the first metallization pattern comprises copper.

14C13. The apparatus of clause 13C13, wherein the first metallization pattern comprises electroplated copper.

15C13. The apparatus of clause 13C13, further comprising a passivation scheme for mitigating recombination.

16C13. Apparatus according to clause 1C13, further comprising:

a third metallization pattern on the first surface of the semiconductor wafer not proximate the first outer edge or the second outer edge; and

A second scribe line between the third metallization pattern and the second metallization pattern, wherein the first scribe line is between the first metallization pattern and the third metallization pattern.

17C13. The apparatus of clause 16C13, wherein the ratio of the first width defined between the first scribe line and the second scribe line divided by the length of the semiconductor wafer is between about 1:2 and about 1:20.

18C13. The apparatus of clause 17C13, wherein the length is about 156mm or about 125mm.

19C13. The apparatus of clause 17C13, wherein the semiconductor wafer includes a chamfer.

20C13. Apparatus according to clause 19C13, wherein:

The first scribe line and the first outer edge define a first rectangular area including two chamfers and a first metallization pattern, the area of the first rectangular area corresponding to the length and the first The product of the two widths minus the combined area of the two chamfers, the second width is greater than the first width; and

The second scribe line and the first scribe line define a second rectangular area that does not include chamfers and includes a third metallization pattern, the second rectangular area having an area corresponding to the length and the first width accumulation.

21C13. The apparatus of clause 16C13, wherein the third metallization pattern includes fingers directed toward the second metallization pattern.

22C13. The apparatus of clause 1C13, further comprising a third metallization pattern on the second surface of the semiconductor wafer opposite the first surface.

23C13. The apparatus of clause 22C13, wherein the third metallization pattern includes contact pads proximate the locations of the first scribe lines.

24C13. The apparatus of clause 1C13, wherein the first scribed line is formed by a laser.

25C13. The apparatus of clause 1C13, wherein the first scribe line is in the first surface.

26C13. The apparatus of clause 1C13, wherein the first metallization pattern includes features configured to limit the spread of the conductive adhesive.

27C13. The apparatus of clause 26C13, wherein the features comprise raised features.

28C13. The apparatus of clause 27C13, wherein the first metallization pattern includes a contact pad, and the feature includes a barrier adjacent to and above the contact pad.

29C13. The apparatus of clause 26C13, wherein the feature comprises a recessed feature.

30C13. The method of clause 29C13, wherein the recessed feature comprises a moat.

31C13. The apparatus of clause 26C13, further comprising a conductive adhesive in contact with the first metallization pattern.

32C13. The device of clause 31C13, wherein the conductive adhesive is printed.

33C13. The apparatus of clause 1C13, wherein the semiconductor wafer comprises silicon.

34C13. The apparatus of clause 33C13, wherein the semiconductor wafer comprises crystalline silicon.

35C13. The apparatus of clause 33C13, wherein the first front surface is of an n-type conductivity type.

36C13. The apparatus of clause 33C13, wherein the first front surface is of a p-type conductivity type.

37C13. Apparatus according to clause 1C13, wherein:

The first metallization pattern is 5 mm or less from the first outer edge; and

The second metallization pattern is 5 mm or less from the second outer edge.

38C13. The apparatus of clause 1C13, wherein the semiconductor wafer includes a chamfer, and the first metallization pattern includes a tapered portion extending around the chamfer.

39C13. The apparatus of clause 38C13, wherein the tapered portion comprises a bus.

40C13. The apparatus of clause 38C13, wherein the tapered portion includes wires connecting discrete contact pads.

1C14. A method that includes:

scribing a first scribe line on the wafer; and

The silicon wafer is singulated along the first scribe lines using vacuum to provide solar cell strips.

2C14. The method of clause 1C14, wherein the scribing comprises laser scribing.

3C14. The method of clause 2C14, wherein the dividing includes applying a vacuum between the surface of the wafer and the curved surface.

4C14. The method of clause 3C14, wherein the curved surface comprises a vacuum manifold.

5C14. The method of clause 4C14, wherein the wafer is supported on a belt, the belt is moved to a vacuum manifold, and the vacuum is applied through the belt.

6C14. The method of clause 5C14, wherein the segmenting comprises:

orienting the first scribe line at an angle relative to the vacuum manifold; and

Begin cutting at one end of the first scribed line.

7C14. The method of clause 6C14, wherein the angle is substantially a right angle.

8C14. The method of clause 6C14, wherein the angle is not substantially a right angle.

9C14. The method of clause 3C14, further comprising applying an uncured conductive adhesive bonding material.

10C14. The method of clause 9C14, wherein the first scribe line and the uncured conductive adhesive bonding material are on the same surface of the wafer.

11C14. The method of clause 10C14, wherein by selecting the laser power and/or the distance between the first scribe line and the uncured conductive adhesive bonding material, the laser scribe avoids causing the uncured conductive adhesive The bonding material cures.

12C14. The method of clause 10C14, wherein the same surface is opposite a wafer surface supported by a belt that moves the wafer to a curved surface.

13C14. The method of clause 12C14, wherein the curved surface comprises a vacuum manifold.

14C14. The method of clause 9C14, wherein the applying occurs after the scribing.

15C14. The method of clause 9C14, wherein the applying occurs after the dividing.

16C14. The method of clause 9C14, wherein the applying comprises screen printing.

17C14. The method of clause 9C14, wherein the applying comprises ink jet printing.

18C14. The method of clause 9C14, wherein the applying comprises depositing using a mask.

19C14. The method of clause 3C14, wherein the first scribe line is between:

a first metallization pattern on the wafer surface along the first outer edge, with

A second metallization pattern on the wafer surface along the second outer edge.

20C14. The method of clause 19C14, wherein the wafer further comprises a third metallization pattern on the surface of the semiconductor wafer not proximate the first outer edge or the second outer edge, and the method further comprising:

drawing a second scribe line between the third metallization pattern and the second metallization pattern such that the first scribe line is located between the first metallization pattern and the third metallization pattern; and

The silicon wafer is divided along a second scribe line to provide another solar cell strip.

21C14. The method of clause 20C14, wherein a distance between the first scribe line and the second scribe line forms a width defining an aspect ratio between about 1:2 and about 1:20, wherein the wafer's The length is about 125mm or about 156mm.

22C14. The method of clause 19C14, wherein the first metallization pattern includes fingers directed toward the second metallization pattern.

23C14. The method of clause 22C14, wherein the first metallization pattern further includes a bus that intersects the fingers.

24C14. The method of clause 23C14, wherein the bus is within 5mm of the first outer edge.

25C14. The method of clause 22C14, further comprising contacting the fingers with an uncured conductive adhesive bonding material.

26C14. The method of clause 19C14, wherein the first metallization pattern includes discrete contact pads.

27C14. The method of clause 19C14, further comprising printing or electroplating the first metallization pattern on the wafer.

28C14. The method of clause 3, further comprising:

The solar cell strips are arranged in a first super cell, the first super cell comprising at least nineteen solar cell strips, each solar cell strip having a breakdown voltage of at least 10V, wherein the length of adjacent solar cell strips is overlapping edges with conductive adhesive bonding material disposed therebetween; and

The conductive bonding material is cured to electrically connect adjacent overlapping solar cell strips in series.

29C14. The method of clause 28C14, wherein the disposing comprises forming a layered structure, the layered structure comprising an encapsulant, the method further comprising pair laminating the layered structure.

30C14. The method of clause 29C14, wherein the curing occurs at least in part during lamination.

31C14. The method of clause 29C14, wherein the curing and laminating are not performed simultaneously.

32C14. The method of clause 29C14, wherein the encapsulant comprises a thermoplastic olefin polymer.

33C14. The method of clause 29C14, wherein the hierarchical structure comprises:

white backing board; and

Dark stripes on the white backing plate.

34C14. The method of clause 28C14, wherein the disposing includes using metallization pattern features to limit the spread of the conductive adhesive bonding material.

35C14. The method of clause 34C14, wherein the metallization pattern features are located on the front surface of the solar cell strip.

36C14. The method of clause 34C14, wherein the metallization pattern features are located on the back surface of the solar cell strip.

