CN108288542A - The manufacturing method of laminated electronic component - Google Patents
The manufacturing method of laminated electronic component Download PDFInfo
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- CN108288542A CN108288542A CN201810024662.0A CN201810024662A CN108288542A CN 108288542 A CN108288542 A CN 108288542A CN 201810024662 A CN201810024662 A CN 201810024662A CN 108288542 A CN108288542 A CN 108288542A
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- electrode layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The present invention provides a kind of manufacturing method that can prevent the laminated electronic component in crimping process in laminated body generation cracking.The manufacturing method of the laminated electronic component of the present invention, including：Lamination process, stacking multi-disc form the raw cook of interior electrode layer, make laminated body；And crimping process, the first elastomeric sheets are configured in the stacking direction upper surface of above-mentioned laminated body, the second elastomeric sheets are configured in the stacking direction lower surface of above-mentioned laminated body, and above-mentioned laminated body is crimped in the stacking direction, the manufacturing method of the laminated electronic component is characterized in that, meet relational expression (1) and (2), wherein relational expression (1) is：The thickness of the first elastomeric sheets of ＞ of (the stacking the piece number of thickness × interior electrode layer of interior electrode layer)/2, relational expression (2) are：The thickness of the second elastomeric sheets of ＞ of (the stacking the piece number of thickness × interior electrode layer of interior electrode layer)/2.
Description
Technical field
The present invention relates to the manufacturing methods of laminated electronic component.
Background technology
In laminated ceramic capacitor, small-sized, bulky capacitor requirement is high, thin layer, internal electrode the multilayer of raw cook
Change and continues to develop.In the manufacturing process of laminated ceramic capacitor, have stacking multi-disc form interior electrode layer raw cook and
The crimping process crimped as laminated body and to laminated body.In laminated body, in the part that forms interior electrode layer and
The part for not forming interior electrode layer generates difference of height on stacking thickness.Moreover, in the part for not forming interior electrode layer,
Contiguity becomes inadequate.In addition, if the multiple stratification of laminated body continues to develop, the influence of difference of height can become much larger.Moreover, being
Ensure not form the adhesion of the part of interior electrode layer, in crimping process, sometimes in the configuration bullet up and down of laminated body
Property body piece.
A kind of manufacturing method of monolithic ceramic electronic component is described in patent document 1, wherein has use and face direction
The process for carrying out the compacting of laminated body compared to the elastomeric sheets for the retractility that thickness direction shows bigger.
Citation
Patent document
Patent document 1：Japanese Unexamined Patent Publication 9-190948 bulletins
Following content is described in patent document 1：It is interior in the process for crimping raw cook in the manufacture of laminated ceramic capacitor
The height residual quantity (the piece number is laminated in=internal electrode layer thickness × raw cook) of portion's electrode layer is 150 μm (3 μ ms 50), as elasticity
The thickness of the polyethylene terephthalate of body piece is 200 μm.
If carrying out such as the crimping process under the conditions of described in Patent Document 1, sometimes at one of the surface of laminated body
Point, especially cracking is generated in the peripheral portion on the surface of laminated body.Especially drawn with internal electrode in the side of laminated body
In the laminated electronic component in portion, there is the tendency for easy ting produce cracking.
Invention content
The subject that the invention solves
The present invention is to complete in order to solve above-mentioned problem, and its purpose is to provide one kind can prevent in crimping work
The manufacturing method of the laminated electronic component of cracking is generated in sequence in laminated body.
A technical solution to solve project
The present inventors study the means that can eliminate the generation of the cracking in crimping process, as a result
It was found that by making configuration in the relationship of the thickness of the upper and lower elastomeric sheets of laminated body and the height residual quantity of interior electrode layer be suitable
When range, so as to reduce the part for foring interior electrode layer with do not formed at the portion boundary of interior electrode layer
The power of application and prevent cracking generation, to contemplate the present invention.That is, the manufacturing method packet of the laminated electronic component of the present invention
It includes：Lamination process, stacking multi-disc form the raw cook of interior electrode layer, make laminated body；And crimping process, in above-mentioned stacking
The stacking direction upper surface of body configures the first elastomeric sheets, and the second elastomer is configured in the stacking direction lower surface of above-mentioned laminated body
Piece, and above-mentioned laminated body is crimped in the stacking direction, the manufacturing method of the laminated electronic component is characterized in that, full
Foot states relational expression (1) and (2).
The thickness (1) of the first elastomeric sheets of ＞ of (the stacking the piece number of thickness × interior electrode layer of interior electrode layer)/2
The thickness (2) of the second elastomeric sheets of ＞ of (the stacking the piece number of thickness × interior electrode layer of interior electrode layer)/2
If the thickness of the first elastomeric sheets and the second elastomeric sheets that are used in crimping process is to meet above-mentioned relation
The thickness of formula (1) and (2) can then be reduced in the part for foring interior electrode layer and the part for not forming interior electrode layer
Boundary apply power, so as to prevent cracking generation.
