CN108300557A - A kind of Buddha's warrior attendant wire cutting liquid for cutting silicon wafer - Google Patents
A kind of Buddha's warrior attendant wire cutting liquid for cutting silicon wafer Download PDFInfo
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- CN108300557A CN108300557A CN201810249891.2A CN201810249891A CN108300557A CN 108300557 A CN108300557 A CN 108300557A CN 201810249891 A CN201810249891 A CN 201810249891A CN 108300557 A CN108300557 A CN 108300557A
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- buddha
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M173/00—Lubricating compositions containing more than 10% water
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
- C10M2207/04—Ethers; Acetals; Ortho-esters; Ortho-carbonates
- C10M2207/046—Hydroxy ethers
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
- C10M2207/28—Esters
- C10M2207/287—Partial esters
- C10M2207/289—Partial esters containing free hydroxy groups
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/102—Polyesters
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
- C10M2209/104—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
- C10M2209/108—Polyethers, i.e. containing di- or higher polyoxyalkylene groups etherified
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2215/00—Organic non-macromolecular compounds containing nitrogen as ingredients in lubricant compositions
- C10M2215/02—Amines, e.g. polyalkylene polyamines; Quaternary amines
- C10M2215/04—Amines, e.g. polyalkylene polyamines; Quaternary amines having amino groups bound to acyclic or cycloaliphatic carbon atoms
- C10M2215/042—Amines, e.g. polyalkylene polyamines; Quaternary amines having amino groups bound to acyclic or cycloaliphatic carbon atoms containing hydroxy groups; Alkoxylated derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2223/00—Organic non-macromolecular compounds containing phosphorus as ingredients in lubricant compositions
- C10M2223/02—Organic non-macromolecular compounds containing phosphorus as ingredients in lubricant compositions having no phosphorus-to-carbon bonds
- C10M2223/04—Phosphate esters
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2229/00—Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
- C10M2229/04—Siloxanes with specific structure
- C10M2229/041—Siloxanes with specific structure containing aliphatic substituents
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/06—Oiliness; Film-strength; Anti-wear; Resistance to extreme pressure
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/08—Resistance to extreme temperature
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/12—Inhibition of corrosion, e.g. anti-rust agents or anti-corrosives
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/64—Environmental friendly compositions
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Organic Chemistry (AREA)
- Lubricants (AREA)
Abstract
The present invention relates to a kind of Buddha's warrior attendant wire cutting liquid for cutting silicon wafer, each component accounts in the Buddha's warrior attendant wire cutting liquid：Extreme pressure agent 6 16%, organic carboxyl acid 1 5%, lubricant 0.5 2.5%, mineral oil 4 6%, emulsifier 0.2 0.6%, antifoaming agent 0.1 0.5%, butyl carbitol 0.1 1.5%, surplus is deionized water；Wherein, lubricant is the mixture of polyoxyethylated alkyl phenol and dimethyl phosphate, and the mass ratio of polyoxyethylated alkyl phenol and dimethyl phosphate is 1.9 2.3:1.The advantage of the invention is that：Buddha's warrior attendant wire cutting liquid provided by the invention enables to Buddha's warrior attendant wire cutting liquid that there is lubrication permeability outstanding and rust-preventing characteristic, abrasive grain to be uniformly dispersed wherein each component has unique effect in formula；And the physics and chemical property of Buddha's warrior attendant wire cutting liquid are stablized, high temperature is not easily decomposed；Cutting liquid corrosion resistance is strong, is unlikely to deteriorate, and use and period of storage are long, cheap, effectively reduce production cost, are conducive to industrialized production.
Description
Technical field
The invention belongs to silicon crystal Buddha's warrior attendant wire cutting liquid technical field, more particularly to a kind of Buddha's warrior attendants for cutting silicon wafer
Wire cutting liquid.
Background technology
Make rapid progress with the science and technology of large scale integrated circuit, global electronic chip industry is grown rapidly, monocrystalline silicon and more
The usage amount of crystal silicon is also continuously increased.In addition, with the utilization increased to regenerative resource, photovoltaic industry is as new energy
Source industry development is rapid, and solar energy industry needs a large amount of silicon materials, especially polysilicon.The increase of silicon wafer diameter, thickness
With the reduction of line width, and the higher requirement etc. to silicon wafer geometric dimension and its surface machinery Sun Shao little, perfection of lattice,
To which to silicon wafer cutting processing quality, more stringent requirements are proposed.The cut quality of silicon wafer will influence it is subsequent grinding,
The processing efficiency of the processes such as polishing and etching even influences the final mass of semiconductor devices.