37C14. The method of clause 28C14, further comprising applying a conductive adhesive bonding material between the first super cell and the interconnect connecting the second super cell in series.

38C14. The method of clause 28C14, further comprising forming a ribbon wire between a single bypass diode of the first super cell, the single bypass diode being located in a first junction box of the first solar module, the first junction The box is arranged in pair with the second junction box of the second solar module.

39C14. A method according to clause 28C14, wherein:

the solar cell strip includes a first chamfer;

Long sides of overlapping solar cell strips of the plurality of solar cell strips do not include a second chamfer; and

The width of the solar cell strips is greater than the width of the overlapping solar cell strips such that the solar cell strips and the overlapping solar cell strips have approximately equal areas.

40C14. A method according to clause 28C14, wherein:

the solar cell strip includes a first chamfer;

Long sides of overlapping solar cell strips of the plurality of solar cell strips include a second chamfer; and

The long sides of the overlapping solar cell strips of the plurality of solar cell strips overlap the long sides of the solar cell strips that do not include the first chamfer.

1C15. A method that includes:

forming a first metallization pattern along a first outer edge of the first surface of the semiconductor wafer;

forming a second metallization pattern along a second outer edge of the first surface, the second outer edge being opposite the first outer edge; and

A first scribe line is formed between the first metallization pattern and the second metallization pattern.

2C15. A method as described in clause 1C15, wherein:

The first metallization pattern includes first fingers directed toward the second metallization pattern; and

The second metallization pattern includes second fingers directed toward the first metallization pattern.

3C15. A method as described in clause 2C15, wherein:

The first metallization pattern also includes a first bus that intersects the first finger and is located within 5 mm of the first outer edge; and

The second metallization pattern includes a second bus that intersects the second finger and is within 5 mm of the second outer edge.

4C15. A method according to clause 3C15, further comprising:

On the first surface, a third metallization pattern is formed not along the first outer edge or the second outer edge, the third metallization pattern comprising:

a third bus parallel to the first bus, and

a third finger pointing to the second metallization pattern; and

A second scribe line is formed between the third metallization pattern and the second metallization pattern, wherein the first scribe line is between the first metallization pattern and the third metallization pattern.

5C15. The method of clause 4C15, wherein the first scribe line and the second scribe line are divided by a width, the ratio of the width to the length of the semiconductor wafer being between about 1:2 and about 1:20.

6C15. The method of clause 5C15, wherein the length of the semiconductor wafer is about 156 mm or about 125 mm.

7C15. The method of clause 4C15, wherein the semiconductor wafer includes a chamfer.

8C15. A method as described in clause 7C15, wherein:

The first scribed line and the first outer edge define a first solar cell region including two chamfers and a first metallization pattern, the first solar cell region having a first area, the the first area corresponds to the product of the length of the semiconductor wafer and the first width minus the combined area of the two chamfers; and

The second scribe line and the first scribe line define a second solar cell region that does not include a chamfer and includes a third metallization pattern, the second solar cell region has a second area, so The second area corresponds to the product of the length and a second width narrower than the first width such that the first area and the second area are approximately equal.

9C15. The method of clause 8C15, wherein the length is about 156 mm or about 125 mm.

10C15. The method of clause 4C15, wherein forming the first scribe line and forming the second scribe line comprises laser scribing.

11C15. The method of clause 4C15, wherein forming the first metallization pattern, forming the second metallization pattern, and forming the third metallization pattern comprises printing.

12C15. The method of clause 11C15, wherein forming the first metallization pattern, forming the second metallization pattern, and forming the third metallization pattern comprises screen printing.

13C15. The method of clause 11C15, wherein forming the first metallization pattern includes forming a plurality of contact pads, the contact pads comprising silver.

14C15. The method of clause 4C15, wherein forming the first metallization pattern, forming the second metallization pattern, and forming the third metallization pattern comprises electroplating.

15C15. The method of clause 14C15, wherein the first metallization pattern, the second metallization pattern, and the third metallization pattern comprise copper.

16C15. The method of clause 4C15, wherein the first metallization pattern comprises aluminum, tin, silver, copper, and/or less expensive wires than silver.

17C15. The method of clause 4C15, wherein the semiconductor wafer comprises silicon.

18C15. The method of clause 17C15, wherein the semiconductor wafer comprises crystalline silicon.

19C15. The method of clause 4C15, further comprising forming a fourth metallization pattern on the second surface of the semiconductor wafer between the first outer edge and within 5 mm of the second inscribed location.

20C15. The method of clause 4C15, wherein the first surface comprises a first conductivity type and the second surface comprises a second conductivity type opposite the first conductivity type.

21C15. The method of clause 4C15, wherein the fourth metallization pattern includes contact pads.

22C15. The method of clause 3C15, further comprising applying a conductive adhesive to the semiconductor wafer.

23C15. The method of clause 22C15, further comprising applying a conductive adhesive in contact with the first finger.

24C15. The method of clause 23C15, wherein applying the conductive adhesive comprises screen printing or depositing with a mask.

25C15. The method of clause 3C15, further comprising dividing the semiconductor wafer along the first scribe lines to form first solar cell strips including the first metallization pattern.

26C15. The method of clause 25C15, wherein the dividing includes applying a vacuum to the first scribe line.

27C15. The method of clause 26C15, further comprising disposing the semiconductor wafer on a belt that is moved to a vacuum.

28C15. The method of clause 25C15, further comprising applying a conductive adhesive to the first solar cell strip.

29C15. A method according to clause 25C15, further comprising:

Disposing a first solar cell strip in a first super cell, the first super cell comprising at least nineteen solar cell strips, each solar cell strip having a breakdown voltage of at least 10V, wherein the length of adjacent solar cell strips the edges overlap with the conductive adhesive disposed between them; and

The conductive adhesive is cured to electrically connect adjacent overlapping solar cell strips in series.

30C15. The method of clause 29C15, wherein the disposing comprises forming a layered structure, the layered structure comprising an encapsulant, the method further comprising pair laminating the layered structure.

31C15. The method of clause 30C15, wherein the curing occurs at least in part during lamination.

32C15. The method of clause 30C15, wherein the curing and laminating are not performed simultaneously.

33C15. The method of clause 30C15, wherein the encapsulant comprises a thermoplastic olefin polymer.

34C15. The method of clause 30C15, wherein the hierarchical structure comprises:

white backing board; and

Dark stripes on the white backing plate.

35C15. The method of clause 29C15, wherein the disposing includes limiting the spread of the conductive adhesive with metallized pattern features.

36C15. The method of clause 35C15, wherein the metallization pattern features are located on the front surface of the first solar cell strip.

37C15. The method of clause 29C15, further comprising applying a conductive adhesive between the first super cell and the interconnect connecting the second super cell in series.

38C15. The method of clause 29C15, further comprising forming a ribbon wire between a single bypass diode of the first super cell, the single bypass diode being located in a first junction box of the first solar module, the first junction The box is arranged in pair with the second junction box of the second solar module.

39C15. A method according to clause 29C15, wherein:

the first solar cell strip includes a first chamfer;

the long sides of the overlapping solar cell strips of the first super cells do not include the second chamfer; and

The width of the first solar cell strip is greater than the width of the overlapping solar cell strip such that the first solar cell strip and the overlapping solar cell strip have approximately equal areas.

40C15. A method according to clause 29C15, wherein:

the first solar cell strip includes a first chamfer;

The long sides of the overlapping solar cell strips of the first super cells include a second chamfer; and

The long sides of the overlapping solar cell strips overlap the long sides of the first solar cell strips that do not include the first chamfer.