It is preferred that in the manufacturing method of the laminated electronic component of the present invention, above-mentioned first elastomeric sheets and above-mentioned second bullet
Property body piece thickness be respectively the height residual quantity found out with (the stacking the piece number of thickness × interior electrode layer of interior electrode layer)
It is more than 20% thickness.If keeping the thickness of elastomeric sheets thinning, it is applied to the pressure phase for the part for foring interior electrode layer
It gets higher over the ground, becomes the thinning tendency of dielectric thickness.Insulation resistance fraction defective (poor short circuit rate) increases as a result, but logical
It crosses and the thickness of elastomeric sheets is set as above range, so as to reduce insulation resistance fraction defective.
In the manufacturing method of the laminated electronic component of the present invention, above-mentioned first elastomeric sheets and above-mentioned second elastomer
The hardometer A type hardness testers of piece are respectively preferably 40 or more and 80 or less.If the hardness of elastomeric sheets is 40 or more, after crimping
The difference of height of the part for foring interior electrode layer and the part for not forming interior electrode layer in laminated body will not become too much,
Therefore preferably.In addition, if elastomeric sheets hardness be 80 hereinafter, if can fully play improvement do not form interior electrode layer
The effect of partial adhesion, therefore preferably.
It is preferred that in the manufacturing method of the laminated electronic component of the present invention, with (thickness × internal electrode of interior electrode layer
The stacking the piece number of layer) the height residual quantity that finds out is 50 μm or more and 200 μm or less.The situation for being 50 μm or more in height residual quantity
Under, the effect of the present invention can be significantly more played, therefore preferably.In addition, if height residual quantity is more than 200 μm, exists and be difficult to really
The case where protecting the adhesion between raw cook.
It is preferred that in the manufacturing method of the laminated electronic component of the present invention, further carried out after above-mentioned crimping process rigid
Body suppression process.By further carrying out rigid body compacting after crimping process, interior electrode layer is formd so as to reduce
Part and the part for not forming interior electrode layer difference of height.If difference of height is big, laminated electronic component is being installed to substrate
When deficient in stability, worry will produce failure welding, therefore preferably reduces difference of height.
It is preferred that in the manufacturing method of the laminated electronic component of the present invention, above-mentioned laminated electronic component is laminated ceramic capacitors
Device.Laminated ceramic capacitor is in the tendency that stacking the piece number increases, and easy tos produce difference of height, therefore the stacking ministry of electronics industry of the present invention
The manufacturing method of part is especially effective.
It is preferred that in the manufacturing method of the laminated electronic component of the present invention, above-mentioned laminated electronic component is that have a side
There are two the laminated electronic components of above internal electrode lead division.If laminated electronic component be side tool there are two with
On internal electrode lead division laminated electronic component, then be particularly easy to produce when having carried out the crimping process based on the prior art
Raw cracking.And if apply the present invention laminated electronic component manufacturing method in crimping process, can prevent cracking production
It is raw.That is, for having the laminated electronic component of more than two internal electrode lead divisions, effect of the invention hair a side
Wave particularly significant.
It is preferred that in the manufacturing method of the laminated electronic component of the present invention, the crimping temperature in crimping process is 60 DEG C or more
And 85 DEG C or less.If crimping temperature is set as 60 DEG C or more, the portion for improving and not forming interior electrode layer can be more fully played
The effect for the adhesion divided, the possibility for generating the construction defect such as layering are reduced.In addition, if crimping temperature be 85 DEG C hereinafter, if
The deformation quantity as caused by temperature deformation that have passed through the laminated body of crimping process is not easy to become larger.Therefore, laminated body is cut afterwards
In the process broken as chip monolithic, internal electrode exposes fraction defective and reduces as caused by the decline of off-position precision.
Invention effect
The manufacturing method of laminated electronic component according to the present invention can prevent from generating tortoise in laminated body in crimping process
It splits to manufacture laminated electronic component.
Description of the drawings
Fig. 1 is the laminated ceramic for the manufacturing method manufacture for schematically showing laminated electronic component that can be through the invention
The stereogram of one example of capacitor.
Fig. 2 (a) and Fig. 2 (b) is the top view for schematically showing the raw cook for foring interior electrode layer, inside electricity
Pole layer is with for manufacturing the internal electrode pattern in a laminated electronic component of the side with 3 internal electrode lead divisions.
Fig. 2 (c) is the vertical view shown in by internal electrode pattern overlapping shown in Fig. 2 (a) and Fig. 2 (b).
Fig. 3 (a) and Fig. 3 (b) is the top view for schematically showing the raw cook for foring interior electrode layer, inside electricity
Pole layer has for manufacturing the internal electrode pattern for having the laminated electronic component there are two internal electrode lead division a side.
Fig. 3 (c) is the vertical view shown in by internal electrode pattern overlapping shown in Fig. 3 (a) and Fig. 3 (b).
Fig. 4 (a) and Fig. 4 (b) is the top view for schematically showing the raw cook for foring interior electrode layer, inside electricity
Pole layer has for manufacturing the internal electrode pattern for having the laminated electronic component there are one internal electrode lead division a side.
Fig. 4 (c) is the vertical view shown in by internal electrode pattern overlapping shown in Fig. 4 (a) and Fig. 4 (b).
Fig. 5 is the more figures in flakes for showing to be laminated the laminated body of raw cook shown in raw cook and Fig. 2 (b) shown in Fig. 2 (a)
The schematic diagram of case.
Fig. 6 is the section view for being shown schematically in the upper and lower appearance for being configured with elastomeric sheets in crimping process in laminated body
Figure.
