CN109538952A - Flip chip type plant light compensation LED light source and the lamps and lanterns for using the light source - Google Patents

Flip chip type plant light compensation LED light source and the lamps and lanterns for using the light source Download PDF

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Publication number
CN109538952A
CN109538952A CN201811400237.3A CN201811400237A CN109538952A CN 109538952 A CN109538952 A CN 109538952A CN 201811400237 A CN201811400237 A CN 201811400237A CN 109538952 A CN109538952 A CN 109538952A
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China
Prior art keywords
led
rubber powder
powder layer
light source
light
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CN201811400237.3A
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CN109538952B (en
Inventor
潘翔
李许可
巩朝光
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HANGZHOU HANHUI OPTOELECTRONIC Tech CO Ltd
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HANGZHOU HANHUI OPTOELECTRONIC Tech CO Ltd
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Priority to CN201811400237.3A priority Critical patent/CN109538952B/en
Publication of CN109538952A publication Critical patent/CN109538952A/en
Priority to PCT/CN2019/114978 priority patent/WO2020103671A1/en
Priority to EP19886796.2A priority patent/EP3767167B1/en
Priority to US17/043,669 priority patent/US11419278B2/en
Priority to JP2020560244A priority patent/JP2021520612A/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • AHUMAN NECESSITIES
    • A01AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01GHORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
    • A01G9/00Cultivation in receptacles, forcing-frames or greenhouses; Edging for beds, lawn or the like
    • A01G9/20Forcing-frames; Lights, i.e. glass panels covering the forcing-frames
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30Elements containing photoluminescent material distinct from or spaced from the light source
    • F21V9/32Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

The invention discloses a kind of flip chip type plant light compensation LED light source and using the lamps and lanterns of the light source, described includes flip chip type plant light compensation LED light source substrate, LED wafer, the first rubber powder layer and the second rubber powder layer;LED wafer is fixed on the substrate by the first rubber powder layer, and it is the mixture of adherent and red fluorescence powder;The second rubber powder layer is covered in the LED wafer.Flip chip type plant light compensation LED light source of the invention, pass through blue LED wafers excitated red fluorescent powder and yellow fluorescent powder, full spectrum can be formed, the light formula of photosynthesis of plant feature can be protruded again, it changes and needs to combine the Plant Light formula being just able to achieve by using red LED chip, blue led chip, infrared LED chip, ultraviolet LED chip, the more LED wafers of green LED chip in the prior art, LED wafer input cost and circuit and radiator cost substantially reduce.