1C16. A method that includes:

Obtaining or providing a silicon wafer including a front surface metallization pattern including a first row of busses or contact pads disposed parallel to and adjacent to a first outer edge of the wafer, and parallel to and a second row of busses or contact pads disposed adjacent a second outer edge of the wafer, the second outer edge of the wafer being opposite and parallel to the first edge;

dividing the silicon wafer along one or more scribe lines parallel to the first outer edge and the second outer edge of the wafer to form a plurality of rectangular solar cells, wherein the first busses or the row of contact pads is arranged parallel to and adjacent to the long outer edge of the first rectangular solar cell, and the second bus or row of contact pads is arranged parallel to and adjacent to the long outer edge of the second rectangular solar cell; and

arranging the rectangular solar cells in a line with long sides of adjacent solar cells overlapping each other and conductively joined to electrically connect the solar cells in series to form a super cell;

wherein the first bus line or row of contact pads of the first rectangular solar cell overlaps and is conductively bonded to the bottom surface of an adjacent rectangular solar cell in the super cell.

2C16. The method of clause 1C16, wherein a second bus line or row of contact pads on a second rectangular solar cell overlaps and is conductively bonded to a bottom surface of an adjacent rectangular solar cell in the super cell.

3C16. The method of clause 1C16, wherein the silicon wafer is a square or pseudo-square silicon wafer.

4C16. The method of clause 3C16, wherein the silicon wafer has sides of about 125 mm in length or about 156 mm in length.

5C16. The method of clause 3C16, wherein each rectangular solar cell has a length to width ratio between about 2:1 and about 20:1.

6C16. The method of clause 1C16, wherein the silicon wafer is a crystalline silicon wafer.

7C16. The method of clause 1C16, wherein the first bus or row of contact pads and the second row of busses or contact pads are located in an edge region of the silicon wafer that converts light to electricity more efficiently than a center of the silicon wafer area is lower.

8C16. The method of clause 1C16, wherein the front surface metallization pattern includes a first plurality of parallel fingers electrically connected to a first bus or row of contact pads and extending inwardly from a first outer edge of the wafer, And a second plurality of parallel fingers electrically connected to a second bus or row of contact pads and extending inwardly from a second outer edge of the wafer.

9C16. The method of clause 1C16, wherein the front surface metallization pattern comprises at least a third bus or contact pad row oriented parallel to and between the first bus or contact pad row and the second bus or contact pad row, and a third plurality of parallel fingers oriented perpendicular to and electrically connected to a third row of busses or contact pads, and after the silicon wafer is diced to form a plurality of rectangular solar cells, the third row of busses or contact pads Arranged parallel to and adjacent to the long outer edge of the third rectangular solar cell.

10C16. The method of clause 1C16, comprising applying a conductive adhesive to a first bus bar or row of contact pads, thereby conductively bonding a first rectangular solar cell to an adjacent solar cell.

11C16. The method of clause 10C16, wherein the metallization pattern includes a barrier configured to limit the spread of conductive adhesive.

12C16. The method of clause 10C16, comprising applying the conductive adhesive by screen printing.

13C16. The method of clause 10C16, comprising applying the conductive adhesive by ink jet printing.

14C16. The method of clause 10C16, wherein a conductive adhesive is applied prior to forming scribe lines in the silicon wafer.

15C16. The method of clause 1C16, wherein dividing the silicon wafer along the one or more scribe lines comprises applying a vacuum between a bottom surface of the silicon wafer and the curved support surface to bend the silicon wafer against the curved support surface to thereby bend the silicon wafer along the curved support surface. The silicon wafer is diced with one or more scribe lines.

16C16. A method as described in clause 1C16, wherein:

The silicon wafer is a pseudo-square silicon wafer including chamfers, and the plurality of rectangular solar cells are formed after the silicon wafer is divided, one or more of the rectangular solar cells including one of the chamfers or more; and

The width of the scribed lines is selected by making the width perpendicular to the long axis of the rectangular solar cell including chamfers greater than the width perpendicular to the long axis of the rectangular solar cell lacking chamfers spaced apart to compensate for the chamfer, so that each of the plurality of rectangular solar cells in the super cell has a substantially equal area exposed to sunlight during operation of the super cell.

17C16. The method of clause 1C16, comprising arranging the super cells in a layered structure between a transparent front sheet and a back sheet, and laminating the layered structure.

18C16. The method of clause 17C16, wherein laminating the layered structure completes curing of a conductive adhesive between adjacent rectangular solar cells disposed in a super cell to conductively connect adjacent rectangular solar cells to joined to each other.

19C16. The method of clause 17C16, wherein the super cells are arranged in one of two or more parallel rows of super cells in the layered structure, and the back plate is a white plate comprising parallel dark stripes , the positions and widths of the dark stripes correspond to the positions and widths of the gaps between the two or more parallel rows of super cells, so that the white portion of the rear plate passes between the rows of super cells in the assembled module gaps are not visible.

20C16. The method of clause 17C16, wherein the front sheet and the back sheet are glass sheets and the super cell is encapsulated in thermoplastic olefin layers sandwiched between glass sheets.

21C16. The method of clause 1C16, comprising arranging the super cells in a first module, the first module including a junction box arranged in a pair with a second junction box of a second solar module.

1D. A solar module comprising:

A plurality of super cells arranged in two or more parallel rows, each super cell comprising a plurality of rectangular or substantially rectangular silicon solar cells arranged in a straight line, wherein the long sides of adjacent silicon solar cells overlap and conduct directly with each other sexually joined to electrically connect the silicon solar cells in series;

a first hidden tap contact pad on the back surface of the first solar cell located midway along the first super cell; and

a first electrical interconnect conductively coupled to the first hidden tap contact pad;

Wherein the first electrical interconnect includes stress relief features that accommodate uneven thermal expansion between the electrical interconnect and the silicon solar cell to which the electrical interconnect is bonded.

2D. The solar module of clause ID, comprising a second hidden tap contact pad on a back surface of a second solar cell located adjacent to the first solar cell and located along the second super An intermediate position of the battery where the first hidden tap contact pad is electrically connected to the second hidden tap contact pad through the first electrical interconnect.

3D. The solar module of clause 2D, wherein the first electrical interconnect extends through the gap between the first super cell and the second super cell and is conductively bonded to the second hidden tap contact pad.

4D. The solar module of clause ID, comprising: a second hidden tap contact pad on a back surface of a second solar cell located at another intermediate location along the first super cell; a second electrical interconnect conductively bonded to the second hidden tap contact pad; and a bypass diode utilizing the first electrical interconnect and the second electrical interconnect to communicate with the first hidden The solar cell is electrically connected in parallel between the tap contact pad and the second hidden tap contact pad.

5D. The solar module of clause ID, wherein the first hidden tap contact pads are a plurality of hidden taps arranged on the back surface of the first solar cell in a row extending parallel to the long axis of the first solar cell one of the contact pads, and wherein the first electrical interconnect is conductively bonded to each of the plurality of hidden contacts and has a span along the long axis substantially equal to that of the first solar cell length.

6D. The solar module of clause ID, wherein the first hidden tap contact pad is located adjacent to a short edge of a back surface of a first solar cell, the first electrical interconnect not along the solar cell The long axis extends substantially inward from the hidden tap contact pads, and a back surface metallization pattern on the first solar cell provides a conductive path for the interconnect having less than or equal to about each Square 5 ohm sheet resistance.

7D. The solar module of clause 6D, wherein the sheet resistance is less than or equal to about 2.5 ohms per square.

8D. The solar module of clause 6D, wherein the first interconnect includes two protrusions positioned on opposite sides of the stress relief feature, and one of the protrusions conductively engages the first hidden tap contact pad.

9D. The solar module of clause 8D, wherein the two protrusions have different lengths.

10D. The solar module of clause ID, wherein the first electrical interconnect includes an alignment feature that identifies a desired alignment with the first hidden tap contact pad.

11D. The solar module of clause ID, wherein the first electrical interconnect includes an alignment feature that identifies a desired alignment with an edge of the first super cell.

12D. A solar module according to clause ID, arranged in an overlapping manner with another solar module electrically connected thereto in the overlapping region.