Reference sign
1：Laminated ceramic capacitor,
10、100：Laminated body,
11：First side,
12：Second side,
21a、21b、22a、22b、23a、23b：External electrode,
101：First elastomeric sheets,
102：Second elastomeric sheets,
110a、110b、210a、210b、310a、310b：Raw cook,
111、111a、111b、211、211a、211b、311、311a、311b：First long side,
112、112a、112b、212、212a、212b、312、312a、312b：Second long side,
121a、121b、122a、122b、123a、123b、221a、221b、222a、222b、321a、322a：Internal electrode
Lead division,
130、230、330：Wave-like line (position for easy ting produce cracking),
313、313b：First short side,
314、314b：Second short side,
323b、324b：End face internal electrode lead division.
Specific implementation mode
Hereinafter, being illustrated to the manufacturing method of the laminated electronic component of the present invention with reference to attached drawing.However, the present invention is not
It is defined in structure below, can suitably be changed in the range of not changing the purport of the present invention to be applied.In addition, will
It is also the present invention that the preferred structure of each of the present invention recorded below, which combines more than two structures,.
Hereinafter, in case of manufacturing laminated ceramic capacitor to the present invention laminated electronic component manufacturing method into
Row explanation.
Fig. 1 is the laminated ceramic for the manufacturing method manufacture for schematically showing laminated electronic component that can be through the invention
The stereogram of one example of capacitor.Laminated ceramic capacitor 1 shown in FIG. 1 is arranged outer in the first side 11 of laminated body 10
Simultaneously external electrode 21b, outside is arranged in the second side of laminated body 10 12 in portion electrode 21a, external electrode 22a, external electrode 23a
Electrode 22b, external electrode 23b are formed.The part for being provided with each external electrode is to have drawn internal electrode from the side of laminated body
Part.In Fig. 1, schematically it has been dotted line shows the internal electrode of the inside in external electrode.Stacking shown in FIG. 1
Ceramic capacitor 1 can be described as the laminated electronic component for having 3 internal electrode lead divisions a side.Hereinafter, to can
The manufacturing method of the laminated electronic component of the such laminated ceramic capacitor of manufacture illustrates.
First, preparation forms the raw cook of interior electrode layer.Using the methods of spraying, molding coating, silk-screen printing in PET
To be mixed with as the ceramic slurry coating of the ceramics of dielectric layer and organic matter and solvent etc. on the mounting film of film etc. is piece
Shape, to obtain ceramic green sheet.Next, what modulation was made of the metal materials such as Ni powder, solvent, dispersant and adhesive etc.
The conductive paste of interior electrode layer formation.Pass through the methods of silk-screen printing, intaglio printing leading interior electrode layer formation
Electrical cream is printed on ceramic green sheet, forms internal electrode pattern.In this way, preparation forms the raw cook of interior electrode layer.
As the ceramics as dielectric layer, it may for example comprise by barium titanate (BaTiO3), calcium titanate (CaTiO3), strontium titanates
(SrTiO3) or calcium zirconate (CaZrO3) etc. ceramic material as principal component.In addition, ceramic material can also include Mn, Mg,
Accessory ingredient Si, Co, Ni or terres rares etc. fewer than principal component as content.As the organic matter that ceramic slurry includes, can enumerate
Polyvinyl butyral (Polyvinyl butyral) class adhesive, phthalate ester (phthalic ester) as adhesive
Class adhesive etc..The thickness of ceramic green sheet is preferably 0.6 μm or more and 1.2 μm or less.
The conductive paste of interior electrode layer formation preferably comprises the metal materials such as Ni, Cu, Ag, Pd, Ag-Pd alloy or Au
Material.In addition, it is also preferred that including the dielectric substance for the same composition class of ceramic material for including with ceramic green sheet.It is formed on raw cook
The thickness of interior electrode layer be preferably 0.2 μm or more and 1.5 μm or less.If it is 0.2 μm or more to make the thickness of interior electrode layer,
Then the continuity of internal electrode improves, therefore acquisition capacitance will not decline.In addition, if the thickness of interior electrode layer is made to be 1.5 μm
Hereinafter, then the adhesion between raw cook will not decline, the generation of the construction defect such as layering can be prevented.
The internal electrode pattern being depicted on ceramic green sheet is different according to the specification for the laminated electronic component to be manufactured, and says
Its bright several examples.The laminated electronic component manufactured with the manufacturing method of the laminated electronic component of the present invention is preferably at one
Side has the laminated electronic component of more than two internal electrode lead divisions.It will be for manufacturing such laminated electronic component
Internal electrode pattern is shown in Fig. 2 (a), Fig. 2 (b) and Fig. 2 (c) and Fig. 3 (a), Fig. 3 (b) and Fig. 3 (c).
Fig. 2 (a) and Fig. 2 (b) is the top view for schematically showing the raw cook for foring interior electrode layer, inside electricity
Pole layer is with for manufacturing the internal electrode pattern in a laminated electronic component of the side with 3 internal electrode lead divisions.
Fig. 2 (c) is the vertical view shown in by internal electrode pattern overlapping shown in Fig. 2 (a) and Fig. 2 (b).
