CN108254593A - absorption type test device - Google Patents
absorption type test device Download PDFInfo
- Publication number
- CN108254593A CN108254593A CN201611238094.1A CN201611238094A CN108254593A CN 108254593 A CN108254593 A CN 108254593A CN 201611238094 A CN201611238094 A CN 201611238094A CN 108254593 A CN108254593 A CN 108254593A
- Authority
- CN
- China
- Prior art keywords
- test device
- absorption type
- type test
- plummer
- top surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
Abstract
A kind of absorption type test device includes a plummer, an electrical conduction, a sealing ring and a conducting probe.Plummer has a top surface, a back side and a wears groove.The back side is relative to top surface.Wears groove extends to the back side from top surface.Electrical conduction includes a plate body and multiple conductive elastic arms.Plate body is located at wears groove and is embedded at plummer, to distinguish an adsorption zone and an accommodating area.These conductive elastic arms run through plate body.Sealing ring is set to top surface, and around adsorption zone.Sealing ring is carrying support plate.One end of these electrical conductions is located at adsorption zone and is for electrically connecting to support plate.Conducting probe is located at wears groove.Conducting probe includes a frame body and multiple probes.Frame body is fixed on plummer.The other end of these conductive elastic arms is located at accommodating area and is electrically connected in these probes.
Description
Technical field
The present invention relates to a kind of test device, particularly a kind of absorption type test device.
Background technology
With the development of science and technology the function of semiconductor element is similarly maked rapid progress, and the function of carrying is more and more various
Change.Traditionally, semiconductor element is before manufacture, often by test program, to determine the various functions in semiconductor element
It is normal.
In general, it is that the semiconductor element with integrated circuit is set on plummer to test.Specifically,
Multiple test circuit boards are configured on plummer and multiple extension types are electrically connected terminal (pogo pin).In addition, it holds
Support plate can be also equipped on microscope carrier, and support plate is equipped with electrical contact, to be connect with semiconductor element electric.Carrying out semiconductor
It before the test of circuit, needs that first support plate is assembled on plummer, test circuit board and half is electrically connected will pass through support plate
Conductor element.In order to ensure support plate can have good in electrical contact with being electrically connected terminal, developed at present through vacuum suction
Mode by various sizes of support plate to be fixedly arranged on plummer.
In test device of the prior art using vacuum suction, entire vacuum area is located at support plate and is mounted with extension type
It is electrically connected between the frame body of terminal (pogo pin), therefore frame body is electrically connected terminal (pogo pin) with each extension type
Processing can all influence the airtight quality of vacuum area with assembling quality.That is, before test device is used, need additionally to frame
Body is electrically connected terminal (pogo pin) with each extension type and carries out more accurate airtight test, to ensure frame body with that can stretch
Contracting formula can meet required vacuum requirement after being electrically connected terminal (pogo pin) actual load.But aforementioned additional airtight test is not only
Can additionally increase can also increase detection time outside testing cost.
Invention content
The technical problems to be solved by the invention are to provide a kind of absorption type test device, so as to solving frame body with electrically connecting
Need the airtight test for additionally carrying out precision that can reduce the probability of absorption type test device gas leakage before connecting terminal actual load.
To achieve these goals, the present invention provides a kind of absorption type test device, to carry a support plate.Absorption type
Test device includes a plummer, an electrical conduction, one first sealing ring and a conducting probe.Plummer has a top surface, one
The back side and a wears groove.The back side is relative to top surface.Wears groove extends to the back side from top surface.Electrical conduction includes a plate body and multiple conductions
Elastic arm.Plate body is located at wears groove and is embedded at plummer, to distinguish an adsorption zone and an accommodating area.These conductive elastic arms run through plate
Body.First sealing ring is set to top surface, and around adsorption zone.First sealing ring is carrying support plate.The one of these electrical conductions
End is positioned at adsorption zone and is for electrically connecting to support plate.Conducting probe is located at wears groove.Conducting probe includes a frame body and multiple probes
Head.Frame body is fixed on plummer.The other end of these conductive elastic arms is located at accommodating area and is electrically connected in these probes.