13D. A solar module comprising:

glass front panel;

rear panel;

A plurality of super cells arranged in two or more parallel rows between the glass front sheet and the back sheet, each super cell comprising a plurality of rectangular or substantially rectangular silicon solar cells arranged in a straight line, wherein Long sides of adjacent silicon solar cells overlap and are flexibly conductively bonded directly to each other to electrically connect the silicon solar cells in series; and

a first flexible electrical interconnect rigidly, conductively bonded to a first of the plurality of super cells;

wherein the flexible conductive junction between the overlapping solar cells provides the super cell with mechanical plasticity to reconcile the super cell with thermal expansion mismatch between the glass front sheets so as not to damage the solar module; and

wherein the rigid conductive bond between the first super cell and the first flexible electrical interconnect forces the first flexible electrical interconnect at a temperature range of about -40°C to about 180°C, attuned perpendicular to the thermal expansion mismatch between the first super cells and the first flexible electrical interconnect in the direction of the super cell row so as not to damage the solar module.

14D. The solar module of clause 13D, wherein the conductive bond between overlapping adjacent solar cells within the super cell and the conductive bond between the super cell and the flexible electrical interconnect utilize different conductive adhesives.

15D. The solar module of clause 14D, wherein the two conductive adhesives can be cured in the same processing step.

16D. The solar module of clause 13D, wherein the conductive bond on one side of the at least one solar cell within the super cell utilizes a different conductive adhesive than the conductive bond on the other side of the solar cell.

17D. The solar module of clause 16D, wherein the two conductive adhesives can be cured in the same processing step.

18D. The solar module of clause 13D, wherein the conductive bonding between overlapping adjacent solar cells mediates differential motion between each cell and the glass front sheet greater than or equal to about 15 microns.

19D. The solar module of clause 13D, wherein the conductive bonds between overlapping adjacent solar cells have a thickness perpendicular to the solar cells of less than or equal to about 50 microns and a thermal conductivity perpendicular to the solar cells Greater than or equal to about 1.5W/(m-K).

20D. The solar module of clause 13D, wherein the first flexible electrical interconnect itself is subject to thermal expansion or contraction greater than or equal to about 40 microns.

21D. The solar module of clause 13D, wherein the portion of the first flexible electrical interconnect that is conductively bonded to the super cell is ribbon-shaped, formed of copper, and has a thickness in a direction perpendicular to its surface to which the solar cell is bonded Less than or equal to about 50 microns.

22D. The solar module of clause 21D, wherein the portion of the first flexible electrical interconnect that is conductively bonded to the super cell is ribbon-shaped, formed of copper, and has a thickness in a direction perpendicular to its surface to which the solar cell is bonded Less than or equal to about 30 microns.

23D. The solar module of clause 21D, wherein the first flexible electrical interconnect includes an integral conductive copper portion that is not bonded to the solar cell and is more conductively bonded to the first flexible electrical interconnect than in the first flexible electrical interconnect. That part of the solar cell provides higher conductivity.

24D. The solar module of clause 21D, wherein the first flexible electrical interconnect has greater than or equal to about 10 mm in a direction perpendicular to the direction of current flow through the interconnect in the plane of the solar cell surface width.

25D. The solar module of clause 21D, wherein the first flexible electrical interconnect is conductively bonded to a wire near the solar cell that provides a higher conductivity than the first electrical interconnect.

26D. A solar module according to clause 13D, arranged in an overlapping manner with another solar module electrically connected thereto in the overlapping region.

27D. A solar module comprising:

A plurality of super cells arranged in two or more parallel rows, each super cell comprising a plurality of rectangular or substantially rectangular silicon solar cells arranged in a straight line, wherein the long sides of adjacent silicon solar cells overlap and conduct directly with each other sexually joined to electrically connect the silicon solar cells in series; and

hidden tap contact pads on the back surface of the first solar cell that do not conduct large currents during normal operation;

wherein the first solar cell is located midway along a first of the super cells in a first row of the super cells, and the hidden tap contact pads are electrically connected in parallel to the second row of the super cells at least a second solar cell in the .

28D. The solar module of clause 27D, comprising electrical interconnects joined to hidden tap contact pads and electrically interconnecting the hidden tap contact pads to a second solar cell, wherein the electrical interconnects have The span is not substantially equal to the length of the first solar cell, and the back surface metallization pattern on the first solar cell provides a conductive path for the hidden tap contact pad, the conductive path having less than or equal to about 5 per square Ohm thin film resistor.

29D. The solar module of clause 27D, wherein the plurality of super cells are arranged in three or more parallel rows, the parallel rows having a span equal to the width of the solar module in a direction perpendicular to the rows, and the the hidden tap contact pads are electrically connected to hidden contact pads on at least one solar cell in each row of super cells to electrically connect the rows of super cells in parallel and to at least one hidden tap contact pad Or at least one bus connection to the interconnect between hidden tap contact pads is connected to a bypass diode or other electronic device.

30D. The solar module of clause 27D, comprising a flexible electrical interconnect conductively bonded to the hidden tap contact pad to electrically connect it to a second solar cell, wherein:

The portion of the flexible electrical interconnect that is conductively bonded to the hidden tap contact pads is ribbon-shaped, formed of copper, and is at the surface where the flexible electrical interconnect is bonded to the solar cell The thickness in the vertical direction is less than or equal to about 50 microns; and

The conductive engagement between the hidden tap contact pads and the flexible electrical interconnect forces the flexible electrical interconnect to withstand the contact between the first solar cell and the flexible electrical interconnect. Thermal expansion mismatch, and in a temperature range of about -40°C to about 180°C, reconciling the relative motion between the first solar cell and the second solar cell caused by thermal expansion so that the relative motion is not damaged the solar module.

31D. The solar module of clause 27D, wherein when the solar module is in operation, the first hidden contact pads can conduct a greater current than can be generated in any single solar cell.

32D. The solar module of clause 27D, wherein the front surface of the first solar cell overlying the first hidden tap contact pad is not occupied by the contact pad or any other interconnect feature.

33D. The solar module of clause 27D, wherein any area on the front surface of the first solar cell that is not overlapped by a portion of an adjacent solar cell in the first super cell is not occupied by contact pads or any other interconnect feature.

34D. The solar module of clause 27D, wherein a majority of the cells in each super cell do not have hidden tap contact pads.

35D. The solar module of clause 34D, wherein cells with hidden tap contact pads may have a larger light collection area than cells without hidden tap contact pads.

36D. A solar module according to clause 27D, arranged in an overlapping manner with another solar module electrically connected thereto in the overlapping region.

37D. A solar module comprising:

glass front panel;

rear panel;

A plurality of super cells arranged in two or more parallel rows between the glass front sheet and the back sheet, each super cell comprising a plurality of rectangular or substantially rectangular silicon solar cells arranged in a straight line, wherein Long sides of adjacent silicon solar cells overlap and are flexibly conductively bonded directly to each other to electrically connect the silicon solar cells in series; and

a first flexible electrical interconnect rigidly, conductively bonded to a first of the plurality of super cells;

wherein the flexible conductive bond between the overlapping solar cells is formed by the first conductive adhesive, and the flexible conductive bond has a shear modulus of less than or equal to about 800 megapascals. and

wherein the rigid conductive bond between the first super cell and the first flexible electrical interconnect is formed from a second conductive adhesive, and the rigid conductive bond has a shear strength greater than or equal to about 2000 megapascals Cut modulus.

38D. The solar module of clause 37D, wherein the first conductive adhesive and the second conductive adhesive are different, but the two conductive adhesives can be cured in the same processing step.

39D. The solar module of clause 37D, wherein the conductive bonds between overlapping adjacent solar cells have a thickness perpendicular to the solar cells of less than or equal to about 50 microns and a thermal conductivity perpendicular to the solar cells Greater than or equal to about 1.5W/(m-K).

40D. A solar module according to clause 37D, arranged in an overlapping manner with another solar module electrically connected thereto in the overlapping region.

1E. A solar module comprising: a number N greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows, each super cell comprising a plurality of said silicon solar cells arranged in a straight line, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other to electrically connect the silicon solar cells in series; wherein the super cells are electrically connected to provide High DC voltage greater than or equal to about 90 volts.

2E. A solar module according to clause IE, comprising one or more flexible electrical interconnects arranged to electrically connect a plurality of super cells in series to provide a high direct current voltage.

3E. The solar module of clause 2E, comprising module level power electronics including an inverter for converting a high DC voltage to an AC voltage.

