CN108274866B - 一种薄壁3d曲面复合壳体及其制备方法 - Google Patents
一种薄壁3d曲面复合壳体及其制备方法 Download PDFInfo
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Abstract
本发明公开了一种薄壁3D曲面复合壳体,包括复合板、内侧硅胶圈和外侧硅胶圈;复合板底部向下凹陷形成凹陷部,内侧硅胶圈设置在凹陷部的周缘,外侧硅胶圈设置在复合板的周缘;复合板由PMMA层与PC层复合而成,PMMA层设置在PC层上表面;复合板的厚度为0.175‑1.5mm,PMMA层与PC层厚度比例为1:(10‑4)。本发明还提供一种薄壁3D曲面复合壳体的制备方法。本发明的复合壳体外观高亮、高光、通透的外观效果的同时更兼具绚丽,颜色丰富多彩的外观装饰效果,又能解决玻璃材料韧性差,易碎裂问题,实现结构件防撞防摔经久耐用的特性,且表面硬度高,整体强度好,结构稳定可靠。
Description
技术领域
本发明涉及一种玻璃外壳,尤其涉及一种薄壁3D曲面复合壳体及其制备方法。
背景技术
玻璃外壳及相关制品因其通透感好,质地坚硬,时尚美观,清澈明亮,美观高档等特点而深受人们的喜爱,也越来越多的应用于手工艺品,消费电子,时尚用品等高附加值产品。但又因玻璃材料加工困难,容易摔碎,比重较高,制品精度较低,生产成本高等特性,导致应用范围窄,做工精细的玻璃产品仅能高档奢饰品或手艺术品,而难以大批量制造。
同时随着人们的生活水平提高,对高附加值的可穿戴设备,手机,智能手表,移动电子等便携3C电子产品要求不断提高,市场竞争的愈加激烈,电子产品的镜片及外壳也越来越多的使用玻璃材料,在提升产品档次的同时能给予产品外观很好的保护,以避免在日常使用中因硬物划伤导致的外壳及屏幕损坏。且3C移动电子等产品外形越来越多的使用渐变,弧面,3D异形曲面等复杂外形,进一步提高了对玻璃外壳的要求,增加了制造的难度与成本。
在外观效果方面,受限于传统玻璃表面的印刷、喷砂、镀膜等处理工艺,玻璃表面装饰效果可选择性较少,效果相对单一,再加上人们长时间的审美疲劳,导致玻璃表面缺乏绚烂的装饰工艺,难以提升传统玻璃制品外观效果上的吸引力。
在结构上因玻璃质地坚硬但较脆,刚性强但韧性低的特点,玻璃难以适应人们日常生活中频繁发生的磕碰,摔伤,外力撞击,压伤等日常使用情况,难以满足人们日常的生活,特别是与密切相关的3C移动电子产品,导致玻璃制品的应用领域及附加值难以提升与突破。
发明内容
为了克服现有技术的不足,本发明的目的之一在于提供一种薄壁3D曲面复合壳体,该复合壳体外观高亮、高光、通透的外观效果的同时更兼具绚丽,颜色丰富多彩的外观装饰效果,又能解决玻璃材料韧性差,易碎裂问题,实现结构件防撞防摔经久耐用的特性,且表面硬度高,整体强度好,结构稳定可靠。
本发明的目的之二在于提供一种薄壁3D曲面复合壳体的制备方法,该制备工艺简单、生产成本低,自动化程度高、尺寸精度高、制造成本低且易于大规模量产,能满足工艺品及现有可穿戴设备,手机、智能手表、移动电子等便携3C电子产品及消费产品外壳的轻薄化、时尚化、实用化的产品需求,具备轻薄时尚,外观新颖,高档次外观且实用的玻璃效果外壳,满足高硬度抗划伤,强度高抗弯曲,可拆卸高端个性化定制,防水防尘防摔伤破裂。
本发明的目的之一采用如下技术方案实现:
一种薄壁3D曲面复合壳体,包括复合板、内侧硅胶圈和外侧硅胶圈;所述复合板底部向下凹陷形成凹陷部,内侧硅胶圈设置在凹陷部的周缘,所述外侧硅胶圈设置在复合板的周缘;所述复合板由PMMA层与PC层复合而成,所述PMMA层设置在PC层上表面;所述复合板的厚度为0.175-1.5mm,PMMA层与PC层厚度比例为1:(10-4)。
进一步地,所述凹陷部上设置有玻纤板。
进一步地,所述PMMA层材料的硬度大于2H。
进一步地,所述复合板的边沿向上延伸并向内弯曲形成凸条,所述外侧硅胶圈设置在凸条上。
进一步地,所述内侧硅胶圈包括两个平行设置的硅胶条,两个硅胶条之间形成防水槽。
本发明的目的之二采用如下技术方案实现:
一种薄壁3D曲面复合壳体的制备方法,包括,
切割步骤:将复合板进行开料切割,得到切割半成品;
表面处理步骤:对基材半成品靠近PC层的一侧进行复合表面处理,复合表面处理包括表面装饰处理和表面功能处理,表面装饰处理包括印刷LOGO、UV转印、表面镀膜和底层印刷,表面功能处理包括AF抗指纹镀膜、AG防眩光镀膜和AR增透镀膜,处理后得到基材半成品;
打孔步骤:在基材半成品上开设定位孔,基材半成品的X方向与Y方向上各开设至少两个定位孔;
热压步骤:将打孔后的基材半成品安装在热压机台上,将基材半成品热压为2D或3D曲面,得到热压半成品;
一次CNC加工步骤:在热压半成品的上表面固定压合机构,在热压半成品的下表面固定吸附孔,然后对热压半成品进行一次CNC加工,得到CNC半成品;
硬化步骤:清洗CNC半成品,去除其表面脏污,然后对CNC半成品表面进行硬化处理,得到硬化半成品;
成型步骤:对硬化半成品进行底涂处理后,将硬化半成品放入塑胶模具中,进行塑胶模内成型,再进行二次CNC加工,得到成型基材;
涂胶步骤:将成型机采放入液态硅胶模具中,进行液态硅胶成型,得到薄壁3D曲面复合壳体。
进一步地,打孔步骤中,定位孔的孔径为3-6mm。
进一步地,热压步骤中,先检查打孔后的基材半成品的平面度,使平面度小于0.15mm,再进行热压。
进一步地,热压步骤中,热压在真空下进行,真空度为20-50torr;热压温度为130-200℃,热压时间为30-40秒。
进一步地,硬化步骤中,硬化处理具体为,采用表面UV光固化的丙烯酸酯为硬化液,采用喷涂工艺对CNC半成品表面进行处理,喷涂膜层厚度为0.015-0.02mm,固化条件为900-1000mj/cm2。
相比现有技术,本发明的有益效果在于:
(1)本发明薄壁3D曲面复合壳体,该复合壳体外观高亮、高光、通透的外观效果的同时更兼具绚丽,颜色丰富多彩的外观装饰效果,又能解决玻璃材料韧性差,易碎裂问题,实现结构件防撞防摔经久耐用的特性,且表面硬度高,整体强度好,结构稳定可靠;
(2)本发明薄壁3D曲面复合壳体的制备方法,该制备工艺简单、生产成本低,自动化程度高、尺寸精度高、制造成本低且易于大规模量产,能满足工艺品及现有可穿戴设备,手机、智能手表、移动电子等便携3C电子产品及消费产品外壳的轻薄化、时尚化、实用化的产品需求,具备轻薄时尚,外观新颖,高档次外观且实用的玻璃效果外壳,满足高硬度抗划伤,强度高抗弯曲,可拆卸高端个性化定制,防水防尘防摔伤破裂。
附图说明
图1为本发明的薄壁3D曲面复合壳体的结构示意图;
图2为图1中A-A截面的剖面图;
图3为图2中B区域放大图;
图4为本发明复合壳体的表面处理步骤示意图;