The alternative traditional free multi-line cutting method of Buddha's warrior attendant line cutting technology, it is to utilize plating or resin bonded
Diamond abrasive is attached to the surface of steel wire by method, and diamond wire is directly acted on silicon rod or silicon ingot surface generates grinding, gold
The features such as rigid wire cutting has cutting speed fast, and cutting accuracy is high, and spillage of material is low, reduces the processing cost of silicon chip, applies
Foreground greatly enhances.
Buddha's warrior attendant wire cutting liquid is Buddha's warrior attendant line cutting technology important component, and Buddha's warrior attendant wire cutting liquid should have the effect that：
（1）Lubricating action, cutting liquid can penetrate between gauze and silicon chip, gauze and clast, form one layer of lubricating film, reduce cutting damage
Wound, stress and fine fisssure；（2）The cooling effect of cutting, and the shape on gauze and silicon chip interface can be improved in osmosis, good penetrability
At lubricating film, frictional resistance is reduced, reduces Cutting Drag；（3）Peptizaiton, cutting liquid can be such that particle dispersion, prevent particle
It is poly- viscous, avoid scuffing；（4）Cooling effect, cutting generate high heat, and a part is taken away by cutting liquid, the remaining big portion of heat
Divide and absorbed by crystalline silicon, temperature is excessively high necessarily to make silicon wafer deform, therefore it is required that cutting liquid has good cooling performance；（5）
Cleaning action, cutting process generate a large amount of clasts and silica flour, are easy to form adherency, reduce cutting accuracy, cutting line is caused to wear,
Therefore it is required that cutting liquid can wrap up clast, its solution is made to fall off cleaning；（6）Anti-rust action, stock-removing machine are steel materials, are cut
Cutting liquid constantly washes away lathe during cutting, and is also easy to produce corrosion, the service life for reducing machine tool accuracy, shortening lathe, thus, cutting fluid
Should have rustless property.
Currently, demand of industrial production and of high cost is not achieved in domestic Buddha's warrior attendant wire cutting liquid；Silicon wafer surface after cutting
Total thickness deviation（TTV）It does not reach requirement and silicon wafer surface has the phenomenon that deformation, when cutting has brittleness to burst apart and cut；Cutting
In use for some time, lubricity and cooling performance are greatly reduced liquid, and solution is putrid and deteriorated, seriously limit later stage use,
Cutting liquid service life is short.The a large amount of middle and high end Buddha's warrior attendant wire cutting liquids in China rely on external import.
Therefore, research and develop it is a kind of can meet current cutting technique, there is lubrication outstanding and cooling performance, safety and environmental protection, chemically
Matter stabilization and cheap Buddha's warrior attendant wire cutting liquid, are conducive to the industrialization pace for accelerating to promote Buddha's warrior attendant line cutting technology.
Invention content
The technical problem to be solved in the present invention is to provide a kind of Buddha's warrior attendant wire cutting liquids for cutting silicon wafer, by changing
Become the component and proportioning in formula, makes Buddha's warrior attendant wire cutting liquid that there is lubrication outstanding and cooling performance, safety and environmental protection, chemical property
It is stable and cheap.
In order to solve the above technical problems, the technical scheme is that：A kind of Buddha's warrior attendant wire cutting for cutting silicon wafer
Liquid, innovative point are：Each component accounts in the Buddha's warrior attendant wire cutting liquid：Extreme pressure agent 6-16%, it is organic
Carboxylic acid 1-5%, lubricant 0.5-2.5%, mineral oil 4-6%, emulsifier 0.2-0.6%, antifoaming agent 0.1-0.5%, butyl carbitol
0.1-1.5%, surplus are deionized water；Wherein, lubricant is the mixture of polyoxyethylated alkyl phenol and dimethyl phosphate, and
The mass ratio of polyoxyethylated alkyl phenol and dimethyl phosphate is 1.9-2.3:1.
