CN109854979A - Flip chip type plant light compensation LED matrix and lamps and lanterns - Google Patents
Flip chip type plant light compensation LED matrix and lamps and lanterns Download PDFInfo
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- CN109854979A CN109854979A CN201811400238.8A CN201811400238A CN109854979A CN 109854979 A CN109854979 A CN 109854979A CN 201811400238 A CN201811400238 A CN 201811400238A CN 109854979 A CN109854979 A CN 109854979A
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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- Y02P60/14—Measures for saving energy, e.g. in green houses
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Abstract
The invention discloses a kind of flip chip type plant light compensation LED matrix and lamps and lanterns, the flip chip type plant light compensation LED matrix includes substrate, LED wafer, the first rubber powder layer and the second rubber powder layer；LED wafer is fixed on the substrate by the first rubber powder layer, and it is the mixture of adherent and red fluorescence powder；The second rubber powder layer is covered in the LED wafer.Flip chip type plant light compensation LED matrix of the invention, pass through blue LED wafers and ultraviolet LED chip excitated red fluorescent powder and yellow fluorescent powder, full spectrum can be formed, the light formula of photosynthesis of plant feature can be protruded again, when increasing ultraviolet LED number of wafers, increase the ingredient of ultraviolet light in spectrum, cultivation especially suitable for medicinal plant, it changes and is needed in the prior art by using red LED chip, blue led chip, infrared LED chip, ultraviolet LED chip, more LED wafers such as green LED chip combine the light formula being just able to achieve, LED wafer input cost and circuit and radiator cost substantially reduce.
Description
Technical field
The present invention relates to a kind of flip chip type plant light compensation LED matrix and lamps and lanterns, belong to industrialized agriculture lighting field.
Background technique
According to the light physiological property of plant, light radiation is to the photosynthesis of plant, growth and development, morphogenesis and plant generation
Thanking etc. has regulating and controlling effect.The light for being radiated at the different-waveband on plant is different to the physiological effect of plant, thus different-waveband
Beche-de-mer without spike and photosynthetic weight it is also different, and change with the stage of plant variety and growth.Chlorophyll is in plant body
Absorption, transmitting and the conversion of interior responsible luminous energy, carotenoid then exercise luminous energy capture and the big function of Photoprotection two, they
Very important effect is played in photosynthesis.The maximum absorption band of chlorophyll a is 410nm, 430nm and 660nm；Chlorophyll
The maximum absorption band of b is 430nm, 455nm and 640nm.Carotenoid is important accessory pigments, and the luminous energy absorbed is just
It is good complementary with chlorophyll, so chlorophyll can be helped to receive luminous energy.Royal purple of the carotenoid absorption band in 400nm~500nm
Light area, the absorption spectrum maximum value of algocyan are in orange light part, and then absorption spectrum maximum value is in green portions to rhodophyll.
Feux rouges (600nm~700nm, R) and far-red light in the influence of light quality, especially spectrum in illumination condition (700nm~
800nm, FR) effect of ratio (R/FR) of light is increasingly subject to the attention of people.Ratio (the R/ of red and far-red light in spectrum
FR) regulation of the content of plant inner gibberellin (CA), phytomorph are built up, adjusting plant height has great influence.Section
Scholar changes the ratio of R/FR by the amount of feux rouges (R) or far-red light (FR) in manual control plant growth environment to adjust
The form of plant.When R/FR ratio becomes larger, the stipes spacing of plant becomes smaller dwarfing: on the contrary the then plant when R/FR ratio becomes smaller
Has the tendency that elongation.
Green plants during growth, needs visible light to carry out photosynthesis.It is well known that, it is seen that light is one
Kind complex light, during the growth process, the demand to the light of the different colours in visible light is also not quite similar different plants.
More and more researches show that the light of different colours is suitably carried out mixed exposure in different proportions, will have
Help the growth of plant.