图5-6为本发明复合壳体的打孔步骤示意图;
图7为本发明的复合壳体的热压步骤示意图;
图8为本发明的复合壳体的一次CNC加工步骤示意图;
图9为本发明的复合壳体的硬化步骤示意图;
图10为本发明的复合壳体的成型步骤示意图。
图中:1、复合板;11、凹陷部;12、凸条;2、内侧硅胶圈;3、外侧硅胶圈;4、玻纤板;a、定位孔。
具体实施方式
下面,结合附图以及具体实施方式,对本发明做进一步描述,需要说明的是,在不相冲突的前提下,以下描述的各实施例之间或各技术特征之间可以任意组合形成新的实施例。
参照图1-3,一种薄壁3D曲面复合壳体,包括复合板1、内侧硅胶圈2和外侧硅胶圈3;复合板底部向下凹陷形成凹陷部11,内侧硅胶圈2设置在凹陷部的周缘,外侧硅胶圈设置在复合板的周缘;复合板由PMMA层与PC层复合而成,PMMA层设置在PC层上表面;复合板的厚度为0.175-1.5mm,PMMA层与PC层厚度比例为1:(10-4)。
PMMA俗称有机玻璃,指聚甲基丙烯酸甲酯,以丙烯酸及其酯类聚合所得到的聚合物统称丙烯酸类树酯。
PC为聚碳酸酯,是分子链中含有碳酸酯基的高分子聚合物,根据酯基的结构可分为脂肪族、芳香族、脂肪族-芳香族等多种类型。
作为进一步地实施方式,凹陷部上设置有玻纤板4。
作为进一步地实施方式,PMMA层材料的硬度大于2H,这样PMMA层为流动性较好的高硬规格。
作为进一步地实施方式,复合板的边沿向上延伸并向内弯曲形成凸条12,外侧硅胶圈设置在凸条上。
作为进一步地实施方式,内侧硅胶圈包括两个平行设置的硅胶条,两个硅胶条之间形成防水槽。
参照图4-10,其中图7-10中,上方为复合板底部示意图,下方为复合板内部示意图;一种薄壁3D曲面复合壳体的制备方法,包括,
切割步骤:将复合板进行开料切割,得到切割半成品;
表面处理步骤:对基材半成品靠近PC层的一侧进行复合表面处理,复合表面处理包括表面装饰处理和表面功能处理,表面装饰处理包括印刷LOGO、UV转印、表面镀膜和底层印刷,表面功能处理包括AF抗指纹镀膜、AG防眩光镀膜和AR增透镀膜,处理后得到基材半成品;
打孔步骤:在基材半成品上开设定位孔a,基材半成品的X方向与Y方向上各开设至少两个定位孔;
热压步骤:将打孔后的基材半成品安装在热压机台上,将基材半成品热压为2D或3D曲面,得到热压半成品;
一次CNC加工步骤:在热压半成品的上表面固定压合机构,在热压半成品的下表面固定吸附孔,然后对热压半成品进行一次CNC加工,得到CNC半成品;
硬化步骤:清洗CNC半成品,去除其表面脏污,然后对CNC半成品表面进行硬化处理,得到硬化半成品;
成型步骤:对硬化半成品进行底涂处理后,将硬化半成品放入塑胶模具中,进行塑胶模内成型,再进行二次CNC加工,得到成型基材;根据产品结构及实际检测的变形度,对产品的CNC加工尺寸进行修正,以产品无变形时的结构状态调整CNC加工尺寸,保证后工序加工精度;二次CNC加工过程中不允许出现边缘崩角、倒角大小边等加工缺陷,对于精度要求高的结构,可采用定制成型刀具,以提升加工精度,视产品结构及工艺需求,需要对产品反面进行加工时,二次CNC加工中需保证加工时的定位与基准面一致,以减小加工误差;
涂胶步骤:将成型机采放入液态硅胶模具中,进行液态硅胶成型,得到薄壁3D曲面复合壳体。
作为进一步地实施方式,打孔步骤中,定位孔的孔径为3-6mm。