Description

Flip chip type plant light compensation LED light source and the lamps and lanterns for using the light source
Technical field
The present invention relates to a kind of flip chip type plant light compensation LED light source and using the lamps and lanterns of the light source, belong to industrialized agriculture Lighting field.
Background technique
According to the light physiological property of plant, light radiation is to the photosynthesis of plant, growth and development, morphogenesis and plant generation Thanking etc. has regulating and controlling effect.The light for being radiated at the different-waveband on plant is different to the physiological effect of plant, thus different-waveband Beche-de-mer without spike and photosynthetic weight it is also different, and change with the stage of plant variety and growth.Chlorophyll is in plant body Absorption, transmitting and the conversion of interior responsible luminous energy, carotenoid then exercise luminous energy capture and the big function of Photoprotection two, they Very important effect is played in photosynthesis.The maximum absorption band of chlorophyll a is 410nm, 430nm and 660nm;Chlorophyll The maximum absorption band of b is 430nm, 455nm and 640nm.Carotenoid is important accessory pigments, and the luminous energy absorbed is just It is good complementary with chlorophyll, chlorophyll can be helped to receive luminous energy.Carotenoid absorption band is in the blue violet light area of 400~500nm, algae The absorption spectrum maximum value of Lan Su is in orange light part, and then absorption spectrum maximum value is in green portions to rhodophyll.
Feux rouges (600nm~700nm, R) and far-red light in the influence of light quality, especially spectrum in illumination condition (700nm~ 800nm, FR) effect of ratio (R/FR) of light is increasingly subject to the attention of people.Ratio (the R/ of red and far-red light in spectrum FR) regulation of the content of plant inner gibberellin (CA), phytomorph are built up, plant height has great influence.Scientist By the light quantum current density of feux rouges (R) or far-red light (FR) in manual control plant growth environment, change the ratio of R/FR To adjust the form of plant.When R/FR ratio becomes larger, the stipes spacing of plant becomes smaller dwarfing: otherwise when R/FR ratio becomes smaller Then plant has the tendency that elongation.
Green plants during growth, needs visible light to carry out photosynthesis.It is well known that, it is seen that light is one Kind complex light, during the growth process, the demand to the light of the different colours in visible light is also not quite similar different plants.
More and more researches show that the light of different colours is suitably carried out mixed exposure in different proportions, will have Help the growth of plant.
But it is formal in concrete implementation, in practical application, red LED in light source or remote red LED need to be increased Quantity, the adjusting of Lai Shixian R/FR ratio, to achieve the purpose that control plant forms;By increase green LED quantity come Make up the deficiency in spectrum.It is combined generally by the LED light source using multiple and different colors not year-on-year to reach realization The luminous environment of the different light medium of example, this is highly inconvenient for user, if during combining LED light source, it is different Mistake has occurred in the ratio of the LED light source of color, is also just difficult to achieve the purpose that plant yield-increasing increases matter.
LED light source in the prior art such as Chinese patent 201180055432.7,201210414873.8, and 201210375582.2 recorded.
But above three patent passes through blue light excitated red fluorescent powder, is simultaneously emitted by red blue light for plant photosynthesis Effect, but need to realize light by increasing UV LED, green light LED or infrared light-emitting diode The supplement of ultraviolet light, green light and near infrared light in spectrum;Following deficiency is brought as a result:
First is that important component is lacked in spectrum, such as ultraviolet light, green light or infrared light, it can be in plant photomorphogenesis There is wretched insufficiency, influences plant growth and development and quality;
Second is that making up plant by increasing UV LED, green light LED or infrared light-emitting diode Deficiency in biologically effective radiation spectrum, enhancing photosynthesis either adjust light quality ratio, considerably increase LED light source investment Cost, if the price of feux rouges and UV LED wafer is 5-8 times of blue LED wafers price;
Third is that light efficiency is low due to increasing UV LED, green light LED or infrared light-emitting diode, Subsequent operation and maintenance cost are greatly increased, heat dissipation cost accordingly also increases, and energy consumption greatly increases;