But it is formal in concrete implementation, in practical application, red LED in light source or remote red LED need to be increased
Quantity, the adjusting of Lai Shixian R/FR ratio, to achieve the purpose that control plant forms；By increase green LED quantity come
Make up the deficiency in spectrum.It is combined generally by the LED light source using multiple and different colors not year-on-year to reach irradiation
The light of the different colours of example, this is highly inconvenient for user, if during combining LED light source, different colours
The ratio of LED light source mistake has occurred, be also just difficult to achieve the purpose that plant yield-increasing.
LED light source in the prior art such as Chinese patent 201180055432.7,201210414873.8, and
201210375582.2 recorded.
But above three patent passes through blue light excitated red fluorescent powder, is simultaneously emitted by red blue light for plant photosynthesis
Effect, but need to realize light by increasing UV LED, green light LED or infrared light-emitting diode
The supplement of ultraviolet light, green light and near infrared light in spectrum；Following deficiency is brought as a result:
First is that important component is lacked in spectrum, such as ultraviolet light, green light or infrared light, it can be in plant photomorphogenesis
There is wretched insufficiency, influences plant growth and development and quality；
Second is that making up plant by increasing UV LED, green light LED or infrared light-emitting diode
Deficiency in biologically effective radiation spectrum, enhancing photosynthesis either adjust light quality ratio, considerably increase LED light source investment
Cost, if the price of feux rouges and ultraviolet LED chip is 5-8 times of blue LED wafers price；
Third is that light efficiency is low due to increasing UV LED, green light LED or infrared light-emitting diode,
Subsequent operation and maintenance cost are greatly increased, heat dissipation cost accordingly also increases, and energy consumption greatly increases；
Fourth is that in photomorphogenesis shared by the spectrum of ultraviolet light (280nm~400nm) and infrared light (700nm~800nm)
Ratio, relatively low in the spectrum of plant biological Net long wave radiation (280nm~800nm), LED light emitting angle is small, so in spectrum
Uniform irradiation design aspect is difficult to reach requirement.Being difficult under the premise of infrared or ultraviolet LED light source number is less will be infrared
Or ultraviolet LED light source uniformly configures, or even if infrared or ultraviolet LED light source angle of flare directive property is adjusted to most preferably, it is ultraviolet
The colour mixture of light, infrared light and feux rouges and blue light is also insufficient, therefore it is uneven that spatial distribution easily occurs.
Summary of the invention
It is an object of the present invention to provide a kind of flip chip type plant light compensation LED matrixs, send out in single LED illumination device
The light of the different colours of fixed proportion out facilitates the use of the manufacturing, cost control and user.
The present invention solves technical problem and adopts the following technical scheme that a kind of flip chip type plant light compensation LED matrix comprising
Substrate, LED wafer, the first rubber powder layer and the second rubber powder layer；
LED wafer is installed on a surface of the substrate；Wherein, the LED wafer includes blue LED wafers and purple
One of outer LED wafer or their combination；
It is provided with the first rubber powder layer between the LED wafer and substrate, is covered with second above the LED wafer
Rubber powder layer；
LED wafer is fixed on the substrate by the first rubber powder layer, and it is the mixed of adherent and red fluorescence powder
Close object；
The second rubber powder layer is covered in the LED wafer, and completely wraps up the LED wafer；Second rubber powder
Layer is the mixture of adherent and IR fluorescence powder；Or second rubber powder layer be adherent and yellow fluorescent powder mixture.
The present invention solves technical problem and adopts the following technical scheme that a kind of flip chip type plant light compensation LED matrix comprising
Substrate, LED wafer, the first rubber powder layer and the second rubber powder layer；
LED wafer is installed on a surface of the substrate；Wherein, the LED wafer includes blue LED wafers and purple
One of outer LED wafer or their combination；
It is provided with the first rubber powder layer between the LED wafer and substrate, is covered with second above the LED wafer
Rubber powder layer；
LED wafer is fixed on the substrate by the first rubber powder layer, and the first rubber powder layer is adherent and red
The mixture of outer fluorescent powder；Or first rubber powder layer be adherent and yellow fluorescent powder mixture；
The second rubber powder layer is covered in the LED wafer, and completely wraps up the LED wafer；Second rubber powder
Layer is the mixture of adherent and red fluorescence powder.