作为进一步地实施方式,热压步骤中,先检查打孔后的基材半成品的平面度,使平面度小于0.15mm,再进行热压。
作为进一步地实施方式,热压步骤中,热压在真空下进行,真空度为20-50torr,以提升热压品质;热压温度为130-200℃,并保证热压热压机的模具型腔周边温差小于±10℃,热压时间为30-40秒。
作为进一步地实施方式,硬化步骤中,硬化处理具体为,采用表面UV光固化的丙烯酸酯为硬化液,采用喷涂工艺对CNC半成品表面进行处理,喷涂膜层厚度为0.015-0.02mm,固化条件为900-1000mj/cm2。
表面处理步骤中,使用印刷工艺,在产品背面第一层印刷产品的LOGO、产品所需的说明文字、产品图案与花纹等,LOGO层厚度约为0.006mm;第二层为UV转印工艺,将细小规律的纹路,通过UV转印模具,将纹路转印至产品背面,作为第二层的UV纹理,使最终的产品表面展现时,会根据不同光线、照射角度,不同区域纹路图案折射出不同的纹路效果,绚丽多彩;UV转印纹路一般有CD纹、光栅纹、碳纤维纹、拉丝纹等各种纹路可供选择,更可根据产品的需求设计或更改,展现出不同的纹路效果,UV纹理层厚约0.02mm,,案例中纹路为CD纹;再使用表面镀膜工艺,在产品背面进行第三层的表面装饰效果,其作用是作为产品正面透视可见的产品颜色,即产品可见的底色,使用的镀膜工艺不限,一般为不导电真空镀膜,也可以是其它镀膜工艺,真空镀层厚度约0.006mm;然后使用底层印刷工艺,在产品背面进行第四次印的底层刷,其作用主要是保护前面几层的镀层,颜色一般为黑色、白色或其它产品指定的颜色,底层印刷厚度约0.006mm。
AF抗指纹镀膜是根据荷叶原理,在产品外表面涂制一层纳米化学材料,将产品表面张力降至最低,灰尘与玻璃表面接触面积减少90%,使产品表面保持光洁亮丽。
AG防眩光镀膜是通过提高产品玻璃透光率,降低玻璃反射率达到增透目的。
AR增透镀膜是将玻璃表面进行单面或双面特殊处理后达到多角度漫反射的效果,从而提到画面的可视角度,降低环境光的感染,减少屏幕反光。
CNC(数控机床)是计算机数字控制机床(Computer numerical control)的简称,是一种由程序控制的自动化机床。该控制系统能够逻辑地处理具有控制编码或其他符号指令规定的程序,通过计算机将其译码,从而使机床执行规定好了的动作,通过刀具切削将毛坯料加工成半成品成品零件。
另外,涂胶步骤后,还可在复合板的凹陷部上贴合玻纤板,增强产品整体强度;使用点胶机对玻纤板与产品背面的贴合区域进行点胶处理,以保证玻纤板与产品之间的粘合力;将按形状要求裁切好的玻纤板,使用贴合机,将玻纤板均匀的压合在产品内侧;贴合用的胶水一般为UV胶水,厚度约0.02mm,玻纤板的厚度为0.1mm;玻纤板贴合后,产品表面不能有压伤等不良,贴合面需尽量控制无空鼓、气泡、多胶等不良。
实施例1:
一种薄壁3D曲面复合壳体,包括复合板、内侧硅胶圈和外侧硅胶圈;复合板底部向下凹陷形成凹陷部,内侧硅胶圈设置在凹陷部的周缘,外侧硅胶圈设置在复合板的周缘,凹陷部上设置有玻纤板;复合板由PMMA层与PC层复合而成,PMMA层设置在PC层上表面;复合板的厚度为1mm,PMMA层与PC层厚度比例为1:4,PMMA层材料的硬度大于2H。
复合板的边沿向上延伸并向内弯曲形成凸条,外侧硅胶圈设置在凸条上。内侧硅胶圈包括两个平行设置的硅胶条,两个硅胶条之间形成防水槽。