In the raw cook 110a shown in Fig. 2 (a), internal electrode lead division 121a, internal electrode lead division 123a are reached
As the first long side 111a of first side when as laminated body, internal electrode lead division 122b reach when as laminated body at
For the second long side 112a of second side.On the other hand, in the raw cook 110b shown in Fig. 2 (b), internal electrode lead division 122a
It reaches and is drawn as the first long side 111b of first side, internal electrode lead division 121b, internal electrode when as laminated body
Portion 123b is reached when as laminated body as the second long side 112b of second side.
In Fig. 2 (c), internal electrode figure when overlappingly showing this two panels raw cook 110a and raw cook 110b overlappings
Case.According to by two panels raw cook be overlapped obtained from shape it is found that internal electrode lead division 121a, internal electrode lead division 122a with
And internal electrode lead division 123a is located at the first side of the laminated body obtained by the first long side 111 when as laminated body.This
Outside, it is known that internal electrode lead division 121b, internal electrode lead division 122b and internal electrode lead division 123b are located in conduct
The second side of the laminated body obtained by the second long side 112 when laminated body.In addition, in Fig. 2 (c), wave-like line is schematically used
130 show that the method by the laminated body prior art with the internal electrode pattern easy tos produce cracking when being crimped
Position.The manufacturing method of laminated electronic component according to the present invention can prevent from generating cracking at the position.
Fig. 3 (a) and Fig. 3 (b) is the top view for schematically showing the raw cook for foring interior electrode layer, inside electricity
Pole layer has for manufacturing the internal electrode pattern for having the laminated electronic component there are two internal electrode lead division a side.
Fig. 3 (c) is the vertical view shown in by internal electrode pattern overlapping shown in Fig. 3 (a) and Fig. 3 (b).
In the raw cook 210a shown in Fig. 3 (a), internal electrode lead division 221a is reached becomes first when as laminated body
First long side 211a of side, internal electrode lead division 222b are reached when as laminated body as the second long side of second side
212a.On the other hand, in the raw cook 210b shown in Fig. 3 (b), internal electrode lead division 222a reach when as laminated body at
For the first long side 211b of first side, internal electrode lead division 221b is reached when as laminated body as the of second side
Two long side 212b.
In Fig. 3 (c), internal electrode figure when overlappingly showing this two panels raw cook 210a and raw cook 210b overlappings
Case.According to shape obtained from being overlapped two panels raw cook it is found that internal electrode lead division 221a and internal electrode lead division
222a is located at the first side of the laminated body obtained by the first long side 211 when as laminated body.In addition, internal electrode lead division
221b and internal electrode lead division 222b is located at the second side of the laminated body obtained by the second long side 212 when as laminated body
Face.In addition, in Fig. 3 (c), schematically shown the laminated body with the internal electrode pattern with existing with wave-like line 230
The position of cracking is easy tod produce when the method for technology is crimped.The manufacturing method of laminated electronic component according to the present invention, energy
It enough prevents from generating cracking at the position.
In addition, the laminated electronic component manufactured with the manufacturing method of the laminated electronic component of the present invention can also be at one
There are one the laminated electronic components of internal electrode lead division for side tool.By the inside electricity for manufacturing such laminated electronic component
Pole figure case is shown in Fig. 4 (a), Fig. 4 (b) and Fig. 4 (c).
Fig. 4 (a) and Fig. 4 (b) is the top view for schematically showing the raw cook for foring interior electrode layer, inside electricity
Pole layer has for manufacturing the internal electrode pattern for having the laminated electronic component there are one internal electrode lead division a side.
Fig. 4 (c) is the vertical view shown in by internal electrode pattern overlapping shown in Fig. 4 (a) and Fig. 4 (b).
In the raw cook 310a shown in Fig. 4 (a), internal electrode lead division 321a is reached becomes first when as laminated body
First long side 311a of side, internal electrode lead division 322a are reached when as laminated body as the second long side of second side
312a.On the other hand, in the raw cook 310b shown in Fig. 4 (b), internal electrode lead division does not reach to be become when as laminated body
First long side 311b of first side and any of the second long side 312b as second side.Shown in Fig. 4 (b)
In raw cook 310b, end face internal electrode lead division 323b is reached when as laminated body as the first short side of first end face
313b, end face internal electrode lead division 324b are reached when as laminated body as the second short side 314b of second end face.
In Fig. 4 (c), internal electrode figure when overlappingly showing this two panels raw cook 310a and raw cook 310b overlappings
Case.According to by two panels raw cook be overlapped obtained from shape it is found that internal electrode lead division 321a be located at when as laminated body by
The first side for the laminated body that first long side 311 obtains.In addition, understanding that internal electrode lead division 322a is located at as laminated body
When the second side of laminated body that is obtained by the second long side 312.Making in addition, understanding that end face internal electrode lead division 323b is located at
First end face for the laminated body obtained by the first short side 313 when laminated body.In addition, understanding end face internal electrode lead division 324b
Positioned at the second end face of the laminated body obtained by the second short side 314 when as laminated body.In addition, in Fig. 4 (c), schematically
Ground shows that the method by the laminated body prior art with the internal electrode pattern is easy when having carried out crimping with wave-like line 330
Generate the position of cracking.The manufacturing method of laminated electronic component according to the present invention can prevent from generating cracking at the position.