Optionally, in the first rubber powder layer or the second rubber powder layer, the weight ratio of the adherent and red fluorescence powder is
100:10-150。
Optionally, in the first rubber powder layer or the second rubber powder layer, the weight ratio of the adherent and IR fluorescence powder is
100:10-40。
Optionally, in the first rubber powder layer or the second rubber powder layer, the weight ratio of the adherent and yellow fluorescent powder is
100:10-40。
Optionally, the blue LED wafers are the LED wafer within the scope of 400nm~480nm with glow peak, or
Blue LED wafers are the multi-wavelength blue LED wafers combination for possessing glow peak in the range of 400nm~480nm；It is described ultraviolet
LED wafer is the LED wafer that wavelength possesses glow peak in the range of 320nm~400nm.
Optionally, the red fluorescence powder uses YAGG, YAGG:Ce3+、YAG:Eu2+, nitride red fluorescent powder, Mn4+
The K of doping2SiF6And K2SnF6Garnet fluorescent powder is one such or their combination；The IR fluorescence powder is Cr3+、
Ce3+、Yb3+One kind or their combination of the YAG near-infrared fluorescent powder more adulterated.
The present invention solves technical problem and also adopts the following technical scheme that a kind of lamps and lanterns comprising above-mentioned flip chip type plant
Light filling LED matrix.
The invention has the following beneficial effects: compared with the prior art, flip chip type plant light compensation of the invention is filled with LED
Set, by blue LED wafers and ultraviolet LED chip excitated red fluorescent powder and yellow fluorescent powder, can be formed full spectrum and
The light formula of prominent photosynthesis of plant feature increases the ingredient of ultraviolet light in spectrum when increasing ultraviolet LED number of wafers,
Especially suitable for the cultivation of medicinal plant, change need in the prior art by using red LED chip, blue led chip,
More LED wafers such as infrared LED chip, ultraviolet LED chip, green LED chip combine the light formula being just able to achieve, and LED wafer is thrown
Enter cost and circuit and radiator cost substantially reduces.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of flip chip type plant light compensation LED matrix of the invention；
The mark in the figure shows: 1- blue LED wafers；2- the first rubber powder layer；3- the second rubber powder layer；4- substrate；5- is ultraviolet
LED wafer.
Specific embodiment
Technical solution of the present invention is further elaborated below with reference to examples and drawings.
Embodiment 1
Present embodiments provide a kind of flip chip type plant light compensation LED matrix, including substrate, LED wafer, the first rubber powder layer
With the second rubber powder layer.
The LED wafer is any one selected from the group including following item: semiconductor light-emitting-diode；Organic light emission
Diode OLED；Light emitting diode with quantum dots QLED and micro- light emitting diode Micro-LED.
The LED wafer is set on the substrate, and preferably, and the substrate is pcb board, and LED wafer is installed on
On one surface of the substrate, the components such as radiator, such as cooling base are installed on another surface of the substrate,
The heat generated when LED wafer working distributes outward, so that LED wafer keeps preferable operating temperature, LED wafer work
It is in stable condition, long service life.
Wherein, the LED wafer includes one of blue LED wafers and ultraviolet LED chip or their combination, i.e.,
The LED wafer can generate the blue light that wavelength is 400nm~480nm and wavelength is 320nm~400nm black light.
It is provided with the first rubber powder layer between the LED wafer and substrate, is covered with second above the LED wafer
Rubber powder layer；In the present embodiment, LED wafer is fixed on the substrate by the first rubber powder layer, and it is adherent and red
The mixture of fluorescent powder, wherein the weight ratio of the adherent and red fluorescence powder is 100:10-150, and be can choose
100:50 is preferably.
The excitation of blue light and ultraviolet light that the red fluorescence powder is issued by LED wafer and issue glow peak and fall in wave
Feux rouges in the range of long 605nm-680nm.
The second rubber powder layer completely wraps up the LED wafer；In the present embodiment, the second rubber powder layer be adherent and
The mixture of IR fluorescence powder, wherein the weight ratio of the adherent and IR fluorescence powder is 100:10-40, and preferably,
The weight ratio of the adherent and IR fluorescence powder is 100:25.