Fourth is that in photomorphogenesis shared by the spectrum of ultraviolet light (280nm~400nm) and infrared light (700nm~800nm) Ratio, relatively low in the spectrum of plant biological Net long wave radiation (280nm~800nm), LED light emitting angle is small, so in spectrum Uniform irradiation design aspect is difficult to reach requirement.Being difficult under the premise of infrared or ultraviolet LED light source number is less will be infrared Or ultraviolet LED light source uniformly configures, or even if infrared or ultraviolet LED light source angle of flare directive property is adjusted to most preferably, it is ultraviolet The colour mixture of light, infrared light and feux rouges and blue light is also insufficient, therefore it is uneven that spatial distribution easily occurs.
Summary of the invention
It is an object of the present invention to provide a kind of flip chip type plant light compensation LED light source and using the lamps and lanterns of the light source, in list The light formula that the different spectral compositions of fixed proportion are issued in one LED illumination device, facilitates the manufacturing, cost control and makes The use of user.
The present invention solves technical problem and adopts the following technical scheme that a kind of flip chip type plant light compensation LED light source comprising Substrate, LED wafer, the first rubber powder layer and the second rubber powder layer;
LED wafer is installed on a surface of the substrate;Wherein, the LED wafer is blue LED wafers;
It is provided with the first rubber powder layer between the LED wafer and substrate, is covered with second above the LED wafer Rubber powder layer;
LED wafer is fixed on the substrate by the first rubber powder layer, and it is the mixed of adherent and red fluorescence powder Close object;
The second rubber powder layer is covered in the LED wafer, and completely wraps up the LED wafer;Second rubber powder Layer is the mixture of adherent and yellow fluorescent powder;Or second rubber powder layer be adherent and IR fluorescence powder mixture.
The present invention solves technical problem and adopts the following technical scheme that a kind of flip chip type plant light compensation LED light source comprising Substrate, LED wafer, the first rubber powder layer and the second rubber powder layer;
LED wafer is installed on a surface of the substrate;Wherein, the LED wafer is blue LED wafers;
It is provided with the first rubber powder layer between the LED wafer and substrate, is covered with second above the LED wafer Rubber powder layer;
LED wafer is fixed on the substrate by the first rubber powder layer, and the first rubber powder layer is adherent and Huang The mixture of color fluorescent powder;Or first rubber powder layer be adherent and IR fluorescence powder mixture;
The second rubber powder layer is covered in the LED wafer, and completely wraps up the LED wafer;Second rubber powder Layer is the mixture of adherent and red fluorescence powder.
Optionally, in the first rubber powder layer or the second rubber powder layer, the weight ratio of the adherent and red fluorescence powder is 100:10-150。
Optionally, in the first rubber powder layer or the second rubber powder layer, the weight ratio of the adherent and yellow fluorescent powder is 100:10-30。
Optionally, in the first rubber powder layer or the second rubber powder layer, the weight ratio of the adherent and IR fluorescence powder is 100:10-40。
Optionally, the blue LED wafers are the LED wafer within the scope of 400nm~480nm with glow peak, or Blue LED wafers are the multi-wavelength blue LED wafers combination for possessing glow peak in the range of 400nm~480nm.
Optionally, the red fluorescence powder uses YAGG, YAGG:Ce3+、YAG:Eu2+, nitride red fluorescent powder, Mn4+ The K of doping2SiF6And K2SnF6Garnet fluorescent powder is one such or their combination;The IR fluorescence powder is Cr3+、 Ce3+、Yb3+One kind or their combination of the YAG near-infrared fluorescent powder more adulterated.
The present invention solves technical problem and also adopts the following technical scheme that a kind of lamps and lanterns comprising above-mentioned flip chip type plant Light filling LED light source.
The invention has the following beneficial effects: compared with the prior art, by blue LED wafers excitated red fluorescent powder and Yellow fluorescent powder passes through blue LED wafers excitated red fluorescent powder and IR fluorescence powder, can form full spectrum and dashes forward The light formula of photosynthesis of plant feature out is changed and is needed in the prior art by using red LED chip, blue led crystalline substance Piece, infrared LED chip, ultraviolet LED chip, green LED chip combine the light formula that could realize, LED wafer input cost with Circuit and radiator cost substantially reduce, and plant light compensation is greatly prolonged with the LED lamp service life.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of flip chip type plant light compensation LED light source of the invention;
The mark in the figure shows: 1-LED chip;2- the first rubber powder layer;3- the second rubber powder layer;4-PCB plate;5- conductor wire Road.
Specific embodiment
Technical solution of the present invention is further elaborated below with reference to examples and drawings.
Embodiment 1
