CN108266704A - A kind of pc-LEDs plant growth lamps based on upper conversion ultraviolet fluorescence powder - Google Patents
A kind of pc-LEDs plant growth lamps based on upper conversion ultraviolet fluorescence powder Download PDFInfo
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- CN108266704A CN108266704A CN201810047477.3A CN201810047477A CN108266704A CN 108266704 A CN108266704 A CN 108266704A CN 201810047477 A CN201810047477 A CN 201810047477A CN 108266704 A CN108266704 A CN 108266704A
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
- A01G7/00—Botany in general
- A01G7/04—Electric or magnetic or acoustic treatment of plants for promoting growth
- A01G7/045—Electric or magnetic or acoustic treatment of plants for promoting growth with electric lighting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P60/00—Technologies relating to agriculture, livestock or agroalimentary industries
- Y02P60/14—Measures for saving energy, e.g. in green houses
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ecology (AREA)
- Forests & Forestry (AREA)
- Environmental Sciences (AREA)
- Botany (AREA)
- Biodiversity & Conservation Biology (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cultivation Of Plants (AREA)
- Luminescent Compositions (AREA)
Abstract
The invention discloses a kind of pc LEDs plant growth lamps based on upper conversion ultraviolet fluorescence powder, preparation process is as follows：The fluorescent powder grain for including upper conversion ultraviolet fluorescence powder is mixed to form uniform slurry with colloid first, slurry is coated on the light direction surface of blue-light LED chip and cured again, realizes a kind of pc LEDs light sources of the plant growth based on blue-light LED chip.The plant growth light source of the present invention excites up-conversion phosphor therein to generate the 200nm 380nm ultraviolet lights needed for plant by blue light, it can inhibit excessive vegetative growth, the shell of plant can be made harder, thick and solid so as to enhance the resistance of plant, it can promote flowering of plant as a result, can be plant surface and soil sterilization.By changing the ratio of glue and powder, irradiation time is controlled, can realize the regulation and control of illumination needed for plant growth.The light source have it is at low cost, simple in structure, convenient for regulate and control spectral component ratio, realize the advantage of correlation function, good application will be had in terms of plant growth.
Description
Technical field
The invention belongs to field of photoelectric technology, and in particular to a kind of pc-LEDs plants based on upper conversion ultraviolet fluorescence powder
The preparation method of growth lamp.
Background technology
Light acts on plant as environmental signal, is numerous external environments (light, the temperature, again for influencing growth and development of plants
Power, water, minerals etc.) in mostly important condition.Its importance not only shows the work that builds up of the photosynthesis to plant
It uses, the important regulatory factor during light or the entire growth and development of plant.And photosynthesis actually runs through plant
The whole process of body later period growth and development, be the basis of growth and development, by being risen in plant Seedling Differentiation, nutrient growth
Effect and influence growth and development of plants.In sunlight, the red blue light in the visible spectrum to play a major role to plant growth,
And ultraviolet light UVA and UVB, UVC.
For the LED light source of plant growth, principle is to provide the light that plant needs more, improves the utilization rate of light.Wherein
Feux rouges Accelerate bloom is as a result, blue light promotes root, stem and leaf growth；UVA (wavelength 320nm-380nm) has very strong penetration power, can be with
Across most transparent material, biological epidermis cell is destroyed, promotes cell senescence, for plant, the light of this wave band
Line can promote epidermal cell aging, make shell hard, thick and solid, while the resistance of plant can enhance, to extraneous physical destruction
Resistance can be significantly increased, the raising resistance and survival rate of energy high degree.What is more important, the plant of epidermis appropriateness aging
Object, the sunburn being avoided that under rinforzando sunlight；UVB (wavelength 280nm-320nm) has medium penetration power, by air
Layer only 2% or so can reach ground.And it can inhibit excessive vegetative growth, paint for it.For from presentation, it can be with
Make dwarfing plants, so as to which nutrient to be run up to the rhizome portion of plant in large quantities, final purpose is carried by the accumulation of nutrition
The constitution of high plant, Accelerate bloom, result.For the angle of family cultivated plant, the irradiation of UVB can allow dwarfing plants,
It is compact, it is more beautiful in presentation, substantially increases resistance.UVC (wavelength 200-280nm), also known as shortwave sterilizing are purple
Outside line, the influence to phytomorph and physiology course is minimum, and major function is sterilization.