The length for constituting the long side of the raw cook of laminated body is preferably 0.7mm or more and 1.3mm or less.In addition, the length of short side
Degree is preferably 0.4mm or more and 0.8mm or less.
Raw cook as explanation so far, to form interior electrode layer is laminated and makes laminated body.Layer
Lamination number is preferably 100 or more and 300 or less.Moreover, (the stacking of thickness × interior electrode layer of interior electrode layer will be used
The piece number) thickness that finds out is known as height residual quantity.The height residual quantity is to form the part of interior electrode layer and do not form internal electricity
The difference of the thickness of the part of pole layer.In the manufacturing method of the laminated electronic component of the present invention, the height is considered in crimping process
Low residual quantity determines the thickness of elastomeric sheets.Height residual quantity is preferably 50 μm or more and 200 μm or less.
When making laminated body, it is laminated for two kinds of raw cooks and is alternately overlapped so that the internal electrode pattern of laminated body becomes
The internal electrode pattern as shown in Fig. 2 (c), Fig. 3 (c) or Fig. 4 (c).It is interior that actually making replotting is shown in FIG. 5
More signals in flakes that it is laminated in the position of more raw cooks and the internal electrode pattern that is staggered in flakes of portion's electrode pattern
Figure.In Figure 5, it is schematically shown the stacking of raw cook 110b shown in raw cook 110a and Fig. 2 (b) shown in Fig. 2 (a) has been laminated
More patterns in flakes of body 100.In fig. 5, it is shown that the pattern of the amount of four laminated ceramic capacitors, is drawn with single-point in Figure 5
Each region that line separates is equivalent to the pattern of the amount of a laminated ceramic capacitor.
In addition, when making laminated body, preferably in the more lateral for the raw cook for foring interior electrode layer, stacking is used to form
The outer layer raw cook of outer layer.Outer layer raw cook is the ceramic green sheet without electrode layer.The thickness of outer layer raw cook be preferably 1 μm or more and
10 μm or less.
Next, carrying out crimping process, in the crimping process, the first bullet is configured in the stacking direction upper surface of laminated body
Property body piece, configure the second elastomeric sheets in the stacking direction lower surface of laminated body, and laminated body pressed in the stacking direction
It connects.
Fig. 6 is the section view for being shown schematically in the upper and lower appearance for being configured with elastomeric sheets in crimping process in laminated body
Figure.It schematically shows in more patterns in flakes of laminated body shown in Fig. 5 and is cut off at the position corresponding to A-A ＇ lines
Section the upper and lower appearance for being configured with elastomeric sheets.
In figure 6, the first elastomeric sheets 101 are configured in the upper surface of laminated body 100, in the lower surface of laminated body 100
Configured with the second elastomeric sheets 102.In laminated body 100, alternately exists towards left and right directions and form interior electrode layer
Part and do not form the part of interior electrode layer, do not formed the part of interior electrode layer thickness it is thinning with (internal electrode
The stacking the piece number of thickness × interior electrode layer of layer) the height residual quantity that finds out measures accordingly.Because elastomeric sheets have elasticity (soft
It is soft), so difference of height can be tracked and also be contacted with the part for not forming interior electrode layer.
About the first elastomeric sheets and the material of the second elastomeric sheets, as long as the part to not forming interior electrode layer
Apply flexible material as pressure, is just not particularly limited.Specifically, styrene butadiene ribber can be enumerated
(styrene-butadiene rubber), isoprene rubber (isoprene rubber), butadiene rubber (butadiene
Rubber), chloroprene rubber (chloroprene rubber), acrylonitrile butadiene rubber (acrylonitrile-
Butadiene rubber), butyl rubber (butyl rubber), ethylene propylene rubber (ethylene-propylene
Rubber), propylene diene hydrocarbon rubbers (ethylene propylene diene rubber), polyurethane rubber
(urethane rubber), silicone rubber (silicone rubber), fluorubber, acrylic rubber (acrylic
Rubber), epichlorohydrin rubber (epichlorohydrin rubber), polysulfide rubber, chlorosulfonated polyethylene rubber
Rubber materials such as (chlorosulfonated polyethylene rubber).In addition, can enumerate polyethylene, polystyrene,
The resin materials such as polyurethane.Among these materials, preferred silicone rubber.
The hardometer A type hardness testers of first elastomeric sheets and the second elastomeric sheets are respectively preferably 40 or more and 80 or less.
Hardometer A type hardness testers are the hardness with (cylindric) measurement of type A pressure heads.
The thickness of first elastomeric sheets and the second elastomeric sheets meets following relational expressions (1) and (2).
The thickness (1) of the first elastomeric sheets of ＞ of (the stacking the piece number of thickness × interior electrode layer of interior electrode layer)/2
The thickness (2) of the second elastomeric sheets of ＞ of (the stacking the piece number of thickness × interior electrode layer of interior electrode layer)/2
(the stacking the piece number of thickness × interior electrode layer of interior electrode layer) is above-mentioned height residual quantity, formula (1) and (2)
It is meant that the thickness of the first elastomeric sheets and the second elastomeric sheets compares so as to see who is superior, the thickness of the half of residual quantity is thin.If the first elasticity
Body piece and the thickness of the second elastomeric sheets meet above-mentioned relation formula (1) and (2), then can reduce foring internal electrode
Layer part and do not form interior electrode layer portion boundary at apply power and prevent cracking generation.In addition, the first bullet
Property body piece and the thickness of the second elastomeric sheets are respectively preferably the use (laminates of thickness × interior electrode layer of interior electrode layer
Number) it is more than 20% thickness of height residual quantity that finds out.In addition, the thickness of the first elastomeric sheets and the second elastomeric sheets is distinguished
Preferably 20 μm or more.