Present embodiments provide a kind of flip chip type plant light compensation LED light source, including substrate, LED wafer, the first rubber powder layer With the second rubber powder layer.
The LED wafer is any one selected from the group including following item: semiconductor light-emitting-diode;Organic light emission Diode OLED;Light emitting diode with quantum dots QLED and micro- light emitting diode Micro-LED.
The LED wafer is set on the substrate, and preferably, and the substrate is pcb board, and LED wafer is installed on On one surface of the substrate, the components such as radiator, such as cooling base are installed on another surface of the substrate, The heat generated when LED wafer working distributes outward, so that LED wafer keeps preferable operating temperature, LED wafer work It is in stable condition, long service life.
Wherein, the LED wafer can be blue LED wafers, i.e., the described LED wafer can generate the indigo plant of 400nm~480nm Light.
It is provided with the first rubber powder layer between the LED wafer and substrate, is covered with second above the LED wafer Rubber powder layer;In the present embodiment, LED wafer is fixed on the substrate by the first rubber powder layer, and it is adherent and red The mixture of fluorescent powder.
The second rubber powder layer is covered in the LED wafer, and completely wraps up the LED wafer;In the present embodiment, institute State the mixture that the second rubber powder layer is adherent and yellow fluorescent powder.
Alternatively, the first rubber powder layer is the mixture of adherent and yellow fluorescent powder, the second rubber powder layer is gluing The mixture of body and red fluorescence powder.
Wherein, the weight ratio of the adherent and red fluorescence powder is 100:10-150, and can choose 100:50, or Person 100:100 is preferably.
The excitation for the blue light that the red fluorescence powder is issued by LED wafer and issue glow peak and fall in wavelength feux rouges Feux rouges in the range of 605nm~680nm.
Wherein, the weight ratio of the adherent and yellow fluorescent powder is 100:10-30, and preferably, the adherent Weight ratio with yellow fluorescent powder is 100:20.
That is, excite yellow fluorescent powder by the setting of yellow fluorescent powder and blue light, can generate 500nm~ The green light and infrared light of 560nm wavelength, the adjustable vision of green light and photosynthesis, infrared is adjustment Plant Light form.
In the present embodiment, by control the first rubber powder layer adherent and red fluorescence powder weight ratio and this first The thickness of rubber powder layer;The adherent of the second rubber powder layer and the weight ratio and the second rubber powder layer of yellow fluorescent powder are controlled simultaneously Thickness so that feux rouges (600nm~680nm): blue light (420nm~480nm): infrared light: green light: the photon flux of ultraviolet light The ratio (PPFD) of density is 70~90:10~30:1~30:5-20:0.01~1.
Preferably, the thickness of the first rubber powder layer can be set to 0.1mm-0.5mm;The thickness of the second rubber powder layer It can be set to 0.1mm-0.9mm, so that the ratio of photon flux density is within the above range.
Blue LED wafers have glow peak within the scope of 400nm~480nm, or in the range of 400nm~480nm Inside possess the multi-wavelength blue LED wafers combination of glow peak.
The yellow fluorescent powder is silicate bloom, aluminate bloom, and the yellow such as nitride and nitric oxide fluorescent powder are glimmering One of light powder or combination.
The red fluorescence powder uses YAGG, YAGG:Ce3+、YAG:Eu2+, nitride red fluorescent powder, Mn4+Doping K2SiF6And K2SnF6Garnet fluorescent powder is one such or their combination.
The adherent is silica gel, epoxy resin, poly-methyl methacrylate vinegar (PMMA), poly- carbonic acid vinegar (PC) or photosensitive The combination of one or more of colloid.According to different needs, die bond process and potting process use corresponding glue.
Compared with the prior art, it is combined, can be formed by blue LED wafers excitated red fluorescent powder and yellow fluorescent powder Full spectrum, and the light formula of photosynthesis of plant feature can be protruded, it changes and is needed in the prior art by using red LED crystalline substance More LED wafers such as piece, blue led chip, infrared LED chip, ultraviolet LED chip, green LED chip combine the light being just able to achieve Formula, LED wafer input cost and circuit and radiator cost substantially reduce (red LED chip, infrared LED chip, green LED wafer price is significantly larger than blue LED wafers, and luminous efficiency is very low);
Moreover, the light formula of flip chip type plant light compensation LED light source of the invention is more uniform, light source luminescent angle can Control;But in plant light compensation LED in the prior art, red LED chip usage amount is big, infrared LED chip, green LED chip Usage amount is small, to realize that uniform light quality distribution is difficult.