LED has many apparent advantages compared with conventional fluorescent lamps：(1) lamp body is compact, LED light be very little is skilful, very
Fine LED wafer is encapsulated in inside transparent epoxy resin, so its unusual granule, very lightly, make with apply it is upper
A large amount of material and space can be saved.(2) energy consumption is very low, and more than 70% is reduced than energy-saving lamp.(3) LED light service life
It is long, under appropriate electric current and voltage, LED light service life was up to 100,000 hours namely theoretically the life of product reaches 10
Year or more, more other type lamps have longer service life.(4) heat distributes few, and LED is more advanced cold light source, it
A large amount of infrared ray and ultraviolet light are radiated unlike fluorescent lamp, greenhouse effects will not be formed to surrounding enviroment.
Therefore, LED light source is paid much attention to by plant planting field, it is considered to be the perfect light source of plant growth.
Invention content
The present invention is mixed to form uniform slurry by will include the upper fluorescent powder for converting ultraviolet fluorescence powder with colloid, then
Slurry is applied in the structure for being equipped with blue-light LED chip, the outputting plant on the basis of blue-light LED chip is realized and grows institute
The pc-LEDs devices of light requirement line.The technology have it is at low cost, simple in structure, convenient for regulating and controlling spectral component ratio, realize related work(
The advantage of energy, will have good application in terms of plant growth.
The technical scheme is that：A kind of pc-LEDs plant growth lamps based on upper conversion ultraviolet fluorescence powder, feature
It is, includes the following steps：
(1) fluorescent powder grain for including upper conversion ultraviolet fluorescence powder is mixed into acquisition fluorescence with colloid according to a certain percentage
Powder slurry；
(2) by phosphor slurry be coated in blue-light LED chip light direction surface on, by the phosphor slurry of coating into
Row curing process；
(3) in phosphor powder layer outer wrapping photic zone；
(4) by driving circuit, different light intensity, spectrum, the regulation and control of photoperiod are realized.
Upper conversion ultraviolet fluorescence powder used refers to send out the fluorescence of ultraviolet spectra ingredient in the case where blue LED light excites
Powder；Upper conversion ultraviolet fluorescence powder used refers to send out the fluorescence of ultraviolet spectra in the case where blue-ray LED (400~500nm) excites
Powder；Its emission spectrum peak wavelength of fluorescent powder used is in ultraviolet band range (200~380nm), these blue outer fluorescence
Powder is Pr3+：Y2SiO5Or the fluorescent powder that ultraviolet fluorescence powder is mixed in a certain ratio with other color fluorescence powder.
In the light source, upper conversion ultraviolet fluorescence powder used has wider ultraviolet spectra ingredient (200nm-
380nm), wherein UVA (wavelength 320nm-380nm) can promote epidermal cell aging, make shell hard, thick and solid, while plant
Resistance can enhance, the raising resistance and survival rate of energy high degree；UVB (wavelength 280nm-320nm) can inhibit plant crazy
It is long, allow dwarfing plants, it is compact, it is more beautiful in presentation, substantially increases resistance, and the knot of blooming of plant can be promoted
Fruit；UVC (wavelength 200-280nm) major function is for surrounding plants environment, soil sterilization.
Red fluorescence powder can be added in above-mentioned mixed fluorescent powder particle, is provided for photosynthesis of plant required red
Light.This red fluorescence powder refers to that red can be sent out or containing red in the case where blue LED light blue light (400~500nm) excites
The fluorescent powder of spectral component；Its emission spectrum peak wavelength of red fluorescence powder used at red band range (600-800nm),
And with wider spectral component, to adapt to the light needed for different plant growths.These luminous red fluorescence powders for YAGG,
YAGG:Ce3+、YAG:Eu2+With nitride red fluorescent powder is therein a kind of or their combination；Either red fluorescence powder
The fluorescent powder being mixed in a certain ratio with other color fluorescence powder.
In step (1), fluorescent powder adjustable a concentration of 1%~35% in the phosphor slurry；Different fluorescence
Powder and the ratio with arogel, can realize blue light different in emergent light (400~500nm)/ultraviolet light (200~380nm)
Ratio, B/V=0~100；When being mixed into red fluorescence powder in upper conversion ultraviolet fluorescence powder, in output light red light with it is ultraviolet
Light ratio is R/V=0~100, and blue light (400~500nm)/red light (600~700nm) ratio is R/B=0~100.