The technical effects of the invention are that：
According to the absorption type test device of above-described embodiment, isolated and vacuumized in wears groove by the plate body of electrical conduction
Adsorption zone and the accommodating area put for conducting probe, so as to conducting probe is excluded in except adsorption zone.Thus, it inhales
Attached area vacuumizes that airtight quality of the quality only between plate body and plummer is related, by can't by conducting probe processing with
Assemble the influence of quality.That is, suction can be also reduced without additionally carrying out accurate airtight test before conducting probe actual load
The probability of attached area's gas leakage, and then reduce testing time and the cost of absorption type test device.
Below in conjunction with the drawings and specific embodiments, the present invention will be described in detail, but not as a limitation of the invention.
Description of the drawings
Fig. 1 is the diagrammatic cross-section of the absorption type test device according to first embodiment of the invention；
Fig. 2 is the decomposition diagram of Fig. 1；
Fig. 3 is the close-up schematic view of Fig. 2；
Fig. 4 is the close-up schematic view of the absorption type test device according to second embodiment of the invention.
Wherein, reference numeral
10 absorption type test devices
20 support plates
100 plummers
110 annular base bodies
111 top surfaces
112 back sides
113 wears grooves
114 internal faces
115 assembling groves
120 annular flanges
121 annular grooves
130 assembling convex blocks
140 are embedded slot
200 electrical conductions
210 plate bodys
220 conductive elastic arms
221 first ends
222 second ends
300 first sealing rings
400 conducting probes
410 frame bodies
420 probes
500 second sealing rings
A1 adsorption zones
A2 accommodating areas
Specific embodiment
The structural principle and operation principle of the present invention are described in detail below in conjunction with the accompanying drawings：
It please refers to Fig.1 to Fig.3.Fig. 1 is that the section of the absorption type test device according to first embodiment of the invention shows
It is intended to.Fig. 2 is the decomposition diagram of Fig. 1.Fig. 3 is the close-up schematic view of Fig. 2.
The absorption type test device 10 of the present embodiment, to carry a support plate 20.Absorption type test device 10 is held comprising one
Microscope carrier 100, an electrical conduction 200, one first sealing ring 300 and a conducting probe 400.
Plummer 100 includes an annular base body 110 and an annular flange 120.Annular base body 110 has a top surface 111, one
The back side 112, a wears groove 113 and the internal face 114 for forming wears groove 113.Wears groove 113 extends to the back side 112 from top surface 111.Ring
Shape flange 120 protrudes from internal face 114, and annular flange 120 is coplanar backwards to the surface of conducting probe 400 and top surface 111.
It is worth noting that, the annular flange 120 of the present embodiment is flat altogether with top surface 111 backwards to the surface of conducting probe 400
Face, but be not limited thereto, in other embodiments, annular flange 120 backwards to the surface of conducting probe 400 with top surface 111 not
It is coplanar.
Electrical conduction 200 includes a plate body 210 and multiple conductive elastic arms 220.Plate body 210 is located at wears groove 113 and is embedded at
Plummer 100 in the opposite sides of plate body 210 and to separate out an an adsorption zone A1 and accommodating area A2, and enables adsorption zone A1 with holding
The gas for putting area A2 is not attached to lead to.These conductive elastic arms 220 run through plate body 210.These conductive elastic arms 220 have opposite 1 the
221 and one second end 222 of one end, and first end 221 is located at adsorption zone A1, second end 222 is located at accommodating area A2.
In the present embodiment, plate body 210 is embedded at the specific practice of plummer 100 and is such as, but not limited to, annular base body
110 have an assembling grove 115.Assembling grove 115 is located at internal face 114, and between annular flange 120 and the back side 112.Carrying
Platform 100 also comprising one assembling convex block 130, assembling convex block 130 be separably embedded at assembling grove 115, with enable annular base body 110,
Annular flange 120 and assembling convex block 130 form one and are embedded slot 140.The part of plate body 210, which is embedded at, is embedded slot 140.