That is, can be generated by the setting of IR fluorescence powder and blue light and ultraviolet excitation IR fluorescence powder
Infrared light, wherein the wavelength of the infrared light is 700nm-760nm, optimal 730nm, to adjust in the form of Plant Light.
In the present embodiment, by control the first rubber powder layer adherent and red fluorescence powder weight ratio and this first
The thickness of rubber powder layer；The adherent of the second rubber powder layer and the weight ratio and the second rubber powder layer of IR fluorescence powder are controlled simultaneously
Thickness so that feux rouges (600nm~700nm): blue light (400nm~470nm): infrared light: green light: the photon flux of ultraviolet light
The ratio (PPFD) of density is between 70~90:10~30:0.05~5:5-20:0.01~5.
Preferably, the thickness of the first rubber powder layer can be set to 0.1mm-0.5mm；The thickness of the second rubber powder layer
It can be designed as 0.1mm-0.9mm, so that the ratio of photon flux density is within the above range.
Blue LED wafers have glow peak within the scope of 400nm~480nm, or in the range of 400nm~480nm
Inside possess the multi-wavelength blue LED wafers combination of glow peak.
The yellow fluorescent powder is silicate bloom, aluminate bloom, and the yellow such as nitride and nitric oxide fluorescent powder are glimmering
One of light powder or combination.
The red fluorescence powder uses YAGG, YAGG:Ce3+、YAG:Eu2+, nitride red fluorescent powder, Mn4+Doping
K2SiF6And K2SnF6Garnet fluorescent powder is one such or their combination.
The IR fluorescence powder is Cr3+、Ce3+、Yb3+The YAG near-infrared fluorescent powder more adulterated it is one such or they
Combination, such as Y3Al5O12:Cr,Ce,Yb。
The adherent is silica gel, epoxy resin, poly-methyl methacrylate vinegar (PMMA), poly- carbonic acid vinegar (PC) or photosensitive
The combination of one or more of colloid.According to different needs, die bond process and potting process use corresponding glue.
Compared with the prior art, pass through blue LED wafers and ultraviolet LED chip excitated red fluorescent powder and IR fluorescence
Powder can form the light formula of full spectrum and prominent photosynthesis spectrum, when increasing ultraviolet LED number of wafers, increase light
The ingredient of ultraviolet light in spectrum is changed and is needed in the prior art by using red LED especially suitable for the cultivation of medicinal plant
What more LED wafer combinations such as chip, blue led chip, infrared LED chip, ultraviolet LED chip, green LED chip were just able to achieve
Light formula, LED wafer input cost and circuit and radiator cost substantially reduce (red LED chip, infrared LED chip, green
Color LED wafer price is significantly larger than blue LED wafers, and luminous efficiency is very low).
Moreover, the light formula of flip chip type plant light compensation LED matrix of the invention is more uniform, light source luminescent angle is small；
But in plant light compensation LED in the prior art, red LED chip usage quantity is big, infrared LED chip, green LED chip
Usage quantity is small, to realize that uniform light quality distribution is difficult.
Flip chip type plant light compensation LED matrix longer life expectancy of the invention, heat dissipation cost are lower.Blue LED wafers and purple
Outer LED wafer excitated red fluorescent powder and IR fluorescence powder, it is brilliant without using red LED chip, infrared LED chip, green LED
Piece substantially reduces the power of plant growth light source, and circuit design simplifies (blue-ray LED, red LED chip, infrared LED
Circuit complicated caused by chip, green LED chip operating pressure drop are different, entirely with blue LED wafers excitated red fluorescent powder and Huang
Color fluorescent powder, IR fluorescence powder achieve that required spectrum, circuit design simple), capacitor usage amount is reduced, and circuit cost is low,
Service life greatly prolongs.
The light source conduct of blue LED wafers and ultraviolet LED chip excitated red fluorescent powder and IR fluorescence powder of the invention
Light formula irradiates romaine lettuce, as a result, it has been found that: under the irradiation of same light quantum current density, using the romaine lettuce of light source processing of the invention
In, soluble sugar content is compared with using being higher by 30%-50% under the light filling of red-light LED light source and blue light LED light source, and light source
It is more than cost drop by half.