4E. The solar module of clause 3E, wherein the module level power electronics sense the high DC voltage and operate the module at an optimal current-voltage power point.

5E. The solar module of clause IE, comprising module-level power electronics electrically connected to each pair of adjacent series-connected super-cell rows for electrically connecting one or more pairs of super-cell rows in series to provide a high DC voltage, the module Stage power electronics include inverters for converting high DC voltages to AC voltages.

6E. The solar module of clause 5E, wherein the module level power electronics sense the voltage across each individual pair of super cell rows and operate each individual pair of super cells at an optimal current-voltage power point battery row.

7E. The solar module of clause 6E, wherein if the voltage across an individual pair of super cell rows is below a threshold, module level power electronics disconnect the pair of super cell rows from the circuit providing the high DC voltage.

8E. The solar module of clause IE, comprising module-level power electronics electrically connected to each individual row of super cells for electrically connecting two or more rows of super cells in series to provide a high DC voltage, the module Stage power electronics include inverters for converting high DC voltages to AC voltages.

9E. The solar module of clause 8E, wherein the module level power electronics sense the voltage across each individual super cell row and operate each individual super cell row at an optimal current-voltage power point.

10E. The solar module of clause 9E, wherein if the voltage across an individual row of super cells is below a threshold, module level power electronics disconnect the individual row of super cells from the circuit providing the high DC voltage.

11E. The solar module of clause IE, comprising module level power electronics electrically connected to each individual super cell for electrically connecting two or more super cells in series to provide a high DC voltage, the module level power The electronics include inverters for converting high DC voltages to AC voltages.

12E. The solar module of clause 11E, wherein the module level power electronics sense the voltage across each individual super cell and operate each individual super cell at an optimal current-voltage power point.

13E. The solar module of clause 12E, wherein if the voltage across an individual super cell is below a threshold, the module level power electronics disconnect the individual super cell from the circuit providing the high DC voltage.

14E. The solar module of clause IE, wherein each super cell is electrically segmented into a plurality of segments by hidden taps, the solar module comprising each sub-cell electrically connected to each super cell by hidden taps Module level power electronics of a segment for electrically connecting two or more segments in series to provide a high DC voltage, the module level power electronics including an inverter for converting the high DC voltage to an AC voltage.

15E. The solar module of clause 14E, wherein the module level power electronics sense the voltage across each individual segment in each super cell and operate each individual segment at an optimal current-voltage power point segment.

16E. The solar module of clause 15E, wherein if the voltage across an individual segment is below a threshold, the module level power electronics disconnect the individual segment from the circuit providing the high DC voltage.

17E. The solar module of any of clauses 4E, 6E, 9E, 12E or 15E, wherein the optimum current-voltage power point is a maximum current-voltage power point.

18E. The solar module of any of clauses 3E to 17E, wherein the module level power electronics lacks DC-to-DC boost components.

19E. The solar module of any one of clauses 1E to 18E, wherein N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to About 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

20E. The solar module of any one of clauses 1E to 19E, wherein the high DC voltage is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, greater than or equal to about 300 volts or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

21E. A solar photovoltaic system comprising:

two or more solar modules electrically connected in parallel; and

inverter;

wherein each solar module includes a number N of greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows, the silicon solar cells in each module Each super cell includes two or more of the silicon solar cells arranged in line in the module, with the long sides of adjacent silicon solar cells overlapping and conductively bonded to each other to connect the silicon solar cells The cells are electrically connected in series and the super cells in each module are electrically connected such that the modules provide a high voltage DC output greater than or equal to about 90 volts; and

Wherein the inverter is electrically connected to two or more solar modules to convert the high voltage DC output of these modules to AC power.

22E. The solar photovoltaic system of clause 21E, wherein each solar module includes one or more flexible electrical interconnects arranged to electrically connect the super cells in the solar module in series, thereby providing High voltage DC output for solar modules.

23E. The solar photovoltaic system of clause 21E, comprising at least a third solar module electrically connected in series with a first solar module of the two or more solar modules electrically connected in parallel, wherein the third solar module comprises a number N' greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows, each super cell in the third solar module comprising the two or more of the silicon solar cells arranged in line in the module, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other to electrically connect the silicon solar cells in series, and the first The super cells in the three solar modules are electrically connected such that the modules provide a high voltage DC output greater than or equal to about 90 volts.

24E. The solar photovoltaic system of clause 23E, comprising at least a fourth solar module electrically connected in series with a second solar module of the two or more solar modules electrically connected in parallel, wherein the fourth solar module comprises a number N' greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows, each super cell in the fourth solar module comprising the two or more of the silicon solar cells arranged in line in the module, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other to electrically connect the silicon solar cells in series, and the first The super cells in the four solar modules are electrically connected such that the modules provide a high voltage DC output greater than or equal to about 90 volts.

25E. A solar photovoltaic system according to clauses 21E to 24E, comprising a fuse arranged to prevent any one solar module from dissipating power generated by the other solar modules due to a short circuit.

26E. A solar photovoltaic system according to any of clauses 21E to 25E, comprising a blocking diode arranged to prevent any one solar module from dissipating power produced by the other solar modules due to a short circuit.

27E. A solar photovoltaic system according to any one of clauses 21E to 26E, comprising a positive bus and a negative bus to which two or more solar modules are electrically connected in parallel, to which an inverter is also electrically connected bus.

28E. A solar photovoltaic system according to any one of clauses 21E to 26E, comprising a combiner box to which two or more solar modules are electrically connected by separate wires, and the combiner box electrically connects the solar modules in parallel .

29E. The solar photovoltaic system of clause 28E, wherein the combiner box includes a fuse arranged to prevent any one solar module from dissipating power generated by the other solar modules due to a short circuit.

30E. A solar photovoltaic system according to clause 28E or clause 29E, wherein the combiner box includes a blocking diode arranged to prevent any one solar module from dissipating power generated by the other solar modules due to a short circuit.

31E. A solar photovoltaic system according to any of clauses 21E to 30E, wherein the inverter is configured to operate the solar modules at a DC voltage above a minimum value set to avoid reverse biasing of the modules .

32E. A solar photovoltaic system according to any of clauses 21E to 30E, wherein the inverter is configured to identify a reverse bias state and operate the solar modules at a voltage that avoids the reverse bias state.

33E. The solar module of any one of clauses 21E to 32E, wherein N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to About 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

34E. The solar module of any one of clauses 21E to 33E, wherein the high DC voltage is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, greater than or equal to about 300 volts or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

35E. A solar photovoltaic system according to any of clauses 21E to 34E positioned on a roof.

36E. A solar photovoltaic system comprising:

A first solar module comprising a number N greater than or equal to about 150 rectangular or substantially rectangular silicon solar cells arranged in two or more parallel rows of a plurality of super cells, each super cell comprising a plurality of the silicon solar cells arranged in a straight line, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other to electrically connect the silicon solar cells in series; and

inverter;

Wherein the super battery is electrically connected for supplying a high direct current voltage greater than or equal to about 90 volts to an inverter, and the inverter converts the direct current into alternating current.

37E. The solar photovoltaic system of clause 36E, wherein the inverter is a micro-inverter integrated with the first solar module.

38E. The solar photovoltaic system of clause 36E, wherein the first solar module includes one or more flexible electrical interconnects arranged to electrically connect the super cells in the solar module in series, thereby providing High voltage DC output for solar modules.

39E. The solar photovoltaic system of any one of clauses 36E to 38E, comprising at least a second solar module electrically connected in series with the first solar module, wherein the second solar module comprises a number N' greater than or equal to about 150 rectangular or substantial upper rectangular silicon solar cells arranged as a plurality of super cells in two or more parallel rows, each super cell in a second solar module comprising the silicon solar cells arranged in a straight line in the module two or more of the cells in which the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other to electrically connect the silicon solar cells in series, and the super cells of the second solar module are electrically connected to Enables the module to provide a high voltage DC output greater than or equal to approximately 90 volts.

40E. The solar module of any of clauses 36E to 39E, wherein the inverter lacks a DC-to-DC boost component.