In the present embodiment, absorption type test device 10 also includes one second sealing ring 500.Annular flange 120 also has
One annular groove 121.Second sealing ring 500 is located at annular groove 121, and is located in annular flange 120 and plate body 210, to carry
Rise the airtight quality of adsorption zone A1.
It is worth noting that, the annular flange 120 of above-described embodiment has annular groove 121, for the second sealing ring 500
Positioning.But be not limited thereto, in other embodiments, annular flange 120 can also acyclic connected in star 121 position.
First sealing ring 300 is set to top surface 111, and around adsorption zone A1.First sealing ring 300 is carrying support plate
20, and the first end 221 of these conductive elastic arms 220 and each circuit for being electrically connected support plate 20.
Conducting probe 400 is located at the accommodating area A2 of wears groove 113.Conducting probe 400 includes a frame body 410 and multiple probes
420.Frame body 410 is fixed on plummer 100.These probes 420 contact and are electrically connected at the second end of conductive elastic arm 220
222.The probe 420 of the present embodiment is solid, helps to reduce the difficulty of processing of conducting probe 400, with promoting conducting probe
400 processing quality.
The absorption type test device 10 of the present embodiment isolates pumping by the plate body 210 of electrical conduction 200 in wears groove 113
The adsorption zone A1 of the vacuum and accommodating area A2 put for conducting probe 400, so as to conducting probe 400 is excluded in adsorption zone A1
Except.Thus, adsorption zone A1 to vacuumize airtight quality of the quality only between plate body 210 and plummer 100 related, will simultaneously
It will not be influenced by the processing of conducting probe 400 with assembling quality.That is, without additional before 400 actual load of conducting probe
The probability of adsorption zone A1 gas leakage can also be reduced, and then reduce the test of absorption type test device 10 by carrying out accurate airtight test
Time and cost.
In the present embodiment, assembling convex block 130 is between annular flange 120 and conducting probe 400.But not as
Limit, please refers to Fig. 4.Fig. 4 is the close-up schematic view of the absorption type test device according to second embodiment of the invention.
In the present embodiment, annular flange 120 assembles people between assembling convex block 130 and conducting probe 400 so as to allowing
Member can assemble electrical conduction 200 above plummer 100.
According to the absorption type test device of above-described embodiment, isolated and vacuumized in wears groove by the plate body of electrical conduction
Adsorption zone and the accommodating area put for conducting probe, so as to conducting probe is excluded in except adsorption zone.Thus, it inhales
Attached area vacuumizes that airtight quality of the quality only between plate body and plummer is related, by can't by conducting probe processing with
Assemble the influence of quality.That is, suction can be also reduced without additionally carrying out accurate airtight test before conducting probe actual load
The probability of attached area's gas leakage, and then reduce testing time and the cost of absorption type test device.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe
It knows those skilled in the art and makes various corresponding changes and deformation, but these corresponding changes and change in accordance with the present invention
Shape should all belong to the protection domain of appended claims of the invention.
Claims (7)
1. a kind of absorption type test device, to carry a support plate, which is characterized in that include：
One plummer, has a top surface, a back side and a wears groove, which extends relative to the top surface, the wears groove from the top surface
To the back side；
One electrical conduction is located at the wears groove and is embedded at the plummer comprising a plate body and multiple conductive elastic arms, the plate body, with every
An adsorption zone and an accommodating area are separated out, multiple conduction elastic arm runs through the plate body；
One first sealing ring is set to the top surface, and around the adsorption zone, for first sealing ring to carry the support plate, this is more
One end of a electrical conduction is located at the adsorption zone and is for electrically connecting to the support plate；And
One conducting probe, positioned at the wears groove, which includes a frame body and multiple probes, which is fixed on the carrying
Platform, the other end of multiple conduction elastic arm are located at the accommodating area and are electrically connected in multiple probe.
