CN108239765B - 屏蔽组件 - Google Patents

屏蔽组件 Download PDF

Info

Publication number
CN108239765B
CN108239765B CN201711399616.0A CN201711399616A CN108239765B CN 108239765 B CN108239765 B CN 108239765B CN 201711399616 A CN201711399616 A CN 201711399616A CN 108239765 B CN108239765 B CN 108239765B
Authority
CN
China
Prior art keywords
shield
frame
shielding frame
shielding
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201711399616.0A
Other languages
English (en)
Other versions
CN108239765A (zh
Inventor
金宰焕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TES Co Ltd
Original Assignee
TES Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TES Co Ltd filed Critical TES Co Ltd
Publication of CN108239765A publication Critical patent/CN108239765A/zh
Application granted granted Critical
Publication of CN108239765B publication Critical patent/CN108239765B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H01L21/0228Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE, pulsed CVD
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04Coating on selected surface areas, e.g. using masks
    • C23C16/042Coating on selected surface areas, e.g. using masks using masks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/0445Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
    • H01L21/0455Making n or p doped regions or layers, e.g. using diffusion
    • H01L21/046Making n or p doped regions or layers, e.g. using diffusion using ion implantation
    • H01L21/0465Making n or p doped regions or layers, e.g. using diffusion using ion implantation using masks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308Chemical or electrical treatment, e.g. electrolytic etching using masks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682Mask-wafer alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本发明涉及一种屏蔽组件。本发明的屏蔽组件具备:屏蔽,位于基板的上部,形成有预先确定的图案;屏蔽框架,支撑所述屏蔽,固定到所述屏蔽的边缘;以及遮挡框架,安装到所述屏蔽框架,与所述屏蔽框架的上表面位于同一平面上,或较所述屏蔽框架的上表面位于下方。因此,可相对性地提高等离子体的密度,改善薄膜的均匀度。