And under the irradiation of same light quantum current density, present invention chrysanthemum flowers diameter and bennet under R/FR=2.5 processing is long
Degree is than maximum, and plant strain growth is more healthy and stronger, improves the ornamental quality of Cut Flower Chrysanthemum Morifolium, and effective blooming control improves flower uniformity.
Embodiment 2
A kind of flip chip type plant light compensation LED matrix is present embodiments provided, difference from example 1 is that,
IR fluorescence powder is replaced using yellow fluorescent powder, at this time:
The weight ratio of the adherent and yellow fluorescent powder is 100:10-40, and preferably, the adherent and yellow
The weight ratio of fluorescent powder is 100:25.
That is, can be generated by the setting of yellow fluorescent powder and blue light and ultraviolet excitation yellow fluorescent powder
Green light and infrared light, wherein the wavelength of the infrared light is 700nm-760nm, optimal 730nm, to pass through infrared adjustment
Plant Light form.
In the present embodiment, by control the first rubber powder layer adherent and red fluorescence powder weight ratio and this first
The thickness of rubber powder layer；The adherent of the second rubber powder layer and the weight ratio and the second rubber powder layer of yellow fluorescent powder are controlled simultaneously
Thickness so that feux rouges (600nm~700nm): blue light (400nm~470nm): infrared light: green light: the photon flux of ultraviolet light
The ratio (PPFD) of density is between 70~90:10~30:0.05~5:5-20:0.01~5.
Preferably, the thickness of the first rubber powder layer can be set to 0.1mm-0.5mm；The thickness of the second rubber powder layer
It can be designed as 0.1mm-0.9mm, so that the ratio of photon flux density is within the above range.
Blue LED wafers have glow peak within the scope of 400nm~480nm, or in the range of 400nm~480nm
Inside possess the multi-wavelength blue LED wafers combination of glow peak.
The yellow fluorescent powder is silicate bloom, aluminate bloom, and the yellow such as nitride and nitric oxide fluorescent powder are glimmering
One of light powder or combination.
The red fluorescence powder uses YAGG, YAGG:Ce3+、YAG:Eu2+, nitride red fluorescent powder, Mn4+Doping
K2SiF6And K2SnF6Garnet fluorescent powder is one such or their combination.
The adherent is silica gel, epoxy resin, poly-methyl methacrylate vinegar (PMMA), poly- carbonic acid vinegar (PC) or photosensitive
The combination of one or more of colloid.According to different needs, die bond process and potting process use corresponding glue.
Embodiment 3
The present embodiment provides a kind of lamps and lanterns comprising the flip chip type plant light compensation LED matrix in embodiment 1 to 2.
Moreover, the lamps and lanterns further include electric connector and LED driver；The flip chip type plant light compensation LED matrix can
To be connected in series, perhaps it is connected in parallel or connects in series and parallel.
It is provided with insulating layer and conducting wire on the pcb board, one or more upside-down mountings are welded on wire circuit
The LED wafer of type plant light compensation LED matrix.
The conducting channel and LED driver output connect；The LED driver is for driving the flip chip type plant to mend
Light LED matrix.
The pcb board be bar shaped pcb board, rectangle pcb board or disc pcb board, and can using aluminium nitride, copper base,
Copper alloy substrate, aluminium oxide, epoxy molding material, silicon carbide, diamond, silicon, graphite aluminum substrate, in alfer substrate,
A kind of preparation of material of high thermal conductivity plastic base or the plastic substrate of aluminium.