It, can be by controlling colloid and upper conversion ultraviolet fluorescence powder, red for the light source of heterogeneity ratio to be obtained
The ratio of fluorescent powder is realized, can also control the light source ratio of chipset entirety by controlling the coated weight of phosphor slurry.
In step (1), the colloid is silica gel, epoxy resin, polymethyl methacrylate (PMMA), makrolon
(PC) or the combination of one or more of photoresists；The photosensitive colloid includes following three classes negative-working photoresist：1. SBQ feels
Optical cement (polyvinyl alcohol cyclic ketal styryl pyridinium resin photoresists), SBQ-PVA+ macromolecules emulsion, SBQ-PVA+ high scores
The combination of one or more of sub- emulsion+acrylate or organic stibazole salt resin photoresists system；2. feel
Photo etching+film forming dosage form, i.e. photosensitive compounds+high-molecular compound type, wherein emulsion are bichromate, chromate, diazonium
The combination of compound either one or more of azido cpd；Film forming agent is polyvinyl alcohol (PVA), Arabic tree
The combination of one or more of glue, polyimides or polyvinyl acetate emulsion；3. the high-molecular compound with photosensitive base
Type mainly has polyvinyl cinnamate, polyvinyl alcohol Chinese cassia tree fork acetic acid esters, polyethylene oxygen ethyl-cinnamic acid ester, polyethylene pyrrole
The combination of one or more of pyrrolidone or polyvinyl alcohol-p- azidobenzoic acid ester (PVAB)；Photosensitive colloid is above-mentioned three
The combination of one kind or multiclass in class；
In step (2), fluorescent powder coated carrier material can also be glass on any light direction surface, asphalt mixtures modified by epoxy resin
One or more of fat, silica gel, polymethyl methacrylate (PMMA), makrolon (PC), polypropylene (EP).
In step (2), the curing mode can be furnace body heating or one or more combinations of infrared heating, institute
The solidification temperature needed and time are depending on the Property requirements of colloid (such as silica gel)；Can also be photocuring, using photic solid
Change colloid, photoresists etc..
In step (2), phosphor slurry can be coated on the light direction surface of LED chip, the light extraction side
To surface LED chip surface or any surface in beam projecting direction on LED chip surface is left, with load
Body keeps apart fluorescent powder and blue-ray LED, forms light.Fluorescence powder carrier in this lamps and lanterns can be arranged to circle,
The different shapes such as triangle；The quantity of carrier can also increase or delete according to the number of species of required light；Blue-ray LED
The distance of chip and carrier can be adjusted according to light intensity demand；Lamps and lanterns can also be according to time, ornamental demand, plant growth
Sheet glass is rotated etc. different demands, red blue light, ultraviolet red blue light, white light etc. is sent out, meets the needs of plant is different.
The LED is the combination of organic LED, inorganic LED or both；The LED is single LED chip, either
The plurality of LEDs chipset or whole wafer of same substrate, the difference that can be required according to illumination, by chip portfolio into not
The structure of similar shape and size (array)；Or it is coated with the wafer of fluorescent powder as needed and cuts into appropriate size and shape
Shape, to meet the requirement of different situations plant growth LED.
In the LED light source for plant growth, the ultraviolet of 200~380nm needed for plant growth can be provided
With 600~800nm feux rouges, 400~500nm blue lights, the red of proper proportion, blue light, it is ultraviolet and with other it is specific will
The spectral component (making illumination deviation white as added in green light and can be, more ornamental etc.) asked.It can accurately adjust required
Spectral region saves the energy.
In the LED light source made with the technology of the present invention, fluorescent powder and the ratio with arogel can be controlled, suitably adjusts light
Spectrum ratio, for different plant cultivations.
Description of the drawings
Fig. 1 is the schematic diagram that fluorescent powder is applied directly on LED chip.Wherein, 1 is LED chip, and 2 be phosphor powder layer, 3
It is isolation carrier for photic zone, 4,5 be reflector.
Fig. 2 is the chipset for the chip composition for coating different arogel ratio phosphor powder layers, and electricity is driven by PWM pulsewidth modulations
Road regulates and controls whole group luminous intensity, wherein 1,2,3 is the phosphor powder layer of different proportion.
Fig. 3 is coated on the surface of any exit direction for leaving LED chip by phosphor slurry and forms bowing for lamps and lanterns
View, 1 is blue-ray LED, and 2 be fluorescence powder carrier, and 3 be lamp bracket.