Description

屏蔽组件
技术领域
本发明涉及一种使用在薄膜沉积装置的屏蔽组件。
背景技术
为了在基板上沉积物质,可利用各种化学工序。例如,可列举化学气相沉积(chemical vapor deposition,CVD)、原子层沉积(atomic layer deposition,ALD)等方法。
在此情况下,以往技术的薄膜沉积装置可使用在腔室的内部安装基板的基板支撑部、向基板供给处理气体的气体供给部、为了将沉积的物质沉积成预先确定的图案而位于基板上部的屏蔽,通过屏蔽框架固定这种屏蔽。
图5表示以往技术的屏蔽100与屏蔽框架20的结构。如图5所示,屏蔽100是以形成有预先确定的图案的状态,其边缘固定到屏蔽框架20。
因此,从上部的气体供给部400供给的处理气体经由屏蔽100而供给到下部的基板。此时,遮挡框架30发挥如下作用:安装到屏蔽框架20的上表面的边缘,不使从气体供给部400供给的处理气体立即排出而使其长时间滞留在基板的边缘区域。处理气体长时间持续地在基板的边缘区域的流动,由此可提高沉积到基板的膜的均匀度。
以往技术在通过气体供给部400供给处理气体而在基板上沉积物质的情况下,使气体供给部400与屏蔽100之间的距离d1越近,越可期待提高等离子体的密度,改善薄膜的均匀度。因此,在沉积工序中,缩短气体供给部400与屏蔽100之间的距离d1较为有利。
然而,如图5所示,在以往技术的结构中,遮挡框架30安装到屏蔽框架20的上表面,因此因遮挡框架30本身的厚度t而难以将气体供给部400与屏蔽100之间的距离d1缩小到遮挡框架30的厚度t以下。
发明内容
[发明欲解决的课题]
本发明的目的在于,为了解决如上所述的问题而提供一种可缩小气体供给部与屏蔽之间的距离来提高等离子体的密度,改善薄膜的均匀度的屏蔽组件。
[解决课题的手段]
通过一种屏蔽组件达成如上所述的本发明的目的,上述屏蔽组件具备:屏蔽,位于基板的上部,形成有预先确定的图案;屏蔽框架,支撑所述屏蔽,固定到所述屏蔽的边缘;以及遮挡框架,安装到所述屏蔽框架,与所述屏蔽框架的上表面位于同一平面上,或较所述屏蔽框架的上表面位于下方。
此处,所述屏蔽框架可具备安装所述遮挡框架的倾斜部。
另外,所述屏蔽框架还可具备导引部,所述导引部从所述倾斜部向上部延伸形成为预先确定的长度,在所述遮挡框架安装到所述倾斜部的情况下进行导引。
进而,所述遮挡框架可具备与所述倾斜部对应的倾斜面。
另一方面,所述遮挡框架还可具备延伸部,所述延伸部沿边缘向上部延伸形成为预先确定的长度而延长从气体供给部供给的处理气体的滞留时间。
此时,所述延伸部可较所述气体供给部位于外围。
[发明的效果]
根据具有上述构成的本发明,以与所述屏蔽框架的上表面位于同一面上、或较所述屏蔽框架的上表面位于下方的方式配置遮挡框架而明显地缩小气体供给部与屏蔽之间的距离,由此与以往相比,可相对性地提高等离子体的密度,改善薄膜的均匀度。
附图说明
图1是本发明的一实施例的屏蔽组件的分解立体图。
图2是图1的侧剖面图。
图3是本发明的另一实施例的屏蔽组件的侧剖面图。
图4是本发明的又一实施例的屏蔽组件的侧剖面图。
图5是以往技术的屏蔽组件的侧剖面图。
附图标号说明
100:屏蔽;
20、200、1200:屏蔽框架;
210、1210:倾斜部;
220:导引部;
30、300、1300:遮挡框架;
310:倾斜面;
400:气体供给部;
1000、2000、3000:屏蔽组件;
1310:倾斜面
1330:延伸部;
d1、d2、d3:距离;
t:厚度。
具体实施方式
以下,参照附图,详细地对本发明的实施例的屏蔽组件进行说明。
图1是本发明的一实施例的屏蔽组件1000的分解立体图,图2是图1的侧剖面图。
参照图1及图2,所述屏蔽组件1000具备:屏蔽100,位于基板(未图示)的上部,形成有预先确定的图案;屏蔽框架200,固定所述屏蔽100的边缘,以便支撑所述屏蔽100;以及遮挡框架300,安装到所述屏蔽框架200,与所述屏蔽框架200的上表面位于同一平面上,或较所述屏蔽框架200的上表面位于下方。
所述屏蔽100为了按照预先确定的形状将沉积物质沉积到所述基板,可具有预先确定的形态的图案。
这种屏蔽100的边缘由屏蔽框架200支撑,基板位于所述屏蔽100的下部。
此时,所述遮挡框架300安装到所述屏蔽框架200,以如下方式定位:可在沉积工序中最大限度地缩小气体供给部400与所述屏蔽100之间的距离d2、或所述气体供给部400与基板之间的距离。
具体而言,在本实施例的屏蔽组件中,所述遮挡框架300像图中所示一样较所述屏蔽框架200的上表面位于下方。
在此情况下,所述屏蔽框架200具备安装所述遮挡框架300的倾斜部210,所述遮挡框架300具备与所述倾斜部210对应的倾斜面310。在将所述遮挡框架300安装到所述屏蔽框架200的上部的情况下,如果使所述遮挡框架300朝向所述屏蔽框架200下降,则所述遮挡框架300的倾斜面310与所述倾斜部210密接而所述遮挡框架300不再向下方下降。
因此,在将所述遮挡框架300安装到所述屏蔽框架200的上部的情况下,无需用以固定或支撑所述遮挡框架300的另外的单元。
此时,所述屏蔽框架200还可具备导引部220,所述导引部从所述倾斜部210向上部延伸形成为预先确定的长度,在所述遮挡框架300安装到所述倾斜部210的情况下进行导引。
所述导引部220从所述倾斜部210向上部延伸形成为预先确定的长度,从而在将所述遮挡框架300安装到所述屏蔽框架200的情况下,可将所述导引部220插入到所述遮挡框架300而容易地安装。此时,所述遮挡框架300的上表面与所述屏蔽框架200的上表面之间的距离d3相当于所述导引部220所延伸的长度。
根据具有上述结构的屏蔽组件1000,如图2所示,可在沉积工序中最大限度地缩小气体供给部400与所述屏蔽100之间的距离d2,从而与以往技术相比,可相对性地提高等离子体的密度,改善薄膜的均匀度。
另一方面,图3是表示另一实施例的屏蔽组件2000的结构的剖面图。
参照图3,在所述遮挡框架300安装到所述屏蔽框架1200的情况下,所述遮挡框架300的上表面与所述屏蔽框架1200的上表面位于同一平面上。
具体而言,与上述实施例相比,本实施例的屏蔽框架1200呈省略导引部的结构。即,所述屏蔽框架1200是从上表面向下方形成倾斜部1210。因此,在所述遮挡框架300安装到所述屏蔽框架1200的情况下,如图所示,所述遮挡框架300的上表面与所述屏蔽框架1200的上表面位于同一面上。
另一方面,图4是表示又一实施例的屏蔽组件3000的结构的剖面图。
参照图4,本实施例的遮挡框架1300还具备延伸部1330,所述延伸部1330沿所述遮挡框架1300的边缘向上部延伸形成为预先确定的长度而延长从气体供给部400供给的处理气体滞留在基板或屏蔽框架1200的边缘区域的时间。
所述延伸部1330沿所述遮挡框架1300的边缘形成,从而不使从所述气体供给部400向基板供给的处理气体朝向外围分散而延长在基板的边缘区域的滞留时间来提高薄膜的均匀度。
然而,如果以在平面上与所述气体供给部400重叠的方式配置所述延伸部1330,则会因所述延伸部1330的突出高度而难以像上述实施例一样缩小所述气体供给部400与所述屏蔽100之间的距离。
因此,如图4所示,所述延伸部1330可较所述气体供给部400位于外围。根据这种结构,可通过所述延伸部1330而延长从所述气体供给部400供给的处理气体的滞留时间,进而,在所述气体供给部400与所述屏蔽100之间的距离变小的情况下,也可防止所述气体供给部400与所述延伸部1330的干涉。
与此同时,所述屏蔽框架1200具有可供安装所述遮挡框架1300的倾斜部1210,且所述遮挡框架1300形成有对应于所述倾斜部1210的倾斜面1310,类似于图3所示的实施例。在上述内容中,参照本发明的优选实施例进行了说明,但本技术领域的技术人员可在不脱离随附的权利要求中所记载的本发明的思想及领域的范围内对本发明实施各种修正及变更。因此,如果变形的实施基本上包括本发明的权利要求的构成要素,则视为均包括在本发明的技术范畴内。