上述薄壁3D曲面复合壳体的制备方法,包括,
切割步骤:将复合板进行开料切割,得到切割半成品;
表面处理步骤:对基材半成品靠近PC层的一侧进行复合表面处理,复合表面处理包括表面装饰处理和表面功能处理,表面装饰处理包括印刷LOGO、UV转印、表面镀膜和底层印刷,表面功能处理包括AF抗指纹镀膜、AG防眩光镀膜和AR增透镀膜,处理后得到基材半成品;
打孔步骤:在基材半成品上开设定位孔,基材半成品的X方向与Y方向上各开设至少两个定位孔,定位孔的孔径为3mm;
热压步骤:先检查打孔后的基材半成品的平面度,使平面度小于0.15mm,再将打孔后的基材半成品安装在热压机台上,热压在真空下进行,真空度为20torr,热压温度为200℃,热压时间为30秒,将基材半成品热压为2D或3D曲面,得到热压半成品;
一次CNC加工步骤:在热压半成品的上表面固定压合机构,在热压半成品的下表面固定吸附孔,然后对热压半成品进行一次CNC加工,得到CNC半成品;
硬化步骤:清洗CNC半成品,去除其表面脏污,然后对CNC半成品表面进行硬化处理,得到硬化半成品,硬化处理具体为,采用表面UV光固化的丙烯酸酯为硬化液,采用喷涂工艺对CNC半成品表面进行处理,喷涂膜层厚度为0.015mm,固化条件为900mj/cm2;
成型步骤:对硬化半成品进行底涂处理后,将硬化半成品放入塑胶模具中,进行塑胶模内成型,再进行二次CNC加工,得到成型基材;根据产品结构及实际检测的变形度,对产品的CNC加工尺寸进行修正,以产品无变形时的结构状态调整CNC加工尺寸,保证后工序加工精度;二次CNC加工过程中不允许出现边缘崩角、倒角大小边等加工缺陷,对于精度要求高的结构,可采用定制成型刀具,以提升加工精度,视产品结构及工艺需求,需要对产品反面进行加工时,二次CNC加工中需保证加工时的定位与基准面一致,以减小加工误差;
涂胶步骤:将成型机采放入液态硅胶模具中,进行液态硅胶成型,再在复合板的凹陷部上贴合玻纤板,得到薄壁3D曲面复合壳体。
实施例2:
一种薄壁3D曲面复合壳体,包括复合板、内侧硅胶圈和外侧硅胶圈;复合板底部向下凹陷形成凹陷部,内侧硅胶圈设置在凹陷部的周缘,外侧硅胶圈设置在复合板的周缘,凹陷部上设置有玻纤板;复合板由PMMA层与PC层复合而成,PMMA层设置在PC层上表面;复合板的厚度为0.7mm,PMMA层与PC层厚度比例为1:6,PMMA层材料的硬度大于2H。
复合板的边沿向上延伸并向内弯曲形成凸条,外侧硅胶圈设置在凸条上。内侧硅胶圈包括两个平行设置的硅胶条,两个硅胶条之间形成防水槽。
上述薄壁3D曲面复合壳体的制备方法,包括,
切割步骤:将复合板进行开料切割,得到切割半成品;
表面处理步骤:对基材半成品靠近PC层的一侧进行复合表面处理,复合表面处理包括表面装饰处理和表面功能处理,表面装饰处理包括印刷LOGO、UV转印、表面镀膜和底层印刷,表面功能处理包括AF抗指纹镀膜、AG防眩光镀膜和AR增透镀膜,处理后得到基材半成品;
打孔步骤:在基材半成品上开设定位孔,基材半成品的X方向与Y方向上各开设至少两个定位孔,定位孔的孔径为5mm;
热压步骤:先检查打孔后的基材半成品的平面度,使平面度小于0.15mm,再将打孔后的基材半成品安装在热压机台上,热压在真空下进行,真空度为30torr,热压温度为150℃,热压时间为35秒,将基材半成品热压为2D或3D曲面,得到热压半成品;