First elastomeric sheets and the second elastomeric sheets can use a piece of respectively, can also use multi-disc overlapping.
The thickness of elastomeric sheets when overlapping more pieces of resilient body piece is used is determined as its aggregate thickness.In addition, the first elasticity
The material of the material of body piece and the second elastomeric sheets can be identical respectively, can also be respectively different.In addition, about the first elastomer
The thickness of the thickness of piece and the second elastomeric sheets can also be different as long as meeting relational expression (1) and (2) respectively.
Crimping condition in crimping process is not particularly limited, it is preferred that crimping temperature (mold temperature) is set as 60 DEG C
Above and 85 DEG C or less.Furthermore it is preferred that pressing pressure is set as 20MPa or more and 60MPa or less.Furthermore it is preferred that when will suppress
Between be set as 30 seconds or more and 180 seconds or less.Crimping can be carried out using arbitrary pressure setting.By using elastomeric sheets
Crimping, it can be ensured that do not form the adhesion of the part of interior electrode layer.
It is preferred that further carrying out rigid body suppression process after crimping process.In rigid body suppression process, without using elasticity
Body piece is suppressed, and the difference of height of the part and the part for not forming interior electrode layer that form interior electrode layer is reduced.In mould
Have (rigid body) between laminated body, preferred disposition PET film.In addition it is also possible to assign releasing agent on the surface of mold, and it is unworthy of
PET film is set to carry out rigid body suppression process.Pressing conditions in rigid body suppression process is not particularly limited, it is preferred that will crimping
Temperature (mold temperature) is set as 60 DEG C or more and 85 DEG C or less.Furthermore it is preferred that pressing pressure is set as 70MPa or more and 150MPa
Below.Furthermore it is preferred that will be set as the pressing time 30 seconds or more and 300 seconds or less.Rigid body suppression process can use arbitrary pressure
Device processed carries out.In addition, in foring the part of interior electrode layer in the laminated body that have passed through crimping process and not formed
In the case that the difference of height of the part of portion's electrode layer is small, rigid body suppression process can not also be carried out.
Hereafter, by carrying out the firing of laminated body and the formation of external electrode, so as to become laminated ceramic electricity
Container.About these processes, can be carried out by well known method.
So far, to the manufacturer of the laminated electronic component of the present invention in case of manufacturing laminated ceramic capacitor
Method is illustrated, but the laminated electronic component of the manufacturing method of laminated electronic component through the invention manufacture does not limit
In laminated ceramic capacitor.In the case of the electronic unit other than laminated ceramic capacitor, as the pottery for constituting dielectric layer
Porcelain can use the magnetic substance ceramics such as semiconductive ceramics, the ferrites such as piezoelectric ceramics, the spinels ceramics such as PZT class ceramics.
It is functioned as piezoelectric part in the case where having used piezoelectric ceramic, the conduct in the case where having used semiconductive ceramic
Thermistor functions, and is functioned as inductor in the case where having used magnetic substance ceramics.
[embodiment]
Hereinafter, showing to more particularly disclose the embodiment of the electronic unit of the present invention.In addition, the present invention and not only limiting
In these embodiments.
(embodiment 1)
1) making of the raw cook of interior electrode layer is formd
In the BaTiO as ceramic raw material3Middle addition polyvinyl butyral class adhesive, plasticizer and as organic
The ethyl alcohol of solvent, and wet mixed is carried out to them using ball mill, make ceramic slurry.Next, by the ceramic slurry
It is shaped to sheet material by scraping sheet mode, has obtained the ceramic green sheet of rectangle.The thickness of ceramic green sheet is 1.0 μm average.Then, exist
Silk-screen printing is carried out to the conductive paste containing Ni on above-mentioned ceramic green sheet, forms the internal electrode figure using Ni as principal component
Case.Internal electrode pattern is that a side there are 3 internal electrodes to draw as shown in Fig. 2 (a) and Fig. 2 (b), for manufacturing
Go out the internal electrode pattern of the laminated electronic component in portion.
2) measurement of internal electrode layer thickness
Printed internal electrode layer thickness is determined using fluorescent X-ray film thickness gauge.To 5 raw cooks, per a piece of
The measurement (5 total) of (5 × 5 rows of row of internal electrode pattern central portion) is carried out at 125 points at 25 points.Average thickness is 0.5 μm.
3) lamination process
To form two kinds of raw cooks of interior electrode layer be alternately respectively laminated 100 and as laminated body.The piece number, which is laminated, is
200.In turn, in the composition stacked on top of one another of laminated body, identical and thickness is average 50 μm of outer layer raw cook with ceramic green sheet.
Height residual quantity in laminated body is that 200=100 μm of the piece number is laminated in 0.5 μ m of internal electrode layer thickness.