Flip chip type plant light compensation LED light source longer life expectancy of the invention, heat dissipation cost are lower.Blue LED wafers excitation Red fluorescence powder and yellow fluorescent powder combination, without using red LED chip, infrared LED chip, green LED chip, drop significantly The power of low plant growth light source, and circuit design simplifies (blue-ray LED, red LED chip, infrared LED chip, green Circuit complicated caused by LED wafer operating pressure drop is different, entirely with blue LED wafers excitated red fluorescent powder and yellow fluorescent powder, IR fluorescence powder achieves that required spectrum, circuit design simple), capacitor usage amount is reduced, and circuit cost is low, and the service life prolongs significantly It is long.
The light source of blue LED wafers excitated red fluorescent powder and yellow fluorescent powder of the invention is irradiated as light formula gives birth to Dish, as a result, it has been found that: under the irradiation of same light quantum current density, in the romaine lettuce using light source processing of the invention, soluble sugar contains Amount relatively uses and is higher by 30%-50%, and the cost drop by half of light source under red-light LED light source and the light filling of blue light LED light source More than.
And under the irradiation of same light quantum current density, present invention chrysanthemum flowers diameter and bennet under R/FR=2.5 processing is long Degree is than maximum, and plant strain growth is more healthy and stronger, improves the ornamental quality of Cut Flower Chrysanthemum Morifolium, and effective blooming control improves flower uniformity.
Embodiment 2
A kind of flip chip type plant light compensation LED light source is present embodiments provided, difference from example 1 is that, Yellow fluorescent powder is replaced using IR fluorescence powder, at this time:
The weight ratio of the adherent and IR fluorescence powder is 100:10-30, and preferably, the adherent and infrared The weight ratio of fluorescent powder is 100:25.
That is, exciting IR fluorescence powder by the setting of IR fluorescence powder and blue light, infrared light can be generated, Wherein, the wavelength of the infrared light is 700nm-760nm, optimal 730nm, to pass through infrared adjustment Plant Light form.
In the present embodiment, by control the first rubber powder layer adherent and red fluorescence powder weight ratio and this first The thickness of rubber powder layer;The adherent of the second rubber powder layer and the weight ratio and the second rubber powder layer of IR fluorescence powder are controlled simultaneously Thickness so that feux rouges (600nm~680nm): blue light (420nm~480nm): infrared light: green light: the photon flux of ultraviolet light The ratio (PPFD) of density is 70~90:10~30:1~30:5-20:0.01~1.
Preferably, the thickness of the first rubber powder layer can be set to 0.1mm-0.5mm;The thickness of the second rubber powder layer It can be set to 0.1mm-0.9mm, so that the ratio of photon flux density is within the above range.
Blue LED wafers have glow peak within the scope of 400nm~480nm, or in the range of 400nm~480nm Inside possess the multi-wavelength blue LED wafers combination of glow peak.
The red fluorescence powder uses YAGG, YAGG:Ce3+、YAG:Eu2+, nitride red fluorescent powder, Mn4+Doping K2SiF6And K2SnF6Garnet fluorescent powder is one such or their combination.
The IR fluorescence powder is Cr3+、Ce3+、Yb3+The YAG near-infrared fluorescent powder more adulterated it is one such or they Combination, such as Y3Al5O12:Cr,Ce,Yb。
The adherent is silica gel, epoxy resin, poly-methyl methacrylate vinegar (PMMA), poly- carbonic acid vinegar (PC) or photosensitive The combination of one or more of colloid.According to different needs, die bond process and potting process use corresponding glue.
Embodiment 3
The present embodiment provides a kind of lamps and lanterns comprising the flip chip type plant light compensation LED light source in embodiment 1 to 2.
Moreover, the lamps and lanterns further include electric connector and LED driver;The flip chip type plant light compensation LED light source can To be connected in series, perhaps it is connected in parallel or connects in series and parallel.
It is provided with insulating layer and conducting wire on the pcb board, one or more upside-down mountings are welded on wire circuit The LED wafer of type plant light compensation LED light source.
The conducting wire and LED driver output connect;The LED driver is for driving the flip chip type plant to mend Light LED light source.
The pcb board be bar shaped pcb board, rectangle pcb board or disc pcb board, and can using aluminium nitride, copper base, Copper alloy substrate, aluminium oxide, epoxy molding material, silicon carbide, diamond, silicon, graphite aluminum substrate, in alfer substrate, A kind of the preparing of high thermal conductivity plastic base or the plastic substrate of aluminium.
The sequencing of above embodiments is not only for ease of description, represent the advantages or disadvantages of the embodiments.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations;Although Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features; And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and Range.