Fig. 4 is the stereogram of lamps and lanterns that the fluorescence powder carrier is spaced with blue-ray LED, and 1 is blue-ray LED, and 2 be fluorescent powder
Carrier, 3 be lamp bracket.
Fig. 5 is the transmitting relative spectral figure of the red fluorescence powder used.
Fig. 6 is by the transmitting relative spectral figure with conversion ultraviolet fluorescence powder.
Specific embodiment
Below in conjunction with the accompanying drawings and case study on implementation the invention will be further described：
Embodiment 1
By 1:9 ratios weigh conversion ultraviolet fluorescence powder with arogel and being uniformly mixed the two, and deaeration machine, which vacuumizes, to be removed
Bubble is gone to obtain phosphor slurry；
Phosphor slurry is coated on transparent glass surface using dotting glue method, it is small to heat (150 DEG C) dryings 2 with drying box
When, obtain phosphor powder layer；
The silica gel of specific shape is uniformly coated on phosphor powder layer by the use of dotting glue method again as photic zone, then in drying box
(120 DEG C) of heating cures 2 hours, obtains photic zone；
The adjusting that luminous intensity is carried out to one group of LED chip is realized finally by PWM pulsewidth modulations driving circuit.
Embodiment 2
By 1:9 ratios weigh conversion ultraviolet fluorescence powder with arogel and being uniformly mixed the two, and deaeration machine, which vacuumizes, to be removed
Bubble is gone to obtain phosphor slurry；
Transparent glass surface is cleaned with plasma cleaner, it is first centainly thick in above-mentioned glass surface even application with spray gun
Silica gel is spent as carrier layer, then by phosphor slurry coating on a carrier layer, it is small to be put into (150 DEG C) dryings 2 of heating in drying box
When, obtain cured phosphor powder layer；
The silica gel of specific shape is uniformly coated on phosphor powder layer by the use of dotting glue method again as photic zone, then in drying box
(120 DEG C) of heating cures 2 hours, obtains photic zone；
The adjusting that luminous intensity is carried out to one group of LED chip is realized finally by PWM pulsewidth modulations driving circuit.
Embodiment 3
Upper conversion ultraviolet fluorescence powder in embodiment 1 and the ratio with arogel are adjusted to 1:16, remaining operation with reality
It is identical to apply example 1.
Embodiment 4
Upper conversion ultraviolet fluorescence powder in embodiment 2 and the ratio with arogel are adjusted to 1:16, remaining operation with reality
It is identical to apply example 2.
Embodiment 5
Upper conversion ultraviolet fluorescence powder in embodiment 1 and the ratio with arogel are adjusted to 1:22, remaining operation with reality
It is identical to apply example 1.
Embodiment 6
Upper conversion ultraviolet fluorescence powder in embodiment 2 and the ratio with arogel are adjusted to 1:22, remaining operation with reality
It is identical to apply example 2.
Embodiment 7
By 2:1:18 ratios weigh conversion ultraviolet fluorescence powder, red fluorescence powder with arogel and being uniformly mixed three,
Vacuumize process is carried out to mixing slurry with vacuum degasing machine, phosphor slurry is obtained after removing bubble；
Phosphor slurry is coated on transparent glass surface using dotting glue method, it is small to heat (150 DEG C) dryings 2 with drying box
When, obtain phosphor powder layer；
The silica gel of specific shape is uniformly coated on phosphor powder layer by the use of dotting glue method again as photic zone, then in drying box
(120 DEG C) of heating cures 2 hours, obtains photic zone；
The adjusting that luminous intensity is carried out to one group of LED chip is realized finally by PWM pulsewidth modulations driving circuit.
Embodiment 8
By 2:1:18 ratios weigh conversion ultraviolet fluorescence powder, red fluorescence powder with arogel and being uniformly mixed three,
Vacuumize process is carried out to mixing slurry with vacuum degasing machine, phosphor slurry is obtained after removing bubble；
Transparent glass surface is cleaned with plasma cleaner, first with spray gun in glass surface even application certain thickness silicon
Glue is put into (150 DEG C) of heating drying 2 hours in drying box, obtains as carrier layer, then by phosphor slurry coating on a carrier layer
To cured phosphor powder layer；
The silica gel of specific shape is uniformly coated on phosphor powder layer by the use of dotting glue method again as photic zone, then in drying box
(120 DEG C) of heating cures 2 hours, obtains photic zone；
The adjusting that luminous intensity is carried out to one group of LED chip is realized finally by PWM pulsewidth modulations driving circuit.