The sequencing of above embodiments is not only for ease of description, represent the advantages or disadvantages of the embodiments.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；
And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (8)
1. a kind of flip chip type plant light compensation LED matrix, which is characterized in that including substrate, LED wafer, the first rubber powder layer and
Two rubber powder layers；
LED wafer is installed on a surface of the substrate；Wherein, the LED wafer includes blue LED wafers and ultraviolet
One of LED wafer or their combination；
It is provided with the first rubber powder layer between the LED wafer and substrate, the second rubber powder is covered with above the LED wafer
Layer；
LED wafer is fixed on the substrate by the first rubber powder layer, and it is the mixture of adherent and red fluorescence powder；
The second rubber powder layer is covered in the LED wafer, and completely wraps up the LED wafer；The second rubber powder layer is
The mixture of adherent and IR fluorescence powder；Or second rubber powder layer be adherent and yellow fluorescent powder mixture.
2. a kind of flip chip type plant light compensation LED matrix, which is characterized in that including substrate, LED wafer, the first rubber powder layer and
Two rubber powder layers；
LED wafer is installed on a surface of the substrate；Wherein, the LED wafer includes blue LED wafers and ultraviolet
One of LED wafer or their combination；
It is provided with the first rubber powder layer between the LED wafer and substrate, the second rubber powder is covered with above the LED wafer
Layer；
LED wafer is fixed on the substrate by the first rubber powder layer, and the first rubber powder layer is adherent and infrared glimmering
The mixture of light powder；Or first rubber powder layer be adherent and yellow fluorescent powder mixture；
The second rubber powder layer is covered in the LED wafer, and completely wraps up the LED wafer；The second rubber powder layer is
The mixture of adherent and red fluorescence powder.
3. flip chip type plant light compensation LED matrix according to claim 1 or 2, which is characterized in that in the first rubber powder layer or
In second rubber powder layer, the weight ratio of the adherent and red fluorescence powder is 100:10-150.
4. flip chip type plant light compensation LED matrix according to claim 3, which is characterized in that in the first rubber powder layer or
In two rubber powder layers, the weight ratio of the adherent and IR fluorescence powder is 100:10-40.
5. flip chip type plant light compensation LED matrix according to claim 3, which is characterized in that in the first rubber powder layer or
In two rubber powder layers, the weight ratio of the adherent and yellow fluorescent powder is 100:10-40.
6. flip chip type plant light compensation LED matrix according to claim 1, which is characterized in that the blue LED wafers are
LED wafer or blue LED wafers within the scope of 400nm~480nm with glow peak are the range in 400nm~480nm
Inside possess the multi-wavelength blue LED wafers combination of glow peak；The ultraviolet LED chip is range of the wavelength in 320nm~400nm
Inside possess the LED wafer of glow peak.
7. flip chip type plant light compensation LED matrix according to claim 1, which is characterized in that the red fluorescence powder is adopted
With YAGG, YAGG:Ce3+、YAG:Eu2+, nitride red fluorescent powder, Mn4+The K of doping2SiF6And K2SnF6Garnet fluorescent powder
One such or their combination；The IR fluorescence powder is Cr3+、Ce3+、Yb3+The YAG near-infrared fluorescent powder more adulterated
One kind or their combination.
8. a kind of lamps and lanterns, which is characterized in that including flip chip type plant light compensation LED matrix described in one of claim 1-7.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811400238.8A CN109854979B (en) | 2018-11-22 | 2018-11-22 | LED device and lamps and lanterns for flip-chip type plant light filling |
| US17/043,669 US11419278B2 (en) | 2018-11-22 | 2019-11-01 | LED light source for supplemental lighting for plants and lamp with light source |
| PCT/CN2019/114978 WO2020103671A1 (en) | 2018-11-22 | 2019-11-01 | Led light source for plant light supplementation and lamp using |
| EP19886796.2A EP3767167B1 (en) | 2018-11-22 | 2019-11-01 | Led light source for plant light supplementation and lamp comprising the same |
| JP2020560244A JP2021520612A (en) | 2018-11-22 | 2019-11-01 | LED light source for plant supplementation and lighting equipment equipped with the light source |
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| CN201811400238.8A CN109854979B (en) | 2018-11-22 | 2018-11-22 | LED device and lamps and lanterns for flip-chip type plant light filling |
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| CN109854979A true CN109854979A (en) | 2019-06-07 |
| CN109854979B CN109854979B (en) | 2020-04-14 |
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| CN109854979B (en) | 2020-04-14 |
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