一次CNC加工步骤:在热压半成品的上表面固定压合机构,在热压半成品的下表面固定吸附孔,然后对热压半成品进行一次CNC加工,得到CNC半成品;
硬化步骤:清洗CNC半成品,去除其表面脏污,然后对CNC半成品表面进行硬化处理,得到硬化半成品,硬化处理具体为,采用表面UV光固化的丙烯酸酯为硬化液,采用喷涂工艺对CNC半成品表面进行处理,喷涂膜层厚度为0.018mm,固化条件为960mj/cm2;
成型步骤:对硬化半成品进行底涂处理后,将硬化半成品放入塑胶模具中,进行塑胶模内成型,再进行二次CNC加工,得到成型基材;根据产品结构及实际检测的变形度,对产品的CNC加工尺寸进行修正,以产品无变形时的结构状态调整CNC加工尺寸,保证后工序加工精度;二次CNC加工过程中不允许出现边缘崩角、倒角大小边等加工缺陷,对于精度要求高的结构,可采用定制成型刀具,以提升加工精度,视产品结构及工艺需求,需要对产品反面进行加工时,二次CNC加工中需保证加工时的定位与基准面一致,以减小加工误差;
涂胶步骤:将成型机采放入液态硅胶模具中,进行液态硅胶成型,再在复合板的凹陷部上贴合玻纤板,得到薄壁3D曲面复合壳体。
实施例3:
一种薄壁3D曲面复合壳体,包括复合板、内侧硅胶圈和外侧硅胶圈;复合板底部向下凹陷形成凹陷部,内侧硅胶圈设置在凹陷部的周缘,外侧硅胶圈设置在复合板的周缘,凹陷部上设置有玻纤板;复合板由PMMA层与PC层复合而成,PMMA层设置在PC层上表面;复合板的厚度为1mm,PMMA层与PC层厚度比例为1:10,PMMA层材料的硬度大于2H。
复合板的边沿向上延伸并向内弯曲形成凸条,外侧硅胶圈设置在凸条上。内侧硅胶圈包括两个平行设置的硅胶条,两个硅胶条之间形成防水槽。
上述薄壁3D曲面复合壳体的制备方法,包括,
切割步骤:将复合板进行开料切割,得到切割半成品;
表面处理步骤:对基材半成品靠近PC层的一侧进行复合表面处理,复合表面处理包括表面装饰处理和表面功能处理,表面装饰处理包括印刷LOGO、UV转印、表面镀膜和底层印刷,表面功能处理包括AF抗指纹镀膜、AG防眩光镀膜和AR增透镀膜,处理后得到基材半成品;
打孔步骤:在基材半成品上开设定位孔,基材半成品的X方向与Y方向上各开设至少两个定位孔,定位孔的孔径为6mm;
热压步骤:先检查打孔后的基材半成品的平面度,使平面度小于0.15mm,再将打孔后的基材半成品安装在热压机台上,热压在真空下进行,真空度为50torr,热压温度为130℃,热压时间为40秒,将基材半成品热压为2D或3D曲面,得到热压半成品;
一次CNC加工步骤:在热压半成品的上表面固定压合机构,在热压半成品的下表面固定吸附孔,然后对热压半成品进行一次CNC加工,得到CNC半成品;
硬化步骤:清洗CNC半成品,去除其表面脏污,然后对CNC半成品表面进行硬化处理,得到硬化半成品,硬化处理具体为,采用表面UV光固化的丙烯酸酯为硬化液,采用喷涂工艺对CNC半成品表面进行处理,喷涂膜层厚度为0.02mm,固化条件为1000mj/cm2;
成型步骤:对硬化半成品进行底涂处理后,将硬化半成品放入塑胶模具中,进行塑胶模内成型,再进行二次CNC加工,得到成型基材;根据产品结构及实际检测的变形度,对产品的CNC加工尺寸进行修正,以产品无变形时的结构状态调整CNC加工尺寸,保证后工序加工精度;二次CNC加工过程中不允许出现边缘崩角、倒角大小边等加工缺陷,对于精度要求高的结构,可采用定制成型刀具,以提升加工精度,视产品结构及工艺需求,需要对产品反面进行加工时,二次CNC加工中需保证加工时的定位与基准面一致,以减小加工误差;