Further, the extreme pressure agent is organic polymer, and molecular structural formula is：
Wherein R1、R6For one kind in methyl, ethyl and benzyl, R2、R3For hydroxyl, phosphate, amino, chlorine atom and hydrogen atom
In one kind, the value of n is 2-15；R4、R5For methyl, ethyl, propyl, isopropyl, p-methylphenyl, chlorine atom and hydrogen atom
In one kind, the value of m is 5-20.
Further, the emulsifier includes Octylphenol polyoxyethylene ether, sorbitol monooleate, dodecyl
At least one of sodium sulfonate, petroleum sodium sulfonate and odium stearate.
Further, the antifoaming agent includes glycerine trihydroxy polyethers, polyoxypropylene pentaerythrite ether, dimethicone
At least one of with polyether modified silicon oil.
The advantage of the invention is that：
（1）Buddha's warrior attendant wire cutting liquid provided by the invention, wherein each component has unique effect in formula, and lubricant selects
With the mixture of polyoxyethylated alkyl phenol and dimethyl phosphate, Buddha's warrior attendant wire cutting liquid is enabled to be permeated with lubrication outstanding
Property and rust-preventing characteristic, abrasive grain be uniformly dispersed, and the physics of Buddha's warrior attendant wire cutting liquid and chemical property are stablized, and high temperature is not easily decomposed；Cutting
Liquid corrosion resistance is strong, is unlikely to deteriorate, and use and period of storage are long, cheap, effectively reduce production cost, are conducive to work
The big production of industryization.
（2）The Buddha's warrior attendant wire cutting liquid prepared by the formula, perfect heat-dissipating, cooling performance are good when cutting liquid uses；And
Silicon wafer precision and quality after cutting is high, surfacing, bright and clean.
Specific implementation mode
The present invention is used to cut the Buddha's warrior attendant wire cutting liquid of silicon wafer, the weight hundred in the Buddha's warrior attendant wire cutting liquid shared by each component
Point ratio is：Extreme pressure agent 6-16%, organic carboxyl acid 1-5%, lubricant 0.5-2.5%, mineral oil 4-6%, emulsifier 0.2-0.6% disappear
Infusion 0.1-0.5%, butyl carbitol 0.1-1.5%, surplus are deionized water；Wherein, lubricant is polyoxyethylated alkyl phenol
With the mixture of dimethyl phosphate, and the mass ratio of polyoxyethylated alkyl phenol and dimethyl phosphate be 1.9-2.3:1.
Specifically, extreme pressure agent is organic polymer, and molecular structural formula is：
Wherein R1、R6For one kind in methyl, ethyl and benzyl, R2、R3For hydroxyl, phosphate, amino, chlorine atom and hydrogen atom
In one kind, the value of n is 2-15；R4、R5For methyl, ethyl, propyl, isopropyl, p-methylphenyl, chlorine atom and hydrogen atom
In one kind, the value of m is 5-20.
Emulsifier includes Octylphenol polyoxyethylene ether, sorbitol monooleate, dodecyl sodium sulfate, mahogany acid
At least one of sodium and odium stearate.
Antifoaming agent includes glycerine trihydroxy polyethers, polyoxypropylene pentaerythrite ether, dimethicone and polyether modified silicon oil
At least one of.
Embodiment 1
The present embodiment is used to cut the Buddha's warrior attendant wire cutting liquid of silicon wafer, which is by its parts by weight percentage：Pole
Pressure agent 6%, organic carboxyl acid 5%, lubricant 2.5%, mineral oil 6%, emulsifier 0.6%, antifoaming agent 0.5%, butyl carbitol 1.5%,
Deionized water 77.9%；Wherein, lubricant is the mixture of polyoxyethylated alkyl phenol and dimethyl phosphate, and polyoxyethylene alkane
The mass ratio of base phenolic ether and dimethyl phosphate is 1.9:1.
In the present embodiment, extreme pressure agent is organic polymer, and molecular structural formula is：
R in molecular structural formula1For methyl, R2For chlorine atom, R3For hydrogen atom, R4For methyl, R5For hydrogen atom, R6For benzyl, n=
7, m=12；Corrosion inhibiter is organic carboxyl acid, and molecular structural formula is：
R in molecular structural formula7For methyl, R8For carboxyl, R9For hydroxyl, R10For ethyl, n1=2；Emulsifier is D-sorbite list oil
Acid esters；Antifoaming agent is dimethicone.