41E. The solar module of any one of clauses 36E to 40E, wherein N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to About 450, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

42E. The solar module of any one of clauses 36E to 41E, wherein the high DC voltage is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, greater than or equal to about 300 volts or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

43E. A solar module comprising:

Greater than or equal to about 250 N rectangular or substantially rectangular silicon solar cells arranged in a plurality of serially connected super cells in two or more parallel rows, each super cell comprising a plurality of super cells arranged in a A plurality of the silicon solar cells in a straight line, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other with an adhesive that is both electrically and thermally conductive to electrically connect the silicon solar cells in the super cell in series connection; and

Less than one bypass diode per 25 solar cells;

wherein the electrically and thermally conductive adhesive forms bonds between adjacent solar cells having a thickness of less than or equal to about 50 microns in a direction perpendicular to the solar cells and a thermal conductivity perpendicular to the solar cells The rate is greater than or equal to about 1.5W/(m-K).

44E. The solar module of clause 43E, wherein the super cell is encapsulated in a thermoplastic olefin layer between a front sheet and a back sheet.

45E. The solar module of clause 43E, wherein the super cell is encapsulated between a glass front sheet and a back sheet.

46E. A solar module according to clause 43E comprising less than one bypass diode per 30 solar cells, less than one bypass diode per 50 solar cells, or less than one bypass diode per 100 solar cells One, either including only a single bypass diode, or no bypass diode.

47E. The solar module of clause 43E, comprising no bypass diodes, only a single bypass diode, no more than three bypass diodes, no more than six bypass diodes, or no more than ten bypass diodes.

48E. The solar module of clause 43E, wherein the conductive bonding between the overlapping solar cells provides the super cells with mechanical plasticity to harmonize an orientation parallel to the super cell row over a temperature range of about -40°C to about 100°C The thermal expansion mismatch between the upper super cell and the glass front plate prevents the thermal expansion mismatch from damaging the solar module.

49E. The solar module of any one of clauses 43E to 48E, wherein N is greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to About 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

50E. The solar module of any one of clauses 43E to 49E, wherein the super cells are electrically connected to provide a high direct current voltage greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to About 240 volts, greater than or equal to about 300 volts, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

51E. A solar energy system comprising:

A solar module according to clause 43E; and

An inverter electrically connected to the solar module and configured to convert the DC output from the solar module to provide an AC output.

52E. The solar energy system of clause 51E, wherein the inverter lacks a DC-to-DC boost component.

53E. The solar energy system of clause 51E, wherein the inverter is configured to operate the solar module at a DC voltage above a minimum value set to avoid reverse biasing the solar cells.

54E. The solar energy system of clause 53E, wherein the minimum voltage value is temperature dependent.

55E. The solar energy system of clause 51E, wherein the inverter is configured to recognize a reverse bias state and operate the solar module at a voltage that avoids the reverse bias state.

56E. The solar energy system of clause 55E, wherein the inverter is configured to operate the solar module within a local maximum region of the voltage-current power curve of the solar module to avoid a reverse bias condition.

57E. The solar energy system of any of clauses 51E to 56E, wherein the inverter is a micro-inverter integrated with the solar module.

1F. A method of manufacturing a solar cell, the method comprising:

advancing the solar cell wafer along the curved surface; and

A vacuum is applied between the curved surface and the bottom surface of the solar cell wafer to bend the solar cell wafer against the curved surface to cut the solar cell wafer along one or more previously prepared scribe lines, thereby cutting the solar cell wafer from the solar cell A plurality of solar cells are separated from the cell wafer.

2F. The method of clause IF, wherein the curved surface is a curved portion of the upper surface of a vacuum manifold that applies a vacuum to the bottom surface of the solar cell wafer.

3F. The method of clause 2F, wherein the vacuum applied by the vacuum manifold to the bottom surface of the solar cell wafer varies along the direction of travel of the solar cell wafer and reaches maximum intensity in the area of the vacuum manifold where the solar cell wafer is cut.

4F. The method of clause 2F or clause 3F, comprising transporting the solar cell wafer along the curved upper surface of the vacuum manifold using a perforated belt, wherein vacuum is applied to the bottom surface of the solar cell wafer through perforations in the perforated belt.

5F. A method according to clause 4F, wherein the perforations are arranged on the perforated belt such that the leading and trailing edges of the solar cell wafer along its own direction of travel must overlie at least one perforation in the perforated belt.

6F. The method of any one of clauses 2F to 5F, comprising: advancing the solar cell wafer along a flat region of the upper surface of the vacuum manifold to a transitional curved region having the first curvature in the upper surface of the vacuum manifold; then pushing the The solar cell wafer is advanced into a cutting region in the upper surface of the vacuum manifold where the solar cell wafer is cut, the cutting region of the vacuum manifold having a second curvature that is tighter than the first curvature.

7F. The method of clause 6F, wherein the curvature of the transition region is defined by a continuous geometric function of increasing curvature.

8F. The method of clause 7F, wherein the curvature of the cut region is defined by a continuous geometric function of increasing curvature.

9F. The method of clause 6F, comprising advancing the cut solar cell into a post-cut region in the vacuum manifold having a third curvature, the third curvature being tighter than the second curvature.

10F. The method of clause 9F, wherein the curvature of the transitional bend region, the cut region, and the post-cut region are defined by a single continuous geometric function of increasing curvature.

11F. The method of clause 7F, clause 8F or clause 10F, wherein the continuous geometric function of increasing curvature is a clothoid.

12F. A method according to any one of clauses 1F to 11F, comprising applying a stronger vacuum between the solar cell wafer and the curved surface, first at one end of each scribed line and then at the other end of each scribed line , so as to provide an asymmetric stress distribution along each scribe line, thereby facilitating the formation of the core of a single cut crack along each scribe line, and the propagation of a single cut crack along each scribe line.

13F. The method of any of clauses 1F to 12F, comprising removing the cut solar cell from the curved surface, wherein the edges of the cut solar cell do not touch before removing the solar cell from the curved surface.

14F. A method according to any of clauses 1F to 13F, comprising:

laser scribed lines onto solar cell wafers; and

applying a conductive adhesive bonding material to the top surface portion of the solar cell wafer prior to dicing the solar cell wafer along the scribe lines;

Each of the cut solar cells includes a portion of the conductive adhesive bonding material disposed along the cut edge of its top surface.

15F. The method of clause 14F, comprising laser scribing a scribe line followed by applying a conductive adhesive bonding material.

16F. The method of clause 14F, comprising applying a conductive adhesive bonding material followed by laser scribing a scribe line.

17F. A method of making a solar cell string from cut solar cells made by the method of any one of clauses 14F to 16F, wherein the cut solar cells are rectangular, the method comprising:

arranging a plurality of rectangular solar cells in a straight line, wherein long sides of adjacent rectangular solar cells overlap in an overlapping manner, wherein a portion of the conductive adhesive bonding material is disposed between adjacent rectangular solar cells; and

The conductive bonding material is cured, thereby bonding adjacent overlapping rectangular solar cells to each other and electrically connecting them in series.

18F. The method of any of clauses IF to 17F, wherein the solar cell wafer is a square or pseudo-square silicon solar cell wafer.

1G. A method of making a solar cell string, the method comprising:

forming a back surface metallization pattern on each of the one or more square solar cells;

printing a complete front surface metallization pattern onto each of the one or more square solar cells in a single stencil printing step using a single stencil;

dividing each square solar cell into two or more rectangular solar cells, thereby forming a plurality of rectangular solar cells from the one or more square solar cells, each rectangular solar cell having a complete front surface metallization pattern and back surface metallization pattern;

arranging a plurality of rectangular solar cells in a straight line, wherein the long sides of adjacent rectangular solar cells overlap in an overlapping manner; and

conductively bonding the rectangular solar cells of each pair of adjacent overlapping rectangular solar cells to each other with a conductive bonding material disposed between the two rectangular solar cells for bonding one of the pair of rectangular solar cells The front surface metallization pattern of the is electrically connected to the rear surface metallization pattern of the other cell of the pair of rectangular solar cells, thereby electrically connecting the plurality of rectangular solar cells in series.