4) crimping process
As the first elastomeric sheets and the second elastomeric sheets, it is 60 silicone rubber to have used hardometer A type hardness testers.
In embodiment 1, it is 40 μm of elastomeric sheets to have used thickness.The first elastomeric sheets are configured in the upper surface of laminated body, in following table
Face configures the second elastomeric sheets, is crimped with 70 DEG C of mold temperature, pressing pressure 40MPa, 60 seconds pressing times.
5) rigid body suppression process
Next, the PET film that thickness is 50 μm is configured in the upper surface of laminated body and following table instead of elastomeric sheets
Face is crimped (rigid body suppression process) with 70 DEG C of mold temperature, pressing pressure 100MPa, 60 seconds pressing times.
6) cut-out and firing process
The laminated body after crimping is split by scribing and has obtained chip.By obtained chip in N2 environment into
Row heats and adhesive is made to burn, and is then including H2、N2And H2It is burnt at 1250 DEG C in the reproducibility environment of O gases,
Sintered laminated body is obtained.The size of the laminated body of making is L × W × T=1.0mm × 0.5mm × 0.4mm.
(observation for the number that is cracked after firing)
Observation have passed through the surface of the laminated body of firing process, it is thus identified that have no cracking.The presence or absence of cracking is by with micro-
It is observed to judge in the mirror pair face (upper surface or lower surface) vertical with the stacking direction of laminated body after firing.In particular,
Tortoise is easy tod produce being equivalent to the part for foring interior electrode layer and the position for the portion boundary for not forming interior electrode layer
It splits.Length is counted for 10 μm or more of cracking as " having cracking ".
(measurement of insulation resistance fraction defective)
Resistance value is set as defective insulation by the voltage for applying 40V, 30ms to laminated body less than 50M Ω.Number is measured to be set as
3000, % be used in combination that fraction defective is shown.The sample of measurement as insulation resistance fraction defective has prepared after crimping process not
The laminated body (being expressed as the laminated body " after crimping process " in table 1) and warp of firing process have been carried out by rigid body suppression process
The laminated body crossed crimping process and rigid body suppression process and carried out firing process (is expressed as in table 1 " after rigid body compacting "
Laminated body) both.
(measurement of height residual quantity)
Resin burial is carried out by crimping process and by the laminated body before carrying out scribing before firing process, and is held
Face is ground, and section observation sample sheet has been made.Then, it measures and does not form the minimum part in part of interior electrode layer and form
The difference of the height of the highest part in part of interior electrode layer is as height residual quantity.For a chip, at 4 (Fig. 6 B,
C, the position shown in D, E) measurement of height is carried out, and carry out the survey of height from the chip randomly extracted out in laminated body from 5
It is fixed.The sample of measurement as height residual quantity has prepared to be burnt without rigid body suppression process after crimping process
At the laminated body (being expressed as the laminated body " after crimping process " in table 1) of process and by crimping process and rigid body suppression process
And carried out firing process laminated body (laminated body " after rigid body compacting " is expressed as in table 1) both.
(embodiment 2~4)
Other than being changed to the thickness of elastomeric sheets respectively as shown in table 1, it is laminated similarly to Example 1
The making and evaluation of body.
(comparative example 1)
Other than carrying out crimping process in addition to elastomeric sheets are not used, the system of laminated body has been carried out similarly to Example 1
Make and evaluates.
(comparative example 2,3)
Other than being changed to the thickness of elastomeric sheets respectively as shown in table 1, it is laminated similarly to Example 1
The making and evaluation of body.
Summarize the evaluation result for showing each embodiment and each comparative example in table 1.
[table 1]
In each embodiment shown in table 1, [(the stacking the piece number of thickness × interior electrode layer of interior electrode layer)/2]=
50 μm, so if the thickness of elastomeric sheets is less than 50 μm, then meet relational expression (1) and (2).Examples 1 to 4 uses
Elastomeric sheets, and its thickness meets relational expression (1) and (2), therefore the generation of cracking can be prevented.In addition, insulation resistance is not
Yield also reduces, in the thickness of elastomeric sheets is 20 μm or more of embodiment 3, embodiment 4 and embodiment 1, insulation resistance
Fraction defective is especially low.
Elastomeric sheets are not used in comparative example 1, therefore insulation resistance fraction defective is high.In comparative example 2 and comparative example 3
In, although having used elastomeric sheets, its thickness is thick, is unsatisfactory for relational expression (1) and (2), therefore produce cracking.
About height residual quantity, reduce after rigid body compacting, it is known that height residual quantity can be reduced by rigid body compacting.
(embodiment 5, comparative example 4)
It has made two kinds internal electrode pattern is set as shown in Fig. 3 (a) and Fig. 3 (b), for manufacturing a side
Mask forms the raw cook of interior electrode layer there are two the internal electrode pattern of the laminated electronic component of internal electrode lead division.
Then, the raw cook that the thickness of elastomeric sheets is 40 μm will be made to be used as embodiment 5, the thickness of elastomeric sheets will be made for 100 μm of life
Piece has carried out the making and evaluation of laminated body as comparative example 4.As evaluation, the observation of cracking number after being only burnt into.