Embodiment 2
The present embodiment Buddha's warrior attendant wire cutting liquid is by its parts by weight percentage：Extreme pressure agent 6%, organic carboxyl acid 5%, lubricant 2.5%, mine
Object oil 6%, emulsifier 0.6%, antifoaming agent 0.5%, butyl carbitol 1.5%, deionized water 77.9%；Wherein, lubricant is polyoxy second
The mixture of allylic alkylation phenolic ether and dimethyl phosphate, and the mass ratio of polyoxyethylated alkyl phenol and dimethyl phosphate is 2.3:1.
In the present embodiment, extreme pressure agent is organic polymer, and molecular structural formula is：
R in molecular structural formula1For methyl, R2For chlorine atom, R3For hydrogen atom, R4For methyl, R5For hydrogen atom, R6For benzyl, n=
7, m=12；Corrosion inhibiter is organic carboxyl acid, and molecular structural formula is：
R in molecular structural formula7For methyl, R8For carboxyl, R9For hydroxyl, R10For ethyl, n1=2；Emulsifier is D-sorbite list oil
Acid esters；Antifoaming agent is dimethicone.
Embodiment 3
The present embodiment Buddha's warrior attendant wire cutting liquid is by its parts by weight percentage：Extreme pressure agent 6%, organic carboxyl acid 5%, lubricant 2.5%, mine
Object oil 6%, emulsifier 0.6%, antifoaming agent 0.5%, butyl carbitol 1.5%, deionized water 77.9%；Wherein, lubricant is polyoxy second
The mixture of allylic alkylation phenolic ether and dimethyl phosphate, and the mass ratio of polyoxyethylated alkyl phenol and dimethyl phosphate is 2.1:1.
In the present embodiment, extreme pressure agent is organic polymer, and molecular structural formula is：
R in molecular structural formula1For methyl, R2For chlorine atom, R3For hydrogen atom, R4For methyl, R5For hydrogen atom, R6For benzyl, n=
7, m=12；Corrosion inhibiter is organic carboxyl acid, and molecular structural formula is：
R in molecular structural formula7For methyl, R8For carboxyl, R9For hydroxyl, R10For ethyl, n1=2；Emulsifier is D-sorbite list oil
Acid esters；Antifoaming agent is dimethicone
Embodiment 4
The present embodiment is used to cut the Buddha's warrior attendant wire cutting liquid of silicon wafer, which is by its parts by weight percentage：Pole
Pressure agent 16%, organic carboxyl acid 1%, lubricant 0.5%, mineral oil 4%, emulsifier 0.2%, antifoaming agent 0.1%, butyl carbitol 0.1%,
Deionized water 78.1%；Wherein, lubricant is the mixture of polyoxyethylated alkyl phenol and dimethyl phosphate, and polyoxyethylene alkane
The mass ratio of base phenolic ether and dimethyl phosphate is 2.1:1.
In the present embodiment, extreme pressure agent is organic polymer, and molecular structural formula is：
R in molecular structural formula1For methyl, R2For chlorine atom, R3For hydrogen atom, R4For methyl, R5For hydrogen atom, R6For benzyl, n=
7, m=12；Corrosion inhibiter is organic carboxyl acid, and molecular structural formula is：
R in molecular structural formula7For methyl, R8For carboxyl, R9For hydroxyl, R10For ethyl, n1=2；Emulsifier is D-sorbite list oil
Acid esters；Antifoaming agent is dimethicone.
Embodiment 5
The present embodiment is used to cut the Buddha's warrior attendant wire cutting liquid of silicon wafer, which is by its parts by weight percentage：Pole
Pressure agent 11%, organic carboxyl acid 3%, lubricant 1.5%, mineral oil 5%, emulsifier 0.4%, antifoaming agent 0.3%, butyl carbitol 0.8%,
Deionized water 78%；Wherein, lubricant is the mixture of polyoxyethylated alkyl phenol and dimethyl phosphate, and polyxyethylated
The mass ratio of phenolic ether and dimethyl phosphate is 2.1:1.
In the present embodiment, extreme pressure agent is organic polymer, and molecular structural formula is：
R in molecular structural formula1For methyl, R2For chlorine atom, R3For hydrogen atom, R4For methyl, R5For hydrogen atom, R6For benzyl, n=
7, m=12；Corrosion inhibiter is organic carboxyl acid, and molecular structural formula is：
R in molecular structural formula7For methyl, R8For carboxyl, R9For hydroxyl, R10For ethyl, n1=2；Emulsifier is D-sorbite list oil
Acid esters；Antifoaming agent is dimethicone.