2G. The method of clause 1G, wherein all portions of the one or more features in the stencil used to define the front surface metallization pattern on the one or more square solar cells are constrained to be located in the stencil during stencil printing Physical connections to other parts of the plane on which the stencil is located.

3G. The method of clause 1G, wherein the front surface metallization pattern on each rectangular solar cell includes a plurality of fingers oriented perpendicular to the long sides of the rectangular solar cell, and the fingers in the front surface metallization pattern are all Not physically connected to each other by the front surface metallization patterns.

4G. The method of clause 3G, wherein the fingers have a width of about 10 microns to about 90 microns.

5G. The method of clause 3G, wherein the fingers have a width of about 10 microns to about 50 microns.

6G. The method of clause 3G, wherein the fingers have a width of about 10 microns to about 30 microns.

7G. The method of clause 3G, wherein the fingers have a height of about 10 microns to about 50 microns perpendicular to the front surface of the rectangular solar cell.

8G. The method of clause 3G, wherein the fingers have a height perpendicular to the front surface of the rectangular solar energy of about 30 microns or more.

9G. The method of clause 3G, wherein the front surface metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged parallel to and adjacent to an edge of a long side of the rectangular solar cell, wherein each contact The pads are located at the ends corresponding to the fingers.

10G. The method of clause 3G, wherein the back surface metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged in a row parallel to and adjacent to an edge of a long side of the rectangular solar cell, and each Pairs of adjacent overlapping rectangular solar cells are arranged such that each rear surface contact pad on one of the pair of rectangular solar cells corresponds to a corresponding one of the front surface metallization patterns on the other of the pair of rectangular solar cells The fingers are aligned and electrically connected to the corresponding fingers.

11G. The method of clause 3G, wherein the back surface metallization pattern on each rectangular solar cell includes a bus line extending parallel to and adjacent to an edge of a long side of the rectangular solar cell, and each pair of adjacent overlapping rectangular solar cells is arranged The busses on one solar cell of the pair of rectangular solar cells overlap and are electrically connected to the fingers in the front surface metallization pattern on the other solar cell of the pair of rectangular solar cells.

12G. A method according to clause 3G, wherein:

The front surface metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged parallel to and adjacent to the edges of the long sides of the rectangular solar cell, wherein each contact pad is located at an end corresponding to a finger department;

the back surface metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged in a row parallel to and adjacent to an edge of a long side of the rectangular solar cell; and

Each pair of adjacent overlapping rectangular solar cells is arranged such that each said rear surface contact pad on one solar cell of the pair is in contact with said front surface on the other solar cell of the pair of rectangular solar cells Corresponding contact pads in the metallization pattern are aligned and electrically connected to the corresponding contact pads.

13G. The method of clause 12G, wherein the rectangular solar cells of each pair of adjacent overlapping rectangular solar cells are conductively connected by discrete portions of conductive bonding material disposed between the overlapping front surface contact pads and rear surface contact pads joined to each other.

14G. The method of clause 3G, wherein the rectangular solar cells of each pair of adjacent overlapping rectangular solar cells are passed through a front surface metallization pattern disposed in a solar cell of the pair of rectangular solar cells and in the pair of rectangular solar cells The discrete portions of the conductive bonding material between the overlapping ends of the fingers in the back surface metallization pattern of the other solar cell are conductively bonded to each other.

15G. The method of clause 3G, wherein the rectangular solar cells of each pair of adjacent overlapping rectangular solar cells are passed through a front surface metallization pattern disposed in a solar cell of the pair of rectangular solar cells and in the pair of rectangular solar cells The dashed or solid lines of conductive bonding material between the overlapping ends of the fingers in the back surface metallization pattern of another solar cell conductively bond to each other, the dashed or solid lines of conductive bonding material connecting the fingers to each other. one or more electrical interconnections in the shape.

16G. A method according to clause 3G, wherein:

The front surface metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged parallel to and adjacent to the edges of the long sides of the rectangular solar cell, wherein each contact pad is located corresponding to a finger the end of the object; and

Said rectangular solar cell of each pair of adjacent overlapping rectangular solar cells is provided with a front surface metallization pattern of one solar cell of the pair of rectangular solar cells and a rear surface of the other solar cell of the pair of rectangular solar cells. Discrete portions of conductive bonding material between contact pads in the surface metallization pattern are conductively bonded to each other.

17G. A method according to clause 3G, wherein:

The front surface metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged parallel to and adjacent to the edges of the long sides of the rectangular solar cell, wherein each contact pad is located corresponding to a finger the end of the object; and

The rectangular solar cells of each pair of adjacent overlapping rectangular solar cells are provided with a front surface metallization pattern of one solar cell of the pair and a rear surface metallization of the other solar cell of the pair of rectangular solar cells The dashed or solid lines of conductive bonding material between the contact pads in the chemical pattern conductively bond to each other, the dashed or solid lines of conductive bonding material electrically interconnecting one or more of the fingers.

18G. The method of any of clauses 1G to 17G, wherein the front surface metallization pattern is formed from a silver paste.

1H. A method of fabricating a plurality of solar cells, the method comprising:

depositing one or more front surface amorphous silicon layers on the front surface of the crystalline silicon wafer, the front surface amorphous silicon layers will be illuminated by light when the solar cell is in operation;

depositing one or more back surface amorphous silicon layers onto the back surface of the crystalline silicon wafer on the opposite side of the front surface of the crystalline silicon wafer;

patterning the one or more front surface amorphous silicon layers to form one or more front surface trenches in the one or more front surface amorphous silicon layers;

depositing a front surface passivation layer over the one or more front surface amorphous silicon layers and into the front surface trenches;

patterning the one or more back surface amorphous silicon layers to form one or more back surface trenches in the one or more back surface amorphous silicon layers, each of the one or more back surface trenches each of the grooves is formed in line with a corresponding one of the front surface grooves;

depositing a back surface passivation layer over the one or more back surface amorphous silicon layers and into the back surface trenches; and

The crystalline silicon wafer is cut at one or more cut planes, each cut plane being centered or substantially centered on a different pair of corresponding front and back surface trenches.

2H. The method of clause 1H, comprising forming one or more front surface trenches to penetrate the front surface amorphous silicon layer to the front surface of the crystalline silicon wafer.

3H. The method of clause 1H, comprising forming one or more back surface trenches to penetrate the one or more back surface amorphous silicon layers to the back surface of the crystalline silicon wafer.

4H. The method of clause 1H, comprising forming a front surface passivation layer and a back surface passivation layer with a transparent conductive oxide.

5H. The method of clause 1H, comprising inducing thermal stress in the crystalline silicon wafer using a laser to sever the crystalline silicon wafer at one or more slicing planes.

6H. The method of clause 1H, comprising mechanically dicing the crystalline silicon wafer at one or more dicing planes.

7H. The method of clause 1H, wherein the one or more front surface amorphous/crystalline silicon layers form an n-p junction with the crystalline silicon wafer.

8H. The method of clause 7H, comprising dicing the crystalline silicon wafer from its rear surface side.

9H. The method of clause 1H, wherein the one or more back surface amorphous/crystalline silicon layers form an n-p junction with the crystalline silicon wafer.

10H. The method of clause 9H, comprising dicing the crystalline silicon wafer from its front surface side.

11H. A method of fabricating a plurality of solar cells, the method comprising:

forming one or more trenches in the first surface of the crystalline silicon wafer;

depositing one or more layers of amorphous silicon onto the first surface of the crystalline silicon wafer;

depositing a passivation layer onto one or more amorphous silicon layers in the trenches and on the first surface of the crystalline silicon wafer;

depositing one or more layers of amorphous silicon onto a second surface of the crystalline silicon wafer, the second surface being on an opposite side of the first surface of the crystalline silicon wafer;

The crystalline silicon wafer is cut at one or more cut planes, each cut plane being centered or substantially centered on a different one of the one or more trenches.

12H. The method of clause 11H, comprising forming a passivation layer with a transparent conductive oxide.

13H. The method of clause 11H, comprising using a laser to induce thermal stress in the crystalline silicon wafer to sever the crystalline silicon wafer at one or more slicing planes.