Claims (8)

1. a kind of flip chip type plant light compensation LED light source, which is characterized in that including substrate, LED wafer, the first rubber powder layer and Two rubber powder layers;
LED wafer is installed on a surface of the substrate;Wherein, the LED wafer is blue LED wafers;
It is provided with the first rubber powder layer between the LED wafer and substrate, the second rubber powder is covered with above the LED wafer Layer;
LED wafer is fixed on the substrate by the first rubber powder layer, and it is the mixture of adherent and red fluorescence powder;
The second rubber powder layer is covered in the LED wafer, and completely wraps up the LED wafer;The second rubber powder layer is The mixture of adherent and yellow fluorescent powder;Or second rubber powder layer be adherent and IR fluorescence powder mixture.
2. a kind of flip chip type plant light compensation LED light source, which is characterized in that including substrate, LED wafer, the first rubber powder layer and Two rubber powder layers;
LED wafer is installed on a surface of the substrate;Wherein, the LED wafer is blue LED wafers;
It is provided with the first rubber powder layer between the LED wafer and substrate, the second rubber powder is covered with above the LED wafer Layer;
LED wafer is fixed on the substrate by the first rubber powder layer, and the first rubber powder layer is that adherent and yellow are glimmering The mixture of light powder;Or first rubber powder layer be adherent and IR fluorescence powder mixture;
The second rubber powder layer is covered in the LED wafer, and completely wraps up the LED wafer;The second rubber powder layer is The mixture of adherent and red fluorescence powder.
3. flip chip type plant light compensation LED light source according to claim 1 or 2, which is characterized in that in the first rubber powder layer or In person's the second rubber powder layer, the weight ratio of the adherent and red fluorescence powder is 100:10-150.
4. flip chip type plant light compensation LED light source according to claim 3, which is characterized in that in the first rubber powder layer or In second rubber powder layer, the weight ratio of the adherent and yellow fluorescent powder is 100:10-30.
5. flip chip type plant light compensation LED light source according to claim 3, which is characterized in that in the first rubber powder layer or In second rubber powder layer, the weight ratio of the adherent and IR fluorescence powder is 100:10-40.
6. flip chip type plant light compensation LED light source according to claim 1, which is characterized in that the blue LED wafers are LED wafer or blue LED wafers within the scope of 400nm~480nm with glow peak are the range in 400nm~480nm Inside possess the multi-wavelength blue LED wafers combination of glow peak.
7. flip chip type plant light compensation LED light source according to claim 1, which is characterized in that the red fluorescence powder is adopted With YAGG, YAGG:Ce3+、YAG:Eu2+, nitride red fluorescent powder, Mn4+The K of doping2SiF6And K2SnF6Garnet fluorescent powder One such or their combination;The IR fluorescence powder is Cr3+、Ce3+、Yb3+The YAG near-infrared fluorescent powder more adulterated One kind or their combination.
8. a kind of lamps and lanterns, which is characterized in that including flip chip type plant light compensation LED light source described in one of claim 1-7.
CN201811400237.3A 2018-11-22 2018-11-22 LED light source for inverted plant light supplement and lamp using same Active CN109538952B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201811400237.3A CN109538952B (en) 2018-11-22 2018-11-22 LED light source for inverted plant light supplement and lamp using same
PCT/CN2019/114978 WO2020103671A1 (en) 2018-11-22 2019-11-01 Led light source for plant light supplementation and lamp using
EP19886796.2A EP3767167B1 (en) 2018-11-22 2019-11-01 Led light source for plant light supplementation and lamp comprising the same
US17/043,669 US11419278B2 (en) 2018-11-22 2019-11-01 LED light source for supplemental lighting for plants and lamp with light source
JP2020560244A JP2021520612A (en) 2018-11-22 2019-11-01 LED light source for plant supplementation and lighting equipment equipped with the light source

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Application Number Priority Date Filing Date Title
CN201811400237.3A CN109538952B (en) 2018-11-22 2018-11-22 LED light source for inverted plant light supplement and lamp using same

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CN109538952B CN109538952B (en) 2020-01-17

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110112128A (en) * 2019-05-24 2019-08-09 温州大学新材料与产业技术研究院 A kind of preparation and application of full spectrum intelligence plant lamp
WO2020103671A1 (en) * 2018-11-22 2020-05-28 杭州汉徽光电科技有限公司 Led light source for plant light supplementation and lamp using
CN111249897A (en) * 2020-01-22 2020-06-09 杭州汉徽光电科技有限公司 Plant air purification system for fixing carbon and releasing oxygen
CN112397488A (en) * 2019-08-12 2021-02-23 杭州汉徽光电科技有限公司 High-voltage alternating current LED chip set, high-voltage alternating current LED light source and illumination equipment

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