2. absorption type test device as described in claim 1, which is characterized in that the plummer includes an annular base body and a ring
Shape flange, the annular base body have an internal face and an assembling grove, and for the internal face around the wears groove is gone out, it is interior which is located at this
Wall surface, for the plummer also comprising an assembling convex block, which is embedded at the assembling grove, and the plate body of the electrical conduction
Part is located between the annular flange and the assembling convex block.
3. absorption type test device as claimed in claim 2, which is characterized in that also comprising one second sealing ring, this is second close
Seal ring is located in the annular flange and the plate body.
4. absorption type test device as claimed in claim 3, which is characterized in that the annular flange also has an annular groove,
Second sealing ring is installed in the annular groove.
5. absorption type test device as claimed in claim 2, which is characterized in that the assembling convex block is between the annular flange with being somebody's turn to do
Between conducting probe.
6. absorption type test device as claimed in claim 5, which is characterized in that the annular flange is backwards to the table of the conducting probe
Face and the top surface are coplanar.
7. absorption type test device as claimed in claim 2, which is characterized in that the annular flange is between the assembling convex block with being somebody's turn to do
Between conducting probe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611238094.1A CN108254593B (en) | 2016-12-28 | 2016-12-28 | Adsorption type testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611238094.1A CN108254593B (en) | 2016-12-28 | 2016-12-28 | Adsorption type testing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108254593A true CN108254593A (en) | 2018-07-06 |
| CN108254593B CN108254593B (en) | 2020-02-18 |
Family
ID=62720332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611238094.1A Active CN108254593B (en) | 2016-12-28 | 2016-12-28 | Adsorption type testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108254593B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111786159A (en) * | 2019-04-03 | 2020-10-16 | 高天星 | Conduction device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH085666A (en) * | 1994-04-21 | 1996-01-12 | Matsushita Electric Ind Co Ltd | Semiconductor wafer case, connection method and apparatus, and inspection method for semiconductor integrated circuit |
| CN201867430U (en) * | 2010-11-08 | 2011-06-15 | 港建日置股份有限公司 | Positioning structure of test bench |
| CN102478593A (en) * | 2010-11-30 | 2012-05-30 | 励威电子股份有限公司 | Probe card structure |
| CN103575938A (en) * | 2012-08-01 | 2014-02-12 | 鸿劲科技股份有限公司 | Adsorption type testing device and testing equipment with adsorption type testing device applied |
| CN105277868A (en) * | 2014-07-11 | 2016-01-27 | 致茂电子(苏州)有限公司 | Test device |
| KR101599049B1 (en) * | 2014-11-28 | 2016-03-04 | 주식회사 세미코어 | Semiconductor chip testing device |
-
2016
- 2016-12-28 CN CN201611238094.1A patent/CN108254593B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH085666A (en) * | 1994-04-21 | 1996-01-12 | Matsushita Electric Ind Co Ltd | Semiconductor wafer case, connection method and apparatus, and inspection method for semiconductor integrated circuit |
| CN201867430U (en) * | 2010-11-08 | 2011-06-15 | 港建日置股份有限公司 | Positioning structure of test bench |
| CN102478593A (en) * | 2010-11-30 | 2012-05-30 | 励威电子股份有限公司 | Probe card structure |
| CN103575938A (en) * | 2012-08-01 | 2014-02-12 | 鸿劲科技股份有限公司 | Adsorption type testing device and testing equipment with adsorption type testing device applied |
| CN105277868A (en) * | 2014-07-11 | 2016-01-27 | 致茂电子(苏州)有限公司 | Test device |
| KR101599049B1 (en) * | 2014-11-28 | 2016-03-04 | 주식회사 세미코어 | Semiconductor chip testing device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111786159A (en) * | 2019-04-03 | 2020-10-16 | 高天星 | Conduction device |
| CN111786159B (en) * | 2019-04-03 | 2022-02-11 | 高天星 | Conduction device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108254593B (en) | 2020-02-18 |
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