14H. The method of clause 11H, comprising mechanically dicing the crystalline silicon wafer at one or more dicing planes.

15H. The method of clause 11H, wherein the one or more front surface amorphous/crystalline silicon layers form an n-p junction with the crystalline silicon wafer.

16H. The method of clause 11H, wherein the one or more back surface amorphous/crystalline silicon layers form an n-p junction with the crystalline silicon wafer.

17H. The method of clause 11H, wherein the first surface of the crystalline silicon wafer is to be illuminated by light while the solar cell is operating.

18H. The method of clause 11H, wherein the second surface of the crystalline silicon wafer is to be illuminated by light while the solar cell is operating.

19H. A solar panel comprising:

A plurality of super cells, each super cell comprising a plurality of solar cells arranged in line, wherein the ends of adjacent solar cells are overlapped and conductively bonded to each other in an overlapping manner, thereby electrically connecting the solar cells in series.

wherein each solar cell includes: a crystalline silicon substrate; one or more first surface amorphous silicon layers disposed on the first surface of the crystalline silicon substrate to form n-p junctions; one or more second surface non-crystalline silicon layers a crystalline silicon layer disposed on a second surface of the crystalline silicon substrate, the second surface being located on the opposite side of the first surface of the crystalline silicon substrate; and a passivation layer preventing the first surface amorphous silicon layer from Carrier recombination occurs at the edge or the edge of the second surface amorphous silicon layer, or prevents both the edge of the first surface amorphous silicon layer and the edge of the second surface amorphous silicon layer from occurring carrier recombination.

20H. The solar panel of clause 19H, wherein the passivation layer comprises a transparent conductive oxide.

21H. A solar panel according to clause 19H, wherein the super cells are arranged in a single row or in two or more parallel rows to form a front surface of the solar panel that will be illuminated by solar radiation during operation of the solar panel.

Z1. A solar module comprising:

Greater than or equal to about 250 N rectangular or substantially rectangular silicon solar cells arranged in a plurality of series-connected super cells in two or more parallel rows, each super cell comprising a plurality of super cells arranged in a A plurality of the silicon solar cells in a straight line, wherein the long sides of adjacent silicon solar cells overlap and are conductively bonded to each other with an adhesive that is both electrically and thermally conductive to electrically connect the silicon solar cells in the super cell in series connection; and

one or more bypass diodes;

wherein each pair of adjacent parallel rows in the solar module is electrically connected by a bypass diode conductively bonded to a rear surface electrical charge on a centrally located solar cell in one of the parallel rows of the pair contacts and is conductively bonded to rear surface electrical contacts on adjacent solar cells in the other row of the pair of parallel rows.

Z2. A solar module according to clause Z1, wherein each pair of adjacent parallel rows is electrically connected by at least one other bypass diode conductively bonded to the solar cells in one row of the pair of parallel rows back surface electrical contacts and conductively bonded to back surface electrical contacts on adjacent solar cells in the other row of the pair of parallel rows.

Z3. A solar module according to clause Z2, wherein each pair of adjacent parallel rows is electrically connected by at least one other bypass diode conductively bonded to the solar cells in one row of the pair of parallel rows back surface electrical contacts and conductively bonded to back surface electrical contacts on adjacent solar cells in the other row of the pair of parallel rows.

Z4. The solar module of clause Z1, wherein the electrically and thermally conductive adhesive forms bonds between adjacent solar cells, the bonds having a thickness perpendicular to the solar cells of less than or equal to about 50 microns, and The thermal conductivity in the direction perpendicular to the solar cell is greater than or equal to about 1.5 W/(m-K).

Z5. The solar module of clause Z1, wherein the super cell is encapsulated in a thermoplastic olefin layer between a front glass sheet and a back glass sheet.

Z6. A solar module according to clause Z1, wherein the conductive bonding between the overlapping solar cells provides the super cells with mechanical plasticity to harmonize the direction parallel to the super cell row in a temperature range of about -40°C to about 100°C The thermal expansion mismatch between the upper super cell and the glass front plate prevents the thermal expansion mismatch from damaging the solar module.

Z7. The solar module of any one of clauses Z1 to Z6, wherein N is greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to About 550, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

Z8. The solar module of any one of clauses Z1 to Z7, wherein the super cells are electrically connected to provide a high direct current voltage greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to About 240 volts, greater than or equal to about 300 volts, greater than or equal to about 360 volts, greater than or equal to about 420 volts, greater than or equal to about 480 volts, greater than or equal to about 540 volts, or greater than or equal to about 600 volts.

Z9. A solar energy system comprising:

A solar module according to clause Z1; and

An inverter electrically connected to the solar module and configured to convert the DC output from the solar module to provide an AC output.

Z10. The solar energy system of clause Z9, wherein the inverter lacks a DC-to-DC boost component.

Z11. A solar energy system according to clause Z9, wherein the inverter is configured to operate the solar modules at a DC voltage above a minimum value set to avoid reverse biasing of the solar cells.

Z12. A solar energy system according to clause Z11, wherein the minimum voltage value is temperature dependent.

Z13. A solar energy system as in clause Z9, wherein the inverter is configured to recognize a reverse biased state and operate the solar modules at a voltage that avoids the reversed biased state.

Z14. A solar energy system according to clause Z13, wherein the inverter is configured to operate the solar module within a local maximum region of the voltage-current power curve of the solar module to avoid a reverse bias condition.

Z15. A solar energy system according to any of clauses Z9 to Z14, wherein the inverter is a micro-inverter integrated with the solar module.

The disclosure is for illustration only, not limitation. Additional modifications will be apparent to those skilled in the art in view of this disclosure and are intended to fall within the scope of the appended claims.

Claims (10)

1. An apparatus for a shingled solar cell, comprising: A plurality of solar cell strips of a solar cell wafer, each solar cell strip comprising: the first long edge away from the center of the solar cell wafer; a second long edge near the center of the solar cell wafer; a first short edge and a second short edge between the first long edge and the second long edge; and One or more front metallization patterns disposed linearly along the first long edge away from the center of the solar wafer. 2. The apparatus of claim 1, further comprising: A plurality of scribed lines disposed between two adjacent ones of the plurality of solar cell strips of the solar cell wafer. 3. The apparatus of claim 2, wherein, The first long edge and the second long edge of the one or more inner solar cell strips of the plurality of solar cell strips of the solar cell wafer are corresponding scribe lines of the plurality of scribe lines; the second long edge of the plurality of outer solar cell strips of the plurality of solar cell strips of the solar cell wafer is a corresponding scribe line of the plurality of scribe lines; and The first long edges of the plurality of outer solar cell strips are the outer edges of the solar cell wafers. 4. The apparatus of claim 3, wherein, The outer solar cell strip includes a chamfer between one or both of the first and second short edges and the first long edge. 5. The apparatus of claim 1, wherein, The one or more front metallization patterns include one or more of the following components: Continuous bus bars, contact pads, continuous conductive glue or discontinuous conductive glue. 6. The apparatus of claim 1, wherein, One or more front metallization patterns are disposed on the front surface of the solar cell strip, and each of the plurality of solar cell strips includes one or more back metallization patterns on the rear surface thereof, the one or more The back metallization pattern is linearly disposed along the second long edge near the center of the solar wafer. 7. The apparatus of claim 6, wherein, The plurality of solar cell strips are arranged in an overlapping relationship such that one or more front metallization patterns of the front surface of a first solar cell strip of the plurality of solar cell strips are electrically connected to a second solar cell strip of the plurality of solar cell strips One or more post metallization patterns on the back surface. 8. The apparatus of claim 1, wherein, The one or more front metallization patterns form a mirror image on the front surface of the solar cell wafer relative to a planar line passing through the center of the front surface of the solar cell wafer. 9. The apparatus of claim 1, wherein, The first long edges of the plurality of outer solar cell strips are the outer edges of the solar cell wafers. 10. The apparatus of claim 9, wherein, The second long edge of the outer solar cell strip of the plurality of solar cell strips of the solar cell wafer is a corresponding scribe line between adjacent ones of the plurality of solar cell strips on the front surface of the solar cell wafer.

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