涂胶步骤:将成型机采放入液态硅胶模具中,进行液态硅胶成型,再在复合板的凹陷部上贴合玻纤板,得到薄壁3D曲面复合壳体。
效果评价及性能检测
上述实施方式仅为本发明的优选实施方式,不能以此来限定本发明保护的范围,本领域的技术人员在本发明的基础上所做的任何非实质性的变化及替换均属于本发明所要求保护的范围。
Claims (4)
1.一种薄壁3D曲面复合壳体,其特征在于,包括复合板、内侧硅胶圈和外侧硅胶圈;所述复合板底部向下凹陷形成凹陷部,所述外侧硅胶圈设置在复合板的周缘,所述内侧硅胶圈设置在凹陷部的周缘;所述复合板由PMMA层与PC层复合而成,所述PMMA层设置在PC层上表面;所述复合板的厚度为0.175-1.5mm,PMMA层与PC层厚度比例为1:(10-4);所述复合板的边沿向上延伸并向内弯曲形成凸条,所述外侧硅胶圈设置在凸条上;所述凹陷部上设置有玻纤板,玻纤板厚度为0.1mm;所述内侧硅胶圈包括两个平行设置的硅胶条,两个硅胶条之间形成防水槽;所述PMMA层材料的硬度大于2H;
所述的薄壁3D曲面复合壳体的制备方法,包括以下步骤:
切割步骤:将复合板进行开料切割,得到切割半成品;
表面处理步骤:对基材半成品靠近PC层的一侧进行复合表面处理,复合表面处理包括表面装饰处理和表面功能处理,表面装饰处理包括印刷LOGO、UV转印、表面镀膜和底层印刷,表面功能处理包括AF抗指纹镀膜、AG防眩光镀膜和AR增透镀膜,处理后得到基材半成品;
打孔步骤:在基材半成品上开设定位孔,基材半成品的X方向与Y方向上各开设至少两个定位孔,定位孔的孔径为3-6mm;
热压步骤:将打孔后的基材半成品安装在热压机台上,将基材半成品热压为2D或3D曲面,得到热压半成品;其中,热压在真空下进行,真空度为20-50torr;热压温度为130-200℃,热压时间为30-40秒;
一次CNC加工步骤:在热压半成品的上表面固定压合机构,在热压半成品的下表面固定吸附孔,然后对热压半成品进行一次CNC加工,得到CNC半成品;
硬化步骤:清洗CNC半成品,去除其表面脏污,然后对CNC半成品表面进行硬化处理,得到硬化半成品;
成型步骤:对硬化半成品进行底涂处理后,将硬化半成品放入塑胶模具中,进行塑胶模内成型,再进行二次CNC加工,得到成型基材;
涂胶步骤:将成型机采放入液态硅胶模具中,进行液态硅胶成型,再在复合板的凹陷部上贴上玻纤板,得到薄壁3D曲面复合壳体。
2.如权利要求1所述的薄壁3D曲面复合壳体的制备方法,其特征在于,热压步骤中,先检查打孔后的基材半成品的平面度,使平面度小于0.15mm,再进行热压。
3.如权利要求1所述的薄壁3D曲面复合壳体的制备方法,其特征在于,打孔步骤中,定位孔的孔径为3-6mm。
4.如权利要求1所述的薄壁3D曲面复合壳体的制备方法,其特征在于,硬化步骤中,硬化处理具体为,采用表面UV光固化的丙烯酸酯为硬化液,采用喷涂工艺对CNC半成品表面进行处理,喷涂膜层厚度为0.015-0.02mm,固化条件为900-1000mj/cm2。
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