(embodiment 6, comparative example 5)
It has made two kinds internal electrode pattern is set as shown in Fig. 4 (a) and Fig. 4 (b), for manufacturing a side
Mask forms the raw cook of interior electrode layer there are one the internal electrode pattern of the laminated electronic component of internal electrode lead division.
Then, the raw cook that the thickness of elastomeric sheets is 40 μm will be made to be used as embodiment 6, the thickness of elastomeric sheets will be made for 100 μm of life
Piece has carried out the making and evaluation of laminated body as comparative example 5.As evaluation, the observation of cracking number after being only burnt into.
Table 2 show together embodiment 1 and comparative example 3 as a result, showing the number in lateral inner extraction electrode portion
With the relationship of cracking number.The size of the laminated body of making is L × W × T=1.0mm × 0.5mm × 0.4mm.
[table 2]
As shown in table 2, tortoise is not generated in each embodiment that the thickness of elastomeric sheets meets relational expression (1) and (2)
It splits, but cracking is produced in each comparative example that the thickness of elastomeric sheets is unsatisfactory for relational expression (1) and (2).Lateral inner
The number of electrode lead-out part is more, and the generation number of cracking is more, thus, it can be known that more than the number of lateral inner electrode lead-out part
In the case of, the method for the present application is particularly effective.
Claims (8)
1. a kind of manufacturing method of laminated electronic component, including：
Lamination process, stacking multi-disc form the raw cook of interior electrode layer, make laminated body；And
Crimping process configures the first elastomeric sheets, in the stacking of the laminated body in the stacking direction upper surface of the laminated body
Direction lower surface configures the second elastomeric sheets, and the laminated body is crimped in the stacking direction, the stacking ministry of electronics industry
The manufacturing method of part is characterized in that,
Meet following relational expressions (1) and (2),
The thickness (1) of the first elastomeric sheets of ＞ of (the stacking the piece number of thickness × interior electrode layer of interior electrode layer)/2
The thickness (2) of the second elastomeric sheets of ＞ of (the stacking the piece number of thickness × interior electrode layer of interior electrode layer)/2.
2. the manufacturing method of laminated electronic component according to claim 1, which is characterized in that
The thickness of first elastomeric sheets and second elastomeric sheets is respectively thickness × inside with interior electrode layer
It is more than 20% thickness of the height residual quantity that the stacking the piece number of electrode layer is found out.
3. the manufacturing method of laminated electronic component according to claim 1 or 2, which is characterized in that
The hardometer A type hardness testers of first elastomeric sheets and second elastomeric sheets are respectively 40 or more and 80 or less.
4. the manufacturing method of the laminated electronic component according to any one of claims 1 to 3, which is characterized in that
The height residual quantity found out with the stacking the piece number of thickness × interior electrode layer of interior electrode layer be 50 μm or more and 200 μm with
Under.
5. the manufacturing method of the laminated electronic component according to any one of Claims 1 to 4, which is characterized in that
After the crimping process, rigid body suppression process is further carried out.
6. the manufacturing method of the laminated electronic component according to any one of Claims 1 to 5, which is characterized in that
The laminated electronic component is laminated ceramic capacitor.
7. the manufacturing method of the laminated electronic component according to any one of claim 1~6, which is characterized in that
The laminated electronic component is the laminated electronic component for having more than two internal electrode lead divisions a side.
8. the manufacturing method of the laminated electronic component according to any one of claim 1~7, which is characterized in that
Crimping temperature in crimping process is 60 DEG C or more and 85 DEG C or less.
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| JPH09190948A (en) * | 1996-01-11 | 1997-07-22 | Murata Mfg Co Ltd | Manufacture of stacked ceramic electronic element |
| JP2014029954A (en) * | 2012-07-31 | 2014-02-13 | Murata Mfg Co Ltd | Electronic component manufacturing method |
| CN104576053A (en) * | 2013-10-25 | 2015-04-29 | 株式会社村田制作所 | Monolithic ceramic capacitor |
| CN104599841A (en) * | 2013-10-30 | 2015-05-06 | 株式会社村田制作所 | Method for manufacturing monolithic ceramic electronic component and monolithic ceramic electronic component |
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| JPH07186119A (en) * | 1993-12-27 | 1995-07-25 | Kyocera Corp | Production of laminated ceramic part |
| KR20050038440A (en) * | 2003-10-22 | 2005-04-27 | 삼성전기주식회사 | Multi layer ceramic condenser pressing device and pressing method using it |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09190948A (en) * | 1996-01-11 | 1997-07-22 | Murata Mfg Co Ltd | Manufacture of stacked ceramic electronic element |
| JP2014029954A (en) * | 2012-07-31 | 2014-02-13 | Murata Mfg Co Ltd | Electronic component manufacturing method |
| CN104576053A (en) * | 2013-10-25 | 2015-04-29 | 株式会社村田制作所 | Monolithic ceramic capacitor |
| CN104599841A (en) * | 2013-10-30 | 2015-05-06 | 株式会社村田制作所 | Method for manufacturing monolithic ceramic electronic component and monolithic ceramic electronic component |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110895992A (en) * | 2018-09-13 | 2020-03-20 | 太阳诱电株式会社 | Multilayer ceramic capacitor and circuit board |
| CN110895992B (en) * | 2018-09-13 | 2022-05-13 | 太阳诱电株式会社 | Multilayer ceramic capacitor and circuit board |
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