The basic principles and main features and advantages of the present invention of the present invention have been shown and described above.The skill of the industry
Art personnel it should be appreciated that the present invention is not limited to the above embodiments, the above embodiments and description only describe
The principle of the present invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these
Changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and
Its equivalent thereof.
Claims (4)
1. a kind of Buddha's warrior attendant wire cutting liquid for cutting silicon wafer, it is characterised in that：Each component institute in the Buddha's warrior attendant wire cutting liquid
The weight percent accounted for is：Extreme pressure agent 6-16%, organic carboxyl acid 1-5%, lubricant 0.5-2.5%, mineral oil 4-6%, emulsifier
0.2-0.6%, antifoaming agent 0.1-0.5%, butyl carbitol 0.1-1.5%, surplus are deionized water；Wherein, lubricant is polyoxy second
The mixture of allylic alkylation phenolic ether and dimethyl phosphate, and the mass ratio of polyoxyethylated alkyl phenol and dimethyl phosphate is 1.9-
2.3:1。
2. the Buddha's warrior attendant wire cutting liquid according to claim 1 for cutting silicon wafer, it is characterised in that：The extreme pressure agent
For organic polymer, molecular structural formula is：
Wherein R1、R6For one kind in methyl, ethyl and benzyl, R2、R3For in hydroxyl, phosphate, amino, chlorine atom and hydrogen atom
One kind, the value of n is 2-15；R4、R5For in methyl, ethyl, propyl, isopropyl, p-methylphenyl, chlorine atom and hydrogen atom
One kind, the value of m is 5-20.
3. the Buddha's warrior attendant wire cutting liquid according to claim 1 for cutting silicon wafer, it is characterised in that：The emulsifier
Including in Octylphenol polyoxyethylene ether, sorbitol monooleate, dodecyl sodium sulfate, petroleum sodium sulfonate and odium stearate
At least one.
4. the Buddha's warrior attendant wire cutting liquid according to claim 1 for cutting silicon wafer, it is characterised in that：The antifoaming agent
Including at least one of glycerine trihydroxy polyethers, polyoxypropylene pentaerythrite ether, dimethicone and polyether modified silicon oil.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810249891.2A CN108300557A (en) | 2018-03-26 | 2018-03-26 | A kind of Buddha's warrior attendant wire cutting liquid for cutting silicon wafer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810249891.2A CN108300557A (en) | 2018-03-26 | 2018-03-26 | A kind of Buddha's warrior attendant wire cutting liquid for cutting silicon wafer |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103725390A (en) * | 2013-12-06 | 2014-04-16 | 当涂县金龙机械厂 | Water-based cutting fluid for silicon chip wire cutting, and preparation method thereof |
| CN105038933A (en) * | 2015-08-11 | 2015-11-11 | 苏州市宝玛数控设备有限公司 | Extreme pressure cutting fluid used for numerical control cutting machine |
| CN105132095A (en) * | 2015-07-31 | 2015-12-09 | 苏州市宝玛数控设备有限公司 | Diamond wire cutting liquid of silicon sheet multi-wire sawing machine |
| CN106398807A (en) * | 2016-08-30 | 2017-02-15 | 无锡库帕油品有限公司 | Cutting fluid of diamond wire for cutting silicon wafers |
-
2018
- 2018-03-26 CN CN201810249891.2A patent/CN108300557A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103725390A (en) * | 2013-12-06 | 2014-04-16 | 当涂县金龙机械厂 | Water-based cutting fluid for silicon chip wire cutting, and preparation method thereof |
| CN105132095A (en) * | 2015-07-31 | 2015-12-09 | 苏州市宝玛数控设备有限公司 | Diamond wire cutting liquid of silicon sheet multi-wire sawing machine |
| CN105038933A (en) * | 2015-08-11 | 2015-11-11 | 苏州市宝玛数控设备有限公司 | Extreme pressure cutting fluid used for numerical control cutting machine |
| CN106398807A (en) * | 2016-08-30 | 2017-02-15 | 无锡库帕油品有限公司 | Cutting fluid of diamond wire for cutting silicon wafers |
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Application publication date: 20180720 |