Embodiment 9
By 2:4:1:25 ratios weigh conversion purple fluorescence powder, and green emitting phosphor, red fluorescence powder is with matching arogel and inciting somebody to action
Three is uniformly mixed, and carries out vacuumize process to mixing slurry with vacuum degasing machine, phosphor slurry is obtained after removing bubble；
Phosphor slurry is coated on transparent glass surface using dotting glue method, it is small to heat (150 DEG C) dryings 2 with drying box
When, obtain phosphor powder layer；
The silica gel of specific shape is uniformly coated on phosphor powder layer by the use of dotting glue method again as photic zone, then in drying box
(120 DEG C) of heating cures 2 hours, obtains photic zone；
The adjusting that luminous intensity is carried out to one group of LED chip is realized finally by PWM pulsewidth modulations driving circuit.
Embodiment 10
By 1:5:1:36 ratios weigh conversion ultraviolet fluorescence powder, and green emitting phosphor, red fluorescence powder is with matching arogel and inciting somebody to action
Three is uniformly mixed, and carries out vacuumize process to mixing slurry with vacuum degasing machine, phosphor slurry is obtained after removing bubble；
Transparent glass surface is cleaned with plasma cleaner, first with spray gun in glass surface even application certain thickness silicon
Glue is put into (150 DEG C) of heating drying 2 hours in drying box, obtains as carrier layer, then by phosphor slurry coating on a carrier layer
To cured phosphor powder layer；
The silica gel of specific shape is uniformly coated on phosphor powder layer by the use of dotting glue method again as photic zone, then in drying box
(120 DEG C) of heating cures 2 hours, obtains photic zone；
The adjusting that luminous intensity is carried out to one group of LED chip is realized finally by PWM pulsewidth modulations driving circuit.
Embodiment 11
It weighs and ultraviolet fluorescence powder (or upper conversion ultraviolet fluorescence powder is mixed with rouge and powder) is converted on 0.3g, 1.2ml photoresists (are used
PVA solution and the mixing of ADC solution are matched) and be uniformly mixed the two；
Transparent glass surface is cleaned with plasma cleaner, first with spray gun in glass surface even application certain thickness silicon
Glue will be coated in the mixed phosphor slurry of photoresists on LED chip surface as carrier layer, then using dotting glue method, exposure
0.75ms simultaneously develops；
The silica gel of specific shape is uniformly coated on phosphor powder layer by the use of dotting glue method again as photic zone, then in drying box
(120 DEG C) of heating cures 2 hours, obtains photic zone；
The adjusting that luminous intensity is carried out to one group of LED chip is realized finally by PWM pulsewidth modulations driving circuit.
Embodiment 12
Upper conversion ultraviolet fluorescence powder is weighed with arogel and being uniformly mixed the two by a variety of different proportions respectively, uses vacuum
Deaeration machine carries out vacuumize process to mixing slurry, and phosphor slurry is obtained after removing bubble；
Glass surface is cleaned with plasma cleaner, is first made with spray gun in glass surface even application certain thickness silica gel
Be respectively coated on a carrier layer for carrier layer, then by the phosphor slurry of different proportion, be put into drying box heat (150 DEG C) it is dry
Dry 2 hours, obtain the different cured phosphor powder layers of arogel ratio；
The silica gel of specific shape is uniformly coated on phosphor powder layer by the use of dotting glue method again as photic zone, then in drying box
(120 DEG C) of heating cures 2 hours, obtains photic zone；
The adjusting that luminous intensity is carried out to one group of LED chip is realized finally by PWM pulsewidth modulations driving circuit.
Embodiment 13
Upper conversion ultraviolet fluorescence powder is weighed with arogel and being uniformly mixed the two by a variety of different proportions respectively, uses vacuum
Deaeration machine carries out vacuumize process to mixing slurry, and phosphor slurry is obtained after removing bubble；
Fluorescent powder carrier surface is cleaned, then the phosphor slurry of different proportion is respectively coated on plasma cleaner
On fluorescence powder carrier, it is put into (150 DEG C) of heating drying 2 hours in drying box；
It is different in acquisition by rotation vector by obtained fluorescence powder carrier and blue-ray LED the composition such as lamps and lanterns of Fig. 3
Light.