Claims (4)

1.一种屏蔽组件,其特征在于,具备:
屏蔽,位于基板的上部,形成有预先确定的图案;
屏蔽框架,固定所述屏蔽的边缘,以便支撑所述屏蔽;以及
遮挡框架,安装到所述屏蔽框架,与所述屏蔽框架的上表面位于同一平面上,或较所述屏蔽框架的上表面位于下方,
其中,所述屏蔽框架具备安装所述遮挡框架的倾斜部,所述遮挡框架具备与所述倾斜部对应的倾斜面,从而当所述遮挡框架位于所述屏蔽框架上时,所述遮挡框架朝向所述屏蔽框架下降,所述遮挡框架的所述倾斜面与所述倾斜部密接而所述遮挡框架不再向下方下降。
2.根据权利要求1所述的屏蔽组件,其特征在于,
所述屏蔽框架还具备导引部,所述导引部从所述倾斜部向上部延伸形成为预先确定的长度,在所述遮挡框架安装到所述倾斜部的情况下进行导引。
3.根据权利要求1所述的屏蔽组件,其特征在于,
所述遮挡框架还具备延伸部,所述延伸部沿所述遮挡框架的边缘向上部延伸形成为预先确定的长度而延长从气体供给部供给的处理气体的滞留时间。
4.根据权利要求3所述的屏蔽组件,其特征在于,
所述延伸部较所述气体供给部位于外围。
CN201711399616.0A 2016-12-23 2017-12-21 屏蔽组件 Active CN108239765B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160177487A KR101918457B1 (ko) 2016-12-23 2016-12-23 마스크 어셈블리
KR10-2016-0177487 2016-12-23

Publications (2)

Publication Number Publication Date
CN108239765A CN108239765A (zh) 2018-07-03
CN108239765B true CN108239765B (zh) 2020-04-28

Family

ID=62700653

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711399616.0A Active CN108239765B (zh) 2016-12-23 2017-12-21 屏蔽组件

Country Status (2)