Claims (9)
1. a kind of pc-LEDs plant growth lamps based on upper conversion ultraviolet fluorescence powder, which is characterized in that preparation method includes following
Step：
(1) fluorescent powder grain for including upper conversion ultraviolet fluorescence powder is mixed into acquisition phosphor with colloid according to a certain percentage
Slurry；
(2) phosphor slurry is coated on the light direction surface of blue-light LED chip, the phosphor slurry of coating is consolidated
Change is handled；
(3) in phosphor powder layer outer wrapping photic zone；
(4) by driving circuit, different light intensity, spectrum, the regulation and control of photoperiod are realized.
2. a kind of pc-LEDs plant growth lamps based on upper conversion ultraviolet fluorescence powder according to claim 1, feature exist
In：In the step (1), upper conversion ultraviolet fluorescence powder used refers to that in the case where blue LED light excites ultraviolet spectra can be sent out
The fluorescent powder of ingredient；Upper conversion ultraviolet fluorescence powder emission spectrum peak wavelength used is in the ultraviolet band of 200nm~380nm；
It can also be that upper conversion is purple that the fluorescent powder grain for including conversion ultraviolet fluorescence powder, which can be upper conversion ultraviolet fluorescence powder,
The fluorescent powder that outer fluorescent powder is mixed in a certain ratio with other color fluorescence powder；The upper conversion ultraviolet fluorescence powder can be Pr3+：
Y2SiO5Or ultraviolet fluorescence powder and combinations thereof is converted on other；The 200- that above-mentioned upper conversion ultraviolet fluorescence powder is sent out
The ultraviolet light of 380nm can inhibit excessive vegetative growth, and the shell of plant can be made harder, thick and solid so as to enhance the anti-of plant
Property, flowering of plant can be promoted as a result, can be plant surface and soil sterilization.
3. a kind of pc-LEDs plant growth lamps based on upper conversion ultraviolet fluorescence powder according to claim 1, feature exist
In：In the step (1), the phosphor slurry a concentration of 1%~35%；Different fluorescent powders and the ratio with arogel
Example, can realize blue light different in emergent light (400~500nm)/ultraviolet light (200~380nm) ratio, B/V=0~
100。
4. a kind of pc-LEDs plant growth lamps based on upper conversion ultraviolet fluorescence powder according to claim 1, feature exist
In：The fluorescent powder comprising upper conversion ultraviolet fluorescence powder in the step (1) can be by adjusting the ratio of fluorescent powder so that
Simultaneously containing the blue light not sent out by the chip that fluorescent powder is converted in light source ingredient, blue light can promote the photosynthetic work of plant
With.
5. a kind of pc-LEDs plant growth lamps based on upper conversion ultraviolet fluorescence powder according to claim 1, feature exist
In：In the step (1), the arogel of matching is silica gel, epoxy resin, polymethyl methacrylate (PMMA), makrolon
(PC) one or more of thermosetting cements or photosensitive the colloid combination such as.
6. a kind of pc-LEDs plant growth lamps based on upper conversion ultraviolet fluorescence powder according to claim 1, feature exist
In：In the step (2), phosphor slurry be coated in LED chip light direction surface on, the light direction surface or
Person is LED chip surface or leaves any surface in beam projecting direction on LED chip surface.
7. a kind of pc-LEDs plant growth lamps based on upper conversion ultraviolet fluorescence powder according to claim 1, feature exist
In：In the step (2), the curing mode can be heat cure, and required solidification temperature and time are according to colloid (example
Such as silica gel) Property requirements depending on or photocuring, use Photosetting colloid, photoresists etc..
8. a kind of pc-LEDs plant growth lamps based on upper conversion ultraviolet fluorescence powder according to claim 1, feature exist
In：In the step (3), the photic zone is using epoxy resin, silica gel, polymethyl methacrylate (PMMA), poly- carbon
One or more of acid esters (PC), polypropylene (EP), polyethylene terephthalate (PET)；The euphotic acquisition
Method can be：Traditional dispensing, spraying, electrostatic spraying, lens embedding, silk-screen printing.
9. a kind of pc-LEDs plant growth lamps based on upper conversion ultraviolet fluorescence powder according to claim 1, feature exist
In：In the step (4), the LED is single or more, the LED chip of the different fluorescent powders of one or more coatings
Combination；The driving circuit can be pulse width modulation (PWM) regulation and control to LED, can respectively to single LED chip or
Person is that the plurality of LEDs chipset of single substrate is regulated and controled；Whole tune can also be carried out to more combined or multigroup chip
Control.
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