Country Link
KR (1) KR101918457B1 (zh)
CN (1) CN108239765B (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002130239A (ja) * 2000-10-30 2002-05-09 Hitachi Ltd テーパコマ、テーパコマを用いるねじ締結構造、テーパコマを用いる液体容器
CN1937907A (zh) * 2005-09-19 2007-03-28 华硕电脑股份有限公司 屏蔽组件及其应用的电子装置
CN200996043Y (zh) * 2004-07-16 2007-12-26 应用材料公司 一种屏蔽框架组件
CN101622703A (zh) * 2007-02-28 2010-01-06 周星工程股份有限公司 基板支持框架及包含此支持框架的基板处理设备和利用此支持框架装载与卸载基板的方法
CN104073761A (zh) * 2013-03-29 2014-10-01 三星显示有限公司 沉积设备、有机发光显示设备及其制造方法
CN204375716U (zh) * 2012-03-05 2015-06-03 应用材料公司 遮蔽框、基板支撑件以及等离子体增强型化学气相沉积设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060011137A1 (en) * 2004-07-16 2006-01-19 Applied Materials, Inc. Shadow frame with mask panels
KR100853544B1 (ko) * 2007-04-05 2008-08-21 삼성에스디아이 주식회사 평판 표시장치 박막 증착용 마스크 프레임 조립체 및 이를이용한 증착장비

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002130239A (ja) * 2000-10-30 2002-05-09 Hitachi Ltd テーパコマ、テーパコマを用いるねじ締結構造、テーパコマを用いる液体容器
CN200996043Y (zh) * 2004-07-16 2007-12-26 应用材料公司 一种屏蔽框架组件
CN1937907A (zh) * 2005-09-19 2007-03-28 华硕电脑股份有限公司 屏蔽组件及其应用的电子装置
CN101622703A (zh) * 2007-02-28 2010-01-06 周星工程股份有限公司 基板支持框架及包含此支持框架的基板处理设备和利用此支持框架装载与卸载基板的方法
CN204375716U (zh) * 2012-03-05 2015-06-03 应用材料公司 遮蔽框、基板支撑件以及等离子体增强型化学气相沉积设备
CN104073761A (zh) * 2013-03-29 2014-10-01 三星显示有限公司 沉积设备、有机发光显示设备及其制造方法

Also Published As

Publication number Publication date
CN108239765A (zh) 2018-07-03
KR101918457B1 (ko) 2018-11-14
KR20180073937A (ko) 2018-07-03

Similar Documents

Publication Publication Date Title
US11866823B2 (en) Substrate supporting unit and a substrate processing device including the same
US10876218B2 (en) Substrate supporting plate, thin film deposition apparatus including the same, and thin film deposition method
CN109075007B (zh) Rf返回条带屏蔽盖罩
KR101267431B1 (ko) 통합형 유동 이퀄라이저와 개선된 콘덕턴스를 가지는 하부 라이너
TWI513851B (zh) 陽極處理之噴頭
CN109314055B (zh) 原子层生长装置及原子层生长方法
US20170369994A1 (en) Apparatus for processing a wafer and method of depositing a thin film using the same
KR101937692B1 (ko) 기판 지지 장치 및 기판 처리 장치
US20150122177A1 (en) Apparatus for processing substrate
US7217326B2 (en) Chemical vapor deposition apparatus
KR20220137720A (ko) 반응 챔버
CN108239765B (zh) 屏蔽组件
TWI557279B (zh) 具有屏蔽接觸環之電鍍處理器
KR100840897B1 (ko) 기판 지지 어셈블리와 기판 처리 장치 및 기판 처리 방법
KR20120098020A (ko) 박막 증착용 쉐도우마스크
KR20120040802A (ko) 기판 지지 장치 및 이를 포함하는 박막 증착 장치
TWI829652B (zh) 具有變化輪廓的側邊的遮蔽框架以改善沉積均勻性
EP3399545B1 (en) Substrate treatment system
KR102046034B1 (ko) 유도결합 플라즈마 처리장치
KR102291236B1 (ko) 기판 처리 장치
TWI491758B (zh) 用於光電半導體製程的沉積設備及其遮覆框
KR102302922B1 (ko) 기판처리장치
KR101780395B1 (ko) 기판 지지용 트레이 및 이를 구비한 기판처리장치
CN116387190A (zh) 基板处理腔室
KR102154479B1 (ko) 정전척

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant